Pressure sensitive chip and pressure sensor

Abstract

The application discloses a pressure-sensitive chip and a pressure sensor, and belongs to the technical field of pressure sensors. The pressure-sensitive chip comprises a first substrate, a second substrate, a pressure sensing element and a conductive part. Since the pressure sensing element is located in the pressure reference cavity between the first substrate and the second substrate, the pressure sensing element will not be damaged when the pressure-sensitive chip is applied to a scene where the pressure medium is a corrosive gas or liquid. Therefore, the pressure-sensitive chip in the application can be used to measure the pressure of the corrosive gas or liquid without packaging, and compared with the current oil-filled core, the pressure-sensitive chip has small volume and low cost. In addition, at least part of the conductive part is located in the first through hole of the second substrate, and the end of the conductive part away from the first substrate can be exposed through the first through hole. In this way, the conductive part can realize the electrical connection between the pressure sensing element located in the pressure reference cavity and the external circuit, thereby ensuring that the pressure-sensitive chip can be normally used.

Description

Pressure-sensitive chip and pressure sensor Technical Field

[0001] This application relates to the field of pressure sensing technology, and in particular to a pressure-sensitive chip and a pressure sensor. Background Technology

[0002] A pressure sensor is a device that converts pressure signals into electrical signals. Pressure sensors can measure the pressure of pressure media in various fields such as petroleum, chemical industry, aircraft, engines, wind tunnels, blasting, hydraulics, and construction.

[0003] Pressure sensors typically consist of a pressure-sensitive chip, a circuit assembly, and a packaging assembly. The pressure-sensitive chip senses pressure and converts the pressure signal into an electrical signal, the circuit assembly conducts the electrical signal, and the packaging assembly encapsulates the pressure-sensitive chip. Here, the circuit assembly is usually connected to the front side of the pressure-sensing element within the pressure-sensitive chip.

[0004] However, current pressure sensors typically sense pressure from the front of the pressure sensor, making them unsuitable for measuring the pressure of liquid media. Furthermore, when a pressure sensor is required to measure the pressure of a liquid medium, the pressure-sensitive chip needs to be further encapsulated, resulting in a larger chip size. Summary of the Invention

[0005] This application provides a pressure-sensitive chip and a pressure sensor. It solves the problem that existing pressure sensors require further encapsulation of the pressure-sensitive chip when measuring the pressure of liquid media, resulting in a large chip size. The technical solution is as follows:

[0006] On the one hand, a pressure-sensitive chip is provided, comprising: a first substrate, a second substrate, a pressure sensing element, and a conductive part;

[0007] The first substrate and the second substrate are stacked, and a pressure reference cavity is provided between the first substrate and the second substrate, and the second substrate has a first through hole;

[0008] The pressure sensor is at least connected to the side of the first substrate facing the second substrate, and at least a portion of the pressure sensor is exposed within the pressure reference cavity;

[0009] At least a portion of the conductive part is located within the first through hole, and the conductive part is electrically connected to the pressure sensing element;

[0010] Wherein, at least a portion of the first substrate opposite to the pressure reference cavity is a pressure-sensitive membrane, and the thickness of the pressure-sensitive membrane is less than the thickness of the second substrate.

[0011] Optionally, the pressure sensing element is a piezoresistor, and the first substrate has a bearing groove on the side facing the pressure reference cavity, with at least a portion of the pressure sensing element embedded in the bearing groove.

[0012] Optionally, the second substrate has a first groove on the side facing the first substrate, and the portion of the second substrate surrounding the first groove is fixedly connected to the first substrate;

[0013] The first groove and the side of the first base facing the second base together form the pressure reference cavity.

[0014] Optionally, the first substrate has a second groove on the side opposite to the second substrate, and the orthographic projection of the second groove onto the side of the first substrate facing the second substrate is located within the orthographic projection of the pressure reference cavity onto the side of the first substrate facing the second substrate.

[0015] The pressure-sensitive membrane is the portion of the first substrate located between the second groove and the pressure reference chamber.

[0016] Optionally, the pressure sensing element includes: a first conductive plate and a second conductive plate;

[0017] At least a portion of the first conductive plate is fixedly connected to the side of the first substrate facing the pressure reference cavity; at least a portion of the second conductive plate is fixedly connected to the side of the second substrate facing the pressure reference cavity.

[0018] Wherein, at least a portion of the first conductive plate and at least a portion of the second conductive plate are disposed opposite to each other, and the pressure reference chamber is located at least between the oppositely disposed portions of the first conductive plate and the second conductive plate.

[0019] Optionally, the pressure-sensitive chip further includes: an isolation substrate, the isolation substrate being located between the first conductive plate and the second conductive plate, and the isolation substrate being distributed around the pressure reference cavity;

[0020] The isolation substrate is fixedly connected to the second substrate on the side facing the second substrate; the isolation substrate is fixedly connected to the first substrate on the side facing the first substrate.

[0021] The first substrate, the second substrate, and the isolation substrate located between the first substrate and the second substrate are used to form the pressure reference cavity.

[0022] Optionally, the pressure-sensitive chip further includes: a first connecting seal located between the first substrate and the isolation substrate, and a second connecting seal located between the second substrate and the isolation substrate, wherein both the first connecting seal and the second connecting seal are distributed around the pressure reference chamber;

[0023] Wherein, the first connecting seal is disposed in the same layer as the first conductive plate and is made of the same material, and the first connecting seal is insulated from the first conductive plate; the second connecting seal is disposed in the same layer as the second conductive plate and is made of the same material, and the second connecting seal is insulated from the second conductive plate.

[0024] Optionally, the pressure-sensitive chip further includes: a first support member located between the first substrate and the isolation substrate, and a second support member located between the second substrate and the isolation substrate; the first support member is located between the first connecting seal and the pressure reference chamber; the second support member is located between the second connecting seal and the pressure reference chamber;

[0025] The first support member, the first connecting seal member, and the first conductive plate are arranged in the same layer and made of the same material, and the first support member is insulated from the first conductive plate; the second support member, the second connecting seal member, and the second conductive plate are arranged in the same layer and made of the same material, and the second support member is insulated from the second conductive plate.

[0026] Optionally, the conductive part includes: a first conductive post, the first conductive post being located inside the first through hole, one end of the first conductive post being electrically connected to the pressure sensing element, and the other end of the first conductive post being exposed from the side of the second substrate away from the first substrate through the first through hole.

[0027] Optionally, the conductive part further includes: an external conductive block, the external conductive block being located on the side of the second substrate away from the first substrate, and the external conductive block being electrically connected to the end of the first conductive post away from the pressure sensing element.

[0028] On the other hand, a pressure sensor is also provided, including: a pressure-sensitive chip, a housing, and an electrical adapter assembly;

[0029] The pressure-sensitive chip is any of the pressure-sensitive chips described above;

[0030] The housing has a first receiving cavity and a fluid channel communicating with the first receiving cavity;

[0031] The electrical adapter assembly is located within the first receiving cavity and is fixedly connected to the housing.

[0032] The pressure-sensitive chip is located within the fluid channel. The second substrate of the pressure-sensitive chip is fixedly connected to the electrical adapter on the side opposite to the first substrate, and is electrically connected to the electrical adapter through the conductive part.

[0033] Optionally, the electrical switching assembly includes: a first insulating plate and a first conductor;

[0034] The first insulating plate has a second through hole;

[0035] At least a portion of the first conductor is located within the second through hole;

[0036] The conductive portion of the pressure-sensitive chip is electrically connected to the first conductor, and the side of the second substrate of the pressure-sensitive chip facing away from the first substrate is fixedly connected to the first insulating plate.

[0037] Optionally, the first conductor includes: a conductive paste and a first conductive lead, wherein the conductive paste is located inside the second through hole; the first conductive lead is inserted into the conductive paste and extends out of the second through hole, wherein the portion of the first conductive lead extending out of the second through hole is located on the side of the first insulating plate away from the pressure-sensitive chip;

[0038] The conductive portion of the pressure-sensitive chip is electrically connected to the conductive paste.

[0039] Optionally, the first conductor includes: a conductive plating layer and a second conductive lead, a portion of the conductive plating layer is attached to the inner wall of the second through hole, and another portion of the conductive plating layer is located on the side of the first insulating plate away from the pressure-sensitive chip; the second conductive lead is electrically connected to the portion of the conductive plating layer located on the side of the first insulating plate away from the pressure-sensitive chip.

[0040] The conductive portion of the pressure-sensitive chip is electrically connected to the portion of the second conductive post attached to the inner wall of the second through hole.

[0041] Optionally, the conductive portion of the pressure-sensitive chip includes a first conductive post;

[0042] The end of the first conductive post facing away from the pressure sensing element is electrically connected to the portion of the first conductor located within the second through hole.

[0043] Optionally, the conductive portion of the pressure-sensitive chip includes a first conductive post and an external conductive block. The end of the first conductive post facing away from the pressure sensor is electrically connected to the external conductive block, and the external conductive block is located on the side of the second substrate facing away from the first substrate.

[0044] At least a portion of the external conductive block is located within the second through hole and is electrically connected to the first conductor.

[0045] Optionally, the electrical adapter assembly further includes: a sealing and fixing part; the sealing and fixing part is fixedly connected to the side of the insulating substrate facing the pressure-sensitive chip, the sealing and fixing part is distributed around the pressure-sensitive chip and fixedly connected to the pressure-sensitive chip.

[0046] Optionally, the sealing fixing part is also distributed around the second through hole, and the orthographic projection of the sealing fixing part on the insulating substrate does not overlap with the second through hole.

[0047] Optionally, the sealing and fixing part is made of insulating slurry, or the sealing and fixing part is made of metal bonding material;

[0048] Wherein, when the sealing and fixing part is made of metal bonding material, the sealing and fixing part has a clearance area; the second through hole and the first through hole are projected onto the insulating substrate on the side facing the pressure-sensitive chip, and the clearance area is located within the projected onto the insulating substrate on the side facing the pressure-sensitive chip, so that the sealing and fixing part is insulated from the conductive part.

[0049] Optionally, the pressure reference chamber in the pressure-sensitive chip is a vacuum-sealed chamber.

[0050] Optionally, the housing further has a second receiving cavity located on the side of the first receiving cavity opposite to the fluid channel;

[0051] The second substrate in the pressure-sensitive chip has a first through hole, and the first insulating plate has a second through hole;

[0052] Wherein, one end of the first through hole is connected to the pressure reference cavity, and the other end is connected to the second through hole; the end of the second through hole opposite to the first through hole is connected to the second receiving cavity.

