Method for cleaning a substrate processing apparatus

Abstract

The substrate processing apparatus of the present application includes a holding section that holds a substrate (9), a processing liquid nozzle (26) that sprays a processing liquid toward the substrate (9), a processing liquid supply line (4) that supplies the processing liquid to the processing liquid nozzle (26), and a chamber (21) in which the holding section and the processing liquid nozzle (26) are disposed. The processing liquid supply line (4) includes a storage tank (41) that can store a liquid. The cleaning method of the substrate processing apparatus includes the steps of connecting a supply source of a specified cleaning liquid to the processing liquid supply line (4), and causing a high-temperature cleaning liquid obtained by heating the cleaning liquid to a temperature higher than a normal temperature to flow in the processing liquid supply line (4) and to be supplied to the inside of the storage tank (41) or the chamber (21), i.e., an object space, thereby generating steam of the cleaning liquid in the object space and causing the cleaning liquid to condense on the top surface and / or the side surface of the object space. Thus, the top surface and the like of the object space can be easily cleaned with the cleaning liquid.

Description

[0001] [References to related applications]

[0002] This application claims the benefit of priority to Japanese Patent Application JP2025-75508, filed on April 30, 2025, all disclosures of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a cleaning method for a substrate processing apparatus. Background Technology

[0004] Conventionally, in the manufacturing process of semiconductor substrates (hereinafter referred to as "substrate"), various treatments are performed on the substrate using a substrate processing apparatus. In this apparatus, a processing liquid is supplied from a processing liquid supply line to a processing liquid nozzle, and the processing liquid is sprayed from the nozzle onto the substrate within a chamber. When particles adhere to the inside of the piping or valves (hereinafter also referred to as "piping") of the processing liquid supply line, the processing liquid containing the particles is supplied to the substrate. Therefore, the processing liquid supply line is cleaned by allowing a specified liquid to circulate in the processing liquid supply line for an extended period (i.e., rinsing). In the apparatus disclosed in Japanese Patent Application Publication No. 2021-2551, DIW (De-Ionized Water) or hydrogen peroxide water is used to clean the piping; in the apparatus disclosed in Japanese Patent Application Publication No. 2022-148186, ammonia, isopropanol, hydrogen peroxide water, or ozone water is used to clean the piping.

[0005] On the other hand, in the processing liquid supply line, if particles adhere to the top or side surface of the storage tank for storing the processing liquid (e.g., the portion of the side surface higher than the metering position), these particles may fall and mix into the processing liquid, resulting in processing liquid containing particles being supplied to the substrate. Additionally, if particles adhere to the top or side surface of the chamber where the substrate is disposed, these particles may also fall onto the substrate, causing defects. Therefore, a method is required that uses the interior of the storage tank or chamber as the target space, and that allows for easy cleaning of the top and / or sides of the target space. Summary of the Invention

[0006] The purpose of this invention is to facilitate the cleaning of the top surface and / or side surface of the object space in a substrate processing apparatus.

[0007] Embodiment 1 of the present invention is a cleaning method for a substrate processing apparatus, the substrate processing apparatus comprising: a holding part for holding a substrate; a processing liquid nozzle for spraying processing liquid onto the substrate; a processing liquid supply line for supplying the processing liquid to the processing liquid nozzle; and a chamber having the holding part and the processing liquid nozzle disposed inside; the processing liquid supply line having a storage tank for storing liquid, the cleaning method comprising the following steps: a) connecting a specified cleaning liquid supply source to the processing liquid supply line; and b) causing a high-temperature cleaning liquid obtained by heating the cleaning liquid to a temperature higher than room temperature to flow in the processing liquid supply line and supplying it to the storage tank or the interior of the chamber, i.e., a target space, thereby generating vapor of the cleaning liquid in the target space and causing the cleaning liquid to condense on the top surface and / or side surface of the target space.

[0008] According to the present invention, the top surface and / or side surface of the object space in the substrate processing apparatus can be easily cleaned with a cleaning solution.

[0009] The second aspect of the present invention is a cleaning method for a substrate processing apparatus according to aspect 1, wherein the object space is the storage tank, and in step b), the high-temperature cleaning liquid is filled into the storage tank until it reaches a position lower than the vent hole provided in the storage tank.

[0010] The cleaning method of the substrate processing apparatus according to Embodiment 2 in Embodiment 3 of the present invention further comprises: a circulation line for circulating the liquid by taking the liquid from one end of the storage tank and returning it to the storage tank from the other end; and a heater for heating the liquid flowing in the circulation path; in step b), the cleaning liquid circulating in the circulation path is heated by the heater.

[0011] The cleaning method of the substrate processing apparatus according to Embodiment 3 of the present invention further includes the following step: before step b), the circulation path is cleaned by circulating the cleaning liquid, which has a temperature lower than that of the high-temperature cleaning liquid, in the circulation path and discharging the cleaning liquid to the outside of the circulation path.

[0012] The present invention, embodiment 5, is a cleaning method for a substrate processing apparatus according to any one of embodiments 2 to 4, wherein the storage tank has a drain outlet, and the cleaning method further comprises the following steps: prior to step b), cleaning the storage tank by filling the storage tank with the cleaning liquid at a temperature lower than that of the high-temperature cleaning liquid and draining the cleaning liquid from the drain outlet to the outside.

[0013] The cleaning method of the substrate processing apparatus according to any one of embodiments 2 to 4 (or any one of embodiments 2 to 5) of the present invention, wherein, prior to step b), other cleaning solutions are supplied to the storage tank, the other cleaning solutions being acidic or alkaline liquids.

[0014] The present invention, embodiment 7, is a cleaning method of the substrate processing apparatus according to embodiment 6, wherein the cleaning solution is water and the other cleaning solution is an aqueous solution.

[0015] The cleaning method of the substrate processing apparatus according to any one of embodiments 1 to 4 (or any one of embodiments 1 to 7) of the present invention, wherein the temperature of the high-temperature cleaning solution is 65°C or higher.

[0016] The cleaning method of the substrate processing apparatus according to any one of embodiments 1 to 4 (or any one of embodiments 1 to 8) of the present invention is performed when the substrate processing apparatus is placed at the installation location after being moved from the manufacturing site to the installation location.

[0017] The objectives, other objectives, features, forms, and advantages of the present invention will become clear from the following detailed description of the invention with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a diagram showing the layout of the substrate processing apparatus.

[0019] Figure 2 This is a diagram showing part of the configuration of multiple processing units and the configuration of the processing fluid supply pipeline.

[0020] Figure 3 This is a diagram showing another part of the composition of the treatment fluid supply pipeline.

[0021] Figure 4 This is a diagram showing the configuration of a mixing valve.

[0022] Figure 5 This is a diagram used to illustrate the state of the processing liquid supply pipeline during substrate processing.

[0023] Figure 6 This is a diagram showing the cleaning process of the substrate processing apparatus.

[0024] Figure 7A This diagram illustrates the cleaning process of the device.

[0025] Figure 7B This diagram illustrates the cleaning process of the device.

[0026] Figure 7C This diagram illustrates the cleaning process of the device.

[0027] Figure 7D This diagram illustrates the cleaning process of the device.

[0028] Figure 8A This diagram illustrates the cleaning process of the device.

[0029] Figure 8B This diagram illustrates the cleaning process of the device.

[0030] Figure 9A This diagram illustrates the cleaning process of the device.

[0031] Figure 9B This diagram illustrates the cleaning process of the device. Detailed Implementation

[0032] Figure 1 This is a diagram showing the layout of the substrate processing apparatus 10. The substrate processing apparatus 10 is a system for processing a disc-shaped semiconductor substrate 9 (hereinafter simply referred to as "substrate 9"). Substrate 9 is a predetermined product substrate from which a semiconductor product will ultimately be produced (i.e., a substrate in the semiconductor product manufacturing process). In this specification, when simply referred to as "substrate 9", it refers to the product substrate and does not include substrates that will not become semiconductor products (so-called dummy substrates).

[0033] The substrate processing apparatus 10 includes a control unit 100, a transfer block 101, and a processing block 102 coupled to the transfer block 101. The control unit 100 is implemented by executing a specified program through a computer having a CPU, memory, etc., and is responsible for the overall control of the substrate processing apparatus 10. Part or all of the control unit 100 may also be implemented by a programmable logic controller (PLC) or the like.

[0034] The transfer block 101 includes a carrier holding section 104, a transfer robot 105, and an IR moving mechanism 106. The carrier holding section 104 holds multiple carriers 107, each capable of accommodating multiple substrates 9. The multiple carriers 107 (e.g., FOUP) are held in the carrier holding section 104 in a state arranged along a specified carrier arrangement direction. The IR moving mechanism 106 moves the transfer robot 105 along the carrier arrangement direction. The transfer robot 105 performs a removal action to take the substrate 9 out of the carrier 107 and a loading action to place the substrate 9 into the carrier 107. The substrate 9 is transported horizontally by the transfer robot 105. A transfer section 103 is provided between the central robot 109 (described later) in the processing block 102 and the transfer robot 105, and the transfer robot 105 transports the substrate 9 between the transfer section 103 and the carriers 107. In the transfer section 103, the substrate 9 is temporarily held horizontally.

[0035] Processing block 102 includes multiple (e.g., four or more) processing units 2 for processing substrate 9, and a central robot 109. The multiple processing units 2 are arranged to surround the central robot 109 in a top-down view. Two or more processing units 2 may also be stacked vertically. Various processes are performed on the substrate 9 within the multiple processing units 2. The central robot 109 handles the transfer of the substrate 9 between itself and the transfer unit 103. Furthermore, the central robot 109 performs actions to move the substrate 9 into the processing units 2 and to move the substrate 9 out of the processing units 2. The central robot 109 also transports the substrate 9 between the multiple processing units 2. The substrate 9 is transported horizontally by the central robot 109.

[0036] Figure 2 This is a diagram showing part of the configuration of multiple processing units 2 and the configuration of the processing liquid supply line 4, which will be described later. Figure 2 The diagram shows a portion of the configuration of the processing unit 2 in cross-section on a plane containing a specified central axis. In each processing unit 2, monolithic processing is performed on each substrate 9.

