Chemical mechanical polishing apparatus

Abstract

This application provides a chemical mechanical polishing (CMP) apparatus, comprising: a mounting frame including a mounting base, and a liquid guiding plate detachably mounted on the mounting base, the liquid guiding plate having at least one drain port; a polishing disc assembly and a carrier disc assembly, respectively disposed at different positions on the liquid guiding plate; and a polishing assembly movably disposed above the liquid guiding plate to move between the polishing disc assembly and the carrier disc assembly. Thus, by configuring the mounting frame as a separate, detachable structure for the mounting base and the liquid guiding plate, when the liquid guiding plate is corroded by the polishing fluid, only the liquid guiding plate needs to be replaced individually without replacing the entire mounting base, reducing maintenance costs and cycle time. Simultaneously, the functional components on the liquid guiding plate are installed in separate zones and arranged in an orderly manner, facilitating coordinated operation. Furthermore, the drain port on the liquid guiding plate can collect and drain the polishing fluid dripping during the polishing process, preventing liquid accumulation inside the apparatus and maintaining its dryness and cleanliness.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing equipment technology, and in particular to a chemical mechanical polishing apparatus. Background Technology

[0002] Chemical mechanical polishing (CMP) equipment is widely used in semiconductor manufacturing for global planarization of wafer surfaces. Its process performance directly affects wafer yield and reliability. CMP equipment polishes the wafer by rotating polishing components while simultaneously using a polishing slurry to further process the wafer surface. This combined mechanical and chemical action results in the polishing of the wafer, thus involving a large amount of liquid in the actual polishing environment.

[0003] Currently, the base of chemical mechanical polishing (CMP) equipment is typically machined from a single piece of sheet metal. However, the base itself is large in weight and area, making movement and machining difficult due to volume constraints during the fabrication of the drainage structure. This results in delayed liquid drainage during polishing, allowing moisture to seep into the main shaft through the assembly gap between the drive shaft and the fixed base. This can lead to bearing corrosion, motor damage, and other malfunctions, severely impacting the equipment's lifespan. Furthermore, any leakage or corrosion damage to the sheet metal surface necessitates complete replacement or repair, resulting in high maintenance costs and long maintenance cycles. Summary of the Invention

[0004] This application provides a chemical mechanical polishing device that reduces maintenance and manufacturing costs through a detachable connection between the mounting base and the liquid guiding plate, and optimizes equipment layout and cleanliness through zoned load-bearing and centralized liquid drainage.

[0005] The technical solution adopted in this application is as follows: A chemical mechanical polishing apparatus, the apparatus comprising: The mounting frame includes a mounting base and a liquid guide plate detachably disposed on the mounting base, the liquid guide plate having at least one drain port; The polishing disc assembly and the carrier disc assembly are respectively located at different positions on the liquid guiding plate; A polishing assembly is movably disposed above the liquid guiding plate to move between the polishing disc assembly and the carrier disc assembly.

[0006] Preferably, the device further includes a slurry arm assembly, a dressing assembly, and a dressing cleaning assembly, wherein the slurry arm assembly, the dressing assembly, and the dressing cleaning assembly are respectively disposed on the side of the liquid guiding plate away from the carrier plate assembly, and are located on the periphery of the polishing plate assembly.

[0007] Preferably, the device further includes a sealing assembly, which includes a first sealing structure and a second sealing structure. The first sealing structure is disposed between at least one of the polishing disc assembly, the carrier disc assembly, the slurry arm assembly, the dresser assembly, and the dresser cleaning assembly and the liquid guiding plate. The second sealing structure is disposed between at least one of the polishing disc assembly, the carrier disc assembly, the slurry arm assembly, the dresser assembly, and the dresser cleaning assembly and the mounting base.

[0008] Preferably, the polishing assembly includes a spindle assembly and a polishing head assembly; The spindle assembly includes a drive component and a connecting ring. The drive component has a drive shaft that passes through the connecting ring and is connected to the polishing head assembly. The inner wall of the connecting ring is provided with an air groove, which faces the outer peripheral surface of the drive shaft and extends along the axial and circumferential directions of the connecting ring.

[0009] Preferably, the end face of the connecting ring is provided with an air inlet and an air supply channel. The air supply channel includes a main channel and multiple branch channels. The air inlet is connected to the main channel, and the main channel is connected to the air trough through the multiple branch channels.

