A potting device for a brain-computer interface implant

Abstract

The application provides a brain-computer interface implant filling equipment, and belongs to the technical field of brain-computer interface. The equipment comprises a supporting base and a filling forming part, and the supporting base is provided with a limiting structure; the filling forming part is installed on the supporting base through the limiting structure, a mold cavity for filling a sealing medium is arranged in the filling forming part, the top of the mold cavity is open, and the brain-computer interface implant is matched with the bottom of the brain-computer interface implant to jointly enclose a closed forming cavity, spring contact fingers on the bottom of the brain-computer interface implant are arranged in the forming cavity; an input channel for connecting the mold cavity and the outside to inject the sealing medium is arranged on the side wall of the filling forming part; a plurality of exhaust ports for connecting the top of the forming cavity and the outside are arranged on the side wall of the filling forming part, so as to exhaust air in the forming cavity during the filling process. The application is mainly used for solving the technical problems of insufficient filling of a micro hidden gap and many bubble defects in the prior art.

Description

Technical Field

[0001] This invention belongs to the field of brain-computer interface technology, and specifically relates to a filling device for a brain-computer interface implant. Background Technology

[0002] With the development of brain-computer interface engineering technology, the demand for electronic devices that can be implanted in the body for a long time is increasing. These implantable devices need to be in direct contact with biological tissues and operate stably for a long time. One of the core challenges is to achieve a reliable biocompatible seal to prevent the infiltration of body fluids from causing short circuits, corrosion, or biological rejection reactions.

[0003] Currently, high-end implants often use precious metal electrodes (such as platinum rings) and connect to the internal circuitry via elastic conductive elements (such as spring-loaded fingers). The sealing quality of this connection point directly determines the lifespan and safety of the entire implant. Therefore, precise and defect-free epoxy resin potting around key conductive components such as spring-loaded fingers has become a crucial step in the manufacturing process of this field.

[0004] In the existing technology, the following methods are commonly used for epoxy resin filling of such miniature, precision components: The first type is a semi-automatic dispensing machine, which uses a clamp to fix the workpiece and a pneumatic or screw-driven dispensing valve to apply glue to the parts of the workpiece that need to be sealed. This method improves efficiency to some extent, but for irregular shapes and hidden glue areas (such as the annular gap around the spring contact finger), there are still problems such as complex glue path planning, difficulty in completely filling dead corners with glue, and insufficient visual positioning accuracy.

[0005] The second method is vacuum potting, which involves placing the part of the workpiece that needs to be sealed in a sealed chamber, evacuating the air, and then injecting resin. This method can effectively reduce air bubbles, but the equipment is complex, and for the online production of individual small parts, the cycle is long and the cost is high. It also faces the challenge of accurately delivering resin to tiny areas.

[0006] The main drawback of existing technologies lies in the difficulty of achieving highly consistent and defect-free epoxy resin filling for small-sized, structurally complex implant components (such as those with annular grooves or dense spring structures). Semi-automatic methods are heavily reliant on manual labor, prone to introducing quality problems such as air bubbles, uneven resin application, and contamination of non-target areas, and have low production efficiency. While methods such as vacuum potting can improve the air bubble problem, they require large equipment investments and involve cumbersome processes, making them unsuitable for high-efficiency assembly line production. Furthermore, epoxy resin has extremely strong adhesion after curing, easily sticking to metal molds and making demolding difficult, while the use of release agents faces strict biocompatibility restrictions for implantable medical devices.

[0007] Therefore, there is a need to provide an improved technical solution that addresses the shortcomings of the existing technology. Summary of the Invention

[0008] The purpose of this invention is to provide a filling device for brain-computer interface implants to solve the technical problems of insufficient filling of micro-hidden gaps and numerous air bubble defects in the prior art.

[0009] To achieve the above objectives, the brain-computer interface implant encapsulation device of the present invention provides the following technical solution: A filling device for a brain-computer interface implant includes: A support base having a limiting structure; A filling and molding component is detachably mounted on a support base via a limiting structure. The filling and molding component has a mold cavity for filling and sealing medium inside. The top of the mold cavity is open and is used to cooperate with the bottom of the brain-computer interface implant to form a closed molding cavity. The spring finger at the bottom of the brain-computer interface implant is placed into the molding cavity as the brain-computer interface implant and the filling and molding component cooperate. The filling and molding component has an input channel on its side wall. One end of the input channel is connected to the top of the mold cavity, and the other end is used to connect to an external device for injecting sealing medium. The side wall of the filling and molding component is provided with multiple vents. The vents are used to connect the top of the molding cavity with the outside to discharge the air inside the molding cavity and the excess sealing medium that overflows during the filling process.

