Substrate carrying device and substrate processing apparatus

Abstract

The application relates to the technical field of semiconductor equipment, in particular to a substrate bearing device and a substrate processing equipment. The substrate bearing device comprises a bearing unit, at least two support strips, the at least two support strips are arranged in parallel and at intervals, at least one tooth groove for bearing a substrate is arranged on each support strip, a blowing part, a first blowing hole arranged at the bottom of the tooth groove, an air inlet unit in communication with the blowing part, and a controller connected with the air inlet unit and configured to control the air inlet unit to deliver clean gas to the blowing part to blow the clean gas to the substrate through the first blowing hole in the process that the substrate is lowered to the tooth groove by the outside, the upwardly sprayed airflow has an upward supporting force on the substrate, the impact force when the substrate falls on the bottom of the tooth groove is reduced, and the edge of the substrate is prevented from being damaged.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, specifically to a substrate carrier device and a substrate processing device. Background Technology

[0002] Tank-type cleaning equipment typically includes a lifting mechanism and at least one process tank. The process tank contains cleaning fluid for wet cleaning of the substrate. The lifting mechanism carries the substrate and lowers it into the process tank for wet cleaning, as well as lifting the substrate out of the process tank. The lifting mechanism includes multiple toothed grooves for supporting the substrate.

[0003] For example, the process tank includes a chemical tank and a water tank adjacent to the chemical tank. A robotic arm picks up a certain number of substrates, such as 50 or 100 substrates, moves them above the chemical tank, and places them on a lifting mechanism. After receiving the substrates, the lifting mechanism lowers the substrates into the chemical tank, immersing them in the cleaning solution within the chemical tank for a certain period of cleaning.

[0004] After the cleaning process is completed, the lifting mechanism lifts the substrate above the chemical tank, then moves it horizontally above the water tank and lowers it into the water tank, immersing the substrate in the deionized water. After the cleaning process in the water tank is completed, the lifting mechanism lifts the substrate above the water tank, and the robot arm removes the substrate from the lifting mechanism.

[0005] During the process of the robotic arm placing the substrate into the lifting mechanism, after the robotic arm releases the substrate, the substrate has a certain speed under its own gravity. When the substrate falls onto the lifting mechanism, it will collide with the lifting mechanism, which will cause the edges of the substrate to bend, crack, etc., thus affecting the product yield and potentially causing the substrate to be scrapped. Summary of the Invention

[0006] To address the aforementioned problems, the purpose of this application is to provide a substrate support device that can reduce the impact force when the substrate falls onto the substrate support device and prevent damage to the edges of the substrate.

[0007] This application solves the above-mentioned technical problems through the following technical solution:

[0008] A substrate carrier device, comprising:

[0009] The support unit includes at least two support bars, which are arranged in parallel and spaced apart, and each support bar is provided with at least one toothed groove for supporting the substrate;

[0010] The air blowing part includes a first air blowing hole, which is disposed at the bottom of the tooth groove;

[0011] An air intake unit, connected to the air blowing section; and

[0012] The controller, connected to the air intake unit, is configured to: control the air intake unit to deliver cleaning gas to the air blowing section during the process of the substrate descending from the outside to the tooth groove, so as to blow the cleaning gas to the substrate through the first air blowing hole.

[0013] This application also provides a substrate processing apparatus, including a process tank and the aforementioned substrate carrying device, wherein the process tank is used to contain a processing liquid for processing the substrate, and the substrate carrying device is used to lift and lower relative to the bottom of the process tank.

[0014] Compared with the prior art, this application has the following beneficial effects:

[0015] The support bar has a toothed structure along its length to form at least one groove, which is used to support the substrate. The air blowing part includes a first air blowing hole located at the bottom of the groove, and the air intake unit is connected to the air blowing part. As the substrate descends into the groove, the first air blowing hole blows clean gas onto the substrate. The upward-spraying airflow exerts an upward lifting force on the substrate, reducing the impact force when the substrate lands at the bottom of the groove and preventing damage to the edges of the substrate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the substrate carrier device according to an embodiment of this application;

[0017] Figure 2a This is a partial structural diagram of the carrier unit in the embodiments of this application;

[0018] Figure 2b This is a perspective view of the tooth groove in an embodiment of this application;

[0019] Figure 3 This is a partial top view of the substrate support device according to an embodiment of the present application, showing the layout structure of the three support bars;

