Sealing quality detection method and device, electronic equipment and medium

Abstract

The application provides a sealing quality detection method and device, electronic equipment and medium, and relates to the field of photovoltaic module detection. First, the void area formed after lamination is identified, then the invalid sealing size caused by the void area is deducted, the effective sealing thickness reflecting the actual continuous sealing capacity of the sealing glue is obtained, and a unified and quantitative sealing quality detection result is formed based on the effective sealing thickness. Therefore, the possibility that the local void area such as bubble and puncture is covered by the sealing glue surface structure and is not identified can be reduced, and the sealing quality detection can be embedded into the photovoltaic module production process as a standardized quality control link after the module lamination.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic module testing, and more specifically to a method, apparatus, electronic device, and medium for testing sealing quality. Background Technology

[0002] In the manufacturing process of photovoltaic (PV) modules, to improve their sealing and insulation performance, sealant is typically applied around the perimeter of the module. For example, butyl rubber is used to seal the edges, reducing the ingress of external moisture. After the glass, encapsulating film, solar cells, and sealant are laminated, a stable encapsulation structure is formed. However, during lamination, the sealant around the PV module and encapsulating films such as EVA (Ethylene-Vinyl Acetate Copolymer) and POE (Polyolefin Elastomer) exhibit some fluidity at high temperatures. The hot-melt sealant at the module's edges can easily interpenetrate and penetrate with adjacent encapsulating films. During cooling after lamination, the encapsulating film may shrink, creating air bubbles, punctures, and other voids at the interpenetration points. These voids reduce the effective sealing width, thus affecting the sealing reliability of the PV module's edges.

[0003] Therefore, how to inspect the sealing quality of the sealant used to seal around photovoltaic modules is a problem that technicians need to consider during the manufacturing and quality inspection of photovoltaic modules. Summary of the Invention

[0004] The purpose of this application is to provide a sealing quality testing method, apparatus, electronic device, and medium, which are designed to test the sealing quality of sealant used to seal around photovoltaic modules.

[0005] In a first aspect, embodiments of this application provide a method for detecting sealing quality, the method comprising: Obtain defect information of the sealant in a photovoltaic module, wherein the sealant is arranged around the perimeter of the photovoltaic module, and the defect information is used to indicate the void areas of the sealant. Based on the defect information, determine the thickness of the sealant in the void area; The effective sealing thickness of the sealant is obtained by subtracting the thickness of the void area from the original thickness of the sealant. Based on the effective sealing thickness, the sealing quality test result of the photovoltaic module is determined. The sealing quality test result is used to indicate whether the sealant seals the photovoltaic module to meet the preset sealing quality requirements.

[0006] In one embodiment of this application, the sealant includes a luminescent tracer that emits light when irradiated with light of a corresponding wavelength; Obtain defect information of the sealant in photovoltaic modules, including: The sealant is irradiated by a light source that emits light of the corresponding wavelength. Acquire a target image captured by an image acquisition device, wherein the target image is used to characterize the distribution of the luminescent area of ​​the sealant after it is irradiated by a light source; The target image was identified as defect information for the sealant.

[0007] In one embodiment of this application, determining the thickness of the void region of the sealant based on defect information includes: Identify dark light areas and non-emitting areas in the target image, where dark light areas are those with luminance less than a preset luminance threshold. The thickness of the sealant's void area is determined based on the geometric information of the dark and non-light-emitting areas.

[0008] In one embodiment of this application, acquiring a target image captured by an image acquisition device includes: The control image acquisition device acquires the light signal after it has been filtered by a bandpass filter to obtain the target image. The bandpass filter is disposed on the image acquisition device and is used to filter the light signal from the area where the sealant is located, allowing the light signal of the wavelength corresponding to the target light signal to pass through, and suppressing the light signal of the wavelength corresponding to the target light signal. The target light signal is the light signal emitted by the luminescent tracer.

[0009] In one embodiment of this application, a light source, an image acquisition device, and an electroluminescence detection device are integrated, and the electroluminescence detection device is used to perform electroluminescence detection on photovoltaic modules; Controlling the irradiation of the sealant by a light source emitting light of a corresponding wavelength includes: At the target time point, the light source used to emit light of the corresponding wavelength is controlled to irradiate the sealant. The target time point is the time point at which the electroluminescence detection of the photovoltaic module begins.

[0010] In one embodiment of this application, the number of photovoltaic modules is N, and N photovoltaic modules form a group of photovoltaic modules, where N is an integer greater than 1; Obtain defect information of the sealant in photovoltaic modules, including: Identify the target photovoltaic module from N photovoltaic modules; The ultrasonic transmitting device is controlled to emit ultrasonic signals to the sealant of the target photovoltaic module, and the intensity of the echo signal fed back by the sealant of the target photovoltaic module in response to the ultrasonic signal is obtained. The intensity of the echo signal is used to determine the defect information; After determining the sealing quality test results of the photovoltaic module based on the effective sealing thickness, the method further includes: If the sealing quality test results indicate that the sealant does not meet the preset sealing quality requirements for the photovoltaic module, all photovoltaic modules other than the target photovoltaic module will be identified as modules to be tested. For each component to be tested, the component to be tested is designated as the target photovoltaic module, and the process jumps to the step of controlling the ultrasonic transmitting device to emit ultrasonic signals to the sealant of the target photovoltaic module.

[0011] In one embodiment of this application, determining the sealing quality test result of the photovoltaic module based on the effective sealing thickness includes: When the effective sealing thickness is greater than or equal to the preset thickness threshold, the sealing quality test result of the photovoltaic module indicates that the sealant meets the preset sealing quality requirements for the photovoltaic module. If the effective sealing thickness is less than the preset thickness threshold, the sealing quality test result of the photovoltaic module indicates that the sealant does not meet the preset sealing quality requirements for the photovoltaic module.

[0012] Secondly, embodiments of this application provide a sealing quality testing device, the device comprising: The acquisition module is used to acquire defect information of the sealant of the photovoltaic module, wherein the sealant is arranged around the perimeter of the photovoltaic module, and the defect information is used to indicate the void areas of the sealant. The first determining module is used to determine the thickness of the void area of ​​the sealant based on the defect information; The second determining module is used to subtract the thickness of the void area from the original arrangement thickness of the sealant to obtain the effective sealing thickness of the sealant. The third determining module is used to determine the sealing quality test result of the photovoltaic module based on the effective sealing thickness. The sealing quality test result is used to indicate whether the sealant seals the photovoltaic module to meet the preset sealing quality requirements.

[0013] Thirdly, embodiments of this application provide an electronic device, including: The memory is configured to store instructions; and The processor is configured to retrieve instructions from memory and, when executing the instructions, to implement the sealing quality detection method provided in the first aspect of the embodiments of this application.

[0014] Fourthly, embodiments of this application provide a machine-readable storage medium storing instructions that, when executed by a processor, cause the processor to implement the sealing quality detection method according to the first aspect of embodiments of this application.

