Square wafer detection device with vertical wafer placement structure and detection method

Abstract

The application discloses a square wafer detection device with a vertical wafer placing structure and a detection method. The device comprises a shock-absorbing support assembly, a wafer bearing assembly, a stable balance counterweight assembly, a deflection and compression assembly, a compression driving assembly, a transfer supporting assembly and a scanning detection assembly. The wafer bearing assembly is installed in the shock-absorbing support assembly through a lifting structure, and has a square wafer vertical bearing space in the interior. The square wafer bottom is supported by a bearing bracket, and is positioned by a bearing suction cup. The stable balance counterweight assembly is linked with the wafer bearing assembly through a transfer chain rope, and balances and compensates the weight in the lifting process. The deflection and compression assembly is driven by the compression driving assembly, and is compressed and locked after the wafer rises to the detection station. The transfer supporting assembly drives the scanning detection assembly to move horizontally, and scans and detects the square wafer. The vertical wafer placing method can avoid the gravity deformation of the large-size square wafer when placed horizontally and the damage risk in the lifting process.

Description

Technical Field

[0001] This invention relates to integrated circuit manufacturing equipment, and more particularly to a square wafer inspection device and method with a vertical wafer placement structure. Background Technology

[0002] In the semiconductor manufacturing and optoelectronic component production fields, square wafers (such as square substrates used in photovoltaic cells, LED substrates, MEMS devices, etc.) require high-precision defect inspection after processing to screen for quality problems such as scratches, dirt, microcracks, and uneven film thickness. Currently, the main technical challenges of inspection equipment for square wafers are as follows:

[0003] Currently, most wafer inspection equipment on the market uses a horizontal placement method, where square wafers are placed flat on a support platform, and the inspection probe scans from above or below. This horizontal placement method has inherent drawbacks: First, horizontal placement makes the wafer surface prone to the accumulation of dust and particulate matter from the environment, often requiring an additional cleaning process before inspection. Second, the horizontal support platform usually needs to be used with a vacuum suction port array to fix the wafers; for square wafers of different sizes, different suction cups or adjustments to the suction port layout are required, resulting in poor equipment compatibility. Third, operators need to bend over when loading and unloading, and with the wafer surface facing upwards, hands or tools can easily touch the wafer inspection surface, causing secondary contamination or scratches. Fourth, with the increasing demand for square wafer sizes in the photovoltaic and display industries, large square wafers, when placed horizontally, will experience significant sag in the central area due to their own gravity, causing the wafer surface to deviate from the ideal flat plane. This static gravitational deformation makes it difficult for the scanning probe to achieve accurate focusing across the entire area within a single focal plane, directly causing blurred images or inaccurate measurement data in the edge areas, severely limiting further improvements in detection accuracy.

[0004] In devices that need to lift wafers from the loading / unloading position to the inspection station, the entire weight of the support frame and the wafer is borne by the lifting drive component. For large-size square wafers, their own weight is significant, and combined with the weight of the support frame, the driving torque requirements for the lifting motor are high, leading to oversized motor selection and increased energy consumption. More importantly, during heavy-load lifting, if there is a lack of an effective weight balancing mechanism, the acceleration and deceleration phases of the lifting motion are prone to impact and vibration, affecting the positional stability of the wafer on the support components, and in severe cases, even causing the wafer to shift or slip. Although some equipment uses pneumatic or spring balancing mechanisms, these structures often suffer from nonlinear balancing forces and response lag, making it difficult to achieve accurate dynamic balance across the entire stroke range.

[0005] During the inspection process, the scanning probe needs to move laterally to scan the entire surface of the wafer. In existing equipment, the mounting bracket of the scanning probe is usually integrated with the wafer carrier, which limits the lateral movement of the scanning probe due to the structure of the carrier. Furthermore, adjusting the detection distance (object distance) between the scanning probe and the surface of the wafer is cumbersome, often requiring additional adjusting shims or tightening / loosening multiple fasteners, resulting in low efficiency and difficulty in ensuring repeatability. In addition, during loading and unloading operations, the scanning probe cannot automatically move aside, which can easily interfere with the operator's hand or the wafer, posing a safety hazard.

[0006] Square wafer inspection typically requires a clean environment and demands micron-level or even sub-micron-level precision. The moving parts of the equipment itself (lifting motors, traversing motors, etc.) generate vibrations during operation, while external environmental factors (such as the operation of adjacent equipment and personnel movement) also transmit vibrations to the inspection area. Existing vibration damping measures are mostly simple rubber pads or spring isolations, which have limited damping bandwidth and are insufficient to effectively isolate low-frequency and high-frequency vibrations, directly affecting the signal-to-noise ratio and image clarity of the scanning inspection.

[0007] In view of the shortcomings of the existing technology, there is an urgent need to provide a square wafer inspection device and corresponding inspection method that can achieve convenient loading and unloading, stable lifting and lowering, safe fixing and accurate detection, so as to overcome the above defects. Summary of the Invention

[0008] The purpose of this invention is to provide a square wafer inspection device and inspection method with a vertical wafer placement structure.

[0009] The technical solution adopted by this invention to solve its technical problem is as follows:

[0010] A square wafer inspection device with a vertical wafer placement structure, comprising:

[0011] A damping support assembly having a support space;

[0012] A wafer carrier assembly is installed in a shock-absorbing support assembly via a lifting structure. It can rise or fall in the shock-absorbing support assembly. It has a vertical support space for square wafers inside, and the square wafers are carried by the wafer carrier assembly to rise or fall together.

[0013] The stabilizing counterweight assembly is installed in the support assembly assembly via a lifting structure, and can rise or fall within the support assembly assembly. The wafer carrier assembly cooperates with the stabilizing counterweight assembly via a linkage structure, so that the stabilizing counterweight assembly can move synchronously with the wafer carrier assembly.

[0014] A deflection clamping assembly is installed in the wafer carrier assembly via a movable connection structure. It can rise or fall together with the wafer carrier assembly and can deflect independently in the wafer carrier assembly. The deflection clamping assembly can clamp or release the square wafer in the wafer carrier assembly.

[0015] A clamping drive assembly is installed in the wafer carrier assembly and can rise or fall together with the wafer carrier assembly. It can also operate independently in the wafer carrier assembly. The deflection clamping assembly cooperates with the clamping drive assembly through a transmission structure, and the clamping drive assembly drives the deflection clamping assembly to deflect.

