Flexible tamper-resistant precision positioning non-contact coupling chip strip

Abstract

The present application belongs to the chip strip technical field, especially for flexible anti-interference precise positioning non-contact coupling chip strip, including: polyimide base material, rectangular shape and as flexible base material, two layers of copper foil, respectively covered on the upper and lower two sides of polyimide base material, and through laser drilling process to form through hole, two through slots, respectively set up on the upper and lower two sides of polyimide base material, for reducing the opening depth required by through hole, inner folding edge, set in the two side edges of copper foil and in the form of inner buckle.The present application, through the through slot opened on the upper and lower two sides of polyimide base material, and using copper foil to cover the base material to form the groove corresponding to the through slot and horizontal arc slot, so that the electronic components such as chip, antenna coil can be installed in the groove, so as to realize the embedded layout of the components without protruding on the surface of the strip, effectively reduce the overall profile height of the strip, significantly improve the applicability and packaging compatibility of the product in the space limited scene such as ultra-thin smart card.

Description

Technical Field

[0001] This invention belongs to the field of chip strip technology, specifically relating to flexible, anti-interference, precise positioning, and non-contact coupling chip strips. Background Technology

[0002] In the current production and application of dual-interface coupling strips, the polyimide substrate commonly used has good flexibility and insulation properties, but its structure is usually a planar laminate design, and components such as chips and antennas are mostly fixed on the substrate by surface mounting or partial embedding.

[0003] This traditional mounting method causes the entire component to protrude from the substrate surface, which not only increases the overall thickness of the strip but also requires more space to be reserved in the subsequent packaging process to accommodate the protruding structure, limiting its application in scenarios such as ultra-thin smart cards where thickness is extremely sensitive.

[0004] In addition, the protruding surface of the component is prone to stress concentration points during bending, pressure or daily use, which accelerates the fatigue aging of the connection and affects the long-term stability and mechanical durability of the electrical connection.

[0005] In terms of positioning, although existing technologies can achieve macroscopic alignment by using positioning holes and vision systems, they still lack effective physical limiting structures for the precise embedding of micro-components such as chips. During high-speed mounting or multiple lamination processes, components are prone to slight amplitude shifts or tilts, which can lead to deviations in signal transmission paths and reduced antenna coupling efficiency, thereby affecting the stability and effective range of contactless communication.

[0006] At the same time, the raised surface of the components increases the risk of damage due to scratches and collisions during the manufacturing process, and poses a challenge to the flatness of subsequent processes such as lamination and printing, affecting the consistency of product appearance and performance.

[0007] Therefore, existing structures still face significant bottlenecks in achieving high-density integration, ultra-thin design, and high-reliability positioning, making it difficult to simultaneously meet the multiple requirements of being lightweight, robust, and precisely coupled. Summary of the Invention

[0008] To address the aforementioned problems in the prior art, this invention provides a flexible, anti-interference, precise positioning, non-contact coupling chip strip. This aims to solve the technical problem in the prior art where protruding surfaces of components easily become stress concentration points during card bending, pressure, or daily use, thereby accelerating fatigue aging of the connection parts and affecting the long-term stability and mechanical durability of the electrical connection.

[0009] To achieve the above objectives, the present invention provides the following technical solution: a flexible, anti-interference, precise positioning, non-contact coupling chip strip, comprising: a polyimide substrate, rectangular in shape and serving as a flexible substrate; two layers of copper foil, respectively covering the upper and lower sides of the polyimide substrate, and forming through holes through a laser drilling process; two through slots, respectively formed on the upper and lower sides of the polyimide substrate, used to reduce the required drilling depth of the through holes; an inner folded edge, provided on both sides of the copper foil and in an inwardly folded shape, the inner folded edge making the thickness of the copper foil on both sides twice that of other positions, used to limit the position of the copper foil and prevent delamination; two symmetrically formed side arc grooves on both sides of the polyimide substrate, the inner wall of the side arc grooves being glued and fixed to the surface of the inner folded edge; and abutting round parts linearly arrayed and installed on the inner wall of the side arc grooves to increase the resilience of the polyimide substrate under pressure, thereby preventing the side arc grooves from collapsing when the polyimide substrate is under pressure.