[0015] In this embodiment, void areas formed after lamination are first identified, and then the ineffective sealing dimensions caused by these void areas are subtracted to obtain an effective sealing thickness that reflects the actual continuous sealing capability of the sealant. Based on this effective sealing thickness, a unified and quantified sealing quality inspection result is formed. This reduces the possibility that local void areas such as bubbles and punctures may be obscured by the sealant surface structure and thus go undetected. It also facilitates embedding sealing quality inspection as a standardized quality control step after module lamination into the photovoltaic module production process. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of the sealing quality testing method provided in the embodiments of this application; Figure 2 This is a schematic diagram of the sealing quality testing device provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0018] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0019] In the manufacturing process of photovoltaic (PV) modules, to improve their sealing and insulation performance, sealant is typically applied around the perimeter of the module. For example, butyl rubber is used to seal the edges, reducing the ingress of external moisture. After the glass, encapsulating film, solar cells, and sealant are laminated, a stable encapsulation structure is formed. However, during lamination, the sealant around the PV module and encapsulating films such as EVA (Ethylene-Vinyl Acetate Copolymer) and POE (Polyolefin Elastomer) exhibit some fluidity at high temperatures. The hot-melt sealant at the module's edges can easily interpenetrate and penetrate with adjacent encapsulating films. During cooling after lamination, the encapsulating film may shrink, creating air bubbles, punctures, and other voids at the interpenetration points. These voids reduce the effective sealing width, thus affecting the sealing reliability of the PV module's edges.

[0020] Based on this, embodiments of this application provide a sealing quality testing method, apparatus, electronic device, and medium, which are intended to test the sealing quality of sealant used to seal around photovoltaic modules.

[0021] Figure 1 This is a schematic flowchart of the sealing quality testing method provided in the embodiments of this application, as shown below. Figure 1 As shown, the first aspect of this application provides a sealing quality testing method, which can be used in testing equipment, including the following steps S100-S400.

[0022] It should be noted that the testing equipment in this embodiment may include a processor and at least one of an image acquisition device, a light source, an ultrasonic transmitter, and an ultrasonic receiver connected in communication with the processor. The specific configuration can be tailored to the chosen sealing quality testing method. The testing equipment can also be connected in communication with the conveying equipment, electroluminescence testing equipment, and production line control equipment of a photovoltaic module production line to receive production information of the photovoltaic modules to be tested or to output test results to other equipment.

[0023] The photovoltaic module in this embodiment can be a photovoltaic module that has undergone stacking and lamination processes. During the module stacking process, glass, encapsulating film, battery strings, and other module materials can be sequentially arranged, and a sealant is applied around the perimeter of the photovoltaic module. The sealant, for example, can be butyl rubber, used to form a sealing structure around the photovoltaic module to prevent moisture from entering the module and improve the insulation performance of the edge areas.

[0024] After lamination, the stacked photovoltaic modules are transported to the lamination equipment via the production line's conveyor system. Lamination is then performed under preset temperature and pressure conditions to cure the encapsulating film and form the desired edge sealing structure. Under the high-temperature lamination conditions, the encapsulating film, as well as EVA, POE, and other encapsulating films, may experience a certain degree of flow. Interfacial penetration or interpenetration may occur between the sealant and adjacent encapsulating films. During the cooling process after lamination, the encapsulating film may also shrink, resulting in voids such as bubbles and punctures in the area where the sealant was located.

[0025] In the embodiments of this application, "the thickness of the sealant" can be understood as the sealing dimension of the sealant extending along the plane of the photovoltaic module from the outer edge of the photovoltaic module toward the interior of the photovoltaic module, rather than the vertical dimension of the photovoltaic module in the glass thickness direction. Accordingly, "original arrangement thickness" can represent the total sealing dimension occupied by the sealant along the above direction without deducting the void area, and "effective sealing thickness" can represent the effective sealing dimension remaining after deducting the void area that cannot actually perform the sealing function from the original arrangement thickness.

[0026] Steps S100-S400: Step S100: Obtain defect information of the sealant in the photovoltaic module; The sealant is applied around the perimeter of the photovoltaic module, and the defect information is used to indicate the gaps in the sealant.

[0027] In this step, the testing equipment performs sealing quality testing on the photovoltaic modules after lamination and obtains defect information that reflects whether there are gaps inside the sealant or at the interface between the sealant and the encapsulation film.

[0028] The sealant is applied around the perimeter of the photovoltaic module. Void areas may include air bubbles, punctures, areas with localized sealant deficiency, or other areas not continuously filled with sealant material, formed during the lamination process due to interfacial penetration and interpenetration between the sealant and the encapsulating film, or during subsequent cooling due to shrinkage of the encapsulating film.

[0029] Defect information is used to enable the inspection equipment to determine the location, extent, or size of the aforementioned void area. Depending on the inspection method, defect information can take different data forms. For example, when using optical inspection, defect information can be a target image reflecting the distribution of the luminescent area of ​​the sealant; when using ultrasonic inspection, defect information can be the echo signal intensity obtained when ultrasonically scanning the sealant, or an echo signal sequence composed of echo signal intensities corresponding to multiple scanning positions.

[0030] Testing can be conducted after the photovoltaic modules have completed lamination and cooling. Specifically, after the photovoltaic modules exit the lamination equipment, they can continue to be transported along the production line to a post-lamination testing station, such as an electroluminescence testing station. The testing equipment can then inspect the sealant around the photovoltaic modules at this station, thereby obtaining the final state of the sealant after the actual lamination process, rather than simply inferring the sealing quality based on the sealant's application state before lamination.

[0031] In this way, defects such as bubbles and punctures formed during the lamination process, which are not easily judged by the appearance of the sealant surface, are converted into defect information that can be processed by the detection equipment, thus providing a data basis for subsequent quantitative determination of the thickness of the void area.

[0032] For example, in the production of a 1500V photovoltaic module, butyl sealant is applied around the perimeter of the module during the module lamination stage, and the glass, EVA or POE encapsulation film, and cell strings are then laminated. After entering the lamination equipment, the photovoltaic module undergoes high-temperature lamination and cooling, and subsequently enters the post-lamination inspection station. The inspection equipment uses optical imaging to detect the butyl sealant on the right side of the module, obtaining a target image that displays both the luminous and dark areas of the butyl sealant. This target image can serve as defect information for the sealant.

[0033] Step S200: Determine the thickness of the void area of ​​the sealant based on the defect information.

[0034] In this step, the detection equipment analyzes the defect information obtained in step S100 to identify gap areas in the sealant that cannot actually form a continuous sealing structure, and further determines the size of the gap areas along the sealant sealing thickness direction.

