A glue filling device and glue filling process
By combining a positioning mechanism, a linear motion mechanism, a glue injection mechanism, and a heating mechanism, the problem of glue overflow caused by slow glue flow rate in low-pressure injection molding overmolding technology is solved, achieving a high-quality glue filling effect.
Patent Information
- Application Number
- CN202611153491.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-31
- Publication Date
- 2026-11-06
AI Technical Summary
In low-pressure injection molding overmolding technology, slow glue flow rate leads to tension squeezing of the injection mold, resulting in glue overflow and other defects.
The system employs a combination of positioning, linear motion, dispensing, and heating mechanisms. By using vacuum extraction and heating, it improves the fluidity of the adhesive, reduces tension and extrusion, and ensures the quality of dispensing.
It improves the fluidity of the adhesive, reduces the risk of adhesive overflow, and ensures the quality and precision of the dispensing process.
Smart Images

Figure CN123040280A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of mobile phone screen manufacturing technology, and in particular to a potting device and potting process. Background Technology
[0002] Low-pressure injection molding encapsulation technology is a molding process that uses very low injection pressure (usually 0.15-4MPa or 1.5-60bar) to inject hot melt material into a mold and quickly solidify it to encapsulate or encapsulate the product. Based on the characteristics of hot melt material, it can play a role in moisture protection, dust protection, and insulation of the product. Therefore, it is widely used in potting equipment in the fields of electronic component encapsulation and automotive skin encapsulation.
[0003] In the encapsulation process of the above-mentioned technology for encapsulating the display screen, the display screen with a pre-formed sealant around its edges is placed on an injection mold. The display screen and the injection mold are placed opposite each other with a gap between them. The sealant around the edges of the display screen is connected to the injection mold, thus forming a hollow space within the display screen, the injection mold, and the sealant. Glue is injected into this space through the injection mold at low injection pressure to encapsulate the display screen. During the encapsulation process, the glue flows within the space under pressure. Due to the viscosity of the glue, there is tension on both sides as it is conveyed forward. If the flow rate is slow, this tension will squeeze the injection mold and the display screen on both sides. At the same time, since the injection mold is made of glue material, its soft structure will cause glue to overflow from one end of the injection mold due to tension. Therefore, after the encapsulation of the display screen is completed, there is a high probability of glue overflow defects.
[0004] Therefore, there is an urgent need for a glue-dispensing device and glue-dispensing process to solve the above problems. Summary of the Invention
[0005] The purpose of this invention is to provide a glue-filling device and glue-filling process to solve the technical problem that slow glue flow rate causes large tension to squeeze the injection mold and cause glue overflow, resulting in a high probability of glue overflow defects in the display screen.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] On the one hand, a dispensing device is provided, including:
[0008] A positioning mechanism, comprising a positioning plate and a positioning component disposed on the upper end of the positioning plate, the positioning component being used to position the product to be glued on the positioning plate;
[0009] A linear motion mechanism whose output end can move in the vertical direction;
[0010] The glue injection mechanism includes a cover, which is connected to the output end of the linear motion mechanism and located above the positioning mechanism. The cover can seal against the upper end face of the positioning plate to form a sealed cavity together with the positioning plate. The cover is provided with an air extraction hole and a glue injection hole, both of which are connected to the sealed cavity.
[0011] A heating mechanism is disposed inside the housing, and the heating mechanism is used to heat the sealed cavity.
[0012] Optionally, the heating mechanism is an infrared lamp.
[0013] Optionally, the housing is provided with a plurality of first lamp holders, which are respectively disposed on a plurality of inner sidewalls of the housing. Each first lamp holder extends along the length direction of the corresponding inner sidewall, and each first lamp holder is provided with an infrared lamp.
[0014] Optionally, the housing is provided with a plurality of second lamp holders, which are respectively arranged at a plurality of corners of the housing, and each second lamp holder is provided with an infrared lamp.
[0015] Optionally, the power of the infrared lamp disposed on the second lamp holder is less than the power of the infrared lamp disposed on the first lamp holder.
[0016] Optionally, the dispensing device further includes a lifting mechanism, the positioning plate being connected to the output end of the lifting mechanism, and the lifting mechanism being used to drive the positioning plate to rise and fall.
