Polishing process for quartz stone countertop joints

Abstract

This invention relates to the field of countertop polishing technology, and more particularly to a polishing process for quartz countertop seams, comprising the following steps: S100, pre-treatment of the countertop on both sides of the seam and countertop constraint; S200, filling the seam with filler, with the countertop constraint restricting the filler until it solidifies and locks in place, balancing the internal stress of the filler; S300, quality inspection of the seam; if the inspection fails, rework is performed; if it passes, it is ready to proceed to the polishing process; S400, progressive polishing under water-cooling conditions, with the polishing area controlled at a predetermined temperature, proceeding to the next stage only after the previous stage's polishing marks are eliminated; S500, polishing the seam under set conditions; S600, re-inspection of the seam; if the re-inspection fails, rework is performed. This invention utilizes the thermal expansion of the filler during solidification, spontaneously generating pre-compression stress, thereby solving the technical problems of not being able to apply mechanical pre-stress under fixed countertop conditions and the inability to permanently lock the pre-compression stress.

Description

Technical Field

[0001] This invention relates to the field of countertop polishing technology, and more particularly to the polishing process for the seams of quartz countertops. Background Technology

[0002] During the fabrication and fitting of quartz countertops, seams may occur due to insufficient slab length or the need for corners. The conventional solution is to fill these seams with a composite material, followed by polishing to remove the filler.

[0003] However, using conventional materials and methods to fill the seams and then polishing them can easily lead to unevenness. The reason is:

[0004] Composite materials are typically composed of resin and inorganic fillers, while quartz stone slabs consist of mineral particles and a resin skeleton. The difference in their thermal expansion and elastic modulus can lead to hairline cracks or stress cracks around the joints over long-term use. During polishing, the filler at the joints is ground to the same height as the countertop; however, when quartz stone slabs are heated or cooled, the joints will noticeably appear concave or convex, affecting both aesthetics and usability. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides the following technical solution:

[0006] The grout polishing process for quartz countertops includes the following steps:

[0007] S100, pre-treatment of the tabletop on both sides of the seam, and tabletop constraint;

[0008] S200 is used to fill the joint with filler. The table surface constraint restricts the filler until it is cured and locked, so that the internal stress of the filler is balanced.

[0009] S300, seam quality inspection; if the inspection fails, rework is required; if it passes, the process is ready to proceed to the polishing stage.

[0010] S400, under water-cooled conditions, grinds step by step, with the grinding area controlled at a predetermined temperature, and enters the next stage only after the grinding marks of the previous stage are eliminated;

[0011] S500 polishes the seams under set conditions;

[0012] S600: The seams are re-inspected. If the re-inspection fails, rework is required.

[0013] As an improvement to the above technical solution, in S100, the tabletop preprocessing includes the following steps:

[0014] S110, Preparatory construction: Inspect and clean the cross-section that forms the joint, and protect the countertops on both sides of the joint.

[0015] S120, Tabletop Leveling: Fine-tune the surfaces on both sides of the seam, and eliminate height differences after alignment;

[0016] S130, Tabletop Fixing: Fix the tabletops on both sides of the seam to define the seam boundary;

[0017] S140, Tabletop Constraint: The tabletops on both sides of the joint are constrained by clamps to prepare for the filling of filler.

[0018] As an improvement to the above technical solution, in S140, the table constraint includes at least the following steps:

[0019] The main fixed clamp applies horizontal clamping force, while the auxiliary clamp provides lateral limiting.

[0020] During the joint filling process, the main fixing clamp and auxiliary clamp dynamically adjust the pressure to make the filler spontaneously generate pre-compression stress.

[0021] As an improvement to the above technical solution, in S200, the filling process includes the following steps:

[0022] S210, inject the prepared filler into the joint and cover the joint opening with release film;

[0023] S220, when it changes from a liquid state to a highly elastic state, is kept at a low temperature and then slowly heated after a period of time;

[0024] S230, in its high-elastic state, is rapidly heated to a high-temperature state and held at that temperature for a period of time, allowing the filler to expand fully and rapidly;

[0025] S240, when it transitions from a highly elastic state to a glassy state, is held for a period of time to ensure that the filler is fully cured.

