Power module, power conversion device, and photovoltaic system

Abstract

The application relates to the technical field of semiconductors, in particular to a power module, a power conversion device and a photovoltaic system. The power module comprises a packaging module and a thermal management device; the packaging module comprises a plurality of electronic elements packaged through a packaging structure; the thermal management device comprises a shell and compressed gas filled in the shell, the shell is provided with an exhaust port for discharging the compressed gas, and the exhaust port is in communication with a space outside the packaging module; the thermal management device is used for releasing the compressed gas to absorb the heat of the packaging module. The power module is provided with the thermal management device, the principle of sharp expansion and heat absorption when the compressed gas is released can rapidly cool the packaging module, the short-time heat dissipation requirement of the power module under overload can be met, the overload resistance of the power module can be improved, and the service life of the module can be prolonged.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a power module, power conversion device and photovoltaic system. Background Technology

[0002] Power conversion plays a crucial role in applications such as photovoltaic power generation, future energy storage, and power plants. Power conversion equipment inverts electrical energy before outputting it to end users or connecting it to the power grid. In practical applications, power conversion equipment is required to operate stably even under grid faults or fluctuations, and it must also possess excellent transient response capabilities. Therefore, high performance requirements are placed on the core component of power conversion equipment—the power module—which needs to have good overload resistance.

[0003] In related technologies, power modules mainly have two packaging forms: housing and molding. For both of these packaging forms, the heat dissipation path for electronic components such as chips in the power module is primarily at the bottom. However, due to the limitations of the thermal resistance of the solder, substrate, thermal grease, and other materials at the bottom, as well as the thermal resistance of various interfaces, the heat dissipation capacity of power modules in these two packaging forms is insufficient under transient high overload conditions. This results in poor overload resistance of the power module, leading to a reduced lifespan or even damage to the power conversion equipment, thus hindering the further development of photovoltaic power generation, future energy storage, and power plant technologies. Summary of the Invention

[0004] This application provides a power module, a power conversion device, and a photovoltaic system that can meet the short-term heat dissipation requirements of the power module under overload conditions and improve the overload resistance of the power module.

[0005] In a first aspect, this application provides a power module, which includes a package module and a thermal management device; the package module includes a plurality of electronic components packaged by a package structure; the thermal management device includes a housing and compressed gas filled in the housing, the housing having an exhaust port for discharging the compressed gas, the exhaust port being connected to a space outside the package module; the thermal management device is used to release the compressed gas to absorb heat from the package module.

[0006] The aforementioned power module is equipped with a thermal management device that utilizes the principle of rapid expansion and heat absorption when compressed gas is released to quickly cool the packaged module. This meets the short-term heat dissipation requirements of the power module under overload conditions, thereby improving its overload resistance and extending its lifespan. Compared to traditional heat dissipation methods, this approach offers higher heat dissipation efficiency.

[0007] In one embodiment, the housing is fixed to the packaging structure, at least a portion of the outer surface of the housing is in contact with the packaging structure, and the vent avoids the portion of the outer surface of the housing in contact with the packaging structure. The thermal management device and the packaging module have a relatively stable connection, facilitating the application of the packaging module and improving heat conduction.

[0008] In one embodiment, the outer surface of the encapsulation structure includes a mounting surface, and the outer surface of the housing includes a first region and a second region; the housing is mounted to the mounting surface via the first region, and the vent port on the outer surface of the housing is located in the second region. The housing is mounted to the outer surface of the encapsulation structure, facilitating arrangement and installation, and is particularly suitable for replaceable thermal management devices.

[0009] In one embodiment, the outer surface of the packaging structure is provided with a receiving groove, the inner wall of the receiving groove forms a mounting surface, and the housing is at least partially received within the receiving groove. Increasing the contact area between the thermal management device and the packaging structure can improve heat conduction efficiency, which is beneficial for reducing the heat conduction distance between the thermal management device and the electronic components, and can also enhance the connection stability between the thermal management device and the packaging module.

[0010] In one embodiment, the exhaust port faces the outer surface of the packaging structure, and the exhaust direction of the exhaust port is set at an acute angle to the outer surface of the packaging structure. The airflow formed when the compressed gas is released from the housing can blow on the surface of the packaging structure, accelerate the heat transfer between the surface of the packaging structure and the environment, and also enhance the heat dissipation of the packaging module.

[0011] In one embodiment, the housing is fixed within a packaging structure, which includes an exhaust channel. One end of the exhaust channel is connected to the exhaust port of the housing, and the other end is connected to the outer surface of the packaging structure, ensuring smooth airflow. By utilizing the space occupied by the packaging structure itself to house the thermal management device, the volume of the power module can be reduced, which is beneficial for device miniaturization.

[0012] In one embodiment, the extension length of the exhaust channel is greater than or equal to the shortest distance between the exhaust port of the housing and the outer surface of the encapsulation structure. This is to ensure that the compressed gas in the thermal management device is discharged as quickly as possible to expand and absorb heat when the module is overloaded.

[0013] In one embodiment, the power module includes a bracket, one end of which is fixed to the packaging module. The housing of the thermal management device is fixed to the bracket, and the housing and the packaging module are not in contact. The exhaust port faces the packaging module. Compressed gas is released from the housing of the thermal management device. As the compressed gas rapidly expands between the exhaust port and the packaging module, it absorbs heat from the packaging module, thus dissipating heat from the packaging module. Simultaneously, the compressed gas is discharged through the exhaust port and blown towards the packaging module, which can accelerate heat transfer between the surface of the packaging module and the environment, and also enhance the heat dissipation of the packaging module.

[0014] In one embodiment, the thermal management device includes a gas supply pipe that communicates with the internal space of the housing and is used to introduce gas into the housing. After the compressed gas in the thermal management device is released, the device loses its effectiveness. The device can be restored by replenishing gas into the housing as needed to cope with potential overloads in the future, and can be reused cyclically.

[0015] In one embodiment, the exhaust port is equipped with a pressure relief structure, which is used to open the exhaust port under set conditions. These set conditions include the internal pressure of the housing reaching the maximum pressure that the pressure relief structure can withstand, or the temperature of the power module reaching the melting point of the pressure relief structure. The pressure relief structure is a passive method for releasing compressed gas, which is convenient, effective, and low-cost. The pressure relief structure includes at least one of the following: a safety valve, a rupture disc, or a fusible plug.

[0016] In one embodiment, an electrically controlled valve assembly is provided at the exhaust port; the electrically controlled valve assembly is used to open the exhaust port when the temperature of the power module reaches a preset value. The status of the power module can be monitored by one or more devices such as a temperature sensor and an ammeter, and the operation of the electrically controlled valve assembly can be controlled based on the detection results. The electrically controlled valve assembly is a solution for actively releasing compressed gas, resulting in more precise control.

[0017] In one embodiment, the packaging module further includes a substrate, with multiple electronic components disposed on the surface of the substrate, and the packaging structure encapsulates the substrate and the multiple electronic components; along a direction perpendicular to the substrate, the orthographic projection of the thermal management device onto the surface of the substrate at least partially overlaps with the multiple electronic components. The shorter linear distance between the electronic components and the thermal management device facilitates faster heat transfer, thereby improving the heat dissipation rate when the module is overloaded.

