An integrated circuit inductive component, a method of manufacturing the same, and an electronic device

Abstract

The application provides an integrated circuit inductance component, a preparation method thereof and an electronic device. The integrated circuit inductance component comprises an inductance, and a ceramic diaphragm is formed on the outer surface of the inductance. The ceramic diaphragm is formed on the outer surface of the inductance, which is beneficial to reducing the area occupied by the component, simplifying the structure of the component, saving the mounting step, simplifying the manufacturing process, facilitating the formation of an electrically connecting layer, enabling the electrically connecting layer to be well connected with a bare chip, improving the heat dissipation effect of the inductance, and making the integrated circuit inductance component have high practical value.

Description

Technical Field

[0001] This invention belongs to the field of electronic equipment technology, specifically relating to an integrated circuit inductor, its preparation method, and an electronic device. Background Technology

[0002] An inductor is a component that can convert electrical energy into magnetic energy and store it. An inductor has a certain inductance, which only impedes changes in current. If there is no current flowing through the inductor, it will try to impede the current when the circuit is turned on; if there is current flowing through the inductor, it will try to maintain the current when the circuit is turned off.

[0003] As the power of electronic devices continues to increase and their size continues to decrease, the application space of various components in electronic devices is becoming more and more compact. How to reduce the board area occupied by inductor components has been a problem that the industry has been researching. In the existing technology, the inductor is mounted on the top and bottom of the printed circuit board, and then the chip and other components are mounted on one side of the printed circuit board. However, the existing technology has a complex structure, cumbersome process, and poor heat dissipation of the inductor.

[0004] Therefore, simplifying processes and device structures, and improving the heat dissipation of inductors are urgent technical problems that need to be solved. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide an integrated circuit inductor, its fabrication method, and an electronic device thereof. The present invention forms a ceramic film on the outer surface of the inductor, which simplifies the device structure, eliminates the mounting step, simplifies the manufacturing process, and facilitates the formation of an electrical connection layer, enabling good electrical connection between the inductor and the bare chip (power device). It also improves the inductor's heat dissipation, giving the integrated circuit inductor strong practical value.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides an integrated circuit inductor device, the integrated circuit inductor device including an inductor, wherein a ceramic diaphragm is formed on the outer surface of the inductor.

[0008] The inductor includes a magnet and a wire winding embedded inside the magnet.

[0009] In existing technologies, inductors are mounted on printed circuit boards (PCBs), and chips and other components are then mounted on one side of the PCB. This approach has the following disadvantages: 1) Double-sided mounting requires high coplanarity of the inductor electrodes; 2) PCBs are generally made of polymer materials with poor thermal conductivity, affecting inductor heat dissipation; 3) Power pins and / or signal pins need to be mounted separately on the inductor, which is complex and results in low mounting yield. Furthermore, this mounting method leads to a larger integrated inductor component size, and the spacing between the inductor and other mounted components during mounting results in a large board area occupied.

[0010] Therefore, the present invention forms a ceramic film on the outer surface of the inductor, which not only helps to reduce the volume of the integrated inductor components, reduce the board area, and simplify the device structure, but also eliminates the mounting step, simplifies the manufacturing process, and facilitates the formation of an electrical connection layer, enabling it to achieve good electrical connection with other electrical components, such as bare chips (power devices). At the same time, it also improves the heat dissipation effect of the inductor components and power devices, making the integrated inductor components highly practical.

[0011] Preferably, an insulating material is formed between the magnetic powder particles of the magnet. Examples include silicon dioxide or aluminum oxide.

[0012] In this invention, the purpose of introducing insulating material is to reduce eddy current losses, improve magnetic properties, and also to bind and fix magnetic powder particles, thereby extending service life.

[0013] Preferably, the ceramic diaphragm is formed on the outer surface of the inductor by sintering; the melting point of the insulating material is greater than or equal to the forming temperature of the ceramic diaphragm.

[0014] In this embodiment of the invention, a ceramic diaphragm is formed on the outer surface of the inductor by sintering, which allows the ceramic diaphragm to be directly connected to the inductor. This reduces the thermal resistance between the ceramic diaphragm and the inductor, and increases the heat dissipation of the inductor components and the power devices connected to the ceramic diaphragm. Furthermore, the ceramic diaphragm and the inductor can interlock on the connection surface, meaning that the ceramic diaphragm can partially fill the gaps between the magnetic powder particles on the inductor, forming a wave-like shape. This increases the connection strength between the ceramic diaphragm and the inductor, improving the stability and reliability of the structure.

