Aluminum chip removing method and system for CTP battery pack bottom plate milling

Abstract

The application discloses a kind of CTP battery package bottom plate milling aluminium chip removal method and system.CTP battery package bottom plate milling aluminium chip removal method includes: battery package is fixed and divided aluminium layer processing area, aluminium glue transition area and glue layer processing area;Bottom collecting groove is arranged below milling station, and follow-up dust extraction pipeline is arranged on the main shaft side, and they are connected aluminium chip collection unit, aluminium glue mixed chip collection unit and glue chip collection unit respectively through shunt valve group;According to the processing area where current tool path is located, collecting channel is synchronously switched, pause feeding and empty pipeline before switching, and the classified collection of aluminium chip, glue chip and mixed chip is realized.The CTP battery package bottom plate milling aluminium chip removal method provided in the application avoids cross contamination of different material chips from the source by combining space zoning and time switching, improves aluminium material recovery purity, reduces pipeline blockage, and improves disassembly production line continuous operation efficiency.

Description

Technical Field

[0001] This invention relates to the field of power battery recycling and dismantling technology, specifically to a method and system for removing aluminum chips during the milling of the bottom plate of a CTP battery pack. Background Technology

[0002] With the popularization of new energy vehicles, the recycling and reuse of retired power batteries has become a focus of industry attention. Cell to Pack (CTP) technology is widely used due to its high space utilization. In the CTP battery pack structure, cells or modules are usually directly bonded to the battery pack base plate (mostly made of aluminum alloy) using high-strength structural adhesive.

[0003] When dismantling retired CTP battery packs, milling is typically used to remove the base plate. Because the aluminum layer and structural adhesive layer of the base plate are tightly bonded, milling generates a large amount of aluminum shavings, adhesive shavings, and mixed aluminum-adhesive shavings. Existing shaving removal systems usually use a single negative pressure suction pipe for global collection, resulting in a mixture of high-value pure aluminum shavings and difficult-to-handle adhesive shavings. This significantly reduces the purity of the recycled aluminum and increases the cost of subsequent sorting and smelting. Simultaneously, the structural adhesive becomes sticky after being heated during milling, causing the mixed debris to easily adhere and agglomerate in the suction pipe, leading to frequent pipe blockages, forced equipment shutdowns for cleaning, and reduced continuous operation efficiency of the dismantling line.

[0004] In existing technologies, the mixing and collection of milling chips from CTP battery packs leads to problems such as low recycling purity and easy clogging of pipelines. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned technical deficiencies and propose a method and system for removing aluminum chips from the bottom plate of CTP battery packs, thereby solving the technical problems of low recycling purity and easy pipeline blockage caused by mixed collection of chips from CTP battery pack milling in the prior art.

[0006] To achieve the above-mentioned technical objectives, this application adopts the following technical solution: In a first aspect, this application provides a method for removing aluminum chips during milling of the bottom plate of a CTP battery pack, comprising the following steps: S1. Fix the battery pack to be disassembled and establish the correspondence between the processing area and the milling layer, dividing the aluminum layer processing area, the aluminum-adhesive transition area and the adhesive layer processing area. S2. A bottom collection trough is arranged below the battery pack milling station, and a follow-up spindle-side dust suction pipe is arranged on the side of the milling spindle; the chip outlet of the bottom collection trough and the spindle-side dust suction pipe are respectively connected to the aluminum chip collection unit, the aluminum-adhesive mixed chip collection unit and the adhesive chip collection unit through their respective corresponding diversion valve groups; S3. When the milling toolpath is in the aluminum layer processing area, the dust suction pipe on the spindle side and the chip outlet of the bottom collection groove are simultaneously connected to the aluminum chip collection unit; S4. Before the milling toolpath enters the aluminum-plastic transition zone, pause the feed, maintain the current path suction to clear the pipeline, and after clearing, simultaneously switch the dust suction pipe on the spindle side and the chip outlet of the bottom collection tank to the aluminum-plastic mixed chip collection unit, and resume milling. S5. When it is confirmed that the current toolpath leaves the aluminum-plastic transition zone and enters the adhesive layer processing zone, pause the feed, keep the aluminum-plastic mixed chip collection unit to clean up the residue, after emptying, switch the dust suction pipe on the spindle side and the chip outlet of the bottom collection groove to the adhesive chip collection unit simultaneously, and resume processing.

[0007] In some embodiments of this application, the process of securing the battery pack to be disassembled includes: The battery pack, after being de-energized, is fixed on an overhead fixture, with the outer side of the base plate facing downwards to mill the working space, and an independent support or lifting mechanism is set for the modules inside the battery pack. The aluminum-plastic transition zone is a conservative collection area set around the material interface, and its range is determined based on the deformation of the base plate, the interface measurement error, the axial cutting depth of the tool, and the toolpath crossing situation.