[0035] In one implementation, a correspondence between the detection data and the actual spatial dimensions of the photovoltaic module can be established in advance. For example, for defect information in the form of an image, the actual distance corresponding to a unit pixel in the target image can be determined by using a calibration board, a module structure of known size, or a pre-established pixel size conversion relationship; after identifying the boundary of the void region, the actual thickness of the void region can be calculated based on the number of pixels covered by the void region in the sealing thickness direction.

[0036] In another implementation, when the defect information is the echo signal intensity obtained from ultrasonic testing, the area where abnormal echoes occur can be determined by combining the scanning position of the ultrasonic probe. The testing equipment can record the current position of the probe as it scans segment by segment along the sealant around the photovoltaic module, and compare the echo signal intensity with preset normal sealant echo characteristics. When the echo signals corresponding to multiple consecutive scanning positions exhibit abnormal characteristics corresponding to the gap area, the thickness of the gap area can be determined based on the spatial span of these scanning positions.

[0037] When multiple separate gap regions exist at the same detection location, the dimensions of each gap region in the sealing thickness direction can be determined separately, and the thickness of the gap region to be deducted from the original arrangement thickness can be determined according to preset calculation rules. For example, when multiple gap regions occupy different intervals along the sealing thickness direction, the thicknesses corresponding to each gap interval can be accumulated to obtain the thickness of the gap region corresponding to the detection location.

[0038] In this way, not only can the presence of defects in the sealant be determined, but the defects can also be converted into quantifiable dimensional parameters, so that the seal quality evaluation can reflect the impact of the void area on the actual effective seal size.

[0039] For example, the detection device identifies a dark area in the sealant on the right side of the component based on the target image. By calibrating the pixel size, it is determined that the dark area extends 1.0 mm from the outer edge of the component towards the inside of the component. Then, 1.0 mm can be determined as the thickness of the void area at that location.

[0040] Step S300: Subtract the thickness of the void area from the original thickness of the sealant to obtain the effective sealing thickness of the sealant.

[0041] In this step, the detection device obtains the original arrangement thickness of the sealant and subtracts the thickness of the void area determined in step S200 from the original arrangement thickness to obtain the effective sealing thickness that can actually perform continuous sealing function.

[0042] The initial thickness of the sealant can be obtained in different ways. For example, the initial thickness can be a preset process parameter corresponding to the current model of photovoltaic module, which is pre-stored in the memory of the production line control system or the testing equipment; or it can be obtained by detecting the overall area of ​​the sealant, that is, determining the total sealing dimension of the sealant extending from the outer boundary to the inner boundary of the module, and using this total sealing dimension as the initial thickness.

[0043] It should be noted that even if the sealant still visually covers a certain area, if air bubbles, punctures, or other unfilled voids have formed within that area, that portion cannot be counted as intact sealant. Therefore, this embodiment does not evaluate the sealing quality solely based on the overall dimensions of the sealant, but rather deducts the thickness of the void areas from the original thickness of the sealant.

[0044] For different testing locations around the photovoltaic module, the testing equipment can calculate the effective sealing thickness at each corresponding location, thus forming effective sealing thickness data distributed around the photovoltaic module. When an effective sealing thickness is needed to characterize the sealing quality of the entire photovoltaic module, for example, the minimum effective sealing thickness at each testing location can be used as the effective sealing thickness of the photovoltaic module to avoid localized insufficient sealing being masked by other normal areas.

[0045] In this way, the nominal arrangement dimensions of the sealant are converted into effective dimensions that can reflect the true continuous sealing capability, thereby improving the correspondence between the sealing quality evaluation results and the actual sealing reliability of photovoltaic modules.

[0046] For example, if the initial thickness of the sealant on the right side of a photovoltaic module is 5.2 mm, and step S200 determines that the thickness of the void area at that location is 1.0 mm, then the detection device determines the effective sealing thickness at that location as: 5.2mm - 1.0mm = 4.2mm.

[0047] Therefore, although the overall sealing dimension at this location is still 5.2 mm when viewed from the sealant's external boundary, the actual dimension that can form an effective sealing structure is evaluated as 4.2 mm.

[0048] Step S400: Determine the sealing quality test results of the photovoltaic module based on the effective sealing thickness; The sealing quality test results are used to indicate whether the sealant's sealing of the photovoltaic module meets the preset sealing quality requirements.

[0049] In this step, the testing equipment compares the effective sealing thickness obtained in step S300 with the preset sealing quality requirements to determine whether the sealant of the current photovoltaic module has sufficient effective sealing dimensions.

[0050] Pre-defined sealing quality requirements can be determined based on factors such as the photovoltaic module's operating voltage, module structure, sealant material, product design requirements, and production quality control requirements, and are pre-stored in the testing equipment. The testing equipment can retrieve the corresponding sealing quality requirements for different models or system voltage levels of photovoltaic modules.

[0051] When the effective sealing thickness meets the preset sealing quality requirements, the testing equipment generates a test result indicating that the current photovoltaic module's sealing quality is qualified; when the effective sealing thickness does not meet the preset sealing quality requirements, the testing equipment generates a test result indicating that the current photovoltaic module's sealing quality is unqualified.

[0052] Furthermore, the testing equipment can send the test results to the production line control equipment, manufacturing execution system, or quality management system for use in subsequent production processes. For photovoltaic modules that pass the test, the production line conveyor equipment can continue to transport them to subsequent processes such as frame assembly, junction box installation, curing, final inspection, and packaging. For photovoltaic modules that fail the test, the testing equipment can output alarm information or a non-conformance label, and the production line control equipment or production personnel can then perform operations such as module diversion, line shutdown, and troubleshooting.

[0053] It should be noted that component diversion, production line shutdown, and modification of upstream process parameters can be implemented by production line control equipment or production and process technicians, and do not necessarily have to be directly executed by the detection equipment in this embodiment. The detection equipment may only be responsible for outputting detection results, abnormal information, or corresponding control requests.

[0054] For example, for a 1500V photovoltaic module, if the testing equipment determines that the minimum effective sealing thickness around the module is 3.8mm and the preset thickness threshold corresponding to the preset sealing quality requirement is 3.5mm, then the testing equipment determines that the photovoltaic module's seal meets the preset sealing quality requirement. The production line can then continue to transport the module to the frame assembly, junction box installation, curing, final inspection, and packaging processes.

[0055] Through steps S100 to S400, the testing equipment first identifies the void areas formed after lamination, then deducts the invalid sealing dimensions caused by these void areas to obtain the effective sealing thickness, which reflects the actual continuous sealing capability of the sealant. Based on this effective sealing thickness, a unified and quantified sealing quality test result is generated. This reduces the possibility that local void areas such as bubbles and punctures may be obscured by the sealant surface structure and thus go undetected. Furthermore, it facilitates embedding sealing quality testing as a standardized quality control step after module lamination into the photovoltaic module production process.

[0056] In one embodiment of this application, the sealant includes a luminescent tracer that can generate a target light signal when irradiated with light of a wavelength corresponding to its spectral characteristics. Based on this, the detection device can utilize the distribution state of the luminescent tracer in the sealant to convert the solid areas of the sealant and void areas such as bubbles and punctures into luminescence differences in the image.

