A dental mold curing device and method based on multi-band ultraviolet light source curing

Abstract

This invention discloses a dental mold curing device and method based on multi-band ultraviolet light source curing. The device includes: a conveying mechanism, a tray, a first curing component, and a second curing component. The conveying mechanism includes a first belt conveyor and a second belt conveyor, and the tray includes a light-transmitting plate and an array of through holes; two multi-band ultraviolet light sources of the first curing component are located above the first belt conveyor; the ultraviolet light source of the second curing component is located below the junction area of ​​the two belt conveyors and irradiates upwards. This device can perform zoned curing of the top, periphery, and bottom support structure of the dental mold during the conveying process, improving the irradiation integrity of the dental mold and the curing effect of the support points.

Description

Technical Field

[0001] This invention relates to the field of dental model post-processing technology, specifically to a dental model curing device and method based on multi-band ultraviolet light source curing. Background Technology

[0002] 3D-printed dental models can be used in various scenarios, including the fabrication of orthodontic invisible aligners, diagnosis of dental crown and bridge restorations, preoperative planning for implant surgery, fabrication of retainers, and demonstrations for doctor-patient communication. After the dental model is formed by light-curing 3D printing equipment, unreacted liquid resin usually remains on its surface. This requires ultrasonic cleaning with alcohol to remove the residual liquid resin, followed by a second UV curing process to improve the degree of curing, dimensional stability, and subsequent performance of the dental model.

[0003] In existing dental mold post-processing production lines, some equipment uses ultraviolet mercury lamps for secondary curing. Due to factors such as spectral utilization, effective irradiation energy, and irradiation direction, when the irradiation dose received by the dental mold resin within the required absorption band is insufficient, it is usually necessary to reduce the conveyor speed or have the dental mold repeatedly pass through the curing area, affecting continuous production efficiency. While some integrated water-cooled LED curing lines use LED light sources, they typically irradiate the surface of a general workpiece, failing to create a coordinated curing light path for the curved top, inner and outer circumferences, and bottom support points of the 3D printed dental mold. Furthermore, dental molds are usually supported on a tray by multiple 3D printed support points. If irradiation is only applied from above, the support points between the bottom of the mold and the tray are easily blocked by the mold body, the tray, or adjacent support points. When the support points are not fully cured, their fracture location and fracture state are difficult to control, potentially affecting the separation of the mold from the tray and the quality of the mold bottom.

[0004] Therefore, there is a need for a UV curing device that can adapt to the three-dimensional shape of a dental mold and can cure the top, sides and bottom support points of the dental mold during continuous transport. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned technical deficiencies and propose a dental mold curing device and method based on multi-band ultraviolet light source curing, so as to solve the technical problem that the effective irradiation band and irradiation direction of the existing dental mold ultraviolet secondary curing device are relatively limited.

[0006] To achieve the above-mentioned technical objectives, this application adopts the following technical solution: In a first aspect, this application provides a dental mold curing device based on multi-band ultraviolet light source curing, comprising: The conveying mechanism includes a first belt line and a second belt line that are connected along the conveying direction, and a connection area is formed between the first belt line and the second belt line. A tray supports a dental mold and a supporting structure. The supporting structure is located between the dental mold and the tray. The tray includes a light-transmitting plate and through holes that penetrate the light-transmitting plate and are evenly distributed in an array. The light-transmitting plate and the through holes together constitute a light-transmitting area. The first curing assembly includes at least two first ultraviolet light sources sequentially disposed above the first belt conveyor along the conveying direction. Each first ultraviolet light source includes a first on-board chip package module with at least two ultraviolet light-emitting chips having at least two different wavelengths. The light emission directions of the two first ultraviolet light sources are directed towards the top and periphery of the dental mold. The second curing component includes a second ultraviolet light source disposed below the connection area, with its light-emitting surface facing upwards, and irradiates the support structure through the light-transmitting area of ​​the tray.

[0007] In some embodiments of this application, the chip packaging module on the first board includes a first ultraviolet (UV) light-emitting chip group, a second UV light-emitting chip group, and a third UV light-emitting chip group. The nominal wavelength of the first UV light-emitting chip group is 270nm-280nm, the nominal wavelength of the second UV light-emitting chip group is 305nm-315nm, and the nominal wavelength of the third UV light-emitting chip group is 360nm-370nm. The three UV light-emitting chip groups with different nominal wavelengths are jointly packaged in the same chip packaging module on the first board and distributed in the same light-emitting area.

