Checking lithographic layers and dynamic data by online metrology

Abstract

Aspects disclosed herein provide a method for processing a device. The method includes determining one or more changed electrical connections based on an offset between a design component and a changed component disposed on a substrate. The method includes depositing photoresist over the substrate and developing the photoresist to form one or more developed regions and one or more undeveloped regions. One of the one or more developed regions or the one or more undeveloped regions of the photoresist is removed to form a changed electrical connection template. The changed component and the changed electrical connection template are scanned to identify one or more misalignment regions of the changed electrical connection template. At least a portion of the changed electrical connection template is removed.

Description

Technical Field

[0001] The embodiments of this disclosure generally relate to apparatus, systems, and methods for processing one or more substrates. More specifically, this disclosure relates to adaptive packaging methods and apparatus. Background Technology

[0002] Flatbed printing is widely used in the manufacture of semiconductor components and display devices, such as liquid crystal displays (LCDs). Large-area substrates are often used in LCD manufacturing. LCDs, or flat panels, are commonly used in active-matrix displays, such as computers, touch panel devices, personal digital assistants (PDAs), cellular phones, television monitors, and the like. Typically, a flat panel comprises layers of liquid crystal material sandwiched between two plates to form pixels. When power from a source is applied to the liquid crystal material, the amount of light passing through the liquid crystal material is controlled at the pixel location, thereby producing an image. Other manufacturing techniques are used to produce organic light-emitting diode (OLED) displays for computers, monitors, and other systems that provide visual output.

[0003] Electrical features have been generated using microlithography techniques and incorporated into portions of a liquid crystal material layer forming pixels. According to these techniques, photosensitive photoresist is coated onto at least one surface of a substrate. Subsequently, a pattern generator exposes selected areas of the photosensitive photoresist with light as part of a pattern, causing a chemical change in the photoresist within the selected areas, thereby preparing these selected areas for subsequent material removal and / or material addition processes to generate the electrical features.

[0004] In order to continue to provide display devices and other devices at prices demanded by consumers, new equipment and methods are needed to accurately and cost-effectively generate patterns on substrates, such as large-area substrates.

[0005] In digital lithography tools, images from a camera are used to locate alignment marks so that processing can take place at the known location. To obtain the image, the camera is calibrated and specifically selected based on pixel size, orientation (rotation), and uniformity.

[0006] One of the main challenges of microlithography systems is the placement of wiring between components. Typically, the arrangement of components on a substrate involves defined alignment, position, and orientation. Wiring must be placed from one component to another on the substrate. Proper placement of components on the substrate is crucial. Normally, the wired connections from one component to another are fixed (static). If one component is misaligned relative to another with respect to its intended position, the wiring will be misaligned when it is generated. However, misalignment can occur during processing. The problems resulting from this range from producing non-compliant components to components that cannot work together. These problems affect the overall economic viability of the lithography process.

[0007] The component wiring system needs to be able to process quickly and generate high throughput, so that misalignment of components during processing reaches a threshold level. Furthermore, slight deviations in component placement within a confined space are required, so that the system can adapt to changes in component handling "in situ" during processing, rather than relying on the difficult-to-achieve assumption of perfect alignment. Summary of the Invention

[0008] This disclosure provides a method for attaching wired connections between components using component design and field measurement data to produce accurate wired connections.

[0009] In one exemplary embodiment, a method of processing equipment in a lithographic printing system is disclosed. The method includes determining one or more altered electrical connections based on the offset between designed components and altered components disposed on a substrate. The method includes depositing photoresist over the substrate and developing the photoresist to form one or more developed regions and one or more undeveloped regions. Removing one or more developed regions or one or more undeveloped regions of the photoresist to form a template for the altered electrical connections. Scanning the altered components and the altered electrical connection template to identify one or more misaligned areas of the altered electrical connection template. Removing at least a portion of the altered electrical connection template.

[0010] In another exemplary embodiment, a method of processing equipment in a microlithography system is disclosed. The method includes determining one or more modified electrical connections based on the offset between a designed component and a modified component disposed on a substrate. A photoresist development process is performed. The photoresist development process includes depositing photoresist over the substrate and developing the photoresist to form one or more developed regions and one or more undeveloped regions. One or more developed regions or one or more undeveloped regions of the photoresist are removed to form a modified electrical connection template. The modified component and the modified electrical connection template are scanned to identify one or more misaligned regions of the modified electrical connection template. Upon identification of one or more misaligned regions, at least a portion of the modified electrical connection template is removed. The photoresist development process is repeated upon identification of one or more misaligned regions. One or more modified electrical connections are formed.

