Display panel and display device

Abstract

The application relates to a display panel and a display device, and relates to the technical field of display. The static electricity generated in the display panel can be uniformly dissipated, the risk of local discharge is avoided, the conductive path of static electricity discharge is increased by the conductive layer, static electricity is conducted from the substrate to the back of the static electricity dissipation material layer along the conductive layer, effective attraction and dissipation of static electricity discharge are realized, and the damage caused by static electricity discharge to the display panel is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] As people's demand for display devices continues to increase, the application of display panels is becoming more and more widespread.

[0003] Electrostatic discharge (ESD) is one of the main problems that display panels may face during manufacturing and use. ESD can damage the circuitry of the display panel, cause display abnormalities, or even lead to complete failure. To ensure the reliability and long-term stability of display panels, effective ESD protection measures are necessary. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and display device to address the problem of preventing electrostatic discharge.

[0005] To achieve the above objectives, in one aspect, the present invention provides a display panel, comprising:

[0006] A substrate having an edge region and a central region defined thereon, the edge region surrounding the central region;

[0007] A light-emitting functional layer is located on one side of the substrate;

[0008] An electrostatic protective layer is located on the side of the substrate away from the light-emitting functional layer;

[0009] The electrostatic protection layer includes an electrostatic dissipative material layer and a conductive layer.

[0010] The electrostatic dissipative material layer covers the substrate and is located in the central region;

[0011] The conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The second conductive portion surrounds the first conductive portion. The first conductive portion is located on the side of the electrostatic dissipative material layer away from the substrate, and the orthographic projection of the first conductive portion on the substrate at least partially covers the orthographic projection of the electrostatic dissipative material layer on the substrate. The first conductive portion includes a first part and a second part that are interconnected. The first part surrounds the second part. The second conductive portion at least surrounds the first part and the electrostatic dissipative material layer, and the substrate, the electrostatic dissipative material layer, and the first conductive portion are connected through the second conductive portion.

[0012] In one embodiment, the second conductive portion includes a third portion and a fourth portion that are interconnected, the third portion being located in the edge region, and the orthographic projection of the fourth portion on the substrate at least covering a portion of the orthographic projection of the first portion on the substrate;

[0013] Optionally, in the direction parallel to the substrate, the width of the second conductive portion ranges from 0.3 mm to 2.0 mm;

[0014] Optionally, the width of the third portion in the direction parallel to the substrate ranges from 0.1 mm to 1.0 mm.

[0015] In one embodiment, the conductive layer further includes a third conductive portion surrounding the second conductive portion and including a first sub-conductive portion and a second sub-conductive portion interconnected with each other.

[0016] The first sub-conductive part is located on the side wall of the second conductive part;

[0017] The second sub-conductive portion is located on at least a portion of the sidewall of the substrate;

[0018] Optionally, the conductive layer may be made of a metallic material or a conductive ceramic material.

[0019] In one embodiment, in a direction perpendicular to the substrate, the height of the second sub-conductive portion is less than or equal to 2 / 3 of the height of the substrate.

[0020] In one embodiment, the first conductive part, the second conductive part, and the third conductive part are an integral structure.

[0021] In one embodiment, the second part includes a plurality of first strip portions and a plurality of second strip portions, wherein the first strip portions and the second strip portions intersect to form a mesh structure;

[0022] Optionally, the first strip portion intersects the second strip portion perpendicularly;

[0023] Optionally, the line width of the first strip portion ranges from 0.3mm to 2.0mm, and the line spacing between adjacent first strip portions ranges from 1.0mm to 5.0mm;

[0024] Optionally, the line width of the second strip portion ranges from 0.3mm to 2.0mm, and the line spacing between adjacent second strip portions ranges from 1.0mm to 5.0mm.

[0025] In one embodiment, the first part includes a smooth connecting portion, and the second part is connected through the smooth connecting portion;

[0026] Optionally, the angle between the sidewall of the smooth connecting part and the second part is an oblique angle or an arc angle.

[0027] In one embodiment, the surface resistivity of the material of the electrostatic dissipative material layer is in the range of 10. 5 Ω / square-10 12 Ω / square, the volume resistivity of the electrostatic dissipative material layer is in the range of 10 Ω / square. 4 Ω·cm-10 11 Ω·cm;

[0028] Optionally, the material of the electrostatic dissipation material layer is an antistatic polymer material.

[0029] In one embodiment, the thickness of the electrostatic dissipative material layer in the direction perpendicular to the substrate ranges from 0.05 mm to 0.2 mm;

[0030] Optionally, the electrostatic dissipative material layer is prepared by coating or vapor deposition.

[0031] On the other hand, a display device is also provided, including the aforementioned display panel.

