A read-write detection system for wafer box management chips

Abstract

The application relates to the technical field of management chip read-write detection, and discloses a read-write detection system for wafer box management chips, which comprises a middle fixing table, upper feeding tables are fixedly installed on the two sides of the middle fixing table, and side fixing tables are diagonally installed on the front and back sides of the middle fixing table. The read-write detection system for wafer box management chips can realize double-station detection and read-write through the cooperation of two groups of visual detection components, two groups of read-write components and two groups of transverse moving units. Through the cooperation of two groups of transverse moving units, two groups of fixed adsorption type clamping components and two groups of movable adsorption type clamping components, stable conveying and reliable adsorption clamping can be realized. Through the cooperation of four upper feeding mechanical hands and four wafer box bodies, automatic double-station feeding and discharging operation can be realized, the detection and read-write efficiency is greatly improved, the situation that a station needs to be frequently replaced in the prior art is avoided, and batch detection and read-write testing can be met.

Description

Technical Field

[0001] This invention relates to the field of management chip read / write detection technology, specifically to a read / write detection system for wafer cell management chips. Background Technology

[0002] Wafer boxes are core components of semiconductor manufacturing lines, serving as specialized containers for wafer transfer and storage between various processes such as photolithography, etching, and thin film deposition. To address the challenge of refined management of wafer boxes, wafer box management chips have emerged. These chips are the core carriers for intelligent wafer box management, embedded within the wafer box and possessing functions such as unique identification, data storage, and information interaction. The chips can record core data in real time, including the wafer box's identity information, stored wafer specifications, transfer trajectory, number of uses, and storage duration, providing data support for automated and digital management. This enables traceable management of each wafer box throughout its entire lifecycle. During the production process of wafer box management chips, they often require testing and read / write tests; only qualified wafer box management chips can be used.

[0003] Currently, the CCD visual appearance inspection and chip data read / write test of wafer cell management chips are independent operations, requiring two separate devices to complete the inspection and read / write tests respectively. The process requires CCD visual appearance inspection first, and then data read / write test. Because two separate devices are used for CCD visual inspection and read / write test, frequent workstation changes are required, and the inspection time is long, making it difficult to adapt to the quality inspection requirements of mass production of wafer cell management chips. Therefore, we propose a read / write inspection system for wafer cell management chips. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a read / write detection system for wafer cassette management chips, which can effectively solve the problems in the prior art.

[0005] The technical solution adopted in this invention is: a read / write detection system for wafer cassette management chips, comprising a central fixed platform, loading platforms fixedly installed on both sides of the central fixed platform, side fixed platforms installed diagonally on the front and rear sides of the central fixed platform, a loading robot fixedly installed at the top of the side fixed platforms, a wafer cassette placement and positioning block fixedly installed at the top of the loading platform, a wafer cassette body placed on the top of the loading platform via the wafer cassette placement and positioning block, a management chip wafer placed inside the wafer cassette body, a top frame fixedly installed at the top of the central fixed platform, an inner suspension frame fixedly installed above the central fixed platform on the inner side of the top frame, a suspension plate fixedly installed inside the inner suspension frame, four identical mounting strips fixedly installed at the top of the suspension plate, a notch opened in the middle of the suspension plate, a visual detection component and a read / write component symmetrically arranged inside the notch on the inner side of the suspension plate, a transverse movement unit provided at the top of the central fixed platform, and a fixed adsorption clamping component and a movable adsorption clamping component provided on the upper side of the transverse movement unit.

[0006] Preferably, the visual inspection component includes a horizontal servo module one, which is fixedly installed on the outside of the mounting strip at the top of the suspension plate. A horizontal moving block one is fixedly installed at the movable end of the horizontal servo module one. A vertical servo module one is fixedly installed at the end of the horizontal moving block one away from the horizontal servo module one. A vertical moving block one is fixedly installed at the movable end of the vertical servo module one. A CCD camera is fixedly installed at the end of the vertical moving block one away from the vertical servo module one.

[0007] Through the above technical solution, the horizontal servo module can drive the horizontal moving block to complete the horizontal displacement adjustment, and the vertical servo module can drive the vertical moving block to complete the vertical displacement adjustment, which can adjust the horizontal and vertical positions of the CCD camera to ensure that the CCD camera captures clear images.