[0008] In some embodiments of this application, the number of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the chip packaging module on the first board accounts for 35%-45%, 15%-25%, and 35%-45%, respectively, and the power percentage of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the total power of the chip packaging module on the first board accounts for 25%-35%, 10%-20%, and 50%-60%, respectively.

[0009] In some embodiments of this application, a mirrored aluminum reflector is provided around the irradiation area of ​​the two first ultraviolet light sources. The mirrored aluminum reflector surrounds the irradiation area corresponding to the two first ultraviolet light sources, and the reflective surface of the mirrored aluminum reflector faces the dental mold on the tray.

[0010] In some embodiments of this application, two first ultraviolet light sources are mounted above the first belt via an adjustable bracket. The adjustable bracket includes a height adjustment component and an angle adjustment component, which are used to adjust the height and light emission direction of the first ultraviolet light sources, respectively.

[0011] In some embodiments of this application, the second ultraviolet light source is disposed directly below the docking area, with its light-emitting surface facing the lower surface of the tray passing through the docking area, and the size of the light-emitting area of ​​the second ultraviolet light source in the horizontal direction is not less than the width of the tray in the direction perpendicular to the conveying direction; the second ultraviolet light source includes a chip packaging module on a second board, and the nominal wavelength of the fourth ultraviolet light-emitting chip group on the chip packaging module on the second board is 360nm-370nm.

[0012] In some embodiments of this application, the ultraviolet transmittance of the light-transmitting plate body is not less than 90%, and the through holes are arranged in a first array direction and a second array direction that are perpendicular to each other, with the center-to-center spacing of the holes in the first array direction being equal to that in the second array direction.

[0013] In some embodiments of this application, the first ultraviolet light source includes a first front cover, a front cover lens, a chip packaging module on the first board, a first heat dissipation body, a rear cover, a first electrical connector, a handle, a first water inlet connector, and a first water outlet connector; the first front cover and the rear cover are respectively disposed on the light-emitting side and the backlight side of the first heat dissipation body, the front cover lens is disposed at the light-emitting port of the first front cover, the chip packaging module on the first board is disposed between the front cover lens and the first heat dissipation body, and is in thermal contact with the first heat dissipation body and electrically connected to the first electrical connector; the first heat dissipation body is provided with a cooling channel, the cooling channel is connected to the first water inlet connector and the first water outlet connector respectively, and the handle is disposed on the rear cover.

[0014] In some embodiments of this application, the second ultraviolet light source includes a second front cover, a front cover glass, a chip packaging module on the second board, a second heat dissipation body, a second electrical connector, a second water inlet connector, and a second water outlet connector; the front cover glass is disposed at the light outlet of the second front cover, the chip packaging module on the second board is disposed between the front cover glass and the second heat dissipation body, and is in thermal contact with the second heat dissipation body and electrically connected to the second electrical connector respectively; the second heat dissipation body is provided with a cooling channel, and the cooling channel is connected to the second water inlet connector and the second water outlet connector respectively.

[0015] Secondly, this application also provides a method for curing dental molds based on multi-band ultraviolet light sources, using a dental mold curing device based on multi-band ultraviolet light sources as described in any one of the first aspects, comprising the following steps: The 3D-printed dental mold was ultrasonically cleaned with alcohol to remove residual liquid resin from its surface. The cleaned dental mold is supported on the tray by the support structure and transported along the conveying direction by the conveying mechanism; The dental model is passed sequentially through two of the first ultraviolet light sources, and the top and periphery of the dental model are irradiated with ultraviolet light of at least two different wavelengths; and As the tray passes through the connection area between the first belt conveyor and the second belt conveyor, a second ultraviolet light source located below the connection area emits ultraviolet light upwards, which illuminates the support structure through the light-transmitting area of ​​the tray.

