A semiconductor chip package placement machine

Abstract

The application relates to the technical field of semiconductor chips, in particular to a semiconductor chip packaging and pasting machine, which comprises a semiconductor chip packaging and pasting machine body, a starting assembly for positioning a waffle box is arranged on a bearing table, a connecting table and a starting arm are arranged in the starting assembly, and the starting assembly can provide power for the positioning of the waffle box through the cooperation of the connecting table and the starting arm. Through the arrangement of the starting assembly, the positioning assembly and the limiting assembly, the thread transmission cooperation of the servo motor driving thread columns and the placing blocks and the thread blocks is achieved, the linkage connecting table smoothly slides along the groove strip and the moving block, the air in the extrusion cylinder of the touch disc is blown out from the guide pipe, the corrugated pipe and the guide pipe through the guide pipe, the plastic dust and the metal scraps accumulated on the surface of the thread column and the bearing table can be effectively blown away, impurities are prevented from being crushed by the waffle box to form particle protrusions, the chip matrix groove is accurately corresponded with the picking coordinate of the mechanical arm, and the micron-level pasting precision is maintained.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip technology, and in particular to a semiconductor chip packaging and placement machine. Background Technology

[0002] Semiconductor chip packaging and placement machines are core automated precision equipment in the semiconductor back-end packaging process, enabling bare chip pickup, alignment, and high-precision die bonding. Waffle boxes, also known as die carriers, are industry-standard, dedicated anti-static material carriers. These boxes feature matrix-style independent grooves to isolate and store diced bare chips individually, preventing chip impact and electrostatic damage. They are the sole carrier for bare chip transfer and loading. The two are inextricably linked, representing the processing unit and its supporting material carrier. The entire set of functional components on the placement machine's carrier platform, including conveyor drive, positioning clamping, and dust removal, are designed based on the standard waffle box's dimensions and operating conditions, ensuring its suitability for long-term production in current semiconductor packaging workshops. During the process, plastic dust, metal shavings, and suspended particles will continuously accumulate on the platform surface. Various impurities will continuously settle and accumulate on the platform surface under the action of gravity and equipment vibration. After the scattered dust is repeatedly rubbed and rolled by the waffle box, it will be compacted to form particles of different sizes and heights. The waffle box is made of flat and hard plastic material, and the bottom plane is completely attached to the platform surface to complete the conveying and positioning. When there are dust accumulation protrusions on the platform, the waffle box cannot maintain a horizontal and flat state, and it is very easy for one side to be raised or the whole body to tilt. The preset positioning reference of the box body will be shifted accordingly, and the originally regular matrix chip grooves will deviate from the preset coordinates of the robotic arm picking up the chip, which will damage the micron-level chip placement accuracy of the equipment. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a semiconductor chip packaging and placement machine.

[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a semiconductor chip packaging and placement machine, comprising a semiconductor chip packaging and placement machine body, a robotic arm mounted on the semiconductor chip packaging and placement machine body, two support columns fixedly connected to the top of the semiconductor chip packaging and placement machine body, a support platform fixedly connected between the two support columns, a starting component for positioning a waffle box mounted on the support platform, a connecting platform and a starting arm within the starting component, the cooperation of the connecting platform and the starting arm providing power for positioning the waffle box, two grooved strips within the starting component, the two grooved strips fixedly connected to the bottom of the support platform, a movable block movably connected to the outer side of each grooved strip, and a connecting platform fixedly connected to the two movable blocks. At the bottom of the block, a connecting block is fixedly connected to the bottom of the connecting platform. A connecting bolt is fixedly connected to the connecting block. An actuating arm is movably connected to the outside of the connecting bolt. A fixing bolt is fixedly connected to the end of the actuating arm away from the connecting block. A starting arm is movably connected to the outside of the fixing bolt. The starting arm is L-shaped and is movably connected to a connecting bolt. Two fixing plates are fixedly connected to the bottom of the support platform. Both fixing plates are movably connected to the connecting bolts. A positioning bolt is fixedly connected to the end of the starting arm away from the fixing bolt. A placement plate is provided inside the starting assembly. The placement plate is fixedly connected to the end of the support platform away from the positioning platform. A housing is fixedly connected to the outside of the placement plate. A servo motor is located inside the housing. A bearing is provided on the placement plate. The inner ring of the bearing on the placement plate is fixedly connected to... A threaded column has its end furthest from the placement plate movably connected to a positioning platform. The platform has a movable elongated hole for placing a threaded block, which is inserted into the hole. A placement block is threadedly connected to the outside of the threaded column, and the threaded block is fixedly connected to its bottom. The bottom of the threaded block is also fixedly connected to a connecting platform. A positioning platform is fixedly connected to the top of the platform. The positioning platform has a cleaning assembly for cooperating with the starting component. The cleaning assembly contains a moving column and a guide tube. Through the cooperation of the moving column and guide tube, impurities on the equipment can be cleaned. The cleaning assembly contains two movable arms, which are movably connected to the outside of the positioning bolt. The ends of the two movable arms furthest from the positioning bolt are fixedly connected to a connecting piece. Two positioning plates are fixedly connected to the outer side of the platform. A movable frame is movably connected to the end of the two positioning plates away from the positioning platform. A sealing cylinder is fixedly connected inside the movable frame. A moving column is inserted into the inside of the sealing cylinder. The bottom of the moving column is fixedly connected to the connecting plate. A touch plate is provided inside the sealing cylinder. The touch plate is fixedly connected to the moving column. A guide tube is fixedly connected to the outer side of the sealing cylinder. Two corrugated pipes are fixedly connected to the outer side of the guide tube. The end of each corrugated pipe away from the guide tube is fixedly connected to the corresponding guide tube. Two blocking frames are fixedly connected to the outer side of the support platform. Each blocking frame has a locking hole for placing the guide tube. The guide tube is fixedly connected in the locking hole of the blocking frame, and a multi-hole box is fixedly connected to the guide tube.

