Multilayer ceramic capacitor

Abstract

A multilayer ceramic capacitor capable of mitigating stress is provided. In a multilayer ceramic capacitor (10), a base electrode layer (32) of an external electrode (30) has an end face electrode portion (40), and a lead-out electrode portion (41) that is led out from a first end face (12e) and a second end face (12f) to at least any one of a first main face (12a), a second main face (12b), a first side face (12c), and a second side face (12d). The lead-out electrode portion (41) has a base end side portion (42) on the first end face (12e) and the second end face (12f) side, and a front end side portion (43) on the front end side away from the first end face (12e) and the second end face (12f) with respect to the base end side portion (42). A front end side interface (53) of a laminate (12) opposite to the front end side portion (43) includes at least one front end side bonded interface (53a) at which the laminate (12) and the front end side portion (43) are bonded, and at least one front end side unbonded interface (53b) at which the laminate (12) and the front end side portion (43) are not bonded.

Description

Technical Field

[0001] This invention relates to multilayer ceramic capacitors. Background Technology

[0002] A typical multilayer ceramic capacitor comprises a stack of multiple ceramic layers and multiple internal electrode layers, and external electrodes formed on the outer surface of the stack. The internal electrode layers are led out to the end faces of the stack and connected to the external electrodes. The external electrodes are, for example, composed of a base electrode layer formed by firing a conductive paste applied to the stack, and a plating layer formed on the outer surface of the base electrode layer.

[0003] In Patent Document 1, the external electrode is formed with its front end (e-sized end) separated from the laminate. During the solder reflow process when mounting the multilayer ceramic capacitor to the substrate, during the handling of the multilayer ceramic capacitor mounted on the substrate, and during operation, the multilayer ceramic capacitor is subjected to stresses such as thermal stress and tensile stress. In the multilayer ceramic capacitor of Patent Document 1, the front end of the external electrode separated from the laminate primarily absorbs stress. Therefore, compared to the case where the external electrode is entirely bonded to the laminate, the stress applied to the laminate can be mitigated.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-109238 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] However, according to the structure in Patent Document 1, since the front end of the external electrode separated from the laminate mainly bears the stress, a significant defect occurs at this front end. Therefore, further improvements are needed to the laminated ceramic capacitor that can alleviate stress.

[0009] Therefore, the main objective of this invention is to provide a multilayer ceramic capacitor capable of mitigating stress.

[0010] Technical solutions for solving the problem

[0011] The multilayer ceramic capacitor of the present invention comprises:

[0012] A laminate, comprising multiple stacked ceramic layers and multiple internal electrode layers, and including a first main surface and a second main surface opposite each other in the height direction, a first side surface and a second side surface opposite each other in the width direction orthogonal to the height direction, and a first end surface and a second end surface opposite each other in the length direction orthogonal to the height and width directions; and

[0013] The external electrode is connected to the internal electrode layer on the first and second end faces.

[0014] The external electrode comprises a base electrode layer formed on the laminate.

[0015] The substrate electrode layer contains conductive particles and glass.

[0016] The substrate electrode layer has: an end-face electrode portion formed on a laminate at a first end face and a second end face; and a winding electrode portion continuous with the end-face electrode portion, formed on the laminate by winding from the first end face and the second end face to at least one of a first main face, a second main face, a first side face, and a second side face.

[0017] The winding electrode section has:

[0018] The base side portion, located on the first end face and the second end face side; and

[0019] The front end side is continuous with the base end side and is located at the front end side away from the first end face and the second end face relative to the base end side.

[0020] The front end side interface of the laminate that is opposite to the front end side in the laminate interface opposite to the lead-winding electrode portion includes at least one front end side bonding interface where the laminate is bonded to the front end side and at least one front end side non-bonding interface where the laminate is not bonded to the front end side.

[0021] The aforementioned multilayer ceramic capacitor has a front end side as described above, which prevents stress from accumulating on the front end side, thus mitigating stress.

[0022] Invention Effects

[0023] According to the present invention, a multilayer ceramic capacitor capable of mitigating stress can be provided.

[0024] The above-mentioned objects, other objects, features, and advantages of the present invention will become clearer from the following detailed description of specific embodiments with reference to the accompanying drawings. Attached Figure Description

[0025] Figure 1 This is a perspective view showing an example of a multilayer ceramic capacitor, an electronic component according to an embodiment of the present invention.

[0026] Figure 2 yes Figure 1 A sectional view at line II-II.

[0027] Figure 3 From Figure 2 The enlarged cross-sectional view of the substrate electrode layer and the laminate in the case of a multilayer ceramic capacitor with the plating layer omitted.

[0028] Figure 4 yes Figure 3 A cross-sectional view of part α.

[0029] Figure 5 (a) is a detection result of an EDX device used on a portion of Al from the front end side to the base end side in a multilayer ceramic capacitor according to an embodiment of the invention. Figure 5 (b) is with Figure 5 (a) Detection results of Cu at the same location using an EDX device.

[0030] Figure 6 (a) is a schematic diagram showing the morphology of the paste for the base electrode layer according to this embodiment. Figure 6 (b) is a schematic diagram showing the morphology of a base electrode layer paste that differs from that in this embodiment.

[0031] Figure 7 This is a schematic diagram showing the state in which the base electrode layer of this embodiment is applied to the laminate with paste.

[0032] Figure 8 The image is an SEM image obtained by taking a cross-sectional view of a portion of the front end side and the base end side of this embodiment before the coating is formed.

[0033] Figure 9 The image is an SEM image obtained by taking a cross-section of a portion of the front end side and a portion of the base end side, which are different from those in this embodiment, before the coating is formed.

[0034] Figure 10 (a) is for Figure 9 The portion shown, from the front end to the base end, utilizes the detection results of the EDX device's Al. Figure 10 (b) is with Figure 10 (a) Detection results of Cu at the same location using an EDX device.

[0035] Figure 11 This is a partially enlarged cross-sectional view of the substrate electrode layer and the laminate in the case of the multilayer ceramic capacitor of Comparative Example 1, where the plating layer is omitted.

[0036] Figure 12 This is a partially enlarged cross-sectional view of the base electrode layer and the laminate in the case of the multilayer ceramic capacitor of Comparative Example 2, where the plating layer is omitted.

[0037] Figure 13 (a) is a stress distribution diagram in the basic specimen of Example 1. Figure 13 (b) is a stress distribution diagram in the specimen of Comparative Example 1. Figure 13(c) is a stress distribution diagram in the specimen of Comparative Example 2. Detailed Implementation

[0038] <Implementation Method>

[0039] 1. Multilayer ceramic capacitor

[0040] The multilayer ceramic capacitor according to embodiments of the present invention will be described. In this embodiment, a two-terminal multilayer ceramic capacitor will be used as an example.

[0041] Figure 1 This is a perspective view showing an example of a multilayer ceramic capacitor, an electronic component according to an embodiment of the present invention. Figure 2 yes Figure 1 A sectional view at line II-II. Figure 3 From Figure 2 The enlarged cross-sectional view of the substrate electrode layer and the laminate in the case of a multilayer ceramic capacitor with the plating layer omitted. Figure 4 yes Figure 3 A cross-sectional view of part α. Figure 3 , Figure 4 In the cross-section orthogonal to the first end face 12e and the second end face 12f, the multilayer ceramic capacitor 10 is exposed. Specifically, Figure 3 , Figure 4 An example is a cross-sectional view of a multilayer ceramic capacitor 10 that has been ground to expose the first end face 12e, the second end face 12f, the first main face 12a, and the second main face 12b.

[0042] The laminate 12 has multiple stacked ceramic layers 14 and multiple internal electrode layers 16. Furthermore, the laminate 12 has a first main surface 12a and a second main surface 12b facing each other in the height direction x, a first side surface 12c and a second side surface 12d facing each other in the width direction y orthogonal to the height direction x, and a first end surface 12e and a second end surface 12f facing each other in the length direction z orthogonal to both the height direction x and the width direction y. In this laminate 12, it is preferable to have rounded corners and edges. A corner is the portion where three adjacent surfaces of the laminate 12 intersect, and an edge is the portion where two adjacent surfaces of the laminate 12 intersect. Additionally, some or all of the first main surface 12a and the second main surface 12b, the first side surface 12c and the second side surface 12d, and the first end surface 12e and the second end surface 12f may be formed with irregularities or protrusions. Furthermore, the dimension of the stacked body 12 in the length direction z is not necessarily longer than the dimension in the width direction y.

[0043] The laminate 12 has an effective layer portion 15a with internal electrode layers 16 facing each other in the lamination direction x that connects the first main surface 12a and the second main surface 12b, a first outer layer portion 15b located between the internal electrode layer 16 closest to the first main surface 12a and the first main surface 12a, and a second outer layer portion 15c located between the internal electrode layer 16 closest to the second main surface 12b and the second main surface 12b.

[0044] The first outer layer 15b is located on the first main surface 12a side of the laminate 12, and is an assembly of multiple ceramic layers 14 located between the first main surface 12a and the inner electrode layer 16 closest to the first main surface 12a.

[0045] The second outer layer 15c is located on the second main surface 12b side of the laminate 12, and is an assembly of multiple ceramic layers 14 located between the second main surface 12b and the inner electrode layer 16 closest to the second main surface 12b.

[0046] The area sandwiched between the first outer layer 15b and the second outer layer 15c is the effective layer 15a.

[0047] The dimensions of the laminate 12 are not particularly limited, but it is preferred that the dimension in the length direction z is, for example, 0.2 mm or more and 10.0 mm or less, the dimension in the width direction y is, for example, 0.1 mm or more and 10.0 mm or less, and the dimension in the height direction x is, for example, 0.1 mm or more and 5.0 mm or less.

[0048] The ceramic layer 14 can be formed, for example, from a dielectric material. Such a dielectric material includes a perovskite compound represented by the general formula ABO3 with Ba at the A-site. For example, a dielectric ceramic containing components such as BaTiO3 can be used as the dielectric material. When the above-mentioned dielectric material is used as the main component, it can also be composed of, for example, Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, etc., depending on the desired characteristics of the laminate 12.

[0049] The number of ceramic layers 14, including the effective layer 15a, the first outer layer 15b, and the second outer layer 15c, is preferably 15 or more and 1000 or less.

[0050] The thickness of the fired ceramic layer 14 is preferably, for example, 0.4 μm or more and 2 μm or less.

[0051] Furthermore, when a piezoelectric ceramic material is used in the ceramic layer 14, the electronic component functions as a piezoelectric component. Specific examples of piezoelectric ceramic materials include, for instance, PZT (lead zirconate titanate) based ceramic materials.

[0052] Furthermore, when a semiconductor ceramic material is used in the ceramic layer 14, the electronic components function as thermistor elements. Specific examples of semiconductor ceramic materials include, for instance, spinel-based ceramic materials.

[0053] Furthermore, when a magnetic ceramic material is used in the ceramic layer 14, the electronic component functions as an inductor element. Additionally, when functioning as an inductor element, the internal electrode layer 16 becomes a coil-shaped conductor. Specific examples of magnetic ceramic materials include, for instance, ferrite ceramic materials.

[0054] like Figure 2 As shown, the laminate 12 has a plurality of first internal electrode layers 16a and a plurality of second internal electrode layers 16b, for example, in a generally rectangular shape, as a plurality of internal electrode layers 16. The plurality of first internal electrode layers 16a and the plurality of second internal electrode layers 16b are embedded in an alternating arrangement at equal intervals along the lamination direction of the laminate 12. The first internal electrode layers 16a and the second internal electrode layers 16b can be configured either parallel to the mounting surface or perpendicular to the mounting surface.

[0055] The end of the first internal electrode layer 16a is exposed from the laminate 12 at the first end face 12e. The end of the second internal electrode layer 16b is exposed from the laminate 12 at the second end face 12f.

[0056] The internal electrode layer 16 may contain, for example, suitable conductive materials such as metals like Ni, Cu, Ag, Pd, and Au, or alloys containing at least one of these metals, such as Ag-Pd alloys. The internal electrode layer 16 may also contain dielectric particles with the same composition as the ceramic contained in the ceramic layer 14.

[0057] The thickness of the internal electrode layer 16 is preferably, for example, 0.2 μm or more and 2.0 μm or less.

[0058] External electrodes 30 are disposed on the first end face 12e side and the second end face 12f side of the laminate 12. The external electrodes 30 have a first external electrode 30a and a second external electrode 30b.

