Process for protecting the side edges of a glass substrate by encapsulation with glue and glass substrate

Abstract

This invention discloses a process for sealing and protecting the sides of a glass substrate, comprising: providing a glass substrate after cutting and edge grinding; applying UV-curable adhesive to the sides of the glass substrate using a non-contact dispensing method, so that the UV-curable adhesive covers the sides of the glass substrate; and curing the UV-curable adhesive to form a buffer protective layer on the sides of the glass substrate. Because the UV-curable adhesive used in this invention has a relatively low viscosity, contact dispensing is prone to problems such as adhesive dragging, stringing, overflow, and scratching the glass sides. Therefore, a non-contact spray dispensing method is used. The cured buffer protective layer fills micro-defects on the sides of the substrate, buffering external impacts, inhibiting crack propagation, reducing the breakage rate of the glass substrate during the transfer process, and improving production yield. It is suitable for mass production of semiconductor packaging, display, and photovoltaic glass substrates.

Description

Technical Field

[0001] This invention relates to the field of glass substrate processing technology, and in particular to a process for sealing and protecting the sides of a glass substrate with adhesive, and the glass substrate itself. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] Glass substrates, being made of high-strength glass, possess physical properties of high hardness and brittleness. In the manufacturing process of semiconductor display panels, glass substrates require cutting and edge-grinding. However, the sides of the substrates after cutting and grinding often contain micro-cracks formed during processing. These micro-cracks constitute stress concentration points, making the substrates highly susceptible to breakage during subsequent handling, cleaning, and coating processes due to impacts. This not only poses production safety risks but also leads to yield losses.

[0004] In existing technologies, the application of adhesive to the sides of glass substrates mostly employs contact dispensing or coating methods, where the adhesive is applied directly to the substrate side using a dispensing needle or coating head. However, when using low-viscosity UV-curable adhesives, contact dispensing has serious drawbacks: due to the adhesive's high fluidity and low surface tension, it is prone to dripping during the contact and separation process between the dispensing valve and the substrate side. This not only wastes adhesive and poses a risk of contamination but also fails to form a uniformly thick and controllable adhesive layer on the substrate side, severely impacting the cushioning and protective effect. Therefore, there is an urgent need to develop a new process specifically designed for side protection of semiconductor / display glass substrates after cutting and edge grinding, to effectively improve the impact resistance of the substrate sides and reduce the breakage rate.

[0005] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a process and a glass substrate for side sealing protection of a glass substrate, which addresses the shortcomings of the prior art. The process involves using non-contact dispensing to coat the side of the glass substrate with UV-curable adhesive, which forms a buffer protective layer after curing, thereby improving the impact resistance of the substrate side and reducing the risk of breakage from impacts.

[0007] This application discloses a process for sealing and protecting the sides of a glass substrate with adhesive, including the following steps: Provide glass substrates after cutting and edge grinding; A non-contact dispensing method is used to apply UV-curable adhesive to the side of the glass substrate, so that the UV-curable adhesive covers the side of the glass substrate. The UV-curable adhesive on the side of the glass substrate is subjected to injection curing to form a buffer protective layer on the side of the glass substrate.

[0008] Furthermore, in the above-mentioned process of sealing and protecting the glass substrate sidewalls, the thickness of the buffer protective layer is 50μm to 150μm.

[0009] Furthermore, in the above-mentioned process of sealing and protecting the glass substrate side, the curing process is performed by irradiation and curing with a UV-LED surface light source with a wavelength of 365nm.

[0010] Furthermore, in the above-mentioned process of sealing and protecting the side of the glass substrate, in the step of "using a non-contact dispensing method", the dispensing distance is 1mm~3mm, the nozzle diameter is 0.1mm~0.2mm, and the dispensing pressure is 0.1MPa~0.3MPa.

[0011] Furthermore, in the above-mentioned process of sealing and protecting the side of the glass substrate, the UV-curable adhesive has a viscosity of 2000 mPa·s to 9000 mPa·s at 25°C, a hardness of Shore D70 to 80 after curing, and an elongation at break of greater than or equal to 80%.

[0012] Furthermore, in the above-mentioned process of sealing and protecting the side of the glass substrate with adhesive, the UV-curable adhesive covers the side of the glass substrate with a width of 0.5mm to 1.5mm.

