Display device

Abstract

A display device is provided. A display device includes a first pad area disposed in a non-display area of a first substrate, a first pad disposed on an upper surface of the first pad area and including a first pattern and a plurality of second patterns, wherein the plurality of second patterns are spaced apart from each other at a first interval, a second substrate disposed on top of the first substrate and including a second pad area, and a second pad disposed on a lower surface of the second pad area and including a third pattern and a plurality of fourth patterns, wherein the plurality of fourth patterns are spaced apart from each other at a second interval, wherein each of the fourth patterns is disposed in the first interval and contacts a side surface of each of the second patterns.

Description

Technical Field

[0001] This disclosure relates to a device, specifically to, for example, but not limited to, a display device. Background Technology

[0002] The content described in this section is only to provide background information about this disclosure and does not constitute prior art.

[0003] Display devices are used in a variety of electronic devices, such as TVs, smartphones, laptops, and tablets. Research is underway to develop thin, lightweight, and low-power display devices.

[0004] Examples of display devices include liquid crystal display (LCD), field emission display (FED), and organic light-emitting diode (OLED).

[0005] A display device may include a display panel having multiple pixels thereon, and various electronic components for driving the display panel. Among the various electronic components, a driver circuit chip (Drive-IC) can transmit power or signals from a printed circuit board to the display panel to control the multiple pixels.

[0006] Therefore, the construction for reliably transmitting power or signals from a printed circuit board to a display panel has been studied.

[0007] The descriptions provided in the Related Art Discussion section should not be assumed to constitute prior art simply because they are mentioned or related to it. The Related Art Discussion section may contain information describing one or more aspects of the subject matter art, and the descriptions in this section do not limit the scope of disclosure. Summary of the Invention

[0008] The method for connecting the driver circuit chip and the display panel can vary depending on the type of substrate on which the driver circuit chip is mounted. For example, the method for connecting the driver circuit chip to the display panel can include COG (Chip on Glass), COF (Chip on Film), COP (Chip on Plastic), etc.

[0009] Conductive films can be used to electrically connect driver circuit chips and display panels to each other. In a conductive film, multiple conductive balls (or particles) are dispersed within an insulating material. The conductive film can be placed between the display panel and the driver circuit chip, which can then be bonded together using a thermoforming method. Therefore, the conductive balls in the conductive film can contact both the display panel and the driver circuit chip, enabling them to be electrically connected.

[0010] However, in solutions using conductive films, a drawback may arise where the display panel and the driving circuit chip are not electrically connected to each other. In particular, as every type of electronic device has recently been miniaturized and thinned, the size of the various electronic components disposed within these devices is also decreasing. Furthermore, as the size of the electrodes or contact and bonding pads disposed within these electronic components decreases, the pitch that serves as the spacing between adjacent electrodes or adjacent contact and bonding pads also decreases.

[0011] However, short circuits may occur between the contact pads and connection pads that are spaced apart by fine pitch, or open circuits may occur where no electrical connection is established. Therefore, defects may arise where power or signals cannot be stably transmitted to the sub-pixels in the display panel.

[0012] Therefore, the inventors of this disclosure have invented a display device through various experiments that can stably realize the electrical connection between the display panel and the driving circuit chip.

[0013] The technical objective of this disclosure is to provide a display device capable of preventing or reducing electrical connection failures between the display panel and the driver circuit chip.

[0014] In addition, the technical objective of this disclosure is to provide a display device that can prevent or reduce the occurrence of alignment errors, such as misalignment of pads on the drive circuit chip package and pads on the display panel within a reference alignment range, when the drive circuit chip package and the display panel are bonded together.

[0015] In addition, the technical objective of this disclosure is to provide a display device that can prevent or reduce contact and connection failures between a display panel comprising contact pads and connection pads spaced apart by fine pitch and a drive circuit chip comprising contact pads and connection pads spaced apart by fine pitch.

[0016] Furthermore, the technical objective of this disclosure is to provide a display device that can prevent or reduce defective connections between contact pads and connection pads spaced apart by fine pitch, thereby reducing the defect rate of the product and thus reducing the production energy generated due to the additional production of the product, thereby reducing greenhouse gas emissions.

[0017] The purposes of this disclosure are not limited to those described above. Other purposes and advantages of this disclosure (not mentioned) may be understood based on the following description and may be more clearly understood based on embodiments of this disclosure. Furthermore, it will be readily understood that the purposes and advantages of this disclosure may be achieved using the means or combinations thereof as shown in the claims.

[0018] A display device according to an embodiment of the present disclosure includes: a first substrate, the first substrate including a display area and a non-display area disposed outside the display area; a first pad area disposed in the non-display area of ​​the first substrate; a first pad disposed on an upper surface of the first pad area and including a first pattern and a plurality of second patterns, wherein the plurality of second patterns are arranged to be spaced apart from each other by a first interval; a second substrate disposed on a top of the first substrate and including a second pad area; and a second pad disposed on a lower surface of the second pad area and including a third pattern and a plurality of fourth patterns, wherein the plurality of fourth patterns are arranged to be spaced apart from each other by a second interval, wherein each of the fourth patterns is disposed in the first interval and contacts the side surface of each of the second patterns.

[0019] The display device according to embodiments of the present disclosure can be configured to have a structure in which an input pad of the display panel, consisting of multiple pad patterns, and an output pad of the driver circuit chip package, consisting of multiple pad patterns, are interconnected. Therefore, conductive balls can be omitted, thereby preventing or reducing the occurrence of short-circuit defects or open-circuit defects caused by conductive balls.

[0020] Therefore, a stable electrical connection can be achieved between the display panel and the driver circuit chip package, thereby reducing the defect rate of the display device. As a result, the production energy required for additional display device manufacturing can be reduced, and greenhouse gas emissions can be decreased.

[0021] Furthermore, the display device according to the embodiments of this disclosure does not require conductive balls in the bonding process between the display panel and the driving circuit chip package, which allows for the arrangement of contact pads and connection pads spaced apart from each other with a finer pitch in a high-density manner, thereby achieving a high-resolution display device.

[0022] Furthermore, in the display device according to this disclosure, structures configured to minimize or reduce the effects of misalignment during the bonding process can be provided on each of the driver circuit chip package and the display panel. Therefore, alignment errors where each pad of the driver circuit chip package and the display panel is located off-reference alignment range can be prevented or reduced, thereby improving product reliability.

[0023] The effects of this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory, and are intended to further explain the claimed inventive concept. Attached Figure Description

[0025] The accompanying drawings, intended to further illustrate the present disclosure and forming part of this application, depict embodiments of the present disclosure and, together with the specification, serve to explain the principles of the disclosure. In the drawings: Figure 1 This is a plan view of a display device according to an embodiment of the present disclosure.

[0026] Figure 2 yes Figure 1 The exploded view of the component shown.

[0027] Figure 3 yes Figure 2 A magnified plan view of region I.

[0028] Figure 4 yes Figure 2 Enlarged plan view of region II.

[0029] Figure 5 It is along Figure 1 The cross-sectional view taken from line III-III'.

[0030] Figure 6 yes Figure 1 A magnified view of region IV.

[0031] Figures 7 to 10 This is a diagram illustrating a display device according to an embodiment of the present disclosure.

[0032] Figure 11 This is a diagram showing a display device in which a first substrate and a second substrate are connected to each other using conductive balls.

[0033] Figure 12 and Figure 13 This is a diagram illustrating a display device according to another embodiment of the present disclosure.

[0034] Figure 14 and Figure 15 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure.

[0035] Figure 16 and Figure 17 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure.

[0036] Figure 18 and Figure 19 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure. Detailed Implementation

[0037] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will become apparent from reference to the embodiments described in detail below, together with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are set forth only to complete this disclosure and to fully inform those skilled in the art of the scope of this disclosure, which is limited only by the scope of the claims.

[0038] For the sake of simplicity and clarity, the elements in the accompanying drawings are not necessarily drawn to scale. The same reference numerals in different drawings denote the same or similar elements and therefore perform similar functions.

[0039] Furthermore, for the sake of simplicity, descriptions and details of well-known steps and components have been omitted. In addition, numerous specific details are set forth in the following detailed description of this disclosure to provide a thorough understanding of it. However, it should be understood that this disclosure can be practiced without these specific details. In other instances, well-known methods, processes, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of this disclosure.

[0040] Examples of various embodiments will be further illustrated and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. Rather, the invention is intended to cover substitutions, modifications, and equivalents that may be included within the concept and scope of this disclosure as defined by the appended claims.

[0041] The shapes, dimensions, ratios, angles, numbers, etc. disclosed in the drawings used to describe embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto.

[0042] The terminology used herein is intended to describe the purpose of particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a” and “an” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that, when used in this specification, the terms “comprise” and “include” specify the presence of the stated features, integrals, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, operations, elements, components, and / or portions thereof.

[0043] As used herein, the term "and / or" includes any and all combinations of one or more of the listed items. Expressions such as "at least one of" can modify the entire list of elements when preceding a list of elements, and may not modify individual elements within the list. In the interpretation of numerical values, errors or tolerances may occur even when not explicitly described.

[0044] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element, or indirectly disposed on the second element when a third element or layer is disposed between the first element or layer and the second element or layer.

[0045] It should be understood that when a component or layer is referred to as being “connected to” another component or layer, it may be directly on the other component or layer, connected to the other component or layer, or there may be one or more intermediate components or layers.

[0046] It should also be understood that when an element or layer is referred to as "between two elements or layers", it can be the only element or layer between the two elements or layers, or there may be one or more intermediate elements or layers.

[0047] Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "above" or "top" of another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "above" or "top" of another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter. Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "below" another layer, membrane, region, plate, etc., the former can directly contact the latter, or another layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "below" another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter.

[0048] In descriptions of temporal relationships, such as temporal precedents between two events, such as “after,” “following,” “before,” etc., unless it is indicated that “directly after,” “directly following,” or “directly before,” another event may occur in between.

[0049] When an implementation can be different, the functions or operations specified in a particular block can occur in a different order than those specified in the flowchart. For example, two consecutive blocks can actually be executed substantially simultaneously, or the two blocks can be executed in reverse order depending on the functions or operations involved.

[0050] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish an element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the technical concept and scope of this disclosure, the first element, component, region, layer, or portion described below may be referred to as the second element, component, region, layer, or portion.

[0051] Features of the various embodiments of this disclosure can be combined partially or completely with each other, and can be technically related to or operable on each other. These embodiments can be implemented independently of each other, or can be implemented together in a related manner.

[0052] When interpreting numerical values, the value is interpreted to include a range of error unless otherwise explicitly described separately.

[0053] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which the concepts of this invention pertain. It should also be understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0054] In the description of signal flow, for example, when a signal is passed from a first node to a second node, this can include cases where the signal is passed from the first node to the second node via another node, unless the phrases "passed immediately" or "passed directly" are used.

[0055] In the following description, display devices according to various embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0056] Figure 1 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 2 yes Figure 1 The exploded view of the component shown.

[0057] Reference Figure 1 and Figure 2The display device 10 according to embodiments of the present disclosure may include a display panel 100, a printed circuit board 110, and a driver circuit chip package 120. The display panel 100, the printed circuit board 110, and the driver circuit chip package 120 may be electrically connected to each other. In the display device 10 according to embodiments of the present disclosure, the display panel 100 and the driver circuit chip package 120 are connected to each other in a chip-on-film (COF) manner. However, embodiments of the present disclosure are not limited thereto.

[0058] The display panel 100 may include a first substrate 400. The display panel 100 may include a display area DA and a non-display area NDA located outside the display area DA. The display panel 100 may include a plurality of light-emitting elements, circuit elements for driving the light-emitting elements, and a plurality of lines (not shown).

[0059] The display area DA can be the area in which an image is displayed, and the non-display area NDA can be the area in which no image is displayed. The non-display area NDA can be located in the peripheral area or edge area of ​​the display panel 100. However, embodiments of this disclosure are not limited thereto. For example, the area in the display area DA other than the external light-emitting area that emits light can be referred to as the non-display area NDA.