[0026] As an improvement to the above technical solution, in S230, the filler expands during the insulation process, forcibly converting the upward pressure of the expansion at the joint into horizontal compressive stress, and maintaining the horizontal compressive stress until the filler cures.

[0027] As an improvement to the above technical solution, in S300, the seam inspection includes the following steps:

[0028] Remove excess filler, attach strain gauges to the joints, and record stress changes after the tabletop constraints are removed;

[0029] If the residual compressive stress is less than the design value, rework is required;

[0030] If the residual compressive stress is not less than the design value, then ultrasonic waves are emitted along the joint direction to measure the change in sound velocity.

[0031] If the changes conform to the design values, then it is acceptable; otherwise, it must be reworked.

[0032] As an improvement to the above technical solution, the grinding and polishing step in step S400 is as follows:

[0033] S410, after removing surface constraints, let it stand for a set time;

[0034] S420, turn on water cooling and perform polishing operation;

[0035] S430, low-temperature mirror polishing.

[0036] As an improvement to the above technical solution, in step S420, the step-by-step polishing includes at least:

[0037] Coarse grinding, fine grinding, and precision grinding;

[0038] The coarse grinding uses 50-100 mesh and a speed range of 1200-1500 rpm;

[0039] Fine grinding uses 200-800 mesh and a speed range of 800-1000 rpm;

[0040] Fine grinding uses 1500-3000 mesh and a speed range of 800-900 rpm.

[0041] As an improvement to the above technical solution, in step S500, the polishing conditions are as follows:

[0042] The rotation speed range is 600-800 rpm, the polishing moving speed is ≤5cm / s, the polishing time at the same position does not exceed 3s, and water cooling is maintained during polishing.

[0043] As an improvement to the above technical solution, in step S600, the seam re-inspection includes the following steps:

[0044] Use ultraviolet lamps for irradiation in dark conditions;

[0045] If the seam appears as a uniform, continuous, and bright band of light under illumination, then the filling and sanding are considered satisfactory.

[0046] If dark areas appear in the seams under light, they are marked as defects;

[0047] If bright spots appear at the seams under light, grouting reinforcement is required.

[0048] The beneficial effects of this invention are:

[0049] By incorporating thermally expanding microcapsules into the filler, the filler expands due to heat during solidification. Under the constraint of the platform, this allows the filler to spontaneously generate pre-stress, thus solving the technical problems of not being able to apply mechanical pre-stress when the platform is fixed and the inability to permanently lock the pre-stress. Permanently locking the pre-stress reduces the difficulty of subsequent grinding and polishing, and extends the service life of the final product. Attached Figure Description

[0050] Figure 1 This is a flowchart of the present invention. Detailed Implementation

[0051] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0052] Composite materials are typically composed of resin and inorganic fillers, while quartz stone slabs consist of mineral particles and a resin skeleton. The difference in their thermal expansion and elastic modulus can lead to hairline cracks or stress cracks around the joints over long-term use. During polishing, the filler at the joints is ground to the same height as the countertop; however, when quartz stone slabs are heated or cooled, the joints will noticeably appear concave or convex, affecting both aesthetics and usability.

[0053] See appendix Figure 1 As shown, in order to solve the above technical problems, a quartz countertop joint grinding and polishing process is provided, including the following steps:

[0054] Step S100 involves pre-treating and constraining the countertops on both sides of the seam. This step is used to fix the countertops and thus control the seam. This ensures the seam is in an optimal filling state, resulting in optimal bond strength and durability after filling. Specifically:

[0055] In step S100, the tabletop preprocessing includes the following steps:

[0056] Step S110, Preparatory construction: Inspect and clean the cross-section that forms the joint, and protect the countertops on both sides of the joint.

