A packaging processing device for integrated circuit chips

Abstract

The present application relates to the field of integrated circuit chip manufacturing and processing technology, specifically relates to a kind of packaging processing device for integrated circuit chip, including heating table and the compression assembly being arranged above heating table.Heating table includes the heat-conducting support plate with adsorption hole, and heating table is internally provided with several independent air chambers being sequentially arranged along the length direction of heat-conducting support plate and being respectively communicated with corresponding adsorption hole.Compression assembly includes several compression pieces distributed in the periphery of heat-conducting support plate and driving mechanism.In the process of translation, the pusher in driving mechanism drives several compression pieces to sequentially descend and compress the outer edge of base plate;At the same time, several independent air chambers cooperate with the compression degree of compression piece and sequentially pump air to generate negative pressure, realize the time sequence linkage of mechanical compression and pneumatic suction, finally the gas at the bottom of base plate is unidirectionally and gradually discharged, effectively avoid the bubbling or separation phenomenon of base plate when heating, significantly improve the yield and processing quality of chip packaging.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit chip manufacturing and processing technology, specifically to a packaging and processing apparatus for integrated circuit chips. Background Technology

[0002] In the packaging process of integrated circuit chips, the substrate is usually placed on a heating stage for positioning and fixation in order to provide a stable bearing position and the required thermal environment for subsequent chip packaging processes.

[0003] Currently, existing packaging and processing equipment generally uses overall vacuum adsorption of the bottom surface or a pressure plate to simultaneously press the four edges of the substrate downwards when fixing the substrate. However, this traditional fixing method has obvious technical defects: in actual operation, when the device applies overall adsorption force to the substrate at the same time, or when the pressure plate is used to press the entire outer edge of the substrate at the same time, it is very easy for a large amount of air to remain between the bottom of the substrate and the heat-conducting support below. This air is instantly trapped in the gap between the two by the surrounding pressure or disordered adsorption force, forming an air cavity or air band that cannot be discharged.

[0004] In subsequent packaging processes, the heating stage needs to continuously heat the substrate. At this time, the residual air trapped at the bottom of the substrate expands dramatically due to the heat, causing the substrate to bulge, warp, or detach from the heat-conducting surface. This not only directly compromises the stability of the substrate, reducing its surface flatness, but also results in uneven heating across different areas of the substrate, ultimately severely impacting the yield and processing quality of integrated circuit chip packaging. Summary of the Invention

[0005] Therefore, it is necessary to provide a packaging and processing apparatus for integrated circuit chips to address the existing technical problems.

[0006] To solve the problems of the prior art, the technical solution adopted by the present invention is: a packaging and processing apparatus for integrated circuit chips, including a heating stage and a pressing component disposed above the heating stage;

[0007] The heating stage includes a heat-conducting tray for placing a substrate; the heat-conducting tray is provided with a plurality of adsorption holes, and the heating stage is provided with a plurality of independent air chambers, the plurality of air chambers being arranged sequentially along the length of the heat-conducting tray, and each air chamber being connected to the adsorption holes in its respective area.

[0008] The clamping assembly includes a driving mechanism and a plurality of clamping members distributed around the periphery of the heat-conducting tray, wherein the plurality of clamping members correspond to a plurality of air chambers along the length direction of the heat-conducting tray.

[0009] The driving mechanism includes a pushing member that can translate along the length direction. During the translation process, the pushing member sequentially engages with a plurality of pressing members to drive the plurality of pressing members to descend sequentially along the length direction of the heat-conducting plate and press against the outer edge of the substrate.

[0010] Furthermore, the gas chambers are adapted to sequentially draw air to generate negative pressure during the sequential pressing of the clamping members, in coordination with the pressing progress of the clamping members, so as to discharge the gas between the substrate and the heat-conducting support plate unidirectionally along the length direction of the heat-conducting support plate.

