An etching device for semiconductor package substrate processing

Abstract

This invention discloses an etching apparatus for processing semiconductor packaging substrates, relating to the field of semiconductor processing equipment technology. The invention includes a processing table, a liquid storage shell fixedly connected to one side of the processing table, a ventilation shell fixedly connected to one side of the liquid storage shell, and a cleaning box fixedly connected to one side of the ventilation shell; a conveying assembly is provided on one side of the processing table. Through the coordinated operation of the conveying assembly, the adjusting assembly, and the flipping assembly, this invention achieves automated continuous conveying and attitude adjustment of the substrate between etching, cleaning, and drying processes. A synchronous belt and a moving plate ensure smooth conveying; a square rod and pulley structure automatically adjust the substrate height according to the position of the protrusions, ensuring precise immersion into the liquid storage shell or cleaning box; a toothed plate and a baffle trigger gear rotation, causing the substrate in the clamping assembly to flip, expanding the cleaning and drying range, significantly improving etching uniformity and cleaning effect, reducing manual intervention, and increasing overall production efficiency.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing equipment technology, and in particular relates to an etching apparatus for processing semiconductor packaging substrates. Background Technology

[0002] Semiconductor packaging substrate etching equipment is a key manufacturing tool. It is primarily used to precisely etch circuit patterns onto substrates. Unwanted copper layers and other materials are removed using chemical or physical methods. The equipment features a high-precision spray system that evenly sprays the etching solution, ensuring consistent etching results. It has an advanced temperature and concentration control system to guarantee a stable etching process. Its high degree of automation allows for precise control of etching time and speed, improving production efficiency and product quality, and meeting the increasingly complex circuit designs and precision machining requirements of semiconductor packaging substrates.

[0003] A Chinese patent application (or patent) with publication number CN115241097A discloses an etching apparatus for semiconductor chip processing, including a worktable and a mounting frame assembly for placing a semiconductor chip substrate. An etching box is provided on the worktable, and a cleaning assembly for cleaning the surface of the semiconductor chip substrate is provided on the worktable. A storage box is provided between the etching box and the cleaning box, and a drying assembly is provided above the water receiving box that can be raised and lowered.

[0004] However, the above-mentioned device still has the following problems during implementation: In the substrate etching process, a full immersion etching method is adopted, in which the substrate is completely immersed in the etching solution for full-coverage etching to ensure accurate formation of the circuit pattern. After etching, the residual solution is thoroughly rinsed off by high-pressure water washing, and then dried to remove moisture and avoid subsequent contamination. Then, it enters the second etching stage to further optimize the circuit accuracy. This requires manual assistance to move the substrate to various equipment for processing, and strict control of etching time, solution concentration and temperature is required, which makes the overall process time-consuming and unable to achieve continuous operation.

[0005] To address these issues, we provide an etching apparatus for processing semiconductor packaging substrates. Summary of the Invention

[0006] The purpose of this invention is to provide an etching apparatus for processing semiconductor packaging substrates. By cooperating with a conveying component, an adjusting component, and a flipping component, it solves the problem in the prior art that the substrate etching process involves immersing the substrate in an etching solution, using a full-coverage method for etching, rinsing it with water after etching, drying it, and then etching it again. This process requires multiple devices to assist in the etching process, resulting in a long overall operation time.

[0007] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution.

[0008] This invention relates to an etching apparatus for processing semiconductor packaging substrates, comprising a processing table, a liquid storage shell fixedly connected to one side of the processing table, a ventilation shell fixedly connected to one side of the liquid storage shell, and a cleaning box fixedly connected to one side of the ventilation shell; a conveying assembly is provided on one side of the processing table, the conveying assembly including a bracket installed on the rear side of the processing table, a support shell installed on the top of the bracket, a synchronous belt disposed inside the support shell, and a moving plate installed on one side of the synchronous belt, the substrate being conveyed by the conveying assembly; an adjusting assembly is provided on one side of the synchronous belt, the adjusting assembly including a square rod slidably connected to the inside of the moving plate, a pulley installed on the top of the square rod, and a protrusion slidably connected to the top of the square rod, the conveying range of the substrate being adjusted by the adjusting assembly; a flipping assembly is provided at the bottom of the square rod, the flipping assembly including a fixed shell installed at the bottom of the square rod, a rotating disk movably connected to the inside of the fixed shell, a rotating shaft installed at the bottom of the rotating disk, a gear installed on the surface of the rotating shaft, a toothed plate meshing with one side of the gear, and a baffle installed on one side of the bracket, the cleaning range of the substrate being adjusted by the flipping assembly.

