Partitioned temperature-controlled perovskite cell packaging hot table device and packaging method thereof

Abstract

The present application relates to the technical field of solar cell packaging, and particularly relates to a partitioned temperature control perovskite cell packaging hot table device and a packaging method thereof. The packaging hot table device has a hot table main body, the hot table main body comprises an inner and outer distributed intermediate heat dissipation zone and a peripheral heating zone, and a heat insulation layer is arranged between the intermediate heat dissipation zone and the peripheral heating zone; the intermediate heat dissipation zone is provided with a heat dissipation assembly for actively cooling the perovskite cell region, and the peripheral heating zone is provided with a heating assembly for melting and heating the packaging adhesive material; the device further comprises a temperature control assembly, which independently controls the heat production power of the heating assembly and the heat dissipation power of the heat dissipation assembly to maintain the temperature of the heating assembly and the heat dissipation assembly. Through the cooperative heat management of the same surface and different temperatures, the temperature of the central cell region is strictly controlled below the heat damage threshold while ensuring that the edge adhesive material is fully melted and sealed, thereby significantly improving the packaging yield and long-term stability of the perovskite cell, and the device is particularly suitable for the packaging of large-area components.

Description

Technical Field

[0001] This invention relates to the field of solar cell encapsulation technology, and in particular to a zoned temperature-controlled perovskite cell encapsulation hot stage device and its encapsulation method. Background Technology

[0002] Perovskite solar cells (PSCs), as representatives of the third generation of new photovoltaic technology, have shown great promise for commercial application due to their advantages such as high light absorption coefficient, long carrier diffusion length, and solution-based fabrication. Their photoelectric conversion efficiency has increased rapidly in laboratory research in recent years.

[0003] However, perovskite materials are extremely sensitive to heat. Because perovskite crystals are stacked by coordination bonds rather than covalent bonds, the organic components are easily decomposed under high temperatures, and the materials are highly sensitive to environmental factors such as moisture and oxygen. Therefore, high-quality packaging is crucial to ensuring the long-term stability of the device.

[0004] In current laboratory research and early-stage industrialization exploration, the mainstream packaging structure typically adopts a sandwich-like stack of "backplane glass / flexible backplane + butyl rubber frame around the perimeter + perovskite battery chip". The core of this packaging process lies in applying heat and pressure to the edge butyl rubber using a hot-pressing device, causing it to melt and generate adhesive fluidity, thereby forming a dense lateral water and oxygen barrier layer at the battery edge. Due to the thermal activation characteristics of butyl rubber, its melting and sealing temperature usually needs to be maintained between 110 and 125°C, and a certain holding time is required to ensure sufficient cross-linking and wetting.

[0005] For the aforementioned hot-pressing process, existing hot-pressing equipment mostly employs a uniform heating mode for the entire hot plate or a traditional resistance heating plate structure. Under these heating methods, to achieve the preset process temperature for the butyl rubber at the edges, the heat generated by the heat source must be conducted to the entire encapsulation area via the encapsulation backplane or directly through thermal radiation. Inevitably, a significant amount of heat will be conducted to the perovskite solar cell located in the central region, exposing the cell to a high-temperature environment for extended periods. This can easily cause changes in the composition and structure of the perovskite layer, leading to irreversible degradation or even complete failure of the device's photoelectric performance.

[0006] To mitigate the damage to the central battery region caused by high temperatures, existing technologies have undertaken some exploratory attempts. For example, Chinese patent CN118042851A proposes a packaging method to reduce thermal pressure damage. This method involves designing heterogeneous thermal conductivity regions on the surfaces of a first heating plate and a second heating plate positioned opposite each other. Specifically, the surface of the first heating plate is partitioned with materials of different thermal conductivity (high thermal conductivity regions correspond to the butyl rubber area at the battery edge, and low thermal conductivity regions correspond to the battery center), and passive heat dissipation protrusions are set on the second heating plate to reduce heat accumulation in the central region through a physical isolation mechanism. However, this solution still essentially relies on the physical isolation mechanism based on the difference in material thermal conductivity. Under continuous hot-pressing conditions, the central region experiences a temperature rise of approximately 30°C (measured 82°C → target 50°C), indicating significant room for improvement in thermal isolation effectiveness.