[0005] Through the above technical solution, when using a semiconductor chip packaging and placement machine to perform semiconductor chip packaging and placement, the servo motor is activated, driving the threaded column to rotate. The rotating threaded column moves the placement block, which in turn moves the threaded block. The threaded block, in turn, moves the connecting platform. The connecting platform, in turn, moves two moving blocks along corresponding grooves towards the positioning platform. Simultaneously, the connecting platform moves the connecting block, which in turn moves the connecting bolt. The connecting bolt, in turn, pushes the actuating arm to move. The actuating arm, in turn, pushes the starting arm through the fixing bolt. Subsequently, the starting arm, under the thrust of the fixing bolt, rotates clockwise along the connecting bolt. During this rotation, the starting arm moves the positioning bolt in the same direction. In the first step, the positioning bolt moves the movable arm, which in turn pushes the connecting plate to rotate towards the positioning plate. The rotating connecting plate then rotates the moving column, which in turn rotates the sealing cylinder. The rotating sealing cylinder, in turn, causes the movable frame to rotate along the positioning plate. During this rotation, the moving column moves towards the interior of the sealing cylinder, causing the touch plate to compress the air inside the sealing cylinder. This compressed air then enters the guide tube. Furthermore, the rotation of the sealing cylinder causes the bellows to rotate and stretch, causing the air inside the guide tube to exit through the bellows. The air exiting the guide tube blows away impurities from the threaded column through the round holes in the multi-hole box, preventing impurities falling from the top of the support platform from affecting the movement and shaking of the waffle box.

[0006] As a preferred embodiment of the present invention, the top of the support platform is provided with a limiting component for cooperating with the positioning component. The limiting component contains a connecting arm and a fixing plate. The waffle box can be fixed by the cooperation of the connecting arm and the fixing plate. A tight-fitting cylinder is fixedly connected to the top of each positioning plate. Each tight-fitting cylinder has a hollow structure, and a telescopic column is inserted into each tight-fitting cylinder. A placement box is provided inside the limiting component, and the placement box is fixedly connected to the top of the placement block. Two support plates are fixedly connected to the outer side of the placement box. A limiting cylinder is fixedly connected to the end of each support plate away from the placement box. A limiting post is fixedly connected inside each limiting cylinder. A first spring is sleeved on the outer side of each limiting post. Each limiting cylinder has a placement elongated hole for placing a movable post. A movable post is inserted into the placement elongated hole of each limiting cylinder. Each movable post is movably connected to the outer side of the corresponding limiting post, and both ends of each first spring... Each component is fixedly connected to the inner wall of the corresponding limiting cylinder and the movable column. A connecting arm is fixedly connected to the top of each movable column. A placement shell is provided inside the limiting assembly. The end of each connecting arm away from the movable column is fixedly connected to the placement shell. Several second springs are provided inside the placement shell, and a fixing plate is provided at the bottom of the placement shell. The two ends of each second spring are fixedly connected to the inner wall of the placement shell and the fixing plate, respectively. A sealing plate is provided inside each tight cylinder, and each sealing plate is fixedly connected to the corresponding telescopic column. A connecting arm is fixedly connected to the end of each telescopic column away from the sealing plate. A touch frame is fixedly connected to the outer side of each of the two connecting arms. The touch frame is C-shaped and has a semi-circular end. When the sealing cylinder rotates to the corresponding position of the touch frame, the sealing cylinder fits with the semi-circular end of the touch frame. The height of the touch frame corresponds to the two connecting arms. When the connecting arm moves to the corresponding position of the touch frame, the touch frame fits with the connecting arm.

