Electronic circuit and method for manufacturing an electronic circuit

Abstract

The present invention relates to an electronic circuit (100) having a first circuit board (105), a second circuit board (110), and a connecting device (115). The first circuit board (105) has an outer side (118) and an inner side (120) opposite to the outer side (118). The first circuit board (105) has at least one first conductor line (130) and / or at least one through hole (190). The second circuit board (110) has an outer side (122) and an inner side (128) opposite to the outer side (122). The second circuit board (110) has a second conductor line (135), and the inner side (128) of the second circuit board (110) faces the inner side (120) of the first circuit board (105). The connecting device (115) is disposed in the gap (125) between the first circuit board (105) and the second circuit board (110). The connecting device (115) is configured to be detachable and forms at least one connecting element (165) having a bottom (175) and an arcuate element (185) adjacent to the bottom (175). The lower side of the bottom (175) is disposed on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The arcuate element (185) passes at least partially through a through-hole (190) of the first circuit board (105) of the electronic circuit (100). Alternatively, the upper side of the arcuate element (185) contacts the inner side (120) of the first circuit board (105).

Description

Technical Field

[0001] This invention relates to an electronic circuit and a method for manufacturing the electronic circuit. Background Technology

[0002] Parasitic stray inductance may occur in power electronic devices.

[0003] Document DE 10 2015 215 084 A1 discloses a seal for a via.

[0004] Document DE 10 2016 205 169 A1 discloses a method, system and electrical connector for manufacturing circuits (electronic devices).

[0005] Document DE 10 2016 218 788 A1 discloses a circuit board connection.

[0006] Document EP 1544954 A2 discloses different variations of contact springs used in antenna amplifiers.

[0007] Document US 2009 / 0190319 A1 discloses a three-dimensional module.

[0008] Document JP 2010-206 505 A discloses a piezoelectric device and a method for manufacturing the same. Summary of the Invention

[0009] Against this backdrop, the present invention provides an improved electronic circuit according to the independent claims and an improved method for manufacturing the electronic circuit. Advantageous designs are given by the dependent claims and the following description.

[0010] The advantages that can be achieved by utilizing the scheme proposed in this paper are particularly in providing an electronic circuit that can reduce stray inductance, especially parasitic stray inductance.

[0011] An electronic circuit includes a first circuit board, a second circuit board, and a connecting device. The first circuit board has an outer side and an inner side opposite to the outer side. The first circuit board has a first conductor line and / or at least one through-hole. The second circuit board has an outer side and an inner side opposite to the outer side. The second circuit board has a second conductor line, and the inner side of the second circuit board faces the inner side of the first circuit board. The connecting device is disposed in the gap between the first and second circuit boards. The connecting device is configured to be detachable and forms at least one connecting element having a bottom and an arcuate element adjacent to the bottom. The lower side of the bottom is disposed on the inner side of the second circuit board of the electronic circuit. The arcuate element passes at least partially through the through-hole of the first circuit board of the electronic circuit. Alternatively, the upper side of the arcuate element contacts the inner side of the first circuit board.

[0012] Circuit boards can be manufactured in low cost and in large quantities. The connection device, also known as a board-to-board connector, can reduce the height in the gap due to its configuration, thereby reducing stray inductance. The first and second circuit boards can, for example, be designed to be separable, allowing them to be separated with minimal effort. Therefore, the connection device can be detachable. Detachable connection devices greatly simplify installation and removal. Furthermore, maintenance and repair are also simplified. Adaptation to assembled components (e.g., gate resistors) is also simplified. The bottom can be soldered to the second circuit board, and the arcuate element can be soldered to the first circuit board. Alternatively, the upper side of the arcuate element can be clamped to the inner side of the first circuit board. The electronic circuitry can achieve a smaller overall component size through better space utilization. Furthermore, the electronic circuitry can achieve a smaller overall component size through the higher current-carrying capacity of the connection device and therefore the smaller size of the connection device.

[0013] The proposed solution can also be viewed as an optimized, low-parasitic layout using a connection device, which can also be called a pitch-optimized, separable board-to-board connector, and may also include solutions for such separable connection devices.

[0014] The proposed scheme for achieving an optimized, low-parasitic layout through the use of pitch-optimized connection devices can also be used for other substrate combinations, such as DBC (direct bonded copper, a connection technology that achieves tight electrical / thermal connections through copper) and / or AMB (active metal brazed, a connection technology or form of brazing in which metal and ceramic are connected without metallization), and not only for combinations of PCBs with IMS or other circuit boards.

[0015] The connecting device may include a metallic material. This metallic material can be, in particular, formed into a conductive metal sheet. For example, the metallic material may be a coated or uncoated copper sheet.

[0016] The connecting element can be at least partially shaped as a parabola and / or an Ω shape and / or a C shape and / or an O shape. The connecting element can be easily bent into the desired shape.

[0017] The connecting element can be integrally formed. Therefore, the connecting element can be manufactured quickly and at low cost.