[0008] In some embodiments of this application, a chip removal system pre-start is included before milling begins, comprising: Confirm that each collection unit is not full, the pipeline is unobstructed, the diversion valve group is in place, and the bottom collection tank is in the working position; open the corresponding suction branch and negative pressure device, and check the working negative pressure of the spindle side suction port and the chip outlet of the bottom collection tank; when the preset effective suction conditions are reached and remain stable, allow the spindle to rotate and feed.

[0009] In some embodiments of this application, the step of simultaneously connecting the spindle-side dust extraction pipe and the chip outlet of the bottom collection groove to the aluminum chip collection unit when the milling toolpath is in the aluminum layer processing area includes: The side suction port of the main shaft side dust collection pipe captures flying debris from the cutting area, and the bottom collection trough receives the settled aluminum chips that are not captured by the side suction port. The mechanical scraping mechanism in the bottom collection trough pushes the aluminum chips in the trough to the chip outlet, and then the negative pressure transports them to the aluminum chip collection unit, achieving near-blade suction and bottom collection simultaneously with the dust collection pipe on the main shaft side.

[0010] In some embodiments of this application, the method further includes: When emptying the pipeline, retract the cutting tool to a safe position; The chip outlet of the bottom collection trough and the corresponding diversion valve group of the main shaft side dust suction pipe are interlocked to prevent a single channel from being connected to different collection units at the same time; when the emptying is not confirmed, the system defaults to keeping the aluminum glue mixed chip collection unit connected.

[0011] In some embodiments of this application, the method further includes: The collection status is determined based on the current local processing area and toolpath segment. When the adhesive layer toolpath needs to cross the residual aluminum structure, the layers in different areas are inconsistent, or the material boundary reliability is insufficient, the process is switched to the aluminum adhesive mixed chip collection unit path in advance. After re-entering the determined single material area, the sequence of actions of pausing, clearing, switching, confirming, and resuming is executed in sequence.

[0012] In some embodiments of this application, the method further includes: Real-time acquisition of branch negative pressure or air volume, filter unit pressure difference, collection box material level, and scraper mechanism operation signals; adjustment of suction capacity according to the set values ​​of each processing stage; when insufficient negative pressure, pipeline blockage, material fullness, valve position abnormality, or scraper jamming occurs, feeding is suspended and cutting is stopped; necessary suction is maintained during abnormal handling process; when fire or abnormal temperature occurs, it switches to an independent safety handling procedure.

[0013] In some embodiments of this application, the method further includes: After processing is completed, cutting is stopped and the tool is retracted to a safe position. The current passage is maintained for a delayed suction, and the scraping mechanism is run to discharge the residual debris. For the final cleaning debris that is difficult to classify, the aluminum glue mixed debris collection unit is used. After confirming that the debris has been emptied according to the emptying time calibrated during trial operation and the results of material flow detection or visual inspection in the tank, the corresponding valves and negative pressure devices are closed.

[0014] In some embodiments of this application, the method further includes: Check the processing status of the base plate and base adhesive, the degree of module connection disconnection, and the condition of residual debris at the work station; after the process conditions are met, the independent support or lifting mechanism, in conjunction with subsequent equipment, removes the module; record the battery pack number, processing section, collection path, abnormal information, and emptying result.

[0015] Secondly, this application also provides an aluminum chip removal system for milling the bottom plate of a CTP battery pack, comprising: Positioning and support mechanism, used to secure the CTP battery pack and keep the module stable; The robotic milling unit includes a robot, a spindle, and cutting tools. The robotic milling unit is configured to perform layered milling of the base plate and the base adhesive according to a preset partitioned toolpath for the aluminum layer processing area, the aluminum-adhesive transition area, and the adhesive layer processing area. The bottom collection trough is located below the battery pack and below the tool working area, and its opening projection area covers the debris drop area. The spindle-side dust collection assembly includes a follower bracket and a suction port. The follower bracket is fixed to the side of the spindle, and the suction port faces the cutting area and maintains a non-interference gap with the tool and workpiece. The suction port is configured to move synchronously with the spindle. The diversion and collection unit includes a diversion valve assembly, an aluminum shavings collection unit, an aluminum-plastic mixed shavings collection unit, and a glue shavings collection unit; the shavings outlet of the bottom collection trough and the dust collection assembly on the main shaft side are selectively connected to each collection unit through their respective diversion valve assemblies. The detection and control unit is communicatively connected to the robot milling unit, the bottom collection trough, the spindle-side dust collection assembly, and the diversion and collection unit. It is configured to receive the area number, layer, and machining start / stop signals, and synchronously control the diversion valve group to switch to the corresponding collection unit according to the machining area where the current toolpath is located.