[0007] With the above technical solution, when the semiconductor chip inside the waffle box needs to be replaced after use, the waffle box is inserted into the placement box through the window. The outer wall of the waffle box then pushes the fixing plate towards the top of the placement box, causing the second spring to compress. When the waffle box enters the placement box, the fixing plate fits against the top outer wall of the waffle box, and the placement block moves synchronously with the placement box. When the placement block moves to the position corresponding to the positioning platform, and the sealing cylinder moves to the position corresponding to the touch frame, the sealing cylinder pushes the touch frame to move. The touch frame moves, causing the connecting arm to move, which in turn moves the telescopic column, which in turn moves the sealing disc. The sealing disc compresses the air inside the sealing cylinder during its movement. When the sealing cylinder reaches a vertical position, the touch frame moves to its maximum position. Simultaneously, the placement block moves, driving the carrier plate through the placement box. The carrier plate moves... The connecting arm moves to a position where it is in contact with the touch frame. The touch frame then pushes the connecting arm to move, which in turn moves the placement shell. The placement shell moves, which in turn moves the fixing plate, causing the fixing plate to come into contact with the placement box. The outer wall of the placement box pushes the fixing plate toward the interior of the placement shell, compressing the second spring. The connecting arm also moves the movable column, which in turn compresses the limiting column. When the placement block moves to a position where it is in contact with the starting arm, the placement shell moves the fixing plate completely away from the top of the placement box. This activates the robotic arm to transfer and package the semiconductor chip in the waffle box inside the placement box. When the sealing cylinder leaves the corresponding position of the touch frame, the compressed air inside the sealing cylinder causes the sealing disc to reset. The resetting of the sealing disc causes the touch frame to reset. When the touch frame leaves the corresponding position of the connecting arm, the compressed first spring rebounds, causing the placement shell to reset, and then the waffle box is replaced.

[0008] Compared with the prior art, the beneficial effects that this invention can achieve are: 1. This invention, through the setting of a starting component, a settling component, and a limiting component, uses a servo motor to drive the threaded column and the placement block and threaded block through threaded transmission. The linkage connects the platform along the groove strip and the moving block to slide smoothly. Then, through the hinge linkage of the connecting block, the touch arm and the L-shaped starting arm, the movable arm and the connecting plate drive the moving column to rotate and advance in the sealed cylinder. This causes the touch plate to squeeze the air in the cylinder and blow it out through the guide tube and the bellows tube. This can effectively blow away the plastic dust and metal shavings accumulated on the surface of the threaded column and the support platform, prevent impurities from forming particle protrusions after being crushed by the waffle box, eliminate the tilting and positioning offset problems caused by uneven force at the bottom during the waffle box feeding, ensure the precise correspondence between the chip matrix groove and the chip picking coordinate of the robotic arm, and maintain micron-level chip placement accuracy.

[0009] 2. By setting up the starting component, the set cleaning component and the limit component, the present invention provides stable guidance and transmission support for the horizontal reciprocating movement of the connecting table through the sliding cooperation between the groove strip and the moving block and the threaded engagement between the threaded column and the placement block. This ensures that there is no radial movement in the linkage transmission process of the connecting table driving the trigger arm and the starting arm, and ensures the stable power transmission accuracy of the waffle box conveying stroke and the subsequent linkage dust removal and unlocking actions.

[0010] 3. This invention can synchronously convert the rotational swing force output by the starting arm into the compressed air power inside the cylinder through the screw-in engagement of the moving column and the sealing cylinder, and the sealing sliding engagement of the touch plate and the inner wall of the sealing cylinder. With the air path conduction of the guide pipe, bellows and guide tube, there is no need for an external independent air source and dust removal control components. The air blowing cleaning of the moving working surface can be completed by the linkage of mechanical parts. The structure is compact and the transmission loss is small.

[0011] 4. The present invention provides stable lateral limiting support for the connecting arm and the placement shell by slidingly connecting the bearing plate, the limiting cylinder, the limiting column and the movable column, combined with the elastic abutment of the first spring. In addition, the elastic pressing of the second spring and the fixed plate inside the placement shell can continuously and elastically press the top of the waffle box during the conveying process, limiting the vertical jumping and horizontal movement of the box and maintaining the stable conveying posture of the waffle box.

[0012] 5. This invention, through the abutting fit between the outer wall of the sealing cylinder and the semi-circular end of the touch frame, combined with the sealing sliding fit between the telescopic column, the sealing plate and the inner wall of the tight cylinder, can convert the rotational swing force of the sealing cylinder into the axial thrust of the telescopic column, smoothly pushing the touch frame to move laterally, providing a smooth triggering power for subsequent limit unlocking actions, and avoiding rigid collision damage to parts.