[0032] Compared with existing technologies, the above technical solution has the following advantages:

[0033] The display panel includes a substrate, a light-emitting functional layer, and an electrostatic discharge (ESD) protection layer. The substrate defines an edge region and a central region, with the edge region surrounding the central region. The light-emitting functional layer is located on one side of the substrate, and the ESD protection layer is disposed on the side of the substrate furthest from the light-emitting functional layer. The ESD protection layer includes an ESD dissipation material layer and a conductive layer. The ESD dissipation material layer is located on the substrate in the central region. Because the ESD dissipation material can uniformly dissipate static electricity generated on one side of the substrate, avoiding the risk of partial discharge, it provides ESD protection. Furthermore, the conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The first conductive portion is located on the side of the electrostatic dissipative material layer away from the substrate. The orthographic projection of the first conductive portion on the substrate at least covers a portion of the orthographic projection of the electrostatic dissipative material layer on the substrate. The first conductive portion includes a first part and a second part that are interconnected, wherein the first part surrounds the second part, and the second conductive portion at least surrounds the first part and the electrostatic dissipative material layer. In this case, the substrate, the electrostatic dissipative material layer, and the first conductive portion are connected through the second conductive portion. The second conductive portion conducts the static electricity generated on the substrate to the first conductive portion, and the first conductive portion conducts and diffuses the static electricity to the back side of the electrostatic dissipative material layer, so that the static electricity is dissipated from the electrostatic dissipative material layer, thereby reducing the damage to the display panel caused by electrostatic discharge. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This application provides a top view of a substrate structure according to an embodiment of the present application;

[0036] Figure 2 This application provides a schematic diagram of the cross-sectional structure of a display panel according to an embodiment;

[0037] Figure 3 This application provides another schematic diagram of the cross-sectional structure of a display panel for an embodiment of the present application;

[0038] Figure 4 This application provides another schematic diagram of the cross-sectional structure of a display panel.

[0039] Figure 5 This application provides a schematic cross-sectional view of a display panel with an integral conductive layer structure.

[0040] Figure 6 This application provides a top view of the electrostatic protection layer of a display panel according to an embodiment of the present application.

[0041] Figure 7 A top view of another electrostatic protection layer for a display panel is provided as an embodiment of this application;

[0042] Figure 8 This application provides a top view of another electrostatic protection layer for a display panel, as shown in the embodiments of this application.

[0043] Figure 9 This application provides a schematic diagram of the structure of a smooth connecting part according to an embodiment of the present application;

[0044] Figure 10 This application provides a schematic diagram of another smooth connection part.

[0045] Figure 11 This application provides a schematic diagram of a cross-sectional structure of a display panel with an encapsulation layer.

[0046] Explanation of reference numerals in the attached drawings: 01-Substrate; 02-Light-emitting functional layer; 03-Electrostatic protection layer; 031-Electrostatic dissipation material layer; 032-Conductive layer; 0321-First conductive part; 1321-First portion; 2321-Second portion; 0322-Second conductive part; 1322-Third portion; 2322-Fourth portion; 0323-Third conductive part; 1323-First sub-conductive part; 2323-Second sub-conductive part; 04-First strip portion; 05-Second strip portion; 06-Smooth connection portion; 07-Encapsulation layer; AA-Central area; BB-Edge area. Detailed Implementation

[0047] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0049] It should be understood that when a layer is referred to as "on," "adjacent to," or "connected to" other layers, it can be directly on, adjacent to, or connected to other layers, or there can be intervening layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," or "directly connected to" other layers, there are no intervening layers.

[0050] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0051] Based on the background information, the impact of electrostatic discharge (ESD) on display panels should not be underestimated. It can not only damage product performance but also cause efficiency losses and increased economic costs in the production process. Even if the display panel does not show any abnormalities during factory testing, the latent damage caused by ESD during use may accelerate the aging of components.

[0052] Based on this, this application provides a display panel and a display device. The display panel includes a substrate, a light-emitting functional layer, and an electrostatic discharge (ESD) protection layer. An edge region and a central region are defined on the substrate, with the edge region surrounding the central region. The light-emitting functional layer is located on one side of the substrate, and an ESD protection layer is disposed on the side of the substrate away from the light-emitting functional layer. The ESD protection layer includes an ESD dissipation material layer and a conductive layer. The ESD dissipation material layer is located on the substrate in the central region. Because the ESD dissipation material can uniformly dissipate static electricity generated on one side of the substrate, avoiding the risk of partial discharge, it can provide ESD protection. Furthermore, the conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The first conductive portion is located on the side of the electrostatic dissipative material layer away from the substrate. The orthographic projection of the first conductive portion on the substrate at least covers a portion of the orthographic projection of the electrostatic dissipative material layer on the substrate. The first conductive portion includes a first part and a second part that are interconnected, wherein the first part surrounds the second part, and the second conductive portion at least surrounds the first part and the electrostatic dissipative material layer. In this case, the substrate, the electrostatic dissipative material layer, and the first conductive portion are connected through the second conductive portion. The second conductive portion conducts the static electricity generated on the substrate to the first conductive portion, and the first conductive portion conducts and diffuses the static electricity to the back side of the electrostatic dissipative material layer, so that the static electricity is dissipated from the electrostatic dissipative material layer, thereby reducing the damage to the display panel caused by electrostatic discharge.

[0053] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0054] refer to Figure 1 , Figure 1 This application provides a top view of a substrate structure according to an embodiment of the present application; see reference. Figure 2 , Figure 2 This application provides a cross-sectional structural diagram of a display panel according to an embodiment; the display panel includes:

[0055] Substrate 01, on which an edge region BB and a central region AA are defined, with the edge region BB surrounding the central region AA;

[0056] The light-emitting functional layer 02 is located on one side of the substrate 01;

[0057] An electrostatic protective layer 03 is located on the side of the substrate 01 away from the light-emitting functional layer 02;

[0058] Among them, the electrostatic protection layer 03 includes an electrostatic dissipative material layer 031 and a conductive layer 032;

[0059] The electrostatic dissipative material layer 031 covers the substrate 01 and is located in the central area AA;

