Battery package and battery module

Abstract

A battery package has a wiring substrate having a first recess, a cover having a second recess, and a seal. The wiring substrate includes a first base portion having a bottom surface of the first recess, and a first frame portion located at an outer edge of the bottom surface. The cover includes a second base portion having a bottom surface of the second recess, and a second frame portion located at an outer edge of the bottom surface. In a longitudinal sectional view of the battery package, a value obtained by dividing a height of an accommodation space of a battery by a wall thickness of the battery package is 3 or more.

Description

Technical Field

[0001] This disclosure relates to battery packaging components and battery modules. Background Technology

[0002] Patent Document 1 discloses a double-layer capacitor with a housing for battery elements. The housing for the battery elements includes a concave container and a sealing plate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2001-216952 Summary of the Invention

[0006] One aspect of this disclosure is a battery package for accommodating a battery, the battery package comprising: a wiring substrate having a first recess forming part of an accommodating space for accommodating the battery; a cover having a second recess forming another part of the accommodating space; and a seal for engaging the wiring substrate and the cover, the wiring substrate having an insulating substrate comprising: a first base having a first surface serving as the bottom surface of the first recess; and a first frame portion located at the outer edge of the first surface and defining the inner wall of the first recess; the cover comprising: a second base having a third surface serving as the bottom surface of the second recess; and a second frame portion located at the outer edge of the third surface and defining the inner wall of the second recess, wherein, in a longitudinal cross-sectional view, the value obtained by dividing the height of the accommodating space by the wall thickness of the battery package is 3 or more.

[0007] One aspect of the battery module disclosed herein includes: a battery package having a plurality of connecting electrodes on the inner surface of the first recess; a battery having a positive electrode and a negative electrode; and a metal sintering member for joining the positive and negative electrodes of the battery to the corresponding connecting electrodes.

[0008] One aspect of the battery module disclosed herein includes: a battery package having a plurality of connecting electrodes on the inner surface of the first recess; a battery having a positive electrode and a negative electrode; and an elastic member for pressing the positive and negative electrodes of the battery toward the corresponding connecting electrodes. Attached Figure Description

[0009] Figure 1 This is an exploded perspective view of the battery package according to Embodiment 1 of this disclosure.

[0010] Figure 2 This is a cross-sectional view of the battery module according to Embodiment 1 of this disclosure.

[0011] Figure 3 yes Figure 1Sectional view along line III-III.

[0012] Figure 4 This is a top view of the wiring substrate of the aforementioned battery package.

[0013] Figure 5 This is a bottom view of the aforementioned wiring substrate.

[0014] Figure 6 yes Figure 2 A magnified view of region R in the image.

[0015] Figure 7 This is a cross-sectional view of the battery module according to Embodiment 2 of this disclosure.

[0016] Figure 8 This is a cross-sectional view of the battery module according to Embodiment 3 of this disclosure.

[0017] Figure 9 This is a cross-sectional view of the battery module according to Embodiment 4 of this disclosure.

[0018] Figure 10 This is a cross-sectional view of the battery module according to Embodiment 5 of this disclosure.

[0019] Figure 11 This is a cross-sectional view of the battery module according to Embodiment 6 of this disclosure. Detailed Implementation

[0020] In battery modules, the goal is to increase energy density.

[0021] According to one method of this disclosure, the energy density of a battery module can be increased.

[0022] [Implementation Method 1]

[0023] Hereinafter, a battery package and battery module according to an embodiment of the present disclosure will be described in detail using the accompanying drawings. However, for ease of explanation, the drawings referred to below sometimes only show simplified structural members necessary for illustrating the embodiment. Therefore, the battery package and battery module of the embodiment may have any structural members not shown in the referenced drawings. In addition, it should be noted that the dimensions of the structural members in the drawings do not faithfully represent the actual dimensions of the structural members or the dimensional proportions of each member.

[0024] The distinction between "top" and "bottom" in the following description is for convenience and does not limit the actual use of battery packages and battery modules. In this specification, the side of the wiring substrate on which the battery is mounted is defined as the top surface. Furthermore, in the accompanying drawings, the Z-axis is defined as the thickness direction of the battery package and battery module, and the positive Z-axis direction is defined as "upper".

[0025] Reference Figures 1 to 5The battery package 100 and battery module 200 of Embodiment 1 will be described. Figure 1 This is an exploded perspective view of the battery package 100. Figure 2 This is a cross-sectional view of the battery module 200 according to Embodiment 1. Figure 3 yes Figure 1 Sectional view along line III-III. Figure 4 This is a top view of the wiring substrate 2 of the battery package 100. Figure 5 This is a bottom view of wiring substrate 2.

[0026] The battery package 100 is a package for housing a battery. In this embodiment, a battery 7 is disclosed in which the battery mounted in the battery package 100 has a positive electrode 701 and a negative electrode 702 on the same side. In the following description, the positive electrode 701 and the negative electrode 702 are sometimes collectively referred to as electrodes.