[0009] The present invention is further configured such that a clamping assembly is provided at the bottom of the square rod, the clamping assembly including a horizontal plate installed at the bottom of the rotating shaft, clamping plates movably connected to both sides of the horizontal plate, an adjusting rod movably connected to the top of the clamping plates, and one side of the protrusion being fixedly connected to the bracket.

[0010] The present invention is further configured such that a fixed plate is fixedly connected to the surface of the rotating shaft, a first hydraulic rod is fixedly connected inside the fixed plate, a movable sleeve is fixedly connected to the output end of the first hydraulic rod, and both sides of the movable sleeve are movably connected to an adjusting rod through pins.

[0011] The invention is further configured such that a slide rod is fixedly connected to one side of the toothed plate, a first spring and a support frame are sleeved on the surface of the slide rod, and one side of the support frame is fixedly connected to the fixed shell.

[0012] The invention is further configured such that a second spring is sleeved on the surface of the square rod, and one end of the second spring is fixedly connected to the movable plate.

[0013] The present invention is further configured such that a second hydraulic rod is fixedly connected to the top of the processing table, and a storage shell is fixedly connected to the output end of the second hydraulic rod.

[0014] The present invention is further configured such that the conveying assembly includes a drive motor mounted on the top of the support shell, a synchronous pulley mounted on the output end of the drive motor, and the synchronous belt sleeved on the surface of the synchronous pulley.

[0015] The present invention is further configured such that a pressurized water pump is fixedly connected to one side of the cleaning tank, a pressurized pipe is connected to the outlet of the pressurized water pump, and the other end of the pressurized pipe extends into the interior of the cleaning tank and is connected to a pressurized nozzle.

[0016] The invention is further configured such that two sets of air inlet pipes are respectively connected to one side of the ventilation shell, a drive shaft is movably connected inside the air inlet pipe, a first pulley and an exhaust fan blade are fixedly connected to the surface of the drive shaft, and the two sets of first pulleys are connected by a first belt drive.

[0017] The present invention is further configured such that a fixed shaft is movably connected inside the liquid storage shell, a mixing blade and a second pulley are fixedly connected to the surface of the fixed shaft, a fixed seat is fixedly connected to one side of the ventilation shell, a servo motor is fixedly connected inside the fixed seat, the output end of the servo motor is fixedly connected to the drive shaft, a third pulley is fixedly connected to the surface of the output end of the servo motor, and the second pulley and the third pulley are connected by a second belt drive.

[0018] The present invention has the following beneficial effects.

[0019] 1. This invention achieves automated continuous conveying and attitude adjustment of substrates between etching, cleaning, and drying processes through the coordinated operation of conveying, adjusting, and flipping components. The synchronous belt and moving plate ensure smooth conveying, while the square rod and pulley structure automatically adjust the substrate height according to the position of the protrusions, allowing it to be accurately immersed in the liquid storage shell or cleaning tank. The toothed plate and baffle cooperate to trigger gear rotation, driving the substrate in the clamping component to flip, expanding the cleaning and drying range, significantly improving etching uniformity and cleaning effect, reducing manual intervention, and improving overall production efficiency.

