A chip pin protection assembly for integrated circuit manufacturing

Abstract

The application relates to the technical field of chip packaging, in particular to a chip pin protection assembly for integrated circuit manufacturing, which comprises a pair of first frames and a pair of second frames, the first frames and the second frames are adjacently connected, and two second frames slide relative to each other through two first frames. The limiting blocks and the limiting grooves are arranged, the baffle is turned down after the chip positioning is completed, the baffle is turned to a horizontal state and abuts against the upper end surface of the chip, the baffle drives the limiting blocks to be inserted into the limiting grooves on the first sliding blocks, the limiting blocks and the limiting grooves are provided with multiple groups, so that different distances between the first frames and the second frames caused by different sizes of chips are adapted, after the limiting blocks are inserted into the limiting grooves, the relative displacement of the first frames and the second frames can be restricted, compared with the packaging frame assembled through the bolt assembly in the prior art, the frame locking can be realized only by turning the baffle, the operation is simple and fast, and no additional tools are needed.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a chip pin protection component for integrated circuit manufacturing. Background Technology

[0002] Chip packaging is a key process in semiconductor manufacturing. The packaging shell and pin protection components can physically isolate the core structure of the chip and the exposed pins, effectively resisting external impacts or dust erosion. At the same time, they help the chip dissipate heat during operation and ensure the long-term stable operation of the chip. Currently, the mainstream chip packaging shell and pin protection structure in the industry mostly adopts a split assembly structure. During assembly, a special bolt assembly is required to fix and lock the shell to the chip substrate. However, the existing technology has a cumbersome installation and disassembly process. The assembly process requires each pair of bolts to be aligned and tightened one by one. When inspecting, replacing chips and maintaining the pin structure, the bolts need to be disassembled one by one, which greatly affects the efficiency of chip packaging and subsequent maintenance and cannot meet the needs of high-efficiency chip production and processing. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies by proposing a chip pin protection component for integrated circuit manufacturing. This invention utilizes limiting blocks and limiting slots to allow the baffle to flip downwards after chip positioning, so that the baffle is horizontal and abuts against the upper surface of the chip. The baffle then drives the limiting block to insert into the limiting slot on the first slider. Multiple sets of limiting blocks and limiting slots are provided to accommodate different spacings between the first and second frames caused by chips of different sizes. After the limiting block is inserted into the limiting slot, it can constrain the relative displacement of the first and second frames. Compared to existing packaging frames that require bolt assembly, this invention achieves frame locking simply by flipping the baffle, making the operation simple, quick, and requiring no additional tools.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a chip pin protection component for integrated circuit manufacturing, comprising a pair of first frames and a pair of second frames, the first frames and the second frames being adjacent to each other and the two second frames sliding relative to each other through the two first frames, a baffle plate rotatably connected to the top outer wall of each second frame and abutting against the upper end face of the chip, a plurality of sets of limiting blocks being provided on the outer wall of each baffle plate, a first groove being provided on the outer wall of each first frame, a first slider being slidably connected in each first groove, a limiting groove being provided on the top outer wall of each first slider, and each limiting groove being parallel to the movement direction of the second frame, by flipping the baffle plate to drive the limiting block to insert into the limiting groove, the relative movement of the first frame and the second frame is restricted, a receiving frame abutting against the lower end face of the chip being slidably connected on the outer wall of each second frame, and an auxiliary component being provided on each second frame, after the baffle plate is flipped and the limiting block is driven to insert into the limiting groove, the baffle plate triggers the auxiliary component, the auxiliary component drives the receiving frame to move downward and constrains the rotational freedom of the baffle plate.

[0005] Preferably, each of the first frames has a first pin slot on its outer wall, and each of the first sliders has a plurality of first pressure plates on its outer wall, the first pressure plates being slidably inserted into the first pin slot.

[0006] Preferably, each of the limiting grooves has a beveled inner wall at the bottom, each of the limiting blocks has an abutment post on its outer wall that abuts against the beveled surface, and each of the first sliders has a first spring between its outer wall and the inner wall of the first groove.