[0010] Furthermore, the cross-section of the side arc groove is in the shape of an arc that matches the inner folded edge, which is used to increase the contact area between the inner folded edge of the copper foil and the inner wall of the side arc groove.

[0011] Furthermore, the polyimide substrate has multiple transverse arc grooves linearly arrayed on its upper and lower sides. The transverse arc grooves are arc-shaped and are used to provide deformation space on the side that is subjected to force expansion when the polyimide substrate is rolled up as a whole, while the transverse arc groove on the other side provides support force.

[0012] Furthermore, when the copper foil is wrapped around the transverse arc groove of the polyimide substrate, a groove is formed.

[0013] Furthermore, the polyimide substrate has side wing plates formed on both sides by side arc grooves, and the side wing plates are rounded near the polyimide substrate to prevent contact between the two copper foils.

[0014] Furthermore, end grooves are formed at both ends of the polyimide substrate.

[0015] Furthermore, the upper and lower sides of the polyimide substrate are formed with protrusions through the through grooves and the transverse arc grooves for positioning during production.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, by opening slots on the upper and lower sides of the polyimide substrate and using copper foil to cover the substrate, grooves corresponding to the slots and transverse arc slots are naturally formed, so that electronic components such as chips and antenna coils can be installed in the grooves, thereby achieving an embedded layout in which the components do not protrude from the surface of the strip, effectively reducing the overall cross-sectional height of the strip and making its thickness controllable to below 0.2mm, significantly improving the applicability and packaging compatibility of the product in space-constrained scenarios such as ultra-thin smart cards; 2. In this invention, by linearly arraying transverse arc grooves on the surface of the polyimide substrate, when the strip is bent, the transverse arc grooves on the tension side expand to release strain, and the transverse arc grooves on the compression side contract to provide support, thereby achieving uniform stress distribution and avoiding local stress concentration. 3. In this invention, by setting an inner folded edge at the edge of the copper foil and bonding it with the side arc groove, the interface bonding strength is further enhanced, preventing the copper foil from delaminating during repeated bending, greatly increasing the dynamic bending life of the strip, and significantly improving the reliability and service life of the product. 4. In this invention, a forming protrusion with a regular contour is formed on the surface of the substrate by through groove and transverse arc groove, which provides a micro-positioning reference for the subsequent mounting of components and improves the installation position accuracy. 5. In this invention, the arc-shaped fitting design of the inner folded edge and the side arc groove increases the adhesive area and strengthens the edge bonding between the copper foil and the substrate. The abutting round parts set in the side arc groove further enhance the compressive resilience of the substrate, prevent the groove from collapsing, and ensure that the components can maintain accurate alignment and firm bonding in high-speed automated production, support high-precision alignment, and adapt to large-scale continuous production. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the present invention; Figure 2 This is an exploded view of the groove in this invention; Figure 3 This is an exploded view of the side wing plate in this invention; Figure 4 This is a three-dimensional structural diagram of the abutting circular component in this invention.

[0018] Legend: 1. Polyimide substrate; 101. Copper foil; 102. Groove; 2. Groove; 3. Inner fold; 4. Side arc groove; 5. Side wing panels; 6. End groove; 7. Form a convex part; 8. Horizontal arc groove; 9. Conflicting round parts. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1: Please see Figures 1-4 This embodiment provides the following technical solution: a flexible, anti-interference, precise positioning, non-contact coupling chip strip, comprising: a polyimide substrate 1, which is rectangular and serves as a flexible substrate; two layers of copper foil 101, which are respectively wrapped around the upper and lower sides of the polyimide substrate 1, and through holes are formed by laser drilling; two through slots 102, which are respectively opened on the upper and lower sides of the polyimide substrate 1, to reduce the opening depth required for the through holes; and inner folded edges 3, which are provided on both sides of the copper foil 101 and are inwardly folded, the inner folded edges 3 making the thickness of the two sides of the copper foil 101 twice that of other positions, to limit the position of the copper foil 101 and prevent delamination.

