MOS chip packaging processing device and packaging method thereof

Abstract

The application belongs to the technical field of packaging equipment, and particularly relates to a MOS chip packaging processing device and a packaging method thereof. The MOS chip packaging processing device comprises a packaging table assembly. A protection box is threadedly fastened to the top of the packaging table assembly. A support frame is welded to the top of the protection box. A temperature control assembly is arranged at the top of the inner wall of the protection box. The MOS chip to be packaged is placed on the top of the packaging table assembly through an observation window. The airflow is continuously delivered to the temperature control assembly through the wind collecting shell. The temperature and direction of the airflow are changed through the temperature control assembly. The airflow with a temperature suitable for the preheating temperature of the MOS chip is delivered to the top of the packaging table assembly. The preheating temperature in the protection box is closed through the isolation assembly. The preheating temperature after being closed is stored in the protection box. The requirement of the MOS chip for temperature regulation under different working conditions is reduced. The loss of the heat source is reduced. The quality of the chip packaging is improved.

Description

Technical Field

[0001] This invention belongs to the field of packaging equipment technology, and specifically relates to a MOS chip packaging processing apparatus and packaging method. Background Technology

[0002] As the core of power devices, the MOS chip's packaging directly determines its heat dissipation, conduction, and reliability. Traditional packaging equipment is mostly general-purpose, with poor adaptability, and suffers from problems such as insufficient chip positioning accuracy, easy wafer damage during clamping, uneven molding, and unreasonable heat dissipation path design. At the same time, its low level of automation makes it prone to misalignment, cold solder joints, and package cracks. The yield and production efficiency are difficult to meet the high-density, high-consistency packaging requirements of high-power MOS chips, thus restricting device performance and mass production.

[0003] A search revealed that Chinese Patent Publication No. CN119480724B, authorized on May 23, 2025, discloses a MOS chip packaging processing apparatus and its usage method. The apparatus includes a bottom support platform, a packaging platform fixedly connected to the top of the bottom support platform, and an electric push rod fixedly connected to the top of the bottom support platform. An outer filter screen on the surface of the protective ring frame reduces contact between dust particles from the external environment and the MOS chip during preheating, and cleans the dust accumulation generated during filtration. Simultaneously, a rotating drive fan blows hot air along the inner side of the inner connecting cylinder onto the surface of the packaging platform, facilitating preheating of the MOS chip on the packaging platform surface, improving the adhesion between the MOS chip and the packaging material. Furthermore, during cooling after curing, the temperature of the airflow generated by the rotating drive fan is lower after the heater body is turned off, which, combined with the continuously rotating bottom connecting frame, improves the cooling efficiency of the MOS chip after packaging and curing on the packaging platform surface.

[0004] However, the equipment still has the following drawbacks: although it can improve the cooling efficiency of MOS chips after the packaging stage surface is cured, the cleaning brush cleaning the surface of the top filter and the direct blowing of hot air can easily contaminate the chip and cause the chip packaging yield to be uncontrollable because there is no real-time temperature measurement of the hot air. Summary of the Invention

[0005] To address the aforementioned problems, this invention provides a MOS chip packaging and processing apparatus, including a packaging stage assembly. A protective box is threadedly fastened to the top of the packaging stage assembly, and a support frame is welded to the top of the protective box. A temperature control component is installed at the top of the inner wall of the protective box, and one end of the temperature control component is driven by a servo motor to a first gear. Observation windows are symmetrically opened on both sides of the outer wall of the protective box, and a linkage component for opening and closing the observation windows is slidably connected to the outer wall of the protective box. The linkage component is meshed with the first gear. Isolation components are rotatably connected to both sides of the support frame, and the isolation components are horizontally slidably connected to the two side walls of the protective box to isolate the cavity inside the protective box. A fan is connected to the side of the temperature control component away from the first gear, and a fan is installed on the outer wall of the fan. A duct is installed on the other side of the fan, and both ends of the duct are provided with storage boxes for collecting dust and impurities inside the temperature control component.

