Substrate clamping device and substrate processing device comprising the same

Abstract

The application provides a substrate clamping device and a substrate processing device comprising the same. The substrate clamping device comprises a ring gear, a base, a clamping piece and a reflective sensor. The ring gear is configured to be in a first relative position with the base when a substrate clamping state is normal and in a second relative position with the base when the substrate clamping state is abnormal. One of the ring gear and the base is provided with a reflective sheet, and the other is provided with a through hole. The through hole is configured to be opposite to the reflective sheet when the ring gear and the base are in the first relative position, and to be completely misaligned with the reflective sheet when the ring gear and the base are in the second relative position. The reflective sensor is configured to receive a signal reflected by the reflective sheet when the ring gear and the base are in the first relative position. The substrate clamping device in the application judges the relative position between the ring gear and the base according to the signal received by the reflective sensor, so as to monitor the clamping state of the substrate in real time.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and in particular to a substrate clamping device and a substrate processing apparatus including the same. Background Technology

[0002] Integrated circuit manufacturing is the process of creating a photomask from a design layout, transferring the circuit pattern information from the photomask onto a silicon wafer, and forming a circuit on the silicon wafer to build a complete circuit chip. Integrated circuit manufacturing includes processes such as photolithography, etching, deposition, ion implantation, chemical mechanical polishing, and cleaning.

[0003] In most process steps, such as etching and cleaning, the substrate needs to be placed on a substrate clamping device. The clamping device holds the substrate and rotates it. During rotation, chemical solutions are distributed to the substrate surface for etching, cleaning, and other operations. During these operations, the substrate clamping device rotates the substrate at high speed, and the clamping status may become abnormal. For example, the substrate may break during clamping, or it may fail to be held by the clamping device. Because the substrate operates within the substrate processing chamber, its clamping status cannot be monitored in real time. If the substrate breaks or is ejected, failure to detect this in time for maintenance can easily lead to product safety accidents. Summary of the Invention

[0004] The technical problem to be solved by this application is to overcome the defect that the clamping status of the substrate cannot be known in a timely manner during the substrate processing, which is prone to product safety accidents, and to provide a substrate clamping device and a substrate processing device including the same.

[0005] This application solves the above-mentioned technical problems through the following technical solution:

[0006] This application provides a substrate clamping device, including a ring gear, a base, and clamping members. The ring gear is rotatably coaxially arranged with the base, and the clamping members are spaced apart on the base along the circumference. The ring gear is pulsatorically connected to the clamping members so that the clamping members clamp or release the substrate.

[0007] The ring gear is configured such that: in response to a normal clamping state of the substrate, the ring gear and the base are in a first relative position; and in response to an abnormal clamping state of the substrate, the ring gear and the base are in a second relative position.

[0008] The substrate clamping device further includes a reflective sensor and a reflective sheet. The reflective sheet is disposed on one of the ring gear and the base, and a through hole is formed on the other. The through hole is configured such that: in response to the ring gear and the base being in a first relative position, the through hole is opposite to the reflective sheet; in response to the ring gear and the base being in a second relative position, the through hole is completely misaligned with the reflective sheet. The reflective sensor is configured such that: in response to the ring gear and the substrate being in the first relative position, the signal emitted by the reflective sensor can pass through the through hole and reach the reflective sheet, and receive the signal reflected back by the reflective sheet.

[0009] This application also provides a substrate clamping device, including a ring gear, a base and a clamping member. The ring gear is rotatably coaxially arranged with the base, and the clamping member is spaced apart on the base along the circumference. The ring gear is pulsatorically connected to the clamping member so that the clamping member clamps or releases the substrate.

[0010] The ring gear is configured such that: in response to a normal clamping state of the substrate, the ring gear and the base are in a first relative position; and in response to an abnormal clamping state of the substrate, the ring gear and the base are in a second relative position.

[0011] The substrate clamping device further includes a reflective sensor and a reflective sheet. The reflective sheet is disposed on one of the ring gear and the base, and a through hole is formed on the other. The through hole is configured such that: in response to the ring gear and the base being in a first relative position, the through hole is opposite to the reflective sheet; in response to the ring gear and the base being in a second relative position, the through hole is partially misaligned with the reflective sheet. The reflective sensor is configured such that the emitted signal can pass through the through hole and reach the reflective sheet, and receives the signal reflected back by the reflective sheet. The reflective sensor is configured such that: in response to the ring gear and the substrate being in the second relative position, the pulse width of the signal received by the reflective sensor is a first preset pulse width.