[0059] The first external electrode 30a is connected to the first internal electrode layer 16a on the first end face 12e side. Furthermore, in this embodiment, the first external electrode 30a extends from the first end face 12e side and is disposed on a portion of the first main face 12a side and a portion of the second main face 12b side, as well as a portion of the first side face 12c side and a portion of the second side face 12d side.

[0060] The second external electrode 30b is connected to the second internal electrode layer 16b on the second end face 12f side. Furthermore, in this embodiment, the second external electrode 30b extends from the second end face 12f side and is disposed on a portion of the first main face 12a side and a portion of the second main face 12b side, as well as a portion of the first side face 12c side and a portion of the second side face 12d side.

[0061] Within the laminate 12, the first inner electrode layer 16a and the second inner electrode layer 16b are positioned opposite each other across the ceramic layer 14, thereby forming an electrostatic capacitor. Therefore, an electrostatic capacitor can be obtained between the first outer electrode 30a connected to the first inner electrode layer 16a and the second outer electrode 30b connected to the second inner electrode layer 16b, exhibiting the characteristics of a capacitor.

[0062] The external electrode 30 includes a base electrode layer 32 and a plating layer 34 formed on the base electrode layer 32.

[0063] The base electrode layer 32 has a first base electrode layer 32a and a second base electrode layer 32b.

[0064] The first base electrode layer 32a is connected to the first inner electrode layer 16a on the first end face 12e side of the laminate 12. Furthermore, in this embodiment, the first base electrode layer 32a is formed to extend from the first end face 12e side, thereby covering a portion of the surfaces of the first main surface 12a side, the second main surface 12b side, the first side surface 12c side, and the second side surface 12d side. However, the first base electrode layer 32a may also be formed to extend from the first end face 12e side, thereby covering a portion of the surfaces of at least any one of the first main surface 12a side, the second main surface 12b side, the first side surface 12c side, and the second side surface 12d side.

[0065] The second base electrode layer 32b is connected to the second inner electrode layer 16b on the second end face 12f side of the laminate 12. Furthermore, in this embodiment, the second base electrode layer 32b is formed to extend from the second end face 12f side, thereby covering a portion of the surfaces of the first main surface 12a side, the second main surface 12b side, the first side surface 12c side, and the second side surface 12d side. However, the second base electrode layer 32b may also be formed to extend from the second end face 12f side, thereby covering a portion of the surfaces of at least any one of the first main surface 12a side, the second main surface 12b side, the first side surface 12c side, and the second side surface 12d side.

[0066] The maximum thickness of the first base electrode layer 32a and the second base electrode layer 32b is preferably, for example, 10 μm or more and 200 μm or less.

[0067] exist Figure 3 , Figure 4In this example, the plating layer 34 is omitted; instead, a representative example is shown where the first base electrode layer 32a extends from the first end face 12e to a portion of the first main face 12a. Furthermore, Figure 3 , Figure 4 The attached drawing shows a cross-sectional view orthogonal to the second end face 12f, starting from the first end face 12e. Furthermore, the morphology of the first base electrode layer 32a, arranged from the first end face 12e to the second main face 12b, the first side face 12c, and the second side face 12d, is also consistent with... Figure 3 , Figure 4 Similarly, the morphology of the second base electrode layer 32b, which extends from the second end face 12f to the first main face 12a, the second main face 12b, the first side face 12c, and the second side face 12d, is also similar to... Figure 3 , Figure 4 same.

[0068] like Figure 3 , Figure 4 As shown, the substrate electrode layer 32 comprises sintered glass 60 and sintered conductive particles. The glass 60 comprises multiple glass domains 61. The sintered glass domains 61 of the substrate electrode layer 32 comprise, for example, oxides containing at least one element selected from B, Si, Ba, Mg, Al, Li, Zn, Ca, Bi, Ti, Sr, Ga, etc. The conductive particles of the substrate electrode layer 32 comprise sintered metal particles. The metal composition of the metal particles comprises, for example, at least one element selected from Cu, Cu alloys, Ni, Ag, Pd, Ag-Pd alloys, Au, etc. Hereinafter, conductive particles will be referred to as metal particles. Furthermore, the substrate electrode layer 32 may also be multilayered.

[0069] In addition, the base electrode layer 32 has an end face electrode portion 40 and a winding electrode portion 41.

[0070] The end-face electrode portion 40 is an electrode extending over the first end-face 12e and the second end-face 12f, and along the surfaces extending from the first end-face 12e and the second end-face 12f. The end-face electrode portion 40 is formed in a state where a plurality of sintered metal particles and a plurality of sintered glass domains 61 coexist. Figure 3 , Figure 4As shown, a portion of a plurality of glass domains 61 is located on the first end face 12e (and the second end face 12f) in the end face electrode portion 40. The end face electrode portion 40 is bonded to the laminate 12 at the portion that contacts the laminate interface 51 described later. Specifically, the end face electrode portion 40 and the laminate 12 are bonded via each of the plurality of glass domains 61 present on the first end face 12e (and the second end face 12f) (each of each consecutive glass domain 61) or a plurality of metal particles, etc. Furthermore, considering a contact portion where the end face electrode portion 40 and the laminate 12 contact via a single glass domain 61, it can be considered that the end face electrode portion 40 and the laminate 12 are bonded to most or all of that contact portion. Furthermore, each glass domain 61 is positioned within the minute irregularities of the laminate interface 51, which serves as the surface of the laminate 12, and it can be considered that the end electrode portion 40 and the laminate 12 are bonded together by the resulting anchoring effect, etc. Additionally, another portion of the plurality of glass domains 61 is located dispersedly within the end electrode portion 40. Furthermore, the plurality of glass domains 61 may also face the outer surface of the end electrode portion 40, and may even partially protrude from that outer surface.

[0071] The lead-in electrode portion 41 is continuous with the end-face electrode portion 40 and is formed on the laminate 12 by being wound from the first end face 12e and the second end face 12f to the first main face 12a, the second main face 12b, the first side face 12c, and the second side face 12d. In this embodiment, the lead-in electrode portion 41 is formed on a portion of the first main face 12a, a portion of the second main face 12b, a portion of the first side face 12c, and a portion of the second side face 12d. Alternatively, the lead-in electrode portion 41 may also be formed on at least any one of the portions of the first main face 12a, the second main face 12b, the first side face 12c, and the second side face 12d. Figure 3 , Figure 4 In this example, the winding electrode portion 41 is adjacent to the end face electrode portion 40 via a surface extending along the first end face 12e (and the second end face 12f). The surface extending along the first end face 12e (and the second end face 12f) includes the base end position P. A Base position P A This is the position closest to the first end face 12e and the second end face 12f within the laminated interface 51. Furthermore, the winding electrode portion 41, like the end face electrode portion 40, is formed in a state where multiple sintered metal particles and multiple sintered glass domains 61 coexist. For example... Figure 3 , Figure 4As shown, a portion of the plurality of glass domains 61 is located on the first main surface 12a (second main surface 12b, first side surface 12c, second side surface 12d) in the winding electrode portion 41. The winding electrode portion 41 and the laminate 12 are bonded primarily via each (each consecutive glass domain 61) of the plurality of glass domains 61 located on the first main surface 12a (second main surface 12b, first side surface 12c, second side surface 12d). Alternatively, the winding electrode portion 41 and the laminate 12 may also be bonded via a plurality of metal particles or the like. Furthermore, another portion of the plurality of glass domains 61 is located in a dispersed state inside the winding electrode portion 41. In addition, the plurality of glass domains 61 may also face the outer surface of the winding electrode portion 41, and may also partially protrude from the outer surface. Including the winding electrode section 41, the content of glass domain 61 (glass 60) in the entire base electrode layer 32, relative to the total content of glass domain 61 (glass 60), metal particles and various additives, is preferably 5% by weight or more and 20% by weight or less.

[0072] The winding electrode portion 41 has a base end side portion 42 and a front end side portion 43. The base end side portion 42 is the portion of the winding electrode portion 41 located on the side of the first end face 12e and the second end face 12f (base end side). The front end side portion 43 is the portion of the winding electrode portion 41 that is continuous with the base end side portion 42. Furthermore, the front end side portion 43 is located at a front end side away from the first end face 12e and the second end face 12f relative to the base end side portion 42.

[0073] Here, the interface of the laminate 12 opposite to the winding electrode portion 41 is designated as the laminate interface 51. The laminate interface 51 is the outer surface of the laminate 12, and is a surface along the length direction z. The laminate interface 51 has small irregularities. Furthermore, the interface of the laminate 12 opposite to the front end side portion 43 in the laminate interface 51 is designated as the front end side interface 53. At the front end side interface 53, the laminate 12 is partially bonded to the front end side portion 43. Specifically, the front end side interface 53 includes at least one front end side bonding interface 53a where the laminate 12 is bonded to the front end side portion 43, and at least one front end side non-bonding interface 53b where the laminate 12 is not bonded to the front end side portion 43. At the front end side non-bonding interface 53b, the laminate 12 is separated from the front end side portion 43. Preferably, at the front end side non-bonding interface 53b, the laminate 12 is separated in a state close to the front end side portion 43. Furthermore, the interface of the laminate 12, which is opposite to the base end side 42 in the laminate interface 51, is designated as the base end side interface 52. At the base end side interface 52, the laminate 12 is substantially bonded to the base end side 42.

[0074] The front end side 43 and the base end side 42 will be further described below.

[0075] The front end side 43 is located on the front end side of the winding electrode portion 41. The term "front end side" refers to the side of the laminate interface 51 that is away from the base end side, which serves as the first end face 12e and the second end face 12f. In this embodiment, as... Figure 3 , Figure 4 As shown, in a cross-sectional view orthogonal to the first end face 12e and the second end face 12f, the front end side 43 extends to the front end position P, which is the starting point of the front end side 43. B The terminal position P, which is the endpoint of the front side 43 D The configuration is such that the front end 43 is located within the interface 51 of the stacked body, relative to the base end position P. A With front position P B The center position P between C It is located further to the front end. That is, at the terminal position P of the front end side 43. D Located at the center position P C The position near the front. Front position P B It is the position furthest from the first end face 12e and the second end face 12f within the layered interface 51. Center position P C Located at the base position P A With front position P B The center, the central location P C With base position P A Distance and center position P between C With front position P B The distances between them are roughly the same.

[0076] Furthermore, the front-end interface 53 is part of the laminate interface 51 opposite to the front-end portion 43 in the winding electrode portion 41. The front-end interface 53 includes at least one front-end adhesive interface 53a and at least one front-end non-adhesive interface 53b. For example, the front-end interface 53 sometimes includes one front-end adhesive interface 53a and one front-end non-adhesive interface 53b. Furthermore, for example, the front-end interface 53 sometimes includes multiple front-end adhesive interfaces 53a and multiple front-end non-adhesive interfaces 53b in a mixed state. At each front-end adhesive interface 53a, the laminate 12 is bonded to the front-end portion 43. Furthermore, at each front-end non-adhesive interface 53b, the laminate 12 is not bonded to the front-end portion 43. Moreover, at each front-end non-adhesive interface 53b, it is preferable that the laminate 12 is separated in a state close to the front-end portion 43. The non-adhesive front-side interface 53b is the part of the front-side interface 53 other than the adhesive front-side interface 53a.

[0077] In this embodiment, such as Figure 3 As shown, the front-end interface 53 extends along the terminal position P of the layer interface 51. D To the front end PB On the front-end interface 53, there is a section from terminal location P. D To position P E The front-side non-adhesive interface 53b, from position P E To position P G Front-side adhesive interface 53a, from position P G To position P H The front-side non-adhesive interface 53b, and from position P H To the front end P B The front-side bonding interface 53a is preferably located at the foremost end of the front-side interface 53. That is, the front-side portion 43 is preferably bonded to the laminate 12 at its foremost end. This helps to prevent significant damage to the front-side portion 43.

[0078] At each front-side bonding interface 53a, the front-side portion 43 and the laminate 12 are bonded. Specifically, at each front-side bonding interface 53a, the front-side portion 43 and the laminate 12 are bonded via each of the plurality of glass domains 61 present on the front-side interface 53 (each consecutive glass domain 61) or a plurality of metal particles, etc. Furthermore, considering a single contact portion where the front-side portion 43 and the laminate 12 contact via a single glass domain 61, it can be considered that the front-side portion 43 and the laminate 12 are bonded to most or all of that single contact portion. Furthermore, since each glass domain 61 is embedded in the minute irregularities of the front-side interface 53, it can be considered that at the front-side bonding interface 53a, the front-side portion 43 and the laminate 12 are bonded by the resulting anchoring effect, etc.

