A pick-up device and method for a semiconductor process apparatus

Abstract

The application relates to the technical field of semiconductors, and discloses a wafer taking device and method of a semiconductor process equipment, which comprises a safety controller, a ranging module, and a driving unit. The safety controller is used for sending a detection instruction to the ranging module after receiving a first control instruction from a first controller. The ranging module is used for measuring a first distance between a wafer and the ranging module in a vertical direction and a second distance between an edge of the wafer and the ranging module in a horizontal direction in response to the detection instruction. The safety controller is connected to the driving unit through a first relay and is used for determining whether the wafer is in a preset position according to the first distance and the second distance. If the wafer is in the preset position, a first enable signal is output to the first relay, and the driving unit is triggered to control a mechanical hand to perform a wafer taking action. If the wafer is not in the preset position, a second enable signal is output to the first relay, and the first relay and the driving unit are in a disconnected state. The application can effectively prevent wafer taking accidents of the mechanical hand.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a wafer pick-up device and method for semiconductor process equipment. Background Technology

[0002] In semiconductor manufacturing processes, robotic arms are responsible for removing wafers from the process chamber and transferring them to the next machine after each process is completed. During this process, wafers may remain abnormally attached to their original position due to electrostatic adsorption, vacuum residue, or thin film adhesion, or they may deviate from the preset pick-up point due to vibration, airflow, or mechanical stress, which can easily lead to wafer breakage and damage to the robotic arm.

[0003] To address this issue, related technologies employ a solution of installing a monitoring camera at the top of the chamber and setting up sensors at the end effector of a robotic arm for detection. However, the solution of installing a monitoring camera at the top of the chamber is limited by factors such as lighting conditions, image resolution, and image processing difficulty, resulting in slow response and insufficient reliability; the solution of setting up sensors at the end effector of the robotic arm only makes a judgment when the robotic arm comes into contact with the wafer, which is difficult to effectively avoid risks. Summary of the Invention

[0004] This invention provides a wafer picking device and method for semiconductor process equipment to prevent accidents caused by the robotic arm picking up wafers during semiconductor processing due to the wafer not being in the preset picking position.

[0005] In a first aspect, the present invention provides a wafer pick-up device for a semiconductor process equipment, comprising: a safety controller connected to a first controller of the semiconductor process equipment, configured to send a detection command to a ranging module after receiving a first control command from the first controller, wherein the semiconductor process equipment includes a process chamber and a carrier tray located in the process chamber, and the first control command is used to indicate that the wafer located on the carrier tray has been released and a wafer pick-up request has been made; a ranging module connected to the safety controller, configured to, in response to the detection command, measure a first distance between the wafer and the ranging module in the vertical direction, and measure a second distance between the edge of the wafer and the ranging module in the horizontal direction; the safety controller connected to a drive unit via a first relay, further configured to determine whether the wafer is in a preset position based on the first and second distances; if the wafer is in the preset position, outputting a first enable signal to the first relay, thereby connecting the first relay to the drive unit and triggering the drive unit to control a robot arm to perform a wafer pick-up action; if the wafer is not in the preset position, outputting a second enable signal to the first relay, thereby disconnecting the first relay from the drive unit.

[0006] The wafer retrieval device provided by this invention, after receiving the first control command that the wafer has been released, does not directly trigger the drive unit to control the robot to perform the wafer retrieval action. Instead, it determines the first distance in the vertical direction and the second distance in the horizontal direction between the wafer and itself through the ranging module, and determines whether the wafer is in a preset position based on the first and second distances. Only when the wafer is in the preset position is the drive unit triggered to control the robot to perform the wafer retrieval action. This avoids the situation where the robot collides with the wafer due to wafer adhesion failure, and avoids the situation where the wafer slips or falls due to offset failure, thereby reducing the risk of wafer breakage.

[0007] Meanwhile, when the wafer is not in the preset position, instead of controlling the robot to stop picking up the wafer through instructions, the connection between the safety controller and the drive unit is cut off in hardware through the first relay. This not only bypasses the software communication protocol stack, fundamentally eliminating the risk of delayed or failed safety response due to network latency, data packet loss, or software crashes, but also blocks the robot from starting earlier, avoiding the collision risk caused by stopping the machine after the robot has already entered the chamber, further reducing the risk of wafer breakage.

