Resin composition, modifier for polyamide resin, and molded article

CN123022752APending Publication Date: 2026-10-30MITSUI CHEMICALS INC
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Patent Information

Application Number
CN202580023124.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-05-27
Filing Date
2025-03-21
Publication Date
2026-10-30

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Abstract

One embodiment of the resin composition of the present application contains a polyamide resin (A), an acid-modified propylene-α-olefin copolymer (B), and an ethylene-α-olefin copolymer (C), the content of the polyamide resin (A) is 50 to 99 parts by mass, the total content of the acid-modified propylene-α-olefin copolymer (B) and the ethylene-α-olefin copolymer (C) is 1 to 50 parts by mass, the mass ratio of the content of the acid-modified propylene-α-olefin copolymer (B) to the content of the ethylene-α-olefin copolymer (C) (content of acid-modified propylene-α-olefin copolymer (B) / content of ethylene-α-olefin copolymer (C)) is 1 / 99 to 25 / 75, and the ethylene-α-olefin copolymer (C) is unmodified, relative to the total 100 parts by mass of the polyamide resin (A), the acid-modified propylene-α-olefin copolymer (B), and the ethylene-α-olefin copolymer (C).
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Citation Information

Patent Citations

  • Polyamide resin molding material

    JP1993032886A

  • Linear aliphatic polyamide-based polymer composition

    JP2021503022A

  • GRAFT-MODIFIED PROPYLENE / α-OLEFIN COPOLYMER AND METHOD FOR PRODUCING SAME

    WO2015125802A1