[0012] The substrate clamping device further includes a judgment unit, which is configured to compare the pulse width of the signal received by the reflective sensor with a first preset pulse width. If the pulse width is equal to the first preset pulse width, the clamping state of the substrate is determined to be abnormal.

[0013] This application also provides a substrate processing apparatus, including the substrate clamping device described above.

[0014] The positive and progressive effects of this application are as follows:

[0015] The substrate clamping device in this application uses signals received by a reflective sensor to determine the relative position between the ring gear and the base, thereby monitoring the clamping status of the substrate in real time. This allows operators to promptly know the clamping status of the substrate, detect any abnormalities in the clamping status, and stop the machine for maintenance in a timely manner, thus avoiding product safety accidents and improving the safety of the substrate processing device. Attached Figure Description

[0016] Figure 1 This is a partial structural diagram of the substrate clamping device according to Embodiment 1 of this application. Figure 1 .

[0017] Figure 2 This is a partial structural diagram of the substrate clamping device according to Embodiment 1 of this application. Figure 2 .

[0018] Figure 3 This is a cross-sectional schematic diagram of a substrate clamping device according to Embodiment 1 of this application.

[0019] Figure 4 This is a schematic diagram of the substrate clamping device according to Embodiment 1 of this application when the substrate is in the released state.

[0020] Figures 5-6 The schematic diagram of the substrate clamping device according to Embodiment 1 of this application is shown when the substrate is clamped in a normal state.

[0021] Figures 7-8 When the substrate clamping state is abnormal, the structural diagram of the substrate clamping device according to Embodiment 1 of this application is shown.

[0022] Figures 9-10 The schematic diagram of the substrate clamping device according to Embodiment 1 of this application shows that the substrate clamping device is in a normal clamping state and the clamping parts are worn.

[0023] Figure 11 for Figure 10 Enlarged view of point A in the middle.

[0024] Figure 12 This is a partial structural diagram of a substrate clamping device according to another implementation of Embodiment 1 of this application, when the substrate is in a normal clamping state.

[0025] Figure 13 A partial structural diagram of the substrate clamping device according to Embodiment 2 of this application is shown when the substrate clamping state is abnormal. Detailed Implementation

[0026] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the following embodiments.

[0027] Example 1

[0028] like Figures 1 to 12 As shown, this application embodiment provides a substrate clamping device 10. The substrate clamping device 10 includes a ring gear 11, a base 12, and clamping members 13. The ring gear 11 is rotatably coaxially disposed with respect to the base 12, and the clamping members 13 are spaced apart on the base 12 along the circumference of the base 12. The ring gear 11 and the clamping members 13 are drively connected to each other so that the clamping members 13 clamp or release the substrate 40. The ring gear 11 is configured such that, in response to the normal clamping state of the substrate 40, the ring gear 11 and the base 12 are in a first relative position (e.g., ...). Figure 5 (as shown); in response to an abnormal clamping state of the substrate 40, the ring gear 11 and the base 12 are in a second relative position (as shown). Figure 7 (As shown). The substrate clamping device 10 also includes a reflective sensor 31 and a reflective sheet 32. The reflective sheet 32 ​​is disposed on one of the ring gear 11 and the base 12, and a through hole 33 is disposed on the other. The through hole 33 is configured such that: in response to the ring gear 11 and the base 12 being in a first relative position, the through hole 33 is opposite to the reflective sheet 32; in response to the ring gear 11 and the base 12 being in a second relative position, the through hole 33 and the reflective sheet 32 ​​are completely misaligned. The reflective sensor 31 is configured such that: in response to the ring gear 11 and the substrate 40 being in the first relative position, the signal reflected by the reflective sensor 31 can pass through the through hole 33 and reach the reflective sheet 32, and receive the signal reflected back by the reflective sheet 32.

