Chip cooling device and chip assembly

Abstract

The application discloses a kind of cooling device and chip assembly for chip, it is related to chip heat dissipation technical field, including cooling component, first elastic floating connection structure and second elastic floating connection structure, cooling component includes at least two cooling structures;Cooling component is connected in the side of chip body away from substrate;All cooling structures are connected, and the first elastic floating connection structure is connected between adjacent two cooling structures, and the first elastic floating connection structure allows corresponding two cooling structures to generate along the thickness direction of cooling component relative floating;Cooling component is away from the cooling structure of chip body, and the second elastic floating connection structure is contacted with outside cooling structure and substrate, and allow outside cooling structure to generate along the thickness direction of floating relative to substrate.The application can be self-adapting different height chip, reduce chip damage probability, reduce contact thermal resistance, improve thermal performance, be favorable to improve the assembly efficiency of chip.

Description

Technical Field

[0001] This invention relates to the field of chip heat dissipation technology, and in particular to a chip cooling device and chip assembly. Background Technology

[0002] With the rapid development of optical communication, optical communication technology has been widely applied in various fields. As the core component of an optical communication system, the optical module directly determines the data transmission rate and quality. In NPO (Near-Package Optics) and ASIC (Application-Specific Integrated Circuit) architectures, the ASIC cold plate can meet the single-point high-efficiency heat dissipation requirements of high-power chips, while the NPO cold plate is adapted for clustered coupled heat dissipation of ASICs and silicon photonic engines, achieving multi-heat source collaborative temperature control. The two complement each other, providing crucial support for the practical application and technological upgrade of high-performance, high-speed interconnect systems. Because optical engines are highly sensitive to operating temperature, temperature fluctuations can easily cause wavelength drift and performance degradation; therefore, precise temperature control is necessary.

[0003] In multi-chip applications, the thermal interface between the liquid cooling system and the chips often uses thermal pads. However, in actual direct contact, due to factors such as processing technology and manufacturing tolerances, the contact surfaces of each chip exhibit microscopic unevenness, resulting in high contact thermal resistance and affecting heat dissipation performance. Specifically, to accommodate the height tolerances and assembly stresses between different chips, using a thicker thermal pad results in higher material thermal resistance and lower heat dissipation efficiency. Conversely, using a thinner thermal pad cannot guarantee perfect filling of the microscopic gaps on the contact surface, failing to absorb manufacturing tolerances and thermal expansion issues, leading to poor contact, thermal failure, or chip damage. Summary of the Invention

[0004] The purpose of this invention is to provide a cooling device and chip assembly for chips to solve the problems existing in the prior art. It can adapt to chips of different heights, reduce the probability of chip damage, reduce contact thermal resistance, improve thermal performance, simplify the chip assembly process, and improve chip assembly efficiency.

[0005] To achieve the above objectives, the present invention provides the following solution: This invention provides a cooling device for a chip, comprising a cooling assembly, a first elastic floating connection structure, and a second elastic floating connection structure. The cooling assembly includes at least two cooling structures. The cooling assembly is connected to the side of the chip body away from the substrate. All the cooling structures are interconnected, and adjacent cooling structures are connected by a first elastic floating connection structure. Each first elastic floating connection structure allows relative floating between corresponding two cooling structures along the thickness direction of the cooling assembly. The cooling structure of the cooling assembly away from the chip body is the outer cooling structure. The second elastic floating connection structure is in contact with both the outer cooling structure and the substrate, and allows the outer cooling structure to float relative to the substrate along the thickness direction.

[0006] Preferably, the cooling assembly includes two cooling structures. The cooling structure closer to the chip body is the inner cooling structure. The outer cooling structure includes a connecting frame and at least one first cold plate structure. Each first cold plate structure is fixedly connected to the connecting frame, and the connecting frame is connected to a second elastic floating connection structure. The inner cooling structure is provided with a through hole penetrating the inner cooling structure along the thickness direction. Each first cold plate structure passes through one of the through holes. The connecting frame is located on the side of the inner cooling structure away from the chip body.

