Display module, assembling method thereof and display device

Abstract

The application provides a display module, an assembling method thereof and a display device, and solves the problem of poor electrostatic discharge effect of a display product in the prior art. The cover plate comprises a cover plate body and an ink layer, the cover plate body has a central region and an edge region, the ink layer is located on one side of the cover plate body and in the edge region, and the ink layer comprises conductive particles; the adhesive layer comprises a glue part, a carbon fiber part and a conductive structure, the glue part is located on one side of the cover plate, the glue part has a groove, the opening of the groove faces the cover plate, the carbon fiber part is located in the groove, the carbon fiber part is in contact with the ink layer, the orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap; one end of the conductive structure is connected to the carbon fiber part; the display panel is located on the side of the glue part away from the cover plate; the circuit board is in bonding connection with the display panel, the circuit board comprises a first grounding wire, the other end of the conductive structure is connected to the first grounding wire, and the conductive structure and the display panel are insulatively arranged.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module, its assembly method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, current display products have poor electrostatic discharge performance. Summary of the Invention

[0004] In view of this, the present application provides a display module, a method for assembling the same, and a display device, which solves the problem of poor electrostatic discharge effect in existing display products.

[0005] The first aspect of this application provides a display module, which includes a cover plate, an adhesive layer, a display panel, and a circuit board. The cover plate includes a cover plate body and an ink layer. The cover plate body has a central region and an edge region surrounding the central region. The ink layer is located on one side of the cover plate body and in the edge region, and the ink layer includes conductive particles. The adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion is located on one side of the cover plate and has a groove with the opening of the groove facing the cover plate. The carbon fiber portion is located in the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion. The display panel is located on the side of the adhesive portion away from the cover plate. The circuit board is bonded to the display panel and includes a first ground wire connected to the other end of the conductive structure. The conductive structure and the display panel are insulated from each other.

[0006] In one embodiment, the conductive structure includes a metal pad and a lead wire, at least a portion of the metal pad being located between the carbon fiber portion and the ink layer, and the lead wire connecting the metal pad and the first ground wire.

[0007] In one embodiment, a polarizer is further included, which is located between the display panel and the adhesive portion, and the polarizer is in contact with the adhesive portion; the carbon fiber portion is not in contact with the polarizer, and the metal gasket is not in contact with the polarizer.

[0008] In one embodiment, the metal pad includes a connected body portion and an extension portion, the body portion being located between the carbon fiber portion and the ink layer, and the extension portion extending beyond the edge of the adhesive portion; the display module further includes an insulating portion that covers the extension portion.

[0009] In one embodiment, the circuit board further includes a filtering element connected in series with the first ground wire; preferably, the filtering element includes either a ferrite bead or an inductor.

[0010] In one embodiment, the circuit board further includes a substrate, and the first ground wire is located on one side of the substrate; the orthographic projection of the first ground wire on the substrate is a mesh; preferably, the circuit board further includes a second ground wire, the second ground wire being insulated from the first ground wire; the second ground wire is electrically connected to the display panel.

[0011] In one embodiment, the orthographic projection of the carbon fiber portion onto the cover plate body is a mesh.

[0012] A second aspect of this application provides a method for assembling a display module, comprising: bonding a display panel and a circuit board, the circuit board including a first ground wire; attaching the display panel and a cover plate using an adhesive layer, the cover plate including a cover plate body and an ink layer, the cover plate body having a central region and an edge region surrounding the central region, the ink layer being located on one side of the cover plate and in the edge region, the ink layer including conductive particles; the adhesive layer including an adhesive portion, a carbon fiber portion and a conductive structure, the adhesive portion having a groove, the opening of the groove facing the cover plate, the carbon fiber portion being located within the groove, the carbon fiber portion contacting the ink layer, the orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlapping; one end of the conductive structure being connected to the carbon fiber portion; and the other end of the conductive structure being electrically connected to the first ground wire.

[0013] In one embodiment, the conductive structure includes a metal pad and a lead wire, the metal pad being located between the carbon fiber portion and the ink layer, and one end of the lead wire being connected to the metal pad; the step of electrically connecting the other end of the conductive structure to the first ground wire includes: electrically connecting the other end of the lead wire to the first ground wire.

[0014] A third aspect of this application provides a display device, including the display module described above, or a display module obtained according to the assembly method described above.