[0020] 2. This invention integrates clamping components, hydraulic drive, and a multi-functional housing structure, enhancing operational stability and functionality. The first hydraulic rod pushes the moving sleeve and adjusting rod to achieve automatic clamping and release of the substrate. The liquid storage shell is equipped with mixing blades driven by a servo motor to ensure uniform etching solution concentration and temperature. The ventilation shell is driven by exhaust fan blades to achieve efficient air drying. The pressure spray head in the cleaning box is driven to achieve high-pressure rinsing. All actuators work together through a belt drive system, resulting in a compact structure and efficient power transmission. This reduces equipment complexity and manufacturing costs while ensuring process quality.

[0021] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0023] Figure 1This is a perspective view of an etching apparatus used for processing semiconductor packaging substrates.

[0024] Figure 2 This is a schematic diagram of the internal structure of a support shell in an etching apparatus used for processing semiconductor packaging substrates.

[0025] Figure 3 This is a schematic diagram of the top structure of the processing stage in an etching apparatus for processing semiconductor packaging substrates.

[0026] Figure 4 This is a schematic diagram of the structure of the square rod surface in an etching apparatus used for processing semiconductor packaging substrates.

[0027] Figure 5 This is a cross-sectional view of a fixing shell in an etching apparatus used for processing semiconductor packaging substrates.

[0028] Figure 6 This is a schematic diagram showing the connection of a horizontal plate, a clamping plate, and an adjusting rod in an etching apparatus for processing semiconductor packaging substrates.

[0029] Figure 7 This is a cross-sectional view of a liquid reservoir in an etching apparatus used for processing semiconductor packaging substrates.

[0030] Figure 8 This is a cross-sectional view of an air inlet duct in an etching apparatus used for processing semiconductor packaging substrates.

[0031] Figure 9 This is a schematic diagram of the internal structure of a cleaning chamber in an etching apparatus used for processing semiconductor packaging substrates.

[0032] In the attached diagram: 1. Processing table; 2. Liquid storage tank; 3. Ventilation shell; 4. Cleaning box; 5. Conveying assembly; 501. Bracket; 502. Support shell; 503. Synchronous belt; 504. Moving plate; 6. Adjusting assembly; 601. Square rod; 602. Pulley; 603. Protrusion; 7. Tilting assembly; 701. Fixed shell; 702. Rotary disk; 703. Rotating shaft; 704. Gear; 705. Gear plate; 706. Baffle; 8. Clamping assembly; 801. Horizontal plate; 802. Clamping plate; 803. Adjusting rod; 804. 805. Fixed plate; 806. First hydraulic rod; 807. Moving sleeve; 9. Slide rod; 10. First spring; 11. Support frame; 12. Second spring; 13. Second hydraulic rod; 14. Storage shell; 505. Drive motor; 506. Synchronous pulley; 15. Pressurized water pump; 16. Pressurized pipe; 17. Air inlet pipe; 18. Drive shaft; 19. First pulley; 20. Exhaust fan blade; 21. Fixed shaft; 22. Mixing blade; 23. Second pulley; 24. Fixed base; 25. Servo motor; 26. Third pulley. Detailed Implementation

[0033] The technical solutions of the present invention will be described below with reference to the accompanying drawings. The described embodiments are only some embodiments of the present invention, and not all embodiments.

[0034] Example 1: Please refer to Figures 1-9 This invention relates to an etching apparatus for processing semiconductor packaging substrates, comprising a processing table 1, a liquid storage shell 2 fixedly connected to one side of the processing table 1, a ventilation shell 3 fixedly connected to one side of the liquid storage shell 2, and a cleaning box 4 fixedly connected to one side of the ventilation shell 3; a conveying assembly 5 is provided on one side of the processing table 1, the conveying assembly 5 including a bracket 501 installed on the rear side of the processing table 1, a support shell 502 installed on the top of the bracket 501, a synchronous belt 503 disposed inside the support shell 502, and a moving plate 504 installed on one side of the synchronous belt 503, the substrate being conveyed by the conveying assembly 5; an adjusting assembly 6 is provided on one side of the synchronous belt 503, the adjusting assembly 6 including a slidingly connected moving plate 504. The square rod 601 inside the plate 504 has a pulley 602 installed on the top of the square rod 601 and a protrusion 603 slidably connected to the top of the square rod 601. The conveying range of the substrate is adjusted by the adjusting component 6. A flipping component 7 is provided at the bottom of the square rod 601. The flipping component 7 includes a fixed shell 701 installed at the bottom of the square rod 601, a rotating disk 702 movably connected inside the fixed shell 701, a rotating shaft 703 installed at the bottom of the rotating disk 702, a gear 704 installed on the surface of the rotating shaft 703, a toothed plate 705 meshing with one side of the gear 704, and a baffle 706 installed on one side of the bracket 501. The cleaning range of the substrate is adjusted by the flipping component 7.