[0015] Preferably, the ceramic diaphragm comprises a top ceramic diaphragm, a middle ceramic diaphragm, and a bottom ceramic diaphragm stacked together, wherein the inductor is disposed within the middle ceramic diaphragm; through holes are respectively formed at both ends of the top ceramic diaphragm, the middle ceramic diaphragm, and the bottom ceramic diaphragm for setting power and / or signal pins; a metallized through hole is formed on the bottom ceramic diaphragm, and the lead-out end of the inductor's wire winding is connected to an external electrode through the metallized through hole.

[0016] This invention utilizes multiple layers of ceramic diaphragms to embed the inductor within the diaphragms, while using through-holes in the ceramic diaphragms to house power and / or signal pins. This not only reduces the size of the integrated inductor component, thus minimizing its board footprint, but also simplifies the device structure, eliminates the need for mounting, simplifies the manufacturing process, and improves inductor heat dissipation. Furthermore, it allows bare chips to be directly integrated onto the inductor's conductive windings, shortening the electrical connection between the bare chip and the inductor, reducing resistance, and giving this integrated circuit inductor component significant practical value. In this invention, using through-holes in the ceramic diaphragms to house power and / or signal pins helps reduce the size of the inductor component and enhances its practical value.

[0017] Preferably, the top ceramic film, the middle ceramic film, and the bottom ceramic film are all LTCC ceramic sheets.

[0018] It should be noted that LTCC refers to Low Temperature Co-fired Ceramic.

[0019] Preferably, the number of layers of the surface ceramic film and the bottom ceramic film is at least one, for example, two, three, four or six layers, and preferably at least two layers.

[0020] Preferably, the middle ceramic film has at least 5 layers, such as 5, 6, 7 or 8 layers.

[0021] Preferably, the height of the middle ceramic diaphragm is the same as the height of the inductor.

[0022] In this invention, the appropriate inductor height allows the inductor to be completely embedded inside the integrated circuit inductor component, which helps reduce electromagnetic interference, enhances inductor performance, and also helps enhance mechanical stability, saves space, and enables the integrated circuit to integrate more components in a limited area, thereby increasing integration and meeting the requirements of modern electronic products for miniaturization and multifunctionality.

[0023] Preferably, the power supply and / or signal pins are made of a metallic material. Examples include silver, copper, or gold.

[0024] Preferably, the number of through holes at any end of the top ceramic film, the middle ceramic film, and the bottom ceramic film is at least two, for example, two, three, four, five, or six, etc.

[0025] Preferably, the metallized via is filled with a conductive material. Examples include silver, copper, or gold.

[0026] Preferably, the wire winding embedded inside the magnet has a U-shaped structure or a Z-shaped structure.

[0027] Preferably, the material of the magnet includes any one or a combination of at least two of Fe-Si, Fe-Si-Al, Fe-Si-Cr or Fe-Ni.

[0028] Preferably, the magnet comprises an amorphous soft magnetic alloy and / or a nanocrystalline soft magnetic alloy.

[0029] Preferably, the conductor winding is a metal conductor.

[0030] Preferably, the metal wire is made of copper and / or aluminum.

[0031] In a second aspect, the present invention provides a method for fabricating an integrated circuit inductor as described in the first aspect, the method comprising the following steps:

[0032] Fabrication of inductors.

[0033] A ceramic film substrate is deposited on the outer surface of the inductor, and then sintered to obtain the integrated circuit inductor device.

[0034] Preferably, the preparation method includes the following steps:

[0035] (1) Prepare an inductor, the inductor comprising a magnet and a wire winding embedded inside the magnet.

[0036] (2) Prepare the top layer ceramic film, the middle layer ceramic film and the bottom layer ceramic film, and stack them according to the design structure. In the process of stacking the middle layer ceramic film, an inductor is added so that the inductor is embedded in the ceramic film to form a stack.

[0037] (3) The stacked body is pressed, sintered and post-processed to obtain the integrated circuit inductor.

[0038] The preparation method provided by this invention is simple in process and low in cost, and has extremely high practical value.

[0039] Preferably, the inductor is prepared by a co-firing method, specifically including the following steps:

[0040] (a) Mix the soft magnetic metal powder and the passivating agent to obtain the magnet pre-material.

[0041] (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding.

[0042] (c) The inductor is obtained by sequentially performing compaction molding and co-firing.

[0043] In this invention, the inductor prepared by the co-firing method is itself insulating and does not require an additional insulating layer.