[0020] Figure 4a This is a partial structural diagram of the carrier unit in another embodiment of this application;

[0021] Figure 4b for Figure 4a A perspective view of the tooth groove in the corresponding embodiment;

[0022] Figure 5a This is a partial structural diagram of the carrier unit in another embodiment of this application;

[0023] Figure 5b This is a perspective view of the tooth groove in another embodiment of this application;

[0024] Figure 6 This is a partial structural diagram of the carrier unit in another embodiment of this application;

[0025] Figure 7 This is a schematic diagram of the substrate processing equipment of this application. Detailed Implementation

[0026] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the embodiments.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] See Figure 1 This application provides a substrate support device, which includes an air intake unit 100, a support unit 200, an air blowing section, and a controller 300. The controller 300 is connected to the air intake unit 100 and is used to control the operation of the air intake unit 100. The air intake unit 100 is connected to the support unit 200. The support unit 200 includes at least two support bars, which are arranged parallel to each other at intervals.

[0029] See Figure 2a Each support bar has a toothed structure 250 on its top surface along its length to form at least one groove 240 for supporting the substrate 400.

[0030] The air blowing part includes a first air blowing hole 241, which is disposed at the bottom 245 of the tooth groove 240.

[0031] The air intake unit 100 is connected to the air blowing section. During the process of the substrate 400 descending from the outside to the tooth groove 240, the controller 300 controls the air intake unit 100 to work. The air intake unit 100 blows clean gas to the substrate 400 through the first air blowing hole 241. The airflow formed by the clean gas sprayed upward from the first air blowing hole 241 has an upward supporting force on the substrate 400, which reduces the impact force when the substrate 400 falls to the bottom of the tooth groove 240 and avoids damage to the edge of the substrate 400.

[0032] Furthermore, since contaminants such as dust particles, metal particles, or oil stains easily adhere to the surface of the substrate 400, the upward-spraying airflow can sweep away contaminants on the surface of the substrate 400 as it descends from the outside into the groove 240, ensuring the cleanliness of the substrate 400 and preventing contaminants from affecting the substrate 400's processing. Simultaneously, the upward-spraying airflow can also blow out contaminants inside the groove 240, reducing their impact on the substrate 400.

[0033] For example, such as Figure 1 and Figure 3 As shown, the support unit 200 includes three support bars: a first support bar 210, a second support bar 220, and a third support bar 230. These three support bars form a stable support structure for supporting the outer periphery of the substrate 400. Specifically, the second support bar 220 supports the bottom end of the substrate 400, and is located below the first support bar 210 and the third support bar 230. The first support bar 210 and the third support bar 230 are respectively positioned on either side of the second support bar 220.

[0034] As an example, a double-row toothed structure can also be provided on the top surface of one or more of the support bars to increase the number of support points. The specific structural form of the support bars is not particularly limited in the embodiments of this application.

[0035] Figure 2a The structure of a portion of the toothed groove in the support strip is shown, with one toothed groove 240 as an example. This toothed groove 240 is located between two adjacent tooth-like structures 250. The toothed groove 240 also includes two sidewalls 246. The thickness of the substrate 400 is adapted to the width of the bottom 245, so that the substrate 400 can be clamped in the toothed groove 240. The lower end groove width of the toothed groove 240 is smaller than the upper end groove width, and the upper end groove width of the toothed groove 240 is larger than the thickness of the substrate 400, so that the substrate 400 can enter the toothed groove 240.

[0036] In one alternative implementation, see [link to relevant documentation] Figure 2b The air intake unit 100 includes a first air vent 110, and the air blowing unit also includes a main air blowing channel 242, which is connected to the first air vent 110 and also connected to a first air blowing hole 241. The first air vent 110 is connected to an external air source and is used to deliver clean gas into the main air blowing channel 242, thereby blowing clean gas into the substrate 400 through the first air blowing hole 241.

[0037] Optional, please continue reading Figure 1The support unit 200 also includes a lifting part 260 and a drive source (not shown). At least two support bars are disposed on the lifting part 260. The drive source is activated to drive at least two support bars to rise and fall simultaneously with the lifting part 260.

[0038] For example, when a cleaning process needs to be performed on the substrate 400, the robot transports the substrate 400 to the top of the support unit 200. The substrate 400 is detached from the robot and falls due to its own weight. During the descent, the controller 300 controls the air intake unit 100 to work, and the first air blowing hole 241 blows cleaning gas onto the substrate 400, which can reduce the impact force when the substrate 400 falls to the bottom of the tooth groove 240.