[0035] Specifically: A liquid storage tank 2 is fixedly connected to one side of the processing table 1. The liquid storage tank 2 is used to store the etching solution. A ventilation shell 3 is fixedly connected to one side of the liquid storage tank 2. The ventilation shell 3 is used to air dry the etched substrate. Forced ventilation accelerates the evaporation of surface liquid and prevents residual droplets from affecting subsequent processes. A cleaning box 4 is fixedly connected to one side of the ventilation shell 3. The cleaning box 4 is used to perform high-pressure water washing on the etched substrate to thoroughly remove etching residues and ensure the substrate surface is clean. A synchronous belt 503 provides stable and continuous conveying power to ensure accurate movement of the substrate between each station. A moving plate 504 is used to support and fix the substrate clamping mechanism to realize the substrate... Precise positioning and conveying: the square rod 601 can slide up and down within the moving plate 504, enabling flexible adjustment of the substrate height to accommodate substrates of different thicknesses and process requirements. The pulley 602, in conjunction with the bump 603, can achieve automatic lifting and lowering, reducing the use of power components and lowering equipment complexity and cost. The bump 603, as a triggering mechanism, controls the lifting and lowering of the square rod 601 through contact with the pulley 602, realizing automated process control. The rotating disk 702 can rotate within the fixed housing 701, causing the substrate to flip, expanding the cleaning and etching range. The rotating shaft 703, as the transmission core, transmits the rotational motion to the clamping components, realizing substrate posture adjustment.

[0036] Example 2: Please refer to Figures 1-9 Based on Embodiment 1, a clamping assembly 8 is provided at the bottom of the square rod 601. The clamping assembly 8 includes a horizontal plate 801 installed at the bottom of the rotating shaft 703, clamping plates 802 movably connected to both sides of the horizontal plate 801, an adjusting rod 803 movably connected to the top of the clamping plate 802, one side of the protrusion 603 being fixedly connected to the bracket 501, a fixing plate 804 being fixedly connected to the surface of the rotating shaft 703, a first hydraulic rod 805 being fixedly connected inside the fixing plate 804, and the output end of the first hydraulic rod 805 being fixedly connected to... There is a movable sleeve 806, and both sides of the movable sleeve 806 are movably connected to the adjusting rod 803 through pins. A slide rod 9 is fixedly connected to one side of the toothed plate 705. A first spring 10 and a support frame 11 are sleeved on the surface of the slide rod 9. One side of the support frame 11 is fixedly connected to the fixed shell 701. A second spring 12 is sleeved on the surface of the square rod 601. One end of the second spring 12 is fixedly connected to the movable plate 504. A second hydraulic rod 13 is fixedly connected to the top of the processing table 1. A storage shell 14 is fixedly connected to the output end of the second hydraulic rod 13.