[0013] 6. The present invention uses the side contact cooperation between the touch frame and the connecting arm to push the connecting arms on both sides to slide along the limit post when the waffle box is transported to the placement station with the placement block. This causes the placement shell and the fixing plate to move laterally away from the top opening of the waffle box. Automatic unlocking is achieved through the linkage of the parts position, ensuring that there is no structural interference in the material picking space of the robotic arm. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the support platform structure of the present invention; Figure 3 This is a schematic diagram of the positioning stage structure of the present invention; Figure 4 This is a schematic diagram of the placement tray structure of the present invention; Figure 5 This is a schematic diagram of the starter arm structure of the present invention; Figure 6This is a schematic diagram of the sealing cylinder structure of the present invention; Figure 7 This is a schematic diagram of the movable column structure of the present invention; Figure 8 This is a schematic diagram of the connecting arm structure of the present invention.

[0015] The components include: 1. Semiconductor chip packaging and placement machine body; 2. Robotic arm; 3. Support column; 4. Support platform; 5. Placement tray; 6. Groove strip; 7. Moving block; 8. Connecting platform; 9. Connecting block; 10. Connecting bolt; 11. Actuating arm; 12. Fixing bolt; 13. Starting arm; 14. Fixing plate; 15. Positioning platform; 16. Connecting bolt; 17. Positioning bolt; 18. Movable arm; 19. Threaded block; 20. Housing; 21. Servo motor; 22. Connecting plate; 23. Placement block; 24. Threaded column; 25. 26. Moving column; 27. Sealing cylinder; 28. Touch plate; 29. ​​Positioning plate; 30. Movable frame; 31. Guide tube; 32. Corrugated pipe; 33. Blocking frame; 34. Guide tube; 35. Touch frame; 36. Connecting arm; 37. Telescopic column; 38. Sealing plate; 39. Tight cylinder; 40. Bearing plate; 41. Limiting cylinder; 42. Limiting column; 43. Movable column; 44. Connecting arm; 45. Placement box; 46. Placement shell; 47. Second spring; 48. Fixing plate; 49. Perforated box. Detailed Implementation

[0016] To make the technical means, creative features, and achieved objectives and effects of this invention easier to understand, the invention is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this invention and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described herein without creative effort are all within the protection scope of this invention. Unless otherwise specified, the experimental methods in the following embodiments are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified.

