A patch and alignment device and method for power modules

Abstract

The application belongs to the technical field of patching devices, and specifically discloses a patching and aligning device and method for a power module, which comprises a working box and a control console, the control console is arranged on one side of the working box, a working cavity is formed in the working box, a placing panel is slidably connected to the inner bottom wall of the working cavity, uniformly distributed mounting holes are formed in the surface of the placing panel, and a limiting piece matched with the mounting holes is arranged on the top of the placing panel; after the chip is adsorbed, the posture deviation is compared by using the first camera and the annular indicating line at the bottom of the bottom disc; when correction is needed, the first and second piezoelectric proportional valves in the corresponding orientation nozzle are opened to spray a small amount of airflow to push the chip to rotate or translate on the side, so that the posture adjustment can be completed without mechanical contact, the structure is compact and the response is rapid, and the situation that the chip solder leg is easily damaged by the traditional mechanical adjustment mode is avoided.

Description

Technical Field

[0001] This invention belongs to the field of surface mount device technology, and specifically discloses a surface mount and alignment device and method for a power module. Background Technology

[0002] In the surface mount packaging (SMT) process of power modules or semiconductor chips, automated SMT equipment is often used to transfer the chip from the tray and precisely place it on the pads of the substrate. Existing SMT equipment has the following main shortcomings in actual production: 1. Traditional devices often rely on mechanical grippers or a single negative pressure adsorption head to pick up materials. If the chip rotates or shifts horizontally after being adsorbed, a complex vision alignment platform is often required for mechanical alignment, which increases the size of the equipment and reduces the adjustment efficiency. 2. The lack of a buffer mechanism when the chip is lowered to contact the chip makes it easy to cause squeezing damage to the microcircuits on the chip surface due to hard contact; and the slight unevenness on the top surface of the chip can easily lead to air leakage in the adsorption cavity, affecting the stability of negative pressure pickup.

[0003] Therefore, those skilled in the art have proposed a patch and alignment device and method for power modules to solve the problems mentioned above. Summary of the Invention

[0004] In view of this, the technical problem to be solved by the present invention is to provide a patch and alignment device and method for power modules, so as to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention provides a power module mounting and alignment device, including a work box and a control console. The control console is located on one side of the work box. The work box has a working cavity inside. A placement panel is slidably connected to the inner bottom wall of the working cavity. The surface of the placement panel has evenly distributed mounting holes, and the top of the placement panel is provided with a limiting member that cooperates with the mounting holes. The inner wall of the working cavity is provided with two symmetrically distributed first linear slide rails. A second linear slide rail is provided on the opposite side of the two first linear slide rails. A patch module is provided on the surface of the second linear slide rail. The patch module includes a driving component and a patch component. The driving component is disposed on the surface of the second linear guide rail, and the patch component is disposed on the surface of the driving component.

[0006] In the above technical solution, preferably, the driving component includes a mounting platform fixedly connected to the surface of the second linear slide rail. An electric push rod is provided on the surface of the mounting platform. The output shaft of the electric push rod is connected to the top of the patch assembly. A mounting plate is fixedly connected to the side of the mounting platform away from the second linear slide rail. A mounting rod is provided at the bottom of the mounting plate. The upper end of the mounting rod extends through the mounting plate. A buffer block is fixedly connected to the lower end of the mounting rod.

[0007] In the above technical solution, preferably, a fixing ring is fixedly connected to the surface of the mounting rod, a spring is fixedly connected to the top of the fixing ring, the upper end of the spring is fixedly connected to the bottom of the mounting plate, and a first camera and a second camera are provided on the lower surface of the mounting rod, with the first camera and the second camera arranged symmetrically.

[0008] In the above technical solution, preferably, the patch assembly includes a connecting shell fixedly connected to the end of the output shaft of the electric actuator, a chassis fixedly connected to the bottom of the connecting shell, an adsorption cavity opened at the bottom of the chassis, a connecting cavity opened inside the connecting shell, the adsorption cavity communicating with the connecting cavity, a vacuum pump installed inside the connecting cavity, an exhaust hole communicating with the connecting cavity opened on the surface of the connecting shell, a mounting shell fixedly connected to the top of the chassis on the surface of the connecting shell, and annularly distributed indicator lines provided at the bottom of the chassis.