[0060] Multiple pixel regions PA can be disposed in a display region DA. Each pixel region PA may include multiple sub-pixels SP. By applying driving signals to the multiple sub-pixels SP, an image can be displayed in the display region DA. Various lines and circuits for driving the multiple sub-pixels SP of the display region DA can be disposed in a non-display region NDA. For example, a driving circuit including a gating driving circuit and a data driving circuit can be disposed in the non-display region NDA. Multiple drivers for driving the display region DA can be disposed in the non-display region NDA. For example, the drivers may include gating drivers and data drivers. However, embodiments of this disclosure are not limited thereto.

[0061] The display panel 100 may include a plurality of first pad regions 101. The plurality of first pad regions 101 may be disposed in a non-display area NDA of the display panel 100. For example, the first pad regions 101 may be arranged to be spaced apart from each other in a first direction X, and simultaneously disposed at one side edge of the display panel 100. In the non-display area NDA, the area where the plurality of first pad regions 101 are disposed may be referred to as a pad region.

[0062] The printed circuit board 110 may be positioned adjacent to at least one side edge of the non-display area NDA. The printed circuit board 110 may transmit various signals or electrical currents to the display panel 100 via the driver circuit chip package 120. The printed circuit board 110 may include a flexible substrate made of a flexible material. A plurality of third pad regions 102, each having multiple output pads, may be located at one side edge of the printed circuit board 110 and may be provided and arranged to be spaced apart from each other in a first direction X. The plurality of third pad regions 102 may each correspond to a plurality of first pad regions 101.

[0063] A driver circuit chip package 120 can be disposed between the display panel 100 and the printed circuit board 110. Multiple driver circuit chip packages 120 can be provided and arranged to be spaced apart from each other in a first direction X. Each driver circuit chip package 120 can be connected to each third pad area in a plurality of third pad areas 102 and each first pad area in a plurality of first pad areas 101, and is disposed between each third pad area and each first pad area.

[0064] Each driver circuit chip package 120 may include a second substrate 121, a driver circuit chip 123, a plurality of second pad regions 103, and a plurality of lines (not shown). The second substrate 121 may be implemented as a flexible plastic film. At least one driver circuit chip 123 may be included in a driver circuit chip package 120. The plurality of second pad regions 103 may include a first region 103a and a second region 103b. The first regions 103a may be arranged to be spaced apart from each other in a first direction X, and are located at one of two opposite side edges in a second direction Y intersecting the first direction X of the driver circuit chip package 120. The second regions 103b may be arranged to be spaced apart from each other in the first direction X, and are located at the other side edge of two opposite side edges in the second direction Y intersecting the first direction X of the driver circuit chip package 120. A plurality of pads may be included in the second pad regions 103. That is, a plurality of pads may be included in each of the first regions 103a. A plurality of pads may be included in each of the second regions 103b. Multiple pads may include, for example, multiple output pads in a first region and multiple input pads in a second region. This will be discussed later. Figure 4 The description is in the middle.

[0065] The driver circuit chip package 120 can provide power or signals from the printed circuit board 110 to the light-emitting elements of the display panel 100 and the circuit elements for driving the light-emitting elements of the display panel 100. For example, the power or signals may include high-level voltage, low-level voltage, scan signals, data signals, etc.

[0066] One side of the driver circuit chip package 120 in the second direction Y can be connected to the display panel 100, and the other side of the driver circuit chip package 120 in the second direction Y can be connected to the printed circuit board 110. A first region 103a and a second region 103b can be included in a plurality of second pad regions 103 of the driver circuit chip package 120. The first region 103a can be located at a position overlapping with a first pad region 101 of the display panel 100 in the vertical direction. The second region 103b can be located at a position overlapping with a third pad region 102 of the printed circuit board 110 in the vertical direction. In the example, the display panel 100 may include a bendable region in which a portion of the non-display region NDA is bent. When the bendable region of the display panel 100 is bent, the printed circuit board 110 and the driver circuit chip package 120 can be disposed on the rear surface of the display region DA of the display panel 100. The bendable region may refer to the area located between the display panel 100 and the driver circuit chip package 120. For example, the bendable area may be a portion of the non-display area NDA of the display panel 100 that does not overlap with the drive circuit chip package 120 in the vertical direction.

[0067] Figure 3 yes Figure 2 A magnified plan view of region I. Figure 4 yes Figure 2 An enlarged plan view of region II. For example, Figure 3 A first pad area 101 of the display panel 100 is shown. Figure 4 This is an enlarged view of the driver circuit chip package 120. Figure 5 It is along Figure 1 The cross-sectional view taken from line III-III'.

[0068] Reference Figure 3 The first pad region 101 may include a plurality of first pads 200 and a plurality of first lines 210 disposed on a first substrate 400 of the display panel 100. The plurality of first pads 200 may be arranged to be spaced apart from each other in a first direction X. The plurality of first lines 210 may be arranged to be spaced apart from each other in the first direction X.

[0069] Each first line 210 can be connected to a first pad 200. The plurality of first pads 200 can be input pads. For example, the plurality of first pads 200 can be input pads for signals provided from the driver circuit chip package 120. In the example, a surface of the first substrate 400 provided with the plurality of first pads 200 can be a connection surface connected to the driver circuit chip package. The plurality of first pads 200 can be disposed in a first pad region 101, which is disposed on a side edge of the first substrate 400 in a second direction Y. The plurality of first pads 200 can be arranged to be spaced apart from each other along the first direction X of the first substrate 400. The first direction X can also be referred to as the X-axis direction, longitudinal direction, or row direction. Each first pad in the plurality of first pads 200 can be connected to a second pad that serves as an output pad for the driver circuit chip. This will be discussed later. Figure 6 The description is in the middle.

[0070] A first pad 200 may include a first pad pattern. The first pad pattern may include a first pattern 200c and a plurality of second patterns 200p. The first pattern 200c and the plurality of second patterns 200p may be integrally formed with each other. For example, the plurality of second patterns 200p may have a shape that branches from and extends from the first pattern 200c. The first pattern 200c may be formed as a line or rod extending along a first direction X of the first substrate 400. Each of the plurality of second patterns 200p may have a shape that branches from the first pattern 200c and extends in a second direction Y intersecting the first direction X. For example, the first pad 200 may have a comb-like structure.

[0071] Referring to an enlarged view of a first pad 200, each second pattern 200p may have a width w1 in the first direction X, and adjacent second patterns 200p may be spaced apart from each other by a first interval s1 in the first direction X. For example, adjacent second patterns 200p may be arranged to be spaced apart from each other in the first direction X of the first substrate 400. The respective width w1 of the second patterns 200p may be equal to each other. One of the plurality of first lines 210 may be connected to a first pattern 200c. The plurality of first lines 210 may be electrically connected to the plurality of light-emitting elements and circuit elements of the display area DA, respectively.

[0072] The printed circuit board 110 (see) can be used to make it possible to... Figure 1The signals provided are supplied to each of the multiple second patterns 200p of each of the multiple first pads 200 of the display panel 100. The multiple second patterns 200p and the first pattern 200c can be integrally formed such that the signals supplied to the sub-pixel SP from the multiple second patterns 200p can be identical to each other. Therefore, the signals provided from the printed circuit board 110 can be divided into identical signals flowing through the multiple second patterns 200p, and then these identical signals can be merged again into a single signal in the first pattern 200c. The merged signal can be transmitted to the sub-pixel SP via a first line 210 connected to the first pattern 200c. In this case, each of the identical signals flowing through the multiple second patterns 200p can be identical to the signal flowing through the first pattern 200c.

[0073] From printed circuit board 110 (see Figure 1 The signal provided can be transmitted via Figure 4 The second pad 300 and the third pad 320 of the driver circuit chip package 120 are transferred to the multiple first pads 200 of the display panel 100.

[0074] Reference Figure 4 The driver circuit chip package 120 may include a second substrate 121, second pads 300 and third pads 320 disposed on the surface of the second substrate 121, and a plurality of second lines 310. The second pads 300 and third pads 320 of the driver circuit chip package 120 may include a plurality of second pads 300 and a plurality of third pads 320. The plurality of second pads 300 may be output pads for outputting signals to the display panel 100. The plurality of third pads 320 may be input pads to which signals or power supplied from the printed circuit board 110 are input. In the example, a surface of the second substrate 121 disposed of the second pads 300 and third pads 320 may be a connection surface connecting to each of the display panel 100 and the printed circuit board 110.

[0075] Multiple second pads 300 can be disposed in a first region 103a of the second pad region 103, which is disposed on a side edge of the second substrate 121 in a second direction Y. The multiple second pads 300 can be arranged to be spaced apart from each other along the first direction X of the second substrate 121. The first direction X can also be referred to as the X-axis direction, longitudinal direction, or row direction. The multiple second pads 300 can be respectively connected to multiple first pads 200 of the display panel 100. This will be discussed later. Figure 6 The description is in the middle.

[0076] A second pad 300 may include a second pad pattern. The second pad pattern may include a third pattern 300c and a plurality of fourth patterns 300p. The third pattern 300c and the plurality of fourth patterns 300p may be integrally formed with each other. For example, each of the plurality of fourth patterns 300p may have a shape that branches from and extends from the third pattern 300c. The third pattern 300c may be formed as a line or rod extending along a first direction X of the second substrate 121. Each of the plurality of fourth patterns 300p may have a shape that branches from the third pattern 300c and extends in a second direction Y intersecting the first direction X. For example, the second pad 300 may have a comb-like structure.

[0077] Referring to an enlarged view of the second pad 300, each of the fourth patterns in the fourth pattern 300p may include a first fin pattern 300p1 and a second fin pattern 300p2. The first fin pattern 300p1 and the second fin pattern 300p2 may be arranged alternately with each other. For example, each of the second fin patterns 300p2 may be disposed between adjacent fin patterns in the first fin pattern 300p1. The first fin pattern 300p1 may constitute each of two opposite ends in a first direction X of the second pad 300.

[0078] The first fin pattern 300p1 and the second fin pattern 300p2 can have different widths w2 and w3. For example, the width w2 of the first fin pattern 300p1 in the first direction X can be greater than the width w3 of the second fin pattern 300p2 in the first direction X. Adjacent first fin patterns 300p1 can be arranged to be spaced apart from each other by a second interval s2. The second fin pattern 300p2 branching from the third pattern 300c can be disposed in the region of the second interval s2. For example, the first fin pattern 300p1 and the second fin pattern 300p2 can be spaced apart from each other by a third interval s3. The first fin pattern 300p1 and the second fin pattern 300p2 can have different vertical lengths. This will be discussed later. Figure 8 The description is in the middle.

[0079] Multiple third pads 320 may be disposed in a second region 103b opposite to the first region 103a in the second direction Y. The second region 103b may be located on the other edge of the second substrate 121 in the second direction Y. The multiple third pads 320 may be arranged to be spaced apart from each other along the first direction X of the second substrate 121. The multiple third pads 320 may be connected to the printed circuit board 110. The shape of each third pad in the multiple third pads 320 may be different from the shape of each second pad in the multiple second pads 300. For example, in a plan view, each third pad in the multiple third pads 320 may be formed as a polygonal plate. For example, in a plan view, a third pad 320 may have a rectangular shape, having a short side extending in the first direction X and a long side extending in the second direction Y.

[0080] The driver circuit chip 123 can be disposed and connected to the plurality of second pads 300 and the plurality of third pads 320 in the second direction Y. The plurality of second pads 300 and the driver circuit chip 123 can be electrically connected to each other via a plurality of second lines 310, and the plurality of third pads 320 and the driver circuit chip 123 can be electrically connected to each other via a plurality of second lines 310. For example, the first sub-line 310a of the plurality of second lines 310 can electrically connect the plurality of third pads 320 to the driver circuit chip 123. The second sub-line 310b of the plurality of second lines 310 can electrically connect the plurality of second pads 300 to the driver circuit chip 123.