[0017] Example: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, a semiconductor chip packaging and placement machine includes a semiconductor chip packaging and placement machine body 1. A robotic arm 2 is mounted on the semiconductor chip packaging and placement machine body 1. Two support columns 3 are fixedly connected to the top of the semiconductor chip packaging and placement machine body 1, and a support platform 4 is fixedly connected between the two support columns 3. A starting assembly for positioning waffle boxes is mounted on the support platform 4. The starting assembly contains a connecting platform 8 and a starting arm 13. The cooperation of the connecting platform 8 and the starting arm 13 provides power for positioning the waffle boxes. The starting assembly contains two grooved strips 6, which are fixedly connected to the bottom of the support platform 4. A movable block 7 is movably connected to the outer side of each grooved strip 6. The connecting platform 8 is fixedly connected to the bottom of the two movable blocks 7. A connecting block 9 is fixedly connected to the bottom of the assembly, and a connecting bolt 10 is fixedly connected to the connecting block 9. An actuating arm 11 is movably connected to the outside of the connecting bolt 10. A fixing bolt 12 is fixedly connected to the end of the actuating arm 11 away from the connecting block 9. An starting arm 13 is movably connected to the outside of the fixing bolt 12. The starting arm 13 is L-shaped and a connecting bolt 16 is movably connected to the starting arm 13. Two fixing plates 14 are fixedly connected to the bottom of the support platform 4, and both fixing plates 14 are movably connected to the connecting bolt 16. A positioning bolt 17 is fixedly connected to the end of the starting arm 13 away from the fixing bolt 12. A placement plate 5 is provided inside the starting assembly. The placement plate 5 is fixedly connected to the end of the support platform 4 away from the positioning platform 15. A housing 20 is fixedly connected to the outside of the placement plate 5. The housing 20 contains a... The servo motor 21 has a bearing on the placement plate 5. A threaded post 24 is fixedly connected to the inner ring of the bearing on the placement plate 5. The end of the threaded post 24 away from the placement plate 5 is movably connected to the positioning platform 15. The support platform 4 has a movable elongated hole for placing a threaded block 19. The threaded block 19 is inserted into the movable elongated hole of the support platform 4. A placement block 23 is threadedly connected to the outer side of the threaded post 24. The threaded block 19 is fixedly connected to the bottom of the placement block 23, and the bottom of the threaded block 19 is fixedly connected to the connecting platform 8. The top of the support platform 4 is fixedly connected to the positioning platform 15. The positioning platform 15 has a cleaning assembly for cooperating with the starting assembly. The cleaning assembly contains a moving post 25 and a guide tube 33. Through the cooperation of the moving post 25 and the guide tube 33, impurities on the equipment can be cleaned. The positioning assembly has two movable arms 18, which are movably connected to the outside of the positioning bolt 17. The ends of the two movable arms 18 away from the positioning bolt 17 are fixedly connected to the connecting piece 22. Two positioning plates 28 are fixedly connected to the outside of the positioning platform 15. A movable frame 29 is movably connected to the end of the two positioning plates 28 away from the positioning platform 15. A sealing cylinder 26 is fixedly connected inside the movable frame 29. A moving column 25 is inserted into the inside of the sealing cylinder 26. The bottom of the moving column 25 is fixedly connected to the connecting piece 22. An actuating plate 27 is provided inside the sealing cylinder 26 and is fixedly connected to the moving column 25. A guide tube 30 is fixedly connected to the outside of the sealing cylinder 26, and two bellows 31 are fixedly connected to the outside of the guide tube 30.Each corrugated pipe 31 is fixedly connected at the end furthest from the guide pipe 30 to the corresponding guide pipe 33. Two blocking frames 32 are fixedly connected to the outer side of the support platform 4. Each blocking frame 32 has a locking hole for placing the guide pipe 33. The guide pipe 33 is fixedly connected in the locking hole of the blocking frame 32, and a perforated box 49 is fixedly connected to the guide pipe 33. like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, when using the semiconductor chip packaging and placement machine 1 to perform semiconductor chip packaging and placement, the servo motor 21 is started. The servo motor 21 drives the threaded column 24 to rotate. When the threaded column 24 rotates, it drives the placement block 23 to move. When the placement block 23 moves, it drives the threaded block 19 to move. When the threaded block 19 moves, it drives the connecting platform 8 to move. When the connecting platform 8 moves, it drives the two moving blocks 7 to move along the corresponding groove strip 6 towards the position of the positioning platform 15. At the same time, the connecting platform 8 moves, it drives the connecting block 9 to move. When the connecting block 9 moves, it drives the connecting bolt 10 to move. When the connecting bolt 10 moves, it pushes the actuating arm 11 to move. Then, when the actuating arm 11 moves, it pushes the starting arm 13 to move through the fixing bolt 12. Then, the starting arm 13 is pushed by the fixing bolt 12 and rotates clockwise along the connecting bolt 16. When the starting arm 13 rotates, it drives the positioning bolt 17 to move synchronously, positioning... When bolt 17 moves, it drives the movable arm 18 to move, which in turn pushes the connecting piece 22 to rotate toward the position of the positioning plate 28. When the connecting piece 22 rotates, it drives the movable column 25 to rotate, which in turn drives the sealing cylinder 26 to rotate. When the sealing cylinder 26 rotates, it drives the movable frame 29 to rotate along the positioning plate 28. During the rotation, the movable column 25 moves toward the inside of the sealing cylinder 26. When the movable column 25 moves, it drives the touch plate 27 to squeeze the air inside the sealing cylinder 26. After being squeezed, the air inside the sealing cylinder 26 enters the guide tube 30. When the sealing cylinder 26 rotates, it drives the bellows 31 to rotate and stretch. As a result, the air inside the guide tube 30 is discharged from the guide tube 33 along the bellows 31. The air discharged from the guide tube 33 blows away the impurities in the threaded column 24 one by one through the round holes in the porous box 49. This air blowing away prevents impurities falling from the top of the support platform 4 from affecting the movement and shaking of the waffle box.