[0007] Preferably, the auxiliary component includes a second slider, a second groove is provided on the outer wall of each second frame, a second slider is slidably connected in each second groove, a slot is provided on the top outer wall of each second slider, and a locking block adapted to the slot is provided on the outer wall of each baffle near the rotating shaft.

[0008] Preferably, a second spring is provided between the outer wall of each second slider and the inner wall of the second slide groove, and each second slider is fixedly connected to the receiving frame.

[0009] Preferably, each of the second frames has a second pin slot on its outer wall, and each of the second sliders has a second pressure plate on its outer wall, with the second pressure plate slidably inserted into the second pin slot.

[0010] Preferably, each of the baffles has a clearance groove on its outer wall, and the clearance groove is aligned with the second pin groove.

[0011] Preferably, each of the first frames is rotatably connected to a connecting rod at its end, and the end of each connecting rod away from the first frame is rotatably connected to the end of the second frame, and each of the first frames is provided with screw holes on its outer wall.

[0012] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, through the setting of limiting blocks and limiting slots, allows the baffle to be flipped downwards after the chip is positioned, so that the baffle is flipped to a horizontal state and abuts against the upper end surface of the chip. The baffle drives the limiting block to insert into the limiting slot on the first slider. Multiple sets of limiting blocks and limiting slots are provided to adapt to the different spacing between the first frame and the second frame caused by chips of different sizes. After the limiting block is inserted into the limiting slot, it can constrain the relative displacement of the first frame and the second frame. Compared with the packaging frame that requires assembly by bolt assembly in the prior art, this invention can lock the frame simply by flipping the baffle. The operation is simple and quick, and no additional tools are required.

[0013] 2. The present invention uses a connecting rod to push the two first frames on both sides closer together during the initial positioning of the chip. The first frames push the two second frames closer together through the connecting rod until both the first and second frames abut against the sidewall of the chip. This allows the device to adapt to chips of different sizes within a certain range. Compared with the fixed-specification packaging frames of the prior art, the device can quickly match the product size without changing the mold, reducing costs while improving chip manufacturing efficiency.

[0014] 3. The present invention, through the auxiliary components, enables the baffle to rotate synchronously with the locking block when the baffle is flipped to a horizontal state, and inserts into the slot on the second slider. Thus, under the combined action of the slot and the locking block, the tendency of the baffle to rotate in reverse is restricted, achieving the effect of locking the baffle in a horizontal state, completing the process of fixing the chip to the device. At the same time, after the locking block enters the slot, the locking block pushes the second slider to move down in the second slide groove and compresses the second spring. The second slider drives the second pressure plate to move down, so that the second pressure plate presses the pin in the second pin slot, preventing the pin on this side from being pulled by external force, which could cause the pin to break at the connection between the pin and the chip. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure proposed in this invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure proposed in this invention. Figure 2 ; Figure 3 This is a schematic diagram of the overall structure in operation proposed in this invention; Figure 4 This is a three-dimensional cross-sectional view of the auxiliary component proposed in this invention; Figure 5This is a partially enlarged schematic diagram of the limiting block and limiting groove proposed in this invention; Figure 6 This is a three-dimensional sectional view of the first frame proposed in this invention; Figure 7 This is a three-dimensional sectional view of the second frame proposed in this invention.

