Optical transceiver and optical communication device

Abstract

An optical transceiver includes a light emitting element that outputs light, a light receiving element that receives light and outputs an electric signal corresponding to the light, a drive circuit that drives the light emitting element, a processing circuit that processes the electric signal from the light receiving element, a first substrate that mounts the light emitting element, the light receiving element, the drive circuit, and the processing circuit, a housing that houses the light emitting element, the light receiving element, the drive circuit, and the processing circuit, a control circuit that controls the drive circuit and the processing circuit, a second substrate that has a mounting portion that mounts the control circuit and a connection portion that has flexibility, and an electric interface that is provided to the first substrate, electrically connects the optical transceiver with an external device, and mounts the second substrate to a wall surface of the housing using the mounting portion.

Description

Technical Field

[0001] This invention relates to optical transceivers and optical communication devices. Background Technology

[0002] Known optical transceivers are disclosed in Patent Documents 1 through 3. On the other hand, in network switching devices implementing CPO (co-packaged optics), a switching ASIC (application-specific integrated circuit) and multiple optical transceivers are mounted on a substrate. As an invention for a substrate assembly with multiple optical transceivers mounted, for example, there is the substrate assembly disclosed in Patent Document 4, in which multiple optical transceivers are fixed to the substrate by a fixing mechanism.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-228965

[0006] Patent Document 2: Japanese Patent Application Publication No. 2021-173875

[0007] Patent Document 3: Japanese Patent Application Publication No. 2022-114606

[0008] Patent Document 4: Japanese Patent Application Publication No. 2023-150085 Summary of the Invention

[0009] -The problem the invention aims to solve-

[0010] The expectation is that this optical transceiver will be smaller.

[0011] The present invention was made in view of the above circumstances, and its object is to provide a smaller optical transceiver and an optical communication device having the optical transceiver.

[0012] -Methods used to solve problems-

[0013] To address the aforementioned issues and achieve the objectives, one aspect of the present invention is an optical transceiver comprising: a light-emitting element that outputs light; a light-receiving element that receives light and outputs an electrical signal corresponding to the light; a driving circuit that drives the light-emitting element; a processing circuit that processes the electrical signal from the light-receiving element; a first substrate for mounting the light-emitting element, the light-receiving element, the driving circuit, and the processing circuit; a housing for housing the light-emitting element, the light-receiving element, the driving circuit, and the processing circuit; a control circuit for controlling the driving circuit and the processing circuit; a second substrate having a mounting portion for mounting the control circuit and a flexible connection portion; and an electrical interface disposed on the first substrate for electrically connecting the optical transceiver to an external device, wherein the second substrate is mounted to the wall of the housing via the mounting portion.

[0014] Alternatively, the second substrate may be electrically connected to the first substrate via the connecting portion.

[0015] Alternatively, the drive circuit, the processing circuit, and the control circuit may be in thermal contact with the housing via a heat conduction element, and the heat emitted by the drive circuit, the processing circuit, and the control circuit may be dissipated in the same direction through the housing.

[0016] Alternatively, the wall surface may be parallel to or intersect with the first surface on which the driving circuit and the processing circuit are mounted in the first substrate.

[0017] Alternatively, the housing may have a mounting structure having the wall surface.

[0018] Alternatively, the mounting structure may be provided in a groove, recess, hole, or countersunk hole in the housing.

[0019] Alternatively, the optical transceiver may include: electronic components mounted on a second side of the first substrate opposite to the first side on which the driving circuit and the processing circuit are mounted; and a housing member mounted on the second side to house the electronic components.

[0020] Alternatively, the housing may be made of a material with good thermal conductivity.

[0021] Alternatively, the second substrate may be electrically connected to the first substrate via solder, conductive adhesive, anisotropic conductive adhesive, or an electrical connector.

[0022] Alternatively, the electrical interface may include a pad grid array.

[0023] Alternatively, the optical transceiver may include a positioning pin that penetrates at least the first substrate and engages with a positioning hole disposed in the housing.

[0024] Alternatively, the housing may have a positioning hole, and a positioning pin in the fixing mechanism for fixing the optical transceiver to the substrate may pass through the first substrate and engage with the positioning hole.

[0025] Alternatively, the optical transceiver may include an optical fiber extending in a direction intersecting the first substrate.

[0026] One aspect of the present invention is an optical communication device comprising: a plurality of said optical transceivers; and electrical components electrically connected to said plurality of optical transceivers.

[0027] -Invention Effects-

[0028] According to the present invention, a smaller optical transceiver and an optical communication device incorporating the optical transceiver can be realized. Attached Figure Description

[0029] Figure 1 This is a schematic structural diagram of an optical communication device having the optical transceiver described in Embodiment 1.

[0030] Figure 2 This is a schematic exploded perspective view of the optical transceiver involved in Embodiment 1.

[0031] Figure 3 yes Figure 1 The image shows a side view of the optical transceiver.

[0032] Figure 4 yes Figure 1 An exploded perspective view of a portion of the optical transceiver shown.

