Display device

Abstract

The display device can include a first substrate including a display area and a non-display area outside the display area, a plurality of light emitting elements disposed on the first substrate, an adhesive layer disposed on the plurality of light emitting elements and including a plurality of core-shell particles, and a second substrate disposed on the adhesive layer, and the plurality of core-shell particles include reduced titanium oxide TiO 2‑x .

Description

Technical Field

[0001] This disclosure relates to a display device, and more specifically, for example, but not limited to, a display device capable of preventing or minimizing moisture penetration. Background Technology

[0002] Currently, as the world enters the information age of comprehensive development, the field of display devices that visually display information is developing rapidly, and research is underway to improve the performance of various display devices, such as thinner, lighter, and lower power consumption.

[0003] Representative display devices may include liquid crystal displays (LCDs), electrowetting displays (EWDs), and light-emitting display devices such as organic light-emitting displays (OLEDs).

[0004] Among these devices, organic light-emitting display devices (OLEDs) are self-emissive and, unlike liquid crystal displays (LCDs), do not require a separate light source. This allows OLEDs to be manufactured with a light weight and thin profile. Furthermore, because OLEDs operate at low voltages, they offer advantages in terms of power consumption. Moreover, due to their superior color reproduction, response speed, viewing angle, and contrast ratio, OLEDs are expected to be used in a wide range of applications. Summary of the Invention

[0005] One objective of this disclosure is to provide a display device with improved moisture and oxygen blocking capabilities.

[0006] Another objective of this disclosure is to provide a display device having reduced dark spot defects due to the accumulation of oxygen absorbent.

[0007] Another objective of this disclosure is to provide a display device that includes an oxygen absorber manufactured at low cost.

[0008] Another objective of this disclosure is to provide a display device in which the oxygen absorber is disposed only in areas that may be susceptible to moisture and oxygen permeation.

[0009] Another objective of this disclosure is to provide an improved display device that overcomes the limitations and disadvantages associated with the prior art.

[0010] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0011] A display device according to an exemplary embodiment of the present disclosure includes: a first substrate including a display area and a non-display area outside the display area; a plurality of light-emitting elements disposed on the first substrate; an adhesive layer disposed on the plurality of light-emitting elements and including a plurality of core-shell particles; and a second substrate disposed on the adhesive layer. The plurality of core-shell particles include reduced titanium oxide (TiO₂). 2－x ).

[0012] A display device according to another exemplary embodiment of the present disclosure includes a first substrate, a plurality of light-emitting elements, an absorption layer, and a second substrate. The first substrate includes a display area and a non-display area located outside the display area. The plurality of light-emitting elements are disposed on the first substrate. The absorption layer is disposed on the plurality of light-emitting elements and includes a plurality of core-shell particles. The second substrate is disposed on the absorption layer. Each of the plurality of core-shell particles includes a core particle made of silicon oxide (SiO2) and a shell layer surrounding the core particle and including oxygen vacancies.

[0013] Further details of the embodiments disclosed herein are included in the detailed description and accompanying drawings.

[0014] The various features of this disclosure can improve the reliability of moisture permeation and the performance of preventing oxygen permeation by using oxygen absorbents with less aggregation.

[0015] The various features of this disclosure can reduce the manufacturing cost of the display device by using an oxygen absorber that coats an oxygen-absorbing material onto nuclear particles manufactured at low cost.

[0016] According to the features of this disclosure, oxygen absorbers can be placed only in the peripheral area of ​​the display device to effectively reduce dark spot defects.

[0017] The effects of this disclosure are not limited to the examples above, and many more effects are included in this disclosure.

[0018] Other systems, methods, features, and advantages will be apparent to those skilled in the art upon examination of the following figures and detailed description. All such additional systems, methods, features, and advantages are intended to be included within this specification, within the scope of this disclosure, and protected by the appended claims. Nothing in this section should be construed as limiting those claims. Further aspects and advantages are discussed below in conjunction with embodiments of this disclosure.

[0019] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0020] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1A and Figure 1B This is a plan view of a display device according to an example embodiment of the present disclosure.

[0021] Figure 2 This is a cross-sectional view of a sub-pixel of a display device according to one embodiment of the present disclosure.

[0022] Figure 3 It is according to one embodiment of this disclosure along Figure 1A A cross-sectional view of the display device taken along line A-A'.

[0023] Figure 4 This is a plan view of a display device according to another embodiment of the present disclosure.

[0024] Figure 5 This is a plan view of a display device according to another embodiment of the present disclosure.

[0025] Figure 6 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure.

[0026] Throughout the accompanying drawings and detailed description, unless otherwise stated, the same reference numerals shall be construed as referring to the same elements, features, and structures. For clarity, illustration, and convenience, the relative sizes and depictions of these elements may be exaggerated. Detailed Implementation

[0027] Reference will now be made in detail to embodiments of this disclosure, examples of which are illustrated in the accompanying drawings. In the following description, detailed descriptions of well-known functions or configurations relevant to this document will be omitted or may be briefly discussed where it is determined that such detailed descriptions would unnecessarily obscure the essential points of the inventive concept. The described process steps and / or order of operations are exemplary; however, the order of steps and / or operations is not limited to the order set forth herein and may be varied as is known in the art, except for steps and / or operations that must occur in a specific order. The same reference numerals always refer to the same elements. The names of the corresponding elements used in the following explanation may be chosen solely for the convenience of writing the specification and may therefore differ from those used in actual products.

[0028] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the following detailed description of exemplary embodiments in conjunction with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. Exemplary embodiments are provided by way of example only to enable those skilled in the art to fully understand the disclosure and scope of this disclosure.

[0029] The shapes, sizes, proportions, angles, quantities, etc., illustrated in the accompanying drawings to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Unless used with the term "only," terms such as "comprising," "having," and "consisting of" as used herein are generally intended to allow for the addition of other components. Unless explicitly stated otherwise, any reference to the singular may include the plural.

[0030] Any implementation described in this article as an "example" is not necessarily to be interpreted as preferred or advantageous over other implementations.

[0031] Even if not explicitly stated, components are interpreted as including a normal error range.

[0032] When using terms such as “above,” “over,” “below,” and “adjacent” to describe the positional relationship between two parts, one or more parts may be positioned between the two parts unless the terms are used with the terms “immediately adjacent” or “directly.”