[0053] Optionally, the pressure sensor further includes: a sealing ring;

[0054] The housing has mounting ring grooves distributed around the flow channel; at least a portion of the sealing ring is located within the mounting ring grooves.

[0055] Optionally, the housing further has a second receiving cavity located on the side of the first receiving cavity opposite to the fluid channel;

[0056] The pressure sensor further includes an electrical discharge assembly; the electrical discharge assembly is located within the second receiving cavity and is fixedly connected to the housing.

[0057] The electrical discharge component has a second conductor, which is electrically connected to the first conductor.

[0058] Optionally, the pressure sensor further includes: a connector located within the first receiving cavity and fixedly connected to the housing; the connector is located on the side of the electrical adapter assembly facing away from the pressure-sensitive chip, and the electrical adapter assembly is fixedly connected to the connector;

[0059] The connector has a third through hole, and a portion of the first conductor of the electrical adapter assembly is located within the third through hole.

[0060] The beneficial effects of the technical solutions provided in this application include at least the following:

[0061] Since the pressure sensing element in the pressure-sensitive chip is located within the pressure reference cavity between the first and second substrates, when the pressure medium is a corrosive gas or liquid, the pressure sensing element within the pressure reference cavity will not come into contact with the corrosive gas or liquid, and thus will not fail due to damage. Therefore, the pressure-sensitive chip in this application can be used to measure the pressure of corrosive gases or liquids without further encapsulation. Compared to the oil-filled cores in the prior art, the pressure-sensitive chip in this application is smaller and less expensive. Furthermore, at least a portion of the conductive part is located within the first through-hole of the second substrate, and the end of the conductive part facing away from the first substrate can be exposed through the first through-hole. Thus, through the conductive part located within the first through-hole of the second substrate, the pressure sensing element within the pressure reference cavity can be electrically connected to the external circuit, thereby ensuring the normal operation of the pressure-sensitive chip. Attached Figure Description

[0062] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0063] Figure 1 is a schematic diagram of the structure of a pressure-sensitive chip in the prior art;

[0064] Figure 2 is a schematic diagram of an oil-filled core;

[0065] Figure 3 is a schematic diagram of the structure of a pressure-sensitive chip provided in an embodiment of this application;

[0066] Figure 4 is a schematic diagram of another pressure-sensitive chip provided in an embodiment of this application;

[0067] Figure 5 is a schematic diagram of another pressure-sensitive chip provided in an embodiment of this application;

[0068] Figure 6 is a schematic diagram of another pressure-sensitive chip provided in an embodiment of this application;

[0069] Figure 7 is a schematic diagram of the structure of a pressure-sensitive chip provided in another embodiment of this application;

[0070] Figure 8 is a circuit diagram of a consistent Wheatstone bridge provided in an embodiment of this application;

[0071] Figure 9 is a top view of a pressure-sensitive chip provided in an embodiment of this application;

[0072] Figure 10 is a structural schematic diagram of a pressure sensor provided in an embodiment of this application;

[0073] Figure 11 is a partial enlarged view of the pressure sensor shown in Figure 10;

[0074] Figure 12 is a schematic diagram of the connection between a pressure-sensitive chip and an electrical adapter assembly provided in an embodiment of this application;

[0075] Figure 13 is a schematic diagram of another connection structure between the pressure-sensitive chip and the electrical adapter assembly provided in an embodiment of this application;

[0076] Figure 14 is a partial enlarged view of a pressure sensor provided in an embodiment of this application;

[0077] Figure 15 is a partial enlarged view of another pressure sensor provided in an embodiment of this application;

[0078] Figure 16 is a top view of a sealing and fixing part provided in an embodiment of this application;

[0079] Figure 17 is a schematic diagram of another pressure sensor provided in an embodiment of this application;

[0080] Figure 18 is a partial enlarged view of the pressure sensor shown in Figure 17;

[0081] Figure 19 is a structural schematic diagram of another pressure sensor provided in an embodiment of this application;

[0082] Figure 20 is a structural schematic diagram of a pressure sensor provided in another embodiment of this application;

[0083] Figure 21 is a schematic diagram of another pressure sensor provided in another embodiment of this application;

[0084] Figure 22 is a partial schematic diagram of another pressure sensor provided in an embodiment of this application;

[0085] Figure 23 is a structural schematic diagram of another pressure sensor provided in another embodiment of this application;

[0086] Figure 24 is a schematic diagram of a pipe structure provided in an embodiment of this application;

[0087] Figure 25 is a schematic diagram of a pressure sensor according to an embodiment of this application measuring the pressure of a pressure medium. Detailed Implementation

[0088] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0089] As shown in Figure 1, which is a schematic diagram of a pressure-sensitive chip in the prior art, the pressure-sensitive chip 010 may include: a first substrate 011, a second substrate 012, a pressure sensing element 013, and a conductive portion 014. At least a portion of the pressure sensing element 013 may be embedded in the side of the first substrate 011 opposite to the second substrate 012. The conductive portion 014 may be electrically connected to the pressure sensing element 013, and a portion of the conductive portion 014 may be embedded in the side of the first substrate 011 opposite to the second substrate 012, while another portion of the conductive portion 014 may be fixedly connected to the side of the first substrate 011 opposite to the second substrate 012. Thus, the conductive portion 014 enables the pressure sensing element 013 to be electrically connected to an external circuit.

[0090] Here, the pressure sensing element 013 can be a piezoresistive resistor. When the piezoresistive chip 010 is immersed in a pressure medium, the side of the pressure sensing element 013 facing away from the second substrate 012 can be used to sense pressure. However, since at least a portion of the pressure sensing element 013 can be embedded in the side of the first substrate 011 facing away from the second substrate 012, the pressure sensing element 013 is easily susceptible to failure due to external environmental influences. Therefore, this piezoresistive chip can only be used in scenarios where the pressure medium is a non-corrosive gas, and cannot be used in scenarios where the pressure medium is a corrosive gas or liquid.

[0091] When current pressure-sensitive chips are used in scenarios where the pressure medium is corrosive gas or liquid, as shown in Figure 2, which is a schematic diagram of an oil-filled core, the oil-filled core is a structure after the pressure-sensitive chip 010 is encapsulated. The oil-filled core can protect the pressure sensing element 013 in the pressure-sensitive chip 010. The oil-filled chip may include: pressure-sensitive chip 010, housing 020, silicone oil 030, corrugated diaphragm 040, circuit board 050, metal leads 060, and pins 070.

[0092] The housing 020 and the corrugated diaphragm 040 can form a receiving cavity filled with silicone oil 030. The pressure-sensitive chip 010 and the circuit board 050 can both be located within the receiving cavity, and the pressure-sensitive chip 010 can be fixed to the side of the housing 020 opposite to the corrugated diaphragm 040 via the circuit board 050. Here, the pressure sensing element 013 in the pressure-sensitive chip 010 can face the corrugated diaphragm 040. Thus, when the oil-filled chip is immersed in the pressure medium, the pressure of the pressure medium can be transmitted through the corrugated diaphragm 040 to the silicone oil located in the receiving cavity, and then through the silicone oil to the pressure sensing element 013 in the pressure-sensitive chip 010. In this way, the pressure of the pressure medium can be measured by the pressure-sensitive chip 010.

[0093] The pin 070 can penetrate the housing 020 to be electrically connected to the circuit board 050 located within the receiving cavity. One end of the metal lead 060 can be electrically connected to the conductive part 014 in the pressure-sensitive chip 010, and the other end of the metal lead 060 can be electrically connected to the pin 070. In this way, the pressure sensor 013 in the pressure-sensitive chip 010 can be electrically connected to an external circuit through the metal lead 060 and the pin 070. This allows the electrical signal from the pressure sensor 013 to be transmitted to the external circuit.

[0094] Here, because the silicone oil 030 encapsulates the pressure-sensitive chip 010, the oil-filled core containing the pressure-sensitive chip 010 can be used in scenarios where the pressure medium is a corrosive gas or liquid. However, currently, when pressure-sensitive chips need to be used in scenarios where the pressure medium is a corrosive gas or liquid, they all need to be encapsulated as oil-filled cores, resulting in a larger size and higher cost for the pressure-sensitive chip 010.

[0095] This application provides a pressure-sensitive chip for measuring the pressure of a pressure medium. For example, this pressure-sensitive chip can be used to measure gas or liquid pressure, as well as parameters such as liquid level or flow rate, in industries such as hydropower, tap water, petroleum, chemical, machinery, and hydraulics.

[0096] Please refer to Figures 3 and 4. Figure 3 is a schematic diagram of the structure of a pressure-sensitive chip provided in an embodiment of this application, and Figure 4 is a schematic diagram of the structure of another pressure-sensitive chip provided in an embodiment of this application. The pressure-sensitive chip may include: a first substrate 110, a second substrate 120, a pressure sensing element 130, and a conductive portion 140. The first substrate 110 and the second substrate 120 in the pressure-sensitive chip are stacked, and a pressure reference cavity P is provided between the first substrate 110 and the second substrate 120.

[0097] The second substrate 120 in the pressure-sensitive chip may have a first through-hole V1. The pressure sensing element 130 in the pressure-sensitive chip may be connected at least to the side of the first substrate 100 facing the second substrate 200, and at least a portion of the pressure sensing element 130 may be exposed within the pressure reference cavity P. That is, the pressure sensing element 130 may be encapsulated between the first substrate 110 and the second substrate 120, and at least a portion of the pressure sensing element 130 may be exposed within the pressure reference cavity P. At least a portion of the conductive portion 140 in the pressure-sensitive chip may be located within the second through-hole V2 of the second substrate 120, and the conductive portion 140 may be electrically connected to the pressure sensing element 130.

[0098] Here, at least a portion of the first substrate 110 in the pressure-sensitive chip, opposite the pressure reference chamber P, can be located on the pressure-sensing membrane 110a. The thickness of the pressure-sensing membrane 110a can be less than the thickness of the second substrate 120, meaning the thickness of the pressure-sensing membrane 110a is relatively small. Thus, when the pressure-sensitive chip is placed in the pressure medium, the pressure sensor 130 can sense the pressure of the pressure medium through the pressure-sensing membrane 110a, and the pressure-sensitive chip can then obtain the pressure of the pressure medium through the pressure sensor 130. Specifically, the pressure sensor 130 can convert the pressure signal caused by the deformation of the pressure-sensing membrane 110a under pressure into an electrical signal, and the pressure-sensitive chip can then obtain the pressure of the pressure medium based on this electrical signal. The conductive portion 140 of the pressure-sensitive chip can transmit the electrical signal from the pressure sensor 130 to an external circuit, so that the pressure-sensitive chip can output the obtained pressure of the pressure medium.