[0033] Figure 5 yes Figure 1 The second substrate and the control circuit shown are in a three-dimensional view.

[0034] Figure 6 This is a schematic perspective view of the optical transceiver involved in Embodiment 2.

[0035] Figure 7 yes Figure 6 The image shows a side view of the optical transceiver.

[0036] Figure 8 yes Figure 6 The second substrate and the control circuit shown are in a three-dimensional view.

[0037] Figure 9 This is a schematic perspective view of the optical transceiver involved in Embodiment 3.

[0038] Figure 10 yes Figure 9 The image shows a top view of the optical transceiver.

[0039] Figure 11 yes Figure 9 The second substrate and the control circuit shown are in a three-dimensional view.

[0040] Figure 12 This is an explanatory diagram of a modified example of the optical transceiver according to Embodiment 2.

[0041] Figure 13 This is an explanatory diagram of a modified example of the optical transceiver according to Embodiment 1.

[0042] Figure 14 yes Figure 13 The image shows a top view of the optical transceiver.

[0043] Figure 15 This is a three-dimensional view of a modified example of the second substrate. Detailed Implementation

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to these embodiments. Furthermore, in the various drawings, the same or corresponding elements are appropriately labeled with the same reference numerals, and repeated descriptions are omitted. Additionally, the xyz orthogonal coordinate axes are appropriately represented in the figures to indicate directions.

[0045] (Implementation Method 1)

[0046] Hereinafter, the switching device of the optical communication device having the optical transceiver according to Embodiment 1 will be described first, and then the optical transceiver according to Embodiment 1 will be described.

[0047] [Optical communication device]

[0048] Figure 1 This is a schematic structural diagram of a switching device for an optical communication device having the optical transceiver described in Embodiment 1.

[0049] like Figure 1 As shown, the switch device 100 is mounted on the motherboard 200 in the same manner as the switch device disclosed in Patent Document 4. Furthermore, in this embodiment, only one switch device 100 is mounted on the motherboard 200, but multiple switch devices 100 may also be mounted on the motherboard 200. The motherboard 200 constitutes a higher-level optical communication device than the switch device 100. This higher-level optical communication device is also an optical communication device equipped with the optical transceiver described in Embodiment 1.

[0050] The switching device 100 includes a substrate 10 with an electrical wiring pattern formed on its interior and surface, a switching ASIC 20, multiple optical transceivers 30, a heat sink 21 for the switching ASIC 20, and a fixing mechanism 40 for fixing the optical transceivers 30 to the substrate 10. The substrate 10 and the fixing mechanism 40 in the switching device 100 are referred to as a substrate assembly. The substrate assembly can be mounted on a motherboard 200.

[0051] The substrate 10 has a square (quadrilateral) shape. Furthermore, the substrate 10 extends orthogonally to the z-axis and has a plate-like shape.

[0052] Optical transceiver 30 receives optical signals transmitted via fiber optic cables (described later) and outputs corresponding electrical signals. The electrical signals output from optical transceiver 30 are input to switch ASIC 20 via an electrical interface on optical transceiver 30 and a conductor on substrate 10. Optical transceiver 30 has a photodiode array as multiple light-receiving parts for receiving optical signals. Furthermore, optical transceiver 30 receives electrical signals from switch ASIC 20 via substrate 10 and the electrical interface, and outputs corresponding optical signals. The optical signals output from optical transceiver 30 are coupled to fiber optic cables and transmitted via the fiber optic cables. Optical transceiver 30 may have, for example, a VCSEL (vertical cavity surface emitting laser) array as multiple light-emitting parts for outputting optical signals.

[0053] Multiple optical transceivers 30 are arranged along each side 10c of the substrate 10. Furthermore, in this embodiment, the optical transceivers 30 are each mounted to cover the side 10c. In other words, when viewed in the negative z-axis direction, the optical transceivers 30 are configured to span the side 10c, having portions located inside and outside the side 10c. This provides the advantage of easily avoiding interference between the optical fiber cables extending from the optical transceivers 30 and other components mounted on the substrate 10, such as the switching ASIC 20 and the heat sink 21, or the advantage of being able to construct the substrate 10 in a smaller form factor.

[0054] Furthermore, multiple optical transceivers 30 are fixed to the substrate 10 by fixing mechanisms 40 provided on each side 10c of the substrate 10. Fixing mechanisms 40 are provided on each of the four sides 10c, i.e., a total of four are provided, which are shared by the multiple (eight in this embodiment) optical transceivers 30 arranged along each side 10c. Thus, by sharing the fixing mechanisms 40 among multiple optical transceivers 30, compared to the case where the optical transceivers 30 are fixed to the substrate 10 by their own fixing mechanisms, the following advantages can be obtained: the mounting structure of the fixing mechanisms 40 to the substrate 10 can be further simplified, or the number of components can be further reduced, thereby suppressing the labor and cost of manufacturing the switching device 100.