[0011] In one exemplary embodiment, a method for processing a substrate in a microlithography system is disclosed. The method includes determining one or more altered electrical connections based on the offset between designed components and altered components disposed on the substrate, and performing a photoresist development process. The photoresist development process includes depositing photoresist over the substrate and developing the photoresist to form one or more developed regions and one or more undeveloped regions. Removing one or more developed regions or one or more undeveloped regions of the photoresist to form an altered electrical connection template. Scanning the altered components and the altered electrical connection template to identify one or more misaligned regions of the altered electrical connection template. Upon identification of one or more misaligned regions, removing at least a portion of the altered electrical connection template. Repeating the photoresist development process upon identification of one or more misaligned regions. Depositing electrical connection material in the altered electrical connection template. Removing at least a portion of the altered electrical connection template to form an altered layout. Attached Figure Description

[0012] To facilitate a detailed understanding of the above-described features of this disclosure, a more detailed description of the disclosure, which has been briefly summarized above, can be obtained with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only illustrate exemplary embodiments and should not be construed as limiting their scope, but rather allow for other equivalent embodiments.

[0013] Figure 1A This is a perspective view of a planographic printing system according to an embodiment.

[0014] Figure 1B This is a perspective view of a planographic printing system with two platforms according to an embodiment.

[0015] Figure 2A This is a perspective view of an image projection device according to an embodiment.

[0016] Figure 2B This is a perspective view of an image projection device including one or more miniature LEDs according to an embodiment.

[0017] Figure 2C This is a perspective view of an image projection device including one or more digital micro-mirror devices (DMDs) according to an embodiment.

[0018] Figure 3 This is a schematic drawing of the design layout according to the implementation method.

[0019] Figure 4 This is a schematic drawing of a layout diagram modified according to an implementation method.

[0020] Figure 5 This is a method for adding materials to a processing device in a lithographic printing system, according to an embodiment.

[0021] Figures 6A to 6F According to the implementation method Figure 5 A schematic top view of a substrate during a method of processing equipment in a lithographic printing system.

[0022] Figure 7 This is a method for material reduction in a lithographic printing system processing device according to an embodiment.

[0023] Figure 8A Up to 8G is according to the implementation method in Figure 7 A schematic top view of a substrate during a method of processing equipment in a lithographic printing system.

[0024] For ease of understanding, the same reference numerals are used as much as possible to identify common elements in the figures. It is contemplated that elements and features of one embodiment may be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0025] The embodiments of this disclosure generally relate to apparatus, systems, and methods for processing one or more substrates. More specifically, this disclosure relates to adaptive packaging methods and apparatus.

[0026] Figure 1AThis is a perspective view of a planographic printing system 100A according to an embodiment disclosed herein. The planographic printing system 100A includes a base frame 110, a plate 120, a platform 130, and a processing device 160. The base frame 110 rests on the bottom surface of a manufacturing facility and supports the plate 120. A passive air isolator 112 is positioned between the base frame 110 and the plate 120. In one embodiment, the plate 120 is a single piece of granite, and the platform 130 is mounted on the plate 120. A substrate 140 is supported by the platform 130. A plurality of holes are formed in the platform 130 to allow a plurality of lifting rods to extend through the holes. In some embodiments, the lifting rods rise to an extended position to receive the substrate 140, such as from one or more transfer robots (not shown). One or more transfer robots are used to load and unload the substrate 140 from the platform 130.

[0027] The substrate 140 comprises any suitable material, such as quartz, used for portions of a flat panel display. In other embodiments, the substrate 140 is made of other materials. In some embodiments, the substrate 140 has a photoresist layer formed thereon. The photoresist is sensitive to radiation. Positive photoresist comprises portions of the photoresist that, when exposed to radiation, are soluble in a photoresist developer coated onto the photoresist after a pattern is written into the photoresist. Negative photoresist comprises portions of the photoresist that, when exposed to radiation, are insoluble in a photoresist developer coated onto the photoresist after a pattern is written into the photoresist. The chemical composition of the photoresist determines whether it is a positive or negative photoresist. Examples of photoresists include, but are not limited to, at least one of diazonaphthoquinone, phenolic resin, poly(methyl methacrylate), poly(methylglutarimide), and SU-8. In this way, patterns are generated on the surface of the substrate 140 to form an electronic circuit system.

[0028] The planographic printing system 100A includes a pair of supports 122 and a pair of tracks 124. The supports 122 are mounted on a flat plate 120, and both the flat plate 120 and the supports 122 are made of a single piece of material. The tracks 124 are supported by the supports 122, and a platform 130 moves along the tracks 124 in the X direction. In one embodiment, the tracks 124 are a pair of parallel magnetic channels. As shown, each track 124 is linear. In other embodiments, one or more tracks 124 are non-linear. An encoder 126 is coupled to the platform 130 to provide position information to a controller.