[0016] Legend: 1. First frame; 11. First pin slot; 12. First slide groove; 13. Connecting rod; 14. Screw hole; 2. Second frame; 21. Second pin slot; 22. Second slide groove; 3. Baffle; 31. Locking block; 32. Limiting block; 321. Abutting post; 33. Alternating groove; 4. Second slider; 41. Locking groove; 42. Second pressure plate; 43. Second spring; 44. Support frame; 5. First slider; 51. Limiting groove; 511. Inclined surface; 52. First pressure plate; 53. First spring. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0018] See Figures 1 to 7 As shown, a chip pin protection assembly for integrated circuit manufacturing includes a pair of first frames 1 and a pair of second frames 2. The first frames 1 and second frames 2 are connected adjacently, and the two second frames 3 slide relative to each other through the two first frames 1. A baffle 3 that abuts against the upper surface of the chip is rotatably connected to the top outer wall of each second frame 2. Several sets of limiting blocks 32 are provided on the outer wall of each baffle 3. A first groove 12 is opened on the outer wall of each first frame 1, and a first slider 5 is slidably connected in each first groove 12. The top of each first slider 5... Each outer wall has a limiting groove 51, and each limiting groove 51 is parallel to the movement direction of the second frame 2. By flipping the baffle 3, the limiting block 32 is inserted into the limiting groove 51 to restrict the relative movement of the first frame 1 and the second frame 2. Each second frame 2 has a receiving frame 44 that slides on its outer wall and abuts against the lower end face of the chip. Each second frame 2 is provided with an auxiliary component. After flipping the baffle 3 and inserting the limiting block 32 into the limiting groove 51, the baffle 3 triggers the auxiliary component. The auxiliary component drives the receiving frame 44 to move down and constrains the rotational freedom of the baffle 3. Each first frame 1 is rotatably connected to a connecting rod 13 at its end, and the end of each connecting rod 13 away from the first frame 1 is rotatably connected to the end of the second frame 2. Each first frame 1 has a screw hole 14 on its outer wall. Each first frame 1 has a first pin groove 11 on its outer wall, and each first slider 5 has a number of first pressure plates 52 on its outer wall. The first pressure plates 52 are slidably inserted into the first pin groove 11. Each limiting groove 51 has a slope 511 on its bottom inner wall. Each limiting block 32 has an abutting post 321 on its outer wall that abuts against the slope 511. Each first slider 5 has a first spring 53 between its outer wall and the inner wall of the first sliding groove 12.

[0019] It should be noted that, as Figures 1 to 2 As shown, when packaging a chip, the chip is placed in the area enclosed by the first frame 1 and the second frame 2. At the same time, the pins around the chip are inserted into the first pin slot 11 or the second pin slot 21 on the corresponding surface, and the chip is supported from below by the support frame 44. The first pin slot 11 and the second pin slot 21 are arranged in multiple sets of equidistant linear arrangement, so that the device can match chips with different pin numbers and spacings. In addition, the first frame 1 and the second frame 2 form a linkage hinge frame structure through the connecting rod 13, and the overall force is evenly distributed. When the chip is heated and expands and contracts due to heat during soldering, the frame relies on the floating gap to offset the slight deformation and avoid the pins being hard squeezed, bent and desoldered.

[0020] During the initial chip positioning, the two first frames 1 on both sides are pushed closer to each other. The first frames 1 push the two second frames 2 closer to each other through the connecting rod 13 until the first frames 1 and the second frames 2 are both in contact with the side wall of the chip. This allows the device to adapt to chips of different sizes within a certain range. Compared with the fixed-specification packaging frames of the existing technology, this device can quickly match the product size without changing the mold, reducing costs while improving chip manufacturing efficiency.

[0021] After the chip is positioned, such as Figure 3 As shown, the baffle 3 is flipped downwards, so that it flips to a horizontal state and abuts against the upper surface of the chip, as... Figure 5As shown, the baffle 3 drives the limiting block 32 to insert into the limiting groove 51 on the first slider 5. Multiple sets of limiting blocks 32 and limiting grooves 51 are provided to adapt to the different spacing between the first frame 1 and the second frame 2 caused by chips of different sizes. After the limiting block 32 is inserted into the limiting groove 51, it can constrain the relative displacement of the first frame 1 and the second frame 2. When the two first frames 1 tend to move away from each other, the movement of the first frame 1 is hindered by the cooperation of the limiting block 32 and the limiting groove 51. Similarly, when the two second frames 2 tend to move away from each other, the two second frames 2 pull the first frame 1 through the connecting rod 13, thereby causing the two first frames 1 to tend to move away from each other, and then being intercepted by the limiting block 32 and the limiting groove 51 again. Compared with the existing packaging frame that needs to be assembled by bolt assembly, the present invention can lock the frame simply by flipping the baffle 3. The operation is simple and quick, and no additional tools are required.

[0022] Meanwhile, during the process, when the limiting block 32 is inserted into the limiting groove 51, the abutting post 321 on the limiting block 32 abuts against the inclined surface 511 in the limiting groove 51, and pushes the first slider 5 to slide in the first sliding groove 12. The first slider 5 drives the first pressure plate 52 to slide slightly along the direction perpendicular to the first pin groove 11, thereby pressing the root of the chip pin to prevent the pin from being pulled by external force, which would cause the pin to break at the connection with the chip.

