Chip transfer robot

Abstract

The application relates to the technical field of mechanical hands, and discloses a chip transfer mechanical hand which comprises an oval block and a rectangular box arranged below the oval block, and further comprises: positioning parts, the two positioning parts are arranged in mirror images in the rectangular box; a driving part installed on the oval block; a rotary lifting part arranged on the oval block; the positioning part comprises a positioning assembly arranged in the rectangular box; a sliding assembly installed on the positioning assembly; and the positioning assembly comprises a rectangular plate arranged in the rectangular box. The positioning part is arranged, so that the existing mechanical hand can solve the problem that the mechanical hand only has a single-direction adsorption and grabbing function during use, cannot realize multidirectional positioning of chips in front and back and left and right directions, is inconvenient for automatically correcting the chip offset posture, and is prone to chip alignment deviation and misplacement.

Description

Technical Field

[0001] This invention relates to the field of robotic arm technology, specifically a chip transfer robotic arm. Background Technology

[0002] With the rapid development of the semiconductor industry, integrated circuits, and chip packaging and testing industry, the market demand for high-end precision chips continues to grow significantly. As a key core link in the chip packaging, sorting, handling, and alignment assembly process, the chip transfer process directly affects the automation level, operational efficiency, and finished product yield of chip production. Chip transfer robots play an important role in accurately grasping, transporting, and placing chips across workstations. Their positioning accuracy, clamping stability, and adaptability to working conditions directly affect the overall processing quality of chip packaging. Therefore, a high-performance chip transfer robot is of great practical significance in meeting the industry's needs for large-scale precision production.

[0003] However, most existing robotic arms only have a single-directional adsorption and gripping function during use, making it difficult to achieve multi-directional positioning of chips in front, back, left, and right directions. This makes it difficult to automatically correct chip offset posture and easily leads to chip alignment deviation and misplacement. Summary of the Invention

[0004] The purpose of this invention is to provide a chip transfer robot. By setting a positioning part, it solves the problem that most existing robots only have a single-direction adsorption and gripping function during use, making it difficult to achieve multi-directional positioning of the chip in front, behind, left, and right, making it inconvenient to automatically correct the chip offset posture, and easily causing chip alignment deviation and misplacement.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a chip transfer robot, comprising an elliptical block and a rectangular box disposed below the elliptical block, and further comprising: a positioning part, wherein two positioning parts are provided and the two positioning parts are mirror images disposed within the rectangular box; a driving part, wherein the driving part is mounted on the elliptical block; a rotating and lifting part, wherein the rotating and lifting part is disposed on the elliptical block; the positioning part includes a positioning component, wherein the positioning component is disposed within the rectangular box; a sliding component, wherein the sliding component is mounted on the positioning component; the positioning component includes a rectangular plate disposed within the rectangular box, wherein a plurality of spring dampers are fixedly connected to the left side of the rectangular plate, and a positioning plate is fixedly connected to the left side of the plurality of spring dampers; two hinge rods are hingedly disposed on the left side of the rectangular plate, and a hinge block is hingedly disposed on the left side of each of the two hinge rods; the left side of each of the two hinge blocks is slidably connected to the right side of the positioning plate; four spring dampers are arranged in an array, and the two hinge rods are inclined and mirror images of each other.

[0006] Furthermore, the sliding assembly includes two L-shaped rods hinged to two cylindrical rods, and two limiting blocks are fixedly connected to the right side of the positioning plate. The inner walls of the two limiting blocks are slidably connected to the outer walls of the two L-shaped rods, and positioning plates are fixedly connected to both L-shaped rods. The two positioning plates are mirror images of each other.

