Wafer box loading equipment with sealing, cleaning and circulating functions

Abstract

The present application relates to the technical fields of semiconductor wafer loading, in particular to a wafer box loading device with sealing, cleaning and circulating functions. The device comprises a bearing main body, a bearing table assembly, a compression sealing assembly, an air inlet manifold, an air outlet manifold, a box opening mechanism and a control unit. The annular sealing member of the compression sealing assembly surrounds the periphery of the loading port, and the compression driving mechanism compresses the annular sealing member at the end face of the wafer box port to form a circumferentially closed sealed space. The air inlet manifold and the air outlet manifold are separately arranged on the two sides of the loading port horizontally opposite to each other, the air outlet flow area is larger than the air inlet flow area, the air outlet is inclined and the projection points to the air outlet side to form a directional circulation. The control unit continuously synchronizes the air inlet and air outlet during the whole period of opening the box door, and switches to high-flow high-speed blowing and cleaning and cooling after the wafer process is completed. The present application can isolate particle pollution, maintain a clean environment and cooperate with cooling during the whole process of opening the box, effectively improving the wafer cleanliness and process yield.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer loading technology, and more particularly to wafer cassette loading equipment with sealing, cleaning, and circulation functions. Background Technology

[0002] In semiconductor manufacturing processes, the batch heat treatment process in vertical furnaces places extremely high demands on the cleanliness of the internal environment of the equipment. A typical vertical furnace process flow is as follows: wafer cassettes carrying wafers to be processed are transported to the loading area of ​​a wafer cassette loading device via a material handling system. The loading device opens the wafer cassette opening, and a wafer transport mechanism removes the wafers one by one and places them into a process boat. The process boat then enters the furnace tube to complete heat treatment processes such as oxidation, diffusion, annealing, or deposition. After the process is complete and the wafers have cooled, the wafer transport mechanism retrieves the wafers one by one and places them back into the wafer cassette. The loading device closes the cassette door, releasing the mating seal, and the wafer cassette is transported away from the loading station by the material handling system. Throughout the complete process of mating, opening, transporting, heat treatment, and returning to the cassette, the loading area, as the transition interface between the wafer cassette cavity and the process chamber, directly affects the yield of the entire batch of wafers due to its cleanliness and thermal environment.

[0003] Existing wafer cassette loading equipment for vertical furnaces has the following technical limitations in the entire process of wafer docking, unpacking, wafer transfer, and wafer return.

[0004] 1. Existing wafer box sealing structures struggle to maintain consistent sealing under both full-load and no-load conditions, making them prone to gaps and atmospheric intrusion. Most loading equipment relies on the weight of the wafer box itself for sealing at the box opening. The overall weight difference between a fully loaded and unloaded wafer box results in significant fluctuations in the compression of the sealing ring. Under no-load conditions, insufficient clamping force can easily create tiny gaps at the box opening, allowing oxygen-containing air, ambient dust, and wear particles from moving parts of the equipment to enter the loading area. This type of structure lacks an independent active axial clamping drive component, making it unable to compensate for sealing deviations caused by sealing ring aging or assembly / processing errors, and unable to maintain a consistently stable low-oxygen sealing environment.

[0005] 2. Conventional purging schemes have inherent defects in airflow organization, easily creating purging dead zones and airflow turbulence, making it difficult to achieve uniform atmosphere replacement throughout the entire wafer cell cavity. Some loading equipment uses bottom-intake purging or single-nozzle direct-blowing purging architectures, lacking directional circulation design in the intake and exhaust channel layout. Bottom-intake schemes only input and output airflow from the bottom of the cell, making it difficult to form a uniform laminar flow sweeping laterally along the wafer surface. Exhaust gases and particulate matter in the wafer interlayer gaps and wafer edge areas cannot be fully entrained and discharged. Single-nozzle direct-blowing schemes often have airflow parallel to the wafer plane, lacking an inclined guiding component towards the exhaust side, easily forming turbulent eddies within the cell, causing secondary suspension of settled particles. Simultaneously, some schemes have an intake flow area larger than the exhaust flow area, easily leading to pressure buildup within the cell, failing to achieve the low-pressure-difference stable circulation condition where the exhaust flow area is larger than the intake flow area.

[0006] 3. The timing control logic is incomplete, failing to achieve coordinated timing for continuous purging throughout the entire opening period and enhanced cleaning and cooling after the process. Existing loading equipment's purging control mostly uses timed start-stop logic, failing to achieve synchronous and continuous air intake and exhaust throughout the entire opening and closing process. Some solutions only initiate purging after the door is fully open, resulting in direct contact between the wafer and unpurified ambient air at the moment of opening, posing a risk of oxidation contamination. Furthermore, the lack of a high-flow-rate enhanced purging process after the wafer completes heat treatment and is returned to the cassette makes it impossible to promptly remove residual process gases carried by the wafer, and also prevents the use of purging airflow for passive heat dissipation and temperature control in the loading area.

[0007] 4. The loading area lacks a passive cooling design relying on purge airflow, leading to heat accumulation that accelerates component aging and amplifies wafer oxidation risks. Vertical furnace tubes and high-temperature process boats continuously radiate and convect heat into the loading area, causing heat accumulation and increased ambient temperature. This high-temperature environment accelerates the aging and failure of the opening mechanism, drive components, sealing components, and sensors within the loading area, increasing equipment maintenance costs and the probability of unplanned downtime. Furthermore, it accelerates the silicon substrate oxidation reaction rate, exacerbating wafer surface oxidation defects. Existing solutions requiring temperature control necessitate additional water-cooling or fan cooling components, increasing equipment complexity and manufacturing costs. The disruptive airflow from fans also poses a risk to cleanliness, potentially stirring up suspended particles.

[0008] 5. Some existing processing methods involve transferring the wafer cassettes out of the equipment after the entire batch of processes is completed before performing nitrogen cleaning. This cleaning process is delayed and cannot avoid contamination damage during the waiting window. After the wafers undergo heat treatment, the residual temperature of the wafer body is relatively high, and process by-product gases and detached microparticles remain on the surface. If the wafer cassettes are transferred to an external storage station before cleaning, the residual gases will continue to react chemically with the wafer surface during the waiting window, and external particles may also enter the cassettes. This increases the probability of wafer contamination and reduces the overall equipment throughput of the production line.