[0010] As a further optimized technical solution, the filling and molding component has a slot at the top of the mold cavity for securing the brain-computer interface implant.

[0011] As a further optimized technical solution, the brain-computer interface implant filling device also includes multiple mandrels, which are detachably mounted on the epoxy filling molding component, with one end of the mandrel extending into the molding cavity.

[0012] As a further optimized technical solution, the support base is provided with a support portion for supporting the mandrel.

[0013] As a further optimized technical solution, the support part has a through hole that matches the supported section of the mandrel, and the mandrel passes through the through hole to extend into the molded cavity.

[0014] As a further optimized technical solution, the input channel is inclinedly opened at the lower part of the molding equipment body. The discharge end of the input channel is aligned with the spring contact finger. The sealing medium fills the spring contact finger and relies on the weight of the sealing medium to lift the air in the cavity upward. The gas is discharged along the top exhaust port.

[0015] As a further optimized technical solution, the radial dimension of the section connecting the input channel and the mold cavity is smaller than that of the section connecting to the external injection sealing medium device.

[0016] As a further optimized technical solution, the exhaust port is arranged at an angle, and the exhaust port extends gradually away from the support base from the bottom to the top, and the radial dimension of the exhaust port gradually increases from the bottom to the top.

[0017] As a further optimized technical solution, the filling and molding component is integrally molded from silicone material.

[0018] As a further optimized technical solution, the limiting structure is a groove formed on the support base, the shape of which is adapted to the bottom end of the filling and molding component. Beneficial effects: First, the present invention uses a mold cavity and the bottom of the brain-computer interface implant to form a closed molding cavity. The spring finger at the bottom of the brain-computer interface implant is placed directly inside the molding cavity along with the brain-computer interface implant and the filling molding component. By injecting sealing material into the outside, the part of the brain-computer interface implant to be sealed is sealed. Specifically, when the spring finger is located in the molding cavity, the injection space of the sealing medium can directly surround the spring finger, so that the sealing medium can fully fill the small structure of the spring finger to ensure that the position on the brain-computer interface implant that needs to be sealed is fully filled.

[0019] Secondly, the molding cavity is a complete closed cavity formed by the implant and the mold cavity. The medium fills the cavity from bottom to top. Air can only be discharged from the vent at the top of the cavity. When the sealing medium is injected, the rise of the medium liquid level will continuously squeeze the air inside the cavity. Air and excess medium can be discharged outward from the top vent at the same time. Therefore, it will not linger in the narrow gap of the spring finger and form encapsulated air bubbles.

[0020] Furthermore, by designing a limiting structure for the support base, the present invention enables the filling and molding component to be quickly and detachably snapped into position with the support base. This eliminates the need for repeated manual calibration of the mold position. The filling process only requires continuous delivery of the medium through the input channel, relying on the self-flowing filling of the cavity. There is no need for manual dispensing of glue point by point using the dispensing valve, which greatly reduces manual intervention and lowers the quality fluctuations caused by human error.

[0021] Finally, the present invention only includes basic structures such as a support base, filling and molding components, and input channels and exhaust ports, and does not involve any vacuum generation or maintenance devices. The equipment structure is simple, and the manufacturing and maintenance costs are significantly reduced compared to vacuum filling methods.

[0022] Furthermore, the entire filling and molding component is integrally molded using medical-grade silicone. Compared to metal, silicone is flexible and deformable, allowing for easy demolding by directly removing the workpiece through elastic deformation. The sealing medium does not adhere tightly to the mold cavity after curing, eliminating the need for forced peeling. This material-level design avoids the technical problems of sticking and tearing of the sealing layer associated with metal molds. The entire filling and molding process requires no release agent, eliminating the risk of release agent residue contaminating the implant and effectively reducing the risks of rejection, inflammation, and other medical safety hazards. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. Wherein: Figure 1 This is a schematic diagram of the overall structure of an embodiment of the filling device for the brain-computer interface implant of the present invention; Figure 2 for Figure 1 The right view and its sectional view, in which Figure 2 (b) is the left view of the overall structure. Figure 2 (a) is a cross-sectional view of 2 (b) along the AA direction; Figure 3 for Figure 1 Front view and its first position sectional view, wherein Figure 3 (a) is a front view of the overall structure. Figure 3 (b) is a cross-sectional view of 3(a) along the BB direction; Figure 4 for Figure 1 Front view and its second position sectional view, wherein Figure 4 (a) is a front view of the overall structure. Figure 4 (b) is a cross-sectional view of 4(a) along the CC direction; Figure 5 for Figure 1 The front view and its third-position sectional view, in which Figure 5 (a) is a front view of the overall structure. Figure 5 (b) is a cross-sectional view of 5(a) along the DD direction; Figure 6 for Figure 1 The rear view and left view, where Figure 6 (a) is a rear view of the overall structure. Figure 6 (b) is the left view of the overall structure.