[0007] Further, the driving unit includes a transmission assembly disposed on a rectangular box; and an elastic assembly disposed on the rectangular box. The transmission assembly includes two rectangular sliders slidably connected to the inner wall of the rectangular box. A cylindrical rod is fixedly connected to the bottom of each of the two rectangular sliders. A fixing block is slidably connected to the outer wall of each of the two cylindrical rods. The sides of the two fixing blocks that are far apart from each other are fixedly connected to the inner wall of the rectangular box. Two connecting blocks are disposed inside the rectangular box. A cylindrical rod is penetrating each of the two connecting blocks. The outer walls of the two cylindrical rods are fixedly connected to the inner walls of the two connecting blocks respectively. The two rectangular sliders are fixedly connected to the two rectangular plates. Each of the two rectangular sliders has two arc-shaped grooves. A guide is provided inside the rectangular box. The outer wall of the cylindrical rod 2 on the left side slides in contact with the inner wall of the two arc-shaped grooves on the left side, and the outer wall of the cylindrical rod 2 on the right side slides in contact with the inner wall of the two arc-shaped grooves on the right side. The two arc-shaped grooves on one rectangular slider are C-shaped and mirror images of each other. During the process of the rectangular slider rising, it will first drive the two cylindrical rods 2 to move closer to each other, and then drive the two cylindrical rods 2 to move away from each other. The guide includes two square sliding rods fixedly connected to the inner wall of the rectangular box. The outer walls of the two square sliding rods slide through the two connecting blocks 1 respectively.

[0008] Furthermore, the elastic component includes two connecting blocks II fixedly connected to the sides of the two rectangular sliders that are close to each other, and spring dampers II fixedly connected to the top of several connecting blocks II, and the top of several spring dampers II fixedly connected to the inner wall of the top of the rectangular box; four spring dampers II are provided, divided into two groups for resetting the two rectangular sliders respectively.

[0009] Furthermore, the rotating lifting unit includes a cylindrical shell disposed above the elliptical block. A hollow cylindrical slider is slidably connected to the inner wall of the cylindrical shell. A motor is fixedly connected to the inner wall of the hollow cylindrical slider. The output shaft of the motor is fixedly connected to a rotating shaft via a coupling. The bottom of the rotating shaft penetrates the elliptical block, and the outer wall of the rotating shaft is fixedly connected to the inner wall of the elliptical block. An electric telescopic rod is fixedly connected to the top of the cylindrical shell. The output shaft of the electric telescopic rod extends slidably into the cylindrical shell. An adsorption component is disposed inside the rectangular box. The output shaft of the electric telescopic rod is fixedly connected to the top of the hollow cylindrical slider. The adsorption component includes a vacuum suction cup installed on the inner wall of the top of the rectangular box. A pipe is connected to the top of the vacuum suction cup. The pipe extends to the outside of the rectangular box and is fixedly connected thereto.

[0010] The present invention has the following beneficial effects: (1) By setting up a positioning part, the present invention relies on the linkage of a rectangular plate, a spring damper, a hinge rod and a hinge block, and a sliding component to achieve step-by-step positioning operation. First, the positioning plate 1 completes the rapid centering of the chip in the left and right directions. Then, with the help of the hinge transmission and the L-shaped rod, the positioning plate 2 is driven to move closer and clamp the front and rear sides of the chip, so as to achieve multi-directional enclosure positioning of the chip in the front, back and left and right directions, automatically correct the chip offset posture, adapt to the regularity and limit requirements in the chip placement process, and avoid chip alignment deviation and misplacement. (2) By setting up a driving unit, the rectangular slider in the transmission assembly slides relative to the rectangular box as it moves downward. The C-shaped arc groove guides the cylindrical rod two to achieve orderly movement of first approaching each other and then moving away from each other. The square slide rod slides to limit the connection block one to ensure smooth transmission. At the same time, the spring damper two of the elastic component compresses and stores force when the rectangular slider moves upward. After the operation is completed, the spring rebounds and drives the overall transmission structure to reset. Therefore, it can provide mechanical power for the clamping action of the positioning unit without the need to add an independent driving source. This simplifies the device structure and realizes the linkage automation of positioning clamping and automatic reset. (3) By setting up a rotating lifting part, the electric telescopic rod drives the hollow cylindrical slider to slide vertically along the cylindrical shell, thereby driving the entire robot to complete a smooth lifting and feeding. At the same time, the motor drives the elliptical block and the rectangular box below to rotate and adjust their posture via the rotating shaft. Combined with the adsorption structure composed of a vacuum suction cup and an external vacuum pump, the negative pressure gripping and release of the chip is realized, which is suitable for the automated transfer of the chip and provides power for the positioning part and the driving part.