[0027] Battery 7 can be a chip-type solid-state battery or a capacitor (capacitor) used as an energy storage device. The capacitor can be chip-type, such as a multi-layer ceramic capacitor (MLCC), a tantalum capacitor, or a film capacitor.

[0028] like Figure 2 As shown, the battery module 200 includes a battery package 100 and a battery 7 housed within the battery package 100. The battery package 100 includes a wiring substrate 2, a cover 3, and a sealing member 4 that joins the wiring substrate 2 and the cover 3. The top view shape of the battery package 100 may be, for example, rectangular. The battery 7 can be connected to the wiring substrate 2 via a connector 5. In this disclosure, the rectangle is not limited to a strictly rectangular shape; for example, it may be a shape with cutouts at the corners and / or sides, or a shape with curved corners, as long as the shape can be visually recognized as rectangular overall.

[0029] (Wiring substrate)

[0030] The wiring substrate 2 has a first recess 21 that forms part of the receiving space S that houses the battery 7. The wiring substrate 2 may also be a substrate having a connecting electrode 24 for connecting to the electrode of the battery 7, an external electrode 25 for connecting to the electrode of the mounting substrate, and internal wiring for connecting the connecting electrode 24 and the external electrode 25.

[0031] The wiring substrate 2 has an insulating substrate 20 including a first base 22 and a first frame 23. The first base 22 may be, for example, a flat insulator with a rectangular shape in plan view. The first base 22 has a first surface 22A that serves as the bottom surface of a first recess 21 and a second surface 22B located opposite to the first surface 22A. The first frame 23 is located at the outer edge of the first surface 22A of the first base 22 and defines the inner wall (inner surface) of the first recess 21. The outer edge of the first frame 23 may overlap with the outer edge of the first base 22 in plan view. The insulating substrate 20 may be, for example, a ceramic such as an alumina sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. The insulating substrate 20 may also include a plurality of stacked insulating layers. Alternatively, the first base 22 and the first frame 23 of the insulating substrate 20 may be integrally formed.

[0032] The first surface 22A of the wiring substrate 2 may include a mounting area for mounting the battery 7. The mounting area in the first surface 22A may be the area that overlaps with the battery 7 when the wiring substrate 2 is viewed from above with the battery 7 mounted.

[0033] The connecting electrode 24 is electrically connected to the electrodes of the battery 7. The connecting electrode 24 includes a first connecting electrode 241 and a second connecting electrode 242 corresponding to the positive electrode 701 and negative electrode 702 of the battery 7, respectively. The connecting electrode 24 is located on the inner surface of the first recess 21. For example, as... Figures 1-4 As shown, the connecting electrode 24 can also be located on the first surface 22A. Alternatively, the connecting electrode 24 can be located on the inner side of the first recess 21, or it can be located at a position from the first surface 22A to the inner side.

[0034] In addition, such as Figure 2 As shown, the connecting electrode 24 can extend from the mounting area of ​​the wiring substrate 2 to the boundary between the first base 22 and the first frame 23. In other words, a portion of the connecting electrode 24 can be located between the first base 22 and the first frame 23. This improves the bonding strength between the connecting electrode 24 and the insulating substrate 20.

[0035] The external electrode 25 is located on the second surface 22B. The external electrode 25 includes a first external electrode 251 and a second external electrode 252, respectively connected to the first connecting electrode 241 and the second connecting electrode 242. For example... Figure 1 As shown, the external electrode 25 can extend from the second surface 22B of the wiring substrate 2 to the corner between the side surfaces of the wiring substrate 2. Alternatively, a groove can be provided at the corner of the wiring substrate 2, allowing the external electrode 25 to extend into the groove.

[0036] Internal wiring connects electrode 24 and external electrode 25. Internal wiring may include, for example... Figure 2The diagram shows a through-hole conductor 26 extending in the thickness direction of the first base 22. Alternatively, a plurality of such through-hole conductors 26 may be included, connecting the connecting electrode 24 and the external electrode 25. This reduces the resistance of the internal wiring, improving the efficiency of power extraction from the battery. The internal wiring may also have wiring conductors located inside the first base 22 and extending in a direction parallel to the first surface 22A.

[0037] (Cover body)

[0038] The cover 3 has a second recess 31 that forms part of the receiving space S for receiving the battery 7. The cover 3 has: a second base 32 having a third surface 32A that serves as the bottom surface of the second recess 31; and a second frame 33 located at the outer edge of the third surface 32A and defining the inner wall of the second recess.

[0039] The top view shape of the cover 3 can be, for example, rectangular. The cover 3 can include ceramic materials, more specifically, it can be alumina sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, or glass-ceramic sintered body, etc. By using a ceramic material to construct the cover 3, it can be manufactured using the same material as the insulating substrate 20 of the wiring substrate 2. In addition, the thermal stress caused by the difference in thermal expansion between the cover 3 and the wiring substrate 2 is reduced, thereby improving the bonding strength and airtightness based on the seal 4, and increasing reliability. Furthermore, due to the low thermal stress, the thickness of the first frame portion 23 of the wiring substrate 2 can also be reduced, thereby increasing the accommodating space S.