[0057] Specifically, ensure that the cross-sections of the workpieces on both sides of the joint meet the requirements for filling accuracy and surface condition, such as removing chips, missing corners, and wavy surfaces, to prevent cross-sectional defects from damaging the filling effect. Thoroughly remove oil, dust, moisture, and other contaminants from the cross-section to prevent the formation of a "weak boundary layer," ensuring effective adhesion between the filler material and the cross-section and preventing interruption of the prestress transfer path. Furthermore, protect the workpieces on both sides of the joint to prevent subsequent operations such as applying adhesive, scraping adhesive, and heating from causing contamination, scratches, or heat damage.

[0058] Joint inspection is primarily conducted visually, using a right-angle ruler, and under light. Surface cleaning mainly removes particulate matter, organic contaminants, and moisture. Dry dust removal is achieved by cleaning the surface with a stiff-bristled brush or scouring pad. Degreasing is performed using solvents, such as acetone, to dissolve organic matter, which evaporates quickly. Alcohol is then used to remove any remaining acetone residue. Because acetone is a highly polar solvent, it effectively dissolves grease, wax, and cutting fluid residue on the surface. However, due to its rapid evaporation, a single wipe cannot guarantee complete dissolution of contaminants; therefore, a dual dissolution method using both acetone and alcohol is employed. Finally, high-pressure purging ensures the surface is dry. Moisture can react with ammonia in the epoxy curing agent in the filler, producing bubbles and byproducts, which can weaken the filler strength and even cause complete adhesive failure in severe cases.

[0059] Countertop protection can prevent risks from occurring on both sides of the seam during subsequent filling, finishing, and polishing operations.

[0060] Step S120, Countertop Leveling: Fine-tune the surfaces on both sides of the joint, aligning them to eliminate height differences. This step is used to adjust the upper surfaces of the boards on both sides of the joint to be flush, so that the subsequent filling can be flush with the countertop after curing. It also establishes a horizontal benchmark, providing a horizontal reference for subsequent countertop constraints. Simultaneously aligned joints stabilize the joint width, preventing changes in joint width due to subsequent operations.

[0061] In conventional countertop joint construction, adjusting height differences is done using bottom padding, which lacks quantifiable standards and a systematic operational procedure. This solution uses leveling tools for precise and fine adjustments, with simultaneous pre-clamping during the leveling process to ensure the leveled state remains unchanged during subsequent filling and curing.

[0062] Step S130, Tabletop Fixing: Fix the tabletops on both sides of the joint to define the joint boundary. Rigidly lock the tabletops in the precise position after leveling to provide a stable and unchanging joint boundary for subsequent filling, curing, and prestressing locking.

[0063] By fixing the worktable, leveling and locking are achieved, preventing displacement of the board material during subsequent filling and curing operations. The worktable is rigidly constrained in the horizontal direction to establish horizontal compressive stress for the subsequent filler. Simultaneously, the fixed worktable can resist the jacking force of the filler expansion.

[0064] Step S140, Platform Constraint: The platform on both sides of the joint is constrained by clamps to prepare for the filling of filler. The leveled platform is locked in place on both sides of the joint by clamps, applying rigid constraints to the platform so that it forms an immovable rigid boundary in space, providing stable boundary conditions for the prestress generated by the subsequent filling and expansion.

[0065] In step S140, the platform constraint includes the following steps:

[0066] The main fixed clamp applies horizontal clamping force, while the auxiliary clamp provides lateral limiting.

[0067] During the seam filling process, the main fixing clamp and auxiliary clamp dynamically adjust the pressure.

[0068] In step S200, filler is filled into the joint, and the platform constraint restricts the filler until it solidifies and locks in, balancing the internal stress of the filler. Based on the rigid constraint of the platform, filler with expansion capacity is filled into the joint. Under the constraint of the platform, the volume expansion during the filler's curing process confines the prestress within the joint space. The prestress is locked through the transition from a highly elastic state to a glassy state, and finally, stress balance brings the internal stress of the filler to a stable state.