[0013] Furthermore, in the above-mentioned process of sealing and protecting the sides of the glass substrate, the UV-curing adhesive is UV9060 type UV adhesive.

[0014] This application also discloses a glass substrate, wherein the glass substrate is coated with a buffer protective layer formed by curing UV-curable adhesive on its side using the above process.

[0015] Furthermore, in the aforementioned glass substrate, the thickness of the buffer protective layer is 50 μm to 150 μm.

[0016] In summary, the structure adopted in the embodiments of the present invention has the following advantages: The glass substrate side sealing protection process described in this invention addresses the microcracks present on the sides of the glass substrate after cutting and grinding. By forming a buffer protective layer cured with UV-curable adhesive on the sides, it effectively reduces the risk of breakage due to stress concentration. In other words, the buffer protective layer covers the surface of the glass substrate side, filling the microcrack defects and forming an elastic protective layer on the outside of the side. When the substrate side is impacted, this buffer protective layer first absorbs the impact force and undergoes elastic deformation to absorb the impact energy, thereby preventing the impact force from being directly transmitted to the glass substrate itself and significantly reducing the probability of breakage.

[0017] By employing a non-contact dispensing method, the process compatibility issue of low-viscosity UV-curable adhesives is fundamentally solved, enabling precise and uniform application of low-viscosity adhesives to the sides of glass substrates. Simultaneously, the low-viscosity UV-curable adhesive provides the following advantages to the process of this invention: (a) the adhesive has good flowability, capable of fully filling and covering the microstructures (including microcracks) on the sides, forming a continuous buffer protective layer; (b) the adhesive layer thickness can be precisely controlled through dispensing parameters, ensuring consistent buffering effect. Furthermore, the non-contact dispensing method avoids physical contact between the dispensing head and the substrate, eliminating the risk of secondary damage and particulate contamination to the substrate sides that might occur with contact dispensing, and offering better compatibility with high-cleanliness automated production lines in the semiconductor / display field.

[0018] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a process step diagram in an embodiment of the present invention; Figure 2 This is a schematic diagram of non-contact UV dispensing in an embodiment of the present invention; Figure 3 This is a schematic diagram of UV curing in an embodiment of the present invention. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0022] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0023] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0024] Reference Figure 1-3 As shown in the figure, this application discloses a process for sealing and protecting the sides of a glass substrate with adhesive, including the following steps: Provide glass substrates after cutting and edge grinding; A non-contact dispensing method is used to apply UV-curable adhesive to the side of the glass substrate, so that the UV-curable adhesive covers the side of the glass substrate. "UV-curable adhesive" (i.e., ultraviolet curable adhesive) refers to a type of adhesive material containing components such as photoinitiators, prepolymers and monomers. Under the irradiation of ultraviolet light of a specific wavelength, the photoinitiator absorbs light energy and generates free radicals or cationic active species, which initiate the polymerization and cross-linking reaction of the prepolymer and monomers, thereby changing from a liquid state to a solid state in a short time. The UV-curable adhesive on the side of the glass substrate is cured to form a buffer protective layer on the side of the glass substrate.

[0025] By employing the above method, this process solves two technical problems: firstly, by forming a buffer protective layer on the side, the impact resistance of the glass substrate side is physically enhanced; secondly, by adopting a non-contact dispensing method, the problems of dripping and uneven adhesive layer caused by contact dispensing during the application of low-viscosity UV curing adhesive on the side are solved, thus achieving precise and uniform application of low-viscosity adhesive on the side of the glass substrate.

[0026] Specifically, in this embodiment, the thickness of the buffer protective layer is 50 μm to 150 μm. "Thickness" refers to the dimension of the buffer protective layer in the normal direction of the glass substrate side surface, i.e., the vertical distance extending outward from the glass substrate side surface. The thickness is limited to 50 μm to 150 μm based on the following comprehensive considerations: if the thickness is less than 50 μm, the buffer layer is too thin, and its ability to absorb impact energy is insufficient, failing to provide effective buffer protection; if the thickness is greater than 150 μm, although the buffering capacity is further enhanced, an excessively thick adhesive layer may lead to the following problems: (a) increased adhesive usage and higher costs; (b) incomplete internal curing during curing due to the excessively thick adhesive layer; (c) for thin glass substrates, an excessively thick side adhesive layer may affect the dimensional accuracy of the substrate and the compatibility with subsequent processes. The thickness range of 50 μm to 150 μm is the preferred range that strikes a balance between buffering effect, process feasibility, and cost.