[0017] Optionally, the lifting mechanism includes a telescopic component, the telescopic end of which is connected to the positioning plate.
[0018] Optionally, a sealing ring is provided on the upper end face of the positioning plate or the lower end face of the cover. When the cover and the positioning plate are in sealing contact, the sealing ring is clamped between the cover and the positioning plate.
[0019] Optionally, the upper end face of the positioning plate is provided with a positioning groove, and part of the sealing ring is fixed in the positioning groove.
[0020] Optionally, a positioning groove is provided on the upper end face of the positioning plate or the lower end face of the cover, and part of the sealing ring is fixed in the positioning groove.
[0021] On the other hand, a dispensing process is also provided, applied to the dispensing device, the dispensing process comprising the following steps:
[0022] S1. Position the product to be glued;
[0023] S2. Control the linear motion mechanism to drive the cover to move downward until the cover abuts against the positioning plate, and the cover and the positioning plate enclose to form a sealed cavity;
[0024] S3. The air inside the sealed cavity is drawn out through the air extraction hole to create a vacuum inside the sealed cavity;
[0025] S4. Open the heating mechanism to heat the inside of the sealed cavity, and at the same time, fill the product to be filled with glue through the glue filling hole to form a glued product.
[0026] S5. Control the linear motion mechanism to drive the cover upward and remove the fixture from the positioning plate;
[0027] S6. Curing the glued product by irradiation;
[0028] S7. Remove the glued product from the fixture.
[0029] The beneficial effects of this invention are as follows:
[0030] The dispensing device of the present invention includes a positioning mechanism, a linear motion mechanism, a dispensing mechanism, and a heating mechanism. The positioning mechanism includes a positioning plate and a positioning component that positions the product to be dispensed on the positioning plate to achieve positioning of the product, thereby ensuring accurate dispensing position and thus ensuring dispensing quality. The output end of the linear motion mechanism moves vertically, and the dispensing mechanism includes a cover connected to the output end of the linear motion mechanism, causing the linear motion mechanism to move the cover vertically. When the cover moves to abut against the upper surface of the positioning plate, the two form a sealed cavity. The cover has an air extraction hole communicating with the sealed cavity to extract air from inside the sealed cavity, creating a vacuum state inside the sealed cavity, thereby ensuring... The adhesive enters the cavity through the filling hole on the casing without generating air bubbles during the filling process, further ensuring the quality of the adhesive filling. Simultaneously, a heating mechanism is installed inside the casing to heat the sealed cavity, as well as the adhesive entering the sealed cavity through the filling hole and the product to be filled positioned on the positioning plate. The increased temperature enhances the activity of the molecules, thus increasing the fluidity of the adhesive and effectively improving the flow rate when filling the product. Compared to a slower flow rate, this reduces the tension on the adhesive at the corresponding location, meaning less pressure is exerted on the upper and lower sides of the product at that location, thereby reducing the risk of adhesive overflow and lowering the probability of adhesive overflow defects after filling.
[0031] The glue-filling process of the present invention is applied to a glue-filling device. The product to be glued is positioned by a fixture and placed in a vacuum sealed cavity. The sealed cavity is heated by a heating mechanism while the product to be glued is filled with glue to form a glued product. The above settings can ensure the activity and fluidity of the glue during the glue-filling process, thereby ensuring the glue-filling quality when filling the product to be glued. Attached Figure Description
[0032] Figure 1 This is a schematic diagram of the dispensing device provided by the present invention;
[0033] Figure 2 This is a schematic diagram of the positioning mechanism provided by the present invention;
[0034] Figure 3 This is a schematic diagram of the sealing ring provided by the present invention;
[0035] Figure 4 This is a structural schematic diagram of the casing provided by the present invention from one perspective;
[0036] Figure 5 This is a schematic diagram of the structure of the product to be glued and the fixture for holding the product to be glued, provided by the present invention;
[0037] Figure 6 This is a schematic diagram of the upper fixture provided by the present invention;
[0038] Figure 7 This is a schematic diagram of the dispensing machine provided by the present invention.