[0010] Preferably, the spindle assembly further includes a first fixed seat, a second fixed seat, and a plurality of connecting rods. The first fixed seat surrounds the drive shaft and is connected to the side of the connecting ring away from the drive member. The second fixed seat is connected to the end of the drive member away from the connecting ring. The plurality of connecting rods are connected between the first fixed seat and the second fixed seat and are arranged circumferentially along the drive member.

[0011] Preferably, the spindle assembly further includes a liquid-blocking plate, which has a first through hole for guiding the drive shaft through, and the liquid-blocking plate is connected to the end of the first fixing seat away from the connecting ring.

[0012] Preferably, the spindle assembly further includes a support plate with a second through hole for guiding the drive shaft through. The support plate is connected to the side of the liquid-separating plate opposite to the first fixed seat. The support plate is adjacent to the polishing head assembly and has an axial gap with the polishing head assembly.

[0013] Preferably, the upper surface of the liquid guiding plate is composed of multiple inclined guide surfaces that are tilted towards the drain port, and the drain port is located at the lowest intersection of the inclined guide surfaces.

[0014] Preferably, the liquid guiding plate has a first center line extending in the width direction, and the number of the drain ports is at least two, with the two drain ports arranged symmetrically along the first center line.

[0015] According to the specific embodiments provided in this application, the following technical effects are disclosed: The technical solution of this application provides a chemical mechanical polishing apparatus, comprising: a mounting frame including a mounting base, and a liquid guiding plate detachably mounted on the mounting base, the liquid guiding plate having at least one drain port; a polishing disc assembly and a carrier disc assembly, respectively disposed at different positions on the liquid guiding plate; and a polishing assembly movably disposed above the liquid guiding plate to move between the polishing disc assembly and the carrier disc assembly. Thus, by configuring the mounting frame as a separate, detachable structure for the mounting base and the liquid guiding plate, when the liquid guiding plate is corroded by the polishing fluid, only the liquid guiding plate needs to be replaced individually without replacing the entire mounting base, reducing maintenance costs and cycle time. Simultaneously, the functional components on the liquid guiding plate are installed in separate zones and arranged in an orderly manner, facilitating coordinated operation. Furthermore, the drain port on the liquid guiding plate can collect and drain the polishing fluid dripping during the polishing process, preventing liquid accumulation inside the apparatus and maintaining its dryness and cleanliness. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is an overall schematic diagram of the chemical mechanical polishing apparatus provided in the embodiments of this application; Figure 2 This is a schematic diagram of the mounting rack provided in an embodiment of this application; Figure 3 This is a top view of the liquid guiding plate provided in the embodiment of this application; Figure 4 This is one of the side view schematic diagrams of the liquid guiding plate provided in the embodiments of this application; Figure 5 This is a second side view of the liquid guiding plate provided in the embodiments of this application; Figure 6 This is a schematic diagram of the polishing assembly provided in an embodiment of this application; Figure 7 This is a schematic diagram of the connecting ring provided in an embodiment of this application; Figure 8 This is an enlarged cross-sectional view of the connecting ring provided in an embodiment of this application; Figure 9This is a schematic diagram of the sealing of the polishing disc assembly provided in the embodiments of this application; Figure 10 This is a schematic diagram of the sealing of the carrier disk assembly provided in the embodiments of this application; Figure 11 This is a schematic diagram of the sealing of the slurry arm assembly provided in the embodiments of this application; Figure 12 This is a schematic diagram of the sealing of the trimmer assembly provided in the embodiments of this application; Figure 13 This is a schematic diagram of the sealing of the trimmer cleaning assembly provided in the embodiments of this application.