[0079] Furthermore, each glass domain 61 is detected, for example, by performing compositional analysis using EDX (energy-dispersive X-ray diffraction) after the cross-section of the multilayer ceramic capacitor 10 is exposed through a polishing process. The presence of each glass domain 61 can be determined by detecting glass components such as Ba, Si, and Al. The polishing agent used in the polishing process sometimes contains components similar to those found in glass components such as Si and Al. Since the polishing agent is spherical, it is preferable that spherical glass components are not detected as glass domains 61.

[0080] In this embodiment, Figure 3 In the middle, from position P E To position P F The distance L5 and from position P F To position P G The total of a series of distances L3a from position P (from position P) E To position P G The portion at distance L5 + distance L3a) serves as a front-side bonding interface 53a. Furthermore, from position P...H To the front end P B The portion at distance L3b serves as another front-side adhesive interface 53a. Here, from position P... E To position P F At the front-side bonding interface 53a of the portion at distance L5, the laminate 12 is bonded to the front-side portion 43 via metal particles or the like. Furthermore, at position P... F To position P G At the front-side bonding interface 53a of the portion at distance L3a, the laminate 12 is bonded to the front-side portion 43 via glass domain 61. Furthermore, at position P... H To the front end P B The front-side bonding interface 53a of the portion at distance L3b, the laminate 12 is bonded to the front-side portion 43 via glass domain 61.

[0081] In addition, Figure 3 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, in the front end side portion 43, the distance of at least one front end side bonding interface 53a is preferably 10% or more and 50% or less relative to the distance L2 of the front end side interface 53. In this embodiment... Figure 3 In the example, the distance of at least one front-side bonding interface 53a from position P is... E To position P G The distance L5 + distance L3a, and from position P H To the front end P B The total distance from L3b is (distance L5 + distance L3a + distance L3b). Additionally, the distance from the front-end interface 53 is the terminal position P. D With front position P B The distance between them is L2.

[0082] In addition, Figure 3 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the distance (distance L5 + distance L3a + distance L3b) of at least one front-end side bonding interface 53a is preferably 2% or more and 15% or less relative to the distance L1 of the laminate interface 51. The distance of the laminate interface 51 is the base end position P. A With front position P B The distance L1 between them. In addition, the distance L2 of the front-end interface 53 relative to the distance L1 of the stacked body interface 51 is preferably, for example, 5% or more and 30% or less.

[0083] On the other hand, at each front-end non-bonding interface 53b, the laminate 12 is not bonded to the front-end side 43. In this embodiment, a void portion 54 is provided on the front-end side 43 facing each front-end non-bonding interface 53b. In the void portion 54, glass domains 61 are mainly absent at each front-end non-bonding interface 53b. In this embodiment, the void portion 54 is a portion in which glass domains 61 and metal particles are absent. More specifically, in this embodiment, the void portion 54 is formed such that a portion of its surroundings is surrounded by metal particles, etc., and is a void in which glass domains 61 and metal particles are absent inside. The metal particles are Cu particles, etc., constituting the front-end side 43. However, as long as the laminate 12 is not bonded to the front-end side 43, glass domains 61 and metal particles may also be present at the front-end non-bonding interface 53b and the void portion 54. In other words, as long as the laminate 12 is separated from the front end side 43, glass domains 61 and metal particles can also exist in the non-bonded interface 53b on the front end side and the void portion 54. The separation distance SE between the laminate 12 and the front end side 43 is preferably, for example, 8% or more and 35% or less relative to the thickness T1 of the winding electrode portion 41. The separation distance SE is preferably, for example, 2 μm or more and 10 μm or less. The separation distance SE can also be described as the thickness of the void portion 54 in the height direction x.

[0084] Furthermore, voids 54 are detected, for example, by performing compositional analysis using EDX (energy-dispersive X-ray diffraction) after the cross-section of the multilayer ceramic capacitor 10 is exposed through a grinding process. The presence of each void 54 can be determined by detecting elements other than metal particles, such as glass components and Cu particles. Elements other than metal particles, such as carbon (C) and oxygen (O), are examples of such elements. Moreover, as mentioned above, it is preferable to exclude spherical glass components contained in the abrasive used in the grinding process when determining voids 54. For example, it is preferable to remove any abrasive residue remaining in the voids 54 after the grinding process using methods such as ultrasonic cleaning.

[0085] In this embodiment, the terminal location P will be... D To position P E The portion at distance L4a is set as a front-side non-adhesive interface 53b. From position P... G To position P H The portion at distance L4b is set as another front-side non-adhesive interface 53b. From the terminal position P... D To position P E The front-side non-adhesive interface 53b and from position P G To position P HEach of the front-side non-adhesive interfaces 53b has a series of voids 54. That is, each of the series of voids 54 constitutes a front-side non-adhesive interface 53b.

[0086] exist Figure 3 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the distance of at least one front-end side non-bonded interface 53b is preferably 5% or more and 50% or less relative to the distance L2 of the front-end side interface 53. In this embodiment... Figure 3 In the example, the distance of at least one front-side non-adhesive interface 53b is from the terminal position P. D To position P E The distance L4a and the distance from position P G To position P H The total distance from L4b (distance L4a + distance L4b).

[0087] In addition, Figure 3 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the distance (distance L4a + distance L4b) of at least one front-end side non-bonded interface 53b is preferably, for example, more than 1.5% and less than 15% relative to the distance L1 of the laminate interface 51.

[0088] Secondly, the base end side 42 is located on the base end side within the winding electrode portion 41. The base end side refers to the side of the first end face 12e and the second end face 12f in the laminate interface 51. In this embodiment, as... Figure 3 , Figure 4 As shown, in a cross-sectional view orthogonal to the first end face 12e and the second end face 12f, the base end side 42 extends to the terminal position P. D With base position P A Configured between. Terminal location P D It is the starting point of the basal side portion 42 and the ending point of the anterior side portion 43. Basal position P A It is the endpoint of the basal side 42.

[0089] The base-side interface 52 is a part of the laminate interface 51 opposite to the base-side portion 42 in the winding electrode portion 41. The base-side interface 52 is the portion of the laminate interface 51 excluding the front-end interface 53. The base-side interface 52 includes at least one base-side bonding interface 52a. In this embodiment, as... Figure 3 , Figure 4 As shown, the base-end interface 52 extends along the base-end position P of the laminate interface 51. A To terminal location P DAt at least one base-end side bonding interface 52a, the laminate 12 is bonded to the base-end side portion 42. At each base-end side bonding interface 52a, the base-end side portion 42 and the laminate 12 are bonded. Specifically, at each base-end side bonding interface 52a, the base-end side portion 42 and the laminate 12 are bonded via each of a plurality of glass domains 61 present on the base-end side interface 52 (each consecutive glass domain 61) or a plurality of metal particles, etc. Furthermore, considering a single contact portion where the base-end side portion 42 and the laminate 12 contact via a single glass domain 61, it can be considered that the base-end side portion 42 and the laminate 12 are bonded to most or all of that single contact portion. Furthermore, since each glass domain 61 is in a state of entering the minute irregularities of the base-end side interface 52, it can be considered that at the base-end side bonding interface 52a, the base-end side portion 42 and the laminate 12 are bonded by the resulting anchoring effect, etc. The detection method for each glass domain 61 is as described above. In this embodiment, each base-side bonding interface 52a is continuous, thereby forming a series of base-side bonding interfaces 52a.

[0090] From position P I To position P J The portion of the distance L7a from position P K To position P L The portion of the distance L7b from position P M To position P N The portion of the distance L7c from position P O To position P p The portion of the distance L7d, and from position P Q To position P R At the base-end side bonding interface 52a of the portion at distance L7e, the laminate 12 is bonded to the base-end side portion 42 via glass domain 61. On the other hand, at the base-end position P A To position P I The portion of the distance L8a from position P J To position P k The portion of the distance L8b from position P L To position P M The portion of the distance L8c from position P N To position P O The portion of the distance L8d from position P P To position P Q The portion of the distance L8e, and from position P R To terminal location P D At the base-end side bonding interface 52a of the portion at distance L8f, the laminate 12 is bonded to the base-end side portion 42 via metal particles or the like. In this embodiment, a series of base-end positions P A To terminal location P DA series of base-side bonding interfaces 52a are formed, and the laminate 12 is bonded to the base-side portion 42 via glass domains 61 and metal particles, etc.

[0091] As described above, in this embodiment, the base-side interface 52 is generally composed of a series of base-side adhesive interfaces 52a, and the laminate 12 is bonded to the base-side portion 42 for the entire base-side interface 52. Alternatively, the laminate 12 may not be bonded to the base-side portion 42 for a portion of the base-side interface 52. For example, the base-side interface 52 may also include a plurality of discontinuous base-side adhesive interfaces 52a.

[0092] The amount of glass 60 present at the front-side interface 53 is less than the amount of glass 60 present at the base-side interface 52. In other words, the continuity of glass 60 at the front-side interface 53 is less than the continuity of glass 60 at the base-side interface 52. Furthermore, the amount of glass 60 can be determined, for example, using an EDX (energy-dispersive X-ray diffraction) device. Specifically, using… Figure 5 Explanation will be provided. In Figure 5 In the diagram, (a) shows the detection results of Al using an EDX device on a portion from the front end side to the base end side, and (b) shows the detection results of Cu using an EDX device on the same portion as in (a). In the EDX device, line analysis was performed at the laminate interface 51 on a portion from the front end side 43 to the base end side 42. (See diagram for details.) Figure 5 As shown in (a), the front end side 43 has a void 54, and the Al content of the front end side interface 53 is less than the Al content of the base end side interface 52. Al is one of the glass components of the glass 60. Therefore, it can be seen that the glass 60 content of the front end side interface 53 is less than the glass 60 content of the base end side interface 52. It can be seen that, in particular, the glass 60 content is less in the portion of the front end side interface 53 where the void 54 exists. Therefore, it can be seen that the bonding area of ​​the front end side 43 and the laminate 12 via the glass 60 (including the front end side bonding interface 53a) is less than the bonding area of ​​the base end side 42 and the laminate 12 via the glass 60 (including the base end side bonding interface 52a). In addition, as Figure 5 As shown in (a) and (b), the void portion 54 of the front end side interface 53 contains not only a small amount of glass 60 but also a small amount of Cu. On the other hand, the void portion 54 is almost non-existent at the base end side interface 52. Based on the above, it can be seen that the area of ​​bonding between the front end side portion 43 and the laminate 12 via glass 60 or metal particles (included in the front end side bonding interface 53a) is smaller than the area of ​​bonding between the base end side portion 42 and the laminate 12 via glass 60 or metal particles (included in the base end side bonding interface 52a). Therefore, it can be concluded that the front end side portion 43 is partially bonded to the laminate 12, and partially unbonded.

[0093] Furthermore, the continuity of the glass 60 at the front-side interface 53 is represented, for example, by the distance of the glass 60 existing on the front-side interface 53 relative to a distance L2. The distance of the glass 60 at the front-side interface 53... Figure 3 In the example case, it is distance L3a + distance L3b. Similarly, the continuity of the glass 60 at the base-side interface 52 is represented, for example, by the distance of the glass 60 present at the base-side interface 52 relative to the base-side interface 52. The distance at the base-side interface 52, as described later, is distance L6. Figure 3 In the example case, the distance of the glass 60 at the base-side interface 52 is distance L7a + distance L7b + distance L7c + distance L7d + distance L7e.

[0094] Furthermore, from the central location P C To the front end P B The bonding area between the winding electrode portion 41 and the laminate 12 is greater than that from the base position P. A To the center position P C The bonding area between the winding electrode portion 41 and the laminate 12 is small.