[0018] The connecting element can be formed with at least one mechanical stop, particularly on the outer edge of the connecting element. For example, the first circuit board can be placed flat on this stop. The stop can thus define the height between the circuit boards.

[0019] The connecting element can be formed into multiple segments, particularly pin-shaped segments or comb-shaped connecting elements. The spacing between the segments can be uniform. These segments can, for example, be configured as stops for a first circuit board, which can be placed flat on these stops. These segments can thus define the height between the circuit boards. These segments can better achieve a clamping or press-fit connection because tolerances can be better compensated for, thereby increasing the contact area.

[0020] The connecting device can form another connecting element having another bottom and another arcuate element adjacent to the other bottom. Another lower side of the other bottom can be disposed on the inner side of the second circuit board of the electronic circuit. The other arcuate element can pass at least partially through the through-hole or another through-hole of the first circuit board of the electronic circuit. Alternatively, another upper side of the other arcuate element can contact the inner side of the first circuit board. The other connecting element and the connecting element can be identically formed and / or can be manufactured in low cost and in large quantities.

[0021] One method for manufacturing an embodiment of the electronic circuit described herein includes a providing step and an arrangement step. In the providing step, a first circuit board, a second circuit board, and connecting devices are provided. In the arrangement step, the connecting devices are arranged between the circuit boards. The bottom of the connecting element is disposed on the second circuit board, and the arcuate element of the connecting element passes at least partially through a through-hole in the first circuit board to manufacture the electronic circuit. Alternatively, the upper side of the arcuate element contacts the inner side of the first circuit board. In the arrangement step, the bottom can be disposed on the second circuit board using surface mount technology. The circuit boards can, for example, be designed to be separable, thus allowing them to be separated without significant cost. Therefore, the connecting devices can be removable. Removable connecting devices can greatly simplify installation and removal. Furthermore, maintenance and repair can be simplified. Adaptation to assembled components (e.g., gate resistors) is simplified.

[0022] The proposed solution also provides an apparatus configured to perform, control, or implement the steps of a variation of the proposed method within a suitable device. This variation of the invention, implemented through such an apparatus, can also quickly and efficiently solve the task on which the invention is based.

[0023] The device can be an electrical apparatus that processes electrical signals, such as sensor signals, and outputs control signals accordingly. The device may have one or more suitable interfaces, which can be constructed in hardware and / or software. In a hardware construction, these interfaces may, for example, be part of an integrated circuit in which the functionality of the device is implemented. These interfaces may also be standalone integrated circuits or at least partially composed of discrete components. In a software construction, these interfaces may be software modules, which may exist, for example, on a microcontroller along with other software modules.

[0024] Furthermore, it is advantageous to have a computer program product having program code that can be stored on a machine-readable medium such as semiconductor memory, hard disk memory or optical memory, and for performing the method according to one of the above embodiments when the program is executed on a computer or device. Attached Figure Description

[0025] This invention will be described in detail with reference to the accompanying drawings. The drawings are as follows: Figure 1 A diagram illustrating one embodiment of an electronic circuit; Figure 2 A diagram illustrating a stray inductance for explaining one embodiment of an electronic circuit is shown; Figure 3 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 4 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 5 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 6 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 7 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 8 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 9 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 10 A diagram illustrating one embodiment of an electronic circuit; Figure 11 A diagram illustrating one embodiment of an electronic circuit; Figure 12 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 13A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 14 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 15 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 16 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 17 A diagram illustrating one embodiment of an electronic circuit; Figure 18 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 19 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 20 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 21 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 22 A diagram illustrating a connection device for explaining one embodiment of an electronic circuit is shown. Figure 23 A diagram illustrating one embodiment of an electronic circuit; Figure 24 A flowchart illustrating one embodiment of a method for manufacturing electronic circuits; Figure 25 A block diagram illustrating one embodiment of a control device for manufacturing electronic circuits; Figure 26 A circuit diagram showing one embodiment of an electronic circuit; and Figure 27 A diagram illustrating one embodiment of an electronic circuit. Detailed Implementation

[0026] In the following description of preferred embodiments of the present invention, elements shown in different figures and functioning similarly are referred to by the same or similar reference numerals, and these elements will not be described repeatedly.

[0027] Figure 1 An illustration shows one embodiment of the electronic circuit 100. More specifically, a longitudinal cross-sectional view of the electronic circuit 100 is shown.

[0028] The electronic circuit 100 has a first circuit board 105, a second circuit board 110, and a connecting device 115.

[0029] The first circuit board 105 has an outer side 118 and an inner side 120 opposite to the outer side 118.

[0030] The second circuit board 110 has an outer side 122 and an inner side 128 opposite to the outer side 122. The inner side 128 of the second circuit board 110 faces the inner side 120 of the first circuit board 105, and a gap 125 is formed between the first circuit board 105 and the second circuit board 110. A connecting device 115 is arranged in the gap 125, which allows the electronic circuit 100 to have a small height hcc.