[0021] Specifically, the rectangular polyimide substrate 1 serves as a flexible insulating carrier and is suitable for smart card strip packaging; Two layers of copper foil 101 are completely wrapped around the upper and lower surfaces of the polyimide substrate 1, respectively, forming a double-sided circuit layer; The polyimide substrate 1 and the copper foil 101 are formed with micron-level through holes by laser drilling process to realize three-dimensional electrical interconnection between the upper and lower circuit layers; The upper and lower surfaces of the polyimide substrate 1 are provided with through grooves 102. The through grooves 102 are used to reduce the total thickness of the material to be penetrated during laser drilling, thereby reducing the difficulty of through hole processing and improving hole position accuracy and consistency. The two sides of the copper foil 101 are bent inward to form an inner folded edge 3, which increases the thickness of the edge area of ​​the copper foil 101 to twice that of other locations; The inner folded edge 3 structure is used to enhance the mechanical strength and peel resistance of the edge area after the copper foil 101 is bonded to the substrate, thereby restricting the positional movement of the copper foil 101 under bending or thermal stress and effectively preventing delamination.

[0022] Preferably, by using polyimide as a rectangular substrate and using laser drilling technology to form through holes on two layers of copper foil 101 symmetrically covering the upper and lower sides of the substrate, the main circuit architecture of the strip is established. By opening through slots 102 on the upper and lower sides of the substrate, the total penetration depth required for laser to form interlayer vias is effectively reduced, the drilling process difficulty is reduced, and the hole position accuracy and consistency are improved. Meanwhile, an inwardly folded edge 3 structure is provided on both sides of the copper foil 101, which doubles the thickness of the copper foil 101 at the edge, physically enhancing the structural strength of the edge of the copper foil 101. After being bonded to the substrate, it forms a mechanical locking effect, effectively limiting the lateral displacement and delamination tendency of the copper foil 101 during subsequent use or bending, thereby improving the reliability and durability of the overall structure.

[0023] Two symmetrical side arc grooves 4 are formed on both sides of the polyimide substrate 1, and the inner wall of the side arc groove 4 is glued to the surface of the inner folded edge 3.

[0024] Specifically, the polyimide substrate 1 has two symmetrically formed side arc grooves 4 along its two sides; The inner wall shape of the side arc groove 4 matches the outer surface of the inner folded edge 3 of the copper foil 101; The inner folded edge 3 is fixed to the inner wall of the side arc groove 4 by adhesive, thereby achieving enhanced bonding and mechanical anchoring between the edge of the copper foil 101 and the substrate, and further preventing interface delamination.

[0025] Preferably, side arc grooves 4 matching the inner folded edge 3 of copper foil 101 are formed on both sides of the polyimide substrate 1. The inner folded edge 3 of copper foil 101 is fixed to the inner wall of the side arc groove 4 by adhesive, realizing the lateral reinforcement connection between copper foil 101 and substrate. This design transforms the traditional edge plane bonding into three-dimensional curved surface fitting and bonding, which greatly increases the bonding area and mechanical interlocking effect, further consolidates the positioning of copper foil 101, and prevents it from lifting or peeling off from the edge under complex stress.

[0026] The side arc groove 4 has a cross-section that matches the inner folded edge 3, which is used to increase the contact area between the inner folded edge 3 of the copper foil 101 and the inner wall of the side arc groove 4.

[0027] Specifically, the cross-section of the side arc groove 4 is a continuous arc shape that matches the outer surface of the inner folded edge 3. This arc shape is designed to increase the contact area between the inner folded edge 3 and the inner wall of the side arc groove 4, thereby improving the adhesion range and bonding strength of the adhesive and enhancing the shear and peel resistance of the edge bond.