[0011] Furthermore, the clamping assembly also includes a mounting bracket fixedly mounted above the heat-conducting support plate;

[0012] A plurality of clamping members are disposed below the mounting bracket and are spliced ​​together to form a rectangular frame structure adapted to the outer edge of the substrate. The plurality of clamping members include a first end plate and a second end plate located at both ends of the heat-conducting tray along the length direction, and a plurality of pairs of side plates spaced between the first end plate and the second end plate along the length direction, and each pair of side plates is distributed opposite to each other on both sides of the width direction of the heat-conducting tray.

[0013] The first end plate, the second end plate, and the multiple pairs of side plates are all slidably connected to the mounting frame in the vertical direction.

[0014] Furthermore, the length direction of both the first end plate and the second end plate is parallel to the width direction of the heat-conducting tray. Both ends of the first end plate and the second end plate are formed with a first guide shaft that extends vertically upward through the mounting frame. A first wedge is fixedly provided at the top of each first guide shaft. A first spring is sleeved on each first guide shaft. The two ends of the first spring abut against the bottom of the first wedge and the top of the mounting frame, respectively.

[0015] Furthermore, each of the side pressure plates has several second guide shafts formed on its top, which extend vertically upward through the mounting frame. The upper ends of the several second guide shafts corresponding to each of the side pressure plates are connected by a connecting plate. A second wedge is fixedly provided on the top of the connecting plate. A second spring is sleeved on each of the second guide shafts. The two ends of the second spring abut against the bottom of the connecting plate and the top of the mounting frame, respectively.

[0016] Furthermore, the driving mechanism includes a pushing frame and a linear cylinder. A support platform is fixedly provided on the side of the heating table. The pushing frame is slidably connected to the support platform along the length direction of the heat-conducting tray. The linear cylinder is fixedly provided on the support platform and is used to drive the pushing frame to move horizontally. The pushing frame includes two push rods, which are distributed opposite to each other on both sides of the width direction of the heat-conducting tray. Each push rod has a driving inclined surface formed at one end facing the heating table. A plurality of first wedges and a plurality of second wedges are divided into two groups at intervals along the width direction of the heat-conducting tray. Each group of first wedges and second wedges is located on the moving path of one of the push rods and slides against the driving inclined surface.

[0017] Furthermore, the heating platform also includes a base and a heating plate. The top of the base has a downward-facing cavity. The heating plate is horizontally fixed inside the cavity. The top of the base is fixedly provided with a heat insulation plate that covers the cavity. A heat insulation barrier is formed on the top of the heat insulation plate. The heat-conducting support plate is horizontally fixed inside the heat insulation barrier. The heating plate is provided with a heat-conducting element for transferring heat to the heat-conducting support plate.

[0018] Furthermore, the heat-conducting component includes a number of heat-conducting pillars grouped and distributed on the outer edge of the heat-conducting support plate. Each group of heat-conducting pillars corresponds to one side of the heat-conducting support plate. The lower end of each heat-conducting pillar passes downward through the heat insulation plate and is fixedly connected to the heating plate. The top of each group of heat-conducting pillars is fixedly connected to a heat-conducting strip that fits against the bottom of the heat-conducting support plate.

[0019] Furthermore, each of the air chambers is located inside the heat insulation enclosure and is fixedly connected to the bottom of the heat-conducting support plate, and each of the air chambers is connected to an exhaust pipe that passes through the heat insulation enclosure.

[0020] Furthermore, the heat-conducting tray is provided with a positioning component, which includes an anti-displacement component and a limiting component. The anti-displacement component includes two baffles distributed opposite to each other on both sides of the width direction of the heat-conducting tray. Each baffle extends along the length direction of the heat-conducting tray and is fixedly connected to the heat insulation barrier. A limiting channel for preventing the substrate from shifting is formed between the two baffles. The limiting component includes a plurality of limiting baffles fixedly connected to the heat insulation barrier and used to abut against the side of the substrate to limit the position of the substrate.