[0008] Preferably, the read / write component includes a second horizontal servo module, which is fixedly installed on the outside of the top mounting strip of the suspension plate. A second horizontal moving block is fixedly installed on the movable end of the second horizontal servo module. A second vertical servo module is fixedly installed on the end of the second horizontal moving block away from the second horizontal servo module. A second vertical moving block is fixedly installed on the movable end of the second vertical servo module. A read / write test unit is fixedly installed on the end of the second vertical moving block away from the second vertical servo module.

[0009] Through the above technical solution, the second horizontal servo module can drive the second horizontal moving block to complete the horizontal displacement adjustment, and the second vertical servo module can drive the second vertical moving block to complete the vertical displacement adjustment. This can adjust the horizontal and vertical positions of the read and write test unit and ensure the stability of the read and write test unit.

[0010] Preferably, there are two identical reading / writing components and two identical visual detection components. The two reading / writing components and the two visual detection components are symmetrically distributed about the vertical axis of the central fixed platform. The reading / writing components and the visual detection components are located above the central fixed platform. The two reading / writing components are located on one side of the top of the suspension plate, and the two visual detection components are located on the other side of the top of the suspension plate.

[0011] Through the above technical solution, the two sets of visual inspection components and the two sets of read and write components arranged symmetrically can form independent and synchronous inspection and read and write operations, which can realize the simultaneous parallel operation of wafer visual inspection and chip read and write testing without interference, greatly improving the overall working efficiency of the equipment.

[0012] Preferably, the transverse movement unit includes a transverse movement module one and a transverse movement module two. Both transverse movement module one and transverse movement module two are fixedly installed inside the central fixed platform. The movable ends of both transverse movement module one and transverse movement module two are fixedly installed with transverse movement plates. A guide rail and a sliding block are provided between the transverse movement plate and the central fixed platform. The guide rail is fixedly connected to the central fixed platform, and the sliding block is fixedly connected to the transverse movement plate.

[0013] Through the above technical solution, transverse module one and transverse module two can drive the transverse plate to move. With the help of guide rails and sliding blocks, the transverse plate can be driven to move to the loading and inspection station.

[0014] Preferably, the transverse moving units are provided in two identical sets, and the two sets of transverse moving units are symmetrically distributed about the vertical axis of the central fixed platform. Each set of guide rails and sliding blocks is provided with four identical ones, and the four guide rails and sliding blocks are arranged symmetrically.

[0015] Through the above technical solution, two sets of symmetrically arranged transverse units can form a dual-station transverse operation structure, which can simultaneously carry two sets of adsorption clamping mechanisms to complete the workpiece conveying operation, thus multiplying the equipment's operating efficiency.

[0016] Preferably, the fixed adsorption clamping assembly includes a fixed base, which is fixedly installed on one side of the top of the transverse plate. A vertical support is fixedly installed above the fixed base. A vertical cylinder is fixedly installed on one side of the vertical support. A movable block is fixedly installed at the movable end of the vertical cylinder. A vertical movable frame is fixedly installed on the side of the movable block away from the vertical cylinder. A rotary cylinder is fixedly installed at the end of the vertical movable frame away from the movable block. A rotary vacuum adsorption frame is fixedly installed at the movable end of the rotary cylinder. A rotary vacuum adsorption groove is formed at the top of the rotary vacuum adsorption frame.

[0017] Through the above technical solution, the vertical cylinder can drive the vertical movable frame to complete the vertical lifting action through the movable block, and the rotary cylinder can drive the rotary vacuum adsorption frame to perform angle rotation adjustment. The height and angle of the workpiece can be flexibly adjusted according to the operation requirements, which can adapt to the needs of multiple scene photo inspection.

[0018] Preferably, the movable adsorption clamping assembly includes a horizontal cylinder, which is fixedly installed at the top of the horizontal moving plate. A movable seat is fixedly installed at the movable end of the horizontal cylinder. A horizontal slider and a horizontal slide rail are provided between the movable seat and the horizontal moving plate. The horizontal slide rail is fixedly connected to the horizontal moving plate, and the horizontal slider is fixedly connected to the movable seat. A second vertical cylinder is fixedly installed on one side of the top of the movable seat. A second movable block is fixedly installed at the movable end of the second vertical cylinder. A second vertical movable frame is fixedly installed on the side of the second movable block away from the second vertical cylinder. A second rotary cylinder is fixedly installed on the side of the second vertical movable frame away from the second movable block. A second rotary vacuum adsorption frame is fixedly installed at the movable end of the second rotary cylinder. A second rotary vacuum adsorption groove is opened at the top of the second rotary vacuum adsorption frame.