[0029] The processing apparatus 160 includes a support 162 and a processing unit 164. The support 162 is mounted on a flat plate 120 and includes an opening 166 for a platform 130 to pass beneath the processing unit 164. The processing unit 164 is supported by the support 162. In one embodiment, the processing unit 164 is a pattern generator configured to expose photoresist in a photolithography process. In some embodiments, the pattern generator is configured to perform a maskless photolithography process. The processing unit 164 includes a plurality of image projection devices (such as...). Figure 2A and 2B (As shown). In one embodiment, processing unit 164 includes up to 84 image projection devices. Each image projection device is housed in housing 165. Processing device 160 is useful for performing maskless direct patterning.

[0030] During operation, platform 130 moves in the X direction from the loading position (e.g., Figure 1A (As shown) the platform 130 is moved to the processing position. The processing position is one or more locations where the platform 130 is situated as it passes beneath the processing unit 164. During operation, the platform 130 is lifted by a plurality of air bearings and moved along a pair of tracks 124 from the loading position to the processing position. A plurality of vertical guide air bearings are coupled to the platform 130 and positioned near the inner wall 128 of each support 122 to stabilize the movement of the platform 130. The platform 130 also moves in the Y direction by moving along track 150 for processing and / or indexing the substrate 140. The platform 130 is capable of operating independently and can scan the substrate 140 in one direction and step in another.

[0031] The metrology system measures the X and Y lateral position coordinates of each platform 130 in real time, enabling each of the multiple image projection devices to accurately position itself on the pattern written into the photoresist-covered substrate. The metrology system also provides real-time measurements of the angular position of each platform 130 around the vertical or Z-axis. Angular position measurements can be used to maintain a constant angular position during scanning via a servo mechanism, or to correct the position of the pattern written by the image projection device 270 on the substrate 140, such as... Figures 2A to 2B As shown. These technologies can be used in combination.

[0032] Figure 1BThis is a perspective view of a planographic printing system 100B according to an embodiment disclosed herein. System 100B is similar to system 100; however, system 100B includes two platforms 130. Each of the two platforms 130 is capable of operating independently and can scan a substrate 140 in one direction while stepping in the other. In some embodiments, while one of the two platforms 130 is scanning the substrate 140, the other of the two platforms 130 is removing an exposed substrate and loading the next substrate to be exposed.

[0033] although Figures 1A to 1B Two implementations of a planographic printing system are illustrated, but other systems and configurations are also envisioned herein. For example, a planographic printing system comprising any suitable number of platforms can also be envisioned.

[0034] Figure 2A This is a perspective view of an image projection device 270 according to one embodiment, which can be used in photolithography systems, such as system 100A or system 100B. The image projection device 270 includes one or more spatial light modulators 280, an alignment and inspection system 284 including a focus sensor 283 and a camera 285, and projection optics 286. The components of the image projection device vary depending on the spatial light modulator being used. Spatial light modulators include, but are not limited to, micro-LEDs, digital micromirror devices (DMDs), and liquid crystal displays (LCDs).

[0035] In operation, spatial light modulator 280 is used to modulate one or more properties, such as amplitude, phase, or polarization, of light projected onto a substrate (such as substrate 140) through image projection device 270. Alignment and inspection system 284 is used to align and inspect components of image projection device 270. In one embodiment, focus sensor 283 includes a plurality of lasers that are guided through and return through the lens of camera 285 and imaged on the sensor to detect whether image projection device 270 is in focus. Camera 285 is used to image substrate 140 to ensure that image projection device 270 is correctly aligned with photolithography system 100A or 100B, or within a predetermined tolerance. Projection optics 286 (such as one or more lenses) are used to project light onto a substrate, such as substrate 140.

[0036] Figure 2B This is an image projection device 271 according to the embodiments described herein. Figure 2BIn the illustrated embodiment, the image projection device 271 includes one or more microLEDs 287 as spatial light modulators, a focus sensor and inspection system 284, and projection optics 286. In one embodiment, the image projection device 271 further includes a beam splitter. The microLEDs are miniature (e.g., less than about 100 µm) light-emitting diodes that can be arranged in an array and used to form individual pixels of a substrate such as a display device. The microLEDs comprise inorganic materials, such as inorganic gallium nitride (GaN). Because the microLEDs are self-emissive, no external light source is required in the image projection device 271.

[0037] In embodiments using micro-LEDs, camera 285 can also be used to measure the image pixel pitch of one or more micro-LEDs to calibrate any thermal expansion occurring at the micro-LED device.

