Method for measuring productivity of substrate processing apparatus, computer program product, and substrate processing apparatus

Abstract

The present application provides a kind of substrate processing device productivity measurement method, computer program product and substrate processing device, the actual measurement of substrate processing device productivity is simply carried out.The measurement method is used to measure the productivity of substrate processing device, substrate processing device has multiple modules including multiple processing modules and conveying robot for conveying multiple modules to substrate, measurement method includes the following steps: according to the operation of user, the mode of substrate processing device is set to measurement mode for carrying out productivity measurement;According to the operation of user, select the conveying process for measurement used in measurement mode from the candidate of conveying process stored in storage in advance;According to the conveying process selected in the process of carrying out selection, the substrate is conveyed in substrate processing device;And calculate productivity based on the conveying result in the process of carrying out conveying, wherein, conveying process specifies the conveying path of substrate in unit of module as conveying destination for each conveying step.

Description

Technical Field

[0001] This disclosure relates to a method, procedure, and substrate processing apparatus for measuring the productivity of a substrate processing apparatus. Background Technology

[0002] The substrate processing system disclosed in Patent Document 1 includes a carrier station, which comprises: a carrier loading / unloading section, through which carriers holding multiple substrates are loaded and unloaded; and a transfer unit for transferring substrates between carriers placed in the carrier loading / unloading section. Furthermore, the aforementioned substrate processing system includes a processing station adjacent to the carrier station, which includes a processing section for applying a coating liquid to the substrates and a main transport unit for transferring substrates between the processing section and the transfer unit. Additionally, the aforementioned substrate processing system includes an inspection station adjacent to the carrier station, which includes an inspection section for inspecting the processed substrates. Furthermore, the aforementioned substrate processing system also includes a productivity control unit for determining the productivity of each of the carrier station, processing station, and inspection station.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-178956 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The technology disclosed herein simply involves the actual measurement of the productivity of a substrate processing apparatus.

[0008] Solution for solving the problem

[0009] One aspect of this disclosure is a measurement method for measuring the productivity of a substrate processing apparatus, the substrate processing apparatus comprising multiple modules including multiple processing modules and a transport robot for transporting substrates to the multiple modules. The measurement method includes the following steps: setting the mode of the substrate processing apparatus to a measurement mode for measuring the productivity according to a user operation; and selecting a measurement transport process for use in the measurement mode from candidates of transport processes pre-stored in a storage unit according to the user operation, wherein the transport process specifies the transport path of the substrate for each transport step on a unit of the module as the transport destination. The measurement method further includes the following steps: transporting the substrate within the substrate processing apparatus according to the transport process selected in the selection step; and calculating the productivity based on the transport results in the transport steps.

[0010] The effects of the invention

[0011] According to this disclosure, it is possible to easily measure the productivity of the substrate processing apparatus. Attached Figure Description

[0012] Figure 1 This is a top view schematically showing the outline of the structure of the coating and developing apparatus 1, which is the substrate processing apparatus according to this embodiment.

[0013] Figure 2 It is a schematic diagram showing the outline of the internal structure of the central part of the coating and developing apparatus in the depth direction.

[0014] Figure 3 This is a schematic diagram showing the outline of the internal structure of the coating and developing apparatus near the front.

[0015] Figure 4 This is a schematic diagram showing the outline of the internal structure of the coating and developing apparatus on the depth side.

[0016] Figure 5 This is a function block diagram of the control unit related to the actual measurement of the productivity of the coating and developing equipment.

[0017] Figure 6 This is an example of a measurement screen.

[0018] Figure 7 This is an example diagram showing a portion of a delivery schedule.

[0019] Figure 8 This diagram illustrates an example of a measurement conveying process, a first segmentation conveying process, and a second segmentation conveying process.

[0020] Figure 9 This is a flowchart illustrating an example of a practical process for measuring productivity. Detailed Implementation

[0021] Hereinafter, the substrate processing apparatus according to this embodiment will be described with reference to the accompanying drawings. Furthermore, in this specification and the accompanying drawings, elements having substantially the same functional structure are omitted from repeated description by using the same reference numerals.

[0022] Coating and developing apparatus

[0023] Figure 1 This is a top view schematically showing the outline of the structure of the coating and developing apparatus 1, which is the substrate processing apparatus according to this embodiment. Figure 2 This is a schematic diagram showing the outline of the internal structure of the central part of the coating and developing apparatus 1 in the depth direction. Figure 3 and Figure 4 These are schematic diagrams showing the outlines of the internal structures of the front and depth sides of the coating and developing apparatus 1.

[0024] like Figure 1 As shown, the coating and developing apparatus 1 is configured with a carrier block B1, a processing block B2, and an interface block B3 serving as a relay block arranged in the described order along the width direction (X direction in the figure). In the following description, the width direction will sometimes be described as the left-right direction. An exposure device E is connected to the side of the interface block B3 opposite to the processing block B2 side (the positive side in the X direction of the figure).

[0025] Carrier block B1 is used to move semiconductor wafers (hereinafter referred to as "wafers") W, which serve as substrates, between carrier C and coating and developing apparatus 1. Additionally, carrier block B1 is also used to move carrier C in and out. Carrier C is an example of a container for storing multiple substrates. That is, carrier C is a transport container used for the centralized transport of multiple wafers W.

[0026] A carrier platform 11 is provided on the carrier block B1. For example, a mounting plate 12 is provided on the carrier platform 11, which is used to mount the carrier C when it is moved in and out relative to the coating and developing apparatus 1. Multiple mounting plates 12 are provided along a depth direction (Y direction in the figure) orthogonal to the width direction (X direction in the figure) in the horizontal plane (four in the example shown). Furthermore, a transfer robot 13 is provided between the carrier block B1 and the carrier platform 11 and the processing block B2. The transfer robot 13 has a transfer arm 13a configured to move freely forward and backward, freely lift and lower, freely rotate about a vertical axis, and freely move in the depth direction, enabling it to transfer wafers W between the carriers C on each mounting plate 12 and each transfer module of the transfer tower 21 (described later).

[0027] Processing block B2 is a block equipped with a processing module for processing the wafer W before or after exposure. In this embodiment, it consists of multiple (two in the example) sub-blocks B21 and B22 connected in the left-right direction (X direction in the figure). Hereinafter, the sub-block B21 on the side of the carrier block B1 will be referred to as the left sub-block B21, and the sub-block B22 on the side of the interface block B3 will be referred to as the right sub-block B22.

[0028] like Figures 2-4 As shown, the left sub-block B21 has first layer blocks L1 to sixth layer blocks L6 stacked sequentially from bottom to top. Similarly, the right sub-block B22 has first layer blocks P1 to sixth layer blocks P6 stacked sequentially from bottom to top. Layer block L1 has a housing L1a. Similarly, layers L2 to L6 and P1 to P6 each have a housing. Layer blocks L1 to L6 and P1 to P6 are separated from each other by the aforementioned housings.

[0029] Various processing modules are installed in each layer block L1~L6 and P1~P6. Furthermore, a module refers to a location where the wafer W is placed, excluding the transport robot. Modules that process the wafer W are described as processing modules, and this processing may include acquiring images for inspection.

[0030] A transfer tower 21 is provided on the left sub-block B21 at its center in the depth direction (Y direction in the figure), near the bearing block B1, spanning from the first layer block L1 to the sixth layer block L6.

[0031] The transfer tower 21 is composed of multiple transfer modules stacked vertically. Transfer modules are positioned at heights corresponding to the first layer L1 through the sixth layer L6 of the transfer tower 21. Specifically, transfer modules TRS and CPL are positioned at positions corresponding to the first layer L1 through the sixth layer L6, respectively. Furthermore, the transfer module TRS and the transfer module CPL are configured in a substantially similar manner. However, only the transfer module CPL is a temperature adjustment module that includes a temperature adjustment board for mounting the wafer W and adjusting the temperature of the mounted wafer W, functioning as a processing module. For example, the transfer module CPL functions as a temperature adjustment module, such as a cooling module. Alternatively, at least one of the transfer modules TRS and CPL may be stacked vertically corresponding to the first layer L1, and the same applies to the second layer L2 through the sixth layer L6.

[0032] Additionally, at the height accessible to the transport robot 13 within the support block B1 of the transfer tower 21, specifically, such as... Figure 2 As shown, a junction module TRS1 is positioned between the junction module CPL of the second layer block L2 and the junction module TRS of the third layer block L3. This junction module TRS1 has the same structure as the junction module TRS, and is used, for example, when moving wafers in and out between the left sub-block B21 and the carrier block B1. The junction module TRS1 can also be stacked vertically.