[0009] In the above technical solution, preferably, an adjusting ring is provided at the bottom of the chassis, the adjusting ring is coaxially arranged with the adsorption cavity, the upper end of the adjusting ring passes through the chassis and is fixedly connected to a sliding ring, a groove is provided inside the chassis, and the sliding ring is slidably connected to the inner wall of the groove.

[0010] In the above technical solution, preferably, four ring-shaped mounting blocks are fixedly connected to the bottom of the chassis, and the angle between two adjacent mounting blocks and the extended line of the chassis center is °. A communicating cavity is opened inside the mounting block. A nozzle is evenly distributed and connected to the communicating cavity on the side of the mounting block near the center of the chassis. A first piezoelectric proportional valve is installed inside the nozzle.

[0011] In the above technical solution, preferably, the surface of the mounting shell is connected to a connecting pipe for introducing gas, the surface of the mounting block is provided with a guide pipe connected to the connecting cavity, the other end of the guide pipe is connected to the mounting shell, and a second piezoelectric proportional valve is provided inside the guide pipe.

[0012] In the above technical solution, preferably, the inner side of the mounting shell is connected to a connecting pipe, the other end of the connecting pipe passes through the connecting shell and is connected to the connecting cavity, and a third piezoelectric proportional valve is provided inside the connecting pipe.

[0013] A method for mounting and aligning a power module includes the following steps: S1. Fixing the substrate and the tray: Place the substrate and the tray for placing the chip on the placement panel, and lock the position of the tray and the substrate by using the threaded engagement of the limiting component and the mounting hole or other fixing methods. S2. Initial positioning of the placement module: The first and second linear guide rails are driven by the console to move the placement module above the tray, and the second camera is used to capture the image to confirm the material picking position. S3. Chip adsorption and picking: The electric pusher pushes the chip assembly down, and the adjusting ring first contacts the top surface of the chip and compresses the slip ring to avoid excessive squeezing. Then the vacuum pump starts and forms a negative pressure on the chip surface through the connecting cavity and the adsorption cavity to complete the adsorption. The electric pusher drives the chip assembly to reset. S4. Chip attitude detection and fine-tuning: The first camera captures the attitude image of the adsorbed chip and compares it with the indicator line on the bottom of the chassis. If the attitude is off, gas is introduced through the connecting tube, and the first and second piezoelectric proportional valves in the corresponding directions are opened as needed. The airflow is sprayed from the nozzle to push the chip from the side to achieve attitude correction. S5. The chip is aligned and placed. The first and second linear slide rails move again to move the chip module above the target placement position on the substrate. The electric push rod descends to make the chip contact the substrate pad. At the same time, the third piezoelectric proportional valve is opened to inject external gas into the connection cavity through the connecting pipe to break the vacuum environment. The chip is automatically released to complete the placement. S6. Device reset and cycle operation: The placement module rises and resets, preparing to execute the next chip pick-up and placement cycle. Compared with the prior art, the present invention has the following beneficial effects: After the chip is adsorbed, the first camera is used to compare the attitude deviation with the ring indicator line at the bottom of the chassis. When correction is needed, the first and second piezoelectric proportional valves in the corresponding nozzle are opened to spray a small amount of airflow to push the chip to rotate or translate. The attitude adjustment can be completed without mechanical contact. The structure is compact and responds quickly, avoiding the situation where chip solder joints are easily damaged by traditional mechanical adjustment methods. By setting up first and second linear slide rails in conjunction with dual-camera visual assistance—the first camera capturing the chip's posture and the second camera positioning the pick-up and placement location—a wide-range, high-precision spatial coordinate positioning is achieved. Simultaneously, when the electric push rod drives the assembly downwards, the spring buffer structure and the sliding compression mechanism of the rubber adjusting ring prevent chip damage caused by hard contact. Furthermore, the adjusting ring can shield the chip's top surface gap, enhancing the negative pressure sealing of the adsorption chamber and improving the pickup success rate. The chip mounting assembly integrates a vacuum pump and gas passage. After the chip contacts the substrate pads, positive pressure gas is injected into the connection chamber by opening the third piezoelectric proportional valve, instantly disrupting the negative pressure adsorption environment. This allows the chip to be accurately and quickly released to the target position, effectively solving the problems of chip placement and displacement caused by untimely vacuum breaking in traditional vacuum adsorption structures. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the pull-out panel of the present invention; Figure 3 This is a schematic diagram of the patch module of the present invention; Figure 4 This is a schematic diagram of the structure of the patch assembly of the present invention; Figure 5 This is a cross-sectional schematic diagram of the patch assembly of the present invention; Figure 6 for Figure 5 Enlarged view of A in the middle; Figure 7 for Figure 5 Enlarged view of B in the middle; Figure 8 for Figure 5 A magnified view of C.