[0021] Furthermore, a mounting base is provided on the side of the limiting member, and a feeding assembly is provided on the mounting base. The feeding assembly includes a pushing cylinder and a pushing plate. The pushing plate is slidably connected to the mounting base along the length direction of the heat-conducting support plate. The pushing cylinder is fixedly mounted on the mounting base and is used to drive the pushing plate to extend toward the heat-conducting support plate and push the substrate out.

[0022] The beneficial effects of this invention compared to the prior art are:

[0023] This invention achieves sequential linkage between mechanical pressing and pneumatic suction by driving several pressing components to descend and press the outer edge of the substrate in sequence, while simultaneously generating negative pressure by sequentially drawing air from several independent air chambers below the substrate according to the pressing progress. This structure can unidirectionally and gradually expel the gas between the substrate and the heat-conducting support along the length direction, effectively avoiding the air blockage problem caused by traditional instantaneous pressing or disordered adsorption. This solves the defects such as blistering, warping, or detachment from the heat-conducting surface caused by the thermal expansion of residual air at the bottom of the substrate during subsequent continuous heating, greatly ensuring the stability of the substrate fixation, surface flatness, and uniform heating of each area, ultimately significantly improving the yield and processing quality of integrated circuit chip packaging. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0025] Figure 2 This is a top view of the present invention;

[0026] Figure 3 yes Figure 2 Section along line AA Figure 1 ;

[0027] Figure 4 yes Figure 2 Section along line AA Figure 2 ;

[0028] Figure 5 yes Figure 4 A magnified view of the area indicated by A1 in the diagram;

[0029] Figure 6 yes Figure 4 The enlarged view of the area indicated by A2 in the diagram;

[0030] Figure 7 This is a three-dimensional structural diagram of the substrate positioned on the heat-conducting tray.

[0031] Figure 8 This is a three-dimensional structural diagram of the clamping component;

[0032] Figure 9 yes Figure 8 The enlarged view of the area indicated in A3;

[0033] Figure 10 This is an exploded view of the three-dimensional structure of the heating platform;

[0034] Figure 11 This is a three-dimensional structural diagram of the drive mechanism.

[0035] The following are the labels in the diagram: 1. Heating platform; 2. Heat-conducting support plate; 3. Adsorption hole; 4. Air chamber; 5. Drive mechanism; 6. Clamping component; 7. Mounting bracket; 8. First end pressure plate; 9. Second end pressure plate; 10. Side pressure plate; 11. First guide shaft; 12. First wedge; 13. First spring; 14. Second guide shaft; 15. Connecting plate; 16. Second wedge; 17. Second spring; 18. Linear cylinder; 19. Support platform; 20. Push rod; 21. Drive inclined plane; 22. Base; 23. Heating plate; 24. Receiving cavity; 25. Heat insulation plate; 26. Heat insulation enclosure; 27. Heat-conducting column; 28. Heat-conducting strip; 29. ​​Air extraction pipe; 30. Baffle; 31. Limiting baffle; 32. Mounting seat; 33. Push cylinder; 34. Push plate. Detailed Implementation

[0036] To further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0037] refer to Figures 1 to 11 The diagram illustrates a packaging apparatus for integrated circuit chips. This apparatus is primarily used in the packaging process of integrated circuit chips, and its core function is to stably position and fix the substrate during chip packaging, preventing bubbling caused by heat. The apparatus mainly includes a heating stage 1 and a clamping assembly positioned above the heating stage 1. The heating stage 1 provides the necessary heat support and bottom bearing for chip packaging, while the clamping assembly provides dynamic clamping force from above. Together, they complete the fixation of the substrate.