[0011] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0012] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial cross-sectional view of the positioning part of the present invention; Figure 3 This is a partial cross-sectional view of the positioning part of the present invention; Figure 4 This is a partial cross-sectional view of the positioning component of the present invention; Figure 5 This is a partial structural schematic diagram of the hinge block of the present invention; Figure 6 This is a partial cross-sectional view of the drive unit of the present invention; Figure 7 This is a partial cross-sectional view of the rotating lifting part of the present invention; Figure 8 This is a partial cross-sectional view of the rectangular box of the present invention.

[0014] The attached diagram lists the components represented by each number as follows: In the diagram: 111, elliptical block; 112, rectangular box; 2, positioning part; 21, positioning assembly; 211, rectangular plate; 212, spring damper one; 213, positioning plate one; 214, hinge rod; 215, hinge block; 22, sliding assembly; 221, L-shaped rod; 222, limiting block; 223, positioning plate two; 3, driving part; 31, transmission assembly; 311, rectangular slider; 312, cylinder. 313. Rod 1; 314. Fixing block; 315. Connecting block 1; 316. Cylindrical rod 2; 317. Arc groove; 318. Square slide rod; 32. Elastic component; 321. Connecting block 2; 322. Spring damper 2; 4. Rotary lifting part; 411. Cylindrical shell; 412. Hollow cylindrical slider; 413. Motor; 414. Rotating shaft; 415. Electric telescopic rod; 416. Vacuum suction cup; 417. Pipe. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Please see Figures 1-8 As shown, the present invention is a chip transfer robot, including an elliptical block 111 and a rectangular box 112 disposed below the elliptical block 111, and further including: a positioning part 2, two positioning parts 2 are provided, and the two positioning parts 2 are mirror images disposed in the rectangular box 112; a driving part 3 is mounted on the elliptical block 111; and a rotating lifting part 4 is disposed on the elliptical block 111. The positioning unit 2 includes a positioning assembly 21, which is disposed within a rectangular box 112; and a sliding assembly 22, which is mounted on the positioning assembly 21. The positioning assembly 21 includes a rectangular plate 211 disposed within the rectangular box 112. A plurality of spring dampers 212 are fixedly connected to the left side of the rectangular plate 211, and a positioning plate 213 is fixedly connected to the left side of the plurality of spring dampers 212. Two hinge rods 214 are hingedly disposed on the left side of the rectangular plate 211, and hinge blocks 215 are hingedly disposed on the left side of each of the two hinge rods 214. The left side of each of the two hinge blocks 215 is slidably connected to the right side of the positioning plate 213. The spring dampers 212 are arranged in an array. The system is equipped with four components: two hinged rods 214 are inclined and mirror images of each other; the sliding assembly 22 includes two L-shaped rods 221 hinged on two cylindrical rods 315; two limiting blocks 222 are fixedly connected to the right side of the positioning plate 213; the inner walls of the two limiting blocks 222 are slidably connected to the outer walls of the two L-shaped rods 221; and positioning plates 223 are fixedly connected to each of the two L-shaped rods 221. The two positioning plates 223 are mirror images of each other. By setting the positioning part 2, the chip can be positioned in multiple directions (front, back, left, and right), the chip offset posture can be automatically corrected, and the regular positioning requirements during chip placement can be adapted to avoid chip alignment deviation and misplacement.