[0009] 6. Existing loading equipment generally has functional components that are scattered, with air intake and exhaust pipelines and drive pipelines for various mechanisms mostly exposed outside the main body of the equipment. Exposed pipeline surfaces are prone to accumulating dust particles, which pose a risk of falling off and polluting the loading area environment. At the same time, exposed pipelines also increase the overall space occupied by the equipment, which is not conducive to the installation layout in the limited space of a vertical furnace.

[0010] In summary, existing wafer cassette loading equipment suffers from several technical limitations, including insufficient adaptability to cassette sealing conditions, dead zones and turbulence in the purge flow field, inability to cover the entire cassette opening cycle with purge timing, susceptibility to heat accumulation in the loading area, delayed cleaning processes after cassette return, and unfavorable component and piping layout for cleanroom management. These limitations hinder the simultaneous integration of active axial compression sealing, manifold-type directional circulation purge, full-time atmosphere protection during cassette opening, and coordinated heat dissipation and cooling via purge airflow. Therefore, it is necessary to develop a novel wafer cassette loading system to address engineering application issues related to sealing reliability, purge cleanliness, operational timing matching, thermal environment management, and cleanroom layout under vertical furnace heat treatment conditions. Summary of the Invention

[0011] The purpose of this invention is to overcome the aforementioned deficiencies of the prior art and provide a wafer cassette loading device with sealing, cleaning, and circulation functions. Through the axial compression and sealing cooperation between the compression sealing component and the carrier body, combined with the directional circulation purging structure constructed by the intake manifold and exhaust manifold, the full-cycle timing control logic for opening the cover, the coordinated heat dissipation of the purging airflow, and the integrated arrangement of various functional components and the built-in gas pipelines and drive pipelines in the carrier body, this invention achieves sealing and isolation, atmosphere replacement, particle suppression, and coordinated temperature control of the loading area throughout the entire process of wafer cassette docking-opening-wafer transfer-wafer return-to-cassette closing under vertical furnace conditions. At the same time, it optimizes the equipment layout and reduces the risk of cleanliness contamination caused by exposed pipelines.

[0012] This invention provides a wafer cassette loading device with sealing, cleaning, and circulation functions, comprising: a support body having a loading port opposite to the wafer cassette opening; a support platform assembly disposed on the support body for supporting the wafer cassette; a pressing and sealing assembly including an annular seal and a pressing drive mechanism; the annular seal is arranged around the periphery of the loading port, and the pressing drive mechanism is configured to: when the wafer cassette is placed on the support platform assembly, apply a pressing force to the wafer cassette along the axial direction of the loading port, so that the end face of the wafer cassette opening presses against the annular seal, forming a circumferentially closed sealing space; an air intake manifold disposed on the support body and located on one side of the loading port in the horizontal direction, having an air intake interface and multiple air outlets communicating with the sealing space; the multiple air outlets are arranged at intervals along the wafer arrangement direction, the air outlet direction is inclined relative to the plane where the wafer is located, and the projection of the air outlet in the plane where the wafer is located points to the side where the exhaust manifold is located; and an exhaust manifold disposed on the support body and located on the loading port. On the other side of the horizontal direction, the outlet is arranged opposite to the intake manifold, and the exhaust flow area of ​​the exhaust manifold is larger than the air outlet flow area of ​​the intake manifold; the wafer cassette opening mechanism is located on the supporting body and is used to open and close the cassette door; the control unit is electrically connected to the clamping drive mechanism, the intake manifold, the exhaust manifold, and the wafer cassette opening mechanism, and is configured to: when the wafer cassette is placed, control the clamping drive mechanism to output clamping force; upon receiving an opening command, control the wafer cassette opening mechanism to open the cassette door, and during the entire period when the cassette door is open, control the intake manifold to supply air at a first flow rate and the exhaust manifold to exhaust air synchronously; upon receiving a signal indicating that the wafer has completed the process, control the intake manifold to switch to supply air at a second flow rate greater than the first flow rate; when all wafers are fed into the wafer cassette and the preset purging time is reached, control the wafer cassette opening mechanism to close the cassette door, stop the intake manifold to supply air, stop the exhaust manifold to exhaust air, and control the clamping drive mechanism to release the clamping force.

[0013] Furthermore, the air outlet's outlet direction is tilted at a first included angle R1 relative to the plane where the wafer is located, satisfying... The angle between the projection of the air outlet's outlet direction onto the plane of the wafer and the direction pointing from the side of the intake manifold to the side of the exhaust manifold is the second angle R2, satisfying... .

[0014] Furthermore, the annular seal is a flexible sealing ring, and its contour is adapted to the outer contour of the wafer cassette opening; after the pressing drive mechanism completes the pressing action, the sealing space formed by the annular seal is connected to the inner cavity of the wafer cassette; the compression amount of the annular seal after being pressed is... .

[0015] Furthermore, the intake manifold includes an intake manifold block and an intake sealing gasket; the intake manifold block is provided with an intake port, the intake manifold block is sealed and fitted to the supporting body through the intake sealing gasket, the intake manifold block is provided with a gradient flow channel inside, and the intake port is connected to each of the air outlets through the gradient flow channel.

[0016] Furthermore, the air outlet is a circular air outlet, and each air outlet is evenly distributed along the wafer arrangement direction; the length of the intake manifold block along the air outlet arrangement direction is D, the diameter of the air outlet is α1, the center distance between adjacent air outlets is L1, and the total number of air outlets is n; the intake manifold block and each air outlet satisfy the following geometric constraint relationship: , ,and Where k1 and k2 are preset proportional coefficients.

[0017] Furthermore, the exhaust manifold includes an exhaust manifold block and an exhaust sealing gasket; the exhaust manifold block is sealed and fitted to the supporting body through the exhaust sealing gasket; the exhaust port diameter of the exhaust manifold block is larger than the air outlet diameter of the intake manifold block.

[0018] Furthermore, the protective gas introduced through the intake manifold is nitrogen, and the temperature of the protective gas is 20°C to 25°C.