[0038] Figure 2C This refers to an image projection device 281 according to the embodiments described herein. Figure 2C In the illustrated embodiment, the image projection device 281 uses one or more DMDs 289 as spatial light modulators. The image projection device 281 is part of the image projection system 290, which, in addition to the alignment and inspection system 284 and the projection optics 286, also includes a light source 272, an aperture 274, a lens 276, a suppressed prism assembly 288, one or more DMDs 289, and a light dump 282. The light source 272 is any suitable light source capable of generating light with a predetermined wavelength, such as a light-emitting diode (LED) or a laser. In one embodiment, the predetermined wavelength is in the blue light or near ultraviolet (UV) range, such as less than about 450 nm. The suppressed prism assembly 288 includes multiple reflective surfaces. The projection optics 286 may include, for example, a 10x objective lens. Figure 2CDuring operation of the image projection device 281 shown, a light source 272 generates a light beam 273 with a predetermined wavelength, such as wavelengths in the blue range. The light beam 273 is reflected by a suppressed prism assembly 288 to a DMD 289. The DMD includes multiple mirrors, the number of which corresponds to the number of pixels to be projected. Based on mask data provided to the DMD 289 by a controller, the multiple mirrors are individually controllable, and each of the multiple mirrors is in an "on" or "off" position. When the light beam 273 reaches a mirror of the DMD 289, the mirror in the "on" position reflects the light beam 273 to a projection optics element 286, thus forming multiple write beams. The projection optics element 286 then projects the write beams onto the surface of a substrate 140. The mirror in the "off" position reflects the light beam 273 to a light dump 282, instead of the surface of the substrate 140.

[0039] When processing material using a lithographic printing system, components with one or more grains are placed on a platform for processing. While the components can be designed and laid out for processing, various factors can affect this design. The processing speed of the lithographic system can slightly move the components as they are processed. Since the wiring from start to finish can be very small, even minute movements can have a significant impact on the final product, especially for small components. Furthermore, each component may have several grains, so incorrect alignment of the components can affect many wired connections compared to the designed layout.

[0040] This disclosure provides that, given the design arrangement of one or more dies within a given package layout and possible changes in the arrangement involving some errors, the design arrangement can be modified or distorted to match the changed arrangement, thereby adaptively generating wiring for packaging dies into a larger component. This disclosure further provides measurements of the location and orientation of the adaptively generated wiring to detect defects in the adaptively generated wiring before depositing wiring material.

[0041] Figure 3Design layout diagram 300 is provided. Design layout diagram 300 includes design components 301 mounted on substrate 140. Multiple design components 301 are connected to design components 301 from a fixed outer periphery 303 of substrate 140, or from one design component 301 to another, using multiple design wire connections 302. Design components 301 further include edges 304. Design wire connections 302 (e.g., design electrical connections) can be connected to design components 301 at the edges 304 of design components 301. This design layout diagram 300 will appear if each design component 301 is generally placed on substrate 140 for processing as intended. It is understood that placing components with high accuracy can be difficult. Therefore, even if design components 301 are placed with high accuracy, misalignment may occur during processing because the photolithography system moves a large substrate at high speed.

[0042] Figure 4 The layout diagram 400 shows the altered component 401. As can be seen, the altered component 401 is from... Figure 3 The position of the component 401 is shifted. Therefore, for the modified component 401 to operate correctly, a modified wired connection 402 (e.g., a modified electrical connection) is required to the modified component 401. For this purpose, a modified wired connection 402 is created such that a modified wired connection 402 is properly established between the modified components 401 or between the modified component 401 and the fixed outer periphery 403. Similar to the designed component 301, the modified component 401 includes a modified edge 404. The modified wired connection 402 can be connected to the modified component 401 at the edge 404 of the modified component 401.

[0043] Figure 5 This is a flowchart of a method 500 for processing equipment in a lithographic printing system. Method 500 is a material addition method, namely, forming a modified wire connection 402 by depositing wire connection material in the wire connection area. Figures 6A to 6F This is a schematic top view of substrate 140 during method 500 for processing equipment in a lithographic printing system. In some embodiments, method 500 for processing substrate 140 may be performed in a microlithographic printing system, such as glossy lithographic printing system 100A or glossy lithographic printing system 100B.

[0044] In operation 501, design data is obtained. The design data (e.g., a first set of data) may include coordinate data on the design component 301 and a pattern of the design wired connection 302 to the design component 301 in the design state. This design data may be obtained, for example, from manufacturing drawings or the memory of a controller. In one embodiment, position data is obtained on the design component 301 and the design wired connection 302 to the design component 301 in the design state. The design component 301 may be any type of component requiring wiring attachment, such as, but not limited to, a processor. The design wired connection 302 may, for example, extend from the design component 301 to a fixed periphery 303, or to a predetermined location, such as the edge 304 of another design component 301.

[0045] In operation 502, such as Figure 6A As shown, a substrate 140 is provided with multiple modified components 401. The substrate 140 is placed on the platform of a microlithography system. It is understood that the modified components 401 are positioned within a defined field for processing. Due to various factors, the modified components 401 may differ slightly from the designed component 301, including the ability to accurately position such designed component 301 during the initial processing of the platen (indexing table) before loading the platen into the microlithography machine. Other factors may also cause the designed component 301 to move, such as during processing of components during microlithography steps.