[0033] When a component or layer is "set" on another component or layer, the other layer or component can be directly inserted on the other component or inserted between them.

[0034] When describing temporal relationships, when the temporal order is described as such as "after", "following", "next" and "before", discontinuous situations may be included unless more restrictive terms such as "only", "immediately" or "directly" are used.

[0035] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others and do not specify the order or sequence. Therefore, in the technical concept of this disclosure, the first component mentioned below may be the second component.

[0036] Furthermore, when a component or layer is “connected,” “joined,” or “adheded” to another component or layer, unless otherwise stated, the component or layer may not only be directly connected or adhered to the other component or layer, but also indirectly connected or attached to the other component or layer, with one or more intermediate components or layers “set” or “inserted” between the components or layers. This should be understood to mean that components may be arranged to be in direct contact with each other, or may be arranged to be in direct contact with each other.

[0037] The terms “first element,” “second element,” and / or “third element” should be understood as one of the first, second, and third elements, or any or all combinations of the first, second, and third elements. For example, A, B, and / or C can refer to only A; only B; only C; any or some combinations of A, B, and C; or all of A, B, and C.

[0038] The term “at least one” should be understood to include any and all combinations of one or more associated listed items. For example, “at least one of the first element, the second element, and the third element” means a combination of all three listed elements, a combination of any two of the three elements, and each individual element (the first element, the second element, or the third element).

[0039] Throughout the disclosure, the same reference numerals generally denote the same elements.

[0040] The size and thickness of each component shown in the accompanying drawings are for illustrative purposes only, and this disclosure is not limited to the size and thickness of the components shown.

[0041] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments pertain. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with, for example, their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless explicitly defined herein. For example, as one of ordinary skill in the art will understand, the terms “component” or “unit” can be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit device, or any structure configured to perform the described functions.

[0042] In contrast, these embodiments may be provided to make this disclosure sufficiently thorough and complete to assist those skilled in the art in fully understanding its scope. Furthermore, this disclosure is limited only by the scope of the claims.

[0043] Features of the various embodiments of this disclosure may be partially or completely bonded or combined with each other, and may be interlocked and operated in technically different ways, and the embodiments may be performed independently of each other or in relation to each other. Furthermore, the term "may" fully encompasses all the meanings and scope of the term "may," and vice versa.

[0044] In the following description, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. All components of each display device / apparatus according to all embodiments of the present disclosure are operatively connected and configured.

[0045] Figure 1A and Figure 1B This is a plan view of a display device according to an example embodiment of the present disclosure. Figure 1B This is a plan view of the display device 100, in which... Figure 1A The second substrate 160 is not shown in the plan view of the display device 100.

[0046] Reference Figure 1A and Figure 1B A display device 100 according to an example embodiment of the present disclosure may include a first substrate 111, a second substrate 160, an adhesive layer 170, and pad components 107 and 108. The display device 100 is an apparatus for displaying images to a user.

[0047] The display device 100 may include a display element for displaying an image, a driving element for driving the display element, and row lines for sending various signals to the display element and the driving element. The display element may be defined differently depending on the type of the display device 100. For example, when the display device 100 is an organic light-emitting display device, the display element may be an organic light-emitting element comprising an anode, an organic light-emitting layer, and a cathode. For example, when the display device 100 is a liquid crystal display device, the display element may be a liquid crystal display element.

[0048] In the following text, even if it is assumed that the display device 100 is an organic light-emitting display device, the display device 100 is not limited to an organic light-emitting display device, and can be a different type of display device.

[0049] The display device 100 may include a display area AA (or an active area) and a non-display area NA (or a non-active area). The display area AA is the area in the display device 100 where an image is displayed.

[0050] In the display area AA, multiple sub-pixels constituting multiple pixels and multiple circuits for driving these sub-pixels can be provided. The multiple sub-pixels are the smallest units constituting the display area AA, and display elements can be disposed in each of the multiple sub-pixels, and the multiple sub-pixels can constitute a pixel. For example, an organic light-emitting element including an anode, an organic light-emitting layer, and a cathode can be disposed in each of the multiple sub-pixels, but is not limited thereto. Furthermore, the circuits for driving the multiple sub-pixels can include driving elements, lines, etc. For example, the circuits can be formed by thin-film transistors, storage capacitors, gate lines, data lines, etc., but are not limited thereto.

[0051] The non-display area NA is the area where no image is displayed. The non-display area NA can completely surround the display area or surround only one or more portions of the display area.

[0052] Figure 1AAn example is shown where a non-display area NA surrounds a display area AA, which has a quadrilateral shape. However, the shape and arrangement of the display area AA and the non-display area NA are not limited to these examples. Figure 1A The example shown.

[0053] In other words, the display area AA and the non-display area NA can have shapes suitable for the design of an electronic device equipped with the display device 100. For example, the exemplary shape of the display area AA can be a pentagon, hexagon, circle, or ellipse.

[0054] In the non-display area NA, various lines and circuits for driving the organic light-emitting elements of the display area AA can be provided. For example, in the non-display area NA, link lines for sending signals to multiple sub-pixels and circuits of the display area AA, driver integrated circuits (ICs) such as ICs and data driver ICs, or pad components 107 and 108 can be provided, but not limited to these.

[0055] The display device 100 may include various additional components for generating various signals or driving pixels in the display area AA. The additional components for driving pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, etc. The display device 100 may also include additional components related to functions other than pixel driving. For example, the display device 100 may include additional components providing touch sensing functions, user authentication functions (e.g., fingerprint recognition), multi-level pressure sensing functions, haptic feedback functions, etc. These additional components may be located in the non-display area NA and / or connected to external circuitry of a connection interface.

[0056] Pad components 107 and 108 can be configured to receive signals from the outside.

[0057] The pad components 107 and 108 can be disposed in the non-display area NA of the display device 100 to be electrically connected to various lines and printed circuit boards disposed in the display area AA.

[0058] For example, pad components 107 and 108 can be used to send signals to each of the strobe lines and data lines, and include, but are not limited to, a strobe pad component 108 for sending strobe signals to the strobe lines and a data pad component 107 for sending data signals to the data lines.

[0059] The gate pad unit 108 may be disposed on at least one side of the display device 100 (e.g., in the non-display area NA on the first side of the display device 100), but is not limited thereto. For example, the first side may refer to one of the left and right sides of the display device 100 adjacent to the upper and lower sides.

