Bonding platform with additional controllable cooling module and hot-press bonding equipment

Abstract

The application discloses a bonding platform with an additional controllable cooling module and a thermal compression bonding device, and the bonding platform comprises a heating platform module, which is used for carrying and heating a substrate during a bonding process; and a controllable cooling module, which is used for controlling the cooling rate of the substrate after a chip is bonded with the substrate, and the controllable cooling module comprises a substrate stage, a first area of the upper surface of the substrate stage is provided with a substrate carrying area, a second area opposite to the first area of the lower surface of the substrate stage is provided with a cooling medium flow channel; a heating module, which is arranged on the substrate stage and is used for generating heat and uniformly transmitting the heat to the substrate stage; and a mounting module, which is arranged below the heating module and is used for mounting the controllable cooling module to the side of the heating platform module and blocking the downward transmission of the heat generated by the heating module. The technical scheme of the application can effectively inhibit the internal stress generated at a welding interface due to thermal expansion mismatch and improve the welding quality.

Description

Technical Field

[0001] This invention relates to the field of advanced semiconductor packaging equipment technology, and more specifically, to a bonding platform and hot-press bonding equipment with an additional controllable cooling module. Background Technology

[0002] Thermocompression Bonding Equipment (TC Bonder / TCB) is a core piece of equipment in the field of advanced semiconductor packaging. Its working principle is as follows: when the solder is in a solid state, the chip and the substrate are aligned and contacted with high precision. Then, the solder is melted by instantaneous high temperature, and the bonding pressure and position are controlled to complete the wetting and bonding. Finally, the molten solder is rapidly cooled to solidify, thus completing the bonding.

[0003] However, due to the significant difference in the coefficient of thermal expansion (CTE) between the chip and the substrate, after bonding, the chip and the substrate are connected as one through the solder joints. During the cooling process from the bonding temperature to room temperature, the two are constrained by the solder joints and cannot shrink freely on their own. This mutual restraint causes significant internal stress at the solder interface, which can easily lead to solder joint cracking or even soldering failure, seriously affecting the yield of the finished chip.

[0004] Therefore, it is necessary to propose a bonding platform and hot-press bonding equipment with an additional controllable cooling module to control the cooling rate of the substrate after bonding, reduce the internal stress generated at the welding interface, and improve the welding quality.

[0005] The statements herein provide only background information in relation to this invention and do not necessarily constitute prior art. Summary of the Invention

[0006] The purpose of this invention is to provide a bonding platform and hot-press bonding equipment with an additional controllable cooling module, so as to solve the problem in the prior art that the internal stress at the welding interface caused by the difference in thermal expansion coefficient affects the welding quality.

[0007] To solve the above problems, the technical solution adopted by the present invention is as follows: In a first aspect, the present invention provides a bonding platform for an additional controllable cooling module, comprising: The heating platform module is used to support and heat the substrate during the bonding process; A controllable cooling module is used to control the cooling rate of the substrate after the chip and substrate are bonded, including: A substrate stage, wherein the upper surface of the substrate stage is provided with a first region for supporting the substrate, and the lower surface of the substrate stage is provided with a second region opposite to the first region, which is provided with a cooling medium flow channel; A heating module is attached to the substrate stage and is used to generate heat and evenly transfer the heat to the substrate stage. The mounting module is located below the heating module and is used to install the controllable cooling module to the side of the heating platform module and to prevent the heat generated by the heating module from being transferred downwards.

[0008] In some embodiments, the second region is recessed inward to form a first groove, and the first groove is provided with a plurality of partition walls extending along a first direction, and the cooling medium flow channel is formed between adjacent partition walls.

[0009] In some embodiments, the first groove has a cooling medium inlet and a cooling medium outlet on the sidewalls at both ends along the first direction, and the cooling medium flows into the cooling medium channel from the cooling medium inlet and flows out from the cooling medium outlet.