[0055] The switch ASIC 20 is mounted on the substrate 10 at a position away from each edge 10c (in this embodiment, for example, approximately the center of the substrate 10). The switch ASIC 20 is, for example, flip-chip mounted on the surface of the substrate 10 facing the positive z-axis. The switch ASIC 20 controls the operation of each optical transceiver 30. The switch ASIC 20 is an example of an electrical device electrically connected to multiple optical transceivers 30.

[0056] The heat sink 21 is positioned opposite the switch ASIC 20 to the substrate 10. The heat sink 21 is in contact with the top surface of the switch ASIC 20 and has a plurality of arrayed, pin-shaped fins 21a protruding from the base in the positive z-axis direction. Furthermore, the heat sink 21 is made of a material with high thermal conductivity, such as aluminum-based metals. With this structure, heat generated by the switch ASIC 20 is transferred in the heat sink 21 in the positive z-axis direction, and released through heat exchange between the fins 21a and the surrounding gas. Alternatively, the heat sink 21 and the switch ASIC 20 can be connected via thermal grease or directly.

[0057] [Optical transceiver]

[0058] Figure 2 This is a schematic exploded perspective view of the optical transceiver involved in Embodiment 1. Figure 3 yes Figure 1 The image shows a side view of the optical transceiver. Figure 4 yes Figure 1 The image shows a partially exploded perspective view of an optical transceiver. The optical transceiver 30 includes a first substrate 31 with an electrical wiring pattern formed on its interior and surface, a housing 32, an optical fiber cable 33 with a connector, a lens assembly 35, lower frames 36a and 36b, two threaded members 37, two locating pins 38, and two heat-conducting members 39. Additionally, in... Figure 3 , Figure 4 The diagram of the fiber optic cable 33 with connector is omitted.

[0059] The first substrate 31 extends orthogonally to the z-axis and has a plate-like shape. The first substrate 31 has a first surface 31a facing the positive z-axis and a second surface 31b located on the opposite side of the first surface 31a and facing the negative z-axis. Furthermore, the first substrate 31 is provided with two threaded holes 31c and two positioning holes 31d extending along the z-axis. Threaded members 37 are inserted into the threaded holes 31c, and positioning pins 38 are inserted and fixed into the positioning holes 31d.

[0060] like Figure 3As shown, a light-emitting element 34a for outputting light signals and a light-receiving element 34b for receiving light signals and outputting electrical signals corresponding to the light signals are mounted on the first surface 31a of the first substrate 31. Here, in Figure 3 In the diagram, the light-emitting element 34a is located on the inside side (the negative y-axis side), and the light-receiving element 34b is located closer to the front side (the positive y-axis side) than the light-emitting element 34a. In this embodiment, the light-emitting element 34a is a 4ch×2 column VCSEL array element, and the light-receiving element 34b is a 4ch×2 column photodiode array element.

[0061] Furthermore, such as Figure 2 , Figure 3 As shown, two driving circuits 34c for driving the light-emitting element 34a and two processing circuits 34d for processing electrical signals from the light-receiving element 34b are mounted on the first surface 31a. The driving circuits 34c are electrically connected to the light-emitting element 34a via the first substrate 31, and the processing circuits 34d are electrically connected to the light-receiving element 34b via the first substrate 31. The driving circuits 34c are configured, for example, to include a driving IC, and the processing circuits 34d are configured, for example, to include a transimpedance amplifier.

[0062] Furthermore, such as Figure 3 , Figure 4 As shown, a plurality of electronic components 34e are mounted on the second surface 31b of the first substrate 31. The electronic components 34e are resistors and capacitors. The electronic components 34e are electrically connected to the drive circuit 34c, the processing circuit 34d, and the control circuit described later via the first substrate 31.

[0063] Furthermore, such as Figure 4 As shown, an electrical interface 34f is provided on the second surface 31b of the first substrate 31. The electrical interface 34f electrically connects the optical transceiver 30 to an external device, for example, it is configured to include a pad grid array. In this embodiment, the electrical interface 34f electrically connects the optical transceiver 30 to the switching ASIC 20 via the fixing mechanism 40 and the substrate 10.

[0064] Furthermore, such as Figure 2 , Figure 3 As shown, a second substrate 34g is mounted on the first surface 31a of the first substrate 31. A control circuit 34h is mounted on the second substrate 34g.

[0065] Figure 5This is a perspective view of the second substrate 34g and the control circuit 34h. In this embodiment, the second substrate 34g is a flexible substrate with electrical wiring patterns formed on its interior and surface, and is flexible. The second substrate 34g has a mounting portion 34g1 and a connecting portion 34g2. The mounting portion 34g1 is the part where the control circuit 34h is mounted, and the connecting portion 34g2 is the part that is electrically and mechanically connected to the first substrate 31. In this embodiment, when the optical transceiver 30 is assembled, the connecting portion 34g2 is bent into an L-shape. Furthermore, the connecting portion 34g2 between the first substrate 31 and the second substrate 34g is electrically and mechanically connected, for example, by solder, conductive adhesive, or anisotropic conductive adhesive.