[0029] In this embodiment, when the substrate 40 is normally clamped by the clamping member 13, the ring gear 11 and the base 12 are in a first relative position, and the reflective sheet 32 ​​and the through hole 33 are arranged opposite to each other. The signal emitted by the reflective sensor 31 can pass through the through hole 33 and reach the reflective sheet 32, and be reflected back to the reflective sensor 31 by the reflective sheet 32. That is, the reflective sensor 31 can receive the signal reflected back by the reflective sheet 32. When the clamping state of the substrate 40 is abnormal, for example, if the substrate 40 is not clamped by the clamping member 13 due to fragments or other reasons, the ring gear 11 and the base 12 are in a second relative position, and the reflective sheet 32 ​​and the through hole 33 are completely misaligned. The signal emitted by the reflective sensor 31 cannot reach the reflective sheet 32 ​​after passing through the through hole 33. That is, the reflective sensor 31 cannot receive the signal reflected by the reflective sheet 32. As can be seen, the clamping state of the substrate 40 can be determined by whether the reflective sensor 31 can receive the signal reflected by the reflective sheet 32 ​​within a preset time period. If the reflective sensor 31 can receive the signal it emits, the clamping state of the substrate 40 is determined to be normal; if the reflective sensor 31 does not receive the signal it emits, the clamping state of the substrate 40 is determined to be abnormal, indicating that the substrate 40 has been broken, thrown out by the substrate clamping device 10, or other abnormalities have occurred, resulting in the substrate 40 not being clamped by the clamping member 13. By using the substrate clamping device 10 in this embodiment to monitor the clamping state of the substrate 40 in real time, the operator can promptly know the clamping status of the substrate 40, promptly detect abnormalities in the clamping state of the substrate 40, and promptly stop the machine for maintenance to avoid product safety accidents, thereby improving the safety of the substrate processing device.

[0030] In some embodiments, such as Figure 4 , Figure 5 and Figure 7 As shown, the outer periphery of the ring gear 11 is provided with a first tooth 1121. The clamping member 13 includes an eccentrically mounted ejector pin 131 and a second tooth 132 that meshes with the first tooth 1121. The ejector pin 131 is mounted on the second tooth 132 and is eccentrically positioned relative to the second tooth 132. During the rotation of the ring gear 11, the engagement between the first tooth 1121 and the second tooth 132 drives the ejector pin 131 to rotate around the vertical axis of the second tooth 132. The ejector pin 131 moves toward or away from the edge of the substrate 40, thereby clamping or releasing the substrate 40.

[0031] Furthermore, such as Figure 4 , Figure 5 and Figure 7As shown, the ring gear 11 includes an inner ring 111, an outer ring 112, and spokes 113. A first tooth 1121 is disposed on the outer periphery of the outer ring 112 for transmission connection with the clamping member 13. The spokes 113 connect the outer ring 112 and the inner ring 111. The substrate clamping device 10 also includes an elastic element 17, with both ends of the elastic element 17 fixed to the base 12 and the spokes 113, respectively. In this embodiment, the elastic element 17 can be a spring. In other embodiments, a suitable elastic element 17 can be selected according to actual needs.

[0032] In some embodiments, such as Figure 3 As shown, relative rotation between the ring gear 11 and the base 12 can be achieved through the bearing 18. Specifically, the base 12 is fitted with a bearing 18, the inner ring of the bearing 18 is connected to the base 12, and the outer ring of the bearing 18 is connected to the ring gear 11. Further, as... Figure 3 As shown, a first limiting part 1131 is provided on the spoke 113, and a second limiting part 1222 that cooperates with the first limiting part 1131 is provided on the base 12 to limit the rotation angle of the ring gear 11 relative to the base 12. For example, a protruding post is provided on the spoke 113 as the first limiting part 1131, and a limiting groove is provided on the base 12 as the second limiting part 1222, with the first limiting part 1131 inserted into the second limiting part 1222.

[0033] like Figures 1 to 3 As shown, the substrate clamping device 10 also includes a limiting rod 16 that can move closer to or further away from the base 12. The base 12 has a slot 1221 for the limiting rod 16 to extend into and abut against the side wall of the spoke 113, thereby limiting the rotation of the ring gear 11. In some embodiments, the limiting rod 16 is located below the base 12. By driving the limiting rod 16 to rise or fall, it can be inserted into or disengaged from the slot 1221. When the limiting rod 16 rises to an appropriate height, it can contact the spoke 113 to limit the spoke 113.

[0034] Please combine Figures 4 to 8 To understand this, taking the clockwise rotation of base 12 to open clamping member 13 as an example, the clamping operation process of substrate 40 is as follows:

[0035] The clamping member 13 is opened to remove the processed substrate 40 from the substrate clamping device 10 or to place the substrate 40 to be processed onto the substrate clamping device 10. The specific operation process is as follows: The limiting rod 16, driven by a cylinder or other driving component, extends upward into the slot 1221 and is located on the side of the spoke 113 near its rotation direction to prevent the ring gear 11 from rotating clockwise. The rotation driving component 15 drives the base 12 to rotate clockwise (from a top view angle) by a preset angle (e.g., 5°). The ring gear 11 is limited by the limiting rod 16, causing the clamping member 13 to rotate clockwise (from a top view angle) relative to the ring gear 11. The elastic member 17 is stretched, and the ejector pin 131 rotates clockwise (from a top view angle) around the vertical axis of the second tooth 132 to open the clamping member 13. At this time, as... Figure 4 As shown, the substrate 40 is not held by the clamping member 13 and is in a released state.