[0008] In one optional implementation, the controller is configured to determine that the wafer is in a preset position when the first distance is within a preset height range and the second distance is within a preset horizontal range; the controller is configured to determine that the wafer is not in a preset position when the first distance is outside the preset height range or the second distance is outside the preset horizontal range.

[0009] This embodiment, by presetting height and horizontal ranges, tolerates normal physical fluctuations while ensuring safety, thereby reducing unnecessary equipment shutdown alarms; the preset range values ​​can be flexibly configured according to different process requirements, and have good versatility.

[0010] In one optional embodiment, the device further includes a second relay, the control terminal of which is connected to a safety controller, and the first relay is connected to a drive unit through the second relay. The safety controller is further configured to output a first enable signal to the second relay when the wafer is in a preset position, so that the second relay is connected to the drive unit and triggers the drive unit to control the robot to perform a wafer picking action; and to output a second enable signal to the second relay when the wafer is not in the preset position, so that the second relay is disconnected from the drive unit.

[0011] This embodiment uses a dual-channel cutoff mechanism. Even if one relay contact is welded together, the circuit will still be cut off as long as the other is disconnected normally, thus minimizing the probability of safety risks caused by single-point failures.

[0012] In one alternative implementation, the first relay and / or the second relay are forced-guided relays.

[0013] This embodiment eliminates the major safety hazard of a relay appearing to be disconnected but actually having its contacts still stuck and conducting by using a forced-guided relay, thus preventing the possibility of the robotic arm continuing to perform the chip-picking action when the contacts are in a failed state.

[0014] In one optional embodiment, the wafer picking device further includes an alarm unit, and the safety controller is also used to send an alarm command to the alarm unit when the wafer is not in a preset position. The alarm command is used to trigger the alarm unit to issue an alarm message.

[0015] This embodiment enables staff to be aware of abnormal conditions immediately through an alarm unit, increasing human-machine collaboration efficiency and effectively avoiding misoperation and prolonged downtime.

[0016] In one optional implementation, the alarm command includes a first command and a second command, the first command indicating that the fault type is a stuck piece and the second command indicating that the fault type is an offset; the safety controller 41 is used to send the first command to the alarm unit when the first distance is outside the preset height range, and to send the second command to the alarm unit when the second distance is outside the preset horizontal range.

[0017] This embodiment divides alarm commands into two types: sticking and offset. This allows workers to directly pinpoint the inspection direction based on the alarm type, facilitating rapid response and improving production efficiency.

[0018] In one optional implementation, the security controller is further configured to send a second control command to the first controller when the first distance is outside the preset height range. The second control command is configured to instruct the first controller to trigger the wafer release device to perform a release action again.

[0019] This embodiment avoids triggering alarm shutdowns due to occasional anomalies by controlling the wafer to be released again, significantly reducing the frequency of production line interruptions and improving the overall efficiency of the equipment and the continuous operation capability of the production line.

[0020] In one optional embodiment, the ranging module includes a first laser ranging sensor and a second laser ranging sensor; the first laser ranging sensor is disposed on the top of the process chamber and is used to detect a first distance; the second laser ranging sensor is disposed on the side wall of the process chamber and is used to detect a second distance.

[0021] This embodiment employs a dual-laser ranging sensor layout, which provides high measurement accuracy and fast response speed, offering a reliable data foundation for subsequent judgment. Non-contact laser measurement can directly reflect the wafer state, completing detection and judgment in milliseconds, meeting the cycle time requirements of high-speed production, and without introducing contamination.

[0022] In one alternative implementation, the ranging module is a line laser profilometer.

[0023] This embodiment uses a line laser profilometer to detect multi-section data, which can more accurately and comprehensively determine whether the wafer is in a safe wafer removal position.