[0066] The control circuit 34h controls the drive circuit 34c and the processing circuit 34d. The control circuit 34h is electrically connected to the drive circuit 34c and the processing circuit 34d via the second substrate 34g and the first substrate 31. The control circuit 34h is configured, for example, to include a microcontroller.

[0067] Next, the housing 32 will be described. The housing 32 has a cuboid shape and is made of a good thermally conductive material such as aluminum, copper-tungsten alloy, or copper. The housing 32 has a through hole 32a, two first receiving portions 32b, two second receiving portions 32c, two positioning holes 32d, and two threaded fixing portions 32e.

[0068] The through-hole 32a penetrates the housing 32 in the z-axis direction. The two first receiving portions 32b are recesses from the surface (facing the negative z-axis direction) that abuts against the first substrate 31 in the assembled state of the optical transceiver 30, towards the positive z-axis direction. The two first receiving portions 32b are located at positions that sandwich the through-hole 32a in the y-axis direction and communicate with the through-hole 32a. Furthermore, the two first receiving portions 32b have top walls 32ba that extend along the xy-direction. Figure 2 , Figure 3 As shown, the housing 32 uses a through hole 32a and two first receiving portions 32b to house the light-emitting element 34a, the light-receiving element 34b, the driving circuit 34c, and the processing circuit 34d.

[0069] The second receiving portion 32c is a bottomed groove extending further from the top wall 32ba of the first receiving portion 32b in the positive z-axis direction. The second receiving portion 32c has an inner wall surface 32ca on either the positive or negative y-axis side. The inner wall surface 32ca intersects the first surface 31a, and in this embodiment, they are orthogonal. The second receiving portion 32c respectively receives the second substrate 34g and the control circuit 34h. The second substrate 34g utilizes the mounting portion 34g1 (see reference 1) on which the control circuit 34h is mounted. Figure 5The second receiving portion 32c is mounted on the inner wall surface 32ca of the housing 32. This mounting is achieved, for example, by a thermally conductive adhesive. Here, the second receiving portion 32c is an example of a mounting structure having a wall surface for mounting the second substrate; it is an example of a groove-like mounting structure.

[0070] Two positioning holes 32d extend from the first substrate 31 in the assembled state of the optical transceiver 30, facing the positive z-axis direction. Positioning pins 38 are inserted and fixed into the positioning holes 32d. Two threaded fixing portions 32e are composed of recesses that are recessed from the positive z-axis direction side of the housing 32 facing the negative direction, and threaded holes that extend further from the recesses in the negative z-axis direction and penetrate the housing 32. Threaded members 37 are arranged in the threaded fixing portions 32e such that the head of the threaded member 37 abuts against the recess and the threaded portion of the threaded member 37 is inserted into the threaded hole.

[0071] Next, the lens assembly 35 will be described. The lens assembly 35 has a lens array 35a disposed on a cuboid-shaped main body and two positioning pins 35b. The lens assembly 35 is mounted on the first surface 31a of the first substrate 31. The lens array 35a includes: a condenser lens array, with unit lenses arranged in a two-dimensional arrangement of 12 rows × 2 columns; and a collimating lens array, with unit lenses arranged in a two-dimensional arrangement of 12 rows × 2 columns. With the optical transceiver 30 assembled, the unit lenses of the condenser lens array are optically connected to each VCSEL of the light-emitting element 34a. Similarly, with the optical transceiver 30 assembled, the unit lenses of the collimating lens array are optically connected to each photodiode of the light-receiving element 34b. The positioning pins 35b extend from the main body in the positive z-axis direction and are inserted into the positioning holes of the MT connector described later.

[0072] Next, the fiber optic cable 33 with connector will be described. The fiber optic cable 33 with connector has a fiber optic cable 33a and an MT connector 33b. The fiber optic cable 33a comprises two 12-core ribbon fibers. The MT connector 33b is mounted at the end of the fiber optic cable 33a. The MT connector 33b has two positioning holes that engage with two positioning pins 35b of the lens assembly 35. The fiber optic cable 33 with connector is positioned by the two positioning pins 35b engaging with the two positioning holes of the MT connector 33b and is mounted on the lens assembly 35. With the fiber optic cable 33 with connector mounted on the lens assembly 35, the 24 fibers constituting the two ribbon fibers are optically connected to the VCSEL or photodiode via the unit lens constituting the lens array 35a. Furthermore, with the fiber optic cable 33 with connector mounted on the lens assembly 35, the fiber optic cable 33a extends in a direction intersecting the first substrate 31.

