An electrostatic protection electronic chip production attaching device

Abstract

The application relates to the technical field of electronic chip production adhesion, in particular to an adhesion device for static protection electronic chip production, which comprises an adhesion mechanism, the adhesion mechanism comprises an adhesion frame, a discharge processing seat is fixedly connected to the bottom of the inner wall of the adhesion frame, the discharge processing seat is grounded through a wire, the discharge processing seat is used for placing an electronic chip to be adhered, an electric cylinder is fixedly connected to the top of the adhesion frame, a clamping plate is fixedly connected to the output end of the electric cylinder and penetrates to the inner side of the adhesion frame, the electronic chip is placed into the adhesion mechanism, a clamping mechanism is started to clamp the electronic chip, the clamping mechanism has a certain elasticity to slightly buffer and compensate the clamped electronic chip, a dynamic static electricity elimination mechanism is started to eliminate dynamic static electricity existing when the electronic chip is placed and adhered, and a cleaning mechanism is started to clean the adhesion mechanism.

Description

Technical Field

[0001] This invention relates to the technical field of electronic chip manufacturing and bonding, and more particularly to a bonding device for electrostatic protection in electronic chip manufacturing. Background Technology

[0002] Electrostatic discharge (ESD) protection electronic chips are high-precision ESD-sensitive devices. Their manufacturing and bonding processes place extremely high demands on equipment protection accuracy, positioning stability, and the uniformity of auxiliary material coating. Existing bonding equipment typically employs a crude ESD protection solution of grounding combined with overall enclosure humidification. This solution can only eliminate static accumulated static electricity on the equipment and workpiece surfaces and cannot address the dynamic frictional static electricity generated throughout the chip gripping, alignment, adhesive layer stretching, and pressing bonding processes. It is also difficult to eliminate residual micro-electric fields in the workstation space, which can easily cause implicit charging and breakdown voltage drift within the ESD protection chip's internal circuitry. Furthermore, the minute potential differences created by single-point grounding of various equipment components can generate micro-discharges at the moment of workpiece contact bonding, causing implicit junction damage to the chip that cannot be detected by conventional testing. This severely affects the chip's ESD protection performance and long-term reliability. Moreover, the overall humidification method is prone to localized condensation, and moisture seeping into the bonding interface can lead to increased leakage current in the chip later, further exacerbating the risk of product failure.

[0003] Meanwhile, existing bonding equipment uses a rigid clamping structure to limit and fix the chip, lacking a micro-buffering compensation structure. During chip positioning, the chip is easily pushed hard, causing micro-chipping at the chip edges and micro-scratches on the surface passivation layer. This disrupts the inherent electric field distribution at the edge of the electrostatic protection chip, weakening its electrostatic protection capability. Furthermore, the protective pads of the equipment are prone to micro-uniform deformation under long-term pressure, leading to chip tilting and further exacerbating subsequent bonding misalignment and uneven bonding gaps. In addition, the existing equipment's adhesive spraying structure lacks micro-volume control and anti-adhesion design. After long-term use, the dispensing needle easily accumulates dry adhesive residue, changing the actual dispensing orifice diameter and causing slight fluctuations in the amount of adhesive dispensed per batch. This results in uneven conductive adhesive layer thickness and localized adhesive overflow, which not only causes hidden micro-leakage at the chip pins but also leads to uneven distribution of conductive particles in the chip pad area and large dispersion in on-resistance. This significantly reduces the consistency and production yield of electrostatic protection electronic chip bonding, making it difficult to meet the requirements of high-precision, high-reliability mass production. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the bonding device for the production of electrostatic protected electronic chips, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a bonding device for electrostatic protection in the production of electronic chips, which aims to solve chip production defects such as electrostatic damage during bonding, rigid clamping damage, and glue accumulation at the spraying point.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including, A bonding mechanism includes a bonding frame, an electrical discharge machining (EDM) base fixedly connected to the bottom of the inner wall of the bonding frame, the EDM base being grounded by a wire, the EDM base being used to place an electronic chip to be bonded, an electric cylinder fixedly connected to the top of the bonding frame, the output end of the electric cylinder extending through to the inner side of the bonding frame and fixedly connected to a bonding plate, a glue spraying head being provided at the bottom left side of the bonding plate, a connecting pipe fixedly connected to the top left side of the glue spraying head, and the top of the connecting pipe being fixedly connected to the left side of the top of the inner wall of the bonding frame. A clamping mechanism includes two mounting plates. The bottom of the mounting plates is fixedly connected to both sides of the bottom of the inner wall of the bonding frame. An airbag is fixedly connected to the inner side of the mounting plate, and a clamping plate is fixedly connected to the inner side of the airbag. A cleaning system, comprising a diversion assembly and a scraping assembly; A dynamic static electricity elimination mechanism, which includes an exhaust component and a delay component.