[0015] According to embodiments of this application, a display module, its assembly method, and a display device are provided. The display module includes a cover plate, an adhesive layer, a display panel, and a circuit board. The cover plate includes a cover plate body and an ink layer. The cover plate body has a central region and an edge region surrounding the central region. The ink layer is located on one side of the cover plate body and in the edge region, and the ink layer includes conductive particles. The adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion is located on one side of the cover plate and has a groove with its opening facing the cover plate. The carbon fiber portion is located within the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion. The display panel is located on the side of the adhesive portion away from the cover plate. The circuit board is bonded to the display panel and includes a first ground wire connected to the other end of the conductive structure. The conductive structure and the display panel are insulated from each other. The above embodiments, by adding conductive particles to the ink layer and providing the carbon fiber portion in the adhesive layer, utilize the high conductivity of the conductive particles and the carbon fiber portion to conduct static electricity of the display module into the adhesive layer, reducing static electricity propagating towards the display panel. Furthermore, when the copper rod generates negative static electricity through friction, it prevents the static electricity from accumulating at the interface of the film layer under the display panel after being transferred, thus preventing the characteristics of the thin-film transistor from shifting positively and causing an increase in the subthreshold swing, and avoiding the problem of the display module screen appearing greenish at low gray levels. Attached Figure Description

[0016] Figure 1 This is a partial cross-sectional structural diagram of the display module provided in the first embodiment of this application.

[0017] Figure 2 yes Figure 1 The top view of the cover body of the display module shown.

[0018] Figure 3 yes Figure 1 A partial top view of the carbon fiber section and cover body of the display module shown.

[0019] Figure 4 This is a partial cross-sectional structural diagram of the display module provided in the second embodiment of this application.

[0020] Figure 5 This is a cross-sectional structural diagram of the display panel of the display module provided in the third embodiment of this application.

[0021] Figure 6 This is a partial cross-sectional structural diagram of the display panel and circuit board of the display module provided in the fourth embodiment of this application.

[0022] Figure 7 yes Figure 6 The diagram shows a top view of the circuit board substrate and the first ground wire.

[0023] Figure 8 This is a partial cross-sectional structural diagram of the display module provided in the fifth embodiment of this application.

[0024] Figure 9 This is a flowchart illustrating the assembly method of the display module provided in the embodiments of this application.

[0025] Figure 10 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Detailed Implementation

[0026] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0027] However, negative static electricity is generated during the friction of the copper rod in the display product. The static electricity propagates along the edge of the display product away from the cover plate and accumulates at the interface of the film layer under the display panel. Since there are mobile impurity ions in the film layer, the accumulated negative static electricity will cause the impurity ions to move towards the back channel of the thin film transistor. Too many impurity ions will cause the characteristics of the thin film transistor to become positively biased and will also cause the subthreshold swing to increase, thus causing the display panel to show defects such as greening.

[0028] In view of this, embodiments of this application provide a display module, its assembly method, and a display device. The display module includes a cover plate, an adhesive layer, a display panel, and a circuit board. The cover plate includes a cover plate body and an ink layer. The cover plate body has a central region and an edge region surrounding the central region. The ink layer is located on one side of the cover plate body and in the edge region, and the ink layer includes conductive particles. The adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion is located on one side of the cover plate and has a groove with the opening facing the cover plate. The carbon fiber portion is located in the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion. The display panel is located on the side of the adhesive portion away from the cover plate. The circuit board is bonded to the display panel and includes a first ground wire connected to the other end of the conductive structure. The conductive structure and the display panel are insulated from each other. The above embodiments, by adding conductive particles to the ink layer and providing the carbon fiber portion in the adhesive layer, utilize the high conductivity of the conductive particles and the carbon fiber portion to conduct static electricity of the display module into the adhesive layer, reducing static electricity propagating towards the display panel. Furthermore, when the copper rod generates negative static electricity through friction, it prevents the static electricity from accumulating at the interface of the film layer under the display panel after being transferred, thus preventing the characteristics of the thin-film transistor from shifting positively and causing an increase in the subthreshold swing, and avoiding the problem of the display module screen appearing greenish at low gray levels.

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0031] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0032] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0033] In this specification, the term "same-layer arrangement" refers to a structure formed by two (or more) structures through the same patterning process, and their materials may be the same or different.