[0033] like Figure 1 As shown, a transport robot 22 is provided on the depth side (positive side in the Y direction of the figure) of the transfer tower 21. The transport robot 22 has a transport arm 22a configured to move forward and backward and rise and fall freely, and can transport wafers W between the various transfer modules of the transfer tower 21.

[0034] Next, the first layer blocks L1 to the sixth layer blocks L6 of the left sub-block B21 will be explained. Furthermore, in Figure 1 In the diagram, the structure of the first layer block L1 is shown in relation to the left sub-block B21. The following is a detailed explanation of the first layer block L1.

[0035] like Figure 1As shown, a transfer area M is formed in the center of the first layer block L1 in the depth direction, extending from the transfer tower 21 in the width direction. That is, when viewed from above, the transfer tower 21 is provided at a position adjacent to the transfer area M in the extension direction of the transfer area M.

[0036] Various processing modules are respectively set in the regions of the first layer block L1 that are closer to the front side (negative side of the Y direction in the figure) than the transport region M and the regions that are closer to the depth side (positive side of the Y direction in the figure) than the transport region M.

[0037] Specifically, in the region near the front of the first layer block L1, there is a developing module DEV, which is a liquid processing module that uses a processing liquid to liquid process the wafer W, and in the region on the depth side, there is a vertical module T with various modules.

[0038] The developing module (DEV) performs developing processing on the exposed wafer W. The developing module (DEV) includes: a rotating holding disk 31 that holds and rotates the wafer W; and cups 32 that surround the wafer W on the rotating holding disk 31 to collect the processing liquid that spills from the wafer W. Two sets of these rotating holding disks 31 and cups 32 are arranged along the width direction. Additionally, for example, the developing module (DEV) is provided with a nozzle 33 that sprays developing liquid, which is the processing liquid, onto the wafer W held on the rotating holding disk 31. This nozzle 33 is configured, for example, to move freely between the cups 32, and the cups 32 share the nozzle 33.

[0039] Multiple vertical modules T are arranged along the width direction (X direction in the figure) (four in the example in the figure). For example, each vertical module T has a heating module for heating the wafer W, and within each vertical module T, the heating modules are stacked in three layers, for example, in the vertical direction.

[0040] Additionally, in the first layer block L1, a transport robot M1 is provided in the aforementioned transport area M. The transport robot M1 has a transport arm M1a configured to freely move forward and backward, freely lift and lower, freely rotate about a vertical axis, and freely move in the width direction (X direction in the figure). Using this transport arm M1a, wafers W can be transferred between each transfer module and the resist forming module COT within the transfer tower 21, and between the resist forming module COT and the vertical module T. The transport arm M1a can also access each module of the transfer tower 41 in the right sub-block B22, which will be described later. In this embodiment, as... Figure 2 As shown, the conveying arm M1a has two forks M1b. Forks M1b are an example of a substrate support portion that supports the substrate.

[0041] The second layer blocks L2 to the sixth layer blocks L6 are constructed in the same way as the first layer block L1.

[0042] like Figure 1As shown, the right sub-block B22 has a junction tower 41 at the center of its conveying area M adjacent to the left sub-block B21 in the width direction (X direction in the figure) and in the depth direction (Y direction in the figure). Figure 2 As shown, the junction tower 41 is set up in a manner that spans the first layer block P1 to the sixth layer block P6 of the right sub-block B22.

[0043] Multiple transfer modules are stacked vertically on the transfer tower 41. Transfer modules are positioned at heights corresponding to the first layer blocks L1 to L6 and the first layer blocks P1 to P6 on the transfer tower 41. Specifically, transfer modules TRS and CPL are positioned on the transfer tower 41 at positions corresponding to the first layer blocks L1 and P1, the second layer blocks L2 and P2, the third layer blocks L3 and P3, the fourth layer blocks L4 and P4, the fifth layer blocks L5 and P5, and the sixth layer blocks L6 and P6, respectively. At least one of the transfer modules TRS and CPL can be stacked vertically at the position corresponding to the first layer blocks L1 and P1, and the same applies to other corresponding positions.

[0044] Additionally, a transfer module TRS2 is provided in transfer tower 41. This transfer module TRS2 has the same structure as the transfer module TRS, and is used, for example, when transferring wafers W from transfer tower 21 to transfer tower 41 but not to the processing module in the left sub-block B21, or when transferring wafers W from the transfer tower 51 (described later) of interface block B3 to transfer tower 41 but not to the processing module in the right sub-block B22. The transfer module TRS2 is, for example, positioned at approximately the same height as the transfer module TRS1. A shuttle robot can also be provided to linearly transfer wafers W between the transfer modules TRS1 and TRS2. The transfer modules TRS2 can also be stacked vertically.

[0045] In addition, such as Figure 1 As shown, a transport robot 42 is installed on the depth side (positive side in the Y direction of the figure) of the transfer tower 41 in the right sub-block B22. The transport robot 42 has a transport arm 42a configured to move freely forward and backward, move freely up and down, and rotate freely about a vertical axis, and can transport wafers W between the various transfer modules of the transfer tower 41. The transport arm 42a can also access the modules of the module tower 43 described later.

[0046] A module tower 43 is provided on the depth side (positive side in the Y direction of the figure) of the conveying robot 42. A hydrophobication processing module (not shown) for hydrophobicating wafer W is provided in the module tower 43, for example. The hydrophobication processing modules can be stacked vertically within the module tower 43.

[0047] Next, the first layer blocks P1 to the sixth layer blocks P6 of the right-side sub-block B22 will be explained. Furthermore, in Figure 1 In the diagram, regarding the right-hand sub-block B22, the structure of the first-layer block P1 is shown.

[0048] In the first layer block P1 of right sub-block B22 and the first layer block L1 of left sub-block B21, the liquid processing module located on the near-front side (negative side in the Y direction of the figure) has a different type of structure than the vertical module located on the depth side (positive side in the Y direction of the figure). In the first layer block P1 of right sub-block B22, an anti-reflective film forming module TCT for forming an anti-reflective film on the wafer W is provided instead of the developing module DEV as the liquid processing module. Furthermore, the processing liquid for forming the anti-reflective film is supplied from the nozzle 33 of the anti-reflective film forming module TCT. In addition, in the fourth layer block P4, a portion (e.g., one) of the vertical modules U provided has a peripheral exposure module for exposing the periphery of the wafer W. The peripheral exposure modules can be stacked multiple times (e.g., three layers) in the vertical direction within the vertical module U. The other structures of the first layer block P1 of right sub-block B22 are the same as those of the first layer block L1 of left sub-block B21.

[0049] Furthermore, the second layer block P2 and the third layer block P3 are constructed in the same way as the first layer block P1.

[0050] In the fourth layer block P4 and the first layer block P1, the type of liquid treatment module located near the front differs from the structure of the vertical module located on the depth side. In the fourth layer block P4, a resist forming module COT, which forms a resist film on the wafer W, is used instead of an anti-reflective film forming module TCT as the liquid treatment module. Furthermore, resist liquid, which serves as the processing liquid, is supplied from the nozzle 33 of the resist forming module COT. Additionally, in the fourth layer block P4, a vertical module T is provided on the depth side instead of a vertical module U.

[0051] The fifth layer block P5 and the sixth layer block P6 are constructed in the same way as the fourth layer block P4.

[0052] exist Figure 1 In this embodiment, the transport area located in the first layer block P1 to the sixth layer block P6 is designated as Q. Furthermore, the transport robot located in the transport area Q is designated as Q1, and the transport arm of the transport robot Q1 is designated as Q1a. Using this transport arm Q1a, wafers W can be transferred between the transfer tower 21 and the developing module DEV, between the resist forming module COT and the vertical module T, and between the anti-reflective coating forming module TCT and the vertical module U. The transport arm Q1a can also access each transfer module of the transfer tower 51 of the interface block B3 (described later). In this embodiment, the transport arm Q1a, like the transport arm M1a, has two forks Q1b.

[0053] like Figure 1 As shown, a transfer tower 51 is provided at a position adjacent to the transport area Q of interface block B3 and right sub-block B22 in the depth direction (Y direction in the figure).

[0054] Multiple junction modules are stacked vertically on the junction tower 51. Junction modules TRS and CPL are respectively positioned at heights corresponding to the first layer blocks P1 to the sixth layer blocks P6 of the right sub-block B22 on junction tower 51. Alternatively, at least one of the junction modules TRS and CPL can be stacked vertically in a manner corresponding to the first layer block P1, and the same applies to the second layer blocks P2 to the sixth layer blocks P6.