[0046] In operation 503, the altered component 401 is scanned in situ to obtain altered component data (e.g., a second set of data). To enable the altered wired connection 402 from the fixed periphery 403 or between altered components 401 to the altered component 401, the “in-situ” positioning of the altered components 401 on the substrate 140 is scanned with at least one scanning device to determine the exact location of each altered component 401. In some embodiments, the platform including the altered component 401 is scanned with at least one scanning device. Thus, the substrate 140 is moved to a position in the planarization system 100A, 100B, causing a scan to occur to process coordinate data. It will be understood that scanning of the altered components 401 can also be performed through a separate process, and the data is fed to the planarization system 100A, 100B for use. The obtained altered component data can be stored in the memory of the controller. The altered component data can be compared with design data to determine any possible offset in the placement of the component compared to the designed component 301. Offsets can be calculated to allow the planographic printing systems 100A and 100B to understand the exact location of the altered component 401. The data from the offset calculations can then be used to modify the wire-connected pattern under design conditions. Visual image data can also be used to determine the necessary differences in the wire-connected pattern.

[0047] Computer analysis can be performed on the data to determine the required offset. The computer analysis can not only calculate the offset, but also provide the position of the changed wired connection 402 between the altered component 401 and the fixed periphery 403 or other altered components 401, thus accelerating the processing.

[0048] In some implementations, hardware designers may determine that slight variations from the design layout are permissible. Deviations between wired connections and components can be determined to be within acceptable levels. In such cases, it is not necessary to change the wired connections.

[0049] When a deviation from these acceptable levels is detected, an alert can be sent to the processor, allowing notification that a change / modification of the wiring is necessary. In other implementations, if the location and orientation of a component are outside a maximum threshold, the component cannot be effectively wired connected. A separate alert can be sent to the processor if the component is out of tolerance and the wired connection will be compromised even if it is modified.

[0050] It will be understood that the design of wired connections considers not only the accuracy of the placement of the start and end points of the wired connection, but also the length of the wired connection. If the length of the wire is too long for effective operation and will cause, for example, excessive delay, an alarm can be generated in the processor, indicating that such wiring is non-compliant. In the implementation, it should be understood that a wired connection refers to an electrical connection established with a component such as a die of a microprocessor.

[0051] In operation 504, such as Figure 6B As shown, photoresist 620 is deposited on top of substrate 140. Photoresist 620 is highly sensitive to radiation. Positive photoresist includes portions of the photoresist that, when exposed to radiation, are soluble in a photoresist developer coated on the photoresist after a pattern is written into the photoresist. Negative photoresist includes portions of the photoresist that, when exposed to radiation, are insoluble in a photoresist developer coated on the photoresist after a pattern is written into the photoresist. The chemical composition of the photoresist determines whether it is a positive or negative photoresist. Examples of photoresists include, but are not limited to, at least one of diazonaphthoquinone, phenolic resin, poly(methyl methacrylate), poly(methylglutarimide), and SU-8. In this manner, patterns are generated on the surface of substrate 140 to form an electronic circuit system, such as a wired connection.

[0052] In operation 505, such as Figure 6CAs shown, photoresist 620 is developed to form developed areas 630 and undeveloped areas 650. Photoresist 620 is developed using a photoresist developer. The photoresist developer is applied to the photoresist 620 to form a pattern corresponding to the altered wire connection 402. In some embodiments, the developed area 630 includes the altered wire connection developed area 602 and a misaligned altered wire connection developed area 605. In other embodiments, the misaligned altered wire connection developed area 605 is not formed. The altered wire connection developed area 602 corresponds to the altered wire connection 402.

[0053] In operation 506, such as Figure 6D As shown, the developing area 630 is removed to form a modified wire connection area 640 (e.g., a modified electrical connection template) and a misaligned modified wire connection area 615 (e.g., a misaligned area of ​​the modified electrical connection template). However, in some embodiments, the misaligned modified wire connection area 615 is not formed.

[0054] In operation 507, substrate 140 is scanned to obtain a third set of data. In operation 508, the third set of data is compared with the second set of data. In some embodiments, the third set of data is compared with the second set of data to detect the position and orientation of the altered wire connection region 640. The position and orientation of the altered wire connection region 640 can be detected using infrared metrology or by imaging the bottom via. In some embodiments, the third set of data is compared with the second set of data to detect misaligned altered wire connection regions 615. The misaligned altered wire connection regions 615 deviate from the altered wire connection 402. Detecting the misaligned altered wire connection regions 615 allows the photoresist pattern of the misaligned altered wire connection regions 615 to be removed before depositing the wire connection material.