[0024] In the diagram: 100, support base; 110, limiting structure; 200, filling and molding component; 210, mold cavity; 220, vent; 230, slot; 240, input channel; 300, brain-computer interface implant; 310, spring finger; 400, mandrel; 500, support part; 510, through hole. Detailed Implementation

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0026] In the description of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. The terms "connected" and "linked" used in this invention should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; they can refer to a direct connection or an indirect connection through intermediate components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances. Furthermore, the term "proximal end" uniformly refers to the end closer to the operator, while "distal end" refers to the end farther from the operator.

[0027] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0028] The shapes and sizes of the components in the accompanying drawings do not reflect the actual proportions of the product; they are only intended to illustrate the content of the invention.

[0029] In the prior art, when filling and sealing the area to be sealed in a brain-computer interface implant, there are technical problems such as insufficient filling of micro-hidden gaps, numerous air bubble defects, high dependence on manual labor, complex and costly vacuum equipment, and difficulty in demolding. Therefore, the area to be sealed at the bottom of the implant (specifically, the area where the spring contact finger 310 is located at the bottom of the brain-computer interface implant 300) cannot be effectively sealed. According to a specific embodiment of the present invention, as... Figure 1-6As shown, this invention provides a filling device for a brain-computer interface implant, comprising a support base 100, a filling and molding component 200, and a mandrel 400. The support base 100 has a limiting structure 110, and the filling and molding component 200 is detachably mounted on the support base 100 via the limiting structure 110. The filling and molding component 200 has a mold cavity 210 inside, with an open top for engaging with the bottom of the brain-computer interface implant 300 to form a closed molding cavity. The spring-loaded finger 310 at the bottom of the brain-computer interface implant 300 is inserted into the molding cavity for sealing. The side wall of the filling and molding component 200 has an input channel 240, one end of which communicates with the mold cavity 210, and the other end is used to connect to an external device for injecting sealing medium into the mold cavity. The sidewall of the filling and molding component 200 has multiple vents 220. The vents 220 are used to connect the top of the molding cavity with the outside to discharge air and excess sealing medium that overflows from inside the molding cavity during the filling process. This invention achieves bubble-free and complete filling of micro-concealed gaps through the design of the molding cavity and vents. The equipment has a simple structure and is easy to operate, making it suitable for high-efficiency mass production of sealing parts for brain-computer interface implants.

[0030] Example 1 like Figure 1 As shown, a brain-computer interface implant filling device includes a support base 100, a filling and molding component 200, and multiple mandrels 400.

[0031] The support base 100 is a rigid metal base with a groove on the top surface as a limiting structure 110. The inner contour of the groove is adapted to the shape of the bottom of the filling and molding component 200 so that the filling and molding component 200 can be detachably embedded in the limiting structure 110.

[0032] The filling and molding component 200 is integrally molded from medical-grade silicone with a Shore hardness of 65A. For example... Figure 2As shown, the filling and molding component 200 has a mold cavity 210 inside. The inner surface of the mold cavity 210 is polished to form a high-gloss surface, making it less likely to stick to the sealing medium to be filled, and facilitating demolding after the sealing medium has hardened. The contour of the mold cavity 210 is adapted to the contour of the part of the brain-computer interface implant 300 to be filled. The top of the mold cavity 210 is open, and a slot 230 for securing the brain-computer interface implant 300 is arranged on the top of the mold cavity 210 on the filling and molding component 200. The shape and size of the slot 230 are adapted to the corresponding part of the brain-computer interface implant 300, so that when the brain-computer interface implant 300 is installed in the slot 230, the bottom end of the brain-computer interface implant 300 is secured. The edge engages in the slot 230, and the bottom surface can seal the mold cavity 210, so that the mold cavity 210 and the bottom of the brain-computer interface implant 300 cooperate to form a closed molding cavity. At this time, the spring finger 310 at the bottom of the brain-computer interface implant 300 is placed into the molding cavity along with the engagement of the brain-computer interface implant 300 and the filling molding component 200. By pouring a sealing medium into the molding cavity, the sealing of the part of the brain-computer interface implant 300 to be sealed is completed. In this embodiment, the sealing medium is epoxy resin.