[0038] In order to provide a stable and controllable thermal environment during the packaging process, such as Figure 4 and Figure 10As shown, the heating platform 1 includes a base 22 and a heating plate 23. The top of the base 22 has a downward-facing cavity 24, and the heating plate 23 is horizontally fixed inside the cavity 24 to serve as the core heat source. To prevent unnecessary heat loss downwards and to the sides, a heat insulation plate 25 is fixedly provided on the top of the base 22 to cover the cavity 24, and a heat insulation barrier 26 is formed on the top of the heat insulation plate 25. A heat-conducting tray 2 for placing a substrate is provided inside the heat insulation enclosure 26. In order to transfer heat accurately and efficiently to the heat-conducting tray 2, a heat-conducting component is provided on the heating plate 23 for transferring heat to the heat-conducting tray 2. The heat-conducting component includes a number of heat-conducting columns 27 distributed in groups on the outer edge of the heat-conducting tray 2. Each group of heat-conducting columns 27 corresponds to one side of the heat-conducting tray 2. The lower end of each heat-conducting column 27 passes downward through the heat insulation plate 25 and is fixedly connected to the heating plate 23. A heat-conducting strip 28 that fits against the bottom of the heat-conducting tray 2 is fixedly connected to the top of each group of heat-conducting columns 27. Through the cooperation of the heat-conducting columns 27 and the heat-conducting strip 28, heat can be evenly and continuously conducted to the heat-conducting tray 2.

[0039] In order to firmly adhere the substrate placed on the heat-conducting tray 2 and remove the air at the bottom, such as Figure 4 and Figure 10 As shown, the heat-conducting support plate 2 has several adsorption holes 3 running through it, and the heating platform 1 has several independent air chambers 4. To prevent interference from external airflow, each air chamber 4 is located inside a heat-insulating enclosure 26 and is fixedly connected to the bottom of the heat-conducting support plate 2. The air chambers 4 are arranged sequentially along the length of the heat-conducting support plate 2. Each air chamber 4 is connected to the adsorption holes 3 in its respective area, and each air chamber 4 is connected to an exhaust pipe 29 that passes through the heat-insulating enclosure 26 to facilitate independent exhaust from an external vacuum source. This design of independent air chambers 4 arranged in different areas provides the basis for subsequent segmented negative pressure adsorption.

[0040] To ensure that the substrate falls accurately into the aforementioned negative pressure area, the heat-conducting tray 2 is equipped with a positioning component. For example... Figure 7 As shown, the positioning component includes an anti-deviation component and a limiting component. The anti-deviation component includes two baffles 30 distributed opposite each other on both sides of the width direction of the heat-conducting tray 2. Each baffle 30 extends along the length direction of the heat-conducting tray 2 and is fixedly connected to the heat insulation barrier 26. In actual production, the substrate can be inserted horizontally against the heat-conducting tray 2 by an external robot arm. When the robot arm feeds the substrate, a limiting channel is formed between the two baffles 30 to prevent the substrate from shifting laterally, thus playing a guiding role. At the same time, the limiting component includes several limiting baffles 31 fixedly connected to the heat insulation barrier 26, which abut against the end side of the substrate to limit the final stopping position of the substrate. Through the combined action of the limiting channel and the limiting baffles 31, it is ensured that the substrate fed in by the robot arm can be completely and accurately positioned above the negative pressure area.

[0041] When the substrate is precisely positioned and ready for adsorption and fixation, this device is equipped with a clamping component to prevent warping of its edges under heat. For example... Figure 1 and Figure 8 As shown, the clamping assembly includes a mounting bracket 7 fixedly mounted above the thermally conductive tray 2 and several clamping components 6 distributed around the periphery of the thermally conductive tray 2. To ensure that only the outer edge of the substrate is compressed while leaving sufficient space in the center for chip packaging, several clamping components 6 are located below the mounting bracket 7 and are assembled to form a rectangular frame structure adapted to the outer edge of the substrate. Specifically, the clamping components 6 include a first end plate 8 and a second end plate 9 located at both ends of the thermally conductive tray 2 along its length, and multiple pairs of side plates 10 spaced apart along the length between the first end plate 8 and the second end plate 9, with each pair of side plates 10 relatively distributed on both sides of the thermally conductive tray 2 in its width direction. Furthermore, to ensure production space, the mounting bracket 7 and other components located above are designed in a frame shape, thus providing ample operating space above the substrate without affecting the subsequent intervention of chip packaging equipment.