[0017] The drive unit 3 includes a transmission assembly 31, which is mounted on a rectangular box 112; and an elastic assembly 32, which is also mounted on the rectangular box 112. The transmission assembly 31 includes two rectangular sliders 311 slidably connected to the inner wall of the rectangular box 112. A cylindrical rod 312 is fixedly connected to the bottom of each of the two rectangular sliders 311. A fixing block 313 is slidably connected to the outer wall of each of the two cylindrical rods 312. The sides of the two fixing blocks 313 that are far apart from each other are fixedly connected to the inner wall of the rectangular box 112. The rectangular box 112 contains... Two connecting blocks 314, each with a cylindrical rod 315 extending through it. The outer walls of the two cylindrical rods 315 are fixedly connected to the inner walls of the two connecting blocks 314. The two connecting blocks 314 are fixedly connected to two rectangular plates 211. Each of the two rectangular sliders 311 has two arc-shaped grooves 316. A guide is provided inside the rectangular box 112. The outer wall of the cylindrical rod 315 on the left side slides in contact with the inner wall of the two arc-shaped grooves 316 on the left side, while the outer wall of the cylindrical rod 315 on the right side slides in contact with the inner wall of the two arc-shaped grooves 316 on the right side. The two arc-shaped grooves 316 on the right side slide in contact with each other. The two arc-shaped grooves 316 on a rectangular slider 311 are C-shaped and mirror images of each other. During the upward movement of the rectangular slider 311, the two cylindrical rods 315 will first move closer to each other, and then move the two cylindrical rods 315 away from each other. The guide includes two square sliding rods 317 fixedly connected to the inner wall of the rectangular box 112. The outer walls of the two square sliding rods 317 slide through the two connecting blocks 314 respectively. The elastic component 32 includes two rectangular sliders 311 fixedly connected to each other. Two connecting blocks 321 on one side close to each other, and several connecting blocks 321 are fixedly connected to the top of each of the several connecting blocks 321. The top of each of the several spring dampers 322 is fixedly connected to the top inner wall of the rectangular box 112. Four spring dampers 322 are provided, divided into two groups for resetting the two rectangular sliders 311 respectively. By setting the drive unit 3, mechanical power can be provided for the clamping action of the positioning unit 2 without the need for an additional independent drive source. This simplifies the structure of the device and realizes the linkage automation of positioning clamping and automatic reset.

[0018] The rotating lifting unit 4 includes a cylindrical shell 411 disposed above the elliptical block 111. A hollow cylindrical slider 412 is slidably connected to the inner wall of the cylindrical shell 411. A motor 413 is fixedly connected to the inner wall of the hollow cylindrical slider 412. The output shaft of the motor 413 is fixedly connected to a rotating shaft 414 via a coupling. The bottom of the rotating shaft 414 penetrates the elliptical block 111. The outer wall of the rotating shaft 414 is fixedly connected to the inner wall of the elliptical block 111. An electric telescopic rod 415 is fixedly connected to the top of the cylindrical shell 411. The output shaft of the electric telescopic rod 415 slides... Extending into the cylindrical shell 411, a suction component is provided inside the rectangular box 112; the output shaft of the electric telescopic rod 415 is fixedly connected to the top of the hollow cylindrical slider 412; the suction component includes a vacuum suction cup 416 installed on the inner wall of the top of the rectangular box 112, and a pipe 417 is provided at the top of the vacuum suction cup 416; the pipe 417 extends to the outside of the rectangular box 112 and is fixedly connected thereto; by setting the rotating lifting part 4, the negative pressure gripping and release of the chip is realized, which is adapted to the automated transfer of the chip, and at the same time provides power to the positioning part 2 and the driving part 3.

[0019] It should be noted that the control of the motor 413 and the electric telescopic rod 415 in this application can be achieved by using a program set in the control panel and inputting relevant parameters as needed for automated control. This control method can be implemented using existing technologies, such as PLC.

