Semiconductor bonding system and method

Abstract

Semiconductor bonding with better placement accuracy and / or higher throughput than previous systems is described. A track comprising a path through a plurality of processing stations is used. A plurality of substrate holders are coupled to the track. Each substrate holder is configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations to enable the first substrate to be bonded to a second substrate. A controller is coupled to the track and the plurality of substrate holders. The controller is configured to control relative motion between the plurality of substrate holders to move each substrate holder along the path through the plurality of processing stations independently of the other substrate holders, with a range and speed of each substrate holder varying according to a track position relative to the plurality of processing stations.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to European application 24166691.6, filed on 27 March 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This specification relates to semiconductor bonding systems and methods. Background Technology

[0004] In the manufacturing process of integrated circuits (ICs), multiple finished or unfinished ICs (e.g., entire wafers, sawn wafers, partially sawn wafers, chips, dies, etc.) are placed at various points during the fabrication process using contact, stacking, bonding, interconnection, or other methods (e.g., to heterogeneous or homogeneous devices). Integration of different substrates, circuits, or other patterning devices can rely on the interconnection of specific portions of multiple dies (e.g., conductive contact elements)—where these specific portions can be aligned in three-dimensional space to ensure functional connectivity. As the physical size of IC components continues to shrink and their structures become increasingly complex, accuracy, minimization of deformation and variability, and throughput become increasingly important in interconnection. In the context of semiconductor manufacturing, improvements in substrate placement and interconnection lead to improvements in IC manufacturing and integration capabilities. Summary of the Invention

[0005] Semiconductor bonding with better placement accuracy and / or higher throughput compared to prior art systems is described. According to an embodiment, a semiconductor bonding system is provided. The system includes a track comprising a path through a plurality of processing stations. A plurality of substrate holders are coupled to the track. Each substrate holder is configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations such that the first substrate can be bonded to a second substrate. A controller is coupled to the track and the plurality of substrate holders. The controller is configured to control the relative movement between the plurality of substrate holders such that each substrate holder moves independently of the other substrate holders along the path through the plurality of processing stations, wherein the range and speed of each substrate holder vary according to its position on the track relative to the plurality of processing stations.

[0006] In some embodiments, each of the first substrates is a die, and the second substrate comprises a semiconductor wafer. In some embodiments, the first substrate comprises a donor die. The donor die may be held by a carrier, which may include a wafer foil frame, a mask-shaped carrier, a wafer-shaped carrier, a covered individual tray, and / or other carriers. For example, the donor die may be introduced into the semiconductor bonding system via a front-opening transfer cassette (FOUP) of the system. The carrier may be optically transparent, coated with a photosensitive material, and / or have other properties. Each donor die may be coupled to the carrier by an object smaller than the entire surface area of ​​the donor die.

[0007] In some embodiments, each of the plurality of substrate holders includes a chuck configured to receive and hold a first substrate and move the first substrate along a path through a plurality of processing stations such that the first substrate can be bonded to a second substrate. In some embodiments, each substrate holder is configured to move along the path and relative to a track in a horizontal, vertical, and / or rotational direction via a non-contact actuator associated with each substrate holder. In some embodiments, the number of the plurality of substrate holders corresponds to the number of processing stations. For example, the number of the plurality of substrate holders may be equal to the number of processing stations. In some embodiments, the number of the plurality of substrate holders is greater than the number of processing stations. In some embodiments, the number of the plurality of substrate holders is less than the number of processing stations.

[0008] In some embodiments, each of a plurality of substrate holders and / or each of a plurality of processing stations includes one or more isolators configured to isolate the environment of the track and substrate holder from the environment of the processing station. The isolators may include gaskets, plates, suction systems, and / or other components.

[0009] In some embodiments, the track includes a horizontal axis and / or a vertical axis for long-stroke movement. In some embodiments, the track includes two or more parallel processing paths. The parallel processing paths are separate from the main path and associated with at least one of the bonding processing stations. For example, a semiconductor bonding system may include multiple tracks. The plurality of substrate holders may be configured to move in different directions on the multiple tracks. In some embodiments, the tracks have an elliptical shape, an "L" shape, and / or other shapes. In some embodiments, the plurality of substrate holders are configured to move along the path (e.g., around an elliptical or "L" shape) in a continuous closed-loop manner in a clockwise and / or counterclockwise direction. In some embodiments, the track includes a balancing mass configured to counteract deformation and / or vibration in the semiconductor bonding system. In some embodiments, the track includes one or more components configured to move the plurality of substrate holders within a first actuation range, and the plurality of substrate holders include one or more components configured to move a first substrate within a second actuation range shorter than the first actuation range.

[0010] In some embodiments, the track and / or multiple substrate holders include one or more starter coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors, springs and / or other components.

[0011] In some embodiments, the system includes a clamp configured to remove the application tube spool from a carrier and connect the application tube spool to a plurality of substrate holders, each substrate holder connecting one or more application tube spools. The clamp may be and / or include electrostatic clamps, vacuum clamps, gecko clamps, air bearing clamps, mechanical clamps, and / or other clamps. In some embodiments, the clamp is configured to clamp the application tube spool via a grid and / or capacitively, based on a reference point determined by interferometry using a camera. In some embodiments, the clamp is configured to clamp the sides and / or back of the application tube spool. In some embodiments, the clamp is configured to position the application tube spool on a movable substrate holder configured to receive the application tube spool and place it on a track for further processing.

[0012] In some embodiments, the controller includes one or more processors, and / or includes or controls one or more robots, one or more turntables, one or more conveyors, one or more rollers, and / or other components. In some embodiments, the controller and the plurality of substrate holders are configured to perform one or more operations at a plurality of processing stations while a given substrate holder is moving. For example, the movement may be controlled in coordination with the processing timing at the processing station. In some embodiments, the controller and the plurality of substrate holders are configured to perform one or more operations at a plurality of processing stations while a given substrate holder is stopped and the other substrate holders of the plurality of substrate holders are moving.

[0013] In some embodiments, the processing station includes a bonding station and at least one alignment station, a height and / or rotation adjustment station, a leveling station, a placement station, and / or other stations. In some embodiments, at the bonding station of the plurality of processing stations, a given substrate holder is configured to be positioned with sufficient accuracy and force by a controller for bonding to a second substrate; or the given substrate holder is coarsely positioned relative to the second substrate, and the second substrate is moved relative to the given substrate holder with sufficient accuracy and force for bonding. In some embodiments, at the alignment station of the plurality of processing stations, a given substrate holder is configured to be positioned with sufficient accuracy by a controller for alignment measurement by an alignment sensor; or the given substrate holder is coarsely positioned relative to an alignment sensor, and the alignment sensor is moved relative to the given substrate holder with sufficient accuracy for alignment measurement. In some embodiments, the plurality of processing stations includes a cleaning station configured to clean a first substrate prior to bonding. In some embodiments, the plurality of processing stations includes an inspection station configured to detect morphological defects in the first substrate prior to bonding. The inspection station may include a dark-field imager, a level sensor, a Fourier imager, a capacitive sensor, and / or other components. In some embodiments, the plurality of processing stations include a leveling station configured to level the first substrate relative to the second substrate prior to bonding.

[0014] According to another embodiment, a connection method is provided, including one or more of the operations described above. Attached Figure Description

[0015] The above and other aspects and features will become apparent to those skilled in the art after reviewing the following description of specific embodiments in conjunction with the accompanying drawings.

[0016] Figure 1 The diagram illustrates a typical bonding process flow according to an embodiment.

[0017] Figure 2 The figure illustrates a semiconductor bonding system according to an embodiment.

[0018] Figure 3 The illustration shows an example die attaching machine according to an embodiment, which is configured to remove each application main die (first substrate) from the carrier and place each application main die on a substrate holder.

[0019] Figure 4 The illustrations show different views of example tracks of the system according to an embodiment.

[0020] Figure 5 The illustrations show different views of an example substrate holder according to an embodiment of the system.

[0021] Figure 6 The illustration shows a balancing mass component, including one or more torque compensators, that can be included in a system according to an embodiment.

[0022] Figure 7 The illustration shows a semiconductor bonding method according to an embodiment.

[0023] Figure 8 This is a block diagram of an example computer system according to an embodiment. Detailed Implementation

[0024] Die stacking is a technique used to achieve greater functionality in semiconductor devices (e.g., more transistors in a microprocessor). Bonding these dies in the stack with high lateral placement accuracy is crucial to ensuring proper matching of electrical contacts across the stack. This is performed using die-to-wafer or wafer-to-wafer bonding tools (or more generally, substrate-to-substrate bonding tools). Existing die-to-wafer bonding tools can be characterized by their placement accuracy and throughput, expressed in the number of dies placed per hour. Currently, no bonding tool achieves placement accuracy <100 nm, let alone the throughput required for typical semiconductor manufacturing processes. For example, a typical bonding tool performs one substrate-to-substrate bonding process at a time, typically after one or two substrates have been moved sequentially through several separate prior preparatory process stations (e.g., cleaning, alignment, etc.). Typically, as space opens for the next operation, one or two substrates are moved (manually or mechanically) from one station to the next during a long string of substrates undergoing these operations. There is little coordination between process steps at the various processing stations due to processing timing or other factors.

