Display device

Abstract

According to an embodiment of the disclosure, a display device includes a substrate including a display area and a non-display area; a plurality of light emitting elements disposed in the display area of the substrate; an encapsulation part disposed to cover the plurality of light emitting elements; a touch sensing unit disposed on the encapsulation part and including a plurality of touch electrodes; a touch planarization layer disposed on the plurality of touch electrodes; a protection layer on the touch planarization layer; a lower partition wall adhesive layer disposed in the non-display area in a manner surrounding the display area and disposed on the same layer as the touch planarization layer and spaced apart from the touch planarization layer; and an upper partition wall adhesive layer disposed on the lower partition wall adhesive layer, wherein the lower partition wall adhesive layer includes a plurality of protruding portions protruding upward, and the upper partition wall adhesive layer overlaps the plurality of protruding portions in a vertical direction.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2025-0057341, filed on April 30, 2025, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device capable of reducing stress and suppressing damage to touch sensors when the bezel is bent. Background Technology

[0004] Typically, display devices are widely used as screens for various electronic devices, such as mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation systems, ultra-mobile PCs (UMPCs), mobile phones, smartphones, tablet PCs, watch phones, electronic boards, wearable devices, watch phones, portable information devices, navigation systems, vehicle control displays, televisions, laptops, and monitors.

[0005] Recently, research and development have been conducted on display devices that can achieve maximum screen size in the same size display panel by reducing the bezel area where no image is displayed. Summary of the Invention

[0006] The purpose of this disclosure is to provide a display device that can minimize the width of the bezel area and reduce the stress caused by the microcoating when the bezel is bent.

[0007] Another objective of this disclosure is to provide a display device that suppresses lateral moisture penetration and inhibits crack formation.

[0008] Another objective of this disclosure is to provide a display device that reduces stress generated in bending regions and improves reliability.

[0009] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0010] According to embodiments of the present disclosure, a display device includes: a substrate including a display area and a non-display area; a plurality of light-emitting elements disposed in the display area of ​​the substrate; an encapsulation portion configured to cover the plurality of light-emitting elements; a touch sensing unit disposed on the encapsulation portion and including a plurality of touch electrodes; a touch planarization layer disposed on the plurality of touch electrodes; a protective layer disposed on the touch planarization layer; a lower partition wall adhesive layer disposed in the non-display area surrounding the display area, and disposed on the same layer as the touch planarization layer and spaced apart from the touch planarization layer; and an upper partition wall adhesive layer disposed on the lower partition wall adhesive layer, wherein the lower partition wall adhesive layer includes a plurality of upwardly projecting protrusions, and the upper partition wall adhesive layer overlaps with the plurality of protrusions.

[0011] Further details of the embodiments are included in the detailed description and accompanying drawings.

[0012] According to this disclosure, when the frame is bent, the thickness of the upper microcoating in the prior art decreases in the bent region, and the stress caused by bending can be reduced by introducing the lower microcoating.

[0013] According to this disclosure, the thickness of the border region and the radius of curvature of the curved region can be reduced by using multiple lower micro-coatings cured by different processes.

[0014] According to this disclosure, external vibration absorption is improved by using micro-coatings with different moduli, thereby improving impact resistance.

[0015] According to this disclosure, the bending shape can be adjusted during the bending process while maintaining a reliable environment and shape.

[0016] The effects of this disclosure are not limited to those illustrated above, and include a wide variety of other effects. Attached Figure Description

[0017] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic plan view of a display device according to an exemplary embodiment of the present disclosure.

[0018] Figure 2 It is shown Figure 1 A plan view of an embodiment of the display device shown.

[0019] Figure 3 It is along Figure 2 A sectional view taken by line I-I'.

[0020] Figure 4 yes Figure 3 An enlarged sectional view of region A.

[0021] Figure 5 This is a schematic cross-sectional view of a display device according to another embodiment of the present disclosure.

[0022] Figures 6A to 6F This is a cross-sectional view used to illustrate a method of manufacturing a display device according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0023] The advantages and features of this disclosure, as well as the methods for implementing these advantages and features, will become clear from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only, so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0024] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Furthermore, in the following description of this disclosure, detailed descriptions of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0025] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0026] When using terms such as “above,” “over,” “below,” and “next to” to describe the positional relationship between two parts, one or more parts may be located between the two parts, unless these terms are used with the terms “immediately” or “directly.”

[0027] When a component or layer is positioned "on" another component or layer, the other layer or component can be directly inserted onto or between the other component.

[0028] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, the first component mentioned below can be the second component in the technical concept of this disclosure.

[0029] Throughout this disclosure, the same reference numerals generally denote the same elements.

[0030] For ease of description, the dimensions and thickness of each component shown in the accompanying drawings are illustrated, and this disclosure is not limited to the dimensions and thickness of the components shown.

[0031] Features of the various embodiments of this disclosure may be partially or completely adhered to or combined with each other, and may be technically associated and operated in various ways, and the embodiments may be performed independently or in association with each other.

[0032] This disclosure will be described in detail below with reference to the accompanying drawings.

[0033] Figure 1 This is a schematic plan view of a display device according to an exemplary embodiment of the present disclosure.

[0034] exist Figure 1 For ease of description, only the substrate 101 and the plurality of pixels PX are shown among the various components of the display device 100.

[0035] The substrate 101 is a component used to support various parts included in the display device 100, and may be made of an insulating material. The substrate 101 may be made of a flexible, bendable material. The substrate 101 may be formed of a transparent insulating material. For example, the substrate 101 may be formed of a plastic material such as polyimide (PI).

[0036] Multiple gate lines and multiple data lines are arranged to intersect each other on substrate 101. Multiple pixels PX are defined at the intersections of the multiple gate lines and multiple data lines. The area where the multiple pixels PX that implement the image are set can be referred to as display area AA, and the area outside display area AA that does not have multiple pixels PX can be referred to as non-display area NA.

[0037] Display units for displaying images and circuitry for driving the display units can be formed in the display area AA. For example, when the display device 100 is an organic light-emitting display device, the display units may include light-emitting elements. When the display device 100 is a liquid crystal display device, the display units may be configured to include a liquid crystal layer. In the following description, for ease of description, it is assumed that the display device 100 is an organic light-emitting display device, but it is not limited thereto.

[0038] The circuit section may include various transistors, capacitors, and lines for driving the light-emitting elements. For example, the circuit section may be formed from various components such as driving transistors, switching transistors, storage capacitors, gate lines, and data lines, but is not limited thereto.

[0039] The non-display area NA is an area where no image is displayed and where various lines, circuits, etc. are provided to drive the display units located in the display area AA.

[0040] The non-display area NA can be like Figure 1 The area shown is defined as the region surrounding the display area AA. However, this disclosure is not limited thereto, and the non-display area NA may be defined as the region extending from the display area AA. In addition, the non-display area NA may be defined as extending from multiple sides of the display area AA.

[0041] In the non-display area NA, various ICs and drive circuits, such as gate driver ICs, data driver ICs, COF, and FPCB, can be installed. Additionally, a drive circuit known as the gate in panel (GIP) can be installed in the non-display area NA.