[0095] In addition, Figure 3 In the cross-sectional view orthogonal to the first end face 12e and the second end face 12f, the proportion of the distance (distance L5 + distance L3a + distance L3b) of at least one front-end bonding interface 53a in the distance L2 of the front-end bonding interface 53 is set as distance of front-end bonding interface 53a / distance of front-end bonding interface 53. Furthermore, the proportion of the distance of at least one base-end bonding interface 52a in the distance of the base-end bonding interface 52 is set as distance of base-end bonding interface 52a / distance of base-end bonding interface 52. The distance of front-end bonding interface 53a / distance of front-end bonding interface 53 can be considered smaller than the distance of base-end bonding interface 52a / distance of base-end bonding interface 52. In this embodiment, the distance of at least one base-side bonding interface 52a is the total distance of distance L7a + distance L7b + distance L7c + distance L7d + distance L7e + distance L8a + distance L8b + distance L8c + distance L8d + distance L8e + distance L8f (distances L7a to L7e + distances L8a to L8f). The distance of the base-side interface 52 is distance L6. The distance of the base-side bonding interface 52a / the distance of the base-side interface 52 is, for example, more than 40% and less than 80%. As mentioned above, the distance of the front-end bonding interface 53a / the distance of the front-end interface 53 is, for example, more than 10% and less than 50%.

[0096] In addition, Figure 3In the cross-sectional view orthogonal to the first end face 12e and the second end face 12f, the proportion of the distance (distance L5 + distance L3a + distance L3b) of at least one front-end bonding interface 53a in the distance L1 of the laminate interface 51 is set as the distance of the front-end bonding interface 53a / the distance of the laminate interface 51. Furthermore, the proportion of the distance (distance L7a to L7e + distance L8a to L8f) of at least one base-end bonding interface 52a in the distance L1 of the laminate interface 51 is set as the distance of the base-end bonding interface 52a / the distance of the laminate interface 51. The distance of the front-end bonding interface 53a / the distance of the laminate interface 51 is likely smaller than the distance of the base-end bonding interface 52a / the distance of the laminate interface 51. For example, the distance of the base-end bonding interface 52a / the distance of the laminate interface 51 is 35% or more and 75% or less. As previously stated, the distance between the front-side adhesive interface 53a and the stacked body interface 51 is, for example, more than 2% and less than 15%.

[0097] In addition, Figure 3 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the total distance (distance L5 + distance L3a + distance L3b + distance L7a to L7e + distance L8a to L8f) along the laminate interface 51 of at least one front end side bonding interface 53a and at least one base end side bonding interface 52a is preferably, for example, more than 40% and less than 70% of the distance L1 of the laminate interface 51.

[0098] exist Figure 3 , Figure 4 In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the glass 60, as previously described, comprises a plurality of glass domains 61. The distance at which each glass domain 61 connects along the laminate interface 51 is preferably, for example, 0.1% or more and 10% or less relative to the distance L1 of the laminate interface 51. Furthermore, as... Figure 4 As shown, the distances at which each glass domain 61 connects along the laminate interface 51 in the base end side 42 are distances L7a, L7b, L7c, L7d, and L7e, respectively. Furthermore, as... Figure 3 As shown, the distances at which each glass domain 61 connects along the interface 51 of the laminate in the front end side 43 are distances L3a and L3b, respectively.

[0099] exist Figure 3 , Figure 4In the cross-sectional view shown orthogonal to the first end face 12e and the second end face 12f, the thickness T2 of each glass domain 61 in the direction orthogonal to the laminate interface 51 is preferably, for example, 0.1% or more and 20% or less, relative to the thickness T1 of the winding electrode portion 41 in the direction orthogonal to the laminate interface 51. The thickness T2 of each glass domain 61 is, for example, 0.2 μm or more and 5.0 μm or less.

[0100] The plating layer 34 has a first plating layer 34a and a second plating layer 34b. The first plating layer 34a is configured to cover the first base electrode layer 32a. The second plating layer 34b is configured to cover the second base electrode layer 32b. The first plating layer 34a and the second plating layer 34b may contain at least one material selected from Cu, Ni, Sn, Ag, Pd, Ag-Pd alloy, Au, etc.

[0101] The first plating layer 34a and the second plating layer 34b can also be formed by multiple layers. In this case, the plating layer 34 is preferably a two-layer structure consisting of a lower plating layer based on Ni plating formed on the substrate electrode layer 32 and an upper plating layer based on Sn plating formed on the lower plating layer.

[0102] That is, the first plating layer 34a has a first lower plating layer and a first upper plating layer located on the surface of the first lower plating layer. In addition, the second plating layer 34b has a second lower plating layer and a second upper plating layer located on the surface of the second lower plating layer.

[0103] The lower plating layer based on Ni plating is used to prevent the base electrode layer 32 from being eroded by solder when mounting the multilayer ceramic capacitor 10 to the substrate, etc. The upper plating layer based on Sn plating is used to improve the wettability of solder when mounting the multilayer ceramic capacitor 10 to the substrate, etc., so that it can be easily mounted.

[0104] The thickness of each of the upper and lower plating layers is preferably, for example, 2.0 μm or more and 15.0 μm or less.

[0105] The dimensions of the multilayer ceramic capacitor 10 are not particularly limited, but the length dimension L in the z-direction is, for example, 0.25 mm or more and 10.5 mm or less, the width dimension W in the y-direction is, for example, 0.12 mm or more and 10.5 mm or less, and the height dimension T in the x-direction is, for example, 0.12 mm or more and 5.5 mm or less. Furthermore, the length dimension L in the z-direction is not necessarily longer than the width dimension W in the y-direction and the height dimension T in the x-direction.

[0106] 2. Manufacturing method of multilayer ceramic capacitors

[0107] Next, the manufacturing method of the multilayer ceramic capacitor 10 will be described.

[0108] (Step 1) First, prepare the dielectric sheet for the ceramic layer and the conductive paste for the internal electrode layer. The dielectric sheet for the ceramic layer is formed, for example, from a dielectric paste with BaTiO3 as the main component, but is not limited thereto. The conductive paste for the internal electrode layer is formed, for example, from a Ni-based component, but is not limited thereto. The dielectric sheet and the conductive paste for the internal electrode layer contain an adhesive and a solvent. The adhesive and solvent are composed of a resin component, and as the resin component, various known thermosetting resins such as epoxy resin, phenoxy resin, phenolic resin, polyurethane resin, and polyimide resin can be used.

[0109] (Step 2) Then, conductive paste for the inner electrode layer is printed on the dielectric sheet in a given pattern, for example by screen printing, gravure printing, etc. Thus, a dielectric sheet with a pattern of the first inner electrode layer and a dielectric sheet with a pattern of the second inner electrode layer are prepared.

[0110] In addition, regarding the dielectric sheet, a dielectric sheet for the outer layer without the pattern of the internal electrode layer is also prepared.

[0111] A given number of dielectric sheets for the outer layer portion without printed internal electrode layer patterns are stacked. Dielectric sheets with printed first internal electrode layer patterns and dielectric sheets with printed second internal electrode layer patterns are then sequentially stacked on top of these, thereby forming an effective layer portion. A given number of dielectric sheets for the outer layer portion without printed internal electrode layer patterns are then stacked on this effective layer portion. This forms a laminate having an effective layer portion and an outer layer portion.

[0112] (Step 3) Next, the laminated sheets are pressed in the lamination direction by means of isostatic pressing, thereby producing a laminated block.

[0113] (Step 4) Then, the stacked blocks are cut into chips by cutting them to a given size.

[0114] (Step 5)

[0115] Next, the resin component in the stacked small pieces is removed. The degreasing temperature used in step 5 to remove the resin component is, for example, above 600°C and below 1000°C.

[0116] (Step 6) Next, the laminate 12 is formed by firing the laminated sheets. The firing temperature of the laminated sheets depends on the materials of the ceramic layer and the internal electrode layer, which serve as the dielectric, but is preferably, for example, above 950°C and below 1400°C. Through this firing, the pattern of the internal electrode layer and the dielectric sheet are fired to form the internal electrode layer 16 and the ceramic layer 14.

[0117] (Step 7) Next, the base electrode layer 32 in the external electrode 30 is formed by applying the base electrode layer paste 71 to the first end face 12e and the second end face 12f of the laminate 12 and firing it.

[0118] Step 7 will be explained in more detail. Figure 6 In the diagram, (a) is a schematic diagram showing the form of the base electrode layer paste according to this embodiment, and (b) is a schematic diagram showing the form of the base electrode layer paste that is different from that of this embodiment. Figure 7 This is a schematic diagram showing the state in which the base electrode layer of this embodiment is applied to the laminate with paste.

[0119] (a) Preparation of paste for base electrode layer

[0120] First of all, Figure 6 The substrate electrode layer paste 71 according to this embodiment, shown in (a), will be described. The substrate electrode layer paste 71 is a paste used to form the substrate electrode layer 32. The substrate electrode layer paste 71 according to this embodiment includes a resin, a plurality of conductive metal powders (metal powders 72), a plurality of glass powders 73, and a solvent. The metal composition of the metal powders includes, for example, at least one selected from Cu, Cu alloys, Ni, Ag, Pd, Ag-Pd alloys, Au, etc.

[0121] As a resin, various known thermosetting resins such as acrylic resins, ethyl cellulose resins, epoxy resins, phenoxy resins, phenolic resins, polyurethane resins, and polyimide resins can be used.

[0122] In each metal powder 72, the major axis is designated as a1, and the minor axis as b1. The aspect ratio (b1 / a1) of the metal powder 72 is preferably, for example, 50:1 to 2:1, that is, preferably, for example, 2 or more and 50 or less. Furthermore, the approximate overall size of the plurality of metal powders 72 in the substrate electrode layer paste 71 is adjusted to the aforementioned aspect ratio (b1 / a1). That is, it is preferable that the particle size of the plurality of metal powders 72 is approximately uniform. The major axis a1 is preferably, for example, 1 μm or more and 10 μm or less, and the minor axis b1 is preferably, for example, 0.1 μm or more and 1 μm or less.

[0123] Furthermore, the content of metal powder 72 in the paste 71 for the base electrode layer is preferably, for example, 15% by volume or more and 35% by volume or less.

[0124] The glass powder 73 contains at least one element selected from, for example, B, Si, Ba, Mg, Al, Li, Zn, Ca, Bi, Ti, Sr, Ga, etc. The spherical equivalent diameter dg of the glass powder 73 is preferably, for example, 0.5 μm or more and 3.0 μm or less. In the paste 71 for the substrate electrode layer, the ratio of the content of glass powder 73 to the content of metal powder 72 and the content of glass powder 73 (content of glass powder 73 / (content of metal powder 72 + content of glass powder 73)) is preferably, for example, 10% by volume or more and 30% by volume or less. Furthermore, the glass softening point of the glass powder 73 is preferably, for example, 500°C or more and 700°C or less.

[0125] Solvents may include, for example, at least one of terpineol, dihydroterpineol, dihydroterpineol acetate, propylene glycol phenyl ether, benzyl alcohol, Texanol, and butyl carbitol acetate. The solvent type can be analyzed by measuring the generated gas using gas chromatography-mass spectrometry (GC-MS). GC-MS can be performed, for example, using a mass spectrometer manufactured by Agilent Technologies, Inc., 7890A / 5975C (heated to 500°C).

[0126] In addition, the paste 71 for the base electrode layer may also contain various additives such as dispersants, plasticizers, anti-settling agents, and thixotropic agents.

[0127] Then, the base electrode layer is manufactured by mixing the resin, metal powder 72, glass powder 73, and solvent in a given mixing ratio using paste 71, and by dispersing and kneading using a three-roll mill or the like.

[0128] In addition, Figure 6 In (b), to illustrate the difference in morphology from the substrate electrode layer paste 71 described in this embodiment, a morphology of substrate electrode layer paste 71a, different from that of this embodiment, is shown. Substrate electrode layer paste 71a, different from that of this embodiment, comprises resin, conductive metal powder (metal powder 72a), glass powder 73, and solvent. The composition of resin, metal powder 72a, glass powder 73, and solvent in substrate electrode layer paste 71a is the same as that in substrate electrode layer paste 71. However, the metal powder 72a exists in a mixture of flat and spherical forms. Furthermore, at least a portion of the flat metal powder 72a differs from the aspect ratio, etc., of the flat metal powder 72a in this embodiment. Substrate electrode layer paste 71a will be described later.