[0055] Additionally, a transfer module TRS3 is provided on transfer tower 51. This transfer module TRS3 has the same structure as the transfer module TRS, and is used, for example, when moving wafer W between interface block B3 and right sub-block B22. Transfer module TRS3 is positioned, for example, at approximately the same height as transfer module TRS2. A shuttle robot can also be provided to linearly transport wafer W between transfer modules TRS2 and TRS3. Transfer modules TRS3 can also be stacked vertically.

[0056] In addition, transport robots 52 and 53 are respectively provided on the interface block B3 near the front side (negative side in the Y direction of the figure) and near the exposure device E side (positive side in the X direction of the figure). Transport robots 52 and 53 have transport arms 52a and 53a configured to move freely forward and backward, freely lift and lower, freely rotate about a vertical axis, and freely move in the depth direction (Y direction of the figure).

[0057] A module tower 54 is provided near the front of the transfer robot 52. The module tower 54 includes, for example, a back-side cleaning module (not shown) that supplies cleaning fluid to the back side of the wafer W for cleaning. The back-side cleaning modules can be stacked vertically within the module tower 54. The transfer robot 52 can use its transfer arm 52a to transfer the wafer W between the transfer modules of the transfer tower 51 and the back-side cleaning module.

[0058] In addition, the transfer robot 53 can use the transfer arm 53a to transfer wafers W between the transfer modules of the transfer tower 51 and the exposure device E.

[0059] The coating and developing apparatus 1 may also have a buffer module (not shown) that allows the wafer W to wait inside. The buffer module is provided, for example, in the module tower 54. Alternatively, multiple buffer modules may be provided in the coating and developing apparatus 1.

[0060] In addition, the coating and developing apparatus 1 has a touch panel 60 as a display unit. The touch panel 60 also functions as an input unit for operator input instructions. The touch panel 60 is, for example, located near the front of the support block B1. Figure 1 The side of the touch panel 60 (the negative side in the Y direction). Additionally, the touch panel 60 may include, for example, a liquid crystal display (LCD), an organic EL display, or a similar display. Input results to the touch panel 60 are output to the control unit 100.

[0061] The coating and developing apparatus 1 configured as described above is provided with at least one control unit 100. The control unit 100 processes computer-executable instructions for causing the coating and developing apparatus 1 to perform the various processes described herein. The control unit 100 can be configured to control the various elements of the coating and developing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the control unit 100 may be included in the coating and developing apparatus 1. The control unit 100 may also include a processing unit, a storage unit, and a communication interface. The control unit 100 is implemented, for example, by a computer. The processing unit can be configured to perform various control actions by reading a program from the storage unit that provides logic or routines capable of performing various control actions and executing the read program. The program can be either pre-stored in the storage unit or retrieved via a medium when needed. The retrieved program is stored in the storage unit and read and executed by the processing unit from the storage unit. The medium can be any computer-readable storage medium H or a communication line connected to the communication interface. The storage medium H can be either transient or non-transient. The processing unit can be a CPU (Central Processing Unit) or one or more circuits. The storage unit can also include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface can also communicate with the coating and developing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0062] In the coating and developing process using the coating and developing apparatus 1 configured as described above, the wafer W is processed in the following order, for example. First, the wafer W undergoes hydrophobication treatment using a hydrophobication treatment module, cooling treatment as a temperature control process using a transfer module CPL, resist film formation treatment using a resist film formation module COT, and heating treatment (pre-exposure baking) using a heat treatment module using a vertical module T. Next, in the above coating and developing process, the wafer W after the pre-exposure baking treatment undergoes, for example, anti-reflective film formation treatment using an anti-reflective film formation module TCT, heating treatment using a heat treatment module using a vertical module U, and peripheral exposure treatment using a peripheral exposure module using a vertical module U. After that, the wafer W after the peripheral exposure treatment undergoes back-side cleaning treatment using a back-side cleaning module and cooling treatment as a temperature control process using a transfer module CPL. Finally, the wafer W is exposed using an exposure apparatus E. In addition, the exposed wafer W undergoes a series of processes: heat treatment using the vertical module T (post-exposure baking (PEB)), cooling using the transfer module CPL, development using the development module DEV, heat treatment using the vertical module T (POST), and cooling using the transfer module CPL. This process forms a resist pattern on the wafer W.

[0063] Furthermore, the theoretical productivity of the coating and developing apparatus 1 configured as described above can be calculated based on factors such as the processing time in each processing module. However, the actual productivity of the coating and developing apparatus 1 may vary depending on the state of each module. Additionally, it is sometimes required that the measured productivity be approximately equal to the theoretical value.

[0064] <Control Unit 100>

[0065] Figure 5 This is a function block diagram of the control unit 100, which is related to the actual measurement of the productivity of the coating and developing apparatus 1. Figure 6 This is an example of a diagram showing the measurement used in the following description. Figure 7 This is an example diagram showing a portion of a delivery schedule.

[0066] In this embodiment, the control unit 100 includes a storage unit 210, a display control unit 220, a mode setting unit 230, a transport process selection unit 240, a transport control unit 250, and a calculation unit 260. For example, the display control unit 220, the mode setting unit 230, the transport process selection unit 240, the transport control unit 250, and the calculation unit 260 are implemented by the aforementioned processing unit reading and executing the program stored in the storage unit 210.

[0067] Storage unit 210 stores various types of information. The information stored in storage unit 210 includes information on transfer processes, processing processes, etc.

[0068] The transport process specifies the transport path, specifically the path from when the wafer W is removed from the carrier C, processed by the coating and developing apparatus 1, until it is transported back into the carrier C. Furthermore, the transport process includes sequentially executed transport steps, specifying candidate modules as transport destinations for each step, thereby specifying the transport path of the wafer W. In other words, the transport process specifies the transport path of the wafer W on a module-by-module basis for each sequentially executed transport step.

[0069] A processing procedure is information that specifies the content of the processing performed by each processing module. The processing procedure includes the processing steps to be executed sequentially, specifying conditions such as the time required for each processing step.

[0070] The candidates for the transport and processing processes used in the productivity measurement are predetermined and stored in the storage unit 210 before the productivity measurement. In addition, each candidate of the transport process is pre-associated with the processing process applied in the previous processing module that transported the wafer W according to the transport process (candidate).

[0071] The display control unit 220 causes the touch panel 60 to display various screens. The screens displayed on the touch panel 60 via the display control unit 220 include an initial screen for operating the coating and developing apparatus 1, Figure 6 The measurement uses image U.

[0072] The measurement screen U is displayed when the coating and developing apparatus 1 is in measurement mode. For example... Figure 6 As shown, the measurement screen U has, for example, a conveying process selection area U1, a start carrier selection button U2, a status display area U3, a scheduled end date and time display area U4, a productivity (TP) value display area U5, and a start button U6.

[0073] The transport process selection area U1 is an area that displays candidates for transport processes used in actual productivity measurements. For example, a drop-down menu is displayed in the transport process selection area U1, showing transport processes (candidates) selected from the transport process candidates pre-stored in the storage unit 210 by a drop-down method.

[0074] The Start Carrier Selection button U2 is used to select which carrier C's wafer W to start moving from when using wafers W housed in multiple carriers C in a productivity test.

[0075] The status display area U3 is the area that displays the current status of the coating and developing apparatus 1. During actual productivity measurements, the status display area U3 may display, for example, "Measurement in progress".

[0076] The predetermined end date and time display area U4 is an area that displays the predetermined end date and time of wafer transport for actual productivity measurements. For example, as described later, when the transport control unit 250 generates a transport schedule, the aforementioned predetermined end date and time is calculated by the transport control unit 250.

[0077] The TP value display area U5 is the area that displays the measured results of productivity.

[0078] The start button U6 is used to start the calculation of the transport of the wafer W using the transport process selected in the transport process selection area U1 (candidate) and the productivity based on the transport results.

[0079] The mode setting unit 230 sets the mode of the coating and developing apparatus 1. Specifically, the mode setting unit 230 sets the mode of the coating and developing apparatus 1 to a measurement mode. The measurement mode is used to measure the productivity of the coating and developing apparatus 1. More specifically, the mode setting unit 230, for example, changes the mode of the coating and developing apparatus 1 from the normal mode to the measurement mode based on operations performed by the user (operator) via the touch panel 60. More specifically, the mode setting unit 230, for example, changes the coating and developing apparatus 1 to the measurement mode based on operator input to a predetermined portion of the initial screen of the coating and developing apparatus 1 displayed on the touch panel 60.