[0008] As a preferred embodiment of the bonding device for electrostatic protection electronic chip production according to the present invention, the shunt component includes a pressure valve, two pressure valves are provided, the inner side of the pressure valve is fixedly connected to the bottom of the outer side of the mounting plate, the pressure valve is connected to the air bag, and a one-way valve is fixedly connected to the top of the left side of the connecting pipe, the one-way valve is connected to the connecting pipe, and the one-way valve is connected to the pressure valve.

[0009] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production according to the present invention, the scraping component includes a collection groove, which is opened on the left side of the top of the bonding plate, and a scraper is fixedly connected to the top of the left side of the bonding plate.

[0010] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production according to the present invention, the exhaust assembly includes two jog mechanical button valves. The inner side of each jog mechanical button valve is fixedly connected to the rear side of the top outer side of the mounting plate. The jog mechanical button valve is connected to the airbag. An air blowing box is fixedly connected to the top of the clamping plate. An air jet groove is opened on the inner side of the bottom of the air blowing box. A positive and negative ion generator is fixedly connected inside the air blowing box. The jog mechanical button valve is connected to the air blowing box. A pressing element is provided on the top of the jog mechanical button valve.

[0011] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production according to the present invention, the delay component includes a transmission plate, the front side of which is fixedly connected to the back side of the bonding plate, guide holes are provided on the front sides of the top two sides of the transmission plate, guide rods are provided inside the guide holes, the bottom of the guide rods are fixedly connected to the top of the pressing member, a mounting plate is fixedly connected to the top of the guide plate, a tension spring is fixedly connected to the bottom of the mounting plate, and the other end of the tension spring is fixedly connected to the front sides of the top two sides of the transmission plate.

[0012] As a preferred embodiment of the bonding device for electrostatic protection electronic chip production described in this invention, the four corners of the outer side of the clamping plate are fixedly connected with limit rods, and the inner side of the mounting plate is provided with four limit holes, the inner wall of the limit holes being slidably connected to the surface of the limit rods.

[0013] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production described in this invention, a limiting disk is fixedly connected to the outer side of the limiting rod, and the diameter of the limiting disk is larger than the diameter of the inner wall of the limiting hole.

[0014] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production described in this invention, the airbag is connected to an external air source, and when the airbag drives the clamping plate to clamp the electronic chip, the elasticity of the airbag after inflation can provide micro-buffering compensation for the clamped electronic chip.

[0015] In a preferred embodiment of the bonding device for electrostatic protection electronic chip production described in this invention, after the airbag is continuously injected with gas, the excess airflow is discharged through the pressure valve and the one-way valve to the connecting pipe and the inside of the spray nozzle for air jet cleaning.

[0016] In a preferred embodiment of the bonding device for producing electrostatic protection electronic chips according to the present invention, when the bonding plate is reset upward, it drives the scraper to scrape off excess glue from the glue spraying point of the glue spraying head, and the scraped glue is collected through the collection tank.