[0037] The processing unit 2 includes a chamber 21, a rotary chuck 22, a cup portion 23, and a processing liquid nozzle 26. The chamber 21 is a container (also called a housing) that forms the processing space of the substrate 9. The rotary chuck 22, the cup portion 23, and the processing liquid nozzle 26 are disposed within the chamber 21. The rotary chuck 22 is a holding portion that holds the substrate 9. Figure 2 In the example, the substrate 9 is held horizontally from below by a generally circular chuck portion centered on a central axis along the vertical direction. The chuck portion is, for example, a vacuum chuck, which contacts and adheres to the center of the lower main surface of the substrate 9. The chuck portion can also be a mechanical chuck, etc. Below the chuck portion, a rotating mechanism is arranged. The rotating mechanism has a shaft and an electric motor, causing the substrate 9 to rotate together with the chuck portion about the central axis. The holding portion holding the substrate 9 is preferably a rotating chuck 22, but other structures such as a non-rotating chuck portion are also possible.

[0038] The cup portion 23 is a ring-shaped component centered on the central axis, arranged around the entire circumference of the rotating chuck 22. The cup portion 23 covers the sides and bottom of the substrate 9 held by the rotating chuck 22, catching liquid splashed outwards from the rotating substrate 9. Whether the substrate 9 is rotating or stationary, the cup portion 23 remains stationary in the circumferential direction. At the bottom of the cup portion 23, a drain port (not shown) is provided to discharge the liquid caught by the cup portion 23 to the outside of the chamber 21. Figure 2 In the example, the cup-bearing portion 23 can move vertically via a cup-bearing moving mechanism having an electric motor and a ball screw, etc. The cup-bearing portion 23 may also have multiple cups stacked radially.

[0039] The processing liquid nozzle 26 is supported by a nozzle moving mechanism (not shown). This nozzle moving mechanism, for example, includes an electric motor and a ball screw, and moves the processing liquid nozzle 26 approximately horizontally between a supply position above the substrate 9 held by the rotating chuck 22 and a retracted position radially outward from the substrate 9. The processing liquid nozzle 26 may also be mounted on a rotatable arm. As described below, the processing liquid nozzle 26 sprays processing liquid onto the substrate 9. During processing liquid spraying, the processing liquid nozzle 26 may move continuously or intermittently above the substrate 9, or stop at a designated position above the substrate 9 (e.g., above the center of the substrate 9).

[0040] The substrate processing apparatus 10 also includes a processing liquid supply line 4. The processing liquid supply line 4 supplies processing liquid to multiple processing liquid nozzles 26 in the multiple processing units 2. Figure 3 This is a diagram showing another part of the configuration of the treatment fluid supply line 4. Figure 3 The diagram shows the configuration of the treatment liquid supply pipeline 4 from the storage tank 41 (described later) to the upstream side (the side of the pure water supply source 81 and the drug solution supply source 82). Figure 2 The diagram shows the configuration of the treatment fluid supply line 4 from the storage tank 41 to the downstream side (the treatment fluid nozzle 26 side). In this specification, the treatment fluid supply line 4 is a liquid flow path mostly composed of piping. This piping is, for example, formed of resin. The components of the treatment fluid supply line 4, described later, including the pure water inlet line 31, pure water branch lines 32a and 32b, the drug inlet line 33, the drug branch lines 34a and 34b, the drug supply lines 35a and 35b, the drain lines 318, 338, 358, 418, and 498, the outlet line 42, the first return line 43, the second return line 44, and the branch line 48, are also constructed in this manner. Figure 2 and Figure 3 The image only shows a portion of the piping equipment (valves, flow meters, etc.) installed in the processing fluid supply line 4; in reality, more piping equipment will be installed.

[0041] In the actual substrate processing apparatus 10, multiple processing liquid supply lines are provided to supply various processing liquids to processing liquid nozzles (which may also be nozzles different from processing liquid nozzle 26), but... Figure 2 and Figure 3 Only one processing fluid supply line 4 is shown in the diagram. Other processing fluid supply lines may be constructed by omitting and / or changing some components of processing fluid supply line 4, or by adding other components. In the device cleaning process described later, only processing fluid supply line 4 will be considered, but other processing fluid supply lines will also be treated in the same way.

[0042] like Figure 3As shown, the treatment fluid supply line 4 includes a storage tank 41, two auxiliary tanks 30a and 30b, a pure water inlet line 31, two pure water branch lines 32a and 32b, a drug inlet line 33, two drug branch lines 34a and 34b, two drug supply lines 35a and 35b, and three drain lines 318, 338, and 358. The storage tank 41 is a container capable of storing liquid. Details regarding the structure of the storage tank 41 will be described below. Each auxiliary tank 30a and 30b is also a container capable of storing liquid; typically, their volume is smaller than that of the storage tank 41. The storage tank 41 and the auxiliary tanks 30a and 30b form a space isolated from the external atmosphere.

[0043] One end of the pure water inlet pipeline 31 becomes the inlet 310 of the pure water (DIW) inlet in the treatment liquid supply pipeline 4. Figure 3 (Represented by a black dot in the image), the other end is connected to the storage tank 41. The inlet 310 of the pure water inlet line 31 is connected to the pure water supply source 81 via the primary side connection pipe 51. The pure water supply source 81 is the supply source of pure water contained in the processing solution and is equipment within the installation location (factory, etc.) of the substrate processing apparatus 10. A valve 311 is installed near the inlet 310 of the pure water inlet line 31. One end of each pure water branch line 32a, 32b is connected between the valve 311 in the pure water inlet line 31 and the storage tank 41. The other end of the pure water branch line 32a is connected to the auxiliary tank 30a, and the other end of the pure water branch line 32b is connected to the auxiliary tank 30b. A valve 321 is installed in each pure water branch line 32a, 32b. During the apparatus cleaning process described later, pure water is supplied from the pure water supply source 81 to the auxiliary tanks 30a, 30b.

[0044] One end of the drug inlet line 33 becomes the drug inlet 330 in the treatment fluid supply line 4. Figure 3 (Represented by black dots). The inlet 330 of the chemical solution introduction line 33 is connected to the chemical solution supply source 82 via the primary side connecting pipe 52. The chemical solution supply source 82 is the supply source of the chemical solution contained in the processing solution, and is equipment within the installation location (factory, etc.) of the substrate processing apparatus 10. A valve 331 is installed near the inlet 330 of the chemical solution introduction line 33. The other end of the chemical solution introduction line 33 branches into two chemical solution branch lines 34a and 34b, which are connected to auxiliary tanks 30a and 30b respectively. A valve 341 is installed on each chemical solution branch line 34a and 34b. Figure 3In the example, the drug solution branch line 34a and the pure water branch line 32a merge on the side closer to the auxiliary tank 30a than valves 321 and 341, and are connected to the auxiliary tank 30a. Additionally, the drug solution branch line 34b and the pure water branch line 32b merge on the side closer to the auxiliary tank 30b than valves 321 and 341, and are connected to the auxiliary tank 30b. During substrate processing, the drug solution is supplied from the drug solution supply source 82 and stored in the auxiliary tanks 30a and 30b.

[0045] One end of the chemical supply line 35a is connected to the auxiliary tank 30a, and the other end is connected to the pure water inlet line 31. In the pure water inlet line 31, the connection point of the chemical supply line 35a is positioned closer to the storage tank 41 than the connection points of the pure water branch lines 32a and 32b. One end of the chemical supply line 35b is connected to the auxiliary tank 30b, and the other end is connected to the chemical supply line 35a. In other words, the chemical supply lines 35a and 35b merge on opposite sides of the auxiliary tanks 30a and 30b and connect to the pure water inlet line 31. During substrate processing and device cleaning, inert gases such as nitrogen are supplied to the interior of the auxiliary tanks 30a and 30b to pressurize them. As a result, the liquid in the auxiliary tanks 30a and 30b is pressurized and sent to the pure water inlet line 31 via the chemical supply lines 35a and 35b.

[0046] In the drug supply line 35a, a flow adjustment unit 362 is provided between the connection point of the drug supply line 35b and the other end (the connection point with the pure water inlet line 31). The flow adjustment unit 362 includes, for example, a switch valve, a flow meter, and a flow regulating valve, and adjusts the flow rate of the liquid flowing in the drug supply line 35a based on the control of the control unit 100. In the pure water inlet line 31, a flow adjustment unit 361 is provided between the connection point of the drug supply line 35a and the connection points of the pure water branch lines 32a and 32b. The flow adjustment unit 361 includes, for example, a switch valve, a flow meter, and a flow regulating valve, and adjusts the flow rate of the liquid flowing in the pure water inlet line 31 based on the control of the control unit 100.

[0047] In one example of substrate processing, the pharmaceutical solution flowing in the pharmaceutical solution supply line 35a is mixed with pure water flowing in the pure water inlet line 31, and the diluted pharmaceutical solution (hereinafter referred to as "diluted pharmaceutical solution") is supplied to the storage tank 41. The diluted pharmaceutical solution is stored in the storage tank 41. The pharmaceutical solution flowing in the pharmaceutical solution supply line 35a does not necessarily have to be diluted with pure water. For example, valve 311 can be closed, and the pharmaceutical solution flowing in the pharmaceutical solution supply line 35a can be supplied to the storage tank 41 via a portion of the pure water inlet line 31 without pure water flowing through the pure water inlet line 31.

[0048] The drain line 318 is located near the inlet 310 of the pure water inlet line 31. Figure 3In the example, one end of the drain line 318 is connected between the inlet 310 of the pure water inlet line 31 and the connection point of the pure water branch lines 32a and 32b. The other end of the drain line 318 is connected to the drain recovery unit 39. A valve 319 is provided on the drain line 318. By opening the valve 319, the liquid flowing in the pure water inlet line 31 can be discharged to the drain recovery unit 39.

[0049] The drainage line 338 is located near the inlet 330 of the drug inlet line 33. Figure 3 In the example, one end of the drain line 338 is connected between the inlet 330 of the drug inlet line 33 and the branch positions of the drug branch lines 34a and 34b. The other end of the drain line 338 is connected to the drain recovery unit 39. A valve 339 is provided on the drain line 338. By opening the valve 339, the liquid flowing in the drug inlet line 33 can be discharged to the drain recovery unit 39.

[0050] The drain line 358 is located near the flow adjustment section 362 in the drug supply line 35a. Figure 3 In the example, one end of the drain line 358 is connected between the connection point of the medicine supply line 35b in the medicine supply line 35a and the flow adjustment unit 362. The other end of the drain line 358 is connected to the drain recovery unit 39. A valve 359 is provided on the drain line 358. By opening the valve 359, the liquid flowing in the medicine supply line 35a can be discharged to the drain recovery unit 39. Typically, drain lines 318, 338, and 358 are connected to the same drain recovery unit 39, but they can also be connected to different drain recovery units 39. The same applies to drain lines 418 and 498, which will be described later. Drain lines 318, 338, and 358 are used during device cleaning.