[0080] The transport process selection unit 240 selects a candidate transport process for use in productivity measurement from a pool of transport process candidates pre-stored in the storage unit 210, based on the operator's operation. That is, the transport process selection unit 240 selects a test transport process from a pool of transport process candidates pre-stored in the storage unit 210 based on the operator's operation. The operator's operation described above is, for example, an operation on the transport process selection area U1 of the measurement screen U displayed on the touch panel 60.

[0081] The transport control unit 250 transports wafers W according to a measurement transport process. Specifically, the transport control unit 250 transports multiple wafers W housed in the carrier C according to a measurement transport process stored in the storage unit 210 and a processing process associated with that measurement transport process (i.e., a candidate transport process).

[0082] More specifically, the transport control unit 250 generates a transport schedule as time-series data for a transport cycle based on the measurement transport process and the associated processing process stored in the storage unit 210. Then, the transport control unit 250 transports each wafer W housed in the carrier C based on the transport schedule. The transport schedule is generated before the first wafer among the multiple wafers transported for productivity measurement is removed from the carrier C. In a transport cycle, for example, the order in which the wafers W transported in that cycle are moved into the coating and developing apparatus 1 is matched with the identification information of the module that is the destination of the transport in that cycle. Furthermore, the next transport cycle will not begin until the previous transport cycle is completed.

[0083] In other words, the transport schedule indicates at what time and to which module all wafers W to be transported according to the measured transport process.

[0084] During the transfer cycle, for the module containing the wafer W, the module's (identification information) is also matched with the transfer sequence of the wafer W located in the module into the coating and developing apparatus 1.

[0085] exist Figure 7 In the example transport schedule Sc, the numbers below "Cycle" indicate the execution order of the transport cycle, "A1", "A2", etc., are identification information for wafer W, and the numbers to the right of "A" in this mark indicate the transport order of wafer W into the coating and developing apparatus 1. Additionally, in Figure 7 In the example transport schedule Sc, the "PEB1," "DEV1," etc. at the top represent module identification information. Furthermore, in... Figure 7 In the example transport schedule Sc, the dark gray portion represents the wafer W being transported in the transport cycle and the module that serves as the transport destination, while the light gray portion represents the module where wafer W remains continuously in the transport cycle and the wafer W itself.

[0086] exist Figure 7 In the example transport schedule Sc, for instance, in the fourteenth transport cycle, wafer W with a transport order of 14 is transported into the second PEB processing heating module PEB2, and wafer W with a transport order of 10 is transported into the second PEB post-transfer module CPL1. Additionally, wafer W with a transport order of 8 is transported into the fourth developing module DEV4, wafer W with a transport order of 4 is transported into the first POST processing heating module POST1, and wafer W with a transport order of 1 is transported into the POST post-transfer module CPL.

[0087] When transporting wafer W based on a transport schedule, the transport control unit 250 performs replacement transport as much as possible. Replacement transport is the transport of a second substrate different from the first wafer W by using one of the two forks M1b (or forks Qb) of the transport robot M1 (or transport robot Q1) to transport a module into the first wafer W, while the transport robots M1 (or transport robot Q1) are still facing each other.

[0088] Specifically, the transfer control unit 250 performs the aforementioned replacement transfer for a module capable of transferring wafer W in and out using the same transfer robot M1 (or transfer robot Q1), where a first wafer W can be transferred out of the module and a second wafer W is scheduled to be transferred into the module in the same transfer cycle.

[0089] Here, let's set it as Figure 7 The modules listed in the transport schedule Sc, excluding the POST post-handover module CPL, are those capable of using the same transport robot M1 (or transport robot Q1) to move wafers W in and out. In this case, in the aforementioned fourteenth cycle, the second PEB processing heating module PEB2 performs a replacement transport of wafers W10 and W14, and the second PEB post-handover module CPL1 performs a replacement transport of wafers W8 and W10. Furthermore, in the aforementioned fourteenth cycle, the fourth developing module DEV4 performs a replacement transport of wafers W8 and W4, and the first POST processing heating module POST1 performs a replacement transport of wafers W1 and W4.

[0090] As mentioned earlier, a buffer module is sometimes provided in the coating and developing apparatus 1. This buffer module is not a module specified in the transport process, but the wafer W can pass through this buffer module. That is, the buffer module is a module specified as the transport destination in the transport schedule. When transporting the wafer W according to the measurement transport process, if the buffer modules passed through are different between the wafers W, the residence time in the coating and developing apparatus 1 becomes the main cause of deviation between the wafers W. Therefore, in the transport control unit 250, when transporting the wafer W according to the measurement transport process, the buffer modules passed through are common between the wafers W. Specifically, for example, the transport control unit 250 generates a transport schedule in a manner that makes the buffer modules passed through common between the wafers W.

[0091] The calculation unit 260 calculates the productivity of the coating and developing apparatus 1 based on the results of transporting the wafer W according to the measurement transport process under the control of the transport control unit 250. This productivity is the maximum processing capacity of the coating and developing apparatus 1 under the condition that a series of processes have been performed according to the measurement transport process and the associated processing processes.

[0092] Specifically, the calculation unit 260, for example, refers to a timer (not shown) to obtain the transfer interval of each wafer W to the module under monitoring for each wafer W. Then, the calculation unit 260 calculates, for example, the average value of the obtained transfer intervals (in seconds), and calculates the measured value of productivity (in sheets per hour (wph)) based on this average value. For example, the transfer interval of the wafer W is only obtained for wafers W that have arrived at the module under monitoring before the last wafer W in the set transfer schedule is removed from the carrier C. In addition, the module under monitoring is, for example, a module that is designated as a candidate for transfer destination in the last transfer step included in the transfer process.

[0093] In addition, the calculation unit 260 can also calculate the theoretical value of the productivity of the coating and developing apparatus 1. The calculation of the above-mentioned theoretical value is performed, for example, as follows.

[0094] First, the calculation unit 260 calculates the cycle time TM for each transport step in the measurement transport process for which a processing module has been designated as a candidate transport destination, according to the following formula.

[0095] Cycle time TM = (Process time TS + Overhead time TO) / (Number of candidate processing modules specified in the transfer step)

[0096] Process time TS is the processing time required in a candidate processing module designated as the transport destination during the transport step, and is calculated based on the process flow.

[0097] The overhead time TO is the time required for the wafer W to be moved in and out of each processing module and for the actions before and after processing by each processing module, and it has been pre-stored in the storage unit 210.

[0098] After calculating the cycle time TM, the calculation unit 260 determines the maximum cycle time among the cycle times TM created for each conveying step. Then, the calculation unit calculates the theoretical value of productivity (in wph) based on the determined maximum value of the cycle time (in seconds).

[0099] The transport control unit 250 can also generate a segmentation transport process that divides the measurement transport process into multiple segments. In this case, the transport control unit 250 transports the wafer W according to each generated segmentation transport process. Specifically, for each generated segmentation transport process, the transport control unit 250 creates a transport schedule based on the processing process associated with the measurement transport process before segmentation and the segmentation transport process. Then, for each created transport schedule, the transport control unit 250 transports each wafer W housed in the carrier C based on the transport schedule.

[0100] The transport control unit 250 determines whether a slicing transport process needs to be generated, for example, based on a condition corresponding to the total number of candidates for modules specified by the measurement transport process. This condition is, for example, that the number of wafers W used in the actual productivity measurement, i.e., the total number of wafers W housed in four carriers, is sufficient compared to the number of wafers W (WIP) that can be processed simultaneously in the coating and developing apparatus 1 based on the measurement transport process. Specifically, it is a condition where (WIP + a specified number) ≥ the total number of wafers W. If this condition is met, productivity may not be properly measured, therefore the transport control unit 250 generates a slicing transport process. The specified number of wafers is pre-stored in the storage unit 210. Furthermore, based on the total number of candidates for modules specified by the measurement transport process, WIP is calculated according to a specified rule (e.g., a rule that modules that will become the entry and exit points of processing block B2, regardless of the number specified by the measurement transport process, are set to 1). In addition, the number of wafers W housed in each carrier C has been counted in advance and stored in the storage unit 210.

[0101] Next, an example of a method for generating a segmented transport process based on measurements using a transport process will be described.

[0102] When a first processing module and a second processing module, which perform different processes, are specified as candidates for the transport destination in the measurement transport process RC1, the transport control unit 250 generates, for example, the following first segmentation transport process RC11 and second segmentation transport process RC12. The first segmentation transport process RC11 is a transport process that passes through the first processing module but not through the second processing module, and the second segmentation transport process RC12 is a transport process that passes through the second processing module but not through the first processing module.