[0044] Preferably, the passivating agent in step (a) comprises any one or a combination of at least two of oxalic acid, nitric acid, or aluminum trifluoroacetylpyruvate.

[0045] In this invention, the passivating agent is added to improve the insulation performance of the soft magnetic metal powder and reduce eddy current losses between powder particles.

[0046] Preferably, the mass ratio of the metal soft magnetic powder to the passivating agent is 100:(0.05-1), for example, it can be 100:0.05, 100:0.1, 100:0.3, 100:0.5, 100:0.7, 100:0.9 or 100:1, etc.

[0047] In this invention, if the amount of passivating agent is too small, the surface of the powder may not be sufficiently passivated; if the amount is too large, it may have adverse effects in the subsequent sintering process, such as forming too much non-magnetic phase and reducing magnetic permeability.

[0048] Preferably, a coating agent is added during the mixing process in step (a), the coating agent including fluorosilicone resin or titanium trifluoride.

[0049] In this invention, the role of adding a coating agent is to further improve the insulation and dispersibility of the soft magnetic metal powder, thereby achieving insulation between the inductor and the external environment and other components.

[0050] Preferably, the amount of the coating agent added accounts for 0.5-10% of the mass of the metal soft magnetic powder, for example, it can be 0.5%, 1%, 3%, 5%, 7%, 9% or 10%, etc.

[0051] Preferably, the temperature of the co-firing treatment in step (c) is 600-850℃, for example, 600℃, 650℃, 700℃, 750℃, 800℃ or 850℃, and the time is 0.5-2h, for example, 0.5h, 1h, 1.5h or 2h.

[0052] Preferably, the ceramic film substrate has an electrode pattern.

[0053] Preferably, the method for preparing the ceramic membrane substrate includes:

[0054] The ceramic raw sheet is perforated, printed, and filled with slurry to obtain the ceramic film substrate.

[0055] Preferably, the pressing pressure is 250-350 MPa, for example, it can be 250 MPa, 300 MPa or 350 MPa.

[0056] Preferably, the sintering temperature is 690-730℃, for example, 690℃, 700℃, 710℃, 720℃ or 730℃, and the time is 0.5-1.5h, for example, 0.5h, 1h or 1.5h.

[0057] Preferably, the top ceramic film sheet, the middle ceramic film sheet, and the bottom ceramic film sheet all have electrode patterns.

[0058] Preferably, the preparation method includes the following steps:

[0059] (1) Fabrication of the inductor, the specific steps include:

[0060] (a) Mixing a soft magnetic metal powder with a passivating agent to obtain a magnet pre-material; wherein the passivating agent includes any one or a combination of at least two of oxalic acid, nitric acid or aluminum trifluoroacetylpyruvate.

[0061] (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding.

[0062] (c) The inductor is obtained by sequentially compacting and co-firing; wherein the co-firing temperature is 600-850℃ and the time is 0.5-2h.

[0063] (2) Using ceramic raw sheets to open holes, print and fill with slurry, respectively, to obtain surface ceramic film raw sheets, middle ceramic film raw sheets and bottom ceramic film raw sheets.

[0064] The top ceramic film, middle ceramic film, bottom ceramic film, and inductor are stacked according to the designed structure. The inductor is added during the stacking of the middle ceramic film, so that the inductor is embedded in the middle ceramic film to form a stack. The top, middle, and bottom ceramic film have through holes at both ends for setting the power and signal pins. The bottom ceramic film has metallized through holes, and the lead-out end of the inductor's wire winding is connected to the external electrode through the metallized through holes.

[0065] (3) The stacked body is pressed under 250-350MPa conditions, and then sintered at 690-730℃ for 0.5-1.5h. After the sintering is completed, the stacked body is cut, ground and packaged to obtain the integrated circuit inductor.

[0066] Thirdly, the present invention provides an electronic device, the electronic device comprising the integrated circuit inductor element as described in the first aspect.

[0067] The numerical range described in this invention includes not only the point values ​​listed above, but also any point values ​​within the numerical ranges not listed above. Due to space limitations and for the sake of brevity, this invention will not exhaustively list all the specific point values ​​included in the range.

[0068] Compared with the prior art, the present invention has the following beneficial effects:

[0069] (1) The present invention forms a ceramic film on the outer surface of the inductor, which not only helps to reduce the volume of integrated inductor components, reduce the board area, and simplify the device structure, but also facilitates the formation of an electrical connection layer, enabling it to achieve good electrical connection with other electrical components, such as power devices. At the same time, it also improves the heat dissipation effect of the inductor components and power devices.