[0036] After the substrate 40 is placed on the substrate clamping device 10, the rotation drive 15 drives the base 12 to rotate counterclockwise (from a top view angle) by the same preset angle (e.g., 5°). The elastic member 17 contracts, the clamping member 13 rotates counterclockwise (from a top view angle) relative to the ring gear 11, and the ejector pin 131 rotates counterclockwise (from a top view angle) around the axis of the second tooth 132 to approach the edge of the substrate 40, thereby clamping the substrate 40. The limiting rod 16 descends to leave the slot 1221. At this time, as Figure 5 As shown, the substrate 40 is in a clamping state, and the ring gear 11 is fixed relative to the base 12 because the clamping member 13 clamps the substrate 40. The ring gear 11 and the base 12 are in a first relative position. The reflective sheet 32 ​​is arranged opposite to the through hole 33, and the reflective sensor 31 can receive the signal reflected back by the reflective sheet 32.

[0037] After the clamping member 13 clamps the substrate 40, the rotation drive member 15 drives the base 12, the ring gear 11 and the substrate 40 to rotate clockwise (top view angle) so that the surface of the substrate 40 can be processed in the next step.

[0038] During the rotation of the substrate 40, if the clamping state of the substrate 40 becomes abnormal, for example, if the substrate 40 is not clamped by the clamping member 13 due to fragments or other reasons, the clamping force between the ejector pin 131 and the substrate 40 disappears, the elastic member 17 further contracts, and the ring gear 11 rotates clockwise (top view) relative to the base 12 until the first limiting part 1131 on the spoke 113 is limited by the elastic member 17 being pressed against the inner end wall of the right side (top view, and viewed in a clockwise direction) of the second limiting part 1222 of the base 12. At this time, if Figure 8As shown, the inner end wall of the first limiting part 1131 is in contact with the inner end wall of the second limiting part 1222 and the ring gear 11 is fixed relative to the base 12. The ring gear 11 and the base 12 are in a second relative position. The reflector 32 and the through hole 33 are completely misaligned, and the reflective sensor 31 cannot receive the signal reflected by the reflector 32.

[0039] In some embodiments, the substrate clamping device 10 further includes a first alarm unit (not shown in the figure), which is configured to issue an alarm signal in response to a pulse width of 0 within one pulse cycle of the signal received by the reflective sensor 31. When the substrate 40 is in its normal clamping state, one rotation of the substrate 40 corresponds to one pulse cycle. If the pulse width of the signal received by the reflective sensor 31 within one pulse cycle is 0, it can be determined that the reflective sheet 32 ​​and the through hole 33 are completely misaligned, indicating an abnormal clamping state of the substrate 40, allowing for timely repair. Furthermore, in the normal clamping state of the substrate 40, the rotational speed of the substrate 40 can be determined based on the pulse cycle, and whether the substrate 40 is stationary can be determined based on the pulse waveform of the signal received by the reflective sensor 31. If the waveform shows a consistently high or low level, it is determined that the substrate 40 is stationary.

[0040] In some embodiments, the substrate clamping device 10 further includes a warning unit (not shown in the figure), which is used to warn of the replacement of the clamping member 13. The warning unit is configured to compare the pulse width of the signal received by the reflective sensor 31 with a second preset pulse width. If the pulse width of the signal received by the reflective sensor 31 is less than the second preset pulse width, a warning signal is issued. After the substrate clamping device 10 has been used for a period of time, the area on the clamping member 13 that contacts the substrate 40 will experience some wear due to the prolonged clamping of the substrate 40. That is, if... Figure 9 and Figure 10 As shown, when the clamping member 13 is worn, the insertion depth of the clamping member 13 into the substrate 40 will be greater. In order to clamp the substrate 40, the first tooth 1121 and the second tooth 132 of the clamping member 13 will rotate relative to each other, and the reflector 32 and the through hole 33 will be partially misaligned. Figure 11As shown, the width W1 of the overlapping area between the reflector 32 and the through hole 33 can indirectly reflect the wear of the clamping member 13. The greater the wear of the clamping member 13, the narrower the width W1 of the overlapping area between the reflector 32 and the through hole 33. The width W1 of the overlapping area between the reflector 32 and the through hole 33 corresponds to the pulse width of the signal received by the reflective sensor 31. If the pulse width of the signal received by the reflective sensor 31 is less than the second preset pulse width, it can be determined that the clamping member 13 has a too deep insertion depth into the substrate 40, and the wear of the clamping member 13 has reached a critical value. This reminds the operator to replace the clamping member 13, thereby avoiding the situation where the substrate 40 is fragmented due to the breakage of the clamping member 13 during subsequent operations, and improving the safety of the substrate clamping device 10.