[0006] Furthermore, the packaging stage assembly includes a packaging stage; the top of the packaging stage has a packaging cavity, and an isolation plate is horizontally fixedly connected to the central axis of the inner wall of the packaging cavity, and a temperature control cavity is provided at the bottom of the isolation plate.

[0007] Furthermore, both sides of the outer wall of the packaging platform are connected to the conveying pipes, and one end of each conveying pipe extends into the temperature control cavity. A heating pipe is installed on the outer wall of the conveying pipe near the temperature control cavity, and a first electric heating wire is installed inside the heating pipe. An air pump is installed on the outer wall of the conveying pipe away from the temperature control cavity.

[0008] Furthermore, the linkage assembly includes two sets of sealing plates; one side wall of each of the two sets of sealing plates is attached to the outer wall of the protective box, and the two sets of sealing plates are located on the outer wall of the observation window, and the two sets of sealing plates are fixedly connected by a crossbeam.

[0009] Furthermore, a guide frame is fixedly connected to the top of a set of sealing plates, and a limiting ring for limiting contact with the first gear is provided on the top of the guide frame. The inner wall of the guide frame is sleeved on the outer wall of the first gear, and a rack that meshes with the first gear is also provided on one side of the inner wall of the guide frame.

[0010] Furthermore, the isolation assembly includes a movable plate; the movable plate is horizontally slidably connected to the outer wall of the protective box, and two sets of hinge seats are installed on the top side of the movable plate, and the output end of a cylinder is rotatably connected to each of the two sets of hinge seats. The side of the cylinder away from the output end is rotatably connected to the outer wall of the support frame. The outer wall of the movable plate is also provided with a guide groove, and the guide groove is slidably connected to the outer wall of the conveying pipe. The inner wall of the guide groove is also horizontally provided with an elastic sealing strip, and the elastic sealing strip is used to prevent heat from the top of the protective box from flowing downwards during the process of the conveying pipe slidingly connected to the inner wall of the guide groove.

[0011] Furthermore, the temperature control component includes two sets of horizontal plates; an arched plate is fixedly connected between the two sets of horizontal plates, and the side of the two sets of horizontal plates away from the arched plate is fixedly connected to the inner wall of the protective box. The outer walls of the two sets of horizontal plates are provided with positioning holes, and the positioning holes are fitted onto the port of the delivery pipe.

[0012] Furthermore, the outer wall of the arched plate is provided with several sets of through holes, and several sets of heating mechanisms are rolled and fitted to the outer wall of the arched plate. The end of one set of heating mechanisms is connected to the first gear for transmission. The ends of several sets of heating mechanisms away from the first gear are fixedly connected to the second gear, and one side of several sets of the second gears is meshed with an external gear ring. Both ends of the external gear ring are fixedly connected to limit plates.

[0013] Furthermore, a linkage rod is fixedly connected to the inner wall of the external gear ring, and the output end of a stepper motor is connected to the position of the central axis of the linkage rod. The side of the stepper motor away from the output end is embedded in the outer wall of the protective box. The ends of several sets of heating mechanisms and the side near the second gear are all connected to air pipes, and the other end of the air pipes is connected to the air collecting shell.

[0014] A packaging method for fabricating a MOS chip includes the following steps. The rotation of the first gear drives the linkage component to move up and down, which is used to open or close the observation window; The MOS chip to be packaged is placed on top of the packaging stage assembly through the observation window; The continuous operation of the fan concentrates the airflow through the air collection shell and delivers it to the temperature control components; By changing the temperature and direction of the airflow through the temperature control component, the airflow suitable for the preheating temperature of the MOS chip is delivered to the top of the packaging stage assembly. The preheating temperature inside the protective enclosure is sealed by an isolation component, so that the sealed preheating temperature is stored inside the protective enclosure. This reduces the need for temperature control of the MOS chip under different operating conditions and reduces heat loss.