[0025] Advantageously, this system and method facilitate semiconductor bonding with better placement accuracy and / or higher throughput compared to previous bonding tools. A track is used, comprising a path through multiple processing stations. Multiple substrate holders are coupled to the track. Each substrate holder is configured to receive and hold a first substrate and move the first substrate along the path through the multiple processing stations such that the first substrate can be bonded to a second substrate. A controller is coupled to the track, the multiple substrate holders, and / or the processing stations. The controller is configured to control the relative movement between the multiple substrate holders such that each substrate holder moves independently of the others along the path through the multiple processing stations, wherein the range and speed of each substrate holder vary according to its position on the track relative to the multiple processing stations. This arrangement provides placement accuracy of <100 nm, throughput required for typical semiconductor manufacturing processes, and other advantages. For example, controlling the substrate holders independently allows for precise control of the time spent by each individual substrate at each particular processing station. For example, the speed of a first substrate on a first substrate holder undergoing an alignment process can differ from the speed of a second substrate on a second substrate holder undergoing a cleaning operation. Since each processing step at the corresponding processing station can have its own processing time requirements, it is advantageous to be able to control the speed and range of each substrate holder on the track independently in a manner unrelated to each other, for example, if all processing stations need to be occupied simultaneously for throughput, productivity and / or other reasons.

[0026] As an introduction, Figure 1 The diagram illustrates a typical bonding process flow 100. In flow 100, a first substrate 104 (e.g., an applicant die or wafer) is bonded to a second substrate 110 (e.g., a recipient die or wafer). This process is performed one bonding process flow 100 at a time, typically after one or two substrates 104 and 110 have been moved sequentially through several separate prior preparatory processing stations (e.g., cleaning, alignment, etc.). Typically, when space is available for the next operation (e.g., there is little coordination between processing stations based on processing timing or other factors), one or two substrates are moved (manually or mechanically) from one station to the next in a long line of substrates undergoing these operations. Figure 1The illustration shows that during several bonding operations in the entire process flow 100, a top chuck 102 holds a top substrate 104, a pin or piston 106, and a bottom chuck 108 holds a bottom substrate 110. Each of the top chuck 102 and bottom chuck 108 includes a protrusion configured to contact the substrate, a vacuum channel configured to provide vacuum force to hold the wafer against the protrusion, an actuator configured to move the chuck, and / or various other components required for the bonding process flow 100. At operation 120, the top substrate 104 is loaded onto the top chuck 102. At operation 122, the bottom substrate 110 is loaded onto the bottom chuck 108. At operation 124, the top substrate 104 and the bottom substrate 110 are aligned. At operation 126, one and / or both chucks move to establish a specific separation distance between substrates 104 and 110. At operation 128, a bottom vacuum force is established between the bottom chuck 108 and the bottom substrate 110. At operation 130, the pin or piston 106 is positioned against the top substrate 104. At operation 132, the vacuum force inside the top chuck is released, causing the center of the top substrate 104 to be pushed toward the bottom substrate 110 by the pin or piston 106. At operation 134, the vacuum force outside the top chuck is released, causing the outer portion of the top substrate 104 to be pushed toward the bottom substrate 110. At operation 136, the pin or piston force is removed because the top substrate 104 is bonded to the bottom substrate 110.

[0027] Figure 2 The illustration shows a novel semiconductor bonding system 200. Compared to previous systems, system 200 provides better placement accuracy and / or higher throughput for semiconductor bonding, and / or other advantages. The system includes a track 202 comprising a path 204 through multiple processing stations 210 to 228. Multiple substrate holders 206 are coupled to the track. The substrate holders 206 may be shuttles or part of shuttles. For example, the shuttle may be formed by the substrate holders 206 plus any other hardware configured to provide movement of the substrate holders 206 and / or retain the substrate holders 206 coupled to the track 202. Each substrate holder 206 is configured to receive and hold a first substrate 208 and move the first substrate 208 along the path 204 through the multiple processing stations 210 to 228 such that the first substrate 208 can be bonded to a second substrate 230. In some embodiments, each of the first substrates 208 is a die, and the second substrate 230 comprises a semiconductor wafer. For example, a semiconductor wafer may include an additional die configured to receive a first substrate 208. In some embodiments, the first substrate 208 includes an agent die, and the second substrate 230 includes a recipient wafer or a receiver die.

[0028] In some embodiments, the number of substrate holders 206 corresponds to the number of processing stations 210 to 228. For example, the number of substrate holders 206 may be equal to the number of processing stations 210 to 228. In some embodiments, the number of substrate holders 206 is greater than the number of processing stations (e.g., as...). Figure 2 (as shown in the diagram) or fewer than the number of processing stations 210 to 228. In some embodiments, a single first substrate 208 is held by a single substrate holder 206. However, in some embodiments, two or more first substrates 208 may be held by substrate holders 206 and moved through the processing station.

[0029] exist Figure 2 In this process, bonding occurs at bonding station 228, where each first substrate 208 is transferred 232 from substrate holder 206 to second substrate 230 (held by chuck 234 in this example). This process occurs sequentially as substrate holder 206 moves around track 202. As several examples, the processing station may include an initial inspection station 210, a coarse placement station 212, a cleaning station 214, a plasma processing station 216, a topography inspection station 218, a leveling station 220, a coarse alignment station 222, a position adjustment station 224 (e.g., the x, y, z and / or rotational position of each first substrate 208 can be adjusted), a fine alignment station 226, bonding station 228, and / or other stations. It should be noted that the stations in system 200 may be more numerous than those in the previous process. Figure 2 The number of stations shown may be more or less.

[0030] For example, in some embodiments, the processing station includes a bonding station 228 and at least one alignment station 226 and / or 222, a height and / or rotation adjustment station 224, a leveling station 220, a placement station 212, and / or other stations. In some embodiments, at the bonding station 228 of the plurality of processing stations 210 to 228, a given substrate holder 206 is configured to be positioned with sufficient accuracy and force by a controller 250 (described below) for bonding to a second substrate 230; or the given substrate holder 206 is coarsely positioned relative to the second substrate 230, and the second substrate 230 is moved relative to the given substrate holder 206 with sufficient accuracy and force for bonding. In some embodiments, at alignment stations 226 and / or 224 of a plurality of processing stations, a given substrate holder 206 is configured to be positioned with sufficient accuracy by a controller 250 for alignment measurement by an alignment sensor; or the given substrate holder 206 is coarsely positioned relative to an alignment sensor, and the alignment sensor is moved with sufficient accuracy relative to the given substrate holder 206 for alignment measurement.

[0031] With several additional examples, at the initial inspection station 210, the first substrate 208 (e.g., the die) is rejected when, for example, particles hindering proper bonding are found on the surface, or when the first substrate 208 cannot be properly aligned. A clamp (with...) can be used. Figure 3 The machine 300 (illustrated in the figure and described below, similar to and / or identical to) removes the rejected first substrate 208 from the substrate holder. The rejected first substrate 208 may be placed on a carrier such as a wafer foil frame to enable reprocessing, placement in a waste bin, and / or placement in other locations. In some embodiments, the first substrate 208 rejected based on particles may be subjected to a second round on track 202 to create a second opportunity to use the first substrate 208 after cleaning (e.g., as described below). In some embodiments, the first substrate 208 rejected based on alignment sensor and / or level sensor information (e.g., as described below) may be subjected to a second round on track 202 to create a second opportunity to use the first substrate 208. In some embodiments, the relationship between the number of dies placed in the waste bin (e.g., wafer foil frame) and the waste bin capacity may be tracked so that the wafer foil frame transport device can remove it when the waste bin is full.

[0032] In some embodiments, cleaning station 214 is configured to clean the first substrate 208 prior to bonding (e.g., using CO2 snow cleaning—https: / / www.youtube.com / watch?v=XDkkeSINtNw—as one possible example). Another cleaning method may use a high-intensity laser beam to heat / bake / strip particles (preferably using a die-insensitive laser wavelength), and / or use a razor to “scrape” particles from the surface of the first substrate 208 (e.g., a die). Another way to clean the first substrate 208 (e.g., a die or wafer) is to use plasma or chemicals to remove the oxide layer. Stripping the oxide layer takes away any particles along with it. The list of such cleaning methods is not exhaustive.

[0033] In some embodiments, inspection station 218 is configured to detect topographic defects in the first substrate 208 prior to bonding. Topographic inspection looks for particles or dents on the bonding surface of the first substrate 208 (e.g., the donor die). These negatively impact bonding as they often lead to voids. In-line inspection of topographic defects (e.g., particles or dents) improves yield. For example, defective substrates are rejected or may undergo an additional cleaning step. In some embodiments, inspection station 218 may include a dark-field imager, a horizontal sensor, a Fourier imager, a capacitive sensor, a combination of these components, and / or other components. For example, topographic inspection can be performed using a dark-field imager. The die (first substrate 208) can be illuminated at a small angle, and the diffracted / reflected light can be analyzed. The amount of diffracted light is an indicator of defects. For example, sensitivity to small particles can be enhanced by using a short-wavelength light source (e.g., deep ultraviolet (DUV) and / or soft X-rays). In capacitive sensing, the donor die is used as an electrode. When another electrode is brought close to the surface of the donor die, particles on the die will affect the capacitance.