[0060] The data pad unit 107 may be disposed in a non-display area NA on the other side of the display device 100 (e.g., the second side of the display device 100), but is not limited thereto. For example, the second side may refer to the upper side of the display device 100. However, this disclosure is not limited thereto, and each side surface portion of the non-display area NA may be referred to as at least one of the first side, the second side, the third side, and the fourth side.

[0061] For example, data pad unit 107 can be electrically connected to a data driver to provide data voltage to multiple data lines. The data driver can receive image data from a timing controller and provide data voltage to multiple data lines to drive them. The data driver can be implemented by including one or more source driver integrated circuits.

[0062] For example, each source driver integrated circuit may include a shift register, latch circuitry, digital-to-analog converter (DAC), output buffer, etc. In some cases, the data driver may also include one or more analog-to-digital converters (ADCs).

[0063] Furthermore, a gating driver can drive multiple gating lines by outputting scan signals to multiple gating lines. For example, a gating driver can sequentially drive multiple gating lines by providing scan signals to them in sequence. Under the control of a timing controller, the gating driver can sequentially provide on-state or off-state scan signals to multiple gating lines.

[0064] A gating driver may include multiple gating drive circuits. Here, the multiple gating drive circuits may each correspond to multiple gating lines.

[0065] For example, each gating drive circuit may include a shift register, a level shifter, etc.

[0066] Each gating drive circuit can be implemented as a panel-in-panel gating (GIP) type and embedded in the display device 100. For example, each gating drive circuit can be directly disposed on the gating pad unit 108, and in this case, the gating pad unit 108 can be referred to as a GIP circuit component.

[0067] Reference Figure 1A and Figure 1B The adhesive layer 170 and the second substrate 160 can be disposed in the display area AA and the non-display area NA of the display device 100. The adhesive layer 170 and the second substrate 160 can overlap the entire surface of the display area AA, and can overlap only a portion of the non-display area NA surrounding the display area AA. For example, except for the data pad unit 107, the adhesive layer 170 and the second substrate 160 can overlap the entire surface of the non-display area NA and the display area AA, but are not limited thereto.

[0068] Reference Figure 1B The adhesive layer 170 may include a transparent layer and an absorbent layer 172 disposed on the transparent layer. The absorbent layer 172 may include a resin 172b and a plurality of hygroscopic agents 172a dispersed in the resin 172b. In this case, the plurality of hygroscopic agents 172a may be configured to correspond to the entire surface of the first substrate 111.

[0069] In the following text, reference will be made to Figure 2 and Figure 3 Detailed description of adhesive layer 170.

[0070] Figure 2 This is a cross-sectional view of a sub-pixel of a display device according to one embodiment of the present disclosure. Figure 3 It is along Figure 1A A cross-sectional view of the display device taken along line A-A'. For example, Figure 3 yes Figure 1A A cross-sectional view of the non-display area NA on the first side of the display device 100. Each sub-pixel or one or more sub-pixels in the display device of this disclosure according to any drawings or embodiments disclosed herein may have Figure 2 The subpixel configuration shown in the figure.

[0071] For ease of description, Figure 2 At least some of the buffer layer 112, gate insulating layer 113, and interlayer insulating layer 114 shown are in Figure 3 The middle layer is shown as insulating layer 117.

[0072] The first substrate 111 can be a glass or plastic substrate. In the case of a plastic substrate, materials based on polyimide or polycarbonate can be used to provide flexibility. In particular, polyimide is a material that can be used in high-temperature processes and is very suitable for coating processes, and therefore it is widely used as a plastic substrate. A buffer layer 112 can be disposed on the first substrate 111.

[0073] In addition, a light-shielding layer may be disposed on the first substrate 111 to block light introduced from the lower portion of the first substrate 111.

[0074] A light-shielding layer can be disposed on the first substrate 111 at the location where the active layer 124 is to be formed. In particular, it is preferable that the size of the light-shielding layer is slightly larger to completely cover the active layer 124.

[0075] The buffer layer 112 can be disposed on the entire surface of the first substrate 111 on which the light-shielding layer is formed.

[0076] Buffer layer 112 is a layer used to protect various electrodes and circuits from impurities such as alkali metal ions released from the first substrate 111 or layers below it. Buffer layer 112 may have a multilayer structure including a first buffer layer 112a and a second buffer layer 112b, but is not limited thereto. For example, buffer layer 112 may be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x It is made of or in multiple layers.

[0077] The buffer layer 112 can delay the diffusion of moisture and / or oxygen that permeates the first substrate 111. Additionally, the buffer layer 112 may include multiple buffers and / or active buffers. The active buffers protect the active layer 124, which is made of semiconductor material from the driving element 120, and can function to block various types of defects introduced from the first substrate 111. The active buffers may be formed of amorphous silicon (a-Si) or the like.

[0078] Furthermore, in the non-display area NA, various lines and circuits for driving the light-emitting elements 130 of the display area AA can be provided. For example, in the non-display area NA, link lines for sending signals to multiple sub-pixels and circuits of the display area AA, driver ICs such as gating driver ICs and data driver ICs, or pad components 107 and 108 can be provided, but not limited to these.

[0079] For example, refer to Figure 3 The grounding wire GW can be set on the first substrate 111 in the non-display area NA.

[0080] The grounding wire GW can be located at the edge of the non-display area NA, excluding the second side. For example, the grounding wire GW can be located in the non-display area NA excluding the upper side of the display device 100, but is not limited thereto.

[0081] The grounding wire GW may be formed of the material of the light-shielding layer constituting the display area AA and / or the driving element 120, but is not limited thereto.

[0082] The light-blocking pattern PP can be disposed inside the grounding wire GW. The light-blocking pattern PP can also be disposed in the non-display area NA on the third side (for example, in the non-display area NA below the display device 100), but is not limited thereto.

[0083] The light-blocking pattern PP can be formed from the material of the light-blocking layer constituting the display area AA and / or the driving element 120, but is not limited thereto.

[0084] Reference Figure 3The GIP circuit component 108 can be disposed inside the light blocking pattern PP. For example, the GIP circuit component 108 can be disposed in the non-display area NA on the first side (e.g., disposed in the non-display areas NA on the left and right sides of the display device 100).