[0073] Next, the lower frames 36a and 36b will be explained. For example... Figure 4As shown, the lower frames 36a and 36b are mounted on the second surface 31b of the first substrate 31, sandwiching the electrical interface 34f. The lower frames 36a and 36b are, for example, made of metal. The lower frame 36a is a plate-shaped member extending in the xy direction, having a threaded hole 36aa extending in the z-axis direction, a positioning hole 36ab extending in the z-axis direction, and a receiving portion 36ac recessed from the positive z-axis direction towards the negative z-axis direction. With the lower frame 36a mounted on the first substrate 31, a threaded member 37 is screwed into the threaded hole 36aa, and a positioning pin 38 is inserted and fixed into the positioning hole 36ab. Furthermore, as... Figure 3 As shown, the receiving section 36ac houses the electronic component 34e. Here, the lower frame 36b is an example of a receiving member for housing the electronic component. The lower frame 36b is a plate-shaped member extending in the xy direction, having a threaded hole 36ba and a positioning hole 36bb that extend in the z-axis direction. When the lower frame 36b is mounted on the first substrate 31, a threaded member 37 is screwed into the threaded hole 36ba, and a positioning pin 38 is inserted and fixed into the positioning hole 36bb.

[0074] Next, the threaded member 37 and the locating pin 38 will be described. The threaded member 37 is sequentially inserted into the threaded hole of the threaded fixing part 32e of the housing 32, the threaded hole 31c of the first substrate 31, and screwed into the threaded hole 36aa of the lower frame 36a or the threaded hole 36ba of the lower frame 36b. Thus, the threaded member 37 secures the housing 32, the first substrate 31, and the lower frames 36a and 36b. The locating pin 38 is a cylindrical member, for example, made of metal. The locating pin 38 can sequentially pass through the locating hole 36ab of the lower frame 36a or the locating hole 36bb of the lower frame 36b, and the locating hole 31d of the first substrate 31, engaging with the locating hole 32d of the housing 32, and fixed by adhesive or the like. The locating pin 38 functions to precisely align the relative positions of the lower frames 36a and 36b, the first substrate 31, and the housing 32. Furthermore, the locating pin 38 is used to mount the optical transceiver 30. Figure 1 The positioning pin 38 is used for positioning when the fixing mechanism 40 is shown. In addition, the positioning pin 38 does not necessarily have to be set on the optical transceiver 30, but can also be set on the fixing mechanism 40.

[0075] also, Figure 3 The heat-conducting element 39 shown thermally connects the drive circuit 34c and the processing circuit 34d to the top wall 32ba of the first receiving portion 32b of the housing 32. The heat-conducting element 39, for example, comprises silicone resin and a thermally conductive adhesive, filling the space between the drive circuit 34c and the processing circuit 34d and the top wall 32ba.

[0076] In the optical transceiver 30 according to Embodiment 1 configured as described above, the control circuit 34h is mounted on the inner wall surface 32ca of the housing 32 via the second substrate 34g. Therefore, space for mounting the control circuit 34h does not need to be secured on the first substrate 31. As a result, the optical transceiver 30 becomes smaller, especially the area required for mounting is reduced. Furthermore, the switching device 100 also becomes smaller, or, in terms of its size, more optical transceivers 30 can be mounted. In addition, the control circuit 34h is mounted on the inner wall surface 32ca of the housing 32, thereby ensuring a heat dissipation path for the control circuit 34h within the housing 32.

[0077] Furthermore, in the optical transceiver 30, such as Figure 3 As shown, the heat emitted by the drive circuit 34c, processing circuit 34d, and control circuit 34h is dissipated in the same direction through the housing 32. Specifically, the heat emitted by the control circuit 34h is dissipated in the positive z-axis direction through the housing 32 as indicated by arrow Ar1. Furthermore, the heat emitted by the drive circuit 34c and processing circuit 34d is dissipated in the positive z-axis direction through the heat conduction element 39 and the housing 32 as indicated by arrow Ar2. Therefore, the heat emitted by the drive circuit 34c, processing circuit 34d, and control circuit 34h can be easily processed. For example, if a heat dissipation mechanism such as a heat sink is provided on the surface of the housing 32 in the positive z-axis direction, the heat emitted by the drive circuit 34c, processing circuit 34d, and control circuit 34h can be processed simultaneously. Furthermore, in the optical transceiver 30, the housing 32 is made of a material with good thermal conductivity, thus providing excellent heat dissipation efficiency.

[0078] Furthermore, in the optical transceiver 30, since the lower frame 36a houses the electronic component 34e, interference between the electronic component 34e and the substrate 10, etc., can be prevented.

[0079] Furthermore, in the optical transceiver 30, since at least the connecting portion 34g2 of the second substrate 34g is flexible, the second substrate 34g will not deform even if the inner wall surface 32ca is orthogonal to the first surface 31a and the second substrate 34g is mounted on the inner wall surface 32ca.

[0080] An example of the assembly method for the optical transceiver 30 will be described. First, a control circuit 34h is mounted on the second substrate 34g. Meanwhile, a light-emitting element 34a, a light-receiving element 34b, a driving circuit 34c, a processing circuit 34d, electronic components 34e, and a lens assembly 35 are mounted on the first substrate 31. Next, the second substrate 34g is mounted on the first substrate 31. Then, a heat-conducting member 39 is supplied. Next, a housing 32 is mounted on the first substrate 31. At this time, the lens assembly 35 is housed in a through-hole 32a, and the second substrate 34g and the control circuit 34h are housed in a second housing portion 32c. Next, a threaded member 37 is installed. Then, a thermally conductive adhesive, for example, is supplied from the through-hole 32a to the second housing portion 32c to fix the second substrate 34g to the inner wall surface 32ca of the second housing portion 32c.