[0019] Through the above technical solution, the horizontal cylinder can drive the movable seat to move towards or away from the fixed seat. By changing the distance between the movable seat and the fixed seat, the rotating vacuum adsorption frame one and the rotating vacuum adsorption frame two can achieve adsorption clamping or release of the management chip wafer. The vertical cylinder two can drive the vertical movable frame two to complete the vertical lifting action through the movable block two. The rotating cylinder two can drive the rotating vacuum adsorption frame two to perform angle rotation adjustment. Through the synchronous rotation and cooperation of the rotating vacuum adsorption frame one and the rotating vacuum adsorption frame two, the angle adjustment of the management chip wafer can be realized, which can meet the requirements of different angle photography and inspection.

[0020] Preferably, the vertical cross-sections of the first and second rotary vacuum adsorption racks are both L-shaped, the first and second rotary vacuum adsorption tanks are both C-shaped, and the first and second rotary vacuum adsorption tanks together form an O-shaped structure.

[0021] Through the above technical solution, the rotating vacuum adsorption rack 1 and the rotating vacuum adsorption rack 2, together with the rotating vacuum adsorption tank 1 and the rotating vacuum adsorption tank 2, can adsorb and clamp the management chip wafer, effectively avoiding the situation where the management chip wafer detaches during the adsorption clamping process.

[0022] Preferably, there are four identical side fixing platforms, loading robots, wafer box placement and positioning blocks, and wafer box bodies. Two of the side fixing platforms, loading robots, wafer box placement and positioning blocks, and wafer box bodies are located on one side of the horizontal axis of the central fixing platform, and the other two side fixing platforms, loading robots, wafer box placement and positioning blocks, and wafer box bodies are located on the other side of the horizontal axis of the central fixing platform.

[0023] The above technical solution, through the design of four identical side fixing stages, a loading robot, a wafer box placement and positioning block, and a wafer box body, enables dual-station detection and read / write operations, accelerating detection and read / write efficiency and effectively solving the problem in existing technologies that require frequent station changes for read / write and detection.

[0024] Compared with the prior art, the present invention provides a read / write detection system for wafer cell management chips, which has the following advantages: 1. This read / write inspection system for wafer management chips, through the cooperation of two sets of vision inspection components, two sets of read / write components, and two sets of horizontal movement units, can achieve dual-station inspection and read / write. At the same time, the CCD camera can adjust its horizontal and vertical positions under the drive of horizontal servo module one and vertical servo module one, and the read / write components can adjust their horizontal and vertical positions under the drive of horizontal servo module two and vertical servo module two, which can better inspect and read / write the management chip wafers. 2. This read / write detection system for wafer cell management chips, through the cooperation of two sets of transverse units, two sets of fixed adsorption clamping components and two sets of movable adsorption clamping components, can achieve both stable transport and reliable adsorption clamping. Through the cooperation of rotary cylinder one, rotary vacuum adsorption frame one, rotary cylinder two and rotary vacuum adsorption frame two, the angle of the management chip wafer can be adjusted, enabling CCD imaging detection at different angles and reducing blind spots in the imaging. 3. This read / write testing system for wafer cassette management chips, through the cooperation of four loading robots and four wafer cassette bodies, can realize automated dual-station loading and unloading operations, which greatly improves the efficiency of testing and reading / writing, effectively avoids the need for frequent station changes in existing technologies, and can meet the requirements of batch testing and read / write testing. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the top frame mounting structure of the present invention; Figure 3 This is a schematic diagram of the internal suspension bracket installation structure of the present invention; Figure 4 This is a schematic diagram of the installation structure of the transverse moving unit of the present invention; Figure 5 This is a schematic diagram of the visual inspection component, read / write component, and suspension plate mounting structure of the present invention. Figure 1 ; Figure 6 This is a schematic diagram of the wafer cassette body mounting structure of the present invention; Figure 7This is a schematic diagram of the distribution structure of the visual detection component and the read / write component of the present invention; Figure 8 This is a schematic diagram of the visual inspection component, read / write component, and suspension plate mounting structure of the present invention. Figure 2 ; Figure 9 This is a schematic diagram of the installation structure of the visual inspection component of the present invention; Figure 10 This is a schematic diagram of the installation structure of the fixed adsorption clamping assembly of the present invention; Figure 11 This is a schematic diagram of the installation structure of the movable adsorption clamping component of the present invention; Figure 12 This is a schematic diagram of the installation structure of the fixed adsorption clamping component, the movable adsorption clamping component, and the transverse movement unit of the present invention.