[0020] In use, the entire device is installed perpendicular to the plane where the chip is located. The cylindrical shell 411 is fixed on the external pneumatic slide rail. The pipe 417 is connected to an external vacuum pump. When gripping, the external pneumatic slide rail moves the entire device, positioning the chip to be gripped below the rectangular box 112. The electric telescopic rod 415 of the rotating lifting unit 4 is activated. The output shaft of the electric telescopic rod 415 pushes the hollow cylindrical slider 412 to slide downward along the inner wall of the cylindrical shell 411, simultaneously driving the motor 413, the rotating shaft 414, the elliptical block 111, and the rectangular box 112. The rectangular box 112 descends as a whole, and the rectangular plate 211 inside the rectangular box 112 moves down accordingly. At the same time, the motor 413 is controlled to rotate. The motor 413 drives the elliptical block 111 and the rectangular box 112 on it to rotate and adjust their own posture through the rotating shaft 414 until the bottom of the cylindrical rod 312 of the drive unit 3 is about to contact the plane where the chip is located. Then the external vacuum pump is started. The vacuum pump draws air through the pipe 417, so that the bottom of the vacuum suction cup 416 forms a negative pressure suction force to adsorb the chip below and complete the chip gripping. Maintaining the vacuum pump's negative pressure adsorption state, the electric telescopic rod 415 is extended and retracted to reset the rectangular box 112. The entire robotic arm is then moved via an external pneumatic slide rail, transporting the gripped chip to the target placement platform. After the device reaches the placement position, the electric telescopic rod 415 is restarted to continue controlling the rectangular box 112 to move downwards until the bottom of the cylindrical rod 312 continuously presses against the flat surface and remains stationary. The rectangular box 112 descends relative to the cylindrical rod 312 and the fixing block 313, causing the rectangular slider 311 to passively slide upwards relative to the inner wall of the rectangular box 112. When the rectangular slider 311 moves vertically, its internal C-shaped arc groove 316 slides against the outer wall of the cylindrical rod 315, first causing the two cylindrical rods 315 to move closer together and then further apart. This, through the two connecting blocks 314, drives the two rectangular plates 211 to move synchronously. The connecting blocks 314 slide along the square slide rod 317 to achieve full-range guidance and limitation. 311 moves upward and pulls the connecting block 321, compressing the spring damper 322 to store energy, preparing for subsequent reset. When the two rectangular plates 211 move closer to each other, they first drive the positioning plates 213 on both sides to fit the left and right sides of the chip, quickly completing the left and right centering and positioning of the chip. After the left and right positioning of the chip is completed, the two rectangular plates 211 continue to feed towards each other in small increments. At this time, the positioning plate 213 has already been fitted to the chip and cannot move further. The rectangular plates 211 squeeze the corresponding spring damper 212 to compress and store energy. During the compression process, the two sets of hinge rods 214 fixed on the right side of the positioning plate 213 deflect with the force, driving the hinge block 215 to slide towards each other along the right side surface of the positioning plate 213. The sliding hinge block 215 drives the L-shaped rod 221 to slide along the inner wall of the limiting block 222, simultaneously driving the two mirror-set positioning plates 223 on both sides to move closer to each other, gradually clamping the front and back sides of the chip, completing the positioning of the chip in the front and back directions. After the chip is positioned, the vacuum pump is turned off, the negative pressure suction at the bottom of the vacuum suction cup 416 disappears, and the chip is released from its adsorption and fixation. Then, the electric telescopic rod 415 is controlled to retract, which moves the rectangular box 112 upward as a whole, detaching it from the chip placement plane. At this time, the stored spring damper 322 rebounds and resets, which drives the rectangular slider 311 to slide downward relative to the rectangular box 112, driving each cylindrical rod 315 and L-shaped rod 221 to reset. Positioning plate 213 and positioning plate 223 return to their initial state. At the same time, spring damper 212 resets, and all components return to their initial positions, completing a single chip transfer operation.

[0021] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A chip transfer robot, comprising an elliptical block (111) and a rectangular box (112) disposed below the elliptical block (111), characterized in that, Also includes: Positioning part (2), two positioning parts (2) are provided, and the two positioning parts (2) are arranged in a mirror image inside the rectangular box (112); A drive unit (3) is mounted on an elliptical block (111); A rotating lifting part (4) is provided on an elliptical block (111); The positioning part (2) includes a positioning component (21), which is disposed within a rectangular box (112); and A sliding component (22) is mounted on a positioning component (21); The positioning component (21) includes a rectangular plate (211) disposed inside a rectangular box (112). A plurality of spring dampers (212) are fixedly connected to the left side of the rectangular plate (211). A positioning plate (213) is fixedly connected to the left side of the plurality of spring dampers (212). Two hinge rods (214) are hinged to the left side of the rectangular plate (211). A hinge block (215) is hinged to the left side of each of the two hinge rods (214). The left side of each of the two hinge blocks (215) is slidably connected to the right side of the positioning plate (213). Among them, there are four spring dampers (212) arrays, and two hinge rods (214) are inclined and mirror images of each other.