[0042] In order for the aforementioned rectangular frame-structured clamping component to have independent lifting and lowering capabilities, such as Figures 4 to 8 As shown, the first end pressure plate 8, the second end pressure plate 9, and multiple pairs of side pressure plates 10 are all slidably connected to the mounting frame 7 in the vertical direction. The length direction of both the first end pressure plate 8 and the second end pressure plate 9 is parallel to the width direction of the heat-conducting support plate 2, and each end has a first guide shaft 11 formed at both ends, extending vertically upward through the mounting frame 7. A first wedge block 12 is fixedly provided at the top of each first guide shaft 11, and a first spring 13 is sleeved on each first guide shaft 11. The two ends of the first spring 13 are respectively connected to the first wedge block 12. The bottom of plate 2 abuts against the top of the mounting bracket 7. Similarly, for the pressure plates on both sides, the top of each side pressure plate 10 is formed with several second guide shafts 14 that extend vertically upward through the mounting bracket 7. The upper ends of the several second guide shafts 14 corresponding to each side pressure plate 10 are connected by a connecting plate 15. A second wedge 16 is fixedly provided on the top of the connecting plate 15. A second spring 17 is sleeved on each second guide shaft 14. The two ends of the second spring 17 abut against the bottom of the connecting plate 15 and the top of the mounting bracket 7, respectively. Relying on the supporting force of the first spring 13 and the second spring 17, in the initial state, all the clamping members 6 remain in a suspended and raised state, which facilitates the feeding of the substrate.

[0043] To drive the clamping members 6 to press down sequentially, this device is equipped with a drive mechanism 5. Specifically, as follows: Figure 3 , Figure 4 and Figure 11As shown, a support platform 19 is fixedly provided on the side of the heating platform 1, and the driving mechanism 5 includes a pushing frame and a linear cylinder 18. The pushing frame, as a pushing component that can translate along the length direction, is slidably connected to the support platform 19, and the linear cylinder 18 is fixedly provided on the support platform 19 and is used to drive the pushing frame to translate. In terms of specific structure, the pushing frame includes two push rods 20, which are distributed opposite each other on both sides of the width direction of the heat-conducting tray 2. Each push rod 20 has a driving inclined surface 21 formed at one end facing the heating platform 1. In order to achieve timing control, a number of first wedges 12 and a number of second wedges 16 are divided into two groups at intervals along the width direction of the heat-conducting tray 2. Each group of first wedges 12 and second wedges 16 is located on the moving path of one of the push rods 20 and is suitable for sliding contact with the driving inclined surface 21, thereby converting the horizontal thrust into a vertically downward pressing force. Finally, during the pushing process of the push rod 20, a number of pressing components 6 will press down in sequence.

[0044] The core operating logic of this device lies in the perfect timing linkage between mechanical clamping and pneumatic vacuuming. Specifically, in the aforementioned structure, several clamping components 6 correspond to several air chambers 4 along the length of the heat-conducting support plate 2. During the translation of the pushing component, the driving inclined surface 21 will successively slide and abut against several first wedges 12 and second wedges 16, which constitutes a transmission engagement, thereby overcoming the spring force and driving several clamping components 6 to descend sequentially along the length of the heat-conducting support plate 2 and gradually clamp the outer edge of the substrate. At the same time, through the externally set negative pressure control logic, several air chambers 4 will sequentially generate negative pressure as several clamping components 6 are pressed down in sequence, in coordination with the pressing progress of the clamping components 6. This design of sequential mechanical clamping and sequential generation of negative pressure by air chambers 4 can unidirectionally discharge the gas between the substrate and the heat-conducting support plate 2 along the length of the heat-conducting support plate 2, solving the problem of bubbling and detachment of the substrate when heated due to residual air inside.