[0034] In some embodiments, the leveling station 220 is configured to level the first substrate 208 prior to bonding. The leveling station 220 may be configured to measure the height of the first substrate 208 (e.g., a die) at at least three points to determine the height (Z), x-dimensional rotation (Rx), and y-dimensional rotation (Ry) of the first substrate 208. In some embodiments, the leveling station 220 may include a semi-dome die stage and is configured to unlock its movement, use an airfoot to level the first substrate 208, and lock the semi-dome. In some embodiments, a confocal microscope may be used for die leveling (parallel array). The required optics can be very small. In some embodiments, an interferometer may be used to measure only the points of interest on the first substrate 208—e.g., the location of alignment marks. In some embodiments, an ultrasonic leveling sensor may be used, where the time of flight is a measure of the distance between the transducer and the first substrate 208. In some embodiments, a barometer may be used as a level sensor, a mirror electron microscope may be used to expose the first substrate 208 with electrons and observe the potential line at a detector, a capacitive sensor may be used as a level sensor, and / or other sensors may be used. In some embodiments, the optical level sensor as part of the leveling station 220 may include a dark-field camera, allowing level sensing to be combined with topography in system 200.

[0035] At position adjustment station 224, X, Y, Z, and / or R (x, y, z) position adjustments occur before fine alignment with an accuracy of approximately 100 nm. These adjustments use coarse alignment information, the position of substrate holder 206 relative to the fixed machine coordinates of system 200, and / or other information to position the first substrate 208 (e.g., the actuator die). For example, an Rz position correction can be performed to limit the rotational initiation of the second substrate 230 (e.g., the receiving wafer) during final die bonding. For example, track 202 can be used to move substrate holder 206 along the X, Y, Z, Rx, Ry, and Rz directions using a six-coil magnet assembly and / or other components. In this way, a magnetically levitated platform with six degrees of freedom can be created (see [link to documentation] for further description of these degrees of freedom). Figure 4 , Figure 5 (and related paragraphs). In some embodiments, a sensor 260 (described herein) such as an accelerometer on track 202 can be used to better attenuate vibrations caused by disturbance forces, thereby achieving higher accuracy. Alternatively, track 202 may facilitate coarse movement of substrate holder 206, and additional mechanisms on substrate holder 206 may serve as short-stroke platforms (as described herein). For example, information regarding any necessary adjustments may also come from the leveling and coarse alignment processing station.

[0036] In some embodiments, one or more of the plurality of substrate holders and / or one or more processing stations include one or more isolators 298 (see Figure 2 (Example dashed line in the diagram) is configured to isolate the environment of track 202 and substrate holder 206 from the environments of processing stations 210 to 228. For example, isolator 298 may include gaskets, plates, suction systems, airflow and / or other components.

[0037] Controller 250 is operatively coupled to track 202, the plurality of substrate holders 206, and / or other components of system 200. Controller 250 is configured to control the relative movement between the plurality of substrate holders 206 such that each substrate holder 206 moves independently of the others along path 204 through the plurality of processing stations 210 to 228, wherein the range and speed of each substrate holder 206 vary according to its position relative to track 202 of the plurality of processing stations 210 to 228. Controller 250 may be configured to control the substrate holders 206, processing stations 210 to 228, and / or other components of system 200 based on output signals and / or other information from track 202, substrate holders 206, and / or processing stations 210 to 228. For example, Figure 2The illustration shows several representative example locations and / or motion sensors 260 on track 202 and / or substrate holder 206, and representative example process sensors 262 at some processing stations 210 to 228. These are merely representative examples (i.e., for space-saving reasons, motion sensors 260 and / or process sensors 262 may not be shown in the illustration). Figure 2 In some part of the system, even if more sensors 260 may be associated with the substrate holder 206 and / or track 202, and more sensors 262 may be associated with each processing station 210 to 228. These and / or other sensors can generate any number and / or type of output signals, which can be used by controller 250 to control system 200. Controller 250 is configured to generate one or more control signals for various components of system 200 based on these (feedback) signals and / or other information. For example, control by controller 250 may include adjustments based on: the position of the various substrate holders 206 on track 202; the speed of the substrate holders; the timing requirements of individual processing stations 210 to 228; the acceleration of the substrate holders; the jerk, snap, crackle, and / or pop of the substrate holders; and / or other information. The control may be performed by means of one or more processors and / or other components of controller 250 (see further explanation of one or more processors). Figure 8 (and the computer system CS described below). In some embodiments, the controller 250, substrate holder 206, track 202 and / or other components of the system 200 include transmitters and / or other components configured to transmit signals to and / or receive signals from the controller 250 to cause the system 200 to operate as described herein.

[0038] In some embodiments, controller 250 includes one or more processors, one or more robots, one or more turntables, one or more conveyors, one or more rollers, and / or other components. For example, in some embodiments, one or more processors of controller 250 may control multiple robots, turntables, conveyors, and / or rollers, wherein the operating speed of each can be controlled individually. As another example, controller 250 may control a single robot, turntable, conveyor, and / or roller moving at a constant speed, such that substrate holder 206 moves co-coordinately, i.e., uniformly, along track 202. In some embodiments, substrate holder 206 may be controlled to move at different speeds in different portions of track 202. In some embodiments, controller 250 and multiple substrate holders 206 are configured such that one or more operations are performed at multiple processing stations 210 to 228 while a given substrate holder 206 is moving. For example, movement may be controlled in coordination with the processing timing at the processing station. In some embodiments, the controller 250 and the plurality of substrate holders 206 are configured such that one or more operations at the plurality of processing stations 210 to 228 are performed while a given substrate holder 206 is stopped (e.g., not moving relative to the processing station), and the other substrate holders of the plurality of substrate holders 206 are moving (relative to the processing station). For example, the controller 250 may be configured to optimize the movement of the substrate holders 206 across all the processing stations 210 to 228 of the system 200 to improve throughput, and / or for other reasons. Such optimization may be based on the processing time required at each individual processing station 210 to 228 and / or other information.

[0039] In some embodiments, the controller 250 and / or other components of the system 200 communicate one-way and / or two-way with each other and / or with other devices, such as mobile user devices, desktop user devices, external resources (such as servers), and / or other devices. Each of these devices may communicate wirelessly and / or via wires. For example, each of these devices may communicate via a network, such as the Internet, or a combination of the Internet and various other networks, such as local area networks, cellular networks, Wi-Fi networks, or personal area networks.

[0040] A mobile user device may be a smartphone, tablet computer, or other handheld networked computing device having a display, user input devices (e.g., buttons, keypads, voice recognition, or single-point or multi-point touchscreens), memory (such as tangible machine-readable non-volatile memory), a network interface, a portable power source (e.g., a battery), and a processor (as used herein, including the term one or more processors) coupled to each of these components. The mobile user device's memory may store instructions that, when executed by the associated processor, provide an operating system and various applications, including a web browser or native mobile applications. For example, a desktop user device may also include a web browser. Additionally, a desktop user device may include a monitor, keyboard, mouse, memory; a processor; and tangible non-transitory machine-readable memory storing instructions that, when executed by the processor, provide an operating system and a web browser. In some embodiments, the on-premises application and web browser are operable to provide a graphical user interface associated with the user, for example, the graphical user interface communicating with controller 250 and / or other components of system 200 and facilitating user interaction with data from system 200.

[0041] In some embodiments, external resources include information sources such as databases, websites, etc.; external entities participating in system 200; one or more servers outside system 200; networks (e.g., the Internet); electronic storage devices; equipment associated with Wi-Fi™ technology; equipment associated with Bluetooth® technology; data entry devices; or other resources. In some embodiments, some or all of the functionality attributed herein to external resources may be provided by resources included in system 200. External resources may be configured to communicate with one or more components of system 200 via wired and / or wireless connections, via networks (e.g., local area networks and / or the Internet), via cellular technology, via Wi-Fi technology and / or via other resources.

[0042] As described above, in some embodiments, each of the first substrates 208 is a die, and the second substrate 230 comprises a semiconductor wafer. In some embodiments, the first substrate 208 comprises a substrate die. The substrate die may initially be formed by a carrier 275 (in... Figure 2 The substrate (shown as having and not having the substrate die) is held in a carrier, which includes a wafer foil frame (e.g., having a diameter larger than the wafer), a mask-shaped carrier, a wafer-shaped carrier, a separate covered tray, and / or other carriers. For example, the substrate die can be introduced into the semiconductor bonding system via the system's front-opening transfer cassette (FOUP) 280. Figure 2The illustration shows FOUP 280, which includes a FOUP for the donor substrate and an optional foil frame, and a second FOUP 282 for the foil frame. The carrier 275 may be optically transparent (e.g., made of glass or a similar material), coated with a photosensitive material (e.g., to help overcome the forces during the pickup of the die from the carrier 275 and placement of the die on the substrate holder 206), and / or have other properties. For example, each donor die may be coupled to the carrier by an object smaller than the entire surface area of ​​the donor die (e.g., for easier removal from the carrier by a clamp). The above can be done to minimize bonding forces and / or for other reasons. For example, the donor die and carrier 275 may be transported to a first processing station (e.g., 210) using any suitable mechanical transport member.