[0041] In some embodiments, such as Figure 3 As shown, the base 12 has a receiving cavity 121 inside, the ring gear 11 is placed in the receiving cavity 121, the reflective sheet 32 ​​is mounted on the ring gear 11, and the through hole 33 is formed in the base 12. Placing the ring gear 11 in the receiving cavity 121 avoids the influence of the internal environment of the substrate processing apparatus on the meshing and engagement between the ring gear 11 and the clamping member 13, thereby improving the reliability of the substrate 40 clamping operation. The reflective sheet 32 ​​and the through hole 33 are respectively set on the already equipped ring gear 11 and base 12, eliminating the need for additional fixing devices to install the reflective sheet 32, saving material costs. Furthermore, the reflective sheet 32 ​​is placed in the receiving cavity 121, and the through hole 33 is formed in the base 12, occupying little space and greatly improving space utilization. In some embodiments, the second tooth 132 of the clamping member 13 is disposed in the receiving cavity 121 to mesh with the ring gear 11, and the pin 131 of the clamping member 13 extends out of the base 12 to clamp the substrate 40.

[0042] In some embodiments, such as Figure 3 As shown, the reflector 32 is mounted on the lower surface of the ring gear 11, the through hole 33 is formed on the bottom wall 122 of the base 12, and the reflective sensor 31 is located below the base 12. The reflector 32, the through hole 33, and the reflective sensor 31 are arranged sequentially from top to bottom, with a reasonable spatial layout. When the substrate 40 is in the normal clamping state, the ring gear 11 and the base 12 are in the first relative position. The signal emitted upward by the reflective sensor 31 passes through the through hole 33 to reach the reflector 32, and after being reflected by the reflector 32, the signal passes through the through hole 33 to reach the reflective sensor 31. It can be seen that the signal transmission path is not affected by the substrate 40, which improves the reliability of the substrate clamping device 10.

[0043] Furthermore, the base 12 is mounted on the mounting base 14 via a rotation drive 15, and the reflective sensor 31 is disposed on the mounting base 14 and faces the base 12.

[0044] In other embodiments, the reflector 32 is disposed on the outer peripheral wall of the ring gear 11, the through hole 33 is opened on the side wall of the base 12, and the reflective sensor 31 is disposed on the side of the base 12. When the ring gear 11 and the base 12 are in the first relative position, the reflector 32 and the through hole 33 are disposed opposite to each other, and the reflective sensor 31 can receive the signal reflected back by the reflector 32.

[0045] In some embodiments, such as Figure 3 As shown, the reflective sensor 31 is an optical reflective sensor, and the substrate clamping device 10 includes a transparent plate 34, which covers the through hole 33. By providing the transparent plate 34, the internal environment of the base 12 is prevented from being contaminated by the chemical solution during the substrate 40 operation, thereby preventing interference with the meshing between the ring gear 11 and the clamping member 13, i.e., preventing interference with the clamping action of the clamping member 13. The transparent plate 34 can be made of acrylic, transparent tempered glass, or other transparent materials. The reflective sheet 32 ​​can be made of tin foil, aluminum foil, coated glass, or other materials with light-reflecting capabilities.

[0046] In some embodiments, such as Figure 3 As shown, the substrate clamping device 10 also includes a nozzle 35, which is positioned towards the reflective sensor 31 and used to spray dry gas to prevent liquid from dripping onto the reflective sensor 31 during substrate 40 operation, thereby avoiding affecting the accuracy of the signal received by the reflective sensor 31. The nozzle 35 can be used to spray nitrogen gas as a dry gas.

[0047] Furthermore, such as Figure 3 As shown, the mounting base 14 is provided with a mounting bracket 36 for mounting the nozzle 35.

[0048] In this embodiment, when the substrate 40 is in a normal clamping state and the substrate clamping device 10 is in the initial use stage, the reflective sheet 32 ​​and the through hole 33 completely overlap along the circumference of the base 12. Figure 5 This illustration shows a top view of the substrate clamping device according to an embodiment of this application when the substrate 40 is in a normal clamping state; as shown Figure 6 The image shows a bottom perspective view of the substrate clamping device of this application embodiment when the substrate 40 is in a normal clamping state. The relative positions of the reflective sheet 32 ​​and the through hole 33 are clearly shown, that is, the reflective sheet 32 ​​and the through hole 33 coincide, and the width of the area where the reflective sheet 32 ​​and the through hole 33 coincide (the width of the reflective sheet 32 / through hole 33 along the circumference of the base 12) corresponds to the pulse width of the signal received by the reflective sensor 31.