[0129] (b) Method for forming the substrate electrode layer

[0130] Next, the method for forming the base electrode layer 32 using the base electrode layer paste 71 described in this embodiment will be explained. In this embodiment, firstly, as Figure 7As shown, in the base electrode layer paste application process, base electrode layer paste 71 is applied to the laminate 12. Then, in the base electrode layer paste drying process, the base electrode layer paste 71 applied to the laminate 12 is dried to form a dried film. Then, in the dried film degreasing process, the resin components in the dried film are degreased to form a base electrode layer before sintering. Then, a sintering process for metal sintering is performed. The application process of base electrode layer paste, the drying process of base electrode layer paste, the degreasing process of dried film, and the sintering process for metal sintering will be described below.

[0131] (b1) Application process of paste for substrate electrode layer

[0132] In the application process of the base electrode layer paste, the area of ​​the laminate 12 to which the base electrode layer 32 is to be formed is immersed in the base electrode layer paste 71 in the paste tank 75, and then the laminate 12 is lifted. In this embodiment, the end faces (first end face 12e, second end face 12f) of the laminate 12 are immersed with the base electrode layer paste 71 facing them. In this embodiment, the area to which the base electrode layer 32 is to be formed is a portion of the first end face 12e, the second end face 12f, a portion of the first main face 12a, a portion of the second main face 12b, a portion of the first side face 12c, and a portion of the second side face 12d of the laminate 12.

[0133] When the laminate 12 is lifted, Marangoni convection occurs between the central portion and the ends of the substrate electrode layer paste 71 attached to the laminate 12 due to the temperature difference and solute concentration difference between the central portion and the ends. The central portion is the part of the substrate electrode layer paste 71 that is mainly applied to the center of the end faces (first end face 12e, second end face 12f) of the laminate 12. The ends are the parts of the substrate electrode layer paste 71 that are mainly applied to a portion of the first main surface 12a, a portion of the second main surface 12b, a portion of the first side surface 12c, and a portion of the second side surface 12d of the laminate 12. Due to the Marangoni convection generated between the central portion and the ends of the substrate electrode layer paste 71, and the stretching of the substrate electrode layer paste 71 in the direction of gravity, the thickness of the substrate electrode layer paste 71 is relatively large in the central portion. On the other hand, the thickness of the substrate electrode layer paste 71 is relatively small at the ends compared to the central portion. Furthermore, the thinner ends of the base electrode layer paste 71 are easier to dry compared to the thicker central portion. Additionally, the solutes in the base electrode layer paste 71 include metal powder 72, glass powder 73, and resin.

[0134] Furthermore, even at the ends, because the base electrode layer paste 71 is stretched in the direction of gravity, the thickness of the base electrode layer paste 71 gradually changes from a thin state to a thick state from the front end portion on the front end side to the portion continuous with the central portion. Moreover, the thin portion (front end portion) dries more easily than the thick portion (the portion continuous with the central portion). The front end portion is the portion that becomes the front end side portion 43 and corresponds to the front end side interface 53. In addition, the portion continuous with the central portion is the portion that becomes the base end side portion 42 and corresponds to the base end side interface 52.

[0135] Here, as previously described, the aspect ratio (b1 / a1) of the metal powder 72 within the base electrode layer paste 71 is, for example, 50:1 to 2:1, that is, for example, 2 or more and 50 or less. Such metal powder 72 has a flat and elongated shape. First, at the ends, because the metal powder 72 is stretched in the direction of gravity, it tends to be arranged in the long axis direction along the coating surfaces of the first main surface 12a, the second main surface 12b, the first side surface 12c, and the second side surface 12d. That is, as... Figure 6 As shown in (a), the metal powder 72 tends to be arranged along the laminate interface 51 in the long axis direction. In particular, as mentioned earlier, at the ends, the front portion (the portion that becomes the front side 43 and corresponds to the front side interface 53) has a thinner film thickness and dries more easily than the portion that is continuous with the central portion (the portion that becomes the base side 42 and corresponds to the base side interface 52), thus tending to suppress the flowability of the glass powder 73. Therefore, at the front portion, the metal powder 72 arranged along the coating surface in the long axis direction reduces the path for the glass powder 73 to flow to the front side interface 53, and the drying process proceeds faster, thereby suppressing the flowability of the glass powder 73 to the front side interface 53. Therefore, the amount of glass powder 73 at the front side interface 53 is less than that at the base side interface 52. In other words, only a portion of the glass powder 73 is present at the front side interface 53.

[0136] Furthermore, by adjusting the glass softening point of the glass powder 73 to, for example, 500°C or higher and 700°C or lower, and adjusting the content of the glass powder 73 in the base electrode layer paste 71, and by having the aforementioned aspect ratio of the metal powder 72, the flowability of the glass powder 73 at the front end portion can be suppressed. Therefore, only a portion of the glass powder 73 is present at the front end side interface 53. The content of the glass powder is, for example, 3% by volume or higher and 15% by volume or lower.

[0137] In addition, it can be assumed that by making the speed of lifting the laminate 12 impregnated with the base electrode layer paste 71 relatively slow, it is also easier to arrange the metal powder 72 in the front end portion so that the long axis direction is along the front end side interface 53.

[0138] On the other hand, in the portion continuous with the central portion (the portion that becomes the base-side portion 42 and corresponds to the base-side interface 52), the drying process is slower compared to the front portion (the portion that becomes the front-side portion 43 and corresponds to the front-side interface 53). Consequently, the metal powder 72 tends to be randomly oriented along the coating surface in the long-axis direction. Therefore, the glass powder 73 in the base electrode layer paste 71 has a longer flow path to the base-side interface 52 than to the front-side interface 53. Therefore, the amount of glass powder 73 at the base-side interface 52 tends to be higher than that at the front-side interface 53. In other words, the glass powder 73 is more continuously present at the base-side interface 52.

[0139] In addition, due to gravity, the metal powder 72 tends to be difficult to arrange along the diameter of the first end face 12a and the second end face 12b, including the central portion. Furthermore, the thickness of the substrate electrode layer paste 71 is relatively large in the central portion, and the drying process is slow. Therefore, the metal powder 72 tends to be oriented in a more random manner than or equal to the portion continuous with the central portion. Consequently, the glass powder 73 exists on the first end face 12e and the second end face 12f in a manner equal to or more continuous with the base end side interface 52.

[0140] (b2) Drying process of paste for substrate electrode layer

[0141] Next, a drying process is performed to evaporate the solvent in the base electrode layer paste 71 applied to the laminate 12. The drying temperature is, for example, 90°C or higher and 200°C or lower, and for example, 140°C. This allows the drying of the base electrode layer paste 71 to proceed. The film formed by drying the base electrode layer paste 71 is called a dried film. The drying process is preferably performed in a reducing atmosphere.

[0142] (b3) Degreasing process of the drying film

[0143] Next, a degreasing process is performed on the dried film. That is, the resin components in the dried film are degreased. As a result, the dried film becomes an unsintered base electrode layer. The degreasing temperature is, for example, a temperature between 120°C and 600°C, such as 350°C.

[0144] (b4) Firing process for metal sintering

[0145] Next, after a degreasing process following the drying of the film, the laminate 12 coated with the unsintered base electrode layer is fired in a given firing atmosphere. This forms... Figure 3 , Figure 4The sintered base electrode layer 32 is shown. That is, the base electrode layer is formed by sintering the metal powder 72 and glass powder 73 in paste 71 to form metal particles and glass 60, respectively.

[0146] As described above, after the application of the base electrode layer paste, the drying of the base electrode layer paste, and the degreasing of the dried film, only a portion of the glass powder 73 remains at the front-end interface 53. Therefore, at the front-end interface 53, the laminate 12 is partially bonded to the front-end side 43. Specifically, in the portion of the front-end interface 53 where the glass powder 73 is present, through firing, most or all of the laminate 12 in this portion is bonded to the front-end side 43 via the glass 60. At this time, it can be considered that due to the anchoring effect generated when the glass powder 73 melts during firing and enters the minute irregularities of the front-end interface 53, the front-end side 43 and the laminate 12 are further bonded via the glass 60. Furthermore, in this embodiment, in the portion of the front-end interface 53 where the metal powder 72 is present, through firing, the laminate 12 is further bonded to the front-end side 43 via metal particles, etc. This bonded portion becomes the front-end bonding interface 53a. On the other hand, in the portion of the front-side interface 53 where the glass powder 73 is absent, the laminate 12 is not bonded to the front-side portion 43. This unbonded portion becomes the front-side non-bonded interface 53b. Thus, the front-side interface 53 includes at least one front-side bonded interface 53a and at least one front-side non-bonded interface 53b.

[0147] Furthermore, as described above, after the application process of the base electrode layer paste, the drying process of the base electrode layer paste, and the degreasing process of the dried film, the glass powder 73 is present more continuously at the base-side interface 52 compared to the front-side interface 53. Therefore, at the base-side interface 52, the laminate 12 is bonded to the base-side portion 42 more continuously, mainly via the glass 60. At this time, it can be considered that due to the anchoring effect generated by the glass powder 73 melting during firing and entering the tiny unevenness of the base-side interface 52, the base-side portion 42 and the laminate 12 are further bonded via the glass 60. In addition, in this embodiment, the laminate 12 is further bonded to the base-side portion 42 via metal particles or the like. This bonded portion becomes the base-side bonding interface 52a.

[0148] To suppress the flowability of metal powder 72 and glass powder 73, it is preferable that the residual amount of resin and solvent in the unsintered substrate electrode layer is low during the sintering process for metal sintering. Therefore, the resin and solvent in the substrate electrode layer paste 71 are preferably resins and solvents that are thermally decomposable and easily degreased during the drying process of the substrate electrode layer paste, the degreasing process of the dried film, and the sintering process for metal sintering. Furthermore, the sintering conditions for the sintering process for metal sintering are preferably in the temperature range where the resin and solvent are thermally decomposed. Moreover, the sintering atmosphere of the metal powder 72 is preferably a reducing atmosphere, and an oxidizing atmosphere is preferred in order to vaporize the C (carbon) in the unsintered substrate electrode layer through sintering. In addition, the sintering temperature in the sintering process for metal sintering is preferably, for example, 700°C or higher and 900°C or lower.

[0149] in addition, Figure 6 The substrate electrode layer paste 71a shown in (b), which differs from this embodiment, comprises, as previously described, resin, conductive metal powder (metal powder 72a), glass powder 73, and solvent. The composition of the resin, metal powder 72a, glass powder 73, and solvent in the substrate electrode layer paste 71a is the same as in the substrate electrode layer paste 71. However, the metal powder 72a is a mixture of flat and spherical particles, with the proportion of spherical particles being greater than that of flat particles. Furthermore, the flat metal powder 72a contains metal powder with a different aspect ratio than the metal powder 72 described in this embodiment. In the metal powder 72a, the major axis is a2, and the minor axis is b2. The aspect ratio (b2 / a2) of at least a portion of the metal powder 72a is, for example, less than 2:1, that is, less than 2.

[0150] A base electrode layer paste 71a is added to the paste tank 75. After immersing the region of the laminate 12 to which the base electrode layer 32 is to be formed into the base electrode layer paste 71a in the paste tank 75, the laminate 12 is lifted. In the base electrode layer paste 71a, flattened and spherical objects are mixed in the metal powder 72a, and the metal powder has an aspect ratio (b2 / a2) of less than 2. Therefore, in the front end portion, even assuming that the long axis direction of the metal powder 72 is arranged along the coating surfaces (front end side interface 53 and base end side interface 52) of the first main surface 12a and the second main surface 12b, the first side surface 12c and the second side surface 12d, the glass powder 73 has more paths to flow toward the coating surface. Therefore, the glass powder 73 is more continuously present at the front end side interface 53 and the base end side interface 52. Figure 6 The density of the glass powder 73 disposed at the interface 51 of the laminate shown in (b) is similar to... Figure 6The density of the glass powder 73 disposed at the laminate interface 51, as shown in (a), becomes relatively high. As a result, after the metal sintering process, the laminate 12 is bonded to the winding electrode portion 41 via glass 60 or the like, covering approximately the entire front end interface 53 and the base end interface 52. Similarly, the laminate 12 is bonded to the end electrode portion 40 via glass 60 or the like, covering approximately the entire interface.

[0151] (Step 8) Next, a plating layer 34 is formed on the substrate electrode layer 32. The plating layer 34 is formed, for example, by sequentially stacking a Ni plating layer and a Sn plating layer on the substrate electrode layer 32.

[0152] The multilayer ceramic capacitor 10 can be manufactured using the manufacturing method described above. The substrate electrode layer paste 71 of the multilayer ceramic capacitor 10 has the characteristics described above. The characteristics of the substrate electrode layer paste 71 can be described, for example, as follows.