[0018] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, the top of the support platform 4 is provided with a limiting component for cooperating with the positioning component. The limiting component contains a connecting arm 44 and a fixing plate 48. The waffle box can be fixed in place through the cooperation of the connecting arm 44 and the fixing plate 48. A tight-fitting cylinder 38 is fixedly connected to the top of each positioning plate 28. Each tight-fitting cylinder 38 is a hollow structure, and a telescopic column 36 is inserted into each tight-fitting cylinder 38. A placement box 45 is provided inside the limiting component. The placement box 45 is fixedly connected to the top of the placement block 23. Two support components are fixedly connected to the outer side of the placement box 45. Each bearing plate 39 has a limiting cylinder 40 fixedly connected to the end away from the placement box 45. A limiting post 41 is fixedly connected inside each limiting cylinder 40. A first spring 42 is sleeved on the outside of each limiting post 41. Each limiting cylinder 40 has a placement elongated hole for placing a movable post 43. A movable post 43 is inserted into each placement elongated hole of the limiting cylinder 40. Each movable post 43 is movably connected to the outside of the corresponding limiting post 41, and both ends of each first spring 42 are respectively connected to the inner wall of the corresponding limiting cylinder 40. The movable column 43 is fixedly connected to the top of each movable column 43. A connecting arm 44 is fixedly connected to the top of each movable column 43. A placement shell 46 is provided inside the limiting assembly. The end of each connecting arm 44 away from the movable column 43 is fixedly connected to the placement shell 46. Several second springs 47 are provided inside the placement shell 46, and a fixing plate 48 is provided at the bottom of the placement shell 46. The two ends of each second spring 47 are fixedly connected to the inner wall of the placement shell 46 and the fixing plate 48, respectively. A sealing disc 37 is provided inside each tight cylinder 38, and each sealing disc 37 is connected to a corresponding... Telescopic columns 36 are fixedly connected, and each telescopic column 36 is fixedly connected to a connecting arm 35 at the end away from the sealing plate 37. A trigger frame 34 is fixedly connected to the outer side of each of the two connecting arms 35. The trigger frame 34 is C-shaped and has a semi-arc end. When the sealing cylinder 26 rotates to the corresponding position of the trigger frame 34, the sealing cylinder 26 fits with the semi-arc end of the trigger frame 34. The height of the trigger frame 34 corresponds to the two connecting arms 44. When the connecting arm 44 moves to the corresponding position of the trigger frame 34, the trigger frame 34 fits with the connecting arm 44. like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, when the semiconductor chip inside the waffle box needs to be replaced after use, the waffle box is inserted into the placement box 45 along the window. The outer wall of the waffle box then pushes the fixing plate 48 towards the top of the placement shell 46. The second spring 47 is then compressed. When the waffle box enters the placement box 45, the fixing plate 48 is in contact with the top outer wall of the waffle box. The placement block 23 moves synchronously with the placement box 45. When the placement block 23 moves to the position corresponding to the positioning platform 15, the sealing cylinder 26 moves to the position corresponding to the touch frame 34. When the sealing cylinder 26 is in position, it pushes the actuating frame 34 to move. The actuating frame 34, in turn, moves the connecting arm 35, which in turn moves the telescopic column 36. The telescopic column 36, in turn, moves the sealing disc 37. As the sealing disc 37 moves, it compresses the air inside the sealing cylinder 38. When the sealing cylinder 26 reaches a vertical position, the actuating frame 34 moves to its maximum position. Simultaneously, the placement block 23, while moving, moves the supporting plate 39 via the placement box 45. The supporting plate 39, in turn, moves the connecting arm 44. When the block 23 is in contact with the touch frame 34, the touch frame 34 pushes the connecting arm 44 to move. As the connecting arm 44 moves, it moves the placement shell 46, which in turn moves the fixing plate 48. The fixing plate 48 then comes into contact with the placement box 45. The outer wall of the placement box 45 pushes the fixing plate 48 towards the interior of the placement shell 46, compressing the second spring 47. The connecting arm 44 also moves the movable column 43, which in turn compresses the limiting column 41. When the placement block 23 moves to the point where it contacts the starting arm 13... When the placement shell 46 moves the fixing plate 48 completely away from the top of the placement box 45, the robotic arm 2 is activated to transfer and package the semiconductor chip in the waffle box inside the placement box 45. When the sealing cylinder 26 moves away from the corresponding position of the touch frame 34, the compressed air inside the tight cylinder 38 drives the sealing disc 37 to reset. When the sealing disc 37 resets, it drives the touch frame 34 to reset. When the touch frame 34 moves away from the corresponding position of the connecting arm 44, the compressed first spring 42 rebounds and drives the placement shell 46 to reset, and then the waffle box is replaced.