[0070] (2) The present invention uses multiple layers of ceramic diaphragms to embed the inductor inside the ceramic diaphragm, and uses the through holes opened on the ceramic diaphragm as power and signal pins. This not only helps to reduce the size of the inductor components, allowing the bare chip to be directly integrated onto the conductive winding of the inductor, reducing the board area, but also the integrated circuit inductor components have strong practical value and low cost. Attached Figure Description

[0071] Figure 1 This is a schematic diagram of the cross-sectional structure of the integrated circuit inductor provided by the present invention.

[0072] Figure 2 This is a top view of the integrated circuit inductor component provided by the present invention.

[0073] Figure 3 A schematic diagram of the cross-sectional structure of the inductor provided by the present invention.

[0074] Among them, 1-top ceramic diaphragm; 2-middle ceramic diaphragm; 3-bottom ceramic diaphragm; 4-magnet; 5-wire winding; 6-power and / or signal pin; 7-metallized via. Detailed Implementation

[0075] The technical solution of the present invention will be further illustrated below through specific embodiments. Those skilled in the art should understand that the embodiments described are merely illustrative of the present invention and should not be construed as limiting the invention in any way.

[0076] Example 1

[0077] This embodiment provides an integrated circuit inductor component, the cross-sectional structural schematic diagram and top view of which are shown below. Figure 1 and Figure 2 As shown, the integrated circuit inductor component includes a top ceramic film 1, a middle ceramic film 2, and a bottom ceramic film 3 stacked together. An inductor is disposed within the middle ceramic film 2, and its cross-sectional structure is shown in the figure. Figure 3 As shown, the inductor includes a magnet 4 and a wire winding 5 embedded inside the magnet 4; wherein, the magnet 4 is made of Fe-Ni material, the wire winding 5 has a U-shaped structure, the wire winding 5 is a metal wire, and the material is copper.

[0078] The top ceramic film 1, the middle ceramic film 2, and the bottom ceramic film 3 each have 5 through holes at both ends for setting power and / or signal pins 6; the bottom ceramic film 3 has metallized through holes 7, and the lead-out end of the inductor's wire winding is connected to the external electrode through the metallized through holes 7.

[0079] The top ceramic film 1, the middle ceramic film 2, and the bottom ceramic film 3 are all LTCC ceramic films; the top ceramic film 1 and the bottom ceramic film 3 each have 2 layers, the middle ceramic film 2 has 5 layers, and the layer height of the middle ceramic film 2 is the same as the height of the inductor; the material of the power supply and / or signal pin 6 is silver; the metallized via 7 is filled with a conductive material, which is silver.

[0080] This embodiment also provides a method for fabricating the above-mentioned integrated circuit inductor component, the method comprising the following steps:

[0081] (1) Fabrication of the inductor, the specific steps include:

[0082] (a) Fe-Ni soft magnetic powder and passivating agent are mixed to obtain magnet pre-material; wherein the passivating agent is a mixed solution of oxalic acid and nitric acid with a mass ratio of 1:1, and the mass ratio of Fe-Ni soft magnetic powder to passivating agent is 100:0.5.

[0083] The magnet feedstock includes soft magnetic powder and a passivation layer formed on the surface of the soft magnetic powder.

[0084] (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding.

[0085] (c) The inductor is obtained by sequentially performing compaction molding and co-firing treatment; wherein the compaction molding pressure is 18MPa, the co-firing temperature is 700℃, and the time is 1h.

[0086] (2) Using ceramic raw sheets to open holes, print and fill slurry, two-layer ceramic film sheets with electrode patterns, five-layer middle ceramic film sheets and two-layer bottom ceramic film sheets are obtained respectively.

[0087] The prepared top ceramic film, middle ceramic film, bottom ceramic film and the inductor are stacked according to the design structure, and the inductor is embedded in the middle ceramic film during the stacking process to form a stack.

[0088] It should be noted that electrode patterns can be formed on the top, middle, and bottom ceramic film sheets through opening, printing, and slurry filling to achieve electrical connections between ceramic films and / or electrical connections between inductor winding 5 and external electrodes. The electrode patterns can be adaptively adjusted according to the actual application's inductor winding 5 configuration, the lead wires of inductor winding 5, the types of other electrical components connected to the ceramic film, and the connection positions of other electrical components on the ceramic film. For example, openings can form holes in the middle ceramic film sheet to accommodate the inductor; printing can form an electrical connection layer for electrical connections with other devices and / or windings; and openings and slurry filling can be used to form power and / or signal pins 6. Figure 1 Only a portion of the electrode pattern is shown. The electrical connection layer for connecting to other electrical components is not shown. The electrical connection layer can be connected to power and / or signal pins 6 and inductor windings 5 ​​as needed by the circuit.