[0081] For example, from printed circuit board 110 (see Figure 1 The provided signal can be transmitted to the driver circuit chip 123 via multiple third pads 320 and the first sub-line 310a. The driver circuit chip 123 can convert the provided signal and provide the converted signal to the display panel 100 via the second sub-line 310b and multiple second pads 300.

[0082] The signal can be provided to the third pattern 300c of each of the multiple second pads 300, and then divided into identical signals flowing through multiple fourth patterns 300p respectively. These divided identical signals can then be provided to the display panel 100. In this case, the signal provided to the third pattern 300c and the identical signals flowing through the multiple fourth patterns 300p respectively can be the same signal. In this example, the signal provided to the display panel 100 via the multiple second pads 300 can be transmitted to the thin-film transistor TFT in the display panel 100, and the operation of each sub-pixel SP can be controlled based on the signal passing through the thin-film transistor TFT.

[0083] The first substrate 400 may include a plastic film or glass. When the first substrate 400 is implemented as a plastic film, a stack of multiple layers made of insulating material may be disposed on the first substrate. A first buffer layer 405 may be disposed on the first substrate 400. The first buffer layer 405 may cover the surface of the first substrate 400. The first buffer layer 405 may reduce or prevent or reduce the penetration of moisture, oxygen, or impurities through the first substrate 400. The first buffer layer 405 may have a single-layer structure or a multilayer structure made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first buffer layer 405 may completely cover the first substrate 400. For example, the first buffer layer 405 may extend into the first pad region 101 (see...). Figure 2 ).

[0084] A light-shielding layer 409 may be disposed on the first buffer layer 405. The light-shielding layer 409 can prevent or reduce external light incident on the first transistor 420. For this purpose, an opaque metallic material may be included in the light-shielding layer 409. A second buffer layer 412 may be disposed on the light-shielding layer 409. The second buffer layer 412 can protect the first transistor 420 from moisture, oxygen, or impurities. The second buffer layer 412 may have a single-layer structure or a multi-layer structure made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). However, embodiments of the present disclosure are not limited thereto. The second buffer layer 412 may completely cover the first substrate 400. For example, the second buffer layer 412 may extend to the first pad region 101 belonging to the non-display area NDA (see Figure 2 In the first pad region 101, the first buffer layer 405 and the second buffer layer 412 may be vertically overlapped with each other. The stack of the first buffer layer 405 and the second buffer layer 412 in the first pad region 101 may be referred to as a multi-buffer layer 410.

[0085] The first transistor 420 can be disposed on the second buffer layer 412. The first transistor 420 may include a first semiconductor layer 421, a first gate insulating layer 422, a first gate electrode 423, a first source electrode 424, and a first drain electrode 425. In the example, the first transistor 420 may be a driving transistor electrically connected to the light-emitting element 460. The region of the first semiconductor layer 421 that overlaps with the first gate electrode 423 in the vertical direction may be a channel region. The source / drain regions may be disposed on two opposite sides of the channel region, respectively. The first semiconductor layer 421 may be configured to overlap with the light shielding layer 409 in the vertical direction. The light shielding layer 409 may prevent or reduce external light incident on the first semiconductor layer 421.

[0086] A first gate insulating layer 422 may be disposed between the first semiconductor layer 421 and the first gate electrode 423. The first gate insulating layer 422 may extend outwards while covering the first semiconductor layer 421. In an example, the first gate insulating layer 422 may extend into the first pad region 101 (see [link to example]). Figure 2 ).

[0087] The first gate electrode 423 may be disposed on the first gate insulating layer 422. The first interlayer insulating layer 414 may be disposed on the first gate electrode 423. The first gate insulating layer 422 or the first interlayer insulating layer 414 may have a single-layer structure or a multilayer structure made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx). The first source electrode 424 and the first drain electrode 425 may contact and be electrically connected to the first semiconductor layer 421.

[0088] The storage capacitor 430 may include a first storage electrode 431 and a second storage electrode 432. For example, the first storage electrode 431 may be located in the same layer as the first gate electrode 423 and may be made of the same material as the first gate electrode 423. The first storage electrode 431 may be disposed on the first gate insulating layer 422 and located at a position spaced apart from the first gate electrode 423. The second storage electrode 432 may be disposed on the first interlayer insulating layer 414 to overlap the first storage electrode 431 in the vertical direction.

[0089] The second interlayer insulating layer 416 can be disposed on the second storage electrode 432. The second interlayer insulating layer 416 can have a single-layer structure or a multi-layer structure made of an inorganic insulating material such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0090] The second transistor 440 may be disposed on the second interlayer insulating layer 416 and spaced apart from the first transistor 420 in a first or second direction. The second transistor 440 may be electrically connected to the first transistor 420. For example, the second transistor 440 may include a second semiconductor layer 441, a second gate insulating layer 442, a second gate electrode 443, a second source electrode 445, and a second drain electrode 446. For example, the second transistor 440 may be used as a switching transistor. The second semiconductor layer 441 may include a channel region and a source / drain region. The region of the second semiconductor layer 441 that overlaps with the second gate electrode 443 in the vertical direction may be the channel region. The source / drain regions may be disposed on two opposite sides of the channel region, respectively. In the example, the second semiconductor layer 441 may be configured to overlap with the storage capacitor 430 in the vertical direction. Therefore, the storage capacitor 430 may prevent or reduce external light from outside the first substrate 400 from incident on the second semiconductor layer 441. Therefore, changes in electrical characteristics (such as the threshold voltage of the second transistor 440) caused by external light may be prevented or reduced.

[0091] The second gate insulating layer 442 may be disposed between the second semiconductor layer 441 and the second gate electrode 443. The second gate insulating layer 442 may have a single-layer structure or a multi-layer structure made of an inorganic insulating material (e.g., silicon oxide (SiOx) or silicon nitride (SiNx)). The first gate electrode 423 or the second gate electrode 443 may have a single-layer structure or a multi-layer structure made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof. However, the material is not limited to these.

[0092] The third interlayer insulating layer 418 may be disposed on the second gate electrode 443. The third interlayer insulating layer 418 may include an inorganic insulating material. For example, the third interlayer insulating layer 418 may include silicon oxide, silicon nitride, and silicon oxynitride.

[0093] The first source electrode 424, the first drain electrode 425, the second source electrode 445, and the second drain electrode 446 can be disposed on the third interlayer insulating layer 418. The first source electrode 424 and the first drain electrode 425 can extend through the third interlayer insulating layer 418, the second gate insulating layer 442, the second interlayer insulating layer 416, the first interlayer insulating layer 414, and the first gate insulating layer 422 to directly contact and connect to the source / drain regions of the first semiconductor layer 421, respectively.

[0094] The second source electrode 445 and the second drain electrode 446 can extend through the third interlayer insulating layer 418 and the second gate insulating layer 442 to directly contact and connect to the source / drain regions of the second semiconductor layer 441, respectively. The second drain electrode 446 of the second transistor 440 can be electrically connected to the storage capacitor 430. For example, a portion of the second drain electrode 446 can extend through the third interlayer insulating layer 418, the second gate insulating layer 442, the second interlayer insulating layer 416, and the first interlayer insulating layer 414 to directly contact and connect to the first storage electrode 431 of the storage capacitor 430.

[0095] Each of the first source electrode 424, the first drain electrode 425, the second source electrode 445, or the second drain electrode 446 may have a single-layer or multi-layer structure made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. However, embodiments of this disclosure are not limited thereto. In an example, the first source electrode 424, the first drain electrode 425, the second source electrode 445, or the second drain electrode 446 may have a stacked structure of titanium / aluminum / titanium layers (Ti / Al / Ti).

[0096] Passivation layer 447 may be disposed on the first source electrode 424, the first drain electrode 425, the second source electrode 445, or the second drain electrode 446. Passivation layer 447 may include an inorganic insulating material, such as silicon oxide, silicon nitride, or silicon oxynitride. Passivation layer 447 may protect the pixel driving circuit disposed thereunder.

[0097] A planarization layer 450 may be disposed on the passivation layer 447. The planarization layer 450 can planarize steps caused by pixel driving circuitry disposed beneath the planarization layer 450. The planarization layer 450 may have a multilayer structure. The planarization layer 450 may include a first planarization layer 451 and a second planarization layer 452. For example, the planarization layer 450 may include an organic insulating material such as polyimide or acrylic resin. The planarization layer 450 is shown having a structure in which the first planarization layer 451 and the second planarization layer 452 are vertically stacked in the figure. However, embodiments of this disclosure are not limited thereto. The planarization layer 450 may have a multilayer structure further including a third planarization layer (not shown).

[0098] Pixel contact electrode 455 may be disposed on the first planarization layer 451. Pixel contact electrode 455 may extend through the first planarization layer 451 and passivation layer 447 to directly contact the first drain electrode 425 of the first transistor 420.

[0099] The light-emitting element 460 can be formed on the planarization layer 450. For example, the light-emitting element 460 can also be disposed on the second planarization layer 452. The light-emitting element 460 may include a first electrode 461, a light-emitting layer 463, a second electrode 465, and a capping layer 467.

[0100] The light-emitting element 460 can be electrically connected to the pixel driving circuit via a first electrode 461. For example, the first electrode 461 can extend through the second planarization layer 452 to directly contact the pixel contact electrode 455. Therefore, the first electrode 461 can be electrically connected to the first transistor 420 via the pixel contact electrode 455. The pixel contact electrode 455 can include a conductive material. For example, the pixel contact electrode 455 can include metallic materials such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), and tungsten (W). For example, the pixel contact electrode 455 can have a multilayer structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0101] The first electrode 461 may include a transparent conductive layer. For example, the first electrode 461 may include ITO (indium tin oxide) or IZO (indium zinc oxide). The first electrode 461 may also be referred to as an anode electrode or a pixel electrode.

[0102] A dam 462 may be disposed on the first electrode 461. The dam 462 may be configured to cover the edge of the first electrode 461. A portion of the dam 462 may extend to be disposed on the second planarization layer 452. The portion of the upper surface of the first electrode 461 not covered by the dam 462 that is to be exposed may be used as a light-emitting region. The dam 462 may be made of an organic insulating material. The dam 462 may include, for example, photosensitive polyimide, photoacryloyl, or benzocyclobutene (BCB). In examples, the dam 462 may include a black material, a light-blocking material, or a light-absorbing material. The dam 462 may include a material that absorbs light within a specific wavelength range. The dam 462 may have a structure in which at least two color filters of different colors, namely a red color filter, a green color filter, and a blue color filter, are stacked.

[0103] Spacer 464 can be provided on the embankment 462. Spacer 464 can be provided to prevent or reduce damage to the embankment 462 and the first electrode 461 during processing. Spacer 464 can be made of the same material as the embankment 462.

[0104] The light-emitting layer 463 can be disposed on the first electrode 461. The light-emitting layer 463 may include a hole transport layer (HTL), an organic light-emitting layer (EML), an electron transport layer (ETL), a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL). The light-emitting layer 463 may have a multilayer structure.

[0105] The second electrode 465 can be disposed on the light-emitting layer 463. The second electrode 465 can be commonly connected to the light-emitting layer 463 formed in all sub-pixels. Therefore, the second electrode 465 can also be referred to as a cathode electrode or a common electrode. The second electrode 465 may include a semi-transmissive and semi-reflective conductive material. For example, the second electrode 465 may include a metallic material, such as magnesium (Mg), silver (Ag), or an alloy of silver (Ag) and magnesium (Mg) (Ag-Mg).

[0106] A capping layer 467 may be disposed on the second electrode 465. The capping layer 467 can correct optical properties by preventing or reducing light loss generated from the light-emitting layer 463.

[0107] An encapsulation portion 470 may be disposed on the light-emitting element 460. The encapsulation portion 470 may protect the light-emitting element 460 from external oxygen or moisture. The encapsulation portion 470 may include a multilayer structure comprising a first encapsulation layer 471, a second encapsulation layer 472, and a third encapsulation layer 475 stacked together. The second encapsulation layer 472 may be disposed between the first encapsulation layer 471 and the third encapsulation layer 475. An inorganic insulating material may be included in each of the first encapsulation layer 471 and the third encapsulation layer 475, and an organic insulating material may be included in the second encapsulation layer 472.