[0019] Furthermore, the circulating airflow formed by the intake manifold and the exhaust manifold can carry away the heat diffused from the process equipment to the loading area where the loading port is located, so that the steady-state temperature of the loading area does not exceed 40°C.

[0020] Further, the ratio of the second flow rate to the first flow rate is 2 to 10; the control unit is also configured to: before opening the box door, control the intake manifold to perform pre-purge with a pre-purge flow rate less than the first flow rate to replace the initial air in the sealed space; after the pre-purge process reaches a preset condition, control the box opening mechanism to open the box door; the preset purge time is 10s to 60s after all the wafers are fed into the wafer box.

[0021] Furthermore, the intake manifold, the exhaust manifold, the compression sealing assembly, and the box opening mechanism are all integrated into the supporting body; the gas pipelines of the intake manifold and the exhaust manifold, as well as the drive pipelines of the compression drive mechanism and the box opening mechanism, are all built into the supporting body.

[0022] Compared with the prior art, the wafer cassette loading device with sealing, cleaning and circulation functions provided by the present invention has the following significant advantages.

[0023] 1. Strong adaptability to sealing conditions, compatible with various loading states including full load and no load on the wafer cassette. This equipment is equipped with a compression sealing assembly. The compression drive mechanism outputs axial compression force to press the wafer cassette opening face against the annular seal. The compression amount of the annular seal under pressure can be stably controlled within... The sealing effect does not depend on the weight of the wafer box itself. It can compensate for assembly and processing errors as well as sealing deviations caused by the aging of the annular seal. After the wafer box is in place, it can form a circumferentially closed sealing space, reducing the risk of external particles and oxygen-containing air entering the sealing space through the gap at the box opening.

[0024] 2. Manifold-type directional circulating purging reduces purging dead zones and suppresses secondary particle suspension. This equipment uses relatively opposite inlet and exhaust manifolds. Multiple air outlets of the inlet manifold are spaced apart along the wafer arrangement direction, and the air outlet direction is inclined relative to the plane of the wafer. The projection of the air outlet direction on the wafer plane points to the side of the exhaust manifold. The inlet manifold has a gradually changing flow channel, which, together with the geometric arrangement of the air outlets, can form a directional sweeping circulating flow field pointing towards the exhaust manifold. The exhaust flow area of ​​the exhaust manifold is larger than the air outlet flow area of ​​the inlet manifold, which can avoid pressure accumulation inside the sealed space. The circulating airflow can cover the wafer interlayer gap and wafer edge area, reducing purging dead zones, suppressing turbulence and eddies inside the sealed space, and reducing the probability of secondary suspension of settled particles due to airflow disturbance.

[0025] 3. A complete multi-stage timing logic ensures atmospheric protection throughout the entire opening period of the wafer cassette, mitigating the risk of instantaneous oxidation upon capping. The control unit of this equipment incorporates complete operational control logic. Before opening the wafer cassette, the intake manifold is controlled to perform a pre-purge operation at a flow rate lower than the initial flow rate, replacing the initial air inside the sealed space. Throughout the entire opening period, the intake manifold continuously supplies air at the initial flow rate, and the exhaust manifold simultaneously exhausts air. After all wafers are fed into the wafer cassette and the preset purging time has been reached, the cassette is closed, the air supply is stopped, and the clamping force is released. The pre-purge process prevents the wafers from directly contacting the high-oxygen environment when the cassette is first opened. After the wafers complete their processing, gas cleaning can be performed inside the equipment, eliminating the need to transfer the wafer cassette outside for cleaning, thus shortening process waiting time and improving the throughput efficiency of the production line.

[0026] 4. Tiered flow rate configuration to adapt to purging needs at different operational stages. The control unit is configured with a two-stage air supply mode: a first flow rate and a second flow rate, with the ratio of the second flow rate to the first flow rate set between 2 and 10. When the wafer is in transit and the cassette door is open, the first flow rate is used to maintain a clean atmosphere inside the sealed space. Upon receiving a signal indicating that the wafer has completed its process, the flow rate switches to a larger second flow rate for enhanced purging. This maintains a clean barrier during the wafer transit window and allows for rapid removal of residual process gases during the wafer return phase using a high flow rate. The preset purging duration is also set to... The cleaning time can be flexibly configured according to the needs of different process batches.

[0027] 5. Passive cooling of the loading area is achieved through a purging and circulating airflow, reducing cleanliness risks associated with additional heat dissipation components. The circulating airflow formed by the intake and exhaust manifolds carries away heat diffused from the process equipment to the loading area, ensuring that the steady-state temperature of the loading area does not exceed [a certain value]. This heat dissipation method relies on the existing protective gas purging circuit of the equipment, eliminating the need for additional water-cooled heat exchange components or independent cooling fans. This simplifies the overall hardware structure of the machine and avoids the cleanliness risks posed by suspended particles stirred up by the fan.

[0028] 6. Suppress component aging and wafer damage caused by high-temperature operating conditions, and improve the overall stability of the machine. The circulating airflow dissipates heat in the loading area, reducing the ambient operating temperature of the loading area, slowing down the aging and parameter drift of the unpacking mechanism, sealing components, and various sensors caused by high temperatures, reducing the frequency of equipment maintenance and the risk of unplanned downtime; at the same time, the lower ambient temperature can slow down the oxidation reaction rate of the silicon substrate, which is beneficial to reducing the generation of wafer oxidation defects.

[0029] 7. Controllable protective gas supply parameters reduce the risk of wafer thermal shock. The protective gas introduced into the intake manifold is selected at a temperature of [temperature value missing]. The nitrogen gas supply temperature matches the normal ambient temperature of semiconductor cleanrooms, which can avoid thermal stress caused by thermal shock to wafers, reduce the risk of wafer warping and deformation, and is suitable for continuous production conditions of batch heat treatment in vertical furnaces.

[0030] 8. Integrated functionality of the entire machine, maximizing the coupling gain effect between structures. This invention integrates the compression sealing assembly, intake manifold, exhaust manifold, and unpacking mechanism into a unified control unit, which performs logical scheduling. This overcomes the shortcomings of simple stacking of discrete components and the lack of parameter and structural coupling relationships between units. Throughout the complete process of wafer cassette docking-unpacking-wafer transfer-wafer return-cassette closing, it simultaneously achieves sealing isolation, atmosphere replacement, particle suppression, and thermal environment control, reducing the probability of wafer particle contamination and oxidation defects, and improving the overall batch wafer processing yield.