[0031] A first circuit board 105 (e.g., a PCB) has a first conductor line 130 and a second circuit board 110 (e.g., an IMS) has a second conductor line 135. According to one embodiment, the second conductor line 135 is disposed on the inner side surface 128 of the second circuit board 110 and the first conductor line 130 is disposed on the inner side surface 120 of the first circuit board 105.

[0032] An element 138 is disposed, for example, in the gap 125 between circuit boards 105 and 110. This element is configured, by way of example only, as a snubber (also referred to as a Csnubb). Element 138 is in electrical contact with the second conductor line 135.

[0033] According to another embodiment, another element 140 is arranged in the gap 125. This other element 140, for example, has a greater height than element 138. This other element 140 is configured, by way of example only, as a transistor, more precisely a semiconductor transistor and / or a high-side transistor (also referred to as an HS transistor), and is in electrical contact with the second conductor line 135. A thermally conductive material 155 is arranged, for example, between the other element 140 and the second conductor line 135.

[0034] According to another embodiment, a third element 150 is disposed in the gap 125 between the first circuit board 105 and the second circuit board 110. The third element 150 is configured as a transistor only by way of example and has the same height as the other element 140. The third element 150 is configured as a low-side transistor, for example, and may be referred to as an LS transistor. Another thermally conductive material 160 is disposed, for example, between the third element 150 and the second conductor line 135.

[0035] The third element 150 is arranged, for example, adjacent to the other element 140, which is arranged, by way of example, between element 138 and the third element 150.

[0036] According to one embodiment, the connecting device 115 forms two connecting elements 165, 168, which have bottoms 175, 178 and arcuate elements 185, 188.

[0037] Connecting element 165 is arranged adjacent to element 138 in gap 125, for example. Arc-shaped element 185 is pin-shaped and passes at least partially through through-hole 190 of first circuit board 105. The lower side of bottom 175 is arranged on the inner side 128 of second circuit board 110 of electronic circuit 100, and is exemplarily arranged on second conductor line 135 only. For example, bottom 175 is soldered to second circuit board 110. Arc-shaped element 185 is soldered from above and / or electrically contacted or potentially electrically contacted with first circuit board 105.

[0038] The other connecting element 168 is shaped identically to, for example, connecting element 165, and is arranged adjacent to the third element 150 in the gap 125. The other bottom 178 of this other connecting element 168 contacts the second circuit board 110, and the other arcuate element 188 of this other connecting element 168 passes at least partially through another through-hole 195 of the first circuit board 105. Connecting elements 165 and 168 are shaped identically only by way of example.

[0039] The connecting device 115 is shown and described in more detail in the following figures.

[0040] In the operational readiness state of electronic circuit 100, current path 198 passes through circuit boards 105 and 110, as illustrated only by arrows. More precisely, current path 198 passes through conductor lines 130 and 135 and extends counterclockwise according to the embodiment shown herein. Current path 198 passes through connecting element 165 and the other connecting element 168.

[0041] By arranging the connection device 115 in the electronic circuit 100, the height hcc in the gap 125 is reduced. The smaller height hcc provides a favorable geometry for the current path 198, thereby achieving a smaller stray inductance.

[0042] In other words, proper layout design is a crucial and decisive aspect that must be considered when designing power electronics for fast-switching applications such as gallium nitride transistors. Based on Figure 1 The layout geometry of the current path 198 shown reduces or avoids parasitic stray inductance, thereby ensuring that the switching performance of fast-switching power electronics is not affected.

[0043] Figure 1This diagram illustrates the structure of a vertical commutation loop, featuring bottom-cooled components 140 and 150 (also referred to as transistors), a connection device 115 (also referred to as a board-to-board connector), and the use of a first circuit board 105 (also referred to as a PCB) and a second circuit board 115 (also referred to as an IMS, i.e., an insulated metal substrate). Therefore, the design's height hcc is limited by the height of the tallest component (here, the connection device 115 soldered to the second circuit board 110, which can also be referred to as a signal board-to-board connector), and the minimum L of this design... CC It is fixed. Dynamic switching tests of this type of design show that the stray inductance (also known as fixed Lcc) has little impact on the switching performance of power electronics, which greatly improves their fast switching capability.

[0044] The connector 115 is optimized to achieve a low-interference layout with a vertical commutation loop. The height hcc is advantageous for the design, and the distance between the two circuit boards 105, 110 can be less than three millimeters, less than two millimeters, and / or less than one millimeter to reduce the height hcc, which is necessary for a low-parasitic layout. The current-carrying capacity is relatively high compared to space requirements, and therefore also has a high current density, resulting in significantly fewer and / or shorter matings. Using the connector 115 presented herein, when the connector 115 is used as a spacer element, the height hcc between the two circuit boards 105, 110 can be defined with sufficiently precise tolerances. The connector 115 is, for example, shaped small enough to meet, for example, the requirements of high-current applications.

[0045] The connector 115 is mounted to the second circuit board 110 (also known as an IMS circuit board) using, for example, SMT (Surface Mount Technology) technology, or a non-conductive connector passes through the second circuit board 110, because otherwise the upper and lower sides of the second circuit board 110 would be electrically connected, which should be avoided. The connector 115 is self-positioned on the pads and will not float or shift during soldering.