[0060] The conductive layer 032 includes a first conductive portion 0321 and a second conductive portion 0322 that are interconnected. The second conductive portion 0322 surrounds the first conductive portion 0321. The first conductive portion 0321 is located on the side of the electrostatic dissipative material layer 031 away from the substrate 01, and the orthographic projection of the first conductive portion 0321 on the substrate 01 at least covers a portion of the orthographic projection of the electrostatic dissipative material layer 031 on the substrate 01. The first conductive portion 0321 includes a first portion 1321 and a second portion 2321 that are interconnected. The first portion 1321 surrounds the second portion 2321. The second conductive portion 0322 at least surrounds the first portion 1321 and the electrostatic dissipative material layer 031, and the substrate 01, the electrostatic dissipative material layer 031, and the first conductive portion 0321 are connected through the second conductive portion 0322.

[0061] Specifically, substrate 01 may include, but is not limited to, a glass substrate. A light-emitting functional layer 02 is disposed on one side of the glass substrate. It should be noted that substrate 01 may also include a transistor array layer, a planarization layer, and a pixel definition layer (not shown in the figure). The transistor array layer includes a large number of regularly arranged thin-film transistor (TFT) arrays and pixel electrodes. These TFTs act as switches and drivers, precisely controlling the signal transmission and display state of each pixel, while the pixel electrodes interact with the light-emitting functional layer 02 to achieve image display. Furthermore, various circuit elements and wiring are integrated on the transistor array layer for transmitting electrical signals and controlling the operation of the entire display area to realize the display, signal transmission, and control functions of the display panel. Each transistor can correspond to a pixel in the light-emitting functional layer 02. The planarization layer can fill and flatten the surface of the underlying structure such as the transistor array layer, providing a flat surface for subsequent pixel definition layers and the light-emitting functional layer 02, ensuring uniform coverage of subsequent layer materials, which is beneficial for improving display quality and reducing display defects caused by uneven underlying surfaces. The pixel definition layer is used to isolate the pixels in the light-emitting functional layer 02. A pixel can also include multiple sub-pixels, such as R (red) sub-pixels, G (green) sub-pixels, and B (blue) sub-pixels. The pixel definition layer can accurately isolate RGB sub-pixels to prevent screen light leakage and prevent optical and electrical crosstalk between adjacent pixels, ensuring that each pixel can emit light and display color independently, thereby improving the clarity and color purity of the displayed image. In addition, the pixel definition layer plays a certain mechanical support role in the display panel, enhancing the structural stability of the display panel and protecting the internal light-emitting layer, electrodes, and other functional layers from external physical damage.

[0062] The light-emitting functional layer 02 serves as the light source for the display panel. In this embodiment, the side of the light-emitting functional layer 02 furthest from the substrate 01 can be the light-emitting side of the display panel, without specific limitations. The material of the light-emitting functional layer 02 includes organic light-emitting materials (such as OLEDs). In OLEDs, the light-emitting functional layer 02 typically consists of multiple sublayers, including a hole injection layer (HIL), a hole transport layer (HTL), an emissive layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). These sublayers work together to achieve efficient injection, transport, and recombination of electrons and holes, thereby generating efficient light emission (not shown in the figure). It should be noted that this is only an example and the light-emitting functional layer 02 is not specifically limited; it can also be a quantum dot material, etc.

[0063] The substrate 01 defines a central region AA and an edge region BB. The edge region BB surrounds the central region AA. It should be noted that the division between the central region AA and the edge region BB is only for better explanation of the structure and is not intended to impose any specific limitations.

[0064] On the side of the substrate 01 away from the light-emitting functional layer 02, an electrostatic discharge (ESD) protection layer 03 is also provided. When electrostatic discharge occurs during the manufacturing or use of the display panel, the ESD protection layer 03 can prevent damage to the components in the display panel. The ESD protection layer 03 includes an ESD dissipative material layer 031 and a conductive layer 032. The ESD dissipative material layer 031 is located in the central area AA of the substrate 01. That is to say, the ESD dissipative material layer 031 does not completely cover the substrate 01. At this time, since the ESD dissipative material layer 031 can dissipate the static electricity generated on one side of the substrate 01, it prevents damage to the components in the display panel from ESD.

[0065] The conductive layer 032 includes a first conductive portion 0321 and a second conductive portion 0322 interconnected with each other. The first conductive portion 0321 is located on the side of the electrostatic dissipative material layer 031 away from the substrate 01, and the orthographic projection of the first conductive portion 0321 on the substrate 01 at least partially covers the orthographic projection of the electrostatic dissipative material layer 031 on the substrate 01. That is, the first conductive portion 0321 can also completely cover the electrostatic dissipative material layer 031, without specific limitation. The first conductive portion 0321 includes a first part 1321 and a second part 2321, wherein the first part 1321 surrounds the second part 2321. It should be noted that the first part 1321 can surround all sidewalls of the second part 2321 (not shown in the figure), or it can only surround part of the sidewalls of the second part 2321 (e.g., ...). Figure 2 As shown), no specific limitations are made.