[0043] Once the first processing station is reached or near (or proceeds to) the first processing station (e.g., initial inspection station 210 or coarse placement station 212), each application core (first substrate 208) can be removed from the carrier 275 and placed on the substrate holder 206. Figure 3 The illustration shows an exemplary die attaching machine 300, configured to remove each application main die (first substrate 208) from the carrier 275 and place each application main die on the substrate holder 206. Figure 3 As shown, machine 300 reciprocates between carrier 275 and each successive substrate holder 206, each substrate holder holding one application tube die (first substrate 208). It should be noted that in some embodiments, machine 300 may place more than one application tube die on each substrate holder for processing. Machine 300 may pick up adjacent dies from carrier 275, picking up dies from opposite sides of carrier 275 on each successive pick, and / or may pick up dies in other modes. Dies may be transferred from carrier 275 to substrate holder 206 such that the dies are clamped to the same side of substrate holder 206 as connected to carrier 275. Alternatively, the dies may be flipped during transfer from carrier 275 to substrate holder 206. In some embodiments, carrier 275 may be coupled to controller 250 (… Figure 2 A two-dimensional platform controlled by the carrier 275 is used to move the carrier 275 closer to the substrate holder 206, thereby minimizing the distance between the carrier 275 and the substrate holder 206 for transfer.

[0044] Release of the application tube die from the carrier 275 can be achieved by: (1) peeling the die from the carrier 275 starting from one side or corner; (2) locally heating the carrier 275 to release the carrier adhesive; and (3) exposing the carrier 275 from the back side, i.e., the back side, using light that releases the adhesive and / or by other methods. As described herein, the application tube dies can be transferred one by one from the carrier to the substrate holder 206, wherein each substrate holder 206 has a single application tube die. Alternatively, multiple dies can be placed on a single substrate holder 206 to allow multiple dies to be processed in parallel.

[0045] Machine 300 may include one or more robotic arms, clamps, various motors, and / or other components that allow machine 300 to operate as described herein. For example, in some embodiments, machine 300 includes clamps configured to remove the application tube spool from carrier 275 and connect the application tube spool to a plurality of substrate holders 206, each substrate holder connecting one application tube spool. The clamps may be and / or include electrostatic clamps, vacuum clamps, gecko clamps, air bearing clamps, mechanical clamps, and / or other clamps. In some embodiments, the clamps are configured to clamp the application tube spool capacitively via a grid plate and / or by other methods based on a reference point determined by interferometry using a camera on the clamp. For example, the application tube spool is connected to substrate holders 206 ( Figure 2 Alignment can be performed using a camera based on the position of the die's edge. Alternatively, the die can be configured to mechanically self-align with the substrate holder 206 by means of, for example, recesses or grooves of limited depth in the substrate holder 206, where the size is approximately equal to (or slightly larger than) the size of the die. As another example, accuracy requirements (e.g., ten micrometers) can be met using a three-ball / groove mating interface of the clamp, substrate holder 206, and carrier 275. Typically, if three balls on the object and three grooves on the floor are used to position the object, the positioning is not over-determined and therefore has the highest possible reproducibility. Typically, the positions of the balls and grooves are around the thermal centers of the two objects, thereby eliminating thermal differential effects.

[0046] Relative to the fixed machine coordinate system of System 200 ( Figure 2 This is used to measure and position the clamp (machine 300), the application tube core (first substrate 208), and the substrate holder 206. The fixed machine coordinate system is shared for the clamp, application tube core, and substrate holder 206. For example, it originates from the coarse placement station 212 ( Figure 2 Motion sensor 260 and / or processing sensor 262 at (e.g., see motion sensor 260 and / or processing sensor 262 at the motion sensor 260 and / or processing sensor 262 at the processing sensor 260) (e.g., see motion sensor 260 and / or processing sensor 262 at the processing ...) (e.g., see motion sensor 260 and Figure 2The output signal (as described above) can be used to determine the three-dimensional (3D) coordinates of the clamp, the applicator core, and the substrate holder 206. System 200 may include a reference point configured to serve as a reference point (or multiple reference points) for the sensor and / or clamp to interface with the applicator core (e.g., a 3-ball-groove), ensuring repeatable transport of the applicator core by the clamp and repeatable reception by the substrate holder 206. In some embodiments, the reference point and interface may include a camera-based measurement system that clamps the applicator core edge and clamp contact point within a frame and uses it as a position control input.

[0047] In some embodiments, the clamp is configured to clamp the sides and / or back of the application tube die. For example, mechanical contact between the clamp and the front side of the application tube die can be minimized because this can be plasma-activated to facilitate bonding. In some embodiments, the clamp can be configured to contact the application tube die along one or two narrow slits, for example, near the edge of the die. In some embodiments, an air-bearing clamp can be used. Here, the central region of the clamp is evacuated (placed under vacuum), while the edges include nozzles with overpressurized XCDA air. In this way, there is no mechanical contact with the surface of the application tube die. To prevent the application tube die from slipping off the clamp, a robotic arm and / or other structures can be used to limit lateral movement. In some embodiments, a reverse dome-shaped clamp can be used to support various die sizes and can be compatible with a dome-shaped jig configured to define the starting point for bonding with the host wafer.

[0048] In some embodiments, the clamp is configured to position the application tube core on a movable substrate holder 206, the movable substrate holder being configured to receive the application tube core and place it on a track (see [link]). Figure 2 The clamp can be used for further processing. To improve throughput, the clamp can receive information about the position of the substrate holder 206 (from the controller 250). In this way, the clamp can accurately position the application tube die before the substrate holder 206 has come to a complete stop, or even accurately position the application tube die "in real time" (while the substrate holder 206 is moving).

[0049] Productivity (high-accuracy throughput) is a key parameter for the commercial viability of machine 300 (and / or other parts of system 200). Productivity is achieved by a separate fabrication die that can contact substrate holder 206 and subsequently bond to a second substrate 230. Figure 2The speed is given by the stress (required contact time) Tc allowed during the contact process. Maximum productivity is given by n*Tc, where n equals the number of dies being transferred. In some embodiments, m die-carrying machines 300 (e.g., robots) can be used, which require Td time to capture the dies and move them to the receiving site. Maximum productivity is given by Max(n*Tc, (m / n)*Td). Considering the distance the machines 300 will travel, it is very likely that Td > Tc. To avoid significantly reducing productivity, m machines 300 are needed such that m > Td / Tc. Considering the actual layout of system 200, for example, there may be > 10 machines 300.

[0050] Return to Figure 2 In some embodiments, the second substrate 230 may be a host substrate, such as a host or host wafer. Figure 2 The diagram also illustrates the FOUP for the second substrate 230 before bonding (acceptor FOUP 285) and after bonding (the bonded wafer FOUP 290 for the second substrate once the first substrate 208 has been bonded to the second substrate 230). For example, the second substrate 230 may be transported to a bonding station, and the bonded second substrate 230 (which includes the first substrate 208) may be transported back to the bonding FOUP 290 using any suitable mechanical transport device.

[0051] In some embodiments, each of the plurality of substrate holders 206 includes a chuck configured to receive and hold a first substrate 208 and move the first substrate 208 along a path 204 through a plurality of processing stations 210 to 228 such that the first substrate 208 can be bonded to a second substrate 230. In some embodiments, each substrate holder 206 is configured to move along the path 204 and move relative to the track 202 in a horizontal, vertical, and / or rotational direction via one or more actuators associated with each substrate holder 206 and / or other components.

[0052] For example, Figure 4 and Figure 5 The illustration shows different views of track 202 and substrate holder 206. As a practical example, track 202 (such as tracks produced by Supertrak (https: / / supertrakconveyance.com / )) can be used in system 200, where wheels are used to guide substrate holder 206. Figure 5 As shown, each of the plurality of substrate holders 206 includes a chuck 500 configured to receive and hold a first substrate 208 (see Figure 1). Figure 2), and move the first substrate 208 along track 202 ( Figure 4 , Figure 2 In some embodiments, each substrate holder 206 is configured to move along path 202 and via one or more actuators 550 associated with each substrate holder 206 and / or other components. Figure 5 ) relative to track 202 in the horizontal direction 410, the vertical direction 420 and / or the rotational direction 430 ( Figure 4 Move upwards. Note that the horizontal direction 410 and the vertical direction 420 ( Figure 4 ) is based on Figure 4 The direction shown in the diagram is marked, but... Figure 2 For example, each of these directions can be rotated 90 degrees. In some embodiments, the track 202 and / or the plurality of substrate holders 206 include one or more actuators, such as non-contact actuators, actuation coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors, springs, motors, rotary platforms and / or other components. Figure 5 The illustrations show several examples of these examples, including a mechanical wheel 560, an air-based actuator 570 / vacuum-based actuator 580, and a magnetic bearing 590. In some embodiments, the substrate holder 206 may have one degree of freedom control around the track 202. In some embodiments, each substrate holder 206 may include a non-contact six-DOF microplatform (e.g., Lorentz control as an example) for positioning the first substrate 208 with nanometer-level accuracy. Figure 2 ), for use in bonding and / or Figure 2 Other operations are shown. In this way, among other advantages, vibrations and / or other unwanted forces are not transferred from the adjacent substrate (retainer) or any other component connected to track 202 to the first substrate 208.