[0010] In some embodiments, a first gas collecting cavity and a second gas collecting cavity are respectively provided at both ends of the substrate stage along the first direction; The first air collection chamber is located on the side of the cooling medium inlet away from the cooling medium flow channel, and the second air collection chamber is located on the side of the cooling medium outlet away from the cooling medium flow channel; The substrate stage is provided with a first pipe connector and a second pipe connector at both ends of the first direction. The first pipe connector is connected to the first gas collection cavity, and the second pipe connector is connected to the second gas collection cavity. The cooling medium flows in from the first pipe joint, flows sequentially through the first gas collecting chamber, the cooling medium inlet, the cooling medium flow channel, the cooling medium outlet, and the second gas collecting chamber, and flows out from the second pipe joint.

[0011] In some embodiments, the heating module includes: A heat spreader is disposed in contact with the lower surface of the substrate stage; A heater module is disposed below the heat spreader plate and is used to generate heat and uniformly transfer the heat to the substrate stage through the heat spreader plate.

[0012] In some embodiments, the lower surface of the substrate stage is recessed inward to form a first receiving groove, the first receiving groove being used to mount the heat spreader, and the bottom wall of the first receiving groove having the second region.

[0013] In some embodiments, the heater module is equipped with a temperature sensor for collecting real-time temperature data.

[0014] In some embodiments, the installation module includes: A heat insulation plate is disposed below the heating module to prevent the heat generated by the heating module from being transferred downwards; A mounting bracket is provided below the heat insulation plate to support the heat insulation plate, the heating module, and the substrate platform, and to install the controllable cooling module to the side of the heating platform module.

[0015] In some embodiments, the upper surface of the substrate stage is provided with at least two first regions for supporting the substrate.

[0016] In some embodiments, the lower surface of the substrate stage is provided with a plurality of second regions corresponding one-to-one with the first region; and the substrate stage is provided with a first heat insulation layer for separating adjacent first regions; The heat spreader is provided with a second heat insulation layer at the position corresponding to the second heat insulation layer; The heater module is provided with a third heat insulation layer at the position corresponding to the second heat insulation layer. The third heat insulation layer divides the heating module into multiple heating sub-modules, and each heating sub-module is provided with an independent heater.

[0017] In some embodiments, the upper surface of the substrate stage is provided with two of the first regions; the heater module includes a first heating submodule and a second heating submodule; The upper surface of the heat insulation board is recessed inward to form a second receiving groove and a third receiving groove. The second receiving groove is used to install the first heating sub-module, and the third receiving groove is used to install the second heating sub-module. The portion between the second receiving groove and the third receiving groove forms the third heat insulation layer.

[0018] In some embodiments, the lower surface of the heat insulation plate is provided with a second groove.

[0019] In a second aspect, the present invention also provides a hot-press bonding apparatus, comprising a bonding platform with an additional controllable cooling module as described in any of the first aspects of the present invention.

[0020] Compared to existing technologies, the beneficial effects of this invention include at least the following: The bonding platform with an additional controllable cooling module provided by the present invention includes a heating platform module and a controllable cooling module. The controllable cooling module includes a substrate stage and a heating module. The upper surface of the substrate stage is provided for supporting the substrate, and the lower surface is provided with a cooling medium flow channel. The cooling medium dissipates heat from the substrate stage through its flow, thereby cooling the substrate stage. At the same time, the heating module can uniformly transfer heat to the substrate stage, thereby heating the substrate stage. During use, the substrate is first placed on the heating platform module and bonded to the chip. After bonding, the substrate is transferred to the upper surface of the substrate stage. The cooling rate of the substrate is controlled by the cooling medium channel and the heating module, so that the thermal deformation of the substrate during the cooling stage is dynamically matched with that of the chip. This effectively suppresses the internal stress caused by thermal expansion mismatch at the welding interface, improves welding quality, and thus improves the yield of finished chips. In addition, the controllable cooling module is additionally installed on the side of the heating platform module. It does not require modification of the main structure of the existing hot-press bonding equipment. Integration can be completed simply by adding the controllable cooling module next to the original heating platform module, which has low modification cost and good compatibility. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the bonding platform for an additional controllable cooling module provided in an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a controllable cooling module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the upper surface structure of a substrate stage according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the lower surface structure of a substrate stage according to an embodiment of the present invention; Figure 5 This is a partial enlarged schematic diagram of the structure of the lower surface of the substrate stage according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of a heat spreader according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of a heating module according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of a heat insulation board according to an embodiment of the present invention; Figure 9This is a schematic diagram of the structure of a fixing frame according to an embodiment of the present invention.