[0033] Specifically, except for the spring finger 310 part, the brain-computer interface implant 300 uses a titanium alloy to make a rectangular shell. When the brain-computer interface implant 300 is installed in the slot 230, that is, the bottom of the titanium shell of the brain-computer interface implant 300, the space around the spring finger 310 and the mold cavity 210 together form a closed molded cavity.

[0034] like Figure 3 As shown, the side wall of the filling and molding component 200 has an input channel 240. The input channel 240 extends obliquely upward from the lower side of the filling and molding component 200 to the mold cavity 210. The feed end of the input channel 240 is located on the outer side wall of the filling and molding component 200 and is used to connect to an external device for injecting sealing medium (such as a dispensing machine or syringe); the discharge end of the input channel 240 is located inside the mold cavity 210 and is aligned with the location of the spring contact finger 310 of the brain-computer interface implant 300. In this way, when the sealing medium enters the mold cavity 210, the fresh sealing medium with the best fluidity will first reach the annular gap of the spring contact finger 310. Relying on the initial high fluidity of the medium, it fully wets the fine gap of the spring, thereby avoiding the problem of insufficient glue or incomplete filling in the tiny annular gap, and ensuring the sealing integrity of the key conductive connection position of the brain-computer interface implant 300.

[0035] In this embodiment, the input channel 240 consists of three sections: the section communicating with the mold cavity 210 is a tapered structure, and its radial dimension decreases as it approaches the mold cavity 210; the two outer sections are of equal diameter, and their diameter increases as they approach the outer wall of the filling and molding component 200, forming a stepped structure. Specifically, this variable diameter design can create a throttling and pressurizing effect during the injection of the sealing medium, ensuring that the sealing medium is injected into the mold cavity 210 at an appropriate pressure.

[0036] like Figures 2 to 6 As shown, the filling and molding component 200 has multiple vents 220. In this embodiment, there are five vents 220, which are evenly arranged circumferentially along the upper edge of the molding cavity. Each vent 220 extends obliquely upward from the top wall of the molding cavity to the outer top surface of the filling and molding component 200.

[0037] Specifically, such as Figure 6 As shown, each vent 220 extends gradually away from the support base 100 from the bottom to the top. Furthermore, the radial dimension of the vent 220 gradually increases from the bottom to the top. This tapered structure, wider at the top and narrower at the bottom, facilitates the smooth discharge of air bubbles and prevents the potting material from clogging the vents due to surface tension.

[0038] The bottom of each vent 220 is located at the highest point of the molding cavity, ensuring that the gas in the molding cavity can naturally gather upward and be discharged from the vent 220 during the filling process of the potting material.

[0039] like Figure 1 and Figure 3 As shown, the filling equipment in this embodiment also includes four mandrels 400 for subsequent core removal after the sealing part of the brain-computer interface implant 300 is demolded. Each mandrel 400 is mounted on the filling and molding component 200, with one end of the mandrel 400 extending into the molding cavity and the other end protruding from the bottom of the filling and molding component 200.

[0040] To facilitate the support of the mandrel 400, a support portion 500 is provided on the support base 100. The support portion 500 is located on both sides of the filling and molding component 200, and is formed by protruding upward from the upper surface of the support base 100. It can be integrally cast with the support base 100, or it can be machined separately from the support base 100 and then fixed together. A total of four through holes 510 are provided on the two support portions 500. The through holes 510 are adapted to the supported section of the mandrel 400. The axial direction of each through hole 510 is consistent with the insertion direction of the corresponding mandrel 400. Each mandrel 400 extends into the molding cavity after passing through the corresponding through hole 510.

[0041] The working process of the filling equipment in this embodiment is as follows: First, the brain-computer interface implant 300 is placed into the slot 230 of the molding component 200, so that one end of the brain-computer interface implant 300 is engaged in the slot 230. The titanium shell at the bottom of the brain-computer interface implant 300 fits tightly with the wall of the mold cavity 210, and the spring-loaded finger 310 is placed inside the mold cavity 210. At this time, the mold cavity 210 and the bottom of the brain-computer interface implant 300 together form a closed molding cavity.

[0042] Then, the filling and molding component 200 is placed in the limiting structure 110 of the support base 100, so that the bottom end of the filling and molding component 200 is embedded in the groove to complete the positioning of the filling and molding component 200.

[0043] Next, the four mandrels 400 are passed through the through holes 510 on the support 500 and the corresponding holes in the filling and molding component 200 in sequence until the ends of the mandrels 400 extend into the molding cavity and reach the predetermined position.