[0037] Specifically: Gear 704 meshes with gear plate 705 to convert linear motion into rotational motion, achieving precise angle control. Gear plate 705 cooperates with baffle 706 to trigger gear 704 to rotate during movement, achieving automatic flipping. Baffle 706, installed on one side of bracket 501, serves as a fixed trigger point and interacts with gear plate 705 to achieve automatic control of the flipping action. Clamping plate 802 is used to directly clamp the substrate, providing reliable fixation and preventing displacement during conveying and processing. Adjusting rod 803 achieves synchronous opening and closing of clamping plate 802 through linkage mechanism, ensuring uniform distribution of clamping force. First hydraulic rod 805 serves as a power source to drive the clamping mechanism, achieving automatic clamping and release, improving operational efficiency and consistency. Moving sleeve 806 drives adjusting rod 803 through linkage, converting the linear motion of hydraulic rod into rotational motion. The clamping action is changed to clamping action of clamping plate 802. Slide rod 9 provides guidance and support for toothed plate 705 to ensure that toothed plate 705 does not deviate from the predetermined trajectory during movement. First spring 10 can automatically reset toothed plate 705 after it is disengaged from baffle 706. Second spring 12 pushes square rod 601 to automatically rise after pulley 602 is disengaged from protrusion 603, realizing automatic lifting action of substrate, reducing additional power requirements. Second hydraulic rod 13 can control the lifting and lowering of storage shell 14, which facilitates the placement and removal of substrate, improves the convenience and safety of operation. Storage shell 14 is used to temporarily place substrate to be processed or processed substrate, which is convenient for continuous operation. Synchronous pulley 506 cooperates with synchronous belt 503 to realize power transmission. A pressurized water pump 15 is fixedly connected to one side of cleaning box 4. Pressurized water pump 15 provides high pressure water source to ensure that the rinsing process has sufficient impact force to thoroughly remove residual liquid.

[0038] Example 3: Please refer to Figures 1-9 Based on Embodiments 1 and 2, the conveying assembly 5 further includes a drive motor 505 mounted on the top of the support shell 502, a synchronous pulley 506 mounted on the output end of the drive motor 505, a synchronous belt 503 sleeved on the surface of the synchronous pulley 506, a pressurized water pump 15 fixedly connected to one side of the cleaning box 4, a pressurized pipe 16 connected to the outlet of the pressurized water pump 15, the other end of the pressurized pipe 16 penetrating into the interior of the cleaning box 4 and connected to a pressurized nozzle, two sets of air inlet pipes 17 connected to one side of the ventilation shell 3, a drive shaft 18 movably connected inside the air inlet pipe 17, and a fixed surface on the drive shaft 18. A first belt pulley 19 and an exhaust fan blade 20 are fixedly connected. The two sets of first belt pulleys 19 are connected by a first belt drive. A fixed shaft 21 is movably connected inside the liquid storage shell 2. A mixing blade 22 and a second belt pulley 23 are fixedly connected to the surface of the fixed shaft 21. A fixed seat 24 is fixedly connected to one side of the ventilation shell 3. A servo motor 25 is fixedly connected inside the fixed seat 24. The output end of the servo motor 25 is fixedly connected to the drive shaft 18. A third belt pulley 26 is fixedly connected to the surface of the output end of the servo motor 25. The second belt pulley 23 and the third belt pulley 26 are connected by a second belt drive.

[0039] Specifically: A pressurized pipe 16 is connected to one outlet of the pressurized water pump 15, which delivers high-pressure water to the nozzle. The pipe layout is reasonable and has good sealing. The other end of the pressurized pipe 16 extends into the cleaning tank 4 and is connected to a pressurized nozzle. The pressurized nozzle can spray water evenly, improving cleaning effect and efficiency. A first belt pulley 19 and an exhaust fan blade 20 are fixedly connected to the surface of the drive shaft 18. The first belt pulley 19 achieves dual-shaft synchronization through belt drive. The exhaust fan blade 20 generates uniform airflow for drying. The two sets of first belt pulleys 19 are connected through the first belt drive to ensure synchronous operation of the two shafts and enhance ventilation. A fixed shaft 21 is movably connected inside the liquid storage tank 2. The fixed shaft 21 is used to install mixing blades 22 to achieve the stirring function of the liquid. The surface of the fixed shaft 21... A mixing blade 22 and a second belt pulley 23 are fixedly connected. The mixing blade 22 keeps the liquid medicine uniformly mixed. The second belt pulley 23 receives external power through a belt. A fixed base 24 is fixedly connected to one side of the ventilation shell 3. The fixed base 24 provides a stable mounting position for the servo motor 25. The servo motor 25 is fixedly connected inside the fixed base 24. The servo motor 25 provides precise and controllable power output to meet the power requirements of stirring and ventilation. The output end of the servo motor 25 is fixedly connected to the drive shaft 18 to achieve direct power transmission with high efficiency. A third belt pulley 26 is fixedly connected to the surface of the output end of the servo motor 25. The third belt pulley 26 transmits power to the second belt pulley 23 through the second belt, realizing that one motor can drive the stirring and ventilation functions at the same time, saving space and cost.