[0018] Figure label: 1. Polishing assembly; 10. Spindle assembly; 11. Polishing head assembly; 100. Drive component; 101. Connecting ring; 102. First fixed seat; 103. Second fixed seat; 104. Connecting rod; 105. Liquid separator plate; 106. Support plate; 107. Connector; 1000. Drive shaft; 1010. Air groove; 1011. Air inlet; 1012. Main channel; 1013. Branch channel; 2. Mounting frame; 20. Mounting base; 21. Liquid guide plate; 210. Drain outlet; 211. Flow guide slope; 3. Polishing disc assembly; 30. Mounting disc; 31. First seal; 32. Second seal; 4. Carrier plate assembly; 40. Mounting ring; 41. Third seal; 42. Fourth seal; 5. Slurry arm assembly; 50. Mounting base; 51. Fifth seal; 6. Dresser assembly; 60. Fixed disc; 61. Sixth seal; 7. Dresser cleaning assembly; 70. Support plate; 71. Seventh seal; 8. Install the cabinet; 9. Guide rail; A. Polishing disc assembly bearing area; B. Bearing disc assembly bearing area; C. Slurry arm assembly bearing area; D. Dresser assembly bearing area; E. Dresser cleaning assembly bearing area. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] As described in the background section, the base of existing chemical mechanical polishing (CMP) devices is typically machined from a single piece of plate, with a corrosion-resistant material sprayed onto its surface to achieve waterproofing and corrosion resistance. This one-piece structure requires integral machining, and the base itself is large in both mass and area, making handling and machining during processing difficult due to volume limitations. Simultaneously, the large processing area necessitates a correspondingly large area requiring corrosion-resistant material spraying, resulting in higher processing costs and difficulty, increased time costs, and a longer processing cycle for the entire device. Once the coating is damaged or corroded, the entire device needs to be repaired or replaced, leading to high maintenance costs and long maintenance cycles. Therefore, this application provides a CMP device aimed at solving the technical problems of high processing and maintenance costs associated with existing one-piece bases.

[0021] The embodiments of this application will be analyzed in detail below with reference to the accompanying drawings.

[0022] Example 1 It should be noted that the chemical mechanical polishing apparatus provided in this embodiment includes a polishing assembly 1, a polishing pad assembly 3, a support pad assembly 4, a slurry arm assembly 5, a dresser assembly 6, and a dresser cleaning assembly 7, all mounted on a mounting frame 2. The polishing assembly 1 drives the wafer to rotate and presses it against the surface of the polishing pad assembly 3 to perform chemical mechanical polishing. The polishing pad assembly 3 supports the polishing pad and provides a rotating grinding surface. The support pad assembly 4 supports the wafer and enables wafer loading and unloading. The slurry arm assembly 5 supplies polishing fluid to the surface of the polishing pad assembly 3. The dresser assembly 6 dresses the polishing pad on the surface of the polishing pad assembly 3 to restore its surface condition. The dresser cleaning assembly 7 cleans the dresser assembly 6.

[0023] refer to Figures 1 to 5 The device includes a mounting frame 2, which includes a mounting base 20 and a liquid guide plate 21 detachably mounted on the mounting base 20. The liquid guide plate 21 is provided with at least one drain port 210 and is divided into multiple carrying areas for carrying different functional components.

[0024] The mounting frame 2 is a split design. The mounting base 20 provides structural support for the entire device. The liquid guide plate 21 is detachably laid on the mounting base 20 to support different functional components, receive the polishing liquid and other liquids dripped from each component during the polishing process, and discharge the liquids through the drain port 210.

[0025] With this configuration, the split mounting frame 2 has the following advantages: the structural support function and the corrosion protection function are respectively undertaken by the mounting base 20 and the liquid guiding plate 21, which reduces the processing accuracy requirements and manufacturing costs of each component; when corrosion or damage occurs on the surface of the liquid guiding plate 21, only the liquid guiding plate 21 needs to be replaced, without the need for overall rework of the mounting base 20, resulting in low maintenance costs and short cycles; the split assembly method also reduces the overall installation difficulty and improves assembly efficiency.

[0026] As an example, the liquid guiding plate 21 can be made of corrosion-resistant plastic, such as polypropylene, polyvinyl chloride, or polytetrafluoroethylene, utilizing the inherent chemical corrosion resistance of the plastic material to achieve waterproof and corrosion-resistant functions without the need for additional corrosion-resistant coating. The mounting base 20 can be made of metal castings, such as cast iron or cast steel, to provide sufficient structural strength and load-bearing capacity to meet the installation accuracy requirements of each functional component.

[0027] As an example, see reference Figure 1 and Figure 2 The periphery of the liquid guiding plate 21 extends in a direction perpendicular to the surface of the liquid guiding plate 21 to form a circumferential sidewall, so that the liquid guiding plate 21 as a whole has a liquid collecting disc structure. With this configuration, when liquid drips onto the upper surface of the liquid guiding plate 21, the circumferential sidewall can prevent the liquid from overflowing from the edge of the liquid guiding plate 21, ensuring that all the liquid is guided by the guide slope 211 to the drain port 210 for centralized discharge, further improving the liquid collecting and draining effect of the liquid guiding plate 21.