[0019] Working principle: Step 1, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, when using the semiconductor chip packaging and placement machine 1 to perform semiconductor chip packaging and placement, the servo motor 21 is started. The servo motor 21 drives the threaded column 24 to rotate. When the threaded column 24 rotates, it drives the placement block 23 to move. When the placement block 23 moves, it drives the threaded block 19 to move. When the threaded block 19 moves, it drives the connecting platform 8 to move. When the connecting platform 8 moves, it drives the two moving blocks 7 to move along the corresponding groove strip 6 towards the position of the positioning platform 15. At the same time, the connecting platform 8 moves, it drives the connecting block 9 to move. When the connecting block 9 moves, it drives the connecting bolt 10 to move. When the connecting bolt 10 moves, it pushes the actuating arm 11 to move. Then, when the actuating arm 11 moves, it pushes the starting arm 13 to move through the fixing bolt 12. Then, the starting arm 13 is pushed by the fixing bolt 12 and rotates clockwise along the connecting bolt 16. When the starting arm 13 rotates, it drives the positioning bolt 17 to move synchronously, positioning... When bolt 17 moves, it drives the movable arm 18 to move, and the movable arm 18 pushes the connecting piece 22 to rotate toward the position of the positioning plate 28. When the connecting piece 22 rotates, it drives the movable column 25 to rotate. When the movable column 25 rotates, it drives the sealing cylinder 26 to rotate. When the sealing cylinder 26 rotates, it drives the movable frame 29 to rotate along the positioning plate 28. When the movable column 25 rotates, it moves toward the inside of the sealing cylinder 26. When the movable column 25 moves, it drives the touch plate 27 to squeeze the air inside the sealing cylinder 26. After the air inside the sealing cylinder 26 is squeezed, it enters the guide tube 30. When the sealing cylinder 26 rotates, it drives the bellows 31 to rotate and stretch. Then the air inside the guide tube 30 is discharged from the guide tube 33 along the bellows 31. The air discharged from the guide tube 33 blows away the impurities in the threaded column 24 one by one through the round holes in the multi-hole box 49. In this way, the air is blown away to prevent the impurities falling from the top of the support platform 4 from affecting the movement and shaking of the waffle box. Step 2, as follows Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8As shown, when the semiconductor chip inside the waffle box needs to be replaced after use, the waffle box is inserted into the placement box 45 along the window. The outer wall of the waffle box then pushes the fixing plate 48 towards the top of the placement shell 46. The second spring 47 is then compressed. When the waffle box enters the placement box 45, the fixing plate 48 is in contact with the top outer wall of the waffle box, and the placement block 23 moves synchronously with the placement box 45. When the placement block 23 moves to the position corresponding to the positioning platform 15, the sealing cylinder 26 moves to the position corresponding to the touch frame 34. When the sealing cylinder 26 is in position, it pushes the actuating frame 34 to move. The actuating frame 34, in turn, moves the connecting arm 35, which in turn moves the telescopic column 36. The telescopic column 36, in turn, moves the sealing disc 37. As the sealing disc 37 moves, it compresses the air inside the sealing cylinder 38. When the sealing cylinder 26 reaches a vertical position, the actuating frame 34 moves to its maximum position. Simultaneously, the placement block 23, while moving, moves the supporting plate 39 via the placement box 45. The supporting plate 39, in turn, moves the connecting arm 44. When the block 23 is in contact with the touch frame 34, the touch frame 34 pushes the connecting arm 44 to move. As the connecting arm 44 moves, it moves the placement shell 46, which in turn moves the fixing plate 48. The fixing plate 48 then comes into contact with the placement box 45. The outer wall of the placement box 45 pushes the fixing plate 48 towards the interior of the placement shell 46, compressing the second spring 47. The connecting arm 44 also moves the movable column 43, which in turn compresses the limiting column 41. When the placement block 23 moves to the point where it contacts the starting arm 13... When the placement shell 46 moves the fixing plate 48 completely away from the top of the placement box 45, the robotic arm 2 is activated to transfer and package the semiconductor chip in the waffle box inside the placement box 45. When the sealing cylinder 26 moves away from the corresponding position of the touch frame 34, the compressed air inside the tight cylinder 38 drives the sealing disc 37 to reset. When the sealing disc 37 resets, it drives the touch frame 34 to reset. When the touch frame 34 moves away from the corresponding position of the connecting arm 44, the compressed first spring 42 rebounds and drives the placement shell 46 to reset, and then the waffle box is replaced.

[0020] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A semiconductor chip packaging and placement machine, comprising a semiconductor chip packaging and placement machine body (1), wherein a robotic arm (2) is provided on the semiconductor chip packaging and placement machine body (1), characterized in that, The top of the semiconductor chip packaging and placement machine body (1) is fixedly connected to two support columns (3), and a support platform (4) is fixedly connected between the two support columns (3). The support platform (4) is provided with a starting component for positioning the waffle box. The starting component is provided with a connecting platform (8) and a starting arm (13). The cooperation between the connecting platform (8) and the starting arm (13) can provide power for positioning the waffle box. A positioning platform (15) is fixedly connected to the top of the support platform (4). The positioning platform (15) is equipped with a cleaning component for cooperating with the starting component. The cleaning component is equipped with a moving column (25) and a guide tube (33). The impurities on the equipment can be cleaned by the cooperation of the moving column (25) and the guide tube (33). The top of the support platform (4) is provided with a limiting component for cooperating with the cleaning component. The limiting component is provided with a connecting arm (44) and a fixing plate (48). The waffle box can be fixed by cooperating with the connecting arm (44) and the fixing plate (48).

2. The semiconductor chip packaging and placement machine according to claim 1, characterized in that, The starting assembly has two grooved strips (6) fixedly connected to the bottom of the support platform (4). A movable block (7) is movably connected to the outside of each grooved strip (6). The connecting platform (8) is fixedly connected to the bottom of the two movable blocks (7). A connecting block (9) is fixedly connected to the bottom of the connecting platform (8). A connecting bolt (10) is fixedly connected to the connecting block (9). An actuating arm (11) is movably connected to the outside of the connecting bolt (10). A fixing bolt (12) is fixedly connected to the end of the actuating arm (11) away from the connecting block (9). The starting arm (13) is movably connected to the outside of the fixing bolt (12). The starting arm (13) is L-shaped. A connecting bolt (16) is movably connected to the starting arm (13). Two fixing pieces (14) are fixedly connected to the bottom of the support platform (4). Both fixing pieces (14) are movably connected to the connecting bolt (16). A positioning bolt (17) is fixedly connected to the end of the starting arm (13) away from the fixing bolt (12).