[0069] By constraining the platform and rigidly limiting the vertical direction, the expansion of the filler within the joint is forcibly converted into compressive stress in the horizontal direction. Pressure holding during cooling and static waiting after curing ensure that the residual stress within the filler is fully balanced and stabilized, guaranteeing the durability of the prestress.

[0070] This solution also provides a filler composition, with each component listed as a mass percentage:

[0071] Component A: 45% bisphenol A epoxy resin, 15% bisphenol F epoxy resin, 5% reactive diluent, 30% quartz powder, 2% hydrophobic fumed silica, 1.5% γ-glycidyl etheroxypropyltrimethoxysilane, 0.5% defoamer, and 1% leveling agent.

[0072] Component B: 50% modified fatty amine curing agent, 30% polyether amine, 10% m-phenylenediamine, 2% accelerator, 3% coupling agent, and 5% hydrophilic fumed silica.

[0073] Functional components: The shell is a polyacrylonitrile copolymer, and the core material is a mixture of isopentane or isooctane. The particle size in the dry state is 15-25 μm, and the particle size after expansion is 50-80 μm. The weight (accounting for the total weight of A+B) is about 6%. The preferred tracer is rhodamine B isothiocyanate.

[0074] It should be noted that the filler used in this solution contains thermally expandable microcapsules. These microcapsules expand after heating, and the core material of the microcapsules contains a fluorescent tracer, which is used for testing the dispersion uniformity after construction and the expansion uniformity after curing.

[0075] Specifically, in step S200, the packing process includes the following steps:

[0076] In step S210, the prepared filler is injected into the seam, and a release film is placed over the seam opening.

[0077] In this scheme, the filler consists of epoxy resin, reactive diluent, coupling agent and other uniformly mixed, then quartz powder, thermal expansion microcapsules and curing agent are added, and finally modified to obtain the filler.

[0078] The filler is inserted into the joint using a special needle or scraper. After filling, a release film is applied to the joint opening to prevent contamination of the filler. Simultaneously, the platform constraint limits the movement at the joint opening, ensuring that the filler can only be compressed inwards, converting this compression into compressive stress.

[0079] In step S220, during the transition from the liquid state to the elastic state, the temperature is maintained at a low temperature, and then slowly increased after a period of time. For ease of understanding, a specific implementation method is provided:

[0080] The filling temperature is lower than the initial temperature of the thermally expanding microcapsules to avoid premature expansion. Preferably, the heating rate is 5°C / min, the holding time is 40min, and the target temperature is 60°C. By slowly increasing the temperature, thermal shock that could cause premature expansion of the thermally expanding microcapsules is avoided, and the holding time ensures that the epoxy network is fully cross-linked and reaches a gel state. To determine if the filler has reached a gel state, gently touch the edge of the filling layer; the filler should be elastic, non-sticky, non-deformable, and not spring back.

[0081] In step S230, while in the highly elastic state, the temperature is rapidly increased to a high temperature and maintained for a period of time to allow the filler to expand fully and rapidly. For ease of understanding, a specific implementation method is provided:

[0082] The thermal expansion microcapsules expand rapidly by quickly heating above their expansion temperature. Preferably, the heating rate is 10°C / min, the holding time is 5min, and the target temperature is 105°C. By heating to the initial temperature of the thermal expansion microcapsules, which is below the glass transition temperature of the epoxy resin, and holding the temperature for a short time, cracking due to prolonged exposure is avoided, and the tabletop material is not damaged by heat.

[0083] Wherein, in step S230, the filler expands during the heat preservation process, the upward expansion pressure at the joint is forcibly converted into horizontal compressive stress, and the horizontal compressive stress is maintained until the filler is cured.