[0040] Furthermore, even if the battery is misaligned within the housing and comes into contact with the cover 3, it will not short-circuit between the positive and negative terminals because it is an insulator.

[0041] The cover 3 is not limited to using ceramic material; it can also be made of metal. An example of a cover 3 made of metal will be described later.

[0042] (Seals)

[0043] The sealing element 4 joins the wiring substrate 2 and the cover 3 to provide an airtight seal for the battery 7. The sealing element 4 can be a sealing element mainly composed of non-conductive material or a sealing element mainly composed of conductive material.

[0044] More specifically, the non-conductive material used for the seal 4 can be a glass material. By using a non-conductive material as the seal 4, the possibility of a short circuit with the battery 7 can be reduced even if the seal 4 overflows into the receiving space S. Furthermore, even if the seal 4 overflows from the upper surface of the first frame portion 23 and comes into contact with the electrodes of the battery 7, a short circuit will not occur between the electrodes.

[0045] The conductive material used for the seal can be AuSn or solder. When AuSn or solder is used as the seal, the accommodating space S can be sealed by pre-applying a metallization layer on the sealing surfaces of the first frame portion 23 and the second frame portion 33.

[0046] (Connecting parts)

[0047] like Figure 2 As shown, the battery module 200 may also have a bonding member 5, which bonds the positive electrode 701 and negative electrode 702 of the battery 7, and the corresponding first connecting electrode 241 and second connecting electrode 242. The bonding member 5 can be any conductive bonding member and is not particularly limited; for example, it can be a sintered metal part. A sintered metal part refers to a sintered bond containing metal nanoparticles that functions as a conductive bonding member through sintering. The metal nanoparticles contained in the sintered metal part can be, for example, gold, silver, copper, or silver-palladium. Silver sintered parts containing silver nanoparticles are superior in terms of cost. Copper sintered parts or silver-palladium sintered parts can also be selected considering migration in the wiring substrate.

[0048] Conductive resins, which can be used as other examples of connectors 5, typically contain about 10% resin. In contrast, the resin content of sintered metal parts is approximately less than 1%, thus resulting in less gas generation due to resin when exposed to high temperatures. When the wiring substrate 2 and the cover 3 are sealed by the sealant 4, they are sometimes exposed to high temperatures. For example, when glass frit is used as the sealant 4 to seal the wiring substrate 2 and the cover 3, leaded glass frit is sealed at a high temperature of about 300–350°C, and lead-free glass frit is sealed at a high temperature of about 380–500°C. Since the connector 5 is a sintered metal part with low resin content, even when the sealing of the wiring substrate 2 and the cover 3 is performed at high temperatures, the possibility of poor airtight sealing due to resin-generated gas can be reduced.

[0049] (Characteristics of battery packaging components)

[0050] use Figure 3 The features of the battery package 100 in the state where the wiring substrate 2 and the cover 3 are joined by the sealing member 4 will be described. In the battery package 100, the surface around the opening of the first recess 21 of the wiring substrate 2 and the surface around the opening of the second recess 31 of the cover 3 are joined by the sealing member 4, and the accommodating space S is hermetically sealed.

[0051] Figure 3H1 is the height of the first frame portion 23, and T1 is the maximum thickness of the first frame portion 23. The height H1 of the first frame portion 23 is, in other words, the depth of the first recess 21. The maximum thickness T1 of the first frame portion 23 is the length of the first frame portion 23 in the X direction from the inner end to the outer end in a longitudinal cross-sectional view. Furthermore, H2 is the height of the second frame portion 33, and T2 is the maximum thickness of the second frame portion 33. The height H2 of the second frame portion 33 is, in other words, the depth of the second recess 31. More specifically, the maximum thickness T2 of the second frame portion 33 is the length of the second frame portion 33 in the X direction from the inner end to the outer end in a longitudinal cross-sectional view. Additionally, HT is the height of the receiving space S defined by the first recess 21 and the second recess 31. The height HT of the receiving space S is, in other words, the height H1 of the first frame portion 23, the height H2 of the second frame portion 33, and the thickness of the seal 4. TP is the wall thickness of the battery package 100, and is the length of the first frame portion 23 and the second frame portion 33 in the X direction from the inner end to the outer end.

[0052] Battery encapsulation component 100 in such Figure 3 In the longitudinal cross-sectional view shown, the value obtained by dividing the height (HT) of the accommodating space S by the wall thickness (TP) of the battery package 100 is 3 or more.

[0053] In structures where only one of the wiring substrate and the cover has a recess while the other is a flat plate, a deep recess is required, resulting in a higher wall height relative to the wall thickness and reduced strength. Furthermore, when the wall of the recess is formed by a laminate, it is difficult to form a thin and high wall. The battery package 100 has a receiving space S formed by a first recess 21 in the wiring substrate 2 and a second recess 31 in the cover 3. Furthermore, by specifying HT / TP≥3, the volume of the receiving space is ensured, and the thickness of the frame portion of the wiring substrate 2 or the cover 3 is reduced, thereby increasing the volume of the receiving space S relative to the outer volume of the package. Thus, a high energy density battery module can be achieved without reducing the strength of the package.