[0089] (3) The stacked body is pressed under a pressure of 300 MPa and then sintered at 710°C for 1 hour.

[0090] After step (3) above is completed, holes are drilled according to the output position of the inductor winding 5, and metallized to form a metallized through hole 7 that is electrically connected to the lead-out end of the conductor winding 5. Of course, the metallized through hole 7 can also be formed by pre-drilling holes and filling during the preparation of the ceramic film substrate and then sintering.

[0091] After step (3) above is completed, cutting, grinding and packaging can be performed to obtain integrated circuit inductor components.

[0092] When multiple integrated circuit inductor components are formed after lamination and sintering, for example, multiple receiving holes are formed on the middle ceramic film 2, each containing an inductor, and / or power and / or signal pins 6 are formed around each inductor; or when a single integrated circuit inductor component is needed; or when adjusting the edge material, cutting, grinding, and other processes can be performed. When it is necessary to connect other electronic devices (e.g., chips, bare chips, resistors, and capacitors) to the ceramic film and package them, a packaging process can also be performed. For example, other electronic devices can be electrically connected to the circuit pattern on the surface ceramic film 1, then the other electronic devices are packaged, and finally cutting, grinding, and other processes are performed. Example 2

[0093] This embodiment provides an integrated circuit inductor device, which includes a top ceramic film, a middle ceramic film, and a bottom ceramic film stacked together. An inductor is disposed within the middle ceramic film. The inductor includes a magnet and a wire winding embedded inside the magnet. The magnet is made of Fe-Ni material, and the wire winding has a U-shaped structure and is made of copper metal wire.

[0094] The top ceramic film, the middle ceramic film, and the bottom ceramic film each have five through holes at both ends for setting power and / or signal pins; the bottom ceramic film has metallized through holes, and the lead-out end of the inductor's wire winding is connected to the external electrode through the metallized through holes.

[0095] The top ceramic film, middle ceramic film, and bottom ceramic film are all LTCC ceramic wafers; the top and bottom ceramic films each have 2 layers, the middle ceramic film has 5 layers, and the height of the middle ceramic film is the same as the height of the inductor; the power and / or signal pins are made of copper; the metallized vias are filled with a conductive material, which is copper.

[0096] This embodiment also provides a method for fabricating the above-mentioned integrated circuit inductor component, the method comprising the following steps:

[0097] (1) Fabrication of the inductor, the specific steps include:

[0098] (a) Fe-Ni soft magnetic powder and passivating agent are mixed to obtain magnet pre-material; wherein the passivating agent is a mixed solution of oxalic acid and nitric acid with a mass ratio of 1:1, and the mass ratio of Fe-Ni soft magnetic powder to passivating agent is 100:0.1.

[0099] (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding.

[0100] (c) The inductor is obtained by sequentially performing compaction molding and co-firing treatment; wherein the compaction molding pressure is 14MPa, the co-firing temperature is 600℃, and the time is 0.5h.

[0101] (2) Using ceramic raw sheets to open holes, print and fill slurry, two-layer ceramic film sheets with electrode patterns, five-layer middle ceramic film sheets and two-layer bottom ceramic film sheets are obtained respectively.

[0102] The prepared top ceramic film, middle ceramic film, bottom ceramic film and the inductor are stacked according to the design structure, and the inductor is embedded in the middle ceramic film during the stacking process to form a stack.

[0103] (3) The stacked body is pressed under a pressure of 250MPa, and then sintered at 690℃ for 1.5h. After the sintering is completed, it is cut, ground and packaged to obtain the integrated circuit inductor.

[0104] Example 3

[0105] This embodiment provides an integrated circuit inductor device, which includes a top ceramic film, a middle ceramic film, and a bottom ceramic film stacked together. An inductor is disposed within the middle ceramic film. The inductor includes a magnet and a wire winding embedded inside the magnet. The magnet is made of Fe-Ni material, and the wire winding has a Z-shaped structure and is made of copper metal wire.

[0106] The top ceramic film, the middle ceramic film, and the bottom ceramic film each have five through holes at both ends for setting power and / or signal pins; the bottom ceramic film has metallized through holes, and the lead-out end of the inductor's wire winding is connected to the external electrode through the metallized through holes.