[0024] Secondly, the present invention provides a wafer picking method for a semiconductor process apparatus, comprising: in response to a first control command from a first controller, sending a detection command to a ranging module, wherein the semiconductor process apparatus includes a process chamber and a carrier plate located in the process chamber, and the first control command is used to indicate that the wafer located on the carrier plate has been released and a wafer picking request has been made; acquiring a first distance between the wafer and the ranging module in the vertical direction, and a second distance between the edge of the wafer and the ranging module in the horizontal direction; determining whether the wafer is in a preset position based on the first distance and the second distance; if the wafer is in the preset position, outputting a first enable signal to connect a first relay and a drive unit, triggering the drive unit to control a robot to perform a wafer picking action; if the wafer is not in the preset position, outputting a second enable signal to disconnect the first relay and the drive unit. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram showing the positional relationship between the wafer and the carrier disk during the processing. Figure 2 This is a schematic diagram showing the positional relationship between the wafer and the carrier disk after the processing is completed; Figure 3 This is a schematic diagram of a wafer misalignment fault; Figure 4 This is a schematic diagram of a wafer picking device for a semiconductor process apparatus according to an embodiment of the present invention; Figure 5 This is a schematic diagram showing the position of the ranging module according to an embodiment of the present invention; Figure 6 This is a schematic diagram of a wafer pick-up device for another semiconductor process apparatus according to an embodiment of the present invention; Figure 7 This is a schematic diagram of a wafer pick-up device for another semiconductor process apparatus according to an embodiment of the present invention; Figure 8 This is a schematic flowchart of a wafer picking method for a semiconductor process apparatus according to an embodiment of the present invention; Figure 9 This is a schematic flowchart of another wafer picking method for semiconductor process equipment according to an embodiment of the present invention.

[0027] Reference numerals: 11. Process chamber; 12. Carrier tray; 13. Ejector pin; 14. First controller; 20. Wafer; 40. Wafer pick-up device; 41. Safety controller; 42. Ranging module; 43. First relay; 44. Drive unit; 45. Robotic arm; 421. First laser ranging sensor; 422. Second laser ranging sensor; 46. Second relay; 47. Alarm unit. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] It is understood that before using the technical solutions disclosed in the various embodiments of the present invention, users should be informed of the types, scope of use, and usage scenarios of the personal information involved in the present invention and their authorization should be obtained in accordance with relevant laws and regulations through appropriate means.

[0030] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] After the semiconductor process equipment completes the corresponding processes on the wafer, the wafer needs to be removed by a robot and transferred to the next station. The semiconductor process equipment can be used for processes such as wet etching, dry etching, or thin-film resist removal. The specific wafer retrieval process in the process chamber can be as follows: Process completion -> Wafer release device (ejector) releases the wafer -> Robot extends into the process chamber to the retrieval position -> Picks up the wafer -> Exits the process chamber.

[0032] See Figure 1 and Figure 2The semiconductor process equipment includes a process chamber 11, a carrier disk 12 located in the process chamber 11, and a first controller (not shown in the figure). The carrier disk 12 has a platform for placing a wafer 20. The wafer release device consists of multiple ejector pins 13, which are spaced apart along the axial direction of the carrier disk within the carrier disk 12. The ejector pins 13 are provided with small holes for blowing out a small amount of gas to disrupt the vacuum adsorption effect.

[0033] During wafer processing, such as Figure 1 As shown, the top of the ejector pin 13 is flush with the upper surface of the carrier plate 12; after the process is completed, as... Figure 2 As shown, the first controller controls the ejector pin 13 to move up relative to the upper surface of the carrier disk 12, lifting the wafer 20 away from the upper surface of the carrier disk 12; then, the small holes of the multiple ejector pins 13 release gas to break the vacuum and complete the wafer release.

[0034] Under normal circumstances, after the first controller triggers the wafer release device to perform the release action, wafer 20 will be placed in the wafer pick-up position, facilitating the robotic arm to pick it up. However, during the wafer pick-up process, the following two types of faults may occur: The first type of fault is die sticking, which refers to the wafer 20 failing to be properly released from the carrier tray 12 of the process chamber 11 due to electrostatic adsorption, vacuum residue, or thin film adhesion, and remaining abnormally attached to its original position. The second type of fault is offset, which refers to the wafer 20 unexpectedly shifting during the process due to vibration, airflow, or mechanical stress, causing its position to deviate significantly from the preset pick-up point. For example... Figure 3 As shown, the ideal position of wafer 20 is the area shown by the solid line. After release, the actual position of wafer 20 may be the position shown by the dashed line. The center of the wafer shifts from the first position point O to the second position point O'.