[0046] The first circuit board 105 and the second circuit board 110 are designed to be separable, for example, so that they can be separated with minimal effort, and the connecting device 115 (also referred to as a plug connector) is therefore detachable. The detachable connecting device 115 greatly simplifies installation and removal. Furthermore, maintenance and repair are also simplified. Adaptation of assembled components (e.g., gate resistors) during development is also simplified.

[0047] Figure 1 This paper presents a novel solution for an optimized, low-parasitic layout of a connection device 115 using a spacing-optimized design. Therefore, the first circuit board 105 can be positioned closer to the second circuit board 110, thereby optimizing the parasitic layout and improving aspects of the design such as: reducing parasitic stray inductance L by decreasing the height hcc. CCSignificantly reduced. Reduced L CC This reduces parasitic effects on the fast switching performance of power electronic devices. By increasing feasible switching speeds, switching losses in power electronic devices are reduced and the efficiency of electrical systems is improved.

[0048] Furthermore, the current-carrying capacity of the connector 115 is relatively high compared to the required space, resulting in a significantly smaller or shorter mating connector. This provides better layout options and further improves the design. Additionally, by using connecting elements 165 and 168 as spacers, the height hcc between the two circuit boards 105 and 110 is defined with sufficiently precise tolerances.

[0049] Figure 2 A diagram illustrating stray inductance for one embodiment of an electronic circuit is shown. An optimized spacing 200 for the connection is shown, which is exemplary only 1.4 mm and has a stray inductance of approximately 6.4 nH. Spacing 200 corresponds, for example, to... Figure 1 The height shown.

[0050] This demonstrates an improvement in drain-source voltage oscillation during shutdown. By reducing the spacing between the two circuit boards (also referred to as boards) by 200, stray inductance is reduced by more than half. If the previous older signal board had a spacing of 3.6 mm between the board terminals (for example only), then... Figure 2 The spacing in the middle is reduced from 200 to 1.4 mm (for example only).

[0051] Figure 3 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 1 The connecting devices in the series are similar or identical, except that the connecting device 115 is formed differently. The connecting device 115 can also be called an Ω-shaped bent plate connector.

[0052] The connecting device 115 forms a connecting element 165 having a bottom 175 and an arcuate element 185. The connecting element 165 is, by way of example only, at least partially shaped and configured as a parabola or Ω shape for insertion into gaps in electronic circuitry, such as, by way of example only in… Figure 6 As shown and described in more detail.

[0053] Figure 4 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 3 The connecting devices are similar or the same, except that the connecting device 115 is shown in a front view.

[0054] Figure 5 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 3 and / or Figure 4 The connecting devices are similar or the same, except that connecting device 115 is shown in a side view.

[0055] Figure 6 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. This connection device 115 is related to the above-described... Figures 3 to 5 The connecting devices in one of them are similar or the same.

[0056] The connecting device 115 forms a connecting element 165 having a bottom 175 and an arcuate element 185. The connecting element 165 is integrally formed, for example, and forms at least one mechanical stop 600.

[0057] According to one embodiment, the connecting element 165 forms a mechanical stop 600 on one outer edge of the arcuate element 185. Another mechanical stop 605 is formed, for example, on another outer edge of the arcuate element 185.

[0058] In other words, the connecting device 115 can also be called an Ω-shaped spacer bent plate connector (Ω-D-BSC) and has mechanical stops 600, 605 on its outer edges, for example, the first circuit board is laid flat on these stops and thus defines the spacing or height between the circuit boards.

[0059] Figure 7 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 6 The connecting devices are similar or identical, except that a portion of the connecting device 115 is shown in a side view. The mechanical stop 600 is therefore clearly visible.

[0060] Figure 8 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. This connection device 115 is related to the above-described... Figures 3 to 7 The connecting devices in one of them are similar or the same, except that the connecting device 115 forms multiple sections 800.

[0061] Segments 800 are shaped, for example, such that they form connecting elements 165 in a comb-like manner. Segments 800 are similarly shaped and also form along the arcuate element 185. Segments 800 serve, for example, as stops on a circuit board.

[0062] In other words, the connecting device 115 can also be referred to as an Ω-shaped spacer bent pin connector (Ω-D-BPSC). The arc-shaped element 185 (also referred to as the contact side of the circuit board) is divided, for example, into multiple individual pins or shorter segments 800 to increase the design possibilities of the circuit board. This also allows for the formation of mechanical stops between the segments 800 (on which the circuit board lies flat) and thus defines the spacing or height between the circuit boards. Individual segments 800 also have the advantage that clamping or press-fit connections function better because tolerances can be better compensated and the contact area is increased.

[0063] Figure 9 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 8 The connecting devices are similar or identical, except that a portion of the connecting device 115 is shown in a side view.

[0064] These segments 800 extend, for example, through the curved element 185 and terminate above the bottom 175. The first circuit board lies, for example, flat on these segments 800.