[0026] The components include: 1. Central fixed platform; 2. Loading platform; 3. Side fixed platform; 4. Loading robot; 5. Wafer box placement and positioning block; 6. Wafer box body; 7. Management chip wafer; 8. Top rack; 9. Inner suspension rack; 10. Suspension plate; 11. Mounting strip; 12. Vision inspection component; 1201. Horizontal servo module one; 1202. Horizontal moving block one; 1203. Vertical servo module one; 1204. Vertical moving block one; 1205. CCD camera; 13. Horizontal movement unit; 1301. Horizontal movement module one; 1302. Horizontal movement module two; 1303. Guide rail; 1304. Sliding block; 1305. Horizontal movement plate; 14. Slot; 15. Fixed adsorption clamping component; 1501. Fixed base; 1502. Vertical support; 1503. Vertical... 1504. Cylinder 1; 1505. Movable Block 1; 1506. Vertical Movable Frame 1; 1507. Rotary Cylinder 1; 1508. Rotary Vacuum Adsorption Frame 1; 1509. Rotary Vacuum Adsorption Tank 1; 16. Movable Adsorption Clamping Assembly; 1601. Horizontal Cylinder; 1602. Movable Seat; 1603. Horizontal Slider; 1604. Horizontal Slide Rail; 1605. Vertical Cylinder 2; 1606. Movable Block 2; 1607. Vertical Movable Frame 2; 1608. Rotary Cylinder 2; 1609. Rotary Vacuum Adsorption Frame 2; 1610. Rotary Vacuum Adsorption Tank 2; 17. Read / Write Assembly; 1701. Horizontal Servo Module 2; 1702. Horizontal Moving Block 2; 1703. Vertical Servo Module 2; 1704. Vertical Moving Block 2; 1705. Read / Write Test Unit. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1: As Figure 1 - Figure 12 As shown, the present invention provides a read / write detection system for wafer cassette management chips, comprising a central fixed stage 1, loading stages 2 fixedly mounted on both sides of the central fixed stage 1, side fixed stages 3 fixedly mounted diagonally on the front and rear sides of the central fixed stage 1, a loading robot 4 fixedly mounted on the top of the side fixed stages 3, a wafer cassette placement and positioning block 5 fixedly mounted on the top of the loading stage 2, a wafer cassette body 6 placed on the top of the loading stage 2 via the wafer cassette placement and positioning block 5, a management chip wafer 7 placed inside the wafer cassette body 6, and a top fixed stage 4 fixedly mounted on the top of the central fixed stage 1. An inner suspension frame 9 is fixedly installed above the middle fixed platform 1 on the inner side of the top frame 8. A suspension plate 10 is fixedly installed inside the inner suspension frame 9. Four identical mounting strips 11 are fixedly installed at the top of the suspension plate 10. A notch 14 is opened in the middle of the suspension plate 10. A visual detection component 12 and a reading and writing component 17 are symmetrically arranged inside the notch 14 inside the suspension plate 10. A transverse movement unit 13 is arranged at the top of the middle fixed platform 1. A fixed adsorption clamping component 15 and a movable adsorption clamping component 16 are arranged on the upper side of the transverse movement unit 13.

[0029] Specifically, the visual inspection component 12 includes a horizontal servo module 1201, which is fixedly installed on the outer side of the mounting strip 11 at the top of the suspension plate 10. A horizontal moving block 1202 is fixedly installed at the movable end of the horizontal servo module 1201. A vertical servo module 1203 is fixedly installed at the end of the horizontal moving block 1202 away from the horizontal servo module 1201. A vertical moving block 1204 is fixedly installed at the movable end of the vertical moving block 1204 away from the vertical servo module 1203. A CCD camera 1205 is fixedly installed at the end of the vertical moving block 1204 away from the vertical servo module 1203. The advantage is that the horizontal servo module 1201 can drive the horizontal moving block 1202 to complete horizontal displacement adjustment, and the vertical servo module 1203 can drive the vertical moving block 1204 to complete vertical displacement adjustment, thus adjusting the horizontal and vertical positions of the CCD camera 1205 and ensuring clear images captured by the CCD camera 1205.