[0017] The beneficial effects of this invention are as follows: When an electronic chip is placed in the bonding mechanism, the clamping mechanism is activated to clamp the electronic chip. At the same time, the clamping mechanism has a certain elasticity to provide micro-buffering compensation for the clamped electronic chip. During bonding, a dynamic static electricity elimination mechanism is activated to eliminate the dynamic static electricity present during the placement and bonding of the electronic chip. At the same time, a cleaning mechanism is activated to clean the bonding mechanism. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 A three-dimensional structural diagram of the mounting plate provided by the present invention.

[0020] Figure 3 This is a three-dimensional structural diagram of the glue spray head provided by the present invention.

[0021] Figure 4 This is a three-dimensional structural diagram of the bonding plate provided by the present invention.

[0022] Figure 5 This is a cross-sectional structural diagram of the air blowing box provided by the present invention. Detailed Implementation

[0023] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0025] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0026] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0027] Example 1

[0028] Reference Figures 1-5 In the first embodiment of the present invention, a bonding mechanism 100 and a clamping mechanism 200 are provided to achieve a certain elasticity to provide micro-buffering compensation for the clamped electronic chip when bonding.

[0029] The bonding mechanism 100 includes a bonding frame 101. A discharge machining (DMC) base 102 is fixedly connected to the bottom of the inner wall of the bonding frame 101. The DMC base 102 is grounded by a wire and is used to place the electronic chip to be bonded. An electric cylinder 103 is fixedly connected to the top of the bonding frame 101. The output end of the electric cylinder 103 extends through to the inner side of the bonding frame 101 and is fixedly connected to a bonding plate 104. A glue spray head 105 is located at the bottom left side of the bonding plate 104. A connecting pipe 106 is fixedly connected to the top left side of the glue spray head 105. The top of the connecting pipe 106 is fixedly connected to the left side of the top of the inner wall of the bonding frame 101. A clamping mechanism 200 includes two mounting plates 201. The bottom of the mounting plate 201... The mounting plate 201 is fixedly connected to both sides of the bottom of the inner wall of the bonding frame 101. An airbag 202 is fixedly connected to the inner side of the mounting plate 201, and a clamping plate 203 is fixedly connected to the inner side of the airbag 202. The airbag 202 is connected to an external air source. When the airbag 202 drives the clamping plate 203 to clamp the electronic chip, the elasticity of the airbag 202 after inflation can provide micro-buffering compensation for the clamped electronic chip. Limiting rods 204 are fixedly connected to the four corners of the outer side of the clamping plate 203. Four limiting holes 205 are opened on the inner side of the mounting plate 201. The inner wall of the limiting hole 205 is slidably connected to the surface of the limiting rod 204. A limiting plate 206 is fixedly connected to the outer side of the limiting rod 204. The diameter of the limiting plate 206 is larger than the diameter of the inner wall of the limiting hole 205.

[0030] Specifically, the flexible deformation characteristics of the inflatable airbag 202 are used to replace the rigid metal limiting structure. After the chip is placed on the grounded surface of the discharge processing base 102, the airbags 202 on both sides inflate and expand synchronously, pushing the clamping plate 203 to move inward and clamp the chip smoothly. Relying on the elastic expansion and contraction performance of the airbag 202 after inflation, it can adapt to the micron-level deformation and placement deviation of the chip surface, and provide slight buffer compensation for the clamping force. This effectively avoids the problems of chip corner chipping and micro-scratches on the surface passivation layer caused by excessive pushing force and stiff positioning in traditional rigid clamping. At the same time, the sliding cooperation between the four corner limiting rods 204 and the limiting holes 205 can ensure that the clamping plate 203 moves horizontally and smoothly, eliminating the chip tilting and alignment deviation caused by clamping offset, and stabilizing the chip's bonding posture.