[0040] The working principle of this invention is as follows: The operator places the semiconductor substrate to be processed into the storage shell 14, and then starts the first hydraulic rod 805 through the external controller. The first hydraulic rod 805 drives the moving sleeve 806 to move. The moving sleeve 806, together with the adjusting rod 803, pushes the clamping plate 802 to move. When the two sets of clamping plates 802 move relative to each other, they clamp the substrate. Then, the drive motor 505 is started. The drive motor 505, together with the synchronous wheel 506, drives the synchronous belt 503 to transport the substrate. The synchronous belt 503 drives the moving plate 504 and the square rod 601 to move. When the square rod 601 moves, it drives the pulley 602 to move. When the pulley 602 contacts the first set of protrusions 603, the protrusions 603 can be used to move the pulley 602 downward. At this time, the semiconductor substrate moves synchronously to the top of the liquid storage shell 2.

[0041] When the square rod 601 moves, it drives the rotating shaft 703 and the clamping plate 802 to move, immersing the semiconductor substrate into the liquid storage shell 2. The semiconductor substrate is etched by the agent in the liquid storage shell 2. After etching is completed, the drive motor 505 continues to control the synchronous belt 503 to transport the semiconductor substrate. When the pulley 602 continues to move, it does not contact the first set of protrusions 603. The first spring 10 can reset the square rod 601, causing the semiconductor substrate to move upward out of the liquid storage shell 2 and continue to move to the right.

[0042] When the pulley 602 contacts the second set of protrusions 603, the second set of protrusions 603 can be used to push the pulley 602 downward. At this time, the semiconductor substrate moves synchronously into the cleaning box 4. When the pulley 602 moves downward, it works with the square rod 601 to drive the clamping plate 802 to move. The clamping plate 802 drives the semiconductor substrate to sink into the cleaning box 4. Then, the pressurized water pump 15 is started. The pressurized water pump 15 draws external water into the pressurized pipe 16 and sprays water out through the pressurized nozzle to rinse the semiconductor substrate.

[0043] During the rinsing process, the drive motor 505 can continue to transport the synchronous belt 503. The synchronous belt 503 drives the moving plate 504 and the toothed plate 705 to move. When the toothed plate 705 contacts the baffle 706, the baffle 706 prevents the toothed plate 705 from moving further. The toothed plate 705 can drive the gear 704 to rotate. The gear 704, in conjunction with the rotating shaft 703, drives the horizontal plate 801 and the clamping plate 802 to rotate. The clamping plate 802 drives the semiconductor substrate to rotate, increasing the rinsing range and improving the rinsing effect of the semiconductor substrate.

[0044] Then, the synchronous belt 503 is controlled to retract, driving the moving plate 504 and the semiconductor substrate to move into the ventilation housing 3. Then, the servo motor 25 is started. The servo motor 25, together with the drive shaft 18, drives the exhaust fan blades 20 to rotate, driving external air to blow onto the semiconductor substrate for drying, thereby improving the processing efficiency of the semiconductor substrate. The entire processing process only requires controlling the drive motor 505 to move the semiconductor substrate, which can automatically enter different equipment without the need for manual operation, effectively improving the etching efficiency of the semiconductor substrate.