[0051] like Figure 2 As shown, a vent 416 communicating with the outside atmosphere is provided near the top surface 412 (i.e., the upper part of the side) on the side of the storage tank 41. The vent 416 prevents excessive pressure inside the storage tank 41. A drain port 411 is provided at the bottom of the storage tank 41, and one end of a drain line 418 is connected to the drain port 411. The other end of the drain line 418 is connected to the drain recovery unit 39. A valve 419 is provided on the drain line 418. By opening the valve 419, the liquid in the storage tank 41 can be discharged to the drain recovery unit 39.

[0052] The processing fluid supply line 4 also includes an extraction line 42, a first return line 43, a second return line 44, and multiple branch lines 48. One end of the extraction line 42 is connected to the lower part of the storage tank 41. A pump 421 (described later) is installed on the extraction line 42. Through the pump 421's pumping action, the liquid in the storage tank 41 is extracted to the extraction line 42 and flows in the extraction line 42. The other end of the extraction line 42 is a connection point 420 connecting one end of the first return line 43 and one end of the second return line 44. In other words, the extraction line 42 branches into the first return line 43 and the second return line 44 at the connection point 420, and the liquid flows into the first return line 43 and the second return line 44. Valves 431 and 441 are respectively installed on the first return line 43 and the second return line 44.

[0053] The other end of the first return line 43 is connected to the storage tank 41, and the liquid flowing in the first return line 43 returns to the storage tank 41. The first circulation line 46 is formed by the take-out line 42 and the first return line 43. This first circulation line 46 takes liquid from one end of the storage tank 41 and returns it to the storage tank 41 from the other end. The other end of the second return line 44 is connected to the storage tank 41, and the liquid flowing in the second return line 44 returns to the storage tank 41. The second circulation line 47 is formed by the take-out line 42 and the second return line 44. This second circulation line 47 takes liquid from one end of the storage tank 41 and returns it to the storage tank 41 from the other end. In the processing liquid supply line 4, a first circulation path 460 for circulating liquid is formed by the storage tank 41 and the first circulation line 46, and a second circulation path 470 for circulating liquid is formed by the storage tank 41 and the second circulation line 47. During substrate processing, the diluted solution flows continuously in both the first circulation path 460 and the second circulation path 470.

[0054] In the take-out line 42, a pump 421, a heater 422, a thermometer 423, and a filter 424 are sequentially arranged from the storage tank 41 toward the connection point 420. The pump 421 pumps liquid, causing the liquid in the storage tank 41 to flow in both the first circulation path 460 and the second circulation path 470. The heater 422, for example an electric heater, heats the liquid flowing in the take-out line 42 as needed. During substrate processing, the diluted solution flowing in the take-out line 42 is heated by the heater 422. The thermometer 423 measures the temperature of the liquid flowing in the take-out line 42. In practice, the heater 422 is controlled based on the temperature measured by the thermometer 423. The filter 424 removes excess substances contained in the liquid.

[0055] Multiple branch lines 48 are respectively connected to multiple processing fluid nozzles 26 in multiple processing units 2. The ends of each branch line 48 opposite to the processing fluid nozzles 26 are connected to the second return line 44. In this way, multiple branch lines 48 branch from the second circulation line 47 and connect to multiple processing fluid nozzles 26. A mixing valve 49 is provided in each branch line 48.

[0056] Figure 4 This diagram illustrates the configuration of the mixing valve 49. The mixing valve 49, also known as a multi-valve device, is capable of mixing two or more liquids supplied internally. The mixing valve 49 includes a mixing body 490 and multiple valves 491 to 494. The mixing body 490 has an internal space for liquid mixing. In the branch line 48, the portion on the side of the second circulation line 47 is connected to the mixing body 490 via the first valve 491, and the portion on the side of the processing liquid nozzle 26 is connected to the mixing body 490 via the third valve 493. In other words, the first valve 491 is provided at the liquid inlet to the mixing body 490, and the third valve 493 is provided at the outlet to the processing liquid nozzle 26. Figure 4 In the diagram, the portion of the branch line 48 on the second circulation line 47 side and the portion on the treatment fluid nozzle 26 side are both labeled with the same symbol 48. By opening the first valve 491, the liquid flowing in the second circulation path 470 is supplied to the interior of the mixing body 490. By opening the third valve 493, the liquid inside the mixing body 490 is supplied to the treatment fluid nozzle 26.

[0057] In the processing liquid supply line 4, there is also a storage tank 41a for storing other types of pharmaceutical solutions. The pipeline connected to this storage tank 41a is connected to the mixing body 490 via a second valve 492. During substrate processing, the second valve 492 is opened as needed, thereby supplying the pharmaceutical solution in the other storage tank 41a into the interior of the mixing body 490. In this way, the second valve 492 is provided in the mixing valve 49 at the inlet for other liquids flowing into the mixing body 490.

[0058] Additionally, the fourth valve 494 of the mixing valve 49 is connected to one end of the drain line 498. The other end of the drain line 498 is connected to the drain recovery unit 39. By opening the fourth valve 494, the liquid inside the mixing body 490 can be discharged to the drain recovery unit 39. The fourth valve 494 is provided at the drain port leading to the outside of the mixing body 490 in the mixing valve 49. Three or more valves may also be provided in the mixing valve 49.

[0059] Figure 5 This diagram illustrates the state of the processing solution supply line 4 during substrate processing, corresponding to... Figure 3 . Figure 5In the diagram, thick solid lines represent the flow paths of the pharmaceutical solution, pure water, and diluted pharmaceutical solution. During substrate processing in the substrate processing apparatus 10, the pharmaceutical solution is supplied from the pharmaceutical solution supply source 82 via the primary side connecting pipe 52, the pharmaceutical solution inlet pipe 33, and the pharmaceutical solution branch pipes 34a and 34b, and stored in the auxiliary tanks 30a and 30b.

[0060] In this embodiment, each auxiliary tank 30a and 30b is equipped with a non-contact upper liquid level sensor L11 and a lower liquid level sensor L12. The upper liquid level sensor L11 is installed at the upper part of the auxiliary tanks 30a and 30b (for example, above the center in the vertical direction), and the lower liquid level sensor L12 is installed at the lower part of the auxiliary tanks 30a and 30b. When the liquid level in the auxiliary tanks 30a and 30b reaches the position of the upper liquid level sensor L11 (i.e., when the output of the upper liquid level sensor L11 indicates that liquid has been detected), the valve 341 is closed to stop the supply of medicine to the auxiliary tanks 30a and 30b. When the liquid level in the auxiliary tanks 30a and 30b is located below the position of the lower liquid level sensor L12 (i.e., when the output of the lower liquid level sensor L12 indicates that liquid has not been detected), the valve 341 is opened to supply medicine to the auxiliary tanks 30a and 30b. As level sensors L11 and L12, various types of sensors, such as capacitive, ultrasonic, and laser sensors, can be used. The same applies to level sensors L13 and L14, which will be described later. The liquid level height in auxiliary tanks 30a and 30b can also be obtained using a camera, etc. Alternatively, the liquid level height in auxiliary tanks 30a and 30b can be inferred from the cumulative flow rate obtained by flow meters installed in the flow paths (inflow and outflow paths) connected to auxiliary tanks 30a and 30b, or from the liquid inflow or outflow time. The same applies to storage tank 41.

[0061] The drug solutions in auxiliary tanks 30a and 30b are supplied to the pure water inlet line 31 via drug supply lines 35a and 35b. In the pure water inlet line 31, pure water is introduced from the pure water supply source 81 via the primary side connection pipe 51, and the drug solutions from the auxiliary tanks 30a and 30b mix with the pure water flowing in the pure water inlet line 31. This generates a diluted drug solution, which is then supplied to the storage tank 41. At this time, the flow rate of the pure water is adjusted by the flow rate adjustment unit 361, and the flow rate of the drug solution is adjusted by the flow rate adjustment unit 362. Therefore, the diluted drug solution, diluted to the required concentration, is stored in the storage tank 41. The pure water inlet line 31 becomes the flow path for the pure water used for dilution.

[0062] Similar to auxiliary tanks 30a and 30b, storage tank 41 is equipped with a non-contact upper liquid level sensor L13 and a lower liquid level sensor L14. The upper liquid level sensor L13 is installed at the upper part of storage tank 41 (e.g., above the center in the vertical direction), and the lower liquid level sensor L14 is installed at the lower part of storage tank 41. The upper liquid level sensor L13 is located below the vent 416. When the liquid level of the diluted medicine in storage tank 41 reaches the position of the upper liquid level sensor L13, the switching valves of flow adjustment units 361 and 362 are closed, stopping the supply of diluted medicine to storage tank 41. This prevents the diluted medicine in storage tank 41 from leaking to the outside through the vent 416. When the liquid level of the diluted medicine in storage tank 41 is below the position of the lower liquid level sensor L14, the switching valves of flow adjustment units 361 and 362 are opened, supplying diluted medicine to storage tank 41. In addition, a mist collector is installed in the exhaust pipe that connects to the outside through the vent 416, and the vapor of the diluted medicine in the storage tank 41 is captured by the mist collector.

[0063] The diluted medicine solution in storage tank 41 was taken out to Figure 2 The output line 42 is shown, and the solution flows continuously in both the first circulation path 460 and the second circulation path 470. At this time, based on the temperature measured by thermometer 423, heater 422 is controlled to maintain a substantially constant temperature of the diluted solution flowing in the first circulation path 460 and the second circulation path 470. At the mixing valve 49 of each branch line 48, the solution is opened... Figure 4 The first valve 491 and the third valve 493 shown, the diluted drug solution flowing in the second circulation path 470, are supplied to the treatment fluid nozzle 26. Figure 2 Inside chamber 21, a processing liquid nozzle 26 is positioned above the substrate 9 at a supply location. Thus, a diluted pharmaceutical solution is sprayed from the processing liquid nozzle 26 toward the substrate 9 as the processing liquid. Pure water from the pure water supply source 81 and pharmaceutical solution from the pharmaceutical solution supply source 82 are the components contained in the processing liquid. Other types of pharmaceutical solutions can also be further mixed with the diluted pharmaceutical solution in the mixing valve 49. Alternatively, undiluted pharmaceutical solution can also be used as the processing liquid.