[0018] Secondly, this application provides a power conversion device, which includes a circuit board and any of the power modules provided in the first aspect above, wherein the power module is electrically connected to the circuit board. Applying this power module to the power conversion device can improve its overload resistance and enhance its operational stability and reliability.

[0019] Thirdly, this application provides a power conversion device, which includes a circuit board, a power module, and a thermal management device. The power module is electrically connected to the circuit board. The thermal management device includes a housing and compressed gas filled within the housing. The housing has an exhaust port for discharging the compressed gas. The housing is fixed to the circuit board, and the exhaust port faces the encapsulation structure of the power module. The thermal management device utilizes the principle of rapid expansion and heat absorption when compressed gas is released to quickly cool the power module, thereby improving the overload resistance of the power conversion device and enhancing its operational stability and reliability.

[0020] Fourthly, this application provides a photovoltaic system, which includes photovoltaic modules and a photovoltaic inverter. The input terminal of the photovoltaic inverter is connected to the photovoltaic modules, and the output terminal of the photovoltaic inverter is used to connect to the power grid and / or a load. The photovoltaic inverter includes any of the power modules provided in the first aspect, or the photovoltaic inverter is a power conversion device provided by the second aspect or a third party. When this power module is applied to the photovoltaic system, it can address the problem of power module overload caused by grid fluctuations, enabling photovoltaic products to operate more stably. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a photovoltaic system provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0023] Figure 3a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0024] Figure 3b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0026] Figure 5 A heat dissipation mechanism for a power module provided in an embodiment of this application;

[0027] Figure 6 A schematic diagram of the structure of a thermal management device for a power module provided in an embodiment of this application;

[0028] Figure 7a The working mechanism of a thermal management device for a power module provided in this application embodiment;

[0029] Figure 7b The working mechanism of a thermal management device for a power module provided in this application embodiment;

[0030] Figure 8 A schematic diagram of the structure of a thermal management device for a power module provided in an embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the structure of a power module packaging module provided in an embodiment of this application;

[0032] Figure 10a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0033] Figure 10bThis is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0034] Figure 10c This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0035] Figure 11 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0036] Figure 12a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0037] Figure 12b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0038] Figure 13a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0039] Figure 13b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0040] Figure 13c This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0041] Figure 14a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0042] Figure 14b This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0043] Figure 14c This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0044] Figure 14d This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0045] Figure 15 This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0046] Figure 16a This is a schematic diagram of the structure of a power module provided in an embodiment of this application;

[0047] Figure 16b This is a schematic diagram of the structure of a power module provided in an embodiment of this application.

[0048] Figure label:

[0049] 100 - Photovoltaic inverter; 200 - Photovoltaic module; 300 - Grid; 400 - Load;

[0050] 10 - Power module; 20 - Circuit board; 30 - Heat sink;

[0051] 1-Packaging module; 11-Packaging structure; 111-Base plate; 112-Packaging body; 12-Electronic component; 13-Substrate; 14-Housing shell; 15-Cover plate; 151-Paper material; 152-Flexible pad; 2-Thermal management device; 21-Housing shell; 211-Middle section; 212-End section; 22-Gas supply pipe; 3-Support;

[0052] A1 - First area; A2 - Second area; K - Exhaust port; Q - Mounting surface. Detailed Implementation

[0053] Power modules are core components in power electronic devices, integrating one or more power electronic elements to convert and manage electrical energy. Therefore, they are widely used in photovoltaics, energy storage, electric vehicles, and other fields. With the continuous upgrading of energy efficiency requirements for power electronic systems due to technological advancements, power modules are evolving towards higher integration and higher power density. In power grid systems, power modules can be used for power conversion. Their high overload resistance ensures the stable operation of power conversion equipment. The overload resistance of a power module is closely related to its heat dissipation performance. If the heat generated by the power module cannot be dissipated in time, it will affect the safe operating time of the power module under high load or abnormal operating conditions, thus affecting the reliability and stability of the system operation.

[0054] Based on this, embodiments of this application provide a power module, a power conversion device, and a photovoltaic system. The power module is equipped with a thermal management structure to dissipate heat from the module in a timely manner when the system is overloaded, thereby improving the module's overload resistance.

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0056] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0057] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0058] To facilitate understanding of the power module, photovoltaic inverter, and photovoltaic system provided in the embodiments of this application, their application scenarios are described below. The power converter of this application can be applied to power supply systems and power generation systems. Taking a photovoltaic system as an example, a photovoltaic system can be used in application scenarios such as residential power stations and industrial photovoltaic power stations. A photovoltaic system can convert solar energy into electrical energy to supply the power grid or loads.

[0059] Figure 1 This is a schematic diagram illustrating an application scenario of the photovoltaic system provided in an embodiment of this application. For example... Figure 1 As shown, the photovoltaic system includes a photovoltaic module 200 and a photovoltaic inverter 100. The photovoltaic module 200 is a DC power supply composed of solar cells connected in series or parallel, used to convert the energy of sunlight into DC electrical energy. One end of the photovoltaic inverter 100 is connected to the output terminal of the photovoltaic module 200, and the other end is used to connect to the load and / or the power grid 300. The photovoltaic inverter 100 is used to convert the DC power from the photovoltaic module 200 into AC power and to supply the AC power to the power grid 300 and / or the load 400.

[0060] Figure 2 This is a schematic diagram of a power conversion device provided in an embodiment of this application. Figure 1 The photovoltaic inverter 100 in the figure represents one possible implementation of this power conversion device. (Reference) Figure 2As shown, the power conversion device includes a power module 10, a circuit board 20, and a heat sink 30. The power module 10 is electrically connected to the circuit board 20, and the heat sink 30 has thermally conductive contact with the power module 10 to dissipate heat from the power module 10. In this application, the circuit board 20 may be, for example, a printed circuit board (PCB). The power module 10 is the core component of the photovoltaic inverter 100 that realizes the power conversion function. The power module 10 may include multiple ports, such as input positive and negative ports, output positive and negative ports, power supply positive and negative ports, etc. These ports are electrically connected to the circuit board 20 through pins, thereby utilizing the circuit board 20 to provide current or voltage input and output, as well as power supply functions, to the power module 10. The heat sink 30 may employ air cooling, water cooling, or other heat dissipation methods; this application does not limit this. The circuit board 20 is a board-level structure used to house the power module 10, other chip packaging structures, etc.

[0061] In one embodiment, the heat sink 30 and the power module 10 can be connected by a thermal interface layer. The thermal interface layer can eliminate the gap between the power module 10 and the heat sink 30, increase the heat exchange channel, and improve the heat exchange efficiency.

[0062] The power module 10 may include various power devices such as chips, inductors, resistors or capacitors. These power devices are connected in a certain functional combination and then packaged into a whole through packaging technology.