[0007] Preferably, each of the first cold plate structures includes a first liquid inlet channel, a first heat collection cavity, and a first liquid outlet channel. The liquid outlet of the first liquid inlet channel and the liquid inlet of the first liquid outlet channel are respectively connected to the liquid inlet and the liquid outlet of the first heat collection cavity. A first thermally conductive layer is provided between the bottom wall of the first cold plate structure near the chip body and the chip body.

[0008] Preferably, the inner cooling structure includes a channel assembly and a second cold plate structure. The channel assembly includes a second liquid inlet channel, a diversion channel, and a second liquid outlet channel. The second cold plate structure has at least two second heat collection cavities. The diversion channel has at least two diversion outlets. The liquid outlet of the second liquid inlet channel is connected to the liquid inlet of the diversion channel. The liquid inlet of each second heat collection cavity is connected to at least one diversion outlet of the diversion channel. The liquid outlet of each second heat collection cavity is connected to the liquid inlet of the second liquid outlet channel. A second thermally conductive layer is provided between the bottom wall of each second heat collection cavity and the chip body.

[0009] Preferably, the channel assembly further includes multiple liquid inlet connection channels and multiple liquid outlet connection channels. Each of the second heat collection chambers and the diversion channel is provided with one liquid inlet connection channel and one liquid outlet connection channel. The liquid inlet and liquid outlet of each liquid inlet connection channel are respectively connected and communicated with the diversion outlet and the liquid inlet of the second heat collection chamber. The liquid inlet and liquid outlet of each liquid outlet connection channel are respectively communicated with the liquid outlet of the second heat collection chamber and the liquid inlet of the second liquid outlet channel.

[0010] Preferably, it further includes a third elastic floating connection structure, wherein each of the liquid inlet connection channels and each of the liquid outlet connection channels are flexible hoses, the liquid inlet of each of the liquid inlet connection channels is fixedly connected to the diversion channel, the liquid outlet of each of the liquid outlet connection channels is fixedly connected to the second liquid outlet channel, the diversion channel is fixedly connected to the second liquid outlet channel, and each of the liquid inlet connection channels and each of the liquid outlet connection channels is fixedly connected to the corresponding second cold plate structure; the channel assembly is used to fixally connect to the substrate; each of the second cold plate structures is connected to the channel assembly through the third elastic floating connection structure, the third elastic floating connection structure allowing each of the second cold plate structures to float relative to the channel assembly along the thickness direction.

[0011] Preferably, each of the first elastic floating connection structures includes at least three elastic clips, and the second elastic floating connection structure includes at least three spring screws.

[0012] Preferably, the diversion channel is annular, and the annulus is either a closed ring or an open ring with an opening; the second liquid outlet channel is a non-linear channel, and the second liquid outlet channel is located on the outer periphery of the diversion channel.

[0013] Preferably, the chip body includes a main chip and peripheral chips disposed around the main chip; each of the first cold plate structures is used to cool the main chip, and a first thermally conductive layer is disposed between the bottom wall of the first cold plate structure near the chip body and the main chip; the inner cooling structure is used to cool the peripheral chips, and the second heat collection cavity corresponds one-to-one with the peripheral chip, and a second thermally conductive layer is disposed between the bottom wall of each second heat collection cavity and the peripheral chip.

[0014] The present invention also provides a chip assembly, including a chip body, a substrate, and a cooling device for the chip, wherein the chip body is disposed on the substrate, and the cooling device is connected to the side of the chip body away from the substrate.