[0054] In the battery package 100, the height (H1) of the first frame portion 23 relative to the height (HT) of the accommodating space S can be 30% or more and 70% or less. For example, the ratio of H1 to HT can be 40% or more and 60% or less, or it can be around 50%. If the difference in depth between the recesses of the wiring substrate 2 and the cover 3 is extremely different, the strength of the side with the deeper recess may be reduced. With the above structure, the height (HT) of the accommodating space S can be increased without excessively reducing the strength of both the wiring substrate 2 and the cover 3, thus enabling a battery module with high energy density.

[0055] Battery encapsulation component 100 in such Figure 3In the longitudinal cross-sectional view shown, the aspect ratio (H1 / T1) of the first frame portion 23, defined by dividing the height (H1) of the first frame portion 23 by the maximum thickness (T1) of the first frame portion 23, can be 1.5 or more. By configuring the first frame portion 23 to satisfy the aspect ratio (H1 / T1) of 1.5 or more, the volume of the accommodating space (volume of the first recess 21) relative to the outer volume of the wiring substrate 2 can be increased.

[0056] Additionally, the battery encapsulation 100 is used in, for example Figure 3 In the longitudinal cross-sectional view shown, the aspect ratio (H2 / T2) of the second frame portion 33, defined by dividing the height (H2) by the maximum thickness (T2) of the second frame portion 33, can be 1.5 or more. By configuring the second frame portion 33 to satisfy an aspect ratio (H2 / T2) of 1.5 or more, the volume of the accommodating space (volume of the second recess 31) relative to the outer volume of the cover 3 can be increased.

[0057] Since the wiring substrate 2 and the cover 3 each have a first frame portion 23 and a second frame portion 33, the rigidity of the wiring substrate / cover can be obtained mainly by relying on the frame portions. Therefore, the thickness of the first base portion 22 and the second base portion 32 can be reduced respectively. As a result, the volume of the accommodating space can be increased. In addition, by making the first base portion 22 of the wiring substrate 2 thinner, the internal wiring connecting the connecting electrode 24 and the external electrode 25 can be shortened, thereby improving the power extraction efficiency.

[0058] Figure 6 yes Figure 2 A magnified view of region R in the image. (See image below.) Figure 6 As shown, the outer surface of the second frame portion 33 may have an inclined surface 331 that slopes inward toward the opening side of the second recess 31. In other words, the outer edge of the second frame portion 33 at the opening side of the second recess 31 may be located further inward than the outer edge of the second frame portion 33 when viewed from above. By having the inclined surface 331, even if the first frame portion 23 and the second frame portion 33 have the same thickness, a seal 4 will accumulate between the inclined surface 331 and the upper surface of the first frame portion 23, increasing the joint area and thus improving the joint strength. In addition, by having the inclined surface 331 on the outer surface, a seal 4 can be accumulated on the outer side where stress is greater, thus improving the strength compared to the inner surface side. The inclined surface may also be located on both the inner and outer sides of the second frame portion 33.

[0059] The battery encapsulation 100 may also have an inclined surface on the outer surface of the first frame portion 23 of the wiring substrate 2, which slopes inward toward the opening side of the first recess 21. Alternatively, both the outer surfaces of the first frame portion 23 and the outer surfaces of the second frame portion 33 may have inclined surfaces. By having an inclined surface only on the second frame portion 33 of the cover 3 located on the upper side, the seal 4 can be easily retained between the cover 3 and the wiring substrate 2.

[0060] [Implementation Method 2]

[0061] Other embodiments of this disclosure will be described below. For ease of explanation, components that have the same function as those described in the above embodiments will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0062] Figure 7 This is a cross-sectional view of the battery module 200B according to Embodiment 2. The battery module 200B includes a battery package 100B and a battery 7. (As shown...) Figure 7 As shown in the battery package 100B, the wiring substrate 2 and the cover 3 may each include a plurality of stacked ceramic insulating layers IL.

[0063] The wiring substrate 2 and cover 3, comprising a plurality of stacked ceramic insulating layers IL, can be manufactured, for example, as follows: When the ceramic insulating layers of the wiring substrate 2 and cover 3 are composed of an alumina sintered body, a slurry is prepared by adding and mixing appropriate organic binders and solvents to raw material powders such as alumina and silica. This slurry is then formed into sheets using a doctor blade method or a rolling mill method to produce ceramic green sheets for the insulating layer. A plurality of rectangular ceramic green sheets, which will become first base 22 / second base 32, and rectangular frame-shaped ceramic green sheets, which will become first frame 23 / second frame 33, are stacked to form a laminate. Then, the laminate is fired at a high temperature (approximately 1300–1600°C) to produce the wiring substrate 2 or cover 3.