[0015] In the diagram: 1. Work box; 11. Work chamber; 12. Placement panel; 13. Limiting component; 2. Control console; 3. First linear slide rail; 31. Second linear slide rail; 4. Patch module; 41. Electric actuator; 411. Mounting plate; 412. Spring; 413. Mounting rod; 414. First camera; 415. Second camera; 42. Patch assembly; 421. Connecting tube; 422. Connecting shell; 423. Chassis; 424. Mounting device. 425. Housing; 426. Indicator line; 427. Mounting block; 428. Adsorption chamber; 429. Connecting chamber; 420. Exhaust port; 4210. Vacuum pump; 4211. Guide pipe; 4212. Adjusting ring; 4213. Connecting chamber; 4214. Groove; 4215. Slip ring; 4216. Nozzle; 4217. First piezoelectric proportional valve; 4218. Second piezoelectric proportional valve; 4219. Connecting pipe; 4220. Third piezoelectric proportional valve. Detailed Implementation

[0016] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] Numerous specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the invention is not limited to the specific embodiments disclosed below.

[0018] like Figures 1-8 The power module mounting and alignment device shown includes a work box 1 and a control console 2. The control console 2 is located on one side of the work box 1. The work box 1 has a working cavity 11 inside. The bottom wall of the working cavity 11 is slidably connected to a placement panel 12. The surface of the placement panel 12 has evenly distributed mounting holes. The top of the placement panel 12 is provided with a limiting member 13 that cooperates with the mounting holes. The inner wall of the working cavity 11 is provided with two first linear slide rails 3 that are symmetrically distributed. The opposite sides of the two first linear slide rails 3 are provided with second linear slide rails 31. The surface of the second linear slide rails 31 is provided with a patch module 4. The patch module 4 includes a drive component and a patch component 42. The drive component is disposed on the surface of the second linear guide rail 31, and the patch component 42 is disposed on the surface of the drive component.

[0019] Specifically, the console 2 is equipped with a control panel, controller, display, wireless transmission module and other related components for controlling the patch module 4, the first linear slide rail 3 and the second linear slide rail 31.

[0020] The position of the chip mounting module 4 can be adjusted by the first linear slide rail 3 and the second linear slide rail 31, so as to adapt to the chip mounting position of the substrate chip in different positions. The substrate and the chip tray can be placed above the placement panel 12. The position of the tray and the substrate is fixed by the cooperation of the limiting member 13 and the mounting hole. The second linear slide rail 31 can drive the patch module 4 to move left and right, i.e., in the X-axis direction. The first linear slide rail 3 can drive the second linear slide rail 31 to move along the setting direction of the first linear slide rail 3, i.e., in the Z-axis direction. Both the first linear slide rail 3 and the second linear slide rail 31 are relatively mature components in existing technology applications. The linear slide rail uses steel balls to infinitely circulate between the slider and the guide rail, so that the load platform can make high-precision linear motion along the guide rail. This will not be elaborated on further here.