[0057] Specifically, before the photovoltaic modules are laminated or during the sealant preparation process, a luminescent tracer can be added to the sealant in advance to ensure a stable distribution of the tracer within the sealant. The luminescent tracer preferably has good compatibility with the sealant material, meets the environmental protection and weather resistance requirements of the photovoltaic module manufacturing process, and can withstand the high temperatures during the lamination process. For example, the luminescent tracer can withstand a processing temperature of approximately 160°C and retain its corresponding luminescent properties after lamination, minimizing the possibility of significant precipitation or luminescent failure due to processing temperature.

[0058] After the sealant containing the luminescent tracer is applied, the glass, encapsulating film, and battery strings can be laminated according to the normal module manufacturing process, and then the components can be laminated in a laminating machine. In other words, adding the luminescent tracer does not change the basic module lamination and lamination process; the luminescent tracer is mainly used to provide identifiable optical markings during the seal quality inspection stage after lamination.

[0059] Obtain defect information of the sealant in photovoltaic modules, including: Step A1: Control the light source used to emit light of the corresponding wavelength to irradiate the sealant.

[0060] Specifically, during seal quality testing, the testing equipment controls a light source to irradiate the sealant surrounding the photovoltaic module. This light source emits light of a corresponding wavelength that matches the excitation spectrum of the luminescent tracer. When the luminescent tracer in the sealant is irradiated by this light, the luminescent tracer located in the normal sealant area generates a target light signal.

[0061] As an example, the luminescent tracer can be a tracer material capable of producing fluorescence under blue-green light excitation, such as a polymeric perylene diimide tracer; correspondingly, the light source can output blue-green light in the 430nm–550nm wavelength range. The specific materials and wavelengths mentioned above are only examples; in practical applications, the corresponding light source can be selected based on the excitation spectrum of the luminescent tracer.

[0062] Step A2: Acquire the target image captured by the image acquisition device, wherein the target image is used to characterize the distribution of the luminescent area of ​​the sealant after it is irradiated by a light source.

[0063] Specifically, the detection equipment acquires target images captured by an image acquisition device during light source illumination. The image acquisition device can be, for example, an industrial area scan camera, to acquire optical images of a certain area of ​​the sealant in a single pass, without requiring point-by-point mechanical scanning along the sealant line as with an ultrasonic probe. Different regions in the target image can reflect the distribution of luminescent tracers within the sealant.

[0064] In areas normally filled with sealant, the luminescent tracer is present along with the sealant and forms a relatively obvious luminescent area after being irradiated by light of the corresponding wavelength. In gaps formed by bubbles, punctures, or localized sealant deficiency, since there is no sealant or the amount of sealant is significantly reduced in these areas, the corresponding luminescent tracer is also absent or its content is significantly reduced, thus appearing as a non-luminescent state or a weaker luminescent state in the target image compared to the normal sealant area.

[0065] Step A3: Identify the target image as defect information of the sealant.

[0066] Specifically, the detection equipment can thus directly use the target image as defect information of the sealant, and further determine the void area based on the light emission distribution in the target image.

[0067] In this way, the material distribution of the sealant can be converted into optical signals with significant differences, enabling the testing equipment to quickly detect the sealant around the component through non-contact image acquisition, reducing the impact of traditional point-by-point scanning on production cycle time, and providing conditions for online full inspection.

[0068] For example, during the production of photovoltaic modules, a luminescent tracer resistant to a processing temperature of 160°C can be added to the butyl rubber beforehand. After the modules are stacked and laminated, they enter the inspection station. The inspection equipment controls a light source capable of outputting blue-green light of 430nm to 550nm to illuminate the four sides of the module, and acquires the luminescent image through an industrial area array camera. Normal butyl rubber areas form brighter areas in the image, while the location of a certain internal bubble forms a weak light area. The inspection equipment thus uses this luminescent image as defect information for the current module.

[0069] In one embodiment of this application, the detection device can further determine the thickness of the void region of the sealant based on the dark and non-light-emitting areas in the target image.

[0070] Based on the defect information, determine the thickness of the sealant in the void area, including: Step B1: Determine the dark light areas and non-emitting areas in the target image, wherein the dark light areas are areas where the emitting brightness is less than a preset brightness threshold.

[0071] Specifically, the detection device can first perform a brightness analysis on the target image. To distinguish between normally emitting areas and areas with significantly reduced luminescence, a brightness threshold can be preset. For each pixel in the target image or an image region composed of multiple adjacent pixels, the detection device can determine the corresponding luminescence brightness and identify areas with luminescence brightness less than the preset brightness threshold but still capable of detecting a certain light signal as dark areas.

[0072] Dark areas may correspond to a significant decrease in sealant content, or the formation of incomplete sealing structures in some areas after the sealant and encapsulation film interpenetrate.

[0073] For areas in the image where no valid target light signal is detected, the detection device can identify them as non-emitting areas. Non-emitting areas can correspond to areas without sealant filling formed by bubbles or punctures.

[0074] In practical image processing, non-illuminating criteria can be set based on the noise level of the image acquisition system. For example, when the signal in a certain area is lower than the threshold corresponding to the camera background noise, that area can be classified as a non-illuminating area, without requiring its pixel value to be absolutely zero.

[0075] Step B2: Determine the thickness of the sealant in the void area based on the geometric information of the dark and non-light-emitting areas.

[0076] Specifically, after identifying the dark-light and non-light-emitting areas, the detection equipment further obtains the geometric information of these areas. This geometric information may include, for example, the boundaries, length, width, area of ​​the area, the location of the area on the photovoltaic module, and the span of the area along the sealing thickness direction.

[0077] The testing equipment can convert the image size of the dark and non-luminous areas along the direction from the outer edge of the component to the inside of the component into the actual spatial size based on the calibration relationship between the pre-established target image and the actual size, thereby obtaining the thickness of the sealant void area.

[0078] When both dark and non-luminous areas exist at a single detection location, both types of areas can be considered as areas where the sealing function may not be fully effective, and their dimensions can be statistically analyzed. For interconnected dark and non-luminous areas, their overall boundaries can be determined and the overall thickness calculated. For multiple independent areas, the thickness of each area can be determined separately, and then the thickness of the gap area to be deducted can be determined according to preset rules.

[0079] In this way, the brightness difference on the target image can be further converted into the quantitative size of the void area, so that the optical detection results can not only be used to determine whether there is a defect, but also participate in the calculation of the effective sealing thickness, thereby improving the quantification of sealing quality evaluation.

[0080] For example, camera calibration results show that every 10 pixels in the target image correspond to an actual distance of 0.1 mm. If the detection device identifies a dark and non-emitting area that continuously covers 80 pixels along the seal thickness direction at a certain sealing location, it can be determined that the thickness of the gap area at that location is approximately 0.8 mm. If the original thickness of the sealant at that location is 4.7 mm, then an effective seal thickness of 3.9 mm can be obtained subsequently.