[0085] GIP circuit component 108 may include, but is not limited to, a control signal clock line CW, a logic unit LP, a buffer TFT unit B-TFT, and a power line GVSS.

[0086] The control signal clock line CW, logic unit LP, buffer TFT unit B-TFT, and power line GVSS can be sequentially arranged from the edge of the second substrate 160, but this disclosure is not limited thereto.

[0087] In this case, the control signal clock line CW, logic unit LP, buffer TFT unit B-TFT, and power line GVSS can be formed from the material of the light-shielding layer constituting the display area AA and / or the driving element 120, but are not limited thereto.

[0088] Furthermore, the link lines can be disposed above the first substrate 111 in the non-display area NA on the second side, and the high-potential power lines can be disposed in the non-display area NA on the third side. For example, the link lines can be disposed in the non-display area NA above the display device 100, and the high-potential power lines can be disposed in the non-display area NA below the display device 100, but this disclosure is not limited thereto.

[0089] The link lines and high-potential power lines may be formed of the material of the light-shielding layer constituting the display area AA and / or the driving element 120, but this disclosure is not limited thereto.

[0090] Reference Figure 2 The driving element 120 can be disposed on the buffer layer 112.

[0091] The driving element 120 may include an active layer 124, a gate insulating layer 113, a gate electrode 121, an interlayer insulating layer 114, a source electrode 122, and a drain electrode 123. Furthermore, the driving element 120 may be electrically connected to the light-emitting element 130 via a connection electrode 125 to transmit current or a signal to the light-emitting element 130. In addition to the top gate structure shown, the driving element 120 may be applied in various ways (e.g., a bottom gate with the gate electrode located below the active layer and a coplanar structure in which the gate electrode, source electrode, and drain electrode are disposed on the same plane).

[0092] The active layer 124 can be disposed on the buffer layer 112. The active layer 124 can be made of polycrystalline silicon (p-Si), and in this case, a predetermined region can be doped with impurities. Alternatively, the active layer 124 can be made of amorphous silicon (a-Si) and can be made of an organic semiconductor material such as pentacene. Furthermore, the active layer 124 can be formed of an oxide semiconductor.

[0093] A gate insulating layer 113 may be disposed on the active layer 124. For example, the gate insulating layer 113 may be made of a material such as silicon oxide (SiO2). x ) or silicon nitride (SiN) x It is formed from insulating inorganic materials or insulating organic materials.

[0094] The gate electrode 121 may be disposed on the gate insulating layer 113. For example, the gate electrode 121 may be made of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof.

[0095] An interlayer insulating layer 114 may be disposed on the gate electrode 121. For example, the interlayer insulating layer 114 may be made of materials such as silicon oxide (SiO2). x ) or silicon nitride (SiN) x It is formed from insulating materials or insulating organic materials.

[0096] Contact holes exposing the source and drain regions can be formed by selectively removing the gate insulating layer 113 and the interlayer insulating layer 114. The source electrode 122 and the drain electrode 123 can be formed on the interlayer insulating layer 114 using electrode materials in a single-layer or multi-layer structure.

[0097] If needed or desired, an additional protective layer made of inorganic insulating material may be formed to cover the source electrode 122 and the drain electrode 123.

[0098] In addition, at least some of the buffer layer 112, gate insulating layer 113 and interlayer insulating layer 114 (i.e., insulating layer 117) may extend to the non-display area NA.

[0099] The planarization layer 115 can be disposed on the drive element 120 configured as described above.

[0100] The planarization layer 115 can have a multilayer structure comprising at least two layers. For example, refer to... Figure 2 The planarization layer 115 may include a first planarization layer 115a and a second planarization layer 115b, but is not limited thereto.

[0101] For example, the first planarization layer 115a is configured to cover the driving element 120 and may be configured to expose part of the source electrode 122 or drain electrode 123 of the driving element 120.

[0102] The planarization layer 115 can extend to the non-display area NA.

[0103] The planarization layer 115 can be an outer coating layer, but is not limited to this.

[0104] The connection electrode 125 for electrically connecting the driving element 120 and the light-emitting element 130 can be disposed on the first planarization layer 115a. Additionally, referring to... Figure 2 Various metal layers that can be used as wiring / electrodes, such as data lines and signal lines, can be provided on the first planarization layer 115a.

[0105] The color filter CF can be set on the first planarization layer 115a, but is not limited thereto, and the color filter CF can be removed depending on the type of the light-emitting element 130.

[0106] Each subpixel's color filter CF can be any of red, green, and blue. Alternatively, in the case of implementing white subpixels, a color filter CF may not be required. The arrangement of red, green, and blue can be formed in various ways, and a black matrix capable of absorbing external light can be provided between the color filter CFs.

[0107] In the case of bottom-emitting type, the color filter CF can be located below the anode 131.

[0108] Furthermore, a second planarization layer 115b can be disposed on the first planarization layer 115a and the connecting electrode 125. Because the number of signal lines increases as the display device 100 achieves high resolution, the planarization layer 115 according to an example embodiment of this disclosure can be composed of two layers. Therefore, since it is difficult to arrange all lines on a single layer while ensuring minimal spacing between them, an additional layer can be introduced. By introducing such an additional layer (i.e., the second planarization layer 115b), greater flexibility in signal line arrangement can be achieved, thereby facilitating the layout design of signal lines and electrodes. Additionally, when a dielectric material is used as the planarization layer 115 configured as a multilayer layer, it can be used to form capacitors between metal layers.

[0109] A second planarization layer 115b can be formed to expose a portion of the connection electrode 125. Furthermore, the drain electrode 123 of the driving element 120 and the anode 131 of the light-emitting element 130 can be electrically connected via the connection electrode 125.

[0110] In addition, refer to Figure 3 The low-potential power line 135 can be disposed on the planarization layer 115. The low-potential power line 135 can be disposed on the non-display area NA other than the second side of the display device 100 (e.g., on the non-display areas NA on the left, right and bottom sides), but is not limited thereto.

[0111] A dam 116 can be formed in the remaining area of ​​the planarization layer 115, excluding the light-emitting region. For example, the dam 116 has dam holes exposing the anode 131 corresponding to the light-emitting region. The dam 116 can be made of materials such as silicon nitride (SiN). x ) or silicon oxide (SiO) x It is made of inorganic insulating materials, or organic insulating materials such as BCB, acrylic resin or imide resin.