[0103] Furthermore, when the first processing module is located in the first processing block and the second processing module is located in a second processing block different from the first processing block, the first segmentation and transfer process RC11 and the second segmentation and transfer process R12 are described as follows. The first segmentation and transfer process RC11 is a transfer process that passes through both the first and second processing blocks, via the first processing module but not via the second processing module. Similarly, the second segmentation and transfer process RC12 is a transfer process that passes through both the first and second processing blocks, via the second processing module but not via the first processing module.

[0104] Figure 8 The measurement transport process RC1 of (A) is a transport process via the left sub-block B21, interface block B3, and right sub-block B22. In this case, the transport control unit 250 generates a first segmented transport process RC11 and a second segmented transport process RC12 based on the measurement transport process RC1, for example as follows: Figure 8(B) and Figure 8 As shown in (C).

[0105] Figure 8 The first segmentation transport process RC11 of (B) passes through all right sub-blocks B22, interface block B3, and left sub-block B21, via the processing modules of right sub-blocks B22 and interface block B3 specified by the measurement transport process RC1, but not via the processing module of left sub-block B21. Additionally, Figure 8 The first segmentation and conveying process RC11 of (B) can be said to be a... Figure 8 The determination of (A) was performed using the following process after the conveying process RC1.

[0106] • Delete the processing module of the left sub-block B21 that is designated as a candidate transport step for the transport destination (e.g., the sixteenth transport step).

[0107] • Regarding the transport steps (e.g., the twentieth transport step) related to the left sub-block B21, which is a candidate for the transport destination and is designated as the processing module, change the candidate for the transport destination to a module other than the processing module.

[0108] Figure 8 The second segmentation transport process RC11 of (C) passes through all the right sub-blocks B22, interface block B3 and left sub-block B21, via the processing modules of interface block B3 and left sub-block B21 specified by the measurement transport process RC1, but not via the processing module of right sub-block B22.

[0109] When the transfer control unit 250 transfers the wafer W according to each segment transfer process generated as described above, the calculation unit 260 calculates the productivity based on the transfer results of each segment transfer process. Then, the calculation unit 260 sets the lowest of the calculated productivity rates as the productivity of the coating and developing apparatus 1.

[0110] <Productivity Measurement Process>

[0111] Figure 9 This is a flowchart illustrating an example of a practical process for measuring productivity.

[0112] When the operator's operation of instructing the coating and developing apparatus 1 to switch to the measurement mode via the touch panel 60 is input to the control unit 100, the mode setting unit 230 sets the mode of the coating and developing apparatus 1 to the measurement mode, and the display control unit 220 causes the touch panel 60 to display the measurement screen U (step S1).

[0113] Next, the operator's operation to start the actual measurement of the productivity of the coating and developing apparatus 1 via the instruction of the touch panel 60, that is, the operation of the start button U6 on the measurement screen U, is input to the control unit 100 (step S2).

[0114] Next, the transport process selection unit 240 selects the transport process for measurement from the candidates of transport processes pre-stored in the storage unit 210 according to the operator's operation (step S3). Specifically, when the start button U6 is operated, the transport process selection unit 240 sets the candidate transport process displayed in the transport process selection area U1 of the measurement screen U on the touch panel 60 as the transport process for measurement.

[0115] Then, for example, the transport control unit 250 determines whether the start conditions for the actual measurement of productivity are met (step S4).

[0116] If at least one of the modules specified by the measurement conveying process is in any of the following states, it is determined that the above start conditions are not met.

[0117] • Fault status

[0118] • Under maintenance

[0119] • The state of wafer W not being recovered from this module

[0120] • Available but scheduled for maintenance

[0121] • Status of being excluded from the transport destination

[0122] • In the case of this module being a liquid treatment module, the liquid being processed is being installed.

[0123] Furthermore, if the transport robot used in the transport process based on the measurement is in a faulty state, it is also determined that the above-mentioned start conditions are not met.

[0124] If the start conditions for the actual productivity measurement are not met (in the case of "No"), the process returns to step S2. At this time, the control unit 100 may also output a warning. Specifically, the display control unit 220 may also cause the touch panel 60, which is the output unit, to output a warning. In addition, when an output warning is issued, the display control unit 220 may also cause the touch panel 60 to display the status of the module that prevented the start.

[0125] On the other hand, if the start condition for the actual measurement of productivity is met ("yes"), the transport control unit 250 determines whether a segmented transport process needs to be generated, i.e., whether a segmented transport process needs to be generated (step S5), based on the condition corresponding to the total number of candidates of the module specified by the measurement transport process.

[0126] If it is determined that no dicing and transfer process will be generated ("No"), the transfer control unit 250 causes the wafer W to be transferred according to the measurement transfer process (step S6). Specifically, the transfer control unit 250 generates a transfer schedule based on the measurement transfer process stored in the storage unit 210 and the processing process associated with the transfer process. Then, the transfer control unit 250 causes the individual wafers W in the carrier C to be transferred according to the transfer schedule.

[0127] In addition, the transport control unit 250 calculates the scheduled end date and time of wafer transport for actual productivity measurement, and the display control unit 220 displays the calculation result on the touch panel 60 (step S7).

[0128] Specifically, firstly, the transport control unit 250 calculates the predetermined end date for each wafer W within the transport carrier C based on the transport schedule. This predetermined end date can be calculated based on the transport process and the associated processing processes.

[0129] Then, the display control unit 220 displays the calculated predetermined end date and time on the predetermined end date and time display area U4 of the measurement screen U on the touch panel 60.

[0130] When the wafer transfer for actual productivity measurement is completed (step S8), the calculation unit 260 calculates the productivity of the coating and developing apparatus 1 based on the results of the wafer transfer (step S9).

[0131] Specifically, for example, in wafer handling for measuring productivity, the calculation unit 260 refers to a timer (not shown) to obtain the transfer interval of each wafer W to the module of the monitored object. Then, the calculation unit 260 calculates, for example, the average value of the obtained transfer intervals, and calculates the measured value of the productivity of the coating and developing apparatus 1 based on the average value.

[0132] Then, the display control unit 220 causes the touch panel 60 to display the measured value of the calculated productivity of the coating and developing apparatus 1 (step S10).

[0133] Specifically, the display control unit 220 displays the calculated measured value of the productivity of the coating and developing apparatus 1 on the TP value display area U5 of the measurement screen U on the touch panel 60.

[0134] Furthermore, the display control unit 220 can also cause the touch panel 60 to display a screen indicating the end of the productivity test.

[0135] Alternatively, the calculation unit 260 compares the measured value of the productivity of the coating and developing apparatus 1 with the theoretical value. If the measured value does not fall within the specified range based on the theoretical value, in step S10, the display control unit 220 outputs a warning on the touch panel 60. Furthermore, for example, the calculation unit 260 calculates the theoretical value of the productivity of the coating and developing apparatus 1 when a transport schedule has been created based on the measurement transport process.

[0136] Alternatively, after the wafer transfer for productivity measurement is completed, for example in step S10, the control unit 100 acquires the transfer log.

[0137] In step S5, if it is determined that a segmentation transport process is to be generated ("yes"), the transport control unit 250 generates a segmentation transport process based on the measured transport process (step S11). For example, the transport control unit 250 from... Figure 8 The determination of (A) was performed using the conveying process RC1. Figure 8 The first segmentation conveying process RC11 of (B) and Figure 8 The second segmentation and conveying process RC12 of (C).

[0138] Following step S11, steps S6 to S8 are performed for each segmentation and transfer process. For example, in step S11, the first segmentation and transfer process RC11 is generated. Figure 8 In the case of the second segmentation conveying process RC12 of (C), after steps S6 to S8 are performed based on one of the first segmentation conveying process RC11 and the second segmentation conveying process RC12, steps S6 to S8 are performed based on the other.

[0139] In step S9 following step S11, the calculation unit 260 calculates the productivity of the coating and developing apparatus 1 based on the conveying results of each segmentation conveying process. Then, the calculation unit 260 sets the lowest of the calculated productivity rates as the productivity of the coating and developing apparatus 1.

[0140] Additionally, in step S10 following step S11, the display control unit 220 causes the touch panel 60 to display the productivity calculated in step S9. Alternatively, instead of the productivity of the coating and developing apparatus 1 finally obtained in step S9, or based on that productivity, the display control unit 220 may cause the calculated multiple productivity rates to be displayed in the TP value display area U5 of the measurement screen U on the touch panel 60.