[0015] The beneficial effects of this invention are: 1. The rotation of the first gear drives the linkage component to lift and lower, opening or closing the observation window. The MOS chip to be packaged is then placed on top of the packaging stage assembly through the observation window. The continuous operation of the fan concentrates the airflow through the air collection housing to the temperature control component. The temperature control component changes the temperature and direction of the airflow to deliver the airflow suitable for the preheating temperature of the MOS chip to the top of the packaging stage assembly. The preheating temperature inside the protective box is then sealed by the isolation component, storing the sealed preheating temperature within the protective box. This reduces the need for temperature control of the MOS chip under different operating conditions, reduces heat loss, and improves the chip packaging quality.

[0016] 2. The fan continuously operates in the forward direction to deliver airflow to several sets of heating tubes. The airflow is heated by the continuous operation of the second electric heating wire inside the heating tubes. The output end of the stepper motor drives the linkage rod to rotate, causing the external gear ring to mesh with several sets of second gears. This rotates the heating tubes, bringing the guide grooves of the heating tubes close to the top of the inner wall of the protective box and sealing the through holes. The heated airflow is stored in the interlayer between the arched plate and the top of the inner wall of the protective box. The airflow is then delivered to the temperature control chamber through the delivery pipe. In conjunction with the continuous operation of the first electric heating wire inside the heating tubes, the temperature inside the temperature control chamber is regulated.

[0017] 3. After the fan stops working, the servo motor drives the first gear to rotate, causing the rack meshing with the first gear to drive the two sets of sealing plates to fall and block the observation window. Then, the output end of the cylinder pushes the movable plate to seal and isolate the inner wall of the protective box. Then, the stepper motor drives the linkage rod to rotate to the other side, so that the guide grooves on several sets of heating tubes are connected to several sets of through holes. This facilitates the heat stored in the arched plate and the interlayer at the top of the inner wall of the protective box to be stored between the bottom of the arched plate and the top of the movable plate through the through holes for later heat recovery and utilization.

[0018] 4. The air pump continuously delivers room temperature airflow through the delivery pipe to the temperature control chamber, which is used to cool the MOS chip in the packaging chamber to room temperature in a timely manner after processing, to prevent warping and to quickly remove it from the work station.

[0019] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the packaging device according to an embodiment of the present invention is shown. Figure 1 ; Figure 2 A partial structural schematic diagram of the packaging device according to an embodiment of the present invention is shown; Figure 3 A schematic diagram of the internal structure of the packaging device according to an embodiment of the present invention is shown; Figure 4 A schematic diagram of the internal structure of the observation window of the packaging device according to an embodiment of the present invention is shown; Figure 5 A schematic diagram of the packaging stage assembly according to an embodiment of the present invention is shown; Figure 6 A schematic diagram of the linkage component according to an embodiment of the present invention is shown; Figure 7 A schematic diagram of the structure of the isolation component according to an embodiment of the present invention is shown; Figure 8 A schematic diagram of the temperature control component according to an embodiment of the present invention is shown. Figure 1 ; Figure 9 A schematic diagram of the temperature control component according to an embodiment of the present invention is shown. Figure 2 ; Figure 10 A schematic diagram of the heating mechanism according to an embodiment of the present invention is shown.

[0022] In the diagram: 1. Encapsulation stage assembly; 11. Encapsulation stage; 12. Encapsulation cavity; 13. Isolation plate; 14. Temperature control cavity; 15. Delivery pipe; 16. Heating pipe; 17. Air pump; 2. Protective box; 3. Support frame; 4. Linkage assembly; 41. Sealing plate; 42. Crossbeam; 43. Guide frame; 44. Limiting ring; 45. Rack; 5. Isolation assembly; 51. Movable plate; 52. Hinge seat; 53. Cylinder; 54. Guide groove; 55. Elastic sealing strip; 6. Temperature control components; 61. Horizontal plate; 62. Positioning hole; 63. Arched plate; 64. Through hole; 65. Heating mechanism; 651. Heating tube; 652. Guide groove; 653. Positioning rod; 654. Connecting tube; 66. External gear ring; 67. Limiting plate; 68. Second gear; 69. Linkage rod; 610. Stepper motor; 611. Air pipe; 7. First gear; 8. Observation window; 9. Air collection shell; 10. Fan; 110. Air duct; 120. Storage box. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] This invention provides a MOS chip packaging and processing apparatus, including a packaging stage assembly 1; for example, such as... Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown.