[0049] When the substrate 40 is clamped abnormally, the reflector 32 and the through hole 33 are completely misaligned. Figure 7A top view of the substrate clamping device according to an embodiment of this application is shown when the substrate 40 is in an abnormal clamping state. It can be seen that the reflective sheet 32 ​​on the ring gear 11 is completely misaligned with the through hole 33 covered by the transparent plate 34. For example... Figure 8 As shown, a bottom perspective view of the substrate clamping device of this application embodiment is shown when the substrate 40 is in an abnormal clamping state. It can be seen intuitively that the reflective sheet 32 ​​and the through hole 33 are completely misaligned at this time, and the reflective sensor 31 cannot receive the signal emitted by it.

[0050] When the substrate 40 is in a normal clamping state, and after the substrate clamping device 10 has been used for a period of time, the wear of the clamping member 13 is large, and the reflector 32 and the through hole 33 are partially misaligned. Figure 9 The top perspective view of the substrate clamping device of this application embodiment shows the relative positions of the reflective sheet 32 ​​and the through hole 33 when the substrate is clamped normally and the clamping member 13 has some wear. Figure 10 and Figure 11 As shown, the substrate clamping state is normal, and the clamping member 13 has a certain amount of wear. The bottom perspective view of the substrate clamping device of this application embodiment shows that the area W1 where the reflective sheet 32 ​​and the through hole 33 overlap indirectly reflects the amount of wear of the clamping member 13, and also corresponds to the pulse width of the signal received by the reflective sensor 31.

[0051] In another embodiment, when the substrate 40 is in a normal clamping state, and the substrate clamping device 10 is in the initial use stage, the reflective sheet 32 ​​and the through hole 33 are not completely aligned along the circumference of the base 12, and there is a partial misalignment. Figure 12 The diagram shows a partial top perspective view of the substrate clamping device according to this embodiment when the substrate 40 is in a normal clamping state. The width W2 of the area where the reflective sheet 32 ​​and the through hole 33 overlap corresponds to the pulse width of the signal received by the reflective sensor 31. When the clamping state of the substrate 40 is abnormal, the reflective sheet 32 ​​and the through hole 33 are completely misaligned, as shown in the diagram. Figure 7 and Figure 8 For understanding. When the substrate 40 is in a normal clamping state, and after the substrate clamping device 10 has been used for a period of time, the wear of the clamping member 13 is relatively large, and the misalignment between the reflector 32 and the through hole 33 increases. Refer to... Figures 9 to 11 To understand this, the width W2 of the area where the reflector 32 overlaps with the through hole 33 (when the substrate 40 is in a normal clamping state and in the initial use stage) is greater than the width W1 of the area where the reflector 32 overlaps with the through hole 33 (when the substrate 40 is in a normal clamping state and after a period of use).

[0052] The substrate clamping device 10 of this application embodiment monitors the clamping state of the substrate 40. The monitoring method includes the following steps:

[0053] Acquire the signal received by the reflective sensor 31;

[0054] The clamping state of the substrate 40 is determined based on the pulse width of the signal within one pulse cycle. If the clamping state of the substrate 40 is determined to be abnormal, the base 12 is stopped from rotating.

[0055] Combination Figures 1 to 12 To understand this, when the substrate clamping device 10 in Embodiment 1 of this application is used to monitor the clamping state of the substrate 40, if the pulse width of the signal received by the reflective sensor 31 is 0 within one pulse cycle, it is determined that the clamping state of the substrate 40 is abnormal, and the base 12 is stopped from rotating.

[0056] Example 2

[0057] Please combine Figures 1 to 6 , Figures 9 to 13 To clarify, Embodiment 2 of this application also provides a substrate clamping device, which differs from the solution in Embodiment 1 in that: when the clamping state of the substrate 40 is abnormal, the reflective sheet 32 ​​and the through hole 33 are not completely misaligned. The through hole 33 is configured such that, in response to the ring gear 11 and the base 12 being in a second relative position, the through hole 33 and the reflective sheet 32 ​​are partially misaligned. The reflective sensor 31 is configured such that, in response to the ring gear 11 and the substrate 40 being in the second relative position, the pulse width of the signal received by the reflective sensor 31 is a first preset pulse width. The substrate clamping device 10 includes a judgment unit, which is configured to compare the pulse width of the signal received by the reflective sensor 31 with the first preset pulse width. If the pulse width of the signal received by the reflective sensor 31 is equal to the first preset pulse width, then it is determined that the clamping state of the substrate 40 is abnormal.