[0153] The paste 71 for the base electrode layer comprises resin, conductive metal powder (metal powder 72), glass powder 73, and solvent. The aspect ratio (b1 / a1) of the metal powder 72 is preferably 50:1 to 2:1, that is, 2 or more and 50 or less. Furthermore, the glass softening point of the glass powder 73 is preferably 500°C or more and 700°C or less. Additionally, the ratio of the content of glass powder 73 to (the content of metal powder 72 + the content of glass powder 73) is preferably 10% by volume or more and 30% by volume or less.

[0154] 3. Effects

[0155] The effects of the characteristic parts of this application are as follows. (1)

[0157] According to this embodiment, such as Figure 3As shown, the front end interface 53 of the lead-wound electrode portion 41 includes at least one front end bonding interface 53a and at least one front end non-bonding interface 53b. That is, the front end portion 43 of the lead-wound electrode portion 41 is bonded to the laminate 12 at at least one front end bonding interface 53a, and separates from the laminate 12 without being bonded to it at at least one front end non-bonding interface 53b. In this way, the front end portion 43 of the lead-wound electrode portion 41 is not bonded to the laminate 12 entirely at the front end interface 53 of the laminate 12, but only partially bonded to it. By configuring the front end portion 43 of the lead-wound electrode portion 41 in this way, when stress is applied to the laminated ceramic capacitor 10 or the lead-wound electrode portion 41, the front end portion 43 can easily peel slightly from the laminate 12 and is also easily bent slightly. This allows for stress dispersion, thus suppressing cracking in the ceramic layer 14 and even the internal electrode layer 16 of the laminate 12. Furthermore, since the front end 43 is partially bonded to the laminate 12, significant peeling or large defects in the front end 43 can be prevented. Therefore, misalignment during substrate mounting due to significant defects in the front end 43 or the inability to maintain the symmetry of the pair of external electrodes 30 can be suppressed.

[0158] Furthermore, the stress applied to the front end side 43 tends to be directed toward the base end side 42 of the winding electrode portion 41 rather than the laminate 12 side, corresponding to the direction in which the front end side 43 is peeled away from the laminate 12 and the direction of flexing.

[0159] Furthermore, since the front end 43 is partially bonded to and partially separated from the laminate 12, the separation distance SE between the front end 43 and the laminate interface 51 can be kept relatively small. Here, plating materials used for wet plating sometimes include dielectric material to ensure conductivity and prevent overlapping of multiple laminated ceramic capacitors. As mentioned above, by keeping the separation distance SE between the front end 43 and the laminate interface 51 relatively small, it is possible to prevent dielectric material from entering the separated portion of the front end 43 and the laminate interface 51 during the plating process. Therefore, it is possible to prevent significant damage to the front end 43, such as large-scale peeling or other severe damage, caused by the dielectric material colliding with the separated portion during the plating process.

[0160] Furthermore, various stresses, such as thermal stress, tensile stress, compressive stress, shear stress, bending stress, and residual stress, can be listed as stresses in the multilayer ceramic capacitor 10. These stresses may arise in the multilayer ceramic capacitor 10 during solder reflow when mounting the multilayer ceramic capacitor 10 to the mounting substrate, during handling of the multilayer ceramic capacitor 10 mounted on the mounting substrate, during operation, and during the sintering shrinkage of the external electrodes 30. Thermal stress, tensile stress, compressive stress, shear stress, and bending stress may be generated due to external forces applied to the multilayer ceramic capacitor 10. Additionally, residual stress is stress that exists within the multilayer ceramic capacitor 10 when no external force is applied.

[0161] As described above, according to this embodiment, a multilayer ceramic capacitor capable of mitigating stress can be provided.

[0162] Hereinafter, cross-sectional SEM images of the multilayer ceramic capacitor 10 of this embodiment manufactured by the above-described manufacturing method and cross-sectional SEM images of multilayer ceramic capacitors different from those of this embodiment will be described. Figure 8 The image is an SEM image obtained by taking a cross-sectional view of a portion of the front end side and the base end side of this embodiment before the coating is formed. Figure 9 This is an SEM image obtained by taking a cross-sectional view of a portion of the front end side and a portion of the base end side, different from the embodiment described in this example, before the coating layer is formed. Figure 8 , Figure 9 In the middle, it was filmed at 500x magnification.

[0163] exist Figure 8 In the cross-sectional SEM image of the multilayer ceramic capacitor 10 involved in this embodiment shown, it is also similar to... Figure 3 , Figure 4 Similarly, the lead-in electrode portion 41 of the base electrode layer 32 is formed in a state where multiple sintered glass domains 61 are dispersed in multiple sintered conductive particles (metal particles). The lead-in electrode portion 41 has a base end side portion 42 and a front end side portion 43. In the laminate interface 51, the front end side interface 53 of the laminate 12, which is opposite to the front end side portion 43, includes multiple front end side bonding interfaces 53a and multiple front end side non-bonding interfaces 53b in a mixed state. At each front end side bonding interface 53a, the laminate 12 is bonded to the front end side portion 43 mainly through each of the multiple glass domains 61, and also through metal particles, etc. At each front end side non-bonding interface 53b, a void portion 54 is provided, and the laminate 12 is not bonded to the front end side portion 43.

[0164] Therefore, the front end 43 is bonded to the laminate 12 at multiple front end bonding interfaces 53a, and separates from the laminate 12 at multiple front end non-bonding interfaces 53b. When stress is applied to the wound electrode portion 41, the front end 43 can easily peel slightly from the laminate 12, and also easily bends slightly. This disperses stress, thus suppressing cracking in the ceramic layer 14 and even the internal electrode layer 16 of the laminate 12. Furthermore, the stress applied to the front end 43 can be considered as, for example,... Figure 8 The middle arrow indicates that it is not facing the side of the laminate 12, but rather towards the base end side 42.

[0165] On the other hand, the base-side interface 52 generally includes multiple base-side bonding interfaces 52a, and the base-side portion 42 generally is bonded to the laminate 12 mainly via multiple glass domains 61, and also via metal particles, etc.

[0166] Next, in Figure 9 In the cross-sectional SEM image of the multilayer ceramic capacitor shown, which differs from this embodiment, the winding electrode portion 41 of the base electrode layer 32 is formed with multiple sintered glass domains 61 dispersed in sintered metal particles. The winding electrode portion 41 has a base end side portion 42 and a front end side portion 431. The multilayer 12 is bonded to the winding electrode portion 41 via glass 60 or metal particles, etc., throughout the multilayer interface 51a, including the front end side interface 531 and the base end side interface 52. Furthermore, the front end side interface 531 is the interface between the multilayer 12 and the front end side portion 431. Therefore, when stress is applied to the winding electrode portion 41, the front end side portion 431 is difficult to peel off from the multilayer 12 and is also difficult to bend. As a result, it is difficult to disperse stress through the front end side portion 431, and cracks are easily generated in the ceramic layer 14 and even the internal electrode layer 16 of the multilayer 12. In addition, it can be considered that the stress applied to the front end side portion 431 is, for example, Figure 9 The middle arrow indicates the direction from the front side 431 toward the interior of the laminate 12.

[0167] use Figure 10 right Figure 9 The analysis results of the multilayer ceramic capacitor using an EDX device, which differs from this embodiment, will be explained. Figure 10 In the middle, (a) is for Figure 9 (a) shows the detection results of Al using an EDX device on a portion from the front end side to the base end side, and (b) shows the detection results of Cu using an EDX device on the same portion as in (a). In the EDX device, line analysis was performed on the laminate interface 51a for a portion from the front end side 431 to the base end side 42. Figure 10 The detection results of Al or Cu in the sample are consistent with Figure 5 The detection results for Al or Cu in the sample differ. For example... Figure 10 As shown in (a), the Al content in the front end side 431 is the same as the Al content in the base end side 42. Al is one of the glass components of glass 60. Therefore, it can be concluded that the glass 60 content in the front end side 431 is the same as the glass 60 content in the base end side 42. Moreover, in the front end side 431, there is no... Figure 5 The cavity 54 is shown. Therefore, it can be seen that the area of ​​the bonding region (included in the front end interface 531) between the front end side 431 and the laminate 12 via the glass 60 is the same as the area of ​​the bonding region (included in the base end interface 52) between the base end side 42 and the laminate 12 via the glass 60. Furthermore, as... Figure 10 As shown in (b), a small amount of Cu is sporadically observed from the front end side 431 to the base end side 42. On the other hand, as Figure 10 As shown in (a), A1 exists approximately evenly from the front end side 431 to the base end side 42, indicating that the front end side 431 and the base end side 42 are bonded to the laminate 12 primarily via the glass 60 from the front end side interface 531 to the base end side interface 52. From the above, it can be seen that the bonding area (included in the front end side interface 531) of the front end side 431 and the laminate 12 via the glass 60 or metal particles is of the same extent as the bonding area (included in the base end side interface 52) of the base end side 42 and the laminate 12 via the glass 60 or metal particles. Furthermore, it can be seen that the front end side 431 and the base end side 42 are bonded to the laminate 12 almost entirely. (2)

[0169] In this embodiment, the amount of glass 60 present at the front end side interface 53 is less than the amount of glass 60 present at the base end side interface 52. In other words, the continuity of glass 60 at the front end side interface 53 is less than the continuity of glass 60 at the base end side interface 52. Here, the higher the amount of glass 60 in the winding electrode portion 41, the greater the bonding strength with the laminate 12. Therefore, according to the above structure, the bonding strength between the front end side portion 43 at the front end side interface 53 and the laminate 12 is less than the bonding strength between the base end side portion 42 at the base end side interface 52 and the laminate 12. Therefore, it is possible to provide a laminated ceramic capacitor 10 that can alleviate stress through the front end side portion 43 when stress is applied to the laminated ceramic capacitor 10. (3)

[0171] In this embodiment, the front end side 43 is located at the center position P of the laminate interface 51. CThe position is closer to the front end. This front end portion 43 helps suppress stress from moving inwards towards the interior of the laminate 12. Furthermore, by keeping the proportion of the front end portion 43 within the winding electrode portion 41 relatively small, damage to the external electrode 30 is less likely to occur even if the front end portion 43 peels off or is damaged due to stress. For example, suppose the front end portion 43 extends from the front end of the laminate interface 51 to a position P closer to the center. C It is closer to the base end side. In this case, the front end side 43 occupies a large proportion in the winding electrode part 41, and the damage to the external electrode 30 is more likely to increase if the front end side 43 peels off or is damaged due to stress. (4)

[0173] In this embodiment, the distance of the front-side bonding interface 53a / the distance of the front-side interface 53 is smaller than the distance of the base-side bonding interface 52a / the distance of the base-side interface 52. Therefore, when stress is applied to the wound electrode portion 41, the front-side portion 43 can be easily peeled slightly from the laminate 12, and it can also be easily bent slightly. This disperses stress, thus suppressing cracking in the ceramic layer 14 and even the inner electrode layer 16 of the laminate 12. Furthermore, it prevents the distance of the front-side bonding interface 53a from becoming too large, and suppresses damage to the outer electrode 30 due to significant peeling of the easily peelable front-side portion 43. Furthermore, by setting the distance of the front-side bonding interface 53a / the distance of the front-side interface 53 to, for example, 10% or more and 50% or less, and setting the distance of the front-side non-bonded interface 53b / the distance of the front-side interface 53 to, for example, 5% or more and 50% or less, the same effects as described above can be further obtained. (5)

[0175] In this embodiment, the distance between the front-side adhesive interface 53a and the laminate interface 51 can be smaller than the distance between the base-side adhesive interface 52a and the laminate interface 51. In this case, cracking in the ceramic layer 14 and even the internal electrode layer 16 of the laminate 12 can be suppressed in the same way as described above. Furthermore, it is possible to prevent the distance of the front-side adhesive interface 53a from becoming too large and to prevent the easily peeled front-side portion 43 from peeling off significantly and damaging the external electrode 30. In addition, by setting the distance between the front-side non-adhesive interface 53b and the laminate interface 51 to, for example, 1.5% or more and 15% or less, the same effect as described above can be further obtained. (6)

[0177] In this embodiment, the total distance along the laminate interface 51 of at least one front-end side bonding interface 53a and at least one base-end side bonding interface 52a is, for example, more than 40% and less than 70% of the distance of the laminate interface 51. Therefore, while suppressing large-scale peeling and large-scale defects of the front-end side 43, the bonding strength between the entire winding electrode portion 41 and the laminate 12 can be adjusted to a level that can disperse stress. (7)

[0179] In this embodiment, the distance between each glass domain 61 and the laminate interface 51 is, for example, 0.1% or more and 10% or less relative to the distance between the laminate interface 51 and the laminate. Furthermore, the thickness T2 of each glass domain 61 is, for example, 0.1% or more and 20% or less relative to the thickness T1 of the winding electrode portion 41. By setting each glass domain 61 as described above, the adhesion strength between the winding electrode portion 41 and the laminate 12 can be appropriately adjusted.