[0141] Furthermore, in step S5, if it is determined that a segmentation transport process is to be generated ("yes"), the display control unit 220 can also cause the touch panel 60 to display that the measurement transport process needs to be segmented, that is, that a productivity segmentation measurement needs to be performed. Operations on this display can also cause steps after step S11 or after step S6 to begin.

[0142] <Main Effects of This Implementation Method>

[0143] According to this embodiment, the operator can measure the productivity of the coating and developing apparatus 1 simply by setting the coating and developing apparatus 1 to measurement mode and selecting a measurement transport process from a predetermined transport process. Therefore, according to this embodiment, the productivity of the coating and developing apparatus 1 can be measured simply.

[0144] Furthermore, according to this embodiment, when the total number of wafers W prepared for measurement is insufficient relative to the total number of candidates for the module specified by the measurement transport process, a dicing transport process can be automatically generated based on the measurement transport process. Therefore, the insufficiency described above, which results in the inability to properly measure the productivity of the coating and developing apparatus 1, can be prevented.

[0145] Furthermore, according to this embodiment, since replacement transport is performed as much as possible, it is possible to suppress the measured value of the productivity of the coating and developing apparatus 1 from being less than the theoretical value.

[0146] <Other examples of segmented transport processes>

[0147] When the processing module specified by the measurement transport process R2 exists in each layer of the processing block, the transport control unit 250 generates, for example, the following first segmentation transport process R21 and second segmentation transport process R22.

[0148] The first segmentation transport process R21 is a transport process that only passes through the processing modules present in a portion of the multiple layers where the processing modules specified by the measurement transport process exist. Specifically, the first segmentation transport process R21 is a transport process that only passes through the processing modules present in three layers when the processing modules such as the resist film forming module COT and the heating module, as specified by the measurement transport process, are provided in each of the five-layer layers.

[0149] The second segmented transport process RC2 is a transport process after removing a portion of the transport steps of a specified processing module from the measurement transport process R2.

[0150] In the case where the measurement transfer process R2 is a transfer process that returns the wafer W from the carrier block B1 to the processing block B without being transferred to the interface block B3, the first segmentation transfer process R21 and the second segmentation transfer process RC2 described above are generated.

[0151] Furthermore, the transport of wafers W under the control of the transport control unit 250 according to the first dicing transport process R21 is performed in the same manner as in the aforementioned first dicing transport process R11, etc. That is, the transport control unit 250 generates a transport schedule based on the processing process associated with the pre-dicing measurement transport process R2 and the first dicing transport process R21. Then, the transport control unit 250 transports each wafer W housed in the carrier C based on the generated transport schedule.

[0152] On the other hand, the wafer W transported under the control of the transport control unit 250 according to the second segmentation transport process R22 differs from the aforementioned first segmentation transport process R11, etc. Specifically, when transporting the wafer W according to the second segmentation transport process R22, the transport control unit 250 sets the processing time of the processing module specified by the second segmentation transport process R22 to zero seconds. More specifically, the transport control unit 250 creates a transport schedule based on the second segmentation transport process R21, and at this time, sets the processing time of the processing module specified by the second segmentation transport process R22 to zero seconds. The transport step of the processing module specified by the second segmentation transport process R22 is retained so that the processing module can be used as a buffer module.

[0153] When the transport control unit 250 transports wafer W according to the first slicing transport process R21 and the second slicing transport process R22 respectively, the calculation unit 260 calculates the productivity based on the transport result of the wafer W transported according to the first slicing transport process R21, and calculates the productivity based on the transport result of the wafer W transported according to the second slicing transport process R22.

[0154] The calculation of productivity based on the transfer results of wafer W according to the second segmentation transfer process R22 is performed in the same manner as in the aforementioned first segmentation transfer process R11, etc. That is, during the transfer of wafer W according to the second segmentation transfer process R22, the calculation unit 260 acquires the transfer interval of wafer W to the module being monitored for each wafer W. Then, the calculation unit 260 calculates, for example, the average value of the acquired transfer intervals, and calculates the productivity of the coating and developing apparatus 1 based on this average value.

[0155] Before calculating the productivity of the coating and developing apparatus 1 based on the transfer interval of wafer W to the module being monitored, the productivity calculation based on the transfer result of wafer W transferred according to the first segmentation transfer process R21 is the same as that of the second segmentation transfer process R22. In the productivity calculation based on the transfer result of wafer W transferred according to the first segmentation transfer process R21, after calculating the productivity of the coating and developing apparatus 1 based on the transfer interval, the calculation unit 260 performs a multiplication operation by multiplying the calculation result by the number of layers present in the processing module specified by the measurement transfer process, and a division operation by dividing the calculation result by the number of layers present in the processing module specified by the first segmentation transfer process R21. The calculation unit 260 sets the value obtained therefrom as the productivity calculated based on the transfer result of wafer W transferred according to the first segmentation transfer process R21. Then, the calculation unit 260 sets the lower of the productivity calculated based on the transfer result of wafer W being transferred according to the first slicing transfer process R21 and the productivity calculated based on the transfer result of wafer W being transferred according to the second slicing transfer process R22 as the productivity of the coating and developing apparatus 1.

[0156] <Variations, etc.>

[0157] When wafer W is transported according to the measurement transport process, processing can be actually performed in each processing module. Alternatively, when wafer W is transported according to the measurement transport process, processing can be performed without actually performing processing in the processing module. When wafer W is transported according to the measurement transport process, regarding the liquid processing module, the nozzle 33 can be moved but the processing liquid can be ejected from the nozzle 33.

[0158] In the coating and developing apparatus 1 in the measurement mode, the control unit 100 may also prevent the generation of a transport schedule for wafers W other than those used for productivity measurement. Specifically, the control unit 100 may also prevent the generation of a transport schedule from sources other than the measurement screen U.

[0159] Furthermore, in measurement mode, when the coating and developing apparatus 1 receives instructions from an external device via external communication, it may hinder the measurement of the productivity of the coating and developing apparatus 1. Specifically, it may hinder the transport of the wafer W according to the measurement transport process. Therefore, when the coating and developing apparatus 1 changes from mode to measurement mode, the mode setting unit 230 may switch the mode of external communication in the coating and developing apparatus 1 from online mode to offline mode. Alternatively, in the coating and developing apparatus 1 in measurement mode, it may be configured so that the mode of external communication cannot be switched to online mode. This can suppress the measurement of the productivity of the coating and developing apparatus 1. In addition, in offline mode, external communication may not be actually cut off, and the receipt of instructions from external devices via external communication may be stopped but not cut off.

[0160] Alternatively, during the measurement mode of the coating and developing apparatus 1, the cleaning of the liquid treatment module and the virtual ejection of the treatment liquid from the nozzle 33 of the liquid treatment module are prohibited by the control unit 100. Specifically, the prohibition period is from the start of wafer transport according to the measurement transport process until the final wafer W passes through the layer block of the liquid treatment module, which is the target of cleaning and virtual ejection. As a result, the time during which cleaning and virtual ejection are prohibited can be shortened.

[0161] Furthermore, the prohibited virtual ejection is periodic virtual ejection. Virtual ejection can also be performed from the start of the transport schedule corresponding to the fabrication and measurement transport process until the start of transporting wafer W based on the transport schedule. For liquid processing modules located on the same layer and with the same transport steps, this timed virtual ejection can be performed simultaneously.

[0162] Alternatively, during the measurement mode of the coating and developing apparatus 1, the display control unit 220 may prevent the display of a screen that would affect the transport, or the control unit 100 may prevent the handling of any operations related to that screen.

[0163] Operations that affect transport are described below.

[0164] • Operation for installing processing fluid into the liquid treatment module

[0165] • Operation of the supply pipeline for the processing fluid shared by the fluid processing modules

[0166] • Used to stop or interrupt the transport of wafer W based on a transport schedule.

[0167] • Operations used to set a state for scheduled maintenance.

[0168] Specifically, the invalidation period is from the start of wafer transport according to the measurement transport process until the final wafer W passes through the processing module or the layer block where the processing module is located. This shortens the invalidation time.

[0169] The embodiments disclosed herein should be considered illustrative in all respects and not restrictive. The above embodiments can be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit. For example, the constituent elements of the above embodiments can be arbitrarily combined. According to such arbitrary combinations, the functions and effects of each structural element related to the combination can be obtained, and other functions and effects that are clearly known to those skilled in the art based on the description herein can be obtained.

[0170] Furthermore, the effects described in this specification are merely illustrative or exemplary and not limiting. In other words, the technology of this invention can replace the aforementioned effects or, based on the aforementioned effects, achieve other effects that are clearly known to those skilled in the art from the description herein.