[0034] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0037] Figure 1 This is a partial cross-sectional structural diagram of the display module provided in the first embodiment of this application. Figure 2 yes Figure 1 The image shows a top view of the cover body of the display module. (See image.) Figure 1 and Figure 2As shown, the display module 100 includes a cover plate 10, an adhesive layer 20, a display panel 30, and a circuit board 40. The cover plate 10 includes a cover plate body 11 and an ink layer 12. The cover plate body 11 has a central region 111 and an edge region 112 surrounding the central region 111. The ink layer 12 is located on one side of the cover plate body 11 and in the edge region 112. The ink layer 12 includes conductive particles 121. The adhesive layer 20 includes an adhesive portion 21, a carbon fiber portion 22, and a conductive structure 23. The adhesive portion 21 is located on one side of the cover plate 10 and has a groove 211. The opening of the groove 211 faces the cover plate 10. The carbon fiber portion 22 is located in the groove 211 and is in contact with the ink layer 12. The orthographic projection of the groove 211 on the cover plate body 11 and the orthographic projection of the ink layer 12 on the cover plate body 11 overlap. One end of the conductive structure 23 is connected to the carbon fiber portion 22. The display panel 30 is located on the side of the adhesive part 21 away from the cover plate 10. The circuit board 40 is bonded to the display panel 30. The circuit board 40 includes a first ground wire 41, which is connected to the other end of the conductive structure 23. The conductive structure 23 and the display panel 30 are insulated from each other.

[0038] The above embodiment adds conductive particles 121 to the ink layer 12 and sets carbon fiber portions 22 in the adhesive layer 20. Utilizing the high conductivity of the conductive particles 121 and the carbon fiber portions 22, static electricity from the display module 100 is guided into the adhesive layer 20, reducing the static electricity propagating towards the display panel 30. Furthermore, when negative static electricity is generated by the friction of the copper rod, it prevents the accumulation of static electricity at the film layer interface under the display panel 30 after transfer, avoiding a positive shift in the characteristics of the thin-film transistor leading to an increased subthreshold swing, and preventing the display module 100 from exhibiting a greenish tint at low grayscale levels.

[0039] Optionally, the cover body 11 is the outermost protective component of the display module 100, usually made of transparent or translucent material. The cover body 11 is used to protect the display panel 30 inside the display module 100 from physical damage, dust or moisture, while also providing touch functionality.

[0040] Specifically, the cover plate body 11 can provide physical protection for the display panel 30, preventing damage to the display panel 30 from scratches, impacts, etc.

[0041] Specifically, the cover plate body 11 has high transmittance to ensure the display effect of the display module 100. Furthermore, the transmittance of the cover plate body 11 is greater than or equal to 90%, for example, the transmittance of the cover plate body 11 is 90%, 95%, 98%, 99%, 100%, etc.

[0042] Specifically, the surface of the cover body 11 may be coated with an oleophobic and hydrophobic coating, such as an AF coating, to prevent the cover body 11 from being contaminated by fingerprints or other contaminants.

[0043] Optionally, in one embodiment, the ink layer 12 includes conductive particles 121, the material of which is not limited to conductive materials such as gold, silver, copper and carbon.

[0044] Optionally, in one embodiment, the material of the adhesive portion 21 may be optical adhesive to bond the cover plate body 11 and the display panel 30 together.

[0045] It should be understood that the specific type of optical adhesive is not limited in the embodiments of this application. For example, the optical adhesive can be a solid optical adhesive, which can be pre-formed into a film, is easy to bond, and is suitable for mass production; or the optical adhesive can be a liquid optical adhesive, which is suitable for complex structures such as curved screens; or the optical adhesive can be an anti-blue light optical adhesive, which contains blue light absorbers to reduce harmful blue light.

[0046] Figure 3 yes Figure 1 The image shows a partial top view of the carbon fiber section and cover body of the display module. (See attached image.) Figure 3 As shown, in one embodiment, the orthographic projection of the carbon fiber portion 22 onto the cover plate body 11 is a mesh, further improving the antistatic effect of the display module 100.

[0047] Figure 4 This is a partial cross-sectional structural diagram of the display module provided in the second embodiment of this application. (See diagram below.) Figure 4 As shown, in one embodiment, the conductive structure 23 includes a metal pad 231 and a lead wire 232. At least a portion of the metal pad 231 is located between the carbon fiber portion 22 and the ink layer 12, and the lead wire 232 connects the metal pad 231 and the first ground wire 41.