[0180] 4. Experimental Example

[0181] Next, the experimental examples will be described. As experimental examples, Example 1, Comparative Examples 1 and 2 were conducted. Figure 11 This is a partially enlarged cross-sectional view of the substrate electrode layer and the laminate in the case of the multilayer ceramic capacitor of Comparative Example 1, where the plating layer is omitted. Figure 12 This is a partially enlarged cross-sectional view of the base electrode layer and the laminate in the case of the multilayer ceramic capacitor of Comparative Example 2, where the plating layer is omitted.

[0182] (1) Sample

[0183] The following describes each sample from Example 1, Comparative Examples 1 and 2.

[0184] (Sample from Example 1)

[0185] As the basic sample for Example 1, the following were prepared Figure 3 , Figure 4 The multilayer ceramic capacitor shown in this embodiment is an example of such a capacitor. Figure 3 , Figure 4 As shown, the winding electrode portion 41 of the basic sample of Example 1 has a base end side portion 42 and a front end side portion 43. The L dimension of the multilayer ceramic capacitor of Example 1 is 1.60 mm, the W dimension is 0.791 mm, and the T dimension is 0.791 mm. The length e of the e dimension is e = 0.40 mm. The G dimension between the front end side portion 43 on the first end face 12e side and the front end side portion 43 on the second end face 12f side is a distance G = 0.80 mm. Figure 1The distance L2 of the front end interface 53 is 0.10 mm. The distance L1 of the laminate interface 51 is 0.34 mm. In addition, as other forms of the basic sample of Example 1, several other forms of samples with distances of more than 0.08 mm and less than 0.09 mm were prepared.

[0186] (Sample of Comparative Example 1)

[0187] As a sample for Comparative Example 1, the following were prepared: Figure 11 The multilayer ceramic capacitor shown. The sample of Comparative Example 1 is... Figure 9 The same sample. For example... Figure 11 As shown, the winding electrode portion 41 of the sample in Comparative Example 1 has a base end side portion 42 and a front end side portion 431. Unlike the front end side portion 43 of Example 1, the front end side portion 431 of Comparative Example 1... Figure 9 , Figure 11 The front-end side non-bonded interface is not shown. Therefore, the laminate 12 and the winding electrode portion 41 are bonded via glass 60 throughout the substantially entire length of the laminate interface 51a (base-end side interface 52 and front-end side interface 531). In other respects, it is the same as the basic sample of Example 1.

[0188] (Sample of Comparative Example 2)

[0189] As a sample for Comparative Example 2, the following were prepared: Figure 12 The multilayer ceramic capacitor shown is an example of a multilayer ceramic capacitor. In Comparative Example 2, a separation portion 57 is provided. The separation portion 57 is continuously provided on the front end side along with the base end side 42 of the winding electrode portion 41. The separation portion 57 is formed relative to the surface of the multilayer body 12 (in...). Figure 12 In the example, the separation distance S of the first main surface 12a) is S = 3.0 mm. The laminate 12 and the base-end side 42 are bonded together via glass 60, covering approximately the entire base-end side interface 52 (laminate interface 51b). On the other hand, at the separation portion 57, the laminate 12 and the winding electrode portion 41 are completely separated and not bonded. Other aspects are the same as the basic sample of Example 1.

[0190] (2) Evaluation of stress in the specimen

[0191] For Example 1, Comparative Example 1, and Comparative Example 2, external forces were applied to each sample using analytical simulation software, and the resulting stresses were compared. The conditions for the external forces are as follows. A multilayer ceramic capacitor model with solder mounting was used, with the second main surface 12b of Example 1, Comparative Example 1, and Comparative Example 2 facing one side of a mounting substrate with a thickness of 1.6 mm. Next, with the center of the other side without the multilayer ceramic capacitor mounted as the fixed end, a load was applied to both ends of the substrate on the other side to bend the mounting substrate. The bending amount of the mounting substrate was set to 1.0 mm.

[0192] (3) Results

[0193] The stress evaluation results are shown in Figure 13 .exist Figure 13 In the diagram, (a) is the stress distribution diagram in the basic sample of Example 1, (b) is the stress distribution diagram in the sample of Comparative Example 1, and (c) is the stress distribution diagram in the sample of Comparative Example 2.

[0194] like Figure 13 As shown in (b), in Figure 11 In the sample of Comparative Example 1 shown, strong stress was locally generated toward the interior of the laminate 12 in a portion of the front end side 431 of the first base electrode layer 32a (the portion surrounded by the circle with a single-dotted line). Similarly, strong stress toward the interior of the laminate 12 was locally generated in the front end side of the second base electrode layer 32b.

[0195] like Figure 13 As shown in (c), in Figure 12 In the sample of Comparative Example 2 shown, strong stress (the part surrounded by the circle with a single-dot dashed line) was locally generated toward the interior of the laminate 12, at least near the junction of the separation portion 57 of the first base electrode layer 32a and the base end side portion 42.

[0196] like Figure 13 As shown in (a), in Figure 3 , Figure 4 In the basic sample of Example 1 shown, no strong local stress was generated at the laminate interface 51 between the first base electrode layer 32a and the laminate 12; the stress was dispersed. Similarly, no strong local stress was generated at the laminate interface 51 between the second base electrode layer 32b and the laminate 12; the stress was dispersed. That is, in either the first base electrode layer 32a or the second base electrode layer 32b of the basic sample of Example 1, the stress at the laminate interface 51 was suppressed, unlike that of the sample of Comparative Example 1. Figure 13 (b) and the sample of Comparative Example 2 ( Figure 13 As shown in (c), strong stress is locally generated towards the interior of the laminate 12. Therefore, it can be seen that by partially bonding the front end side 43 to the laminate 12, the stress applied to the laminated ceramic capacitor 10 can be mitigated.

[0197] In the multilayer ceramic capacitor of Example 1, the following parameters were obtained.

[0198] (a) It is known that by setting the front-end interface 53 to a distance L2 (0.08 mm or more and 0.10 mm or less) relative to the distance L1 (0.34 mm) of the laminate interface 51, stress can be mitigated. In this case, the distance L2 of the front-end interface 53 relative to the distance L1 of the laminate interface 51 is 23.5% or more and 29.4% or less.

[0199] (b) In the winding electrode section 41, the content of glass domain 61 (glass 60) is 5% by weight or more and 20% by weight or less relative to the total content of glass domain 61 (glass 60), metal particles and various additives.

[0200] (c) The total distance between the multiple front-side bonding interfaces 53a and the distance L2 of the front-side interface 53 is more than 10% and less than 50%. The total distance between the front-side bonding interfaces 53a and the distance L1 of the laminate interface 51 is more than 2% and less than 15%.

[0201] (d) The separation distance SE between the laminate 12 and the front end side 43 is more than 2 μm and less than 10 μm.

[0202] (e) The total distance of the multiple front-side non-adhesive interfaces 53b relative to the distance L2 of the front-side interface 53 is more than 5% and less than 50%. The total distance of the multiple front-side non-adhesive interfaces 53b relative to the distance L1 of the laminate interface 51 is more than 1.5% and less than 15%.

[0203] (f) The total distance of the multiple base-side bonding interfaces 52a relative to the distance L6 of the base-side interface 52 is more than 40% and less than 80%. The total distance of the multiple base-side bonding interfaces 52a relative to the distance L1 of the laminate interface 51 is more than 35% and less than 75%.

[0204] (g) The total distance between the multiple front-end bonding interfaces 53a and the multiple base-end bonding interfaces 52a is more than 40% and less than 70% relative to the distance L1 of the laminate interface 51.

[0205] (h) Thickness T2 is more than 0.5% and less than 17% relative to thickness T1.

[0206] (i) The distance at which a glass domain 61 is connected along the laminate interface 51 is, for example, more than 1.0% and less than 6.0% of the distance L1 of the laminate interface 51.

[0207] Furthermore, as described above, the embodiments of the present invention have been disclosed in the foregoing description, but the present invention is not limited thereto.

[0208] That is, without departing from the technical concept and scope of the present invention, various changes can be made to the above-described embodiments regarding the mechanism, shape, material, quantity, position or configuration, etc., and these are all included in the present invention.

[0209] <Other variations>

[0210] (1) Regarding the external electrodes

[0211] In the above embodiment, the external electrode 30 includes a base electrode layer 32 and a plating layer 34 on the base electrode layer 32. However, the structure of the external electrode 30 is not limited to this; the external electrode may also not include the plating layer 34, but only the base electrode layer 32. Except for the absence of the plating layer 34, it is the same as the above embodiment.

[0212] (2) Regarding the bonding interface

[0213] In the above embodiment, at the front-end bonding interface 53a, the laminate 12 is bonded to the front-end side 43 not only via glass domains 61, but also via metal particles, etc. Therefore, the distance from the front-end bonding interface 53a is from position P. E To position P G The distance L5 + distance L3a, and from position P H To the front end P B The total distance of the front-side bonding interface 53a is (distance L5 + distance L3a + distance L3b). However, the front-side bonding interface 53a may also be an interface in which the laminate 12 is bonded to the front-side portion 43 via glass domains 61 without the presence of metal particles or the like. In this case, the distance of the front-side bonding interface 53a is the total distance of the distances L3a and L3b (distance L3a + distance L3b).

[0214] Similarly, in the above embodiment, at the base-side bonding interface 52a, the laminate 12 is bonded to the base-side portion 42 via glass domains 61 and metal particles. Therefore, the distance from the base-side bonding interface 52a is from the base-end position P. A To terminal location P D The total distance is (distance L7a to distance L7e + distance L8a to distance L8f). However, the base-side bonding interface 52a may also be an interface in which the laminate 12 is bonded to the base-side portion 42 via glass domains 61 without the presence of metal particles or the like. In this case, the distance of the base-side bonding interface 52a is the total distance from distance L7a to distance L7e.

[0215] <1>

[0216] A multilayer ceramic capacitor, comprising:

[0217] A laminate comprising multiple stacked ceramic layers and multiple internal electrode layers, and including a first main surface and a second main surface opposite each other in the height direction, a first side surface and a second side surface opposite each other in the width direction orthogonal to the height direction, and a first end surface and a second end surface opposite each other in the length direction orthogonal to the height direction and the width direction; and

[0218] The external electrode is connected to the internal electrode layer on the first end face and the second end face.

[0219] in,

[0220] The external electrode includes a base electrode layer formed on the laminate.

[0221] The substrate electrode layer comprises a conductive metal and glass.

[0222] The substrate electrode layer has: an end face electrode portion formed on the laminated body on the first end face and the second end face; and a winding electrode portion continuous with the end face electrode portion, formed on the laminated body by winding from the first end face and the second end face to at least one of the first main face, the second main face, the first side face, and the second side face.

[0223] The winding electrode section has:

[0224] The base end side is located on the first end face and the second end face side; and

[0225] The front end side is continuous with the base end side and is located on the front end side away from the first end face and the second end face relative to the base end side.

[0226] The front end side interface of the laminate that is opposite to the front end side in the laminate interface opposite to the winding electrode portion includes at least one front end side bonding interface where the laminate is bonded to the front end side, and at least one front end side non-bonding interface where the laminate is not bonded to the front end side.

[0227] <2>

[0228] According to the multilayer ceramic capacitor described in <1>, among which,

[0229] The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface.

[0230] In a cross-sectional view orthogonal to the first end face and the second end face, the amount of glass present at the front end side interface is less than the amount of glass present at the base end side interface.

[0231] <3>

[0232] According to the multilayer ceramic capacitor described in <1> or <2>, wherein,

[0233] The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface.

[0234] In a cross-sectional view orthogonal to the first end face and the second end face, the continuity of the glass in the front end side interface is less than that of the glass in the base end side interface.