[0042] The non-display area NA may include: a first non-display area NA1 adjacent to the display area AA; a curved area BA extending from the first non-display area NA1; and a second non-display area NA2 extending from one side of the curved area BA.

[0043] Specifically, the first non-display area NA1 is an area in which no image is displayed and is configured to surround the display area AA. The first non-display area NA1 may be an area provided with various lines, driver ICs, etc., for driving multiple sub-pixels disposed in the display area AA. The first non-display area NA1 in which no image is displayed may be a border area, and the embodiments of this disclosure are not limited thereto.

[0044] A portion of the non-display area NA can be bent in the bending direction, for example... Figure 1 The arrow shown. An area curved in this way can be called a curved area BA. In other words, the curved area BA is a part of the first non-display area NA1 that extends from one side of the non-display area NA, and can be a curved area.

[0045] The pad portion PA is disposed in a second non-display area NA2 extending from one side of the curved area BA. The pad portion PA may include multiple pad electrodes to which an external module is coupled.

[0046] In the following text, we will refer to... Figures 2 to 3 The display device 100 will be described in more detail.

[0047] Figure 2 It is shown Figure 1 A plan view of an embodiment of the display device shown. Figure 3 It is along Figure 2 A sectional view taken by line I-I'.

[0048] In the substrate 101, a thin-film transistor 110 for driving each pixel is disposed in the display area AA. The thin-film transistor 110 includes an active layer 111, a gate 112, a source 113, and a drain 114.

[0049] An active layer 111 is disposed on a substrate 101. The active layer 111 may be formed of polycrystalline silicon (p-Si), amorphous silicon (a-Si), or oxide semiconductor, but is not limited thereto.

[0050] A gate insulating layer 115 is disposed on the substrate 101 and the active layer 111. The gate insulating layer 115 may be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x It is made of or in multiple layers.

[0051] A gate 112 is disposed on a gate insulating layer 115. The gate 112 is configured to overlap the active layer 111 on the gate insulating layer 115. The gate 112 may be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof, but is not limited thereto.

[0052] An interlayer insulating layer 120 is disposed on the gate insulating layer 115 and the gate 112. The interlayer insulating layer 120 may be made of silicon oxide (SiO2). x ), silicon nitride (SiN) x It is made of or in multiple layers.

[0053] Source 113 and drain 114 are disposed on interlayer insulating layer 120. Source 113 and drain 114 are electrically connected to active layer 111 through contact holes formed in gate insulating layer 115 and interlayer insulating layer 120. Source 113 and drain 114 can be formed of various conductive materials, such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof, but are not limited thereto.

[0054] A passivation layer 125 for insulating the thin-film transistor 110 can be disposed on the source 113 and drain 114. The passivation layer 125 can be made of materials such as silicon oxide (SiO2). x ), silicon nitride (SiN) x It can be formed by multiple inorganic layers, or by the formation of such layers.

[0055] A first planarization layer 131 is disposed on the passivation layer 125. The first planarization layer 131 protects the thin-film transistor 110 and planarizes the upper part of the thin-film transistor. For example, the first planarization layer 131 may be formed of an organic insulating layer such as benzocyclobutene (BCB) or acrylic acid, but is not limited thereto.

[0056] A connection electrode 138 is disposed on the first planarization layer 131. The connection electrode 138 can be electrically connected to the source electrode 113 or the drain electrode 114 through a via included in the first planarization layer 131. The connection electrode 138 can be formed of various conductive materials such as magnesium (Mg), aluminum (Al), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), gold (Au), or alloys thereof, but is not limited thereto. The connection electrode 138 can contain the same material as the source electrode 113 or the drain electrode 114.

[0057] A second planarization layer 132 is disposed on the connecting electrode 138. The second planarization layer 132 protects the connecting electrode 138 and planarizes the upper part of the connecting electrode. For example, the second planarization layer 132 may be formed of an organic insulating layer such as benzocyclobutene (BCB) or acrylic acid, but is not limited thereto. The second planarization layer 132 may contain the same material as the first planarization layer 131.

[0058] The light-emitting element 140 is disposed on the second planarization layer 132. The light-emitting element 140 includes an anode 141, an organic light-emitting layer 142, and a cathode 143.

[0059] The anode 141 is formed on the second planarization layer 132 to correspond to the light-emitting area of ​​each pixel PX. The anode 141 can be electrically connected to the drain 114 of the thin-film transistor 110 through contact holes in the first planarization layer 131 and the second planarization layer 132. The anode 141 can be formed of a metallic material.

[0060] When the display device 100 is a top-emitting type that emits light from the light-emitting element 140 toward the substrate 101 on which the light-emitting element 140 is disposed, the anode 141 may further include a transparent conductive layer and a reflective layer on the transparent conductive layer. The transparent conductive layer may be made of a transparent conductive oxide such as ITO or IZO, and the reflective layer may be made of materials such as silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof.

[0061] A dam layer 150 is formed in the remaining region excluding the light-emitting region. Therefore, the dam layer 150 can expose the anode 141 corresponding to the light-emitting region. The dam layer 150 can be made of materials such as silicon nitride (SiN). x ) or silicon oxide (SiO) x It can be formed from inorganic insulating materials or organic insulating materials such as benzocyclobutene resin, acrylic resin or imide resin, but is not limited thereto.

[0062] Spacers may be further formed on the dam layer 150. The spacers may be formed of the same material as the dam layer 150. The spacers may perform the function of preventing damage to the light-emitting element 140, which may be caused by the fine metal mask (FMM) used when the organic light-emitting layer 142 is patterned.

[0063] An organic light-emitting layer 142 is disposed on the anode 141 exposed by the embankment layer 150. The organic light-emitting layer 142 may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. The organic light-emitting layer 142 may be configured as a single light-emitting layer structure that emits one type of light, or it may be configured as a structure consisting of multiple light-emitting layers that emits white light.

[0064] A cathode 143 is disposed on the organic light-emitting layer 142. The cathode 143 supplies electrons to the organic light-emitting layer 142, allowing the cathode to be formed of a conductive material with a low work function. The cathode 143 can be arranged in a square layer on multiple sub-pixels. That is, the cathodes 143 of multiple sub-pixels can be connected to each other and integrated into one another.

[0065] The encapsulation portion 160 is disposed on the cathode 143. The encapsulation portion 160 can protect the light-emitting element 140 from moisture and oxygen. When the light-emitting element 140 is exposed to moisture or oxygen, pixel shrinkage may occur, or dark spots may appear in the light-emitting area.

[0066] For example, the encapsulation portion 160 may include a first inorganic encapsulation layer 161, an organic encapsulation layer 162 on the first inorganic encapsulation layer 161, and a second inorganic encapsulation layer 163 on the organic encapsulation layer 162. The first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 may be formed of inorganic insulating layers.