[0023] 01-Heating platform module; 02-Controllable cooling module; 10-Substrate stage; 100-Heating module; 20-Heat spreader; 30-Heater module; 200-Mounting module; 40-Heat insulation plate; 50-Fixing bracket; 11-First region; 12-Second region; 13-First receiving tank; 121-First groove; 122-Separation wall; 14-Cooling medium inlet; 15-Cooling medium outlet; 16-First pipe joint; 17-Second pipe joint; 31-First heating submodule; 32-Second heating submodule; 33-Temperature sensor; 41-Second receiving groove; 42-Third receiving groove; 43-Second groove; 61-First insulation layer; 62-Second insulation layer; 63-Third insulation layer. Detailed Implementation

[0024] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a bonding platform and hot-press bonding equipment with an additional controllable cooling module proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0025] In the prior art, due to the difference in thermal expansion coefficients between the chip and the substrate, after bonding, the chip and the substrate are connected as one through the solder joints. During the cooling process from the bonding temperature to room temperature, the two are constrained by the solder joints and cannot shrink freely on their own. The mutual restraint causes significant internal stress at the welding interface, which can easily lead to solder joint cracking or even welding failure, seriously affecting the yield of the finished chip.

[0026] To address the aforementioned technical problems, this embodiment provides a bonding platform with an additional controllable cooling module. Please refer to [link / reference]. Figure 1It includes a heating platform module 01 and a controllable cooling module 02, wherein the heating platform module 01 is used to support and heat the substrate during the bonding process, and the controllable cooling module 02 is used to control the cooling rate of the substrate after the chip and the substrate are bonded.

[0027] Specifically, in some embodiments, the heating platform module 01 includes, from top to bottom, a substrate base, a heat spreader, a heater, a heat insulation plate, and a platform base. The substrate base supports the substrate and fixes its position during the bonding process; the heat spreader evenly transfers the heat generated by the heater to the substrate base to heat the substrate supported by the substrate base; and the heat insulation plate prevents the heat from the heater from being transferred to the platform base. In other embodiments, heating platform modules 01 with other structures may be used. This embodiment does not impose specific limitations, as long as the substrate can be fixed in position and heated, allowing the substrate to be bonded to the chip on the heating platform module 01.

[0028] In this embodiment, please refer to Figure 2 The controllable cooling module 02 includes a substrate platform 10, a heating module 100, and an installation module 200.

[0029] Please see Figure 3 and Figure 4 The substrate stage 10 has a first region 11 on its upper surface for supporting the substrate, and a second region 12 on its lower surface opposite to the first region 11 has a cooling medium channel for cooling medium flow to dissipate heat from the substrate stage 10 and achieve cooling of the substrate stage 10. In some embodiments, the first region 11 has a receiving groove adapted to the shape of the substrate to achieve substrate positioning; the substrate stage 10 has a vacuum channel (not shown) inside, and a plurality of adsorption holes communicating with the vacuum channel are formed on the bottom wall of the receiving groove; by connecting an external vacuum source, the substrate is adsorbed and fixed to the upper surface of the substrate stage 10 by the negative pressure generated by the adsorption holes. In other embodiments, other methods can also be used to fix the substrate, and this embodiment does not specifically limit this.

[0030] Please continue reading. Figure 1 The heating module 100 is disposed in contact with the lower surface of the substrate stage 10, and is used to generate heat and uniformly transfer the heat to the substrate stage 10, thereby raising the temperature of the substrate stage 10.