[0053] In some embodiments, movement of the substrate holder 206 can be achieved by a hexapod robot on or within a shuttle associated with the substrate holder 206, the hexapod robot being actuated by an electrically controlled actuator (e.g., a piezoelectric actuator and / or a Lorentz actuator and / or other components). In some embodiments, a brake may be present on the chuck of the substrate holder 206 at each processing station. For example, the brake can be released and the chuck adjusted using coils and magnets on the substrate holder 206. Embodiments of the substrate holder and / or shuttle may include three folded leaf springs at a 120-degree angle around a central axis, and / or other components. This enables the substrate holder 206 (chuck) to perform X, Y, and / or Rz movements. For example, for the long-stroke Z-motion required for bonding and / or other operations, the central axis can be moved by three double leaf springs.

[0054] In some embodiments, each substrate holder 206 includes: a protrusion configured to contact a first substrate 208; and a plurality of vacuum channels coupled to a vacuum ( Figure 4 or Figure 5 (Not shown in the image), configured to provide a vacuum force to hold the first substrate 208 against the protrusion; actuators and / or other components (e.g., as described above), configured to move each substrate holder 206; and / or other components. In some embodiments, the system 200 includes a second substrate holder, the second substrate holder including a chuck 234 ( Figure 2 ) and / or configured to hold the second substrate 230 ( Figure 2 Other similar components. The second substrate holder may include: additional protrusions configured to contact the second substrate 230; and a second plurality of vacuum channels ( Figure 4 or Figure 5 (not shown in the image), the second plurality of vacuum channels are configured to provide a second vacuum force to hold the second substrate 230 against the protrusion.

[0055] Return to Figure 2 In some embodiments, track 202 includes one or more components (e.g., actuators, actuation coils, one or more air bearings, mechanical wheels, magnetic bearings, sliding bearings, capacitors, springs, motors, and / or other components described above) configured to move the plurality of substrate holders 206 within a first actuation range. For example, this first actuation range may be a long-stroke actuation range. In some embodiments, track 202 includes a horizontal axis 270 and / or a vertical axis 272 (again, it should be noted that the horizontal axis 270 and the vertical axis 272 are based on...). Figure 2 The direction markings shown in the image are not... Figure 4 In this configuration, each of these axes can rotate 90 degrees to achieve long-stroke movement. Long-stroke movement can include, for example, movements on the order of centimeters or meters. The plurality of substrate holders 206 and / or shuttles, comprising one or more components (e.g., non-contact actuators, actuation coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors, springs, motors, rotary platforms, and / or other components described above), are configured to hold the first substrate 208 and cause the first substrate 208 to move within a second actuation range shorter than the first actuation range. For example, the second actuation range can be a short-stroke actuation range. For example, short-stroke movement can include movements on the order of millimeters, micrometers, and / or nanometers.

[0056] In some embodiments, track 202 includes two or more parallel processing paths 274. The parallel processing paths 274 are separate from the main path and associated with at least one of bonding processing stations 210 to 228. For example, a semiconductor bonding system may include multiple tracks 202. Multiple substrate holders 206 may be configured to move in different directions on the multiple tracks 202. Figure 2 In this parallel processing path 274 (and the track defining it), processing operations 214 (cleaning), 216 (plasma treatment), and 218 (morphological inspection) are skipped. Track 202 may include one or more straight segments, one or more curved segments, and / or other segments. In some embodiments, track 202 has an elliptical shape (e.g., as shown in the image). Figure 2 and Figure 4 (as shown in the figure), "L" shape, and / or other shapes. In some embodiments, a plurality of substrate holders 206 are configured to move in a continuous closed-loop manner along a track 202 / path 204 (e.g., around an elliptical or "L" shape) in a clockwise and / or counterclockwise direction. In some embodiments, the track 202 may be gas- or liquid-cooled, and / or have other temperature control systems.

[0057] In some embodiments, track 202 includes a balancing mass configured to counteract deformation and / or vibration in the semiconductor bonding system 200. For example, as in Figure 6 As shown, system 200 may include a balancing mass element 650, which includes one or more torque compensators T. In this example, two torque compensators T are present. The torque compensators T may include a motor and / or other components with rotating virtual mass blocks (as in this example). Figure 6 As indicated by the arrows, multiple substrate holders 206 and the first substrate 208 move clockwise around track 202. Torque compensators T rotate in the opposite direction. By adding one or more torque compensators T (e.g., a motor with a rotating dummy mass), the reaction torque on the base frame 652 of system 200 can be counteracted and / or at least significantly reduced. Alternatively, the reaction torque (peak) on the base frame 652 can also be significantly reduced by not moving all substrate holders 206 simultaneously. These are just two of many possible options. Overall, the force counteracting by means of a balancing mass is configured to minimize deformation and vibration of the base frame 652. If, as in some embodiments, all substrate holders 206 do move in one direction, the force generates torque on the base frame 652. The torque required to accelerate the rotating dummy mass can counteract the torque generated by moving the substrate holders 206.

[0058] Figure 7 The diagram illustrates semiconductor bonding method 700. Figure 7 The illustration depicts a series of actions (without limitation) in semiconductor bonding. In some embodiments, such as, one or more operations of method 700, can be performed in the system described above, a computer system (e.g., as...) Figure 8 The method 700 may be implemented in, or by, the systems illustrated in, and described below, and / or other systems, or by the systems, computer systems, and / or other systems described above. In some embodiments, the method 700 includes receiving and holding (process placement operation 702) a first substrate (e.g., a donor die or donor wafer) such that it can ultimately be bonded to a second substrate. A plurality of first substrates are each received and held by a plurality of corresponding substrate holders coupled to a track. The first substrates move along a path through a plurality of processing stations such that the first substrates can be bonded to one or more second substrates. The method 700 includes cleaning (operation 704) the first substrate, plasma treatment (operation 706) the first substrate, inspection (morphological inspection operation 708) of the first substrate, leveling (operation 710) the first substrate, coarse alignment (operation 712) of the first substrate, adjusting the position of the first substrate (x, y, z, Rz adjustment operation 714), fine alignment (operation 716) of the first substrate, bonding (operation 718) the first substrate to one or more second substrates (e.g., the receiving main die and / or the receiving main wafer), rejecting (operation 720) the first substrate and / or the bonded first and second substrates if they do not meet process specifications, and / or other operations.

[0059] The operations of method 700 can be performed along a track that includes a path passing through multiple processing stations. Multiple substrate holders are coupled to the track. Each substrate holder is configured to receive and hold a first substrate and move the first substrate along the path through the multiple processing stations such that the first substrate can be bonded to a second substrate, as described above. A controller is coupled to the track and the multiple substrate holders. The controller is configured to control the relative movement between the multiple substrate holders such that each substrate holder moves independently of the other substrate holders along the path through the multiple processing stations, wherein the range and speed of each substrate holder vary according to its position on the track relative to the multiple processing stations.

[0060] In some embodiments, each of the plurality of first substrates is a die, and the second substrate comprises a semiconductor wafer. In some embodiments, the first substrate comprises an application die. The application die may be held by a carrier, which may include a wafer foil frame, a mask-shaped carrier, a wafer-shaped carrier, a covered individual tray, and / or other carriers. For example, the application die may be introduced into the semiconductor bonding system via a front-opening transfer cassette (FOUP) of the system (e.g., at operation 702). The carrier may be optically transparent, coated with a photosensitive material, and / or have other properties. Each application die may be bonded to the carrier by an object smaller than the entire surface area of ​​the application die.

[0061] In some embodiments, each of the plurality of substrate holders includes a chuck configured to receive and hold a first substrate and move the first substrate along a path through a plurality of processing stations such that the first substrate can be bonded to a second substrate. In some embodiments, each substrate holder is configured to move along the path via a non-contact actuator associated with each substrate holder, and in a horizontal, vertical, and / or rotational direction relative to a track. In some embodiments, the number of the plurality of substrate holders corresponds to the number of processing stations. In some embodiments, the number of the plurality of substrate holders is greater than the number of processing stations.

[0062] In some embodiments, a portion of one or more of operations 702 to 720 may include isolating the environment of the track and substrate holder from the environment of the processing station. For example, each of a plurality of substrate holders and / or each of a plurality of processing stations may include one or more isolators configured to isolate the environment. The isolators may include gaskets, plates, suction systems, and / or other components.