[0067] For example, the first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 can be made of materials such as silicon nitride (SiN). x ), silicon oxide (SiO) x The organic encapsulation layer 162 is formed from an inorganic insulating material such as silicon oxynitride (SiON) or aluminum oxide (Al2O3). The organic encapsulation layer 162 can be formed from an organic insulating layer. For example, the organic encapsulation layer 162 can contain acrylic resin or epoxy resin.

[0068] The second inorganic encapsulation layer 163 can cover the upper and side surfaces of the first inorganic encapsulation layer 161 and the organic encapsulation layer 162, and the second inorganic encapsulation layer 163 minimizes or blocks external moisture or oxygen from penetrating into the first inorganic encapsulation layer 161 and the organic encapsulation layer 162. In this case, the first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 are used to block the penetration of moisture or oxygen, and the organic encapsulation layer 162 is used to planarize the upper part of the first inorganic encapsulation layer 161. However, the configuration of the encapsulation portion 160 is not limited to this.

[0069] In the non-display area NA, a weir section DAM can be provided to block the flow of the organic encapsulation layer 162 constituting the encapsulation section 160. Specifically, the weir section DAM is configured as a closed curve shape around the display area AA in the non-display area NA, the first inorganic encapsulation layer 161 and the second inorganic encapsulation layer 163 are provided on the weir section DAM, and the flow of the organic encapsulation layer 162 can be blocked by the weir section DAM.

[0070] The weir section DAM should be formed to a predetermined height above to prevent the flow of the organic encapsulation layer 162. For this purpose, the weir section DAM can be formed by at least one or more layers made of organic material. For example, the weir section DAM may include a lower layer made of the same material as the first planarization layer 131 and the second planarization layer 132, and an upper layer made of the same material as the dike layer 150, but is not limited thereto. Although the accompanying drawings show a configuration with two weir sections, one, three, or more weir sections may be provided.

[0071] A touch sensing unit TS is formed on the package portion 160. Specifically, the touch sensing unit TS may include a touch buffer layer 171, a bridging electrode BE, a touch interlayer insulating layer 172, a plurality of touch electrodes TE including a first touch electrode TE1 and a second touch electrode TE2 that intersect each other, and a touch planarization layer 173 disposed on the package portion 160.

[0072] A touch buffer layer 171 is disposed on the package portion 160. The touch buffer layer 171 may be formed to cover the weir portion DAM disposed in the non-display area NA. The touch buffer layer 171 can prevent liquid chemicals such as developer or etching solution used in the manufacturing process of the touch electrode TE formed on the touch buffer layer 171, or external moisture or foreign matter, from penetrating into the light-emitting element.

[0073] although Figure 3 Although not shown, a bridging electrode BE is provided on the touch buffer layer 171. The bridging electrode BE is located in the display area AA and is electrically connected to the second touch electrode TE2 on the touch layer interlayer insulating layer 172.

[0074] To prevent short circuits in the area where the first touch electrode TE1 and the second touch electrode TE2 intersect, adjacent second touch electrodes TE2 can be electrically connected via a bridging electrode BE. The bridging electrode BE can be disposed on a different layer than the first touch electrode TE1 and the second touch electrode TE2, and connected to the adjacent second touch electrode TE2 via a contact hole. The bridging electrode BE can intersect with the first touch electrode TE1.

[0075] In this configuration, contact holes can be formed through the interlayer insulating layer 172. The bridging electrode BE is disposed below the interlayer insulating layer 172 and exposed through two contact holes. Therefore, the bridging electrode BE can be connected to two adjacent second touch electrodes TE2.

[0076] The interlayer insulating layer 172 is disposed on the touch buffer layer 171 to cover the bridging electrode BE, thereby insulating the bridging electrode BE from the first touch electrode TE1. Alternatively, the interlayer insulating layer 172 may be disposed between the bridging electrodes BE to insulate the bridging electrodes BE.

[0077] The touch interlayer insulating layer 172 extends to the non-display area NA and the display area AA. The touch interlayer insulating layer 172 is formed as a covering weir DAM. The step difference can be reduced by the weir DAM.

[0078] The touch buffer layer 171 and the interlayer insulating layer 172 can be made of materials such as silicon nitride (SiN). x ) or silicon oxide (SiO) x It may be formed from at least one of inorganic insulating materials and organic insulating materials such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, but is not limited thereto.

[0079] Multiple touch electrodes TE1 and TE2 are formed on the interlayer insulating layer 172. The first touch electrode TE1 can be a touch driving electrode, and the second touch electrode TE2 can be a touch sensing electrode. The first touch electrodes TE1 can be connected in the column direction to form multiple electrode columns, and the second touch electrodes TE2 can be connected in the row direction through the bridging electrode BE to form multiple electrode rows.

[0080] The external shape of the first touch electrode TE1 and the second touch electrode TE2 may have a grid pattern including multiple rhomboid shapes, but is not limited thereto. The first touch electrode TE1 and the second touch electrode TE2 may be formed of a metal including at least one of titanium (Ti), aluminum (Al), molybdenum (Mo), molybdenum titanium (MoTi), copper (Cu) and tantalum (Ta), and may be formed of a transparent conductive material such as indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited thereto.

[0081] Multiple touch electrodes TE1 and TE2 can be disposed in the region corresponding to the embankment 150. Therefore, the reduction in light emission efficiency caused by the overlap of multiple touch electrodes with the light-emitting region can be minimized.

[0082] Multiple pad electrodes (PADs) are provided in the non-display area NA. One end of each pad electrode (PAD) is connected to the wiring TL, and the other end of each pad electrode (PAD) is electrically connected to external circuitry such as a touch driver to receive touch signals from the external circuitry or to transmit touch sensing signals to the external circuitry.

[0083] In this case, multiple wiring lines TL can be set in the non-display area NA to electrically connect multiple pad electrodes PAD to touch electrodes TE.

[0084] The wiring TL electrically connects multiple touch electrodes TE to pad electrodes PAD. Specifically, the wiring TL includes a first wiring TL1 connected to a first touch electrode TE1 and a second wiring TL2 connected to a second touch electrode TE2. Touch drive signals can be applied to the first touch electrode TE1 through the first wiring TL1 connected to the first touch electrode TE1, and touch sensing signals can be transmitted to the second touch electrode TE2 through the second wiring TL2 connected to the second touch electrode TE2.

[0085] The traces (TLs) can be made of low-resistance metallic materials, or transparent conductive materials such as ITO or IZO, but are not limited to these. For example, when multiple traces (TLs) are made of low-resistance metallic materials, the resistance is reduced and the RC delay can be reduced.

[0086] Each trace TL may include a first auxiliary trace TLa and a second auxiliary trace TLb. The first auxiliary trace TLa is connected to the touch electrode TE disposed in the display area AA and disposed on the touch interlayer insulating layer 172 in the non-display area NA. The second auxiliary trace TLb is disposed between the first planarization layer 131 and the second planarization layer 132 in the non-display area NA, and connects the first auxiliary trace TLa to the pad electrode PAD.

[0087] The first auxiliary wiring TLa can be electrically connected to the touch sensing unit TS. In this case, the first auxiliary wiring TLa can contain the same material as the touch electrode TE of the touch sensing unit TS.