[0016] Compared with the prior art, the beneficial technical effects of the technical solution provided in this application include: This application utilizes two multi-band first ultraviolet light sources positioned along the conveying direction to create continuous upper irradiation, ensuring that the top and periphery of the dental mold receive ultraviolet radiation from different directions. Simultaneously, a second upward-emitting ultraviolet light source is positioned below the junction of the two conveyor belts, allowing ultraviolet light to reach the bottom support point of the dental mold through a light-transmitting plate and an array of through holes. This structure enables the top, periphery, and bottom support points of the dental mold to be cured during a single conveying path, reducing irradiation blind spots and facilitating the subsequent removal of the support points between the dental mold and the tray. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the embodiments will be briefly described below: Figure 1 This is a schematic diagram of the dental mold curing device based on multi-band ultraviolet light source in the embodiments of this application; Figure 2 This is a schematic diagram of the dental model in the embodiments of this application; Figure 3 This is a schematic diagram of the tray structure in an embodiment of this application; Figure 4 This is a schematic diagram of the dental mold curing device in the embodiments of this application; Figure 5 This is a schematic diagram of the dental mold curing device in the embodiments of this application; Figure 6 This is a schematic diagram of the structure of the reflector in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the first curing component in the embodiments of this application; Figure 8 This is a schematic diagram of the wavelength of the chip packaging module on the first board in the embodiments of this application; Figure 9 This is a schematic diagram of the structure of the second curing component in the embodiments of this application.

[0018] Figure label: Conveying mechanism 1, first belt conveyor 11, second belt conveyor 12; Tray 2, translucent panel 21, through hole 22; 3. First ultraviolet light source 3, first front cover 31, front cover lens 32, first chip packaging module on board 33, first heat dissipation body 34, rear cover 35, first water outlet connector 36, first electrical connector 37, handle 38, first water inlet connector 39; Second ultraviolet light source 4, second front cover 41, front cover glass 42, second chip packaging module on the second board 43, second heat dissipation body 44, second water outlet connector 45, second electrical connector 46, second water inlet connector 47. Dental model 5, supporting structure 51; Reflector 6; Height adjustment component 71, angle adjustment component 72; First position detector 81, first position detector 81. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] Those skilled in the art will understand that, in this specification, the term "comprising" is an open-ended expression, meaning that the stated feature is present but other features are excluded. Directional terms such as "upper," "lower," "left," and "right" refer to exemplary directions based on the accompanying drawings. Features specified as "first" or "second" implicitly include one or more of that feature. Singular expressions can also be used in plural forms. "Multiple" means two or more. The terms "installed," "connected," and "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection via an intermediate medium, and it can be a connection within two components. Furthermore, "linked" can include wireless connections.

[0021] like Figures 1 to 9 As shown, the dental mold curing device includes a conveying mechanism 1, a tray 2, a first curing component, and a second curing component.

[0022] The conveying mechanism 1 includes a first belt conveyor 11 and a second belt conveyor 12. The first belt conveyor 11 and the second belt conveyor 12 are connected front and rear along the conveying direction, forming a connection area between them. An irradiation gap is left in the connection area, which provides space for ultraviolet light to pass upward while ensuring the smooth transfer of the tray 2 from the first belt conveyor 11 to the second belt conveyor 12.

[0023] The tray 2 has a support area. The dental mold 5 is supported above the support area by a support structure 51, which includes multiple 3D printed support points. The 3D printed support points are distributed between the bottom of the dental mold 5 and the tray 2, supporting the dental mold 5 during printing and post-processing, and serving as the connection points that need to be removed when the dental mold 5 is separated from the tray 2 after curing.

[0024] The tray 2 includes a light-transmitting plate 21 made of quartz glass. Multiple through-holes 22 are formed on the upper and lower surfaces of the light-transmitting plate 21, and these through-holes 22 are evenly distributed in an array. The solid area of ​​the light-transmitting plate 21 allows ultraviolet light to pass through, while the through-holes 22 form a direct path for ultraviolet light without passing through the solid glass. Together, they form the light-transmitting area of ​​the tray 2.

[0025] The first curing component includes two first ultraviolet light sources 3. The two first ultraviolet light sources 3 are spaced apart above the first conveyor belt 11 along the conveying direction and are respectively mounted on the device frame via adjustable brackets. The light-emitting surfaces of the two first ultraviolet light sources 3 face the bearing area of ​​the tray 2. Each first ultraviolet light source 3 is equipped with a first on-board chip packaging module 33, which contains at least two ultraviolet emitting chip groups with different nominal wavelengths.

[0026] A mirrored aluminum reflector 6 is provided around the irradiation area corresponding to the two first ultraviolet light sources 3. The reflective surface of the mirrored aluminum reflector 6 faces the bearing area, so that the ultraviolet light that is not directly incident on the dental model 5 changes its propagation direction and re-enters the area where the dental model 5 is located.