[0065] Figure 10 A diagram illustrating one embodiment of electronic circuit 100 is shown. Electronic circuit 100 and... Figure 1 The electronic circuits are similar or identical, the difference being the connection device 115 and Figures 3 to 9 The connecting devices in one of them are similar or the same.

[0066] The connecting device 115 forms connecting element 165 and the other connecting element 168. Here, connecting elements 165 and 168 are formed identically only by way of example, and more precisely, at least partially formed in a parabolic or Ω shape.

[0067] The bottom 175 of the connecting element 165 contacts, for example, the second conductor line 135 of the second circuit board 110. The arcuate element 185 of the connecting element 165 extends at least partially from the through hole 190 of the first circuit board 105. The connecting element 165 is arranged adjacent to element 138.

[0068] The other connecting element 168 is arranged adjacent to the third element 150, and the other bottom 178 of the other connecting element 168 is connected to the second conductor line 135 of the second circuit board 110. The other arcuate element 188 of the other connecting element 168 passes at least partially through the other through hole 195 of the first circuit board 105.

[0069] Based on the molding of connecting elements 165 and 168, the height hcc is correspondingly reduced. Through holes 190 and 195 are, for example, electrically insulated.

[0070] In the operational readiness state, the current path 198 passes, for example, counterclockwise through conductor lines 130 and 135 and through connecting elements 185 and 188. More precisely, the current path passes through the gaps in the arcuate elements 185 and 188 due to their parabolic and / or Ω-shaped configurations.

[0071] In other words, Figures 3 to 10 The connecting device 115, which may also be referred to as an Ω-shaped bent plate connector (Ω-BSC, Ω-D-BSC), is shown to describe a board-to-board connection scheme that may also be referred to as a pitch-optimized connection.

[0072] The connecting device 115 is made of, for example, a conductive metal sheet (e.g., coated or uncoated copper sheet) and is bent into, for example, a desired Ω shape. The connecting device 115 is soldered on one side, i.e., with its bottoms 175, 178 flat on the second circuit board 110, for example, in a vapor phase soldering process along with other components 138, 140, 150, and on the other side, i.e., the arcuate elements 185, 188 can pass through through holes 190, 195 (also referred to as elongated holes, see also) Figure 7 The contacts and clamps are made in the first circuit board 105, i.e., pressed in or soldered from above.

[0073] Figure 11 This illustration shows one embodiment of electronic circuit 100. Here, electronic circuit 100 is... Figure 10 The electronic circuitry is similar or identical to that shown, except that a top view of the first circuit board 105 is presented. More specifically, through-holes 190 and 195 are shown, through which the arcuate elements of the connecting device can pass.

[0074] Figure 12 A diagram is shown illustrating a connection device 115 for illustrating one embodiment of an electronic circuit. This connection device 115 is similar to or the same as the connection devices in any of the above figures, except that the connection device 115 is differently shaped.

[0075] The connecting device 115 forms a connecting element 165 having a bottom 175 and an arcuate element 185. The connecting element 165 is at least partially shaped as an Ω shape and / or an O shape. The connecting device 115 may also be referred to, for example, as an O-shaped bent pin connector.

[0076] Figure 13 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 12 The connecting devices are similar or the same, except that the connecting device 115 is shown in a front view.

[0077] Figure 14A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 11 and / or Figure 12 The connecting devices are similar or the same, except that connecting device 115 is shown in the rear view.

[0078] Figure 15 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figures 12 to 14 The connecting devices in one of them are similar or the same, except that the connecting element 165 forms multiple segments 800.

[0079] Connecting device 115, for example, with Figure 10 The connecting devices are similar or identical, except that the connecting element 165 is at least partially constructed in an Ω shape and / or an O shape.

[0080] The connecting device 115 can be referred to, for example, as an O-type bent pin connector (O-BPSC). The arc-shaped element 185 (also referred to as the contact side for the circuit board) is divided into multiple individual, shorter segments 800 to improve the design possibilities of the circuit board. The individual segments 800 also have the advantage that the contact made by pressing against the conductive outer layer of the circuit board can function better because tolerances can be better compensated and the contact area is increased.

[0081] Figure 16 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 15 The connecting devices are similar or identical, except that a portion of the connecting device 115 is shown in a side view.

[0082] Figure 17 A diagram illustrating one embodiment of electronic circuit 100 is shown. Electronic circuit 100 and... Figure 10 The electronic circuits in them are similar or the same, the difference being the arrangement of the connecting device 115. The connecting device 115 and... Figures 12 to 16 The connecting devices in one of them are similar or the same.

[0083] The connecting elements 165 and 168 are arranged in the gap 125 of the electronic circuit 100 such that one surface of the arcuate elements 185 and 188 contacts the inner surface 120 of the first circuit board 105. The first circuit board 105, for example, does not have through holes.

[0084] In the operational readiness state, the current path 198 passes, for example, counterclockwise through the conductive lines 130, 135 and the connecting elements 185, 188. More precisely, the current path passes through the gaps in the arcuate elements 185, 188 due to their O-shaped and / or Ω-shaped configurations.