[0081] (Implementation Method 2)

[0082] Figure 6 This is a schematic perspective view of the optical transceiver involved in Embodiment 2. Figure 7 yes Figure 6 The image shows a side view of the optical transceiver. The optical transceiver 30A has a [missing information - likely referring to a device or component]. Figures 2-4 The optical transceiver 30 shown has a structure where the housing 32 is replaced with housing 32A and the second substrate 34g is replaced with second substrate 34Ag. Additionally, in Figure 6 , Figure 7 The diagrams of the fiber optic cable 33 with connector, the positioning pin 38, and the heat conduction component 39 are omitted.

[0083] The housing 32A has a structure in which two first receiving portions 32b and two second receiving portions 32c in the housing 32 are replaced with two receiving portions 32Ag. The two receiving portions 32Ag are recesses from the surface (facing the negative z-axis direction) that abuts against the first substrate 31 in the assembled state of the optical transceiver 30A, towards the positive z-axis direction. The two receiving portions 32Ag are located at a position that sandwiches a through hole 32a in the y-axis direction and communicate with the through hole 32a. Furthermore, the two receiving portions 32Ag have a top wall 32Aga extending along the xy direction. The top wall 32Aga is substantially parallel to the first surface 31a of the first substrate 31.

[0084] Figure 8 This is a three-dimensional view of the second substrate 34Ag and the control circuit 34h. (See diagram below.) Figures 6-8As shown, the second substrate 34Ag is a flexible substrate with electrical wiring patterns formed on its interior and surface. When the optical transceiver 30A is assembled, it is bent into a "コ" shape and mounted on the wall surface, i.e., the top wall 32Aga, of the housing 32A. Here, the receiving portion 32Ag is an example of a mounting structure with a wall surface for mounting the second substrate; it is an example of a recessed mounting structure. Therefore, the housing 32A houses the drive circuit 34c, the processing circuit 34d, the second substrate 34Ag, and the control circuit 34h via two receiving portions 32Ag.

[0085] The optical transceiver 30A, configured as described above, is also small, similar to the optical transceiver 30, and a heat dissipation path for the control circuit 34h is ensured within the housing 32A. Furthermore, in the optical transceiver 30A, the heat generated by the drive circuit 34c, processing circuit 34d, and control circuit 34h is also dissipated in the positive z-axis direction via the housing 32A. Moreover, the housing 32A is made of a material with good thermal conductivity, resulting in excellent heat dissipation efficiency. Furthermore, no deformation occurs on the second substrate 34Ag.

[0086] (Implementation Method 3)

[0087] Figure 9 This is a schematic perspective view of the optical transceiver involved in Embodiment 3. Figure 10 yes Figure 9 The image shows a top view of the optical transceiver. The optical transceiver 30B has the following structure: Figures 2-4 In the optical transceiver 30 shown, housing 32 is replaced with housing 32B, second substrate 34g is replaced with second substrate 34Bg, and heat-conducting element 39 is replaced with heat-conducting element 39B. Additionally, in Figure 9 , Figure 10 The diagram omits the fiber optic cable 33 with connector and the positioning pin 38.

[0088] The housing 32B has a structure in which two first receiving portions 32b and two second receiving portions 32c in the housing 32 are replaced with two first receiving portions 32Bb and two countersunk portions 32Bc. The two first receiving portions 32Bb are recesses from the surface (facing the negative z-axis direction) that abuts against the first substrate 31 when the optical transceiver 30A is assembled, in the positive z-axis direction, and a protrusion 32Bba is formed on the bottom surface of the recess, protruding in the positive z-axis direction. The two first receiving portions 32Bb are located at positions that sandwich a through hole 32a in the y-axis direction and communicate with the through hole 32a. The housing 32B utilizes the two first receiving portions 32Bb to house the drive circuit 34c and the processing circuit 34d. Furthermore, a heat-conducting member 39B thermally connects the drive circuit 34c and the processing circuit 34d to the protrusion 32Bba of the housing 32. The heat-conducting element 39B, for example, comprises silicone resin and a thermally conductive adhesive, filling the space between the drive circuit 34c, the processing circuit 34d, and the protrusion 32Bba.

[0089] Furthermore, the two countersunk portions 32Bc are recessed portions from the side of the housing 32B facing the y-axis in the positive or negative direction of the y-axis, and have wall surfaces 32Bca facing the positive or negative direction of the y-axis. The wall surfaces 32Bca intersect with the first surface 31a of the first substrate 31, and are orthogonal in this embodiment.