[0016] Compared with the prior art, the beneficial effects of this application are as follows: The aluminum chip removal method for CTP battery pack bottom plate milling provided in this application precisely divides the milling area into aluminum layer, transition zone and adhesive layer, and uses a dual-channel chip removal structure with spindle side suction and bottom collection. The corresponding collection unit is switched synchronously in different processing areas. This not only achieves source classification and collection of aluminum chips, adhesive chips and mixed chips, improving the purity of recycled aluminum, but also reduces cross-contamination of chips of different materials, ensuring the continuous and efficient operation of the dismantling production line. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the embodiments will be briefly described below: Figure 1 This is a flowchart illustrating the method for removing aluminum chips during milling of the bottom plate of a CTP battery pack in an embodiment of this application. Figure 2 This is a schematic diagram of the aluminum chip removal system in an embodiment of this application; Figure 3 This is a timing diagram of dual-path debris collection control during the processing of the aluminum layer and adhesive layer in the embodiments of this application; Figure 4 This is a schematic diagram showing the arrangement relationship between the dust suction pipe on the main shaft side, the main shaft, and the robot end effector in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the eddy current sensor detecting the surface of the battery pack bottom plate in the embodiments of this application; Figure 6 This is a schematic diagram of the overall architecture and connection topology of the dual-path debris collection system in the embodiments of this application; Figure 7 This is a block diagram illustrating the control signal interaction principle between the PLC controller and the robot, the vacuuming system, and the spindle in this embodiment of the application.

[0018] Figure label: Positioning and support mechanism 100, robot milling unit 200, bottom collection tank 300, spindle-side dust collection assembly 400, diversion and collection unit 500; 1. Robot, 2. Spindle, 3. Side suction pipe, 4. Mounting connection, 5. Eddy current sensor probe, 6. Probe mounting assembly, 7. Connecting cable, 8. Numerical display instrument, 9. Collection tank body, 10A. Side suction diversion valve assembly, 10B. Aluminum chip collection box, 11. Aluminum and glue mixed chip collection box, 12. Glue chip collection box, 13. Negative pressure source for suction system, 14. PLC controller, 15. Robot controller, 16. Suction system, 17. Spindle controller, 18. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Those skilled in the art will understand that, in this specification, the term "comprising" is an open-ended expression, meaning that the stated feature is present but other features are excluded. Directional terms such as "upper," "lower," "left," and "right" refer to exemplary directions based on the accompanying drawings. Features specified as "first" or "second" implicitly include one or more of that feature. Singular expressions can also be used in plural forms. "Multiple" means two or more. The terms "installed," "connected," and "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection via an intermediate medium, and it can be a connection within two components. Furthermore, "linked" can include wireless connections.

[0021] like Figures 1 to 7 As shown. This application provides a method for quickly removing aluminum chips during milling of the bottom plate of a CTP battery pack.

[0022] S1. Fix the battery pack to be disassembled and establish the correspondence between the processing area and the milling layer, dividing the aluminum layer processing area, the aluminum-adhesive transition area and the adhesive layer processing area. In this embodiment, before fixing the battery pack to be disassembled, it is first confirmed that the battery pack has been powered off and isolated and is in a safe state. After fixing, based on the battery pack structural data and the measured boundaries of the base plate and adhesive layer, the correspondence between the processing area and the milling layer is established, and the aluminum layer processing area, aluminum-adhesive transition area and adhesive layer processing area are divided. At the same time, the prohibited area and processing depth boundary are determined to avoid the tool touching non-processed parts and control the risk of milling through the base plate.

[0023] In this embodiment, material layer information is obtained by detecting the surface of the battery pack base plate using eddy current sensors carried by the robot. Under the detection conditions of this embodiment, when an aluminum layer is detected, the sensor value approaches zero; when an adhesive layer is detected, the sensor value reaches the upper limit of the sensor value. The detection and control unit determines the aluminum layer or adhesive layer corresponding to each detection area based on the changes in the sensor value, and uses this layer determination result as the material determination basis for switching between the aluminum chip path and the adhesive chip path.

[0024] S2. In terms of hardware layout, a bottom collection trough is arranged below the battery pack milling station, and a follow-up spindle-side dust suction pipe is arranged on the side of the milling spindle. The chip outlet of the bottom collection trough and the spindle-side dust suction pipe are respectively connected in parallel to the aluminum chip collection unit, the aluminum-adhesive mixed chip collection unit, and the adhesive chip collection unit through their respective corresponding diversion valve groups.

[0025] S3. During the actual milling process, when the milling toolpath is in the aluminum layer processing area, the control system will simultaneously connect the dust suction pipe on the spindle side and the chip outlet of the bottom collection tank to the aluminum chip collection unit. At this time, the pure aluminum chips generated by cutting are collected in a directional manner.

[0026] S4. Just before the milling toolpath enters the aluminum-plastic transition zone, the system controls the robot to pause feed, but maintains spindle rotation and current path suction, using delayed suction to clear the residual pure aluminum chips in the pipeline. After clearing, the control diversion valve group synchronously switches the chip outlet of the spindle-side dust suction pipe and the bottom collection tank to the aluminum-plastic mixed chip collection unit, and then resumes milling feed.