[0066] The second conductive portion 0322 at least surrounds the first portion 1321 and the electrostatic dissipation material layer 031, simultaneously electrically connecting the substrate 01, the electrostatic dissipation material layer 031, and the first conductive portion 0321. The first portion 1321 serves as the connection area between the first conductive portion 0321 and the second conductive portion 0322, allowing the first conductive portion 0321 and the second conductive portion 0322 to overlap. At this time, since the second conductive portion 0322 is in contact with the substrate 01, and the second conductive portion 0322 overlaps with the first conductive portion 0321, static electricity on the substrate 01 is conducted from the second conductive portion 0322 to the side of the electrostatic dissipation material layer 031 away from the substrate 01, i.e., the back side of the electrostatic dissipation material layer 031. Because the conductive layer 032 has better conductivity, static electricity can be quickly and uniformly diffused to the back side of the electrostatic dissipation material layer 031 and dissipated. It should be noted that the materials of the first conductive portion 0321 and the second conductive portion 0322 can be the same or different, and no specific limitation is made here.

[0067] In this application, an electrostatic dissipative material layer 031 is provided on the side of the substrate 01 away from the light-emitting functional layer 02, which allows the static electricity generated during manufacturing or use to be dissipated. The conductive layer 032 is used to conduct the static electricity from the substrate 01 uniformly and quickly to the back of the electrostatic dissipative material layer 031 for dissipation, thereby preventing damage to the components in the display panel by electrostatic discharge.

[0068] In another embodiment of this application, reference is made to Figure 3 , Figure 3 A cross-sectional structural schematic diagram of another display panel is provided for an embodiment of this application; the second conductive part 0322 includes a third part 1322 and a fourth part 2322 that are connected to each other. The third part 1322 is located in the edge region BB, and the orthographic projection of the fourth part 2322 on the substrate 01 at least covers part of the orthographic projection of the first part 1321 on the substrate 01.

[0069] Optionally, in the direction parallel to the substrate 01, the width of the second conductive portion 0322 ranges from 0.3 mm to 2.0 mm;

[0070] Optionally, the width of the third portion 1322 in the direction parallel to the substrate 01 ranges from 0.1 mm to 1.0 mm.

[0071] Specifically, when the second conductive portion 0322 surrounds the first portion 1321 and the electrostatic dissipative material layer 031, a third portion 1322 located in the edge region BB can be provided for overlapping the substrate 01. The orthographic projection of the fourth portion 2322 on the substrate 01 at least partially covers the orthographic projection of the first portion 1321 on the substrate 01. In one embodiment, the orthographic projection of the fourth portion 2322 on the substrate 01 can also cover the entire orthographic projection of the first portion 1321 on the substrate 01 (e.g., ...). Figure 3 As shown), in another embodiment, the orthographic projection of the fourth part 2322 on the substrate 01 can at least cover the orthographic projection of the second part 2321 on the substrate 01. There is no specific limitation on this, as long as the fourth part 2322 overlaps with the first conductive part 0321.

[0072] It should be noted that, in the direction parallel to the plane of the substrate 01, the width d1 of the second conductive part 0322 can be set to a range of 0.3mm-2.0mm, including the endpoint values. For example, the width d1 of the second conductive part 0322 can be set to 0.3mm, or the width d1 of the second conductive part 0322 can be set to 0.9mm, or the width d1 of the second conductive part 0322 can be set to 1.6mm, or the width d1 of the second conductive part 0322 can be set to 1.8mm, etc., without any specific limitation.

[0073] It should also be noted that, in the direction parallel to the plane of substrate 01, the width d2 of the third portion 1322 can be set to a range of 0.1mm-1.0mm, including the endpoint values. For example, the width d2 of the third portion 1322 can be set to 0.3mm, or 0.4mm, or 0.7mm, or 1mm, etc., without specific limitations. Since the third portion 1322 is located in the edge region BB, the width range of the third portion 1322 can be the same as the width range of the edge region BB.

[0074] In this embodiment, the orthographic projection of the fourth portion 2322 on the substrate 01 at least partially covers the orthographic projection of the first portion 1321 on the substrate 01, such that the width d1 of the second conductive portion 0322 in the direction parallel to the plane of the substrate 01 is greater than the width d2 of the edge region BB. At this time, the electrical connection between the second conductive portion 0322 and the first conductive portion 0321 is better, making it easier for static electricity to be uniformly and quickly conducted from the substrate 01 to the back of the static dissipation material layer 031 and dissipated, thus preventing damage to the components in the display panel from electrostatic discharge.

[0075] In another embodiment of this application, reference is made to Figure 4 , Figure 4 This application provides a cross-sectional structural diagram of another display panel according to an embodiment of the present application; the conductive layer 032 further includes a third conductive part 0323, the third conductive part 0323 surrounds the second conductive part 0322, and includes a first sub-conductive part 1323 and a second sub-conductive part 2323 that are interconnected.

[0076] The first sub-conductive part 1323 is located on the side wall of the second conductive part 0322;

[0077] The second sub-conductive portion 2323 is located on at least a portion of the sidewall of the substrate 01.

[0078] Specifically, the conductive layer 032 also includes a third conductive portion 0323, which surrounds the second conductive portion 0322. The first sub-conductive portion 1323 in the third conductive portion 0323 is located on the sidewall of the second conductive portion 0322 and is connected to the second conductive portion 0322. The second sub-conductive portion 2323 is located on at least part of the sidewall of the substrate 01. At this time, the third conductive portion 0323 can conduct the static electricity on the upper side of the substrate 01 through the second conductive portion 0322 to the first conductive portion 0321, and then diffuse to the back of the static dissipation material layer 031 for dissipation. This ensures that the conductive path is connected to the edge of the substrate 01 and the static dissipation material layer 031, forming an effective electrostatic discharge path.