[0031] Furthermore, during the operation, the electrostatic protection electronic chip to be bonded is first placed stably on the grounded discharge processing base 102. The discharge processing base 102 is used to discharge the static static electricity accumulated on the chip surface in advance. Then, an external air source inflates the air bladders 202 on both sides at a uniform speed. The air bladders 202 gradually expand and push the clamping plates 203 slowly towards the sides of the chip until the clamping plates 203 are in contact with the sidewalls of the chip. The chip is held in place with a small air pressure. During the clamping process, if there is a slight placement deviation of the chip or Under pressure and slight deformation, the airbag 202 can adapt itself through slight elastic deformation, always maintaining a balanced and gentle clamping force to avoid hard squeezing and damaging the chip. The limiting rod 204 slides horizontally along the limiting hole 205 synchronously with the clamping plate 203. The limiting plate 206 can prevent the clamping plate 203 from excessive displacement and falling off, ensuring the stability of the clamping operation. After clamping is completed, the electric cylinder 103 is started to drive the bonding plate 104 to move down, driving the glue spraying head 105 to complete the alignment, glue spraying and chip pressing bonding operation.

[0032] Example 2

[0033] Reference Figures 1-5 In the second embodiment of the present invention, a cleaning mechanism 300 and a dynamic static electricity elimination mechanism 400 are provided to clean the adhesive spraying area and eliminate static electricity during the placement of electronic chips.

[0034] The cleaning mechanism 300 includes a diversion assembly 301 and a scraping assembly 302. The diversion assembly 301 includes two pressure valves 301a. The inner side of the pressure valve 301a is fixedly connected to the bottom of the outer side of the mounting plate 201. The pressure valve 301a is connected to the airbag 202. A one-way valve 301b is fixedly connected to the top of the left side of the connecting pipe 106. The one-way valve 301b is connected to the connecting pipe 106 and the pressure valve 301a. After the airbag 202 is continuously injected with gas, the excess airflow is diverted through the pressure valve 301a and the one-way valve 301a. The gas is discharged through valve 301b into the connecting pipe 106 and the inside of the spray nozzle 105 for air cleaning. The scraping assembly 302 includes a collection groove 302a, which is located on the left side of the top of the bonding plate 104. A scraper 302b is fixedly connected to the top left side of the bonding plate 104. When the bonding plate 104 is reset upward, the scraper 302b is driven to scrape off the excess glue from the spray nozzle 105. The scraped glue is collected through the collection groove 302a. The dynamic static elimination mechanism 400 includes an exhaust assembly 401 and a delay assembly 402. The exhaust assembly 401 includes a jog mechanical button. Two jog-type mechanical button valves 401a are provided. The inner side of the jog-type mechanical button valve 401a is fixedly connected to the rear side of the top of the outer side of the mounting plate 201. The jog-type mechanical button valve 401a is connected to the airbag 202. An air box 401b is fixedly connected to the top of the clamping plate 203. An air jet groove 401c is opened on the inner side of the bottom of the air box 401b. A positive and negative ion generator 401e is fixedly connected inside the air box 401b. The jog-type mechanical button valve 401a is connected to the air box 401b. The top of the jog-type mechanical button valve 401a is provided with... There is a pressing component 401d, and the delay component 402 includes a transmission plate 402a. The front side of the transmission plate 402a is fixedly connected to the back side of the bonding plate 104. Guide holes 402b are opened on the front side of the top two sides of the transmission plate 402a. Guide rods 402c are opened inside the guide holes 402b. The bottom of the guide rods 402c is fixedly connected to the top of the pressing component 401d. A mounting plate 402d is fixedly connected to the top of the guide plate. A tension spring 402e is fixedly connected to the bottom of the mounting plate 402d. The other end of the tension spring 402e is fixedly connected to the front side of the top two sides of the transmission plate 402a.