[0090] Figure 11 This is a perspective view of the second substrate 34Bg and the control circuit 34h. (See diagram below.) Figures 9-11 As shown, the second substrate 34Bg is a flexible substrate with electrical wiring patterns formed on its interior and surface. When the optical transceiver 30B is assembled, it is bent into an L-shape and mounted on the wall surface 32bca of the countersunk portion 32Bc of the housing 32B. Here, the countersunk portion 32Bc is an example of a mounting structure having a wall surface for mounting the second substrate; it is an example of a countersunk mounting structure. Furthermore, the wall surface 32bca of the countersunk portion 32Bc can also be referred to as the outer wall surface of the housing 32B.

[0091] The optical transceiver 30B, configured as described above, is also small, similar to the optical transceiver 30, and a heat dissipation path for the control circuit 34h is ensured within the housing 32B. Furthermore, in the optical transceiver 30B, the heat generated by the drive circuit 34c, processing circuit 34d, and control circuit 34h is also dissipated in the positive z-axis direction via the housing 32B. Moreover, the housing 32B is made of a material with good thermal conductivity, resulting in excellent heat dissipation efficiency. Furthermore, no deformation occurs on the second substrate 34Bg.

[0092] (Modified example)

[0093] In the embodiment described, the second substrate and the first substrate are electrically and mechanically connected by solder, conductive adhesive or anisotropic conductive adhesive, but the second substrate and the first substrate may also be electrically and mechanically connected by an electrical connector.

[0094] For example, Figure 12 This is an explanatory diagram of a modified example of the optical transceiver according to Embodiment 2. In the optical transceiver 30C of this modified example, an electrical connector 34Ci is provided on the second substrate 34Ag, and the second substrate 34Ag and the first substrate 31 are electrically connected and mechanically connected through the electrical connector.

[0095] Furthermore, in the above-described embodiment 1, the second receiving portion 32c is a bottomed groove, but the second receiving portion can also be a through hole. For example, Figure 13 This is an explanatory diagram of a modified example of the optical transceiver according to Embodiment 1. Figure 14 yes Figure 13The diagram shows a top view of the optical transceiver. In the housing 32D of the optical transceiver 30D according to this modified example, the second housing portion 32Dc, corresponding to the second housing portion 32c of the optical transceiver 30, is a through hole extending further from the top wall of the first housing portion 32b in the positive z-axis direction, and has an inner wall surface 32Dca. The second housing portion 32Dc houses the second substrate 34g and the control circuit 34h. The second substrate 34g is mounted to the inner wall surface 32Dca, which is a wall surface of the housing 32D, using a mounting portion on which the control circuit 34h is mounted. This mounting is achieved, for example, by a thermally conductive adhesive. Here, the second housing portion 32Dc is an example of a mounting structure having a wall surface for mounting the second substrate, and is an example of a hole-like mounting structure. Furthermore, the through hole 32Da corresponding to the through hole 32a of the optical transceiver 30 does not communicate with the second housing portion 32Dc. In this case, in order to fix the second substrate 34g to the inner wall surface 32Dca of the second receiving portion 32Dc, a thermally conductive adhesive is supplied from the opening of the second receiving portion 32Dc.

[0096] Furthermore, in the described embodiment, the second substrate is entirely composed of a flexible substrate, but for example, it may also be as follows: Figure 15 As shown in the modified example of the second substrate, the mounting portion 34Eg1 of the second substrate 34Eg, where the control circuit 34h is mounted, is a rigid substrate, while the connecting portion 34Eg2, which is electrically and mechanically connected to the first substrate 31, is a flexible substrate. In this case, the connecting portion 34Eg2 is, for example, made of a flexible substrate. In this case, the second substrate 34Eg does not deform.

[0097] Furthermore, in the optical transceiver 30B according to Embodiment 3, the countersunk hole portion 32Bc is provided on the side (outer wall surface) of the housing 32B facing the y-axis direction, but the countersunk hole portion can also be provided on other outer wall surfaces (e.g., the outer wall surface on the positive z-axis direction, i.e., the top surface). Moreover, a second substrate and a control substrate can also be mounted on this countersunk hole portion.

[0098] Furthermore, in the described embodiment, the control circuit may also be mounted on the first substrate. In this case, a drive circuit, processing circuit, or electronic components may be mounted on the second substrate instead of the control circuit.

[0099] Furthermore, for example, in Embodiment 1, the connecting portion 34g2 of the second substrate 34g is electrically and mechanically connected to the first substrate 31. However, the second substrate 34g and the first substrate 31 may also be electrically connected without passing through the connecting portion 34g2. In this case, the second substrate 34g and the first substrate 31 may also be electrically connected via conductors such as bonding wires. Furthermore, the second substrate 34g and the control circuit 34h mounted thereon may be electrically connected to the drive circuit 34c, the processing circuit 34d, and other electronic circuits via conductors such as bonding wires, without passing through the first substrate 31. The same applies in other embodiments.

[0100] Furthermore, the present invention is not limited to the embodiments described above. Structures formed by appropriately combining the various structural elements are also included in the present invention. Moreover, those skilled in the art can readily derive further effects and modifications. Therefore, the present invention is not limited to the embodiments described above, and various modifications are possible.

[0101] Industrial availability

[0102] This invention can be applied to optical transceivers.