[0027] The second curing component includes a second ultraviolet light source 4. The second ultraviolet light source 4 is disposed below the irradiation gap, with its light-emitting surface facing upward and opposite to the lower surface of the tray 2 passing through the connection area. The second ultraviolet light source 4 is provided with a second on-board chip packaging module 43. The ultraviolet light emitted by the second ultraviolet light source 4 passes sequentially through the irradiation gap and the light-transmitting area of ​​the tray 2 before reaching the support structure 51 located at the bottom of the dental mold 5.

[0028] During operation, the dental mold 5, ultrasonically cleaned with alcohol, along with the support structure 51, is placed on the tray 2. The tray 2 moves with the first conveyor belt 11, successively entering the irradiation areas of the two first ultraviolet light sources 3. The multi-band ultraviolet light emitted by the first ultraviolet light sources 3 directly irradiates the top and part of the periphery of the dental mold 5, while the ultraviolet light deviating from the dental mold 5 is reflected by the mirrored aluminum reflector 6 and reaches the side or concave surface of the dental mold 5 from other directions. The tray 2 continues to move to the docking area, where the second ultraviolet light source 4 irradiates from below, and the ultraviolet light reaches the 3D printing support point through the light-transmitting plate 21 and the through hole 22. Subsequently, the tray 2 enters the second conveyor belt 12 and exits the curing area.

[0029] The above structure places the upper multi-band irradiation, the surrounding reflected supplementary light and the lower support point irradiation in the same transport path, which can improve the integrity of the ultraviolet irradiation on different surfaces of the dental mold 5 and improve the curing degree of the 3D printed support points, making it easier to remove the support structure 51 later.

[0030] In some embodiments of this application, the chip packaging module on the first board includes a first ultraviolet (UV) light-emitting chip group, a second UV light-emitting chip group, and a third UV light-emitting chip group. The nominal wavelength of the first UV light-emitting chip group is 270nm-280nm, the nominal wavelength of the second UV light-emitting chip group is 305nm-315nm, and the nominal wavelength of the third UV light-emitting chip group is 360nm-370nm. The three UV light-emitting chip groups with different nominal wavelengths are jointly packaged in the same chip packaging module on the first board and distributed in the same light-emitting area.

[0031] Each chip package module 33 on the first board includes a first ultraviolet (UV) light-emitting chip group 331, a second UV light-emitting chip group 332, and a third UV light-emitting chip group 333. The nominal wavelength of the first UV light-emitting chip group 331 is 275 nm, the nominal wavelength of the second UV light-emitting chip group 332 is 310 nm, and the nominal wavelength of the third UV light-emitting chip group 333 is 365 nm.

[0032] Three ultraviolet-emitting chip groups are encapsulated together in the same chip packaging module 33 on the first board and distributed in the same light-emitting area. The three chips are all located in the same light-emitting area, so that the ultraviolet light of each band can be superimposed on each other in the space where the dental mold 5 is located after leaving the chip packaging module 33 on the first board, instead of forming separate isolated single-band irradiation areas.

[0033] When the first ultraviolet light-emitting chip group 331, the second ultraviolet light-emitting chip group 332, and the third ultraviolet light-emitting chip group 333 operate simultaneously, 275nm, 310nm, and 365nm ultraviolet light work together on the dental model resin. Different wavelengths cooperate in terms of resin surface absorption, internal propagation, and edge band response, thus enabling the first ultraviolet light source 3 to have multi-band output capability. Integrating the three wavelengths into the same module also helps to reduce the space occupied by multiple independent light sources and improves the spatial overlap of the light fields of each wavelength.

[0034] In some embodiments of this application, the number of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the chip packaging module on the first board accounts for 35%-45%, 15%-25%, and 35%-45%, respectively, and the power percentage of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the total power of the chip packaging module on the first board accounts for 25%-35%, 10%-20%, and 50%-60%, respectively.

[0035] The chip count ratios of the first ultraviolet-emitting chip group 331, the second ultraviolet-emitting chip group 332, and the third ultraviolet-emitting chip group 333 are 40%, 20%, and 40%, respectively. In specific settings, the chip count ratio of the three chip groups is 2:1:2, and the corresponding total number of chips can be selected according to the rated power and light-emitting area of ​​the chip packaging module 33 on the first board.

[0036] The configuration power ratios of the three ultraviolet light-emitting chip groups are 30%, 15%, and 55%, respectively. The configuration power referred to in this specification refers to the driving power allocated to each chip group under the rated operating conditions of the chip package module 33 on the first board. Because the photoelectric conversion characteristics of chips with different wavelengths and the response of dental resin to corresponding wavelengths are different, the chip quantity ratio and configuration power ratio are not required to be the same.