[0030] Specifically, the read / write component 17 includes a second horizontal servo module 1701, which is fixedly installed on the outside of the top mounting strip 11 of the suspension plate 10. A second horizontal moving block 1702 is fixedly installed on the movable end of the second horizontal servo module 1701. A second vertical servo module 1703 is fixedly installed on the end of the second horizontal moving block 1702 away from the second horizontal servo module 1701. A second vertical moving block 1704 is fixedly installed on the movable end of the second vertical servo module 1703. A read / write test unit 1705 is fixedly installed on the end of the second vertical moving block 1704 away from the second vertical servo module 1703. The advantage is that the horizontal servo module 1701 can drive the horizontal moving block 1702 to complete the horizontal displacement adjustment, and the vertical servo module 1703 can drive the vertical moving block 1704 to complete the vertical displacement adjustment. It can adjust the horizontal and vertical positions of the read and write test unit 1705 to ensure the read and write stability of the read and write test unit 1705.

[0031] Specifically, two identical read / write components 17 and vision inspection components 12 are provided. Both the two read / write components 17 and the two vision inspection components 12 are symmetrically distributed about the vertical axis of the central fixed stage 1. The read / write components 17 and the vision inspection components 12 are located above the central fixed stage 1, with the two read / write components 17 located on one side of the top of the suspension plate 10 and the two vision inspection components 12 located on the other side. The advantage is that the symmetrically arranged two sets of vision inspection components 12 and two sets of read / write components 17 can form independent and synchronous detection and read / write operations, enabling wafer vision inspection and chip read / write testing to be performed simultaneously and in parallel without interference, significantly improving the overall working efficiency of the equipment.

[0032] Example 2: like Figure 2 - Figure 12 As shown, this is an improvement on the previous embodiment.

[0033] Specifically, the transverse transfer unit 13 includes a first transverse transfer module 1301 and a second transverse transfer module 1302. Both transverse transfer modules 1301 and 1302 are fixedly installed inside the central fixed platform 1. A transverse transfer plate 1305 is fixedly installed on the movable end of each transverse transfer module 1301 and 1302. A guide rail 1303 and a sliding block 1304 are provided between the transverse transfer plate 1305 and the central fixed platform 1. The guide rail 1303 is fixedly connected to the central fixed platform 1, and the sliding block 1304 is fixedly connected to the transverse transfer plate 1305. The advantage is that the first transverse transfer module 1301 and the second transverse transfer module 1302 can drive the transverse transfer plate 1305 to move. Combined with the guide rail 1303 and the sliding block 1304, this ensures that the transverse transfer plate 1305 can be moved to the loading and inspection station.

[0034] Specifically, two identical sets of transverse moving units 13 are provided, and the two sets of transverse moving units 13 are symmetrically distributed about the vertical axis of the central fixed platform 1. Four identical guide rails 1303 and sliding blocks 1304 are provided, and the four guide rails 1303 and sliding blocks 1304 are arranged symmetrically. The advantage is that the two symmetrically arranged transverse moving units 13 can form a dual-station transverse moving operation structure, capable of simultaneously supporting two sets of adsorption clamping mechanisms to complete workpiece conveying operations, thus significantly improving equipment operating efficiency.

[0035] Specifically, the fixed adsorption clamping assembly 15 includes a fixed base 1501, which is fixedly installed on one side of the top of the transverse plate 1305. A vertical support 1502 is fixedly installed above the fixed base 1501. A vertical cylinder 1503 is fixedly installed on one side of the vertical support 1502. A movable block 1504 is fixedly installed at the movable end of the vertical cylinder 1503. A vertical movable frame 1505 is fixedly installed on the side of the movable block 1504 away from the vertical cylinder 1503. A rotary cylinder 1506 is fixedly installed at the end of the vertical movable frame 1505 away from the movable block 1504. A rotary vacuum adsorption frame 1507 is fixedly installed at the movable end of the rotary cylinder 1506. A rotary vacuum adsorption groove 1508 is opened at the top of the rotary vacuum adsorption frame 1507. The advantages are that the vertical cylinder 1503 can drive the vertical movable frame 1505 to complete the vertical lifting action through the movable block 1504, and the rotary cylinder 1506 can drive the rotary vacuum adsorption frame 1507 to perform angle rotation adjustment. The height and angle of the workpiece can be flexibly adjusted according to the operation requirements, which can adapt to the needs of multiple scene photo inspection.