[0084] When the volume of the thermally expandable microcapsule expands rapidly, since the opening of the joint is restricted by the table surface constraint and both sides of the joint are constrained by the plate, the expansion deformation can only be converted into horizontal compressive stress inside the filling.

[0085] In step S240, when transitioning from the high elastic state to the glassy state, hold for a period of time to ensure the filler is fully cured. The epoxy continues to crosslink in the expanded high elastic state, and gradually transitions from a rubbery state to a stripped state. The molecular chain movement of the epoxy in the glassy state is frozen. Although the thermally expandable microcapsule elastically retracts as the temperature decreases, the epoxy network with extremely high surrounding modulus can maintain the tension generated during expansion, ensuring that the residual pre-compressive stress is permanently locked.

[0086] Stop heating during pressure holding, so that the filler cools in a natural state, preventing the thermally expandable microcapsule from retracting at the initial stage of cooling and causing the stress to be released in advance. The cooling rate is controlled, preferably not exceeding 5°C / min, to avoid impact caused by quenching of the filler that has not been completely solidified. When the temperature drops to room temperature, the epoxy has been completely vitrified, and the retraction of the thermally expandable microcapsule is locked. At this time, the table surface constraint can be removed, and the system is left to stand for a period of time after the table surface is removed.

[0087] In step S300, joint quality inspection is performed; if the inspection fails, rework is carried out; if it is qualified, preparation for the polishing process is made. This step is executed after the filler curing and locking, table surface constraint removal and stress balance waiting are all completed. Excess material generated by the filler and table surface constraint on the joint surface is removed, and a flat adhesive layer surface is cleaned out to provide a flat inspection surface for subsequent strain gauge pasting and ultrasonic testing.

[0088] The joint quality inspection includes the following steps:

[0089] Shovel off the excess filler, paste a strain gauge on the joint, and record the stress change after the table surface constraint is removed.

[0090] After the table surface constraint with the same length as the joint is removed, the excess filler can be shoveled off, the strain gauge is pasted at the joint, and then the table surface constraint is completely removed to record the data after the table surface constraint force is removed.

[0091] If the residual compressive stress is less than the design value, rework is performed.

[0092] The residual compressive stress value inside the filler after the table surface constraint is removed is directly measured by the strain gauge method to verify whether it reaches the design value. For example, if the residual stress value ranges from 2 to 8 MPa, it is qualified. If the measured residual stress value does not fall within this range, it is unqualified and rework is performed.

[0093] If the residual compressive stress is not less than the design value, then ultrasonic waves are emitted along the joint direction to measure the change in sound velocity.

[0094] To ensure the measurement results are free from errors or other interference, ultrasonic testing was performed after the variable plate method. The uniformity of stress distribution within the packing was detected by measuring the sound velocity along the seam direction using the acoustoelastic effect. Changes in sound velocity reflect the stress distribution; uniform sound velocity indicates uniform stress, while abnormal sound velocity indicates the presence of stress concentration or relaxation areas.

[0095] If the changes conform to the design values, then it is acceptable; otherwise, it must be reworked.

[0096] Finally, a final decision is made based on a comprehensive evaluation of the residual compressive stress measurement and the uniformity of ultrasonic velocity.

[0097] In step S400, grinding is performed step by step under water cooling conditions, with the grinding area controlled at a predetermined temperature. The grinding marks from the previous stage are eliminated before proceeding to the next stage. The remaining filler protruding from the tabletop is removed step by step, making the seam filler flush with the surfaces of both sides of the tabletop, achieving a visually seamless effect.

[0098] Specifically, the sanding and polishing steps are as follows:

[0099] In step S410, after removing the surface constraints, the surface is left to stand for a set time.

[0100] After the tabletop constraints are removed, the packing material is no longer physically constrained, and the internal residual stress is in a non-equilibrium state. The purpose of allowing it to stand still is to allow the residual stress inside the packing material to fully redistribute and stabilize at room temperature, preventing uncontrollable stress release caused by grinding under unstable stress conditions.