[0081] In one embodiment of this application, the image acquisition device is equipped with a bandpass filter. The detection device can use the bandpass filter to select the wavelength of the light signal entering the image acquisition device, so as to improve the distinction between the target light signal and the background light signal in the target image.

[0082] Acquiring the target image captured by the image acquisition device includes: Step C1: Control the image acquisition device to acquire the light signal filtered by the bandpass filter to obtain the target image; The bandpass filter is configured on the image acquisition device. The bandpass filter is used to filter the light signal from the area where the sealant is located, allowing the light signal of the wavelength corresponding to the target light signal to pass through, and suppressing the light signal other than the light signal of the wavelength corresponding to the target light signal. The target light signal is the light signal emitted by the luminescent tracer.

[0083] Specifically, a bandpass filter can be placed in the optical path between the sealant area and the imaging sensor of the image acquisition device, for example, mounted on the front of the lens of an industrial area scan camera. The transmission wavelength of the bandpass filter can be selected according to the wavelength of the target light signal generated after the luminescent tracer is excited.

[0084] When a light source illuminates the sealant, the light signal reaching the image acquisition device may include not only the target light signal generated by the luminescent tracer, but also reflected light formed after the excitation light is reflected by the glass, encapsulation material, or sealant surface, ambient lighting light, and other stray light. If light signals of different wavelengths all enter the image acquisition device, it may reduce the image brightness difference between the normal sealant area and the void area.

[0085] Therefore, when the detection equipment controls the image acquisition device to acquire images, the light signal from the area where the sealant is located first passes through a bandpass filter. The bandpass filter allows high transmittance for light signals in the wavelength band corresponding to the target light signal generated by the luminescent tracer, while suppressing light signals outside the target wavelength band. The filtered light signal then enters the imaging sensor of the image acquisition device, where the image acquisition device forms the target image.

[0086] It should be noted that bandpass filters are not required to absolutely filter out all optical signals outside the target band; they only need to make the target optical signal stand out more relative to optical signals in other bands.

[0087] In this way, interference from non-target light signals such as excitation light reflection and ambient light on the target image can be suppressed, and the contrast between normally luminous areas, dark areas and non-luminous areas can be improved, which is beneficial to improving the stability of gap area boundary recognition.

[0088] For example, when using a luminescent tracer that produces fluorescence in a specific wavelength band upon excitation by blue-green light, a bandpass filter matching the fluorescence wavelength band can be installed in front of the lens of an industrial area array camera. When blue-green excitation light illuminates the four sides of the photovoltaic module, the camera mainly collects the tracer's luminescence signal retained after filtering, while the blue-green excitation light reflected by the glass and other ambient stray light are suppressed, thus making the bubble position appear as a more obvious dark area in the target image.

[0089] In one embodiment of this application, the light source and image acquisition device can be integrated with the electroluminescence detection equipment, so that the sealing quality inspection can be carried out using the original electroluminescence detection station after lamination of the photovoltaic module.

[0090] Controlling the irradiation of the sealant by a light source emitting light of a corresponding wavelength includes: Step D1: At the target time point, control the light source used to emit light of the corresponding wavelength to irradiate the sealant, where the target time point is the time point at which the electroluminescence detection of the photovoltaic module begins.

[0091] Specifically, after the photovoltaic modules have completed lamination and cooling, the production line conveyor transports the photovoltaic modules to the electroluminescence testing station after lamination. The electroluminescence testing equipment can detect internal defects in the modules, such as microcracks in the cells, by applying electrical signals to the photovoltaic modules and acquiring corresponding electroluminescence images.

[0092] The light source and image acquisition device used for sealing quality inspection can be integrated into the electroluminescence inspection station. For example, the component positioning mechanism, conveying mechanism, equipment controller or part of the image processing hardware can be shared, and a light source for illuminating the sealant around the photovoltaic module and an industrial area array camera for acquiring target images of the sealant can be set near the electroluminescence inspection equipment.

[0093] The detection equipment can obtain trigger information indicating that the electroluminescence detection device has started performing electroluminescence detection, and determine the time point at which the electroluminescence detection begins as the target time point. When the target time point is reached, the detection equipment controls the light source used to emit light of the corresponding wavelength to irradiate the sealant around the photovoltaic module, and controls the image acquisition device to acquire the corresponding target image.

[0094] In one implementation, the electroluminescence detection device and the sealing quality detection device can be synchronously triggered by the same host controller. In another implementation, the detection device can listen for the start signal output by the electroluminescence detection device and immediately activate the light source and image acquisition device upon detecting the start signal. Thus, sealing quality detection can be synchronously initiated at the same workstation as the electroluminescence detection that the component already needs to perform.

[0095] Since the area array imaging method can obtain a large area of ​​sealant image in a short time, the seal quality inspection can be performed on each photovoltaic module entering the station, thus forming an online full inspection method without adding a long mechanical scanning time for each module.

[0096] In this way, sealing quality inspection can be embedded into the existing electroluminescence inspection station after lamination of photovoltaic modules, reducing the increase in production line space and cycle time caused by setting up additional independent inspection stations, which is conducive to making sealing quality inspection a routine online quality control process in module production.

[0097] For example, after lamination, component A enters the electroluminescence inspection station. The electroluminescence inspection equipment begins electroluminescence inspection of component A at 10:00:00. Simultaneously, the equipment uses 10:00:00 as the target time point, activating a blue-green light source to illuminate the four sides of the component and triggering an industrial area array camera to capture the target image of the sealant. Thus, electroluminescence inspection and sealant quality inspection can be completed simultaneously while the component remains at the same inspection station.

[0098] In one embodiment of this application, without using the above-mentioned light-emitting tracer optical detection method or when compatibility with existing ultrasonic testing equipment is required, defect information of the sealant can be obtained by ultrasonic testing, and production quality control can be achieved by group sampling inspection and expanding the detection range after anomalies.

[0099] Specifically, N photovoltaic modules that are produced continuously or belong to the same production batch can be grouped into a group, where N is an integer greater than 1. For example, based on production cycle time, process stability, or quality management requirements, 6 to 20 continuously produced photovoltaic modules can be grouped into a group.

[0100] Obtain defect information of the sealant in photovoltaic modules, including: Step E1: Identify the target photovoltaic module among N photovoltaic modules.

[0101] Specifically, the testing equipment selects at least one target photovoltaic module from N photovoltaic modules as the sampling object for the current group. The target photovoltaic module can be, for example, the first module, the last module, or the Nth module in the group, or it can be determined according to a preset sampling order or random sampling rules.

[0102] Since ultrasonic testing usually requires the probe to scan along the sealant segment by segment, the testing time is relatively long compared to area array optical imaging. Therefore, the target photovoltaic module can be transported to the sideline testing area by the production line conveyor equipment or diversion mechanism, while other modules in the group that are not sampled continue to circulate or be temporarily stored according to the production rhythm under normal circumstances.