[0112] The embankment 116 may extend into the non-display area NA. For example, the embankment 116 may extend into the non-display area NA to cover the upper and side surfaces of the low-potential power line 135.

[0113] Return to reference Figure 2 The light-emitting element 130 can be disposed on the embankment 116.

[0114] The light-emitting element 130 can be configured such that an anode 131, a plurality of organic layers 132, and a cathode 133 are sequentially disposed. For example, the light-emitting element 130 may include an anode 131 disposed on a planarization layer 115, a plurality of organic layers 132 disposed on the anode 131, and a cathode 133 disposed on the plurality of organic layers 132.

[0115] The display device 100 can be either a top-emitting or bottom-emitting type. In the top-emitting method, a reflective layer made of an opaque conductive material with high reflectivity (e.g., silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof) can be added below the anode 131 so that light emitted from the plurality of organic layers 132 is reflected by the anode 131 and directed upward (e.g., in the direction of the top cathode 133). Conversely, in the bottom-emitting type, the anode 131 can be made solely of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO). Hereinafter, the display device 100 of this disclosure will be described under the assumption that it is a bottom-emitting type. However, this disclosure is not limited thereto.

[0116] Multiple organic layers 132 can be disposed on the anode 131 exposed by the embankment 116. The multiple organic layers 132 may include a light-emitting layer, an electron injection layer, an electron transport layer, a hole transport layer, a hole injection layer, etc.

[0117] Reference Figure 3 The organic layer 132 may extend into the non-display area NA. Multiple organic layers 132 may extend into the non-display area NA, and their edges may be positioned inside the edge of the embankment 116, but are not limited thereto.

[0118] Reference Figure 2The cathode 133 can be disposed on multiple organic layers 132.

[0119] In the case of a top-emitting type, the cathode 133 may comprise a transparent conductive material. For example, the cathode 133 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), etc. In the case of a bottom-emitting type, the cathode 133 may comprise any of a metallic material formed of a metal material such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or alloys thereof. Alternatively, the cathode 133 may be configured by laminating a layer made of a transparent conductive material (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO)) and a layer made of a metallic material (e.g., gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), magnesium (Mg), palladium (Pd), copper (Cu), or alloys thereof), but is not limited thereto.

[0120] Reference Figure 3 The cathode 133 may extend into the non-display area NA. The cathode 133 may cover, but is not limited to, the top surface, side surface, and top surface of the embankment 116 of the organic layer 132 in the non-display area NA.

[0121] A capping layer can be disposed on the cathode 133. The capping layer can be formed of a material with high refractive index and high absorbance to reduce diffuse reflection of external light.

[0122] The protective layer 140 can be disposed on the light-emitting element 130 configured as described above.

[0123] The protective layer 140 can be an inorganic layer, and in this case, it can be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x It is made of or in multiple layers.

[0124] The protective layer 140 can extend to the non-display area NA.

[0125] In addition, the protective layer 140 may be configured to surround the cathode 133, except for the non-display area NA on the second side (e.g., the non-display area NA on the upper side).

[0126] For example, the protective layer 140 can be made of an inorganic insulating material.

[0127] The protective layer 140 can delay moisture penetration at the top and inhibit the occurrence of defects caused by dents or foreign matter.

[0128] The protective layer 140 can be made of silicon oxide (SiO2). x ), silicon nitride (SiN)x It may be made of or in a multi-layered structure to delay moisture penetration, but is not limited thereto.

[0129] The adhesive layer 170 and the second substrate 160 can be disposed on the protective layer 140.

[0130] However, this disclosure is not limited thereto, and a multi-layered encapsulation structure consisting of a sealing member and a reinforcing substrate may be disposed on the protective layer 140.

[0131] The adhesive layer 170 can be disposed between the protective layer 140 and the second substrate 160.

[0132] For example, adhesive layer 170 can be used to delay lateral moisture penetration.

[0133] The adhesive layer 170 may include a transparent layer 171 and an absorbent layer 172 located on the transparent layer 171.

[0134] The transparent layer 171 can enhance the adhesion between the absorbent layer 172 and the lower component located below the transparent layer 171. The transparent layer 171 can be configured to correspond to the entire surface of the first substrate 111, but is not limited thereto.

[0135] The transparent layer 171 can be made of a resin-based material that is made of a transparent material. For example, the transparent layer 171 can be made of a material such as isobutyl rubber resin, but is not limited thereto.

[0136] The absorption layer 172 is disposed on the transparent layer 171 and can adsorb or remove moisture or oxygen flowing into the absorption layer 172.

[0137] The absorbent layer 172 includes a plurality of hygroscopic agents 172a and resin 172b.

[0138] The plurality of desiccant 172a may be reactive absorbents that chemically react with moisture or oxygen introduced into the adhesive layer 170 to adsorb moisture or oxygen, or they may be physical absorbents. In this case, the plurality of desiccant 172a may be configured to correspond to the entire surface of the adhesive layer 170. Alternatively, the desiccant 172a may be configured to overlap the entire surface of the transparent layer 171, but is not limited thereto.

[0139] Multiple desiccant 172a may include multiple hydrogen adsorption particles 172a-1, multiple moisture adsorption particles 172a-2, and multiple core-shell particles 172a-3.

[0140] Multiple hydrogen adsorption particles 172a-1 can adsorb hydrogen gas. For example, the organic layer 132 can react with moisture to generate hydrogen gas, which can cause white spot phenomenon. Therefore, multiple hydrogen adsorption particles 172a-1 adsorb hydrogen gas generated due to the organic layer 132 and moisture, thereby preventing or minimizing the white spot phenomenon. Multiple hydrogen adsorption particles 172a-1 can be formed from, for example, nickel (Ni) particles, but are not limited thereto.

[0141] Multiple moisture adsorption particles 172a-2 can collect moisture introduced from the outside through physical or chemical reactions. For example, multiple moisture adsorption particles 172a-2 can be formed from multiple calcium oxide (CaO) particles, but are not limited thereto.

[0142] Multiple core-shell particles 172a-3 can adsorb or remove moisture or oxygen introduced from the outside through physical or chemical reactions. Each of the multiple core-shell particles 172a-3 may include a core particle 172a-3c and a shell 172a-3s surrounding the core particle 172a-3c.