[0027] S5. Similarly, when it is confirmed that the current toolpath has left the aluminum-plastic transition zone and fully entered the adhesive layer processing zone, the feed is paused again, and the aluminum-plastic mixed chip collection unit is used to keep suction to clean up the residue. After emptying, the dual channels are switched to the adhesive chip collection unit simultaneously and the processing is resumed.

[0028] The zone-based switching collection system utilizes the spatial location information of the CNC milling toolpath as a trigger signal, combined with a pipeline emptying delay mechanism, to achieve physical isolation of debris of different materials in both time and space dimensions. This avoids the mixing of high-value pure aluminum debris with sticky adhesive debris at the source, improving the recycling purity and economic value of aluminum, while reducing the adhesion of adhesive debris in the pure aluminum collection pipeline.

[0029] When securing the battery pack to be disassembled, the battery pack, after being de-energized and isolated, is fixed on an overhead fixture, with the outer side of the base plate facing downwards into the milling work space. Since the internal cell modules will lose their bottom support after the base plate is milled through, an independent support or lifting mechanism is required for the modules inside the battery pack. The aforementioned aluminum-plastic transition zone is designed as a conservative collection area surrounding the material interface. Its extent is not fixed but is determined through comprehensive calculation based on the initial deformation of the base plate, interface measurement error, the current axial depth of cut of the tool, and the toolpath crossing conditions. The principle behind this design is that, considering the physical deformation of retired battery packs, there is a deviation between the theoretical aluminum-plastic interface and the actual interface. By setting a conservative transition zone with a certain degree of redundancy and employing an independent support mechanism, damage to the modules from falling during the moment the base plate is milled through can be prevented. Simultaneously, the conservative transition zone ensures that no potentially glue-containing debris is mixed into the pure aluminum shavings collection unit, guaranteeing the reliability of the classified collection.

[0030] Before milling begins, the system executes a pre-start procedure for the chip removal system. This includes confirming that each collection unit is not fully loaded, the pipelines are unobstructed, the diversion valve assembly is in its initial position, and the bottom collection trough is in the correct working position. Then, the corresponding suction branch and negative pressure device are activated, and sensors detect the working negative pressure at the spindle side suction port and the chip outlet of the bottom collection trough. Only when the negative pressure value reaches the preset effective suction conditions and remains stable does the system issue a command to allow spindle rotation and feed. The principle of this pre-start mechanism is to establish a closed loop for confirming the environmental status before machining. Its effect is to prevent aluminum chips from scattering during the first cut due to an incomplete negative pressure system, thus maintaining a clean workstation environment.

[0031] During milling in the aluminum processing area, the side suction port of the spindle-side dust extraction duct uses close-range negative pressure to capture high-speed flying chips from the cutting area. Aluminum chips that are not captured by the side suction port and settle due to gravity are collected by the bottom collection trough. The bottom collection trough is equipped with a mechanical scraping mechanism that pushes the scattered aluminum chips in the trough to the chip outlet through the reciprocating or rotating motion of the mechanical scraper, and then transports them to the aluminum chip collection unit through the bottom negative pressure pipeline. This dual-channel collaborative chip removal principle combines the advantages of aerodynamic capture and gravity-based mechanical collection, achieving full-space envelope collection of cutting chips and improving the overall chip removal rate.

[0032] During the pipeline emptying process, the system controls the robot to retract the cutter to a safe position. The corresponding diversion valve assemblies of the chip outlet in the bottom collection trough and the dust extraction pipe on the spindle side are electrically and logically interlocked, strictly prohibiting a single channel from simultaneously connecting to two different collection units. When the system has not received a confirmation signal that emptying is complete, the valve assembly defaults to remaining connected to the aluminum glue mixed chip collection unit. The principle of interlocking control and the default safe position is to use logical constraints to prevent channel interconnection caused by valve malfunctions. This reduces airflow cross-contamination and material cross-polluting between different collection boxes, improving the system's fault tolerance.

[0033] To address the complex internal structure of battery packs, the system determines the collection status based on the current local processing area and toolpath segment. When the adhesive layer toolpath needs to cross residual aluminum structures, or when inconsistent layer thicknesses are detected in different areas, or when the material boundary reliability is insufficient, the system will issue an instruction in advance to switch to the mixed chip path. Only after the tool re-enters a defined single material area will the sequential actions of pause, clear, switch, confirm, and resume be executed. The principle of this control strategy is based on the conservative judgment logic of "preferring degraded collection to contamination of pure material," which enables the system to adapt to the complex deformation and irregular adhesive coating process inside the retired battery pack, ensuring the absolute purity of the collected pure material.