[0103] Step E2: Control the ultrasonic transmitting device to emit ultrasonic signals to the sealant of the target photovoltaic module, and obtain the intensity of the echo signal fed back by the sealant of the target photovoltaic module in response to the ultrasonic signal.

[0104] Specifically, for a photovoltaic module identified as the target, the testing equipment controls a high-frequency ultrasonic probe to scan the sealant around the photovoltaic module segment by segment. The ultrasonic transmitter emits an ultrasonic signal into the sealant at the current scanning position. The ultrasonic waves are reflected to varying degrees at the interfaces of different media such as glass, encapsulation film, sealant, and gaps, and the ultrasonic receiver obtains the corresponding echo signals.

[0105] When using ultrasonic testing equipment that requires a coupling medium, a coupling medium such as water can be placed between the ultrasonic probe and the photovoltaic module to reduce the impact of air gaps on ultrasonic wave propagation. Correspondingly, after the ultrasonic testing is completed on-line, the module surface can be cleaned by relevant equipment or personnel on the production line. The aforementioned coupling and cleaning operations are supporting procedures within the ultrasonic testing process.

[0106] Step E3: Determine the intensity of the echo signal as defect information.

[0107] Specifically, the testing equipment acquires the echo signal intensity corresponding to each scanning position. Because the continuous filling area of ​​the sealant has different acoustic interface characteristics than void areas such as bubbles and punctures, the echo signal intensity will differ. The testing equipment can determine the defect information of the sealant by identifying the echo signal intensity or a dataset composed of echo intensity data from multiple scanning positions.

[0108] The detection equipment can also spatially locate continuous areas with abnormal echo characteristics by combining the scanning position of the probe, and determine the thickness of the gap area accordingly. Then, the effective sealing thickness is calculated according to the aforementioned steps S300 and S400 to form a sealing quality detection result.

[0109] When the target photovoltaic module in the random inspection meets the preset sealing quality requirements, the ultrasonic sampling inspection process for the current group can be terminated, and the other modules in the group can continue to enter the subsequent manufacturing process.

[0110] Step E4: If the sealing quality test results indicate that the sealant does not meet the preset sealing quality requirements for the photovoltaic module, all photovoltaic modules other than the target photovoltaic module out of the N photovoltaic modules are identified as modules to be tested.

[0111] Step E5: For each component to be tested, take the component to be tested as the target photovoltaic module and proceed to the step of controlling the ultrasonic transmitter to emit ultrasonic signals to the sealant of the target photovoltaic module.

[0112] Specifically, when the sealing quality test result of the target photovoltaic module indicates that it does not meet the preset sealing quality requirements, the testing equipment marks all the remaining N-1 photovoltaic modules in the current group as modules to be tested. Subsequently, for each module to be tested, the testing equipment sequentially uses it as a new target photovoltaic module and repeats the ultrasonic emission, echo acquisition, void area thickness determination, effective sealing thickness calculation, and sealing quality judgment, thereby expanding the original sampling inspection to a full inspection of the current group.

[0113] It is important to note that the testing equipment can generate a stop-line suggestion, an anomaly alarm, or a batch full-inspection instruction upon detecting a non-conforming component, and send these instructions to the production line control equipment. The actual production line stoppage can be implemented by the production line control equipment or by production personnel based on alarm information.

[0114] Furthermore, in cases where sampled components fail inspection, production or process technicians can analyze the preceding manufacturing processes and adjust the process parameters accordingly. For example, they can optimize lamination parameters such as lamination temperature, lamination pressure, and lamination time, or adjust parameters such as the amount and placement of sealant to reduce the probability of void defects in subsequent components. These process parameter adjustments are not part of the sealing quality inspection steps performed by the testing equipment itself, but rather closed-loop quality control measures implemented based on the equipment's output.

[0115] Once the current assembly has completed the relevant tests and is deemed qualified, the production line can continue to complete the component encapsulation and molding processes, such as frame assembly, junction box installation, curing, final inspection, and packaging.

[0116] In this way, while being compatible with existing high-frequency ultrasonic testing equipment, the number of ultrasonic scans under normal production conditions can be reduced by using the method of "group sampling inspection - abnormality detection - full inspection of the whole group". At the same time, when abnormalities are detected, the detection range can be expanded in a timely manner, and quality feedback can be provided for the adjustment of the previous lamination parameters and sealant application parameters.

[0117] For example, 10 continuously produced photovoltaic modules are divided into a group, i.e., N=10, and the 10th module is selected as the target photovoltaic module. The testing equipment sends the 10th module into an ultrasonic scanner and scans the sealant around it segment by segment. If the minimum effective seal thickness of the module meets the preset thickness threshold, the ultrasonic sampling inspection of the group ends. If the minimum effective seal thickness of the 10th module is lower than the preset thickness threshold, the testing equipment marks the first 9 modules as modules to be tested and performs ultrasonic testing on them sequentially; at the same time, the testing equipment outputs an abnormal alarm, and the production line control system or production personnel execute the necessary line stoppage, and process technicians check the lamination temperature, pressure, and butyl sealant application amount, and adjust the corresponding process parameters according to the actual cause.

[0118] In a relatively complete production embodiment, the same photovoltaic module production line can simultaneously have both a light-emitting tracer optical detection path and an ultrasonic detection path. The two paths can share the sealing quality judgment logic of "subtracting the thickness of the void area from the original layout thickness to obtain the effective sealing thickness", but they respectively undertake online full inspection and sampling verification or backup inspection functions.

[0119] First, during the module lamination stage, the production equipment sequentially lays out glass, EVA or POE encapsulating film, cell strings, and other module materials, and then arranges butyl rubber containing a luminescent tracer around the photovoltaic module. The luminescent tracer is compatible with the butyl rubber system, can withstand the subsequent lamination processing temperature of approximately 160°C, and maintains detectable luminescent performance after lamination is completed.

[0120] After the modules are stacked, they enter the pre-lamination inspection process. If the pre-lamination inspection meets the requirements, the modules are then transported from the production line to the lamination equipment. Under preset lamination temperature, pressure, and time conditions, the encapsulating film completes the encapsulation and curing, and the butyl rubber completes the four-sided sealing. The modules are then cooled and discharged.

[0121] During the high-temperature lamination process, both the butyl rubber and the encapsulating film may flow, and interfacial penetration may occur at some locations. During cooling, as the encapsulating film shrinks, air bubbles or puncture voids may form at some of these interfacial locations. Therefore, the laminated components are transported to the post-lamination electroluminescence testing station, where edge seal quality inspection is performed.