[0085] In other words, Figures 12 to 17 The connecting device 115, which may also be referred to as an O-shaped bent plate connector (O-BSC, O-BPSC), is shown to describe the connecting device 115.

[0086] The connecting device 115 is made of, for example, a conductive metal sheet (e.g., coated or uncoated copper sheet) and is bent into, for example, a desired Ω shape. The connecting device 115 is soldered on one side, i.e., with its bottoms 175, 178 flat on the second circuit board 110, for example, in a vapor phase soldering process along with other components 138, 140, 150, and on the other side, i.e., the arcuate elements 185, 188, are in contact with the inner surface 120 (also referred to as the conductive outer layer) of the first circuit board 105 by pressure. This connection is particularly easy to re-disconnect because it does not require melting solder.

[0087] Figure 18 A diagram is shown illustrating a connection device 115 for illustrating one embodiment of an electronic circuit. This connection device 115 is similar to or identical to the connection devices in any of the preceding figures, except that the connecting element 165 is at least partially formed in a C-shape. The connection device 115 may also be referred to as a C-shaped bent pin connector (C-BSC).

[0088] Figure 19 A diagram is shown illustrating a connection device 115 for illustrating one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 18 The connecting devices are similar or the same, except that the connecting device 115 is shown in a front view.

[0089] Figure 20 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 18 and / or Figure 19 The connecting devices are similar or the same, except that connecting device 115 is shown in the rear view.

[0090] Figure 21 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figures 18 to 20 The connecting devices in one of them are similar or the same, except that the connecting element 165 forms multiple segments 800.

[0091] For example, connecting device 115 and Figure 10 and / or Figure 16 The connecting devices are similar or identical, except that the connecting element 165 is at least partially shaped as a C.

[0092] The connecting device 115 can also be referred to as a C-shaped bent pin connector (C-BPSC). The arc-shaped element 185 (also referred to as the contact side of the circuit board) is divided into multiple individual, shorter segments 800 to improve the design possibilities of the circuit board. The individual segments 800 also have the advantage that the contact made by pressing against the conductive outer layer of the circuit board can function better because it can better compensate for tolerances and thus increase the contact area.

[0093] Figure 22 A diagram shows a connection device 115 used to illustrate one embodiment of an electronic circuit. In this connection device 115, a connection is... Figure 22 The connecting devices are similar or identical, except that a portion of the connecting device 115 is shown in a side view.

[0094] Figure 23 A diagram illustrating one embodiment of electronic circuit 100 is shown. Electronic circuit 100 and... Figure 15 The electronic circuits in them are similar or identical, the difference being the design of the connecting device 115. The connecting device 115 and... Figures 18 to 22 The connecting device 115 in one of them is similar or the same.

[0095] The connecting elements 165 and 168 are arranged in the gap 125 of the electronic circuit 100 such that the surfaces of the arcuate elements 185 and 188 contact the inner surface 120 of the first circuit board 105. The first circuit board 105, for example, does not have through holes.

[0096] In the operational readiness state, the current path 198 passes, for example, counterclockwise through conductor lines 130 and 135 and through connecting elements 185 and 188. More precisely, the current path 198 passes, for example, through arcuate elements 185 and 188.

[0097] In other words, Figures 18 to 23 A connecting device 115, which may also be referred to as a C-shaped bent metal strip connector (C-BSC, C-BPSC), is shown to describe the connecting device 115.

[0098] The connecting device 115 is made of, for example, a conductive metal sheet (e.g., coated or uncoated copper sheet) and is bent into, for example, a desired C-shape. The connecting device 115 is soldered on one side, i.e., with its bottom 175, 178 flat on the second circuit board 110, for example, in a vapor phase soldering process along with other components 138, 140, 150, and on the other side, i.e., the arcuate elements 185, 188, are in contact with the inner surface 120 (also referred to as the conductive outer layer) of the first circuit board 105 by pressure. This connection is particularly easy to re-disconnect because it does not require melting solder.

[0099] Figure 24A flowchart illustrating one embodiment of a method 2400 for manufacturing an electronic circuit is shown. This electronic circuit is similar to or identical to the electronic circuits in any of the above figures.

[0100] Method 2400 includes a providing step 2405 and an arrangement step 2410. In the providing step 2405, a first circuit board, a second circuit board, and a connecting device are provided. In the arrangement step 2410, the connecting device is arranged between the circuit boards. The bottom of this connecting element is disposed on the second circuit board, and the arcuate element of the connecting element passes at least partially through a through-hole in the first circuit board to fabricate an electronic circuit. Alternatively, the upper side of the arcuate element contacts the inner surface of the first circuit board.

[0101] Figure 25 A block diagram illustrating one embodiment of a control device 2500 for manufacturing electronic circuits is shown. The control device 2500 is configured for controlling and / or performing... Figure 24 The method or similar method.