[0007] In addition, Chinese patent CN117750848A proposes a two-step / multi-step encapsulation process. First, a first encapsulating material is used to press the substrate together at a lower temperature or for a shorter time. After cooling, EVA hot melt adhesive (100℃) is used for a second sealing process with a glue gun. While this multi-step process avoids the continuous high temperature of the substrate to some extent, it significantly increases the complexity of operation and the encapsulation time, failing to meet the integrated operation requirements of efficient laboratory R&D and future small-scale pilot production lines.

[0008] Therefore, how to completely block heat conduction and effectively dissipate residual heat in the center through active and precise thermodynamic intervention in a single plane and a single hot pressing process is currently a bottleneck problem faced by large-area perovskite solar cell packaging. Summary of the Invention

[0009] The technical problem this invention aims to solve is to overcome the shortcomings of existing technologies and provide a zoned temperature-controlled perovskite solar cell encapsulation hot stage device and its encapsulation method. This invention's encapsulation hot stage device, through coordinated thermal management of "different temperatures on the same surface," ensures sufficient melting and sealing of the edge adhesive while strictly controlling the temperature of the central cell area below the thermal damage threshold, significantly improving the encapsulation yield and long-term stability of perovskite solar cells, and is particularly suitable for encapsulating large-area modules.

[0010] The technical solution adopted by the present invention to solve its technical problem is: a zoned temperature-controlled perovskite battery encapsulation hot stage device, which has a hot stage body, the hot stage body includes an inner heat dissipation zone and an outer heating zone distributed inside and outside, and a heat insulation layer is provided between the inner heat dissipation zone and the outer heating zone. The intermediate heat dissipation zone is equipped with a heat dissipation component for actively cooling the perovskite battery area, and the outer heating zone is equipped with a heating component for melting and heating the encapsulating adhesive. It also includes a temperature control component, which independently controls the heat generation power of the heating component and the heat dissipation power of the heat dissipation component to maintain the temperature of the heating component and the heat dissipation component.

[0011] Furthermore, the heating component includes one or more of an infrared radiation heating tube, an electric heating wire, and an electric heating film; the heat dissipation component includes one or more of a heat dissipation fins, an air-cooling channel, a cooling water circuit, and a semiconductor refrigeration chip.

[0012] If the heating component is an infrared radiation heating tube, the middle heat dissipation area is set higher than the outer heating area, and the distance H between the top of the middle heat dissipation area and the top of the outer heating area is 30-80 mm. H < 30 mm: The radiation spot is too dense, and the encapsulating material locally exceeds 145°C, leading to thermal degradation and microbubbles at the encapsulation edge. H > 80 mm: The radiation power density is insufficient; after 5 minutes, the encapsulating material is only 95-105°C, which is insufficient for complete melting and sealing. If the heating component is a heating wire or heating film, the tops of the outer heating area, the middle heat dissipation area, and the heat insulation layer are flush.

[0013] Furthermore, the width W of the outer heating zone satisfies: W = width of adhesive material + (0~10) mm.

[0014] Furthermore, the thermal conductivity of the insulation layer (130) is 0.02 to 0.05 W / (m·K), and the material of the insulation layer (130) is aerogel, ceramic fiber or mica sheet.

[0015] Furthermore, the temperature control component includes a second temperature sensor disposed on the surface of the intermediate heat dissipation area, for real-time feedback and maintaining the temperature of the area at 40-60°C.

[0016] A method for encapsulating perovskite solar cells using the above-described apparatus includes the following steps: Step S1: Place the component to be packaged on the hot stage body, align the packaging material on the component to be packaged with the outer heating area, and align the perovskite cell on the component to be packaged with the middle heat dissipation area. Step S2: Control the heating component to heat up to 100-130°C using the temperature control component, and simultaneously control the heat dissipation component to start. Step S3: During the melting of the encapsulating adhesive, the temperature of the intermediate heat dissipation zone is controlled to be 40-60°C by the temperature control system; Step S4: After the encapsulating adhesive has fully melted and formed a sealed bond, stop heating and remove the encapsulated device.

[0017] Furthermore, in step S1, the encapsulating material is butyl rubber.