[0027] Specifically, in this embodiment, the curing process is performed by irradiation with a 365nm UV-LED surface light source. The UV curing adhesive (such as UV9060) preferably used in this invention has a photoinitiator absorption peak that matches the 365nm wavelength, enabling efficient absorption of light energy and initiation of the polymerization reaction; simultaneously, the 365nm wavelength offers higher safety for operators (compared to the shorter wavelength of UVC). This feature is directly related to the aforementioned "curing process" step, defining the specific implementation method of the curing process, namely, curing is achieved by irradiation with a 365nm UV-LED surface light source.

[0028] Specifically, in this embodiment, in the step "using a non-contact dispensing method", the dispensing distance is 1mm~3mm, the nozzle diameter is 0.1mm~0.2mm, and the dispensing pressure is 0.1MPa~0.3MPa. The nozzle diameter determines the initial micelle thickness, the dispensing pressure determines the micelle ejection speed, and the dispensing distance determines the distance the micelles travel. These three factors together determine the final position, width, and thickness of the adhesive material deposited on the side of the substrate. Specifically, given the nozzle diameter (0.1mm~0.2mm) and dispensing distance (1mm~3mm), the dispensing pressure (0.1MPa~0.3MPa) determines the speed and spread of the adhesive material when it reaches the side of the substrate; given the dispensing pressure and dispensing distance, the nozzle diameter determines the amount of adhesive material released per unit time; and given the nozzle diameter and dispensing pressure, the dispensing distance determines the area of ​​adhesive material spread on the substrate surface. The coordinated control of these three elements is crucial for achieving a uniform and precise adhesive layer coating on the substrate side. If the dispensing distance is less than 1mm, the nozzle is too close to the substrate side, and the adhesive may not accelerate sufficiently before contacting the substrate surface, leading to adhesive accumulation or splattering. If the dispensing distance is greater than 3mm, the adhesive may deviate due to air resistance during flight, resulting in a deviation in the landing point and affecting coating accuracy. A range of 1mm to 3mm ensures that the adhesive is accurately deposited on the substrate side surface with an appropriate flight distance. A nozzle diameter of 0.1mm to 0.2mm releases fine micelles or droplets that match the side dimensions, achieving precise control of the adhesive layer width. If the nozzle diameter is too small (<0.1mm), it may cause difficulty in adhesive passage and unstable spraying; if the nozzle diameter is too large (>0.2mm), the amount of adhesive sprayed in a single pass is too large, making it difficult to control the coating width and thickness. A pressure range of 0.1 MPa to 0.3 MPa is considered low-pressure and is suitable for spraying low-viscosity (2000~9000 mPa·s) UV-curable adhesives. Low-viscosity adhesives achieve sufficient flowability and spraying speed even at lower pressures. If the pressure is too low (<0.1 MPa), the adhesive spraying speed will be insufficient, potentially causing the adhesive to fail to accurately reach the substrate sides or resulting in unstable spraying. If the pressure is too high (>0.3 MPa), the adhesive spraying speed will be too fast, potentially causing adhesive splattering or excessive accumulation on the substrate sides.

[0029] The experimental data for the non-contact dispensing comparison are shown in the table below: Table 1. Comparison Experiment of Non-Contact Dispensing Process Parameters Based on the above seven sets of experimental data, with nozzle diameter, dispensing pressure, and dispensing distance as single control variables, we can conclude that: First, nozzle diameter of 0.1mm to 0.2mm, dispensing pressure of 0.1MPa to 0.3MPa, and dispensing distance of 1mm to 3mm can all achieve a buffer protective layer with adhesive width of 0.5mm to 1.5mm and adhesive thickness of 50μm to 150μm, and the appearance quality is good or acceptable, which verifies that the above parameter range can actually achieve the technical effect claimed in this application.