[0099] It should be noted that the pressure value inside the pressure reference chamber P serves as a reference pressure for the pressure-sensitive chip's pressure measurement. In other words, the pressure value of the pressure medium output by the pressure-sensitive chip is based on the pressure value inside the pressure reference chamber P. For example, when the pressure of the pressure medium equals the pressure inside the pressure reference chamber P, the pressure output by the pressure-sensitive chip is zero. When the pressure of the pressure medium is greater than the pressure inside the pressure reference chamber P, the pressure output by the pressure-sensitive chip is the pressure of the pressure medium minus the pressure inside the pressure reference chamber P.

[0100] In this application, since the pressure sensing element 130 in the pressure-sensitive chip is located within the pressure reference cavity P between the first substrate 110 and the second substrate 120, when the pressure-sensitive chip is used in scenarios where the pressure medium is a corrosive gas or liquid, the pressure sensing element 130 located within the pressure reference cavity P will not come into contact with the corrosive gas or liquid, and thus will not fail due to damage. Therefore, the pressure-sensitive chip in this application can be used to measure the pressure of corrosive gases or liquids without further encapsulation. Compared to the oil-filled core in the prior art, the pressure-sensitive chip in this application is smaller and lower in cost. Furthermore, at least a portion of the conductive part 140 is located within the first through-hole V1 of the second substrate 120, and the end of the conductive part 140 facing away from the first substrate 110 can be exposed through the first through-hole V1. Thus, through the conductive part 140 located within the first through-hole V1 of the second substrate 120, the pressure sensing element 130 located within the pressure reference cavity P can be electrically connected to the external circuit, thereby ensuring the normal operation of the pressure-sensitive chip.

[0101] It should be noted that the first substrate 110 in the varistor chip can be a silicon substrate. The second substrate 120 in the varistor chip can be a glass substrate. The conductive part 140 in the varistor chip can be made of copper. In the manufacturing process of the varistor chip, a first through-hole V1 can be formed on the second substrate 120 using glass substrate through-hole technology, and then an electroplating process can be used to fill the first through-hole V1 of the second substrate 120 with copper, thus manufacturing the portion of the conductive part 140 located within the first through-hole V1 of the second substrate 120.

[0102] In summary, this application provides a pressure-sensitive chip, including a first substrate, a second substrate, a pressure sensing element, and a conductive portion. Since the pressure sensing element in the pressure-sensitive chip is located within a pressure reference cavity between the first and second substrates, when the pressure medium is a corrosive gas or liquid, the pressure sensing element within the pressure reference cavity will not come into contact with the corrosive gas or liquid, and therefore will not fail due to damage. Thus, the pressure-sensitive chip in this application can be used to measure the pressure of corrosive gases or liquids without further encapsulation. Compared to oil-filled cores in the prior art, the pressure-sensitive chip in this application is smaller and lower in cost. Furthermore, at least a portion of the conductive portion is located within a first through-hole in the second substrate, and the end of the conductive portion facing away from the first substrate can be exposed through the first through-hole. Thus, through the conductive portion located within the first through-hole in the second substrate, electrical connection between the pressure sensing element within the pressure reference cavity and an external circuit can be achieved, thereby ensuring the normal operation of the pressure-sensitive chip.

[0103] In this application, the pressure sensing element 130 in the pressure-sensitive chip can be implemented in the following two optional ways:

[0104] In a first optional implementation, as shown in Figure 5, which is a schematic diagram of another pressure-sensitive chip provided in this application embodiment, the pressure sensing element 130 in the pressure-sensitive chip can be a varistor. The first substrate 110 in the pressure-sensitive chip may have a support groove C on the side facing the pressure reference cavity P, and at least a portion of the pressure sensing element 130 may be embedded in the support groove C.

[0105] It should be noted that, since at least a portion of the first substrate 110 opposite to the pressure reference chamber P is a pressure-sensing membrane 110a, at least a portion of the pressure sensing element 130 can be embedded within the pressure-sensing membrane 110a. Thus, when the pressure-sensitive chip is located in the pressure medium, the pressure sensing element 130 can sense the pressure of the pressure medium through the pressure-sensing membrane 110a, and the pressure-sensitive chip can then obtain the pressure of the pressure medium through the pressure sensing element 130.

[0106] Optionally, as shown in Figure 5, the side of the second substrate 120 facing the first substrate 110 may have a first groove P1. The portion of the second substrate 120 surrounding the first groove P1 may be fixedly connected to the first substrate 110, thus enabling a stacked arrangement of the first substrate 110 and the second substrate 120. The first groove P1 of the second substrate 120 and the side of the first substrate 110 facing the second substrate 120 can be used to form a pressure reference cavity P. Here, the portion of the second substrate 120 surrounding the first groove P1 is directly fixedly connected to the first substrate 110, ensuring the sealing of the pressure reference cavity P. Consequently, when the pressure-sensitive chip is used in applications where the pressure medium is a corrosive gas or liquid, the pressure sensing element 130 located within the pressure reference cavity P will not be corroded.

[0107] It should be noted that a portion of the pressure sensing element 130 may be located between the first substrate 110 and the pressure reference cavity P, and another portion of the pressure sensing element 130 may be located between the portions of the first substrate 110 and the second substrate 120 surrounding the pressure reference cavity P. Alternatively, the pressure sensing element 130 may be located between the first substrate 110 and the pressure reference cavity P. This application does not specifically limit this aspect.

[0108] Optionally, as shown in Figure 5, the side of the first substrate 110 facing away from the second substrate 120 may have a second groove P2. The orthographic projection of the second groove P2 of the first substrate 110 onto the side of the first substrate 110 facing the second substrate 120 may be located within the orthographic projection of the pressure reference cavity P onto the side of the first substrate 110 facing the second substrate 120. The pressure-sensitive membrane 110a may be the portion of the first substrate 110 located between the second groove P2 and the pressure reference cavity P. Specifically, the pressure-sensitive membrane 110a may be the portion of the first substrate 110 located between the side of the second groove P2 facing the second substrate 120 and the pressure reference cavity P.

[0109] In this way, the thickness of the pressure-sensitive film 110a can be less than the overall thickness of the first substrate 110, thus enabling the pressure-sensitive film 110a to be formed on the first substrate 110. Therefore, when the pressure-sensitive chip is in a pressure medium, the pressure sensor 130 can sense the pressure of the pressure medium through the pressure-sensitive film 110a, and the pressure-sensitive chip can obtain the pressure of the pressure medium through the pressure sensor 130.

[0110] It should be noted that the pressure sensing element 130 is a piezoresistor. After the piezoresistor is in the pressure medium, the resistance value of the piezoresistor can change according to the pressure applied to the pressure sensing diaphragm 110a by the pressure medium. In turn, the piezoresistor can obtain the pressure of the pressure medium according to the resistance value of the piezoresistor.

[0111] In a second alternative embodiment, as shown in Figure 6, which is a schematic diagram of another pressure-sensitive chip provided in this application, the pressure sensing element 130 in the pressure-sensitive chip may include: a first conductive plate 1301 and a second conductive plate 1302. At least a portion of the first conductive plate 1301 may be fixedly connected to the side of the first substrate 110 facing the pressure reference cavity P, and at least a portion of the second conductive plate 1302 may be fixedly connected to the side of the second substrate 120 facing the pressure reference cavity P.

[0112] In this configuration, at least a portion of the first conductive plate 1301 can be disposed opposite to at least a portion of the second conductive plate 1302, and the pressure reference chamber P can be located at least between the oppositely disposed portions of the first conductive plate 1301 and the second conductive plate 1302, meaning there can be a certain distance between the first conductive plate 1301 and the second conductive plate 1302. Thus, when an external circuit supplies power to the first conductive plate 1301 and the second conductive plate 1302 through the conductive part 140, the oppositely disposed portions of the first conductive plate 1301 and the second conductive plate 1302 can form a capacitor.

[0113] It should be noted that the pressure-sensitive membrane 110a is the portion of the first substrate 110 opposite to the pressure reference cavity P. Therefore, at least a portion of the first conductive plate 1301 is fixedly connected to the side of the pressure-sensitive membrane 110a facing the pressure reference cavity P. Thus, when the pressure-sensitive chip is in the pressure medium, because the pressure-sensitive membrane 110a is relatively thin, it will displace in the direction towards the pressure reference cavity P. This will cause the first conductive plate 1301 to displace in the direction towards the second conductive plate 1302. Consequently, the capacitance value of the capacitor formed by the opposing portions of the first conductive plate 1301 and the second conductive plate 1302 will change. Therefore, the pressure-sensitive chip can obtain the pressure of the pressure medium based on the capacitance value.

[0114] Optionally, as shown in Figure 6, the pressure-sensitive chip may further include an isolation substrate 150. The isolation substrate 150 in the pressure-sensitive chip may be located between the first conductive plate 1301 and the second conductive plate 1301, and the isolation substrate 150 may be distributed around the pressure reference cavity P. Here, the side of the isolation substrate 150 facing the second substrate 120 may be fixedly connected to the second substrate 120, and the side of the isolation substrate 150 facing the first substrate 110 may be fixedly connected to the first substrate 110. Thus, the first substrate 110, the second substrate 120, and the isolation substrate 150 located between the first substrate 110 and the second substrate 120 can be used to form the pressure reference cavity P.

[0115] Optionally, as shown in Figure 6, the pressure-sensitive chip may further include: a first connecting seal 1601 located between the first substrate 110 and the isolation substrate 150, and a second connecting seal 1602 located between the second substrate 120 and the isolation substrate 150, wherein the first connecting seal 1601 and the second connecting seal 1602 are both distributed around the pressure reference cavity P.

[0116] Here, the first connecting seal 1601 connects the first substrate 110 and the isolation substrate 150, and ensures that the pressure reference chamber P does not communicate with the outside through the gap between the first substrate 110 and the isolation substrate 150. The second connecting seal 1602 connects the second substrate 120 and the isolation substrate 150, and ensures that the pressure reference chamber P does not communicate with the outside through the gap between the second substrate 120 and the isolation substrate 150. Thus, the first connecting seal 1601 and the second connecting seal 1602 ensure the sealing of the pressure reference chamber P, and therefore, when the pressure-sensitive chip is used in a corrosive gas or liquid environment, the pressure sensing element 130 located in the pressure reference chamber P will not be corroded.