[0018] The beneficial effects of this invention are that it is rationally designed and has the following advantages: 1. Unlike the localized heating of existing technologies, this invention integrates two opposing thermodynamic processes, "peripheral active heating" and "central active heat dissipation," on the same hot plate, and enhances their independence through a physical insulation layer. This structure can actively and precisely intervene in the temperature field distribution, fundamentally solving the heat accumulation effect of large-area components, which is something that passive insulation solutions cannot achieve. 2. This invention can strictly control the temperature of the central area of ​​the battery to 40-60°C or even lower, achieving "zero thermal damage" encapsulation of perovskite materials; comparative experimental data strongly proves that: using the device of this invention, the photoelectric conversion efficiency attenuation rate before and after encapsulation can be less than 2%, which is far superior to traditional overall heating (attenuation >15%). 3. The heating method of the present invention is flexible, supporting multiple modes such as contact (electrothermal) and non-contact (infrared), and can be adapted to different types of perovskite components and encapsulation materials. It is especially suitable for the preparation of new material systems and large-area components that are extremely sensitive to heat. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a top view of the working plane of the heating table body provided by the present invention; Figure 2 This is a cross-sectional structural diagram of the non-infrared radiation hot stage provided in Example 1; Figure 3 This is a cross-sectional structural diagram of the infrared radiation heating stage provided in Example 2; Figure 4 This is a schematic diagram of the stacked structure of the component to be packaged, provided by the present invention, placed on the hot stage body.

[0021] In the diagram: 110, outer heating zone; 120, middle heat dissipation zone; 130, heat insulation zone; 500, component to be encapsulated; 510, perovskite cell; 520, encapsulation material. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0023] like Figure 1The perovskite battery encapsulation hot stage device with zoned temperature control of the present invention has a hot stage body, which includes an inner heat dissipation zone 120 and an outer heating zone 110 distributed inside and outside. A heat insulation layer 130 is provided between the inner heat dissipation zone 120 and the outer heating zone 110, and the inner heat dissipation zone 120 and the heat insulation layer 130 form a whole. The middle heat dissipation area 120 is equipped with a heat dissipation component for actively cooling the perovskite cell area, and the outer heating area 110 is equipped with a heating component for melting and heating the encapsulating adhesive. It also includes a temperature control component, which independently controls the heat generation power of the heating component and the heat dissipation power of the heat dissipation component to maintain the temperature of the heating component and the heat dissipation component.

[0024] The width W of the outer heating zone 110 satisfies: W = width of the adhesive material + (0~10) mm.

[0025] The thermal conductivity of the insulation layer 130 is 0.02 to 0.05 W / (m·K), and the material of the insulation layer 130 is aerogel, ceramic fiber or mica sheet.

[0026] The temperature control component also includes a second temperature sensor disposed on the surface of the intermediate heat dissipation area 120, for real-time feedback and maintaining the temperature of the area at 40-60°C.

[0027] To more intuitively verify the technical effects of this invention, a 10×10cm perovskite solar cell 510 (structure: ITO / MeO-2PACz / Perovskite / C60 / BCP / Ag) was selected for a comparative experiment of butyl rubber encapsulation. The target hot-pressing temperature was 120℃, and the holding time was 5 minutes.

[0028] Example 1: External electric heating + physical insulation + intermediate active cooling like Figure 2 As shown, in this embodiment of the zoned temperature-controlled perovskite battery encapsulation hot stage device, the tops of the outer heating zone 110, the middle heat dissipation zone 120, and the heat insulation layer 130 are arranged flush.

[0029] The outer heating zone 110 has a ring of resistance wires embedded inside, and is covered with a high thermal conductivity aluminum alloy panel. The middle heat dissipation zone 120 has multiple heat dissipation slots below it and is equipped with a miniature forced convection fan (air cooling channel). The space between the outer heating zone 110 and the middle heat dissipation zone 120 is filled with a 5mm thick aerogel insulation strip (i.e., insulation layer 130).

[0030] During operation, the component to be encapsulated 500 is placed on the hot plate main body, aligning the encapsulation material 520 with the outer heating area 110, and aligning the perovskite cell 510 with the central heat dissipation area 120. The temperature of the outer heating zone 110 is set to 120℃ by an independent temperature controller, allowing the butyl rubber to soften rapidly in this area. Simultaneously, the central fan runs at full speed. Thermocouple measurements show that the panel temperature in the central area remains stable at around 45℃, perfectly achieving both the melting of the butyl rubber and low-temperature protection for the perovskite battery.

[0031] Example 2: Peripheral infrared heating + physical insulation + intermediate TEC active cooling like Figure 3 As shown, in this embodiment of the zoned temperature-controlled perovskite battery packaging hot stage device, the middle heat dissipation zone 120 is set higher than the outer heating zone 110, and the distance H between the top of the middle heat dissipation zone 120 and the top of the outer heating zone 110 is 50-65mm.