[0045] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An etching apparatus for processing semiconductor packaging substrates, comprising a processing table (1), characterized in that: A liquid storage shell (2) is fixedly connected to one side of the processing table (1), a ventilation shell (3) is fixedly connected to one side of the liquid storage shell (2), and a cleaning box (4) is fixedly connected to one side of the ventilation shell (3). A conveying assembly (5) is provided on one side of the processing table (1). The conveying assembly (5) includes a bracket (501) installed on the rear side of the processing table (1), a support shell (502) installed on the top of the bracket (501), a synchronous belt (503) installed inside the support shell (502), and a moving plate (504) installed on one side of the synchronous belt (503). The substrate is conveyed by the conveying assembly (5). An adjustment component (6) is provided on one side of the synchronous belt (503). The adjustment component (6) includes a square rod (601) slidably connected inside the moving plate (504), a pulley (602) installed on the top of the square rod (601), and a protrusion (603) slidably connected to the top of the square rod (601). The conveying range of the substrate is adjusted by the adjustment component (6). The bottom of the square rod (601) is provided with a flipping assembly (7). The flipping assembly (7) includes a fixed shell (701) installed at the bottom of the square rod (601), a rotating disk (702) movably connected inside the fixed shell (701), a rotating shaft (703) installed at the bottom of the rotating disk (702), a gear (704) installed on the surface of the rotating shaft (703), a toothed plate (705) meshing with one side of the gear (704), and a baffle (706) installed on one side of the bracket (501). The cleaning range of the substrate is adjusted by the flipping assembly (7).

2. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: The square rod (601) is provided with a clamping assembly (8) at its bottom. The clamping assembly (8) includes a horizontal plate (801) installed at the bottom of the rotating shaft (703), clamping plates (802) movably connected to both sides of the horizontal plate (801), and an adjusting rod (803) movably connected to the top of the clamping plate (802). One side of the protrusion (603) is fixedly connected to the bracket (501).

3. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: A fixing plate (804) is fixedly connected to the surface of the rotating shaft (703). A first hydraulic rod (805) is fixedly connected inside the fixing plate (804). A movable sleeve (806) is fixedly connected to the output end of the first hydraulic rod (805). Both sides of the movable sleeve (806) are movably connected to the adjusting rod (803) through pins.

4. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: A slide rod (9) is fixedly connected to one side of the toothed plate (705). A first spring (10) and a support frame (11) are sleeved on the surface of the slide rod (9). One side of the support frame (11) is fixedly connected to the fixed shell (701).

5. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: A second spring (12) is sleeved on the surface of the square rod (601), and one end of the second spring (12) is fixedly connected to the moving plate (504).

6. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: The top of the processing table (1) is fixedly connected to a second hydraulic rod (13), and the output end of the second hydraulic rod (13) is fixedly connected to a storage shell (14).

7. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: The conveying assembly (5) also includes a drive motor (505) installed on the top of the support shell (502), a synchronous pulley (506) installed at the output end of the drive motor (505), and a synchronous belt (503) sleeved on the surface of the synchronous pulley (506).

8. The etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: A pressurized water pump (15) is fixedly connected to one side of the cleaning tank (4). A pressurized pipe (16) is connected to the outlet of the pressurized water pump (15). The other end of the pressurized pipe (16) passes through the interior of the cleaning tank (4) and is connected to a pressurized nozzle.

9. An etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: Two sets of air inlet pipes (17) are connected to one side of the ventilation shell (3). A drive shaft (18) is movably connected inside the air inlet pipe (17). A first pulley (19) and an exhaust fan blade (20) are fixedly connected to the surface of the drive shaft (18). The two sets of first pulleys (19) are connected by a first belt drive.

10. An etching apparatus for processing semiconductor packaging substrates according to claim 1, characterized in that: The liquid storage shell (2) is movably connected to a fixed shaft (21). A mixing blade (22) and a second belt pulley (23) are fixedly connected to the surface of the fixed shaft (21). A fixed seat (24) is fixedly connected to one side of the ventilation shell (3). A servo motor (25) is fixedly connected inside the fixed seat (24). The output end of the servo motor (25) is fixedly connected to the drive shaft (18). A third belt pulley (26) is fixedly connected to the surface of the output end of the servo motor (25). The second belt pulley (23) and the third belt pulley (26) are connected by a second belt drive.

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