[0101] The preferred method is to allow the plant to stand for at least 2 hours, and to keep the ambient temperature between 15-20°C. This avoids excessive temperature differences that could cause thermal stress fluctuations, as well as localized sudden cooling or heating that could lead to uneven stress distribution.

[0102] In step S420, water cooling is turned on to perform the polishing operation.

[0103] Under full water cooling conditions, the material is polished step by step according to a fixed grinding disc grit sequence from coarse to fine, gradually removing the excess filler material that protrudes above the board surface and making the joint flush with the surface of the two side panels.

[0104] Gradual polishing includes: coarse polishing, fine polishing, and precision polishing.

[0105] The coarse grinding uses 50-100 mesh and a speed range of 1200-1500 rpm.

[0106] Low-speed control of frictional heat and rapid reduction of filler excess through water cooling can be achieved by setting up an additional infrared thermometer for real-time monitoring.

[0107] Fine grinding uses 200-800 mesh and a speed range of 800-1000 rpm.

[0108] Fine grinding uses 1500-3000 mesh and a speed range of 800-900 rpm.

[0109] After each level of sanding is completed, it must be ensured that the sanding marks from the previous level are no longer visible before moving on to the next level, and that the seams and countertops are seamless after fine sanding.

[0110] The temperature is controlled below the expansion initiation temperature of the thermal expansion microcapsules to ensure that, from a thermodynamic perspective, the thermal expansion microcapsules will not expand or rupture due to heat.

[0111] In addition, different grinding disc mesh sizes will be set with different rotation speeds. By gradually reducing the rotation speed as the mesh size increases, the generation of frictional heat can be controlled from the source.

[0112] In step S430, low-temperature mirror polishing is performed. Preliminary polishing removes scratches from the previous polishing process and ensures that the seam surface is substantially consistent with the two side countertops.

[0113] In step S500, the seam is polished under set conditions.

[0114] Final polishing is performed at low speed and low temperature to achieve a high gloss level on the seam surface that matches the two side countertops, while avoiding thermal damage caused by high-speed friction that could lead to the failure of the thermally expanded microcapsules.

[0115] Preferably, the rotation speed is 600-800 rpm, the polishing moving speed is ≤5 cm / s, the polishing time at the same position is no more than 3 seconds, and water cooling is maintained during polishing to ensure that the filler temperature does not exceed the initial temperature of the thermal expansion microcapsules.

[0116] S600: The seams are re-inspected. If the re-inspection fails, rework is required.

[0117] The seam re-inspection includes the following steps:

[0118] Use ultraviolet lamps for irradiation in dark conditions.

[0119] By utilizing the fluorescent agent in the thermally expanding microcapsules, and after polishing, irradiation with ultraviolet light allows for a direct visual assessment of whether the filler is damaged, thereby verifying whether the residual pressure is intact.

[0120] If the seam appears as a uniform, continuous, and bright band under light, then the filling and sanding are acceptable.

[0121] If dark areas appear in the seams under light, they are marked as defects.

[0122] If bright spots appear at the seams under light, grouting reinforcement is required.

[0123] During irradiation, the device moves at a uniform speed along the seam direction and observes from multiple angles to achieve visualized, non-destructive, and rapid inspection of the prestress integrity. The appearance of dark areas or bright spots indicates that the thermal expansion microcapsules have overheated or been damaged by mechanical impact, or that the fluorescent agent has been quenched or leaked, resulting in the release of prestress or a localized area of ​​fluorescent enrichment. Complete non-uniformity indicates uneven distribution of the thermal expansion microcapsules within the filler or large-area damage.

[0124] Rework requires reinforcing the abnormal areas or refilling the seams, starting again from step S100.