[0063] Figure 3a An example is a power module 10 encapsulated in a plastic housing. Figure 3b An example of a power module 10 using a molded package is provided. Figure 3a and Figure 3b As shown, the power module 10 includes a structure consisting of a substrate 13, multiple electronic components 12, and a base plate 111. The substrate 13 is fixed to the base plate 111. The multiple electronic components 12 are disposed on the surface of the substrate 13 facing away from the base plate 111 for electrical connection to form a functional circuit. The pins T of the substrate 13 are led out perpendicularly along the thickness direction of the substrate 13. The substrate 13, the multiple electronic components 12, their circuit traces, and a portion of the pins T of the power module 10 need to be protected by plastic encapsulation through the package 112.

[0064] Figure 3a In the power module packaged in a plastic housing shown, the power module 10 further includes a housing 14. The housing 14 and the base plate 111 cooperate to form a receiving cavity, so that the substrate 13 and multiple electronic components 12 are housed in the receiving cavity. The leads T of the substrate 13 extend out through the housing 14 along the thickness direction of the substrate 13. During the packaging process, silicone gel or the like is poured into the receiving cavity to form a package 112 to protect each power device.

[0065] Figure 3bThe power module shown employs molded packaging. The power module 10 also includes a cover plate 15, which comprises stacked substrate 151 and a flexible pad 152. During the packaging process, a structure consisting of a substrate 13, multiple electronic components 12, and a base plate 111 is placed within the mold cavity of a molding fixture. The leads T of the substrate 13 pass through the cover plate 15 along the thickness direction of the substrate 13 and are interference-fitted with the cover plate 15, creating a gap between the cover plate 15 and the electronic components 12. Epoxy resin or similar materials are injected into the mold cavity of the molding fixture to form an encapsulation 112 to protect each power device.

[0066] Taking the photovoltaic industry as an example, photovoltaic products, including power modules 10, need to operate more stably in new power grid architectures, requiring improved overload resistance. The high integration and high power density development of power modules 10 are accompanied by heat dissipation challenges. When the system is overloaded, the current through the power module 10 increases rapidly, leading to increased heat dissipation demands. Insufficient or ineffective heat dissipation will affect the overload resistance of the power module 10.

[0067] This application provides an embodiment of a method. Figure 4 The power module 10 shown is equipped with a thermal management device for heat dissipation, which can dissipate heat from the module in a timely manner when the system is overloaded, thereby improving the module's overload resistance.

[0068] like Figure 4 As shown, the power module 10 includes a packaging module 1 and a thermal management device 2. The packaging module 1 includes multiple electronic components 12 encapsulated by a packaging structure 11. These multiple electronic components 12 are electrically connected to form a functional circuit. The electronic devices included in these multiple electronic components 12 include active devices such as chips, and may also include passive devices such as capacitors, inductors, and resistors. Those skilled in the art can select the type and quantity of electronic components 12 according to actual needs; this application does not limit this selection. The packaging structure 11 serves as the carrier for encapsulating the electronic components 12, providing protection, support, heat dissipation, and assembly functions.

[0069] In some embodiments, electronic component 12 is an electronic device with power conversion function: high-power transistor, thyristor, bidirectional thyristor, metal-oxide-semiconductor field-effect transistor (MOSFET), insulated-gate bipolar transistor (IGBT), diode, silicon controlled rectifier (SCR), SiC, GaN, etc. The connection method of multiple electronic components 12 is not limited; the devices can be connected in series or in parallel to form a functional circuit, or the devices can be independent units. This effectively reduces the number of devices, saves on the copper trace connection required for discrete devices on the circuit board, optimizes the size design of the circuit board, and thus reduces the size of the power devices. The topology of multiple electronic components 12 can be single-transistor, half-bridge, H-bridge, three-phase full-bridge, three-level, etc.

[0070] The heat generated by electronic component 12 during normal operation can be continuously dissipated through the packaging structure 11 of the packaging module 1 or the heat sink configured for the packaging module 10, ensuring that electronic component 12 can maintain normal operation. When electronic component 12 is subjected to short-term overload, timely heat dissipation is required through thermal management device 2 to prevent damage to the module due to short-term overload. This thermal management device 2 uses the principle of gas compression releasing heat and expansion absorbing heat to dissipate heat from the module for short-term, in order to meet the heat dissipation requirements of power module 10 under short-term overload.

[0071] In one embodiment, such as Figure 4 As shown, the thermal management device 2 includes a housing 21 and compressed gas filled within the housing 21. The housing 21 has an exhaust port K for discharging the compressed gas. The compressed gas is pre-compressed and stored within the housing 21. The compressed gas stored within the housing 21 has a high density and a high pressure, exceeding atmospheric pressure. When the exhaust port K is open, the compressed gas within the housing 21 is discharged through the exhaust port K and expands rapidly, absorbing heat during the expansion process. By configuring the thermal management device 2 onto the encapsulation module 1, the compressed gas in the thermal management device 2 absorbs heat during expansion, thus dissipating heat from the encapsulation module 1. The rapidly expanding compressed gas has a high heat absorption efficiency, enabling rapid heat dissipation of the encapsulation module 1.

[0072] Combination Figure 4The power module 10 shown has a thermal management device 2, which is a pre-stored device with high latent heat. When the power module 10 is subjected to a short-term overload, the thermal management device 2 can operate quickly to achieve heat dissipation in a short time. Latent heat refers to the heat absorbed or released by a unit mass of a substance when it changes from one phase to another under isothermal and isobaric conditions. The compressed gas in the thermal management device 2 absorbs latent heat when it changes from a denser compressed state to a less dense expanded state. In some embodiments, the compressed gas can be in a liquid or gas-liquid mixture state in the compressed state, and becomes gaseous after expansion.

[0073] It should be understood that during the process of the compressed gas in the housing 21 being discharged through the exhaust port K, the gas molecules absorb and consume heat during the expansion process. The temperature of the expanded gas will not increase significantly, but will instead increase the temperature of the encapsulation structure 11.

[0074] For ease of understanding, the operating mechanism of the thermal management device 2 provided in this application embodiment for heat dissipation of the encapsulation module 1 is compared to the fire protection operating mechanism. For example... Figure 5 As shown, the thermal management device 2 is a "fire-fighting device" with high latent heat pre-configured for the power module 10. A short-term overload of the power module 10 can be likened to a "fire". When the power module 10 experiences an overload, which is a "fire", the thermal management device 2, as a "fire-fighting device", quickly starts to operate and cools down the module in a short time to achieve a "fire-extinguishing" effect.

[0075] Therefore, the power module 10 with thermal management device 2 provided in this application embodiment can dissipate heat from the packaged module 1 in a short time during short-term overload through the rapid operation of thermal management device 2, thereby improving the overload resistance of the power module 10. Compared with traditional phase change heat dissipation methods, it has higher heat dissipation efficiency and better heat dissipation effect.

[0076] Figure 6 An example of a thermal management device 2 is provided. The housing 21 of the thermal management device 2 is cylindrical in shape. When containing compressed gas, the pressure applied to the housing 21 by the compressed gas can be distributed more evenly, avoiding the problem of local stress concentration and improving the safety and stability of the system. Specifically, the housing 21 includes a middle part 211 and two ends 212. The middle part 211 is cylindrical, and the two ends 212 are hemispherical. The two ends 212 are fastened to the two ends of the middle part 211 along the axial direction. The entire structure has higher strength and stability.