[0143] The core particles 172a-3c exhibit good adhesion to the shell 172a-3s and can be made of materials that are stable at high temperatures. For example, the core particles 172a-3c can be made of silicon oxide (SiO2), but are not limited to this.

[0144] The shell layers 172a-3s collect oxygen introduced into the adhesive layer 170 to prevent or minimize oxygen penetration into the lower portion of the adhesive layer 170. For example, the shell layers 172a-3s can be formed from reduced titanium oxide (TiO2) including oxygen vacancies. However, this disclosure is not limited thereto. The shell layers 172a-3s are made of one or more metallic materials selected from titanium (Ti), chromium (Cr), vanadium (V), manganese (Mn), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), and palladium (Pd), and can be made from metal oxides including oxygen vacancies.

[0145] Resin 172b can be made of a resin-based material, which is made of a transparent material. For example, resin 172b can be made of a material such as isobutyl rubber resin, but is not limited thereto.

[0146] The second substrate 160 can be disposed on the adhesive layer 170.

[0147] The second substrate 160, together with the adhesive layer 170, can protect the light-emitting element 130 from external moisture, oxygen, impact, etc.

[0148] For example, the second substrate 160 can be used to prevent or minimize front-side moisture penetration.

[0149] For example, the second substrate 160 can be made of stainless steel (SUS) or Invar alloy, but is not limited to these. Invar alloy is one of the alloys composed of nickel and iron, and has a very low coefficient of thermal expansion and is relatively stable with respect to temperature changes.

[0150] The display device includes an adhesive layer comprising a plurality of hygroscopic agents to prevent, minimize, and delay moisture penetration. For example, the display device may include an adhesive layer in which reduced metal oxides are dispersed to reduce dark spot defects in the display device due to moisture penetration.

[0151] In the display device 100 according to an exemplary embodiment of the present disclosure, a plurality of core-shell particles 172a-3 made of reduced metal oxides are used as a desiccant for adsorbing or removing moisture or oxygen. For example, each of the plurality of core-shell particles 172a-3 may consist of a core particle 172a-3c made of silicon oxide (SiO2) and a core particle 172a-3c made of reduced titanium oxide (TiO2). 2－x The shell layer 172a-3s is made of titanium oxide (TiO2) containing oxygen vacancies. Since the core-shell particles 172a-3 are formed from titanium oxide (TiO2) including oxygen vacancies, oxygen that has permeated into the lower component of the adhesive layer 170 can be adsorbed into the core-shell particles 172a-3. Therefore, the permeation of moisture or oxygen into the lower component of the adhesive layer 170 can be prevented or minimized. Therefore, the reliability of the display device 100 can be improved by delaying dark spot defects in the display device 100 caused by moisture permeation.

[0152] Furthermore, in the display device 100 according to an exemplary embodiment of the present disclosure, silicon oxide (SiO2) with low cost and high adhesion to the shell layers 172a-3s is used as the core particles 172a-3c of the core-shell particles 172a-3, which can reduce the manufacturing cost of the display device 100. Moreover, the shell layers 172a-3s can be formed by performing an atomic layer deposition (ALD) process on a plurality of core particles 172a-3c. Therefore, since the core-shell particles 172a-3 in a granular state can be formed by an ALD process without the need for a separate particle formation process, the manufacturing process of the display device 100 can be reduced.

[0153] Furthermore, in the display device 100 according to the exemplary embodiment of this disclosure, titanium oxide (TiO2) with a small particle size is used as the shell layer 172a-3s of the core-shell particles 172a-3. Therefore, excessive increase in size due to aggregation of the core-shell particles 172a-3 can be prevented, and damage to the light-emitting element 130 can be reduced. Thus, dark spot defects in the display device 100 can be reduced, and reliability can be improved.

[0154] Figure 4 This is a plan view of a display device according to another embodiment of the present disclosure. Figure 4 The display device 400 and Figures 1A to 3 The difference in the display device 100 lies only or primarily in the absorbent layer 472 of the adhesive layer 470, therefore a redundant description will be omitted or can be simply provided. Figure 4 For ease of description, the second substrate 160 is not shown.

[0155] Reference Figure 4 The absorbent layer 472 of the adhesive layer 470 is disposed on the first substrate 111.

[0156] The absorbent layer 472 may include resin 172b and a plurality of hygroscopic agents 172a dispersed in resin 172b.

[0157] Multiple desiccant 172a may include multiple hydrogen adsorption particles, multiple moisture adsorption particles and multiple core-shell particles. Figure 4 The display device 400 contains multiple hydrogen adsorption particles, multiple moisture adsorption particles, and multiple core-shell particles, each of which is substantially related to... Figures 1A to 3 Each of the plurality of hydrogen adsorption particles 172a-1, the plurality of moisture adsorption particles 172a-2, and the plurality of core-shell particles 172a-3 in the display device 100 is identical; therefore, redundant descriptions will be omitted or provided briefly.

[0158] At this time, the plurality of desiccant 172a can be configured to correspond to the peripheral region of the first substrate 111. For example, the plurality of desiccant 172a can be disposed only in the outer portion of the absorption layer 472, which is located in the central portion and the outer portion surrounding the central portion.

[0159] In a display device 400 according to another exemplary embodiment of the present disclosure, a plurality of core-shell particles 172a-3 made of reduced metal oxides are used as a desiccant for adsorbing or removing moisture or oxygen. For example, titanium oxide (TiO2) including oxygen vacancies is used as the shell layer 172a-3s of the plurality of core-shell particles 172a-3c, and silicon oxide (SiO2), which has low cost and high adhesion to the shell layer 172a-3s, is used as the core particle 172a-3c. Therefore, by using a plurality of low-cost core-shell particles 172a-3, dark spot defects in the display device 400 caused by moisture penetration can be delayed.

[0160] Furthermore, in a display device 400 according to another exemplary embodiment of the present disclosure, since titanium oxide (TiO2) with small particle size is used as the shell layer 172a-3s of the core-shell particles 172a-3, excessive increase in size due to aggregation of the core-shell particles 172a-3 can be prevented, and damage to the light-emitting element 130 can be reduced.