[0122] For the first luminescent tracer optical detection path, the light source, industrial area scan camera, and corresponding image processing module are integrated with the electroluminescence detection equipment. When electroluminescence detection begins, the detection equipment simultaneously starts seal quality detection: the light source emits light that matches the excitation spectrum of the luminescent tracer around the component, and the luminescent tracer generates a target light signal in the butyl rubber area; the industrial area scan camera collects the filtered target light signal through a bandpass filter and forms a target image of the sealant around the component.

[0123] The detection equipment identifies normally luminous areas, dark areas, and non-luminous areas in the target image. It determines the thickness of the gap area based on the geometric dimensions of the dark and non-luminous areas. Then, it subtracts the gap area thickness from the original thickness of the sealant at each location to obtain the effective sealing thickness at each location, and forms the sealing quality detection result accordingly.

[0124] Because this method eliminates the need for point-by-point scanning with a probe, it allows for the inspection of every component entering the electroluminescence inspection station. For example, when a production line continuously produces 100 components, all 100 components can be subjected to luminescence tracer optical inspection, achieving online full inspection.

[0125] Meanwhile, a second ultrasonic testing path can be implemented, with 10 modules grouped together. One target photovoltaic module is selected for each group and directed to the ultrasonic bypass line. A high-frequency ultrasonic probe scans the sealant segment by segment along the four sides, identifying gap areas by the difference in echo signal intensity. The test results are then generated according to the same effective seal thickness rules as the optical path.

[0126] In this parallel configuration, luminescent tracer optical inspection can be used as an online full inspection method, while ultrasonic inspection can be used as a sampling verification method in the production process, or provide another inspection path in cases such as maintenance of optical inspection equipment and anomaly verification.

[0127] For example, for a set of 10 components, all 10 components undergo luminescence tracer optical testing at the electroluminescence testing station, while the 10th component is selected for ultrasonic side-by-side sampling inspection. If both types of testing indicate that the sealing quality is qualified, the component continues to the assembly, junction box installation, curing, final inspection, and packaging processes.

[0128] If the ultrasonic test result of the 10th component shows that the effective sealing thickness does not meet the preset sealing quality requirements, even if optical testing has already been completed for this group, the testing equipment can still treat this abnormal information as a batch quality abnormality signal and mark the remaining 9 components as components to be tested for further verification, and conduct testing again through the ultrasonic testing path. At the same time, the testing equipment outputs the abnormal results to the production line control system and quality management system.

[0129] Production line control equipment can halt the line or restrict the continued flow of that batch of components based on the level of abnormality. Production personnel or process technicians can further inspect the preceding lamination process and the sealant application process. For example, when multiple components are found to have void areas in similar locations, the lamination temperature, lamination pressure, and lamination time can be checked for appropriateness, and the relevant lamination parameters can be adjusted. When the initial sealant thickness is generally too small or defects are concentrated in areas with insufficient sealant application, the amount or location of butyl sealant application can be adjusted.

[0130] After the process adjustment is completed, the newly produced components can still be tested according to the above-mentioned optical online full inspection and ultrasonic sampling inspection methods, thus forming a complete quality control process of "component stacking - component lamination - sealing quality inspection - inspection judgment - component diversion - process feedback adjustment - subsequent packaging".

[0131] Therefore, the two detection paths can share a unified effective seal thickness determination logic, and respectively utilize the characteristics of optical detection (fast speed, suitable for online full inspection) and ultrasonic detection (mature technology, easy to be compatible with existing equipment), so that the production line can maintain a high detection coverage rate and be compatible with existing ultrasonic detection conditions.

[0132] In one embodiment of this application, the testing equipment can determine the sealing quality test result of the photovoltaic module by comparing the effective sealing thickness with a preset thickness threshold.

[0133] Based on the effective sealing thickness, the sealing quality test results of the photovoltaic module are determined, including: Step F1: When the effective sealing thickness is greater than or equal to the preset thickness threshold, determine that the sealing quality test result of the photovoltaic module indicates that the sealant meets the preset sealing quality requirements for the photovoltaic module.

[0134] Specifically, pre-configured thickness thresholds can be set for different types of photovoltaic modules, different operating voltage levels, or different sealing design requirements, and these preset thickness thresholds can be stored in the testing equipment. When a photovoltaic module enters the testing station, the testing equipment can determine the preset thickness threshold corresponding to the current module based on the module model, product code, or product information obtained from the production line system.

[0135] When the effective sealing thickness determined by the testing equipment is greater than or equal to the preset thickness threshold, it means that even after deducting voids such as bubbles and punctures, the remaining sealant still has an effective sealing size that meets the design requirements. Therefore, the testing equipment determines the current sealing quality test result of the photovoltaic module to meet the preset sealing quality requirements.

[0136] Step F2: If the effective sealing thickness is less than the preset thickness threshold, determine that the sealing quality test result of the photovoltaic module indicates that the sealant does not meet the preset sealing quality requirements for the photovoltaic module.

[0137] Specifically, when the effective sealing thickness is less than the preset thickness threshold, it indicates that due to insufficient original arrangement size of the sealant or the presence of large void areas, the actual size of the sealant that can continuously perform the sealing function is lower than the quality control requirements. Therefore, the testing equipment determines that the sealing quality test result of the photovoltaic module does not meet the preset sealing quality requirements.

[0138] When calculating the effective sealing thickness at multiple locations around the photovoltaic module, the effective sealing thickness at each location can be compared with a preset thickness threshold. If at least one detection location that needs to meet the quality requirements is lower than the preset thickness threshold, the photovoltaic module can be determined to not meet the preset sealing quality requirements, thus preventing local sealing deficiencies from being overlooked because other locations are properly sealed.

[0139] As an example, for photovoltaic modules in a 1500V system, the preset thickness threshold can be set to 3.5mm; for photovoltaic modules in a 2000V system, the preset thickness threshold can be set to 5.0mm. The above specific values ​​are only examples; in actual applications, different preset thickness thresholds can be set according to product design specifications, system voltage levels, or quality control standards.

[0140] In this way, a unified quantitative threshold can be used to evaluate the actual effective sealing capability of photovoltaic modules, so that the defect information obtained by different detection paths can all fall under the same sealing quality judgment standard, thereby improving the consistency of production quality control.

[0141] For example, the initial sealant thickness of a 1500V photovoltaic module is 4.8mm, with a identified gap area thickness of 1.0mm, resulting in an effective seal thickness of 3.8mm. Since 3.8mm is greater than 3.5mm, the testing equipment determines that the photovoltaic module meets the preset seal quality requirements. Another 1500V module also has an initial sealant thickness of 4.8mm, but the gap area thickness reaches 1.6mm, resulting in an effective seal thickness of only 3.2mm, which is less than 3.5mm. Therefore, the testing equipment determines that this module does not meet the preset seal quality requirements and outputs a corresponding unqualified test result.