[0035] Specifically, relying on the redundant airflow of the airbag 202 to achieve air source reuse, there is no need to add an additional independent air source, resulting in a simplified structure and lower energy consumption. On the one hand, the excess airflow after the airbag 202 is inflated and stabilized can be introduced into the glue spray head 105 and the connecting tube 106 through the pressure valve 301a and the one-way valve 301b. The high-speed airflow continuously blows the inner wall of the needle, effectively removing the long-term accumulated nano-level dry glue residue, eliminating problems such as glue output fluctuations, uneven glue layer thickness, and lead overflow and leakage caused by glue residue accumulation, thus achieving self-cleaning of the glue spraying structure. On the other hand, during the resetting and upward movement of the bonding plate 104, it can... The scraper 302b automatically scrapes away excess adhesive remaining at the port of the spray nozzle 105, which is then collected in the collection tank 302a to prevent residual adhesive from dripping and contaminating the chip and work station. At the same time, relying on the reset action of the bonding plate 104, the delayed pressing structure triggers the positive and negative ion generator 401e to work with excessive airflow to directionally blow the workpiece. This can neutralize the dynamic frictional static electricity and residual micro-electric field generated during the chip bonding process of gripping, alignment, and pressing, eliminating hidden electrostatic damage. Furthermore, the tension spring 402e delay structure enables continuous air blowing after reset, taking into account both finished product cooling and secondary static elimination effects.

[0036] Furthermore, during the pressure-holding process of the airbag 202, the continuously introduced excess gas is stabilized and diverted by the pressure valve 301a, and then introduced into the connecting pipe 106 and the inside of the spray head 105 through the one-way valve 301b. The high-speed airflow continuously washes along the inner wall of the spray head 105, cleaning the trace amounts of residual glue and dust impurities adhering to the inner wall in real time, keeping the glue spraying channel unobstructed, and ensuring that the glue output is uniform and stable each time. After a single bonding and pressing is completed, the electric cylinder 103 drives the bonding plate 104 to reset upwards. The bonding plate 104 simultaneously drives the scraper 302b to move upwards. The scraper 302b slides against the end of the spray head 105, clearing the overflow and cured residual glue accumulated on the end face of the spray head 105. The adhesive is scraped off and falls directly into the collection tank 302a at the top for centralized collection, preventing residual adhesive from falling and contaminating the workpiece. At the same time, the bonding plate 104 moves upward, causing the transmission plate 402a on the back to rise synchronously. The transmission plate 402a drives the guide rod 402c to move downward through the tension spring 402e and the mounting plate 402d, pressing the pressing part 401d. This triggers the jog mechanical button valve 401a to open, and the airbag 202 flows into the air blowing box 401b. Together with the positive and negative ion generator 401e, it generates a high-density positive and negative ion airflow, which is evenly blown onto the chip surface and bonding station through the air jet groove 401c, neutralizing dynamic static electricity and clearing the micro electric field of the station.

[0037] The remaining structure is the same as that in Example 1.

[0038] Example 3

[0039] Reference Figures 1-5This is the third embodiment of the present invention, which differs from the second embodiment in that it provides a bonding device for the production of electrostatic protected electronic chips.

[0040] At the start of the operation, the electrostatic protection electronic chip to be processed is first placed stably on the grounded discharge processing seat 102. The static static electricity on the chip surface is pre-discharged through the discharge processing seat 102 to avoid the risk of initial static electricity accumulation. Then, the external air source is started to inflate the airbags 202 on both sides at a uniform speed. The airbags 202 slowly expand and push the clamping plates 203 on both sides to move horizontally in opposite directions. With the limit rod 204 limiting and guiding, the chip is stably clamped and fixed. The flexible elasticity of the airbags 202 realizes micro-buffering clamping, which completely avoids the chip micro-damage and placement misalignment problems caused by traditional rigid clamping, and accurately positions the chip bonding station.

[0041] After the chip is clamped and positioned, the electric cylinder 103 is activated to drive the bonding plate 104 to move vertically downward, which in turn drives the glue spraying head 105 to complete the precise alignment and automatic glue spraying operation. During the glue spraying process, the redundant airflow continuously introduced by the airbag 202 continuously blows the inner wall of the glue spraying head 105 to clean residual glue in real time, ensuring uniform coating of conductive glue and eliminating problems such as glue fluctuation and local glue overflow. After the glue spraying is completed, the bonding plate 104 continues to move downward to complete the chip pressing and bonding operation. During the entire bonding process, the dynamic static electricity generated by the friction of various parts of the equipment and the stretching of the glue layer can be neutralized in real time by the ion airflow that is turned on in advance, eliminating the latent static electricity damage.