[0107] The top ceramic film, middle ceramic film, and bottom ceramic film are all LTCC ceramic wafers; the top and bottom ceramic films each have 2 layers, the middle ceramic film has 5 layers, and the height of the middle ceramic film is the same as the height of the inductor; the power and / or signal pins are made of gold; the metallized vias are filled with a conductive material, which is gold.

[0108] This embodiment also provides a method for fabricating the above-mentioned integrated circuit inductor component, the method comprising the following steps:

[0109] (1) Fabrication of the inductor, the specific steps include:

[0110] (a) Fe-Ni soft magnetic powder and passivating agent are mixed to obtain magnet pre-material; wherein the passivating agent is a mixed solution of oxalic acid and nitric acid in a mass ratio of 1:1, and the mass ratio of Fe-Ni soft magnetic powder to passivating agent is 100:1.

[0111] (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding.

[0112] (c) The inductor is obtained by sequentially performing compaction molding and co-firing treatment; wherein the compaction molding pressure is 22MPa, the co-firing temperature is 850℃, and the time is 2h.

[0113] (2) Using ceramic raw sheets to open holes, print and fill slurry, two-layer ceramic film sheets with electrode patterns, five-layer middle ceramic film sheets and two-layer bottom ceramic film sheets are obtained respectively.

[0114] The prepared top ceramic film, middle ceramic film, bottom ceramic film and the inductor are stacked according to the design structure, and the inductor is embedded in the middle ceramic film during the stacking process to form a stack.

[0115] (3) The stacked body is pressed under a pressure of 350MPa, and then sintered at 730°C for 0.5h. After the sintering is completed, it is cut, ground and packaged to obtain the integrated circuit inductor.

[0116] Example 4

[0117] The difference between this embodiment and Embodiment 1 is that, in step (a), a coating agent is added during the mixing of the Fe-Ni soft magnetic powder and the passivating agent. The coating agent is fluorosilicone resin, and the amount of coating agent added accounts for 5% of the mass of the Fe-Ni soft magnetic powder. It can be understood that the above-mentioned insulating material is obtained by co-firing the coating agent during the preparation of the inductor.

[0118] The remaining preparation methods and parameters are consistent with those in Example 1.

[0119] Example 5

[0120] The difference between this embodiment and Embodiment 1 is that co-firing is not performed in step (c), but rather the co-firing of the inductor and the ceramic film substrate is achieved during the sintering process of the stack in step (3). It is understood that when a coating agent is added during the mixing of the soft magnetic powder and the passivator, at least part of the coating agent and the ceramic film substrate can form a single unit after co-firing at the contact point between the inductor green body and the ceramic film substrate.

[0121] The remaining preparation methods and parameters are consistent with those in Example 1.

[0122] It should be noted that in the above embodiments, the integrated circuit inductor components are described as including a top ceramic film, a middle ceramic film, and a bottom ceramic film stacked together, with an inductor disposed within the middle ceramic film, and through-holes provided in the ceramic film for hosting power and / or signal pins. However, in some other embodiments, the integrated circuit inductor components may only include a top ceramic film and / or a bottom ceramic film, excluding the middle ceramic film to expose the sides of the inductor. The power and / or signal pins can be formed independently and then assembled onto the sides of the inductor. For example, a top ceramic film is formed on the upper surface of the inductor, and the projection of the top ceramic film onto the upper surface of the inductor does not exceed the boundary of the upper surface. The inductor windings may be U-shaped, all exiting from the bottom of the inductor (see...). Figure 3 The inductor has a surface ceramic film formed on its upper surface, and an electrode pattern is formed on the outer surface of the surface ceramic film for electrical connection with other devices. Power and / or signal pins can be independently formed and assembled on the side of the inductor and can be electrically connected to the electrode pattern. The surface ceramic film near the inductor may also be partially magnetic to provide electromagnetic shielding for the inductor and other devices connected to the electrode pattern.

[0123] Alternatively, in some other embodiments, the integrated circuit inductor may consist only of a middle ceramic diaphragm, excluding the top ceramic diaphragm and / or the bottom ceramic diaphragm. That is, the location of the ceramic diaphragm on the inductor can be adapted to the inductor's leads, the arrangement of other electronic components, and the operating environment of the integrated circuit inductor.

[0124] It should be noted that the ceramic diaphragm arrangement in the above embodiments is only an example and does not limit the arrangement of the ceramic diaphragm. The ceramic diaphragm can be arranged in any way on the outer surface of the inductor, such as embedding the inductor in a stacked manner, winding the ceramic diaphragm around the outer surface of the inductor, or spraying the ceramic diaphragm on the outer surface of the inductor in the form of a thin film.