[0064] In the fabrication of the wiring substrate 2, a metal paste, made by mixing tungsten powder with an organic solvent and an organic binder, is applied to the green sheet that forms the first base 22, at the positions of the connecting electrode 24, the external electrode 25, and the internal wiring, and then fired. This produces the wiring substrate 2 with wiring.

[0065] When the wiring substrate 2 or the cover 3 includes multiple insulating layers, if the height of the frame is increased to ensure the accommodating volume, the thickness of the frame needs to be increased to ensure manufacturing accuracy during manufacturing and strength after sintering. By satisfying HT / TP≥3 with the battery package 100B, a high energy density battery module can be achieved without reducing the strength of the package.

[0066] The outer and inner surfaces of the second frame portion 33 can be substantially perpendicular to the third surface 32A. By making the inner surface perpendicular, the volume of the accommodating space S relative to the outer volume of the cover 3 can be increased. Additionally, the outer and inner surfaces of the first frame portion 23 can be substantially perpendicular to the first surface 22A. By making the inner surface perpendicular, the volume of the accommodating space S relative to the outer volume of the wiring substrate 2 can be increased.

[0067] Furthermore, since the outer and inner surfaces of the second frame portion 33 are perpendicular, the wall thickness of the second frame portion 33 remains the same in the height direction, allowing the second frame portion 33 to be set to its maximum thickness overall, thus resulting in excellent cover strength. For the first frame portion 23, since the outer and inner surfaces are perpendicular, the wall thickness of the first frame portion 23 remains the same in the height direction, allowing the first frame portion 23 to be set to its maximum thickness overall, thus resulting in excellent substrate strength. Therefore, by increasing the height of the frame portion, the volume of the accommodating space S relative to the outer volume of the package can be maximized.

[0068] Furthermore, in the X direction of the longitudinal section view, the position of the inner side of the second frame portion 33 can also be the same as the position of the inner side of the first frame portion 23. This allows for a further increase in the accommodating space.

[0069] By constructing the cover 3 from multiple stacked ceramic insulating layers IL, a cover can be achieved in which the inner and outer walls of the second frame portion 33 have a shape substantially perpendicular to the third surface 32A, thereby increasing the internal volume of the second recess 31. Furthermore, by changing the number of ceramic insulating layers IL and the thickness of each layer, the depth of the second recess 31 can be easily set. In the case of forming by stamping, changing the mold is required to change the depth or manufacture coveres with different depths, but in the case of stacking, only the number of layers or the layer thickness needs to be changed, making manufacturing easier.

[0070] In the first frame portion 23 of the wiring substrate 2, the thickness of the first frame portion 23 on the opening side of the first recess 21 can be greater than the thickness on the bottom surface (first surface 22A) side. For example, the thickness of the ceramic insulating layer IL at the uppermost section of the first frame portion 23 of the wiring substrate 2 in the direction perpendicular to the inner wall of the first frame portion 23 can be greater than the thickness of the ceramic insulating layer IL at the lowermost section.

[0071] By increasing the thickness of the opening side of the first recess 21, the contact area with the sealing member 4 is increased, thereby improving the bonding strength between the cover 3 and the wiring substrate 2. Furthermore, since the thickness of the bottom side of the first recess 21 is less than that of the opening side, when the battery 7 and the wiring substrate 2 are joined using the connector 5, the connector 5 can extend outwards, further improving the bonding strength between the battery 7 and the wiring substrate 2. In this case, the thickness of the second frame portion 33 of the cover 3 on the opening side of the second recess 31 can also be greater than the thickness on the bottom side (third surface 32A).

[0072] In addition, such as Figure 7As shown, when the connecting electrode 24 extends to the boundary between the first frame portion 23 and the first base portion 22, the through-hole conductor 26 connecting the connecting electrode 24 and the external electrode 25 can also be located at a position overlapping the first frame portion 23 when viewed from above. With this structure, even when the first base portion 22 is relatively thin, the possibility of cracks originating from the through-hole conductor 26 can be reduced, thereby improving the strength of the battery package 100B.

[0073] [Implementation Method 3]

[0074] Figure 8 This is a cross-sectional view of the battery module 200C according to Embodiment 3. The battery module 200C has a battery package 100C and a battery 7. The battery package 100C has a wiring substrate 2, a cover 3C and a seal 4.

[0075] The cover 3C can be formed into a cup shape by stamping or other processes using a sheet metal. In the case of a metal cover 3 having a second frame portion 33 with the same or approximately the same thickness as the first frame portion 23, as in Embodiment 1, the thermal stress caused by the difference in thermal expansion is greater compared to the case of a ceramic cover. By forming a cup-shaped cover using a sheet metal that is thinner than the first frame portion 23, the thermal stress can be reduced, the thickness of the first frame portion 23 of the wiring substrate 2 can be reduced, and the accommodating space can be increased. The metal material used for the cover 3C is preferably a material with a small difference in thermal expansion compared to ceramic, such as an iron-nickel (Fe-Ni) alloy or an iron-nickel-cobalt (Fe-Ni-Co) alloy.