[0064] The treatment liquid ejected from the treatment liquid nozzle 26 may be, for example, hydrofluoric acid, sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia, hydrogen peroxide solution, organic acid, organic base, surfactant, preservative, or a mixture containing any of these. An example of such a mixture is SPM (sulfuric acid-hydrogen peroxide solution) or SC1 (ammonia-hydrogen peroxide solution). The treatment liquid may also contain pure water as a solvent.

[0065] Next, refer to Figure 6 The cleaning process for the substrate processing apparatus 10 (hereinafter referred to as "apparatus cleaning process") will be described. Figure 6The image shows only the device cleaning process using pure water from pure water supply source 81. As described below, the device cleaning process using pharmaceutical solution from pharmaceutical solution supply source 82 is performed in the same manner. Figure 6 In this process, all processes except for step S11 described later can be performed either by an operator or by the control unit 100. Here, it is assumed that when the substrate processing apparatus 10 is moved from the manufacturing site to the installation site and installed there (so-called startup), the following steps are performed: Figure 6 The device undergoes cleaning and treatment. As described below, Figure 6 The cleaning process for the device can also be carried out at times other than startup.

[0066] Figures 7A to 7D This is a diagram used to illustrate the cleaning process of the device, corresponding to Figure 3 In the device cleaning process, firstly, the operator connects the inlet 310 of the treatment solution supply line 4 to the pure water supply source 81 via the primary side connection pipe 51 (step S11). The primary side connection pipe 51 is, for example, a pipe formed of resin. Typically, the primary side connection pipe 51 is not installed at the inlet 310 at the manufacturing site of the substrate processing apparatus 10, but is installed at the inlet 310 when the substrate processing apparatus 10 is set up at the installation site.

[0067] Next, with valve 311 near the inlet 310 and valve 319 of the drain line 318 open, pure water is supplied from the pure water supply source 81 to the primary side connection pipe 51. Thus, as... Figure 7A As shown by the thick solid line, pure water flows from the pure water supply source 81 through the primary side connecting pipe 51 and the inlet 310 into the drain pipe 318, and is discharged to the drain recovery unit 39. The pure water flows continuously in the primary side connecting pipe 51, the inlet 310, and the drain pipe 318 for a relatively long time. As a result, the primary side connecting pipe 51 is cleaned (step S12). The continuous liquid flow is also called rinsing. At this time, the valves 321 of the pure water branch lines 32a and 32b, and the switch valve of the flow adjustment unit 361 are closed, and pure water does not flow into the auxiliary tanks 30a and 30b and the storage tank 41. In the pure water inlet line 31, a valve may also be installed between the connection position of the drain pipe 318 and the connection position of the pure water branch line 32a, and this valve is closed.

[0068] In the pure water path of the treatment fluid supply line 4, if a drain line 318 is connected between the auxiliary tanks 30a, 30b and the storage tank 41 and the inlet 310, then the drain line 318 can be considered to be located near the inlet 310. Alternatively, a drain line can be connected to the primary side connecting pipe 51 near the connection point with the treatment fluid supply line 4 (i.e., the inlet 310), and pure water can be discharged from this drain line to clean the primary side connecting pipe 51. When the connection point of the drain line in the primary side connecting pipe 51 is closer to the inlet 310 than the pure water supply source 81, the drain line can be considered to be located near the inlet 310. Preferably, the drain line 318 is a branch line from the pure water supply source 81 toward the storage tank 41, located closest to the inlet 310. The same applies to the drain line 338 in the drug solution inlet line 33.

[0069] When pure water flows continuously from the pure water supply source 81 to the drain line 318 for a specified time, the valve 319 of the drain line 318 is closed, and the switch valve of the flow regulating unit 361 is opened. Thus, as... Figure 7B As shown by the thick solid line, pure water flows from the pure water supply source 81 into the storage tank 41 via the primary side connecting pipe 51 and the pure water inlet pipe 31. Additionally, the valve 419 of the drain pipe 418 connected to the storage tank 41 is opened, and the pure water flowing into the storage tank 41 is immediately discharged to the drain recovery unit 39 via the drain pipe 418. In this way, the pure water inlet pipe 31, i.e., the flow path of the pure water for dilution, is cleaned (step S13). At this time, since the primary side connecting pipe 51 has been cleaned, it is possible to more reliably prevent particles adhering to the primary side connecting pipe 51 from contaminating the treatment liquid supply pipe 4 (here, the pure water inlet pipe 31).

[0070] When the pure water in the pure water inlet pipeline 31 has been flowing continuously for a specified time, the switch valve of the flow adjustment unit 361 is closed, and the valves 321 of the pure water branch pipelines 32a and 32b are opened. Thus, as... Figure 7C As shown by the thick solid line, pure water flows from the pure water supply source 81 through the primary side connecting pipe 51 and a portion of the pure water inlet pipe 31 into the pure water branch pipes 32a and 32b to supply pure water to the auxiliary tanks 30a and 30b. At this time, in the auxiliary tanks 30a and 30b, the upper liquid level sensor L11 is moved by the operator to a position between the quantitative position during substrate processing and the bottom surface (for example, approximately the center position between the two, hereinafter referred to as "position 1"). Figure 7CIn the diagram, the upper liquid level sensor L11, positioned at the first position, is indicated by a double-dotted line. Furthermore, the metering position during substrate processing can be any position lower than the top surface of the auxiliary tanks 30a and 30b, and the first position can be any position higher than the bottom surface and lower than the metering position (the same applies to the metering position and the first position of the storage tank 41). When the level of pure water in the auxiliary tanks 30a and 30b reaches the position of the upper liquid level sensor L11 (i.e., when pure water accumulates to the first position of the auxiliary tanks 30a and 30b), the supply of pure water from the pure water supply source 81 to the auxiliary tanks 30a and 30b is stopped by closing the valve 321 of the pure water branch lines 32a and 32b.

[0071] Next, the interiors of auxiliary tanks 30a and 30b are pressurized, and the pure water in auxiliary tanks 30a and 30b is discharged through the liquid supply lines 35a and 35b. When discharging the pure water, valve 359 of drain line 358 is opened, and the pure water flowing in liquid supply lines 35a and 35b is discharged through drain line 358 to drain recovery section 39. Figure 7C In the diagram, the path of pure water from auxiliary tanks 30a and 30b to the drain recovery unit 39 is represented by a thick dashed line. Furthermore, the switch valve of the flow adjustment unit 362 is closed. When the level of pure water in auxiliary tanks 30a and 30b is below the lower level sensor L12 (i.e., after the output of the lower level sensor L12 indicates that no liquid has been detected) for a specified period of time, it is determined that all pure water in auxiliary tanks 30a and 30b has been drained, and the valve 359 of the drain line 358 is closed. The phrase "all liquid drained" in this specification should be understood based on the output of sensors, etc., and does not necessarily mean that all liquid must be completely drained.

[0072] In auxiliary tanks 30a and 30b, pure water is stored to the first position and then discharged repeatedly. This constitutes the first cleaning, i.e., cleaning the lower portion of the first position in auxiliary tanks 30a and 30b (step S14). The storage and discharge of pure water during the first cleaning process in auxiliary tanks 30a and 30b can also be performed only once.

[0073] After the first cleaning of auxiliary tanks 30a and 30b is completed, the operator returns the upper liquid level sensor L11 to the quantitative position during substrate processing, which is higher than the first position. Figure 7CThe position of the upper liquid level sensor L11, shown by the solid line, is hereinafter referred to as the "second position". Furthermore, the second position can be any position that is lower than the top surface of the auxiliary tanks 30a and 30b and higher than the first position (the second position of the storage tank 41 is the same). Then, pure water is supplied to the auxiliary tanks 30a and 30b from the pure water supply source 81 in the same manner as the first cleaning. When the level of the pure water in the auxiliary tanks 30a and 30b reaches the position of the upper liquid level sensor L11 (the second position), the supply of pure water from the pure water supply source 81 to the auxiliary tanks 30a and 30b is stopped. Next, the pure water in the auxiliary tanks 30a and 30b is discharged to the drainage recovery unit 39 via the liquid supply lines 35a and 35b and the drainage line 358. When the water level in the auxiliary tanks 30a and 30b is below the lower level sensor L12 after a specified time, it is determined that all the pure water in the auxiliary tanks 30a and 30b has been discharged, and the valve 359 of the drain line 358 is closed.

[0074] In auxiliary tanks 30a and 30b, pure water is stored to the second position and then discharged repeatedly. This constitutes a second cleaning process, specifically cleaning the upper portion of the auxiliary tanks 30a and 30b at the first position (more precisely, between the first and second positions) (step S15). The storage and discharge of pure water during the second cleaning process in auxiliary tanks 30a and 30b can also be performed only once.

[0075] After the second cleaning of auxiliary tanks 30a and 30b is completed, pure water is supplied to auxiliary tanks 30a and 30b from the pure water supply source 81. When the pure water level reaches the position of the upper liquid level sensor L11, the supply of pure water from the pure water supply source 81 to the auxiliary tanks 30a and 30b is stopped. Additionally, the switching valves of the flow adjustment units 361 and 362 are opened. Thus, as... Figure 7D As shown by the thick solid line, the pure water flowing in the pure water inlet line 31 mixes with the pure water flowing in the drug supply line 35a and is then supplied to the storage tank 41. Furthermore, in the auxiliary tanks 30a and 30b, when the pure water level is below the lower level sensor L12, pure water is supplied (replenished) from the pure water supply source 81 to the auxiliary tanks 30a and 30b. The same applies below.

[0076] In the storage tank 41, the upper liquid level sensor L13 is moved by the operator to a position between the quantitative position during substrate processing and the bottom surface (e.g., a position approximately in the middle between the two, hereinafter referred to as "position 1"). Figure 7DIn the diagram, the upper liquid level sensor L13, positioned at the first position, is indicated by a double-dotted line. When the level of pure water in the storage tank 41 reaches the position of the upper liquid level sensor L13 (i.e., when pure water accumulates to the first position of the storage tank 41), the supply of pure water to the storage tank 41 is stopped by closing the switching valves of the flow adjustment units 361 and 362. In the processed liquid supply line 4, the upstream flow path relative to the storage tank 41 (in...) Figure 7D In the example, the pure water inlet line 31, pure water branch lines 32a and 32b, auxiliary tanks 30a and 30b, and drug supply lines 35a and 35b have been cleaned. Therefore, even when storing pure water in the storage tank 41, it is possible to more reliably suppress the contamination of the storage tank 41 by particles adhering to the upstream flow path.