[0171] In addition, the following structural examples also fall within the technical scope of this invention.

[0172] (1) A measurement method for measuring the productivity of a substrate processing apparatus, the substrate processing apparatus comprising a plurality of modules including a plurality of processing modules and a transfer robot for transferring substrates to the plurality of modules, the measurement method comprising the following steps:

[0173] The mode of the substrate processing device is set to a measurement mode for measuring the productivity, based on the user's operation; and

[0174] Based on the user's operation, the measurement transport process to be used in the measurement mode is selected from the candidates of transport processes pre-stored in the storage unit.

[0175] In this process, the transport path of the substrate is specified for each transport step on a per-module basis, with the module serving as the transport destination as the unit.

[0176] The determination method also includes the following steps:

[0177] The substrate is transported within the substrate processing apparatus according to the transport process selected in the process of making the selection; and

[0178] The productivity is calculated based on the conveying results during the conveying process.

[0179] (2) According to the determination method described in (1), wherein,

[0180] It also includes the following steps: generating a segmented transport process that divides the measurement transport process into multiple segments.

[0181] In the conveying process, the substrate is conveyed according to each of the segmented conveying processes generated in the generating process.

[0182] In the process of performing the calculation, the productivity is calculated based on the conveying results of each of the segmented conveying processes in the conveying process.

[0183] (3) According to the determination method described in (2), wherein,

[0184] It also includes the following steps: determining whether the segmentation transport process needs to be generated based on conditions corresponding to the number of modules specified by the measurement transport process.

[0185] The process of generating the segmentation and conveying process is performed only if the process that makes the determination determines that it is necessary.

[0186] (4) According to the determination method described in (2) or (3), wherein,

[0187] The plurality of processing modules includes a first processing module and a second processing module that perform different processing operations.

[0188] When the transport process selected in the process of making the selection specifies both the first processing module and the second processing module, in the process of generating the segmented transport process, a first segmented transport process is generated that passes through the first processing module but not through the second processing module, and a second segmented transport process is generated that passes through the second processing module but not through the first processing module.

[0189] (5) According to the determination method described in (2) or (3), wherein,

[0190] The substrate processing apparatus includes:

[0191] A carrier block for moving substrates in and out of a container holding multiple substrates and the substrate processing apparatus; and

[0192] A processing block that processes the substrate moved in from the carrier block.

[0193] The processing block is composed of stacked layers.

[0194] The processing modules specified by the measurement conveying process exist in each of the layers.

[0195] In the process of generating the segmentation and conveying process, a first segmentation and conveying process and a second segmentation and conveying process are generated. The first segmentation and conveying process specifies only the processing modules present in a portion of the multiple layers in which the processing modules specified by the measurement conveying process exist. The second segmentation and conveying process is a segmentation and conveying process after deleting a portion of the conveying steps specifying the processing modules from the measurement conveying process.

[0196] During the conveying process, when the substrate is conveyed according to the second segmentation conveying process, the time during which the substrate remains in the processing module specified by the second segmentation conveying process is set to zero seconds.

[0197] (6) The determination method according to any one of (1) to (3), wherein,

[0198] It also includes the process of displaying the operation screen.

[0199] In the selection process, the measurement conveying process is selected based on the user's operation on the operation screen.

[0200] (7) The determination method described in any one of (1) to (6), wherein,

[0201] In the measurement mode, the substrate processing device prohibits the creation of substrate transport schedules and external communication, except for those used for productivity measurement.

[0202] (8) The determination method described in any one of (1) to (7), wherein,

[0203] The plurality of processing modules include a liquid processing module, which has a spray section for dispensing processing liquid.

[0204] In the measurement mode, the substrate processing device prohibits the virtual ejection of processing liquid from the ejection section of the liquid processing module.

[0205] (9) The determination method described in any one of (1) to (8), wherein,

[0206] It also includes the following steps: outputting a warning when the module specified by the measurement conveying process is under maintenance.

[0207] (10) The determination method described in any one of (1) to (9), wherein,

[0208] The plurality of modules includes buffer modules not specified in the transport process but which the substrate can pass through, enabling the substrate to pass through these buffer modules, etc.

[0209] In the conveying process, multiple substrates are conveyed within the substrate processing apparatus according to the measurement conveying process.

[0210] In the process of performing the calculation, the productivity is calculated based on the transfer results in the process of transferring the multiple substrates.

[0211] During the conveying process, the buffer modules are shared between the substrates.

[0212] (11) The determination method described in any one of (1) to (10), wherein,

[0213] The transport robot has two substrate support portions for supporting the substrate.

[0214] In the conveying process, the substrate is conveyed according to the time series data of the conveying cycle based on the measurement conveying process.

[0215] In the transport cycle, the order in which the substrates are transported into the substrate processing apparatus corresponds to the module that serves as the transport destination in the transport cycle.

[0216] For a module capable of using the same transport robot to move the substrate in and out, if a first substrate can be moved out of the module and a second substrate different from the first substrate is planned to be moved into the module in the same transport cycle, after moving the first substrate into the module using one of the two substrate supports, the second substrate is moved out of the module using the other of the two substrate supports while the transport robots are still facing each other.

[0217] (12) A program, which is run by a computer of the control unit of a control board processing apparatus, so that the substrate processing apparatus performs the measurement method described in any one of (1) to (11).

[0218] (13) A substrate processing apparatus comprising:

[0219] Multiple modules, including multiple processing modules;

[0220] A transport robot that transports substrates to the plurality of modules; and

[0221] Control Department

[0222] The control unit includes:

[0223] The mode setting unit sets the mode of the substrate processing apparatus to a measurement mode for measuring the productivity of the substrate processing apparatus according to the user's operation.

[0224] The transport process selection unit selects the measurement transport process to be used in the measurement mode from the candidates of transport processes pre-stored in the storage unit according to the user's operation, wherein the transport process specifies the transport path of the substrate on a module-by-module basis for each transport step.

[0225] A transport control unit that causes the substrate to be transported within the substrate processing apparatus according to the transport process selected by the transport process selection unit; and

[0226] The calculation unit calculates the productivity based on the conveying results controlled by the conveying control unit.

[0227] (14) The substrate processing apparatus according to (13), wherein,

[0228] The transport process selection unit generates a segmented transport process that divides the measurement transport process into multiple segments.

[0229] The transport control unit transports the substrate according to each of the generated segmentation transport processes.

[0230] The calculation unit calculates the productivity based on the conveying results of each segmented conveying process under the control of the conveying control unit.

[0231] (15) The substrate processing apparatus according to (14), wherein,

[0232] The transport control unit determines whether the segmented transport process needs to be generated based on a condition corresponding to the number of modules specified by the measurement transport process, and generates the segmented transport process only if it is determined to be necessary.

[0233] (16) The substrate processing apparatus according to (14) or (15), wherein,

[0234] The plurality of processing modules includes a first processing module and a second processing module that perform different processing operations.

[0235] When the first processing module and the second processing module are specified by the measurement conveying process, the conveying control unit generates a first segmented conveying process that passes through the first processing module but not through the second processing module, and a second segmented conveying process that passes through the second processing module but not through the first processing module.

[0236] (17) The substrate processing apparatus according to (14) or (15) further comprises:

[0237] A carrier block for moving substrates in and out of a container holding multiple substrates and the substrate processing apparatus; and

[0238] A processing block that processes the substrate moved in from the carrier block.

[0239] The processing block is composed of stacked layers.

[0240] The processing modules specified by the measurement conveying process exist in each of the layers.

[0241] When generating the segmented transport process, the transport control unit generates a first segmented transport process and a second segmented transport process. The first segmented transport process specifies only the processing modules present in a portion of the multiple layers containing the processing modules specified by the measurement transport process. The second segmented transport process removes a portion of the transport steps specifying the processing modules from the measurement transport process.

[0242] When the substrate is transported according to the second segmentation transport process, the transport control unit sets the time during which the substrate remains in the processing module specified by the second segmentation transport process to zero seconds.

[0243] (18) The substrate processing apparatus according to any one of (13) to (17), wherein,

[0244] It also has a display unit for showing the operation screen.

[0245] The transport process selection unit selects the transport process based on the user's operation on the operation screen.

[0246] (19) The substrate processing apparatus according to any one of (13) to (18), wherein,

[0247] The control unit prohibits the creation of substrate transport schedules and external communication, except for those used for productivity measurement, in the measurement mode.

[0248] (20) The substrate processing apparatus according to any one of (13) to (19), wherein,

[0249] The plurality of processing modules include a processing module, wherein the liquid processing module has a spraying part for spraying out the processing liquid.