[0088] The first auxiliary wiring TLa can be disposed on the touch interlayer insulating layer 172 and can extend from the non-display area NA toward the curved area BA. The first auxiliary wiring TLa can be configured to overlap with and cover at least a portion of the weir portion DAM. At the end of the touch interlayer insulating layer 172, the first auxiliary wiring TLa can be disposed on the top surface of the second planarization layer 132.

[0089] On the other hand, the second auxiliary wiring TLb can be disposed in the non-display area NA, and the first auxiliary wiring TLa, which electrically connects the second auxiliary wiring TLb to the touch electrode TE, can be disposed on the touch interlayer insulating layer 172. The second auxiliary wiring TLb can be electrically connected to the pad electrode PAD to transmit the touch sensing signal sensed by the touch electrode TE to the pad electrode PAD. The second auxiliary wiring TLb can be formed on the same layer as the connecting electrode 138 using the same material. That is, the second auxiliary wiring TLb electrically connects the first auxiliary wiring TLa to the pad electrode PAD and can be disposed between the first planarization layer 131 and the second planarization layer 132.

[0090] The first planarization layer 131 and the second planarization layer 132 can be disposed on the substrate 101 covering the non-display area NA and the display area AA.

[0091] In the non-display area NA, the second planarization layer 132 may include a first opening OP1 for contacting the first auxiliary wiring TLa and the second auxiliary wiring TLb. The first auxiliary wiring TLa and the second auxiliary wiring TLb may be in direct contact with each other or electrically connected to each other through the first opening OP1 of the second planarization layer 132.

[0092] The touch planarization layer 173 can be disposed above multiple touch electrodes TE to cover the upper and side surfaces of the multiple touch electrodes TE.

[0093] The touch planarization layer 173 can be configured to cover multiple touch electrodes TE, thereby planarizing the upper parts of the multiple touch electrodes TE. Additionally, the touch planarization layer 173 can extend from the display area AA to the non-display area NA, be disposed on and cover the first auxiliary wiring TLa in the non-display area NA. Therefore, the touch planarization layer 173 can be tilted from the display area AA toward the non-display area NA. That is, in the non-display area NA, the touch planarization layer 173 can include a tilted surface. The touch planarization layer 173 can cover the touch interlayer insulating layer 172 disposed beneath it, and can also cover the weir portion DAM.

[0094] The touch planarization layer 173 may contain a flowable organic material. For example, the touch planarization layer 173 may contain, but is not limited to, acrylic resin or epoxy resin.

[0095] A protective layer 180 may be disposed on the touch planarization layer 173. The protective layer 180 may be used to prevent oxidation, corrosion or damage to the touch sensing unit TS. The protective layer 180 may cover the touch sensing unit TS. When viewed from the vertical direction of the substrate, the protective layer 180 may overlap with the touch sensing unit TS.

[0096] Since the protective layer 180 is not restricted by flowability, it can extend from the display area AA to the non-display area NA to cover the touch planarization layer 173. The protective layer 180 can be disposed on the first opening OP1 included in the second planarization layer 132, and when viewed from a direction perpendicular to the substrate, the protective layer 180 can overlap with the first opening OP1.

[0097] The protective layer 180 may contain a fluid organic material. For example, the protective layer 180 may be formed of an organic insulating material such as benzocyclobutene, acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited thereto.

[0098] Due to the flow restriction created by the lower partition wall adhesive layer 191, the protective layer 180 can be disposed in the first non-display area NA1 without extending toward the curved area.

[0099] A partition wall adhesive layer 190 is disposed in the first non-display area NA1. The partition wall adhesive layer 190 prevents the touch planarization layer from flowing and prevents external moisture from penetrating into the touch sensing unit TS. The partition wall adhesive layer 190 can be configured as a closed curve shape around the weir portion DAM in the first non-display area NA1. The partition wall adhesive layer 190 is disposed adjacent to the curved area BA and is located between the curved area BA and the weir portion DAM.

[0100] The partition wall adhesive layer 190 includes a lower partition wall adhesive layer 191 and an upper partition wall adhesive layer 192 on the lower partition wall adhesive layer 191. (See later...) Figure 4 Describe the detailed configuration and effects of the partition wall adhesive layer 190.

[0101] A polarizing layer POL is provided on the protective layer 180 in the display area AA. The polarizing layer POL selectively transmits light to reduce the reflection of external light. The polarizing layer POL only transmits light that vibrates in the same direction as the polarization axis from the light emitted from the display unit including the light-emitting element 140, while absorbing or reflecting light that vibrates in other directions.

[0102] The microcoating MCL is disposed in the curved region BA. In this case, the microcoating MCL can be configured to overlap with at least a portion of the first non-display region NA1 and the second non-display region NA2. For example, the microcoating MCL extends toward the display region AA to contact one side of the polarizing layer POL and is disposed in the first non-display region NA1.

[0103] Microcoated MCLs can exert tensile forces on the wire positioned in the bend region BA, which may lead to microcracks. Therefore, microcoated MCLs can be used to protect the wire by coating the bend location with a small thickness. In this case, the microcoated MCL can be made of resins such as acrylic materials or polyurethane acrylates, but is not limited to these.

[0104] Microcoatings (MCLs) can adjust the neutral plane of the bending region (BA). A neutral plane is a virtual plane unaffected by stress because the compressive and tensile forces applied to the structure cancel each other out when the structure bends. Virtual neutral planes can be formed between structures when two or more are stacked. When the entire structure bends in one direction, the structure based on the neutral plane in that direction is compressed by the bending and therefore experiences compressive forces. Conversely, the structure based on the neutral plane in the opposite direction of the bending is stretched by the bending and therefore experiences tensile forces. Typically, a structure is more fragile when subjected to the tensile force within the same compressive and tensile forces, and is therefore more likely to crack when subjected to tensile forces.

[0105] Because the line positioned below the neutral face is compressed, it is subjected to compressive forces, while the connecting line LNK positioned above it may be subjected to tensile forces, which could lead to cracking. Therefore, to minimize the tensile forces applied to the connecting line LNK, the micro-coated MCL can be located on the neutral face.

[0106] By applying a microcoating (MCL) to the bending region BA, the neutral surface can be raised upwards, and can be formed at the same position as the line or at a position above the line, so that it is not subjected to stress or compressive force during bending, thereby inhibiting crack initiation. The elastic modulus of the microcoating (MCL) can be from 50 MPa to 200 MPa.

[0107] In the following text, reference will be made to Figure 4 The detailed configuration and effects of the partition wall adhesive layer 190 in the display device according to embodiments of the present disclosure are described.

[0108] Figure 4 yes Figure 3 An enlarged sectional view of region A. Figure 4 Specifically, the partition wall adhesive layer 190 and the protective layer 180 in contact with the partition wall adhesive layer 190 are shown.

[0109] The partition wall adhesive layer 190 includes a lower partition wall adhesive layer 191 and an upper partition wall adhesive layer 192 on the lower partition wall adhesive layer 191.