[0058] Based on the above description of the substrate 40 clamping process, when the clamping state of the substrate 40 is abnormal, the first limiting portion 1131 on the spoke 113 is limited by the second limiting portion 1222 on the base 12, thereby fixing the ring gear 11 relative to the base 12. It should be understood that when the clamping state of the substrate 40 is abnormal, the relative position between the through hole 33 and the reflector 32 can be affected by factors such as the circumferential length of the second limiting portion 1222. If the length of the second limiting portion 1222 is short, the rotation angle range of the ring gear 11 relative to the base 12 is narrow, meaning the amount of displacement of the through hole 33 relative to the reflector 32 is small. Even when the clamping state of the substrate 40 is abnormal, the through hole 33 is partially misaligned relative to the reflector 32, rather than completely misaligned. At this time, the reflective sensor 31 can still receive the signal reflected by the reflective sheet 32, and when the clamping state of the substrate 40 is abnormal, the pulse width of the signal received by the reflective sensor 31 is less than the pulse width of the signal received by the reflective sensor 31 when the clamping state of the substrate 40 is normal.

[0059] In this embodiment, when the clamping state of the substrate 40 is abnormal, the ring gear 11 and the base 12 are in a second relative position, and the width of the overlapping area of ​​the reflector 32 and the through hole 33 corresponds to the first preset pulse width. If the pulse width of the signal received by the reflective sensor 31 is equal to the first preset pulse width, it can be determined that the ring gear 11 and the base 12 are in the second relative position, and the clamping state of the substrate 40 is abnormal. It can be understood that the first preset pulse width on which the abnormal clamping state of the substrate 40 is determined is less than the second preset pulse width on which the clamping member 13 needs to be replaced.

[0060] Furthermore, the substrate clamping device 10 also includes a second alarm unit (not shown in the figure). The second alarm unit is configured to issue an alarm signal in response to the judgment unit determining that the clamping state of the substrate 40 is abnormal, so that the staff can be informed of the abnormality of the clamping state of the substrate 40 in a timely manner.

[0061] In this embodiment, when the substrate 40 is in a normal clamping state and the substrate clamping device 10 is in the initial use stage, the reflective sheet 32 ​​and the through hole 33 are completely overlapped along the circumference of the base 12, as can be seen from... Figure 5 and Figure 6 To understand.

[0062] When the clamping state of the substrate 40 is abnormal, the reflector 32 and the through hole 33 are partially misaligned. Figure 13 The bottom perspective view of the substrate clamping device of this application embodiment shows that when the clamping state of the substrate 40 is abnormal, it can be seen that the reflective sheet 32 ​​and the through hole 33 are partially misaligned.

[0063] When the substrate 40 is clamped normally, and after the substrate clamping device 10 has been used for a period of time, the wear of the clamping member 13 is relatively large, causing partial misalignment between the reflective sheet 32 ​​and the through hole 33. At this time, the width W1 of the overlapping area between the reflective sheet 32 ​​and the through hole 33 is greater than the width of the overlapping area between the reflective sheet 32 ​​and the through hole 33 when the substrate 40 is clamped abnormally. (Refer to...) Figures 9 to 11 To understand.

[0064] In another embodiment, when the substrate 40 is in a normal clamping state and the substrate clamping device 10 is in the initial use stage, there is a partial misalignment between the reflector 32 and the through hole 33 along the circumference of the base 12, which can be referred to Figure 12 For understanding. When the substrate 40 is in a normal clamping state, and after the substrate clamping device 10 has been used for a period of time, the wear of the clamping member 13 is relatively large, and the misalignment between the reflector 32 and the through hole 33 increases. Refer to... Figures 9 to 11 For understanding, when the clamping state of the substrate 40 is abnormal, the misalignment between the reflector 32 and the through hole 33 further increases, which can be referred to... Figure 13 To understand.

[0065] The substrate clamping device 10 of this application embodiment monitors the clamping state of the substrate 40. The monitoring method includes the following steps:

[0066] Acquire the signal received by the reflective sensor 31;

[0067] The clamping state of the substrate 40 is determined based on the pulse width of the signal within one pulse cycle. If the clamping state of the substrate 40 is determined to be abnormal, the base 12 is stopped from rotating.