[0039] In the diagram: 1. Positioning plate; 2. Positioning assembly; 3. Cover; 4. Linear motion mechanism; 5. Glue filling hole; 6. First lamp holder; 7. Second lamp holder; 8. Lifting mechanism; 9. Telescopic rod; 10. Water cooling channel; 11. Sealing ring; 12. Product to be glued; 13. Upper fixture; 14. Lower fixture; 15. Glue inlet; 16. Glue outlet; 17. Bracket; 18. Body; 19. First contact surface; 20. Second contact surface. Detailed Implementation
[0040] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0041] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0044] This invention provides a dispensing device, such as... Figure 1 As shown, the glue-dispensing device includes a positioning mechanism, a linear motion mechanism 4, a glue-dispensing mechanism, and a heating mechanism. The positioning mechanism includes a positioning plate 1 and a positioning component 2 disposed on the upper end of the positioning plate 1. The positioning component 2 positions the product 12 to be glued onto the positioning plate 1. The output end of the linear motion mechanism 4 moves vertically. The glue-dispensing mechanism includes a cover 3, which is connected to the output end of the linear motion mechanism and is located above the positioning mechanism. The cover 3 can seal against the upper end face of the positioning plate 1 to form a sealed cavity together with the positioning plate 1. The cover 3 is also provided with an air extraction hole and a glue-dispensing hole 5, both of which are connected to the sealed cavity. The heating mechanism is disposed inside the cover 3 and is used to heat the sealed cavity.
[0045] Positioning component 2 positions the product 12 to be glued onto positioning plate 1 to ensure that the product 12 is placed in the correct position. Cover 3 is located above positioning plate 1 and moves vertically under the drive of linear motion mechanism 4. During this process, cover 3 can move away from positioning plate 1, providing sufficient space for the product 12 to be glued onto positioning plate 1. Cover 3 can also move closer to positioning plate 1 until it abuts against the upper surface of positioning plate 1, forming a sealed cavity in which the product 12 is contained. The air extraction hole on cover 3 is opened to extract air from the sealed cavity, creating a vacuum state within the cavity, i.e., the product 12 is glued under vacuum conditions. The glue is poured to ensure that no air bubbles are generated during the pouring process, thus ensuring the quality of the glue pouring for the product 12. The housing 3 is also equipped with a heating mechanism to heat the inside of the sealed cavity, and can also heat the product 12 placed in the sealed cavity. When the glue enters the housing 3 through the glue pouring hole 5, the heating mechanism can also heat it. Under the heating state, the activity of the molecules is enhanced, and the flow rate of the glue increases when it fills the product 12, that is, the tendency to flow forward is enhanced. Therefore, it effectively reduces the squeezing of the product 12 on the upper and lower sides along the conveying direction while the glue is flowing, reducing the probability of glue overflowing from the product 12, and thus reducing the probability of glue overflow defects.
[0046] like Figure 2 As shown, a positioning component 2 is provided on the positioning plate 1. The positioning component 2 includes a positioning block and / or a positioning post. The product 12 to be glued with positioning groove is placed on the positioning plate 1. Through the cooperation of the positioning groove and the positioning block and / or the positioning post, the positioning of the product 12 to be glued is completed, so as to position the product 12 to be glued in the sealed cavity, ensuring that the product 12 to be glued is in the correct glued position, thereby ensuring the glued quality. There can be multiple positioning blocks and / or positioning posts that make up the positioning component 2. By using multiple positioning blocks and / or positioning posts to position the product 12 to be glued, the positioning accuracy is further improved.
[0047] A sealing ring 11 is also provided on the upper end face of the positioning plate 1. The sealing ring 11 surrounds the sealing cavity. When the cover 3 moves to abut against the upper end face of the positioning plate 1, the sealing ring 11 is clamped between the cover 3 and the positioning plate 1, which can further ensure the sealing performance of the sealing cavity and ensure the stability of the vacuum state after the air is extracted from the sealing cavity, thereby effectively avoiding the generation of air bubbles during the glue pouring process. Alternatively, the sealing ring 11 can also be provided on the lower end face of the cover 3. Then, when the cover 3 abuts against the upper end face of the positioning plate 1, the sealing ring 11 is clamped between the cover 3 and the positioning plate 1, which can also ensure the sealing performance and the stability of the vacuum state.