[0077] Next, open valve 419 of drain line 418 to discharge the pure water in storage tank 41 to drain recovery unit 39 via drain line 418. Figure 7D In the diagram, a thick dashed line represents the path of pure water from storage tank 41 to drain recovery unit 39. When the level of pure water in storage tank 41 is lower than the lower level sensor L14 (i.e., after the output of the lower level sensor L14 indicates that no liquid has been detected) and a specified time has elapsed, it is determined that all pure water in storage tank 41 has been drained, and valve 419 of drain line 418 is closed.

[0078] In the storage tank 41, pure water is stored to the first position and all pure water in the storage tank 41 is discharged repeatedly. Thus, the first cleaning is performed, that is, the lower part of the storage tank 41 at the first position is cleaned (step S16). The storage and discharge of pure water in the first cleaning process of the storage tank 41 can also be performed only once.

[0079] After the first cleaning of storage tank 41 is completed, the operator returns the upper liquid level sensor L13 to the quantitative position during substrate processing, which is higher than the first position. Figure 7D The position of the upper liquid level sensor L13 (hereinafter referred to as "position 2") is shown by the solid line. Then, pure water is supplied to the storage tank 41 in the same manner as the first cleaning. When the liquid level of the pure water in the storage tank 41 reaches the position of the upper liquid level sensor L13 (position 2), the supply of pure water to the storage tank 41 is stopped. Next, the pure water in the storage tank 41 is discharged to the drainage recovery unit 39 via the drainage line 418. When the liquid level of the pure water in the storage tank 41 is below the lower liquid level sensor L14 for a specified time, it is determined that all the pure water in the storage tank 41 has been discharged, and the valve 419 of the drainage line 418 is closed.

[0080] In storage tank 41, pure water is stored to the second position and then discharged repeatedly. This constitutes a second cleaning, specifically cleaning the upper portion of storage tank 41 at the first position (more precisely, between the first and second positions) (step S17). The storage and discharge of pure water during the second cleaning process of storage tank 41 can also be performed only once.

[0081] Figure 8A and Figure 8B This is a diagram used to illustrate the cleaning process of the device, corresponding to Figure 2 After the second cleaning of storage tank 41 is completed, pure water is stored in storage tank 41 to the second position. Next, valve 431 of the first return line 43 and valve 441 of the second return line 44 are opened, and pump 421 begins its liquid delivery operation, thereby introducing pure water from storage tank 41 into take-off line 42. The flow of pure water in take-off line 42 branches into the first return line 43 and the second return line 44 at connection point 420. Pure water flowing into the first return line 43 flows to the end opposite to connection point 420 and returns to storage tank 41. Pure water flowing into the second return line 44 also flows to the end opposite to connection point 420 and returns to storage tank 41. Figure 8A In the diagram, the first circulation line 46 (extraction line 42 and first return line 43) and the second circulation line 47 (extraction line 42 and second return line 44) with pure water flow are represented by thick solid lines.

[0082] In this way, pure water circulates in a first circulation path 460 containing a storage tank 41 and a first circulation line 46, and also in a second circulation path 470 containing a storage tank 41 and a second circulation line 47. At this time, the temperature of the pure water circulating in the first circulation path 460 and the second circulation path 470 (hereinafter referred to as the "first temperature") is relatively low. In this processing example, since the heater 422 is in the off state, the first temperature is ambient temperature. In the processing liquid supply line 4, the upstream flow path relative to the first circulation path 460 and the second circulation path 470 (in...) Figure 8A In the example, the storage tank 41, the pure water inlet pipeline 31, etc. have been cleaned, so it is possible to more reliably suppress the contamination of the first circulation flow path 460 and the second circulation flow path 470 by particles attached to the upstream flow path.

[0083] When the circulation of pure water in the first circulation path 460 and the second circulation path 470 continues for a specified time, the pump 421 stops its liquid delivery operation. This stops the circulation of pure water in the first circulation path 460 and the second circulation path 470. Additionally, the valve 419 of the drain line 418 is opened, discharging the pure water in the storage tank 41 to the drain recovery unit 39 via the drain line 418. In other words, the pure water in the first circulation path 460 and the second circulation path 470 is discharged outside the circulation paths. At this time, the flow adjustment units 361 and 362 (see reference)... Figure 7D When the switch valve is closed, no new pure water will be supplied to the storage tank 41. After a specified time has elapsed since the level of pure water in the storage tank 41 is below the lower level sensor L14, it is determined that all the pure water in the storage tank 41 has been discharged, and the valve 419 of the drain line 418 is closed.

[0084] As described above, a first cycle cleaning is performed by circulating pure water at a first temperature (here, room temperature) in the first circulation flow path 460 and the second circulation flow path 470, and then discharging the pure water from the first circulation flow path 460 and the second circulation flow path 470, thereby cleaning the first circulation flow path 460 and the second circulation flow path 470 (step S18). The first cycle cleaning can also be repeated multiple times (as are the second and third cycle cleanings and additional cleanings described later).

[0085] After the first cycle of cleaning is completed, the switch valves of the flow adjustment units 361 and 362 are opened, allowing pure water to be stored in the storage tank 41 to the second position. Next, similar to the first cycle of cleaning, the pure water is circulated in the first circulation path 460 and also in the second circulation path 470 by starting the liquid delivery action of the pump 421. At this time, the pure water circulating in the first circulation path 460 and the second circulation path 470 is heated by the heater 422, which is in the on state. Specifically, through the control of the heater 422 by the control unit 100, the pure water is heated to a second temperature (e.g., 40–60°C) that is higher than the first temperature but lower than the high-temperature cleaning temperature described later.

[0086] When the circulation of pure water at the second temperature in the first circulation path 460 and the second circulation path 470 continues for a specified time, the pump 421 stops delivering liquid. Additionally, the valve 419 of the drain line 418 is opened, and the pure water in the storage tank 41 is discharged to the drain recovery unit 39 via the drain line 418. As described above, the second circulation cleaning is performed by circulating pure water at the second temperature in the first circulation path 460 and the second circulation path 470, and then discharging the pure water from the first circulation path 460 and the second circulation path 470, thereby cleaning the first circulation path 460 and the second circulation path 470 (step S19). Furthermore, after the second circulation cleaning at the second temperature, a further circulation cleaning at a third temperature higher than the second temperature but lower than the high-temperature cleaning temperature may be performed.

[0087] After the second cycle of cleaning is completed, an ammonia supply source (not shown) is installed on the treatment fluid supply line 4. Ammonia is supplied from the ammonia supply source to the storage tank 41 as additional cleaning fluid and stored in position 2. Then, similar to the first and second cycles of cleaning, the ammonia is circulated in the first circulation path 460 and also in the second circulation path 470 by starting the pump 421. Particles adhering to the interior of the first and second circulation paths 460 are more easily removed from the ammonia compared to pure water. The ammonia circulating in the first and second circulation paths 460 and 470 can also be heated by the heater 422, which is in the on state.

[0088] When supplying ammonia water to the storage tank 41, the ammonia water supply source and the storage tank 41 can be directly connected via other pipelines (not shown in the diagram), or the ammonia water supply source can be connected to the pure water inlet pipeline 31, outlet pipeline 42, first return pipeline 43, or second return pipeline 44, etc. Alternatively, ammonia water can also be supplied to the storage tank 41 via auxiliary tanks 30a and 30b.

[0089] When the circulation of ammonia in the first circulation path 460 and the second circulation path 470 continues for a specified time, the pump 421 stops delivering liquid. Additionally, valve 419 of the drain line 418 is opened to discharge all ammonia in the storage tank 41 to the drain recovery unit 39 via the drain line 418. As described above, additional cleaning is performed by circulating ammonia in the first circulation path 460 and the second circulation path 470 and then discharging the ammonia from the first circulation path 460 and the second circulation path 470, thereby cleaning the first circulation path 460 and the second circulation path 470 (step S20).

[0090] During additional cleaning, an additional cleaning solution other than ammonia may be used. The additional cleaning solution is preferably an acidic or alkaline liquid, thereby thoroughly cleaning the first circulation path 460 and the second circulation path 470. During additional cleaning, the ammonia contained in the ammonia solution in the storage tank 41 will evaporate, and ammonia-containing substances may adhere to the top surface 412 of the storage tank 41 and the portion of the side surface of the storage tank 41 that is higher than the liquid surface (hereinafter referred to as "top surface 412, etc."). The reaction products of this substance with the pharmaceutical solution, etc., may form particles. Additionally, particles may also adhere to the top surface 412, etc. In the device cleaning process, following the additional cleaning, the top surface 412, etc. of the storage tank 41 is cleaned. In this processing example, pure water is used as the cleaning solution when cleaning the top surface 412, etc.

[0091] Specifically, after the additional cleaning is completed, the ammonia supply source is disconnected from the treatment fluid supply line 4. Additionally, the switch valves of the flow adjustment units 361 and 362 are opened, allowing pure water, which serves as the cleaning fluid, to be stored in the storage tank 41 at position 2. Next, similar to the first and second cycle cleaning, the pure water is circulated in the first cycle flow path 460 and also in the second cycle flow path 470 by starting the pump 421. At this time, the pure water circulating in the first and second cycle flow paths 460 is heated by the heater 422, which is in the on state. Specifically, the pure water is heated to a temperature higher than the first and second temperatures (hereinafter referred to as the "high-temperature cleaning temperature") by the control unit 100 controlling the heater 422. The high-temperature cleaning temperature is, for example, 65°C or higher, preferably 70°C or higher, and more preferably 75°C or higher. The upper limit of the high-temperature cleaning temperature is, for example, the boiling point of the cleaning fluid (here, pure water). In the following description, the cleaning fluid used for high-temperature cleaning will be referred to as "high-temperature cleaning fluid".

[0092] High-temperature cleaning fluid is continuously supplied to storage tank 41 from the first circulation line 46 and the second circulation line 47. Within storage tank 41, cleaning fluid vapor is generated, such as… Figure 8B As shown by the small circles, the cleaning fluid condenses on the top surface 412, etc. When excess substances such as ammonia or particles adhere to the top surface 412, etc., these excess substances will dissolve in the cleaning fluid or mix with the cleaning fluid. Clumps (droplets, etc.) of the cleaning fluid containing these excess substances will fall into the cleaning fluid stored in the storage tank 41, or flow into the cleaning fluid along the side, etc. In this way, the top surface 412, etc., is cleaned by the cleaning fluid (step S21).