[0016] The adapter carrier assembly is installed in the shock-absorbing support assembly via a lateral sliding structure and corresponds to the position of the wafer carrier assembly, and can move laterally in the shock-absorbing support assembly;

[0017] A scanning and inspection component is installed in the adapter carrier assembly and is adapted to the square wafer. It can move laterally with the adapter carrier assembly and inspect the square wafer in the wafer carrier assembly.

[0018] Specifically, the damping support assembly includes:

[0019] Support columns, which are provided in a set, with each support column arranged vertically;

[0020] A support platform, which is located above the support column and is arranged horizontally;

[0021] The shock-absorbing pads are provided in a set. Each shock-absorbing pad is a bearing shock absorber. They are installed on the top of the support column and connected to the bottom of the support platform. The shock-absorbing pads damp the support platform.

[0022] The support base is made of marble and is installed on the top of the support platform and arranged in a horizontal direction. A transverse guide rail extending in a horizontal direction is provided on the top of the support base.

[0023] The support frame is installed on the top of the support base and arranged vertically. On both sides of the support frame, there are load-bearing guide rails and counterweight guide rails arranged vertically. A transfer support wheel is installed on the top of the support frame, and a clearance notch is opened at the bottom of the support frame.

[0024] Wafer carrier components include:

[0025] The support frame is arranged vertically and cooperates with the support rail via a slider. It can rise or fall along the support rail. A clearance opening is opened in the middle of the frame. The clearance opening has a set of support plates that cooperate with the edge of the square wafer. The support plates are arranged sequentially along the circumference of the clearance opening. The edge of the square wafer can abut against the support plates.

[0026] The carrier suction cup is provided in a set. Each carrier suction cup is installed in the carrier support and is connected to the vacuum mechanism. The carrier suction cup is used to adsorb and position the edge of the back side of the square wafer.

[0027] The support bracket is installed on the side of the support frame and arranged laterally. It can rise or fall together with the support frame, forming a square wafer support space at the top of the support bracket, and the support bracket supports the bottom of the square wafer.

[0028] The lifting motor is a linear motor. Its fixed part is installed on the side of the support frame, and its movable part is installed on the side of the load-bearing frame. The lifting motor drives the load-bearing frame and the load-bearing bracket to rise or fall.

[0029] The lifting gauge is made of optical grating ruler. Its fixed part is installed on the side of the support frame, and its movable part is installed on the side of the load-bearing frame. The lifting gauge monitors the rising or falling position of the load-bearing frame.

[0030] The stabilizing counterweight components include:

[0031] The counterweight frame is located outside the support frame and is connected to the counterweight guide rail via a slider, allowing it to rise or fall along the counterweight guide rail.

[0032] The counterweight blocks are provided in a set, and each counterweight block is installed in the counterweight frame through a detachable connection structure, and can rise or fall together with the counterweight frame.

[0033] The adapter chain is wound around the adapter support wheel, and its two ends are connected to the counterweight frame and the load-bearing frame respectively. When the load-bearing frame rises or falls, the adapter chain can drive the counterweight frame to rise or fall.

[0034] The deflection clamping assembly includes:

[0035] A set of clamping supports is provided, with each clamping support installed on the side of the load-bearing frame and corresponding to the position of the load-bearing support piece.

[0036] A set of clamping angle brackets is provided, and the middle part of each clamping angle bracket is installed in the clamping support through a rotating shaft. It can be deflected in the clamping support, and its inner end points towards the direction of the clearance opening.

[0037] An extension pressure bar is provided, and each extension pressure bar is installed at the inner end of the clamping angle bracket and extends towards the bearing support plate, and can deflect together with the clamping angle bracket.

[0038] A clamping end is installed at the end of an extended pressure rod and cooperates with a carrier suction cup. The clamping end clamps and positions the front edge of the square wafer, clamping the square wafer between the carrier suction cup and the clamping end.

[0039] The clamping drive assembly includes:

[0040] The drive electric cylinder is provided in a set, and the cylinder body of each drive electric cylinder is respectively installed in the adapter support, and its power output axis extends to the outside of the adapter panel.

[0041] A set of drive pushers is provided, each drive pusher is installed at the end of the power output shaft of the drive electric cylinder, and the drive electric cylinder drives the drive pusher to move.

[0042] The drive shaft is provided in a set. Each drive shaft is mounted in the drive push frame by bearings. It can move together with the drive push frame and can deflect independently in the drive push frame.

[0043] The drive link is provided in a set. One end of each drive link is rotatably connected to the outer end of the clamping angle frame, and the other end is rotatably connected to the drive shaft. When the drive shaft moves, it can drive the drive link to deflect, thereby causing the clamping angle frame to deflect.

[0044] A set of guide bushings is provided, and each guide bushing is installed in the adapter support;

[0045] The guide optical shaft is provided in a set. Each guide optical shaft is engaged with the drive pusher and passes through the guide shaft sleeve. The guide shaft sleeve and the guide optical shaft guide the movement process of the drive pusher.

[0046] The transfer carrier assembly includes:

[0047] The transition beam has a notch that runs through both sides of the support frame. Its two ends are connected to the transverse guide rail via sliders, allowing it to move laterally on the transverse guide rail.

[0048] The support column is provided in pairs. Each support column is installed at both ends of the transition bottom beam. They are arranged on both sides of the support frame and are arranged vertically. They can move horizontally together with the transition bottom beam. Each support column is provided with a scanning guide rail extending longitudinally at its top.

[0049] The lateral movement motor is a linear motor. Its fixed part is installed on the top of the support base, and its movable part is installed on the side of the transition beam. The lateral movement motor drives the transition beam and the support column to move laterally.

[0050] The transverse measuring tool is made of optical grating ruler. Its fixed part is installed on the top of the support base, and its movable part is installed on the side of the transition beam. The transverse measuring tool monitors the transverse position of the transition beam and the support column.

[0051] The scanning and detection components include:

[0052] The scanning frame is provided in pairs. Each scanning frame is connected to the scanning guide rail by a slider. It can move laterally together with the support column and can move independently longitudinally on the scanning guide rail.

[0053] The scanning probe is provided in pairs, with each scanning probe installed inside the scanning frame. It can move longitudinally along with the scanning frame to approach or move away from the square wafer, and the scanning probe scans and inspects the square wafer.

[0054] Locking side frames, which are provided in pairs, are respectively installed on the top of the support column and located on the outside of the scanning frame;

[0055] The locking bolts are provided in pairs, each of which is installed in the locking side frame. The ends of the bolts are engaged with the side wall of the scanning frame through a threaded structure. The locking bolts lock and position the scanning frame and the scanning probe to prevent longitudinal displacement during the scanning and detection process.