[0117] Optionally, as shown in Figure 6, the first connecting seal 1601 can be disposed in the same layer as the first conductive plate 1301 and made of the same material. That is, if the first conductive plate 1301 is made of a conductive material, the first connecting seal 1601 is also made of a conductive material. Furthermore, the first connecting seal 1601 can be insulated from the first conductive plate 1301. Here, there can be a certain distance between the first connecting seal 1601 and the first conductive plate 1301 so that the first connecting seal 1601 does not contact the first conductive plate 1301, thereby enabling the first connecting seal 1601 to be insulated from the first conductive plate 1301.

[0118] Similarly, as shown in Figure 6, the second connecting seal 1602 can be disposed in the same layer as the second conductive plate 1302 and made of the same material. That is, if the second conductive plate 1302 is made of a conductive material, the second connecting seal 1602 is also made of a conductive material. Furthermore, the second connecting seal 1602 can be insulated from the second conductive plate 1302. Here, there can be a certain distance between the second connecting seal 1602 and the second conductive plate 1302 so that the second connecting seal 1602 will not contact the second conductive plate 1302, thereby enabling the second connecting seal 1602 to be insulated from the second conductive plate 1302.

[0119] Optionally, as shown in Figure 6, the pressure-sensitive chip may further include: a first support 1701 located between the first substrate 110 and the isolation substrate 150, and a second support 1702 located between the second substrate 120 and the isolation substrate 150. The first support 1701 may be located between the first connecting seal 1601 and the pressure reference chamber P, and the second support 1702 may be located between the second connecting seal 1602 and the pressure reference chamber P.

[0120] Here, the first support member 1701, located between the first connecting seal 1601 and the pressure reference chamber P, is also used to connect the first base 110 and the isolation base 150 to ensure the reliability of the connection between the first base 110 and the isolation base 150. The second support member 1702, located between the second connecting seal 1602 and the pressure reference chamber P, is also used to connect the second base 120 and the isolation base 150 to ensure the reliability of the connection between the second base 120 and the isolation base 150.

[0121] Optionally, as shown in Figure 6, the first support member 1701 can be disposed in the same layer and made of the same material as the first connecting seal member 1601 and the first conductive plate 1301. That is, if the first conductive plate 1301 and the first connecting seal member 1601 are made of conductive material, the first support member 1701 is also made of conductive material. Furthermore, the first support member 1701 can be insulated from the first conductive plate 1301. Here, there can be a certain distance between the first support member 1701 and the first conductive plate 1301 so that the first support member 1701 will not contact the first conductive plate 1301, thereby enabling the first support member 1701 to be insulated from the first conductive plate 1301. Additionally, there can be a certain distance between the first support member 1701 and the first connecting member 1601 so that the first support member 1701 and the first connecting member 1601 will not contact each other. Alternatively, the first support member 1701 and the first connecting member 1601 can be in contact; this embodiment does not specifically limit this.

[0122] Optionally, as shown in Figure 6, the second support member 1702 can be disposed in the same layer and made of the same material as the second connecting seal member 1602 and the second conductive plate 1302. That is, if the second conductive plate 1302 and the second connecting seal member 1602 are made of conductive material, the second support member 1702 is also made of conductive material. Furthermore, the second support member 1702 can be insulated from the second conductive plate 1302. Here, there can be a certain distance between the second support member 1702 and the second conductive plate 1302 so that the second support member 1702 will not contact the second conductive plate 1302, thereby enabling the second support member 1702 to be insulated from the second conductive plate 1302. Additionally, there can be a certain distance between the second support member 1702 and the second connecting member 1602 so that the second support member 1702 and the second connecting member 1602 will not contact each other. Alternatively, the second support member 1702 and the second connecting member 1602 can be in contact; this embodiment does not specifically limit this.

[0123] In this application, the structure of the conductive portion 140 in the pressure-sensitive chip can also have two optional implementation methods:

[0124] In a first optional implementation, as shown in Figure 7, which is a schematic diagram of a pressure-sensitive chip according to another embodiment of this application, the conductive portion 140 in the pressure-sensitive chip may include a first conductive post 1401. The first conductive post 1401 in the conductive portion 140 may be located within a first through hole V1 in the second substrate 120. One end of the first conductive post 1401 may be electrically connected to the pressure sensing element 130, and the other end of the first conductive post 1401 may be exposed through the first through hole V1 from the side of the second substrate 120 opposite to the first substrate 110. In this way, the first conductive post 1401 enables the electrical connection between the pressure sensing element 1301 located in the pressure reference cavity P and the external circuit.

[0125] In a second optional implementation, as shown in Figures 5 and 6, the conductive part 140 may further include an external conductive block 1402, that is, the conductive part 140 may include a first conductive post 1401 and an external conductive block 1402. The external conductive block 1402 in the conductive part 140 may be located on the side of the second substrate 120 opposite to the first substrate 110, and the external conductive block 1402 may be electrically connected to the end of the first conductive post 1401 opposite to the pressure sensing element 130. In this way, the pressure sensing element 130 located in the pressure reference chamber P can be electrically connected to the external conductive block 1402 through the first conductive post 1401, and the pressure sensing element 130 can be electrically connected to the external circuit through the external conductive block 1402.

[0126] It should be noted that, as shown in Figures 5 and 6, the external conductive block 1402 in the conductive part 140 may include: a first electrical connection structure 14021, a second electrical connection structure 14022, and a conductive block body 14023. Here, both the first electrical connection structure 14021 and the second electrical connection structure 14022 can be located on the side of the second substrate 120 opposite to the first substrate 110, and the conductive block body 14023 can be located on the side of the second electrical connection structure 14022 opposite to the second substrate 120. Furthermore, one end of the first electrical connection structure 14021 can be electrically connected to the first conductive post 1401, and the other end can be electrically connected to the second electrical connection structure 14022. The second electrical connection structure 14022 can be electrically connected to the conductive block body 14023. In this way, the electrical signal of the pressure sensing element 130 can be transmitted sequentially through the first conductive post 1401, the first electrical connection structure 14021, and the second electrical connection structure 14022 to the conductive block body 14023, and then through the conductive block body 14023 to the external circuit.

[0127] It should also be noted that the first electrical connection structure 14021 can be a redistribution layer (RDL), the second electrical connection structure 14022 can be an underball metal layer (UBM), and the conductive block body 14023 can be a sphere made of tin. Here, the second electrical connection structure 14022, which is UBM, can prevent tin atoms from diffusing from the tin conductive block body 14023 to the first electrical connection structure 14021, which is RDL, to ensure the normal transmission of electrical signals.

[0128] Optionally, in the first optional implementation of the pressure sensing element 130, that is, when the pressure sensing element 1301 is a piezoresistor, as shown in Figures 5 and 7, the conductive part 140 may further include a resistor lead 1403. The resistor lead 1403 can be embedded in the first substrate 110, and the orthographic projection of the resistor lead 1403 on the side of the first substrate 110 facing the second substrate 120 can be located within the orthographic projection of the portion of the second substrate 120 surrounding the pressure reference cavity P on the side of the first substrate 110 facing the second substrate 120. The resistor lead 1403 can be electrically connected to the piezoresistor and can be electrically connected to the first conductive post 1401. That is, one end of the first conductive post 1401 can be electrically connected to the pressure sensing element 130 through the resistor lead 1403.

[0129] In this application, when the pressure sensing element 130 in the pressure-sensitive chip is a piezoresistive resistor, the pressure-sensitive chip measures the pressure of the pressure medium using a Wheatstone bridge. For example, as shown in FIG8, FIG8 is a circuit diagram of a consistent Wheatstone bridge provided in an embodiment of this application. The Wheatstone bridge is a bridge circuit composed of four resistors connected in series, and has two input points U1 and U2, and two output points U3 and U4. The two input points U1 and U2 are used to input voltage to the Wheatstone bridge.

[0130] Here, the resistance values ​​of the three resistors in the Wheatstone bridge are fixed, and can be R1, R2, and R3 respectively. The resistance value of the fourth resistor, R4, can vary. When R4 changes, the voltage between the two output points U1 and U2 in the diagram changes. By collecting the voltage change, the change in the physical quantity can be determined, thus achieving the measurement purpose. The Wheatstone bridge uses the change in resistance to measure the change in a physical quantity.

[0131] It should be noted that during the manufacturing process of the pressure-sensitive chip, the four resistors in the Wheatstone bridge can be located within the pressure reference chamber P after corresponding electrical connections. The two input points U1 and U2, and the two output points U3 and U4 in the Wheatstone bridge can be electrically connected to external circuit points through conductive parts 140. That is, as shown in Figure 9, which is a top view of a pressure-sensitive chip provided in an embodiment of this application, when the pressure sensing element 130 in the pressure-sensitive chip is a varistor, the pressure-sensitive chip needs to have four conductive parts 140 to be electrically connected to the two input points U1 and U2, and the two output points U3 and U4 in the Wheatstone bridge, respectively.

[0132] When the pressure-sensitive chip measures pressure by changing capacitance, as shown in Figure 5, the pressure-sensitive chip can have two conductive parts 140, which can be connected to the first conductive plate 1301 and the second conductive plate 1302 in the pressure sensing element 130, respectively.

[0133] It should also be noted that when the pressure sensing element 130 in the pressure-sensitive chip is a piezoresistive resistor, the pressure-sensitive chip can be a piezoresistive pressure chip, which can be used for medium to high range pressure measurements. When the pressure-sensitive chip measures pressure through capacitance changes, it can be a capacitive pressure chip, which has higher sensitivity and can be used for low range pressure measurements.

[0134] In summary, this application provides a pressure-sensitive chip, including a first substrate, a second substrate, a pressure sensing element, and a conductive portion. Since the pressure sensing element in the pressure-sensitive chip is located within a pressure reference cavity between the first and second substrates, when the pressure medium is a corrosive gas or liquid, the pressure sensing element within the pressure reference cavity will not come into contact with the corrosive gas or liquid, and therefore will not fail due to damage. Thus, the pressure-sensitive chip in this application can be used to measure the pressure of corrosive gases or liquids without further encapsulation. Compared to oil-filled cores in the prior art, the pressure-sensitive chip in this application is smaller and lower in cost. Furthermore, at least a portion of the conductive portion is located within a first through-hole in the second substrate, and the end of the conductive portion facing away from the first substrate can be exposed through the first through-hole. Thus, through the conductive portion located within the first through-hole in the second substrate, electrical connection between the pressure sensing element within the pressure reference cavity and an external circuit can be achieved, thereby ensuring the normal operation of the pressure-sensitive chip.