[0093] In step S21, the residual additional cleaning fluid in the first circulation path 460 and the second circulation path 470 is replaced with pure water as high-temperature cleaning fluid, and the particles solidified in the first circulation path 460 and the second circulation path 470 can also be peeled off and removed by the high-temperature cleaning fluid. When the temperature of the high-temperature cleaning fluid is 75-85°C, sudden boiling of pure water and malfunction of flow meters can be avoided, and a sufficient amount of cleaning fluid vapor is generated. When the supply of high-temperature cleaning fluid to the storage tank 41 (circulation of high-temperature cleaning fluid in the first circulation path 460 and the second circulation path 470) continues for a specified time, the pump 421 stops its liquid delivery operation. In addition, the valve 419 of the drain line 418 is opened, and all the high-temperature cleaning fluid in the storage tank 41 is discharged to the drain recovery unit 39 via the drain line 418.

[0094] When substances generated by the added cleaning fluid adhere to the top surface 412, the high-temperature cleaning fluid is effective in cleaning the top surface 412 of the storage tank 41. In other words, when the substances contained in the added cleaning fluid have a vapor pressure higher than that of pure water at room temperature and a boiling point lower than that of pure water, i.e., when they are volatile substances with higher volatility than pure water, it is preferable to use the high-temperature cleaning fluid to clean the top surface 412. When the added cleaning fluid is an aqueous solution, the high-temperature cleaning fluid, which is water, can efficiently remove the substances adhering to the top surface 412 of the storage tank 41. The cleaning of the top surface 412 of the storage tank 41 can also be repeated multiple times.

[0095] After the top surface 412 of the storage tank 41 is cleaned, the switch valves of the flow adjustment units 361 and 362 are opened to store pure water in the second position within the storage tank 41. Next, the pump 421 is activated to circulate the pure water in the first circulation path 460 and also in the second circulation path 470. At this time, the heater 422 can be either on or off. Then, the mixing valve 49 is activated, causing the pure water in the second circulation path 470 to flow into the branch line 48 and be supplied to the mixing valve 49.

[0096] Figure 9A and Figure 9B This is a diagram used to illustrate the cleaning process of the device, corresponding to Figure 4 In mixing valve 49, by opening valve 491, and as... Figure 9A As shown by the thick solid line, pure water in the second circulation path 470 is supplied to the mixing body 490 via branch line 48. Additionally, by opening the fourth valve 494, the pure water in the mixing body 490 is discharged to the drainage recovery unit 39 via the drainage line 498. This cleans the mixing body 490 (step S22). Figure 9A In the diagram, parallel diagonal lines are added inside the mixing body 490 to indicate that the interior is filled with pure water. Figure 9B (Similarly). In the processing fluid supply line 4, most of the flow path upstream of the mixing valve 49 (here, the second circulation flow path 470, the storage tank 41, etc.) has been cleaned. Therefore, it is possible to more reliably suppress the contamination of the mixing valve 49 by particles adhering to the upstream flow path. In the process of step S22, the amount of pure water in the storage tank 41 will decrease. However, when the liquid level of the pure water in the storage tank 41 is located below the lower liquid level sensor L14, the flow adjustment units 361 and 362 are controlled to replenish the pure water into the storage tank 41 (the same applies to step S23 described later).

[0097] When pure water is continuously supplied to and discharged from the mixing body 490 for a specified time, valve 494 is closed and valve 3 is opened. Thus, as... Figure 9B As shown by the thick solid line, pure water within the mixing body 490 is supplied to the processing liquid nozzle 26. The pure water ejected from the processing liquid nozzle 26 is caught by the receiving cup 23 and discharged to the outside of the chamber 21 via the drain port (see Figure 26). Figure 2 Thus, the treatment fluid nozzle 26 is cleaned with pure water (step S23). In the treatment fluid supply line 4, most of the flow path upstream of the treatment fluid nozzle 26 (here, the mixing valve 49, the second circulation flow path 470, etc.) has been cleaned, thus more reliably preventing particles adhering to this upstream flow path from contaminating the mixing valve 49. In fact, through the processes in steps S22 and S23, the entire branch line 48 is also cleaned.

[0098] When pure water is continuously ejected from the treatment fluid nozzle 26 for a specified time, the ejection of pure water from the treatment fluid nozzle 26 is stopped by closing the first valve 491 and the third valve 493 of the mixing valve 49. Through the above steps, Figure 6 The device cleaning process is complete. Steps S22 and S23 can be performed simultaneously on multiple (all) branch lines 48, or individually. In this processing example, during the cleaning of the processing liquid nozzle 26, the substrate 9 (product substrate) is not placed in the chamber 21, but a substrate that will not become a semiconductor product (so-called dummy substrate) can also be placed.

[0099] In fact, the device cleaning process using the drug solution from the drug solution supply source 82 is carried out in the same manner as the device cleaning process using pure water from the pure water supply source 81. Specifically, firstly, the operator connects the device to the primary side connection pipe 52... Figure 3The inlet 330 of the drug solution inlet line 33 is connected to the drug solution supply source 82 (step S11). Next, with the valve 331 near the inlet 330 and the valve 339 of the drain line 338 open, drug solution is supplied from the drug solution supply source 82 to the primary side connecting pipe 52. The drug solution flows into the drain line 338 through the primary side connecting pipe 52 and the inlet 330, and is discharged to the drain recovery unit 39. In this way, the primary side connecting pipe 52 is cleaned (step S12).

[0100] Next, valve 339 of drain line 338 is closed, and valve 341 of branch lines 34a and 34b is opened. Thus, the medicine flows from the medicine supply source 82 through the primary side connecting pipe 52 and the medicine inlet line 33 into the branch lines 34a and 34b, supplying medicine to the auxiliary tanks 30a and 30b. At this time, in the auxiliary tanks 30a and 30b, the upper liquid level sensor L11 is positioned at position 1 by the operator (refer to...). Figure 7C The upper liquid level sensor L11 (with a double-dotted line in the middle) is used. When the liquid level in the auxiliary tanks 30a and 30b reaches the position of the upper liquid level sensor L11, the supply of liquid from the liquid supply source 82 to the auxiliary tanks 30a and 30b is stopped by closing the valve 341 of the liquid branch pipelines 34a and 34b.

[0101] Next, the interiors of auxiliary tanks 30a and 30b are pressurized, and the medicinal liquid in auxiliary tanks 30a and 30b is discharged into the medicinal liquid supply lines 35a and 35b. During the discharge, valve 359 of drain line 358 is opened, and the medicinal liquid flowing in the medicinal liquid supply lines 35a and 35b is discharged through drain line 358 to drain recovery section 39. After all the medicinal liquid in auxiliary tanks 30a and 30b has been discharged, valve 359 of drain line 358 is closed. The process of storing medicinal liquid in auxiliary tanks 30a and 30b to the first position and discharging all the medicinal liquid in auxiliary tanks 30a and 30b is repeated multiple times. Thus, the first cleaning is performed, that is, the lower part of the auxiliary tanks 30a and 30b at the first position is cleaned (step S14). The storage and discharge of medicinal liquid during the first cleaning process of auxiliary tanks 30a and 30b can also be performed only once. Furthermore, in the cleaning process of devices using chemical solutions, the following steps are omitted. Figure 6 Step S13.

[0102] After the first cleaning of auxiliary tanks 30a and 30b is completed, the operator returns the upper liquid level sensor L11 to the quantitative position (i.e., the second position) above the first position, which is the position used during substrate processing. Liquid is supplied to auxiliary tanks 30a and 30b from the liquid supply source 82. When the liquid level reaches the second position, the supply of liquid from the liquid supply source 82 to the auxiliary tanks 30a and 30b is stopped. Then, the liquid in the auxiliary tanks 30a and 30b is discharged to the drainage recovery unit 39 via the liquid supply lines 35a and 35b and the drainage line 358. The process of storing liquid in auxiliary tanks 30a and 30b to the second position and discharging all liquid from the auxiliary tanks 30a and 30b is repeated multiple times. Thus, a second cleaning is performed, i.e., the upper portion of the auxiliary tanks 30a and 30b at the first position is cleaned (step S15). The storage and discharge of the cleaning solution in the second cleaning process of auxiliary tanks 30a and 30b can also be carried out only once.

[0103] After the second cleaning of auxiliary tanks 30a and 30b is completed, medicine is supplied to auxiliary tanks 30a and 30b from the medicine supply source 82. When the liquid level of the medicine reaches the position of the upper liquid level sensor L11, the supply of medicine from the medicine supply source 82 to auxiliary tanks 30a and 30b is stopped. Meanwhile, the switching valves of flow adjustment units 361 and 362 are opened. As a result, the pure water flowing in the pure water inlet line 31 mixes with the medicine flowing in the medicine supply line 35a, and the diluted medicine is supplied to the storage tank 41. Alternatively, the switching valve of the flow adjustment unit 361 can be kept closed, supplying medicine only to the storage tank 41 (the same applies below).

[0104] In storage tank 41, the upper liquid level sensor L13 is moved to position 1 by the operator (see reference). Figure 7D The upper liquid level sensor L13 (with a double-dotted line) is used. When the liquid level of the diluted medicine in the storage tank 41 reaches the position of the upper liquid level sensor L13, the supply of diluted medicine to the storage tank 41 is stopped by closing the switch valves of the flow adjustment units 361 and 362. Then, the valve 419 of the drain line 418 is opened, and the diluted medicine in the storage tank 41 is discharged to the drain recovery unit 39 through the drain line 418. After all the diluted medicine in the storage tank 41 has been discharged, the valve 419 of the drain line 418 is closed. The process of storing diluted medicine to the first position and discharging all diluted medicine in the storage tank 41 is repeated multiple times. Thus, the first cleaning is performed, that is, the lower part of the storage tank 41 at the first position is cleaned (step S16). The storage and discharge of diluted medicine in the first cleaning process of the storage tank 41 can also be performed only once.

[0105] After the first cleaning of the storage tank 41 is completed, the operator returns the upper liquid level sensor L13 to the quantitative position (i.e., the second position) above the first position, which was used during substrate processing. Similarly, diluent is supplied to the storage tank 41, and when the liquid level reaches the second position, the supply of diluent is stopped. Then, the diluent in the storage tank 41 is discharged to the drainage recovery unit 39 via the drainage line 418. The process of storing diluent to the second position and discharging all diluent from the storage tank 41 is repeated multiple times. Thus, a second cleaning is performed, i.e., cleaning the upper portion of the storage tank 41 at the first position (step S17). The storage and discharge of diluent during the second cleaning process of the storage tank 41 can also be performed only once.