[0079] It should be noted that the materials of the second sub-conductive part 2323 and the first sub-conductive part 1323 may be the same or different, and there is no specific limitation. The materials of the first conductive part 0321, the second conductive part 0322, and the third conductive part 0323 may be the same or different, and there is no specific limitation.

[0080] In this embodiment, the third conductive portion 0323 is provided, which allows static electricity on the upper side of the substrate 01 to be quickly conducted along the third conductive portion 0323 to the back side of the static dissipation material layer 031. This provides a better static electricity conduction path, thereby allowing static electricity to dissipate faster and preventing damage to components in the display panel from static electricity.

[0081] In another embodiment of this application, such as Figure 4 As shown, in the direction perpendicular to the substrate 01, the height H of the second sub-conductive portion 2323 is less than or equal to 2 / 3 of the height of the substrate 01.

[0082] Specifically, in the direction perpendicular to the substrate 01, the maximum heights of the first sub-conductive portion 1323 and the second conductive portion 0322 are aligned. In the same direction, the height H of the second sub-conductive portion 2323 needs to be less than or equal to 2 / 3 of the height of the substrate 01. For example, the height H of the second sub-conductive portion 2323 could be 1 / 2, 1 / 3, 3 / 5, or 5 / 9 of the height of the substrate 01, etc. No specific limitation is imposed; the height can be set as needed.

[0083] In this embodiment, the height H of the second sub-conductive part 2323 is less than or equal to 2 / 3 of the height of the substrate 01, which can prevent the second conductive part 0322 from affecting the wiring on the front side and further avoid damage to the display panel.

[0084] In another embodiment of this application, reference is made to Figure 5 , Figure 5 This application provides a cross-sectional structural diagram of a display panel with an integral conductive layer structure; the first conductive part 0321, the second conductive part 0322, and the third conductive part 0323 are integral structures.

[0085] Specifically, the first conductive part 0321, the second conductive part 0322, and the third conductive part 0323 can be made of the same material, forming an integral structure. By making the first conductive part 0321, the second conductive part 0322, and the third conductive part 0323 an integral structure, energy loss due to contact resistance is avoided because there are no connection points or interfaces. Electrostatic current travels more smoothly in a continuous conductive path, with uniform and stable resistance, effectively reducing energy loss during transmission and improving conductivity. Furthermore, the absence of connection points reduces poor contact caused by loose connections, oxidation, or corrosion, thereby improving the reliability and stability of the conductive layer 032. In addition, integral conductive components can usually be manufactured using a single molding process, reducing the processing and assembly steps of multiple parts, improving production efficiency, and lowering production costs. Simultaneously, the integral conductive layer 032 is easier and faster to install, reducing the workload and time required. Moreover, the integral conductive body has higher strength and toughness, capable of withstanding greater mechanical stress and deformation. It is less prone to breakage or damage when subjected to external forces.

[0086] In another embodiment of this application, reference is made to Figure 6 , Figure 6 This application provides a top view of the electrostatic discharge (ESD) protection layer of a display panel according to an embodiment of the present application; see reference. Figure 7 , Figure 7 This application provides a top view of another electrostatic protection layer for a display panel; the second part 2321 includes a plurality of first strip portions 04 and a plurality of second strip portions 05, the first strip portions 04 and the second strip portions 05 intersecting to form a mesh structure;

[0087] Optionally, the first strip 04 and the second strip 05 intersect perpendicularly (e.g., Figure 6 (as shown)

[0088] Optionally, the line width of the first strip 04 ranges from 0.3mm to 2.0mm, and the line spacing between adjacent first strips 04 ranges from 1.0mm to 5.0mm;

[0089] Optionally, the line width of the second strip 05 ranges from 0.3mm to 2.0mm, and the line spacing between adjacent second strips 05 ranges from 1.0mm to 5.0mm.

[0090] Specifically, the orthographic projection of the second portion 2321 of the first conductive part 0321 onto the substrate 01 at least covers the orthographic projection of the electrostatic dissipative material layer 031 onto the substrate 01. That is to say, the second portion 2321 does not need to completely cover the electrostatic dissipative material layer 031.

[0091] At this time, the second part 2321 may include a plurality of first strip portions 04 and a plurality of second strip portions 05, the extending directions of the first strip portions 04 and the second strip portions 05 being parallel to the plane of the substrate 01. It should be noted that the line width of the first strip portions 04 and the second strip portions 05 can range from 0.3mm to 2.0mm, including endpoint values. For example, the line width of the first strip portions 04 and the second strip portions 05 can be 0.3mm, or 0.9mm, or 1.3mm, or 1.8mm, etc., without specific limitations. The line spacing between the first strip 04 and the second strip 05 can range from 1.0mm to 5.0mm, including the endpoint values. For example, the line spacing between the first strip 04 and the second strip 05 can be 1.3mm, 2.1mm, 3.6mm, or 5.0mm, etc., without specific limitations. It can be set as needed. It should be noted that setting the line width and line spacing of the first strip 04 and the second strip 05 is beneficial for more uniform electrostatic conduction and diffusion.

[0092] The first strip 04 and the second strip 05 are intersected to form a closed conductive network, i.e., a mesh structure. The first strip 04 and the second strip 05 can be a single integrated structure. The mesh structure can conduct static electricity more evenly into the static dissipation material layer 031. In addition, it can also provide electromagnetic shielding, reducing external electromagnetic interference to the display panel.