[0108] Although not shown in the figure, a touch unit can be disposed on the package portion 470 when the display device performs a touch operation. The touch unit may include a touch sensor array and a touch sensor array protective layer.

[0109] Figure 6 yes Figure 1 A magnified view of region IV. Figures 7 to 10 This is a diagram illustrating a display device according to an embodiment of the present disclosure. For example, Figure 6 This is an enlarged view of the part where the display panel and printed circuit board are connected to a driver circuit chip package. Figure 7 yes Figure 6 A magnified view of region V. Figure 8 This illustrates an embodiment according to the present disclosure. Figure 7 A diagram of the cross section taken by line VI-VI'. Figure 9 yes Figure 7 A magnified perspective view of part A. Figure 10 It is a cross-sectional view showing the width of each of the second and fourth patterns in the first direction X when the second and fourth patterns are connected to each other.

[0110] Reference Figure 6Multiple third pads 320 disposed on the other side edge of the second substrate 121 of each driver circuit chip package 120 in the second direction Y can be configured to overlap with the third pad region 102 of the printed circuit board 110 in the vertical direction and can be electrically connected to the third pad region 102. Multiple second pads 300 disposed on one side edge of the second substrate 121 of each driver circuit chip package 120 in the second direction Y can be opposite to the multiple third pads 320 in the second direction Y, and can be configured to overlap with the multiple first pads 200 in the first pad region 101 of the display panel 100 in the vertical direction, and can be electrically connected to the multiple first pads 200 respectively. For example, the printed circuit board 110 can be electrically connected to the driver circuit chip 123 via the multiple third pads 320 and the second sub-line 310b. The driving circuit chip 123 can be electrically connected via the first sub-line 310a to the first pad 200 of the display panel 100 that overlaps with a plurality of second pads 300 in the vertical direction, and can therefore be electrically connected via a plurality of first lines 210 to the display area DA.

[0111] The plurality of second pads 300 of the driver circuit chip package 120 and the plurality of first pads 200 of the display panel 100 can be electrically connected to each other in a direct contact manner. The connection between a second pad 300 of the driver circuit chip package 120 and a first pad 200 of the display panel 100 will be described below by way of example.

[0112] Reference Figure 7 and Figure 8 The second pad 300 of the driver circuit chip package 120 and the first pad 200 of the display panel 100 can be electrically connected to each other. For example, the first pad 200 and the second pad 300 can be configured to overlap each other in the vertical direction. For example, in a plan view, the second pattern 200p of the first pad 200 can be disposed in a region corresponding to a second interval s2 between adjacent first fin patterns 300p1 of the plurality of fourth patterns 300p of the second pad 300. In addition, in a plan view, each first fin pattern 300p1 of the plurality of fourth patterns 300p of the second pad 300 can be disposed in a region corresponding to a first interval s1 between adjacent second patterns 200p of the first pad 200.

[0113] The first fin pattern 300p1 of the second pad 300 can be disposed outside the second pattern 200p at each of the two opposite ends constituting the first pad 200 in the first direction X. For this purpose, the number of first fin patterns 300p1 of the fourth pattern 300p of the second pad 300 can be at least one greater than the number of second patterns 200p of the first pad 200.

[0114] The first fin pattern 300p1 of the second pad 300 can be partially inserted into the region corresponding to the first interval s1 between adjacent second patterns 200p disposed in the second pattern 200p of the first pad 200. (Refer to...) Figure 8 The first fin pattern 300p1 and the second fin pattern 300p2 of the second pad 300 can have different vertical lengths. In this respect, the vertical length can refer to the dimension in a direction perpendicular to the plane defined by the first direction X and the second direction Y. For example, the first fin pattern 300p1 can have a first vertical length h1, and the second fin pattern 300p2 can have a second vertical length h2 that is less than the first vertical length h1. Therefore, the second pattern 200p of the first pad 200 can contact the second fin pattern 300p2 of the second pad 300 in the region corresponding to the second interval s2. For example, the upper surface of the second pattern 200p can contact the bottom surface of the second fin pattern 300p2.

[0115] On the first substrate 400 and in the first pad area 101 of the display panel 100 (see...) Figure 6 Multiple buffer layers 410 can be provided in the first substrate. The multiple buffer layers 410 can have a stacked structure of a first buffer layer 405 and a second buffer layer 412 disposed on the display area DA of the first substrate. A first gate insulating layer 422 can be disposed on the multiple buffer layers 410. The first gate insulating layer 422 can be referred to as a protective layer. A first pad 200 can be disposed on the first gate insulating layer 422. The first pad 200 can be made of the same material as the first gate electrode 423 of the display area DA and formed in the same process as the process of forming the first gate electrode 423 of the display area DA. A second pad 300 disposed on the second substrate 121 of the driver circuit chip package 120 can include a metal material containing copper (Cu).

[0116] A filler layer 500 may be disposed between the first gate insulating layer 422 of the display panel 100 and the second substrate 121 of the driver circuit chip package 120. Each of the first fin patterns 300p1 in the plurality of fourth patterns 300p of the second pad 300 may extend through the filler layer 500 to directly contact and connect to the second pattern 200p of the first pad 200. The filler layer 500 may be made of an insulating material. For example, the filler layer 500 may not include conductive materials, such as conductive balls (or particles), and may be made solely of insulating material. For example, resin may be included in the filler layer 500.

[0117] Each of the plurality of second patterns 200p of the first pad 200 may have a first surface 200a and a second surface 200b that are opposite to each other in the vertical direction. In this respect, the width of the first surface 200a in the first direction X and the width of the second surface 200b in the first direction X may be different from each other. The first surface 200a may be spaced apart from the first gate insulating layer 422, and the second surface 200b may be opposite to the first surface 200a. The first surface 200a may contact the second fin pattern 300p2 of the second pad 300. For example, the second pattern 200p may have a tapered shape, the width of which increases as the second pattern 200p extends from the first surface 200a to the second surface 200b. Therefore, the second pattern 200p may have a trapezoidal shape in cross-sectional view. The second pattern 200p may include an inclined side surface 200i having a ramp from the first surface 200a to the second surface 200b.

[0118] The first fin pattern 300p1 of the fourth pattern 300p of the second pad 300 may have a first surface 300a1 and a second surface 300b1 that are opposite to each other in the vertical direction. At this point, the width of the first surface 300a1 in the first direction X and the width of the second surface 300b1 in the first direction X may be equal to each other. At this point, the first surface 300a1 of the first fin pattern 300p1 may be the surface in contact with the second substrate 121, and the second surface 300b1 of the first fin pattern 300p1 may be the surface facing the first gate insulating layer 422. Therefore, each of the first fin patterns 300p1 in the first fin pattern 300p1 of the second pad 300 may have a rectangular shape in cross-sectional view. However, embodiments of the present disclosure are not limited thereto. Additionally, the second fin pattern 300p2 of the fourth pattern 300p may have a first surface 300a2 and a second surface 300b2 that are opposite to each other, and the first surface 300a2 and the second surface 300b2 may have the same width in the first direction. In this respect, the first surface 300a2 of the second fin pattern 300p2 can be the surface in contact with the second substrate 121, and the second surface 300b2 can be the surface in contact with the first surface 200a of the second pattern 200p of the first pad 200. Therefore, the second fin pattern 300p2 can have a rectangular shape in cross-sectional view. However, embodiments of the present disclosure are not limited thereto. The width of the second fin pattern 300p2 in the first direction X can be smaller than the width of the second pattern 200p in the first direction X, such that there is no portion of the second fin pattern 300p2 that does not overlap with the second pattern 200p of the first pad 200 in the vertical direction. Therefore, the width of the second fin pattern 300p2 in the first direction X is smaller than the width of the first fin pattern 300p1 in the first direction X.

[0119] The angles of the corners of the first fin pattern 300p1 of the second pad 300 can be no greater than 90 degrees. Therefore, the corners 300v of the first fin pattern 300p1 can be sharp enough to extend through the fill layer 500 covering the inclined side surface 200i of the second pattern 200p. Thus, as... Figure 8 As shown in the enlarged view of a partial area, each corner (or tip) 300v of the first fin pattern 300p1 can extend through the filler layer 500 in region C1 to directly contact the inclined side surface 200i of the second pattern 200p. Therefore, the first pad 200 of the display panel 100 and the second pad 300 of the drive circuit chip package 120 can be electrically connected to each other in direct contact.

[0120] The second fin pattern 300p2 of the second pad 300 can overlap with the first surface 200a of the second pattern 200p of the first pad 200 in the vertical direction. When pressure is applied to connect the display panel 100 and the driver circuit chip package 120, the second surface 300b2 of the second fin pattern 300p2 can extend through the filler layer 500. Therefore, the second surface 300b2 of the second fin pattern 300p2 and the first surface 200a of the second pattern 200p can be electrically connected to each other in direct contact within region C2. Therefore, the fourth pattern 300p of the driver circuit chip package 120, including the first fin pattern 300p1 and the second fin pattern 300p2, can not only directly contact the inclined side surface 200i of the second pattern 200p, but also directly contact the first surface 200a of the second pattern 200p, thereby increasing the contact area and thus enabling a stable electrical connection to the second pattern 200p.

[0121] Reference Figure 9 At least the first fin pattern 300p1 of the fourth pattern 300p of the drive circuit chip package 120 can extend in the longitudinal direction (second direction Y) of the second pattern 200p of the first pad 200 of the display panel 100. Therefore, each corner 300v of the first fin pattern 300p1 can be in surface contact with the inclined side surface 200i of the second pattern 200p while extending in its longitudinal direction.

[0122] In the display device according to embodiments of the present disclosure, instead of using point-contact conductive balls, the second pattern 200p and the first fin pattern 300p1 can be electrically connected to each other via line contact, and the second fin pattern 300p2 and the second pattern 200p can be electrically connected to each other via surface contact, thereby reliably connecting the driving circuit chip 123 and the display panel 100 to each other. Therefore, compared to point contact, the contact and connection area between the second pattern 200p and the fourth pattern 300p can be increased. Consequently, the contact resistance between the second pattern 200p and the fourth pattern 300p is reduced, thereby improving conductivity.

[0123] The first fin pattern 300p1 of the fourth pattern 300p of the driving circuit chip package 120 is partially inserted into the region corresponding to the first interval s1 between adjacent second patterns 200p of the display panel 100, thereby contacting the respective inclined side surfaces 200i of the adjacent second patterns 200p facing each other. For this purpose, the width of the first fin pattern 300p1 of the driving circuit chip package 120 in the first direction X can be smaller than the first interval s1 between adjacent second patterns 200p of the display panel 100 in the first direction X.

[0124] Reference Figure 8 and Figure 10 The width between the respective facing side ends of the first surfaces 200a of adjacent second patterns 200p can be a first width b. The width between the respective facing side ends of the inclined side surfaces 200i of adjacent second patterns 200p can be a second width a, which is less than the first width b.

[0125] The first fin pattern 300p1 of the driver circuit chip package 120 is typically inserted into a region corresponding to the first interval s1 between the second patterns 200p of the display panel 100, and is in direct contact with the inclined side surfaces 200i of adjacent second patterns 200p facing each other. Therefore, the third width c of a first fin pattern 300p1 in the first direction X can be less than the first width b and greater than the second width a. Additionally, the lower surface of the second fin pattern 300p2 of the driver circuit chip package 120 is typically in contact with the first surface 200a, which is the upper surface of the second pattern 200p. Therefore, the width w3 of the second fin pattern 300p2 in the first direction X can be less than the width w1 of the second pattern 200p in the first direction X.

[0126] The display device according to the embodiments of the present disclosure, which uses a direct contact method, can transmit signals more stably than a display device using a connection scheme utilizing conductive balls. In the following, reference will be made to... Figure 11 This will be described.

[0127] Figure 11 This is a diagram showing a display device in which a first substrate 400 and a second substrate 121 are connected to each other using conductive balls.