[0035] In the event of a die-attachment failure, if the robotic arm continues to perform the die-picking action according to the established program, it will cause a strong collision between the robotic arm and wafer 20, resulting in wafer 20 shattering and damage to the robotic arm. In the event of a misalignment failure, if the robotic arm continues to perform the die-picking action according to the established program, it will cause misalignment between the robotic arm and wafer 20, leading to wafer 20 slipping or falling.

[0036] To address these issues, some related technologies indirectly infer whether the wafer has been released by detecting sensor signals indicating whether the ejector pin has risen to its designated position or whether vacuum breaking has been completed. Alternatively, the encoder feedback from the robotic arm itself confirms whether it has moved to the preset wafer pick-up coordinates. However, these methods cannot directly confirm the true physical state of the wafer.

[0037] Other related technologies employ methods such as installing monitoring cameras on the top of the process chamber and setting sensors at the end effector of a robotic arm for detection. However, the method of installing monitoring cameras on the top of the process chamber is limited by factors such as lighting conditions, image resolution, and image processing difficulty, resulting in slow response and insufficient reliability; the method of setting sensors at the end effector of the robotic arm only makes judgments when the robotic arm comes into contact with the wafer, which is difficult to effectively avoid risks.

[0038] Therefore, the present invention provides a wafer picking device and method for semiconductor process equipment. By detecting whether the wafer is in a preset position before the robotic arm picks up the wafer, and triggering the robotic arm to perform the wafer picking action only when the wafer is in the preset position, the collision between the robotic arm and the wafer, wafer slippage or dropping can be avoided, thereby improving the wafer processing yield.

[0039] The wafer picking device of the semiconductor process equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0040] like Figure 4 As shown, the wafer picking device 40 of the semiconductor process equipment provided by the present invention includes a safety controller 41, a ranging module 42, a first relay 43, a drive unit 44, and a robotic arm 45.

[0041] The safety controller 41 is connected to the first controller 14 and the ranging module 42 of the semiconductor process equipment. The safety controller 41 is also connected to the drive unit 44 through the first relay 43. The drive unit 44 is connected to the robot arm 45.

[0042] The safety controller 41, upon receiving a first control command from the first controller 14, sends a detection command to the ranging module 42. In response to the detection command, the ranging module 42 measures a first distance in the vertical direction between the wafer and the ranging module 42, and a second distance in the horizontal direction between the edge of the wafer and the ranging module 42. The safety controller 41 is also used to determine whether the wafer 20 is in a preset position based on the first and second distances. If the wafer 20 is in the preset position, it outputs a first enable signal to the first relay 43, connecting the first relay 43 to the drive unit 44 and triggering the drive unit 44 to control the robot arm to perform a wafer-picking action. If the wafer 20 is not in the preset position, it outputs a second enable signal to the first relay 43, disconnecting the first relay 43 from the drive unit 44.

[0043] The first control command is used to indicate that the wafer 20 located on the carrier disk 12 has completed release and requests to pick up the wafer. The preset position is the position where the wafer is normally released. The first enable signal and the second enable signal are both digital level signals. Their high level, low level and the on / off relationship with the first relay are determined by the relay contact type and control logic, and can be flexibly configured according to the actual situation.

[0044] In this embodiment, the first enable signal functionally corresponds to the on state, and the second enable signal functionally corresponds to the off state. Taking the first relay as a normally open relay and using low-level active control as an example, the first enable signal can be low level, which energizes the coil, closes the contacts, and connects to the drive unit 44; the second enable signal can be high level, which de-energizes the coil, opens the contacts, and disconnects from the drive unit 44.

[0045] This invention does not specifically limit the type and location of the ranging module 42, as long as it can detect the first distance and the second distance. For example, the ranging module 42 can be a ranging sensor, and it can be located inside the process chamber 11 or integrated into the robotic arm.