[0028] As a preferred embodiment, refer to Figures 1 to 3 The upper surface of the liquid guiding plate 21 is composed of multiple inclined guide surfaces 211 that are tilted towards the drain port 210, and the drain port 210 is located at the lowest intersection of the inclined guide surfaces 211.

[0029] When polishing fluid or other liquids drip onto the upper surface of the guide plate 21 during the polishing process, the liquids automatically flow along the inclined direction of each guide slope 211 to the drain port 210 located at the lowest confluence under the action of gravity, and are discharged through the drain port 210, thus avoiding the accumulation of liquids on the guide plate 21.

[0030] As a preferred embodiment, refer to Figure 3 The liquid guiding plate 21 has a first center line extending in the width direction and a second center line extending in the length direction. The first center line is perpendicular to the second center line. The number of drain ports 210 is at least two. The two drain ports 210 are symmetrically arranged along the first center line and are respectively close to the opposite sides of the liquid guiding plate in the direction of extension of the second center line.

[0031] Specifically, the liquid guiding plate 21 is rectangular in shape, with a first center line guiding the center line in the width direction and a second center line guiding the center line in the length direction. There are two drain ports 210, symmetrically arranged about the center line in the width direction of the liquid guiding plate 21 and located near both ends in the length direction. This arrangement allows the liquid collected by the guide slopes 211 on the liquid guiding plate 21 to be evenly distributed along the length direction to the drain ports 210 at both ends for discharge, reducing the instantaneous accumulation of liquid at a single drain port and improving drainage efficiency. The symmetrical layout also facilitates manufacturing.

[0032] As an example, see reference Figure 4 and Figure 5 The two drain ports 210 are located at opposite corners of the liquid guiding plate 21. Specifically, Figure 4 A drain port 210 located at the lower left corner of the liquid guiding plate 21 is shown. The guide slope 211 on the left side of the drain port 210 has a first preset angle, and the guide slope 211 on the right side has a second preset angle. Figure 5 The drain port 210 located at the lower right corner of the liquid guiding plate 21 is shown. The guide slopes 211 on both sides of the drain port 210 have a second preset angle. This configuration allows for differentiated design of the tilt angle of each guide slope 211 according to the liquid flow distribution in different areas of the liquid guiding plate 21, enabling the liquid to flow more evenly into the two drain ports 210 and further optimizing the drainage efficiency.

[0033] As a preferred embodiment, refer to Figures 1 to 3 The device also includes a polishing disc assembly 3, a bearing disc assembly 4, a slurry arm assembly 5, a dresser assembly 6, and a dresser cleaning assembly 7, which are respectively disposed in the corresponding bearing areas.

[0034] Specifically, refer to Figure 3 The liquid guiding plate 21 is divided into multiple bearing areas, each used to install different functional components. Specifically, the polishing disc assembly 3, the bearing disc assembly 4, the slurry arm assembly 5, the dressing assembly 6, and the dressing cleaner assembly 7 are located at different positions on the liquid guiding plate 21. The slurry arm assembly 5, the dressing assembly 6, and the dressing cleaner assembly 7 are located on the side of the liquid guiding plate 21 furthest from the bearing disc assembly, and are situated around the polishing disc assembly 3. Specifically, the polishing disc assembly 3 is located in bearing area A, the bearing disc assembly 4 in bearing area B, the slurry arm assembly 5 in bearing area C, the dressing assembly 6 in bearing area D, and the dressing cleaner assembly 7 in bearing area E. Each functional component is fixed within its corresponding bearing area, resulting in an orderly overall layout that facilitates coordinated operation and routine maintenance of the components.

[0035] Example 2 In a preferred embodiment, the device further includes a sealing assembly, which includes a first sealing structure and a second sealing structure. The first sealing structure is disposed between at least one of the polishing disc assembly 3, the carrier disc assembly 4, the slurry arm assembly 5, the dresser assembly 6, and the dresser cleaning assembly 7 and the liquid guiding plate 21. The second sealing structure is disposed between at least one of the polishing disc assembly 3, the carrier disc assembly 4, the slurry arm assembly 5, the dresser assembly 6, and the dresser cleaning assembly 7 and the mounting base 20.