[0034] Throughout the processing, the detection and control unit collects real-time signals of branch negative pressure or airflow, filter unit differential pressure, collection box material level, and scraper mechanism operating current, and dynamically adjusts the suction capacity of the variable frequency fan according to the set values ​​for each processing stage. When abnormal signals such as insufficient negative pressure, pipeline blockage, material fullness, abnormal valve position, or scraper jamming are detected, the system immediately suspends feeding and stops cutting. During abnormal handling, the system maintains necessary suction. If the temperature sensor detects an abnormality or a fire occurs, it automatically switches to an independent fire safety procedure. This multi-dimensional real-time monitoring principle is based on building a comprehensive equipment status perception network, which can eliminate potential equipment failures or safety hazards in their infancy, improving the safety of dismantling operations.

[0035] After processing a single battery pack, the system stops cutting and retracts the tool to a safe position, maintaining the current flow path for a delayed suction while continuously operating the scraping mechanism to remove residual debris from the tank. For final cleaning debris that is difficult to classify at the end of processing, the system uniformly directs it to the aluminum-rubber mixed debris collection unit. Based on the emptying time calibrated during the initial trial run, and combined with the material flow detection sensors in the pipeline or visual inspection results within the tank confirming complete emptying, the system closes the corresponding valves and negative pressure devices. The principle of this finishing procedure is to ensure no material residue remains in the pipeline through dual verification of time delay and sensor confirmation. Its effect is to provide a clean initial state for the processing of the next battery pack, avoiding material mixing between batches.

[0036] After the base plate milling is completed, the system checks the processing status of the base plate and base adhesive, the degree of module connection disconnection, and the condition of residual debris at the workstation. Once it is confirmed that the subsequent process conditions are met, an independent support or lifting mechanism, in conjunction with subsequent equipment on the production line, safely removes the exposed modules. Simultaneously, the system database records the battery pack's serial number, processing section parameters, collection path switching records, abnormal alarm information, and clearing results. The principle behind this step is to establish a complete data archive for the disassembly of a single battery pack, achieving traceability of the disassembly process and providing data support for subsequent process optimization and production line management.

[0037] In this embodiment, if the bottom plate or base adhesive is found to still be connected during the separation confirmation, local repair processing is performed, and the corresponding chip removal process is started simultaneously. The chips generated during the repair processing are collected according to their category, and those whose category is difficult to determine are introduced into the aluminum adhesive mixed chip collection unit.

[0038] The conveying and collecting components for aluminum-containing fine powder adopt electrostatic conductive connections and equipotential grounding adapted to the characteristics of the dust being processed, and are equipped with necessary isolation, explosion relief, or explosion suppression measures according to the hazardous characteristics of the dust; the aluminum-rubber mixed debris and the debris path adopt a pre-separation and filtration structure that is easy to disassemble and clean. Specific suction parameters and protective configurations are determined according to the particle size, debris production, and material properties of the debris being processed.

[0039] During trial operation, the suction settings, emptying time, and abnormal thresholds for each processing stage were calibrated based on the amount of chip production and the pipeline status. The residual and mixed material conditions after switching were also verified. During normal operation, the detection and control unit only grants milling permission when the valve position is correct, suction is effective, and the collection capacity is sufficient. If insufficient negative pressure occurs, cutting is paused, the blockage is cleared, and the operation is resumed after verification.

[0040] Based on the above method, this application also provides a rapid aluminum chip removal system for milling the bottom plate of a CTP battery pack, including a positioning and support mechanism 100, a robotic milling unit 200, a bottom collection trough 300, a spindle-side dust collection assembly 400, a diversion and collection unit 500, and a detection and control unit. The positioning and support mechanism 100 is used to fix the CTP battery pack and keep the internal modules stable. The robotic milling unit 200 includes a robot, a spindle, and a cutting tool, which is configured to perform layered milling of the bottom plate and the bottom adhesive according to a preset partitioned toolpath for the aluminum layer processing area, the aluminum-adhesive transition area, and the adhesive layer processing area. The bottom collection trough 300 is arranged below the battery pack and below the cutting tool working area, and its opening projection area covers the chip falling area. It is provided with a guide slope, a chip-blocking edge, a mechanical scraping mechanism, and a chip outlet inside. The spindle-side dust collection assembly 400 includes a follower bracket, a suction port, a flexible connecting section, and a fixed conveying pipe section. The follower bracket is fixed to the side of the spindle, the suction port faces the cutting area and maintains a non-interference clearance with the tool and workpiece, and is configured to move synchronously with the spindle. The diversion and collection unit 500 includes a diversion valve assembly, an aluminum chip collection unit, an aluminum-adhesive mixed chip collection unit, and an adhesive chip collection unit; the chip outlet of the bottom collection tank and the fixed conveying pipe section are respectively connected to each collection unit through their corresponding diversion valve assemblies. The detection and control unit is communicatively connected to the above hardware modules and stores a control program. When executed, it synchronously switches the connection status of the diversion valve assembly according to the machining area where the current toolpath is located.