[0028] Preferably, the arc-shaped groove wall can achieve a larger area and tighter fit with the curved surface of the inner folded edge 3. Compared with right angle or flat contact, it not only significantly increases the adhesion area of ​​the adhesive to enhance the bonding force, but also makes the stress distribution on the curved surface more uniform, reduces local stress concentration, and thus improves the stability and life of the connection when bent or subjected to shear force.

[0029] The inner wall of the side arc groove 4 is linearly arrayed with abutting round parts 9, which are used to increase the resilience of the polyimide substrate 1 under pressure, thereby preventing the side arc groove 4 from collapsing when the polyimide substrate 1 is under pressure.

[0030] Specifically, the contact circle 9 is made of elastic material and is used to provide local elastic support when the polyimide substrate 1 is subjected to external pressure, enhance the compressive resilience of the side arc groove 4 area, prevent the area from undergoing plastic deformation or collapse due to pressure, thereby maintaining the long-term stability of the adhesive structure.

[0031] Preferably, when the strip is subjected to external pressure, these abutting round parts 9 act as miniature spring supports, providing additional elastic support to prevent the side arc groove 4 area from undergoing plastic deformation or collapse due to pressure. This ensures that the integrity of the side arc groove 4 structure and its internal bonding is restored after being subjected to pressure, maintains the long-term effectiveness of the copper foil 101 edge fixation, and improves the mechanical robustness of the product in complex usage environments.

[0032] Multiple transverse arc grooves 8 are linearly arrayed on the upper and lower sides of the polyimide substrate 1. The transverse arc grooves 8 are arc-shaped and are used to provide deformation space on the side of the transverse arc groove 8 that is subjected to force expansion when the polyimide substrate 1 is rolled up as a whole, while the transverse arc groove 8 on the other side provides support force.

[0033] Specifically, the upper and lower surfaces of the polyimide substrate 1 are linearly arrayed with multiple transverse arc grooves 8 along their width direction; The cross-section of the transverse arc groove 8 is arc-shaped and extends laterally along the surface of the substrate; When the strip bends as a whole, the transverse arc groove 8 located on the outer side of the bend and subjected to tensile stress can expand to provide deformation accommodation space, while the transverse arc groove 8 located on the inner side of the bend and subjected to compressive stress provides support through structural contraction. This design allows bending stress to be evenly distributed within the substrate, avoiding localized stress concentration, thereby significantly improving the dynamic bending fatigue life of the strip.

[0034] Preferably, when the strip is curled or bent as a whole, the transverse arc groove 8 located on the side under tensile stress can expand outward to provide deformation space to absorb strain; Meanwhile, the transverse arc groove 8, located on the other side of the compressive stress, provides support through structural contraction. This design allows the stress to be evenly distributed when the strip bends, avoiding excessive stress concentration in local areas, thereby significantly improving the dynamic bending life and fatigue resistance of the strip.

[0035] When copper foil 101 is wrapped around the transverse arc groove 8 of polyimide substrate 1, a groove 2 is formed.

[0036] Specifically, when the copper foil 101 is wrapped around the surface of the polyimide substrate 1, grooves 2 that match its contour are naturally formed at the corresponding positions of the transverse arc groove 8 and the through groove 102. The groove 2 is used to accommodate the mounted electronic components, so that the outer surface of the components is not higher than the outer surface of the copper foil 101 after installation, thereby realizing the embedded mounting structure, which helps to reduce the overall thickness of the strip and meet the packaging requirements of ultra-thin smart cards.

[0037] Preferably, when chips, antenna coils, or other electronic components are mounted using surface mount or embedded processes, they can be partially or completely accommodated within these grooves 2. This effectively reduces the overall profile height of the mounted components, creating conditions for achieving ultra-thin strip designs, such as those with a thickness of less than 0.2 mm. At the same time, the groove 2 structure also provides lateral restraint for the components, helping to improve mounting accuracy and anti-displacement capability.