[0036] Specifically, the movable adsorption clamping assembly 16 includes a transverse cylinder 1601, which is fixedly installed on the top of the transverse plate 1305. A movable seat 1602 is fixedly installed on the movable end of the transverse cylinder 1601. A transverse slider 1603 and a transverse slide rail 1604 are provided between the movable seat 1602 and the transverse plate 1305. The transverse slide rail 1604 is fixedly connected to the transverse plate 1305, and the transverse slider 1603 is fixedly connected to the movable seat 1602. A [missing information - likely a device or component] is fixedly installed on one side of the top of the movable seat 1602. A vertical cylinder 1605 is provided. A movable block 1606 is fixedly installed on the movable end of the vertical cylinder 1605. A vertical movable frame 1607 is fixedly installed on the side of the movable block 1606 away from the vertical cylinder 1605. A rotary cylinder 1608 is fixedly installed on the side of the vertical movable frame 1607 away from the movable block 1606. A rotary vacuum adsorption frame 1609 is fixedly installed on the movable end of the rotary cylinder 1608. A rotary vacuum adsorption groove 1610 is provided at the top of the rotary vacuum adsorption frame 1609. The advantages are that the horizontal cylinder 1601 can drive the movable seat 1602 to move towards or away from the fixed seat 1501. By changing the distance between the movable seat 1602 and the fixed seat 1501, the rotating vacuum adsorption frame 1507 and the rotating vacuum adsorption frame 2 1609 can adsorb and clamp or release the management chip wafer 7. The vertical cylinder 2 1605 can drive the vertical movable frame 2 1607 to complete the vertical lifting action through the movable block 2 1606. The rotating cylinder 2 1608 can drive the rotating vacuum adsorption frame 2 1609 to perform angle rotation adjustment. Through the synchronous rotation of the rotating vacuum adsorption frame 1507 and the rotating vacuum adsorption frame 2 1609, the angle of the management chip wafer 7 can be adjusted, which can meet the requirements of different angle photography and inspection.

[0037] Specifically, both the first rotary vacuum adsorption frame 1507 and the second rotary vacuum adsorption frame 1609 have an "L"-shaped vertical cross-section, while both the first rotary vacuum adsorption tank 1508 and the second rotary vacuum adsorption tank 1610 have a "C"-shaped structure. Together, they form an "O"-shaped structure. The advantage is that the first rotary vacuum adsorption frame 1507 and the second rotary vacuum adsorption frame 1609, in conjunction with the first rotary vacuum adsorption tank 1508 and the second rotary vacuum adsorption tank 1610, can adsorb and clamp the management chip wafer 7, effectively preventing the management chip wafer 7 from detaching during the adsorption clamping process.

[0038] Specifically, four identical side fixing stages 3, loading robot arms 4, wafer cassette placement and positioning blocks 5, and wafer cassette bodies 6 are provided. Two of these components are located on one side of the horizontal axis of the central fixing stage 1, while the other two are located on the other side. The advantage is that this design, using four identical side fixing stages 3, loading robot arms 4, wafer cassette placement and positioning blocks 5, and wafer cassette bodies 6, enables dual-station detection and read / write operations, accelerating detection and read / write efficiency and effectively solving the problem in existing technologies where frequent station changes are required for read / write and detection.