[0106] The processes in steps S18 to S23 use a diluted solution instead of pure water; otherwise, they are the same as the cleaning process using pure water. As described above, in Figure 6 In the device cleaning process, the processing solution supply line 4 is cleaned using a component solution (here, pure water and chemical solution) contained in the processing solution for the substrate 9. In the device cleaning process using chemical solution, some processes, such as the additional cleaning in step S20 or the cleaning of the top surface 412 of the cleaning storage tank 41 in step S21, can be omitted. In addition, the device cleaning process using pure water and the device cleaning process using chemical solution can be performed in parallel to some extent.

[0107] exist Figure 3 In the treatment fluid supply line 4, a supply source for other component liquids contained in the treatment fluid may also be provided, supplying these other component liquids to the storage tank 41. For example, this supply source is connected to the storage tank 41 via a primary side connecting pipe and an inlet pipe for the other component liquid, instead of via auxiliary tanks 30a and 30b. In this case, after connecting the inlet of the inlet pipe for the other component liquid to the supply source via the primary side connecting pipe (step S11), the other component liquid is discharged to the outside via a drain pipe located near the inlet, cleaning the primary side connecting pipe (step S12). After cleaning the primary side connecting pipe, the other component liquid is supplied from the supply source to the storage tank 41 via the primary side connecting pipe and the inlet pipe to clean the inlet pipe, etc. Of course, Figure 3 The pure water supply source 81 and the medicine supply source 82 can also be connected to the storage tank 41 without going through the auxiliary tanks 30a and 30b.

[0108] Alternatively, processing fluid supply lines that do not include a circulation flow path can also be... Figure 6 The device is used for cleaning and treatment. In this case, for example, a pipeline connected at one end to the treatment fluid nozzle 26 ( Figure 2The other end of the branch line 48 is directly connected to the storage tank 41. Furthermore, in the branch line 48, the mixing valve 49 can also be changed to a switch valve or the like. In this case, the cleaning of the mixing valve 49 in step S22 is omitted. The configuration of the treatment fluid supply line can be modified in various ways, and the device cleaning process can also be appropriately modified according to the treatment fluid supply line.

[0109] As explained above, Figure 6 The device cleaning process includes a piping cleaning method for a substrate processing apparatus 10, which includes: a holding part (rotary chuck 22) for holding a substrate 9; a processing liquid nozzle 26 for spraying processing liquid onto the substrate 9; and a processing liquid supply line 4 for supplying processing liquid to the processing liquid nozzle 26. In the installation location of the substrate processing apparatus 10, a supply source for the component liquid contained in the processing liquid (pure water supply source 81 or chemical solution supply source 82) is provided. The piping cleaning method includes: a connection step, in which the inlet ports 310 and 330 of the treatment fluid supply line 4 are connected to the supply source through primary side connection pipes 51 and 52; a first cleaning step, in which the component liquid is introduced from the supply source into the primary side connection pipes 51 and 52, and the component liquid is discharged to the outside through the drain pipes 318 and 338 located near the inlet ports 310 and 330, thereby cleaning the primary side connection pipes 51 and 52; and a second cleaning step, in which, after the first cleaning step, the component liquid is introduced into the treatment fluid supply line 4 through the primary side connection pipes 51 and 52, thereby cleaning the treatment fluid supply line 4.

[0110] In this way, by allowing the component solution to flow in the processing liquid supply line 4 after cleaning the primary side connecting pipes 51 and 52, it is possible to suppress a large area of ​​particles that have been detached from the primary side connecting pipes 51 and 52 from entering the processing liquid supply line 4. As a result, it is possible to suppress adverse conditions caused by these particles in the substrate processing apparatus 10. In the processing example described above, a mixture of multiple component solutions (diluted solution) is used as the processing liquid, but in the substrate processing apparatus 10, the component solution can also be used directly as the processing liquid.

[0111] Preferably, the processing fluid supply line 4 includes a storage tank 41 capable of storing liquid and having a drain outlet 411. The second cleaning process includes a storage tank cleaning process, which involves filling the storage tank 41 with the component liquid and draining the component liquid from the drain outlet 411 to the outside, thereby cleaning the storage tank 41. This allows for the appropriate removal of particles adhering to the storage tank 41. Furthermore, by performing the storage tank cleaning process before the component liquid flows into the downstream side (processing fluid nozzle 26 side) of the storage tank 41 in the processing fluid supply line 4, it is possible to prevent particles from entering the downstream side of the storage tank 41.

[0112] The preferred treatment fluid supply line 4 also includes circulation lines (referred to above as the first circulation line 46 and the second circulation line 47), which draw liquid from one end of the storage tank 41 and return it to the storage tank 41 from the other end. Furthermore, the storage tank 41 and the circulation lines form a circulation path for circulating the liquid (referred to above as the first circulation path 460 and the second circulation path 470). The second cleaning process also includes a circulation path cleaning process, which is performed after the storage tank cleaning process, by circulating the component liquid in the circulation path to clean the circulation path. In this way, by cleaning the storage tank 41 before cleaning the circulation path, it is possible to prevent particles that have been detached from the storage tank 41 from entering the circulation path. Additionally, cleaning the circulation path that circulates the component liquid reduces the consumption of the component liquid.

[0113] The preferred treatment fluid supply line 4 also includes a branch line 48, which branches off from the circulation line and connects to the treatment fluid nozzle 26. Furthermore, the second cleaning step includes the following step: after the circulation path cleaning step, the component solution is introduced into the branch line 48 to clean the treatment fluid nozzle 26. In this way, by cleaning the circulation path before cleaning the treatment fluid nozzle 26, it is possible to prevent particles that have been detached from the circulation path from entering the treatment fluid nozzle 26.

[0114] When the processing fluid supply line 4 is also equipped with a heater 422 for heating the liquid flowing in the circulation path, the circulation path cleaning process preferably includes: a first circulation cleaning, in which a component liquid at a first temperature is circulated in the circulation path to clean the circulation path; and a second circulation cleaning, in which, after the first circulation cleaning, a component liquid at a second temperature higher than the first temperature is circulated in the circulation path to clean the circulation path. In this way, by sequentially increasing the temperature of the component liquid, particles adhering to the circulation path can be gradually detached. As a result, it is possible to prevent a large number of particles from being detached at once and then re-attaching to unwanted parts of the processing fluid supply line 4.

[0115] If the processing fluid supply line 4 does not include a circulation line, the second cleaning step may also include the following step: after the storage tank cleaning step, the component liquid stored in the storage tank 41 is supplied to the processing fluid nozzle 26 to clean the processing fluid nozzle 26. By cleaning the storage tank 41 before cleaning the processing fluid nozzle 26, it is possible to prevent particles that have been detached from the storage tank 41 from entering the processing fluid nozzle 26. Of course, if the processing fluid supply line 4 includes a circulation line, the circulation flow path cleaning step may be omitted after the storage tank cleaning step, and the component liquid may be supplied to the processing fluid nozzle 26 to clean the processing fluid nozzle 26.

[0116] The preferred storage tank cleaning process includes: a first cleaning, in which the component solution is filled into the storage tank 41 to a first position in the vertical direction, and the component solution is discharged to the outside from the drain port 411, thereby cleaning the lower part of the storage tank 41 at the first position; and a second cleaning, after the first cleaning, in which the component solution is filled into the storage tank 41 to a second position above the first position, and the component solution is discharged to the outside from the drain port 411, thereby cleaning the upper part of the storage tank 41 at the first position. This allows particles adhering to the storage tank 41 to be gradually detached. As a result, it is possible to prevent a large number of particles from being detached at once and entering the piping connected to the storage tank 41. The storage tank cleaning process including the first and second cleanings can also be used independently of other cleaning processes. The same applies when auxiliary tanks 30a and 30b are used.

[0117] In the substrate processing apparatus 10, as described above, the processing liquid supply line 4 may also include auxiliary tanks 30a and 30b capable of storing liquid. The liquid in the auxiliary tanks 30a and 30b can be supplied to the storage tank 41. In this case, the second cleaning step preferably includes the following step: cleaning the auxiliary tanks 30a and 30b before the storage tank cleaning step. This prevents particles that have been detached from the auxiliary tanks 30a and 30b from entering the storage tank 41.

[0118] Additionally, the processing fluid supply line 4 may also include a mixing valve 49, which mixes two or more liquids supplied internally. Among the multiple valves provided in the mixing valve 49, a first valve 491 is located at the inlet of the component liquid, a second valve 492 is located at the inlet of other liquids, a third valve 493 is located at the outlet leading to the processing fluid nozzle 26, and a fourth valve 494 is located at the drain outlet leading to the outside. In this case, the second cleaning process preferably includes: a mixing valve cleaning process, in which component liquid is supplied into the mixing valve 49 and discharged from the drain outlet, thereby cleaning the mixing valve 49; and a processing fluid nozzle cleaning process, after the mixing valve cleaning process, in which component liquid is supplied from the mixing valve 49 to the processing fluid nozzle 26 to clean the processing fluid nozzle 26. By cleaning the mixing valve 49 before cleaning the processing fluid nozzle 26, it is possible to prevent particles that have been detached from the mixing valve 49 from entering the processing fluid nozzle 26.

[0119] On the other hand, Figure 6In step S21, the top surface 412 of the storage tank 41 is cleaned by supplying high-temperature cleaning fluid into the interior of the storage tank 41. However, the high-temperature cleaning fluid flowing in the processing fluid supply line 4 can also be supplied into the interior of the chamber 21. Specifically, the high-temperature cleaning fluid flowing in the processing fluid supply line 4 is sprayed from the processing fluid nozzle 26 and supplied into the chamber 21. As a result, cleaning fluid vapor is generated in the chamber 21, and the cleaning fluid condenses on the top and sides of the chamber 21, as well as on the outer surface of the processing fluid nozzle 26 disposed in the chamber 21. As a result, the top surface of the chamber 21 can be cleaned.