[0036] To ensure the airtightness of the installation, this embodiment also provides a sealing component, which forms a reliable seal between each functional component and the liquid guiding plate 21, and between each functional component and the mounting base 20, to prevent liquids such as grinding fluid from seeping into the component installation gaps, thereby protecting each component and the mounting base 20 from liquid corrosion. At the same time, in conjunction with the drainage function of the liquid guiding plate 21, it ensures that all dripping liquid is discharged through the drain port 210, maintaining the cleanliness and dryness of the inside of the device.

[0037] The arrangement of the sealing components will be further explained below in conjunction with the specific installation structure of each functional component.

[0038] As an example of sealing for the polishing disc assembly, refer to Figure 9 The polishing disc bearing area A on the liquid guiding plate 21 for mounting the polishing disc assembly 3 is a first through groove. The polishing disc assembly 3 includes a mounting disc 30, which is at least partially housed within the first through groove. The first sealing structure includes a first sealing element 31 and a second sealing element 32. The first sealing element 31 is pressed between the bottom of the mounting disc 30 and the radially extending portion of the inner wall of the first through groove, forming an axial seal; the second sealing element 32 is pressed between the outer wall of the mounting disc 30 and the inner wall of the first through groove, forming a radial seal. Thus, double sealing protection is achieved between the polishing disc assembly 3 and the liquid guiding plate 21.

[0039] As an example of sealing for the carrier disk assembly, refer to Figure 10 The bearing area B on the liquid guiding plate 21 for mounting the bearing plate assembly 4 is a second through groove. The bearing plate assembly 4 includes a mounting ring 40, which is at least partially housed within the second through groove. The first sealing structure includes a third sealing element 41, which is pressed between the inner wall of the mounting ring 40 and the outer wall of the liquid guiding plate 21 at the second through groove, forming a radial seal. The second sealing structure includes a fourth sealing element 42, which is pressed between the top of the mounting ring 40 and a portion of the bottom wall of the mounting base 20, forming an axial seal. Thus, the bearing plate assembly 4 achieves double sealing protection with both the liquid guiding plate 21 and the mounting base 20.

[0040] As an example of sealing for the slurry arm assembly, refer to Figure 11 The slurry arm bearing area C on the liquid guiding plate 21 for mounting the slurry arm assembly 5 is a first groove. The slurry arm assembly 5 includes a mounting base 50, which abuts against the top of the first groove. The first sealing structure includes a fifth seal 51, which is pressed between the bottom of the mounting base 50 and the top of the first groove to form an axial seal.

[0041] As an example of sealing for the dresser assembly, refer to Figure 12 The dressing plate 21 has a second groove as the dressing bearing area D for mounting the dressing assembly 6. The dressing assembly 6 includes a mounting plate 60 that abuts against the top of the second groove. The first sealing structure includes a sixth seal 61, which is pressed between the bottom of the mounting plate 60 and the top of the second groove to form an axial seal.

[0042] As an example of sealing the trimmer cleaning component, refer to Figure 13 The dressing plate 21 has a third groove as the dressing cleaning support area E for mounting the dressing cleaning assembly 7. The dressing cleaning assembly 7 includes a support plate 70 that abuts against the top of the third groove. The first sealing structure includes a seventh seal 71, which is pressed between the bottom of the support plate 70 and the top of the third groove to form an axial seal.

[0043] Example 3 The chemical mechanical polishing apparatus provided in this embodiment also improves the spindle sealing structure of the polishing assembly.

[0044] In chemical mechanical polishing (CMP) equipment, the polishing components need to move frequently along the guide rails during operation to achieve relative motion between the wafer and the polishing pad. The polishing environment contains a large amount of water vapor and chemical polishing fluid mist. Under prolonged polishing conditions, this water vapor and mist will gradually seep into the spindle through the assembly gap between the drive shaft and the fixed base, leading to bearing corrosion, motor damage, and other malfunctions, severely impacting the equipment's lifespan.

[0045] Currently, the spindles of existing chemical mechanical polishing (CMP) devices typically employ a mechanical loop-type waterproof seal structure to block external water vapor. However, this mechanical loop-type seal structure has two main drawbacks: firstly, its structure is relatively complex, with a large number of parts and high machining precision requirements, resulting in high manufacturing costs; secondly, the loop seal is a contact or narrow-gap mechanical seal, which is prone to wear under high-speed spindle rotation, leading to a decrease in sealing effectiveness after long-term use and a continued risk of leakage.