[0250] The control unit prohibits the virtual ejection of the treatment liquid from the ejection section of the liquid treatment module in the measurement mode.

[0251] Explanation of reference numerals in the attached figures

[0252] 1: Coating and developing apparatus; 22: Transfer robot; 42: Transfer robot; 52: Transfer robot; 53: Transfer robot; 100: Control unit; 230: Mode setting unit; 240: Transfer process selection unit; 250: Transfer control unit; 260: Calculation unit; COT: Resist forming module; CPL: Transfer module; DEV: Developing module; M1: Transfer robot; Q1: Transfer robot; T: Vertical module; TCT: Anti-reflective film forming module; TRS: Transfer module; U: Vertical module; W: Wafer.

Claims

1. A measurement method for measuring the productivity of a substrate processing apparatus, the substrate processing apparatus comprising multiple modules including multiple processing modules and a transfer robot for transferring substrates to the multiple modules, the measurement method comprising the following steps: The mode of the substrate processing device is set to the measurement mode for measuring the productivity, based on the user's operation. as well as Based on the user's operation, the measurement transport process to be used in the measurement mode is selected from the candidates of transport processes pre-stored in the storage unit. in, The transfer process specifies the transfer path of the substrate for each transfer step, on a unit basis, with the module as the transfer destination. The determination method also includes the following steps: The substrate is transported within the substrate processing apparatus according to the transport process selected in the process of making the selection. as well as The productivity is calculated based on the conveying results during the conveying process.

2. The determination method according to claim 1, wherein, It also includes the following steps: generating a segmented transport process that divides the measurement transport process into multiple segments. In the conveying process, the substrate is conveyed according to each of the segmented conveying processes generated in the generating process. In the process of performing the calculation, the productivity is calculated based on the conveying results of each of the segmented conveying processes in the conveying process.

3. The determination method according to claim 2, wherein, It also includes the following steps: determining whether the segmented transport process needs to be generated based on conditions corresponding to the number of modules specified by the measurement transport process. The process of generating the segmentation and conveying process is performed only if the process that makes the determination determines that it is necessary.

4. The determination method according to claim 2 or 3, wherein, The plurality of processing modules includes a first processing module and a second processing module that perform different processing operations. When the transport process selected in the process of making the selection specifies both the first processing module and the second processing module, in the process of generating the segmented transport process, a first segmented transport process is generated that passes through the first processing module but not through the second processing module, and a second segmented transport process is generated that passes through the second processing module but not through the first processing module.

5. The determination method according to claim 2 or 3, wherein, The substrate processing apparatus includes: A carrier block for moving substrates in and out of a container holding multiple substrates and the substrate processing apparatus; and A processing block that processes the substrate moved in from the carrier block. The processing block is composed of stacked layers. The processing modules specified by the measurement conveying process exist in each of the layers. In the process of generating the segmentation and conveying process, a first segmentation and conveying process and a second segmentation and conveying process are generated. The first segmentation and conveying process specifies only the processing modules present in a portion of the multiple layers in which the processing modules specified by the measurement conveying process exist. The second segmentation and conveying process is a segmentation and conveying process after deleting a portion of the conveying steps specifying the processing modules from the measurement conveying process. During the conveying process, when the substrate is conveyed according to the second segmentation conveying process, the time that the substrate remains in the processing module specified in the second segmentation conveying process is set to zero seconds.

6. The determination method according to any one of claims 1 to 3, wherein, It also includes the process of displaying the operation screen. In the selection process, the measurement conveying process is selected based on the user's operation on the operation screen.

7. The determination method according to any one of claims 1 to 3, wherein, In the measurement mode, the substrate processing device prohibits the creation of substrate transport schedules and external communication, except for those used for productivity measurement.

8. The determination method according to any one of claims 1 to 3, wherein, The plurality of processing modules include a liquid processing module, which has a spray section for dispensing processing liquid. In the measurement mode, the substrate processing device prohibits the virtual ejection of processing liquid from the ejection section of the liquid processing module.

9. The determination method according to any one of claims 1 to 3, wherein, It also includes the following steps: outputting a warning when the module specified by the measurement conveying process is under maintenance.

10. The determination method according to any one of claims 1 to 3, wherein, The plurality of modules includes a buffer module that is not specified in the transport process but can be passed through by the substrate, allowing the substrate to wait in the buffer module. In the conveying process, multiple substrates are conveyed within the substrate processing apparatus according to the measurement conveying process. In the process of performing the calculation, the productivity is calculated based on the transfer results in the process of transferring the multiple substrates. During the conveying process, the buffer modules are shared between the substrates.

11. The determination method according to any one of claims 1 to 3, wherein, The transport robot has two substrate support portions for supporting the substrate. In the conveying process, the substrate is conveyed according to the time series data of the conveying cycle based on the measurement conveying process. In the transport cycle, the order in which the substrates are transported into the substrate processing apparatus corresponds to the module that serves as the transport destination in the transport cycle. For a module capable of using the same transport robot to move the substrate in and out, if a first substrate can be moved out of the module and a second substrate different from the first substrate is planned to be moved into the module in the same transport cycle, after moving the first substrate into the module using one of the two substrate supports, the second substrate is moved out of the module using the other of the two substrate supports while the transport robots are still facing each other.

12. A computer program product comprising a program that is run by a computer of a control unit of a control board processing apparatus to cause the substrate processing apparatus to perform the measurement method according to any one of claims 1 to 3.

13. A substrate processing apparatus comprising: Multiple modules, including multiple processing modules; A transport robot that transports substrates to the plurality of modules; and Control Department in, The control unit has: The mode setting unit sets the mode of the substrate processing apparatus to a measurement mode for measuring the productivity of the substrate processing apparatus according to the user's operation. The transport process selection unit selects the measurement transport process to be used in the measurement mode from the candidates of transport processes pre-stored in the storage unit according to the user's operation, wherein the transport process specifies the transport path of the substrate on a module-by-module basis for each transport step. A transport control unit that causes the substrate to be transported within the substrate processing apparatus according to the transport process selected by the transport process selection unit; and The calculation unit calculates the productivity based on the conveying results controlled by the conveying control unit.

14. The substrate processing apparatus according to claim 13, wherein, The transport process selection unit generates a segmented transport process that divides the measurement transport process into multiple segments. The transport control unit causes the substrate to be transported according to each of the generated segmented transport processes. The calculation unit calculates the productivity based on the conveying results of each segmented conveying process under the control of the conveying control unit.

15. The substrate processing apparatus according to claim 14, wherein, The transport control unit determines whether the segmented transport process needs to be generated based on a condition corresponding to the number of modules specified in the measurement transport process, and generates the segmented transport process only if it is determined to be necessary.

16. The substrate processing apparatus according to claim 14 or 15, wherein, The plurality of processing modules includes a first processing module and a second processing module that perform different processing operations. When both the first processing module and the second processing module are specified in the measurement conveying process, the conveying control unit generates a first segmented conveying process that passes through the first processing module but not through the second processing module, and a second segmented conveying process that passes through the second processing module but not through the first processing module.

17. The substrate processing apparatus according to claim 14 or 15, further comprising: A carrier block for moving substrates in and out of a container holding multiple substrates and the substrate processing apparatus; and A processing block that processes the substrate moved in from the carrier block. in, The processing block is stacked with layers of blocks. The processing modules specified in the measurement conveying process exist in each of the layers. When generating the segmentation transport process, the transport control unit generates a first segmentation transport process and a second segmentation transport process. The first segmentation transport process specifies only the processing modules present in a portion of the multiple layers containing the processing modules specified in the measurement transport process. The second segmentation transport process is a segmentation transport process after deleting a portion of the transport steps specifying the processing modules from the measurement transport process. When the substrate is transported according to the second segmentation transport process, the transport control unit sets the time during which the substrate remains in the processing module specified in the second segmentation transport process to zero seconds.

18. The substrate processing apparatus according to any one of claims 13 to 15, wherein, It also has a display unit for showing the operation screen. The transport process selection unit selects the transport process based on the user's operation on the operation screen.

19. The substrate processing apparatus according to any one of claims 13 to 15, wherein, The control unit prohibits the creation of substrate transport schedules and external communication, except for those used for productivity measurement, in the measurement mode.

20. The substrate processing apparatus according to any one of claims 13 to 15, wherein, The plurality of processing modules include a liquid processing module, which has a spray section for dispensing processing liquid. The control unit prohibits the virtual ejection of the treatment liquid from the ejection section of the liquid treatment module in the measurement mode.

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