[0031] The mounting module 200 is disposed below the heating module 100 and is used to install the controllable cooling module 02 to the side of the heating platform module 01, so that the substrate after bonding can be quickly transferred to the controllable cooling module 02; the mounting module 200 is also used to block the heat generated by the heating module from being transferred downward, so that the heat generated by the heating module 100 can be quickly accumulated, thereby achieving rapid heating of the substrate stage 10.

[0032] The bonding platform with the additional controllable cooling module provided in this embodiment dissipates heat from the substrate stage 10 through the flow of the cooling medium, thereby cooling the substrate stage 10; and heat is evenly transferred to the substrate stage 10 through the heating module 100, thereby heating the substrate stage 10. During use, the substrate is first placed on the heating platform module 01 and the bonding process with the chip is performed. After bonding, the substrate is transferred to the upper surface of the substrate stage 10. The cooling rate of the substrate is controlled by the cooling medium channel and the heating module 100, so that the thermal deformation of the substrate during the cooling stage is dynamically matched with the thermal deformation of the chip. This effectively suppresses the internal stress caused by thermal expansion mismatch at the welding interface, improves the welding quality, and thus improves the yield of the finished chip. In addition, the controllable cooling module 02 is additionally provided on the side of the heating platform module 01. There is no need to modify the main structure of the existing hot press bonding equipment. Integration can be completed simply by adding the controllable cooling module 02 to the side of the original heating platform module 01. The modification cost is low and the compatibility is good.

[0033] It should be noted that the bonding platform with controllable heating and cooling functions provided in this embodiment is particularly suitable for the thermocompression bonding process between silicon chips and ABF (Ajinomoto Build-up Film) organic substrates. In this application scenario, the substrate stage is used to support the ABF organic substrate. The controllable cooling module 02 dynamically regulates the heating or cooling rate of the ABF organic substrate, ensuring that its thermal deformation during the cooling stage is dynamically matched with that of the silicon chip. This effectively solves the problem of stress concentration and solder joint cracking at the welding interface caused by the significant difference in the coefficient of thermal expansion (CTE) between the silicon chip and the ABF organic substrate.

[0034] Please combine Figure 4 and Figure 5 In some embodiments, the second region 12 is recessed downward to form a first groove 121, and the first groove 121 is provided with a plurality of partition walls 122 extending along a first direction, with the cooling medium flow channel formed between adjacent partition walls 122. For example, the partition walls 122 can be arranged to extend along the length direction of the substrate so that the cooling medium has a longer flow path, thereby carrying away more heat and achieving rapid cooling.

[0035] In the above embodiments, by setting a first groove 121 and a partition wall 122 in the second region 12, multiple parallel cooling medium flow channels are formed, which extends the flow path of the cooling medium, improves the heat dissipation efficiency, and achieves rapid cooling of the substrate stage 10.

[0036] Furthermore, in the above embodiment, the first groove 121 has a cooling medium inlet 14 and a cooling medium outlet 15 respectively on the sidewalls at both ends along the first direction. The cooling medium flows into the cooling medium channel from the cooling medium inlet 14 and flows out from the cooling medium outlet 15. The cooling medium inlet 14 and the cooling medium outlet 15 are respectively located on the sidewalls at both ends of the first groove 121 along the first direction, allowing the cooling medium to flow smoothly and quickly remove heat, thereby achieving rapid cooling of the substrate stage 10. Specifically, please refer to... Figure 5 The first groove 121 has multiple cooling medium inlets 14 and multiple cooling medium outlets 15 on the side walls at both ends along the first direction. It should be noted that the aperture and number of the cooling medium inlets 14 and the cooling medium outlets 15 can be adjusted according to actual process requirements or cooling rate requirements. This embodiment does not make specific limitations on this.

[0037] In the above embodiments, by setting the cooling medium inlet 14 and the cooling medium outlet 15 on the sidewalls at both ends of the first groove 121 along the first direction, a through flow path is formed, ensuring that the cooling medium can flow evenly through the entire second region 12, making the heat dissipation of the substrate stage 10 more uniform and avoiding excessive local temperature differences.