[0093] like Figure 6 As shown, in one embodiment, the first strip portion 04 and the second strip portion 05 can intersect perpendicularly.

[0094] like Figure 7 As shown, in another embodiment, the first strip 04 and the second strip 05 can be designed to intersect at an angle to form a rhomboid grid structure between the first strip 04 and the second strip 05.

[0095] In this embodiment, the second part 2321 is set as a mesh structure, which can make the electrostatic conduction more uniform and avoid concentrated damage.

[0096] refer to Figure 8 , Figure 8 This application provides a top view of another display panel's electrostatic discharge (ESD) shielding layer; the first portion 1321 of the first conductive portion 0321 is used to connect the second conductive portion 0322 and the second portion 2321. Figure 8 The first part 1321 is taken as an example, surrounding the entire sidewall of the second part 2321. In this case, only the first part 1321 needs to connect the second conductive part 0322 and the second part 2321; therefore, the first part 1321 can be configured as a ring (e.g., ...). Figure 6 As shown), so that the sidewall of the second conductive portion 0322 completely covers the sidewall of the first portion 1321. Alternatively, the first portion 1321 can also be configured as a dot (e.g., Figure 8 As shown), the first part 1321 is set as the end of the first strip 04 and the second strip 05, thereby surrounding the second part 2321 in a dotted structure and connecting the second part 2321 and the second conductive part 0322. No specific limitation is made.

[0097] In another embodiment of this application, reference is made to Figure 9 , Figure 9 This application provides a schematic diagram of the structure of a smooth connecting portion according to an embodiment of the present application; see reference. Figure 10 , Figure 10 A schematic diagram of another smooth connecting portion is provided for an embodiment of this application; the first part 1321 includes a smooth connecting portion 06, and is connected to the second part 2321 through the smooth connecting portion 06;

[0098] Optionally, the angle between the sidewall of the smooth connecting part 06 and the second part 2321 is an oblique angle or an arc angle.

[0099] Specifically, the first part 1321 and the second part 2321 of the first conductive part 0321 are integrally structured. When the first part 1321 connects to the second conductive part 0322 and the second part 2321, static electricity is transferred from the second conductive part 0322 through the first part 1321 to the second part 2321. At this time, a smooth connecting part 06 is provided in the first part 1321 to connect the second part 2321. That is, the width of the conductive channel from the first part 1321 to the second part 2321 gradually decreases. The smooth connecting part 06 makes the surface of the sidewall at the connection point smoother, increases the contact area, and reduces the increase in local resistance caused by surface unevenness. This allows the current to pass through the connection point more evenly, reduces contact resistance, and reduces power loss and heat generation. In addition, the smooth connection of the first part 1321 and the second part 2321 by the smooth connecting part 06 helps to achieve a better tight fit between the first part 1321 and the second part 2321, reducing stress concentration caused by gaps or sharp corners. This reduces the probability of loosening or fatigue cracking at the connection due to long-term use or external factors, improving the reliability and stability of the conductive structure connection. Furthermore, when electrostatic current passes through the smooth connection part 06, the smooth connection part 06 allows for smoother current flow, preventing current accumulation or turbulence at sharp corners, thereby improving the current distribution throughout the conductive structure and enhancing conductivity. This arrangement in the connection area allows electrostatic discharge to be transmitted more smoothly to the second part 2321. The angle between the sidewall of the smooth connection part 06 and the second part 2321 can be an oblique angle or a rounded angle, etc. (e.g., Figure 9 , Figure 10 (As shown), without making specific limitations, this is just an example.

[0100] In this embodiment, the angle between the sidewall of the smooth connecting part 06 and the second part 2321 is set to an oblique angle or an arc angle, which allows static electricity to be quickly and smoothly introduced into the second part 2321, and then diffused evenly and quickly to the static dissipation material layer 031.

[0101] In another embodiment of this application, the surface resistivity of the electrostatic dissipative material layer 031 is in the range of 10. 5 Ω / square-10 12 Ω / square, the volume resistivity of the electrostatic dissipative material layer 031 ranges from 10 Ω / square. 4 Ω·cm-10 11 Ω·cm;

[0102] Optionally, the material of the static dissipation material layer 031 is an antistatic polymer material.

[0103] Specifically, the surface resistivity of the electrostatic dissipative material layer 031 ranges from 10. 5Ω / square-10 12 Ω / square, including endpoint values; for example, the surface resistivity of the material in electrostatic dissipative material layer 031 can be 10. 5 Ω / square, or the surface resistivity of the electrostatic dissipative material layer 031 can be 10 Ω / square. 6 Ω / square, or the surface resistivity of the electrostatic dissipative material layer 031 can be 10 Ω / square. 10 Ω / square, or the surface resistivity of the electrostatic dissipative material layer 031 can be 10 Ω / square. 11 Ω / square, etc., without making specific limitations.

[0104] The volume resistivity of the electrostatic dissipative material layer 031 is in the range of 10. 4 Ω·cm-10 11 Ω·cm, including endpoint values; for example, the volume resistivity of the material in electrostatic dissipative material layer 031 can be 10 Ω·cm. 4 The volume resistivity of the material, or the volume resistivity of the electrostatic dissipative material layer 031, can be 10 Ω·cm. 7 The volume resistivity of the material, or the volume resistivity of the electrostatic dissipative material layer 031, can be 10 Ω·cm. 9 The volume resistivity of the material in the electrostatic dissipative material layer 031 can be 10¹¹ Ω·cm, etc., without any specific limitation.