[0063] In some embodiments, the track includes a horizontal axis and / or a vertical axis for long-stroke movement. In some embodiments, the track includes two or more parallel processing paths. The parallel processing paths are separate from the main path and associated with at least one of the bonding processing stations. For example, a semiconductor bonding system may include multiple tracks. Multiple substrate holders may be configured to move in different directions on multiple tracks. In some embodiments, the track has an elliptical shape, an "L" shape, and / or other shapes. In some embodiments, the multiple substrate holders are configured to move along the path (e.g., around an elliptical or "L" shape) in a continuous closed-loop manner in a clockwise and / or counterclockwise direction. In some embodiments, the track includes a balancing mass configured to counteract deformation and / or vibration in the semiconductor bonding system. In some embodiments, the track includes one or more components configured to move the multiple substrate holders within a first actuation range, and the multiple substrate holders include one or more components configured to move a first substrate within a second actuation range shorter than the first actuation range. In some embodiments, the track and / or the plurality of substrate holders include one or more starter coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors, springs and / or other components.

[0064] In some embodiments, operation 702 includes removing the application tube spool from the carrier and coupling the application tube spool to a plurality of substrate holders, each substrate holder coupling one application tube spool. This can be performed by clamps and / or other components. The clamps can be and / or include electrostatic clamps, vacuum clamps, gecko clamps, air bearing clamps, mechanical clamps, and / or other clamps. In some embodiments, the clamps are configured to clamp the application tube spool via a grid and / or capacitively, based on a reference point determined by interferometry using a camera. In some embodiments, the clamps are configured to clamp the sides and / or back of the application tube spool. In some embodiments, the clamps are configured to position the application tube spool on a movable substrate holder configured to receive the application tube spool and place it on a track for further processing.

[0065] In some embodiments, the controller includes one or more processors, one or more robots, one or more turntables, one or more conveyor belts, and / or one or more rollers. In some embodiments, the controller and the plurality of substrate holders are configured to perform one or more operations at multiple processing stations while a given substrate holder is moving. For example, the movement can be controlled in coordination with the processing timing at the processing station. In some embodiments, the controller and the plurality of substrate holders are configured to perform one or more operations at multiple processing stations while a given substrate holder is stopped and the other substrate holders among the plurality of substrate holders are moving.

[0066] As a few representative examples, in some embodiments, the processing station includes a bonding station and at least one alignment station, height and / or rotation adjustment station, leveling station, placement station, and / or other stations. In some embodiments, at the bonding station of the plurality of processing stations (i.e., at operation 718), a given substrate holder is configured to be positioned with sufficient accuracy and force by a controller for bonding to a second substrate; or the given substrate holder is coarsely positioned relative to the second substrate, and the second substrate is moved relative to the given substrate holder with sufficient accuracy and force for bonding. In some embodiments, at the alignment station of the plurality of processing stations (i.e., at operations 716 and / or 712), a given substrate holder is configured to be positioned with sufficient accuracy by a controller for alignment measurement by an alignment sensor; or the given substrate holder is coarsely positioned relative to an alignment sensor, and the alignment sensor is moved relative to the given substrate holder with sufficient accuracy for alignment measurement. In some embodiments, the plurality of processing stations may include a cleaning station configured to clean (i.e., operation 704) a first substrate prior to bonding. In some embodiments, the plurality of processing stations include an inspection station configured to detect (i.e., operation 708) topographic defects in the first substrate prior to bonding. The inspection station includes a dark-field imager, a leveling sensor, a Fourier imager, a capacitive sensor, and / or other components. In some embodiments, the plurality of processing stations include a leveling station configured to level the first substrate prior to bonding.

[0067] The operation of method 700 is intended to be illustrative. In some embodiments, method 700 may be implemented using one or more additional operations not described and / or without one or more operations discussed. Additionally, Figure 7 The order of operations of method 700, as illustrated in the diagram and described herein, is not intended to be restrictive.

[0068] In some embodiments, one or more portions of method 700 may be implemented in and / or controlled by one or more processing devices (e.g., digital processors, analog processors, digital circuits designed to process information, analog circuits designed to process information, state machines, and / or other mechanisms for electronically processing information). For example, the processing device may be a computer system or included in a computer system, such as a desktop computer, laptop computer, smartphone, server, and / or other computing device. One or more processing devices may include one or more means that perform some or all of the operations of method 700 in response to instructions electronically stored on an electronic storage medium. One or more processing devices may include one or more means configured by hardware, firmware, and / or software to specifically design for performing the operations of method 700.

[0069] Figure 8 It can be used for one or more operations described in this document (e.g., Figure 7 The diagram illustrates an example computer system CS (one or more of the operations of method 700 and other operations). The computer system CS may be included in and / or similar to the controller described above and / or identical to the controller described above (e.g., the computer system CS may form some or all of the controllers described above). The computer system CS includes a bus BS or other communication mechanism for transmitting information, and a processor PRO (one or more processors) coupled to the bus BS to process information. The computer system CS also includes main memory MM, such as random access memory (RAM) or other dynamic storage coupled to the bus BS, for storing information and instructions to be executed by the processor PRO. The main memory MM may also be used to store temporary variables or other intermediate information during instruction execution by the processor PRO. The computer system CS also includes a read-only memory (ROM) or other static storage device coupled to the bus BS for storing static information and instructions for the processor PRO. A storage device SD, such as a disk or optical disk, is provided and coupled to the bus BS for storing information and instructions.

[0070] A computer system CS can be connected via a bus BS to a display DS, such as a tablet or touch panel display, for displaying information to a computer user or observer. Input devices ID (including alphanumeric keys and other keys) are connected to the bus BS to communicate information and command selections to the processor PRO. Another type of user input device is a cursor control CC, such as a mouse, trackball, or arrow keys, used to transmit directional information and command selections to the processor PRO and to control cursor movement on the display DS. Such input devices typically have two degrees of freedom along two axes; the first axis (e.g., x) and the second axis (e.g., y) allow the device to specify its position in a plane. Touch panel (screen) displays can also be used as input devices.

[0071] In some embodiments, all or some of the operations described herein may be executed by a computer system CS in response to processor PRO executing one or more sequences of one or more instructions included in main memory MM. These instructions may be read into main memory MM from another computer-readable medium, such as storage device SD. Execution of the sequence of instructions included in main memory MM causes processor PRO to perform the process steps (operations) described herein. One or more processors arranged in a multiprocessor configuration may also be used to execute the sequence of instructions included in main memory MM. In some embodiments, hard-wired circuitry may be used in place of or in combination with software instructions. Therefore, the description herein is not limited to any particular combination of hardware circuitry and software.

[0072] As used herein, the terms "computer-readable medium" or "machine-readable medium" refer to any medium that participates in providing instructions to a processor (PRO) for execution. Such media can take many forms, including, but not limited to, non-volatile media, volatile media, and transmission media. Non-volatile media include, for example, optical discs or magnetic disks, such as storage devices (SDs). Volatile media include volatile memory, such as main memory (MMs). Transmission media include coaxial cables; copper wires and optical fibers, including the wires forming the bus (BS). Transmission media can also take the form of sound waves or light waves (such as those generated during radio frequency (RF) and infrared (IR) data communications). Computer-readable media can be non-transitory, such as floppy disks, floppy disks, hard disks, magnetic tapes, any other magnetic media, CD-ROMs, DVDs, any other optical media, punched cards, paper tapes, any other physical storage media with a perforated pattern, RAM, PROMs and EPROMs, FLASH-EPROMs, any other memory chips or memory cartridges. Non-transitory computer-readable media may have instructions recorded on them. When executed by a computer, the instructions can perform any of the operations described herein. For example, a temporary computer-readable medium may include a carrier wave or other propagated electromagnetic signal.

[0073] Various forms of computer-readable media may be involved when carrying one or more sequences of instructions to a processor PRO for execution. For example, the instructions may initially be carried on the disk of a remote computer. The remote computer may load the instructions into its volatile memory and transmit the instructions via a network. The computer system CS may receive data and place the data on the bus BS. The bus BS carries the data to the main memory MM, from which the processor PRO fetches and executes the instructions. The instructions received by the main memory MM may optionally be stored on a storage device SD before or after execution by the processor PRO.

[0074] The computer system CS may also include a communication interface CI connected to the bus BS. The communication interface CI provides bidirectional data communication to a network link NDL connected to a local area network (LAN). For example, the communication interface CI may be an Integrated Services Digital Network (ISDN) card or a modem to provide data communication connectivity to a corresponding type of telephone line. As another example, the communication interface CI may be a LAN card to provide data communication connectivity with a compatible LAN, or it may implement a wireless link. In any such embodiment, the communication interface CI transmits and receives electrical, electromagnetic, or optical signals carrying digital data streams representing various types of information.

[0075] A network link (NDL) typically provides data communication to other data devices via one or more networks. For example, a network link NDL can provide a connection to a host computer (HC) via a local area network (LAN). This can include data communication services provided via a global packet data communication network (now commonly referred to as the "Internet" INT). A LAN (Internet) can use electrical, electromagnetic, or optical signals to carry digital data streams. Signals through various networks and signals on the network data link (NDL) and through the communication interface (CI) are exemplary carrier forms for transmitting information, carrying digital data to and from the computer system (CS).