[0048] In some embodiments, a positioning groove structure is formed on the upper end face of the positioning plate 1, so that part of the sealing ring 11 is fixed in the positioning groove. This setting can limit the installation of the sealing ring 11, effectively prevent the sealing ring 11 from moving, and further ensure the stability of the sealing contact between the cover 3 and the upper end face of the positioning plate 1, as well as the stability of the vacuum state in the sealing cavity. In addition, a positioning groove structure can also be formed on the lower end face of the cover 3, and the sealing ring 11 can be placed in the corresponding groove structure, which can also achieve the effect of ensuring the stability of the sealing contact between the cover 3 and the upper end face of the positioning plate 1, as well as the stability of the vacuum state in the sealing cavity.
[0049] The sealing ring 11 has a protruding structure at one end near the positioning plate 1. When the sealing ring 11 is installed on the positioning plate 1 or the cover 3, the protruding structure inserts into the corresponding positioning groove, which can limit the sealing ring 11 and prevent it from shifting. Figure 3 As shown, the sealing ring 11 includes a first abutting surface 19 and a second abutting surface 20. When the positioning plate 1 is installed in the positioning groove, the first abutting surface 19 abuts against the upper end face of the positioning plate 1 or the lower end face of the cover 3, and the second abutting surface 20 extends into the positioning groove and abuts against the inner side wall of the positioning plate 1, thereby ensuring the stability of the sealing ring 11 installed on the positioning plate 1 or the cover 3.
[0050] The dispensing device provided by this invention also includes a lifting mechanism 8. The output end of the lifting mechanism 8 is connected to the positioning plate 1, thereby driving the positioning plate 1 to rise and fall. When the cover 3 and the upper surface of the positioning plate 1 abut to form a sealed cavity, the lifting mechanism 8 drives the positioning plate 1 to rise upward, further ensuring the stability of the contact with the cover 3 and the sealing performance of the formed sealed cavity, while also ensuring the stability of the vacuum state within the sealed cavity. Specifically, the lifting mechanism 8 includes a telescopic member 9, the telescopic end of which is connected to the positioning plate 1, thereby driving the positioning plate 1 to perform a lifting movement. The telescopic member 9 can be a cylinder or an electric push rod. In other embodiments, the lifting mechanism 8 can also adopt a scissor fork structure or a lead screw slider structure.
[0051] In this invention, the heating mechanism is an infrared lamp. The infrared lamp heats the sealed cavity, thereby enhancing the activity of the adhesive entering the cavity and increasing its flow tendency on the product 12 to be filled. This effectively reduces the squeezing of both sides of the product 12 during filling, thus avoiding the phenomenon of high-power adhesive overflow on the product 12. Figure 1 and Figure 2As shown, multiple first lamp holders 6 are provided inside the housing 3. The multiple first lamp holders 6 are respectively arranged on multiple inner sidewalls of the housing 3, and each first lamp holder 6 extends along the length direction of the corresponding inner sidewall. Multiple infrared lamps are installed inside the housing 3 through the first lamp holders 6. After forming a sealed cavity, the infrared lamps on the multiple inner sidewalls and located on the first lamp holders 6 can heat the sealed cavity and multiple positions of the product 12 to be filled with glue, ensuring the uniformity and sufficiency of heating, and ensuring the stable flow of glue when filling the product 12.
[0052] Preferably, the housing 3 is further provided with a plurality of second lamp holders 7, which are arranged one-to-one at the corners of the housing 3. The plurality of second lamp holders 7 are also for placing infrared lamps. With this arrangement, the infrared lamps are placed at the top of the housing 3, which can further improve the fullness and uniformity of heating in the sealed cavity and the product 12 to be filled, thereby increasing the flow rate of the glue when filling the product 12 and ensuring stable flow during the filling process.
[0053] In some embodiments, the heating mechanism may also employ resistance wire, electromagnetic induction heating, or other methods, and is disposed within a sealed cavity, requiring only a heating element capable of heating the sealed cavity.