[0048] Specifically, in one embodiment, the metal pad 231 includes a connected main body 2311 and an extension 2312, the main body 2311 being located between the carbon fiber portion 22 and the ink layer 12, and the extension 2312 extending out of the edge of the adhesive portion 21.

[0049] Furthermore, in one embodiment, the display module 100 also includes an insulating portion 60 that covers the extension 2312.

[0050] Optionally, in one embodiment, the display panel 30 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0051] Please refer to it again. Figure 1 In one embodiment, the display panel 30 includes a display area 301, a bending area 302 and a bonding area 303 connected in sequence, and the display area 301 has opposing display sides 304 and non-display sides 305.

[0052] It should be understood that the display side 304 refers to the side of the display panel 30 facing the cover plate 10, and the non-display side 305 refers to the side of the display panel 30 away from the cover plate 10.

[0053] Optionally, in one embodiment, the bending area 302 has a bent state, in which the bonding area 303 is located on the non-display side 305 of the display panel 30.

[0054] Figure 5 This is a schematic cross-sectional view of the display panel of the display module provided in the third embodiment of this application. Figure 5 As shown, in one embodiment, the display panel 30 includes a substrate 31, a pixel definition layer 32, and a light-emitting device 33. The pixel definition layer 32 is located on the substrate 31 and encloses a pixel opening Q. At least a portion of the light-emitting device 33 is located within the pixel opening Q.

[0055] Optionally, in one embodiment, the substrate 31 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or it may be a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or it may include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0056] Furthermore, in one embodiment, the substrate 31 may have a driving circuit for driving multiple light-emitting devices 33 to emit light of corresponding colors. For example, the substrate 31 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0057] Optionally, in one embodiment, the pixel definition layer 32 can be a light-transmitting material to allow light from the light-emitting device 33 to pass through the pixel definition layer 32 more effectively. Optionally, the pixel definition layer 32 can be an opaque material, which can improve the light absorption of the pixel definition layer 32, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent light-emitting devices 33, and improve the display effect of the display panel 30.

[0058] Optionally, in one embodiment, the pixel definition layer 32 is made of an inorganic material.

[0059] Optionally, in one embodiment, the light-emitting device 33 can be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 33 can be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, a white light-emitting device W, etc.

[0060] Optionally, in one embodiment, the light-emitting device 33 includes a first electrode 331 and a second electrode 332 stacked together, and at least one light-emitting functional layer 333 located between the first electrode 331 and the second electrode 332, wherein the second electrode 332 is located on the side of the first electrode 331 facing away from the substrate 31. The first electrode 331 may be an anode, and the second electrode 332 may be a cathode. The at least one light-emitting functional layer 333 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0061] Optionally, in one embodiment, the display panel 30 further includes a thin film encapsulation layer 34. The thin film encapsulation layer 34 is located on the side of the second electrode 332 away from the substrate 31. The thin film encapsulation layer 34 is used to encapsulate the light-emitting device 30, which can isolate water and oxygen, reduce the probability of failure of the light-emitting device 30 and the underlying layer structure due to impurities such as water and oxygen entering the light-emitting device 33, and ensure that the manufacturing process of the display panel does not affect the lifespan and reliability of the OLED device.

[0062] Optionally, in one embodiment, the thin-film encapsulation layer 34 includes a first encapsulation layer 341, a second encapsulation layer 342, and a third encapsulation layer 343 sequentially stacked on the side of the second electrode 332 facing away from the substrate 31.

[0063] Optionally, in one embodiment, the first encapsulation layer 341 and the third encapsulation layer 343 are inorganic encapsulation layers. For example, the material of the inorganic encapsulation layer is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer can be a single layer, multiple layers, composite layers, etc.

[0064] Optionally, in one embodiment, the second encapsulation layer 342 is an organic encapsulation layer. Exemplarily, the organic encapsulation layer is made of fiber materials, resin materials, or materials used in multilayer boards, etc. The organic encapsulation layer can be a single layer, multiple layers, composite layers, etc.

[0065] Please refer to it again. Figure 1 In one embodiment, the circuit board 40 is located in the bonding area 303. Specifically, the portion of the circuit board 40 projected onto the display panel 30 is located in the bonding area 303 of the display panel 30.