[0055] In optional operation 509, the undeveloped area 650 of the photoresist 620 is removed. In an embodiment where a misalignment change in the wire connection area 615 is detected, the undeveloped area 650 of the photoresist 620 is removed to repeat operations 504 to 508. Operations 501 to 508 are repeated until a third set of data does not detect a misalignment change in the wire connection area 615, or a misalignment change in the wire connection area 615 is detected. Removing the photoresist 620 when a misalignment change in the wire connection area 615 is detected increases defect detection before the deposition of a more permanent wire connection material, thereby reducing waste and increasing throughput.

[0056] In some implementations, the hardware designer may determine that slight differences from the modified wired connection 402 are permissible. It can be determined that the misaligned modified wired connection area 615 deviates from the modified wired connection 402 at an acceptable level (e.g., a threshold). In such cases, it is not necessary to remove the undeveloped area 650.

[0057] In some implementations, if the location and orientation of the misaligned wired connection area 615 are outside a threshold, the component cannot be effectively wired. A separate alarm can be issued to the processor if the misaligned wired connection area 615 exceeds the tolerance and the wired connection 402 will be compromised.

[0058] In operation 510, such as Figure 6E As shown, wire connection material 660 is deposited in the modified wire connection region 640 to form the modified wire connection 402. In operation 511, as... Figure 6F As shown, the undeveloped area 650 is removed to form the altered layout diagram 400.

[0059] Figure 7 This is a flowchart of a method 700 for processing equipment in a lithographic printing system. Method 700 is a material subtraction method, which forms a modified wire connection 402 by removing wire connection material outside the wire connection area. Figures 8A to 8F This is a schematic top view of substrate 140 during method 700 for processing equipment in a lithographic printing system. In some embodiments, method 700 for processing substrate 140 may be performed in a microlithographic printing system, such as glossy lithographic printing system 100A or glossy lithographic printing system 100B.

[0060] In operation 701, design data is available. The design data (e.g., a first set of data) may include coordinate data on the design component 301 and a pattern of the wired connection 302 to the design component 301 in the design state. This design data may be obtained, for example, from manufacturing drawings or the memory of a controller. In one embodiment, position data is obtained on the design component 301 and the wired connection 302 to the design component 301 in the design state. The design component 301 may be any type of component requiring wiring attachment, such as, but not limited to, a processor. The wired connection 302 may, for example, extend from the design component 301 to a fixed periphery 303, or to a predetermined location, such as the edge 304 of another design component 301.

[0061] In operation 702, such as Figure 8AAs shown, a substrate 140 is provided with multiple modified components 401. The substrate 140 is placed on the platform of a microlithography system. It is understood that the modified components 401 are positioned within a defined field for processing. Due to various factors, the modified components 401 may differ slightly from the designed component 301, including the ability to accurately position such a designed component 301 during the initial processing of the platen (indexing table) before loading the platen into the microlithography machine. Other factors may also cause the designed component 301 to move, such as processing components during microlithography steps.

[0062] In operation 703, the altered component 401 is scanned in situ to obtain altered component data (e.g., a second set of data). To enable the altered wired connection 402 from the fixed periphery 303 or between the altered components 401, the “in-situ” positioning of the altered components 401 on the substrate 140 is scanned with at least one scanning device to determine the exact positioning of each altered component 401. In some embodiments, the platform including the altered components 401 is scanned with at least one scanning device. Thus, the substrate 140 is moved to a position in the lithography system, causing a scan to occur to process the coordinate data. It will be understood that, if necessary, scanning of the altered components 401 can also be performed via a separate process, and the data is fed to a microlithography machine for use. The obtained altered component data can be stored in a controller. The second set of coordinate data can be compared with the first set of data to determine any possible offset in the altered component placement compared to the designed positioning. The offset can be calculated to allow the microlithography machine to understand the exact placement of the component. Subsequently, data from the offset calculations can be used to modify the wire connection pattern under the design conditions. Visual image data can also be used to determine the required differences in the wire connection pattern.

[0063] Computer analysis can be performed on the data to determine the required offset. The computer analysis can not only calculate the offset, but also provide the position of the changed wired connection 402 between the changed component 401 and the fixed outer periphery 303 or other changed components 401, thus speeding up the processing.

[0064] In implementation, hardware designers can determine that slight differences from the design layout are permissible. Deviations between wired connections and components can be determined to be within acceptable levels. In such cases, it is not necessary to change the wired connections.

[0065] When a deviation from these acceptable levels is detected, an alert can be generated to the processor, allowing notification that a change / modification of the wiring is necessary. In other embodiments, if the location and orientation of a component are outside a maximum threshold, the component cannot be effectively wired connected. A separate alert can be issued to the processor if the component is out of tolerance and the wired connection will be compromised even if it is modified.

[0066] It will be understood that the design of wired connections must consider not only the accuracy of the placement of the start and end points of the wires, but also the length of the wires. If the length of the wire is too long for effective operation and will cause, for example, excessive delays, an alarm can be generated in the processor, indicating that such wiring is non-compliant. In implementation, it should be understood that a wired connection refers to an electrical connection established with a component such as a microprocessor die.