[0038] Side wing plates 5 are formed on both sides of the polyimide substrate 1 through side arc grooves 4. The side wing plates 5 are rounded near the polyimide substrate 1 to prevent the two copper foils 101 from contacting each other.

[0039] Specifically, the polyimide substrate 1 forms outwardly extending side wing plates 5 by opening side arc grooves 4 on both sides of it; The edge where the side wing plate 5 connects to the main body of the substrate is set as a rounded edge structure; The side wing plate 5 and its rounded edge are designed to form a physical isolation between the upper and lower copper foils 101, preventing the edges of the two copper foils 101 from contacting under extreme bending or pressure conditions, which could lead to a short circuit. At the same time, the rounded edge transition can reduce stress concentration at this point and improve structural reliability.

[0040] Preferably, by opening side arc grooves 4 on both sides of the substrate, a structure called side wing plate 5 is naturally formed, and the edge of the side wing plate 5 near the main body of the substrate is designed as a rounded edge, which provides electrical isolation and physical protection. The side wing plate 5 and its rounded edge design form a physical isolation zone between the two upper and lower copper foils 101, which effectively prevents the edges of the upper and lower copper foils 101 from accidentally contacting each other and causing a short circuit under extreme bending or pressure. The rounded edge transition further avoids sharp corners and reduces the risk of tearing due to stress concentration at that point.

[0041] Both ends of the polyimide substrate 1 are provided with end grooves 6.

[0042] Specifically, the end groove 6 is used to provide a mechanical gripping position, tension buffer or visual recognition feature during the production process, which facilitates the traction, positioning and cutting of automated equipment, and improves the smoothness of the production process and the controllability of the process.

[0043] Preferably, end grooves 6 are formed at both ends of the polyimide substrate 1. The end groove 6 structure can serve as a process gripper, tension release area or visual recognition feature, which facilitates traction, positioning or cutting on automated production lines. It helps to reduce deformation or damage to the ends of the substrate during processing and conveying, and improves the smoothness of the production process and the yield.

[0044] The upper and lower sides of the polyimide substrate 1 have protrusions 7 formed by through grooves 102 and transverse arc grooves 8 for positioning during production.

[0045] Specifically, the polyimide substrate 1 forms regularly arranged protrusions 7 on its surface by opening through grooves 102 and transverse arc grooves 8. The protrusion 7 has a clear three-dimensional profile, which can be used as a micro-positioning reference in subsequent precision assembly processes. It can be used in conjunction with the fixtures or detection probes of automated production equipment to achieve high-precision alignment and installation of electronic components, thereby improving the positioning accuracy and consistency of the overall production.

[0046] Preferably, by creating through slots 102 and transverse arc grooves 8 on the substrate, forming protrusions 7 with specific contours are formed on the substrate surface, providing additional microscopic positioning references. These precision-machined protrusion structures can cooperate with precision fixtures of production equipment or probes of detection sensors to achieve finer local alignment and status detection than macroscopic positioning holes. This is crucial for ensuring the accurate installation of high-precision components within the grooves 2, further improving the accuracy and consistency of the entire strip production process.

[0047] Example 2: Please see Figures 1-4 In this embodiment, the staff used the equipment disclosed in this invention in a smart card manufacturer's production project for a new generation of ultra-thin dual-interface financial IC cards; To overcome the bottlenecks of limited thickness and insufficient reliability due to bending in traditional strips, its core antenna module adopts the flexible, anti-interference, precise positioning, non-contact coupling chip strip of this invention.