[0021] Furthermore, the mounting holes and limiting members 13 can be fixed in position by threaded engagement, but are not limited to threaded engagement. As long as the position of the tray and the base plate is fixed, this method is a well-known technical means to those skilled in the art and will not be described in detail here.

[0022] like Figure 2 and Figure 3As shown, the drive assembly includes a mounting platform fixedly connected to the surface of the second linear slide rail 31. An electric push rod 41 is provided on the surface of the mounting platform. The output shaft of the electric push rod 41 is connected to the top of the patch assembly 42. A mounting plate 411 is fixedly connected to the side of the mounting platform away from the second linear slide rail 31. A mounting rod 413 is provided at the bottom of the mounting plate 411. The upper end of the mounting rod 413 extends through the mounting plate 411. A buffer block is fixedly connected to the lower end of the mounting rod 413.

[0023] A fixing ring is fixedly connected to the surface of the mounting rod 413, and a spring 412 is fixedly connected to the top of the fixing ring. The upper end of the spring 412 is fixedly connected to the bottom of the mounting plate 411. A first camera 414 and a second camera 415 are provided on the lower surface of the mounting rod 413. The first camera 414 and the second camera 415 are symmetrically arranged. Specifically, the electric push rod 41 can adjust its height in the Y-axis direction, the first camera 414 is used to capture the posture of the chip adsorbed by the chip mounting assembly 42 and transmit the image signal to the control console 2 for reference by the staff, and the second camera 415 is used to capture the position of the tray and substrate to facilitate chip picking and subsequent chip mounting operations.

[0024] The spring 412 is used to maintain the position of the mounting rod 413 and prevent the mounting rod 413 from sliding upward after contacting the object below during movement, thus avoiding damage to the first camera 414 and the second camera 415.

[0025] like Figures 2-6 As shown, the patch assembly 42 includes a connecting shell 422 fixedly connected to the end of the output shaft of the electric actuator 41. A chassis 423 is fixedly connected to the bottom of the connecting shell 422. An adsorption cavity 427 is opened at the bottom of the chassis 423. A connecting cavity 428 is opened inside the connecting shell 422. The adsorption cavity 427 communicates with the connecting cavity 428. A vacuum pump 4210 is installed inside the connecting cavity 428. An exhaust hole 429 communicating with the connecting cavity 428 is opened on the surface of the connecting shell 422. A mounting shell 424 located on the surface of the connecting shell 422 is fixedly connected to the top of the chassis 423. A ring-shaped distribution of indicator lines 425 is provided at the bottom of the chassis 423.

[0026] An adjusting ring 4212 is provided at the bottom of the chassis 423. The adjusting ring 4212 is coaxially arranged with the adsorption cavity 427. The upper end of the adjusting ring 4212 passes through the chassis 423 and is fixedly connected to a sliding ring 4215. A groove 4214 is provided inside the chassis 423, and the sliding ring 4215 is slidably connected to the inner wall of the groove 4214.

[0027] The electric push rod 41 can drive the connecting shell 422 to move down, and in the process, it can drive the chassis 423 to move down simultaneously. After it comes into contact with the chip surface, the vacuum pump 4210 is started. Under the connection between the connecting cavity 428 and the adsorption cavity 427, the adsorption cavity 427 is used to adsorb the surface of the chip to achieve the effect of picking up the material. Then, the electric push rod 41 drives it to move up and reset. At the same time, the first camera 414 is used to capture its posture. With the help of the indicator line 425, it can be determined whether the chip posture meets the requirements of the chip mounting. The adjusting ring 4212 protrudes from the base 423 and can first contact the top surface of the chip when it comes into contact with the chip. As it continues to move downward, it drives the slip ring 4215 to gradually rise to avoid excessive pressure on the chip. The groove 4214 can be equipped with a pressure sensor to determine the chip contact pressure. The adjusting ring 4212 can also block the space between the top surface of the chip and the adsorption cavity 427 to prevent the slight unevenness of the chip top surface from affecting the subsequent negative pressure adsorption effect. Furthermore, the adjustment ring 4212 is a rubber material component. The rubber material component adjustment ring 4212 can adapt to slight unevenness during the process of fitting the top surface of the chip, enhance the subsequent negative pressure adsorption effect, and at the same time reduce hard contact damage to the chip.