[0076] When joining a metal cover 3C to a wiring substrate 2, a metallization layer or a bonding metal layer such as a sealing ring can be pre-formed on the upper surface of the wiring substrate 2, and the cover 3C can be joined to the bonding metal layer by welding methods such as seam welding or laser welding. The joining by seam welding or laser welding involves localized heating, thus reducing the thermal impact on the battery 7.

[0077] The cover 3C has: a second base 32 having a third surface 32A that serves as the bottom surface of the second recess 31; and a second frame portion 33 located at the outer edge of the third surface 32A and defining the inner wall of the second recess. In the cover 3C, H2 is the height of the second frame portion 33. Specifically, in the battery package 100C, H2 may also be the distance from the mating surface of the cover 3C in contact with the seal 4 to the third surface 32A. T2 is the length from the inner end to the outer end in the X direction. TP is the wall thickness of the battery package 100, defined as the length from the outer end of the first frame portion 23 to the inner end of the second frame portion 33. Figure 8In the longitudinal cross-sectional view shown, the battery package 100C has an HT / TP ≥ 3. This structure allows for an increase in the volume of the containment space S relative to the outer volume of the package without reducing its strength, thus enabling the creation of a high-energy-density battery module.

[0078] [Implementation Method 4]

[0079] Figure 9 This is a cross-sectional view of the battery module 200D according to Embodiment 4. The battery module 200D has a battery package 100D and a battery 7. The battery package 100D has a wiring substrate 2, a cover 3D, and a seal 4.

[0080] like Figure 9 As shown in the cover 3D, the inner surface of the cover 3D (the inner surface of the second frame portion 33) can also be an inclined surface with an angle relative to the third surface 32A. The angle between the third surface 32A and the inclined surface is an obtuse angle. This shape reduces stress concentration at the corner between the third surface 32A and the inner surface of the second frame portion 33, thus reducing the likelihood of cracks originating from the corner. Furthermore, the thickness at the joint surface of the second frame portion 33 is less than the thickness at the joint surface of the first frame portion 23. Therefore, the seal 4 can remain between the inclined surface and the upper surface of the wiring substrate 2, improving the bonding strength between the wiring substrate 2 and the cover 3C. Figure 9 As shown, by reducing the thickness at the joint surface of the second frame portion 33 and tilting the inner surface, the possibility of corner cracks can be reduced without reducing the size of the accommodating space S, and the joint strength can be improved by the retention of the seal.

[0081] Such a 3D lid can be obtained, for example, by stamping ceramic powder into a cup shape and then firing it. Alternatively, the 3D lid can also be constructed by stacking frame-shaped ceramic insulating layers with inclined inner surfaces.

[0082] Alternatively, the inner surface of the cover 3D (the inner surface of the second frame portion 33) can be perpendicular to the third surface 32A, and the corner where the inner surface and the third surface 32A meet is an inclined surface or a curved surface. Even with this structure, stress concentration at the corner between the third surface 32A and the inner surface of the second frame portion 33 can be reduced, thereby reducing the likelihood of cracks originating from the corner.

[0083] [Implementation Method 5]

[0084] Figure 10 This is a cross-sectional view of the battery module 200E according to Embodiment 5. The battery module 200E has a battery package 100E and a battery 7. The battery package 100E has a wiring substrate 2, a cover 3D, a seal 4, and a leaf spring 6E. The leaf spring 6E is an example of the elastic member of this disclosure.

[0085] The leaf spring 6E presses the battery 7 toward the first surface 22A of the wiring substrate 2. More specifically, the leaf spring 6E presses the positive electrode 701 and negative electrode 702 of the battery 7 toward the corresponding first connecting electrode 241 and second connecting electrode 242. The leaf spring 6E is a leaf spring made of metal.

[0086] The cover 3E can be made of ceramic containing ceramic material, or it can have a recess 32C on the third surface 32A for accommodating the leaf spring 6E. The recess 32C in the cover 3E allows the leaf spring 6E to be positioned properly and reduces lateral displacement. This reduces the likelihood of the leaf spring 6E shifting at its pressing position and exerting a tilting force on the battery, thus improving the reliability of the connection between the battery 7 and the first connecting electrode 241 and the second connecting electrode 242.

[0087] Since the battery module 200E has a leaf spring 6E, the connector 5 that links the battery 7 to the wiring substrate 2 may not be necessary. The leaf spring, made of metal, is a component that deteriorates less even over long periods, thus enabling the battery module 200E to achieve excellent long-term reliability. Furthermore, the leaf spring 6E does not require sintering or hardening processes. Therefore, temperature-induced degradation of the battery 7 can be reduced. Alternatively, the battery module 200E may have both the connector 5 that links the battery 7 to the wiring substrate 2 and the leaf spring 6E. Having both of these further improves connection reliability.