[0045] Finally, after the entire integrated circuit chip has completed packaging and cooled, the finished product needs to be removed for the next cycle. To do this, such as... Figure 3 , Figure 4 and Figure 11 As shown, the device has a mounting base 32 on the side of the limiting member, and a feeding assembly for automatic material discharge is provided on the mounting base 32. The feeding assembly includes a pushing cylinder 33 and a push plate 34, and the push plate 34 is slidably connected to the mounting base 32 along the length of the heat-conducting tray 2. After processing is completed and the vacuum is released and the clamping member 6 is reset and raised, the pushing cylinder 33 will drive the push plate 34 to extend to the heat-conducting tray 2, thereby smoothly pushing the processed substrate out of the heat-conducting tray 2 to facilitate the connection of subsequent processes.

[0046] The above embodiments only illustrate one or more implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A packaging and processing apparatus for integrated circuit chips, characterized in that, Includes a heating table (1) and a clamping assembly disposed above the heating table (1); The heating platform (1) includes a heat-conducting tray (2) for placing a substrate; the heat-conducting tray (2) is provided with a plurality of adsorption holes (3), and the heating platform (1) is provided with a plurality of independent air chambers (4). The plurality of air chambers (4) are arranged sequentially along the length direction of the heat-conducting tray (2), and each air chamber (4) is connected to the adsorption holes (3) in its respective area. The clamping assembly includes a driving mechanism (5) and a plurality of clamping members (6) distributed around the heat-conducting plate (2). The plurality of clamping members (6) correspond to the plurality of air chambers (4) along the length direction of the heat-conducting plate (2). The driving mechanism (5) includes a pushing member that can be translated along the length direction. During the translation process, the pushing member sequentially engages with a plurality of pressing members (6) to drive the plurality of pressing members (6) to descend sequentially along the length direction of the heat-conducting plate (2) and press against the outer edge of the substrate. Furthermore, the gas chambers (4) are adapted to sequentially draw air to generate negative pressure in coordination with the pressing progress of the pressing members (6) during the sequential pressing process of the pressing members (6), so as to discharge the gas between the substrate and the heat-conducting support plate (2) unidirectionally along the length direction of the heat-conducting support plate (2).

2. The packaging and processing apparatus for integrated circuit chips according to claim 1, characterized in that, The clamping assembly also includes a mounting bracket (7) fixedly mounted above the heat-conducting support plate (2). Several clamping members (6) are disposed below the mounting bracket (7) and spliced ​​together to form a rectangular frame structure adapted to the outer edge of the substrate. The several clamping members (6) include a first end plate (8) and a second end plate (9) located at both ends of the heat-conducting tray (2) in the length direction, and multiple pairs of side plates (10) spaced between the first end plate (8) and the second end plate (9) along the length direction, and each pair of side plates (10) is relatively distributed on both sides of the width direction of the heat-conducting tray (2). The first end plate (8), the second end plate (9), and the multiple pairs of side plates (10) are all slidably connected to the mounting bracket (7) in the vertical direction.

3. The packaging and processing apparatus for integrated circuit chips according to claim 2, characterized in that, The length direction of the first end plate (8) and the second end plate (9) are parallel to the width direction of the heat-conducting tray (2). Both ends of the first end plate (8) and the second end plate (9) are formed with a first guide shaft (11) that passes vertically upward through the mounting frame (7). A first wedge (12) is fixedly provided on the top of each first guide shaft (11). A first spring (13) is sleeved on each first guide shaft (11). The two ends of the first spring (13) abut against the bottom of the first wedge (12) and the top of the mounting frame (7), respectively.

4. The packaging and processing apparatus for integrated circuit chips according to claim 3, characterized in that, Each of the side pressure plates (10) has several second guide shafts (14) formed on its top, which are vertically upward and pass through the mounting frame (7). The upper ends of the several second guide shafts (14) corresponding to each of the side pressure plates (10) are connected by a connecting plate (15). A second wedge (16) is fixedly provided on the top of the connecting plate (15). A second spring (17) is sleeved on each of the second guide shafts (14). The two ends of the second spring (17) abut against the bottom of the connecting plate (15) and the top of the mounting frame (7), respectively.