[0015] The present invention achieves the following technical effects compared to the prior art: This invention provides a cooling device and chip assembly for chips, including a cooling component, a first elastic floating connection structure, and a second elastic floating connection structure. The cooling component includes at least two cooling structures. The cooling component is connected to the side of the chip body away from the substrate. All cooling structures are interconnected, and adjacent cooling structures are connected by a first elastic floating connection structure. Each first elastic floating connection structure allows relative floating between corresponding two cooling structures along the thickness direction of the cooling component. The cooling structure of the cooling component away from the chip body is the outer cooling structure. The second elastic floating connection structure is in contact with both the outer cooling structure and the substrate, and allows the outer cooling structure to float relative to the substrate along the thickness direction.

[0016] Due to process and other factors, the thickness of the chip and cooling structure requires tolerance. The first and second elastic floating connection structures of this invention allow the cooling structure and substrate, as well as adjacent cooling structures, to float in the thickness direction, changing "rigid locking" to "flexible locking." After installation, the cooling assembly automatically adapts to chips of different heights, ensuring a tight fit while preventing damage to fragile chips. The chip cooling device of this invention is connected to the chip as a mounting assembly. During installation, only the mounting assembly needs to be installed on the chip, simplifying the chip assembly process and improving assembly efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A front view of a chip cooling device provided in one or more embodiments; Figure 2 An exploded view of components of a chip cooling device provided in one or more embodiments; Figure 3 This is a schematic diagram of the structure of a chip cooling device provided in one or more embodiments; Figure 4 A schematic diagram of the internal cooling structure provided in one or more embodiments; Figure 5 for Figure 1 The right view; Figure 6 for Figure 5 Sectional view of AA; Figure 7A front view of the outer cooling junction provided in one or more embodiments; Figure 8 for Figure 7 Sectional view of BB; Figure 9 An exploded view of the first cold plate structure provided in one or more embodiments; Figure 10 This is a front view of the internal cooling structure and the chip in one or more embodiments; Figure 11 for Figure 10 Sectional view of EE; Figure 12 for Figure 11 Enlarged view of F in the middle; Figure 13 A side view of a partial structure of a chip cooling device provided in one or more embodiments; Figure 14 for Figure 13 A cross-sectional view of GG; Figure 15 for Figure 14 Enlarged view of H in the middle; In the diagram: 100, Chip cooling device; 1. Cooling assembly; 101. Outer cooling structure; 102. Inner cooling structure; 103. Connecting frame; 104. First cold plate structure; 105. Through hole; 106. First liquid inlet channel; 107. First heat collection chamber; 108. First liquid outlet channel; 109. Second liquid inlet channel; 110. Diversion channel; 111. Second heat collection chamber; 112. Second liquid outlet channel; 113. Liquid inlet connection channel; 114. Liquid outlet connection channel; 115. Upper plate; 116. Middle plate; 117. Lower plate; 118. Liquid inlet hole; 119. Liquid outlet hole; 120. Liquid inlet tank; 121. Liquid return tank; 122. Shovel teeth; 123. First strip hole; 124. Second strip hole; 125. Channel assembly; 126. Second cold plate structure; 2. First elastic floating connection structure; 3. Second elastic floating connection structure; 4. Chip body; 401. Main chip; 402. Peripheral chips; 5. Substrate; 6. Third elastic floating connection structure; 7. Sealing ring; 8. Pin. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that in the description of this invention, the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "center," "longitudinal," "transverse," "length," "width," "thickness," "vertical," "horizontal," "top," "bottom," "clockwise," and "counterclockwise," etc., indicating directional or positional relationships, are based on the directional or positional relationships shown in the accompanying drawings. These are merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] The purpose of this invention is to provide a cooling device and chip assembly for chips to solve the problems existing in the prior art. It can adapt to chips of different heights, reduce the probability of chip damage, reduce contact thermal resistance, improve thermal performance, simplify the chip assembly process, and improve chip assembly efficiency.