[0068] Combination Figure 13 To understand this, when the substrate clamping device 10 in Embodiment 2 of this application is used to monitor the clamping state of the substrate 40, if the pulse width of the signal received by the reflective sensor 31 is equal to the first preset pulse width, it is determined that the clamping state of the substrate 40 is abnormal and the base 12 is stopped from rotating.

[0069] Example 3

[0070] This application provides a substrate processing apparatus, which includes a substrate clamping device 10 as described in any of the above embodiments.

[0071] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the scope of protection of this application.

Claims

1. A substrate clamping device, characterized in that, The device includes a ring gear, a base, and a clamping member. The ring gear is rotatably coaxially arranged with the base, and the clamping member is spaced apart on the base along the circumference. The ring gear is kinetically connected to the clamping member so that the clamping member clamps or releases the substrate. The ring gear is configured such that: in response to a normal clamping state of the substrate, the ring gear and the base are in a first relative position; and in response to an abnormal clamping state of the substrate, the ring gear and the base are in a second relative position. The substrate clamping device further includes a reflective sensor and a reflective sheet. The reflective sheet is disposed on one of the ring gear and the base, and a through hole is formed on the other. The through hole is configured such that: in response to the ring gear and the base being in a first relative position, the through hole is opposite to the reflective sheet; in response to the ring gear and the base being in a second relative position, the through hole is completely misaligned with the reflective sheet. The reflective sensor is configured such that: in response to the ring gear and the substrate being in the first relative position, the signal emitted by the reflective sensor can pass through the through hole and reach the reflective sheet, and receive the signal reflected back by the reflective sheet.

2. The substrate clamping device as described in claim 1, characterized in that, The substrate clamping device further includes a first alarm unit, which is configured to issue an alarm signal in response to the pulse width of the signal received by the reflective sensor being 0 within one pulse cycle.

3. A substrate clamping device, characterized in that, The device includes a ring gear, a base, and a clamping member. The ring gear is rotatably coaxially arranged with the base, and the clamping member is spaced apart on the base along the circumference. The ring gear is kinetically connected to the clamping member so that the clamping member clamps or releases the substrate. The ring gear is configured such that: in response to a normal clamping state of the substrate, the ring gear and the base are in a first relative position; and in response to an abnormal clamping state of the substrate, the ring gear and the base are in a second relative position. The substrate clamping device further includes a reflective sensor and a reflective sheet. The reflective sheet is disposed on one of the ring gear and the base, and a through hole is formed on the other. The through hole is configured such that: in response to the ring gear and the base being in a first relative position, the through hole is opposite to the reflective sheet; in response to the ring gear and the base being in a second relative position, the through hole is partially misaligned with the reflective sheet. The reflective sensor is configured such that the emitted signal can pass through the through hole and reach the reflective sheet, and receives the signal reflected back by the reflective sheet. The reflective sensor is configured such that: in response to the ring gear and the substrate being in the second relative position, the pulse width of the signal received by the reflective sensor is a first preset pulse width. The substrate clamping device further includes a judgment unit, which is configured to compare the pulse width of the signal received by the reflective sensor with a first preset pulse width. If the pulse width is equal to the first preset pulse width, the clamping state of the substrate is determined to be abnormal.

4. The substrate clamping device as described in claim 3, characterized in that, The substrate clamping device further includes a second alarm unit, which is configured to issue an alarm signal in response to the judgment unit determining that the clamping state of the substrate is abnormal.

5. The substrate clamping device as described in claim 1 or 3, characterized in that, The substrate clamping device further includes an early warning unit, which is used to warn of the replacement of the clamping component. The early warning unit is configured to compare the pulse width of the signal received by the reflective sensor with a second preset pulse width. If the pulse width is less than the second preset pulse width, an early warning signal is issued.

6. The substrate clamping device as described in claim 1 or 3, characterized in that, The base has an internal cavity, the ring gear is placed inside the cavity, the reflector is mounted on the ring gear, and the through hole is formed on the base.

7. The substrate clamping device as described in claim 6, characterized in that, The reflector is mounted on the lower surface of the ring gear, the through hole is opened on the bottom wall of the base, and the reflective sensor is located below the base.

8. The substrate clamping device as described in claim 1 or 3, characterized in that, The reflective sensor is an optical reflective sensor, and the substrate clamping device includes a transparent plate that covers the through hole.

9. The substrate clamping device as described in claim 1 or 3, characterized in that, The substrate clamping device further includes a nozzle, which is positioned toward the reflective sensor and used to eject dry gas.

10. A substrate processing apparatus, characterized in that, Includes the substrate clamping device as described in any one of claims 1-9.

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