[0066] Figure 6 This is a partial cross-sectional structural diagram of the display panel and circuit board of the display module provided in the fourth embodiment of this application. Figure 7 yes Figure 6 The diagram shows a top view of the circuit board substrate and the first ground wire. (See diagram for reference.) Figure 6 and Figure 7 As shown, in one embodiment, the circuit board 40 further includes a substrate 42, a first grounding wire 41 located on one side of the substrate 42, and the orthographic projection of the first grounding wire 41 on the substrate 42 is a mesh.

[0067] Optionally, in one embodiment, the circuit board 40 further includes a second ground wire 43, which is electrically connected to the display panel 30.

[0068] Furthermore, in one embodiment, the second grounding wire 43 and the first grounding wire 41 are insulated from each other. Specifically, in one embodiment, an insulating layer 45 may be provided between the second grounding wire 43 and the first grounding wire 41.

[0069] Furthermore, in one embodiment, the first grounding wire 41 and the second grounding wire 43 can be arranged on the same layer.

[0070] Optionally, in one embodiment, the circuit board 40 further includes a filter element 44 connected in series with the first ground wire 41. The filter element 44 can suppress noise, stabilize power supply and signals, and ensure that the circuit board 40 works normally.

[0071] Specifically, in one embodiment, the filter element 44 includes either a ferrite bead or an inductor.

[0072] Furthermore, in one embodiment, the filter element 44 may also include a capacitor, a resistor, a common-mode choke, etc.

[0073] Optionally, in one embodiment, the circuit board 40 may be a printed circuit board, a flexible circuit board, or the like.

[0074] Figure 8 This is a partial cross-sectional structural diagram of the display module provided in the fifth embodiment of this application. (See diagram below.) Figure 8 As shown, in one embodiment, the display module 100 further includes a polarizer 50, which is located between the display panel 30 and the adhesive portion 21 of the adhesive layer 20. The polarizer 50 realizes functions such as display, dimming or optical detection by controlling the polarization state of light.

[0075] Furthermore, the polarizer 50 and the adhesive part 21 come into contact.

[0076] Furthermore, the polarizer 50 and the carbon fiber section 22 do not contact each other.

[0077] Furthermore, the polarizer 50 and the metal pad 231 do not contact each other.

[0078] It should be understood that the specific type of polarizer 50 is not limited in the embodiments of this application. For example, polarizer 50 can be a transmissive polarizer, a reflective polarizer, an absorptive polarizer, etc.

[0079] Optionally, in one embodiment, the display module 100 further includes a support layer 70 located on the non-display side 305 of the display panel 30. The support layer 70 can improve the support strength during the bonding process, thereby improving the display module's resistance to deformation.

[0080] Specifically, in one embodiment, the support layer 70 may include a first support layer 71 and a second support layer 72, wherein the first support layer 71 is located in the display area 301 and the second support layer 72 is located in the bonding area 303.

[0081] Optionally, in one embodiment, the display module 100 further includes a composite tape 80 located on the non-display side 305 of the display panel 30. Specifically, in one embodiment, the composite tape 80 is located on the side of the first support layer 71 facing away from the display panel 30.

[0082] It should be understood that the specific type of composite tape 80 is not limited in the embodiments of this application. For example, composite tape 80 can be conductive composite tape, foam composite tape, aluminum foil composite tape, PET composite tape, etc.

[0083] This application provides a display module, its assembly method, and a display device. The display module includes a cover plate, an adhesive layer, a display panel, and a circuit board. The cover plate includes a cover plate body and an ink layer. The cover plate body has a central region and an edge region surrounding the central region. The ink layer is located on one side of the cover plate body and in the edge region, and the ink layer includes conductive particles. The adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion is located on one side of the cover plate and has a groove with its opening facing the cover plate. The carbon fiber portion is located in the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion. The display panel is located on the side of the adhesive portion away from the cover plate. The circuit board is bonded to the display panel and includes a first ground wire connected to the other end of the conductive structure. The conductive structure and the display panel are insulated from each other. The above embodiment adds conductive particles to the ink layer and sets the carbon fiber portion in the adhesive layer. Utilizing the high conductivity of the conductive particles and the carbon fiber portion, the static electricity of the display module is conducted into the adhesive layer, reducing the static electricity propagating towards the display panel. Furthermore, when the copper rod generates negative static electricity through friction, it prevents the static electricity from accumulating at the interface of the film layer under the display panel after being transferred, thus preventing the characteristics of the thin-film transistor from shifting positively and causing an increase in the subthreshold swing, and avoiding the problem of the display module screen appearing greenish at low gray levels.