[0088] In addition, such as Figure 10 As shown, when viewed from above, the shape of the cover 3E can be smaller than that of the wiring substrate 2. In other words, the length of one side of the cover 3E can be shorter than the length of one side of the corresponding wiring substrate 2. This structure reduces the possibility of changes in the external dimensions of the battery package 100E due to positional offset of the cover 3E.

[0089] Furthermore, in planar perspective, the opening diameter of the first recess 21 (the inner diameter of the first frame portion 23) can be smaller than the opening diameter of the second recess 31 (the inner diameter of the second frame portion 33). In other words, the thickness of the first frame portion 23 can be greater than the thickness of the second frame portion 33. This allows for the formation of a rounded corner of the seal 4 from the upper surface of the wiring substrate 2 to the inner / outer side of the second frame portion 33, improving the bonding strength between the wiring substrate 2 and the cover 3E. Additionally, it reduces the possibility that the accommodating space S of the battery package 100E will become smaller due to positional displacement of the cover 3E.

[0090] exist Figure 10 The diagram shows an example where the thickness of the first frame portion 23 is greater than the thickness of the second frame portion 33, but the thickness of the first frame portion 23 can also be less than the thickness of the second frame portion 33. Furthermore, in... Figure 10The diagram shows an example where the outer shape of the wiring substrate 2 is larger than that of the cover 3E, but the outer shape of the wiring substrate 2 can also be smaller than that of the cover 3E. Even in such a case, it is possible to obtain a result similar to... Figure 10 The example shown has the same effect.

[0091] [Implementation Method 6]

[0092] Figure 11 This is a cross-sectional view of the battery module 200F according to Embodiment 6. The battery module 200F differs from the battery module 200E in Embodiment 5 in that it has a helical spring 6F instead of a leaf spring 6E. The helical spring 6F is an example of the elastic member of this disclosure.

[0093] The cover 3F can be ceramic containing ceramic material, or it can have a recess 32C on the third surface 32A for accommodating the helical spring 6F.

[0094] The helical spring 6F can be made of metal or ceramic. In addition, the elastic member disclosed herein is not limited to the leaf spring 6E of Embodiment 5 and the helical spring 6F of Embodiment 6, as long as it is an elastic body that can press the battery 7 toward the first surface 22A of the wiring substrate 2 as the cover 3E, 3F is pressed.

[0095] [Other methods]

[0096] In the above embodiments, an example is shown where one battery 7 is housed in each battery package, but multiple batteries 7 can also be housed in the battery package. In this case, the number and arrangement of the first connecting electrode 241 and the second connecting electrode 242 in the battery package can be appropriately changed according to the number and arrangement of the housed batteries 7. Additionally, electronic components such as semiconductor elements or capacitors for battery control can also be housed in the battery package.

[0097] 〔Summarize〕

[0098] (1) A battery package of embodiment 1 of the present disclosure is used to accommodate a battery, the battery package having: a wiring substrate having a first recess forming part of a receiving space for accommodating the battery; a cover having a second recess forming another part of the receiving space; and a seal for engaging the wiring substrate and the cover; the wiring substrate having an insulating substrate including: a first base having a first surface as the bottom surface of the first recess; and a first frame portion located at the outer edge of the first surface and defining the inner wall of the first recess; the cover including: a second base having a third surface as the bottom surface of the second recess; and a second frame portion located at the outer edge of the third surface and defining the inner wall of the second recess; in a longitudinal cross-sectional view, the value obtained by dividing the height of the receiving space by the wall thickness of the battery package is 3 or more.

[0099] (2) In the above-mentioned embodiment 1, the battery package of embodiment 2 of this disclosure includes a plurality of stacked ceramic insulating layers.

[0100] (3) In the battery package of the present disclosure of embodiment 3, in embodiment 1 or 2 above, the height of the first frame portion is more than 30% and less than 70% of the height of the accommodating space.

[0101] (4) In any of the above embodiments 1 to 3, the aspect ratio of the first frame portion defined by the height of the first frame portion divided by the maximum thickness of the first frame portion in the longitudinal cross-sectional view of the battery package of embodiment 4 of this disclosure is 1.5 or more.

[0102] (5) In any of the above embodiments 1 to 4, the cover of the battery package of embodiment 5 of this disclosure comprises a ceramic material.

[0103] (6) In any of the above embodiments 1 to 5, the cover of the battery package of embodiment 6 of this disclosure comprises a plurality of stacked ceramic insulating layers.

[0104] (7) In any of the above embodiments 1 to 6, the aspect ratio of the second frame portion defined by the height of the second frame portion divided by the maximum thickness of the second frame portion in the longitudinal cross-sectional view of the battery package of embodiment 7 of this disclosure is 1.5 or more.

[0105] (8) In any one of the above embodiments 1 to 7, the outer surface of the second frame portion of the battery package of embodiment 8 of the present disclosure has an inclined surface that is inclined inward on the opening side of the second recess.

[0106] (9) In any of the above embodiments 1 to 8, the sealing element of the battery package of embodiment 9 of this disclosure comprises a non-conductive material.