[0032] The outer heating zone 110 uses an infrared radiation heating tube, which emits infrared rays of a specific wavelength that can penetrate the back panel of the component and act directly on the butyl rubber, achieving "non-contact" heating in seconds with extremely fast thermal response. The middle heat dissipation zone 120 is fitted with a semiconductor cooling chip (TEC), with its cold end facing upwards as the heat dissipation working surface, while the hot end is connected to the bottom water cooling plate to enhance heat dissipation.

[0033] During operation, the outer heating zone 110 rises to 120±5℃ within 90 to 120 seconds, and the temperature uniformity along the perimeter is better than ±3℃.

[0034] Infrared heating eliminates the time lag in heat conduction, while TEC cooling can force the temperature in the central area down to room temperature or even below (e.g., 25°C), creating an extreme temperature gradient. Experiments have shown that this approach not only increases encapsulation speed by 40% but also achieves "zero thermal damage" encapsulation of perovskite materials.

[0035] Comparative Example 1: Traditional overall heating (120°C constant temperature throughout) The entire structure is placed in the center of the heating platform, with no heat dissipation.

[0036] Temperature performance: The temperature in the central area of ​​the module rises to above 110°C within 60 seconds of placement, and by the end of 5 minutes, the measured temperature of the active area of ​​the battery reaches as high as 118°C.

[0037] Device performance: PCE degradation is greater than 15%, and in the subsequent accelerated aging test (dual 85 test), the efficiency degradation rate is much higher than other partitioned heating schemes, and more than 50% of the initial efficiency is lost after 500h. Comparative Example 2: (Passive partitioned hot station based on the approach of CN118042851A) The outer perimeter of the heating platform is made of high thermal conductivity stainless steel, the center is made of low thermal conductivity ceramic, and the bottom is supplemented with metal heat dissipation columns (without active cooling).

[0038] Temperature performance: Heat is continuously conducted through the air and backplate. At the 5th minute of hot pressing, the highest measured temperature in the central perovskite cell area slowly climbed to 82℃.

[0039] Device performance: After packaging, slight thermal collapse was observed at the edge of the Ag electrode; IV testing showed an absolute decrease of 6.5% in the power conversion efficiency (PCE), indicating that the underlying SAM material or perovskite grain boundaries were damaged by thermal stress.

[0040] Comparative Example 3: (Refer to the two-step packaging method in CN117750848A) First, press the main body together (after cooling), then use a 100℃ hot melt glue gun to apply glue to the edges for a second sealing.

[0041] Temperature performance / processability: Although the central area did not experience a large area of ​​120°C high temperature, heat was locally conducted during the secondary application of adhesive at the edge, and the two-step method resulted in the total encapsulation time of a single module being more than twice that of the conventional method, making it difficult to guarantee batch consistency.

[0042] Device performance: PCE decay is around 3.1%, but the operation is cumbersome and the finished product yield is greatly affected by manual intervention.

[0043] Comparative experimental data and analysis To verify the effectiveness of this invention, the following comparative experiments were conducted. The target hot-pressing temperature for all experiments was 120℃, and the holding time was 5 minutes. The experimental results are shown in Table 1. Table 1

[0044] As shown in Table 1: 1. Size Effect and Thermal Sensitivity: For large-area modules, due to the long perimeter of the butyl rubber sealant, the hot-pressing time usually needs to be maintained at 3-5 minutes to ensure complete sealing. In Comparative Example 2, even with the use of low thermal conductivity materials, under long-term hot pressing, heat still caused the central area to rise to over 80°C due to in-plane heat diffusion, resulting in a drop in FF from 71.6% to 68.8%, indicating that the demand for active heat dissipation for large-area devices is much higher than that for small-area devices. Electrical stability of the present invention: In Examples 1 and 2, the VOC remained above 1.150V before and after encapsulation with almost no fluctuation. This demonstrates that the active heat dissipation zone (intermediate heat dissipation zone 120) strictly locks the central core area of ​​the 100mm module within a safe temperature range, completely avoiding thermal decomposition of the perovskite film and deterioration of the interface properties of the underlying SAM material (such as MeO-2PACz).