[0046] The wafer retrieval device provided by this invention, after receiving the first control command that the wafer 20 has been released, does not directly trigger the drive unit 44 to control the robot arm 45 to perform the wafer retrieval action. Instead, it determines the first distance in the vertical direction and the second distance in the horizontal direction between the wafer 20 and itself through the ranging module 42, and determines whether the wafer 20 is in a preset position through the first distance and the second distance. Only when the wafer 20 is in the preset position is the drive unit 44 triggered to control the robot arm to perform the wafer retrieval action. This avoids the situation where the robot arm collides with the wafer due to the wafer sticking failure, and avoids the situation where the wafer slips or falls due to the offset failure, thereby reducing the risk of wafer breakage.

[0047] Meanwhile, when wafer 20 is not in the preset position, instead of controlling the robot arm to stop picking up the wafer through instructions, the connection between the safety controller and the drive unit is cut off in hardware through the first relay 43. This not only bypasses the software communication protocol stack, fundamentally eliminating the risk of delayed or failed safety response due to network latency, data packet loss, or software crashes, but also blocks the robot arm from starting earlier, avoiding the collision risk caused by stopping the machine after the robot arm has already entered the chamber, further reducing the risk of wafer breakage.

[0048] In some embodiments, such as Figure 5 As shown, the ranging module 42 includes a first laser ranging sensor 421 and a second laser ranging sensor 422; the first laser ranging sensor 421 is disposed on the top of the process chamber 11 and is used to detect a first distance H; the second laser ranging sensor 422 is disposed on the side wall of the process chamber 11 and is used to detect a second distance P.

[0049] The laser beam emitted by the first laser rangefinder 421 is vertically downward and aimed at the center of the wafer; the laser beam emitted by the second laser rangefinder 422 is horizontally pointed towards the expected position of the edge of the wafer.

[0050] Specifically, the laser rangefinder (first laser rangefinder 421 and second laser rangefinder 422) emits laser signals toward the wafer 20 and receives laser signals returned from the wafer 20. By combining the time difference between emitting and receiving the laser signals, the distance between itself and the wafer can be accurately calculated.

[0051] This embodiment employs a dual-laser ranging sensor layout, which provides high measurement accuracy and fast response speed, offering a reliable data foundation for subsequent judgment. Non-contact laser measurement can directly reflect the wafer state, completing detection and judgment in milliseconds, meeting the cycle time requirements of high-speed production, and without introducing contamination.

[0052] In other embodiments, the ranging module 42 can be a line laser profilometer.

[0053] A line laser profilometer is a high-speed, high-precision 3D measurement device. It uses laser triangulation to obtain the 3D contour data of an object by projecting a laser line onto the object's surface and analyzing its deformation. A single scan can simultaneously extract the height and edge position information of a wafer, offering advantages such as high precision, high efficiency, and strong adaptability.

[0054] This embodiment uses a line laser profilometer to detect multi-section data, which can more accurately and comprehensively determine whether the wafer is in a safe wafer removal position.

[0055] In one optional implementation, the safety controller 41 is used to determine that the wafer is in a preset position when the first distance H is within a preset height range and the second distance P is within a preset horizontal range; the safety controller 41 is used to determine that the wafer is not in a preset position when the first distance H1 is outside the preset height range or the second distance H2 is outside the preset horizontal range.

[0056] Preset height range (H) min H max H is the allowable offset distance of wafer 20 in the vertical direction. min H is the preset minimum height. max Preset maximum height; preset horizontal range (P) min P max P is the allowable offset distance of wafer 20 in the horizontal direction. min To preset the minimum level threshold, P max The preset maximum horizontal threshold is set. The preset height range and preset horizontal range can be flexibly configured according to the process chamber, support stage, ejector pin, robot arm and wafer, etc., to ensure fault tolerance while ensuring wafer picking safety.

[0057] The first distance being outside the preset height range means H≤H min Or H≥H maxThe second distance being outside the preset horizontal interval means P ≤ P min or P≥P max Furthermore, the first distance being outside the preset height range or the second distance being outside the preset horizontal range also includes cases where no reading is detected (such as when the beam of the optical sensor hits the air).

[0058] This embodiment, by presetting height and horizontal ranges, tolerates normal physical fluctuations while ensuring safety, thereby reducing unnecessary equipment shutdown alarms.

[0059] In one alternative implementation, such as Figure 6 As shown, the chip picking device also includes a second relay 46, the control terminal of which is connected to the safety controller 41, and the first relay 43 is connected to the drive unit 44 through the second relay 46.