[0038] For further information, please refer to [link / reference]. Figure 4 In the above embodiment, the substrate stage 10 has a first gas collecting chamber and a second gas collecting chamber respectively located inside both ends along the first direction. The first gas collecting chamber is located on the side of the cooling medium inlet 14 away from the cooling medium flow channel, and the second gas collecting chamber is located on the side of the cooling medium outlet 15 away from the cooling medium flow channel. The substrate stage 10 has a first pipe connector 16 and a second pipe connector 17 respectively located outside both ends along the first direction. The first pipe connector 16 communicates with the first gas collecting chamber, and the second pipe connector 17 communicates with the second gas collecting chamber. The cooling medium flows in from the first pipe connector 16, flows sequentially through the first gas collecting chamber, the cooling medium inlet 14, the cooling medium flow channel, the cooling medium outlet 15, and the second gas collecting chamber, and flows out from the second pipe connector 17. For details, please refer to [link to relevant documentation]. Figure 4The substrate stage 10 is provided with a first pipe connector 16 and a second pipe connector 17 on the outside of both ends along the first direction. It should be noted that the position and number of the first pipe connector 16 and the second pipe connector 17 can be adjusted according to actual process requirements. This embodiment does not make specific limitations on this.

[0039] In the above embodiments, by setting the first and second air collection chambers, the externally input cooling medium can be evenly distributed to multiple cooling medium inlets 14, and the medium discharged from multiple cooling medium outlets 15 can be collected and output uniformly, avoiding flow differences caused by uneven pressure between the flow channels, ensuring consistent cooling medium flow in each cooling medium flow channel, and further improving the uniformity of heat dissipation of the substrate stage 10.

[0040] In some embodiments, please continue reading Figure 2 The heating module 100 includes a heat spreader 20 and a heater module 30. The heat spreader 20 is disposed in contact with the lower surface of the substrate stage 10; the heater module 30 is disposed below the heat spreader 20 and is used to generate heat and uniformly transfer the heat to the substrate stage 10 through the heat spreader 20, thereby raising the temperature of the substrate stage 10.

[0041] Specifically, in this embodiment, the heat spreader 20 is disposed in contact with the lower surface of the substrate stage 10, and the heat spreader 20 is used to close the first groove 121, so that the multiple partition walls 122 and the upper surface of the heat spreader 20 surround and form multiple cooling medium channels, thereby realizing the flow of cooling medium in the cooling medium channels.

[0042] By setting the heating module 100 as a combination of the heat spreader 20 and the heater module 30, the heat spreader 20 evenly diffuses the heat generated by the heater module 30 before transferring it to the substrate stage 10, avoiding local overheating and making the substrate heat more uniform, which is beneficial to improving the consistency of welding quality.

[0043] Please combine Figure 2 and Figure 4 In some embodiments, the lower surface of the substrate stage 10 is recessed inward to form a first receiving groove 13. The first receiving groove 13 is used to install the heat spreader 20. The bottom wall of the first receiving groove 13 forms the second region 12. The upper surface of the heat spreader 20 is fitted to the bottom wall of the first receiving groove 13, so that the heat generated by the heater module 30 is efficiently conducted to the substrate stage 10. By providing a first receiving groove 13 on the lower surface of the substrate stage 10 to install the heat spreader 20, the heat spreader 20 is embedded inside the substrate stage 10, which reduces the overall thickness and increases the contact area between the heat spreader 20 and the substrate stage 10, thereby improving the heat conduction efficiency.

[0044] In some embodiments, a temperature sensor 33 is provided within the heater module 30 or the heat spreader 20 for collecting real-time temperature data. Please refer to [link / reference]. Figure 7 For example, the heater module 30 may embed one or more temperature sensors 33 for collecting real-time temperature data of the area. The bonding platform may include a temperature control system that receives the real-time temperature data collected by the temperature sensors 33 and dynamically adjusts the power of the heater module 30 based on the real-time temperature data to regulate the cooling or heating rate of the substrate stage 10 in real time. Additionally, the heating or cooling curve of the substrate stage 10 can be plotted based on the real-time temperature data collected by the temperature sensors 33.