[0076] A computer system (CS) can send and receive messages, including program code, via a network, network data link (NDL), and communication interface (CI). In the Internet example, the host computer (HC) can transmit requested code for an application via the Internet (INT), network data link (NDL), local area network (LAN), and communication interface (CI). For example, such a downloadable application can provide all or part of the methods described herein. The received code can be executed by the processor (PRO) upon receipt and / or stored in storage device (SD) or other non-volatile memory for later execution. In this way, the computer system (CS) can obtain application code in carrier-based form.

[0077] Various embodiments of this system and method are disclosed in a subsequent list of numbered aspects. Other features, characteristics, and exemplary technical solutions of this disclosure will be described below according to aspects that may optionally be claimed in any combination:

[0078] 1. A semiconductor bonding system comprising: a track including a path through a plurality of processing stations; a plurality of substrate holders coupled to the track, each substrate holder configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations such that the first substrate can be bonded to a second substrate; and a controller operatively coupled to the track and the plurality of substrate holders, the controller configured to control relative movement between the plurality of substrate holders such that each substrate holder moves independently of the other substrate holders along the path through the plurality of processing stations, wherein the range and speed of each substrate holder vary according to its position on the track relative to the plurality of processing stations.

[0079] 2. The system according to aspect 1, wherein each of the first substrates is a die, and the second substrate comprises a semiconductor wafer.

[0080] 3. The system according to any of the foregoing aspects, wherein the processing station includes a bonding station and at least one alignment station, a height and / or rotation adjustment station, a leveling station and / or a placement station.

[0081] 4. The system according to any of the foregoing aspects, wherein the track includes a horizontal axis and / or a vertical axis for long-stroke movement.

[0082] 5. The system according to any of the foregoing aspects, wherein the plurality of substrate holders are configured to move along the path in a continuous closed-loop manner in a clockwise and / or counterclockwise direction.

[0083] 6. The system according to any of the foregoing aspects, wherein the track comprises two or more parallel processing paths, the parallel processing paths being separate from the main path and associated with at least one of the bonding processing stations.

[0084] 7. The system according to any of the foregoing aspects, wherein the orbit has an elliptical shape.

[0085] 8. The system according to any of the foregoing aspects, wherein the controller and the plurality of substrate holders are configured such that one or more operations are performed at the plurality of processing stations while a given substrate holder is moving.

[0086] 9. The system according to any of the foregoing aspects, wherein the movement is controlled in coordination with the processing timing at the processing station.

[0087] 10. The system according to any of the foregoing aspects, wherein the controller and the plurality of substrate holders are configured such that one or more operations are performed at the plurality of processing stations when a given substrate holder is stopped and the other substrate holders of the plurality of substrate holders are moving.

[0088] 11. The system according to any of the foregoing aspects, wherein the number of the plurality of substrate holders corresponds to the number of the processing stations.

[0089] 12. The system according to any of the foregoing aspects, wherein the number of the plurality of substrate holders is equal to, greater than or less than the number of the processing stations.

[0090] 13. The system according to any of the foregoing aspects, wherein the track and / or the plurality of substrate holders comprises one or more actuation coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors and / or springs.

[0091] 14. The system according to any of the foregoing aspects, wherein the track includes one or more components configured to move the plurality of substrate holders within a first actuation range, and the plurality of substrate holders includes one or more components configured to move the first substrate within a second actuation range shorter than the first actuation range.

[0092] 15. The system according to any of the foregoing aspects, wherein each substrate holder is configured to move along the path and relative to the track in a horizontal, vertical and / or rotational direction via a non-contact actuator associated with each substrate holder.

[0093] 16. The system according to any of the foregoing aspects, wherein, at the bonding station among the plurality of processing stations, a given substrate holder is configured by the controller to be positioned with sufficient accuracy and force for bonding to the second substrate; or the given substrate holder is coarsely positioned relative to the second substrate, and the second substrate is moved relative to the given substrate holder with sufficient accuracy and force for bonding.

[0094] 17. The system according to any of the foregoing aspects, wherein at an alignment station among the plurality of processing stations, a given substrate holder is configured by the controller to be positioned with an accuracy sufficient for alignment measurement by an alignment sensor; or the given substrate holder is coarsely positioned relative to the alignment sensor, and the alignment sensor is moved relative to the given substrate holder with a measurement accuracy sufficient for the alignment.

[0095] 18. The system according to any of the foregoing aspects, wherein the semiconductor bonding system comprises a plurality of tracks.

[0096] 19. The system according to any of the foregoing aspects, wherein the plurality of substrate holders are configured to move in different directions on the plurality of tracks.

[0097] 20. The system according to any of the foregoing aspects, wherein the controller comprises one or more processors, one or more robots, one or more turntables, one or more conveyor belts, and / or one or more rollers.

[0098] 21. The system according to any of the foregoing aspects, wherein the first substrate includes an application main die held by a carrier, the carrier including a wafer foil frame, a mask-shaped carrier, a wafer-shaped carrier, or a separate tray with a cover; and is introduced into the semiconductor bonding system via a front-opening transfer cassette (FOUP) of the system.

[0099] 22. The system according to any of the foregoing aspects, wherein the carrier is optically transparent and coated with a photosensitive material.

[0100] 23. The system according to any of the foregoing aspects, wherein each actuator core is connected to the carrier via an object smaller than the entire surface area of ​​the actuator core.

[0101] 24. The system according to any of the foregoing aspects further includes a clamp configured to remove the application tube spool from the carrier and connect the application tube spool to the plurality of substrate holders, each substrate holder connecting one application tube spool.

[0102] 25. The system according to any of the foregoing aspects, wherein the clamping device includes an electrostatic clamping device, a vacuum clamping device, a gecko clamping device, an air bearing clamping device, or a mechanical clamping device.

[0103] 26. The system according to any of the foregoing aspects, wherein the clamp is configured to clamp the application tube core via a grid and / or capacitively, based on a reference object on the clamp and the position of the reference object determined by interferometry using a camera.

[0104] 27. The system according to any of the foregoing aspects, wherein the clamp is configured to clamp the side and / or back of the actuator core.

[0105] 28. The system according to any of the foregoing aspects, wherein the clamp is configured to position the application tube core on a movable substrate holder, the movable substrate holder being configured to receive the application tube core and place the application tube core on the track for further processing.

[0106] 29. The system according to any of the foregoing aspects, wherein the plurality of processing stations includes a cleaning station configured to clean the first substrate prior to bonding.

[0107] 30. The system according to any of the foregoing aspects, wherein the plurality of processing stations include an inspection station configured to detect morphological defects in the first substrate prior to bonding, the inspection station including a dark-field imager, a horizontal sensor, a Fourier imager, and / or a capacitive sensor.

[0108] 31. The system according to any of the foregoing aspects, wherein the plurality of processing stations include a leveling station configured to level the first substrate relative to the second substrate prior to bonding.

[0109] 32. The system according to any of the foregoing aspects, wherein each of the plurality of substrate holders includes a chuck configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations such that the first substrate can be bonded to the second substrate.

[0110] 33. The system according to any of the foregoing aspects, wherein the track includes a balancing mass configured to counteract deformation and / or vibration in the semiconductor bonding system.

[0111] 34. The system according to any of the foregoing aspects, wherein each of the plurality of substrate holders and / or each of the plurality of processing stations includes one or more isolators configured to isolate the environment of the track and the substrate holder from the environment of the processing station.

[0112] 35. The system according to any of the foregoing aspects, wherein the isolator includes a gasket, a plate, and / or a suction system.

[0113] 36. A semiconductor bonding method comprising: receiving and holding a first substrate using each of a plurality of substrate holders coupled to a track, and moving the first substrate along a path through a plurality of processing stations such that the first substrate can be bonded to a second substrate; and controlling relative movement between the plurality of substrate holders using a controller operatively coupled to the track and the plurality of substrate holders such that each substrate holder moves independently of the other substrate holders along the path through the plurality of processing stations, wherein the range and speed of each substrate holder vary according to its position relative to the track of the plurality of processing stations.

[0114] 37. The method according to aspect 36, wherein each of the first substrates is a die and the second substrate comprises a semiconductor wafer.

[0115] 38. The method according to any of the foregoing aspects, wherein the processing station comprises a bonding station and at least one alignment station, a height and / or rotation adjustment station, a leveling station and / or a placement station.

[0116] 39. The method according to any of the foregoing aspects, wherein the track comprises a horizontal axis and / or a vertical axis for long-stroke movement.

[0117] 40. The method according to any of the foregoing aspects further comprises moving the plurality of substrate holders along the path in a continuous closed-loop manner in a clockwise and / or counterclockwise direction.

[0118] 41. The method according to any of the foregoing aspects, wherein the track comprises two or more parallel processing paths, the parallel processing paths being separate from the main path and associated with at least one of the bonding processing stations.