[0142] Figure 2 This is a schematic diagram of the sealing quality testing device provided in the embodiments of this application, as shown below. Figure 2 As shown, a second aspect of this application provides a sealing quality testing device 10, the device 10 comprising: The acquisition module 11 is used to acquire defect information of the sealant of the photovoltaic module, wherein the sealant is arranged around the perimeter of the photovoltaic module, and the defect information is used to indicate the void area of ​​the sealant. The first determining module 12 is used to determine the thickness of the void area of ​​the sealant based on the defect information; The second determining module 13 is used to obtain the effective sealing thickness of the sealant by subtracting the thickness of the void area from the original arrangement thickness of the sealant. The third determining module 14 is used to determine the sealing quality test result of the photovoltaic module based on the effective sealing thickness. The sealing quality test result is used to indicate whether the sealant seals the photovoltaic module to meet the preset sealing quality requirements.

[0143] The sealing quality detection device 10 provided in the second aspect of the present application can realize the various processes implemented in the above method embodiments and achieve the same beneficial effects. To avoid repetition, it will not be described again here.

[0144] Please see Figure 3This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. A third aspect of this application provides an electronic device 1000, including a processor 1100 and a memory 1200. The memory 1200 stores machine-executable instructions that can be executed by the processor 1100. The processor 1100 can execute the machine-executable instructions to implement the above-mentioned sealing quality detection method.

[0145] A fourth aspect of this application provides a machine-readable storage medium storing instructions that, when executed by a processor, cause the processor to implement the aforementioned sealing quality detection method.

[0146] In some embodiments, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the sealing quality detection method according to the above embodiments.

[0147] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0148] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 The computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable apparatus for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0149] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0150] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0151] Computer-readable media include both permanent and non-permanent, removable and non-removable media that can store information by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include temporary computer-readable media (transistor silicon switching devices), such as modulated data signals and carrier waves.

[0152] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0153] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0154] Furthermore, various different embodiments of the present invention can be combined in any way, as long as they do not violate the spirit of the present invention, they should also be regarded as the content disclosed by the present invention.

Claims

1. A method for detecting sealing quality, characterized in that, The method includes: Obtain defect information of the sealant of a photovoltaic module, wherein the sealant is disposed around the perimeter of the photovoltaic module, and the defect information is used to indicate the void areas of the sealant; Based on the defect information, determine the thickness of the void area of ​​the sealant; The effective sealing thickness of the sealant is obtained by subtracting the thickness of the void area from the original thickness of the sealant. Based on the effective sealing thickness, the sealing quality test result of the photovoltaic module is determined, wherein the sealing quality test result is used to indicate whether the sealant's sealing of the photovoltaic module meets the preset sealing quality requirements.

2. The method according to claim 1, characterized in that, The sealant includes a luminescent tracer that emits light when irradiated with light of a corresponding wavelength. The acquisition of defect information of the sealant in the photovoltaic module includes: The sealant is irradiated by a light source that emits light of the corresponding wavelength. Acquire a target image captured by an image acquisition device, wherein the target image is used to characterize the distribution of the luminescent area of ​​the sealant after it is irradiated by the light source; The target image is identified as defect information of the sealant.

3. The method according to claim 2, characterized in that, Determining the thickness of the void region of the sealant based on the defect information includes: Identify dark light regions and non-emitting regions in the target image, wherein the dark light regions are regions whose luminance is less than a preset luminance threshold; The thickness of the void region of the sealant is determined based on the geometric information of the dark light region and the non-light-emitting region.

4. The method according to claim 2, characterized in that, The target image acquired by the image acquisition device includes: The image acquisition device is controlled to acquire the light signal filtered by the bandpass filter to obtain the target image. The bandpass filter is disposed on the image acquisition device and is used to filter the light signal from the area where the sealant is located, allowing the light signal of the wavelength corresponding to the target light signal to pass through, and suppressing the light signal of the wavelength corresponding to the target light signal. The target light signal is the light signal emitted by the luminescent tracer.

5. The method according to claim 2, characterized in that, The light source, the image acquisition device, and the electroluminescence detection device are integrated, and the electroluminescence detection device is used to perform electroluminescence detection on the photovoltaic module. The control of the light source used to emit light of the corresponding wavelength to irradiate the sealant includes: At a target time point, a light source for emitting light of the corresponding wavelength is controlled to irradiate the sealant, wherein the target time point is the time point at which electroluminescence detection of the photovoltaic module begins.

6. The method according to claim 1, characterized in that, The number of photovoltaic modules is N, and N photovoltaic modules form a group of photovoltaic modules, where N is an integer greater than 1. The acquisition of defect information of the sealant in the photovoltaic module includes: Determine the target photovoltaic module from among the N photovoltaic modules; The ultrasonic transmitting device is controlled to emit ultrasonic signals toward the sealant of the target photovoltaic module, and the intensity of the echo signal fed back by the sealant of the target photovoltaic module in response to the ultrasonic signals is obtained. The intensity of the echo signal is determined as the defect information; After determining the sealing quality test result of the photovoltaic module based on the effective sealing thickness, the method further includes: If the sealing quality test result indicates that the sealant does not meet the preset sealing quality requirements for the photovoltaic module, all photovoltaic modules other than the target photovoltaic module among the N photovoltaic modules are identified as modules to be tested. For each component to be tested, the component to be tested is designated as the target photovoltaic module, and the process jumps to the step of controlling the ultrasonic transmitting device to emit ultrasonic signals to the sealant of the target photovoltaic module.

7. The method according to claim 1, characterized in that, The step of determining the sealing quality test result of the photovoltaic module based on the effective sealing thickness includes: If the effective sealing thickness is greater than or equal to a preset thickness threshold, the sealing quality test result of the photovoltaic module indicates that the sealant meets the preset sealing quality requirements for the photovoltaic module. If the effective sealing thickness is less than the preset thickness threshold, the sealing quality test result of the photovoltaic module indicates that the sealant does not meet the preset sealing quality requirements for the photovoltaic module.

8. A sealing quality testing device, characterized in that, The device includes: An acquisition module is used to acquire defect information of the sealant of a photovoltaic module, wherein the sealant is arranged around the perimeter of the photovoltaic module, and the defect information is used to indicate the void areas of the sealant. The first determining module is used to determine the thickness of the void region of the sealant based on the defect information; The second determining module is used to obtain the effective sealing thickness of the sealant by subtracting the thickness of the void region from the original arrangement thickness of the sealant. The third determining module is used to determine the sealing quality test result of the photovoltaic module based on the effective sealing thickness, wherein the sealing quality test result is used to indicate whether the sealant's sealing of the photovoltaic module meets the preset sealing quality requirements.

9. An electronic device, characterized in that, It includes a processor and a memory, the memory storing programs or instructions that can run on the processor, the programs or instructions being executed by the processor to implement the sealing quality detection method as described in any one of claims 1-7.

10. A machine-readable storage medium, characterized in that, The machine-readable storage medium stores instructions that, when executed by a processor, cause the processor to implement the sealing quality detection method as described in any one of claims 1-7.

Images