[0045] In this embodiment, the cooling medium is preferably a gaseous cooling medium. In other embodiments, other types of cooling media, such as phase change cooling media, may also be used, and no specific limitation is made here.

[0046] Furthermore, the temperature control system may also include a gas flow regulator, which is disposed on the gas delivery pipeline (for connecting the first pipeline connector 16 and the gaseous cooling medium source) and is used to regulate the flow rate of the gaseous cooling medium delivered to the second region 12. The temperature control system receives real-time temperature data collected by the temperature sensor 33 and dynamically adjusts the opening of the gas flow regulator based on the real-time temperature data to perform closed-loop control of the cooling rate of the substrate stage 10. In this embodiment, by collecting temperature data in real time through the temperature sensor 33, and cooperating with the temperature control system, closed-loop dynamic regulation of heating power and cooling medium flow rate is achieved, enabling the temperature curve to accurately track the preset process curve, improving temperature control accuracy, and further enhancing the consistency and reliability of welding quality.

[0047] In some embodiments, the mounting module 200 includes a heat insulation plate 40 and a fixing frame 50. The heat insulation plate 40 is disposed below the heating module 100 to prevent the heat generated by the heating module 100 from being transferred downwards. The fixing frame 50 is disposed below the heat insulation plate 40 to support the heat insulation plate 40, the heating module 100, and the substrate platform 10, and to mount the controllable cooling module 02 to the side of the heating platform module 01. In this embodiment, by setting the heat insulation plate 40 to prevent the heat from being transferred downwards, the heat generated by the heating module 100 can be concentrated and transferred upwards to the substrate platform 10, improving the heating efficiency; the fixing frame 50 enables the controllable cooling module 02 to be stably mounted on the side of the heating platform module 01, facilitating the rapid transfer of the substrate after bonding.

[0048] In some embodiments, the upper surface of the substrate stage 10 is provided with at least two first regions 11 for supporting the substrate. See also... Figure 3 The substrate stage 10 provided in this embodiment has two first regions 11. In some other embodiments, other numbers of first regions 11 may also be provided, and this embodiment does not make a specific limitation. By providing multiple first regions 11, multiple substrates with the same process parameters can be processed simultaneously in the same process cycle. Multiple substrates with the same process parameters should also have the same requirements for cooling curves. At the same time, the cooling process of multiple substrates with the same process parameters can be controlled. Compared with the method of processing one piece at a time, the energy consumption caused by repeated heating and cooling is significantly reduced, and the output efficiency of the equipment per unit time is effectively improved. In addition, since multiple substrates are in the same thermal field, the cooling curves experienced by each substrate are consistent, which is beneficial to improving the uniformity of welding quality and batch consistency among multiple substrates.

[0049] Further, please refer to Figure 4 In the above embodiment, the lower surface of the substrate stage 10 is provided with a plurality of second regions 12 corresponding one-to-one with the first regions 11; and the substrate stage 10 is provided with a first heat insulation layer 61 for separating adjacent first regions 11 to block heat transfer between two adjacent first regions 11; please refer to Figure 6 The heat spreader 20 has a second heat insulation layer 62 at the position corresponding to the first heat insulation layer 61; please refer to Figure 7 The heater module 30 is provided with a third heat insulation layer 63 at the position corresponding to the second heat insulation layer 62. The third heat insulation layer divides the heater module 30 into multiple heating sub-modules, and each heating sub-module is provided with an independent heater.