[0023] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Example 1 like Figures 1-15As shown, this embodiment provides a chip cooling device 100, including a cooling component 1, a first elastic floating connection structure 2, and a second elastic floating connection structure 3. The cooling component 1 includes at least two cooling structures. The cooling component 1 is used to connect to the side of the chip body 4 away from the substrate 5. All cooling structures are interconnected, and adjacent cooling structures are connected by a first elastic floating connection structure 2. Each first elastic floating connection structure 2 allows relative floating between the corresponding two cooling structures along the thickness direction of the cooling component 1. The cooling structure of the cooling component 1 away from the chip body 4 is the outer cooling structure 101. The second elastic floating connection structure 3 is in contact with both the outer cooling structure 101 and the substrate 5. The second elastic floating connection structure 3 allows the outer cooling structure 101 to float relative to the substrate 5 along the thickness direction.

[0025] Due to process and other factors, the thickness of the chip and cooling structure needs to be accommodated to reduce tolerances. In this embodiment, the first elastic floating connection structure 2 and the second elastic floating connection structure 3 allow the cooling structure and substrate 5, as well as adjacent cooling structures, to float in the thickness direction, changing "rigid locking" to "flexible locking." After installation, the cooling assembly 1 can automatically adapt to chips of different heights, ensuring a tight fit while preventing damage to fragile chips. The cooling structures are connected via the first elastic floating connection structure 2, allowing the chip cooling device 100 to be connected to the chip as a mounting assembly. During installation, only the mounting assembly needs to be installed on the chip, simplifying the chip assembly process and improving assembly efficiency.

[0026] In some specific embodiments, the cooling structure of the cooling component 1 near the chip body 4 is an inner cooling structure 102, which is used to connect with the chip body 4.

[0027] In some specific embodiments, both the inner cooling structure 102 and the substrate 5 are provided with mounting holes. The mounting holes are either oblong or round. Bolts and other connectors pass through the mounting holes of the inner cooling structure 102 and the substrate 5 and connect the two. A gap is left between the connectors and the mounting holes. When the substrate 5 is heated and undergoes expansion deformation from the center to the periphery, the connectors can move slightly within the mounting holes to prevent the PCB from warping too much and affecting the bonding of the chip and the cold plate.

[0028] In some specific embodiments, the cooling assembly 1 includes two cooling structures. The outer cooling structure 101 includes a connecting frame 103 and at least one first cold plate structure 104. Each first cold plate structure 104 is fixedly connected to the connecting frame 103. The connecting frame 103 is connected to the second elastic floating connecting structure 3. The connecting frame 103 is disposed on the side of the inner cooling structure 102 away from the chip body 4. The inner cooling structure 102 is provided with a through hole 105 extending through the inner cooling structure 102 along the thickness direction. Each first cold plate structure 104 passes through a through hole 105, so that the first cold plate structure 104 can approach the chip body 4 to cool the chip body 4.

[0029] In some specific embodiments, each first cold plate structure 104 includes a first liquid inlet channel 106, a first heat collection cavity 107, and a first liquid outlet channel 108. The liquid outlet of the first liquid inlet channel 106 and the liquid inlet of the first liquid outlet channel 108 are respectively connected to the liquid inlet and liquid outlet of the first heat collection cavity 107. A first thermally conductive layer is disposed between the bottom wall of the first cold plate structure 104 near the chip body 4 and the chip body 4. Coolant enters the outer cooling structure 101 through the first liquid inlet channel 106, flows to the first heat collection cavity 107, and flows to the external heat sink through the first liquid outlet channel 108, thus circulating repeatedly. The first thermally conductive layer can adapt to the contact between the chip and the first cold plate structure 104, so that the chip and the cooling structure are in close contact, significantly reducing the gap thermal resistance.

[0030] In some specific embodiments, each first cold plate structure 104 is used to cool the main chip 401, and a first heat-conducting layer is provided between the bottom wall of the first cold plate structure 104 near the chip body 4 and the main chip 401.