[0031] 9. Integrated component layout avoids pollution risks from exposed pipelines. The intake manifold, exhaust manifold, compression sealing assembly, and opening mechanism are all integrated into the main body; the gas pipelines of the intake and exhaust manifolds, as well as the drive pipelines of the compression drive mechanism and the opening mechanism, are all built into the main body, eliminating external pipelines, reducing the risk of dust particles falling and being stirred up after accumulating on the pipeline surface, and at the same time reducing the external space occupied by the equipment, adapting to the use conditions of limited installation space for vertical furnaces. Attached Figure Description

[0032] The accompanying drawings, which are provided to further illustrate this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application.

[0033] Figure 1 This is a three-dimensional assembly diagram of the wafer cassette loading device with sealing, cleaning, and circulation functions of the present invention.

[0034] Figure 2 This is a front view showing the arrangement of the intake manifold, exhaust manifold, and box-opening mechanism on the main body of the present invention.

[0035] Figure 3 This is a three-dimensional structural diagram of the intake manifold of the present invention.

[0036] Figure 4 This is a schematic diagram showing the frontal dimensions of the intake manifold of the present invention.

[0037] Figure 5 This is a schematic diagram showing the cross-sectional angles of the first included angle R1 and the second included angle R2 of the air outlet direction of the present invention.

[0038] Figure 6 This is a three-dimensional structural diagram of the exhaust manifold of the present invention.

[0039] Figure 7 This is a three-dimensional assembly diagram of the annular seal and the sealing ring pressure plate of the present invention.

[0040] Figure 8 This is a schematic diagram showing the assembly state of the support platform assembly and the wafer cassette of the present invention.

[0041] Figure 9 This is a three-dimensional schematic diagram of the airflow direction for heat dissipation and purging inside the sealed space of the present invention.

[0042] Figure 10 This is a schematic diagram illustrating the principle of the flow of purge airflow carrying particles and / or residual gas within the sealed space of this invention.

[0043] Figure 11 This is a three-dimensional structural diagram of the wafer cassette of the present invention.

[0044] Figure 12 This is a schematic diagram illustrating the heat exchange principle of the heat dissipation and blowing airflow circulation of the present invention.

[0045] Reference numerals: 10 for the supporting body, 20 for the intake manifold, 201 for the intake manifold block, 202 for the intake seal, 203 for the intake interface, 204 for the air outlet, 30 for the exhaust manifold, 301 for the exhaust manifold block, 302 for the exhaust seal, 303 for the exhaust port, 40 for the supporting platform assembly, 401 for the supporting platform body, 402 for the fixing assembly, 50 for the pressing and sealing assembly, 501 for the annular seal, 502 for the sealing ring pressure plate, 503 for the pressing drive mechanism, 60 for the box opening mechanism, 70 for the wafer box, 80 for the sealed space, 90 for the heat dissipation and purging airflow, 100 for the particulate matter and / or residual gas, 110 for the supply airflow, and 120 for the heat. Detailed Implementation

[0046] The technical solutions of the embodiments of the present invention will be clearly, completely, and in detail described below with reference to the accompanying drawings. The described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0047] It should be noted that in the description of this invention, the terms "upper," "lower," "left," "right," "front," "back," "horizontal," "vertical," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are all based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solution of this invention and simplifying the descriptive language, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this invention.

[0048] Furthermore, in the description of this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixing," "assembly," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific implementation.

[0049] Reference Appendix Figure 1-2This embodiment discloses a wafer cassette loading device with sealing, cleaning, and circulation functions, which is used in conjunction with a vertical furnace batch heat treatment semiconductor process equipment. It interfaces with an upstream material handling system, a downstream wafer handling mechanism, and the vertical furnace process cavity to achieve fully automated operation of wafer cassette 70 loading and docking, circumferential compression sealing of the cassette opening, pre-purge replacement, cassette opening, wafer removal and feeding into the process boat, post-process enhanced purging, cleaning, and cooling, wafer return to the cassette, and cassette closing and desealing. The equipment uses a support body 10 as the foundation for the entire machine. The entire machine mainly includes a support platform assembly 40, a compression sealing assembly 50, an intake manifold 20, an exhaust manifold 30, a cassette opening mechanism 60, and a control unit. All functional components are integrated and assembled on the support body 10, and are uniformly coordinated and scheduled by the control unit to complete the entire operation process of wafer cassette 70 loading, unloading, wafer transfer, wafer return to the cassette, and cassette closing.

[0050] Reference Appendix Figure 1-2 Appendix Figure 8 and attached Figure 11 The supporting body 10 is provided with a loading port opposite to the opening of the wafer cassette 70. The supporting platform assembly 40 includes a supporting platform body 401 and a fixing component 402. The supporting platform body 401 is connected and fixed to the supporting body 10 through the fixing component 402 to support the wafer cassette 70 after it is in place. The supporting platform body 401 can be configured with positioning pins and a guide structure to ensure that the opening of the wafer cassette 70 is accurately aligned with the loading port after it is placed. The pressing and sealing assembly 50, the air intake manifold 20, the exhaust manifold 30, and the opening mechanism 60 are all integrated into the supporting body 10. The gas pipelines of the air intake manifold 20 and the exhaust manifold 30, as well as the driving pipelines of the pressing drive mechanism 503 and the opening mechanism 60, are all built into the supporting body 10. There are no exposed pipelines on the outer surface of the equipment, and there is no need to adopt a split splicing cavity structure, thereby reducing the risk of dust and heat leakage caused by splicing gaps, while compressing the external space occupied by the whole machine and adapting to the narrow equipment assembly space around the vertical furnace. The compression sealing assembly 50 is arranged around the loading port, the intake manifold 20 and the exhaust manifold 30 are respectively arranged on both sides of the loading port in the horizontal direction, and the box opening mechanism 60 is arranged at the position of the loading port corresponding to the box door movement path.