[0056] The reset spring has two sets, each set of which is installed on the top of the support column and engaged with the outer end of the scanning frame. When the locking bolt is disengaged from the scanning frame, the reset spring applies a pulling force to the scanning frame, so that the scanning frame and scanning end are away from the square wafer, which facilitates loading and unloading operations.

[0057] A method for inspecting square wafers, using the aforementioned inspection device, includes the following steps:

[0058] Loading and positioning steps: The square wafer is placed vertically into the wafer carrier assembly. The bottom of the square wafer is supported by the carrier bracket, and the back edge of the square wafer is adsorbed and positioned by the carrier suction cup, so that the square wafer remains in a vertical standing position.

[0059] Lifting and conveying steps: Start the lifting motor, which drives the support frame and the support bracket installed on the side of the support frame to rise together along the support guide rail, conveying the square wafer from the initial loading position to the predetermined inspection station; during the lifting process, the support frame drives the counterweight frame to move in the opposite direction along the counterweight guide rail through the transfer chain, and the counterweight blocks balance and compensate for the weight of the support frame and the square wafer; at the same time, the lifting ruler monitors the rising position of the support frame in real time until the support frame reaches the predetermined inspection station and the lifting motor stops.

[0060] Clamping and locking steps: After the support frame reaches the predetermined inspection station, the drive cylinder in the clamping drive assembly is activated. The drive cylinder pushes the drive push frame and drive shaft to move. The drive shaft drives the clamping corner frame to deflect around the clamping support through the drive connecting frame. This causes the extension pressure rod installed at the inner end of the clamping corner frame to drive the clamping end head to deflect towards the square wafer. The clamping end head applies clamping force to the front edge of the square wafer, clamping and fixing the square wafer between the support suction cup and the clamping end head.

[0061] Scanning and inspection steps: Start the transverse motor, which drives the transfer base beam and the support column mounted on the transfer base beam to move laterally along the transverse guide rail. This causes the scanning frame and scanning probe mounted on the top of the support column to move laterally together with the support column. The scanning probe scans and inspects the square wafer. During the scanning process, the transverse movement position of the transfer base beam and the support column is monitored in real time by the transverse ruler.

[0062] Clamping release step: After the scanning and detection is completed, the drive cylinder moves in the opposite direction, driving the clamping corner frame to deflect in the opposite direction through the drive push frame, drive shaft and drive connecting frame, so that the clamping end is separated from the front edge of the square wafer, and the clamping lock on the square wafer is released.

[0063] Lifting and Reset Procedure: Start the lifting motor to run in reverse. The lifting motor drives the support frame and support bracket to descend along the support guide rail, sending the square wafer back from the predetermined inspection station to the initial loading position. During the descent, the support frame drives the counterweight frame to move in reverse along the counterweight guide rail and reset via the transfer chain. At the same time, the support suction cup releases the adsorption of the square wafer.

[0064] Material unloading procedure: The operator removes the square wafers that have completed testing from the support tray.

[0065] In the lifting and conveying step, the chuck maintains continuous adsorption of the square wafer throughout the lifting process; in the pressing and locking step, each pressing end moves synchronously, and the movement of the drive pusher is guided by the guide bushing and the guide optical shaft; in the scanning and detection step, the scanning probe slides longitudinally along the scanning guide rail to adjust the detection distance, and after adjustment, it is locked and positioned by the locking bolt rod. After scanning is completed, the reset spring pulls the scanning frame and scanning probe back to the initial position.

[0066] Compared with the prior art, the square wafer inspection device and method with a vertical wafer placement structure provided by the present invention have the following advantages:

[0067] The system employs a vertical wafer placement structure, where square wafers are placed vertically into the square wafer support space at the top of the support bracket, with the bracket supporting the bottom of the square wafers. Compared to the traditional horizontal placement method, this avoids deformation of the square wafers under their own weight, thereby improving testing accuracy.

[0068] A stabilizing counterweight assembly is installed, with the support frame linked to the counterweight frame via a connecting chain. When the support frame rises, the counterweight frame descends synchronously. The gravity of the counterweight exerts a traction force in the opposite direction on the support frame through the connecting chain, effectively offsetting most of the weight of the support frame and the square wafer. This balancing compensation mechanism means that the lifting motor only needs to overcome the small gravity difference and friction between the support frame and the counterweight frame, significantly reducing the load on the lifting motor and extending its service life. Simultaneously, due to the balanced force during lifting, the lifting movement of the support frame is smoother, avoiding motion shocks and vibrations caused by excessive load, providing a good motion foundation for subsequent accurate testing.

[0069] During the lifting and conveying process, only a slight vacuum suction force is provided by the carrier suction cup, which, together with the bottom support of the carrier bracket, keeps the wafer upright, while the deflection clamping assembly remains fully released. This design ensures that the clamping end does not contact the wafer surface during lifting, avoiding the transmission of additional stress caused by vibration or guide rail errors during lifting to the wafer edge, effectively preventing cracks or breakage of the wafer during lifting. Once the carrier frame reaches the inspection station and stops moving, the clamping and locking action is performed. At this point, the wafer only bears clamping force under static conditions, and the stress state is clear and controllable, maximizing the protection of the wafer's structural integrity.

[0070] Multiple structural designs ensure the accuracy and stability of the scanning and inspection process. First, the vibration damping support assembly uses bearing dampers to absorb vibrations on the support platform. Combined with a marble support base, this effectively absorbs vibrations generated by power components such as the lifting and traversing motors, as well as vibrations transmitted from the external environment, providing a stable foundation for scanning and inspection. Second, in the clamping and locking step, the clamping end cooperates with the bearing suction cup to clamp and fix the square wafer, keeping it rigidly fixed during scanning and inspection, completely eliminating inspection errors caused by the wafer's own micro-movements or resonance. Third, the scanning and inspection assembly is equipped with a locking bolt. After the scanning probe is adjusted longitudinally along the scanning guide rail to the desired detection distance, the locking bolt locks it in place, preventing longitudinal displacement of the scanning probe during scanning and further ensuring the accuracy of the scanning path and the reliability of the inspection data.