[0041] In this embodiment, the bottom collection trough 300 is equipped with a guide slope, a chip-blocking edge, and a chip outlet. Its position avoids the movement path of the robot and spindle, and it features an accessible cleaning port and an easy-to-clean inner surface. The scraping mechanism inside the trough uses a reciprocating scraper, which pushes the debris in the trough to the chip outlet through its reciprocating motion. Under the working conditions of this embodiment, the shavings generated during milling are typically fragmented and largely non-adhesive; therefore, a reciprocating scraper is sufficient to meet the scraping and cleaning requirements.

[0042] In this embodiment, the aluminum shavings collection unit, the aluminum-adhesive mixed shavings collection unit, and the adhesive shavings collection unit are each equipped with pre-separation or settling components, a sealed collection box, and a filter assembly. The shavings-containing airflow is connected to the negative pressure device after solid-gas separation. Each collection box and its matching pre-separation and filter components constitute the corresponding collection unit. Each collection unit can be independently pumped; when using a shared negative pressure source, the shavings-containing sections of each branch remain independent of each other, and only converge after filtration and are isolated by branch lines to prevent backflow of shavings and cross-mixing of different types of shavings.

[0043] like Figure 3The diagram illustrates the dual-path debris collection control timing of this embodiment. The diagram shows the sequential relationship between processing, detection, cleaning, switching, confirmation, and recovery according to the process state over time. The width of each stage does not represent the duration, nor does it specify the polarity, address, or fixed delay of the I / O level. When the robot carries the spindle to process the aluminum layer, the chip discharge channel of the bottom collection trough and the dust suction pipe on the spindle side are opened synchronously, and both paths are connected to the aluminum chip collection unit to collect settled aluminum chips and scattered aluminum chips respectively. The synchronous collection of the two paths here refers to the two paths working collaboratively in the same processing stage. After pausing the feed and completing the switching before entering the preset aluminum glue transition zone, both paths switch to the aluminum glue mixed chip collection unit to process the transition zone. Once the robot, equipped with an eddy current sensor, detects the surface of the base plate, and the detected value reaches the sensor's upper limit, confirming that the current area is an adhesive layer, the feed is paused and the tool is retracted to a safe position. While maintaining suction in the original debris mixing path, the robot cleans the tank and shared pipe sections for any residue. After the original path is cleaned and the valve position and suction conditions are normal, the two paths are coordinated to switch to the adhesive debris collection unit. After confirming that the valve position and negative pressure are normal, processing resumes, the adhesive layer is milled, and adhesive debris is collected simultaneously. The collection of mixed debris in the transition zone is performed according to the aforementioned transition zone processing steps; pause, emptying, and switching confirmation are performed according to the corresponding steps.

[0044] During the switching process, the emptying status is determined by changes in the negative pressure value. After switching to the adhesive debris collection unit, the spindle-side suction port continuously removes scattered adhesive debris, while the scraping mechanism in the bottom collection trough intermittently or continuously conveys settled adhesive debris, reducing its adhesion and accumulation. The collection status is determined based on the current local processing area and toolpath segment, not solely on the total cumulative processing time of the entire package. If the subsequent toolpath crosses an unremoved aluminum structure, it first returns to the aluminum-adhesive mixed debris path to prevent residual aluminum debris from entering the adhesive debris collection box. Note: Dual paths refer to the bottom collection trough debris outlet channel and the spindle-side suction pipe. The transition zone is handled according to step S5; pause, emptying, and switching confirmation are performed according to steps S5 to S7. This diagram shows the process status timing and does not specify the I0 level polarity, address, or fixed delay.

[0045] like Figure 4 As shown, the spindle 2 is connected to the end effector of the robot 1 via the mounting connection part 4. The spindle-side dust collection pipe 3 is arranged on the side of the spindle and extends to near the lower end of the spindle, moving synchronously with the robot end effector and the spindle to collect the scattered debris generated during milling. The figure only shows the external visible structure and relative position, and does not represent the internal structure or actual dimensions. The suction port of the spindle-side dust collection assembly faces the cutting area and is close to the main chip removal direction. Its flexible connecting section (hose) is equipped with movement margin and limit, and the suction port position is adjustable to adapt to different tools and machining areas.

[0046] like Figure 5As shown, the eddy current sensor probe 5 is mounted on the probe mounting assembly 6 and is carried by the robot to probe the surface of the battery pack base plate. The probe mounting assembly 6 is connected to the numerical display instrument 8 via the connecting cable 7, and the numerical display instrument 8 provides the probe readings. The left side of the figure shows the main shaft outline, and the area below the probe is a schematic representation of the surface being measured. This figure does not represent the internal structure, actual dimensions, or specific test readings.