[0028] like Figures 1-8 As shown, four ring-shaped mounting blocks 426 are fixedly connected to the bottom of the chassis 423, and the angle between two adjacent mounting blocks 426 and the extended line of the center of the chassis 423 is 90°. A connecting cavity 4213 is opened inside the mounting block 426. A nozzle 4216 is evenly distributed and connected to the connecting cavity 4213 on the side of the mounting block 426 near the center of the chassis 423. A first piezoelectric proportional valve 4217 is installed inside the nozzle 4216.

[0029] The surface of the mounting housing 424 is connected to a connecting pipe 421 for introducing gas. The surface of the mounting block 426 is provided with a guide pipe 4211 that communicates with the connecting cavity 4213. The other end of the guide pipe 4211 is connected to the mounting housing 424, and a second piezoelectric proportional valve 4218 is provided inside the guide pipe 4211.

[0030] The inner side of the mounting housing 424 is connected to a connecting pipe 4219. The other end of the connecting pipe 4219 passes through the connecting housing 422 and is connected to the connecting cavity 428. A third piezoelectric proportional valve 4220 is installed inside the connecting pipe 4219.

[0031] Based on the posture captured by the first camera 414, air pressure can be input into the interior of the connecting cavity 4213 through the connecting pipe 421, and the first piezoelectric proportional valve 4217 and the second piezoelectric proportional valve 4218 can be opened as needed, so that the airflow can be discharged through the nozzle 4216 at the opened first piezoelectric proportional valve 4217, and the airflow is pushed from the side of the chip to adjust the chip posture, which facilitates the subsequent chip alignment with the substrate for surface mount installation.

[0032] During the chip placement process on the substrate, the gas can be injected into the connecting cavity 4213 by opening the third piezoelectric proportional valve 4220 to break the vacuum environment and achieve chip placement and detachment, avoiding the situation in the traditional chip placement process where the vacuum environment is not easily broken and affects the chip mounting.

[0033] A method for mounting and aligning a power module includes the following steps: S1. Fixing the substrate and the tray: Place the substrate and the tray for placing the chip on the placement panel 12, and lock the position of the tray and the substrate by using the threaded engagement of the limiting member 13 with the mounting hole or other fixing methods. S2. Initial positioning of the placement module: The first linear slide rail 3 and the second linear slide rail 31 are driven by the control console 2 to move the placement module 4 above the tray. The second camera 415 is used to capture the image to confirm the material picking position. S3. Chip adsorption and picking: Electric push rod 41 pushes the chip assembly 42 down. Adjusting ring 4212 first contacts the top surface of the chip and compresses slip ring 4215 to avoid excessive compression. Then vacuum pump 4210 starts and forms negative pressure on the chip surface through connecting cavity 428 and adsorption cavity 427 to complete adsorption. Electric push rod 41 drives chip assembly 42 to reset. S4. Chip attitude detection and fine-tuning: The first camera 414 captures the attitude image of the adsorbed chip and compares it with the indicator line 425 on the bottom of the chassis 423. If the attitude is off, gas is introduced through the connecting pipe 421, and the first piezoelectric proportional valve 4217 and the second piezoelectric proportional valve 4218 in the corresponding direction are opened as needed. The nozzle 4216 sprays airflow from the side of the chip to push it and achieve attitude correction. S5. The chip is aligned and placed. The first linear slide rail 3 and the second linear slide rail 31 move again to move the chip module 4 above the target placement position on the substrate. The electric push rod 41 descends to make the chip contact the substrate pad. At the same time, the third piezoelectric proportional valve 4220 is opened to inject external gas into the connection cavity 428 through the connecting pipe 4219 to break the vacuum environment. The chip is automatically released to complete the placement. S6. Device reset and cycle operation: The chip placement module 4 rises and resets, ready to execute the next chip picking and placement cycle.