[0048] In practice, UPILEX-S polyimide film manufactured by Ube Industries, Ltd. of Japan was selected as the substrate and cut into standard strips, each strip measuring 150 mm in length, 35 mm in width, and 0.05 mm in thickness. First, a carbon dioxide laser was used to perform precision micromachining on the upper and lower surfaces of the substrate: at four key locations corresponding to the chip mounting and antenna coil bridging, a rectangular through-groove 102, 3 mm long, 2 mm wide, and 0.03 mm deep, was etched. Simultaneously, 34 horizontal arc-shaped grooves 8, with a cross-section radius of 0.15 mm and a depth of 0.02 mm, were linearly etched along the width direction on the substrate surface at 2 mm intervals. The processing of these grooves naturally formed regularly arranged elongated protrusions 7 on the substrate surface. Subsequently, a side arc groove 4 with a cross-section of 0.2 mm radius semicircular arc and a groove depth of 0.04 mm is punched out on each side edge of the substrate using a precision die, thereby forming a side wing plate 5 with a width of 0.8 mm on both sides of the substrate. The connection between the side wing plate 5 and the substrate body is ground into a rounded edge with a radius of 0.05 mm. On the arc-shaped inner wall of each side arc groove 4, silicone contact round parts 9 with a diameter of 0.1 mm are inserted at 0.5 mm intervals. At each end of the substrate, an end groove 6 with a length of 5 mm and a depth of 0.02 mm is machined as a process gripping position.

[0049] After substrate pretreatment, copper plating and molding are performed. Both the upper and lower layers use rolled copper foil 101 from Mitsui Metals, Japan, with a thickness of 12 micrometers each. In a vacuum hot press, the copper foil 101 is pressed onto the substrate at 175 degrees Celsius and 3.5 kg / cm². Under pressure, the copper foil 101 perfectly conforms to the microstructure of the substrate surface, precisely forming congruent grooves 2 at the corresponding positions of the through groove 102 and the transverse arc groove 8. Subsequently, in a dedicated folding mold, the two edges of the copper foil 101 are bent inwards at 180 degrees along the direction of the substrate side wing plate 5, forming tightly folded inner edges 3, resulting in a total thickness of 24 micrometers for the copper foil 101 in this edge area. The inner edges 3, coated with a small amount of Loctite 3311 UV-curable adhesive, are precisely embedded into the side arc grooves 4 of the substrate and cured with ultraviolet light to maximize adhesion of the arc surface.

[0050] Next, component installation is performed. An NXP SmartMX2 security chip with a thickness of 0.2 mm is adhered to a groove 2 formed by a through-slot 102 on the upper surface using conductive adhesive. Simultaneously, an etched copper antenna coil, with a line width of 0.15 mm and a total of six turns, is also embedded into the corresponding groove 2 network. Because the depth of groove 2 is 0.05 mm, and the chip and coil thickness, after grinding, are both 0.048 mm, the highest point of all components after installation is still slightly lower than the surrounding copper foil 101 plane by about 2 micrometers, achieving a true embedded layout. Measurements show that the overall thickness of the strip after component mounting is only 0.18 mm.

[0051] In tests simulating actual bank card use, the strip demonstrated superior performance. During dynamic bending tests at a radius of 5 mm and a rate of 60 bends per minute, the outer transverse groove 8 expanded by up to 15%, effectively releasing tensile strain; the inner transverse groove 8 uniformly contracted to provide support. The built-in silicone contact circle 9 provides approximately 0.1 Newtons of elastic support per square millimeter under pressure, ensuring no plastic collapse in the side groove 4 area after 100,000 pressure cycles. Thanks to the reinforced anchoring of the inner folded edge 3 and the side groove 4, no visible delamination occurred between the copper foil 101 and the polyimide substrate 1 after more than 500,000 bends, with a peel strength retention rate exceeding 95%. During thermal cycling from -25°C to 85°C, its antenna resonant frequency shift was less than 0.1 MHz, demonstrating stable coupling performance. This structural design eliminates the need to reserve cavities for the raised components when the strip is subsequently laminated onto the PVC card body, successfully controlling the final thickness of the financial IC card within the international ultra-thin card standard of 0.76 mm. With its extremely high reliability, it has passed all mechanical and electrical durability tests, including ISO / IEC10373-1, and has been successfully applied to the production of tens of millions of high-end financial IC cards.