[0042] After a single pressing and bonding process is completed, the electric cylinder 103 drives the bonding plate 104 to reset upwards. During the reset process, the bonding plate 104 drives the scraper 302b to move upwards synchronously, automatically scraping off the excess adhesive remaining at the port of the spray nozzle 105. The scraped adhesive is collected in the collection tank 302a, realizing automatic cleaning of the spray structure. At the same time, the upward movement of the bonding plate 104 drives the transmission plate 402a to rise synchronously. The transmission plate 402a pulls the tension spring 402e to generate elastic tension, which pulls the guide rod 402c to move downwards and continuously presses the pressing part 401d of the jog mechanical button valve 401a, keeping the valve in the conducting state. Even after the bonding plate 104 is completely reset, relying on the delayed rebound characteristic of the tension spring 402e, the pressing part 401d will continue to press the valve for a period of time, so that the air box 401b continuously outputs high-speed airflow carrying positive and negative ions, continuously blowing and sweeping the surface of the chip that has been bonded.

[0043] This delayed blowing process serves two purposes: firstly, it neutralizes the residual static electricity after chip bonding, completely eliminating the residual micro-electric field at the workstation and further enhancing electrostatic protection; secondly, the continuous flow of room-temperature high-speed airflow provides uniform cooling to the bonded chip, quickly removing the residual heat generated during bonding and adhesive curing. This prevents uneven adhesive curing and chip thermal damage caused by excessively high local chip temperatures, improving bonding quality and product reliability. Once the tension spring 402e has fully rebounded and reset, the pressing component 401d is released, the valve closes, and ion blowing stops, completing a single chip bonding operation. The next batch of chip bonding can then be processed in a cyclical manner.

[0044] In summary, when the electronic chip is placed in the bonding mechanism 100, the clamping mechanism 200 is activated to clamp the electronic chip. At the same time, the clamping mechanism 200 has a certain elasticity to provide micro-buffering compensation for the clamped electronic chip. During bonding, the dynamic static electricity elimination mechanism 400 is activated to eliminate the dynamic static electricity present during the placement and bonding of the electronic chip. At the same time, the cleaning mechanism 300 is activated to clean the bonding mechanism 100. When bonding is completed and the bonding mechanism 100 is reset, the airflow generated by the dynamic static electricity elimination mechanism 400 can also help cool the electronic chip.

[0045] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible without substantially departing from the novelty and advantages of the subject matter described in this application. For example, variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​such as temperature, pressure, etc., installation arrangements, use of materials, color, orientation, etc. For instance, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure performing the function described herein, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims. Furthermore, for the purpose of providing a concise description of exemplary embodiments, not all features of actual embodiments may be omitted, i.e., those features not relevant to the currently considered best mode for carrying out the invention, or those features not relevant to implementing the invention.

[0046] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A bonding device for producing electrostatic protected electronic chips, characterized in that: include, A bonding mechanism (100) includes a bonding frame (101), a discharge machining base (102) is fixedly connected to the bottom of the inner wall of the bonding frame (101), the discharge machining base (102) is grounded by a wire, the discharge machining base (102) is used to place the electronic chip to be bonded, an electric cylinder (103) is fixedly connected to the top of the bonding frame (101), the output end of the electric cylinder (103) extends through to the inner side of the bonding frame (101) and is fixedly connected to a bonding plate (104), a glue spraying head (105) is provided at the bottom left side of the bonding plate (104), a connecting pipe (106) is fixedly connected to the top left side of the glue spraying head (105), and the top of the connecting pipe (106) is fixedly connected to the left side of the top of the inner wall of the bonding frame (101). The clamping mechanism (200) includes a mounting plate (201), two mounting plates (201) are provided, the bottom of the mounting plate (201) is fixedly connected to both sides of the bottom of the inner wall of the fitting frame (101), an airbag (202) is fixedly connected to the inner side of the mounting plate (201), and a clamping plate (203) is fixedly connected to the inner side of the airbag (202). A cleaning mechanism (300) includes a diversion assembly (301) and a scraping assembly (302); The dynamic static electricity elimination mechanism (400) includes an exhaust assembly (401) and a delay assembly (402).