3. A semiconductor chip packaging and placement machine according to claim 2, characterized in that, The starting assembly is provided with a placement plate (5), which is fixedly connected to the end of the support platform (4) away from the positioning platform (15). The outer side of the placement plate (5) is fixedly connected to the housing (20). The housing (20) is provided with a servo motor (21). The placement plate (5) is provided with a bearing. The inner ring of the bearing of the placement plate (5) is fixedly connected to a threaded column (24). The end of the threaded column (24) away from the placement plate (5) is movably connected to the positioning platform (15). The support platform (4) is provided with a movable elongated hole for placing a threaded block (19). The threaded block (19) is inserted into the movable elongated hole of the support platform (4). The outer side of the threaded column (24) is threadedly connected to a placement block (23). The bottom of the threaded block (19) is fixedly connected to the placement block (23), and the bottom of the threaded block (19) is fixedly connected to the connecting platform (8).

4. A semiconductor chip packaging and placement machine according to claim 3, characterized in that, The positioning assembly has two movable arms (18), which are movably connected to the outside of the positioning bolt (17). The ends of the two movable arms (18) away from the positioning bolt (17) are fixedly connected to the connecting piece (22). The outside of the positioning platform (15) is fixedly connected to two positioning plates (28). The ends of the two positioning plates (28) away from the positioning platform (15) are movably connected to a movable frame (29). A sealing cylinder (26) is fixedly connected inside the movable frame (29). A moving column (25) is inserted into the inside of the sealing cylinder (26). The bottom of the moving column (25) is fixedly connected to the connecting piece (22). The inside of the sealing cylinder (26) is provided with There is a touch plate (27), which is fixedly connected to the moving column (25). A guide tube (30) is fixedly connected to the outside of the sealing cylinder (26). Two corrugated tubes (31) are fixedly connected to the outside of the guide tube (30). The end of each corrugated tube (31) away from the guide tube (30) is fixedly connected to the corresponding guide tube (33). Two blocking frames (32) are fixedly connected to the outside of the support platform (4). Each blocking frame (32) is provided with a card hole for placing the guide tube (33). The guide tube (33) is fixedly connected in the card hole of the blocking frame (32), and a multi-hole box (49) is fixedly connected to the guide tube (33).

5. A semiconductor chip packaging and placement machine according to claim 4, characterized in that, Each of the positioning plates (28) has a tightly connected cylinder (38) fixedly connected to its top. Each tightly connected cylinder (38) is hollow. Each tightly connected cylinder (38) has a telescopic column (36) inserted into it. Each tightly connected cylinder (38) has a sealing plate (37) inside it. Each sealing plate (37) is fixedly connected to the corresponding telescopic column (36). Each telescopic column (36) has a connecting arm (35) fixedly connected to one end away from the sealing plate (37). Both connecting arms (35) have a touch frame (34) fixedly connected to their outer sides.

6. A semiconductor chip packaging and placement machine according to claim 5, characterized in that, The limiting assembly is provided with a placement box (45), which is fixedly connected to the top of the placement block (23). Two bearing plates (39) are fixedly connected to the outer side of the placement box (45). A limiting cylinder (40) is fixedly connected to the end of each bearing plate (39) away from the placement box (45). A limiting post (41) is fixedly connected inside each limiting cylinder (40). A first spring (42) is sleeved on the outer side of each limiting post (41). Each limiting cylinder (40) is provided with a placement elongated hole for placing a movable post (43). A movable post (43) is inserted into the placement elongated hole of each limiting cylinder (40). Each movable post (43) is movably connected to the outer side of the corresponding limiting post (41). The two ends of each first spring (42) are fixedly connected to the inner wall of the corresponding limiting cylinder (40) and the movable post (43). A connecting arm (44) is fixedly connected to the top of each movable post (43).

7. A semiconductor chip packaging and placement machine according to claim 6, characterized in that, The limiting assembly has a placement shell (46) inside. The end of each connecting arm (44) away from the movable column (43) is fixedly connected to the placement shell (46). The placement shell (46) is provided with several second springs (47) inside, and the bottom of the placement shell (46) is provided with a fixing plate (48). The two ends of each second spring (47) are fixedly connected to the inner wall of the placement shell (46) and the fixing plate (48) respectively.

8. A semiconductor chip packaging and placement machine according to claim 5, characterized in that, The touch frame (34) is C-shaped and has a semi-arc end. When the sealing cylinder (26) rotates to the corresponding position of the touch frame (34), the sealing cylinder (26) and the semi-arc end of the touch frame (34) fit together. The height of the touch frame (34) corresponds to the two connecting arms (44). When the connecting arm (44) moves to the corresponding position of the touch frame (34), the touch frame (34) and the connecting arm (44) fit together.

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