[0161] Furthermore, in another exemplary embodiment of the display device 400 according to this disclosure, a plurality of core-shell particles 172a-3 are disposed only in the outer portion of the absorption layer 472, which is located in the central portion and the outer portion surrounding the central portion. Moisture and oxygen can penetrate into the interior of the display device 400 from the outside. Therefore, in another exemplary embodiment of the display device 400 according to this disclosure, a plurality of core-shell particles 172a-3 are disposed only in the outer portion of the area of ​​the absorption layer 472 that is susceptible to moisture and oxygen penetration, in order to effectively prevent or minimize moisture and oxygen penetration.

[0162] Figure 5 This is a plan view of a display device according to another embodiment of the present disclosure. Figure 6 This is a cross-sectional view of a display device according to yet another embodiment of the present disclosure. Figure 5 and Figure 6 In the display device 500, with Figures 1A to 3 Compared to the display device 100, the addition of the trench 580 and the outer embankment 516', and the only differences between the low potential power line 535, the insulating layer 517, the planarization layer 515, the embankment 516, the cathode 533, the protective layer 540 and the transparent layer 571, will be omitted or can be briefly provided in a redundant description.

[0163] Reference Figure 5 and Figure 6 The trench 580 can be disposed at the edge of the non-display area NA. The trench 580 is the area in which the insulating layer 517 and the planarization layer 515 are removed. In this case, the trench 580 can be configured to be spaced apart from the GIP circuit component 108 by a predetermined interval G. Therefore, the effect of moisture penetration on the GIP circuit component 108 can be minimized.

[0164] The trench 580 may be formed on the second side where the data pad unit 107 is disposed, for example, on the non-display area NA on the left, right and lower sides of the four side portions of the display device 500, excluding the upper side, but is not limited thereto.

[0165] The trench 580 can be disposed in the shaded area within the non-display area NA. Therefore, the reliability bezel area L can be expanded by converting the existing shaded area into a reliability bezel area L, and the bezel width can be reduced by increasing the length of the reliability bezel area L. Thus, the trench 580 can delay the rate at which moisture penetrates to the side surface of the display device 500. In this case, the reliability bezel area L can be defined as the portion from the end of the second substrate 160 to the end of the cathode 533.

[0166] Reference Figure 6 Low-potential power lines 535 can be provided in trench 580. Furthermore, low-potential power lines 535 can be provided to cover the upper and side surfaces of the insulation layer 517 and planarization layer 515 exposed through trench 580.

[0167] The outer embankment 516' can be disposed on the low-potential power line 535. The outer embankment 516' can cover the outer portion of the low-potential power line 535 in an island shape. For example, the outer embankment 516' can cover the tapered portion of the low-potential power line 535 and the planarization layer 515.

[0168] The outer embankment 516' can be disposed on the same layer as the embankment 516 and formed of the same material as the embankment 516. In this case, the embankment 516 and the outer embankment 516' can be separated on opposite sides of the trench 580, and a portion of the top surface of the low-potential electric field line 535 can be exposed without being covered by the outer embankment 516'. Therefore, the moisture transfer velocity (WTV) can be suppressed.

[0169] The cathode 533 may extend into the trench 580 in the display area AA. The cathode 533 may extend into the trench 580 and may contact the top surface of the low-potential power line 535 exposed in the trench 580, and receive low-potential power from the low-potential power line 535.

[0170] The protective layer 540 may extend into the trench 580 to cover the cathode 533. For example, the protective layer 540 may be configured to surround the cathode 533 except for the non-display area NA on the second side. Alternatively, the protective layer 540 may cover a portion of the top surface of the cathode 533 in the non-display area NA on the second side.

[0171] The transparent layer 571 of the adhesive layer 570 can cover the trench 580. For example, the transparent layer 571 can extend into the trench 580 to cover the protective layer 540, the low-potential power line 535, and the outer embankment 516'.

[0172] In a display device 500 according to another exemplary embodiment of the present disclosure, a plurality of core-shell particles 172a-3 made of reduced metal oxides are used as a desiccant for adsorbing or removing moisture or oxygen. For example, titanium oxide (TiO2) containing oxygen vacancies is used as the shell layer 172a-3s of the plurality of core-shell particles 172a-3c, and silicon oxide (SiO2), which has low cost and high adhesion to the shell layer 172a-3s, is used as the core particle 172a-3c. Therefore, by using a plurality of low-cost core-shell particles 172a-3, dark spot defects in the display device 500 caused by moisture penetration can be delayed.

[0173] Furthermore, in a display device 500 according to another exemplary embodiment of the present disclosure, since titanium oxide (TiO2) with small particle size is used as the shell layer 172a-3s of the core-shell particles 172a-3, excessive increase in size due to the aggregation of the core-shell particles 172a-3 can be prevented, thereby improving the reliability of the display device 500.

[0174] Furthermore, in another exemplary embodiment of the display device 500 according to this disclosure, a trench 580 is provided at the edge of the non-display area NA to minimize the impact of moisture penetration on the GIP circuit component 108. For example, in another exemplary embodiment of the display device 500 according to this disclosure, a cathode 533 may extend into the trench 580 and may contact the low-potential power line 535 exposed in the trench 580. Therefore, the entire GIP circuit component 108 and the display area AA can be sealed, and the moisture penetration effect can be minimized. Therefore, the stability and durability of the GIP circuit component 108 can be significantly improved, and the reliability of the display device 500 can be improved.

[0175] The exemplary embodiments of this disclosure can also be described as follows: According to embodiments of this disclosure, a display device includes: a first substrate including a display area and a non-display area outside the display area; a plurality of light-emitting elements disposed on the first substrate; an adhesive layer disposed on the plurality of light-emitting elements and including a plurality of core-shell particles; and a second substrate disposed on the adhesive layer, wherein the plurality of core-shell particles may include reduced titanium oxide (TiO2). 2－x ).

[0176] According to another aspect of this disclosure, each of the plurality of core-shell particles may include a core particle comprising silicon oxide (SiO2) and a shell surrounding the core particle and comprising reduced titanium oxide.

[0177] According to another aspect of this disclosure, a plurality of core-shell particles may be configured to correspond to the entire surface of the first substrate.

[0178] According to another aspect of this disclosure, a plurality of core-shell particles can be configured to correspond to an outer region of the first substrate.