[0077] In one embodiment, the exhaust port K of the thermal management device 2 is located in the middle 211 of the housing 21 to reduce the impact on the housing 21 when releasing compressed gas and reduce the risk of the housing 21 being deformed by pressure.

[0078] When the thermal management device 2 is provided with multiple exhaust ports K, the multiple exhaust ports K can be arranged at intervals along the axial direction of the housing 21 to disperse the impact of compressed gas on the housing 21 when it is released. Specifically, the multiple exhaust ports K can be arranged in a uniform manner as needed.

[0079] The thermal management device 2 provided in this application embodiment can release compressed gas under either passive or active triggering conditions, which can be selected according to the application environment of the power module 10.

[0080] In one embodiment, the exhaust port K of the housing 21 is provided with a pressure relief structure. The pressure relief structure is used to open the exhaust port K under set conditions. These set conditions include pressure and temperature conditions. Specifically, when the internal pressure of the housing 21 reaches the maximum pressure that the pressure relief structure can withstand, the pressure relief structure can be ruptured by the pressure to open the exhaust port. Alternatively, when the temperature of the pressure relief structure reaches its melting point, the exhaust port K is opened. It should be understood that the configuration of the pressure relief structure can choose one or both of these mechanisms; when the power module 10 is overloaded, opening the exhaust port K is sufficient as long as one of these mechanisms is met. The pressure relief structure includes at least one of the following: a safety valve, a rupture disc, or a fusible plug. The pressure relief structure is a passive method for releasing compressed gas, which is convenient, effective, and low-cost.

[0081] In one embodiment, an electrically controlled valve assembly is provided at the exhaust port K of the housing 21. This assembly is used to open the exhaust port K when the temperature of the power module 10 reaches a preset value. A thermal management device 2 is configured in the power module 10 to monitor its temperature, current, and other status parameters to determine if the power module 10 is overloaded. When an overload is detected, the electrically controlled valve assembly is activated to open the exhaust port K, allowing the compressed gas inside the housing 21 to be released through the exhaust port K and expand, absorbing heat. The status of the power module 10 can be monitored using one or more devices, such as a temperature sensor and an ammeter. The electrically controlled valve assembly provides an active release of compressed gas, resulting in more precise control.

[0082] Figure 7a and Figure 7b This application illustrates two working mechanisms of the thermal management device 2 provided in its embodiments. The thermal management device 2 can be... Figure 7a The one-time structure shown can also be Figure 7b The diagram shows a resettable structure.

[0083] like Figure 7aAs shown, the thermal management device 2 operates when an overload occurs, rapidly releasing compressed gas to absorb heat and reduce the impact of short-term temperature rise in the module caused by the overload. After the compressed gas in the thermal management device 2 is released, its effectiveness disappears, and it needs to be replaced to cope with the next possible overload. This thermal management device 2 is suitable for power modules 10 with low overload risk. Such power modules 10 have a low frequency of overloads during their service life and may not even encounter overloads. Even if an overload occurs, replacing the thermal management device 2 will not incur significant workload or replacement costs.

[0084] like Figure 7b As shown, the thermal management device 2 operates when an overload occurs, rapidly releasing compressed gas to absorb heat and reduce the impact of short-term temperature rise in the module caused by the overload. After the compressed gas in the thermal management device 2 is released, its effectiveness disappears. The thermal management device 2 can be restored as needed by replenishing gas into the housing 21 to cope with the next possible overload, and it can be reused repeatedly. This type of thermal management device 2 is suitable for power modules 10 with a high risk of overload, as these power modules 10 experience a high number of overloads within their service life. Restoring the thermal management device 2 by replenishing gas reduces workload and saves costs.

[0085] Based on the recoverable thermal management device 2, embodiments of this application provide, as follows: Figure 8 The thermal management device 2 shown is an example. Figure 8 As shown, the thermal management device 2 also includes a gas supply pipe 22, which communicates with the internal space of the housing 21. When gas needs to be supplied to the thermal management device 2, gas can be introduced into the housing 21 through the gas supply pipe 22, so that the housing 21 can be filled with compressed gas that meets the heat dissipation requirements. When the gas supply pipe 22 delivers gas into the housing 21, the compressed gas can be gas that has been compressed before delivery, or compressed gas that is gradually compressed after being delivered into the housing 21. The heat dissipation requirements of the power module 10 are related to the amount and pressure of the compressed gas. In some embodiments, the type of compressed gas may also be selected according to the different requirements of the power module 10; choosing air as the compressed gas can save costs.

[0086] In one embodiment, the gas supply pipe 22 of the thermal management device 2 is connected to one end 212 of the housing 21. The extension direction of the gas supply pipe 22 is parallel or approximately parallel to the axial direction of the housing 21, thereby reducing the influence of the airflow when the gas enters the housing 21 on the gas distribution state inside the housing 21.

[0087] The power module 10 provided in this embodiment has a high heat absorption value and better heat conduction effect due to the rapid release of compressed gas through the thermal management device 2. Configuring the thermal management device 2 on the encapsulation module 1 allows for effective heat dissipation of the encapsulation module 1 in a short time during overload, thereby improving the overload resistance of the power module 10 and enhancing the stability of system operation.

[0088] Figure 9 An example is provided of the structure of a package module 1 for a power module 10, which is exemplified by an electronic component 12. Figure 6 As shown, the packaging module 1 also includes a substrate 13, on which the electronic component 12 is disposed. The packaging structure 11 encapsulates the electronic component 12 and the substrate 13. The substrate 13 is provided with pins T, one end of which is disposed on the same surface as the electronic component 12 on the substrate 13, and the other end of which extends out of the packaging module 1 through the packaging structure 11 to facilitate external circuit connection. In some embodiments, the electronic component 12 and the substrate 13 are also connected by a connecting wire, which may specifically be a bonding wire (clip) or other wire.

[0089] Specifically, substrate 13 can be a substrate prepared by direct bonded copper (DBC) ceramic process, and electronic component 12 can be connected to the copper layer of substrate 13. DBC ceramic refers to the process of coating one or both sides of a ceramic substrate with copper and bonding the copper to the ceramic layer using high temperature. Substrate 13 can also be prepared by direct plate copper (DPC) ceramic substrate vacuum sputtering process, which refers to the method of depositing a copper layer onto a ceramic substrate using vacuum sputtering, and then using a development process to manufacture electrical circuits. Substrate 13 can also be prepared by active metal bonding (AMB) process, specifically referring to the high-temperature metallurgical bonding of aluminum nitride and oxygen-free copper using active metal solder. It is understood that the embodiments of this application do not limit substrate 13 to a DBC ceramic substrate; it can also be a copper-clad metal substrate, etc. A copper-clad metal substrate refers to a substrate with aluminum, copper, iron, molybdenum, etc., as the base material, covered with a thermally conductive insulating layer, and then covered with a copper layer on the side of the thermally conductive insulating layer facing away from the metal base material. Of course, the metal layer of the substrate 13 is not limited to copper; it can also be other metal layers such as gold.