[0103] -Explanation of Figure Markers-

[0104] 10: Substrate

[0105] 10c: edge

[0106] 20: Switching ASIC

[0107] 21: Radiator

[0108] 21a: Fin

[0109] 30, 30A, 30B, 30C, 30D: Optical transceivers

[0110] 31: First substrate

[0111] 31a: First page

[0112] 31b: Second page

[0113] 31c: Threaded hole

[0114] 31d: Positioning hole

[0115] 32, 32A, 32B, 32D: Shell

[0116] 32Ag: Containment Department

[0117] 32ba, 32Aga: Top wall

[0118] 32b, 32Bb: First Containment Department

[0119] 32Bba: convex part

[0120] 32Bc: Countersunk section

[0121] 32a, 32Da: Through holes

[0122] 32Dc: Second Containment Department

[0123] 32ca, 32Dca: inner wall surface

[0124] 32bca: wall

[0125] 32c: Second Containment Department

[0126] 32d: Positioning hole

[0127] 32e: Threaded fixing part

[0128] 33: Fiber optic cable with connector

[0129] 33a: Fiber optic cable

[0130] 33b: MT connector

[0131] 34a: Light-emitting element

[0132] 34b: Light receiving element

[0133] 34c: Drive circuit

[0134] 34d: Processing circuit

[0135] 34e: Electronic components

[0136] 34f: Electrical interface

[0137] 34g, 34Ag, 34Eg: Second substrate

[0138] 34g1, 34Eg1: Installation section

[0139] 34g2, 34Eg2: Connecting part

[0140] 34h: Control circuit

[0141] 34Ci: Electrical connector

[0142] 35: Lens assembly

[0143] 35a: Lens array

[0144] 35b, 38: Positioning pins

[0145] 36a, 36b: Lower frame

[0146] 36aa, 36ba: Threaded holes

[0147] 36ab, 36bb: Positioning holes

[0148] 36ac: Containment Department

[0149] 37: Threaded components

[0150] 39, 39B: Heat transfer components

[0151] 40: Fixed mechanism

[0152] 100: Switching device

[0153] 200: Motherboard

[0154] Ar1, Ar2: Arrows.

Claims

1. An optical transceiver, characterized in that, have: Light-emitting element, outputs light; A light-receiving element that receives light and outputs an electrical signal corresponding to that light; The driving circuit drives the light-emitting element; The processing circuit processes the electrical signal from the light-receiving element; A first substrate is on which the light-emitting element, the light-receiving element, the driving circuit, and the processing circuit are mounted. The housing houses the light-emitting element, the light-receiving element, the driving circuit, and the processing circuit. A control circuit that controls the drive circuit and the processing circuit; The second substrate has a mounting portion for mounting the control circuit and a flexible connection portion; and An electrical interface, located on the first substrate, electrically connects the optical transceiver to external devices. The second substrate is mounted to the wall of the housing using the mounting portion.

2. The optical transceiver according to claim 1, wherein, The second substrate is electrically connected to the first substrate via the connecting portion.

3. The optical transceiver according to claim 1, wherein, The drive circuit, the processing circuit, and the control circuit are in thermal contact with the housing via a heat-conducting element. The heat generated by the drive circuit, the processing circuit, and the control circuit is dissipated in the same direction through the housing.

4. The optical transceiver according to claim 1, wherein, The wall surface is parallel to or intersects with the first surface on which the driving circuit and the processing circuit are mounted in the first substrate.

5. The optical transceiver according to claim 1, wherein, The housing includes a mounting structure having the wall surface.

6. The optical transceiver according to claim 5, wherein, The mounting structure is provided in the groove, recess, hole or countersunk hole of the housing.

7. The optical transceiver according to claim 1, wherein, The optical transceiver includes: Electronic components are mounted on a second side of the first substrate, opposite to the first side on which the driving circuit and the processing circuit are mounted; and A housing component is mounted on the second surface to house the electronic component.

8. The optical transceiver according to claim 1, wherein, The shell is made of a material with good thermal conductivity.

9. The optical transceiver according to claim 1, wherein, The second substrate is electrically connected to the first substrate by solder, conductive adhesive, anisotropic conductive adhesive or electrical connector.

10. The optical transceiver according to claim 1, wherein, The electrical interface includes a pad grid array.

11. The optical transceiver according to claim 1, wherein, The optical transceiver includes: a positioning pin that penetrates at least the first substrate and engages with a positioning hole disposed in the housing.

12. The optical transceiver according to claim 1, wherein, The housing is provided with positioning holes. The positioning pin, which is provided in the fixing mechanism for fixing the optical transceiver to the substrate, passes through the first substrate at least and engages with the positioning hole.

13. The optical transceiver according to claim 1, wherein, The optical transceiver includes an optical fiber extending in a direction intersecting the first substrate.

14. An optical communication device, characterized in that, have: Multiple optical transceivers, which are the optical transceivers described in any one of claims 1 to 13; and Electrical components are electrically connected to the plurality of optical transceivers.

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