[0023] The size of the baffle 3 can be set according to actual needs. When the baffle 3 completely covers the chip, it can achieve full coverage of the chip and improve protection. When the baffle 3 is like... Figure 3 As shown, when only part of the chip is blocked, the chip can be limited while improving the chip's heat dissipation effect. The clearance groove 33 of the baffle 3 is aligned and connected with the second pin groove 21 to form a through heat dissipation channel. The chip's working heat can be quickly discharged through the groove, taking into account both packaging protection and heat dissipation performance.

[0024] In addition, by equipping the first slider 5 with the first spring 53 and the second slider 4 with the second spring 43, the first pressure plate 52 and the second pressure plate 42 can elastically and flexibly press the chip pins, buffering equipment vibration and assembly impact, and preventing stress fatigue fracture at the root of the pins.

[0025] The auxiliary components include a second slider 4. Each second frame 2 has a second groove 22 on its outer wall. A second slider 4 is slidably connected in each second groove 22. Each second slider 4 has a slot 41 on its top outer wall. Each baffle 3 has a locking block 31 that matches the slot 41 on its outer wall near the rotating shaft. A second spring 43 is provided between the outer wall of each second slider 4 and the inner wall of the second groove 22. Each second slider 4 is fixedly connected to the receiving frame 44. Each second frame 2 has a second pin groove 21 on its outer wall. Each second slider 4 has a second pressure plate 42 on its outer wall. The second pressure plate 42 is slidably inserted into the second pin groove 21. Each baffle 3 has a clearance groove 33 on its outer wall. The clearance groove 33 is aligned with the second pin groove 21.

[0026] It should be noted that, as Figure 4 As shown, when the baffle 3 is flipped to the horizontal state, the baffle 3 drives the locking block 31 to rotate synchronously and insert into the locking slot 41 on the second slider 4. Thus, under the cooperation of the locking slot 41 and the locking block 31, the tendency of the baffle 3 to rotate in reverse is restricted, thereby achieving the effect of locking the baffle 3 in the horizontal state and completing the process of fixing the chip to the device.

[0027] Meanwhile, when the card block 31 enters the card slot 41, the card block 31 pushes the second slider 4 to move down in the second slide groove 22 and compresses the second spring 43. The second slider 4 drives the second pressure plate 42 to move down, so that the second pressure plate 42 presses the pin in the second pin slot 21 to prevent the pin on this side from being pulled by external force, which would cause the pin to break at the connection with the chip.

[0028] Furthermore, the second slider 4 drives the receiving frame 44 to move downwards synchronously, causing the receiving frame 44 to move the chip downwards, so that the upper surface of the chip is completely within the area surrounded by the first frame 1 and the second frame 2, reducing the probability of damage to the protruding part of the chip and improving the protection effect. When it is necessary to remove the chip, simply press down the second slider 4, causing the second slider 4 to disengage the slot 41 from the block 31, thereby unlocking the baffle 3. At this time, flip the baffle 3 downwards to fully expose the chip. After the second slider 4 moves upwards to reset, the second pressure plate 42 separates from the pins. At the same time, the baffle 3 drives the limiting block 32 to disengage from the limiting groove 51, causing the first pressure plate 52 to separate from the pins. Compared with the chip removal method of the prior art that requires disassembling the packaging frame, the present invention only needs to flip the baffle 3 to simultaneously release the fixing effect of the chip and the pins. The operation is simple and quick. In addition, when the second slider 4 moves upwards to reset, it drives the receiving frame 44 to move upwards synchronously, and the receiving frame 44 drives the chip upwards, so that the chip is exposed from the area surrounded by the first frame 1 and the second frame 2, making it easy to remove the chip.

[0029] In addition, the receiving frame 44 moves up and down synchronously with the second slider 4, automatically lifting the chip during disassembly, eliminating the need for manual prying and avoiding scratches and bumps to the pins. The first frame 1 has reserved screw holes 14, which can not only lock the entire assembly onto the circuit board, but also connect to the assembly line tooling fixtures, adapting to automated mass packaging production. The entire assembly is locked by flipping the baffle 3, without bolts or other loose parts, and can be repeatedly disassembled and reused, reducing packaging material consumption.