[0102] For this purpose, the control device 2500 includes a providing unit 2505 and an arrangement unit 2510. The providing unit 2505 is configured to provide a first circuit board, a second circuit board, and a connecting device. The arrangement unit 2510 is configured to arrange the connecting device between the two circuit boards. The bottom of the connecting element is disposed on the second circuit board, and the arcuate element of the connecting element passes at least partially through a through-hole in the first circuit board to fabricate electronic circuitry. Alternatively, the upper side of the arcuate element contacts the inner surface of the first circuit board.

[0103] Figure 26 A circuit diagram illustrating one embodiment of electronic circuit 100 is shown. The electronic design of this electronic circuit 100 is similar to or the same as one of the figures above.

[0104] The electronic circuit 100 has a first power supply voltage terminal 2602 and a second power supply voltage terminal 2604, wherein a capacitor 2606 is connected between the power supply voltage terminals 2602 and 2604.

[0105] Electronic circuit 100 has, for example, a bridge circuit unit 2600, which includes a first half-bridge 2605 and a second half-bridge 2610. The first half-bridge 2610 includes a first switch 2615 and a second switch 2620, which are interconnected via a tap 2625. The first switch 2615 constitutes a high-side switch and the second switch 2620 constitutes a low-side switch, wherein the switches 2615 and 2620 are configured as transistors.

[0106] The first switch 2615 represents the additional component 140, and the second switch 2620 represents the third component 150. The electronic circuit 100 includes, for example, a first comparator 2630 and a second comparator 2635. The first comparator 2630 is connected, for example, to the first switch 2615, and a first inductor 2640 is connected between the first switch 2615 and the first comparator 2630. The second comparator 2635 is connected, for example, to the second switch 2620, and a second inductor 2645 is connected between the second switch 2620 and the second comparator 2635.

[0107] The second switch 2620, together with the second inductor 2645 and the second comparator 2635, forms, for example, a gate loop 2650, which may also be referred to as a gate loop.

[0108] The second half-bridge 2610 has an element 138, which represents a series circuit consisting of a capacitor 2655 and a resistor 2660.

[0109] A third inductor 2665, which may also be referred to as a stray inductor and / or L, is connected between the first half-bridge 2605 and the second half-bridge 2610. CC In the operational readiness state, current path 198 (e.g., ...) Figure 1 The circuit passes through the bridge circuit unit 2600 and forms a commutation loop 2670.

[0110] In other words, Figure 23 The most common parasitic stray inductance is shown. In fast-switching applications, the stray inductance L of the commutation loop 2670 is... CC The greatest impact on switching performance can be reduced through proper layout, for example, Figure 1 As shown and described.

[0111] Figure 27 A diagram illustrating one embodiment of electronic circuit 100 is provided. This electronic circuit 100 is similar to or corresponds to the electronic circuit in one of the above figures. In other words, Figure 27 The minimized vertical commutation loop and its geometric parameters are shown.

[0112] The current path 198 extending along the first circuit board 105 and the second circuit board 110 is shown. All four parameters, lcc, hcc (i.e., height hcc), wcc, and tcc, are related to the total stray inductance L. CC There is a direct impact. The height hcc (also known as the spacing hcc) between the current paths 198 in the vertical commutation loop is significantly reduced, thereby also reducing the corresponding stray inductance L. CC .

[0113] The parameter lcc represents, for example, the length of electronic circuit 100, hcc represents, for example, the height of electronic circuit 100, wcc represents the width, and tcc represents the thickness.

[0114] The embodiments described and shown in the accompanying drawings are merely exemplary options. Different embodiments may be combined with each other, either entirely or in terms of a single feature. One embodiment may also be supplemented by features of another embodiment.

[0115] Furthermore, the method steps according to the invention can be repeated and performed in a different order than the stated order.

[0116] If an embodiment includes an "and / or" connection between the first feature and the second feature, it can be understood that the embodiment has both the first feature and the second feature according to one implementation and only the first feature or only the second feature according to another implementation.