[0179] According to another aspect of this disclosure, the display device may further include: an insulating layer and a planarization layer disposed above a first substrate and extending from a display area to a non-display area; and at least one trench disposed in the non-display area, wherein at least one of the insulating layer and the planarization layer is removed, and an adhesive layer may cover the trench.

[0180] According to another aspect of this disclosure, the adhesive layer may include a transparent layer disposed on a plurality of light-emitting elements and an absorption layer disposed on the transparent layer and comprising a plurality of core-shell particles.

[0181] According to another aspect of this disclosure, the adhesive layer may further comprise a plurality of nickel particles and a plurality of calcium oxide particles.

[0182] A display device according to another exemplary embodiment of this disclosure may include a first substrate, a plurality of light-emitting elements, an absorption layer, and a second substrate. The first substrate includes a display area and a non-display area outside the display area. The plurality of light-emitting elements are disposed on the first substrate. The absorption layer is disposed on the plurality of light-emitting elements and includes a plurality of core-shell particles. The second substrate is disposed on the absorption layer. Each of the plurality of core-shell particles may include a core particle made of silicon oxide and a shell layer surrounding the core particle and including oxygen vacancies.

[0183] According to another aspect of this disclosure, a plurality of core-shell particles can be configured to correspond to the entire surface of the absorber layer.

[0184] According to another aspect of this disclosure, the absorber layer may include a central portion and an outer portion surrounding the central portion, and a plurality of core-shell particles may be disposed in the central portion and the outer portion or only in the outer portion of the central portion and the outer portion.

[0185] According to another aspect of this disclosure, the display device may further include: an insulating layer and a planarization layer disposed above a first substrate and extending from a display area to a non-display area; at least one trench disposed in the non-display area, wherein at least one of the insulating layer and the planarization layer is removed; and a transparent layer disposed between a plurality of light-emitting elements and an absorption layer, the transparent layer being capable of covering the trench.

[0186] According to another aspect of this disclosure, the shell may be formed of one or more materials selected from titanium (Ti), chromium (Cr), vanadium (V), manganese (Mn), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh) and palladium (Pd).

[0187] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in various forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided merely for illustrative purposes and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are exemplary in all embodiments and do not limit the present disclosure. The scope of protection of the present disclosure should be interpreted based on the appended claims, and all technical concepts within their equivalent scope should be interpreted as falling within the scope of the present disclosure.

[0188] Cross-reference to related applications

[0189] This application claims priority to Korean Patent Application No. 10-2025-0057675, filed in Korea on April 30, 2025, the entire disclosure of which is expressly incorporated herein by reference.

Claims

1. A display device, the display device comprising: A first substrate, the first substrate including a display area and a non-display area outside the display area; Multiple light-emitting elements are disposed on the first substrate; An adhesive layer is disposed on the plurality of light-emitting elements, and the adhesive layer includes a plurality of core-shell particles; as well as The second substrate is disposed on the adhesive layer. The plurality of core-shell particles include reduced titanium oxide (TiO2). 2-x .

2. The display device according to claim 1, wherein, Each of the plurality of core-shell particles includes: Core particles, said core particles comprising silicon oxide (SiO2); and A shell surrounding the core particle and comprising the reduced titanium oxide.

3. The display device according to claim 1, wherein, The plurality of core-shell particles are configured to correspond to the entire surface of the first substrate.

4. The display device according to claim 1, wherein, The plurality of core-shell particles are configured to correspond to the peripheral region of the first substrate.

5. The display device according to claim 1, further comprising: An insulating layer and a planarization layer are disposed on the first substrate, and the insulating layer and the planarization layer extend from the display area to the non-display area; as well as At least one trench is disposed in the non-display area, and in the at least one trench, at least one of the insulating layer and the planarization layer is removed.

6. The display device according to claim 5, wherein, The adhesive layer covers at least one trench in the non-display area.

7. The display device according to claim 6, further comprising: Low-potential power lines are disposed in at least one trench beneath the adhesive layer in the non-display area.

8. The display device according to claim 7, further comprising: An outer embankment is disposed in the non-display area on the low-potential power line, and the outer embankment covers the outer portion of the low-potential power line.

9. The display device according to claim 1, wherein, The adhesive layer includes: A transparent layer is disposed on the plurality of light-emitting elements; and An absorption layer is disposed on the transparent layer, and the absorption layer includes the plurality of core-shell particles.

10. The display device according to claim 9, wherein, The adhesive layer also includes multiple nickel particles and multiple calcium oxide particles.

11. The display device according to claim 9, further comprising: An insulating layer and a planarization layer are disposed on the first substrate, and the insulating layer and the planarization layer extend from the display area to the non-display area; as well as At least one trench is disposed in the non-display area, and in the at least one trench, at least one of the insulating layer and the planarization layer is removed. The transparent layer of the adhesive layer is disposed in the at least one groove.

12. A display device, the display device comprising: A first substrate, the first substrate including a display area and a non-display area outside the display area; Multiple light-emitting elements are disposed on the first substrate; An absorption layer is disposed on the plurality of light-emitting elements, and the absorption layer includes a plurality of core-shell particles; as well as The second substrate is disposed on the absorption layer. Each of the plurality of core-shell particles includes: The core particles, said core particles being made of silicon oxide, and A shell surrounding the nucleus particle, and the shell comprising oxygen vacancies.

13. The display device according to claim 12, wherein, The plurality of core-shell particles are configured to correspond to the entire surface of the absorber layer.

14. The display device according to claim 12, wherein, The absorbent layer includes a central portion and an outer portion surrounding the central portion, and The plurality of core-shell particles are disposed only in the outer portion of the central portion and the outer portion.

15. The display device according to claim 12, further comprising: An insulating layer and a planarization layer are disposed on the first substrate, and the insulating layer and the planarization layer extend from the display area to the non-display area; At least one trench is disposed in the non-display area, and in the at least one trench, at least one of the insulating layer and the planarization layer is removed; as well as A transparent layer is disposed between the plurality of light-emitting elements and the absorption layer.

16. The display device according to claim 15, wherein, The transparent layer covers the at least one trench.

17. The display device according to claim 12, wherein, The shell layer comprises one or more materials selected from titanium (Ti), chromium (Cr), vanadium (V), manganese (Mn), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), and palladium (Pd).

18. The display device according to claim 12, wherein, The absorber layer comprises multiple nickel particles and multiple calcium oxide particles.

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