[0030] Working principle: like Figures 1 to 2 As shown, when packaging a chip, the chip is placed in the area enclosed by the first frame 1 and the second frame 2. At the same time, the pins around the chip are inserted into the first pin slot 11 or the second pin slot 21 on the corresponding side, and the chip is supported from below by the support frame 44. The first pin slot 11 and the second pin slot 21 are arranged in multiple sets of equidistant linear arrangement, so that the device can match chips with different numbers of pins.

[0031] During the initial chip positioning, the two first frames 1 on both sides are pushed closer to each other. The first frames 1 push the two second frames 2 closer to each other through the connecting rod 13 until the first frames 1 and the second frames 2 are both in contact with the side wall of the chip. This allows the device to adapt to chips of different sizes within a certain range. Compared with the fixed-specification packaging frames of the existing technology, this device can quickly match the product size without changing the mold, reducing costs while improving chip manufacturing efficiency.

[0032] After the chip is positioned, such as Figure 3 As shown, the baffle 3 is flipped downwards, so that it flips to a horizontal state and abuts against the upper surface of the chip, as... Figure 5 As shown, the baffle 3 drives the limiting block 32 to insert into the limiting groove 51 on the first slider 5. Multiple sets of limiting blocks 32 and limiting grooves 51 are provided to adapt to the different spacing between the first frame 1 and the second frame 2 caused by chips of different sizes. After the limiting block 32 is inserted into the limiting groove 51, it can constrain the relative displacement of the first frame 1 and the second frame 2. When the two first frames 1 tend to move away from each other, the movement of the first frame 1 is hindered by the cooperation of the limiting block 32 and the limiting groove 51. Similarly, when the two second frames 2 tend to move away from each other, the two second frames 2 pull the first frame 1 through the connecting rod 13 under the action of the connecting rod 13, so that the two first frames 1 tend to move away from each other, and are then intercepted by the limiting block 32 and the limiting groove 51 again. Compared with the packaging frame that needs to be assembled by bolt assembly in the prior art, the present invention can lock the frame by simply flipping the baffle 3. The operation is simple and quick, and no additional tools are required. After packaging, the device and the chip are fixed on the circuit board through the screw hole 14.

[0033] Meanwhile, during the process, when the limiting block 32 is inserted into the limiting groove 51, the abutting post 321 on the limiting block 32 abuts against the inclined surface 511 in the limiting groove 51, and pushes the first slider 5 to slide in the first sliding groove 12. The first slider 5 drives the first pressure plate 52 to slide slightly along the direction perpendicular to the first pin groove 11, thereby pressing the root of the chip pin to prevent the pin from being pulled by external force, which would cause the pin to break at the connection with the chip.

[0034] like Figure 4 As shown, when the baffle 3 is flipped to the horizontal state, the baffle 3 drives the locking block 31 to rotate synchronously and insert into the locking slot 41 on the second slider 4. Thus, under the cooperation of the locking slot 41 and the locking block 31, the tendency of the baffle 3 to rotate in reverse is restricted, thereby achieving the effect of locking the baffle 3 in the horizontal state and completing the process of fixing the chip to the device.

[0035] Meanwhile, when the card block 31 enters the card slot 41, the card block 31 pushes the second slider 4 to move down in the second slide groove 22 and compresses the second spring 43. The second slider 4 drives the second pressure plate 42 to move down, so that the second pressure plate 42 presses the pin in the second pin slot 21 to prevent the pin on this side from being pulled by external force, which would cause the pin to break at the connection with the chip.