[0110] The lower partition wall adhesive layer 191 reduces bending stress during bending of the display device and prevents cracking due to bending. The lower partition wall adhesive layer 191 is disposed in the first non-display area NA1 adjacent to the bending region BA. The lower partition wall adhesive layer 191 is located between the bending region BA and the weir portion DAM. The lower partition wall adhesive layer 191 may be disposed on the second planarization layer 132 in the first non-display area NA1 and overlap with the second auxiliary wiring TLb. Alternatively, the lower partition wall adhesive layer 191 may be disposed between the bending region BA and the first opening OP1 without overlapping with the first opening OP1 where the first auxiliary wiring TLA and the second auxiliary wiring TLb are connected, but is not limited to this.

[0111] The lower partition wall adhesive layer 191 can be formed of the same material as the touch planarization layer 173 in the same layer as the touch planarization layer 173. However, the thickness d1 of the lower partition wall adhesive layer 191 can be the same as or thicker than the touch planarization layer 173.

[0112] The lower partition wall adhesive layer 191 prevents the protective layer 180 from flowing into the curved region BA. Therefore, at least a portion of the inner surface of the lower partition wall adhesive layer 191 can be in direct contact with the protective layer 180.

[0113] The lower partition wall adhesive layer 191 includes a lower layer 191a disposed on the second planarization layer 132 and a plurality of protrusions 191b disposed on the lower layer 191a and protruding upward.

[0114] Specifically, refer to Figure 4 The lower layer 191a of the lower partition wall adhesive layer 191 is disposed on the second planarization layer 132 of the first non-display area NA1. The lower layer 191a is disposed adjacent to the curved area BA, and the lower layer 191a is located between the curved area BA and the weir section DAM.

[0115] The thickness d1 of the lower layer 191a can be the same as, but not limited to, the thickness of the touch planarization layer 173. Depending on the material of the protective layer 180 or the degree of flow control, the thickness d1 of the lower layer 191a can be less than or greater than the thickness of the touch planarization layer 173.

[0116] The protrusions 191b of the lower partition wall adhesive layer 191 can control the flow of the protective layer 180 and accommodate some material. The protrusions 191b prevent the protective layer 180 from flowing, thus preventing it from entering the curved area BA from the display area AA. In this case, the presence of multiple protrusions 191b ensures adequate accommodating space for the protective layer 180. Specifically, when the protective layer 180 is applied in excess of a predetermined amount or has high flow characteristics, it may extend beyond the lower partition wall adhesive layer 191 into the curved area BA. In this case, the presence of multiple protrusions 191b fills the accommodating spaces between the protrusions 191b, thereby greatly controlling the flow.

[0117] Furthermore, the multiple protrusions 191b significantly improve the work of adhesion with the upper partition wall adhesive layer 192. The contact area between the lower partition wall adhesive layer 191 and the upper partition wall adhesive layer 192 is increased due to the multiple protrusions 191b, thereby improving the bond between them. Therefore, it is possible to prevent the space between the lower partition wall adhesive layer 191 and the upper partition wall adhesive layer 192 from separating or separating due to stress generated during bending, and to reduce the permeation of moisture or hydrogen.

[0118] The protrusion 191b is provided on the top surface of the lower layer 191a and has a structure that protrudes relatively long in the upward direction. The protrusion 191b can be composed of multiple protrusions to form multiple uneven patterns. Figure 4 The illustration shows four protrusions 191b, but is not limited to this.

[0119] The protrusion 191b may have a polygonal shape, such as a rectangular cross-section or a trapezoidal shape with a tapered side having a predetermined angle. (See reference...) Figure 2 In the enlarged view, the protrusion 191b may have an elongated shape extending along the direction of the lower partition wall adhesive layer 191. That is, when viewed from the top, the protrusion 191b may have a polygonal shape, such as a rectangular shape or a trapezoidal shape, but is not limited thereto. For example, when viewed from the top, the protrusion 191b may be formed in a grid shape.

[0120] The thickness d2 of the protrusion 191b can be adjusted to various thicknesses depending on the material of the protective layer 180 or the degree of flow control. In addition, the spacing between the plurality of protrusions 191b can be formed to provide space for accommodating portions of the protective layer 180 that overlap with the lower partition wall adhesive layer 191.

[0121] The lower layer 191a and protrusion 191b of the lower partition wall adhesive layer 191 can be integrally formed from the same material. The lower partition wall adhesive layer 191 can be formed using the same process as the touch planarization layer 173. A detailed manufacturing method for the lower partition wall adhesive layer 191 will be described later.

[0122] The lower separator adhesive layer 191 reduces bending stress and improves adhesion work to the lower layer 191a to prevent cracking during bending and to suppress moisture penetration into the touch sensing unit TS and corrosion of the touch electrode TE due to cracking or peeling. For this purpose, the lower separator adhesive layer 191 can have a high adhesion work or work of adhesion Wa. Specifically, the lower separator adhesive layer 191 can have a higher adhesion work than the upper separator adhesive layer 192.

[0123] As used herein, the adhesion work Wa refers to the energy per unit area required to completely separate the interface of two materials in contact with each other into two independent surfaces. For example, the adhesion work Wa of the lower partition wall adhesive layer 191 is the adhesive energy between the lower partition wall adhesive layer 191 and the second planarization layer 132 in contact with the lower partition wall adhesive layer 191. In this case, the adhesion work Wa between the lower partition wall adhesive layer 191, formed of polymer and organic materials, and the second planarization layer 132, which is the lower layer, can be defined by Equation 1 below using the component-wise harmonic mean of the surface free energy of the two materials.

[0124] [Equation 1]

[0125] In equation 1, γ1 d and γ1 p These represent the dispersion and polar terms in the surface free energy of the first material (e.g., the lower partition wall adhesive layer 191), respectively. Additionally, γ2... d and γ2 p These represent the dispersion and polar terms in the surface free energy of the second material (e.g., the second planarization layer 132), respectively.

[0126] In other words, the adhesion work Wa according to embodiments of this disclosure is a derived value obtained by summing the binding energies between the nonpolar (dispersion force) interacting components and the binding energies between the polar interacting components of each polymer and organic material constituting the layer. As the value of the adhesion work Wa calculated by Equation 1 increases, the chemical and physical affinity between the lower partition wall adhesive layer 191 and the second planarization layer 132 increases, which means excellent interfacial bonding strength, thereby effectively preventing delamination between layers even in repeated bending stress environments.

[0127] For example, the adhesion work Wa of the lower partition wall adhesive layer 191 can be 60 mJ / m 2 Or greater, 70 mJ / m 2 Or larger, or 60 mJ / m 2 Up to 80 mJ / m 2 However, it is not limited to this. When the adhesion work of the current partition wall adhesive layer 191 meets the upper limit range, it can suppress the occurrence of cracks in the organic material layer during bending, thereby inhibiting the penetration of moisture and hydrogen, and preventing separation from the lower layer 191a.