[0046] To overcome the shortcomings of the aforementioned mechanical spiral seal structure, as a preferred embodiment, refer to... Figure 1 and Figures 6 to 8The polishing assembly 1 is movably disposed above the liquid guiding plate 21 to move between the polishing disc assembly 3 and the carrier disc assembly 4. The polishing assembly 1 includes a spindle assembly 10 and a polishing head assembly 11. The spindle assembly 10 includes a drive member 100 and a connecting ring 101. The drive member 100 has a drive shaft 1000, which passes through the connecting ring 101 and is connected to the polishing head assembly 11. An air groove 1010 is provided on the inner sidewall of the connecting ring 101. The air groove 1010 faces the outer peripheral surface of the drive shaft 1000 and extends along the axial and circumferential directions of the connecting ring 101.

[0047] The spindle assembly 10 drives the polishing head assembly 11 to rotate. The polishing head assembly 11 is used to adsorb and rotate the wafer, pressing the wafer against the surface of the polishing disc assembly 3 for polishing. The air groove 1010 preferably extends spirally along the axial and circumferential directions of the connecting ring 101. Spiral extension means that the air groove 1010 extends along a spiral path on the inner wall of the connecting ring 101, both circumferentially around the connecting ring 101 and advancing along its axial direction. With this configuration, when an external air source introduces gas into the air groove 1010 through the air supply channel, the gas flows along the spirally extending air groove 1010, forming an airflow that rotates circumferentially and advances axially between the inner wall of the connecting ring 101 and the outer circumferential surface of the drive shaft 1000. This airflow forms a continuous cyclone sealing barrier around the outer circumferential surface of the drive shaft 1000, preventing external moisture from seeping into the spindle assembly 10 in a non-contact manner through the assembly gaps around the drive shaft 1000. Compared to mechanical spiral sealing structures, the gas-tight structure in this embodiment has no contact wear, provides a stable and reliable sealing effect over long-term use, and has a simple structure and low cost.

[0048] As a preferred embodiment, refer to Figures 6 to 8 The end face of the connecting ring 101 is provided with an air inlet 1011 and an air supply channel. The air supply channel includes a main channel 1012 and multiple branch channels 1013. The air inlet 1011 is connected to the main channel 1012, and the main channel 1012 is connected to the air trough 1010 through multiple branch channels 1013.

[0049] Specifically, refer to Figure 7 The main channel 1012 is an annular groove formed on the end face of the connecting ring 101 and extends circumferentially along the connecting ring 101. Multiple branch channels 1013 are elongated grooves formed on the end face of the connecting ring 101. One end of each branch channel 1013 connects to the main channel 1012, and the other end connects to the portion of the gas groove 1010 extending to the end face of the connecting ring 101. The multiple branch channels 1013 are arranged at intervals along the circumference of the connecting ring 101, for example, four, and are symmetrically distributed along the center of the connecting ring 101 to ensure that gas is evenly distributed into each section of the gas groove 1010.

[0050] As an example, a connector 107 may be provided at the air inlet 1011. The connector 107 is used to connect an external air source to introduce gas into the air supply channel. The external air source can provide inert gases such as nitrogen to avoid chemical interference with the polishing working environment while forming a cyclone seal.

[0051] With this configuration, after the gas enters the main channel 1012 from the air inlet 1011, it flows circumferentially along the annular main channel 1012 and is evenly distributed to each branch channel 1013. Then, it flows into multiple locations in the air groove 1010 through each branch channel 1013, making the air pressure uniform throughout the air groove 1010. This results in a more stable and continuous cyclone sealing barrier on the outer circumferential surface of the drive shaft 1000.

[0052] As a preferred embodiment, refer to Figure 6 and Figure 8 The spindle assembly 10 also includes a first fixed seat 102, a second fixed seat 103 and a plurality of connecting rods 104. The first fixed seat 102 surrounds the drive shaft 1000 and is connected to the side of the connecting ring 101 away from the drive member 100. The second fixed seat 103 is connected to the end of the drive member 100 away from the connecting ring 101. The plurality of connecting rods 104 are connected between the first fixed seat 102 and the second fixed seat 103 and are arranged along the circumference of the drive member 100.