[0135] This application also provides a pressure sensor. Please refer to FIG10, which is a schematic diagram of the structure of a pressure sensor provided in this application embodiment. The pressure sensor may include: a pressure-sensitive chip 100, a housing 200, and an electrical adapter 300. The pressure-sensitive chip 100 in the pressure sensor may be the pressure-sensitive chip in the above embodiment. The housing 200 in the pressure sensor has a first receiving cavity S1 and a fluid channel H communicating with the first receiving cavity S1. The electrical adapter 300 may be located in the first receiving cavity S1 of the housing 100 and may be fixedly connected to the housing 100.

[0136] The pressure-sensitive chip 100 in the pressure sensor can be located within the fluid channel H. The side of the second substrate 120 in the pressure-sensitive chip 100 facing away from the first substrate 100 can be fixedly connected to the electrical adapter 300, and the pressure-sensitive chip 100 can be electrically connected to the electrical adapter 300 through the conductive part 140 in the pressure-sensitive chip 100. In this way, the electrical signal of the pressure sensing element 130 in the pressure-sensitive chip can be transmitted to the electrical adapter through the conductive part 140 to realize the output of the pressure of the pressure medium measured by the pressure-sensitive chip.

[0137] It should be noted that when the pressure sensor is used to measure the pressure of a pressure medium, the pressure medium can be located in the fluid channel H of the housing 200, so that the pressure-sensitive chip 100 can be in the pressure medium to measure the pressure of the pressure medium.

[0138] Optionally, as shown in Figures 10 and 11, where Figure 11 is a partially enlarged view of the pressure sensor shown in Figure 10, the electrical adapter assembly 300 in the pressure sensor may include a first insulating plate 301 and a first conductor 302. The first insulating plate 301 in the electrical adapter assembly 300 may have a second through-hole V2, and at least a portion of the first conductor 302 in the electrical adapter assembly 300 may be located within the second through-hole V2 of the first insulating plate 301. For example, the insulating substrate 301 in the electrical adapter assembly 300 may be made of a ceramic material.

[0139] Here, the conductive portion 140 in the pressure-sensitive chip 100 can be electrically connected to the first conductor 302 in the electrical adapter assembly 300, thus achieving electrical connection between the conductive portion 140 in the pressure-sensitive chip 100 and the electrical adapter assembly 300. The side of the second substrate 120 in the pressure-sensitive chip 100 facing away from the first substrate 110 can be fixedly connected to the insulating substrate 301 in the electrical adapter assembly 300, thus achieving fixed connection between the pressure-sensitive chip 100 and the electrical adapter assembly 300.

[0140] It should be noted that the number of first conductors 302 in the electrical adapter 300 can be the same as the number of conductive portions 140 in the pressure-sensitive chip 100. Specifically, when the pressure sensing element 130 in the pressure-sensitive chip 100 is a piezoresistor, the pressure-sensitive chip 100 includes four conductive portions 140. Correspondingly, the insulating substrate 301 in the electrical adapter 300 can have four second through holes V2, and the electrical adapter 300 can include four first conductors 302. When the pressure-sensitive chip 100 measures the pressure of the pressure medium by changing the capacitance, the pressure-sensitive chip 100 includes two conductive portions 140. Correspondingly, the insulating substrate 301 in the electrical adapter 300 can have two second through holes V2, and the electrical adapter 300 can include two first conductors 302.

[0141] In this application, the structure of the first conductor 302 in the electrical transfer assembly 300 can also have the following two optional implementations:

[0142] In a first optional implementation, as shown in Figures 11 and 12, Figure 12 is a schematic diagram of the connection between a pressure-sensitive chip and an electrical adapter according to an embodiment of this application. The first conductor 302 may include a conductive paste 3021 and a first conductive lead 3022. The conductive paste 3021 in the first conductor 302 may be located within the second through-hole V2 of the insulating substrate 301. The first conductive lead 3022 in the first conductor 302 may be inserted into the conductive paste 3021 and extend out of the second through-hole V2 of the insulating substrate 301. Here, the portion of the first conductive lead 3022 extending out of the second through-hole V2 of the insulating substrate 301 may be located on the side of the insulating substrate 301 facing away from the pressure-sensitive chip 100. The conductive portion 140 in the pressure-sensitive chip 100 may be electrically connected to the conductive paste 3021 in the first conductor 302, and thus to the first conductive lead 3022.

[0143] In this way, the pressure sensing element 130 in the pressure-sensitive chip 100 can be electrically connected to the conductive paste 3021 through the conductive part 140, and then electrically connected to the first conductive lead 3022 through the conductive paste 3021. Thus, the first conductive lead 3022 extending out of the second through hole V2 of the insulating substrate 301 can be electrically connected to the external circuit, thereby realizing the transmission of electrical signals from the pressure sensing element 130.

[0144] In the second optional implementation, as shown in Figures 13, 14, and 15, Figure 13 is a schematic diagram of another connection structure between the pressure-sensitive chip and the electrical adapter assembly provided in this embodiment; Figure 14 is a partially enlarged view of a pressure sensor provided in this embodiment; and Figure 15 is a partially enlarged view of another pressure sensor provided in this embodiment. The first conductor 302 in the electrical adapter assembly 300 may include a conductive plating layer 3023 and a second conductive lead 3024. A portion of the conductive plating layer 3023 in the first conductor 302 may be attached to the inner wall of the second through hole V2 of the insulating substrate 301. Another portion of the conductive plating layer 3023 may be located on the side of the first insulating plate 301 opposite to the pressure-sensitive chip 100. The second conductive lead 3024 in the first conductor 302 may be electrically connected to the portion of the conductive plating layer 3023 located on the side of the first insulating plate 301 opposite to the pressure-sensitive chip 100. The conductive portion 140 in the pressure-sensitive chip 100 can be electrically connected to the portion of the conductive plating layer 3023 attached to the inner wall of the second through hole V2.

[0145] In this way, the pressure sensor 130 in the pressure-sensitive chip 100 can be electrically connected to the conductive plating layer 3023 in the electrical transfer assembly 300 through the conductive part 140, and then electrically connected to the second conductive lead 3022 through the conductive plating layer 3023. Thus, it can be electrically connected to the external circuit through the second conductive lead 3022 located on the side of the insulating substrate 301 away from the pressure-sensitive chip 100, thereby realizing the transmission of electrical signals from the pressure sensor 130.

[0146] It should be noted that the conductive plating layer 3023 can be made of copper. After the second through hole V2 of the insulating substrate 301 is manufactured, the conductive plating layer 3023 can also be formed inside the second through hole V2 by electroplating, so that the conductive plating layer 3023 can adhere to the inner wall of the second through hole V2. Moreover, when the conductive plating layer 3023 is manufactured by electroplating, the conductive plating layer 3023 can also be attached to the side of the insulating substrate 301 opposite to the pressure-sensitive chip 100, and the second conductive lead 3024 in the first conductor 302 can be electrically connected to the conductive plating layer 3023 attached to the side of the insulating substrate 301 opposite to the pressure-sensitive chip 100.

[0147] In this application, in the above embodiments, the structure of the conductive part 140 in the pressure-sensitive chip can also be implemented in two optional ways: the conductive part 140 in the pressure-sensitive chip may include a first conductive post 1401, or the conductive part 140 in the pressure-sensitive chip may include a first conductive post 1401 and an external conductive block 1402.

[0148] As shown in Figures 12 and 15, when the conductive portion 140 in the pressure-sensitive chip may include a first conductive post 1401, the end of the first conductive post 1401 facing away from the pressure sensing element 130 can be electrically connected to the portion of the first conductor 302 located within the second through hole V2. This enables electrical connection between the conductive portion 140 in the pressure-sensitive chip and the first conductor 302 in the electrical transfer assembly 300.

[0149] As shown in Figures 11 and 14, when the conductive portion 140 in the pressure-sensitive chip 100 includes a first conductive post 1401 and an external conductive block 1402, the end of the first conductive post 1401 facing away from the pressure sensor 130 can be electrically connected to the external conductive block 1402. The external conductive block 1402 can be located on the side of the second substrate 120 facing away from the first substrate 110. At least a portion of the external conductive block 1402 can be located within the second through hole V2 of the insulating substrate 301 and electrically connected to the first conductor 302. This enables the electrical connection between the conductive portion 140 in the pressure-sensitive chip and the first conductor 302 in the electrical transfer assembly 300.

[0150] When the first conductor 302 in the electrical adapter assembly 300 has two optional implementation methods, and the conductive part 140 in the pressure-sensitive chip 100 also has two optional implementation methods, the connection between the first conductor 302 and the conductive part 140 can have the following four cases:

[0151] In the first case, when the first conductor 302 includes a conductive paste 3021 and a first conductive lead 3022, and the conductive portion 140 in the pressure-sensitive chip 100 includes a first conductive post 1401, as shown in FIG10, the end of the first conductive post 1401 in the conductive portion 140 that faces away from the pressure sensing element 130 can be electrically connected to the conductive paste 3021 located in the second through hole V2. This achieves electrical connection between the conductive portion 140 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical adapter assembly 300, thereby achieving electrical connection between the pressure sensing element 130 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical adapter assembly 300.

[0152] In the second scenario, when the first conductor 302 includes a conductive paste 3021 and a first conductive lead 3022, and the conductive portion 140 in the pressure-sensitive chip 100 includes a first conductive post 1401 and an external conductive block 1402, as shown in FIG11, the end of the first conductive post 1401 facing away from the pressure sensor 130 can be electrically connected to the external conductive block 1402. The external conductive block 1402 can be located on the side of the second substrate 120 facing away from the first substrate 110. At least a portion of the external conductive block 1402 can be located within the second through hole of the insulating substrate 301 and electrically connected to the conductive paste 3021 in the first conductor 302, and can then be electrically connected to the first conductive lead 3022 through the conductive paste 3021.

[0153] Here, the first electrical connection structure 14021 in the external conductive block 1402 is electrically connected to the first conductive post 1401, the first electrical connection structure 14021 in the external conductive block 1402 is electrically connected to the second electrical connection structure 14022 in the external conductive block 1402, the second electrical connection structure 14022 in the external conductive block 1402 is electrically connected to the conductive block body 14023 in the external conductive block 1402, and the conductive block body 14023 in the external conductive block 1402 is located within the second through hole V2 of the insulating substrate 301 and is electrically connected to the conductive paste 3021 in the first conductor 302. For example, the entire conductive block body 14023 may be located within the second through hole V2 of the insulating substrate 301.

[0154] This enables the electrical connection between the conductive part 140 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, thereby enabling the electrical connection between the pressure sensing element 130 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, so as to realize the transmission of the electrical signal of the pressure sensing element 130 to the electrical transfer assembly 300.