[0105] It should be noted that the surface resistivity range of the electrostatic dissipation material layer 031 means that the material will neither conduct current rapidly like a conductor, causing a large amount of static electricity to be released instantaneously and potentially leading to electric sparks or other dangers, nor will it completely prevent charge movement like an insulator. Instead, it allows charges to move on the material surface in a relatively slow and controllable manner, thereby gradually dissipating static electricity.

[0106] It should be noted that the material of the electrostatic dissipation material layer 031 is an antistatic polymer material, such as a mixed material formed by incorporating antistatic masterbatch or conductive carbon black into a polymer material. When electrostatic charge accumulates on the material surface, the antistatic masterbatch or conductive carbon black inside the antistatic polymer material can move under the action of an electric field, conducting the charge from the high potential region to the low potential region, thereby achieving uniform distribution and dissipation of the charge.

[0107] It should also be noted that, in addition to the electrostatic dissipative material layer 031 itself being able to dissipate the material, the electrostatic dissipative material layer 031 can also be grounded, thereby dissipating the material through the ground or other safe paths, thus protecting the light-emitting functional layer 02 and the wiring on the front of the display panel.

[0108] In another embodiment of this application, the thickness of the electrostatic dissipative material layer 031 in the direction perpendicular to the substrate 01 ranges from 0.05 mm to 0.2 mm.

[0109] Optionally, the electrostatic dissipative material layer 031 is prepared by coating or vapor deposition.

[0110] Specifically, in the direction perpendicular to the substrate 01, the thickness of the electrostatic dissipative material layer 031 ranges from 0.05mm to 0.2mm, including endpoint values. For example, the thickness of the electrostatic dissipative material layer 031 can be 0.05mm, or 0.08mm, or 0.12mm, or 0.18mm, etc., without any specific limitation.

[0111] The electrostatic dissipative material layer 031 is prepared by coating or vapor deposition, which can make the thickness of the electrostatic dissipative material layer 031 covering the substrate 01 more uniform and can also meet the coverage range of the electrostatic dissipative material layer 031.

[0112] For example, to prepare the electrostatic dissipative material layer 031 using a coating method, firstly, deionized water, organic solvents (such as acetone, ethanol, etc.), and a specialized glass cleaner are used to thoroughly remove dust, oil, and other impurities from the surface of the substrate 01 through ultrasonic cleaning and wiping, ensuring the surface is clean, dry, and free of any contaminants. Then, based on the selected material and coating process of the electrostatic dissipative material layer 031, appropriate coating equipment, such as a spin coater, blade coater, or spray coater, is prepared. Next, the electrostatic dissipative material layer 031 solution is spin-coated, blade-coated, or spray-coated onto the surface of the substrate 01, ensuring the final required thickness of the electrostatic dissipative material layer 031. After coating, the substrate 01 is placed in a drying oven or other drying methods are used to remove the solvent from the coating, allowing the electrostatic dissipative material to cure into a film, thus forming the electrostatic dissipative material layer 031.

[0113] The electrostatic dissipative material layer 031 is prepared by vapor deposition. First, deionized water, organic solvents (such as acetone and ethanol), and a specialized glass cleaner are used to thoroughly remove dust, oil, and other impurities from the surface of the substrate 01 through ultrasonic cleaning and wiping, ensuring the surface is clean, dry, and free of contaminants. Next, the vapor deposition equipment, such as a vacuum coating machine, is inspected to ensure its vacuum system and evaporation source are functioning properly. A suitable evaporation source, such as a resistance evaporation source or an electron beam evaporation source, is selected based on the type and characteristics of the vapor deposition material. The electrostatic dissipative material is then formed into a shape suitable for vapor deposition, such as powder, granules, or filaments, and placed in the evaporation source. For materials requiring doping or mixing, they must be mixed uniformly in advance according to a specific ratio. Finally, the cleaned substrate 01 is clamped onto the substrate holder of the vapor deposition equipment, ensuring accurate positioning and that the distance and angle between the substrate 01 and the evaporation source meet process requirements. Care must be taken to avoid contamination or damage to the substrate 01 during clamping. The gaseous electrostatic dissipative material is then heated and evaporated, propelling it into a vacuum environment and depositing it onto the substrate 01 to form a thin film. During the deposition process, the thickness of the deposited electrostatic dissipative material can be monitored in real time using a monitoring device. When the desired thickness is reached, the heating of the evaporation source is stopped. After the evaporation source is turned off, the coating chamber is allowed to cool naturally to room temperature. Then, air is slowly introduced to release the vacuum, the chamber is opened, and the substrate 01 with the deposited electrostatic dissipative material layer 031 is removed.

[0114] Whether it is coating or vapor deposition, in actual operation, optimization and adjustment are required according to the specific electrostatic dissipation materials and process requirements to obtain high-quality coatings or films that meet the electrostatic dissipation requirements of substrate 01.

[0115] In this embodiment, a uniform thickness ensures that the resistance value of the electrostatic dissipative material layer 031 remains consistent throughout, resulting in a uniform charge conduction speed on the material surface. This ensures that regardless of where static electricity is generated in the electrostatic dissipative material layer 031, it dissipates at the same rate, preventing excessive localized static electricity accumulation and providing stable and reliable electrostatic dissipation capabilities for display surfaces requiring electrostatic protection.