[0071] In the lifting and conveying step, a grating ruler is used as the lifting tool to monitor the lifting position of the support frame in real time and feed the feedback to the control system. The control system then performs closed-loop control of the lifting motor to ensure that the support frame can accurately stop at the predetermined inspection position. Similarly, in the scanning and inspection step, a grating ruler is used as the lateral movement tool to monitor the lateral movement position of the transfer base beam and the support column in real time and feed the feedback to the control system. The control system then performs closed-loop control of the lateral movement motor to ensure that the scanning probe moves accurately along the predetermined path. This dual closed-loop control mechanism reliably guarantees the positioning accuracy of each moving component, meeting the process requirements for high-precision inspection of square wafers. Attached Figure Description

[0072] Figure 1 This is a schematic diagram of the top surface structure of the square wafer inspection device with a vertical wafer placement structure proposed in this invention;

[0073] Figure 2 This is a schematic diagram of the bottom structure of the detection device;

[0074] Figure 3 This is a schematic diagram of the structure of the wafer carrier component;

[0075] Figure 4 This is a schematic diagram of the stabilizing counterweight assembly;

[0076] Figure 5 This is a side view of the scanning and detection component.

[0077] Figure 6 This is a schematic diagram of the top structure of the scanning and detection component;

[0078] Figure 7 This is a structural schematic diagram of the deflection clamping assembly and the clamping drive assembly. Detailed Implementation

[0079] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0080] like Figures 1 to 7As shown, this invention provides a square wafer inspection device and method with a vertical wafer placement structure, mainly used for automated scanning inspection of square wafers. The inspection device mainly consists of a shock-absorbing support assembly, a wafer carrier assembly, a stabilizing counterweight assembly, a deflection and clamping assembly, a clamping drive assembly, a transfer carrier assembly, and a scanning inspection assembly. The shock-absorbing support assembly provides support and a vibration-damping foundation for the entire device; the wafer carrier assembly carries the square wafer and enables lifting and conveying; the stabilizing counterweight assembly balances the weight of the wafer carrier assembly; the deflection and clamping assembly and the clamping drive assembly clamp and lock the square wafer; and the transfer carrier assembly and the scanning inspection assembly enable lateral feeding and inspection of the scanning probe.

[0081] The vibration damping support assembly includes support columns 110, support platform 120, vibration damping pads 130, support base 140, and support frame 150. In this embodiment, four support columns 110 are provided, each vertically arranged at the bottom of the device to support the upper components. The support platform 120 is located above the support columns 110 and horizontally arranged. Four vibration damping pads 130 are provided, each using a bearing vibration damper, installed on the top of the support columns 110 and engaging with the bottom of the support platform 120. During equipment operation, vibrations generated by power components such as the lifting motor 240 and the traverse motor 630, as well as vibrations transmitted from the external environment, are absorbed and attenuated by the vibration damping pads 130, effectively preventing vibration transmission to the precision components above the support platform 120, ensuring the accuracy and stability of the scanning detection.

[0082] The support base 140 is made of marble and is installed on top of the support platform 120 and arranged laterally. The marble material has good rigidity and shock absorption properties, which can provide a high-precision installation reference surface for the transverse guide rail 141. The top of the support base 140 is provided with a transverse guide rail 141 extending laterally to guide the lateral movement of the transition beam 610.

[0083] The support frame 150 is installed on top of the support base 140 and arranged vertically. On both sides of the support frame 150 are vertically arranged load-bearing guide rails 151 and counterweight guide rails 152, respectively. The load-bearing guide rails 151 guide the lifting and lowering movement of the load-bearing frame 210, and the counterweight guide rails 152 guide the lifting and lowering movement of the counterweight frame 310. A transfer wheel 153 is provided at the top of the support frame 150 for winding a transfer chain rope. A clearance notch is provided at the bottom of the support frame 150, extending laterally through both sides of the support frame 150, allowing the transfer bottom beam 610 to pass through and move laterally within it. This allows the transfer bottom beam 610 to span across both sides of the support frame 150 while avoiding spatial interference with the support frame 150.

[0084] The wafer carrier assembly includes a carrier frame 210, a carrier suction cup 220, a carrier bracket 230, a lifting motor 240, and a lifting ruler 250.

[0085] The support frame 210 is arranged vertically, and its back side engages with the support rail 151 via a slider, allowing it to rise or fall along the support rail 151. A clearance opening is provided in the center of the support frame 210, the shape of which is adapted to the square wafer, facilitating the scanning probe 720 to inspect the square wafer through the clearance opening. The clearance opening contains a set of support plates 211; in this embodiment, four support plates 211 are provided, arranged sequentially along the circumference of the clearance opening, specifically at the four corners. The edges of the square wafer can rest against the support plates 211, which provide support for the back edge of the square wafer.

[0086] Four suction cups 220 are provided, each of which is installed in the support plate 211 and connected to the external vacuum mechanism through a pipeline. When the square wafer is placed in position, the vacuum mechanism is activated, and the suction cups 220 exert an adsorption force on the back edge of the square wafer, keeping the square wafer upright and preventing it from tipping over during lifting.

[0087] The support bracket 230 is installed on the side of the support frame 210 and arranged laterally. The support bracket 230 can rise or fall together with the support frame 210. A limiting groove is formed on the top of the support bracket 230, which constitutes a square wafer support space. The bottom of the square wafer is embedded in the limiting groove, and the support bracket 230 supports the bottom of the square wafer. The support bracket 230 and the support suction cup 220 work together to provide dual positioning of bottom support and back suction for the square wafer during the lifting and lowering process, ensuring that the square wafer remains stable during the lifting and lowering process.

[0088] The lifting motor 240 is a linear motor. Its fixed part (stator) is installed on the side of the support frame 150, and its movable part (moving element) is installed on the side of the load-bearing frame 210. When the lifting motor 240 is started, the movable part moves vertically relative to the fixed part, thereby driving the load-bearing frame 210 and the load-bearing bracket 230 to rise or fall. The direct drive by the linear motor eliminates intermediate transmission links, offering advantages such as fast response speed and high positioning accuracy.

[0089] The lifting gauge 250 is a grating ruler. Its fixed part (scale grating) is installed on the side of the support frame 150, and its movable part (grating reading head) is installed on the side of the support frame 210. During the lifting and lowering of the support frame 210, the lifting gauge 250 reads the position information of the support frame 210 in real time and feeds the position signal back to the control system. The control system then performs closed-loop control on the lifting motor 240 to ensure that the support frame 210 can be accurately stopped at the predetermined inspection position.

[0090] The stabilizing counterweight assembly includes a counterweight frame 310, a counterweight block 320, and a connecting chain.

[0091] The counterweight frame 310 is located on the outside of the support frame 150. Its back is connected to the counterweight guide rail 152 via a slider, allowing it to rise or fall along the guide rail 152. A set of counterweight blocks 320 is provided, each mounted in the counterweight frame 310 via bolts or other detachable connection structures. The operator can adjust the total weight of the counterweight frame 310 by increasing or decreasing the number of counterweight blocks 320, based on the total weight of the wafer support assembly and the square wafer, to make it substantially equivalent to the total weight of the support frame 210 and the square wafer.