2. The chip transfer robot according to claim 1, characterized in that, The drive unit (3) includes a transmission assembly (31) disposed on a rectangular box (112); and An elastic component (32) is disposed on a rectangular box (112).

3. The chip transfer robot according to claim 1, characterized in that, The rotating lifting part (4) includes a cylindrical shell (411) disposed above the elliptical block (111). A hollow cylindrical slider (412) is slidably connected to the inner wall of the cylindrical shell (411). A motor (413) is fixedly connected to the inner wall of the hollow cylindrical slider (412). The output shaft of the motor (413) is fixedly connected to a rotating shaft (414) via a coupling. The bottom of the rotating shaft (414) penetrates through the elliptical block (111). The outer wall of the rotating shaft (414) is fixedly connected to the inner wall of the elliptical block (111). An electric telescopic rod (415) is fixedly connected to the top of the cylindrical shell (411). The output shaft of the electric telescopic rod (415) slides into the cylindrical shell (411). An adsorption element is disposed inside the rectangular box (112). The output shaft of the electric telescopic rod (415) is fixedly connected to the top of the hollow cylindrical slider (412).

4. A chip transfer robot according to claim 2, characterized in that, The transmission assembly (31) includes two rectangular sliders (311) slidably connected to the inner wall of the rectangular box (112). The bottom of each of the two rectangular sliders (311) is fixedly connected to a cylindrical rod (312). The outer walls of each of the two cylindrical rods (312) are slidably connected to a fixing block (313). The sides of the two fixing blocks (313) that are far apart from each other are fixedly connected to the inner wall of the rectangular box (112). The rectangular box (112) is provided with two connecting blocks (314). Each of the two connecting blocks (314) has a cylindrical rod (315) penetrating through it. The outer walls of the two cylindrical rods (315) are fixedly connected to the inner walls of the two connecting blocks (314). The two connecting blocks (314) are fixedly connected to two rectangular plates (211). Each of the two rectangular sliders (311) has two arc-shaped grooves (316). The rectangular box (112) is provided with a guide. Among them, the outer wall of the cylindrical rod 2 (315) on the left side slides in contact with the inner wall of the two arc grooves (316) on the left side, and the outer wall of the cylindrical rod 2 (315) on the right side slides in contact with the inner wall of the two arc grooves (316) on the right side. The two arc grooves (316) on a rectangular slider (311) are C-shaped and mirror images of each other. During the process of the rectangular slider (311) rising, it will first drive the two cylindrical rods 2 (315) to move closer to each other, and then drive the two cylindrical rods 2 (315) to move away from each other.

5. A chip transfer robot according to claim 2, characterized in that, The elastic component (32) includes two connecting blocks (321) fixedly connected to one side of the two rectangular sliders (311) respectively. A spring damper (322) is fixedly connected to the top of each of the connecting blocks (321), and the top of each of the spring dampers (322) is fixedly connected to the top inner wall of the rectangular box (112). Among them, four spring dampers (322) are provided, divided into two groups for resetting the two rectangular sliders (311).

6. A chip transfer robot according to claim 1, characterized in that, The sliding assembly (22) includes two L-shaped rods (221) hinged on two cylindrical rods (315). Two limiting blocks (222) are fixedly connected to the right side of the positioning plate (213). The inner walls of the two limiting blocks (222) are slidably connected to the outer walls of the two L-shaped rods (221). The positioning plate (223) is fixedly connected to each of the two L-shaped rods (221). Among them, the two positioning plates (223) are mirror images of each other.

7. A chip transfer robot according to claim 4, characterized in that, The guide includes two square slide rods (317) fixedly connected to the inner wall of the rectangular box (112), and the outer walls of the two square slide rods (317) slide through the two connecting blocks (314) respectively.

8. A chip transfer robot according to claim 3, characterized in that, The adsorption component includes a vacuum suction cup (416) installed on the inner wall of the top of the rectangular box (112), and a pipe (417) is provided on the top of the vacuum suction cup (416). The pipe (417) extends to the outside of the rectangular box (112) and is fixedly connected thereto.

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