2. The bonding device for electrostatic protection electronic chip production according to claim 1, characterized in that: The diversion assembly (301) includes a pressure valve (301a), and there are two pressure valves (301a). The inner side of the pressure valve (301a) is fixedly connected to the bottom of the outer side of the mounting plate (201). The pressure valve (301a) is connected to the airbag (202). A one-way valve (301b) is fixedly connected to the top of the left side of the connecting pipe (106). The one-way valve (301b) is connected to the connecting pipe (106) and the pressure valve (301a).

3. The bonding device for electrostatic protection electronic chip production according to claim 2, characterized in that: The scraping assembly (302) includes a collection groove (302a) which is opened on the left side of the top of the bonding plate (104), and a scraper (302b) is fixedly connected to the top of the left side of the bonding plate (104).

4. The bonding device for electrostatic protection electronic chip production according to claim 3, characterized in that: The exhaust assembly (401) includes two jog mechanical button valves (401a). The inner side of the jog mechanical button valve (401a) is fixedly connected to the rear side of the top of the outer side of the mounting plate (201). The jog mechanical button valve (401a) is connected to the airbag (202). The top of the clamping plate (203) is fixedly connected to an air blowing box (401b). An air jet groove (401c) is opened on the inner side of the bottom of the air blowing box (401b). A positive and negative ion generator (401e) is fixedly connected inside the air blowing box (401b). The jog mechanical button valve (401a) is connected to the air blowing box (401b). A pressing element (401d) is provided on the top of the jog mechanical button valve (401a).

5. The bonding device for electrostatic protection electronic chip production according to claim 4, characterized in that: The delay component (402) includes a transmission plate (402a), the front of which is fixedly connected to the back of the bonding plate (104). Guide holes (402b) are provided on the front sides of the top two sides of the transmission plate (402a). Guide rods (402c) are provided inside the guide holes (402b). The bottom of the guide rods (402c) is fixedly connected to the top of the pressing member (401d). A mounting plate (402d) is fixedly connected to the top of the guide plate. A tension spring (402e) is fixedly connected to the bottom of the mounting plate (402d). The other end of the tension spring (402e) is fixedly connected to the front sides of the top two sides of the transmission plate (402a).

6. The bonding apparatus for producing electrostatic protected electronic chips according to any one of claims 2 to 5, characterized in that: Limiting rods (204) are fixedly connected to the four corners of the outer side of the clamping plate (203). Four limiting holes (205) are opened on the inner side of the mounting plate (201). The inner wall of the limiting hole (205) is slidably connected to the surface of the limiting rod (204).

7. The bonding apparatus for electrostatic protection electronic chip manufacturing according to claim 6, characterized in that: The limiting rod (204) is fixedly connected to the outer side of the limiting plate (206), and the diameter of the limiting plate (206) is larger than the diameter of the inner wall of the limiting hole (205).

8. The bonding device for electrostatic protection electronic chip production according to claim 3, characterized in that: The airbag (202) is connected to an external air source. When the airbag (202) drives the clamping plate (203) to clamp the electronic chip, the elasticity of the airbag (202) after inflation can provide micro-buffering compensation for the clamped electronic chip.

9. The bonding apparatus for electrostatic protection electronic chip manufacturing according to claim 8, characterized in that: After the airbag (202) is continuously injected with gas, the excess airflow is discharged through the pressure valve (301a) and the one-way valve (301b) into the connecting pipe (106) and the spray nozzle (105) for air jet cleaning.

10. The bonding apparatus for electrostatic protection electronic chip manufacturing according to claim 9, characterized in that: When the bonding plate (104) is reset upward, it drives the scraper (302b) to scrape off the excess glue at the glue spraying point of the glue spraying head (105), and the scraped glue is collected through the collection tank (302a).

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