[0050] Please see Figures 3-8In this embodiment, taking two first regions 11 as an example, the upper surface of the substrate stage 10 is provided with two first regions 11, and the lower surface of the substrate stage 10 (or the bottom wall of the first receiving groove 13) is provided with two second regions 12. The substrate stage 10 is provided with a first heat insulation layer 61 in the middle to separate the two first regions 11. The heat spreader 20 is provided with a second heat insulation layer 62 in the middle. The heater module 30 includes a first heating submodule 31 and a second heating submodule 32, and a third heat insulation layer 63 is provided between the first heating submodule 31 and the second heating submodule 32 (in this embodiment, the third heat insulation layer 63 is provided by the heat insulation plate 40). Specifically, both the first heating submodule 31 and the second heating submodule 32 have independent heaters, and can transfer heat to the corresponding first region 11 on the substrate stage 10 through the corresponding area on the heat spreader 20, so as to raise the temperature of the two first regions 11 to the same or different degrees. In addition, the two second regions 12 are also blocked by the first heat insulation layer 61, and each first region 11 dissipates heat through the corresponding second region 12, so as to lower the temperature of the two first regions 11 to the same or different degrees.

[0051] As can be seen, the controllable cooling module 02 is divided into multiple independent temperature control zones. Heat transfer between each temperature control zone is blocked by the first heat insulation layer 61, the second heat insulation layer 62, and the third heat insulation layer 63, enabling the cooling rate regulation of substrates with different process parameters within the same process cycle, thereby improving the output efficiency of the equipment per unit time. It should be noted that, in order to achieve independent cooling control of each of the first zones 11, the first gas collecting chamber and the second gas collecting chamber should be set in a one-to-one correspondence with the second zone 12.

[0052] Further, please refer to Figure 8 In the above embodiment, the upper surface of the heat insulation plate 40 is recessed inward to form a second receiving groove 41 and a third receiving groove 42. The second receiving groove 41 is used to install the first heating sub-module 31, and the third receiving groove 42 is used to install the second heating sub-module 32. The portion between the second receiving groove 41 and the third receiving groove 42 forms the third heat insulation layer 63.

[0053] In some embodiments, the lower surface of the heat insulation plate 40 is provided with a second groove 43. The presence of the second groove 43 creates an air gap between the heat insulation plate 40 and the mounting bracket 50, significantly reducing the heat transferred from the heat insulation plate 40 to the mounting bracket 50, allowing the heat generated by the heater module 30 to accumulate rapidly and increasing the heating rate of the substrate stage 10. (See also...) Figure 8In other embodiments, other types of grooves may be provided, and this embodiment does not impose specific limitations. Furthermore, in this embodiment, the heat insulation plate 40 and the substrate platform 10 are fixedly connected by screws, and their coefficients of thermal expansion are essentially the same to reduce interfacial stress caused by thermal expansion mismatch under alternating hot and cold conditions, thus ensuring the long-term stability of the structure.

[0054] In some embodiments, please combine Figure 2 and Figure 9 The fixing frame 50 includes a support plate extending in the horizontal direction and a mounting plate extending in the vertical direction. The support plate is used to support the heat insulation plate 40, the heater module 30, the heat spreader 20 and the substrate stage 10. The mounting plate is used to install the controllable cooling module 02 to the side of the heating platform module 01, so that the substrate after bonding can be quickly transferred to the controllable cooling module 02.

[0055] Based on the same inventive concept, this embodiment also provides a hot-press bonding apparatus, including a bonding platform with an additional controllable cooling module as provided in any of the above embodiments of the present invention. The substrate stage 10 is cooled by the flow of a cooling medium; heat is transferred to the substrate stage 10 by a heating module 100, thus raising the temperature of the substrate stage 10. During use, the substrate is first placed on the heating platform module 01 in the bonding platform, and a bonding process with the chip is performed. After bonding, the substrate is transferred to the substrate stage 10 in the bonding platform. The cooling rate of the substrate is controlled by the cooling medium flow channel and the heating module 100, so that the thermal deformation of the substrate during the cooling stage is dynamically matched with the thermal deformation of the chip. This effectively suppresses the internal stress caused by thermal expansion mismatch at the welding interface, improves welding quality, and thus improves the yield of finished chips.