[0060] Specifically, the positive terminal (+24V) of the external 24V DC power supply is connected to the coil input terminal of the first relay 43 and the coil input terminal of the second relay 46. The control terminals of the first relay 43 and the second relay 46 are both connected to the safety controller 41. The normally open main contact K1 of the first relay 43 and the normally open main contact K2 of the second relay 46 are connected in series between the positive terminal of the 24V power supply and the enable input terminal of the drive unit 44. The safety controller 41 and the drive unit 44 are grounded to GND.

[0061] The safety controller 41 is also used to output a first enable signal to the second relay 46 when the wafer 20 is in a preset position, so that the second relay 46 is connected to the drive unit 44; if the wafer is not in the preset position, it outputs a second enable signal to the second relay 46, so that the second relay 46 is disconnected from the drive unit 44.

[0062] Taking normally open relays and low-level active control as an example, when the safety controller 41 determines that the wafer is in a preset position, it simultaneously outputs a first enable signal (i.e., a low-level signal) to the first relay 43 and the second relay 46. At this time, both coils are energized simultaneously, respectively closing their corresponding normally open main contacts. Since the two normally open main contacts are connected in series, the drive unit 44 can only obtain +24V voltage when both are in the closed state. The drive unit of the robot arm is then enabled, allowing the wafer picking action to be performed.

[0063] When the safety controller 41 determines that the wafer is not in the preset position, it simultaneously outputs a second enable signal (i.e., a high-level signal) to the first relay 43 and the second relay 46. At this time, the two coils are de-energized, and the two normally open main contacts corresponding to them immediately open. Since the two normally open main contacts are connected in series, the drive unit 44 loses the +24V voltage, the robot's drive unit is forcibly disabled, and the robot immediately stops. The disconnection of either relay can independently cut off the enable circuit, realizing dual-channel redundant interlocking.

[0064] This embodiment uses a dual-channel cutoff mechanism. Even if one relay contact is welded together, the circuit will still be cut off as long as the other is disconnected normally, thus minimizing the probability of safety risks caused by single-point failures.

[0065] When the relay is active low, the control terminal will automatically return to a high-impedance state or high level when the safety controller experiences an internal power failure, hardware watchdog timeout, or communication interruption. At this time, the coil is immediately disconnected due to power loss, and the robot arm enable is physically cut off, ensuring that any abnormal situation (including controller failure) tends to bring the robot arm to a safe stop, in accordance with the highest electrical safety standards for semiconductor devices.

[0066] In one alternative implementation, the first relay and / or the second relay are forced-guided relays.

[0067] A forced-direction relay is a relay that, when its contacts fail, can be mechanically pushed to a safe position to prevent circuit malfunction. In conjunction with this, the safety controller has a built-in diagnostic scanning unit that monitors the auxiliary normally closed contacts of the coil in real time via signal lines. When the controller issues a disconnect command, if the diagnostic unit detects that the main normally open contact has not opened as expected, i.e., the auxiliary normally closed contact has not closed within the set time, the system will immediately determine that the relay has a contact welding fault and trigger an unrecoverable hard fault lockout state, forcing manual replacement of the relay.

[0068] This embodiment eliminates the major safety hazard of a relay appearing to be disconnected but actually having its contacts still stuck and conducting by using a forced-guided relay, thus preventing the possibility of the robotic arm continuing to perform the chip-picking action when the contacts are in a failed state.

[0069] In one alternative implementation, such as Figure 7 As shown, the wafer pick-up device also includes an alarm unit 47. The safety controller is also used to send an alarm command to the alarm unit when the wafer is not in a preset position. The alarm command is used to trigger the alarm unit to issue an alarm message.

[0070] The alarm unit is a device that can issue alarm information. There is no specific type limit here. For example, the alarm unit can be a buzzer or an audible and visual alarm.

[0071] This embodiment transforms potential hardware collision damage requiring prolonged downtime for maintenance into quickly recoverable software alarms and manual intervention through an alarm unit, greatly shortening the mean time to recovery and improving equipment availability; at the same time, it enables staff to be aware of abnormal conditions immediately, increasing human-machine collaboration efficiency.