[0045] 2. Decoupling of Sealing Quality and Aging Performance: Although Comparative Example 3 retained high efficiency at the moment of encapsulation, its aging performance (only 61.1% remaining after 500h) reflects poor sealing consistency of the two-step manual glue application method (EVA / hot melt adhesive), making it extremely easy for moisture to penetrate. This invention allows for the full melting of high-strength, high-airtightness butyl rubber at 120°C in the peripheral heating zone (110). Therefore, after a 1000h ultra-long double 85 aging test, the module still retained 96.0% of its initial efficiency. This proves that this invention achieves optimal encapsulation physical reliability without compromising module performance.

[0046] 3. Comparative experiments using 100×100 mm specifications demonstrate that this invention is currently the only single-step thermo-pressing encapsulation technology that can simultaneously achieve "extremely low encapsulation damage" and "extremely high encapsulation strength / air tightness," making it particularly suitable for the research and pilot production of large-area perovskite solar cell modules.

[0047] In summary, the perovskite solar cell encapsulation hot stage device and encapsulation method provided by this invention, through the organic combination of "zoned temperature control" and "active thermal management," can significantly improve the encapsulation quality and production efficiency of perovskite solar cells, successfully resolving the long-standing contradiction between "thermal damage" and "sealing reliability" in perovskite solar cell encapsulation. The encapsulation hot stage device and encapsulation method provided by this invention are not only suitable for laboratory research and development but also fully meet the needs of future industrial production, possessing extremely high industrial practical value and broad application prospects.

[0048] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A zoned temperature-controlled perovskite solar cell packaging hot stage device, characterized in that: It has a hot stage body, which includes an inner heat dissipation area (120) and an outer heating area (110) distributed inside and outside. A heat insulation layer (130) is provided between the inner heat dissipation area (120) and the outer heating area (110), and the inner heat dissipation area (120) and the heat insulation layer (130) form a whole. The intermediate heat dissipation zone (120) is provided with a heat dissipation component for actively cooling the perovskite battery area, and the peripheral heating zone (110) is provided with a heating component for melting and heating the encapsulating adhesive. It also includes a temperature control component, which independently controls the heat generation power of the heating component and the heat dissipation power of the heat dissipation component to maintain the temperature of the heating component and the heat dissipation component.

2. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 1, characterized in that: The heating component includes one or more of infrared radiation heating tubes, heating wires, and heating films; the heat dissipation component includes one or more of heat dissipation fins, air-cooling channels, cooling water circuits, and semiconductor refrigeration chips.

3. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 2, characterized in that: The heating component is an infrared radiation heating tube, with the middle heat dissipation area (120) set higher than the outer heating area (110), and the distance H between the top of the middle heat dissipation area (120) and the top of the outer heating area (110) is 30-80mm.

4. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 2, characterized in that: The heating component is an electric heating wire or an electric heating film, with the tops of the outer heating area (110), the middle heat dissipation area (120), and the heat insulation layer (130) flush.

5. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 1, characterized in that: The width W of the outer heating zone (110) satisfies: W = width of adhesive material + (0~10) mm.

6. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 1, characterized in that: The thermal conductivity of the insulation layer (130) is 0.02 to 0.05 W / (m·K), and the material of the insulation layer (130) is aerogel, ceramic fiber or mica sheet.

7. The perovskite solar cell packaging hot stage device with zoned temperature control according to claim 1, characterized in that: The temperature control component includes a second temperature sensor disposed on the surface of the intermediate heat dissipation area (120) for real-time feedback and maintaining the temperature of the area at 40-60°C.

8. A method for encapsulating perovskite solar cells using the apparatus according to any one of claims 1 to 7, characterized in that, Includes the following steps: Step S1: Place the component to be packaged (500) on the hot stage body, align the packaging adhesive (520) on the component to be packaged (500) with the outer heating area (110), and align the perovskite cell (510) on the component to be packaged with the middle heat dissipation area (120). Step S2: Control the heating component to heat up to 100-130°C using the temperature control component, and simultaneously control the heat dissipation component to start. Step S3: During the melting of the encapsulating adhesive (520), the temperature of the intermediate heat dissipation zone (120) is controlled to be 40-60°C by the temperature control system; Step S4: After the encapsulating adhesive (520) has fully melted and formed a sealed bond, stop heating and remove the encapsulated device.

9. The perovskite solar cell packaging method with zoned temperature control according to claim 8, characterized in that: In step S1, the encapsulating adhesive (520) is butyl rubber.

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