[0054] Multiple injection holes 5 are provided on the upper surface of the cover 3. These holes are positioned diagonally opposite each other, allowing for rapid injection of adhesive into the product 12 from opposite sides. A bracket 17 is also provided on the upper surface of the cover 3. This bracket 17 is connected to the output end of the linear motion mechanism 4. When the linear motion mechanism 4 moves vertically, the bracket 17 synchronously moves the cover 3, achieving a sealing contact or retraction from the positioning plate 1. In some embodiments, the bracket 17 may be omitted, and the output end of the linear motion mechanism 4 may be directly connected to the cover 3.
[0055] The housing 3 is also provided with a water cooling channel 10, which includes a water cooling pipe, a water cooling inlet and a water cooling outlet. The water cooling pipe is located inside the housing 3 and extends along the circumference of the housing 3. The water cooling inlet and the water cooling outlet are located on the side wall of the housing 3 and extend into the housing 3 to communicate with the water cooling pipe, thereby enabling heat dissipation and cooling of the first lamp holder 6 and the second lamp holder 7.
[0056] The positioning component 2 also includes a fixture for clamping the product 12 to be glued, and the fixture has positioning grooves corresponding to the positioning blocks and / or positioning posts to position the fixture on the positioning plate 1, thereby achieving the positioning of the product 12 to be glued within the sealed cavity. Figure 3 and Figure 4As shown, the fixture includes an upper fixture 13 and a lower fixture 14. The lower fixture 14 has a receiving groove for accommodating and positioning the product 12 to be glued. The product 12 to be glued is placed in the receiving groove, and the upper fixture 13 is placed on the lower fixture 14, with the lower end face of the upper fixture 13 abutting against the upper end face of the lower fixture 14. This allows the product 12 to be glued in the receiving groove to be clamped and pressed, ensuring that the position of the product 12 to be glued is fixed. This further ensures the accuracy of the glue inlet position when the glue enters the product to be glued, avoiding glue leakage due to misalignment of the glue inlet, which would cause poor glue filling of the product 12. In addition, the upper fixture 13 is provided with multiple glue inlets 15 and multiple glue outlets 16. The multiple glue inlets 15 and multiple glue outlets 16 all pass through the upper fixture 3 and are connected to the glue filling hole 5 on the cover 3 through pipes. The other end of the pipe passes through the glue inlet 15 and is connected to the inlet of the product 12 to be glued, which is clamped between the upper fixture 13 and the lower fixture 14, so as to realize the delivery of glue and the filling of the product 12 to be glued. The glue outlet 16 is connected to the outlet of the product 12 to be glued. In this way, when the product 12 to be glued is overfilled, the excess glue can flow out from here. The excess glue is collected through the pipe and transported to the glue storage tank set in the cover 3 for storage, so as to avoid the phenomenon that the excess glue is inside the product 12 to be glued, which would cause the excess glue to squeeze the sides and cause glue to overflow. Preferably, the upper fixture 13 has two glue inlets 15 and two glue outlets 16. The two glue inlets 15 are symmetrically arranged on both sides of one diagonal line of the upper fixture 13, and the two glue outlets 16 are symmetrically arranged on both sides of the other diagonal line of the upper fixture 13. Thus, during glue filling, the glue is injected into the product 12 to be glued simultaneously through the two glue inlets 15. Compared with the setting of a single glue inlet 15, the flow path of the glue during filling is reduced, which improves the efficiency of glue filling the product 12 to be glued, and at the same time ensures the uniformity of glue filling.
[0057] Furthermore, the first lamp holder 6 is disposed on multiple inner sidewalls of the housing 3, and the irradiation distance between the infrared lamp disposed on the first lamp holder 6 and the product 12 to be glued is L. Therefore, the heat emitted by the infrared lamp on the sidewall acts on the product 12 to be glued through the irradiation distance L, thereby heating its surroundings. The second lamp holder 7 is disposed at multiple corners of the top of the housing 3, and the irradiation distance between the infrared lamp disposed on the second lamp holder 7 and the product 12 to be glued is M. Therefore, the heat emitted by the infrared lamp at the corner acts on the product 12 to be glued through the irradiation distance M, thereby heating its surroundings. Multiple corners of the product are heated. In the above scheme, the irradiation distance L>M. At the same time, in order to ensure the sufficiency and uniformity of heating of the product 12 to be glued, the power of the infrared lamp located on the first lamp holder 6 is set to be higher than that of the infrared lamp located on the second lamp holder 7. This ensures that the heat transferred to the product 12 by the infrared lamps located on the multiple inner side walls of the housing 3 is basically equal to the heat transferred to the product 12 by the infrared lamps located on the multiple corners of the housing 3, so as to ensure the uniformity of the glue flow rate injected into the product 12 and the stability of the glue-gluing process.