[0051] Reference Appendix Figure 1 Appendix Figure 7 and attached Figure 11The compression sealing assembly 50 includes an annular seal 501 and a compression driving mechanism 503. As a preferred assembly method in this embodiment, the compression sealing assembly 50 may also include a sealing ring pressure plate 502, which is an optional mounting component. The sealing ring pressure plate 502 is used to press and fix the annular seal 501 inside the mounting groove of the supporting body 10, preventing the annular seal 501 from shifting or flipping under pressure. The contour of the annular seal 501 is adapted to the outer contour of the wafer cassette 70's opening, and the annular seal 501 is arranged around the periphery of the loading port. The annular seal 501 can be made of silicone or fluororubber, possessing good elasticity and resistance to corrosion from clean protective gases. The compression driving mechanism 503 can be a cylinder, electric cylinder, or cam-type linear drive element. The compression driving mechanism 503 is arranged axially along the loading port. A buffer pad can be added to the contact area between the push rod of the compression driving mechanism 503 and the wafer cassette 70 to evenly transmit the compression force and avoid local stress concentration damage to the wafer cassette 70.

[0052] Reference Appendix Figure 1-2 Appendix Figure 7 Appendix Figure 9 and attached Figure 11 After the wafer cassette 70 is placed on the support platform assembly 40, the clamping drive mechanism 503 pushes the entire wafer cassette 70 towards the annular seal 501, pressing the opening end face of the wafer cassette 70 tightly against the annular seal 501, thereby forming a circumferentially closed sealing space 80. The sealing space 80 is interconnected with the inner cavity of the wafer cassette 70, and maintains a sealed fit at the opening position throughout the entire opening process. The clamping force output by the clamping drive mechanism 503 can stably control the compression amount of the annular seal 501 after being compressed. The compression zone ensures a tight seal in the circumferential direction while preventing rapid aging and damage caused by excessive compression of the sealing ring. Compared to ordinary O-rings, the annular seal 501 has a larger deformation rebound margin, can accommodate the planar machining errors of the wafer cassette 70's end face, reduces the machining accuracy requirements of the support platform assembly 40 and the cassette opening, and extends the service life of the seal. This structure achieves static dust barrier, forming a dual synergistic protection with the dynamic directional circulation formed by the subsequent intake manifold 20 and exhaust manifold 30. Simulation verification shows that under specified test conditions, the removal rate of particles and / or residual gases 100 can reach 90%. The specific simulation test conditions are as follows: A device geometry model consistent with this embodiment is used; the wafer cassette 70 is loaded with 25 standard 300mm wafers; the air supply manifold 20 supplies nitrogen gas, and the air supply flow rate is the first flow rate of this application; at the initial moment of the simulation, particles with a diameter of 0.1μm to 1.0μm and / or residual gas 100 are uniformly distributed in the wafer interlayer gap and the sealed space 80; the percentage of residual particulate matter in the sealed space 80 and the inner cavity of the wafer cassette 70 after 30 seconds of purging is used as the statistical basis; a parallel direct-blowing air intake scheme without the double-angle tilt of the air outlet of this application is used as the simulation control group; under the above simulation boundary conditions, the simulation results show that the particle and / or residual gas 100 removal rate of this application can reach 90%. Simultaneously, the sealing interface remains in contact throughout the entire opening process, ensuring that the inner cavity of the wafer cassette 70 remains within the protection range of the sealed space 80 when the cassette door is open.

[0053] Reference Appendix Figure 1-4 The intake manifold 20 includes an intake manifold block 201 and an intake seal 202. The intake manifold block 201 is sealed to the supporting body 10 through the intake seal 202, avoiding gas leakage caused by assembly gaps. The intake manifold block 201 is provided with an intake interface 203, and a gradient flow channel is provided inside the intake manifold block 201. The gradient flow channel has a gradually changing cross-sectional area along the arrangement direction of the air outlets 204 to compensate for the pressure drop caused by the diversion process and ensure that the air flow of each air outlet 204 tends to be uniform under high-flow conditions. The intake interface 203 connects to multiple air outlets 204 through the gradient flow channel. The multiple air outlets 204 are evenly distributed along the wafer arrangement direction, and the air outlets 204 are circular air outlets.

[0054] Reference Appendix Figure 3-4 and attached Figure 11 Let D be the length of the intake manifold block 201 along the direction of the air outlet 204, let α1 be the diameter of the air outlet 204, let L1 be the center-to-center distance between adjacent air outlets 204, and let n be the total number of air outlets 204; the assembly of the whole machine satisfies the geometric constraints: , , Wherein, k1 and k2 are preset proportional coefficients. For example, as a preferred example, if D=400mm, the diameter of the air outlet 204 α1=4mm, k1 is 5, then L1=20mm; k2 is 360, then n=18, satisfying n·L1=360mm<D=400mm. k1 and k2 can be adaptively selected according to the height of the wafer cassette 70 and the wafer arrangement pitch. The number of air outlets 204 is matched with the number of wafers inside the wafer cassette 70 and the arrangement pitch, ensuring that each wafer's height range corresponds to at least one air outlet 204, ensuring that each layer of wafers can be covered by swept airflow.

[0055] Reference Appendix Figure 2 Appendix Figure 4-5 and attached Figure 9-11 The air outlet 204 has an inclination angle of the air outlet direction relative to the plane where the wafer is located, which is the first included angle R1, satisfying... The angle between the projection of the exhaust direction of the air outlet 204 onto the plane of the wafer and the direction from the side of the intake manifold 20 to the side of the exhaust manifold 30 is the second included angle R2, which satisfies... The first included angle provides a normal airflow component perpendicular to the wafer plane, preventing the airflow from flowing completely parallel to the surface; the second included angle deflects the airflow toward the exhaust manifold 30; relying on the dual-angle constraint combined with the geometric constraints of the gradient flow channel and the air outlet 204, a top-down directional sweeping circulation is formed inside the sealed space 80 and the inner cavity of the wafer cassette 70, carrying particles and / or residual gas 100 out to the exhaust side. As an alternative implementation, the air outlet 204 can also be processed into a long, narrow slit structure, extending along the wafer arrangement direction, to adapt to the inner cavity conditions of wafer cassettes 70 of different specifications.