[0053] Specifically, the first fixing seat 102 and the second fixing seat 103 serve as fixed supports. The second fixing seat 103 is located at the fixed end of the driving member 100 (i.e., the upper end of the driving member 100 in the figure), and the first fixing seat 102 is located at the driving end of the driving member 100 (i.e., the lower end of the driving member 100 in the figure). This results in the driving member 100 being installed in an inverted state, with the driving end facing downwards and the driving shaft 1000 extending downwards as well. The purpose of the inverted driving member 100 is that the polishing disc assembly 3 is located below the driving member 100. To ensure that the polishing head assembly 11 can extend downwards and contact the polishing disc assembly 3 to perform the polishing operation, the driving member 100 is inverted, with the driving end facing downwards and the driving shaft 1000 extending downwards and connecting to the polishing head assembly 11.

[0054] Connecting rods 104 connect the first fixed base 102 and the second fixed base 103, serving to integrate the first fixed base 102 and the second fixed base 103 into a rigid frame, providing reliable structural support for the drive component 100. Multiple connecting rods 104 are used, preferably four, and they are evenly distributed along the circumference of the drive component 100, ensuring balanced force distribution on each connecting rod 104 and further enhancing the overall structural rigidity of the spindle assembly 10.

[0055] Furthermore, in some embodiments, the inner wall surface of the first fixing base 102 is also provided with an air groove, which extends spirally along the axial and circumferential directions of the first fixing base 102. The bottom end face of the connecting ring 101 and the top end face of the first fixing base 102 are mated together, so that the air groove 1010 at the bottom of the connecting ring 101 and the air groove at the top of the first fixing base 102 are connected at the mating surface. With this arrangement, the cyclone sealing barrier can be extended downward along the axial direction, expanding the coverage of the air seal and further enhancing the barrier effect against water vapor. It should be noted that the width or depth of the air groove on the inner wall surface of the first fixing base 102 can be smaller than the width or depth of the air groove 1010 on the inner wall surface of the connecting ring 101. The purpose of this arrangement is that when gas flows from the gas groove 1010 of the connecting ring 101 into the gas groove of the first fixed seat 102, the flow cross section gradually narrows and the airflow velocity increases, which is beneficial to maintain sufficient air pressure in the lower section of the drive shaft 1000, thereby ensuring the overall axial stability of the cyclone sealing barrier.

[0056] As a preferred embodiment, refer to Figure 6 and Figure 8 The spindle assembly 10 also includes a liquid-separating plate 105, which has a first through hole through which the drive shaft 1000 passes. The liquid-separating plate 105 is connected to the end of the first fixed seat 102 away from the connecting ring 101.

[0057] During the polishing process, the polishing disc assembly 3 rotates at high speed, and the polishing liquid on its disc surface is prone to splashing upwards. The liquid-blocking plate 105 is placed on the lower end of the first fixed seat 102 to block the liquid splashed from the disc surface of the polishing disc assembly 3 and prevent the liquid from entering the spindle assembly 10 from the inside, thereby playing a physical role in blocking the liquid and forming a double protection with the aforementioned air-tight structure.

[0058] In a preferred embodiment, the spindle assembly 10 further includes a support plate 106, which has a second through hole through which the drive shaft 1000 passes. The support plate 106 is connected to the side of the liquid-separating plate 105 facing away from the first fixed seat 102. The support plate 106 is adjacent to the polishing head assembly 11 and has an axial gap with the polishing head assembly 11.

[0059] Specifically, the support plate 106 is a small micro-plate that connects only to a portion of the liquid-blocking plate 105, rather than covering the entire lower surface of the liquid-blocking plate 105. An axial gap is maintained between the support plate 106 and the polishing head assembly 11. This gap is designed to maintain axial distance between the support plate 106 and the polishing head assembly 11, preventing interference with the rotational movement of the drive shaft 1000 and the polishing head assembly 11. Simultaneously, although there is an axial gap between the support plate 106 and the polishing head assembly 11, the small gap still physically blocks liquid splashing upwards from the polishing disc assembly 3, preventing further upward penetration through this tiny gap. Thus, the support plate 106 further enhances the waterproof protection of the lower end of the spindle assembly 10 without hindering the normal rotation of the drive shaft 1000.