[0155] It should be noted that the conductive paste 3021 located in the second through hole V2 can wrap the portion of the external conductive block 1402 located in the second through hole V2, so that the conductive paste 3021 and the external conductive block 1402 have good electrical connection.

[0156] In the third case, when the first conductor 302 includes a conductive plating layer 3023 and a second conductive lead 3042, and the conductive portion 140 in the pressure-sensitive chip 100 includes a first conductive post 1401 and an external conductive block 1402, as shown in FIG14, the end of the first conductive post 1401 facing away from the pressure sensing element 130 can be electrically connected to the external conductive block 1402, and the external conductive block 1402 can be located on the side of the second substrate 120 facing away from the first substrate 110. The external conductive block 1402 can be electrically connected to the side of the conductive plating layer 3023 facing the pressure-sensitive chip 100, and then the external conductive block 1402 can be electrically connected to the second conductive lead 3024 through the conductive plating layer 3023 located in the second through hole V2.

[0157] Here, the first electrical connection structure 14021 in the external conductive block 1402 is electrically connected to the first conductive post 1401, the first electrical connection structure 14021 in the external conductive block 1402 is electrically connected to the second electrical connection structure 14022 in the external conductive block 1402, the second electrical connection structure 14022 in the external conductive block 1402 is electrically connected to the conductive block body 14023 in the external conductive block 1402, and the conductive block body 14023 in the external conductive block 1402 can be electrically connected to the side of the conductive plating layer 3023 facing the pressure-sensitive chip 100. This achieves electrical connection between the conductive part 140 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, thereby achieving electrical connection between the pressure sensing element 130 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, and enabling the transmission of electrical signals from the pressure sensing element 130 to the electrical transfer assembly 300.

[0158] It should be noted that the conductive block body 1403 in the external conductive block 1401 can be fixedly connected to the side of the conductive plating layer 3023 facing the varistor chip 100. For example, the conductive block body 1403 in the external conductive block 1401 can be soldered to the side of the conductive plating layer 3023 facing the varistor chip 100. In this way, the conductive block body 1403 in the external conductive block 1401 can not only be electrically connected to the side of the conductive plating layer 3023 facing the varistor chip 100, but also be fixedly connected to it, which can improve the connection strength between the varistor chip 100 and the electrical adapter assembly 300.

[0159] In the fourth case, when the first conductor 302 includes a conductive plating layer 3023 and a second conductive lead 3042, and the conductive portion 140 in the pressure-sensitive chip 100 includes a first conductive post 1401, as shown in FIG15, the end of the first conductive post 1401 in the conductive portion 140 that faces away from the pressure sensing element 130 can be electrically connected to the conductive plating layer 3023 located in the second through hole V2. This achieves electrical connection between the conductive portion 140 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, thereby achieving electrical connection between the pressure sensing element 130 in the pressure-sensitive chip 100 and the first conductor 302 in the electrical transfer assembly 300, and enabling the transmission of the electrical signal from the pressure sensing element 130 to the electrical transfer assembly 300.

[0160] Optionally, as shown in Figures 11, 12, 14, and 15, the electrical adapter assembly 300 may further include a sealing and fixing portion 303. The sealing and fixing portion 303 in the electrical adapter assembly 300 can be fixedly connected to the side of the insulating substrate 301 facing the pressure-sensitive chip 100, and the sealing and fixing portion 303 can be distributed around the pressure-sensitive chip 100 and fixedly connected to it. Thus, the sealing and fixing portion 303 achieves a fixed connection between the pressure-sensitive chip 100 and the insulating substrate 301 in the electrical adapter assembly 300. Furthermore, the sealing and fixing portion 303's distribution around the pressure-sensitive chip 100 allows the pressure-sensitive chip 100 to be surrounded by the sealing and fixing portion 303, preventing the pressure medium from contacting the conductor portion 140 in the pressure-sensitive chip 100 after the pressure-sensitive chip 100 is placed in the pressure medium, thus preventing the pressure-sensitive chip 100 from malfunctioning.

[0161] Specifically, the sealing and fixing portion 303 in the electrical adapter assembly 300 can also be distributed around the second through hole V2 of the insulating substrate 301, and the orthographic projection of the sealing and fixing portion 303 on the insulating substrate 301 does not overlap with the second through hole V2 of the insulating substrate 301. This can improve the connection strength between the pressure-sensitive chip 100 and the insulating substrate 301 through the sealing and fixing portion 303. Furthermore, the distribution of the sealing and fixing portion 303 around the second through hole V2 allows the sealing and fixing portion 303 to also surround the connection position between the first conductor 302 and the conductive portion 140 of the pressure-sensitive chip 100 located in the second through hole V2, so as to prevent the pressure medium from contacting the connection position between the first conductor 302 and the conductive portion 140 after the pressure-sensitive chip 100 is placed in the pressure medium, which would cause the pressure-sensitive chip 100 to fail.

[0162] Optionally, the sealing and fixing portion 303 in the electrical adapter assembly 300 can be made of an insulating material, for example, glass. Alternatively, the sealing and fixing portion 303 can be made of a metal bonding material, for example, copper, tin, or gold.

[0163] When the sealing and fixing part 303 is made of insulating material, and when the first conductor 302 includes conductive paste 3021 and first conductive lead 3022, and the conductive part 140 in the pressure-sensitive chip 100 includes the first conductive post 1401 and the external conductive block 1402, as shown in FIG11, a part of the external conductive block 1402, namely the conductive block body 14023, is located in the second through hole V2, and the other parts of the external conductive block 1402, namely the first electrical connection structure 14021 and the second electrical connection structure 14023, can directly contact the sealing and fixing part 303.

[0164] When the sealing and fixing portion 303 is made of an insulating material, and the first conductor 302 includes a conductive paste 3021 and a first conductive lead 3022, and the conductive portion 140 in the pressure-sensitive chip includes a first conductive post 1401, as shown in FIG12; or, when the sealing and fixing portion 303 is made of an insulating material, and the first conductor 302 includes a conductive plating layer 3023 and a second conductive lead 3024, and the conductive portion 140 in the pressure-sensitive chip includes a first conductive post 1401, as shown in FIG13, the sealing and fixing portion 303 can be distributed around the second through hole V2. Specifically, one end of the first conductor 302 facing the pressure-sensitive chip 100 may have a portion extending from the second through hole V2, and the sealing and fixing portion 303 can be distributed around the portion of the first conductor 100 extending from the second through hole V2.

[0165] When the sealing and fixing part 303 is made of insulating material, and the first conductor 302 includes a conductive plating layer 3023 and a second conductive lead 3024, and the conductive part 140 in the pressure-sensitive chip 100 includes a first conductive post 1401 and an external conductive block 1402, as shown in FIG14, since a part of the external conductive block 1402, namely the conductive block body 14023, is fixedly connected to the conductive plating layer 3023 located in the second through hole V2, the sealing and fixing part 303 can be distributed around the conductive block body 14023 and can contact the conductive block body 14023. Furthermore, other parts of the external conductive block 1402, namely the first electrical connection structure 14021 and the second electrical connection structure 14023, can directly contact the sealing and fixing part 303.

[0166] When the sealing and fixing part 303 is made of a metal bonding material, the sealing and fixing part 303 may have a clearance area B. The orthographic projection of the second through hole V2 of the insulating substrate 301 and the first through hole V1 of the second substrate 120 onto the side of the insulating substrate 301 facing the pressure-sensitive chip 100 may be located within the clearance area B of the sealing and fixing part 303 within the orthographic projection of the side of the insulating substrate 301 facing the pressure-sensitive chip 100, so that the sealing and fixing part 303 is insulated from the conductive part 140. This avoids the metal sealing and fixing part 303 from affecting the transmission of electrical signals of the pressure-sensitive chip 100.

[0167] It should be noted that the orthographic projection of the second through hole V2 of the insulating substrate 301 and the first through hole V1 of the second substrate 120 onto the side of the insulating substrate 301 facing the pressure-sensitive chip 100 can be located within the orthographic projection of the clearance area B of the sealing and fixing part 303 onto the side of the insulating substrate 301 facing the pressure-sensitive chip 100. This means that the sealing and fixing part 303 is insulated from the conductive part 140, which means that there is a certain distance between the conductive part 140 and the sealing and fixing part 303, and the conductive part 140 does not contact the sealing and fixing part 303.

[0168] For example, as shown in FIG16, FIG16 is a top view of a sealing and fixing part provided in an embodiment of the present application. When the conductive part 140 in the pressure-sensitive chip 100 includes a first conductive post 1401 and an external conductive block 1402, the first through hole V1 of the second substrate 120, and the first electrical connection structure 14021, the second electrical connection structure 14022 and the conductive block body 14023 in the external conductive block 1402, all need to be located in the avoidance area B of the sealing and fixing part 303 within the orthogonal projection of the insulating substrate 301 towards the pressure-sensitive chip 100, so as to ensure that neither the first conductive post 1401 nor the external fixing block 1402 will contact the sealing and fixing part 303.

[0169] In the manufacturing of the pressure sensor, the connected electrical adapter 301 and the pressure-sensitive chip 100 can be manufactured separately, and then installed inside the housing 200. The manufacturing process of the connected electrical adapter 301 and the pressure-sensitive chip 100 is as follows:

[0170] After the insulating substrate 301 with the second through hole V2 and the pressure-sensitive chip 100 are manufactured, the electrical adapter 300 and the pressure-sensitive chip 100 can be fixedly connected and electrically connected through the following steps. The insulating substrate 301 with the second through hole V2 can be manufactured using laser or mechanical drilling.

[0171] Specifically, when the first conductor 302 in the electrical transfer assembly 300 includes a conductive paste 3021 and a first conductive lead 3022, firstly, after manufacturing the insulating substrate 301 having the second through hole V2, a sealing and fixing portion 303 can be manufactured on the side of the insulating substrate 301 facing the varistor chip 100. During the curing of the sealing and fixing portion 303 on the side of the insulating substrate 301 facing the varistor chip 100, the sealing and fixing portion 303 must not cover the second through hole V2 of the insulating substrate 301. Next, the varistor chip 100 can be placed on the sealing and fixing portion 303, and after the sealing and fixing portion 303 is fixed, a fixed connection between the insulating substrate 301 and the varistor chip 100 can be achieved. Here, when placing the varistor chip 100 on the sealing and fixing portion 303, it is necessary to ensure that the conductive portion 140 in the varistor chip 100 is positioned opposite to the corresponding second through hole V2. Finally, the conductive paste 3021 can be filled into the second through hole V2 by screen printing. After the conductive paste 3021 is filled, the first conductive lead 3022 can be inserted into the conductive paste 3021 before the conductive paste 3021 is cured.