[0056] It should be noted that the first included angle This refers to the condition where the airflow direction at vent 204 is nearly parallel to the plane of the wafer, and the normal airflow component is insufficient. Because the gaps between the multiple wafer layers within the wafer cassette 70 are narrow, when the normal disturbance component of the airflow is insufficient, the airflow has difficulty penetrating the wafer interlayer. Particles and / or residual gas 100 trapped in the interlayer cannot be effectively agitated and carried out, resulting in incomplete purging and replacement, and easily forming purging dead zones. Simultaneously, the parallel airflow flowing along the wall easily forms a stable laminar flow, and contaminants detached from the wafer easily re-settle onto the wafer surface. When At this time, the airflow direction is almost perpendicular to the wafer surface. After the airflow impacts the wafer, it rebounds in the opposite direction. The rebounding airflow will induce eddies and turbulence inside the sealed space 80. Particles and / or residual gas 100 that have been blown away will be lifted up again and dispersed, increasing the risk of pollutant diffusion. An excessively large vertical downward airflow component will shorten the lateral travel distance of the airflow, which is not conducive to the establishment of directional circulation between the intake manifold 20 and the exhaust manifold 30, and the efficiency of pollutant removal will decrease.

[0057] Second angle This refers to a condition where the airflow projection direction within the wafer plane travels almost in a straight line from the intake manifold 20 to the exhaust manifold 30. In this case, the airflow beam is concentrated, the lateral sweep coverage is narrow, and the corner areas of the wafer cassette 70 cavity far from the airflow centerline are not covered by the airflow, easily forming blind spots. Furthermore, the airflow path is short, resulting in insufficient time for the clean purge gas to mix and replace the existing contaminated gas in the cavity, thus limiting the cleaning effect. At this time, the airflow direction deviates significantly from the side wall of the cavity and the direction of the exhaust manifold 30. After flowing to the side wall, the airflow is prone to turn back and form a swirling vortex in the side wall area of ​​the cavity. Some airflow even shows a tendency to flow in the opposite direction to the intake side. The directional circulation flow order is disrupted, and the particles and / or residual gas 100 carried by the airflow have difficulty flowing smoothly to the exhaust port 303 and being extracted. The pollutants remain inside the sealed space 80, and the purging and cleaning efficiency is reduced.

[0058] exist as well as Within the preferred angle range, the airflow can simultaneously obtain a moderate normal disturbance component and a lateral transport component pointing towards the exhaust manifold 30. The two work together to ensure that a stable, fully covered, low-eddy directional sweeping circulation is formed inside the sealed space 80 and the inner cavity of the wafer box 70.

[0059] Reference Appendix Figure 1-4 Appendix Figure 6 Appendix Figure 9-10 and attached Figure 12 The exhaust manifold 30 includes an exhaust manifold block 301 and an exhaust seal 302; the exhaust manifold block 301 is sealed and fitted to the supporting body 10 through the exhaust seal 302. The exhaust manifold 30 and the intake manifold 20 are arranged horizontally opposite each other. The diameter of the exhaust port 303 of the exhaust manifold block 301 is larger than the diameter of the air outlet 204 of the intake manifold block 201, so that the overall exhaust flow area of ​​the exhaust manifold 30 is larger than the air outlet flow area of ​​the intake manifold 20, avoiding pressure accumulation inside the sealed space 80. This structure keeps the sealed space 80 in a slightly positive pressure state, further suppressing the backflow of outside air from the tiny gaps in the sealing interface, ensuring stable directional circulation flow, reducing the generation of backflow and eddy current phenomena, and reducing the risk of secondary suspension of settled particles and / or residual gas 100. The intake seal 202 and the exhaust seal 302 are made of elastic compensating sealing material, which maintains the sealing performance under repeated compression and decompression cycle conditions, preventing particles from entering from the assembly gaps.

[0060] Reference Appendix Figure 1-2The opening mechanism 60 is mounted on the supporting body 10 and is used to open and close the door of the wafer cassette 70. It should be noted that this embodiment provides a specific structural example of the opening mechanism 60, which includes an unlocking execution component, a door push-pull mechanism, and an opening drive unit. The opening drive unit is fixedly embedded inside the supporting body 10. The opening drive unit can be a linear cylinder or a servo electric cylinder, and its drive pipelines and electrical wiring are all housed inside the supporting body 10, with no exposed pipelines on the outer surface of the entire unit. The power output end of the opening drive unit is connected to both the unlocking execution component and the door push-pull mechanism. The unlocking execution component acts on the latch structure of the wafer cassette 70 door to unlock and reset the door latch. The door push-pull mechanism can form a separable abutment with the door of the wafer cassette 70.

[0061] During operation, once the wafer cassette 70 has been pressed into place by the sealing assembly 50 and the sealed space 80 has been established, the opening drive unit first drives the unlocking actuator to release the mechanical lock of the wafer cassette 70 door. Then, the opening drive unit continues its stroke, causing the door push-pull mechanism to abut against the door and move it in a translational motion, thus opening the door. During closing, the opening drive unit reverses its movement, pushing the door back to its original position via the door push-pull mechanism. Afterward, the unlocking actuator releases, and the wafer cassette 70's own door lock automatically closes. The opening mechanism 60 is arranged along with the supporting body 10, without intruding into the internal area of ​​the sealed space 80, thus preventing dust generated by moving parts from contaminating the interior of the sealed space 80. The control unit is electrically connected to the pressing drive mechanism 503, the intake manifold 20, the exhaust manifold 30, and the box opening mechanism 60 respectively. All timing actions of the whole machine are uniformly scheduled by the control unit. The equipment can receive process instructions issued by the vertical furnace host and automatically execute the whole set of standardized purging sequence to achieve linkage with upstream and downstream process equipment.

[0062] Reference Appendix Figure 1-2 Appendix Figure 9 and attached Figure 12 The protective gas supplied through the intake manifold 20 is nitrogen, with the supply temperature controlled between 20°C and 25°C. This temperature range matches the typical ambient temperature of a semiconductor cleanroom, reducing the risk of warpage caused by thermal shock to the wafers. The supply temperature of the protective gas can be adjusted using heat exchange elements added to the intake pipe. The circulating cooling and purging airflow 90 formed by the intake manifold 20 and the exhaust manifold 30 can remove the heat 120 diffused from the vertical furnace tubes and high-temperature process boat to the loading area where the loading port is located, keeping the steady-state temperature of the loading area no higher than... It provides thermal protection for the box opening mechanism 60, the clamping drive mechanism 503, and various sensors, thus delaying the high-temperature aging and parameter drift of the devices.