[0235] <4>

[0236] According to any one of <1> to <3>, the multilayer ceramic capacitor, wherein,

[0237] In a cross-sectional view orthogonal to the first end face and the second end face, the front end portion is located in the interface of the laminate at a position closer to the front end than the center position between the base position closest to the first end face and the second end face and the front end position furthest from the first end face and the second end face.

[0238] <5>

[0239] According to any one of <1> to <4>, the multilayer ceramic capacitor described therein,

[0240] The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface.

[0241] The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass.

[0242] In a cross-sectional view orthogonal to the first end face and the second end face, the proportion of the distance of the at least one front end side bonding interface in the distance of the front end side interface is smaller than the proportion of the distance of the at least one base end side bonding interface in the distance of the base end side interface.

[0243] <6>

[0244] According to any one of <1> to <5>, the multilayer ceramic capacitor, wherein,

[0245] The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface.

[0246] The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass.

[0247] In a cross-sectional view orthogonal to the first end face and the second end face, the proportion of the distance of the at least one front end side bonding interface in the distance of the laminate interface is smaller than the proportion of the distance of the at least one base end side bonding interface in the distance of the laminate interface.

[0248] <7>

[0249] According to any one of <1> to <6>, the multilayer ceramic capacitor described therein,

[0250] In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side bonding interface and the distance between the front-end side interface is more than 10% and less than 50%.

[0251] <8>

[0252] According to any one of <1> to <7>, the multilayer ceramic capacitor, wherein,

[0253] In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side bonding interface and the distance between the laminate interface and the front-end side bonding interface is more than 2% and less than 15%.

[0254] <9>

[0255] According to any one of <1> to <8>, the multilayer ceramic capacitor described therein,

[0256] In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side non-bonded interface and the distance between the front-end side interface and the front-end side interface is more than 5% and less than 50%.

[0257] <10>

[0258] According to any one of <1> to <9>, the multilayer ceramic capacitor, wherein,

[0259] In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side non-bonded interface and the distance between the laminate interface and the non-bonded interface is more than 1.5% and less than 15%.

[0260] <11>

[0261] According to any one of <1> to <10>, the multilayer ceramic capacitor, wherein,

[0262] The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface.

[0263] The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass.

[0264] In a cross-sectional view orthogonal to the first end face and the second end face, the total distance between the at least one front end side bonding interface and the at least one base end side bonding interface is more than 40% and less than 70% relative to the distance between the laminate interfaces.

[0265] <12>

[0266] According to any one of <1> to <11>, the multilayer ceramic capacitor described therein,

[0267] The glass comprises multiple glass domains, and the distance between each glass domain and the interface of the laminate is greater than 0.1% and less than 10% relative to the distance of the interface of the laminate.

[0268] <13>

[0269] According to any one of <1> to <12>, the multilayer ceramic capacitor, wherein,

[0270] The glass comprises a plurality of glass domains, and the thickness of each glass domain in the direction orthogonal to the interface of the laminate is 0.1% or more and 20% or less relative to the thickness of the winding electrode portion in the direction orthogonal to the interface of the laminate.

[0271] <14>

[0272] According to any one of <1> to <13>, the multilayer ceramic capacitor, wherein,

[0273] The external electrode includes a plating layer disposed on the substrate electrode layer.

[0274] <15>

[0275] A multilayer ceramic capacitor, comprising:

[0276] A laminate comprising multiple stacked ceramic layers and multiple internal electrode layers, and including a first main surface and a second main surface opposite each other in the height direction, a first side surface and a second side surface opposite each other in the width direction orthogonal to the height direction, and a first end surface and a second end surface opposite each other in the length direction orthogonal to the height direction and the width direction; and

[0277] The external electrode is connected to the internal electrode layer on the first end face and the second end face.

[0278] in,

[0279] The external electrode includes a base electrode layer formed on the laminate.

[0280] The substrate electrode layer comprises a conductive metal and glass.

[0281] The substrate electrode layer has: an end face electrode portion formed on the laminated body on the first end face and the second end face; and a winding electrode portion continuous with the end face electrode portion, formed on the laminated body by winding from the first end face and the second end face to at least one of the first main face, the second main face, the first side face, and the second side face.

[0282] In the winding electrode section, when the position closest to the first end face and the second end face is designated as the base position, the position furthest from the first end face and the second end face is designated as the front position, and the position between the base position and the front position is designated as the center position, the bonding area between the winding electrode section and the laminate is smaller from the center position to the front position compared to the position between the base position and the center position.

[0283] Explanation of reference numerals in the attached figures

[0284] 10: Multilayer ceramic capacitors

[0285] 12: Layered bodies

[0286] 12a, 12b: 1st and 2nd main surface

[0287] 12c, 12d: First and second side views

[0288] 12e, 12f: First and second end faces

[0289] 14: Ceramic layer

[0290] 15a: Effective layer

[0291] 15b, 15c: First and second outer layers

[0292] 16: Internal electrode layer

[0293] 16a, 16b: First and second internal electrode layers

[0294] 30: External electrode

[0295] 30a, 30b: First and second external electrodes

[0296] 32: Substrate electrode layer

[0297] 32a, 32b: First and second base electrode layers

[0298] 34: Plating layer

[0299] 34a, 34b: First and second plating layers

[0300] 40: End face electrode section

[0301] 41: Lead-winding electrode section

[0302] 42: Basement side

[0303] 43: Front side

[0304] 51: Layered interface

[0305] 51a: Interface of a stacked body

[0306] 51b: Layered interface

[0307] 52: Base-side interface

[0308] 52a: Base end side bonding interface

[0309] 53: Front-end interface

[0310] 53a: Front-side adhesive interface

[0311] 53b: Front-side non-adhesive interface

[0312] 54: Hollow Section

[0313] 57: Separated Part

[0314] 60: Glass

[0315] 61: Glass domain

[0316] 71: Paste for base electrode layer

[0317] 71a: Paste for base electrode layer

[0318] 72: Metal powder

[0319] 72a: Metal powder

[0320] 73: Glass powder

[0321] 75: Paste trough

[0322] 431: Front Side

[0323] 531: Front-end interface

[0324] a1: Major axis (major axis of the metal powder)

[0325] b1: Minor axis (minor axis of metal powder)

[0326] a2: Major axis (the major axis of traditional metal powders)

[0327] b2: Short axis (the short axis of traditional metal powders)

[0328] dg: Equivalent diameter of sphere (equivalent diameter of glass powder sphere)

[0329] P A : Base position

[0330] P B Front-end position

[0331] P C Central position

[0332] P D Terminal location

[0333] P E ~P R :Location

[0334] L1~L8: Distance

[0335] S: Separation distance

[0336] SE: Separation distance

[0337] T1, T2: Thickness

[0338] x: Height direction

[0339] y: width direction

[0340] z: Length direction.

Claims

1. A multilayer ceramic capacitor, comprising: A laminate comprising multiple stacked ceramic layers and multiple internal electrode layers, and including a first main surface and a second main surface opposite each other in the height direction, a first side surface and a second side surface opposite each other in the width direction orthogonal to the height direction, and a first end surface and a second end surface opposite each other in the length direction orthogonal to the height direction and the width direction; and The external electrode is connected to the internal electrode layer on the first end face and the second end face. in, The external electrode includes a base electrode layer formed on the laminate. The substrate electrode layer comprises a conductive metal and glass. The substrate electrode layer has: an end face electrode portion formed on the laminated body on the first end face and the second end face; and a winding electrode portion continuous with the end face electrode portion, formed on the laminated body by winding from the first end face and the second end face to at least one of the first main face, the second main face, the first side face, and the second side face. The winding electrode section has: The base end side is located on the first end face and the second end face side; and The front end side is continuous with the base end side and is located on the front end side away from the first end face and the second end face relative to the base end side. The front end side interface of the laminate that is opposite to the front end side in the laminate interface opposite to the winding electrode portion includes at least one front end side bonding interface where the laminate is bonded to the front end side, and at least one front end side non-bonding interface where the laminate is not bonded to the front end side.

2. The multilayer ceramic capacitor according to claim 1, wherein, The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface. In a cross-sectional view orthogonal to the first end face and the second end face, the amount of glass present at the front end side interface is less than the amount of glass present at the base end side interface.

3. The multilayer ceramic capacitor according to claim 1 or claim 2, wherein, The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface. In a cross-sectional view orthogonal to the first end face and the second end face, the continuity of the glass in the front end side interface is less than that of the glass in the base end side interface.

4. The multilayer ceramic capacitor according to any one of claims 1 to 3, wherein, In a cross-sectional view orthogonal to the first end face and the second end face, the front end portion is located in the interface of the laminate at a position closer to the front end than the center position between the base position closest to the first end face and the second end face and the front end position furthest from the first end face and the second end face.

5. The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein, The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface. The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass. In a cross-sectional view orthogonal to the first end face and the second end face, the proportion of the distance of the at least one front end side bonding interface in the distance of the front end side interface is smaller than the proportion of the distance of the at least one base end side bonding interface in the distance of the base end side interface.

6. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein, The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface. The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass. In a cross-sectional view orthogonal to the first end face and the second end face, the proportion of the distance of the at least one front end side bonding interface in the distance of the laminate interface is smaller than the proportion of the distance of the at least one base end side bonding interface in the distance of the laminate interface.

7. The multilayer ceramic capacitor according to any one of claims 1 to 6, wherein, In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side bonding interface and the distance between the front-end side interface is more than 10% and less than 50%.

8. The multilayer ceramic capacitor according to any one of claims 1 to 7, wherein, In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side bonding interface and the distance between the laminate interface and the front-end side bonding interface is more than 2% and less than 15%.

9. The multilayer ceramic capacitor according to any one of claims 1 to 8, wherein, In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side non-bonded interface and the distance between the front-end side interface and the front-end side interface is more than 5% and less than 50%.

10. The multilayer ceramic capacitor according to any one of claims 1 to 9, wherein, In a cross-sectional view orthogonal to the first end face and the second end face, the distance between the at least one front-end side non-bonded interface and the distance between the laminate interface and the non-bonded interface is more than 1.5% and less than 15%.

11. The multilayer ceramic capacitor according to any one of claims 1 to 10, wherein, The interface of the laminate that is opposite to the base end side in the laminate interface is the base end side interface. The base-side interface includes at least one base-side bonding interface in which the laminate is bonded to the base-side portion primarily via the glass. In a cross-sectional view orthogonal to the first end face and the second end face, the total distance between the at least one front end side bonding interface and the at least one base end side bonding interface is more than 40% and less than 70% relative to the distance between the laminate interfaces.

12. The multilayer ceramic capacitor according to any one of claims 1 to 11, wherein, The glass comprises multiple glass domains, and the distance between each glass domain and the interface of the laminate is greater than 0.1% and less than 10% relative to the distance of the interface of the laminate.

13. The multilayer ceramic capacitor according to any one of claims 1 to 12, wherein, The glass comprises a plurality of glass domains, and the thickness of each glass domain in the direction orthogonal to the interface of the laminate is 0.1% or more and 20% or less relative to the thickness of the winding electrode portion in the direction orthogonal to the interface of the laminate.

14. The multilayer ceramic capacitor according to any one of claims 1 to 13, wherein, The external electrode includes a plating layer disposed on the substrate electrode layer.

15. A multilayer ceramic capacitor, comprising: A laminate comprising multiple stacked ceramic layers and multiple internal electrode layers, and including a first main surface and a second main surface opposite each other in the height direction, a first side surface and a second side surface opposite each other in the width direction orthogonal to the height direction, and a first end surface and a second end surface opposite each other in the length direction orthogonal to the height direction and the width direction; and The external electrode is connected to the internal electrode layer on the first end face and the second end face. in, The external electrode includes a base electrode layer formed on the laminate. The substrate electrode layer comprises a conductive metal and glass. The substrate electrode layer has: an end face electrode portion formed on the laminated body on the first end face and the second end face; and a winding electrode portion continuous with the end face electrode portion, formed on the laminated body by winding from the first end face and the second end face to at least one of the first main face, the second main face, the first side face, and the second side face. In the winding electrode section, when the position closest to the first end face and the second end face is designated as the base position, the position furthest from the first end face and the second end face is designated as the front position, and the position between the base position and the front position is designated as the center position, the bonding area between the winding electrode section and the laminate is smaller from the center position to the front position compared to the position between the base position and the center position.

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