[0036] Furthermore, the second slider 4 drives the receiving frame 44 to move downwards synchronously, causing the receiving frame 44 to move the chip downwards, so that the upper surface of the chip is completely within the area surrounded by the first frame 1 and the second frame 2, reducing the probability of damage to the protruding part of the chip and improving the protection effect. When it is necessary to remove the chip, simply press down the second slider 4, causing the second slider 4 to disengage the slot 41 from the block 31, thereby unlocking the baffle 3. At this time, flip the baffle 3 downwards to fully expose the chip. After the second slider 4 moves upwards to reset, the second pressure plate 42 separates from the pins. At the same time, the baffle 3 drives the limiting block 32 to disengage from the limiting groove 51, causing the first pressure plate 52 to separate from the pins. Compared with the chip removal method of the prior art that requires disassembling the packaging frame, the present invention only needs to flip the baffle 3 to simultaneously release the fixing effect of the chip and the pins. The operation is simple and quick. In addition, when the second slider 4 moves upwards to reset, it drives the receiving frame 44 to move upwards synchronously, and the receiving frame 44 drives the chip upwards, so that the chip is exposed from the area surrounded by the first frame 1 and the second frame 2, making it easy to remove the chip.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip pin protection assembly for integrated circuit manufacturing, comprising a pair of first frames (1) and a pair of second frames (2), characterized in that: The first frame (1) and the second frame (2) are connected adjacently, and the two second frames (3) slide relative to each other through the two first frames (1). Each second frame (2) has a baffle (3) rotatably connected to the top outer wall of the top of the chip. Each baffle (3) has a number of limiting blocks (32) on its outer wall. Each first frame (1) has a first sliding groove (12) on its outer wall. Each first sliding groove (12) has a first slider (5) slidably connected in its inner wall. Each first slider (5) has a limiting groove (51) on its top outer wall. (51) are all parallel to the movement direction of the second frame (2). By flipping the baffle (3), the limiting block (32) is driven to insert into the limiting groove (51), which restricts the relative movement of the first frame (1) and the second frame (2). Each second frame (2) has a receiving frame (44) that slides on its outer wall and abuts against the lower end face of the chip. Each second frame (2) is provided with an auxiliary component. After flipping the baffle (3) and driving the limiting block (32) to insert into the limiting groove (51), the baffle (3) triggers the auxiliary component. The auxiliary component drives the receiving frame (44) to move down and constrains the rotational freedom of the baffle (3).

2. The chip pin protection component for integrated circuit manufacturing according to claim 1, characterized in that: Each of the first frames (1) has a first pin slot (11) on its outer wall, and each of the first sliders (5) has a number of first pressure plates (52) on its outer wall. The first pressure plates (52) are slidably inserted into the first pin slot (11).

3. The chip pin protection component for integrated circuit manufacturing according to claim 2, characterized in that: Each of the limiting grooves (51) has a slope (511) on its bottom inner wall, and each of the limiting blocks (32) has an abutting post (321) on its outer wall that abuts against the slope (511). A first spring (53) is provided between the outer wall of each first slider (5) and the inner wall of the first slide groove (12).

4. A chip pin protection component for integrated circuit manufacturing according to claim 1, characterized in that: The auxiliary components include a second slider (4), a second groove (22) is provided on the outer wall of each second frame (2), a second slider (4) is slidably connected in each second groove (22), a slot (41) is provided on the top outer wall of each second slider (4), and a block (31) adapted to the slot (41) is provided on the outer wall of each baffle (3) near the rotating shaft.

5. A chip pin protection component for integrated circuit manufacturing according to claim 4, characterized in that: A second spring (43) is provided between the outer wall of each second slider (4) and the inner wall of the second groove (22), and each second slider (4) is fixedly connected to the support frame (44).

6. A chip pin protection component for integrated circuit manufacturing according to claim 4, characterized in that: Each of the second frames (2) has a second pin slot (21) on its outer wall, and each of the second sliders (4) has a second pressure plate (42) on its outer wall. The second pressure plate (42) is slidably inserted into the second pin slot (21).

7. A chip pin protection component for integrated circuit manufacturing according to claim 6, characterized in that: Each of the baffles (3) has a clearance groove (33) on its outer wall, and the clearance groove (33) is aligned with the second pin groove (21).

8. A chip pin protection component for integrated circuit manufacturing according to claim 1, characterized in that: Each of the first frames (1) is rotatably connected to a connecting rod (13) at one end, and the end of each connecting rod (13) away from the first frame (1) is rotatably connected to the end of the second frame (2). Each of the first frames (1) has a screw hole (14) on its outer wall.

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