[0063] Reference Appendix Figure 9 and attached Figure 11 This equipment is equipped with two levels of air supply flow: a first flow rate and a second flow rate, with the ratio of the second flow rate to the first flow rate set to 2–10. The control unit is also configured with a pre-purge flow rate, which is less than the first flow rate; the preset purge time after all wafers are fed into the wafer cassette (70°C) is set to... The purging time can be configured according to the actual needs of different process batches and different wafer cell volumes (70 mAh). Pre-purging uses a preset time as the criterion; the preset pre-purging time can be selected... It can be adjusted to accommodate a sealed space with a volume of 80.

[0064] The complete operating process of this equipment is explained in detail below.

[0065] Phase 1: Wafer box placement and axial compression sealing.

[0066] The wafer cassette 70, carrying the wafers to be processed, is conveyed by the upstream material handling system and falls onto the carrier assembly 40. The guiding and positioning structure of the carrier assembly 40 completes the alignment of the wafer cassette 70, and the alignment signal is fed back to the control unit. The control unit outputs a command to control the clamping drive mechanism 503 to output axial clamping force, pushing the end face of the wafer cassette 70 to press against the annular seal 501, thus forming a circumferentially closed sealed space 80.

[0067] Phase Two: Pre-purge before opening the lid.

[0068] After sealing is completed, the control unit controls the intake manifold 20 to output the supply airflow 110 at the pre-purge flow rate, and the exhaust manifold 30 simultaneously performs exhaust to replace the original air inside the sealed space 80. When the pre-purge process reaches the preset conditions, the pre-purge stage ends. Pre-purge can replace the gas in the sealed space 80 in advance before the box door is opened, avoiding direct contact between the wafer and the unreplaced ambient air at the moment the cover is opened.

[0069] Phase 3: The box door is opened, and continuous blowing and cleaning are carried out around the clock to maintain the clean barrier.

[0070] The control unit sends an opening command to the opening mechanism 60, which then opens the wafer cassette 70 door. During the entire period the door is open, the control unit maintains a continuous air supply at the first flow rate through the intake manifold 20, while the exhaust manifold 30 simultaneously and continuously exhausts air. The intake manifold 20 and exhaust manifold 30 work together to form a directional sweeping circulating flow field. The heat dissipation purge airflow 90 covers the wafer interlayer gaps and wafer edge areas, suppressing turbulent eddies and reducing the secondary suspension of settled particles and / or residual gas 100. This maintains a clean environment inside the sealed space 80 throughout the entire cycle of the wafer cassette 70 door opening. At this time, the process boat that has completed heat treatment in the vertical furnace can retract to the loading area. The heat dissipation purge airflow 90 simultaneously carries away the heat 120 accumulated in the loading area, achieving passive heat dissipation in the loading area.

[0071] Phase 4: Wafers are removed and placed into the process boat.

[0072] An external wafer handling mechanism enters the sealed space 80 and removes the wafers one by one from the wafer box 70, transferring them to the process boat inside the vertical furnace. After all the wafers are removed, the process boat enters the furnace tube cavity to carry out the corresponding heat treatment processes such as oxidation, diffusion, annealing, or deposition. During this process, the box door remains open, the purging gas supply and exhaust continue to operate, and the sealing interface is always kept in a tight and sealed state.

[0073] Phase 5: Process completion, wafer return to cassette stage, enhanced purging, cleaning and cooling.

[0074] After the heat treatment process is completed, the process boat carries the processed wafers back to the loading area. The control unit receives a signal indicating that the wafer has completed the process and controls the intake manifold 20 to switch to a second flow rate for high-flow enhanced purging, while the exhaust manifold 30 simultaneously exhausts air. The high-flow heat-dissipating purging airflow 90 quickly removes process by-product gases, trace particles, and / or residual gas contaminants 100 from the wafer surface, and further cools the high-temperature wafer and loading area, removing accumulated heat 120. The external wafer handling mechanism retrieves the heat-treated wafers one by one and places them into the inner cavity of the wafer cassette 70. This stage reuses the same air path system; the purging gas also acts as a cooling medium, completing residual gas cleaning and wafer cooling inside the equipment, eliminating the need to transfer the wafer cassette 70 out of the equipment for further cleaning operations.

[0075] Phase 6: After returning the box to its original position, continue purging, close the box, and release the seal.

[0076] After all wafers are fed into the wafer cassette 70, the intake manifold 20 and exhaust manifold 30 continue to maintain the preset purging time. When the preset purging time ends, the control unit instructs the cassette opening mechanism 60 to perform the cassette closing action, closing the wafer cassette 70 door. After the door is closed, the intake manifold 20 stops supplying air and the exhaust manifold 30 stops exhausting air. Then, the control clamping drive mechanism 503 is retracted to release the axial clamping force on the wafer cassette 70 and release the sealed docking state of the cassette opening.

[0077] Phase 7: Wafer box delivery station.

[0078] Once the entire process is complete, the wafer cassette 70 can be removed from the carrier assembly 40 by the material handling system and transferred to the next work station, completing one complete work cycle.

[0079] The wafer cassette receiving process is the reverse of the above process. The control logic for pressing and sealing, pre-purge, full-cycle purging, enhanced purging and cooling, and closing and depressurizing remains the same, and will not be repeated here.

[0080] During the operation of the equipment, the intake manifold 20, exhaust manifold 30, compression sealing assembly 50 and opening mechanism 60 are all integrated into the supporting body 10. All gas pipelines and drive pipelines are arranged inside the supporting body 10. There are no exposed pipelines on the outer surface of the equipment, which reduces the risk of pollution caused by dust particles falling off and being raised after accumulating on the surface of the exposed pipelines.