[0037] This ratio allows the 275nm and 310nm bands to provide short-wave and mid-wave ultraviolet energy, while simultaneously enabling the 365nm band to achieve higher configuration power. The three wavelengths, output in the stated quantity and power ratio, can create a multi-band irradiation environment suitable for secondary curing of dental molds within a limited luminescent area.

[0038] The mirrored aluminum reflector 6 includes a reflector mounting bracket and multiple reflectors. The reflector mounting bracket is located around the irradiation area corresponding to the two first ultraviolet light sources 3, and the multiple reflectors are spaced apart on the reflector mounting bracket circumferentially along the irradiation area. The mirrored reflective surface of each reflector faces the bearing area of ​​the tray 2, and at least some of the reflective surfaces of the reflectors are not parallel to the bearing surface of the tray 2.

[0039] A passageway is maintained between the reflectors for the tray 2 to enter and exit the irradiation area. The reflectors are positioned to avoid the direct light emission path of the first ultraviolet light source 3 and the moving parts of the conveying mechanism 1, so as not to obstruct the transport of the tray 2.

[0040] Part of the ultraviolet light emitted by the first ultraviolet light source 3 directly reaches the dental mold 5, while the other part reaches the reflector plate before directly incident on the dental mold 5. Because the reflective surface of the reflector plate faces the bearing area and has a different spatial orientation than the bearing surface, the reflected ultraviolet light can re-enter the area where the dental mold 5 is located from the side or obliquely. This structure increases the propagation direction of ultraviolet light to the periphery of the dental mold 5, reducing the shading effects of the curved sidewalls, concave parts, and adjacent surfaces of the dental mold.

[0041] Each first ultraviolet light source 3 is mounted on an adjustable bracket. The adjustable bracket includes a height adjustment component 71 and an angle adjustment component 72, specifically including a fixed base, a vertical guide, a lifting base, a rotating base, a horizontal rotating shaft, and a locking rotating shaft.

[0042] The fixed base is connected to the device frame, and the vertical guide is mounted on the fixed base along the height direction. The lifting base is slidably engaged with the vertical guide and can rise or fall along the vertical guide. The rotating base is connected to the lifting base via a horizontal rotating shaft and can rotate around the horizontal rotating shaft. The first ultraviolet light source 3 is fixed on the rotating base. The locking member shaft acts on both the lifting base and the rotating base to fix the height and light emission angle of the first ultraviolet light source 3 after adjustment.

[0043] When adult and pediatric dental molds differ in height, width, or arch dimensions, the locking mechanism can be released first, the lifting seat moved to the appropriate height, and then the rotating seat rotated around the horizontal axis to the appropriate angle. After completion, it can be relocked. By changing the distance between the first ultraviolet light source 3 and the tray 2, and the tilt direction of the light-emitting surface, the direct irradiation range can be matched to dental molds 5 of different sizes, and the reflector can obtain appropriate incident light, which helps improve the irradiation uniformity of dental molds 5 of different sizes.

[0044] The second ultraviolet light source 4 is installed directly below the irradiation gap in the connection area. The light-emitting surface of the second ultraviolet light source 4 is horizontally upward or substantially upward, and is opposite to the lower surface of the tray 2 passing through the connection area.

[0045] The chip packaging module 43 on the second board is composed of a fourth ultraviolet light-emitting chip group, the nominal wavelength of which is 360nm-370nm, and can be selected as 365nm. The light-emitting area of ​​the chip packaging module 43 on the second board corresponds to the through-hole 22 in the carrying area of ​​the tray 2. When the tray 2 passes through the docking area, the orthographic projection of the light-emitting area of ​​the chip packaging module 43 on the second board onto the tray 2 covers the corresponding through-hole 22 in the carrying area.

[0046] The irradiation gap between the first conveyor belt 11 and the second conveyor belt 12 allows the ultraviolet light emitted by the second ultraviolet light source 4 to not need to pass through the conveyor belt. As the tray 2 moves along the conveying direction, the irradiation area of ​​the second ultraviolet light source 4 sweeps across the carrying area relative to the tray 2 from front to back, thereby irradiating the 3D printing support points distributed at the bottom of the dental mold 5. Positioning the second ultraviolet light source 4 below the connection area utilizes the structural space between the two conveyor belts and creates a different bottom irradiation direction from the upper first ultraviolet light source 3.