[0090] In one embodiment, the package structure 11 includes a base plate 111 and a package body 112. A substrate 13 is fixed to the base plate 111 on the surface of the electronic component 12 facing away from the base plate 111. The package body 112 is bonded to the base plate 111 and covers the substrate 13 and the electronic component 12. Pins T extend through the package body 112 away from the base plate 111 and are exposed on the surface of the package body 112 facing away from the base plate 111. The surface of the base plate 111 facing away from the substrate 13 is exposed, while the other surfaces of the base plate 111 are covered by the package body 112.

[0091] It should be noted that, Figure 9 The purpose is merely to illustratively describe one structure of the packaging module 1, and is not to specifically limit the structure included in the packaging module 1, the connection positions of each structure, the specific construction of each structure, or the quantity of each structure. In other embodiments of this application, the power module 10 may include a... Figure 9 More components, or combining some components, or splitting some components, or different component arrangements.

[0092] The power module 10 provided in this application embodiment may have multiple implementations for configuring the aforementioned thermal management device 2 in the package module 1. Next, we will discuss... Figure 9 The encapsulation module 1 shown is used as a basic architecture to illustrate the implementation of the thermal management device 2.

[0093] In some embodiments, the housing 21 of the thermal management device 2 is fixed to the packaging module 1 in contact with the packaging module 1. The thermal management device 2 can absorb the heat of the packaging module 1 through heat conduction in contact with the packaging module 1, thereby achieving heat dissipation for the packaging module 1. The thermal management device 2 is connected to the packaging module 1, and the two have a relatively stable connection relationship, which facilitates the application of the packaging module 10 and improves the heat conduction effect.

[0094] Based on the scheme of connecting the thermal management device 2 to the packaging module 1, the thermal management device 2 can, as Figure 10a The encapsulation structure 11 is shown connected to the encapsulation module 1. Specifically, the housing 21 is connected to the encapsulation structure 11, and when the compressed gas expands and absorbs heat, it can absorb the heat of the encapsulation module 1 through the interface where the housing 21 is connected to or in contact with the encapsulation structure 11.

[0095] In one embodiment, the thermal management device 2 is disposed on the outer surface of the encapsulation structure 11, with at least a portion of the thermal management device 2 exposed on the outer surface of the encapsulation structure 11. The placement of the thermal management device 2 on the outer surface of the encapsulation structure 11 facilitates its arrangement and installation, and is particularly suitable for replaceable thermal management devices.

[0096] The outer surface of the encapsulation structure 11 includes a mounting surface Q, and the outer surface of the housing 21 includes a first region A1 and a second region A2. The housing 21 of the thermal management device 2 is mounted on the mounting surface Q of the encapsulation structure 11 through the first region A1, thus connecting the thermal management device 2 and the encapsulation module 1. The exhaust port K on the outer surface of the housing 21 is located in the second region A2. The purpose of this design is to ensure that the exhaust port K of the housing 21 avoids the part of the housing 21 that contacts the encapsulation structure 11, preventing the compressed gas inside the housing 21 from being blocked or obstructed from escaping through the exhaust port K. The mounting surface Q of the encapsulation structure 11 at least partially overlaps with the first region A1 of the housing 21.

[0097] Taking the thermal management device 2 disposed on the outer surface of the package body 112 of the packaging structure 11 as an example, the mounting surface Q is a part of the outer surface of the package body 112. Figure 10a As shown, the housing 21 of the thermal management device 2 is disposed on the surface of the encapsulation body 112 facing away from the base plate 111, and the surface of the thermal management device 2 facing the encapsulation body 112 is flush with the surface of the encapsulation body 112 facing away from the base plate 111. Along a direction parallel to the base plate 111, the structures of the thermal management device 2 and the encapsulation body 112 do not overlap. When the thermal management device 2 can be disassembled and replaced, the housing 21 and the encapsulation body 112 can be detachably connected by means of snap-fit, threaded connection, etc. When the thermal management device 2 cannot be replaced, the housing 21 and the encapsulation body 112 can be fixed by means of adhesive bonding, welding, etc.

[0098] When the power module 10 is overloaded, the compressed gas inside the housing 21 of the thermal management device 2 is released and discharged through the exhaust port K. The orientation of the exhaust port K of the housing 21 avoids the structure of the encapsulation module 1, which can ensure smooth release of compressed gas, improve the expansion rate of compressed gas, and improve heat absorption efficiency.

[0099] In some embodiments, the exhaust port K of the housing 21 faces away from the mounting surface Q of the encapsulation structure 11, and the compressed gas is released to... Figure 10a The way shown, which moves away from the packaging module 1, will not affect the heat dissipation of the packaging module 1.

[0100] In some embodiments, the vent K of the housing 21 may also face other areas of the encapsulation structure 11 besides the mounting surface Q, such as... Figure 10b The airflow formed when the compressed gas is released from the housing 21 can blow on the surface of the packaging structure 11, accelerating heat transfer between the surface of the packaging structure 11 and the environment, and also enhancing the heat dissipation of the packaging module 1. Figure 10b In the encapsulation module 10 shown, the orientation of the exhaust port K forms an acute angle with the surface of the encapsulation structure 11.

[0101] Refer to together Figure 10a and Figure 10b As shown, when the thermal management device 2 is disposed on the surface of the package 112 away from the base plate 111, the heat of the electronic component 12 needs to be transferred to the thermal management device 2 through the package 112. In order to reduce the length of the heat conduction path, in some embodiments, the orthographic projection of the thermal management device 2 on the substrate 13 along the thickness direction perpendicular to the substrate 13 at least partially overlaps with the electronic component 12, so that there is a shorter straight-line distance between the electronic component 12 and the housing 21 of the thermal management device 2, which is beneficial to improve the speed of heat transfer, thereby improving the heat dissipation rate when the module is overloaded.

[0102] In some embodiments, such as Figure 10c As shown, multiple thermal management devices 2 can be configured for the packaging module 1 as needed. The multiple thermal management devices 2 can be set at different positions on the surface of the package 112 away from the base plate 111 to increase the number of paths for the electronic components 12 to transfer heat through the package 112, thereby improving the heat dissipation effect and enhancing the heat dissipation uniformity of the packaging module 1.

[0103] The packaging module 1 is equipped with multiple thermal management devices 2. Along the thickness direction perpendicular to the substrate 13, the orthographic projection of at least one of the multiple thermal management devices 2 on the substrate 13 at least partially overlaps with the electronic component 12. Of course, as needed, more thermal management devices 2 can be provided at the positions corresponding to the electronic component 12 to provide targeted heat dissipation for the electronic component 12.

[0104] like Figure 11 As shown, the thermal management device 2 is disposed on the outer surface of the package 112 in the packaging structure 11. The thermal management device 2 can be located on the circumferential side of the package 112. The circumferential side of the package 112 is defined with reference to the thickness direction of the base plate 111; that is, the side of the package 112 surrounding the thickness direction of the base plate 111 is the circumferential side. By disposing the thermal management device 2 on the circumferential side of the package 112, targeted heat dissipation can be achieved for a specific electronic component in the packaging module 1 that is close to the package 112.