[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention. The scope of protection claimed by the appended claims and their equivalents is defined.

Claims

1. A patch and alignment device for a power module, comprising a work box (1) and a control console (2), characterized in that, The control console (2) is located on one side of the work box (1). The control console (2) is equipped with a controller. The work box (1) has a working cavity (11) inside. The bottom wall of the working cavity (11) is slidably connected to a placement panel (12). The surface of the placement panel (12) has evenly distributed mounting holes, and the top of the placement panel (12) is equipped with a limiting member (13) that works in conjunction with the mounting holes. The inner wall of the working cavity (11) is provided with two first linear slide rails (3) that are symmetrically distributed. The opposite sides of the two first linear slide rails (3) are provided with second linear slide rails (31). The surface of the second linear slide rails (31) is provided with patch modules (4). The controller is connected to the first linear slide rail (3) and the second linear slide rail (31) respectively; The patch module (4) includes a driving component and a patch component (42). The driving component is disposed on the surface of the second linear slide rail (31), and the patch component (42) is disposed on the surface of the driving component. The driving component is used to adjust the height of the patch component (42). The patch assembly (42) includes a chassis (423), four mounting blocks (426), a guide tube (4211), a nozzle (4216), a first piezoelectric proportional valve (4217), and a second piezoelectric proportional valve (4218). Four mounting blocks (426) are fixedly connected to the bottom of the chassis (423) in a ring arrangement. The mounting blocks (426) have a connecting cavity (4213) inside. The nozzle (4216) is located on the side of the mounting block (426) near the center of the chassis (423) and is connected to the connecting cavity (4213). The first piezoelectric proportional valve (4217) is located inside the nozzle (4216) and is used to control the airflow interruption and flow rate of the nozzle (4216). The guide tube (4211) connects the connecting cavity (4213) with an external air source. The second piezoelectric proportional valve (4218) is located inside the guide tube (4211) and is used to control the opening and closing of the air passage into the connecting cavity (4213) and the pressure stability. The first piezoelectric proportional valve (4217) and the second piezoelectric proportional valve (4218) cooperate with each other to achieve non-contact attitude correction of the chip by acting on the side of the chip through a directional micro airflow.

2. The patch and alignment device for a power module according to claim 1, characterized in that, The drive assembly includes a mounting platform fixedly connected to the surface of the second linear slide rail (31). An electric push rod (41) is provided on the surface of the mounting platform. The output shaft of the electric push rod (41) is connected to the top of the patch assembly (42). A mounting plate (411) is fixedly connected to the side of the mounting platform away from the second linear slide rail (31). A mounting rod (413) is provided at the bottom of the mounting plate (411). The upper end of the mounting rod (413) extends through the mounting plate (411). A buffer block is fixedly connected to the lower end of the mounting rod (413). The electric push rod (41) is signal-connected to the controller.

3. The patch and alignment device for a power module according to claim 2, characterized in that, A fixing ring is fixedly connected to the surface of the mounting rod (413), and a spring (412) is fixedly connected to the top of the fixing ring. The upper end of the spring (412) is fixedly connected to the bottom of the mounting plate (411). A first camera (414) and a second camera (415) are provided on the lower surface of the mounting rod (413). The first camera (414) and the second camera (415) are symmetrically arranged. Both the first camera (414) and the second camera (415) are connected to the controller signal.