[0128] Furthermore, the elastic modulus of the lower partition wall adhesive layer 191 can be from 1 GPa to 3 GPa or from 1.5 GPa to 2.0 GPa. The hardness of the lower partition wall adhesive layer 191 can be from 0.1 GPa to 0.25 GPa or from 0.15 GPa to 0.20 GPa. Additionally, the water contact angle of the lower partition wall adhesive layer 191 can be 90 degrees or less or from 60 degrees to 80 degrees, and the surface energy can be 30 mN / m or greater or from 35 mN / m to 50 mN / m. When the lower partition wall adhesive layer 191 meets the above-mentioned physical property ranges, the bending stress applied to the adjacent region during bending in the bending region BA is reduced, and cracking of the organic layer can be prevented. Furthermore, adhesion to the lower second planarization layer 132 can be improved.

[0129] In a configuration that satisfies physical properties, the lower partition wall adhesive layer 191 may include a silicone-modified polyimide resin with a low coefficient of thermal expansion. Specifically, the lower partition wall adhesive layer 191 may be formed from a composition comprising a silicone-modified polyimide resin with a low coefficient of thermal expansion, a low molecular weight monomer, and a plasticizer to act as reactants to ensure excellent adhesion to the interface.

[0130] For example, as low molecular weight monomers, 2-hydroxyethyl acrylate, isobornyl acrylate, tris(2-hydroxyethyl) isocyanurate diacrylate, hydroxyanisole butyrate, 2,6-di-tert-butyl-4-hydroxymethylphenol, hydroxytoluene butyrate, propyl gallate, lauryl gallate, octyl gallate, 2,4,5-trihydroxybutyrylbenzene, tert-butylhydroquinone, 3-aminophenol, 4-aminophenol, 4-methoxyphenol, 2,3,4-trimethylphenol, 2,6-dimethylphenol, poly(4-vinylphenol), and 4-bromophenol can be used as plasticizers. Additionally, to reduce the elastic modulus and elongation, DOP (dioctyl phthalate), DOA (dioctyl adipate), and TCP (tricresyl phosphate) can be used.

[0131] An upper partition wall adhesive layer 192 is disposed on a lower partition wall adhesive layer 191. The upper partition wall adhesive layer 192 can be disposed on the lower partition wall adhesive layer 191 in the first non-display area NA1 to cover the lower partition wall adhesive layer 191. For example, the upper partition wall adhesive layer 192 can be configured to contact the top and side surfaces of the lower partition wall adhesive layer 191. Additionally, the upper partition wall adhesive layer 192 can fill between the protrusions 191b of the lower partition wall adhesive layer 191 to cover both the side and top surfaces of the protrusions 191b.

[0132] The upper partition wall adhesive layer 192 is configured to be in direct contact with the protective layer 180. The protective layer 180 may be configured to contact the interior portion of the lower partition wall adhesive layer 191 by reducing flow through the lower partition wall adhesive layer 191.

[0133] On the other hand, the upper partition wall adhesive layer 192 can be formed on the lower partition wall adhesive layer 191 after the protective layer 180 is formed. In this case, the upper partition wall adhesive layer 192 can be configured to simultaneously contact the lower partition wall adhesive layer 191 and the protective layer 180. For example, the upper partition wall adhesive layer 192 can be disposed on the top surface of the lower partition wall adhesive layer 191 and extend to be disposed on a portion of the top surface of the adjacent touch planarization layer 173. Furthermore, the upper partition wall adhesive layer 192 can be disposed on the top surfaces of the lower partition wall adhesive layer 191 and the protective layer 180 simultaneously. For example, when the protective layer 180 is partially disposed in the receiving space between the top surface of the plurality of protrusions 191b of the lower partition wall adhesive layer 191 and the protrusions 191b, the upper partition wall adhesive layer 192 can be disposed on the protrusions 191b of the lower partition wall adhesive layer 191 and overlap with the protective layer 180 filling the receiving space between the protrusions 191b. In other words, the protective layer 180 can be partially inserted between the upper partition wall adhesive layer 192 and the lower partition wall adhesive layer 191.

[0134] The upper separator adhesive layer 192 prevents moisture and hydrogen from penetrating into the touch sensing unit TS from the outside, thereby suppressing cracking during bending. To this end, the upper separator adhesive layer 192 can possess superhydrophobicity and low adhesion work. Specifically, the upper separator adhesive layer 192 can have an adhesion work lower than that of the lower separator adhesive layer 191. For example, the adhesion work Wa of the upper separator adhesive layer 192 can be 60 mJ / m 2 or smaller, 50 mJ / m 2 Or smaller, or 30 mJ / m 2 Up to 50mJ / m 2 .

[0135] Furthermore, the elastic modulus of the upper partition wall adhesive layer 192 can be 5 GPa or greater, or 6 GPa to 8 GPa. The hardness of the upper partition wall adhesive layer 192 can be 0.2 GPa or greater, or 0.2 GPa to 0.3 GPa. Furthermore, the water contact angle of the lower partition wall adhesive layer 191 can be 90 degrees or greater, or 90 degrees to 110 degrees, and the surface energy can be 20 mN / m or less, or 20 mN / m to 30 mN / m.

[0136] The upper separator adhesive layer 192 uses a material that reduces adhesion, thereby allowing the use of superhydrophobic materials to prevent expansion that may occur during the photolithography process due to rinsing with deionized water. For example, the upper separator adhesive layer 192 can be formed of a glassy material such as a fluoropolymer, polysilazane, or polycarbosilane.

[0137] In a configuration that satisfies physical properties, the upper partition wall adhesive layer 192 can be formed from a composition comprising an adhesive resin, a monomer, and a plasticizer as reactants.

[0138] For example, acrylic resins and silicone resins can be used as adhesive resins. Furthermore, as monomers, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, ethylene glycol diacrylate, propylene glycol dimethacrylate, pentaerythritol tetraacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol diacrylate, and trimethylpropane triacrylate can be used. Fluoropolymers, polysilazanes, and polycarbosilanes can be used as glassy materials.

[0139] In related technologies, in display devices including touch sensor units for forming touch electrodes on an encapsulation layer to protect display elements, a protective layer is provided below and / or above the touch electrodes to protect them during formation or to prevent damage to the lower part. However, when the curved area of ​​the display device is bent, moisture and humidity penetration occur due to cracks generated in the protective layer of the touch electrodes, resulting in problems such as deterioration of touch performance and stains on the display panel.

[0140] According to embodiments of the present disclosure, the display device includes: a partition wall adhesive layer formed of an organic material and having a large adhesive work; and an upper layer having a small adhesive work so as to prevent the protective layer from moving to the curved area by inhibiting its flow.

[0141] The lower adhesive layer of the separator adhesive layer can be formed on the same layer as the planarization layer on the touch electrode, and can alleviate bending stress during bending of the display device through large adhesive work, thereby preventing cracks or peeling in the organic material layer of the touch sensing unit. In addition, a superhydrophobic upper layer with low adhesive work covers part of the lower and touch protection layers, thereby inhibiting moisture penetration from the outside and ultimately preventing corrosion and damage to the touch electrode.