[0125] The above embodiments are merely illustrative of the technical solutions of the present invention and are not intended to limit it. Anyone skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. The quartz stone countertop joint grinding and polishing process, characterized in that, Includes the following steps: S100, pre-treatment of the tabletop on both sides of the seam, and tabletop constraint; S200 is used to fill the joint with filler. The table surface constraint restricts the filler until it is cured and locked, so that the internal stress of the filler is balanced. S300, seam quality inspection; if the inspection fails, rework is required; if it passes, the process is ready to proceed to the polishing stage. S400, grinding is performed step by step under water cooling conditions. The grinding area is controlled at a predetermined temperature. The grinding marks of the previous stage are eliminated before entering the next stage. S500 polishes the seams under set conditions; S600: The seams are re-inspected. If the re-inspection fails, rework is required.

2. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In S100, the tabletop preprocessing includes the following steps: S110, Preparatory construction: Inspect and clean the cross-section that forms the joint, and protect the countertops on both sides of the joint. S120, Tabletop Leveling: Fine-tune the surfaces on both sides of the seam, align them, and eliminate height differences; S130, Tabletop Fixing: Fix the tabletops on both sides of the seam to define the seam boundary; S140, Tabletop Constraint: The tabletops on both sides of the joint are constrained by clamps to prepare for the filling of filler.

3. The quartz countertop seam grinding and polishing process according to claim 2, characterized in that: In S140, the table constraint includes at least the following steps: The main fixed clamp applies horizontal clamping force, while the auxiliary clamp provides lateral limiting. During the joint filling process, the main fixing clamp and auxiliary clamp dynamically adjust the pressure to make the filler spontaneously generate pre-compression stress.

4. The quartz countertop seam grinding and polishing process according to claim 3, characterized in that: In S200, the packing process includes the following steps: S210, inject the prepared filler into the joint and cover the joint opening with release film; S220, when it changes from a liquid state to a highly elastic state, is kept at a low temperature and then slowly heated after a period of time; S230, in its high-elastic state, is rapidly heated to a high-temperature state and held at that temperature for a period of time, allowing the filler to expand fully and rapidly; S240, when it transitions from a highly elastic state to a glassy state, is held for a period of time to ensure that the filler is fully cured.

5. The quartz countertop seam grinding and polishing process according to claim 4, characterized in that: In S230, the filler expands during the insulation process, forcibly converting the upward pressure at the joint into horizontal compressive stress, and maintaining the horizontal compressive stress until the filler cures.

6. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In S300, seam inspection includes the following steps: Remove excess filler, attach strain gauges to the joints, and record stress changes after the tabletop constraints are removed; If the residual compressive stress is less than the design value, rework is required; If the residual compressive stress is not less than the design value, then ultrasonic waves are emitted along the joint direction to measure the change in sound velocity. If the changes conform to the design values, then it is acceptable; otherwise, it must be reworked.

7. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In step S400, the grinding and polishing steps are as follows: S410, after removing surface constraints, let it stand for a set time; S420, turn on water cooling and perform step-by-step polishing operation; S430, low-temperature mirror polishing.

8. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In step S420, the progressive polishing process includes at least the following: Coarse grinding, fine grinding, and precision grinding; The coarse grinding uses 50-100 mesh and a speed range of 1200-1500 rpm; Fine grinding uses 200-800 mesh and a speed range of 800-1000 rpm; Fine grinding uses 1500-3000 mesh and a speed range of 800-900 rpm.

9. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In step S500, the polishing conditions are: The rotation speed range is 600-800 rpm, the polishing moving speed is ≤5cm / s, the polishing time at the same position does not exceed 3s, and water cooling is maintained during polishing.

10. The quartz countertop seam grinding and polishing process according to claim 1, characterized in that: In step S600, the seam re-inspection includes the following steps: Use ultraviolet lamps for irradiation in dark conditions; If the seam appears as a uniform, continuous, and bright band of light under illumination, then the filling and sanding are considered satisfactory. If dark areas appear in the seams under light, they are marked as defects; If bright spots appear at the seams under light, grouting reinforcement is required.

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