[0128] Reference Figure 11 An anisotropic conductive film 510 is disposed between the second substrate 121 of the driver circuit chip package 120 and the first substrate 400 of the display panel 100. In the anisotropic conductive film 510, a plurality of conductive balls 505 are dispersed in a filler layer 500. A first bump IC-BP, serving as a contact and connection terminal, is disposed on the lower surface of the second substrate 121 of the driver circuit chip package, and a second bump P-BP, also serving as a contact and connection terminal, is disposed on the upper surface of the first substrate 400 of the display panel 100. The lower surface of the first bump IC-BP and the upper surface of the second bump P-BP can face each other. Different signals can be provided to adjacent first bump IC-BPs.

[0129] With the anisotropic conductive film 510 disposed between the first substrate 400 and the second substrate 121, the first substrate 400 and the second substrate 121 can be connected to each other by applying pressure to them. A plurality of conductive balls 505 can contact the first bump IC-BP and the second bump P-BP in the vertical direction. Then, the first bump IC-BP and the second bump P-BP are electrically connected to each other through the conductive balls 505. That is, since a plurality of conductive balls 505 are disposed between the first bump IC-BP and the second bump P-BP, the contact scheme between them can be a point contact scheme.

[0130] Since different signals are provided to adjacent first bump IC-BPs, the horizontally dispersed conductive balls 505 are typically electrically insulated from each other. However, the first bump IC-BPs may be spaced apart with a fine pitch, or the second bump IC-BPs may be spaced apart with a fine pitch, resulting in connection defects DF1 and DF2 due to the conductive balls 505.

[0131] For example, a connection defect occurs when the conductive balls 505 are not uniformly distributed. In this example, the conductive balls 505 may be arranged in a cluster between the first bump IC-BP or the second bump P-BP, which are spaced apart from each other in the horizontal direction. As a result, the first bump IC-BP or the second bump P-BP, which are spaced apart from each other in the horizontal direction, will be electrically connected to each other, resulting in a connection defect DF1, which is a short-circuit defect. Alternatively, the conductive balls 505 may be unevenly distributed, such that there may be no conductive balls between the first bump IC-BP and the second bump P-BP, which overlap in the vertical direction. As a result, a connection defect DF2, which is an open-circuit defect, occurs, where the first bump IC-BP and the second bump P-BP are not electrically connected to each other.

[0132] In the connection scheme using the anisotropic conductive film 510, it is difficult to maintain a stable electrical connection between the display panel 100 and the driver circuit chip package 120 because the electrical connection between them is achieved using conductive balls 505 that are non-uniformly dispersed in the filler layer. In addition, the conductive balls 505 are connected to each other in a point contact manner, which increases the contact resistance between them and thus consumes a large amount of power.

[0133] In this respect, in the display device according to the embodiments of the present disclosure, the display panel 100 and the driving circuit chip package 120 can be electrically connected to each other in such a way that a plurality of fourth patterns 300p of the driving circuit chip package 120 and a plurality of second patterns 200p of the display panel 100 are in direct surface contact and line contact with each other. Therefore, the electrical connection therebetween can be stably maintained even without the use of conductive balls. In addition, since conductive balls are not applied, the occurrence of short-circuit defects and open-circuit defects can be prevented or reduced. Furthermore, since the plurality of second patterns 200p and the plurality of fourth patterns 300p are in direct surface contact and line contact with each other, the contact and connection area between the second patterns 200p and the fourth patterns 300p can be increased. With the increase of contact and connection area, the contact resistance between patterns 200p and 300p can be reduced, and thus the conductivity therebetween can be improved. In addition, since the plurality of second patterns 200p and the plurality of fourth patterns 300p are in direct contact with each other and electrically connected to each other, the signal path length can be shortened. Therefore, noise generated due to the increase in signal path length can be prevented or reduced.

[0134] Furthermore, a display device according to another embodiment of this disclosure may include a structure capable of minimizing or reducing the effects of alignment between the plurality of second patterns 200p and the plurality of fourth patterns 300p during the process of connecting the plurality of second patterns 200p and the plurality of fourth patterns 300p to each other. This will be described below with reference to the accompanying drawings.

[0135] Figure 12 and Figure 13 This is a diagram illustrating a display device according to another embodiment of the present disclosure. Figure 12 and Figure 13 Zhongyu Figure 7 and Figure 8 The same reference numerals in the figures can indicate the same as Figure 7 and Figure 8 The same components are used in the same way. Therefore, redundant descriptions will be omitted or briefly explained.

[0136] Reference Figure 12 and Figure 13The second pad 300 of the driver circuit chip package 120 and the first pad 200 of the display panel 100 can be arranged to overlap each other in the vertical direction. The first pad 200 may include a first pad pattern. In addition, a first stabilizing pattern 445p and a second stabilizing pattern 455p may be stacked on the first pad 200. The second pad 300 may include a second pad pattern.

[0137] The first pad pattern may include a first pattern 200c and a plurality of second patterns 200p. Each of the plurality of second patterns 200p may have a shape that branches off from and extends from the first pattern 200c. For example, the first pad 200 may have a comb-like structure. The second patterns 200p may be arranged to be spaced apart from each other at predetermined intervals in a first direction X.

[0138] Each of the first stabilizing pattern 445p and the second stabilizing pattern 455p can be used as a structure capable of minimizing or reducing the effects of alignment during the joining process. Each of the first stabilizing pattern 445p and the second stabilizing pattern 455p can be used as an auxiliary structure capable of maintaining position. The first stabilizing pattern 445p can be referred to as the first auxiliary structure, and the second stabilizing pattern 455p can be referred to as the second auxiliary structure.

[0139] For example, all second patterns 200p may have the same thickness. In this case, the second pad pattern to be joined to the second pattern 200p may not be aligned with it during the bonding process. For example, during the bonding process, the second pad pattern may shift in the left or right direction. As a result, alignment errors may occur where the second pad pattern is positioned off-reference alignment range. When alignment errors occur, the second pad pattern may not be positioned where it extends through the filler layer 500 to contact the second pattern 200p. As a result, defects may occur where the second pad pattern does not contact the first pad pattern, and thus product defects may occur. Therefore, according to embodiments of the present disclosure, an auxiliary structure may be included that is capable of maintaining the position of the second pad pattern relative to the first pad pattern so as not to deviate from the alignment range during the bonding process.

[0140] The auxiliary structure allows the position of the second pad pattern to remain within the alignment range of the central region CL of the array of multiple second patterns 200p. The auxiliary structure may include a first stabilizing pattern 445p and a second stabilizing pattern 455p.

[0141] Therefore, the first stabilizing pattern 445p can be disposed on each of the plurality of second patterns 200p. The first stabilizing pattern 445p can be disposed on a portion of some of the plurality of second patterns 200p. The plurality of second patterns 200p can be arranged to be spaced apart from each other in the direction of each of the two opposite end regions EP surrounding the central region CL and facing the first direction X. The first stabilizing pattern 445p can be disposed on each of the second patterns 200p disposed in the central region CL. The first stabilizing pattern 445p can be disposed on the upper surface of the second pattern 200p disposed in the central region CL and on two inclined side surfaces in the first direction. The first stabilizing pattern 445p can be disposed on a portion of the second pattern 200p disposed in each of the two opposite end regions EP. More specifically, the first stabilizing pattern 445p can be disposed on a portion of the upper surface of the second pattern 200p disposed in each of the two opposite end regions EP and on an inclined side surface. Therefore, the first stabilizing pattern 445p is not disposed on a portion of the upper surface of the second pattern 200p in each of the two opposite end regions EP and on the other inclined side surface, so that the other inclined side surface and a portion of the upper surface can be exposed.

[0142] The width of the first stabilizing pattern 445p disposed on a portion of the upper surface of the second pattern 200p and on an inclined side surface in the first direction X can be half the overall width of the second pattern 200p in the first direction X. For example, when the overall width of the second pattern 200p in the first direction X is 3 μm, the overall width of the first stabilizing pattern 445p disposed on a portion of the upper surface of the second pattern 200p and on an inclined side surface in the first direction X can be 1.5 μm.

[0143] The second stabilizing pattern 455p can be disposed on the first stabilizing pattern 445p disposed in the central region CL. The second stabilizing pattern 455p can be stacked on one of two opposite regions in a first direction surrounding the central vertical axis of the first stabilizing pattern 445p. For example, the second stabilizing pattern 455p can be disposed on half of the upper surface of the first stabilizing pattern 445p and an inclined side surface 445i.

[0144] The width of the second stabilizing pattern 455p, located on half of the upper surface of the first stabilizing pattern 445p and on an inclined side surface 445i, in the first direction X can be half the overall width of the second pattern 200p in the first direction X. For example, when the overall width of the second pattern 200p in the first direction X is 3 μm, the overall width of the second stabilizing pattern 455p in the first direction X can be 1.5 μm. In this example, the width of the second stabilizing pattern 455p in the first direction X does not exceed half the overall width of the second pattern 200p in the first direction X.

[0145] Since the first stabilizing pattern 445p and the second stabilizing pattern 455p are disposed on the second pattern 200p in the central region CL, the central region CL can include a first portion and a second portion. In the first portion, both the first stabilizing pattern 445p and the second stabilizing pattern 455p are disposed on the second pattern 200p, and in the second portion, only the first stabilizing pattern 445p is disposed on the second pattern 200p. This second portion, in which only the first stabilizing pattern 445p is disposed on the second pattern 200p, and a third portion in which the surface of the second pattern 200p is exposed, can be included in the respective end regions EP of the two opposite end regions EP. Therefore, a stepped structure can be formed in which the overall thickness of the structure on the first substrate 400 gradually increases as the first substrate 400 extends from the respective end regions EP of the two opposite end regions EP toward the central region CL. That is, the thickness of the structure can be the greatest in the first portion of the central region CL, and its thickness can be the smallest in the third portion of the respective end regions EP of the two opposite end regions EP.

[0146] Conductive material may be included in each of the first stabilizing pattern 445p and the second stabilizing pattern 455p. For example, the first stabilizing pattern 445p may be made of the same material as the second source electrode 445 of the display area DA, and formed in the same process as the process of forming the second source electrode 445 of the display area DA. For example, the second stabilizing pattern 455p may be made of the same material as the pixel contact electrode 455, and formed in the same process as the process of forming the pixel contact electrode 455. For example, the first stabilizing pattern 445p or the second stabilizing pattern 455p may have a single-layer structure or a multi-layer structure made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof. In an example, the first stabilizing pattern 445p or the second stabilizing pattern 455p may have a stacked structure of titanium layer / aluminum layer / titanium layer (Ti / Al / Ti).

[0147] The second pad pattern of the driver circuit chip package 120 (see...) Figure 6 The fin pattern 300c may include a third pattern 300c and a plurality of fourth patterns 300p. The plurality of fourth patterns 300p may include a first fin pattern 300p1a, a second fin pattern 300p1b, and a third fin pattern 300p1c. Among the plurality of fourth patterns 300p, the first fin pattern 300p1a may constitute a fourth pattern disposed in each of two opposite end regions EP. Among the plurality of fourth patterns 300p, the third fin pattern 300p1c may constitute a fourth pattern disposed in the central region CL. The second fin pattern 300p1b may be disposed in the first direction X between the first fin pattern 300p1a and the third fin pattern 300p1c.

[0148] The first fin pattern 300p1a, the second fin pattern 300p1b, and the third fin pattern 300p1c may have different thicknesses. For example, among the plurality of fourth patterns 300p, the first fin pattern 300p1a constituting the fourth pattern disposed at each end region EP in two opposite end regions EP of the plurality of fourth patterns 300p may have a first thickness ha, and the third fin pattern 300p1c constituting the fourth pattern disposed at the central region CL of the plurality of fourth patterns 300p may have a third thickness hc. The second fin pattern 300p1b disposed between the first fin pattern 300p1a and the third fin pattern 300p1c in the first direction X may have a second thickness hb.