[0058] This invention also provides a dispensing machine, including a body 18 and the above-mentioned dispensing device, wherein the dispensing device is disposed on the body 18.
[0059] The positioning mechanism, linear motion mechanism 4, glue injection mechanism and heating mechanism of the glue dispensing device are all set on the machine body 18. The fixed end of the linear motion mechanism 4 is set on the side wall of the machine body 18. When the output end of the linear motion mechanism 4 moves vertically relative to the side wall of the machine body 18, it drives the cover 3 connected to it to move vertically relative to the machine body 18, so as to achieve the sealing contact or separation between the cover 3 and the positioning plate 1 placed on the machine body 18.
[0060] One end of the machine body 18 is provided with an opening. The linear motion mechanism 4, heating mechanism, positioning mechanism, and dispensing mechanism of the glue-dispensing device are all located at the corresponding opening positions on the machine body 18. This arrangement allows operators to easily observe the positional relationship between the positioning plate 1 and the cover 3, thereby ensuring the effective connection between the two and the installation of the product 12 to be dispensed on the positioning plate 1. It also facilitates the inspection and maintenance of the heating mechanism located inside the cover 3. In addition, the machine body 18 also includes a door, which is located at the end of the machine body 18 with the opening, enabling the opening and closing of the internal space of the machine body 18. The lifting mechanism 8 for lifting the positioning plate 1 is located at the corresponding door position on the machine body 18. When operators perform maintenance or other tasks, they will need to use some tools. The space can also store the necessary tools, making it convenient for operators to retrieve and put them away during operation, avoiding time wasted due to searching, and effectively improving work efficiency.
[0061] The present invention also provides a dispensing process based on the above-mentioned dispensing device, the specific steps of which are as follows:
[0062] S1. Positioning the product 12 to be glued. Specifically, a suitable injection mold is prepared, and the display screen with sealing glue is placed on the injection mold to form the product 12 to be glued. Simultaneously, a suitable fixture is also prepared, including an upper fixture 13 and a lower fixture 14. The product 12 to be glued is placed on the lower fixture 14, and then the upper fixture 13 is placed on top of the product 12 and locked to the lower fixture 14 to clamp and fix the product 12 to be glued, and positioned by positioning blocks and / or positioning pins. In some embodiments, the product 12 to be glued is positioned directly by positioning blocks and / or positioning pins.
[0063] S2. Control the linear motion mechanism 4 to drive the cover 3 to move downward until the cover 3 is pressed against the positioning plate 1, and the cover 3 and the positioning plate 1 form a sealed cavity.
[0064] S3. The air inside the sealed cavity is evacuated through the evacuation port, creating a vacuum inside the sealed cavity. Specifically, a vacuum pump is installed outside the sealed cavity and connected to the evacuation port. The vacuum pump evacuates the inside of the sealed cavity. The vacuum pump is existing technology, and its specific structure and working principle will not be described in detail here.
[0065] S4. Open the heating mechanism to heat the inside of the sealed cavity, and at the same time, inject glue into the product to be injected 12 through the glue injection hole 5 to form a glued product. Specifically, infrared lamps located on multiple inner walls and corners of the housing 3 are all turned on to heat the interior of the sealed cavity. The distance between the infrared lamps located at the corners of the housing 3 and the corresponding corners of the product 12 to be glued is 15mm, and the power is 930W. The distance between the infrared lamps located on the inner walls and the corresponding sides of the product 12 to be glued is 30mm, and the power is 1085W. The wavelengths of the infrared lamps are all between 1.8μm and 2.8μm, resulting in an ambient temperature of 35-50℃ within the sealed cavity. This ensures uniform heating of the product to be glued, guaranteeing the glue-filling quality. Furthermore, the glue-filling hole 5 is opened simultaneously with the infrared lamps. Glue flows through the glue-filling hole 5 into the corresponding pipe and is then transported to the inlet of the product 12 to be glued. After entering the product 12 through the inlet, glue is applied. During this process, the glue flow rate is 18mm / s to ensure stable glue flow and further guarantee the glue-filling quality.