[0072] Furthermore, the alarm command includes a first command and a second command. The first command is used to indicate that the fault type is sticking, and the second command is used to indicate that the fault type is offset. The safety controller 41 is used to send the first command to the alarm unit when the first distance is outside the preset height range, and to send the second command to the alarm unit when the second distance is outside the preset horizontal range.

[0073] The alarm unit can adopt differentiated response strategies for different fault types, such as flashing lights of different colors, sounding alerts of different frequencies, or displaying specific fault type text on the human-machine interface, thereby helping on-site personnel to quickly identify the root cause of the problem and take targeted measures.

[0074] This embodiment divides alarm commands into two types: sticking and offset. This allows workers to directly pinpoint the inspection direction based on the alarm type, facilitating rapid response and improving production efficiency.

[0075] In an optional implementation, the security controller 41 is further configured to send a second control command to the first controller when the first distance is outside the preset height range. The second control command is configured to instruct the first controller to trigger the wafer release device to perform a release action again.

[0076] Understandably, after the carrier disk performs the wafer release operation again, the first controller will send the first control command to the safety controller again to execute the previous complete control process again.

[0077] This embodiment avoids triggering alarm shutdowns due to occasional anomalies by controlling the wafer to be released again, significantly reducing the frequency of production line interruptions and improving the overall efficiency of the equipment and the continuous operation capability of the production line.

[0078] The wafer picking process of the wafer picking device for semiconductor process equipment provided by the present invention will be described in detail below with specific examples.

[0079] like Figure 8 As shown, after the process is completed, the first controller sends a start signal to the wafer release device to indicate that the process is finished and a wafer pick-up request is needed. In response to the start signal, the wafer release device executes a wafer release action, which includes driving the ejector pins to rise relative to the carrier tray and breaking the vacuum inside the chamber. Once the release action is complete, a first control command is sent to the safety controller.

[0080] After receiving the first control command, the safety controller sends a detection command to the ranging module. The first laser ranging sensor in the ranging module measures the first distance H in response to the detection command, and the second laser ranging sensor in the ranging module measures the second distance P in response to the detection command.

[0081] After receiving the first distance H and the second distance P, the safety controller determines whether the wafer is in a preset position based on the first distance H and the second distance P. Specifically, if H... min <H<H max And P min <P<P max If H indicates that the wafer is in the preset position, a low-level output is triggered, the first and second relays engage, connecting the drive unit, and the robotic arm performs the wafer picking action; if H min <H<H max and / or P min <P<P max If the condition is not met, it indicates that the wafer is not in the preset position. At this time, the output is high, the contacts of the first and second relays are disconnected, and the drive unit is disconnected. The alarm unit then issues an alarm signal.

[0082] At the same time, in response to the abnormal judgment result determined by the safety controller that the wafer is not in the preset position, the alarm unit issues an audible and visual alarm and displays the specific fault type on the human machine interface (HMI), including but not limited to die sticking or offset, so that maintenance personnel can accurately troubleshoot.

[0083] According to an embodiment of the present invention, a wafer picking method for a semiconductor process apparatus is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0084] This embodiment provides a wafer picking method for semiconductor process equipment, which can be used in the controller of semiconductor process equipment. Figure 9 This is a flowchart of a wafer-picking method for a semiconductor process apparatus according to an embodiment of the present invention, such as... Figure 9 As shown, the process includes the following steps: Step S901: In response to the first control command from the first controller, a detection command is sent to the ranging module.

[0085] The semiconductor process equipment includes a process chamber and a carrier disk located in the process chamber. The first control command is used to indicate that the wafer located on the carrier disk has been released and to request wafer retrieval.

[0086] Step S902: Obtain the first distance between the wafer and the ranging module in the vertical direction, and the second distance between the edge of the wafer and the ranging module in the horizontal direction.

[0087] Step S903: Determine whether the wafer is in a preset position based on the first distance and the second distance.

[0088] In step S904, if the wafer is in a preset position, a first enable signal is output to connect the first relay and the drive unit, triggering the drive unit to control the robot to perform the wafer picking action.

[0089] In step S905, if the wafer is not in the preset position, a second enable signal is output to disconnect the first relay from the drive unit.