[0056] It should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A bonding platform with an additional controllable cooling module, characterized in that, include: The heating platform module is used to support and heat the substrate during the bonding process; A controllable cooling module is used to control the cooling rate of the substrate after the chip and substrate are bonded, including: A substrate stage, wherein the upper surface of the substrate stage is provided with a first region for supporting the substrate, and the lower surface of the substrate stage is provided with a second region opposite to the first region, which is provided with a cooling medium flow channel; A heating module is attached to the substrate stage and is used to generate heat and evenly transfer the heat to the substrate stage. The mounting module is located below the heating module and is used to install the controllable cooling module to the side of the heating platform module and to prevent the heat generated by the heating module from being transferred downwards.

2. The bonding platform as described in claim 1, characterized in that, The second region is recessed inward to form a first groove, and the first groove is provided with a plurality of partition walls extending along a first direction, and the cooling medium flow channel is formed between adjacent partition walls.

3. The bonding platform as described in claim 2, characterized in that, The first groove has a cooling medium inlet and a cooling medium outlet on its sidewalls at both ends along the first direction. The cooling medium flows into the cooling medium channel from the cooling medium inlet and flows out from the cooling medium outlet.

4. The bonding platform as described in claim 3, characterized in that, The substrate stage is provided with a first gas collection cavity and a second gas collection cavity at both ends along the first direction. The first air collection chamber is located on the side of the cooling medium inlet away from the cooling medium flow channel, and the second air collection chamber is located on the side of the cooling medium outlet away from the cooling medium flow channel; The substrate stage is provided with a first pipe connector and a second pipe connector at both ends of the first direction. The first pipe connector is connected to the first gas collection cavity, and the second pipe connector is connected to the second gas collection cavity. The cooling medium flows in from the first pipe joint, flows sequentially through the first gas collecting chamber, the cooling medium inlet, the cooling medium flow channel, the cooling medium outlet, and the second gas collecting chamber, and flows out from the second pipe joint.

5. The bonding platform as described in claim 1, characterized in that, The heating module includes: A heat spreader is disposed in contact with the lower surface of the substrate stage; A heater module is disposed below the heat spreader plate and is used to generate heat and uniformly transfer the heat to the substrate stage through the heat spreader plate.

6. The bonding platform as described in claim 5, characterized in that, The lower surface of the substrate stage is recessed inward to form a first receiving groove, which is used to install the heat spreader plate, and the bottom wall of the first receiving groove forms the second region.

7. The bonding platform as described in claim 5, characterized in that, A temperature sensor is installed inside the heater module or the heat spreader plate to collect real-time temperature data.

8. The bonding platform as described in claim 5, characterized in that, The installation module includes: A heat insulation plate is disposed below the heating module to prevent the heat generated by the heating module from being transferred downwards; A mounting bracket is provided below the heat insulation plate to support the heat insulation plate, the heating module, and the substrate platform, and to install the controllable cooling module to the side of the heating platform module.

9. The bonding platform as described in claim 8, characterized in that, The upper surface of the substrate stage is provided with at least two first regions for supporting the substrate.

10. The bonding platform as described in claim 9, characterized in that, The lower surface of the substrate stage is provided with a plurality of second regions corresponding one-to-one with the first region; and the substrate stage is provided with a first heat insulation layer for separating adjacent first regions. The heat spreader is provided with a second heat insulation layer at the position corresponding to the second heat insulation layer; The heater module is provided with a third heat insulation layer at the position corresponding to the second heat insulation layer. The third heat insulation layer divides the heating module into multiple heating sub-modules, and each heating sub-module is provided with an independent heater.

11. The bonding platform as described in claim 10, characterized in that, The substrate platform has two first regions on its upper surface; the heater module includes a first heating submodule and a second heating submodule; The upper surface of the heat insulation board is recessed inward to form a second receiving groove and a third receiving groove. The second receiving groove is used to install the first heating sub-module, and the third receiving groove is used to install the second heating sub-module. The portion between the second receiving groove and the third receiving groove forms the third heat insulation layer.

12. The bonding platform as described in claim 8, characterized in that, The lower surface of the heat insulation board is provided with a second groove.

13. A hot-press bonding apparatus, characterized in that, A bonding platform including an additional controllable cooling module as described in any one of claims 1 to 12.

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