[0031] In some specific embodiments, the inner cooling structure 102 includes a channel assembly 125 and a second cold plate structure 126. The channel assembly 125 includes a second liquid inlet channel 109, a diversion channel 110, and a second liquid outlet channel 112. The second cold plate structure 126 is provided with at least two second heat collection cavities 111, and the diversion channel 110 is provided with at least two diversion outlets. The liquid outlet of the second liquid inlet channel 109 is connected to the liquid inlet of the diversion channel 110, the liquid inlet of each second heat collection cavity 111 is connected to at least one diversion outlet of the diversion channel 110, and the liquid outlet of each second heat collection cavity 111 is connected to the liquid inlet of the second liquid outlet channel 112. A second thermally conductive layer is provided between the bottom wall of each second heat collection cavity 111 and the chip body 4. The coolant enters the diversion channel 110 through the second inlet channel 109, and after being diverted by the diversion channel 110, it flows into multiple second heat collection cavities 111. The second heat collection cavities 111 are opposite to the chip, thereby absorbing the heat from the chip. Then, the coolant in the multiple second heat collection cavities 111 converges into the second outlet channel 112 and finally flows out, thus forming a cooling cycle. When the chip is working, the heat generated is transferred to the chip surface. The chip surface is in close contact with the second thermal conductive layer, thereby absorbing the heat from the chip. The second thermal conductive layer is in close contact with the inner cooling structure 102, and the heat is transferred to the inner cooling structure 102, and finally to the coolant in the second heat collection cavities 111. Through the circulation of the coolant, the heat generated by the chip assembly is transferred to the outside. The coolant enters at least two second heat collection cavities 111 after diversion, which improves the uniformity of the flow. The second heat collection cavities 111 dissipate heat for different chip bodies 4, solving the heat dissipation problem of each chip body 4 individually and ensuring the temperature difference of each chip.

[0032] In some specific embodiments, the inner cooling structure 102 is used to cool the peripheral chip 402, and a second heat-conducting layer is provided between the bottom wall of each second heat collection cavity 111 and the peripheral chip 402.

[0033] In some specific embodiments, the channel assembly 125 further includes multiple inlet connection channels 113 and multiple outlet connection channels 114. Each second heat collection cavity 111 is provided with an inlet connection channel 113 and an outlet connection channel 114 between it and the diversion channel 110. The inlet and outlet of each inlet connection channel 113 are connected and communicate with the diversion outlet and the inlet of the second heat collection cavity 111, respectively. The inlet and outlet of each outlet connection channel 114 are connected and communicate with the outlet of the second heat collection cavity 111 and the inlet of the second outlet channel 112, respectively. The coolant enters the diversion channel 110 through the second inlet channel 109, then enters the second heat collection cavity 111 through the inlet connection channel 113, and then enters the second outlet channel 112 through the outlet connection channel 114, and flows out through the outlet. This embodiment extends the flow path of the coolant, which is beneficial to improving the cooling effect.

[0034] In some specific embodiments, the diversion channel 110 is annular, and the annulus is either a closed ring or an open ring with an opening; the second liquid outlet channel 112 is a non-linear channel, and the second liquid outlet channel 112 is located on the outer periphery of the diversion channel 110. By diverting the flow in the middle and converging it externally, the incoming coolant is dispersed into multiple second heat collection chambers 111, resulting in a simple and compact structure.

[0035] In some specific implementations, the second heat collection cavity 111 corresponds one-to-one with the peripheral chip 402.

[0036] In some specific embodiments, a third elastic floating connection structure 6 is also included. Each liquid inlet connection channel 113 and each liquid outlet connection channel 114 is a flexible hose. The inlet of each liquid inlet connection channel 113 is fixedly connected to the diversion channel 110, and the outlet of each liquid outlet connection channel 114 is fixedly connected to the second liquid outlet channel 112. The diversion channel 110 is fixedly connected to the second liquid outlet channel 112. Each liquid inlet connection channel 113 and each liquid outlet connection channel 114 is fixedly connected to the corresponding second cold plate structure 126. The channel assembly 125 is used for fixed connection to the substrate 5. Each second cold plate structure 126 is connected to the channel assembly 125 via the third elastic floating connection structure 6. The third elastic floating connection structure 6 allows each second cold plate structure 126 to float relative to the channel assembly 125 in the thickness direction. The flexible hose does not limit the floating function of the second cold plate structure 126. By floating in the thickness direction, each second cold plate structure 126 can adapt to chip bodies 4 of different thicknesses.