5. The packaging and processing apparatus for integrated circuit chips according to claim 4, characterized in that, The driving mechanism (5) includes a pushing frame and a linear cylinder (18). A support platform (19) is fixedly provided on the side of the heating table (1). The pushing frame is slidably connected to the support platform (19) along the length direction of the heat-conducting tray (2). The linear cylinder (18) is fixedly provided on the support platform (19) and is used to drive the pushing frame to move horizontally. The pushing frame includes two push rods (20). The two push rods (20) are distributed opposite to each other on both sides of the width direction of the heat-conducting tray (2). Each push rod (20) has a driving inclined surface (21) formed at one end facing the heating table (1). A number of first wedges (12) and a number of second wedges (16) are divided into two groups along the width direction of the heat-conducting tray (2). Each group of first wedges (12) and second wedges (16) is located on the moving path of one of the push rods (20) and slides against the driving inclined surface (21).

6. The packaging and processing apparatus for integrated circuit chips according to claim 1, characterized in that, The heating platform (1) also includes a base (22) and a heating plate (23). The top of the base (22) is provided with a receiving cavity (24) facing downward. The heating plate (23) is horizontally fixed in the receiving cavity (24). The top of the base (22) is fixedly provided with a heat insulation plate (25) covering the receiving cavity (24). The top of the heat insulation plate (25) is formed with a heat insulation barrier (26). The heat-conducting support plate (2) is horizontally fixed in the heat insulation barrier (26). The heating plate (23) is provided with a heat-conducting component for transferring heat to the heat-conducting support plate (2).

7. The packaging and processing apparatus for integrated circuit chips according to claim 6, characterized in that, The heat-conducting component includes a number of heat-conducting columns (27) distributed in groups on the outer edge of the heat-conducting support plate (2). Each group of heat-conducting columns (27) corresponds to one side of the heat-conducting support plate (2). The lower end of each heat-conducting column (27) passes downward through the heat insulation plate (25) and is fixedly connected to the heating plate (23). The top of each group of heat-conducting columns (27) is fixedly connected to a heat-conducting strip (28) that fits against the bottom of the heat-conducting support plate (2).

8. The packaging and processing apparatus for integrated circuit chips according to claim 6, characterized in that, Each of the air chambers (4) is located inside the heat insulation enclosure (26) and is fixedly connected to the bottom of the heat-conducting support plate (2). Each of the air chambers (4) is connected to an exhaust pipe (29) that passes through the heat insulation enclosure (26).

9. A packaging and processing apparatus for integrated circuit chips according to claim 6, characterized in that, The heat-conducting tray (2) is provided with a positioning component, which includes an anti-offset component and a limiting component. The anti-offset component includes two baffles (30) that are distributed opposite to each other on both sides of the width direction of the heat-conducting tray (2). Each baffle (30) extends along the length direction of the heat-conducting tray (2) and is fixedly connected to the heat insulation enclosure (26). A limiting channel for preventing the substrate from shifting is formed between the two baffles (30). The limiting component includes a plurality of limiting baffles (31) that are fixedly connected to the heat insulation enclosure (26) and abut against the side of the substrate to limit the position of the substrate.

10. A packaging and processing apparatus for integrated circuit chips according to claim 9, characterized in that, The limiting member is provided with a mounting base (32) on its side. The mounting base (32) is provided with a feeding assembly. The feeding assembly includes a pushing cylinder (33) and a push plate (34). The push plate (34) is slidably connected to the mounting base (32) along the length direction of the heat-conducting support plate (2). The pushing cylinder (33) is fixedly mounted on the mounting base (32) and is used to drive the push plate (34) to extend toward the heat-conducting support plate (2) and push out the substrate.

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