[0084] This application also provides a method for assembling a display module. Figure 9 This is a flowchart illustrating the assembly method of the display module provided in an embodiment of this application. Figure 9 As shown, this assembly method is applicable to assembling the aforementioned display module 100. The manufacturing method includes:

[0085] Step S100: Bond and connect the display panel and the circuit board.

[0086] The circuit board 40 includes a first ground wire 41.

[0087] Optionally, in one embodiment, the display panel 30 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0088] Optionally, in one embodiment, the circuit board 40 may be a printed circuit board, a flexible circuit board, or the like.

[0089] Optionally, in one embodiment, the circuit board 40 further includes a substrate 42, with a first grounding wire 41 located on one side of the substrate 42, and the orthographic projection of the first grounding wire 41 on the substrate 42 being a mesh.

[0090] Optionally, in one embodiment, the circuit board 40 further includes a second ground wire 43, which is electrically connected to the display panel 30.

[0091] Optionally, in one embodiment, the second grounding wire 43 and the first grounding wire 41 are insulated from each other.

[0092] Optionally, in one embodiment, the circuit board 40 further includes a filter element 44 connected in series with the first ground wire 41. The filter element 44 can suppress noise, stabilize power supply and signals, and ensure that the circuit board 40 works normally.

[0093] Specifically, in one embodiment, the filter element 44 includes either a ferrite bead or an inductor.

[0094] Step S200: Use an adhesive layer to bond the display panel and the cover plate together.

[0095] The display module 100 includes a cover plate 10, an adhesive layer 20, a display panel 30, and a circuit board 40. The cover plate 10 includes a cover plate body 11 and an ink layer 12. The cover plate body 11 has a central region 111 and an edge region 112 surrounding the central region 111. The ink layer 12 is located on one side of the cover plate body 11 and in the edge region 112. The ink layer 12 includes conductive particles 121. The adhesive layer 20 includes an adhesive portion 21, a carbon fiber portion 22, and a conductive structure 23. The adhesive portion 21 is located on one side of the cover plate 10 and has a groove 211 with its opening facing the cover plate 10. The carbon fiber portion 22 is located inside the groove 211 and is in contact with the ink layer 12. The orthographic projection of the groove 211 on the cover plate body 11 and the orthographic projection of the ink layer 12 on the cover plate body 11 overlap. One end of the conductive structure 23 is connected to the carbon fiber portion 22. The display panel 30 is located on the side of the adhesive part 21 away from the cover plate 10, and the circuit board 40 is bonded to the display panel 30.

[0096] Step S300: Connect the other end of the conductive structure to the first ground wire.

[0097] Optionally, in one embodiment, the conductive structure 23 includes a metal pad 231 and a lead wire 232, with at least a portion of the metal pad 231 located between the carbon fiber portion 22 and the ink layer 12, and one end of the lead wire 232 connected to the metal pad 231.

[0098] Specifically, in one embodiment, the metal pad 231 includes a connected main body 2311 and an extension 2312, the main body 2311 being located between the carbon fiber portion 22 and the ink layer 12, and the extension 2312 extending out of the edge of the adhesive portion 21.

[0099] Optionally, in one embodiment, electrically connecting the other end of the conductive structure 23 to the first ground wire 41 includes:

[0100] Connect the other end of lead 232 to the first ground wire 41 electrically.

[0101] The assembly method for a display module provided in this application includes: bonding a display panel and a circuit board, the circuit board including a first ground wire; bonding the display panel and a cover plate using an adhesive layer, the cover plate including a cover plate body and an ink layer, the cover plate body having a central region and an edge region surrounding the central region, the ink layer located on one side of the cover plate and in the edge region, the ink layer including conductive particles; the adhesive layer including an adhesive portion, a carbon fiber portion and a conductive structure, the adhesive portion having a groove with the opening of the groove facing the cover plate, the carbon fiber portion located in the groove, the carbon fiber portion in contact with the ink layer, the orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlapping; one end of the conductive structure being connected to the carbon fiber portion; and the other end of the conductive structure being electrically connected to the first ground wire. The above embodiment, by adding conductive particles to the ink layer and setting the carbon fiber portion in the adhesive layer, utilizes the high conductivity of the conductive particles and the carbon fiber portion to conduct static electricity of the display module into the adhesive layer, reducing static electricity propagating towards the display panel. Furthermore, when the copper rod generates negative static electricity through friction, it prevents the static electricity from accumulating at the interface of the film layer under the display panel after being transferred, thus preventing the characteristics of the thin-film transistor from shifting positively and causing an increase in the subthreshold swing, and avoiding the problem of the display module screen appearing greenish at low gray levels.