[0142] In the following text, reference will be made to Figure 5 A display device according to another exemplary embodiment of the present disclosure is described.

[0143] Figure 5 This is a schematic cross-sectional view of a display device according to another embodiment of the present disclosure.

[0144] Figure 5 The display device 200 shown is different from the one shown except for the position of the partition wall adhesive layer 290. Figures 1 to 4 The display devices shown are basically the same, so repeated descriptions will be omitted.

[0145] Reference Figure 5 The partition wall adhesive layer 290 is disposed in the first non-display area NA1 in a manner that is closer to the display area AA than the curved area BA. At this time, the partition wall adhesive layer 290 is positioned in the first non-display area NA1 closer to the display area AA than the weir portion DAM. Therefore, when viewed from above, the weir portion DAM is positioned to surround the partition wall adhesive layer 290.

[0146] Since the encapsulation portion 160 located below the partition wall adhesive layer 290 is closer to the display area AA than the area forming an inclined surface towards the weir portion DAM, the bending stress applied to the protective layer 180 during the bending of the bending area BA is reduced to suppress cracking and reduce moisture penetration from the side surface.

[0147] In the following text, reference will be made to Figures 6A to 6F A method for manufacturing a display device according to exemplary embodiments of the present disclosure is described.

[0148] Figures 6A to 6F This is a cross-sectional view used to illustrate a method of manufacturing a display device according to an exemplary embodiment of the present disclosure.

[0149] Reference Figure 6AA thin-film transistor 110, a light-emitting element 140, and a package portion 160 are formed on a substrate 101. Simultaneously, a weir portion DAM, a first planarization layer 131, a second auxiliary wiring TLb, a second planarization layer 132, and a pad electrode PAD are formed in the non-display area NA. In this case, the first planarization layer 131 and the second planarization layer 132 of the non-display area NA can be formed using the same material and the same process as the first planarization layer 131 and the second planarization layer 132 of the display area AA. Furthermore, the second auxiliary wiring TLb can be formed using the same material and the same process as the connection electrode 138 of the display area AA.

[0150] A first opening OP1 is formed in the second planarization layer 132 of the non-display area NA using a mask process. Therefore, the second auxiliary wiring TLb beneath the second planarization layer 132 can be exposed.

[0151] A touch sensing unit TS is formed on the package portion 160. Specifically, a touch buffer layer 171, a bridging electrode BE, a touch interlayer insulating layer 172, and a plurality of touch electrodes TE are sequentially formed on the package portion 160. In this case, the first auxiliary wiring TLa is formed from the same material as the touch electrodes TE using the same process. Through this process, the first auxiliary wiring TLa is formed adjacent to the non-display area NA and the curved area to the first opening OP1 formed in the second planarization layer 132. In this case, the pad electrode PAD of the second non-display area NA2 can also be formed using the same process.

[0152] Reference Figure 6B To form the touch planarization layer 173, a touch protective coating 173' is applied to the touch electrode TE and the interlayer insulating layer 172. Figure 6B In this embodiment, the touch protective coating 173' can be applied and disposed in the display area AA and the first non-display area NA1, but the touch protective coating 173' can also be applied to the front surface of the display device. In this case, the touch protective coating 173' can be formed from a photosensitive resin composition.

[0153] Reference Figure 6C The touch planarization layer 173 and the lower separator adhesive layer 191 are formed using a photoresist process. For example, a halftone mask can be used to simultaneously form the pattern P of the touch planarization layer 173 and the lower separator adhesive layer 191.

[0154] A halftone mask is composed of masks with different amounts of transmitted light. The halftone mask consists of a transmissive region, a blocking region, and a semi-transparent / semi-reflective region. The blocking region is configured to correspond to the protruding pattern of the lower partition wall adhesive layer 191. The semi-transmissive region is configured to correspond to the recessed region between the touch planarization layer 173 and the protruding pattern of the lower partition wall adhesive layer 191. The transmissive region is the area in which the touch protective coating 173' is to be removed, and for example, the transmissive region may be provided in the first non-display area NA1 in a manner corresponding to the space between the touch planarization layer 173 and the lower partition wall adhesive layer 191.

[0155] Exposure and development processes are performed using a halftone mask. When the composition of the touch protective coating 173' is a positive photoresist, the material in the light-exposed transmissive and semi-transmissive regions is removed by reacting with the developer. Therefore, in response to the semi-transmissive regions, only a portion of the touch protective coating 173' corresponding to the recessed region between the protruding pattern of the touch planarization layer 173 and the lower partition wall adhesive layer 191 is removed. Thus, the unremoved portion of the touch protective coating 173' forms the pattern P of the protrusion 191b of the lower partition wall adhesive layer 191.

[0156] Reference Figure 6D A protective layer 180 is formed on the touch planarization layer 173. The protective layer 180 is applied and disposed in the display area AA and the first non-display area NA1. However, the protective layer 180 is formed to be thinner than the lower partition wall adhesive layer 191, and one side of the protective layer 180 can contact the side of the lower partition wall adhesive layer 191.

[0157] Reference Figure 6E An upper partition wall adhesive layer 192 is formed on the lower partition wall adhesive layer 191. The upper partition wall adhesive layer 192 can be formed by a photoresist process. The upper partition wall adhesive layer 192 can be configured to cover the side surface and top surface of the lower partition wall adhesive layer 191 adjacent to the curved region BA, and can also be configured to simultaneously cover the top surface of the protective layer 180 adjacent to the lower partition wall adhesive layer 191.

[0158] Reference Figure 6F The polarizing layer POL is disposed on the display area AA, and the micro-coating MCL is formed in the non-display area NA.

[0159] Figure 6F The polarizing layer POL is shown to be directly disposed on the protective layer 180. However, when the polarizing layer POL is configured by a polarizer or a polarizing film, an adhesive film can be formed between the polarizing layer POL and the protective layer 180.

[0160] The microcoating MCL is formed to correspond to the curved region BA of the non-display region NA. In this case, the microcoating MCL can be disposed in a portion of the first non-display region NA1 and the second non-display region NA2 adjacent to the curved region BA. The microcoating MCL can be configured to cover the partition wall adhesive layer 190 and the protective layer 180 to protect the underlying components and prevent moisture and hydrogen from penetrating from the outside, and can be configured to contact a side surface of the polarizing layer POL.

[0161] Exemplary embodiments of this disclosure can also be described as follows: According to embodiments of the present disclosure, a display device includes: a substrate including a display area and a non-display area; a plurality of light-emitting elements disposed in the display area of ​​the substrate; an encapsulation portion configured to cover the plurality of light-emitting elements; a touch sensing unit disposed on the encapsulation portion and including a plurality of touch electrodes; a touch planarization layer disposed on the plurality of touch electrodes; a protective layer disposed on the touch planarization layer; a lower partition wall adhesive layer disposed in the non-display area surrounding the display area, and disposed on the same layer as the touch planarization layer and spaced apart from the touch planarization layer; and an upper partition wall adhesive layer disposed on the lower partition wall adhesive layer, wherein the lower partition wall adhesive layer includes a plurality of upwardly projecting protrusions, and the upper partition wall adhesive layer overlaps the plurality of protrusions in the vertical direction.