[0067] In operation 704, such as Figure 8B As shown, a wire connection material 860 is deposited over the substrate 140. The wire connection material may include aluminum, copper, tungsten, or a combination thereof.

[0068] In operation 705, such as Figure 8C As shown, photoresist 820 is deposited on top of substrate 140. Photoresist 820 is highly sensitive to radiation and can be either positive or negative. In this manner, patterns are created on the surface of substrate 140 to form electronic circuit systems, such as wired connections.

[0069] In operation 706, such as Figure 8D As shown, photoresist 820 is developed to form developed areas 830 and undeveloped areas 850. Photoresist 820 is developed using a photoresist developer. The photoresist developer is applied to the photoresist 820 to form a pattern corresponding to the modified wire connection 402. In some embodiments, the undeveloped area 850 includes the modified wire connection undeveloped area 802 and the misaligned modified wire connection undeveloped area 805. In other embodiments, the misaligned modified wire connection undeveloped area 805 is not formed. The modified wire connection undeveloped area 802 corresponds to the modified wire connection 402.

[0070] In operation 707, such as Figure 8E As shown, the developing area 830 is removed to form a modified wire connection area 840 (modified electrical connection template) and a misaligned modified wire connection area 815 (e.g., a misaligned area of ​​the modified electrical connection template). The removal of the developing area 830 exposes the wire connection material 860. However, in some embodiments, the misaligned modified wire connection area 815 is not formed.

[0071] In operation 708, the substrate 140 is scanned to obtain a third set of data. In operation 709, the third set of data is compared with the second set of data. In some embodiments, the third set of data is compared with the second set of data to detect the position and orientation of the altered wire connection region 840. The altered component 401 and the altered wire connection region 840 can be detected using infrared metrology or by imaging the bottom via. In some embodiments, the third set of data is compared with the second set of data to detect misaligned altered wire connection regions 815. The misaligned altered wire connection regions 815 deviate from the altered wire connection 402. Detecting the misaligned altered wire connection regions 815 can be achieved by removing the photoresist pattern of the misaligned altered wire connection regions 815 before removing the wire connection material 860 to form the altered wire connection.

[0072] In some implementations, the hardware designer may determine that slight differences from the modified wired connection 402 are permissible. It can be determined that the misaligned modified wired connection area 815 deviates from the modified wired connection 402 at an acceptable level (e.g., a threshold). In such cases, it is not necessary to remove the undeveloped area 650.

[0073] In other embodiments, if the location and orientation of the misaligned wired connection area 815 are outside a threshold, the component cannot be effectively wired connected. A separate alarm can be issued to the processor if the misaligned wired connection area 815 exceeds the tolerance and the wired connection 402 will be compromised.

[0074] In optional operation 710, the undeveloped area 850 of the photoresist 820 is removed. In other words, at least a portion of the altered electrical connection template is removed. In an embodiment where a misaligned altered wire connection area 815 is detected, the undeveloped area 850 of the photoresist 820 is removed to repeat operations 705 to 709. Operations 705 to 709 are repeated until no misaligned altered wire connection area 815 is detected in the third set of data. Removing the photoresist 820 when a misaligned altered wire connection area 815 is detected increases defect detection before removing more permanent wire connection material, thereby reducing waste and increasing throughput.

[0075] In operation 711, such as Figure 8F As shown, the undeveloped area 850 and the exposed wire connection material 860 are removed to form the altered layout diagram 400.

[0076] In summary, this method is disclosed. The method includes determining one or more modified electrical connections based on the offset between a designed component and a modified component disposed on a substrate. The method includes depositing photoresist over the substrate and developing the photoresist to form one or more developed areas and one or more undeveloped areas. One or more developed areas or one or more undeveloped areas of the photoresist are removed to form a modified electrical connection template. The modified component and the modified electrical connection template are scanned to identify one or more misaligned areas of the modified electrical connection template. At least a portion of the modified electrical connection template is removed. This disclosure provides measurements of the location and orientation of adaptively generated wiring to detect defects in adaptively generated wiring before wiring material deposition, thereby improving manufacturing throughput.

[0077] Although embodiments have been described herein, those skilled in the art who benefit from the content of this disclosure will understand that other embodiments are conceivable without departing from the scope of the invention. Therefore, the scope of the claims or any subsequent related claims should not be unduly limited by the description of the embodiments described herein.

Claims

1. A method for processing equipment, the method comprising: Based on the offset between the designed component and the modified component mounted on the substrate, one or more modified electrical connections are determined. Photoresist is deposited over the substrate; The photoresist is developed to form one or more developed areas and one or more undeveloped areas; Remove one of the one or more developed areas or one or more undeveloped areas of the photoresist to form a modified electrical connection template; Scan the altered component and the altered electrical connection template to identify one or more misaligned areas of the altered electrical connection template; and Remove at least a portion of the modified electrical connection template.