[0025] The top of the packaging platform assembly 1 is fastened to a protective box 2 by threads, and a support frame 3 is welded to the top of the protective box 2. A temperature control component 6 is provided at the top of the inner wall of the protective box 2, and one end of the temperature control component 6 is connected to a first gear 7 via a servo motor drive. Observation windows 8 are symmetrically opened on both sides of the outer wall of the protective box 2, and a linkage component 4 for opening and closing the observation windows 8 is slidably connected to the outer wall of the protective box 2. The linkage component 4 is meshed with the first gear 7. Isolation components 5 are rotatably connected to both sides of the support frame 3, and the isolation components 5 are horizontally slidably connected to the two side walls of the protective box 2 to isolate the cavity inside the protective box 2. The side of the temperature control component 6 away from the first gear 7 is connected to a wind collection shell 9, and a fan 10 is installed on the outer side wall of the wind collection shell 9. A duct 110 is installed on the other side of the fan 10, and a collection box 120 for collecting dust and impurities inside the temperature control component 6 is provided at both ends of the duct 110.

[0026] Specifically, the rotation of the first gear 7 is used to drive the linkage component 4 to lift and lower, and to open or close the observation window 8. The MOS chip to be packaged is then placed on top of the packaging stage component 1 through the observation window 8. The continuous operation of the fan 10 concentrates the airflow through the air collection housing 9 and delivers it to the temperature control component 6. The temperature control component 6 changes the temperature and direction of the airflow to deliver the airflow suitable for the preheating temperature of the MOS chip to the top of the packaging stage component 1. The preheating temperature inside the protective box 2 is then sealed by the isolation component 5, so that the sealed preheating temperature is stored inside the protective box 2. This reduces the need for temperature control of the MOS chip under different operating conditions and reduces heat loss.

[0027] The packaging stage assembly 1 includes a packaging stage 11; for example, such as... Figure 5 As shown.

[0028] The top of the packaging platform 11 is provided with a packaging cavity 12, and an isolation plate 13 is horizontally fixedly connected to the central axis of the inner wall of the packaging cavity 12. A temperature control cavity 14 is provided at the bottom of the isolation plate 13. Both sides of the outer wall of the packaging platform 11 are connected and installed with a conveying pipe 15, and one end of the conveying pipe 15 extends into the temperature control cavity 14. A heating pipe 16 is installed on the outer wall of the conveying pipe 15 and on the side close to the temperature control cavity 14. A first electric heating wire is installed inside the heating pipe 16. An air pump 17 is installed on the outer wall of the conveying pipe 15 and on the side away from the temperature control cavity 14.

[0029] Furthermore, the isolation plate 13 is made of aluminum metal, and a temperature sensor is installed at the bottom of the isolation plate 13.

[0030] The linkage component 4 includes two sets of sealing plates 41; for example, such as Figure 6 As shown.

[0031] One side wall of each of the two sets of sealing plates 41 is attached to the outer wall of the protective box 2, and the two sets of sealing plates 41 are located on the outer wall of the observation window 8. The two sets of sealing plates 41 are fixedly connected by a crossbeam 42. A guide frame 43 is fixedly connected to the top of one set of sealing plates 41, and a limiting ring 44 for limiting contact with the first gear 7 is provided on the top of the guide frame 43. The inner wall of the guide frame 43 is sleeved on the outer wall of the first gear 7, and a rack 45 that meshes with the first gear 7 is also provided on one side of the inner wall of the guide frame 43.

[0032] The isolation component 5 includes a movable plate 51; for example, such as Figure 7 As shown.

[0033] The movable plate 51 is horizontally slidably connected to the outer wall of the protective box 2, and two sets of hinge seats 52 are installed on the top side of the movable plate 51. The output end of the cylinder 53 is rotatably connected to both sets of hinge seats 52. The side of the cylinder 53 away from the output end is rotatably connected to the outer wall of the support frame 3. The outer wall of the movable plate 51 is also provided with a guide groove 54, and the guide groove 54 is slidably connected to the outer wall of the conveying pipe 15. The inner wall of the guide groove 54 is also horizontally provided with an elastic sealing strip 55. The elastic sealing strip 55 is used to prevent the heat at the top of the protective box 2 from flowing downwards during the process of the conveying pipe 15 slidingly connected to the inner wall of the guide groove 54.