[0081] As an alternative embodiment, the equipment can also be equipped with multiple bearing stations (such as two bearing stations); the upper and lower bearing stations are respectively equipped with independent compression sealing components 50, air intake manifolds 20 and exhaust manifolds 30. The air paths of the two bearing stations are independent of each other and do not interfere with each other. The upper layer is used for feeding and purging the wafer cassette 70 to be processed, and the lower layer is used for recycling, cooling and cleaning the high-temperature wafers after heat treatment. The upper and lower stations can operate in parallel, thereby improving the processing throughput of the whole machine.

[0082] The various structures in this equipment do not function in isolation: circumferential compression sealing is the physical prerequisite for the establishment of directional circulation; the relative arrangement of the intake and exhaust manifolds, the difference in flow area, and the dual-angle constraints of R1 and R2 jointly ensure the stability of directional sweeping circulation; the graded flow rate and standardized timing of the control unit couple static sealing, dynamic purging, and cleaning and cooling into a coordinated system, and the overall technical effect is better than the simple superposition of individual structures.

[0083] It should be noted that the compression amount, angle range, flow rate ratio, purging time, protective gas temperature and other parameters described in this embodiment are all preferred implementation parameters. Those skilled in the art can make reasonable adjustments according to the actual wafer cassette 70 specifications, production line process requirements and equipment installation space, all of which fall within the scope of the protection concept of this invention.

[0084] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered within the scope of protection of the present invention.

Claims

1. A wafer cassette loading device with sealing, cleaning, and circulation functions, characterized in that, include: The supporting body is equipped with a loading port opposite to the wafer box opening; A support platform assembly, located on the support body, is used to support the wafer cassette; A compression sealing assembly includes an annular seal and a compression driving mechanism; the annular seal is arranged around the periphery of the loading port, and the compression driving mechanism is configured to apply a compression force to the wafer cassette along the axial direction of the loading port after the wafer cassette is placed on the support platform assembly, so that the end face of the wafer cassette opening presses against the annular seal to form a circumferentially closed sealing space. An intake manifold is provided on the supporting body and located on one side of the loading port in the horizontal direction. It has an intake interface and multiple air outlets that connect to the sealed space. The multiple air outlets are arranged at intervals along the wafer arrangement direction. The air outlets are inclined relative to the plane where the wafer is located, and their projections in the plane where the wafer is located point to the side where the exhaust manifold is located. An exhaust manifold is provided on the supporting body and located on the other side of the loading port in the horizontal direction, opposite to the intake manifold. The exhaust flow area of ​​the exhaust manifold is larger than the air outlet flow area of ​​the intake manifold. An opening mechanism, located on the supporting body, is used to open and close the door of the wafer box; The control unit is electrically connected to the pressing drive mechanism, the intake manifold, the exhaust manifold, and the box-opening mechanism, and is configured to: Once the wafer cassette is in place, the clamping drive mechanism is controlled to output clamping force; Upon receiving the box opening command, the box opening mechanism is controlled to open the box door, and during the entire period when the box door is open, the intake manifold is controlled to supply air at a first flow rate and the exhaust manifold is controlled to exhaust air synchronously. Upon receiving a signal indicating that the wafer has completed its processing, the intake manifold is controlled to switch to a second flow rate that is greater than the first flow rate. Once all wafers have been fed into the wafer cassette and the preset purging time has been reached, the cassette opening mechanism is controlled to close the cassette door, the air intake manifold stops supplying air, the exhaust manifold stops exhausting air, and the clamping drive mechanism is controlled to release the clamping force.

2. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The air outlet's outlet direction is tilted at a first included angle R1 relative to the plane where the wafer is located, satisfying... The angle between the projection of the air outlet's outlet direction onto the plane of the wafer and the direction pointing from the side of the intake manifold to the side of the exhaust manifold is the second included angle R2, satisfying... .

3. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The annular seal is a flexible sealing ring, and its contour is adapted to the outer contour of the wafer cassette opening. After the pressing drive mechanism completes the pressing action, the sealing space formed by the annular seal is connected to the inner cavity of the wafer cassette. The compression amount of the annular seal after being pressed is... .

4. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The intake manifold includes an intake manifold block and an intake sealing gasket; the intake manifold block has an intake port, the intake manifold block is sealed to the supporting body through the intake sealing gasket, the intake manifold block has a gradient flow channel inside, and the intake port is connected to each of the air outlets through the gradient flow channel.

5. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 4, characterized in that, The air outlet is a circular air outlet, and the air outlets are evenly distributed along the wafer arrangement direction; the length of the air intake manifold block along the air outlet arrangement direction is D, the diameter of the air outlet is α1, the center distance between adjacent air outlets is L1, and the total number of air outlets is n; the air intake manifold block and each air outlet satisfy the following geometric constraint relationship: , ,and Where k1 and k2 are preset proportional coefficients.

6. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The exhaust manifold includes an exhaust manifold block and an exhaust sealing gasket; the exhaust manifold block is sealed and fitted to the supporting body through the exhaust sealing gasket; the exhaust port diameter of the exhaust manifold block is larger than the air outlet diameter of the intake manifold block.

7. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The protective gas introduced through the intake manifold is nitrogen, and the temperature of the protective gas is 20℃~25℃.

8. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The circulating airflow formed by the intake manifold and the exhaust manifold can carry away the heat diffused from the process equipment to the loading area where the loading port is located, so that the steady-state temperature of the loading area does not exceed 40°C.

9. The wafer cassette loading device with sealing, cleaning, and circulation functions according to claim 1, characterized in that, The ratio of the second flow rate to the first flow rate is 2 to 10; the control unit is further configured to: before opening the box door, control the intake manifold to perform a pre-purge flow rate less than the first flow rate to replace the initial air in the sealed space; After the pre-purge process reaches the preset conditions, the box opening mechanism is controlled to open the box door; the preset purge time is 10s to 60s after all the wafers are fed into the wafer box.

10. The wafer cassette loading device with sealing, cleaning, and circulation functions according to any one of claims 1 to 9, characterized in that, The intake manifold, the exhaust manifold, the compression sealing assembly, and the box opening mechanism are all integrated into the supporting body; the gas pipelines of the intake manifold and the exhaust manifold, as well as the drive pipelines of the compression drive mechanism and the box opening mechanism, are all built into the supporting body.

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