[0125] It is understood that, based on the above embodiments, the inductor is not formed by co-firing in one piece. For example, as an example, after step (a) of preparing the inductor in Embodiment 1, the magnet preform is directly placed in the mold, and then compacted and co-fired. That is, the inductor can be composed of multiple separate magnets and windings. By directly sintering the ceramic film onto one of the magnets of the inductor, it can be subsequently assembled with the remaining magnets and windings to form an integrated circuit inductor device.

[0126] Furthermore, it is understandable that when other electrical components are also encapsulated and connected on the ceramic diaphragm, the magnet with the other encapsulated electrical components can be directly assembled with the remaining magnet and windings to form an integrated circuit inductor component.

[0127] Furthermore, it can be understood that a ceramic diaphragm is sintered onto a magnet according to predetermined rules, and multiple sets of other electrical components are electrically connected and encapsulated on the ceramic diaphragm. Each set of other electrical components includes at least one of, for example, a chip, a bare chip, a resistor, a capacitor, etc. (the types and arrangements of electrical components in each set can be the same or different). Then, the magnet is cut along the boundaries of each set of other electrical components to obtain a unit magnet integrating the ceramic diaphragm and the encapsulated electrical components. Corresponding magnets and windings that cooperate with the unit magnet are prepared. Finally, the unit magnet, corresponding magnets, and windings are combined to form an integrated circuit inductor.

[0128] Furthermore, it can be understood that a ceramic diaphragm is sintered onto the first surface of the first magnet according to predetermined rules, and multiple sets of other electrical components are electrically connected and encapsulated on the ceramic diaphragm. Each set of other electrical components contains the same type and arrangement of components (e.g., each set may include switching modules and capacitors of the same size and number). Then, the magnet is cut along the boundaries of each set of other electrical components to obtain a first unit magnet integrating the ceramic diaphragm and encapsulated electrical components. A ceramic diaphragm is sintered onto the third surface of the second magnet according to certain rules, and multiple sets of other electrical components are electrically connected on the ceramic diaphragm. Each set of other electrical components contains the same type and arrangement of components (e.g., each set may include capacitors and / or resistors of the same size and number). Then, the magnet is cut along the boundaries of each set of electrical components to obtain a second unit magnet integrating the ceramic diaphragm and electrical components. A winding is prepared and sandwiched between the second surface of the first unit magnet and the fourth surface of the second unit magnet to form an integrated circuit inductor component. In this design, the second surface of the first unit magnet is opposite to the first surface of the first unit magnet, and the fourth surface of the second unit magnet is opposite to the third surface of the second unit magnet. Neither the second nor the fourth surface has an integrated ceramic diaphragm.

[0129] Comparative Example 1

[0130] This embodiment provides an integrated circuit inductor component, including an inductor mounted on a stack consisting of a top ceramic film, a middle ceramic film, and a bottom ceramic film. The inductor has four pins connected to the pads of the stack.

[0131] As can be seen from the comparison between Example 1 and Comparative Example 1, if the inductor is set by surface mounting, the inductor component is large in size, and there is a gap between the inductor component and other mounted components, resulting in a large board area occupied by the mounting, and poor inductance value, quality factor, DC resistance and saturation current, resulting in low mounting yield.

[0132] In summary, this invention utilizes multiple layers of ceramic diaphragms to embed the inductor within the diaphragms, while using through-holes in the ceramic diaphragms as power and / or signal pins. This not only reduces the size of the inductor component, allowing bare chips to be directly integrated onto the inductor's conductive windings, reducing board area, simplifying the device structure, eliminating mounting steps, and simplifying the manufacturing process, but also improves the inductor's heat dissipation, making this integrated circuit inductor component highly practical. Furthermore, it exhibits excellent performance, with significant improvements in inductance, quality factor, DC resistance, and saturation current.

[0133] The applicant declares that the present invention is illustrated by the above embodiments, but the present invention is not limited to the above process steps, that is, it does not mean that the present invention must rely on the above process steps to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions of the raw materials used in the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. An integrated circuit inductor component, characterized in that, The integrated circuit inductor component includes an inductor, and a ceramic diaphragm is formed on the outer surface of the inductor; The inductor includes a magnet and a wire winding embedded inside the magnet.