[0172] When the first conductor 302 in the electrical transfer assembly 300 includes a conductive plating layer 3023, firstly, after manufacturing the insulating substrate 301 having the second through hole V2, an electroplating process can be used to coat the inner wall of the second through hole V2 of the insulating substrate 301 with a conductive material to form the conductive plating layer 3023. For example, the conductive material can be copper. Next, a sealing and fixing portion 303 can be manufactured on the side of the insulating substrate 301 facing the pressure-sensitive chip 100. During the curing of the sealing and fixing portion 303 on the side of the insulating substrate 301 facing the pressure-sensitive chip 100, the sealing and fixing portion 303 must not cover the second through hole V2 of the insulating substrate 301. Finally, the pressure-sensitive chip 100 can be placed on the sealing and fixing portion 303, and after the sealing and fixing portion 303 is fixed, a fixed connection between the insulating substrate 301 and the pressure-sensitive chip 100 can be achieved. Here, when the pressure-sensitive chip 100 is placed on the sealing fixing part 303, it is necessary to ensure that the conductive part 140 in the pressure-sensitive chip 100 is electrically connected to the conductive plating layer 3023 located in the second through hole V2.

[0173] Optionally, the pressure reference chamber P in the pressure-sensitive chip 100 can be a vacuum-sealed chamber. When the pressure reference chamber P in the pressure-sensitive chip 100 is a vacuum-sealed chamber, the pressure value of the pressure medium output by the pressure-sensitive chip is based on the pressure value inside the vacuum-sealed chamber.

[0174] Optionally, as shown in Figures 17 and 18, Figure 17 is a schematic diagram of another pressure sensor provided in an embodiment of this application, and Figure 18 is a partially enlarged view of the pressure sensor shown in Figure 17. The housing 200 in the pressure sensor may also have a second receiving cavity located on the side of the first receiving cavity S1 opposite to the fluid channel H. The second substrate 120 in the pressure-sensitive chip 100 may have a first through hole H, and the insulating substrate 301 in the electrical transfer assembly 300 may have a second through hole C2. One end of the first through hole C1 of the second substrate 120 may communicate with the pressure reference cavity P, and the other end may communicate with the second through hole C2 of the insulating substrate 301. The end of the second through hole C2 of the insulating substrate 301 opposite to the first through hole C1 of the second substrate 120 may communicate with the second receiving cavity C2 of the housing 200.

[0175] Thus, through the first through-hole C1 of the second substrate 120 and the second through-hole C2 of the insulating substrate 301, the pressure reference chamber P of the pressure-sensitive chip 100 can be connected to the second receiving cavity S2 of the housing 200. That is, the pressure value of the pressure reference chamber P can be the same as the pressure value of the second receiving cavity S2 of the housing 200. Therefore, the pressure value output by the pressure-sensitive chip 100 is a value based on the pressure value within the pressure reference chamber P. Here, different pressures of gas can be filled into the second receiving cavity S2 of the housing 200 as needed. For example, the pressure value of the second receiving cavity S2 can be standard atmospheric pressure.

[0176] It should be noted that, in order to facilitate the connection between the electrical adapter 300 and the pressure-sensitive chip 100, the diameter of the second through hole C2 of the insulating substrate 301 in the electrical adapter 300 can be larger than the diameter of the first through hole C1 of the second substrate 120 in the pressure-sensitive chip 100.

[0177] Optionally, as shown in Figures 19 and 20, where Figure 19 is a schematic diagram of another pressure sensor provided in an embodiment of this application, and Figure 20 is a schematic diagram of a pressure sensor provided in yet another embodiment of this application, the pressure sensor may further include a sealing ring 400. The housing 200 may have a mounting ring groove A, which may be distributed around the flow channel H. At least a portion of the sealing ring 400 may be located within the mounting ring groove A. Thus, the sealing ring 400 may be distributed around the fluid channel H.

[0178] Here, after the flow channel H is filled with pressure medium, the sealing rings A distributed around the flow channel H can prevent the pressure medium from flowing from the flow channel H into the second receiving cavity S2, so as to avoid the pressure medium contacting the part of the first conductor 301 located on the side of the insulating substrate 301 opposite to the pressure-sensitive chip 100, thereby causing the first conductor 301 to fail. For example, if the pressure medium is a corrosive gas or liquid, the first conductor 301 may fail due to contact with the pressure medium.

[0179] It should be noted that the sealing ring 400 in the pressure sensor can be made of rubber.

[0180] In this application, as shown in FIG18, the mounting groove A can be located between the side of the insulating substrate 301 facing the pressure-sensitive chip 100 and the housing 200, and the mounting groove A can be distributed around the flow channel H. Alternatively, as shown in FIG16, the mounting groove A can be distributed around the insulating substrate 301.

[0181] Optionally, as shown in Figures 19 and 20, the pressure sensor may further include an electrical discharge assembly 500. The electrical discharge assembly 500 in the pressure sensor may be located within the second receiving cavity S2 of the housing 200 and may be fixedly connected to the housing 200. Here, the electrical discharge assembly 500 may have a second conductor 501, which may be electrically connected to the first conductor 302 in the electrical transfer assembly 300. In this way, the electrical signal of the pressure sensing element 130 of the pressure-sensitive chip 100 can be transmitted through the conductive portion 140 of the pressure-sensitive chip 100 to the first conductor 301 in the electrical transfer assembly 300, and then through the first conductor 301 to the second conductor 501 of the electrical discharge assembly 500, enabling the pressure sensor to output the pressure value of the pressure medium.

[0182] It should be noted that the pressure sensor may also include a wire 700, one end of which can be electrically connected to the first conductor 302 of the electrical adapter 300, and the other end can be electrically connected to the second conductor 501 of the electrical discharge assembly 500, thus connecting the first conductor 302 and the second conductor 501 through the wire 700.

[0183] It should also be noted that the electrical discharge assembly 500 may further include a second insulating plate 502, which may have a third through hole V3, and at least a portion of the second conductor 501 may be located within the third through hole V3. The second insulating plate 502 may be fixedly connected to the housing 200 to achieve a fixed connection between the electrical discharge assembly 500 and the second housing 200.

[0184] Optionally, as shown in Figure 21, which is a structural schematic diagram of another pressure sensor provided in another embodiment of this application, the pressure sensor may further include a connector 600. The connector 600 in the pressure sensor may be located within the second receiving cavity S2 of the housing 200 and fixedly connected to the housing 200. The connector 600 may be located on the side of the electrical adapter 300 away from the pressure-sensitive chip 100, and the electrical adapter 300 may be fixedly connected to the connector 600. Here, the connector 600 may have a third through hole D. A portion of the first conductor 302 of the electrical adapter 300 may be located within the third through hole D of the connector 600, so that the first conductor 302 can be electrically connected to the second conductor 501 of the electrical discharge assembly 500. That is, the third through hole D of the connector 600 is to ensure that the connector 600 does not obstruct the connection between the first conductor 302 of the electrical adapter 300 and the second conductor 501 of the electrical discharge assembly 500.

[0185] It should be noted that since the pressure-sensitive chip in this application can be used in scenarios where the pressure medium is corrosive gas or liquid without further encapsulation, the pressure-sensitive chip 100 in this application is relatively small in size. Consequently, the size of the electrical adapter component 300 used for fixed and electrical connection with the pressure-sensitive chip 100 also does not need to be too large. The electrical adapter component 300 only needs to have sufficient strength to be fixedly connected to the pressure-sensitive chip 100 and a first conductor 302 of sufficient size to be electrically connected to the pressure-sensitive chip 100. Furthermore, the cost of the electrical adapter component 300 is relatively high; therefore, to reduce the overall cost of the pressure sensor, the size of the electrical adapter component 300 does not need to be too large.

[0186] However, the current housing 200 used to mount the pressure-sensitive chip 100 has a uniform size. To facilitate the installation of the pressure-sensitive chip 100 within the conventionally sized housing 200, the pressure sensor can have a connector 600 to fix a smaller electrical adapter component 300. Fixing the smaller electrical adapter component 300 using the connector 600 ensures a secure connection between the electrical adapter component 300 and the conventionally sized housing 200 while also reducing the overall cost of the pressure sensor. Here, the connector 600 can be a rivet ring, meaning the electrical adapter component 300 can be fixed by riveting.

[0187] It should be noted that, as shown in Figure 21, the housing 200 may include a first housing 201 and a second housing 202. The first housing 201 may have a first receiving cavity S1, a flow channel H, and a mounting annular groove A. The second housing 200 may have a second receiving cavity S2.

[0188] After connecting the electrical adapter assembly 300 and the pressure-sensitive chip 100 together, the sealing ring 400 can be installed in the mounting ring groove A. Next, the connected electrical adapter assembly 300 and the pressure-sensitive chip 100 can be fixed in the first receiving cavity S1 of the first housing 201. Then, the electrical discharge assembly 500 can be fixed in the second receiving cavity S2 of the second housing 200, and the second conductor 501 in the electrical discharge assembly 500 and the first conductor 302 in the electrical adapter assembly 300 can be electrically connected. Finally, the first housing 201 and the second housing 202 can be fixedly connected together.

[0189] In this application, as shown in FIG22, which is a partial schematic diagram of another pressure sensor provided in an embodiment of this application, the pressure sensor may further include a resistive-capacitive component 801 and an AISC chip (Application-Specific Integrated Circuit) 802. To improve the integration level of the pressure sensor, the resistive-capacitive component 801 and the AISC chip 802 can be integrated on the insulating substrate 301 of the electrical adapter component 300. Specifically, the resistive-capacitive component 801 and the AISC chip 802 can be integrated on the side of the insulating substrate 301 opposite to the pressure-sensitive chip 100.

[0190] It should be noted that the RC component 801 in the pressure sensor can process and adjust the circuit of the pressure-sensitive chip 100, filter out interference signals, and improve the overall performance of the circuit. The ASIC chip 802 in the pressure sensor can process the signal from the pressure-sensitive chip, mainly including filtering, amplification, and compensation functions.

[0191] When using this pressure sensor, as shown in Figures 23, 24, and 25, Figure 23 is a structural schematic diagram of another pressure sensor provided in another embodiment of this application, Figure 24 is a structural schematic diagram of a pipeline provided in an embodiment of this application, and Figure 25 is a schematic diagram of a pressure sensor measuring the pressure of a pressure medium provided in an embodiment of this application. This pressure sensor can be connected to a pipeline 900 to measure the pressure medium located within the pipeline 900. Alternatively, the pressure sensor can be connected to a container to measure the pressure medium located within the container. This embodiment of the application illustrates the use of a pressure sensor installed inside a pipeline as an example.