[0149] The third thickness hc of the third fin pattern 300p1c disposed in the central region CL can be the smallest, while the first thickness ha of the first fin pattern 300p1a disposed in each of the two opposite end regions EP can be the largest. The second thickness hb of the second fin pattern 300p1b can be greater than the third thickness hc of the third fin pattern 300p1c and less than the first thickness ha of the first fin pattern 300p1a. Therefore, as the multiple fourth patterns 300p are arranged sequentially in the direction from each of the two opposite end regions EP to the central region CL, the thickness of the multiple fourth patterns 300p gradually decreases.

[0150] A first stabilizing pattern and / or a second stabilizing pattern are stacked on a plurality of second patterns 200p to form a stack. The stack is arranged in a first direction X. As the stack is arranged sequentially from each end region EP in two opposite end regions EP toward the central region CL, the thickness of the stack can gradually increase. The thickness of the plurality of fourth patterns 300p gradually decreases as they are arranged sequentially from each end region EP in two opposite end regions EP toward the central region CL. Each of the plurality of fourth patterns 300p can be inserted into the space defined between adjacent patterns in the second patterns 200p. Therefore, each of the plurality of fourth patterns 300p can be inserted into the space defined between adjacent second patterns 200p in a wedge shape.

[0151] The first fin pattern 300p1a of the fourth pattern 300p is disposed in each of the two opposite end regions EP and has the maximum thickness. Therefore, the pattern with the maximum thickness in the outermost region allows the connection between the second pattern and the fourth pattern located inside it to be maintained, thereby maintaining the alignment between the second and fourth patterns during the bonding process. Each corner of the first fin pattern 300p1a can extend through the filler layer 500 to contact and be electrically connected to the inclined side surface 200i of the second pattern 200p corresponding to that corner. The third fin pattern 300p1c of the fourth pattern 300p is disposed in the central region CL and has the minimum thickness. The third fin pattern 300p1c can also be kept in contact with the corresponding inclined side surfaces 455i of the adjacent second stabilizing pattern 455p, which face each other. Therefore, the second stabilizing pattern 455p allows the connection between the second pattern and the fourth pattern located outside it to be maintained, such that the alignment between the second and fourth patterns can be maintained during the bonding process. Each corner of the third fin pattern 300p1c can extend through the filler layer 500 to contact and be electrically connected to the inclined side surfaces 455i facing each other of the adjacent second stabilizing pattern 455p.

[0152] Figure 14 and Figure 15 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure. Figure 14 and Figure 15 The thickness of each stack of the second pattern 200p and the first and / or second stable patterns, the thickness of each of the fourth patterns in the plurality of fourth patterns 300p, and the position of each of the first and second stable patterns 445p are related to the thickness of each stack of the second and third stable patterns 455p. Figure 12 and 13 different. Figure 14 and Figure 15 Zhongyu Figure 12 and Figure 13 The same reference numerals in the figures can indicate the same as Figure 12 and Figure 13 The same components are used in the same way. Therefore, redundant descriptions will be omitted or briefly explained.

[0153] Reference Figure 14 and Figure 15 The second pad 300 of the driver circuit chip package 120 and the first pad 200 of the display panel 100 can be arranged to overlap each other in the vertical direction. The first pad 200 may include a first pad pattern. In addition, a first stabilizing pattern 445p and a second stabilizing pattern 455p may be disposed on the first pad 200. The second pad 300 may include a second pad pattern.

[0154] The first pad pattern may include a first pattern 200c and a plurality of second patterns 200p. Each of the plurality of second patterns 200p may have a shape that branches off from and extends from the first pattern 200c. For example, the first pad 200 may have a comb-like structure. The second patterns 200p may be arranged to be spaced apart from each other at predetermined intervals in a first direction X.

[0155] Each of the first stabilizing pattern 445p and the second stabilizing pattern 455p can be used as a structure capable of minimizing or reducing the effects of alignment during the joining process. Each of the first stabilizing pattern 445p and the second stabilizing pattern 455p can be used as an auxiliary structure capable of maintaining position. The first stabilizing pattern 445p can be referred to as the first auxiliary structure, and the second stabilizing pattern 455p can be referred to as the second auxiliary structure.

[0156] For example, all second patterns 200p may have the same thickness. In this case, the second pad pattern to be joined to the second pattern 200p may not be aligned with it during the bonding process. For example, during the bonding process, the second pad pattern may shift in the left or right direction. As a result, alignment errors may occur where the second pad pattern is set at a position deviating from the reference alignment range. When alignment errors occur, the second pad pattern may not be set at the position where the second pad pattern extends through the filler layer 500 to contact the second pattern 200p. As a result, defects may occur where the second pad pattern does not contact the first pad pattern, and thus product defects may occur. Therefore, according to embodiments of the present disclosure, an auxiliary structure may be included that is capable of maintaining the position of the second pad pattern relative to the first pad pattern so as not to deviate from the alignment range during the bonding process.

[0157] The auxiliary structure allows the position of the second pad pattern to remain within the alignment range of the central region CL of the array of multiple second patterns 200p. The auxiliary structure may include a first stabilizing pattern 445p and a second stabilizing pattern 455p.

[0158] Therefore, the first stabilizing pattern 445p can be disposed on each of the plurality of second patterns 200p. The first stabilizing pattern 445p can be disposed on a portion of each of the plurality of second patterns 200p. The plurality of second patterns 200p can be arranged to be spaced apart from each other in the direction of each of the two opposite end regions EP surrounding the central region CL and facing the first direction X. The first stabilizing pattern 445p can be disposed on each of the second patterns 200p disposed in the central region CL. The first stabilizing pattern 445p can be disposed on the upper surface of the second patterns 200p disposed in the two opposite end regions EP and on two inclined side surfaces in the first direction.

[0159] The first stabilizing pattern 445p may be disposed on a portion of the second pattern 200p disposed in the central region CL. More specifically, the first stabilizing pattern 445p may be disposed on a portion of the upper surface and a sloping side surface of the second pattern 200p disposed in the central region CL. Therefore, the first stabilizing pattern 445p is not disposed on a portion of the upper surface and the other sloping side surface of the second pattern 200p disposed in the central region, such that the other sloping side surface and a portion of the upper surface can be exposed.

[0160] The width of the first stabilizing pattern 445p disposed on a portion of the upper surface of the second pattern 200p and on an inclined side surface in the first direction X can be half the overall width of the second pattern 200p in the first direction X. For example, when the overall width of the second pattern 200p in the first direction X is 3 μm, the overall width of the first stabilizing pattern 445p disposed on a portion of the upper surface of the second pattern 200p and on an inclined side surface in the first direction X can be 1.5 μm.

[0161] Since the first stabilizing pattern 445p and the second stabilizing pattern 455p are disposed on the second pattern 200p in the central region CL, each of the two opposite end regions EP can include a first portion and a second portion. In the first portion, both the first stabilizing pattern 445p and the second stabilizing pattern 455p are disposed on the second pattern 200p. In the second portion, only the first stabilizing pattern 445p is disposed on the second pattern 200p. This second portion, in which only the first stabilizing pattern 445p is disposed on the second pattern 200p, and a third portion in which the surface of the second pattern 200p is exposed, can be included in the central region CL. Therefore, a stepped structure can be formed, wherein the total thickness of the structure on the first substrate 400 gradually decreases as the first substrate 400 extends from each of the two opposite end regions EP toward the central region CL. That is, the thickness of the structure can be the smallest in the first portion of the central region CL, and its thickness can be the largest in the third portion of the end regions EP.

[0162] Conductive material may be included in each of the first stabilizing pattern 445p and the second stabilizing pattern 455p. For example, the first stabilizing pattern 445p may be made of the same material as the second source electrode 445 of the display area DA, and formed in the same process as the process of forming the second source electrode 445 of the display area DA. For example, the second stabilizing pattern 455p may be made of the same material as the pixel contact electrode 455, and formed in the same process as the process of forming the pixel contact electrode 455. For example, the first stabilizing pattern 445p or the second stabilizing pattern 455p may have a single-layer structure or a multi-layer structure made of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof. In an example, the first stabilizing pattern 445p or the second stabilizing pattern 455p may have a stacked structure of titanium layer / aluminum layer / titanium layer (Ti / Al / Ti).

[0163] The second pad pattern of the driver circuit chip package 120 (see...) Figure 6 The fin pattern 300c may include a third pattern 300c and a plurality of fourth patterns 300p. The plurality of fourth patterns 300p may include a first fin pattern 300p1a, a second fin pattern 300p1b, and a third fin pattern 300p1c. The first fin pattern 300p1a may constitute a fourth pattern disposed in each of two opposite end regions EP of the plurality of fourth patterns 300p. The third fin pattern 300p1c may constitute a fourth pattern disposed in the central region CL of the plurality of fourth patterns 300p. The second fin pattern 300p1b may be disposed between the first fin pattern 300p1a and the third fin pattern 300p1c in a first direction X.

[0164] The first fin pattern 300p1a, the second fin pattern 300p1b, and the third fin pattern 300p1c may have different thicknesses. For example, among the plurality of fourth patterns 300p, the first fin pattern 300p1a constituting the fourth pattern in each of the two opposite end regions EP of the plurality of fourth patterns 300p may have a first thickness ha, and the third fin pattern 300p1c constituting the fourth pattern disposed at the central region CL of the plurality of fourth patterns 300p may have a third thickness hc. The second fin pattern 300p1b disposed between the first fin pattern 300p1a and the third fin pattern 300p1c in the first direction X may have a second thickness hb.

[0165] The third thickness hc of the third fin pattern 300p1c located in the central region CL can be maximized, while the first thickness ha of the first fin pattern 300p1a located in each of the two opposite end regions EP can be minimized. The second thickness hb of the second fin pattern 300p1b can be less than the third thickness hc of the third fin pattern 300p1c and greater than the first thickness ha of the first fin pattern 300p1a. Therefore, as multiple fourth patterns 300p are sequentially arranged in the direction from each of the two opposite end regions EP to the central region CL, the thickness of the multiple fourth patterns 300p gradually increases.

[0166] A first stabilizing pattern and / or a second stabilizing pattern are stacked on a plurality of second patterns 200p to form a stack. The stack is arranged in a first direction X. As the stack is arranged sequentially along a direction from each end region EP in two opposite end regions EP toward the central region CL, the thickness of the stack can gradually decrease. As the plurality of fourth patterns 300p are arranged sequentially along a direction from each end region EP in two opposite end regions EP toward the central region CL, the thickness of the plurality of fourth patterns 300p gradually increases. Each of the plurality of fourth patterns 300p can be inserted into the space defined between adjacent patterns in the second patterns 200p. Therefore, each of the plurality of fourth patterns 300p can be inserted into the space defined between adjacent second patterns 200p in a wedge shape.

[0167] The third fin pattern 300p1c of the fourth pattern 300p is disposed in the central region CL and has the maximum thickness. The third fin pattern 300p1c can also be kept in contact with the respective inclined side surfaces of the adjacent second pattern 200p that face each other. Therefore, the connection between the second and fourth patterns can be maintained in the central region CL, thereby maintaining alignment between the second and fourth patterns during the bonding process. Each corner of the third fin pattern 300p1c can extend through the filler layer 500 to contact and be electrically connected to the respective inclined side surfaces of the adjacent second pattern 200p that face each other.

[0168] The first fin pattern 300p1a of the fourth pattern 300p is disposed in each of the two opposite end regions EP. Therefore, the pattern located in the outermost region allows the connection between the second pattern and the fourth pattern located inside it to be maintained, ensuring alignment between the second and fourth patterns during the bonding process. It also allows the first fin pattern 300p1a to remain in contact with the inclined side surface 455i of the second stabilizing pattern 455p. Therefore, the second stabilizing pattern 455p allows the connection between the second pattern and the fourth pattern located outside it to be maintained, ensuring alignment between the second and fourth patterns during the bonding process. The corners of the first fin pattern 300p1a can extend through the filler layer 500 to contact and be electrically connected to the inclined side surface 455i of the second stabilizing pattern 455p.