[0034] The temperature control component 6 includes two sets of horizontal plates 61; for example, such as... Figure 8 and Figure 9 As shown.

[0035] An arched plate 63 is fixedly connected between each of the two sets of horizontal plates 61, and the side of each set of horizontal plates 61 away from the arched plate 63 is fixedly connected to the inner wall of the protective box 2. Positioning holes 62 are provided on the outer walls of the two sets of horizontal plates 61, and the positioning holes 62 are fitted onto the ports of the conveying pipe 15. Several sets of through holes 64 are provided on the outer walls of the arched plate 63. Several sets of heating mechanisms 65 are rolled and fitted onto the outer walls of the arched plate 63. The end of one set of heating mechanisms 65 is connected to the first gear 7 for transmission. The ends of several sets of heating mechanisms 65 away from the first gear 7 are fixedly connected to the first gear 7. Two gears 68 are provided, and one side of each of several sets of the second gears 68 is meshed with an external gear ring 66. Both ends of the external gear ring 66 are fixedly connected to limit plates 67. The inner wall of the external gear ring 66 is fixedly connected to a linkage rod 69, and the output end of a stepper motor 610 is connected to the central axis of the linkage rod 69. The side of the stepper motor 610 away from the output end is embedded in the outer wall of the protective box 2. The ends of several sets of heating mechanisms 65 and the side near the second gear 68 are connected to air pipes 611. The other end of the air pipes 611 is connected to the air collecting shell 9.

[0036] The heating mechanism 65 includes a heating tube 651; for example, such as Figure 10 As shown.

[0037] The bottom of the heating tube 651 is provided with a guide groove 652, and the guide groove 652 is interconnected with several sets of through holes 64. The surface of the through holes 64 is provided with a filter screen. One end of the heating tube 651 is fixedly connected to a positioning rod 653, and the other end of the positioning rod 653 is rotatably connected to the inner wall of the protective box 2. The other end of the heating tube 651 is connected to a connecting pipe 654, and the port of the connecting pipe 654 is interconnected with the gas pipe 611. The inner wall of the heating tube 651 is provided with a second electric heating wire.

[0038] Specifically, the fan 10 operates continuously in the forward direction to deliver airflow to several sets of heating tubes 651. Utilizing the continuous operation of the second electric heating wire within the heating tubes 651, the airflow is heated. Then, the output end of the stepper motor 610 drives the linkage rod 69 to rotate, causing the external gear ring 66 to mesh with several sets of second gears 68. This causes the rotation angle of several sets of heating tubes 651 to be adjusted, bringing the guide grooves 652 of the heating tubes 651 close to the top of the inner wall of the protective box 2. Simultaneously, it seals the through holes 64, allowing the heated airflow to be stored in the interlayer between the arched plate 63 and the top of the inner wall of the protective box 2. The airflow is then transmitted again to the temperature control cavity 14 via the delivery pipe 15. Combined with the continuous operation of the first electric heating wire within the heating tube 16, the temperature within the temperature control cavity 14 is regulated. After the fan 10 stops working, the servo motor drives the first gear 7 to rotate, causing the rack 45 meshing with the first gear 7 to drive the two sets of sealing plates 41 to fall and block the observation window 8. Then, the output end of the cylinder 53 pushes the movable plate 51 to seal and isolate the inner wall of the protective box 2. Then, the stepper motor 610 drives the linkage rod 69 to rotate to the other side, so that the guide grooves 652 on several sets of heating pipes 651 are connected to several sets of through holes 64. This facilitates the storage of heat stored in the arched plate 63 and the top layer of the inner wall of the protective box 2 through the through holes 64 between the bottom of the arched plate 63 and the top of the movable plate 51 for later heat recovery and utilization. The continuous operation of the air pump 17 delivers room temperature airflow through the delivery pipe 15 to the temperature control chamber 14, which is used to cool the MOS chip in the packaging chamber 12 to room temperature in a timely manner after processing, to prevent warping and to allow it to be quickly removed from the work station.