[0162] According to another aspect of this disclosure, the protective layer can extend from the display area to the non-display area, and at least a portion of the protective layer can be configured to directly contact the side of the lower partition wall adhesive layer.

[0163] According to another aspect of this disclosure, the lower partition wall adhesive layer may include a lower layer and a plurality of protrusions disposed on the top surface of the lower layer and projecting upward, and the protective layer may be in direct contact with the plurality of protrusions.

[0164] According to another aspect of this disclosure, the upper partition wall adhesive layer can be configured to cover the multiple protrusions and all the top and side surfaces of the lower layer.

[0165] According to another aspect of this disclosure, the upper partition wall adhesive layer may be disposed on the top surface of the lower partition wall adhesive layer and the protective layer to cover the contact surface between the protective layer and the lower partition wall adhesive layer.

[0166] According to another aspect of this disclosure, the adhesion energy of the lower partition wall adhesive layer can be 60 mJ / m 2 Up to 80 mJ / m 2 Furthermore, the adhesion energy of the upper partition wall adhesive layer can be 30 mJ / m 2 Up to 50 mJ / m 2 .

[0167] According to another aspect of this disclosure, the elastic modulus of the lower partition wall adhesive layer may be from 1.5 GPa to 2.0 GPa, and the elastic modulus of the upper partition wall adhesive layer may be from 6.0 GPa to 8.0 GPa.

[0168] According to another aspect of this disclosure, the non-display area may include: a first non-display area adjacent to the display area; a curved area extending from the first non-display area; and a second non-display area extending from one side of the curved area, wherein the lower partition wall adhesive layer and the upper partition wall adhesive layer may be disposed between the curved area and the display area.

[0169] According to another aspect of this disclosure, the touch sensing unit may include: a touch buffer layer disposed on the package portion; a bridging electrode disposed on the touch buffer layer; an inter-layer insulating layer disposed on the bridging electrode; and a touch electrode disposed on the inter-layer insulating layer, wherein the lower partition wall adhesive layer may be configured to overlap the touch buffer layer and the inter-layer insulating layer in the vertical direction.

[0170] According to another aspect of this disclosure, the display device may further include a plurality of wirings configured to connect a plurality of touch electrodes to a plurality of touch pads disposed in a second non-display area, and a lower partition wall adhesive layer may be disposed on the plurality of wirings.

[0171] According to another aspect of this disclosure, the display device may further include: at least one weir portion disposed in a non-display area and configured to surround a display area; and an encapsulation portion comprising a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer, wherein the first and second inorganic encapsulation layers may be disposed on the weir portion, and an upper partition wall adhesive layer and a lower partition wall adhesive layer may be disposed between the weir portion and the display area.

[0172] According to another aspect of this disclosure, the upper partition wall adhesive layer can be made of a superhydrophobic material.

[0173] According to another aspect of this disclosure, the lower partition wall adhesive layer may be made of the same material as the touch planarization layer.

[0174] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and may be implemented in various forms without departing from the technical concept of the present disclosure. Therefore, exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all embodiments and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be interpreted as falling within the scope of the present disclosure.

Claims

1. A display device, comprising: A substrate, the substrate including a display area and a non-display area; A plurality of light-emitting elements are disposed in the display area of ​​the substrate; The encapsulation section is configured to cover the plurality of light-emitting elements; A touch sensing unit is disposed on the package and includes a plurality of touch electrodes; A touch planarization layer is disposed on the plurality of touch electrodes; A protective layer is disposed on the touch planarization layer; A lower partition wall adhesive layer is disposed in the non-display area in a manner surrounding the display area, and is disposed on the same layer as the touch planarization layer and spaced apart from the touch planarization layer; as well as An upper partition wall adhesive layer is disposed on the lower partition wall adhesive layer. The lower partition wall adhesive layer includes multiple upwardly protruding portions, and the upper partition wall adhesive layer overlaps with the multiple protruding portions in the vertical direction.

2. The display device according to claim 1, wherein, The protective layer extends from the display area to the non-display area and is configured such that at least a portion of the protective layer is in direct contact with the side of the lower partition wall adhesive layer.

3. The display device according to claim 1, wherein, The lower partition wall adhesive layer also includes a lower layer, and the plurality of protrusions are disposed on the top surface of the lower layer. The protective layer is in direct contact with at least a portion of the plurality of protrusions.

4. The display device according to claim 3, wherein, The upper partition wall adhesive layer is configured to cover all the top and side surfaces of the plurality of protrusions and the lower layer.

5. The display device according to claim 3, wherein, The upper partition wall adhesive layer is disposed on the top surface of the lower partition wall adhesive layer and the protective layer to cover the contact surface between the protective layer and the lower partition wall adhesive layer.

6. The display device according to claim 1, wherein, The adhesion work of the upper partition wall adhesive layer is less than that of the lower partition wall adhesive layer.

7. The display device according to claim 6, wherein, The adhesion energy of the lower partition wall adhesive layer is 60 mJ / m 2 Up to 80 mJ / m 2 ,and The adhesion energy of the upper partition wall adhesive layer is 30 mJ / m 2 Up to 50 mJ / m 2 .

8. The display device according to claim 1, wherein, The elastic modulus of the lower partition wall adhesive layer is 1.5 GPa to 2.0 GPa, and The elastic modulus of the upper partition wall adhesive layer is 6.0 GPa to 8.0 GPa.

9. The display device according to claim 1, wherein, The non-display area includes: a first non-display area adjacent to the display area; a curved area extending from the first non-display area; and a second non-display area extending from one side of the curved area. The lower partition wall adhesive layer and the upper partition wall adhesive layer are disposed between the curved area and the display area.

10. The display device according to claim 9, wherein, The touch sensing unit includes: A touch buffer layer is disposed on the encapsulation portion; A bridging electrode is disposed on the touch buffer layer; A touch interlayer insulating layer, the touch interlayer insulating layer being disposed on the bridging electrode; and A touch electrode, wherein the touch electrode is disposed on the interlayer insulating layer, and The lower partition wall adhesive layer is configured to overlap the touch buffer layer and the insulating layer between the touch layers in the vertical direction.

11. The display device according to claim 10, further comprising: Multiple wirings connect multiple touch electrodes to multiple touch pads disposed in the second non-display area. The lower partition wall adhesive layer is disposed on the plurality of wirings.

12. The display device according to claim 10, further comprising: At least one weir portion, wherein the at least one weir portion is disposed in the non-display area and configured to surround the display area. The encapsulation portion includes a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer. The first inorganic encapsulation layer and the second inorganic encapsulation layer are disposed on the weir portion, and The upper partition wall adhesive layer and the lower partition wall adhesive layer are disposed between the weir and the display area.

13. The display device according to claim 1, wherein, The upper partition wall adhesive layer is formed of a superhydrophobic material.

14. The display device according to claim 1, wherein, The lower partition wall adhesive layer is formed of the same material as the touch planarization layer.

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