[0169] In one embodiment, when the second pattern 200p, which comprises a metallic material, is exposed to moisture, corrosion or electrolytic corrosion may occur, resulting in defects. Therefore, a display device according to another embodiment of the present disclosure may include a structure capable of preventing or reducing the exposure of the second pattern 200p to moisture.

[0170] Figure 16 and Figure 17 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure. Figure 16 and Figure 17 Zhongyu Figure 12 and Figure 13 The same reference numerals in the figures can indicate the same as Figure 12 and Figure 13 The same components are used in the same way. Therefore, redundant descriptions will be omitted or briefly explained.

[0171] Reference Figure 16 and Figure 17The second pad 300 of the driver circuit chip package 120 and the first pad 200 of the display panel 100 can be arranged to overlap each other in the vertical direction. The first pad 200 may include a first pad pattern. The second pad 300 may include a second pad pattern.

[0172] The first pad pattern may include a first pattern 200c and a plurality of second patterns 200p. The plurality of second patterns 200p may have a shape that branches off from and extends from the first pattern 200c. For example, the first pad 200c may have a comb-like structure. The second patterns 200p may be spaced apart from each other at predetermined intervals. For example, the plurality of second patterns 200p may be arranged to be spaced apart from each other in a direction surrounding a central region CL toward each of two opposite end regions EP.

[0173] A cover layer 461p can be disposed on each of the plurality of second patterns 200p. The cover layer 461p can completely cover the exposed surfaces of each of the second patterns 200p. For example, the cover layer 461p can cover the upper surface of the second pattern 200p and the two inclined side surfaces in the first direction. The cover layer 461p can be made of the same material as the first electrode 461 of the display area DA and formed using the same process as that used to form the first electrode 461 of the display area DA. Therefore, since no additional processing is required, the process can be simplified, and production energy can be reduced.

[0174] The cover layer 461p contains a material capable of preventing or reducing moisture penetration, thereby preventing or reducing moisture penetration into the second pattern 200p. Therefore, corrosion defects or electrolytic corrosion defects in the second pattern 200p can be prevented or reduced. This can prevent or reduce operational malfunctions of the display device, thereby improving product reliability.

[0175] An auxiliary structure for preventing or reducing misalignment between the second and fourth patterns can be provided on the cover layer 461p. The auxiliary structure can be provided on a plurality of second patterns 200p, at least on the central region CL, to keep the position of the second pad patterns within the alignment range. The auxiliary structure may include a second stabilizing pattern 455p. In embodiments of this disclosure, an example in which the second stabilizing pattern 455p acts as an auxiliary structure is described. However, this disclosure is not limited thereto. For example, the auxiliary structure may be implemented as a first stabilizing pattern 445p (see...). Figure 13 ).

[0176] The second stabilizing pattern 455p can be disposed on each of the second patterns among a plurality of second patterns 200p. For example, the second stabilizing pattern 455p can also be disposed on the second pattern 200p adjacent to the vertical central axis of the central region CL. The second stabilizing pattern 455p can be stacked on one of two opposite regions in a first direction of the second pattern 200p. For example, the second stabilizing pattern 455p can be disposed on each of the respective inclined side surfaces 461i of the cover layer 461p facing each other, the cover layer 461p being disposed on the second patterns 200p adjacent to each other in the central region CL. The second stabilizing pattern 455p can be on and extend along one inclined side surface 461i of the cover layer 461p and on and extend along a portion of the upper surface of the cover layer 461p. Thus, a portion of the upper surface of the cover layer 461p and the other inclined side surface can be exposed. As a result, a stepped structure can be formed, wherein the total thickness of the structure on the first substrate 400 gradually increases as the first substrate 400 extends from each of the two opposite end regions EP toward the central region CL.

[0177] Conductive material may be included in the second stabilizing pattern 455p. For example, the second stabilizing pattern 455p may be made of the same material as the pixel contact electrode 455 and formed in the same process as the pixel contact electrode 455. In an example, the second stabilizing pattern 455p may have a stacked structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0178] The fourth pattern 300p of the second pad pattern may include a first fin pattern 300p1a, a second fin pattern 300p1b, and a third fin pattern 300p1c. The first fin pattern 300p1a may be disposed in two opposite end regions EP. The third fin pattern 300p1c may be disposed in the central region CL. The second fin pattern 300p1b may be disposed in the first direction X between the first fin pattern 300p1a and the third fin pattern 300p1c.

[0179] The first fin pattern 300p1a, the second fin pattern 300p1b, and the third fin pattern 300p1c may have different thicknesses corresponding to the thickness of the stack, each stack comprising a second pattern 200p and a cover layer and / or a second stabilizing pattern. For example, the first fin pattern 300p1a disposed in each of two opposite end regions EP may have a first thickness ha, and the third fin pattern 300p1c disposed in the central region CL may have a third thickness hc. The second fin pattern 300p1b disposed between the first fin pattern 300p1a and the third fin pattern 300p1c may have a second thickness hb.

[0180] The third thickness hc of the third fin pattern 300p1c disposed in the central region CL can be the minimum thickness, and the first fin pattern 300p1a disposed in each of the two opposite end regions EP can have the maximum thickness. The second thickness hb of the second fin pattern 300p1b can be less than the first thickness ha of the first fin pattern 300p1a and greater than the third thickness hc of the third fin pattern 300p1c. Therefore, as the multiple fourth patterns 300p are arranged sequentially in the direction from each of the two opposite end regions EP to the central region CL, the thickness of the multiple fourth patterns 300p gradually decreases.

[0181] The third fin pattern 300p1c disposed in the central region CL can contact the cover layer 461p and the second stabilizing pattern 455p disposed on the second pattern 200p, and maintain the position of the second pattern 200p, thereby preventing or reducing misalignment between the second and fourth patterns during the bonding process. The third fin pattern 300p1c can contact the inclined side surface 455i of the second stabilizing pattern 455p and can be electrically connected to the second pattern 200p.

[0182] The first fin pattern 300p1a can have a maximum thickness and can maintain the connection between the second and fourth patterns in each of the two opposite end regions EP to prevent or reduce misalignment between them. The corners of the first fin pattern 300p1a can extend through the filler layer 500 to contact the inclined side surface 461i of the cover layer 461p. Therefore, the first fin pattern 300p1a can be electrically connected to the second pattern 200p.

[0183] Figure 18 and Figure 19 This is a diagram illustrating a display device according to yet another embodiment of the present disclosure. Figure 18 and Figure 19 Zhongyu Figure 12 and Figure 13 The same reference numerals in the figures can indicate the same as Figure 12 and Figure 13 The same components are used in the same way. Therefore, redundant descriptions will be omitted or briefly explained.

[0184] Reference Figure 18 and Figure 19 The second pad 300 of the driver circuit chip package 120 and the first pad 200 of the display panel 100 can be configured to overlap each other in the vertical direction. The first pad 200 may include a first pad pattern. The second pad 300 may include a second pad pattern.

[0185] The first pad pattern may include a first pattern 200c and a plurality of second patterns 200p. The second patterns 200p may be spaced apart from each other at predetermined intervals. The width of the upper surface of the second pattern 200p in the first direction X may be smaller than the width of its bottom surface in the first direction X. Therefore, the inclined side surface may be defined between its upper surface and bottom surface. An auxiliary structure for preventing or reducing misalignment may be provided on the upper surface of the second pattern 200p. The auxiliary structure may include a first stabilizing pattern 445p. The width of the first stabilizing pattern 445p in the first direction X may be smaller than the width of the second pattern 200p in the first direction X. Therefore, a portion of the upper surface of the second pattern 200p may not be covered by the first stabilizing pattern 445p and is thus exposed.

[0186] In embodiments of this disclosure, an example of using a first stabilizing pattern 445p as an auxiliary structure is described. However, embodiments of this disclosure are not limited thereto. For example, the auxiliary structure can be implemented as a second stabilizing pattern 455p (see...). Figure 13 Additionally, the auxiliary structure can be implemented as a 461p overlay (see...). Figure 17 ).

[0187] Conductive material may be included in the first stabilizing pattern 445p. For example, the first stabilizing pattern 445p may be made of the same material as the second source electrode 445 of the display area DA, and may be formed in the same process as the process for forming the second source electrode 445 of the display area DA. In one example, the second stabilizing pattern 455p may have a stacked structure of titanium / aluminum / titanium (Ti / Al / Ti).

[0188] Each of the plurality of fourth patterns 300p in the second pad pattern may include a body 300-1 and a protrusion 300-2. The body 300-1 and the protrusion 300-2 of each of the plurality of fourth patterns 300p may be integrally formed with each other. The width of the protrusion 300-2 in the first direction X may be smaller than the width of the body 300-1 in the first direction X. The protrusion 300-2 may overlap at least vertically with the central region of the body 300-1. Therefore, the width of the protrusion in the first direction is smaller than the width of the body in the first direction, such that each right-angled surface is defined between each side surface of the two opposite side surfaces of the body 300-1 in the first direction and the lower surface of the protrusion 300-2. In this case, the right-angled surface may define a step between the protrusion 300-2 and the body 300-1. The fourth pattern 300p including the body 300-1 and the protrusion 300-2 may also be referred to as a wedge pattern.

[0189] The fourth pattern 300p can be inserted into the space between adjacent second patterns 200p. In this respect, the right-angled surface defined between the lower surface of the protrusion 300-2 of the fourth pattern 300p and the side surface of the body 300-1 can contact the upper surface of the second pattern 200p and its inclined side surface 200i. The horizontal portion of the right-angled surface can contact the upper surface of the second pattern 200p, and the vertical portion of the right-angled surface can contact the inclined side surface of the second pattern 200p. For example, a portion of the lower surface of the body 300-1 of the fourth pattern 300p can be configured to contact a portion of the upper surface of the second pattern 200p.

[0190] Furthermore, the protrusion 300-2 can extend through the filler layer 500, such that each corner of the protrusion 300-2 at two opposite corners in the first direction X is in surface contact with each of the two opposite inclined side surfaces 200i of the second pattern 200p in the first direction. As a result, the fourth pattern 300p and the second pattern 200p can be electrically connected to each other by surface contact and / or line contact. Additionally, a portion of the upper surface of the second pattern 200p and a portion of the lower surface of the body 300-1 of the fourth pattern 300p are in contact with each other, thereby increasing the contact and connection area between them. Therefore, the contact resistance between the second pattern 200p and the fourth pattern 300p is reduced, thereby improving their conductivity.

[0191] Additionally, the first stabilizing pattern 445p disposed on the upper surface of the second pattern 200p can minimize or reduce the effects of misalignment during the joining process. For example, the first stabilizing pattern 445p can maintain the position of the fourth pattern 300p so as not to deviate from the alignment range during the joining process.

[0192] According to embodiments of this disclosure, the driver circuit chip package and the display panel can be electrically connected to each other, with the respective pads of the driver circuit chip package and the display panel in surface contact and / or line contact. Therefore, conductive balls can be omitted in the bonding process, thereby preventing or reducing the occurrence of short-circuit and open-circuit defects. Thus, a stable electrical connection between the display panel and the driver circuit chip can be achieved, and consequently, the defect rate of the display device can be reduced. As a result, the additional production energy required for the production of the display device can be reduced, thereby having the effect of reducing greenhouse gas emissions.

[0193] Furthermore, when the pads of the driver circuit chip package and the display panel are connected to each other via direct surface / line contact, the contact and connection area between them increases. Therefore, the contact resistance between them can be reduced, thereby improving their conductivity.

[0194] Furthermore, since the conductive balls can be omitted, the design margin for arranging them can be eliminated, allowing the pads to be arranged with finer pitches. This reduces the area size of individual pad regions within the same area. Consequently, pads can be arranged more densely per unit area. Therefore, this results in the ability to achieve high-resolution display devices.

[0195] Furthermore, in the display device according to this disclosure, structures configured to minimize or reduce the effects of misalignment during the bonding process can be provided on each of the driver circuit chip package and the display panel. Therefore, alignment errors in which the pads of the driver circuit chip package and the display panel are located off-reference alignment ranges can be prevented or reduced, thereby improving product reliability.