[0092] A transfer chain is wound around a transfer wheel 153 at the top of the support frame 150, with both ends of the transfer chain engaging with the counterweight frame 310 and the load-bearing frame 210, respectively. When the lifting motor 240 drives the load-bearing frame 210 to rise, the load-bearing frame 210 pulls the counterweight frame 310 down synchronously along the counterweight guide rail 152 via the transfer chain; conversely, when the load-bearing frame 210 falls, the counterweight frame 310 rises synchronously. The gravity of the counterweight block 320 exerts a pulling force in the opposite direction on the load-bearing frame 210 through the transfer chain, thereby offsetting most of the weight of the load-bearing frame 210 and the square wafer. This allows the driving force of the lifting motor 240 to only overcome the small gravity difference between the load-bearing frame 210 and the counterweight frame 310, significantly reducing the load on the lifting motor 240 while ensuring the smoothness of the lifting movement.

[0093] The deflection clamping assembly includes a clamping support 410, a clamping bracket 420, an extension clamping rod 430, and a clamping end 440.

[0094] Four clamping supports 410 are provided, each clamping support 410 is installed on the side of the bearing frame 210, and the position corresponds one-to-one with the bearing support piece 211. Four clamping angle brackets 420 are provided, and the middle part of each clamping angle bracket 420 is installed in the clamping support 410 through a rotating shaft, so that the clamping angle bracket 420 can deflect around the rotating shaft in the clamping support 410. The inner end of the clamping angle bracket 420 points towards the clearance opening. Four extension pressure rods 430 are provided, each extension pressure rod 430 is installed in the inner end of the clamping angle bracket 420 and extends towards the bearing support piece 211, and can deflect together with the clamping angle bracket 420. A clamping end 440 is installed at the end of the extension pressure rod 430. The clamping end 440 is made of a flexible material (such as polyurethane rubber) to avoid scratching the surface of the square wafer during the clamping process.

[0095] When the clamping bracket 420 deflects inward around its axial direction, the extending clamping rod 430 moves the clamping end 440 toward the square wafer. The clamping end 440 contacts the front edge of the square wafer and applies clamping force, cooperating with the support suction cup 220 on the back to clamp and fix the square wafer between the support suction cup 220 and the clamping end 440. When the clamping bracket 420 deflects outward, the clamping end 440 disengages from the front of the square wafer, releasing the clamping lock.

[0096] The clamping drive assembly includes a drive electric cylinder 510, a drive pusher 520, a drive shaft 530, a drive connecting frame 540, a guide bushing 550, and a guide optical shaft 560.

[0097] There are four drive cylinders 510, and the cylinder body of each drive cylinder 510 is respectively installed in the adapter support on the side of the support frame 210, and its power output shaft extends outward in the horizontal direction. There are four drive pushers 520, and each drive pusher 520 is respectively installed at the end of the power output shaft of the drive cylinder 510, and the drive cylinder 510 drives the drive pusher 520 to reciprocate in the horizontal direction.

[0098] There are four drive shafts 530, each mounted in the drive push frame 520 via bearings. Each drive shaft 530 moves together with the drive push frame 520, and can also rotate independently within the drive push frame 520. There are also four drive connecting frames 540, one end of which is rotatably connected to the outer end of the clamping angle bracket 420 via a pin, and the other end of which is rotatably connected to the drive shaft 530 via a pin.

[0099] Four guide bushings 550 are provided, and each guide bushing 550 is installed in the adapter support on the side of the bearing frame 210. Four guide optical shafts 560 are provided, one end of each guide optical shaft 560 is fixedly engaged with the drive push frame 520, and the other end passes through the guide bushing 550.

[0100] When the drive cylinder 510 is activated, its power output shaft extends, pushing the drive pusher 520 to move outward. The drive pusher 520 then moves the drive shaft 530 outward as well. The drive shaft 530 pulls the outer end of the clamping bracket 420 through the drive connecting frame 540, causing the clamping bracket 420 to rotate around its axis. The inner end of the clamping bracket 420 then drives the extension pressure rod 430 and the clamping end 440 to deflect towards the square wafer, achieving the clamping action. During this process, the guide shaft 560 slides along the guide sleeve 550, guiding the movement of the drive pusher 520 and ensuring the synchronicity and consistency of the actions of each clamping end 440. When the drive cylinder 510 reverses its action, its power output shaft retracts, causing all components to move in the opposite direction, achieving the release action.

[0101] The transfer support assembly includes a transfer base beam 610, a support column 620, a transverse motor 630, and a transverse ruler 640.

[0102] The transition beam 610 is arranged laterally, passing through the clearance notch at the bottom of the support frame 150, and extending to both sides of the support frame 150. The bottom ends of the transition beam 610 are respectively engaged with the transverse guide rail 141 at the top of the support base 140 via sliders, so that the transition beam 610 can move freely laterally on the transverse guide rail 141.

[0103] A pair of support columns 620 are provided, each mounted at both ends of the transition beam 610, arranged vertically on both sides of the support frame 150. Each support column 620 can move laterally together with the transition beam 610. Each support column 620 has a longitudinally extending scanning guide rail 621 at its top for guiding the longitudinal movement of the scanning frame 710.

[0104] The transverse motor 630 is a linear motor. Its fixed part (stator) is installed on the top of the support base 140, and its movable part (mover) is installed on the side of the transition beam 610. When the transverse motor 630 is started, the movable part moves laterally relative to the fixed part, thereby driving the transition beam 610 and the support column 620 to move laterally along the transverse guide rail 141.

[0105] The transverse measuring tool 640 is a grating ruler. Its fixed part (scale grating) is installed on the top of the support base 140, and its movable part (grating reading head) is installed on the side of the transfer base beam 610. During the transverse movement, the transverse measuring tool 640 reads the transverse position information of the transfer base beam 610 in real time and feeds the position signal back to the control system. The control system then performs closed-loop control on the transverse motor 630 to ensure that the scanning probe 720 moves accurately along the predetermined path.

[0106] The scanning and detection assembly includes a scanning mount 710, a scanning probe 720, a locking side frame 730, a locking bolt 740, and a reset spring 750.

[0107] A pair of scanning mounts 710 are provided, each of which engages with a scanning guide rail 621 on the top of the support column 620 via a slider. The scanning mounts 710 can move laterally with the support column 620 and can also move independently longitudinally along the scanning guide rail 621. A pair of scanning probes 720 are provided, each mounted on the inner end of the scanning mount 710 and can move longitudinally with the scanning mount 710 to approach or move away from the square wafer. The scanning probes 720 are optical scanning probes or laser scanning probes used for scanning and inspecting the surface of the square wafer.