[0116] In another embodiment of this application, the material of the conductive layer 032 includes a metallic material or a conductive ceramic material.

[0117] Specifically, the material of the conductive layer 032 can be a metal material or a conductive ceramic material. For example, the metal material can be copper, aluminum, silver, etc.; the conductive ceramic material can be indium tin oxide (ITO) or silicon carbide (SiC), etc., without any specific limitation.

[0118] In this embodiment, setting the material of the conductive layer 032 to a metal material or a conductive ceramic material can better achieve the conduction of static electricity.

[0119] In another embodiment of this application, reference is made to Figure 11 , Figure 11 This application provides a schematic cross-sectional view of a display panel with an encapsulation layer. An encapsulation layer 07 is also provided on the side of the light-emitting functional layer 02 away from the substrate 01. The encapsulation layer 07 protects the light-emitting functional layer 02 and the structure in the substrate 01 from external environmental factors such as moisture, oxygen, and dust, thereby improving the stability and lifespan of the display panel. The encapsulation layer 07 can include organic encapsulation materials and inorganic light-emitting materials, and is not specifically limited thereto. It should be noted that the encapsulation layer 07 can be a thin-film encapsulation (TFE). For flexible devices, the TFE encapsulation layer can also adapt well to flexible substrates, meeting the requirements for device flexibility and rollability.

[0120] A cover plate can also be attached to the side of the encapsulation layer 07 away from the light-emitting functional layer 02. The cover plate can protect the internal structure, enhance mechanical strength and improve optical performance.

[0121] In another embodiment of this application, a display device is also provided, including the display panel described above.

[0122] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0123] In the description of this specification, references to terms such as "some embodiments," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0124] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0125] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate having an edge region and a central region defined thereon, the edge region surrounding the central region; A light-emitting functional layer is located on one side of the substrate; An electrostatic protective layer is located on the side of the substrate away from the light-emitting functional layer; The electrostatic protection layer includes an electrostatic dissipative material layer and a conductive layer. The electrostatic dissipative material layer covers the substrate and is located in the central region; The conductive layer includes a first conductive portion and a second conductive portion that are interconnected. The second conductive portion surrounds the first conductive portion. The first conductive portion is located on the side of the electrostatic dissipative material layer away from the substrate, and the orthographic projection of the first conductive portion on the substrate at least partially covers the orthographic projection of the electrostatic dissipative material layer on the substrate. The first conductive portion includes a first part and a second part that are interconnected. The first part surrounds the second part. The second conductive portion at least surrounds the first part and the electrostatic dissipative material layer, and the substrate, the electrostatic dissipative material layer, and the first conductive portion are connected through the second conductive portion.

2. The display panel according to claim 1, characterized in that, The second conductive portion includes a third portion and a fourth portion that are interconnected, the third portion being located in the edge region, and the orthographic projection of the fourth portion on the substrate at least covering a portion of the orthographic projection of the first portion on the substrate; Optionally, in the direction parallel to the substrate, the width of the second conductive portion ranges from 0.3 mm to 2.0 mm; Optionally, the width of the third portion in the direction parallel to the substrate ranges from 0.1 mm to 1.0 mm.

3. The display panel according to claim 1, characterized in that, The conductive layer further includes a third conductive portion, which surrounds the second conductive portion and includes a first sub-conductive portion and a second sub-conductive portion that are interconnected. The first sub-conductive part is located on the side wall of the second conductive part; The second sub-conductive portion is located on at least a portion of the sidewall of the substrate; Optionally, the conductive layer may be made of a metallic material or a conductive ceramic material.

4. The display panel according to claim 3, characterized in that, In a direction perpendicular to the substrate, the height of the second sub-conductive portion is less than or equal to 2 / 3 of the height of the substrate.

5. The display panel according to claim 3, characterized in that, The first conductive part, the second conductive part, and the third conductive part are an integral structure.

6. The display panel according to claim 1, characterized in that, The second part includes a plurality of first strip portions and a plurality of second strip portions, wherein the first strip portions and the second strip portions intersect to form a mesh structure; Optionally, the first strip portion intersects the second strip portion perpendicularly; Optionally, the line width of the first strip portion ranges from 0.3mm to 2.0mm, and the line spacing between adjacent first strip portions ranges from 1.0mm to 5.0mm; Optionally, the line width of the second strip portion ranges from 0.3mm to 2.0mm, and the line spacing between adjacent second strip portions ranges from 1.0mm to 5.0mm.

7. The display panel according to claim 1, characterized in that, The first part includes a smooth connecting portion, and the second part is connected through the smooth connecting portion; Optionally, the angle between the sidewall of the smooth connecting part and the second part is an oblique angle or an arc angle.

8. The display panel according to claim 1, characterized in that, The surface resistivity of the electrostatic dissipative material layer is in the range of 10. 5 Ω / square-10 12 Ω / square, the volume resistivity of the electrostatic dissipative material layer is in the range of 10 Ω / square. 4 Ω·cm-10 11 Ω·cm; Optionally, the material of the electrostatic dissipation material layer is an antistatic polymer material.

9. The display panel according to claim 1, characterized in that, In the direction perpendicular to the substrate, the thickness of the electrostatic dissipative material layer ranges from 0.05 mm to 0.2 mm; Optionally, the electrostatic dissipative material layer is prepared by coating or vapor deposition.

10. A display device, characterized in that, Includes the display panel as described in claims 1-9.

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