[0039] After the substrate 400 descends onto the groove 240, the air intake unit 100 stops working, and the first air blowing hole 241 no longer sprays cleaning gas upwards. The drive source operates, driving at least two support bars and the lifting part 260 to descend simultaneously, thereby lowering the substrate 400 into the process tank 500 (see here). Figure 7 The substrate 400 is lowered into the cleaning solution within the process tank 500 to perform a cleaning process on the substrate 400. During the cleaning process, the first air vent 241 does not spray cleaning gas toward the substrate 400. For ease of description, the cleaning or etching processes performed on the substrate are referred to herein as substrate processing processes.

[0040] After the substrate processing is completed, the drive source operates, driving at least two support bars and the lifting unit 260 to rise simultaneously. The support bars carry the substrate 400 up and away from the process tank 500. The robotic arm then removes the processed substrate 400.

[0041] After the robotic arm removes the substrate 400, the controller 300 controls the air intake unit 100 to work, delivering clean gas into the tooth groove 240 through the first air blowing hole 241, further ensuring the cleanliness of the tooth groove 240, and preventing contaminants remaining from the previous process from reacting with the surface of the substrate 400 through the action of the cleaning liquid in subsequent processes, thus causing defects in the substrate 400 and effectively improving the yield of the substrate 400.

[0042] In one alternative implementation, see [link to relevant documentation] Figures 4a-4b The air blowing unit also includes a first air inlet valve (not shown), two second air blowing holes 243, and two side air blowing channels 244. The first air inlet valve is connected to the controller 300 and is located on the main air blowing channel 242. The two second air blowing holes 243 are symmetrically arranged on the side wall 246, and the two side air blowing channels 244 are correspondingly connected to the two second air blowing holes 243. The first air vent 110 is connected to the two side air blowing channels 244.

[0043] For example, when a cleaning process needs to be performed on the substrate 400, the robot transports the substrate 400 to the top of the support unit 200. The substrate 400 is detached from the robot and falls due to its own weight. During the descent, the controller 300 controls the air intake unit 100 to work. The first air passage 110 delivers cleaning gas to the main air blowing channel 242 and the two side air blowing channels 244. The first air blowing hole 241 and the two second air blowing holes 243 blow cleaning gas to the substrate 400, which can reduce the impact force when the substrate 400 falls to the bottom 245.

[0044] After the substrate 400 descends onto the groove 240, the air intake unit 100 stops working, and the first air blowing hole 241 and the two second air blowing holes 243 no longer eject cleaning gas. The drive source operates, driving at least two support bars and the lifting part 260 to descend simultaneously, thereby lowering the substrate 400 into the process tank 500 (see here). Figure 7 The substrate 400 is lowered into the cleaning solution in the process tank 500 to perform a cleaning process on the substrate 400.

[0045] During the cleaning process of substrate 400 in process tank 500, particles tend to accumulate in the grooves 240 and adhere to the edges of substrate 400. Controller 300 controls the first air inlet valve to close, and the main air blowing channel 242 stops supplying cleaning gas. Controller 300 controls the air inlet unit 100 to operate, supplying cleaning gas to the two side air blowing channels 244, so that cleaning gas is blown to both sides of substrate 400 through the second air blowing holes 243, stirring the cleaning liquid and effectively removing contaminants from the grooves 240 and the surface of substrate 400.

[0046] After the cleaning process is completed, the controller 300 stops the air intake unit 100 from operating, and the two second air blowing holes 243 cease to eject cleaning gas. The drive source then operates, driving at least two support bars and the lifting unit 260 to rise simultaneously. The support bars carry the substrate 400 upwards, leaving the process tank 500. The robotic arm then removes the processed substrate 400.

[0047] After the robotic arm removes the substrate 400 from the carrier unit 200, the controller 300 controls the air intake unit 100 to work, delivering clean gas into the tooth groove 240 through the first air blowing hole 241 and the second air blowing hole 243, further ensuring the cleanliness of the tooth groove 240, and preventing contaminants remaining from the previous process on the tooth groove 240 from reacting with the surface of the substrate 400 through the action of the cleaning liquid in subsequent processes, thus causing defects in the substrate 400 and effectively improving the yield of the substrate 400.