[0039] The working principle of the MOS chip packaging and processing apparatus proposed in this embodiment of the invention is as follows: The fan 10 continuously operates in the forward direction to deliver airflow to several sets of heating tubes 651. The airflow is heated by the continuous operation of the second electric heating wire within each heating tube 651. The output of the stepper motor 610 then drives the linkage rod 69 to rotate, causing the external gear ring 66 to mesh with several sets of second gears 68. This rotation of the heating tubes 651 causes the guide grooves 652 of the heating tubes 651 to approach the top of the inner wall of the protective box 2, while simultaneously sealing the through holes 64. The heated airflow is stored in the interlayer between the arched plate 63 and the top of the inner wall of the protective box 2. The airflow is then transferred again to the temperature control chamber 14 via the delivery pipe 15. Combined with the continuous operation of the first electric heating wire within the heating tube 16, the temperature within the temperature control chamber 14 is regulated. After the fan 10 stops operating, the servo motor drives the first gear... The rotation of wheel 7 causes the rack 45, which is meshed with the first gear 7, to fall down and block the observation window 8. Then, the output end of cylinder 53 pushes the movable plate 51 to seal and isolate the inner wall of the protective box 2. Then, the stepper motor 610 drives the linkage rod 69 to rotate to the other side, so that the guide grooves 652 on several sets of heating tubes 651 are connected to several sets of through holes 64. This facilitates the storage of heat stored in the arched plate 63 and the top layer of the inner wall of the protective box 2 through the through holes 64 between the bottom of the arched plate 63 and the top of the movable plate 51 for later heat recovery and utilization. The continuous operation of air pump 17 delivers room temperature airflow through the delivery pipe 15 to the temperature control cavity 14 for timely room temperature cooling of the MOS chip in the packaging cavity 12 after processing, preventing warping and allowing it to be quickly removed from the work station.

[0040] Based on the aforementioned MOS chip packaging and processing apparatus, this embodiment of the invention also provides a packaging method for MOS chip processing, comprising the following steps: The rotation of the first gear 7 drives the linkage component 4 to move up and down, which is used to open or close the observation window 8. The MOS chip to be packaged is placed on top of the packaging stage assembly 1 through the observation window 8; The airflow is concentrated and delivered to the temperature control component 6 through the air collection shell 9 by the continuous operation of the fan 10; The temperature and direction of the airflow are changed by the temperature control component 6, so that the airflow suitable for the preheating temperature of the MOS chip is delivered to the top of the packaging stage component 1. The preheating temperature inside the protective box 2 is sealed by the isolation component 5, so that the sealed preheating temperature is stored inside the protective box 2, which reduces the need for temperature control of the MOS chip under different operating conditions and reduces heat loss.

[0041] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MOS chip packaging and processing apparatus, characterized in that: The device includes a packaging platform assembly; a protective box is threadedly fastened to the top of the packaging platform assembly, and a support frame is welded to the top of the protective box. A temperature control component is installed at the top of the inner wall of the protective box, and one end of the temperature control component is connected to a first gear via a servo motor drive. Observation windows are symmetrically opened on both sides of the outer wall of the protective box, and a linkage component for opening and closing the observation windows is slidably connected to the outer wall of the protective box. The linkage component is meshed with the first gear. Isolation components are rotatably connected to both sides of the support frame, and the isolation components are horizontally slidably connected to the two side walls of the protective box to isolate the cavity inside the protective box. The side of the temperature control component away from the first gear is connected to an air collecting shell, and a fan is installed on the outer wall of the air collecting shell. An air duct is installed on the other side of the fan, and both ends of the air duct are provided with a collection box for collecting dust and impurities inside the temperature control component.

2. The MOS chip packaging and processing apparatus according to claim 1, characterized in that: The packaging stage assembly includes a packaging stage; the top of the packaging stage has a packaging cavity, and an isolation plate is horizontally fixedly connected to the central axis of the inner wall of the packaging cavity, and a temperature control cavity is provided at the bottom of the isolation plate.