[0047] like Figure 6 As shown, robot 1 carries spindle 2 and cutting tool to perform milling; the spindle-side dust extraction pipe 3 is connected to aluminum chip collection box 11, aluminum-plastic mixed chip collection box 12, and adhesive chip collection box 13 respectively via side suction diversion valve group 10A and chip discharge channel of collection tank body 9 via tank body diversion valve group 10B. In the same processing stage, the two diversion valve groups select the same type of collection box, and each group only connects to one type of branch, so that the chip discharge channel of the bottom collection tank and the spindle-side dust extraction pipe can synchronously complete the collection of the corresponding type of chips. Figure 6 The connection method of sharing a negative pressure source is illustrated as follows: After pre-separation or sedimentation, sealed collection and filtration, the filtered airflow of each collection unit is connected to the negative pressure source 14 of the dust collection system. Different types of dust-containing branches remain independent, and the branch isolation is set up in the aforementioned manner. Figure 6 Solid arrows indicate the direction of debris or airflow, dashed lines indicate mechanical installation or processing relationships, cross-line arcs indicate discontinuity, and solid dots indicate convergence.

[0048] like Figure 7 As shown, the detection and control unit includes a PLC or industrial controller, valve position sensors, negative pressure or airflow sensors, differential pressure sensors, and material level sensors. It can also be configured with a material flow detection device or a vision detection device for stage identification, suction adjustment, emptying confirmation, and fault interlocking. The PLC controller 15 communicates with the robot controller 16 via PROFINET to exchange process control information and processing status information. The PLC controller 15 is connected to the dust collection system 17 (including the diversion valve group and suction device) via hardwired I / O to control the switching of the dust collection pipes and the start and stop of the dust collection system. The PLC controller 15 is also connected to the spindle controller 18 via hardwired I / O to control the start and stop of the spindle. Bidirectional arrows in the figure indicate signal interaction between the PLC controller and the robot via PROFINET communication, while unidirectional arrows indicate hardwired I / O control signals output by the PLC controller. Based on the material layering results and the robot's processing status, the PLC controller coordinates the selection of the dual collection channels, the start and stop of the dust collection system, and the start and stop of the spindle according to the aforementioned timing sequence.

[0049] The method and system for rapid aluminum chip removal during CTP battery pack bottom plate milling provided in this application precisely divides the milling area into three layers: pure aluminum, transition layer, and pure adhesive layer. In terms of time, it utilizes the toolpath position to trigger pipeline emptying and synchronize valve switching. Physically, it employs a dual-channel, full-envelope collection architecture of "spindle side suction + bottom scraper receiving." This solution effectively solves the industry's pain points of low recycling purity and easy pipeline blockage caused by mixed collection of milling chips from CTP battery packs. It achieves automated, high-purity classified recycling of chips of different materials, possessing high industrial application value. The method and system of this embodiment are applicable to automated milling and dismantling stations for the bottom plate and adhesive layer of CTP battery packs in new energy end-of-life vehicles, and can also be used in battery pack dismantling production lines with composite metal and adhesive connection structures. By adjusting the bottom collection tank size, suction port position, material partitioning, and suction parameters, it can be adapted to battery packs of different specifications.

[0050] Those skilled in the art will understand that the steps, measures, and schemes in the various operations, methods, processes, and procedures discussed in this application can be alternated, modified, rearranged, decomposed, combined, or deleted.

[0051] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Any other corresponding changes and modifications made based on the technical concept of this application should be included within the scope of protection of the claims of this application.

Claims

1. A method for removing aluminum chips during milling of the bottom plate of a CTP battery pack, characterized in that, Includes the following steps: The battery pack to be disassembled is fixed, and the correspondence between the processing area and the milling layer is established, dividing the aluminum layer processing area, the aluminum-adhesive transition area and the adhesive layer processing area. A bottom collection trough is arranged below the battery pack milling station, and a follow-up spindle-side dust suction pipe is arranged on the side of the milling spindle; the chip outlet of the bottom collection trough and the spindle-side dust suction pipe are respectively connected to the aluminum chip collection unit, the aluminum-adhesive mixed chip collection unit and the adhesive chip collection unit through their respective corresponding diversion valve groups. When the milling toolpath is in the aluminum layer processing area, the dust suction pipe on the spindle side and the chip outlet of the bottom collection groove are simultaneously connected to the aluminum chip collection unit; Before the milling toolpath enters the aluminum-plastic transition zone, pause the feed, maintain the current path suction to clear the pipeline, and after clearing, synchronously switch the dust suction pipe on the spindle side and the chip outlet of the bottom collection tank to the aluminum-plastic mixed chip collection unit, and resume milling. When it is confirmed that the current toolpath leaves the aluminum-plastic transition zone and enters the adhesive layer processing zone, the feed is paused, and the aluminum-plastic mixed chip collection unit is kept suctioned to clean up the residue. After emptying, the dust suction pipe on the spindle side and the chip outlet of the bottom collection groove are simultaneously switched to the adhesive chip collection unit, and processing is resumed.

2. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, The process of securing the battery pack to be disassembled includes: The battery pack, after being de-energized, is fixed on an overhead fixture, with the outer side of the base plate facing downwards to mill the working space, and an independent support or lifting mechanism is set for the modules inside the battery pack. The aluminum-plastic transition zone is a conservative collection area set around the material interface, and its range is determined based on the deformation of the base plate, the interface measurement error, the axial cutting depth of the tool, and the toolpath crossing situation.

3. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, Before milling begins, a pre-start of the chip removal system is also included, comprising: Confirm that each collection unit is not full, the pipeline is unobstructed, the diversion valve group is in place, and the bottom collection tank is in the working position; open the corresponding suction branch and negative pressure device, and check the working negative pressure of the spindle side suction port and the chip outlet of the bottom collection tank; when the preset effective suction conditions are reached and remain stable, allow the spindle to rotate and feed.

4. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, When the milling toolpath is in the aluminum layer processing area, the dust extraction pipe on the spindle side and the chip outlet of the bottom collection groove are simultaneously connected to the aluminum chip collection unit, including: The side suction port of the main shaft side dust collection pipe captures flying debris from the cutting area, and the bottom collection trough receives the settled aluminum chips that are not captured by the side suction port. The mechanical scraping mechanism in the bottom collection trough pushes the aluminum chips in the trough to the chip outlet, and then the negative pressure transports them to the aluminum chip collection unit, achieving near-blade suction and bottom collection simultaneously with the dust collection pipe on the main shaft side.

5. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, The method further includes: When emptying the pipeline, retract the cutting tool to a safe position; The chip outlet of the bottom collection trough and the corresponding diversion valve group of the main shaft side dust suction pipe are interlocked to prevent a single channel from being connected to different collection units at the same time; when the emptying is not confirmed, the system defaults to keeping the aluminum glue mixed chip collection unit connected.

6. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, The method further includes: The collection status is determined based on the current local processing area and toolpath segment. When the adhesive layer toolpath needs to cross the residual aluminum structure, the layers in different areas are inconsistent, or the material boundary reliability is insufficient, the process is switched to the aluminum adhesive mixed chip collection unit path in advance. After re-entering the determined single material area, the sequence of actions of pausing, clearing, switching, confirming, and resuming is executed in sequence.

7. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, The method further includes: Real-time acquisition of branch negative pressure or air volume, filter unit pressure difference, collection box material level, and scraper mechanism operation signals; adjustment of suction capacity according to the set values ​​of each processing stage; when insufficient negative pressure, pipeline blockage, material fullness, valve position abnormality, or scraper jamming occurs, feeding is suspended and cutting is stopped; necessary suction is maintained during abnormal handling process; when fire or abnormal temperature occurs, it switches to an independent safety handling procedure.

8. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 1, characterized in that, The method further includes: After processing is completed, cutting is stopped and the tool is retracted to a safe position. The current passage is maintained for a delayed suction, and the scraping mechanism is run to discharge the residual chips. For the final cleaning chips that are difficult to classify, the aluminum glue mixed chip collection unit is used. After confirming that the chips have been emptied according to the emptying time calibrated during trial operation and the results of material flow detection or visual inspection in the tank, the corresponding valves and negative pressure devices are closed.

9. The method for removing aluminum chips from the bottom plate of a CTP battery pack according to claim 2, characterized in that, The method further includes: Check the processing status of the base plate and base adhesive, the degree of module connection disconnection, and the condition of residual debris at the work station; after the process conditions are met, the independent support or lifting mechanism, in conjunction with subsequent equipment, removes the module; record the battery pack number, processing section, collection path, abnormal information, and emptying result.

10. A chip removal system for milling the bottom plate of a CTP battery pack, characterized in that, include: Positioning and support mechanism, used to secure the CTP battery pack and keep the module stable; The robotic milling unit is configured to perform layered milling of the base plate and base adhesive according to the preset partitioned toolpaths of the aluminum layer processing area, aluminum-adhesive transition area and adhesive layer processing area; The bottom collection trough is located below the battery pack and below the tool working area, and its opening projection area covers the debris drop area. The spindle-side dust collection assembly includes a follower bracket and a suction port. The follower bracket is fixed to the side of the spindle, and the suction port faces the cutting area and maintains a non-interference gap with the tool and workpiece. The suction port is configured to move synchronously with the spindle. The diversion and collection unit includes a diversion valve assembly, an aluminum shavings collection unit, an aluminum glue mixed shavings collection unit, and a glue shavings collection unit; The chip outlet of the bottom collection trough and the dust collection assembly on the main shaft side can be selectively connected to each collection unit through their respective diversion valve groups; The detection and control unit is communicatively connected to the robot milling unit, the bottom collection tank, the spindle-side dust collection assembly, and the diversion and collection unit. It is configured to receive the area number, layer, and machining start / stop signals, and synchronously control the diversion valve group to switch to the corresponding collection unit according to the machining area where the current toolpath is located.

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