[0030] Secondly, when the dispensing pressure is below 0.1 MPa, a defect of "insufficient adhesive at the edges" occurs, resulting in weak protection at the edges and corners of the substrate; when the dispensing pressure is above 0.3 MPa, a defect of "excessive adhesive at the edges" occurs, with the upper limit of adhesive thickness exceeding the preferred range of 50 μm to 150 μm. This, in turn, confirms the necessity of a dispensing pressure range of 0.1 MPa to 0.3 MPa.

[0031] Third, the optimal combination of process parameters is 0.15mm nozzle diameter, 0.2MPa glue supply pressure, and 2mm dispensing distance. At this point, the glue width is 0.889~1.12mm, the glue thickness is 94~138μm, the appearance is good, and the buffering and protection effect is optimal.

[0032] The above comparative experimental data fully demonstrate that the present invention, through non-contact dispensing and combined with the coordinated control of specific parameter ranges (nozzle diameter 0.1mm~0.2mm, dispensing pressure 0.1MPa~0.3MPa, dispensing distance 1mm~3mm), can achieve precise and uniform molding of the side buffer protective layer of the glass substrate under low viscosity UV curing adhesive conditions, thus realizing the technical effect claimed in this application.

[0033] Specifically, in this embodiment, the UV-curable adhesive has a viscosity of 2000 mPa·s to 9000 mPa·s at 25°C, a hardness of Shore D 70 to 80 after curing, and an elongation at break greater than or equal to 80%. The liquid viscosity determines the feasibility of the application process and the coating quality; the hardness and elongation at break after curing determine the mechanical properties of the final buffer layer. Specifically, a lower viscosity (2000~9000 mPa·s) ensures that the adhesive can be accurately applied and fully spread on the sides using a non-contact dispensing method; moderate hardness after curing (Shore D 70~80) ensures that the buffer layer has sufficient rigidity while retaining elasticity; and a higher elongation at break (≥80%) ensures that the buffer layer can undergo elastic deformation to absorb energy without rupturing under impact conditions.

[0034] Specifically, in this embodiment, the UV-curable adhesive covers the side of the glass substrate with a width of 0.5 mm to 1.5 mm.

[0035] Specifically, in this embodiment, the UV-curing adhesive is UV9060 type UV adhesive.

[0036] This embodiment also provides a glass substrate, which, using the above-described process, has a buffer protective layer formed by UV curing adhesive covering its sides.

[0037] Specifically, in this embodiment, the thickness of the buffer protective layer is 50 μm to 150 μm.

[0038] Example 1 This embodiment provides a process for sealing and protecting the sides of a glass substrate after cutting and grinding the edges, specifically including the following steps: A glass substrate with a thickness of 1.1 mm is provided, which has been cut and edge-ground.

[0039] A non-contact jet dispensing method was used to apply UV9060 UV adhesive to the side of the glass substrate. The dispensing parameters were set as follows: dispensing distance 2mm, nozzle diameter 0.15mm, dispensing pressure 0.2mPa, dispensing valve opening time 0.3ms, valve closing time 2ms, and ejector pin stroke 55%. The width of the UV adhesive covering the side was controlled between 0.85-1.0mm.

[0040] Curing was performed using a 365nm UV-LED surface light source with a light power of 700MW / cm². 2 The curing time is 15 seconds, and the cumulative energy is 4200 mJ / cm². 2 After curing, a UV adhesive buffer layer with a thickness of 100-130μm is formed on the side of the glass substrate.

[0041] Impact testing showed that the glass substrate prepared in this embodiment could withstand a drop height of 15cm without breaking in a 150g impact cone free fall test, which is about 3 times more impact-resistant than the untreated substrate (drop height of 5cm).

[0042] Example 2 The difference between this embodiment and Embodiment 1 is that the thickness of the UV adhesive buffer layer is controlled at 50 μm. This is achieved by adjusting the dispensing amount and curing parameters.

[0043] Impact tests showed that the glass substrate prepared in this embodiment can withstand a drop height of approximately 12cm without breaking.

[0044] Example 3 The difference between this embodiment and Embodiment 1 is that the thickness of the UV adhesive buffer layer is controlled at 150μm.

[0045] Impact tests showed that the glass substrate prepared in this embodiment can withstand a drop height of approximately 15cm without breaking.