[0105] Based on the scheme of setting the thermal management device 2 on the outer surface of the package 112 in the packaging structure 11, when there are multiple thermal management devices 2, they can be arranged at different positions on the outer surface of the package 112 to achieve a more balanced heat dissipation effect. For example, at least one thermal management device 2 can be provided on the surface of the package 112 away from the base plate 111, and at least one thermal management device 2 can be provided on the circumferential side of the package 112.

[0106] When the power module 10 is overloaded, the heat generated by the electronic components 12 can be transferred through the package 112 to the housing 21 of the thermal management device 2, forming a heat conduction path between the package 112 and the housing 21. When the compressed gas inside the housing 21 is released, the expanding gas absorbs the heat from the package 112 through the housing 21, thus dissipating heat from the package module 1. The size of the contact area between the first region A1 of the housing 21 and the mounting surface Q of the package structure 11 affects the effectiveness of heat conduction.

[0107] In one embodiment, such as Figure 12a As shown, a recessed receiving groove can be formed on the surface of the package 112, recessed towards the base plate 111. The inner wall of the receiving groove is used to contact the outer surface of the housing 21, and the inner wall of the receiving groove forms the mounting surface Q. The housing 21 of the thermal management device 2 is at least partially received in the receiving groove, and the area where the housing 21 contacts the inner wall of the receiving groove is the first area A1. The receiving groove receives the thermal management device 2, embedding the thermal management device 2 into the package 112, which helps to reduce the thermal conduction distance between the thermal management device 2 and the electronic component 12, and can also enhance the connection stability between the thermal management device 2 and the package module 1. Of course, in the scheme where the thermal management device 2 is partially embedded in the package 112, the receiving groove can also be provided on the circumferential side of the package 112.

[0108] As a specific example, the receiving groove of the package 112 is adapted to the housing 21 of the thermal management device 2. The package 112 accommodates the thermal management device 2 in a semi-enclosed manner, that is, the inner wall of the receiving groove forms the mounting surface Q. The thermal management device 2 is accommodated in the groove in a semi-embedded manner. The contact area between the thermal management device 2 and the package 112 is increased, which can improve the heat conduction efficiency between the package 112 and the housing 21.

[0109] In such Figure 12b In the power module 10 shown, most of the housing 21 of the thermal management device 2 is embedded in the encapsulation 112, and the exhaust port K is exposed in the area where the port of the exhaust port K is located on the outer surface of the housing 21, which is the second area A2. The contact area between the housing 21 and the encapsulation 112 is further increased, thereby further improving the heat conduction effect.

[0110] It should be understood that when the power module 10 is packaged, the package body 112 is formed by injecting and solidifying the molten packaging material. The embedded structure between the thermal management device 2 and the package body 112 can be achieved during the packaging process. The molten packaging material can contact the shell 21 more closely, and the contact interface between the shell 21 and the package body 112 has better bonding, which is beneficial to improving the heat conduction effect.

[0111] Based on the scheme where the thermal management device 2 is disposed on the outer surface of the packaging structure 11, the thermal management device 2 can be disposed on the surface of the base plate 111. For example... Figure 13a As shown, the mounting surface Q is a portion of the outer surface of the base plate 111. The surface of the base plate 111 facing away from the substrate 13 exposes the surface of the encapsulation module 1, and a portion of this surface of the base plate 111 can be used to form the mounting surface Q. The electronic component 12 is disposed on the surface of the substrate 13 facing away from the base plate 111, and the thermal management device 2 is disposed on the surface of the base plate 111 facing away from the substrate 13. The electronic component 12 and the thermal management device 2 are separated by a portion of the substrate 13 and the base plate 111, thus reducing the distance for heat conduction. Depending on whether the thermal management device 2 is replaceable, the housing 21 of the thermal management device 2 and the base plate 111 can be fixed by adhesive bonding, welding, or other methods, or they can be detached by snap-fitting, threaded connection, or other methods.

[0112] In some embodiments, the substrate 13 includes metal components, such that the thermal conductivity of the substrate 13 is higher than that of the package 112, which can further improve the rate at which the heat generated by the electronic components 12 is transferred to the thermal management device 2 via the substrate 13 and the base plate 111.

[0113] exist Figure 13a In the power module 10 shown, a portion of the surface of the base plate 111 facing away from the substrate 13 forms a mounting surface Q. The housing 21 of the thermal management device 2 is fixed to the mounting surface Q on the side facing the base plate 111. A portion of the outer surface of the housing 21 facing the base plate 111 forms a first region A1, and the outer surface of the housing 21 that does not contact the base plate 111 forms a second region A2. The surface of the thermal management device 2 facing the base plate 111 is flush with the surface of the base plate 111 facing away from the substrate 13. The structures of the thermal management device 2 and the base plate 111 do not overlap in a direction parallel to the base plate 111. The orientation of the exhaust port K of the housing 21 can be chosen to face away from the mounting surface Q of the base plate 111 to ensure sufficient space for gas expansion and improve heat absorption. Alternatively, the exhaust port K of the housing 21 can be chosen to face other areas of the encapsulation structure 11 besides the mounting surface Q, using the ejected airflow to assist in heat dissipation.

[0114] Please continue to refer to Figure 13a As shown, when the thermal management device 2 is disposed on the surface of the base plate 111 away from the substrate 13, the heat of the electronic component 12 needs to be transferred to the thermal management device 2 through the package substrate 13 and the base plate 111. In order to reduce the length of the heat conduction path, in some embodiments, the orthographic projection of the thermal management device 2 on the substrate 13 along the thickness direction perpendicular to the substrate 13 at least partially overlaps with the electronic component 12, so that there is a shorter straight-line distance between the electronic component 12 and the housing 21 of the thermal management device 2, which is beneficial to improve the speed of heat transfer, thereby improving the heat dissipation rate when the module is overloaded.

[0115] Of course, multiple thermal management devices 2 can be configured for the packaging module 1 as needed. These multiple thermal management devices 2 can be positioned at different locations on the surface of the base plate 111 opposite to the substrate 13 to increase the number of paths through which the electronic component 12 transfers heat via the substrate 13 and the base plate 111, thereby improving heat dissipation and enhancing the heat dissipation uniformity of the packaging module 1. Along the thickness direction perpendicular to the substrate 13, at least one of the multiple thermal management devices 2 has its orthographic projection on the substrate 13 at least partially overlapping with the electronic component 12. Alternatively, more thermal management devices 2 can be provided at locations corresponding to the electronic component 12 as needed to provide targeted heat dissipation for the electronic component 12.