[0052] The working principle of this invention is as follows: Step 1: Use a rectangular polyimide film as a flexible substrate.

[0053] First, multiple transverse arc grooves 8 are precisely machined into a linear array on its upper and lower surfaces, and through slots 102 are made at specific locations corresponding to the future mounting points of components such as chips and antenna coils.

[0054] The opening of these grooves naturally forms protrusions 7 with regular contours on the surface of the substrate.

[0055] Simultaneously, symmetrical side arc grooves 4 are machined on both sides of the substrate, thereby forming side wing plates 5 on both sides of the substrate, and the connection between the side wing plates 5 and the substrate body is machined into rounded edges. End grooves 6 are machined at both ends of the substrate. The inner wall of the side arc grooves 4 is also linearly arrayed with abutting circular parts 9 made of elastic material.

[0056] The transverse arc groove 8 and through groove 102 provide space for the embedded installation of subsequent components and form a microscopic positioning reference, creating the protrusion 7. The side arc groove 4 and side wing plate 5 prepare for the reinforcement, fixation, and electrical isolation of the copper foil 101 edge. The end groove 6 facilitates gripping and positioning in automated production. The abutting round part 9 pre-embeds an elastic support unit in the area of ​​the side arc groove 4.

[0057] Step 2: Apply the top and bottom layers of copper foil 101 onto the surface of the pre-processed polyimide substrate 1. During the hot-pressing process, the flexible copper foil 101 tightly wraps around the substrate, conforming to the contours of all grooves. At the corresponding positions of the transverse arc groove 8 and the through groove 102, the copper foil 101 is recessed to form matching grooves 2. These grooves 2 serve as mounting positions for electronic components such as chips and antenna coils.

[0058] The two sides of the copper foil 101 are specially bent to form an inward folded edge 3 that folds inward toward the substrate. This process doubles the thickness of the copper foil 101's edges, thus strengthening its structure.

[0059] The inner folded edge 3 of the copper foil 101 is precisely embedded into the side arc groove 4 of the substrate and fixed with adhesive. Since the cross-section of the side arc groove 4 is an arc shape that matches the outer surface of the inner folded edge 3, a large-area curved surface bonding and adhesive bonding is achieved. This completes the integration of the circuit layer and the carrier structure.

[0060] Electronic components can be installed within the groove 2, with their surfaces not protruding from the plane of the copper foil 101, achieving ultimate optimization of the overall thickness of the strip. The adhesive fixation of the inner folded edge 3 and the side arc groove 4 constitutes a robust edge anchoring system. The thickened inner folded edge 3 provides rigidity, and the arc fit increases the bonding area. This structure effectively resists the shearing and peeling forces that separate the copper foil 101 from the substrate, fundamentally preventing interlayer delamination.

[0061] The side wing plate 5 and its rounded edge form a physical isolation zone between the upper and lower copper foils 101 to prevent short circuits in case of extreme bending.

[0062] Step 3: When the strip bends during actual use, its internal structure activates a coordinated deformation mechanism.

[0063] The transverse arc groove 8 located on the outer side of the bend expands to provide space for the tensile strain of the material and avoid excessive stress concentration. The transverse arc groove 8 located on the inner side of the bend contracts, and its arc-shaped structure provides uniform support to resist compressive deformation.

[0064] When bent or compressed, the side arc groove 4 area may be subjected to pressure. The built-in abutting circle 9 acts as a spring at this time, providing elastic support and preventing plastic collapse of the side arc groove 4, thereby protecting the integrity of the inner folded edge 3 anchor point and ensuring the long-term effectiveness of the edge bond.

[0065] Since the electronic components are embedded in the groove 2, the bending stress is mainly borne by the groove network of the substrate and the overall structure of the copper foil 101, which avoids the components themselves becoming direct stress concentration points and improves the reliability of the connection parts.