3. The MOS chip packaging and processing apparatus according to claim 2, characterized in that: Both sides of the outer wall of the packaging platform are connected to the conveying pipes, and one end of each conveying pipe extends into the temperature control cavity. A heating pipe is installed on the outer wall of the conveying pipe near the temperature control cavity, and a first electric heating wire is installed inside the heating pipe. An air pump is installed on the outer wall of the conveying pipe away from the temperature control cavity.

4. The MOS chip packaging and processing apparatus according to claim 1, characterized in that: The linkage assembly includes two sets of sealing plates; one side wall of each of the two sets of sealing plates is attached to the outer wall of the protective box, and the two sets of sealing plates are located on the outer wall of the observation window, and the two sets of sealing plates are fixedly connected by a crossbeam.

5. The MOS chip packaging and processing apparatus according to claim 4, characterized in that: A guide frame is fixedly connected to the top of a set of sealing plates, and a limiting ring for limiting and abutting the first gear is provided on the top of the guide frame. The inner wall of the guide frame is sleeved on the outer wall of the first gear, and a rack that meshes with the first gear is also provided on one side of the inner wall of the guide frame.

6. The MOS chip packaging and processing apparatus according to claim 1, characterized in that: The isolation assembly includes a movable plate; the movable plate is horizontally slidably connected to the outer wall of the protective box, and two sets of hinge seats are installed on the top side of the movable plate, and the output end of a cylinder is rotatably connected to each of the two sets of hinge seats. The side of the cylinder away from the output end is rotatably connected to the outer wall of the support frame. The outer wall of the movable plate is also provided with a guide groove, and the guide groove is slidably connected to the outer wall of the conveying pipe. The inner wall of the guide groove is also horizontally provided with an elastic sealing strip, and the elastic sealing strip is used to prevent heat from the top of the protective box from flowing downwards during the process of the conveying pipe slidingly connected to the inner wall of the guide groove.

7. The MOS chip packaging and processing apparatus according to claim 1, characterized in that: The temperature control component includes two sets of horizontal plates; an arched plate is fixedly connected between the two sets of horizontal plates, and the side of the two sets of horizontal plates away from the arched plate is fixedly connected to the inner wall of the protective box. The outer wall of the two sets of horizontal plates is provided with positioning holes, and the positioning holes are fitted into the port of the delivery pipe.

8. The MOS chip packaging and processing apparatus according to claim 7, characterized in that: The outer wall of the arched plate has several sets of through holes. Several sets of heating mechanisms are rolled and fitted to the outer wall of the arched plate. The end of one set of heating mechanisms is connected to the first gear. The end of each set of heating mechanisms away from the first gear is fixedly connected to a second gear. One side of each set of second gears is meshed with an external gear ring. Both ends of the external gear ring are fixedly connected to limit plates.

9. The MOS chip packaging and processing apparatus according to claim 8, characterized in that: The inner wall of the external gear ring is fixedly connected to a linkage rod, and the output end of the stepper motor is connected to the position of the central axis of the linkage rod. The side of the stepper motor away from the output end is embedded in the outer wall of the protective box. The ends of several sets of heating mechanisms and the side near the second gear are all connected to air pipes. The other end of the air pipes is connected to the air collecting shell.

10. A packaging method for a MOS chip packaging processing apparatus according to any one of claims 1-9, characterized in that: The encapsulation method includes: The rotation of the first gear drives the linkage component to move up and down, which is used to open or close the observation window; The MOS chip to be packaged is placed on top of the packaging stage assembly through the observation window; The continuous operation of the fan concentrates the airflow through the air collection shell and delivers it to the temperature control components; By changing the temperature and direction of the airflow through the temperature control component, the airflow suitable for the preheating temperature of the MOS chip is delivered to the top of the packaging stage assembly. The preheating temperature inside the protective enclosure is sealed by an isolation component, so that the sealed preheating temperature is stored inside the protective enclosure. This reduces the need for temperature control of the MOS chip under different operating conditions and reduces heat loss.

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