[0107] (10) In any of the above embodiments 1 to 9, the thickness of the first frame portion on the opening side of the first recess is greater than the thickness of the first frame portion on the bottom side of the first recess in the battery package of embodiment 10 of this disclosure.

[0108] (11) The battery module of embodiment 11 of this disclosure has: a battery package of any one of embodiments 1 to 10 above, the battery package having a plurality of connecting electrodes on the inner surface of the first recess; a battery having a positive electrode and a negative electrode; and a metal sintering member for joining the positive electrode and the negative electrode of the battery with the corresponding connecting electrodes.

[0109] (12) The battery module of embodiment 12 of this disclosure has: a battery package of any one of embodiments 1 to 10 above, the battery package having a plurality of connecting electrodes on the inner surface of the first recess; a battery having a positive electrode and a negative electrode; and an elastic member for pressing the positive electrode and the negative electrode of the battery toward the corresponding connecting electrode.

[0110] [Additional Notes]

[0111] The invention disclosed herein has been described above based on the accompanying drawings and embodiments. However, the invention disclosed herein is not limited to the embodiments described above. That is, the invention disclosed herein can be modified in various ways within the scope shown in this disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of the invention disclosed herein. In other words, it should be noted that those skilled in the art can easily make various modifications or alterations based on this disclosure. Furthermore, it should be noted that these modifications or alterations are also included within the scope of this disclosure.

[0112] Explanation of reference numerals in the attached figures

[0113] 100, 100B, 100C, 100D, 100E: Battery packaging components

[0114] 2: Wiring substrate

[0115] 20: Insulating substrate

[0116] 21: First recess

[0117] 22: First base

[0118] 23: First frame

[0119] 24: Connecting Electrodes

[0120] 25: External Electrode

[0121] 26: Through-hole conductor

[0122] 3, 3C, 3D, 3E, 3F: Cover

[0123] 31: Second concave portion

[0124] 32: Second base

[0125] 33: Second frame

[0126] 4: Seals

[0127] 5: Connecting parts

[0128] 6E: Leaf spring (elastic component)

[0129] 6F: Coil spring (elastic component)

[0130] 7: Battery

[0131] 701: Positive electrode

[0132] 702: Negative electrode

[0133] 200, 200B, 200C, 200D, 200E, 200F: Battery Modules

Claims

1. A battery encapsulation for housing a battery, wherein, The battery encapsulation component has: The wiring substrate has a first recess that forms part of the receiving space for receiving the battery; The cover has a second recess that forms another part of the receiving space; as well as A sealing element that joins the wiring substrate and the cover. The wiring substrate includes: a first base having a first surface serving as the bottom surface of the first recess; and a first frame portion located at the outer edge of the first surface and defining the inner wall of the first recess. The cover includes: a second base having a third surface that serves as the bottom surface of the second recess; and a second frame portion located at the outer edge of the third surface and defining the inner wall of the second recess. In a longitudinal cross-sectional view, the value obtained by dividing the height of the accommodating space by the wall thickness of the battery package is 3 or more.

2. The battery encapsulation component according to claim 1, wherein, The wiring substrate includes a plurality of stacked ceramic insulating layers.

3. The battery encapsulation according to claim 1 or 2, wherein, The height of the first frame portion is more than 30% and less than 70% of the height of the accommodating space.

4. The battery package according to any one of claims 1 to 3, wherein, In a longitudinal section view, the aspect ratio of the first frame portion, defined by dividing the height of the first frame portion by the maximum thickness of the first frame portion, is 1.5 or more.

5. The battery package according to any one of claims 1 to 4, wherein, The cover is made of ceramic material.

6. The battery package according to any one of claims 1 to 5, wherein, The cover comprises a plurality of stacked ceramic insulating layers.

7. The battery package according to any one of claims 1 to 6, wherein, In the longitudinal section view, the aspect ratio of the second frame portion, defined by dividing the height of the second frame portion by the maximum thickness of the second frame portion, is 1.5 or more.

8. The battery package according to any one of claims 1 to 7, wherein, The outer surface of the second frame portion has an inclined surface that slopes inward toward the opening side of the second recess.

9. The battery package according to any one of claims 1 to 8, wherein, The seal comprises a non-conductive material.

10. The battery package according to any one of claims 1 to 9, wherein, In the first frame portion, the thickness of the first frame portion on the opening side of the first recess is greater than the thickness of the first frame portion on the bottom side of the first recess.

11. A battery module, wherein, The battery module has: The battery package according to any one of claims 1 to 10 has a plurality of connecting electrodes on the inner surface of the first recess; A battery has a positive terminal and a negative terminal; and A sintered metal component that connects the positive and negative electrodes of the battery to the corresponding connecting electrodes.

12. A battery module, wherein, The battery module has: The battery package according to any one of claims 1 to 10 has a plurality of connecting electrodes on the inner surface of the first recess; A battery has a positive terminal and a negative terminal; and An elastic member presses the positive and negative terminals of the battery toward the corresponding connecting electrodes.

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