[0066] S5. Control the linear drive mechanism 4 to drive the housing 3 to move upward and remove the fixture from the positioning plate 1.
[0067] S6. Curing of the glued product by irradiation. Specifically, UV blue light or ultraviolet light is used.
[0068] S7. Remove the glued product from the fixture.
[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A glue filling device, characterized in that, include: The positioning mechanism includes a positioning plate (1) and a positioning component (2) disposed on the upper end of the positioning plate (1). The positioning component (2) is used to position the product (12) to be glued onto the positioning plate (1). The linear motion mechanism (4) has an output end that can move in the vertical direction; The glue injection mechanism includes a cover (3), which is connected to the output end of the linear motion mechanism (4) and located above the positioning mechanism. The cover (3) can seal against the upper end face of the positioning plate (1) to form a sealed cavity together with the positioning plate (1). The cover (3) is provided with an air extraction hole and a glue injection hole (5), which are both connected to the sealed cavity. A heating mechanism is provided inside the cover (3) and is used to heat the sealed cavity.
2. The glue filling device according to claim 1, wherein The heating mechanism is an infrared lamp.
3. The glue filling apparatus according to claim 2, wherein The housing (3) is provided with a plurality of first lamp holders (6), which are respectively disposed on a plurality of inner sidewalls of the housing (3). Each first lamp holder (6) extends along the length direction of the corresponding inner sidewall, and each first lamp holder (6) is provided with an infrared lamp.
4. The glue filling apparatus according to claim 3, wherein The cover (3) is provided with a plurality of second lamp holders (7), which are respectively located at a plurality of corners of the cover (3), and each second lamp holder (7) is provided with an infrared lamp.
5. The glue filling apparatus according to claim 4, wherein The irradiation distance between the infrared lamp set on the first lamp holder (6) and the product to be glued (12) is L, and the irradiation distance between the infrared lamp set on the second lamp holder (7) and the product to be glued (12) is M, L>M, and the power of the infrared lamp set on the second lamp holder (7) is less than the power of the infrared lamp set on the first lamp holder (6).
6. The glue filling apparatus according to any one of claims 1 to 5, wherein The glue-dispensing device also includes a lifting mechanism (8), the positioning plate (1) is connected to the output end of the lifting mechanism (8), and the lifting mechanism (8) is used to drive the positioning plate (1) to rise and fall.
7. The glue filling apparatus according to claim 6, wherein The lifting mechanism (8) includes a telescopic component (9), the telescopic end of which is connected to the positioning plate (1).
8. The glue filling apparatus according to any one of claims 1 to 5, wherein A sealing ring (11) is provided on the upper end face of the positioning plate (1) or the lower end face of the cover (3). When the cover (3) and the positioning plate (1) are sealed and abutted, the sealing ring (11) is clamped between the cover (3) and the positioning plate (1).
9. The glue filling apparatus according to claim 8, wherein A positioning groove is provided on the upper end face of the positioning plate (1) or the lower end face of the cover (3), and part of the sealing ring (11) is fixed in the positioning groove.
10. A process for potting, characterized in that, The dispensing apparatus according to any one of claims 1-9, wherein the dispensing process comprises the following steps: S1. Position the product (12) to be glued; S2. Control the linear motion mechanism (4) to drive the cover (3) to move downward until the cover (3) abuts against the positioning plate (1), and the cover (3) and the positioning plate (1) enclose to form a sealed cavity; S3. The air inside the sealed cavity is drawn out through the air extraction hole to create a vacuum inside the sealed cavity; S4. Open the heating mechanism to heat the inside of the sealed cavity, and at the same time, fill the product to be filled (12) with glue through the glue filling hole (5) to form a glued product; S5. Control the linear motion mechanism (4) to drive the cover (3) to move upward and remove the fixture from the positioning plate (1); S6. Cure the glued product by irradiation; S7. Remove the glued product from the fixture.