[0090] The wafer picking method for semiconductor process equipment provided in this embodiment, through dual-dimensional distance detection and hardware relay cut-off safety logic, ensures the accuracy of the robotic arm in picking wafers while minimizing the risk of wafer breakage, and is suitable for automated semiconductor process equipment in mass production environments.

[0091] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A wafer picking device for semiconductor process equipment, characterized in that, include: A safety controller, connected to a first controller of a semiconductor process equipment, is used to send a detection command to a ranging module after receiving a first control command from the first controller. The semiconductor process equipment includes a process chamber and a carrier disk located in the process chamber. The first control command is used to indicate that the wafer located on the carrier disk has been released and a wafer retrieval request has been made. A ranging module, connected to the security controller, responds to the detection command to measure a first distance in the vertical direction between the wafer and the ranging module, and to measure a second distance in the horizontal direction between the edge of the wafer and the ranging module; The safety controller is connected to the drive unit via a first relay and is also used to determine whether the wafer is in a preset position based on the first distance and the second distance. If the wafer is in the preset position, a first enable signal is output to the first relay, so that the first relay and the drive unit are connected, triggering the drive unit to control the robot to perform a wafer picking action. If the wafer is not in the preset position, a second enable signal is output to the first relay, so that the first relay and the drive unit are disconnected.

2. The apparatus according to claim 1, characterized in that, The controller is used to determine that the wafer is in the preset position when the first distance is within a preset height range and the second distance is within a preset horizontal range; The controller is used to determine that the wafer is not in the preset position when the first distance is outside the preset height range or the second distance is outside the preset horizontal range.

3. The apparatus according to claim 1, characterized in that, The device further includes a second relay, the control terminal of which is connected to the safety controller, and the first relay is connected to the drive unit through the second relay. The safety controller is also used to output a first enable signal to the second relay when the wafer is in the preset position, so that the second relay is connected to the drive unit and triggers the drive unit to control the robot to perform the wafer picking action; And for outputting a second enable signal to the second relay when the wafer is not in a preset position, so that the second relay is disconnected from the drive unit.

4. The apparatus according to claim 3, characterized in that, The first relay and / or the second relay are forced-guided relays.

5. The apparatus according to any one of claims 1 to 4, characterized in that, The device also includes an alarm unit; The safety controller is also used to send an alarm command to the alarm unit when the wafer is not in a preset position, and the alarm command is used to trigger the alarm unit to issue alarm information.

6. The apparatus according to claim 5, characterized in that, The alarm command includes a first command and a second command, wherein the first command is used to indicate that the fault type is sticking and the second command is used to indicate that the fault type is offset. The safety controller is configured to send the first instruction to the alarm unit when the first distance is outside a preset height range, and to send the second instruction to the alarm unit when the second distance is outside a preset horizontal range.

7. The apparatus according to claim 6, characterized in that, The safety controller is also configured to send a second control command to the first controller when the first distance is outside the preset height range, the second control command being configured to instruct the first controller to trigger the wafer release device to perform a release action again.

8. The apparatus according to any one of claims 1 to 4, characterized in that, The ranging module includes a first laser ranging sensor and a second laser ranging sensor; The first laser ranging sensor is disposed on the top of the process chamber and is used to detect the first distance; The second laser rangefinder is disposed on the side wall of the process chamber and is used to detect the second distance.

9. The apparatus according to any one of claims 1 to 4, characterized in that, The ranging module is a line laser profilometer.

10. A method for wafer picking in a semiconductor process apparatus, characterized in that, A safety controller applied in the wafer pick-up device of any one of claims 1 to 9, comprising: In response to a first control command from a first controller, a detection command is sent to a ranging module, wherein the semiconductor process equipment includes a process chamber and a carrier disk located in the process chamber, and the first control command is used to indicate that the wafer located on the carrier disk has been released and a wafer retrieval request has been made; Obtain a first distance in the vertical direction between the wafer and the ranging module, and a second distance in the horizontal direction between the edge of the wafer and the ranging module; Based on the first distance and the second distance, determine whether the wafer is in a preset position; If the wafer is in a preset position, a first enable signal is output to connect the first relay and the drive unit, triggering the drive unit to control the robot to perform the wafer picking action; If the wafer is not in the preset position, a second enable signal is output to disconnect the first relay from the drive unit.

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