[0102] One embodiment of this application also provides a display device. Figure 10 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Figure 10 As shown, the display device 200 includes the display module 100 provided in the above embodiments, or the display module 100 obtained according to the assembly method provided in the above embodiments. The display device 200 is a product with image display function. For example, the display device 200 can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0103] In addition, the display device 200 can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device 200 also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0104] The display device 200 provided according to any embodiment of this application and the display module 100 provided in the embodiments of this application belong to the same inventive concept and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display device 200 can be found in the embodiments of the display module 100, and will not be repeated here.

[0105] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0106] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0107] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0108] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0109] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0110] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: A cover plate, the cover plate comprising a cover plate body and an ink layer, the cover plate body having a central region and an edge region surrounding the central region, the ink layer being located on one side of the cover plate body and in the edge region, the ink layer comprising conductive particles; An adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion is located on one side of the cover plate and has a groove with the opening of the groove facing the cover plate. The carbon fiber portion is located in the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion; The display panel is located on the side of the adhesive portion opposite to the cover plate; A circuit board is bonded to the display panel. The circuit board includes a first ground wire connected to the other end of the conductive structure. The conductive structure and the display panel are insulated from each other.

2. The display module according to claim 1, characterized in that, The conductive structure includes a metal pad and a lead wire, at least a portion of which is located between the carbon fiber portion and the ink layer, and the lead wire connects the metal pad and the first ground wire.

3. The display module according to claim 2, characterized in that, It also includes a polarizer located between the display panel and the adhesive portion, with the polarizer in contact with the adhesive portion; the carbon fiber portion and the polarizer are not in contact, and the metal gasket and the polarizer are not in contact.

4. The display module according to claim 2, characterized in that, The metal gasket includes a main body and an extension connected to each other. The main body is located between the carbon fiber portion and the ink layer, and the extension extends out of the edge of the adhesive portion. The display module also includes an insulating portion that covers the extension.

5. The display module according to claim 1, characterized in that, The circuit board also includes a filter element, which is connected in series with the first grounding line; Preferably, the filtering element includes either a ferrite bead or an inductor.

6. The display module according to claim 1, characterized in that, The circuit board also includes a substrate, and the first grounding wire is located on one side of the substrate; the orthographic projection of the first grounding wire on the substrate is a mesh pattern. Preferably, the circuit board further includes a second grounding wire, which is insulated from the first grounding wire; the second grounding wire is electrically connected to the display panel.

7. The display module according to claim 1, characterized in that, The carbon fiber portion has a mesh-like orthographic projection on the cover plate body.

8. A method for assembling a display module, characterized in that, include: The display panel and the circuit board are bonded together, the circuit board including a first ground wire; The display panel and the cover plate are bonded together using an adhesive layer. The cover plate includes a cover plate body and an ink layer. The cover plate body has a central region and an edge region surrounding the central region. The ink layer is located on one side of the cover plate and in the edge region. The ink layer includes conductive particles. The adhesive layer includes an adhesive portion, a carbon fiber portion, and a conductive structure. The adhesive portion has a groove with the opening facing the cover plate. The carbon fiber portion is located inside the groove and is in contact with the ink layer. The orthographic projection of the groove on the cover plate body and the orthographic projection of the ink layer on the cover plate body overlap. One end of the conductive structure is connected to the carbon fiber portion; The other end of the conductive structure is electrically connected to the first grounding wire.

9. The assembly method according to claim 8, characterized in that, The conductive structure includes a metal pad and a lead wire. The metal pad is located between the carbon fiber portion and the ink layer, and one end of the lead wire is connected to the metal pad. The step of electrically connecting the other end of the conductive structure to the first grounding wire includes: Connect the other end of the lead wire to the first ground wire electrically.

10. A display device, characterized in that, The display module includes any one of claims 1-7, or the display module obtained by the assembly method according to claim 8 or 9.

Images