[0060] As an example, see reference Figure 1 The device also includes a mounting cabinet 8 and a guide rail 9 mounted on the mounting cabinet 8. The guide rail 9 is arranged laterally and connected to the spindle assembly 10, used to drive the spindle assembly 10 to move along the guide rail 9 between different bearing areas on the liquid guide plate 21 to perform wafer pick-and-place, polishing, and cleaning processes. With this configuration, the spindle assembly 10 can sequentially move to the bearing plate assembly 4 to pick up and place the wafer, to the polishing plate assembly 3 to perform polishing operations, to the dresser assembly 6 to trim the polishing pad, and to the dresser cleaning assembly 7 to clean the dresser within one polishing cycle, realizing multi-station continuous operation and improving the working efficiency of the device.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A chemical mechanical polishing apparatus characterized by comprising: The device includes: The mounting frame (2) includes a mounting base (20) and a liquid guide plate (21) detachably disposed on the mounting base (20), the liquid guide plate (21) having at least one drain port (210). The polishing disc assembly (3) and the carrier disc assembly (4) are respectively located at different positions on the liquid guiding plate (21); The polishing assembly (1) is movably disposed above the liquid guiding plate (21) to move between the polishing disc assembly (3) and the carrier disc assembly (4).

2. The chemical mechanical polishing apparatus of claim 1, wherein The device further includes a sealing assembly, a slurry arm assembly (5), a trimmer assembly (6), and a trimmer cleaning assembly (7). The sealing assembly includes a first sealing structure disposed between at least one of the polishing disc assembly (3), the carrier disc assembly (4), the slurry arm assembly (5), the trimmer assembly (6), and the trimmer cleaning assembly (7) and the liquid guiding plate (21).

3. The chemical mechanical polishing apparatus of claim 2, wherein The sealing assembly further includes a second sealing structure disposed between at least one of the polishing disc assembly (3), the carrier disc assembly (4), the slurry arm assembly (5), the dresser assembly (6), and the dresser cleaning assembly (7) and the mounting base (20).

4. The chemical mechanical polishing apparatus of claim 1, wherein The polishing assembly (1) includes a spindle assembly (10) and a polishing head assembly (11). The spindle assembly (10) includes a drive member (100) and a connecting ring (101). The drive member (100) has a drive shaft (1000) which passes through the connecting ring (101) and is connected to the polishing head assembly (11). The inner wall of the connecting ring (101) is provided with an air groove (1010), which faces the outer peripheral surface of the drive shaft (1000) and extends along the axial and circumferential directions of the connecting ring (101).

5. The chemical mechanical polishing apparatus of claim 4, wherein The end face of the connecting ring (101) is provided with an air inlet (1011) and an air supply channel. The air supply channel includes a main channel (1012) and multiple branch channels (1013). The air inlet (1011) is connected to the main channel (1012). The main channel (1012) is connected to the air trough (1010) through the multiple branch channels (1013).

6. The chemical mechanical polishing apparatus according to claim 5, characterized in that, The spindle assembly (10) further includes a first fixed seat (102), a second fixed seat (103), and a plurality of connecting rods (104). The first fixed seat (102) surrounds the drive shaft (1000) and is connected to the side of the connecting ring (101) away from the drive member (100). The second fixed seat (103) is connected to the end of the drive member (100) away from the connecting ring (101). The plurality of connecting rods (104) are connected between the first fixed seat (102) and the second fixed seat (103) and are arranged circumferentially along the drive member (100).

7. The chemical mechanical polishing apparatus according to claim 6, characterized in that, The spindle assembly (10) further includes a liquid-separating plate (105) having a first through hole for guiding the drive shaft (1000) through, and the liquid-separating plate (105) being connected to the end of the first fixing seat (102) away from the connecting ring (101).

8. The chemical mechanical polishing apparatus according to claim 7, characterized in that, The spindle assembly (10) further includes a support plate (106) having a second through hole for guiding the drive shaft (1000) through. The support plate (106) is connected to the side of the liquid-separating plate (105) facing away from the first fixed seat (102). The support plate (106) is adjacent to the polishing head assembly (11) and has an axial gap with the polishing head assembly (11).

9. The chemical mechanical polishing apparatus according to claim 1, characterized in that, The upper surface of the liquid guiding plate (21) is composed of multiple guide slopes (211) that are inclined toward the drain port (210), and the drain port (210) is located at the lowest intersection of the guide slopes (211).

10. The chemical mechanical polishing apparatus according to claim 9, characterized in that, The liquid guiding plate (21) has a first center line extending in the width direction, and the number of the drain ports (210) is at least two, with the two drain ports (210) arranged symmetrically along the first center line.

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