[0108] A pair of locking side brackets 730 are provided, each mounted on top of the support column 620 and located on the outside of the scanning frame 710. A pair of locking bolts 740 are provided, each mounted in a locking side bracket 730, with the end of the locking bolt 740 engaging with the side wall of the scanning frame 710 via a threaded structure. When the locking bolts 740 are tightened, the ends of the locking bolts 740 screw into the threaded holes in the side wall of the scanning frame 710, locking and positioning the scanning frame 710 and the scanning probe 720 to prevent longitudinal displacement during scanning. When the locking bolts 740 are loosened, the scanning frame 710 can slide freely longitudinally.

[0109] Two sets of reset springs 750 are provided, each set of which is installed on the top of the support column 620. One end of the reset spring 750 is connected to the support column 620, and the other end is engaged with the outer end of the scanning frame 710. When the locking bolt 740 is disengaged from the scanning frame 710, the reset spring 750 applies an outward pulling force to the scanning frame 710, causing the scanning frame 710 and the scanning probe 720 to slide outward along the scanning guide rail 621, away from the square wafer, thereby providing sufficient clearance for wafer loading and unloading operations.

[0110] The process of inspecting a square wafer using the above-mentioned inspection device includes:

[0111] Loading and positioning steps: First, the support frame 210 and support bracket 230 are in the initial loading position, which is lower than the clearance notch at the bottom of the support stand 150. At this time, the scanning mount 710 and scanning probe 720 are in the initial position away from the support stand 150 under the action of the reset spring 750, providing an open operating space for the operator. The operator places the square wafer to be inspected into the wafer carrier assembly in a vertical position. Specifically, the bottom of the square wafer is embedded in the square wafer carrier space at the top of the support bracket 230, and the support bracket 230 supports the bottom of the square wafer; the back edge of the square wafer abuts against the support plate 211 in the middle of the support frame 210. Subsequently, the operator activates the vacuum mechanism, and the carrier suction cup 220 generates an adsorption force on the back edge of the square wafer, keeping the square wafer in an upright position.

[0112] Lifting and conveying steps: The lifting motor 240 is started, and its moving part drives the support frame 210 to rise along the support guide rail 151. During the rise of the support frame 210, the support bracket 230, deflection clamping assembly, and clamping drive assembly installed on the side of the support frame 210 rise together with the support frame 210. Simultaneously, the support frame 210 drives the counterweight frame 310 to move in the opposite direction along the counterweight guide rail 152 via the adapter chain (i.e., the counterweight frame 310 descends). The gravity of the counterweight block 320 applies balance compensation to the support frame 210 through the adapter chain, so that the lifting motor 240 only needs to provide a small driving force to complete the lifting action. During this process, the support suction cup 220 maintains continuous adsorption on the square wafer, ensuring that the square wafer does not tip over during the lifting process. The lifting gauge 250 monitors the rising position of the support frame 210 in real time and feeds the position signal back to the control system. When the support frame 210 reaches the predetermined inspection station, the control system issues a command to stop the lifting motor 240.

[0113] Clamping and locking steps: After the support frame 210 reaches the predetermined inspection station, the drive cylinders 510 in the clamping drive assembly are activated. Each drive cylinder 510 operates synchronously, its power output shaft extending to push the drive pusher 520 outwards. The drive pusher 520 drives the drive shaft 530 to move together, and the drive shaft 530 pulls the outer end of the clamping angle bracket 420 through the drive connecting frame 540, causing the clamping angle bracket 420 to deflect around the pivot in the clamping support 410. The inner end of the clamping angle bracket 420 drives the extension pressure rod 430 to deflect towards the square wafer, causing the clamping end head 440, installed at the end of the extension pressure rod 430, to move towards the front edge of the square wafer. Finally, the clamping end head 440 contacts the front edge of the square wafer and applies clamping force, cooperating with the support suction cup 220 on the back to clamp and fix the square wafer between the support suction cup 220 and the clamping end head 440. During this process, the guide optical shaft 560 slides along the guide sleeve 550 to precisely guide the movement of the drive pusher 520 and ensure the synchronous action of each clamping end 440.

[0114] Scanning and Inspection Procedure: After clamping and locking, the operator first slides the scanning mount 710 longitudinally along the scanning guide rail 621 to adjust the inspection distance between the scanning probe 720 and the surface of the square wafer. Once adjusted, the locking bolt 740 is tightened, so that the end of the locking bolt 740 engages with the threaded hole on the side wall of the scanning mount 710, locking and positioning the scanning mount 710 and the scanning probe 720. Then, the transverse motor 630 is started, driving the adapter beam 610 to move laterally along the transverse guide rail 141. The support columns 620 mounted at both ends of the adapter beam 610 move laterally along with the adapter beam 610. The scanning mount 710 and scanning probe 720 mounted on the top of the support columns 620 move laterally along with the support columns 620. During the lateral movement, the scanning probe 720 scans and inspects the vertical plane of the square wafer, and the scan data is transmitted in real time to an external analysis system for processing. During the scanning process, the transverse ruler 640 monitors the transverse position of the transition beam 610 and the support column 620 in real time and feeds back the position signal to the control system. The control system then performs closed-loop control on the transverse motor 630 to ensure the accuracy of the scanning path.

[0115] Clamping Release Step: After the scanning and detection are completed, each drive cylinder 510 moves in reverse, its power output shaft retracts, pulling the drive pusher 520 and drive shaft 530 inward. The drive shaft 530 pushes the outer end of the clamping bracket 420 through the drive connecting frame 540, causing the clamping bracket 420 to deflect in the opposite direction around the rotation axis. The inner end of the clamping bracket 420 drives the extension pressure rod 430 and the clamping end 440 to deflect outward, causing the clamping end 440 to disengage from the front edge of the square wafer, releasing the clamping lock on the square wafer.

[0116] Lifting and Reset Procedure: After the clamping is released, the lifting motor 240 is started to rotate in reverse. The lifting motor 240 drives the support frame 210 and the support bracket 230 to descend along the support guide rail 151, returning the square wafer from the predetermined inspection station to the initial loading position. During the descent, the support frame 210 drives the counterweight frame 310 to move in the opposite direction along the counterweight guide rail 152 via the adapter chain (i.e., the counterweight frame 310 rises) to reset. At the same time, the vacuum mechanism is closed, and the support suction cup 220 releases its adsorption on the square wafer. The lifting gauge 250 monitors the descent position of the support frame 210 in real time to ensure that it accurately returns to the initial loading position.