[0039] Working principle: During use, the operator places a wafer cassette body 6 containing a management chip wafer 7 on one side of the top of the loading platform 2, and places a wafer cassette body 6 without a management chip wafer 7 on the other side of the top of the loading platform 2. Then, the equipment is started, and the two sets of transverse units 13 move synchronously. Transverse module one 1301 and transverse module two 1302 synchronously drive the transverse plate 1305 towards the loading platform 2 until the transverse unit 13 stops at the loading station. At this time, the movable adsorption clamping assembly 16 works, and the transverse cylinder 1601 drives the adsorption clamping movable seat 1602 and drives the rotating vacuum adsorption frame two 1609 to move away from the rotating vacuum adsorption frame one 1507. At this time, the fixed adsorption clamping assembly... 15 separates from the movable adsorption clamping assembly 16 and begins to work near the loading robot 4 containing the management chip wafer 7. The loading robot 4 removes the management chip wafer 7 from inside the wafer cassette body 6 and places it inside the rotating vacuum adsorption frame 1609 and the rotating vacuum adsorption frame 1507. At this time, the horizontal cylinder 1601 drives the adsorption clamping movable seat 1602 and moves the rotating vacuum adsorption frame 1609 towards the rotating vacuum adsorption frame 1507. At this time, the fixed adsorption clamping assembly 15 and the movable adsorption clamping assembly 16 cooperate to adsorb and clamp the management chip wafer 7. After the adsorption clamping is completed, the horizontal movement module 1301 and the horizontal movement module 1302 inside the horizontal movement unit 13 drive the horizontal movement plate 1 305 returns to the inspection station. When the transverse plate 1305 reaches the inspection station, the vision inspection component 12 is activated. The transverse servo module 1201 drives the CCD camera 1205 to move horizontally and vertically through the transverse moving block 1202, the vertical servo module 1203, and the vertical moving block 1204 until it reaches the preset position. At this time, the vertical cylinder 1503 and the vertical cylinder 2 1605 drive the management chip wafer 7 to rise and fall and adjust its angle through the rotary cylinder 1506 and the rotary cylinder 2 1608. The CCD camera 1205 performs image inspection on the management chip wafer 7. After the image inspection is completed, the rotary cylinder 1506 and the rotary cylinder 2 1608 return to their initial positions, and the vision inspection component 12 moves to its initial position. The read / write component 17 starts working. The horizontal servo module 1701 drives the read / write test unit 1705 to move horizontally and vertically through the horizontal moving block 1702, the vertical servo module 1703, and the vertical moving block 1704 until it reaches the preset position. The read / write test unit 1705 performs read / write tests on the management chip wafer 7. After the read / write test unit 1705 completes the test, the vertical cylinder 1503 and the vertical cylinder 1605 drive the management chip wafer 7 to descend and move it back to the loading position under the drive of the horizontal moving unit 13. At this time, the loading robot 4, which is close to the wafer 7 without the management chip wafer 7, starts working, takes out the management chip wafer 7, and places it inside the wafer cassette body 6 without the management chip wafer 7.The loading robot 4, positioned close to the wafer 7 containing the management chip, simultaneously loads the wafer and repeats the above steps. During loading, the loading robot 4 picks up wafers sequentially from top to bottom; during unloading, it releases wafers sequentially from bottom to top. The overall design is reasonable, the operation is simple, and it effectively solves the problem in existing technologies where frequent changes of workstations are required for reading, writing, and testing.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A read / write detection system for wafer cassette management chips, comprising a central fixed stage (1), characterized in that: A loading platform (2) is fixedly installed on both sides of the central fixed platform (1). Side fixed platforms (3) are installed diagonally on the front and rear sides of the central fixed platform (1). A loading robot (4) is fixedly installed on the top of the side fixed platform (3). A wafer cassette placement positioning block (5) is fixedly installed on the top of the loading platform (2). A wafer cassette body (6) is placed on the top of the loading platform (2) through the wafer cassette placement positioning block (5). A management chip wafer (7) is placed inside the wafer cassette body (6). A top frame (8) is fixedly installed on the top of the central fixed platform (1). The top of the central fixed platform (1) is located above the top frame (8). An inner suspension bracket (9) is fixedly installed on the inner side of the central fixed platform (1). A suspension plate (10) is fixedly installed inside the inner suspension bracket (9). Four identical mounting strips (11) are fixedly installed on the top of the suspension plate (10). A notch (14) is opened in the middle of the suspension plate (10). A visual inspection component (12) and a reading and writing component (17) are symmetrically arranged inside the notch (14) of the suspension plate (10). A transverse movement unit (13) is arranged on the top of the central fixed platform (1). A fixed adsorption clamping component (15) and a movable adsorption clamping component (16) are arranged on the upper side of the transverse movement unit (13).

2. The read / write detection system for wafer cassette management chips according to claim 1, characterized in that: The visual inspection component (12) includes a horizontal servo module (1201), which is fixedly installed on the outside of the mounting strip (11) at the top of the suspension plate (10). A horizontal moving block (1202) is fixedly installed on the movable end of the horizontal servo module (1201). A vertical servo module (1203) is fixedly installed on the end of the horizontal moving block (1202) away from the horizontal servo module (1201). A vertical moving block (1204) is fixedly installed on the movable end of the vertical servo module (1203). A CCD camera (1205) is fixedly installed on the end of the vertical moving block (1204) away from the vertical servo module (1203).

3. The read / write detection system for wafer cassette management chips according to claim 2, characterized in that: The read / write component (17) includes a second horizontal servo module (1701), which is fixedly installed on the outside of the top mounting strip (11) of the suspension plate (10). A second horizontal moving block (1702) is fixedly installed on the movable end of the second horizontal servo module (1701). A second vertical servo module (1703) is fixedly installed on the end of the second horizontal moving block (1702) away from the second horizontal servo module (1701). A second vertical moving block (1704) is fixedly installed on the movable end of the second vertical servo module (1703). A read / write test unit (1705) is fixedly installed on the end of the second vertical moving block (1704) away from the second vertical servo module (1703).