[0192] The inner wall of the pipe 900 may have an internal thread M1, and the outer surface of the portion of the housing 200 surrounding the flow channel H in the pressure sensor may have an external thread M2. Through the engagement of the internal thread M1 and the external thread M2, the portion of the housing 200 surrounding the flow channel H can be installed inside the pipe 900, thus connecting the pressure sensor to the pipe. In this way, the pressure medium flowing in the pipe 900 can flow into the flow channel H. The pressure-sensitive chip 100 located in the flow channel H can measure the pressure of the pressure medium through the pressure sensing element 130. After the pressure sensing element 130 converts the pressure signal into an electrical signal, the electrical signal of the pressure sensing element 130 can be transmitted through the first conductor 302 of the electrical transfer assembly 300 to the second conductor 502 of the electrical output assembly 500. Thus, the pressure sensor can output the pressure value of the pressure medium.

[0193] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0194] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0195] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A pressure-sensitive chip, characterized in that, include: First substrate, second substrate, pressure sensing element, and conductive part; The first substrate and the second substrate are stacked, and a pressure reference cavity is provided between the first substrate and the second substrate, and the second substrate has a first through hole; At least a portion of the pressure sensing element is located within the pressure reference chamber; At least a portion of the conductive part is located within the first through hole, and the conductive part is electrically connected to the pressure sensing element; Wherein, at least a portion of the first substrate opposite to the pressure reference cavity is a pressure-sensitive membrane, and the thickness of the pressure-sensitive membrane is less than the thickness of the second substrate.

2. The pressure-sensitive chip according to claim 1, characterized in that, The pressure sensing element is a piezoresistor, and the first substrate has a bearing groove on the side facing the pressure reference cavity, with at least a portion of the pressure sensing element embedded in the bearing groove.

3. The pressure-sensitive chip according to claim 2, characterized in that, The second substrate has a first groove on the side facing the first substrate, and the portion of the second substrate surrounding the first groove is fixedly connected to the first substrate; The first groove and the side of the first base facing the second base together form the pressure reference cavity.

4. The pressure-sensitive chip according to claim 2, characterized in that, The first substrate has a second groove on the side facing away from the second substrate, and the second groove is located within the orthographic projection of the pressure reference cavity on the side of the first substrate facing the second substrate. The pressure-sensitive membrane is the portion of the first substrate located between the second groove and the pressure reference chamber.

5. The pressure-sensitive chip according to claim 1, characterized in that, The pressure sensing element includes: a first conductive plate and a second conductive plate; At least a portion of the first conductive plate is fixedly connected to the side of the first substrate facing the pressure reference cavity; at least a portion of the second conductive plate is fixedly connected to the side of the second substrate facing the pressure reference cavity. Wherein, at least a portion of the first conductive plate and at least a portion of the second conductive plate are disposed opposite to each other, and the pressure reference chamber is located at least between the oppositely disposed portions of the first conductive plate and the second conductive plate.

6. The pressure-sensitive chip according to claim 5, characterized in that, The pressure-sensitive chip further includes an isolation substrate, which is located between the first conductive plate and the second conductive plate, and the isolation substrate is distributed around the pressure reference cavity; The isolation substrate is fixedly connected to the second substrate on the side facing the second substrate; the isolation substrate is fixedly connected to the first substrate on the side facing the first substrate. The first substrate, the second substrate, and the isolation substrate located between the first substrate and the second substrate are used to form the pressure reference cavity.

7. The pressure-sensitive chip according to claim 6, characterized in that, The pressure-sensitive chip further includes: a first connecting seal located between the first substrate and the isolation substrate, and a second connecting seal located between the second substrate and the isolation substrate, wherein the first connecting seal and the second connecting seal are both distributed around the pressure reference cavity; Wherein, the first connecting seal is disposed in the same layer as the first conductive plate and is made of the same material, and the first connecting seal is insulated from the first conductive plate; the second connecting seal is disposed in the same layer as the second conductive plate and is made of the same material, and the second connecting seal is insulated from the second conductive plate.

8. The pressure-sensitive chip according to claim 7, characterized in that, The pressure-sensitive chip further includes: a first support member located between a first substrate and an isolation substrate, and a second support member located between a second substrate and an isolation substrate; the first support member is located between the first connecting seal and the pressure reference chamber; the second support member is located between the second connecting seal and the pressure reference chamber; The first support member, the first connecting seal member, and the first conductive plate are arranged in the same layer and are made of the same material, and the first support member is insulated from the first conductive plate; the second support member, the second connecting seal member, and the second conductive plate are arranged in the same layer and are made of the same material, and the second support member is insulated from the second conductive plate.

9. The pressure-sensitive chip according to any one of claims 1-8, characterized in that, The conductive part includes: a first conductive post, which is located in the first through hole, one end of which is electrically connected to the pressure sensing element, and the other end of which is exposed from the side of the second substrate away from the first substrate through the first through hole.

10. The pressure-sensitive chip according to claim 9, characterized in that, The conductive part further includes an external conductive block, which is located on the side of the second substrate away from the first substrate, and is electrically connected to the end of the first conductive post away from the pressure sensing element.

11. A pressure sensor, characterized in that, include: Pressure-sensitive chip, housing, and electrical adapter assembly; The pressure-sensitive chip is any one of the pressure-sensitive chips described in claims 1-9 above; The housing has a first receiving cavity and a fluid channel communicating with the first receiving cavity; The electrical adapter assembly is located within the first receiving cavity and is fixedly connected to the housing. The pressure-sensitive chip is located within the fluid channel. The second substrate of the pressure-sensitive chip is fixedly connected to the electrical adapter on the side opposite to the first substrate, and is electrically connected to the electrical adapter through the conductive part.

12. The pressure sensor according to claim 11, characterized in that, The electrical adapter assembly includes: a first insulating plate and a first conductor; The first insulating plate has a second through hole; At least a portion of the first conductor is located within the second through hole; The conductive portion of the pressure-sensitive chip is electrically connected to the first conductor, and the side of the second substrate of the pressure-sensitive chip facing away from the first substrate is fixedly connected to the first insulating plate.

13. The pressure sensor according to claim 12, characterized in that, The first conductor includes: a conductive paste and a first conductive lead, wherein the conductive paste is located inside the second through hole; the first conductive lead is inserted into the conductive paste and extends out of the second through hole, wherein the portion of the first conductive lead extending out of the second through hole is located on the side of the first insulating plate opposite to the pressure-sensitive chip; The conductive portion of the pressure-sensitive chip is electrically connected to the conductive paste.

14. The pressure sensor according to claim 12, characterized in that, The first conductor includes a conductive plating layer and a second conductive lead. A portion of the conductive plating layer is attached to the inner wall of the second through hole, and another portion of the conductive plating layer is located on the side of the first insulating plate away from the pressure-sensitive chip. The second conductive lead is electrically connected to the portion of the conductive plating layer located on the side of the first insulating plate away from the pressure-sensitive chip. The conductive portion of the pressure-sensitive chip is electrically connected to the portion of the second conductive post attached to the inner wall of the second through hole.

15. The pressure sensor according to any one of claims 11 to 14, characterized in that, The conductive portion of the pressure-sensitive chip includes a first conductive post; The end of the first conductive post facing away from the pressure sensing element is electrically connected to the portion of the first conductor located within the second through hole.

16. The pressure sensor according to any one of claims 11 to 14, characterized in that, The conductive portion of the pressure-sensitive chip includes a first conductive post and an external conductive block. The end of the first conductive post facing away from the pressure sensor is electrically connected to the external conductive block. The external conductive block is located on the side of the second substrate facing away from the first substrate. At least a portion of the external conductive block is located within the second through hole and is electrically connected to the first conductor.

17. The pressure sensor according to any one of claims 11 to 14, characterized in that, The electrical adapter assembly further includes: a sealing and fixing part; the sealing and fixing part is fixedly connected to the side of the insulating substrate facing the pressure-sensitive chip, the sealing and fixing part is distributed around the pressure-sensitive chip and fixedly connected to the pressure-sensitive chip.

18. The pressure sensor according to claim 17, characterized in that, The sealing and fixing part is also distributed around the second through hole, and the orthographic projection of the sealing and fixing part on the insulating substrate does not overlap with the second through hole.

19. The pressure sensor according to claim 18, characterized in that, The sealing and fixing part is made of insulating slurry, or the sealing and fixing part is made of metal bonding material; Wherein, when the sealing and fixing part is made of metal bonding material, the sealing and fixing part has a clearance area; the second through hole and the first through hole are projected onto the insulating substrate on the side facing the pressure-sensitive chip, and the clearance area is located within the projected onto the insulating substrate on the side facing the pressure-sensitive chip, so that the sealing and fixing part is insulated from the conductive part.

20. The pressure sensor according to any one of claims 11-14 and 18-19, characterized in that, The pressure reference chamber in the pressure-sensitive chip is a vacuum-sealed chamber.

21. The pressure sensor according to any one of claims 11-14 and 18-19, characterized in that, The housing also has a second receiving cavity located on the side of the first receiving cavity opposite to the fluid channel; The second substrate in the pressure-sensitive chip has a first through hole, and the first insulating plate has a second through hole; Wherein, one end of the first through hole is connected to the pressure reference cavity, and the other end is connected to the second through hole; the end of the second through hole opposite to the first through hole is connected to the second receiving cavity.

22. The pressure sensor according to claim 21, characterized in that, The pressure sensor also includes: a sealing ring; The housing has mounting ring grooves distributed around the flow channel; at least a portion of the sealing ring is located within the mounting ring grooves.

23. The pressure sensor according to any one of claims 11-14, 18-19, and 22, characterized in that, The housing also has a second receiving cavity located on the side of the first receiving cavity opposite to the fluid channel; The pressure sensor further includes an electrical discharge assembly; the electrical discharge assembly is located within the second receiving cavity and is fixedly connected to the housing. The electrical discharge component has a second conductor, which is electrically connected to the first conductor.

24. The pressure sensor according to any one of claims 10-17, 19-20, and 23, characterized in that, The pressure sensor further includes: a connector, which is located within the first receiving cavity and fixedly connected to the housing; the connector is located on the side of the electrical adapter assembly opposite to the pressure-sensitive chip, and the electrical adapter assembly is fixedly connected to the connector; The connector has a third through hole, and a portion of the first conductor of the electrical adapter assembly is located within the third through hole.

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