[0046] Comparative Example 1 (Contact Dispensing Comparison Experiment) This comparative example uses a contact-type needle dispensing method, applying the same UV9060 UV adhesive (viscosity 2000-9000 mPa·s at 25°C) as in Example 1 to the side of the glass substrate. The dispensing needle diameter is 0.15 mm, and other parameters are kept as consistent as possible with Example 1.

[0047] Experiments have shown that during the contact dispensing process, due to the low viscosity of UV9060 UV adhesive, when the dispensing needle contacts and detaches from the side of the substrate, the adhesive material drips significantly (drip phenomenon), resulting in: (1) the adhesive material cannot form a continuous and uniform coating layer on the side of the substrate, with some areas missing adhesive layer and some areas having excessively thick adhesive layer; (2) the dripping adhesive material contaminates the substrate surface and equipment; (3) the thickness of the adhesive layer on the side after curing is extremely uneven (thickness deviation exceeds ±50%), and a stable buffer protection effect cannot be obtained.

[0048] This comparative example confirms that low-viscosity UV adhesives (such as UV9060) cannot achieve uniform side coating through contact dispensing and must be applied using non-contact dispensing.

[0049] Comparison of UV curing adhesive materials A systematic selection study was conducted on various UV adhesive materials, and the results are shown in the table below: Table 2 Systematic Selection Study of Various UV Adhesive Materials As can be seen from the above comparison, UV9060 UV adhesive, with its lower hardness (Shore D 76), higher elongation at break (100%), moderate shear strength (0.3 MPa), and good compatibility with 365nm UV-LED surface light source, is the preferred adhesive material for this invention. Meanwhile, the above selection comparison clearly reveals that low-viscosity UV adhesives such as UV9060 and 2162C5 cannot be used with contact dispensing methods due to their excessively low viscosity. This further confirms the necessity and innovation of using non-contact dispensing in this invention.

[0050] The present invention has the following beneficial effects: First, this invention specifically addresses the problem of glass breakage caused by microcracks. For microcracks present on the sides of glass substrates after cutting and grinding, this invention effectively reduces the risk of breakage due to stress concentration by forming a buffer protective layer cured with UV-curable adhesive on the side. In other words, the buffer protective layer covers the surface of the glass substrate side, filling the microcrack defects and forming an elastic protective layer on the outside of the side. When the substrate side is impacted, this buffer protective layer first absorbs the impact force and undergoes elastic deformation to absorb the impact energy, thereby preventing the impact force from being directly transmitted to the glass substrate itself and significantly reducing the probability of breakage.

[0051] Second, the design addresses the compatibility between non-contact dispensing and low-viscosity adhesives. Based on an in-depth analysis of the characteristics of UV-curable adhesives, this invention recognizes that low-viscosity UV-curable adhesives (viscosity 2000~9000 mPa·s at 25℃), suitable for uniform side coating, cannot be applied using contact dispensing. During contact dispensing, the adhesive's high fluidity and low surface tension cause it to drip when the dispensing needle detaches from the substrate side, resulting in uneven adhesive layers and uncontrollable thickness. This invention fundamentally solves the process compatibility problem of low-viscosity UV-curable adhesives by employing a non-contact dispensing method, achieving precise and uniform application of low-viscosity adhesives to the sides of glass substrates. Simultaneously, the low-viscosity UV-curable adhesive provides the following advantages to the process: (a) good fluidity, capable of fully filling and covering the microstructures (including microcracks) on the sides, forming a continuous buffer protective layer; (b) the adhesive layer thickness can be precisely controlled through dispensing parameters, ensuring consistent buffering effect. In addition, the non-contact dispensing method avoids physical contact between the dispensing head and the substrate, eliminating the risk of secondary damage and particulate contamination to the sides of the substrate that may be caused by contact dispensing, and has better compatibility with high-cleanliness automated production lines in the semiconductor / display field.