[0037] In some specific embodiments, each of the first elastic floating connection structures 2 includes at least three elastic clips, and the second elastic floating connection structure 3 and the third elastic floating connection structure 6 each include at least three spring screws.

[0038] In some specific embodiments, the channel assembly 125 includes a support and a multi-segment manifold fixed on the support, the inner cavity of the manifold being used to form a second inlet channel 109, a diversion channel 110, and a second outlet channel 112.

[0039] In some specific embodiments, the outer cooling structure 101 is connected to the bracket or manifold of the inner cooling structure 102 by four elastic clips. The protrusion of the elastic clip is fixedly connected to the outer cooling structure 101, and the two legs of the elastic clip are fixedly connected to the bracket. While connecting the two cooling structures, the elastic clip allows the two cooling structures to have a floating amount in the thickness direction.

[0040] In some specific embodiments, the outer cooling structure 101, the chip, and the chassis are connected by four spring screws. The screws pass through the outer cooling structure 101 and the substrate 5 and are threaded into the chassis, pressing the substrate 5 firmly onto the chassis. The two ends of the spring screws abut against the substrate 5 and the outer cooling structure 101, respectively. During installation, when the chip pushes upwards against the corresponding thermally conductive layer, the thermally conductive layer transmits the force to the spring, changing the spring's deformation and absorbing the tolerance between the cooling structure and the chip. This eliminates the need for a thicker thermal pad to absorb the tolerance, and an ultra-thin, highly thermally conductive material can be filled between the cooling structure and the chip. Simultaneously, a flexible hose floats along with the chip, ensuring the cold plate adheres to the outer chip 402.

[0041] In some specific embodiments, the outer cooling structure 101 includes an upper plate 115, a middle plate 116, and a lower plate 117 that are fixed and sealed together in sequence. The upper plate 115 is provided with an inlet hole 118, an outlet hole 119, an inlet groove 120 communicating with the inlet hole 118, and a partially annular return groove 121 communicating with the outlet hole 119. The inner surface of the lower plate 117 is provided with shovel teeth 122. The middle plate 116 is provided with a first strip-shaped hole 123 communicating with the inlet groove 120 and two second strip-shaped holes 124 communicating with the return groove 121 in the middle part. The coolant flows sequentially through the inlet hole 118, the inlet groove 120, and the first strip-shaped hole 123 and enters between the middle plate 116 and the lower plate 117. The coolant flows through the shovel teeth 122 to the second strip-shaped holes 124, then through the second strip-shaped holes 124 to the return groove 121, and finally flows out through the outlet hole 119.

[0042] In some specific embodiments, the upper plate 115 and the lower plate 117 are connected by welding or other welding methods, or they can be 3D printed as a single piece. The size of the shovel teeth 122 can be set according to heat dissipation requirements.

[0043] In some specific embodiments, the thermally conductive layer is a layer of high thermal conductivity material, using a low thermal resistance material. Preferably, it is an ultra-thin high thermal conductivity material layer.

[0044] In some specific embodiments, the thermally conductive layer is at least one of a thermal pad, thermal paste, and a phase change material. It can be any one of the thermal pad, thermal paste, and phase change material, or a combination of the three.

[0045] In some specific implementations, different types of flexible hoses can be selected according to different requirements, such as metal corrugated pipes, EPDM pipes, PTFE pipes, etc.

[0046] In some specific implementations, the spring type may be, but is not limited to, coil springs, wave springs, disc springs, etc. Among them, disc springs are suitable for scenarios with small deformation and large required elastic force.