[0117] Unloading procedure: After the support frame 210 returns to its initial loading position, the operator removes the completed square wafer from the support bracket 230. Simultaneously, the locking bolt 740 is loosened, disengaging its end from the side wall of the scanning holder 710. The reset spring 750 applies an outward pulling force to the scanning holder 710, causing the scanning holder 710 and scanning probe 720 to slide back along the scanning guide rail 621 to their initial position away from the square wafer, providing clearance for the next loading operation.

[0118] This completes one inspection cycle for a square wafer. The above steps can then be repeated as needed for continuous inspection of the next batch of square wafers.

[0119] In summary, the square wafer inspection device and method with a vertical wafer placement structure provided by this invention achieves efficient, stable, and accurate inspection of square wafers through vertical wafer placement combined with lifting and conveying, counterweight balancing, linkage clamping, and lateral scanning inspection. The vertical wafer placement method facilitates manual loading and unloading operations; the counterweight balancing structure significantly reduces the load on the lifting motor and ensures the smoothness of the lifting movement; and the clamping and locking structure ensures the rigid fixation of the wafer during scanning inspection, avoiding the impact of vibration on inspection accuracy. The overall structure is compact, highly automated, and has broad application prospects.

[0120] In the description of this invention, it should be noted that when terms such as "upper," "lower," "inner," "outer," "left," and "right" appear to indicate orientation or positional relationships, they should be understood as being based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the product of this invention is in use, or the orientation or positional relationships commonly understood by those skilled in the art. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, when terms such as "first" and "second" appear, they are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this invention, it should also be noted that unless otherwise explicitly specified and limited, terms such as "installation," "setting," and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

Claims

1. A square wafer inspection device with a vertical wafer placement structure, characterized in that, include: A damping support assembly having a support space; A wafer carrier assembly is installed in a shock-absorbing support assembly via a lifting structure. It can rise or fall in the shock-absorbing support assembly. It has a vertical support space for square wafers inside, and the square wafers are carried by the wafer carrier assembly to rise or fall together. The stabilizing counterweight assembly is installed in the support assembly assembly via a lifting structure, and can rise or fall within the support assembly assembly. The wafer carrier assembly cooperates with the stabilizing counterweight assembly via a linkage structure, so that the stabilizing counterweight assembly can move synchronously with the wafer carrier assembly. A deflection clamping assembly is installed in the wafer carrier assembly via a movable connection structure. It can rise or fall together with the wafer carrier assembly and can deflect independently in the wafer carrier assembly. The deflection clamping assembly can clamp or release the square wafer in the wafer carrier assembly. A clamping drive assembly is installed in the wafer carrier assembly and can rise or fall together with the wafer carrier assembly. It can also operate independently in the wafer carrier assembly. The deflection clamping assembly cooperates with the clamping drive assembly through a transmission structure, and the clamping drive assembly drives the deflection clamping assembly to deflect. The adapter carrier assembly is installed in the shock-absorbing support assembly via a lateral sliding structure and corresponds to the position of the wafer carrier assembly, and can move laterally in the shock-absorbing support assembly; A scanning and inspection component is installed in the adapter carrier assembly and is adapted to the square wafer. It can move laterally with the adapter carrier assembly and inspect the square wafer in the wafer carrier assembly.

2. The square wafer inspection device with a vertical wafer placement structure according to claim 1, characterized in that, The damping support assembly includes: Support columns, which are provided in a set, with each support column arranged vertically; A support platform, which is located above the support column and is arranged horizontally; The shock-absorbing pads are provided in a set. Each shock-absorbing pad is a bearing shock absorber. They are installed on the top of the support column and connected to the bottom of the support platform. The shock-absorbing pads damp the support platform. The support base is made of marble and is installed on the top of the support platform and arranged in a horizontal direction. A transverse guide rail extending in a horizontal direction is provided on the top of the support base. The support frame is installed on the top of the support base and arranged vertically. On both sides of the support frame, there are load-bearing guide rails and counterweight guide rails arranged vertically. A transfer support wheel is installed on the top of the support frame, and a clearance notch is opened at the bottom of the support frame.

3. A square wafer inspection device with a vertical wafer placement structure according to claim 2, characterized in that, Wafer carrier components include: The support frame is arranged vertically and cooperates with the support rail via a slider. It can rise or fall along the support rail. A clearance opening is opened in the middle of the frame. The clearance opening has a set of support plates that cooperate with the edge of the square wafer. The support plates are arranged sequentially along the circumference of the clearance opening. The edge of the square wafer can abut against the support plates. The carrier suction cup is provided in a set. Each carrier suction cup is installed in the carrier support and is connected to the vacuum mechanism. The carrier suction cup is used to adsorb and position the edge of the back side of the square wafer. The support bracket is installed on the side of the support frame and arranged laterally. It can rise or fall together with the support frame, forming a square wafer support space at the top of the support bracket, and the support bracket supports the bottom of the square wafer. The lifting motor is a linear motor. Its fixed part is installed on the side of the support frame, and its movable part is installed on the side of the load-bearing frame. The lifting motor drives the load-bearing frame and the load-bearing bracket to rise or fall. The lifting gauge is made of optical grating ruler. Its fixed part is installed on the side of the support frame, and its movable part is installed on the side of the load-bearing frame. The lifting gauge monitors the rising or falling position of the load-bearing frame.

4. A square wafer inspection device with a vertical wafer placement structure according to claim 3, characterized in that, The stabilizing counterweight components include: The counterweight frame is located outside the support frame and is connected to the counterweight guide rail via a slider, allowing it to rise or fall along the counterweight guide rail. The counterweight blocks are provided in a set, and each counterweight block is installed in the counterweight frame through a detachable connection structure, and can rise or fall together with the counterweight frame. The adapter chain is wound around the adapter support wheel, and its two ends are connected to the counterweight frame and the load-bearing frame respectively. When the load-bearing frame rises or falls, the adapter chain can drive the counterweight frame to rise or fall.

5. A square wafer inspection device with a vertical wafer placement structure according to claim 3, characterized in that, The deflection clamping assembly includes: A set of clamping supports is provided, with each clamping support installed on the side of the load-bearing frame and corresponding to the position of the load-bearing support piece. A set of clamping angle brackets is provided, and the middle part of each clamping angle bracket is installed in the clamping support through a rotating shaft. It can be deflected in the clamping support, and its inner end points towards the direction of the clearance opening. An extension pressure bar is provided, and each extension pressure bar is installed at the inner end of the clamping angle bracket and extends towards the bearing support plate, and can deflect together with the clamping angle bracket. A clamping end is installed at the end of an extended clamping rod and cooperates with a carrier suction cup. The clamping end clamps and positions the front edge of the square wafer, clamping the square wafer between the carrier suction cup and the clamping end.