2. The method of claim 1, further comprising forming the one or more modified electrical connections on the modified electrical connection template based on determining that misalignment areas have not been identified.

3. The method of claim 2, wherein the one or more developing regions correspond to the one or more modified electrical connections, and the formation of the one or more modified electrical connections comprises: Deposit electrical connection material in the modified electrical connection template; and Remove at least a portion of the modified electrical connection template to form a modified layout diagram.

4. The method of claim 2, wherein the one or more undeveloped regions correspond to the one or more altered electrical connections, and the formation of the one or more altered electrical connections comprises: Before depositing the photoresist, an electrical connection material is deposited on the substrate; and At least a portion of the altered electrical connection template and the exposed portion of the electrical connection material are removed to form an altered layout, wherein removing one or more development areas of the photoresist to form the altered electrical connection template exposes a portion of the electrical connection material.

5. The method of claim 1, further comprising: Based on the determination that the offset is less than the threshold, the offset is set to zero.

6. The method of claim 1, further comprising: An alarm is generated based on the determination that the offset is greater than a threshold.

7. The method of claim 1, wherein the method is performed in situ in a maskless microlithography system.

8. The method of claim 1, further comprising: The one or more altered electrical connections are provided between the altered component and the second altered component.

9. The method of claim 1, further comprising: The one or more modified electrical connections are provided between the modified component and the fixed outer periphery of the substrate.

10. A method for processing equipment, the method comprising: Based on the offset between the designed component and the modified component mounted on the substrate, one or more modified electrical connections are determined. ； Performing a photoresist development process, the photoresist development process includes: Photoresist is deposited over the substrate; The photoresist is developed to form one or more developed areas and one or more undeveloped areas; Remove one or more developed areas or one or more undeveloped areas of the photoresist to form a modified electrical connection template; Scan the altered component and the altered electrical connection template to identify one or more misaligned areas of the altered electrical connection template; Upon identifying the one or more misaligned areas, at least a portion of the altered electrical connection template is removed; and When identifying the one or more misaligned areas, repeat the photoresist development process; and To form one or more altered electrical connections.

11. The method of claim 10, wherein the one or more developing regions correspond to the one or more modified electrical connections, and the formation of the one or more modified electrical connections comprises: Deposit electrical connection material in the modified electrical connection template; and Remove at least a portion of the modified electrical connection template to form a modified layout diagram.

12. The method of claim 10, wherein the one or more undeveloped regions correspond to the one or more altered electrical connections, and the formation of the one or more altered electrical connections comprises: Before depositing the photoresist, an electrical connection material is deposited on the substrate; and At least a portion of the altered electrical connection template and the exposed portion of the electrical connection material are removed to form an altered layout, wherein removing one or more development areas of the photoresist to form the altered electrical connection template exposes a portion of the electrical connection material.

13. The method of claim 10, further comprising: This further includes providing the one or more altered electrical connections between the altered component and the second altered component.

14. The method of claim 10, further comprising: Compare the first set of data for the designed component with the second set of data for the modified component; and The offset is compared with a threshold, where: When the offset is less than the threshold, the offset is set to zero; and When the offset is greater than the threshold, an alert is generated to the user that the threshold has been exceeded.

15. The method of claim 10, wherein the one or more altered electrical connections are based on the offset.

16. A method for processing equipment, the method comprising: Based on the offset between the designed component and the modified component mounted on the substrate, one or more modified electrical connections are determined. ； Performing a photoresist development process, the photoresist development process includes: Photoresist is deposited over the substrate; The photoresist is developed to form one or more developed areas and one or more undeveloped areas; Remove one or more developed areas or one or more undeveloped areas of the photoresist to form a modified electrical connection template; Scan the altered component and the altered electrical connection template to identify one or more misaligned areas of the altered electrical connection template; Upon identifying the one or more misaligned areas, at least a portion of the altered electrical connection template is removed; and When identifying one or more misaligned areas, repeat the photoresist development process; Depositing electrical connection material in the modified electrical connection template; and Remove at least a portion of the modified electrical connection template to form a modified layout diagram.

17. The method of claim 16, wherein the method is performed in situ in a maskless microlithography system.

18. The method of claim 16, further comprising: This further includes providing the one or more altered electrical connections between the altered component and the second altered component.

19. The method of claim 16, further comprising: Compare the first set of data for the designed component with the second set of data for the modified component; and The offset is compared with a threshold, where: When the offset is less than the threshold, the offset is set to zero; and When the offset is greater than the threshold, an alert is generated to the user that the threshold has been exceeded.

20. The method of claim 16, wherein the one or more altered electrical connections are based on the offset.

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