[0047] In some specific implementations, the size and elasticity of different cooling structures can be the same or different, and the TIM can also be different, which can be adjusted according to the requirements.

[0048] In some specific embodiments, the coolant can be deionized water, a 25% wt propylene glycol solution, a 25% wt ethylene glycol solution, etc. The inlet water temperature can be set according to actual requirements, generally 30℃~50℃.

[0049] In some specific embodiments, the outer cooling structure 101 and the inner cooling structure 102 are connected in parallel or in series.

[0050] In some specific implementations, the manifold can be formed by welding or other methods, and its shape can be freely adjusted according to requirements.

[0051] In some specific implementations, considering the reliability of the connection between the flexible hose and the manifold, a sealing ring + pin connection is used to reduce the feasibility of the weld point improvement process. The flexible hose is welded to the second cold plate structure 126.

[0052] In some specific implementations, considering that the main chip 401 has extremely high power consumption, a 3D jet cold plate can be used as the main chip 401 cold plate as needed. Using a 3D printed cold plate can effectively reduce flow resistance and thermal resistance.

[0053] In some specific embodiments, the manifold can be replaced by copper pipes and connectors. For example, multiple copper pipe sections and multiple connectors are sequentially and alternately connected to form a second inlet channel 109, and each connector of the second inlet channel 109 is also connected to two branch channels 110; multiple copper pipes and multiple connectors are sequentially and alternately connected to form a second outlet channel 112, and the connectors of the second outlet channel 112 are also connected to two outlet connection channels 114. A stainless steel bracket is used for support at the bottom. The copper pipes and the four-way connectors can be connected by brazing or high-frequency welding, which results in high production volume and low cost. Soldering or screws are used to connect them to the underlying support.

[0054] This embodiment provides a floating cold plate heat dissipation solution. It uses a variety of components such as a high thermal conductivity material layer, spring screws, brackets, and flexible hoses to achieve floating and low thermal resistance close contact between the chip and the liquid cooling system (cold plate). The structure is simple and easy to implement.

[0055] In some specific embodiments, the accompanying drawings of this embodiment illustrate a combination of 1+8 chips (1 main chip 401 and 8 peripheral chips 402). However, the present invention is not only applicable to the combination of 1+8 chips (1 main chip 401 and 8 peripheral chips 402), but is also suitable for various forms such as 1+4 (1 main chip 401 and 4 peripheral chips 402), 1+6 (1 main chip 401 and 6 peripheral chips 402), and 1+2 (1 main chip 401 and 2 peripheral chips 402).

[0056] Example 2 This embodiment provides a chip assembly, including a chip body 4, a substrate 5, and a chip cooling device 100 as described in Embodiment 1. The chip body 4 is disposed on the substrate 5, and the cooling assembly 1 is connected to the side of the chip body 4 away from the substrate 5.

[0057] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A cooling device for chips, characterized in that, The device includes a cooling assembly, a first elastic floating connection structure, and a second elastic floating connection structure. The cooling assembly comprises at least two cooling structures. The cooling assembly is connected to the side of the chip body away from the substrate. All the cooling structures are interconnected, and adjacent cooling structures are connected by a first elastic floating connection structure. Each first elastic floating connection structure allows relative floating between corresponding two cooling structures along the thickness direction of the cooling assembly. The cooling structure of the cooling assembly away from the chip body is the outer cooling structure. The second elastic floating connection structure is in contact with both the outer cooling structure and the substrate. The second elastic floating connection structure allows the outer cooling structure to float relative to the substrate along the thickness direction.

2. The chip cooling device according to claim 1, characterized in that, The cooling assembly includes two cooling structures. The cooling structure closer to the chip body is the inner cooling structure. The outer cooling structure includes a connecting frame and at least one first cold plate structure. Each first cold plate structure is fixedly connected to the connecting frame, and the connecting frame is connected to a second elastic floating connection structure. The inner cooling structure is provided with a through hole that penetrates the inner cooling structure along the thickness direction. Each first cold plate structure passes through one of the through holes. The connecting frame is located on the side of the inner cooling structure away from the chip body.