[0196] The display device according to various aspects and embodiments of this disclosure can be described as follows.

[0197] One aspect of this disclosure provides a display device comprising: a first substrate including a display area and a non-display area disposed outside the display area; a first pad area disposed in the non-display area of ​​the first substrate; a first pad disposed on an upper surface of the first pad area and including a first pattern and a plurality of second patterns, wherein the plurality of second patterns are arranged to be spaced apart from each other by a first interval; a second substrate disposed on a top of the first substrate and including a second pad area; and a second pad disposed on a lower surface of the second pad area and including a third pattern and a plurality of fourth patterns, wherein the plurality of fourth patterns are arranged to be spaced apart from each other by a second interval, wherein each of the fourth patterns is disposed in the first interval and contacts the side surface of each of the second patterns.

[0198] According to some embodiments of this disclosure, the first pattern extends in a first direction of the first substrate, wherein the plurality of second patterns are arranged in the first direction, and each of the plurality of second patterns branches from the first pattern and extends in a second direction intersecting the first direction.

[0199] According to some embodiments of this disclosure, the third pattern extends in a first direction of the second substrate, wherein the plurality of fourth patterns are arranged in the first direction, and each of the plurality of fourth patterns branches from the third pattern and extends in a second direction intersecting the first direction.

[0200] According to some embodiments of this disclosure, the first widths of the plurality of second patterns in a first direction are equal to each other.

[0201] According to some embodiments of this disclosure, each of the plurality of fourth patterns includes a first fin pattern and a second fin pattern, wherein the first fin pattern and the second fin pattern of the plurality of fourth patterns are arranged alternately to each other and spaced apart from each other in a first direction, wherein the first fin patterns are arranged to be spaced apart from each other by a second interval, wherein the second fin patterns are disposed between adjacent first fin patterns, wherein the first fin patterns constitute each end of two opposite ends of the second pad in the first direction, and wherein the first fin pattern and the second fin pattern branch from the third pattern.

[0202] According to some embodiments of this disclosure, the first width of the first fin pattern and the second width of the second fin pattern are different from each other.

[0203] According to some embodiments of this disclosure, the first width of the first fin pattern is greater than the second width of the second fin pattern.

[0204] According to some embodiments of this disclosure, the vertical length of the second fin pattern is less than the vertical length of the first fin pattern, and wherein one surface of the second fin pattern is in contact with the upper surface of the second pattern.

[0205] According to some embodiments of the present disclosure, the display device further includes a filler layer disposed between the first substrate and the second substrate, wherein each of the plurality of fourth patterns extends through the filler layer to contact the side surface of the second pattern.

[0206] According to some embodiments of this disclosure, the filler layer is made of an insulating material that does not contain conductive material.

[0207] According to some embodiments of this disclosure, the plurality of second patterns are arranged to be spaced apart from each other in a direction from the central region of the first substrate to each of the two opposite end regions of the first substrate in a first direction. The display device further includes: a first auxiliary structure that covers the upper surface of the second pattern disposed on the central region and two opposite side surfaces in the first direction, and covers a portion of the upper surface of the second pattern disposed on each of the two opposite end regions and one of the two opposite side surfaces in the first direction; and a second auxiliary structure that is disposed on one of the two opposite inclined side surfaces in the first direction of the first auxiliary structure on the central region, and on a portion of the upper surface of the first auxiliary structure on the central region.

[0208] According to some embodiments of this disclosure, the width of the second auxiliary structure in the first direction is less than 1 / 2 of the width of the second pattern in the first direction.

[0209] According to some embodiments of this disclosure, the plurality of fourth patterns include a first fin pattern, a second fin pattern, and a third fin pattern, wherein the first fin pattern, the second fin pattern, and the third fin pattern have different thicknesses, wherein the corner of the third fin pattern contacts the side surface of the second auxiliary structure, wherein the corner of the second fin pattern contacts the side surface of the first auxiliary structure, and wherein the corner of the first fin pattern contacts the side surface of the second pattern.

[0210] According to some embodiments of this disclosure, the first fin pattern has the greatest thickness, and the third fin pattern has the smallest thickness.

[0211] According to some embodiments of this disclosure, the plurality of second patterns are arranged to be spaced apart from each other toward a central region and toward two opposite end regions. The display device further includes: a first auxiliary structure covering the upper surface and two side surfaces of the second patterns disposed on each end region in the opposite end regions; and a second auxiliary structure disposed on a portion of the upper surface and an outwardly inclined surface of the first auxiliary structure.

[0212] According to some embodiments of this disclosure, the plurality of fourth patterns include a first fin pattern, a second fin pattern, and a third fin pattern, wherein the first fin pattern, the second fin pattern, and the third fin pattern have different thicknesses, wherein the corner of the first fin pattern contacts the side surface of the second auxiliary structure, wherein the corner of the second fin pattern contacts the side surface of the first auxiliary structure, and wherein the corner of the third fin pattern contacts the side surface of the second pattern.

[0213] According to some embodiments of this disclosure, the third fin pattern has the greatest thickness, and the first fin pattern has the smallest thickness.

[0214] According to some embodiments of this disclosure, the plurality of second patterns are arranged to be spaced apart from each other toward a central region and toward two opposite end regions, wherein the display device further includes: a cover layer covering the upper surface and two inclined side surfaces of each of the second patterns; and an auxiliary structure disposed on a portion of the upper surface of the cover layer covering the second patterns disposed on the central region and on an inclined side surface.

[0215] According to some embodiments of this disclosure, the display device further includes an auxiliary structure disposed on the upper surface of each of the plurality of second patterns arranged along a first direction, wherein the width of the auxiliary structure is smaller than the width of the upper surface of the second pattern.

[0216] According to some embodiments of this disclosure, each of the plurality of fourth patterns includes: a body; a protrusion extending from the body into a region corresponding to the first interval; and a right-angled surface defined between a side surface of the body and a lower surface of the protrusion, wherein the right-angled surface contacts an upper surface and an inclined side surface of the second pattern.

[0217] Although embodiments of the present disclosure have been described with reference to the accompanying drawings, the present disclosure is not limited to the above embodiments, but can be implemented in various different forms. Those skilled in the art will understand that the present disclosure can be practiced in other specific forms without changing the technical concept or essential characteristics of the present disclosure. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not limiting.

Claims

1. A display device, the display device comprising: A first substrate, the first substrate including a display area and a non-display area disposed outside the display area; A first pad area is disposed in the non-display area of ​​the first substrate; A first pad is disposed on the upper surface of the first pad area and includes a first pattern and a plurality of second patterns, wherein the plurality of second patterns are arranged to be spaced apart from each other by a first interval. A second substrate, disposed on top of the first substrate and including a second pad area; and The second pad is disposed on the lower surface of the second pad region and includes a third pattern and a plurality of fourth patterns, wherein the plurality of fourth patterns are arranged to be spaced apart from each other by a second interval. Each of the fourth patterns in the fourth pattern is disposed in the first interval and contacts the side surface of each of the second patterns in the second pattern.

2. The display device according to claim 1, wherein, The first pattern extends in a first direction on the first substrate. The plurality of second patterns are arranged in the first direction, and each of the plurality of second patterns branches from the first pattern and extends in a second direction that intersects the first direction.

3. The display device according to claim 1, wherein, The third pattern extends in a first direction on the second substrate. The plurality of fourth patterns are arranged in the first direction, and each of the plurality of fourth patterns branches from the third pattern and extends in a second direction that intersects the first direction.

4. The display device according to claim 1, wherein, The first widths of the plurality of second patterns in the first direction are equal to each other.

5. The display device according to claim 1, wherein, The plurality of fourth patterns include a first fin pattern and a second fin pattern. In this plurality of fourth patterns, the first fin pattern and the second fin pattern are arranged alternately and spaced apart from each other in a first direction. The first fin pattern is arranged such that it is spaced apart from each other by the second interval. Wherein, the first fin pattern constitutes each of the two opposite ends of the second pad in the first direction. The first fin pattern and the second fin pattern branch from the third pattern.

6. The display device according to claim 5, wherein, The first width of the first fin pattern and the second width of the second fin pattern are different from each other.

7. The display device according to claim 5, wherein, The first width of the first fin pattern is greater than the second width of the second fin pattern.

8. The display device according to claim 5, wherein, The vertical length of the second fin pattern is less than the vertical length of the first fin pattern, and In this configuration, one surface of the second fin pattern is in contact with the upper surface of the second pattern.

9. The display device according to claim 1, wherein, The display device further includes a filler layer disposed between the first substrate and the second substrate. Each of the plurality of fourth patterns extends through the filler layer to contact the side surface of the second pattern.

10. The display device according to claim 9, wherein, The filling layer is made of an insulating material that does not contain conductive materials.

11. The display device according to claim 1, wherein, The plurality of second patterns are arranged to be spaced apart from each other in a direction from the central region of the first substrate to the respective end regions of two opposite end regions of the first substrate in a first direction. The display device further includes: A first auxiliary structure covers the upper surface of the second pattern disposed on the central region and two opposite side surfaces in the first direction, and also covers a portion of the upper surface of the second pattern disposed on each of the two opposite end regions and one of the two opposite side surfaces in the first direction; and The second auxiliary structure is disposed on one of the two opposite inclined side surfaces of the first auxiliary structure in the first direction in the central region, and on a portion of the upper surface of the first auxiliary structure in the central region.

12. The display device according to claim 11, wherein, The width of the second auxiliary structure in the first direction is less than 1 / 2 of the width of the second pattern in the first direction.

13. The display device according to claim 11, wherein, The plurality of fourth patterns include a first fin pattern, a second fin pattern, and a third fin pattern, wherein the first fin pattern, the second fin pattern, and the third fin pattern have different thicknesses. The corner of the third fin pattern contacts the side surface of the second auxiliary structure. In this configuration, the corners of the second fin pattern contact the side surface of the first auxiliary structure. The corner of the first fin pattern is in contact with the side surface of the second pattern.

14. The display device according to claim 13, wherein, The first fin pattern has the greatest thickness, and the third fin pattern has the smallest thickness.

15. The display device according to claim 1, wherein, The plurality of second patterns are arranged such that they are spaced apart from each other towards the central region and towards the two opposite end regions. The display device further includes: A first auxiliary structure covers the upper surface and two side surfaces of the second pattern disposed on each end region in the opposite end regions, and The second auxiliary structure is disposed on a portion of the upper surface and the outwardly inclined surface of the first auxiliary structure.

16. The display device according to claim 15, wherein, The plurality of fourth patterns include a first fin pattern, a second fin pattern, and a third fin pattern, wherein the first fin pattern, the second fin pattern, and the third fin pattern have different thicknesses. In this configuration, the corner of the first fin pattern contacts the side surface of the second auxiliary structure. In this configuration, the corners of the second fin pattern contact the side surface of the first auxiliary structure. The corner of the third fin pattern is in contact with the side surface of the second pattern.

17. The display device according to claim 16, wherein, The third fin pattern has the greatest thickness, and the first fin pattern has the smallest thickness.

18. The display device according to claim 1, wherein, The plurality of second patterns are arranged such that they are spaced apart from each other towards the central region and towards the two opposite end regions. The display device further includes: A cover layer covering the upper surface and two inclined side surfaces of each of the second patterns in the second pattern; and An auxiliary structure is disposed on a portion of the upper surface of the cover layer covering the second pattern disposed on the central region and on an inclined side surface.

19. The display device according to claim 1, wherein, The display device further includes an auxiliary structure disposed on the upper surface of each of the plurality of second patterns arranged along the first direction. The width of the auxiliary structure is smaller than the width of the upper surface of the second pattern.

20. The display device according to claim 19, wherein, Each of the plurality of fourth patterns includes: ontology; The protrusion, which protrudes from the body into a region corresponding to the first interval, and A right-angled surface, defined between the side surface of the body and the lower surface of the protrusion. The right-angled surface is in contact with the upper surface and the inclined side surface of the second pattern.

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