4. The patch and alignment device for a power module according to claim 2, characterized in that, The patch assembly (42) includes a connecting shell (422) fixedly connected to the end of the output shaft of the electric push rod (41), a chassis (423) fixedly connected to the bottom of the connecting shell (422), an adsorption cavity (427) opened at the bottom of the chassis (423), a connecting cavity (428) opened inside the connecting shell (422), the adsorption cavity (427) and the connecting cavity (428) are connected, a vacuum pump (4210) is installed inside the connecting cavity (428), an exhaust hole (429) connected to the connecting cavity (428) is opened on the surface of the connecting shell (422), a mounting shell (424) located on the surface of the connecting shell (422) is fixedly connected to the top of the chassis (423), an indicator line (425) distributed in a ring is provided at the bottom of the chassis (423), and the vacuum pump (4210) is connected to the controller signal.

5. The patch and alignment device for a power module according to claim 4, characterized in that, An adjusting ring (4212) is provided at the bottom of the chassis (423). The adjusting ring (4212) is coaxially arranged with the adsorption chamber (427). The upper end of the adjusting ring (4212) passes through the chassis (423) and is fixedly connected to a slip ring (4215). A groove (4214) is provided inside the chassis (423). The slip ring (4215) is slidably connected to the inner wall of the groove (4214).

6. The patch and alignment device for a power module according to claim 5, characterized in that, The angle between the two adjacent mounting blocks (426) and the extended center line of the chassis (423) is 90°, and the first piezoelectric proportional valve (4217) is located inside the nozzle (4216).

7. The patch and alignment device for a power module according to claim 4, characterized in that, The surface of the mounting shell (424) is connected to a connecting pipe (421) for introducing gas. The surface of the mounting block (426) is provided with a guide pipe (4211) that communicates with the connecting cavity (4213). The other end of the guide pipe (4211) is connected to the mounting shell (424). The second piezoelectric proportional valve (4218) is disposed inside the guide pipe (4211).

8. The patch and alignment device for a power module according to claim 7, characterized in that, The inner side of the mounting shell (424) is connected to a connecting pipe (4219), and the other end of the connecting pipe (4219) passes through the connecting shell (422) and is connected to the connecting cavity (428). A third piezoelectric proportional valve (4220) is provided inside the connecting pipe (4219).

9. A method for mounting and aligning a power module, comprising a mounting and aligning apparatus for a power module according to any one of claims 1-8, characterized in that, The following methods and steps are included: S1. Fixing the substrate and the tray: Place the substrate and the tray for placing the chip on the placement panel (12), and use the limiting member (13) and the threaded engagement of the mounting hole or other fixing methods to lock the position of the tray and the substrate. S2. Initial positioning of the patch module: drive the first linear slide rail (3) and the second linear slide rail (31) through the console (2) to move the patch module (4) above the tray, and use the second camera (415) to capture the image to confirm the pick-up position; S3. Chip adsorption and material picking: The electric push rod (41) pushes the chip assembly (42) down. The adjusting ring (4212) first contacts the top surface of the chip and compresses the slip ring (4215) to avoid excessive squeezing. Then the vacuum pump (4210) starts and forms a negative pressure on the chip surface through the connecting cavity (428) and the adsorption cavity (427) to complete the adsorption. The electric push rod (41) drives the chip assembly (42) to reset. S4. Chip attitude detection and fine-tuning: The first camera (414) captures the attitude image of the adsorbed chip and compares it with the indicator line (425) at the bottom of the chassis (423). If the attitude is off, gas is introduced through the connecting pipe (421), and the first piezoelectric proportional valve (4217) and the second piezoelectric proportional valve (4218) in the corresponding direction are opened as needed. The nozzle (4216) sprays airflow from the side of the chip to achieve attitude correction. S5. The chip is aligned and placed. The first linear slide rail (3) and the second linear slide rail (31) move again to move the chip module (4) above the target mounting position on the substrate. The electric push rod (41) descends to make the chip contact the substrate pad. At the same time, the third piezoelectric proportional valve (4220) is opened to inject external gas into the connection cavity (428) through the connecting pipe (4219) to break the vacuum environment. The chip is automatically released to complete the mounting. S6. Device reset and cycle operation: The chip mounting module (4) rises and resets, ready to execute the next chip picking and mounting cycle.

Images