[0052] Third, it offers instant curing and high production efficiency. This invention uses a UV-LED surface light source to irradiate and cure the UV-curable adhesive coated on the side of a glass substrate, achieving instant curing after application. Specifically, the UV-LED surface light source emits ultraviolet light of a specific wavelength. The photoinitiator in the UV-curable adhesive absorbs the ultraviolet light energy and generates free radicals or cations, initiating a polymerization and cross-linking reaction between the prepolymer and monomers, completing the transformation from liquid to solid in a short time (several seconds to tens of seconds). The advantages of instant curing are: the curing time is only 5-25 seconds, compatible with the cycle time of automated production lines, and does not significantly increase the production cycle; the cured adhesive layer immediately gains strength and elasticity, avoiding defects such as sagging and displacement caused by gravity or external forces in the uncured state of liquid adhesive; in addition, the UV-LED light source has advantages such as long lifespan, low heat generation, and instantaneous switching, which helps to reduce energy consumption and improve equipment reliability.

[0053] Fourth, the cushioning and protection effect is significant. By selecting a UV-curable adhesive with low hardness (Shore D 70~80) and high elongation at break (≥80%), and controlling the thickness of the cushioning protective layer to 50μm~150μm, a significant improvement in impact resistance is achieved. Specifically, the low hardness ensures that the cushioning protective layer can undergo sufficient elastic deformation to absorb energy upon impact, rather than rigidly transmitting the impact force directly to the glass substrate; the high elongation at break ensures that the cushioning protective layer can maintain its structural integrity without cracking under large deformation, thus continuously providing protection. Tests using a 150g impact cone in a free-fall impact test showed that the glass substrate without the process of this invention (without UV adhesive) cracked after a drop height of only 5cm; the glass substrate treated with the process of this invention (with a UV adhesive cushioning protective layer) could withstand a drop height of up to 15cm. This demonstrates that the process of this invention provides approximately three times the impact resistance of the glass substrate's sides.

[0054] Fifth, the process parameters are highly controllable and have a wide range of applications. This invention achieves precise control over the thickness and coverage width of the buffer protective layer by accurately controlling the process parameters of non-contact dispensing (dispensing distance 1mm~3mm, nozzle diameter 0.1mm~0.2mm, dispensing pressure 0.1MPa~0.3MPa) and curing parameters (365nm wavelength, suitable optical power, and curing time). The process of this invention is applicable to various specifications of glass substrates (thickness 0.2mm~3mm) in the semiconductor display field, is highly compatible with existing production lines, and has broad industrial applicability.

[0055] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0056] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0057] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A process for sealing and protecting the sides of a glass substrate with adhesive, characterized in that, Includes the following steps: Provide glass substrates after cutting and edge grinding; A non-contact dispensing method is used to apply UV-curable adhesive to the side of the glass substrate, so that the UV-curable adhesive covers the side of the glass substrate; wherein, in the "non-contact dispensing method", the dispensing distance is 1mm~3mm, the nozzle diameter is 0.1mm~0.2mm, and the dispensing pressure is 0.1MPa~0.3MPa. The UV-curable adhesive on the side of the glass substrate is subjected to injection curing to form a buffer protective layer on the side of the glass substrate.

2. The process for sealing and protecting the sides of a glass substrate according to claim 1, characterized in that, The thickness of the buffer protective layer is 50 μm to 150 μm.

3. The process for sealing and protecting the sides of a glass substrate according to claim 1, characterized in that, The curing process is performed by irradiation with a UV-LED surface light source with a wavelength of 365nm.

4. The process for sealing and protecting the sides of a glass substrate according to claim 1, characterized in that, The UV-curable adhesive has a viscosity of 2000 mPa·s to 9000 mPa·s at 25°C, a hardness of Shore D 70 to 80 after curing, and an elongation at break of greater than or equal to 80%.

5. The process for sealing and protecting the sides of a glass substrate according to claim 1, characterized in that, The UV-curable adhesive covers the side of the glass substrate with a width of 0.5 mm to 1.5 mm.

6. The process for sealing and protecting the sides of a glass substrate according to claim 1, characterized in that, The UV-curing adhesive is UV9060 type UV adhesive.

7. A glass substrate, using the process described in any one of claims 1 to 6, characterized in that, The sides of the glass substrate are covered with a buffer protective layer formed by UV-curable adhesive.

8. The glass substrate according to claim 7, characterized in that, The thickness of the buffer protective layer is 50 μm to 150 μm.

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