[0117] List of reference numerals

[0118] 100 Electronic Circuits

[0119] 105 First Circuit Board

[0120] 110 Second Circuit Board

[0121] 115 Connecting device

[0122] 118 The outer side of the first circuit board

[0123] 120 Inner side of the first circuit board

[0124] 122 The outer side of the second circuit board

[0125] 125 gap

[0126] 128 Inner side of the second circuit board

[0127] 130 First Conductor Circuit

[0128] 135 Second Conductor Circuit

[0129] 138 components

[0130] 140 Another component

[0131] 150 Third Component

[0132] 155 Thermal conductive material

[0133] 160 Another thermally conductive material

[0134] 165 Connecting elements

[0135] 168 Another connecting element

[0136] 175 Bottom of connecting element

[0137] 178 The other bottom of the other connecting element

[0138] 185 Arc-shaped element of connecting element

[0139] 188 Another arc-shaped element of the other connecting element

[0140] 190 Through-holes on the first circuit board

[0141] 195 Another through hole on the first circuit board

[0142] 198 Current Path

[0143] 200 spacing

[0144] 600 Mechanical Stop

[0145] 605 Another mechanical stop

[0146] 800 section

[0147] 1600 gap

[0148] 2400 Methods for manufacturing electronic circuits

[0149] 2405 provides steps

[0150] 2410 Layout Steps

[0151] 2500 Control device for manufacturing electronic circuits

[0152] 2505 Providing Unit

[0153] 2510 Layout Unit

[0154] 2600 Bridge Circuit Unit

[0155] 2602 First power supply voltage terminal

[0156] 2604 Second power supply voltage terminal

[0157] 2605 First Half Bridge

[0158] 2606 capacitor

[0159] 2610 Second Half Bridge

[0160] 2615 First Switch

[0161] 2620 Second Switch

[0162] 2625 Tuition Point

[0163] 2630 First Comparator

[0164] 2635 Second Comparator

[0165] 2640 First Inductor

[0166] 2645 Second Inductor

[0167] 2650 gate circuit

[0168] 2655 capacitor

[0169] 2660 resistor

[0170] 2665 Third Inductor

[0171] 2670 Reversing Loop

[0172] Lcc stray inductance

[0173] lcc length

[0174] wcc width

[0175] hcc height

[0176] TCC thickness

Claims

1. Electronic circuit (100), which has the following characteristics: A first circuit board (105) has an outer side (118) and an inner side (120) opposite to the outer side (118), the first circuit board (105) has at least one first conductor line (130) and the first circuit board (105) has at least one through hole (190). A second circuit board (110) having an outer side (122) and an inner side (128) opposite to the outer side (122), the second circuit board (110) having a second conductor line (135), and the inner side (128) of the second circuit board (110) facing the inner side (120) of the first circuit board (105); and A connecting device (115) is disposed in the gap (125) between the first circuit board (105) and the second circuit board (110). The connecting device (115) is detachable and forms at least one connecting element (165) having a bottom (175) and an arcuate element (185) adjacent to the bottom (175). The lower side of the bottom (175) is disposed on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The arcuate element (185) passes at least partially through the through-hole (190) of the first circuit board (105) of the electronic circuit (100) or the upper side of the arcuate element (185) contacts the inner side (120) of the first circuit board (105). Its features are, The connecting device (115) forms another connecting element (168), which has another bottom (178) and another arcuate element (188) adjacent to the other bottom (178). The other lower side of the other bottom (178) is arranged on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The other arcuate element (188) passes at least partially through the through hole (190) or another through hole (195) of the first circuit board (105) of the electronic circuit (100), or the other upper side of the other arcuate element (188) contacts the inner side (120) of the first circuit board (105). The connecting element (165) and the other connecting element (168) are arranged and connected such that the first conductor line (130), the second conductor line (135), the connecting element (165) and the other connecting element (168) are in electrical contact.

2. The electronic circuit (100) according to claim 1, wherein, The connecting device (115) includes a metallic material, particularly the metallic material being formed into a conductive metal sheet.

3. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (165) is at least partially shaped as a parabola and / or an Ω shape and / or a C shape and / or an O shape.

4. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (165) is integrally formed.

5. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (165) is formed to form at least one mechanical stop (600), particularly at least one mechanical stop is formed on the outer edge of the connecting element (165).

6. The electronic circuit (100) according to any one of the preceding claims, wherein, The connecting element (165) is formed into multiple segments (800), particularly the segments (800) are formed into pins or the connecting element (165) is formed into a comb.

7. A method (2400) for manufacturing an electronic circuit (100) according to any one of claims 1 to 6, wherein, The method (2400) includes the following steps: Provided (2405) a first circuit board (105), a second circuit board (110), and a connecting device (115); and A connecting device (115) is arranged (2410) between the circuit boards (105, 110), the bottom (175) of the connecting element (165) is arranged on the second circuit board (110), and the arcuate element (185) of the connecting element (165) passes at least partially through a through hole (190) of the first circuit board (105) to manufacture an electronic circuit (100). The arcuate element (185) passes at least partially through the through hole (190) of the first circuit board (105) of the electronic circuit (100) or the upper side of the arcuate element (185) contacts the inner side (120) of the first circuit board (105). Furthermore, for the... The connecting device (115) arranges another connecting element (168), which has another bottom (178) and another arcuate element (188) adjacent to the other bottom (178). The other lower side of the other bottom (178) is arranged on the inner side (128) of the second circuit board (110) of the electronic circuit (100). The other arcuate element (188) passes at least partially through the through hole (190) or another through hole (195) of the first circuit board (105) of the electronic circuit (100), or the other upper side of the other arcuate element (188) contacts the inner side (120) of the first circuit board (105). The connecting element (165) and the other connecting element (168) are arranged and connected such that the first conductor line (130), the second conductor line (135), the connecting element (165) and the other connecting element (168) are in electrical contact.

8. A control device (2500) configured to perform and / or control the steps of the method (2400) according to claim 7 in corresponding units (2505, 2510).

9. A computer program product having program code for performing the method (2400) according to claim 7 when the computer program product is executed on a control device (2500).

10. A machine-readable storage medium on which the computer program according to claim 9 is stored.

Images