[0116] Figure 13b An example is provided where a recessed receiving groove is formed on the surface of the base plate 111, recessed towards the substrate 13. The inner wall of the receiving groove can be used to contact the outer surface of the housing 21, and the inner wall of the receiving groove forms a mounting surface Q. The housing 21 of the thermal management device 2 is at least partially received within the receiving groove, and the area where the housing 21 contacts the inner wall of the receiving groove is the first area A1. The receiving groove accommodates the thermal management device 2, embedding the thermal management device 2 into the base plate 111, which helps to reduce the thermal conduction distance between the thermal management device 2 and the electronic component 12, and also enhances the connection stability between the thermal management device 2 and the packaging module 1. As a specific example, the receiving groove of the base plate 111 is adapted to the housing 21 of the thermal management device 2. The base plate 111 accommodates the thermal management device 2 in a semi-enclosed manner, that is, the inner wall of the receiving groove forms the mounting surface Q, and the thermal management device 2 is received in the groove in a semi-embedded manner. The contact area between the thermal management device 2 and the base plate 111 is increased, which can improve the thermal conduction efficiency between the base plate 111 and the housing 21.

[0117] In such Figure 13c In the power module 10 shown, most of the housing 21 of the thermal management device 2 is embedded in the encapsulation 112, and the exhaust port K is exposed in the area where the port of the exhaust port K is located on the outer surface of the housing 21, which is the second area A2. The contact area between the housing 21 and the encapsulation 112 is further increased, thereby further improving the heat conduction effect.

[0118] It should be understood that when the power module 10 is packaged, the base plate 111 is a molded structure, and the embedded structure between the thermal management device 2 and the base plate 111 can be realized during the preparation of the base plate 111. Alternatively, after the base plate 111 is molded, a receiving groove is formed on the base plate 111 by means of etching, extrusion, etc., to accommodate the thermal management device 2.

[0119] Based on the above-mentioned technical solution of setting the thermal management device 2 on the surface of the packaging module 1, when the power module 10 is equipped with multiple thermal management devices 2, the thermal management devices 2 can be arranged at different positions on the outer surface of the packaging module 1 as needed, so as to achieve the purpose of heat dissipation in a short time and improve the uniformity of heat transfer.

[0120] Based on the scheme where the thermal management device 2 is installed in the packaging module 1, the thermal management device 2 can, as Figures 14a to 14d The thermal management device 2 is housed within the packaging module 1. The packaging structure 11 has an exhaust port K connecting the thermal management device 2 to an exhaust channel D on its outer surface. By utilizing the space occupied by the packaging structure 11 itself to house the thermal management device 2, the volume of the power module 10 can be reduced, which is beneficial for device miniaturization.

[0121] in, Figure 14a The thermal management device 2 is disposed within the package 112 of the packaging structure 11. Figure 14b The thermal management device 2 is disposed within the base plate 111 of the encapsulation structure 11. Figure 14c The thermal management device 2 is disposed on the surface of the base plate 111 facing the substrate 13, and the package 112 encapsulates the housing 21 of the thermal management device 2. Figure 14d The thermal management device 2 is partially embedded in the base plate 111 and partially encapsulated by the encapsulation body 112.

[0122] Refer to together Figures 14a to 14d As shown, the compressed gas inside the housing 21 of the thermal management device 2 is discharged through the exhaust port K and then needs to be discharged through the exhaust channel D to the outer surface of the encapsulation structure 11 for expansion and heat absorption. The exhaust channel D is used to connect the exhaust port K, and the diameter of the exhaust port K is adapted to ensure smooth airflow.

[0123] In some embodiments, to enable the compressed gas in the thermal management device 2 to expand rapidly when the module is overloaded, the exhaust port K of the thermal management device 2 is positioned closer to the surface of the packaging structure 11, reducing the extension length of the exhaust channel D, thereby reducing the path of the compressed gas discharged through the exhaust channel D. In the optimal case, the extension length of the exhaust channel D is equal to the shortest distance between the exhaust port K of the housing 21 and the outer surface of the packaging structure 11. Considering the complexity of the device layout in the packaging module 1, the extension length of the exhaust channel D may also be greater than the shortest distance between the exhaust port K of the housing 21 and the outer surface of the packaging structure 11 to avoid structural overlap.

[0124] Based on the scheme of setting the thermal management device 2 inside the packaging module 1, when there are multiple thermal management devices 2, the layout positions of the multiple thermal management devices 2 can be set according to the layout of different devices in the packaging module 1. For example, at least one thermal management device 2 can be set in the base plate 111, at least one thermal management device 2 can be set in the package body 112, and at least one thermal management device 2 can be set on the surface of the base plate 111 facing the substrate 13.

[0125] It should be understood that when multiple thermal management devices 2 are connected to the packaging module 1, the schemes of setting the thermal management devices 2 inside the packaging module 1 and on the outer surface of the packaging module 1 can be combined and implemented. That is, different local schemes of the thermal management devices 2 relative to the packaging module 1 in the above embodiments can be implemented by combining two or more of them.

[0126] This application embodiment also provides a method such as Figure 15 The power module 10 shown includes a package module 1 and a thermal management device 2. The housing 21 of the thermal management device 2 is not directly connected to the package module 1, and the electronic components 12 in the package module 1 cannot transfer heat to the housing 21 of the thermal management device 2 through contact heat transfer. The exhaust port K of the housing 21 faces the outer surface of the package module 1. When the power module 10 is overloaded, the compressed gas inside the housing 21 of the thermal management device 2 is released. The compressed gas is discharged through the exhaust port K and blown towards the package module 1. When the compressed gas rapidly expands between the exhaust port K and the package module 1, it absorbs the heat of the package module 1, thereby achieving heat dissipation for the package module 1. At the same time, the airflow formed when the compressed gas is released from the housing 21 can blow on the surface of the package module 1, accelerating the heat transfer between the surface of the package module 1 and the environment, and also enhancing the heat dissipation of the package module 1.

[0127] Based on the heat dissipation mechanism of the above-mentioned thermal management device 2, the distance between the exhaust port K of the thermal management device 2 and the packaging module 1, as well as the orientation of the exhaust port K, are related to the heat dissipation effect. It is necessary to ensure that the compressed gas can absorb heat quickly and smoothly, and to ensure that the heat conduction distance between the exhaust port K and the packaging module 1 is not too far to reduce the heat transfer effect.

[0128] Figure 15 The thermal management device 2 is shown to be located on the side of the package 112 away from the base plate 111. However, the thermal management device 2 can also be located in other positions on the package module 1. For example, it can be located on the side of the base plate 111 away from the substrate 13, or it can be located on the circumferential outer side of the package 112. When multiple thermal management devices 2 are provided, they can be positioned at different locations on the heat dissipation module 1 according to heat dissipation requirements.

[0129] In the applicable state, the position of the thermal management device 2 relative to the packaging module 1 is fixed in the power module 10 provided in this application embodiment. The thermal management device 2 can also be fixed to the packaging module 1 using a structure such as a bracket 3, for example... Figure 16a As shown, one end of the bracket 3 is fixed to the packaging module 1, and the housing 21 of the thermal management device 2 is fixed to the bracket 3. The housing 21 and the packaging module 1 do not contact each other. Alternatively, the thermal management device 2 can be fixed to other structures in the application scenario of the power module 10, such as... Figure 16b As shown, the thermal management device 2 is fixed to the side of the circuit board 20 facing the packaging module 1.