4. The read / write detection system for a wafer cassette management chip according to claim 3, characterized in that: The reading and writing component (17) and the visual detection component (12) are provided in two identical units. The two reading and writing components (17) and the two visual detection components (12) are symmetrically distributed about the vertical axis of the central fixed platform (1). The reading and writing components (17) and the visual detection components (12) are located above the central fixed platform (1). The two reading and writing components (17) are located on one side of the top of the suspension plate (10), and the two visual detection components (12) are located on the other side of the top of the suspension plate (10).

5. The read / write detection system for a wafer cassette management chip according to claim 1, characterized in that: The transverse unit (13) includes a transverse module one (1301) and a transverse module two (1302). Both the transverse module one (1301) and the transverse module two (1302) are fixedly installed inside the central fixed platform (1). The movable ends of the transverse module one (1301) and the transverse module two (1302) are fixedly installed with transverse plates (1305). A guide rail (1303) and a sliding block (1304) are provided between the transverse plate (1305) and the central fixed platform (1). The guide rail (1303) is fixedly connected to the central fixed platform (1), and the sliding block (1304) is fixedly connected to the transverse plate (1305).

6. The read / write detection system for a wafer cassette management chip according to claim 1, characterized in that: The transverse unit (13) is provided in two identical sets. The two sets of transverse units (13) are symmetrically distributed about the vertical axis of the central fixed platform (1). The guide rail (1303) and sliding block (1304) of one set are provided in four identical sets. The four guide rails (1303) and sliding blocks (1304) are arranged symmetrically.

7. The read / write detection system for a wafer cassette management chip according to claim 5, characterized in that: The fixed adsorption clamping assembly (15) includes a fixed base (1501), which is fixedly installed on one side of the top of the transverse plate (1305). A vertical bracket (1502) is fixedly installed above the fixed base (1501). A vertical cylinder (1503) is fixedly installed on one side of the vertical bracket (1502). A movable block (1504) is fixedly installed at the movable end of the vertical cylinder (1503). (1504) A vertical movable frame (1505) is fixedly installed on the side away from the vertical cylinder (1503). A rotary cylinder (1506) is fixedly installed on the end of the vertical movable frame (1505) away from the movable block (1504). A rotary vacuum adsorption frame (1507) is fixedly installed on the movable end of the rotary cylinder (1506). A rotary vacuum adsorption groove (1508) is opened at the top of the rotary vacuum adsorption frame (1507).

8. The read / write detection system for a wafer cassette management chip according to claim 1, characterized in that: The movable suction clamping assembly (16) includes a transverse cylinder (1601), which is fixedly installed on the top of the transverse plate (1305). A movable seat (1602) is fixedly installed on the movable end of the transverse cylinder (1601). A transverse slider (1603) and a transverse slide rail (1604) are provided between the movable seat (1602) and the transverse plate (1305). The transverse slide rail (1604) is fixedly connected to the transverse plate (1305), and the transverse slider (1603) is fixedly connected to the movable seat (1602). One side of the top of the movable seat (1602) is fixedly mounted with... A vertical cylinder two (1605) is provided. A movable block two (1606) is fixedly installed on the movable end of the vertical cylinder two (1605). A vertical movable frame two (1607) is fixedly installed on the side of the movable block two (1606) away from the vertical cylinder two (1605). A rotary cylinder two (1608) is fixedly installed on the side of the vertical movable frame two (1607) away from the movable block two (1606). A rotary vacuum adsorption frame two (1609) is fixedly installed on the movable end of the rotary cylinder two (1608). A rotary vacuum adsorption groove two (1610) is opened at the top of the rotary vacuum adsorption frame two (1609).

9. The read / write detection system for a wafer cassette management chip according to claim 8, characterized in that: The vertical cross-sections of the first rotating vacuum adsorption rack (1507) and the second rotating vacuum adsorption rack (1609) are both "L" shaped, and the first rotating vacuum adsorption tank (1508) and the second rotating vacuum adsorption tank (1610) are both "C" shaped. The first rotating vacuum adsorption tank (1508) and the second rotating vacuum adsorption tank (1610) together form an "O" shaped structure.

10. The read / write detection system for a wafer cassette management chip according to claim 1, characterized in that: The side fixing platform (3), the loading robot (4), the wafer box placement positioning block (5) and the wafer box body (6) are all provided with four identical ones. Two of the side fixing platforms (3), the loading robot (4), the wafer box placement positioning block (5) and the wafer box body (6) are located on one side of the horizontal axis of the middle fixing platform (1), and the other two side fixing platforms (3), the loading robot (4), the wafer box placement positioning block (5) and the wafer box body (6) are located on the other side of the horizontal axis of the middle fixing platform (1).

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