[0119] 42. The method according to any of the foregoing aspects, wherein the orbit has an elliptical shape.

[0120] 43. The method according to any of the foregoing aspects further includes performing one or more operations at the plurality of processing stations while a given substrate holder is moving.

[0121] 44. The method according to any of the foregoing aspects further includes controlling the movement in coordination with the processing timing at the processing station.

[0122] 45. The method according to any of the foregoing aspects, further comprising: performing one or more operations at the plurality of processing stations while a given substrate holder is stopped and other substrate holders of the plurality of substrate holders are moving.

[0123] 46. ​​The method according to any of the foregoing aspects, wherein the number of the plurality of substrate holders corresponds to the number of the processing stations.

[0124] 47. The method according to any of the foregoing aspects, wherein the number of the plurality of substrate holders is equal to, greater than or less than the number of the processing stations.

[0125] 48. The method according to any of the foregoing aspects, wherein the track and / or the plurality of substrate holders comprises one or more actuation coils, one or more air bearings, vacuum, mechanical wheels, magnetic bearings, pressure vessels, sliding bearings, capacitors and / or springs.

[0126] 49. The method according to any of the foregoing aspects further comprises moving the plurality of substrate holders within a first actuation range using one or more components of the track, and moving the first substrate within a second actuation range shorter than the first actuation range using one or more components of the plurality of substrate holders.

[0127] 50. The method according to any of the foregoing aspects, wherein each substrate holder is configured to move along the path and relative to the track in a horizontal, vertical and / or rotational direction via a non-contact actuator associated with each substrate holder.

[0128] 51. The method according to any one of the foregoing aspects, further comprising: at a bonding station among the plurality of processing stations, using the controller to position a given substrate holder with sufficient accuracy and force to bond to the second substrate; or to coarsely position the given substrate holder relative to the second substrate and move the second substrate relative to the given substrate holder with sufficient accuracy and force to perform bonding.

[0129] 52. The method according to any one of the foregoing aspects, further comprising: at an alignment station among the plurality of processing stations, using the controller to position a given substrate holder with sufficient accuracy to perform an alignment measurement by means of an alignment sensor; or coarsely positioning the given substrate holder relative to the alignment sensor and moving the alignment sensor relative to the given substrate holder with sufficient accuracy to perform the alignment measurement.

[0130] 53. The method according to any of the foregoing aspects, wherein the track comprises a plurality of tracks.

[0131] 54. The method according to any of the foregoing aspects, wherein the plurality of substrate holders are configured to move in different directions on the plurality of tracks.

[0132] 55. The method according to any of the foregoing aspects, wherein the controller comprises one or more processors, one or more robots, one or more turntables, one or more conveyor belts, and / or one or more rollers.

[0133] 56. The method according to any of the foregoing aspects, wherein the first substrate includes an application main die held by a carrier including a wafer foil frame, a mask-shaped carrier, a wafer-shaped carrier, or a separate tray with a cover; and introduced via a front-opening transfer box (FOUP).

[0134] 57. The method according to any of the foregoing aspects, wherein the carrier is optically transparent and coated with a photosensitive material.

[0135] 58. The method according to any of the foregoing aspects, wherein each application tube core is connected to the carrier by an object smaller than the entire surface area of ​​the application tube core.

[0136] 59. The method according to any of the foregoing aspects further comprises removing the application main die from the carrier using a clamp and coupling the application main die to the plurality of substrate holders, each substrate holder coupling one application main die.

[0137] 60. The method according to any of the foregoing aspects, wherein the clamping device comprises an electrostatic clamping device, a vacuum clamping device, a gecko clamping device, an air bearing clamping device, or a mechanical clamping device.

[0138] 61. The method according to any of the foregoing aspects, wherein the clamp is configured to clamp the application tube core via a grid and / or capacitively, based on a reference on the clamp and the position of the reference determined by interferometry using a camera.

[0139] 62. The method according to any of the foregoing aspects, wherein the clamp is configured to clamp the side and / or back of the actuator core.

[0140] 63. The method according to any of the foregoing aspects, wherein the clamp is configured to position the application tube core on a movable substrate holder, the movable substrate holder being configured to receive the application tube core and place the application tube core on the track for further processing.

[0141] 64. The method according to any of the foregoing aspects further includes cleaning the first substrate at a cleaning station of the plurality of processing stations prior to bonding.

[0142] 65. The method according to any of the foregoing aspects further includes detecting morphological defects in the first substrate prior to bonding at an inspection station of the plurality of processing stations, said inspection station including a dark-field imager, a horizontal sensor, a Fourier imager, and / or a capacitive sensor.

[0143] 66. The method according to any of the foregoing aspects further includes leveling the first substrate at a leveling station of the plurality of processing stations prior to bonding.

[0144] 67. The method according to any of the foregoing aspects, wherein each of the plurality of substrate holders includes a chuck configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations such that the first substrate can be bonded to the second substrate.

[0145] 68. The method according to any of the foregoing aspects further includes utilizing the balancing mass of the track to counteract deformation and / or vibration.

[0146] 69. The method according to any of the foregoing aspects further comprises isolating the environment of the track and the substrate holder from the environment of the processing station using one or more isolators of each of the plurality of substrate holders and / or each of the plurality of processing stations.

[0147] 70. The method according to any of the foregoing aspects, wherein the isolator comprises a gasket, a plate, and / or a suction system.

[0148] The foregoing description is intended to be illustrative and not restrictive. Therefore, those skilled in the art will understand that modifications can be made as described without departing from the scope of the claims set forth below.

Claims

1. A semiconductor bonding system, comprising: The track, which includes a path through multiple processing stations; A plurality of substrate holders are coupled to the track, each substrate holder being configured to receive and hold a first substrate and move the first substrate along the path through the plurality of processing stations such that the first substrate can be bonded to a second substrate; as well as A controller operatively coupled to the track and the plurality of substrate holders, the controller being configured to control the relative movement between the plurality of substrate holders such that each substrate holder moves independently of the other substrate holders along the path through the plurality of processing stations, wherein the range and speed of each substrate holder vary according to its position relative to the track of the plurality of processing stations.

2. The system according to claim 1, wherein, Each of the first substrates is a die, and the second substrate comprises a semiconductor wafer.

3. The system according to claim 1, wherein, The processing station includes a bonding station and at least one alignment station, a height and / or rotation adjustment station, a leveling station and / or a placement station.

4. The system according to claim 1, wherein, The track includes a horizontal axis and / or a vertical axis for long-stroke movement.

5. The system according to claim 1, wherein, The controller and the plurality of substrate holders are configured such that one or more operations are performed at the plurality of processing stations while a given substrate holder is moving.

6. The system according to claim 5, wherein, The movement is controlled in coordination with the processing timing at the processing station.

7. The system according to claim 1, wherein, The controller and the plurality of substrate holders are configured such that one or more operations are performed at the plurality of processing stations when a given substrate holder is stopped and the other substrate holders among the plurality of substrate holders are moving.

8. The system according to claim 1, wherein, The track includes one or more components configured to move the plurality of substrate holders within a first actuation range, and the plurality of substrate holders includes one or more components configured to move the first substrate within a second actuation range that is shorter than the first actuation range.

9. The system according to claim 1, wherein, Each substrate holder is configured to move along the path and relative to the track in a horizontal, vertical and / or rotational direction via a non-contact actuator associated with each substrate holder.

10. The system according to claim 1, wherein, At the bonding station among the plurality of processing stations. The given substrate holder is configured to be positioned by the controller with sufficient accuracy and force for bonding to the second substrate; or The given substrate holder is roughly positioned relative to the second substrate, and the second substrate is moved relative to the given substrate holder with sufficient accuracy and force for bonding.

11. The system according to claim 1, wherein, At the alignment station among the plurality of processing stations A given substrate holder is configured to be positioned by the controller with sufficient accuracy for alignment measurements by an alignment sensor; or The given substrate holder is roughly positioned relative to the alignment sensor, and the alignment sensor is moved relative to the given substrate holder with sufficient measurement accuracy to perform the alignment.

12. The system according to claim 1, wherein, The track includes a balancing mass configured to counteract deformation and / or vibration in the semiconductor bonding system.

13. The system according to claim 1, wherein, Each of the plurality of substrate holders and / or each of the plurality of processing stations includes one or more isolators configured to isolate the environment of the track and the substrate holder from the environment of the processing station.

14. A semiconductor bonding method, comprising: The first substrate is received and held using each of a plurality of substrate holders connected to a track, and the first substrate is moved along a path through a plurality of processing stations so that the first substrate can be bonded to a second substrate. and The relative movement between the plurality of substrate holders is controlled by a controller operably coupled to the track and the plurality of substrate holders, such that each substrate holder moves independently of the other substrate holders along the path through the plurality of processing stations, wherein the range and speed of each substrate holder vary according to its position relative to the track of the plurality of processing stations.

15. The method of claim 14, further comprising: One or more operations are performed at the plurality of processing stations while a given substrate holder is stopped and the other substrate holders among the plurality of substrate holders are moving.

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