[0048] Optionally, the blowing unit includes a side blowing channel 244 and a plurality of second blowing holes 243. The plurality of second blowing holes 243 are interconnected and are symmetrically arranged on two side walls 246. The side blowing channel 244 is connected to the plurality of second blowing holes 243. The first ventilation pipe 110 is connected to the side blowing channel 244 and is used to deliver clean gas to the side blowing channel 244.

[0049] As an example, the number of side air channels 244 and second air holes 243 does not need to correspond one-to-one. The specific number of side air channels 244 and second air holes 243 is not particularly limited in the embodiments of this application.

[0050] In an alternative embodiment, the amount of cleaning gas blown into the substrate 400 by the second air hole 243 on the sidewall 246 remains the same, so that the substrate 400 is stable and remains centered in the groove 240.

[0051] Optionally, multiple second air holes 243 are asymmetrically arranged on the two side walls 246. The air volume of the second air holes 243 on both sides is controlled by the controller 300 so that the substrate 400 is stable and remains centered in the tooth groove 240.

[0052] See Figures 5a-5b In one optional embodiment, the air blowing unit includes a second air inlet valve (not shown), two second air blowing holes 243, and two side air blowing channels 244. The two second air blowing holes 243 are symmetrically arranged on corresponding side walls 246, and the two side air blowing channels 244 are correspondingly connected to the two second air blowing holes 243. The second air inlet valve is connected to the controller 300 and is located on the main air blowing channel 242 or the first air vent 110.

[0053] The air intake unit 100 also includes a second vent pipe 111, which is connected to two side air blowing channels 244. The second vent pipe 111 is connected to an external air source. The first vent pipe 110 and the second vent pipe 111 can be connected to the same external air source or to different external air sources.

[0054] For example, when a cleaning process needs to be performed on the substrate 400, the robot transports the substrate 400 to the top of the support unit 200. The substrate 400 is detached from the robot and falls due to its own weight. During the descent, the controller 300 controls the air intake unit 100 to work. The first air duct 110 delivers cleaning gas into the main air blowing channel 242, and the second air duct 111 delivers cleaning gas into the two side air blowing channels 244. The first air blowing hole 241 and the two second air blowing holes 243 blow cleaning gas onto the substrate 400, which can reduce the impact force when the substrate 400 falls to the bottom 245.

[0055] After the substrate 400 descends onto the groove 240, the air intake unit 100 stops working, and the first air blowing hole 241 and the two second air blowing holes 243 no longer eject cleaning gas. The drive source operates, driving at least two support bars and the lifting part 260 to descend simultaneously, thereby lowering the substrate 400 into the process tank 500 (see here). Figure 7 The substrate 400 is lowered into the cleaning solution in the process tank 500 to perform a cleaning process on the substrate 400.

[0056] During the cleaning process on the substrate 400 in the process tank 500, particles tend to accumulate in the grooves 240 and adhere to the edges of the substrate 400. The controller 300 controls the second air inlet valve to close, and the main air blowing channel 242 no longer supplies cleaning gas. The controller 300 controls the air inlet unit 100 to operate, and the second air vent 111 supplies cleaning gas to the two side air blowing channels 244, so as to blow the cleaning gas to both sides of the substrate 400 through the second air blowing holes 243, agitate the cleaning liquid, and effectively remove contaminants in the grooves 240 and on the surface of the substrate 400.

[0057] After the cleaning process is completed, the controller 300 stops the air intake unit 100 from operating, and the two second air blowing holes 243 cease to eject cleaning gas. The drive source then operates, driving at least two support bars and the lifting unit 260 to rise simultaneously. The support bars carry the substrate 400 upwards, leaving the process tank 500. The robotic arm then removes the processed substrate 400.

[0058] After the robotic arm removes the substrate 400 from the carrier unit 200, the controller 300 controls the air intake unit 100 to work. The first air blowing hole 241 and the second air blowing hole 243 deliver clean gas into the tooth groove 240, further ensuring the cleanliness of the tooth groove 240. This prevents contaminants remaining from the previous process on the tooth groove 240 from reacting with the surface of the substrate 400 through the action of the cleaning liquid in subsequent processes, thus causing defects in the substrate 400 and effectively improving the yield of the substrate 400.