[0120] As described above, in the cleaning method of the substrate processing apparatus 10 (the apparatus cleaning method), the substrate processing apparatus 10 includes: a holding part (rotary chuck 22 in the above text) for holding a substrate 9; a processing liquid nozzle 26 for spraying processing liquid onto the substrate 9; a processing liquid supply line 4 for supplying processing liquid to the processing liquid nozzle 26; and a chamber 21, inside which the holding part and the processing liquid nozzle 26 are disposed. Furthermore, the processing liquid supply line 4 includes a storage tank 41 capable of storing liquid. The cleaning method includes: a connection step, connecting a designated cleaning liquid supply source (pure water supply source 81 or chemical liquid supply source 82 in the above text) to the processing liquid supply line 4; and a top surface cleaning step, whereby a high-temperature cleaning liquid obtained by heating the cleaning liquid to a temperature higher than room temperature flows in the processing liquid supply line 4 and is supplied to the interior of the storage tank 41 or the chamber 21, i.e., the target space, thereby generating cleaning liquid vapor in the target space and causing the cleaning liquid to condense on the top surface and / or side surface of the target space. In this way, by using a high-temperature cleaning fluid, the top and / or sides of the object space can be easily cleaned.

[0121] When the target space is a storage tank 41, it is preferable to fill the storage tank 41 with high-temperature cleaning fluid during cleaning processes such as the top surface cleaning process, up to a position lower than the vent 416 provided in the storage tank 41. This prevents the high-temperature cleaning fluid from leaking to the outside during cleaning processes such as the top surface cleaning process. Depending on the structure of the storage tank 41, the vent 416 may also be omitted.

[0122] The preferred processing liquid supply line 4 also includes: circulation lines (referred to above as the first circulation line 46 and the second circulation line 47), which, together with the storage tank 41, form a circulation path for circulating liquid (referred to above as the first circulation path 460 and the second circulation path 470) by taking liquid from one end of the storage tank 41 and returning it to the storage tank 41 from the other end; and a heater 422 to heat the liquid flowing in the circulation path. Furthermore, in cleaning processes such as the top surface cleaning process, the cleaning liquid circulating in the circulation path is heated by the heater 422. This allows for easy preparation of high-temperature cleaning liquid. Additionally, it reduces the amount of cleaning liquid consumed and thoroughly cleans the circulation lines. Furthermore, it enables parallel cleaning of the top surface of the target space and the circulation lines, i.e., it enables efficient cleaning of the substrate processing apparatus 10.

[0123] In this case, the preferred cleaning method further includes the following step: before cleaning steps such as the top surface, cleaning the circulation path by circulating a cleaning solution with a temperature lower than that of the high-temperature cleaning solution within the circulation path and then discharging the cleaning solution to the outside of the circulation path. By cleaning the circulation path with a low-temperature (e.g., room temperature) cleaning solution before using the high-temperature cleaning solution, it is possible to suppress the large number of particles from being detached from the circulation path and entering the treatment fluid nozzle 26, etc., during cleaning with the high-temperature cleaning solution.

[0124] When the storage tank 41 has a drain port 411, the cleaning method preferably further includes the following steps: before cleaning steps such as the top surface, the storage tank 41 is cleaned by filling it with a cleaning solution at a temperature lower than that of the high-temperature cleaning solution, and then draining the cleaning solution from the drain port 411 to the outside. In this way, by cleaning the storage tank 41 with a low-temperature cleaning solution before using the high-temperature cleaning solution, it is possible to prevent a large number of particles from detaching from the storage tank 41 and entering the treatment fluid nozzle 26, etc., during the cleaning process using the high-temperature cleaning solution.

[0125] Alternatively, other cleaning solutions can be supplied to the storage tank 41 before the cleaning processes on the top surface, etc. These other cleaning solutions are acidic or alkaline liquids. In this case, the storage tank 41 and the like can be cleaned more effectively using the acidic or alkaline other cleaning solutions. Furthermore, for the top surface and the like of the object space where the other cleaning solution has adhered, a high-temperature cleaning solution can be used for appropriate cleaning. When the cleaning solution is water, and the other cleaning solution is an aqueous solution, the other cleaning solution adhering to the top surface and the like of the object space can be removed more reliably.

[0126] Various variations can be made during the cleaning process of the device.

[0127] In the treatment fluid supply line 4, for example, a heater can be installed between the storage tank 41 and the pure water supply source 81 (or the medicine supply source 82) to perform the second cycle cleaning (step S19) and the cleaning of the top surface 412 of the storage tank 41 (step S21). In addition, the pure water supply source 81 can also supply heated cleaning fluid (high temperature cleaning fluid, etc.) to the treatment fluid supply line 4.

[0128] The cleaning of auxiliary tanks 30a and 30b, the cleaning of storage tank 41, and the circulation cleaning of the circulation path can be performed after the cleaning process such as the top surface cleaning, or they can be omitted. On the other hand, in order to reduce the amount of particles contained in the cleaning solution and prevent particles from re-adhering to unwanted areas during the cleaning process such as the top surface cleaning, it is preferable to perform the cleaning of auxiliary tanks 30a and 30b, the cleaning of storage tank 41, and the circulation cleaning of the circulation path before the cleaning process such as the top surface cleaning.

[0129] In the described embodiment, in each of steps S18 and S19 (and steps S20 and S21), the first circulation path 460 and the second circulation path 470 are cleaned in parallel (simultaneously). However, the first circulation path 460 and the second circulation path 470 can also be cleaned individually, or only one of them can be cleaned. In one example of cleaning the first circulation path 460 and the second circulation path 470 individually, firstly, the first circulation path 460 is cleaned with the valve 431 of the first return line 43 open and the valve 441 of the second return line 44 closed. Then, the second circulation path 470 is cleaned with the valve 431 of the first return line 43 closed and the valve 441 of the second return line 44 open.

[0130] When cleaning the storage tank 41 and auxiliary tanks 30a and 30b, the storage of cleaning fluid into the tanks and the discharge of cleaning fluid from the tanks can be carried out in parallel. Similarly, during the circulating cleaning of the first circulation path 460 and the second circulation path 470, the circulation of cleaning fluid in the circulation path and the discharge of cleaning fluid from the circulation path can be carried out in parallel.

[0131] The device cleaning process can also be performed at the manufacturing site of the substrate processing apparatus 10. Alternatively, it can be performed after the substrate processing apparatus 10, which is actually used for substrate processing at the installation site, resumes operation following a temporary shutdown (e.g., after maintenance). In this case, the cleaning fluid supply source (e.g., pure water supply source 81) can be pre-connected to the processing fluid supply line 4. On the other hand, during the transport of the substrate processing apparatus 10 from the manufacturing site to the installation site, particles can easily adhere to the constituent parts of the substrate processing apparatus 10. Therefore, the device cleaning process is more preferably performed when the apparatus is installed at the installation site after being transported from the manufacturing site.

[0132] Substrate 9 can also be a substrate other than a semiconductor substrate (e.g., a glass substrate or a printed circuit board).

[0133] The components in the described implementation methods and variations can be appropriately combined as long as they do not contradict each other.

[0134] The invention has been described in detail and is illustrated, but the foregoing description is illustrative and not restrictive. Therefore, it is reasonable to assume that many variations or modifications are possible without departing from the scope of the invention.

[0135] [Explanation of Symbols]

[0136] 4: Processing fluid supply pipeline

[0137] 9: Substrate

[0138] 10: Substrate processing apparatus

[0139] 21: Chamber

[0140] 22: Rotary chuck

[0141] 26: Processing fluid nozzle

[0142] 41: Storage slot (object space)

[0143] 46, 47: Circulation pipelines

[0144] 81: Pure water supply source

[0145] 82: Source of drug solution supply

[0146] 411: Drainage port

[0147] 412: Top surface

[0148] 416: Vent hole

[0149] 422: Heater

[0150] 460, 470: Circulating flow path

[0151] S11~S23: Steps.

Claims

1. A cleaning method for a substrate processing apparatus, The substrate processing apparatus includes: The holding section holds the substrate; A processing liquid nozzle sprays processing liquid onto the substrate; The treatment fluid supply line supplies the treatment fluid to the treatment fluid nozzle; and The chamber is equipped with the holding part and the treatment liquid nozzle; The processing fluid supply pipeline is equipped with a storage tank capable of storing the liquid, and The cleaning method includes the following steps: a) Connect the designated cleaning fluid supply source to the treatment fluid supply line; and b) A high-temperature cleaning solution, obtained by heating the cleaning solution to a temperature above room temperature, is circulated in the treatment solution supply line and supplied to the storage tank or the interior of the chamber, i.e., the object space, thereby generating vapor of the cleaning solution in the object space and causing the cleaning solution to condense on the top and / or side surfaces of the object space.

2. The cleaning method of the substrate processing apparatus according to claim 1, wherein... The object space is the storage slot, and In step b), the high-temperature cleaning fluid is filled into the storage tank until it reaches a position lower than the vent hole provided in the storage tank.

3. The cleaning method of the substrate processing apparatus according to claim 2, wherein... The treatment fluid supply pipeline also includes: A circulation pipeline, by removing the liquid from one end of the storage tank and returning it to the storage tank from the other end, forms a circulation path together with the storage tank for circulating the liquid; and A heater for heating the liquid flowing in the circulation path; and In step b), the cleaning fluid circulating in the circulation path is heated by the heater.

4. The cleaning method of the substrate processing apparatus according to claim 3 further includes the following steps: Before step b), the circulation path is cleaned by circulating the cleaning fluid, which is at a temperature lower than that of the high-temperature cleaning fluid, within the circulation path and then discharging the cleaning fluid to the outside of the circulation path.

5. A cleaning method for a substrate processing apparatus according to any one of claims 2 to 4, wherein... The storage tank has a drain outlet. The cleaning method also includes the following steps: Before step b), the storage tank is cleaned by filling it with the cleaning solution, which is at a temperature lower than that of the high-temperature cleaning solution, and then draining the cleaning solution from the drain outlet to the outside.

6. The cleaning method of the substrate processing apparatus according to any one of claims 2 to 4, wherein Prior to step b), other cleaning solutions are supplied to the storage tank. The other cleaning solutions are acidic or alkaline liquids.

7. The cleaning method of the substrate processing apparatus according to claim 6, wherein... The cleaning solution is water, and the other cleaning solutions are aqueous solutions.

8. A cleaning method for a substrate processing apparatus according to any one of claims 1 to 4, wherein The temperature of the high-temperature cleaning fluid is above 65°C.

9. A cleaning method for a substrate processing apparatus according to any one of claims 1 to 4, wherein The cleaning method is performed after the substrate processing apparatus is moved from the manufacturing site to the installation site and then installed there.

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