[0130] In some embodiments, when the power module 10 provided in this application includes multiple thermal management devices 2, the housing 21 of each thermal management device 2 can be installed on the encapsulation module 1 for heat transfer, or it can be separated from the encapsulation module 1 and use gas heat transfer. Different embodiments of the two schemes can be combined and applied according to requirements.

[0131] In summary, the power module 10 provided in this application embodiment is equipped with at least one thermal management device 2 for the encapsulation module 1. This thermal management device 2 utilizes the principle of rapid expansion and heat absorption when compressed gas is released to quickly cool the encapsulation module 1, meeting the short-term heat dissipation requirements of the power module 10 under overload conditions. This improves the overload resistance of the power module 10 and extends its service life. Applying this power module 10 to power conversion equipment can improve the overload resistance of the equipment and enhance its operational stability and reliability. For example, when applied to a photovoltaic system, this power module 10 can address the overload problem caused by grid fluctuations, enabling photovoltaic products to operate more stably. The thermal management device 2 has a simple structure and high cost-effectiveness, reducing redundant module design and contributing to energy saving and cost reduction in the overall system.

[0132] Please refer to Figure 16b As shown, the thermal management device 2 can also be considered as a structure independent of the power module 10. This application embodiment also provides a power conversion device including the power module 10 and the thermal management device 2, whose structure is similar to... Figure 16b As shown.

[0133] It should be understood that the power module 10 provided in this application embodiment can also be applied to other power conversion fields to cope with overload problems in application scenarios with higher overload resistance, and improve the service life and energy efficiency of the product.

[0134] In the consumer electronics field, power modules are used in devices such as power adapters, inverters, and frequency converters. Power adapters are power conversion devices for small portable electronic devices and appliances. Power modules are used for power conversion and amplification, converting AC to DC to provide a stable and reliable power supply for these devices, ensuring their normal operation. Inverters are power electronic devices composed of semiconductor switching devices. Power modules can convert DC to AC, achieving efficient power conversion in inverters and providing power support for homes, offices, and other locations.

[0135] In the field of power energy, power modules can be used in devices such as solar inverters and wind power converters. Solar inverters convert direct current (DC) generated by solar panels into alternating current (AC) and feed it into the grid. Power modules are responsible for achieving efficient power conversion and reliable grid connection, providing power support for homes, businesses, and other applications. Wind power converters are devices used in wind power systems to control generator speed, regulate output power, and ensure stable grid operation. Power modules can adjust the generator speed and output power according to wind speed and load changes, playing a role in power conversion and control, ensuring the safe and stable operation of the wind power system.

[0136] In the field of automotive electronics, power modules can be applied to devices such as electric vehicle drive motors, battery management systems, and electric power steering. The electric vehicle drive motor is responsible for converting electrical energy into mechanical energy to drive the vehicle. The power module amplifies and controls the power, precisely controlling the motor's current and voltage to achieve efficient and smooth driving performance. The battery management system controls and protects the electric vehicle's battery by charging and discharging. The power module converts electrical energy and protects the battery, monitoring its status and taking appropriate protective measures to ensure battery safety and longevity. Electric power steering is a device that upgrades a traditional mechanical steering system to an electronic steering system. The power module amplifies and controls the power, providing appropriate assistance based on the driver's steering intentions, improving driving comfort and safety.

[0137] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power module, characterized in that, The power module includes a packaging module and a thermal management device; The packaging module includes multiple electronic components packaged by a packaging structure; The thermal management device includes a housing and compressed gas filled within the housing. The housing has an exhaust port for discharging the compressed gas, and the exhaust port is connected to a space outside the encapsulation module. The thermal management device is used to release the compressed gas to absorb the heat of the encapsulation module.

2. The power module as described in claim 1, characterized in that, The housing is fixed to the encapsulation structure, at least a portion of the outer surface of the housing is in contact with the encapsulation structure, and the vent avoids the portion of the outer surface of the housing that is in contact with the encapsulation structure.

3. The power module as described in claim 2, characterized in that, The outer surface of the encapsulation structure includes a mounting surface, and the outer surface of the housing includes a first region and a second region; The housing is mounted to the mounting surface through the first region, and the exhaust port is located in the second region on the outer surface of the housing.

4. The power module as described in claim 3, characterized in that, The outer surface of the encapsulation structure is provided with a receiving groove, the inner wall of the receiving groove forms the mounting surface, and the housing is at least partially received within the receiving groove.

5. The power module as described in any one of claims 2-4, characterized in that, The exhaust port faces the outer surface of the packaging structure, and the exhaust direction of the exhaust port is set at an acute angle to the outer surface of the packaging structure.

6. The power module as described in claim 2, characterized in that, The housing is fixed within the encapsulation structure, which includes an exhaust channel. One end of the exhaust channel is connected to the exhaust port of the housing, and the other end is connected to the outer surface of the encapsulation structure.

7. The power module as described in claim 6, characterized in that, The extension length of the exhaust channel is greater than or equal to the shortest distance between the exhaust port of the housing and the outer surface of the encapsulation structure.

8. The power module as described in claim 1, characterized in that, The power module includes a bracket, one end of which is fixed to the packaging module. The housing of the thermal management device is fixed to the bracket, and there is a gap between the housing and the packaging module. The exhaust port faces the packaging module.

9. The power module as described in any one of claims 1-8, characterized in that, The thermal management device includes a gas supply pipe that communicates with the internal space of the housing and is used to introduce gas into the housing.

10. The power module according to any one of claims 1-9, characterized in that, The exhaust port is provided with a pressure relief structure, which is used to open the exhaust port under set conditions; The set conditions include the internal pressure of the housing reaching the maximum pressure that the pressure relief structure can withstand, or the temperature of the power module reaching the melting point of the pressure relief structure.

11. The power module according to any one of claims 1-9, characterized in that, The exhaust port is equipped with an electronically controlled valve assembly; The electronically controlled valve assembly is used to open the exhaust port when the temperature of the power module reaches a preset value.

12. The power module as described in any one of claims 1-11, characterized in that, The packaging module further includes a substrate, the plurality of electronic components are disposed on the surface of the substrate, and the packaging structure encapsulates the substrate; Along a direction perpendicular to the substrate, the orthographic projection of the thermal management device onto the surface of the substrate at least partially overlaps with the plurality of electronic components.

13. A power conversion device, characterized in that, The power conversion device includes a circuit board and a power module as described in any one of claims 1-12, wherein the power module is electrically connected to the circuit board.

14. A power conversion device, characterized in that, The power conversion device includes a circuit board, a power module, and a thermal management device, wherein the power module is electrically connected to the circuit board; The thermal management device includes a housing and compressed gas filled within the housing, the housing having an exhaust port for discharging the compressed gas; The housing is fixed to the circuit board, and the exhaust port faces the packaging structure of the power module.

15. A photovoltaic system, characterized in that, The photovoltaic system includes photovoltaic modules and a photovoltaic inverter. The input terminal of the photovoltaic inverter is connected to the photovoltaic modules, and the output terminal of the photovoltaic inverter is used to connect to the power grid and / or a load. The photovoltaic inverter includes a power module as described in any one of claims 1-12, or the photovoltaic inverter is a power conversion device as described in claim 13 or 14.

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