[0066] This mechanism transforms the localized concentrated stress of traditional planar structures into a uniformly distributed stress guided by the groove network. The expansion and contraction deformation of the transverse arc groove 8 absorbs and disperses stress, while the contact circular piece 9 protects key anchor points, together achieving excellent bending fatigue life and dynamic reliability of the strip.

[0067] Step 4: The end groove 6 on the substrate provides a gripping point or tension buffer for the production line robot.

[0068] The protrusions 7 formed on the substrate surface by the through grooves 102 and the transverse arc grooves 8 have precise three-dimensional contours. In precision processes such as chip mounting, high-precision vision systems or sensors can identify these protrusions 7 as positioning references, enabling sub-micron level precise placement of electronic components within the grooves 2.

[0069] The robust inner folded edge 3-side arc groove 4 anchoring and anti-bending design ensures that the position of RF components such as antenna coils does not shift slightly during bending, maintaining the designed signal transmission path and coupling parameters, and guaranteeing the stability and effective distance of non-contact communication.

[0070] The component is embedded in the groove 2, which reduces the risk of being scratched or damaged by external objects, and also reduces signal interference caused by uneven surface.

[0071] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible, anti-interference, precise positioning, non-contact coupling chip strip, characterized in that: include: A polyimide substrate (1) is rectangular and serves as a flexible substrate; two layers of copper foil (101) are respectively wrapped around the upper and lower sides of the polyimide substrate (1), and through holes are formed by laser drilling; two through slots (102) are respectively opened on the upper and lower sides of the polyimide substrate (1) to reduce the opening depth required for the through holes; an inner folded edge (3) is provided on both sides of the copper foil (101) and is inwardly folded, the inner folded edge (3) causing the two sides of the copper foil (101) to be inwardly folded. The thickness is twice that of other positions, which is used to limit the position of the copper foil (101) to prevent delamination. Two side arc grooves (4) are symmetrically opened on both sides of the polyimide substrate (1). The inner wall of the side arc groove (4) is glued to the surface of the inner folded edge (3). The inner wall of the side arc groove (4) is linearly arrayed with abutting round parts (9) to increase the resilience of the polyimide substrate (1) under pressure, thereby preventing the side arc grooves (4) from collapsing when the polyimide substrate (1) is under pressure.

2. The flexible, anti-interference, precise positioning, non-contact coupling chip strip according to claim 1, characterized in that: The cross-section of the side arc groove (4) is an arc shape that matches the inner folded edge (3), which is used to increase the contact area between the inner folded edge (3) of the copper foil (101) and the inner wall of the side arc groove (4).

3. The flexible, anti-interference, precise positioning, non-contact coupling chip strip according to claim 1, characterized in that: The polyimide substrate (1) has multiple horizontal arc grooves (8) arranged in a linear array on its upper and lower sides. The horizontal arc grooves (8) are arc-shaped and are used to provide deformation space on one side of the horizontal arc groove (8) that is subjected to force expansion when the polyimide substrate (1) is rolled up as a whole, while the horizontal arc groove (8) on the other side provides support force.

4. The flexible, anti-interference, precise positioning, non-contact coupling chip strip according to claim 3, characterized in that: When the copper foil (101) is wrapped around the transverse arc groove (8) of the polyimide substrate (1), a groove (2) is formed.

5. The flexible, anti-interference, precise positioning, non-contact coupling chip strip according to claim 2, characterized in that: The polyimide substrate (1) has side wing plates (5) formed on both sides by side arc grooves (4). The side wing plates (5) are rounded near the polyimide substrate (1) to prevent the two copper foils (101) from contacting each other.

6. The flexible, anti-interference, precise positioning, non-contact coupling chip strip according to claim 5, characterized in that: Both ends of the polyimide substrate (1) are provided with end grooves (6).

7. The flexible anti-interference precise positioning non-contact coupling chip strip according to claim 3, characterized in that: The polyimide substrate (1) has protrusions (7) formed on its upper and lower sides through the through groove (102) and the transverse arc groove (8) for positioning during production.

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