2. The integrated circuit inductor component according to claim 1, characterized in that, An insulating material is formed between the magnetic powder particles of the magnet; Preferably, the ceramic diaphragm is formed on the outer surface of the inductor by sintering; the melting point of the insulating material is greater than or equal to the forming temperature of the ceramic diaphragm. Preferably, the ceramic diaphragm comprises a top ceramic diaphragm, a middle ceramic diaphragm, and a bottom ceramic diaphragm stacked together, wherein the inductor is disposed within the middle ceramic diaphragm; The top ceramic film, the middle ceramic film, and the bottom ceramic film are each provided with through holes at both ends for setting power pins and / or signal pins. Preferably, the bottom ceramic diaphragm and / or the top ceramic diaphragm are provided with metallized through holes, and the lead-out end of the inductor's wire winding is connected to the external electrode through the metallized through holes.

3. The integrated circuit inductor component according to claim 2, characterized in that, The top ceramic film, the middle ceramic film, and the bottom ceramic film are all LTCC ceramic films; Preferably, the number of layers of the surface ceramic film and the bottom ceramic film is at least one, and more preferably at least two. Preferably, the middle ceramic film has at least 5 layers; Preferably, the height of the middle ceramic diaphragm is the same as the height of the inductor; Preferably, the power supply pins and / or signal pins are made of a metallic material; Preferably, the number of through holes at any end of the top ceramic film, the middle ceramic film, and the bottom ceramic film is at least two. Preferably, the metallized through-hole is filled with a conductive material.

4. The integrated circuit inductor component according to any one of claims 2 or 3, characterized in that, The wire windings embedded inside the magnet have a U-shaped or Z-shaped structure. Preferably, the material of the magnet includes any one or a combination of at least two of Fe-Si, Fe-Si-Al, Fe-Si-Cr or Fe-Ni; Preferably, the conductor winding is a metal conductor; Preferably, the metal wire is made of copper and / or aluminum.

5. A method for fabricating an integrated circuit inductor as described in any one of claims 1-4, characterized in that, The preparation method includes the following steps: Fabricating an inductor, the inductor comprising a magnet and a wire winding embedded inside the magnet; A ceramic film substrate is deposited on the outer surface of the inductor, and then sintered to obtain the integrated circuit inductor device.

6. The preparation method according to claim 5, characterized in that, The inductor is prepared by a co-firing method, and the specific steps include: (a) Mixing soft magnetic metal powder and passivating agent to obtain magnet pre-material; (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding; (c) The inductor is obtained by sequentially performing compaction molding and co-firing.

7. The preparation method according to claim 6, characterized in that, The passivating agent in step (a) includes any one or a combination of at least two of oxalic acid, nitric acid, or aluminum trifluoroacetylpyruvate; Preferably, a coating agent is added during the mixing process in step (a), the coating agent including fluorosilicone resin or titanium trifluoride; Preferably, the co-firing process in step (c) is carried out at a temperature of 600-850°C for 0.5-2 hours.

8. The preparation method according to any one of claims 5-7, characterized in that, The ceramic film substrate has an electrode pattern; Preferably, the method for preparing the ceramic membrane substrate includes: The ceramic raw sheet is perforated, printed, and filled with slurry to obtain the ceramic film substrate; Preferably, the sintering temperature is 690-730℃ and the time is 0.5-1.5h.

9. The preparation method according to any one of claims 5-8, characterized in that, The preparation method includes the following steps: (1) Fabrication of the inductor, the specific steps include: (a) Mixing a soft magnetic metal powder with a passivating agent to obtain a magnet pre-material; wherein the passivating agent includes any one or a combination of at least two of oxalic acid, nitric acid, or aluminum trifluoroacetylpyruvate; (b) The magnet preform is placed in a mold with a wire winding, such that the magnet preform covers the wire winding; (c) The inductor is obtained by sequentially compacting and co-firing; wherein the co-firing temperature is 600-850℃ and the time is 0.5-2h. (2) Using ceramic raw sheets to open holes, print and fill slurry, respectively, to obtain surface ceramic film raw sheets, middle ceramic film raw sheets and bottom ceramic film raw sheets; The top ceramic film, the middle ceramic film, the bottom ceramic film, and the inductor are stacked according to the designed structure. An inductor is added during the stacking of the middle ceramic film, so that the inductor is embedded in the ceramic film to form a stack. (3) The stacked body is pressed under 250-350MPa conditions, and then sintered at 690-730℃ for 0.5-1.5h. After the sintering is completed, the stacked body is cut, ground and packaged to obtain the integrated circuit inductor.

10. An electronic device, characterized in that, The electronic device includes the integrated circuit inductor as described in any one of claims 1-4.

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