6. A square wafer inspection device with a vertical wafer placement structure according to claim 5, characterized in that, The clamping drive assembly includes: The drive electric cylinder is provided in a set, and the cylinder body of each drive electric cylinder is respectively installed in the adapter support, and its power output axis extends to the outside of the adapter panel. A set of drive pushers is provided, each drive pusher is installed at the end of the power output shaft of the drive electric cylinder, and the drive electric cylinder drives the drive pusher to move. The drive shaft is provided in a set. Each drive shaft is mounted in the drive push frame by bearings. It can move together with the drive push frame and can deflect independently in the drive push frame. The drive link is provided in a set. One end of each drive link is rotatably connected to the outer end of the clamping angle frame, and the other end is rotatably connected to the drive shaft. When the drive shaft moves, it can drive the drive link to deflect, thereby causing the clamping angle frame to deflect. A set of guide bushings is provided, and each guide bushing is installed in the adapter support; The guide optical shaft is provided in a set. Each guide optical shaft is engaged with the drive pusher and passes through the guide shaft sleeve. The guide shaft sleeve and the guide optical shaft guide the movement process of the drive pusher.

7. A square wafer inspection device with a vertical wafer placement structure according to claim 3, characterized in that, The transfer carrier assembly includes: The transition beam has a notch that runs through both sides of the support frame. Its two ends are connected to the transverse guide rail via sliders, allowing it to move laterally on the transverse guide rail. The support column is provided in pairs. Each support column is installed at both ends of the transition bottom beam. They are arranged on both sides of the support frame and are arranged vertically. They can move horizontally together with the transition bottom beam. Each support column is provided with a scanning guide rail extending longitudinally at its top. The lateral movement motor is a linear motor. Its fixed part is installed on the top of the support base, and its movable part is installed on the side of the transition beam. The lateral movement motor drives the transition beam and the support column to move laterally. The transverse measuring tool is made of optical grating ruler. Its fixed part is installed on the top of the support base, and its movable part is installed on the side of the transition beam. The transverse measuring tool monitors the transverse position of the transition beam and the support column.

8. A square wafer inspection device with a vertical wafer placement structure according to claim 7, characterized in that, The scanning and detection components include: The scanning frame is provided in pairs. Each scanning frame is connected to the scanning guide rail by a slider. It can move laterally together with the support column and can move independently longitudinally on the scanning guide rail. The scanning probe is provided in pairs, with each scanning probe installed inside the scanning frame. It can move longitudinally along with the scanning frame to approach or move away from the square wafer, and the scanning probe scans and inspects the square wafer. Locking side frames, which are provided in pairs, are respectively installed on the top of the support column and located on the outside of the scanning frame; The locking bolts are provided in pairs, each of which is installed in the locking side frame. The ends of the bolts are engaged with the side wall of the scanning frame through a threaded structure. The locking bolts lock and position the scanning frame and the scanning probe to prevent longitudinal displacement during the scanning and detection process. The reset spring has two sets, each set of which is installed on the top of the support column and engaged with the outer end of the scanning frame. When the locking bolt is disengaged from the scanning frame, the reset spring applies a pulling force to the scanning frame, so that the scanning frame and scanning end are away from the square wafer, which facilitates loading and unloading operations.

9. A method for inspecting square wafers, characterized in that, Operating the detection device according to any one of claims 1 to 8 includes the following steps: Loading and positioning steps: The square wafer is placed vertically into the wafer carrier assembly. The bottom of the square wafer is supported by the carrier bracket, and the back edge of the square wafer is adsorbed and positioned by the carrier suction cup, so that the square wafer remains in a vertical standing position. Lifting and conveying steps: Start the lifting motor, which drives the support frame and the support bracket installed on the side of the support frame to rise together along the support guide rail, conveying the square wafer from the initial loading position to the predetermined inspection station; during the lifting process, the support frame drives the counterweight frame to move in the opposite direction along the counterweight guide rail through the transfer chain, and the counterweight blocks balance and compensate for the weight of the support frame and the square wafer; at the same time, the lifting ruler monitors the rising position of the support frame in real time until the support frame reaches the predetermined inspection station and the lifting motor stops. Clamping and locking steps: After the support frame reaches the predetermined inspection station, the drive cylinder in the clamping drive assembly is activated. The drive cylinder pushes the drive push frame and drive shaft to move. The drive shaft drives the clamping corner frame to deflect around the clamping support through the drive connecting frame. This causes the extension pressure rod installed at the inner end of the clamping corner frame to drive the clamping end head to deflect towards the square wafer. The clamping end head applies clamping force to the front edge of the square wafer, clamping and fixing the square wafer between the support suction cup and the clamping end head. Scanning and inspection steps: Start the transverse motor, which drives the transfer base beam and the support column mounted on the transfer base beam to move laterally along the transverse guide rail. This causes the scanning frame and scanning probe mounted on the top of the support column to move laterally together with the support column. The scanning probe scans and inspects the square wafer. During the scanning process, the transverse movement position of the transfer base beam and the support column is monitored in real time by the transverse ruler. Clamping release step: After the scanning and detection is completed, the drive cylinder moves in the opposite direction, driving the clamping corner frame to deflect in the opposite direction through the drive push frame, drive shaft and drive connecting frame, so that the clamping end is separated from the front edge of the square wafer, and the clamping lock on the square wafer is released. Lifting and Reset Procedure: Start the lifting motor to run in reverse. The lifting motor drives the support frame and support bracket to descend along the support guide rail, sending the square wafer back from the predetermined inspection station to the initial loading position. During the descent, the support frame drives the counterweight frame to move in reverse along the counterweight guide rail and reset via the transfer chain. At the same time, the support suction cup releases the adsorption of the square wafer. Material unloading procedure: The operator removes the square wafers that have completed testing from the support tray.

10. A method for inspecting square wafers according to claim 9, characterized in that: In the lifting and conveying step, the chuck maintains continuous adsorption of the square wafer throughout the lifting process; in the pressing and locking step, each pressing end moves synchronously, and the movement of the drive pusher is guided by the guide bushing and the guide optical shaft; in the scanning and detection step, the scanning probe slides longitudinally along the scanning guide rail to adjust the detection distance, and after adjustment, it is locked and positioned by the locking bolt rod. After scanning is completed, the reset spring pulls the scanning frame and scanning probe back to the initial position.

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