[0059] Optionally, the air blowing unit includes a side air blowing channel 244 and a plurality of second air blowing holes 243. The plurality of second air blowing holes 243 are interconnected and symmetrically arranged on two side walls 246. The side air blowing channel 244 is connected to the plurality of second air blowing holes 243. The second air passage 111 is connected to the side air blowing channel 244 and is used to deliver clean gas to the side air blowing channel 244. Optionally, the plurality of second air blowing holes 243 are asymmetrically arranged on the two side walls 246. The air blowing volume of the second air blowing holes 243 on both sides is controlled by the controller 300 to stabilize the substrate 400 and keep it centered in the tooth groove 240.

[0060] See Figure 6In an optional embodiment, the air blowing unit further includes a third air blowing hole 248, which is disposed on the side surface opposite to the adjacent support bar. The air intake unit 100 also includes a third air passage (not shown), which communicates with the third air blowing hole 248.

[0061] During the cleaning process of substrate 400 in process tank 500, controller 300 controls air intake unit 100 to work, controls third air duct to deliver clean gas to third air blowing hole 248, stirs cleaning liquid, and forms convection between two adjacent support bars, enhancing the cleaning effect on substrate 400.

[0062] See Figure 7 The embodiments of this application also provide a substrate processing apparatus, which includes a process tank 500 and the aforementioned substrate carrying device. The process tank 500 is used to contain the processing liquid for processing the substrate 400, and the substrate carrying device can be raised and lowered relative to the bottom of the process tank 500.

[0063] The substrate carrier lowers the substrate 400 into the processing liquid in the process tank 500 to perform processes such as cleaning or etching on the substrate 400.

[0064] Although specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the protection scope of this application.

[0065] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

Claims

1. A substrate carrier device, characterized in that, include: The support unit includes at least two support bars, which are arranged in parallel and spaced apart, and each support bar is provided with at least one toothed groove for supporting the substrate; The air blowing part includes a first air blowing hole, which is disposed at the bottom of the tooth groove; The air intake unit is connected to the air blowing section; as well as The controller, connected to the air intake unit, is configured to: control the air intake unit to deliver cleaning gas to the air blowing section during the process of the substrate descending from the outside to the tooth groove, so as to blow the cleaning gas to the substrate through the first air blowing hole.

2. The substrate carrier device as described in claim 1, characterized in that, The lower end of the tooth groove has a narrower groove width than the upper end of the tooth groove.

3. The substrate carrier device as described in claim 1, characterized in that, The tooth groove includes two sidewalls, which are respectively disposed on both sides of the bottom.

4. The substrate carrier device as described in claim 3, characterized in that, The air intake unit includes a first air vent, and the air blowing unit also includes a main air blowing channel. The main air blowing channel is connected to the first air blowing hole and the first air vent, and the first air vent is used to deliver the clean gas into the main air blowing channel.

5. The substrate carrier device as described in claim 4, characterized in that, The air blowing section further includes a first air inlet valve, a second air blowing hole, and a side air blowing channel. The first air inlet valve is connected to the controller and is disposed on the main air blowing channel. A plurality of second air blowing holes are disposed on the two side walls respectively, and the side air blowing channel communicates with the plurality of second air blowing holes. The first ventilation pipe is connected to the side blowing channel and is used to deliver the cleaning gas to the side blowing channel so as to blow the cleaning gas to both sides of the substrate through the second blowing hole.

6. The substrate carrier device as claimed in claim 4, characterized in that, The air blowing section includes a second air inlet valve, a second air blowing hole and a side air blowing channel. A plurality of second air blowing holes are respectively disposed on the side wall, and the side air blowing channel communicates with the plurality of second air blowing holes. The second air intake valve is connected to the controller, and the second air intake valve is disposed on the main air blowing channel or the first air supply line; The air intake unit further includes a second air vent, which is connected to the side blowing channel and is used to deliver the cleaning gas to the side blowing channel so as to blow the cleaning gas to both sides of the substrate through the second blowing hole.

7. The substrate carrier device as claimed in claim 1, characterized in that, The air blowing part further includes a third air blowing hole, which is disposed on the side surface opposite to the adjacent support bar. The air intake unit further includes a third air passage, which is connected to the third air blowing hole. The controller is configured to control the third ventilation conduit to deliver clean gas to the third air vent during the processing of the substrate.

8. A substrate processing apparatus, characterized in that, The device includes a process tank and a substrate support device as described in any one of claims 1-7, wherein the process tank is used to contain a processing liquid for processing a substrate, and the substrate support device is used to lift and lower relative to the bottom of the process tank.

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