[0044] Subsequently, a curable sealing medium (such as implantable epoxy resin) is injected into the molding cavity through the input channel 240. After entering the molding cavity along the input channel 240, the sealing medium first fills the area where the spring contact finger 310 is located, and then, relying on the weight of the sealing medium and the pressure generated by continuous injection, gradually fills the entire molding cavity from bottom to top. During this process, the air in the molding cavity is lifted from bottom to top by the sealing medium and discharged from the five vents 220 located at the top of the molding cavity. When the sealing medium overflows evenly from all the vents 220, it indicates that the molding cavity has been completely filled, and injection is stopped.

[0045] Next, the entire assembly is placed under curing conditions. After the potting material has completely cured, the four mandrels 400 are first pulled out, forming corresponding pre-reserved channels on the cured sealing parts. Then, the filling and molding component 200 is removed from the support base 100, and the filling and molding component 200 is peeled off from the cured potting component to complete the demolding.

[0046] In summary, the brain-computer interface implant filling device provided by this invention, through the design of the support base and filling molding component, achieves full and bubble-free filling of the spring contact area of ​​the brain-computer interface implant. The filling molding component is integrally molded using medical-grade silicone, and with the refined design of the vent and input channels, it effectively solves the technical problems of difficult demolding, high bubble rate, and poor filling quality consistency in the prior art.

[0047] It is understood that the above description is merely exemplary and the embodiments of this application do not limit the scope of the application.

[0048] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are within the protection scope of the present invention.

Claims

1. A filling device for a brain-computer interface implant, characterized in that, include: A support base (100) having a limiting structure (110). A filling and molding component (200) is detachably mounted on a support base (100) via a limiting structure (110). The filling and molding component (200) has a mold cavity (210) for filling and sealing medium inside. The top of the mold cavity (210) is open and is used to cooperate with the bottom of the brain-computer interface implant (300) to form a closed molding cavity. The spring finger (310) at the bottom of the brain-computer interface implant (300) is placed into the molding cavity as the brain-computer interface implant (300) cooperates with the filling and molding component (200). The filling and molding component (200) has an input channel (240) on its side wall. One end of the input channel (240) is connected to the top of the mold cavity (210), and the other end is used to connect to an external device for injecting sealing medium. The filling and molding component (200) has multiple vents (220) on its sidewall. The vents (220) are used to connect the top of the molding cavity with the outside to discharge the air inside the molding cavity and the excess sealing medium overflowing during the filling process.

2. The filling device for the brain-computer interface implant according to claim 1, characterized in that, The filling and molding component (200) has a slot (230) on the top of the mold cavity (210) for securing the brain-computer interface implant (300).

3. The filling device for the brain-computer interface implant according to claim 1, characterized in that, The brain-computer interface implant filling device also includes multiple mandrels (400), which are detachably mounted on the epoxy filling molding component (200), with one end of the mandrel (400) extending into the molding cavity.

4. The filling device for the brain-computer interface implant according to claim 3, characterized in that, The support base (100) is provided with a support part (500) for supporting the mandrel (400).

5. The filling device for the brain-computer interface implant according to claim 4, characterized in that, The support portion (500) has a through hole (510) adapted to the supported section of the mandrel (400), through which the mandrel (400) passes to extend into the molded cavity.

6. The filling device for the brain-computer interface implant according to claim 1, characterized in that, The input channel (240) is inclinedly opened on the lower part of the molding equipment body. The discharge end of the input channel (240) is aligned with the spring contact finger (310). The sealing medium fills the spring contact finger (310) and lifts the air in the cavity upward by the weight of the sealing medium. The gas is discharged along the top exhaust port (220).

7. The filling device for the brain-computer interface implant according to claim 6, characterized in that, The radial dimension of the section connecting the input channel (240) and the mold cavity (210) is smaller than that of the section connecting to the external injection sealing medium device.

8. The filling device for the brain-computer interface implant according to claim 6, characterized in that, The exhaust port (220) is arranged at an angle, and the exhaust port (220) extends from the bottom to the top of the support base (100) gradually away from the bottom. The radial dimension of the exhaust port (220) gradually increases from the bottom to the top.

9. The filling device for the brain-computer interface implant according to any one of claims 1-8, characterized in that, The filling and molding component (200) is integrally molded from silicone material.

10. The filling device for the brain-computer interface implant according to any one of claims 1-8, characterized in that, The limiting structure (110) is a groove formed on the support base (100), and the shape of the groove is adapted to the bottom end of the filling and molding component (200).

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