3. The chip cooling device according to claim 2, characterized in that, Each of the first cold plate structures includes a first liquid inlet channel, a first heat collection cavity, and a first liquid outlet channel. The liquid outlet of the first liquid inlet channel and the liquid inlet of the first liquid outlet channel are respectively connected to the liquid inlet and the liquid outlet of the first heat collection cavity. A first thermally conductive layer is provided between the bottom wall of the first cold plate structure near the chip body and the chip body.

4. The chip cooling device according to claim 3, characterized in that, The inner cooling structure includes a channel assembly and a second cold plate structure. The channel assembly includes a second liquid inlet channel, a diversion channel and a second liquid outlet channel. The second cold plate structure is provided with at least two second heat collection cavities. The diversion channel is provided with at least two diversion outlets. The outlet of the second liquid inlet channel is connected to the inlet of the diversion channel, the inlet of each second heat collection cavity is connected to at least one diversion outlet of the diversion channel, and the outlet of each second heat collection cavity is connected to the inlet of the second outlet channel; a second thermally conductive layer is provided between the bottom wall of each second heat collection cavity and the chip body.

5. The chip cooling device according to claim 4, characterized in that, The channel assembly further includes multiple liquid inlet connection channels and multiple liquid outlet connection channels. Each of the second heat collection chambers and the diversion channel is provided with one liquid inlet connection channel and one liquid outlet connection channel. The liquid inlet and liquid outlet of each liquid inlet connection channel are respectively connected and communicated with the diversion outlet and the liquid inlet of the second heat collection chamber. The liquid inlet and liquid outlet of each liquid outlet connection channel are respectively communicated with the liquid outlet of the second heat collection chamber and the liquid inlet of the second liquid outlet channel.

6. The chip cooling device according to claim 5, characterized in that, It also includes a third elastic floating connection structure, wherein each of the liquid inlet connection channels and each of the liquid outlet connection channels are flexible hoses, the liquid inlet of each of the liquid inlet connection channels is fixedly connected to the diversion channel, the liquid outlet of each of the liquid outlet connection channels is fixedly connected to the second liquid outlet channel, the diversion channel is fixedly connected to the second liquid outlet channel, and each of the liquid inlet connection channels and each of the liquid outlet connection channels is fixedly connected to the corresponding second cold plate structure; the channel assembly is used to fix it to the substrate; each of the second cold plate structures is connected to the channel assembly through the third elastic floating connection structure, which allows each of the second cold plate structures to float relative to the channel assembly along the thickness direction.

7. The chip cooling device according to claim 6, characterized in that, Each of the first elastic floating connection structures includes at least three elastic clips, and each of the second elastic floating connection structures includes at least three spring screws.

8. The chip cooling device according to claim 4, characterized in that, The diversion channel is annular, and the annulus is either a closed ring or an open ring with an opening; the second liquid outlet channel is a non-linear channel, and the second liquid outlet channel is located on the outer periphery of the diversion channel.

9. The chip cooling device according to claim 4, characterized in that, The chip body includes a main chip and peripheral chips disposed around the main chip; each of the first cold plate structures is used to cool the main chip, and a first thermal conductive layer is disposed between the bottom wall of the first cold plate structure near the chip body and the main chip; the inner cooling structure is used to cool the peripheral chips, and the second heat collection cavity corresponds one-to-one with the peripheral chip, and a second thermal conductive layer is disposed between the bottom wall of each second heat collection cavity and the peripheral chip.

10. A chip assembly, characterized in that, The device includes a chip body, a substrate, and a cooling device for a chip as described in any one of claims 1 to 9, wherein the chip body is disposed on the substrate, and the cooling assembly is connected to the side of the chip body away from the substrate.

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