[0047] The light-transmitting plate 21 of the tray 2 is made of high-transmittance ultraviolet quartz glass. In this embodiment, the solid portion of the light-transmitting plate 21 has an ultraviolet transmittance of not less than 90% for 365nm ultraviolet light. The transmittance is the transmittance of the light-transmitting plate 21 for 365nm ultraviolet light incident from the second ultraviolet light source 4, under the actual plate thickness and surface condition used.

[0048] A through-hole 22 penetrates the light-transmitting plate 21, and the diameter of the through-hole 22 is 10 mm. Multiple through-holes 22 are arranged along a first array direction and a second array direction that are perpendicular to each other. The center-to-center distance between adjacent holes in the first array direction is a, and the center-to-center distance between adjacent holes in the second array direction is b, both of which are 15 mm, thus forming a regular two-dimensional through-hole array.

[0049] After the ultraviolet light emitted by the second ultraviolet light source 4 reaches the lower surface of the tray 2, part of the ultraviolet light is transmitted through the solid part of the light-transmitting plate 21, while the other part passes directly through the through hole 22. Because quartz glass itself has high ultraviolet transmittance, even if the 3D-printed support point is not perfectly aligned with the through hole 22, ultraviolet irradiation can still be obtained through the light-transmitting plate 21; the through hole 22 further forms a direct light path with minimal attenuation. The combined effect of these two light paths helps to improve the continuity and spatial coverage of bottom illumination within the load-bearing area of ​​the tray 2.

[0050] The first ultraviolet light source 3 includes a first front cover 31, a front cover lens 32, a first on-board chip packaging module 33, a first heat dissipation body 34, a rear cover 35, a first water outlet connector 36, a first electrical connector 37, a handle 38, and a first water inlet connector 39.

[0051] A first front cover 31 is mounted on the light-emitting side of the first heat sink 34, and a rear cover 35 is mounted on the backlight side of the first heat sink 34. A front cover lens 32 is disposed at the light-emitting port of the first front cover 31, and a chip packaging module 33 on the first board is located between the front cover lens 32 and the first heat sink 34. The front cover lens 32 is used to protect the chip packaging module 33 on the first board and to transmit or shape the light field emitted from it.

[0052] The back of the chip packaging module 33 on the first board is in thermal contact with the first heat sink 34. A first electrical connector 37 is electrically connected to the chip packaging module 33 on the first board for connecting to a driving power supply. The first heat sink 34 has a cooling channel inside, and a first water inlet connector 39 and a first water outlet connector 36 are respectively connected to both ends of the cooling channel. Cooling water enters the cooling channel through the first water inlet connector 39, exchanges heat with the first heat sink 34, and then flows out through the first water outlet connector 36. A handle 38 is provided on the rear cover 35 for easy installation, removal, and angle adjustment of the first ultraviolet light source 3.

[0053] The heat generated by the three ultraviolet light-emitting chips with different wavelengths during operation is transferred to the first heat dissipation body 34 via the chip packaging module 33 on the first board, and then carried away by circulating cooling water. The water-cooled packaging structure can reduce the operating temperature fluctuation of the chip packaging module 33 on the first board, which is conducive to maintaining the stable output of ultraviolet light in each wavelength band, and makes the first ultraviolet light source 3 suitable for continuous delivery curing operations.

[0054] The second ultraviolet light source 4 includes a second front cover 41, a front cover glass 42, a chip packaging module 43 on the second board, a second heat dissipation body 44, a second water outlet connector 45, a second electrical connector 46, and a second water inlet connector 47.

[0055] The second front cover 41 is disposed on the light-emitting side of the second heat sink 44, and the front cover glass 42 is mounted at the light-emitting port of the second front cover 41. The chip packaging module 43 on the second board is disposed between the front cover glass 42 and the second heat sink 44, and its back side is in thermal contact with the second heat sink 44. The second electrical connector 46 is electrically connected to the chip packaging module 43 on the second board.

[0056] The second heat dissipation body 44 has a cooling channel inside. The second water inlet connector 47 and the second water outlet connector 45 are respectively connected to the cooling channel to form a circulating cooling water path. When the second ultraviolet light source 4 is installed below the connection area, the front cover glass 42 faces upward and protects the chip packaging module 43 on the second board.

[0057] The heat generated by the chip packaging module 43 on the second board is transferred to the circulating cooling water via the second heat dissipation body 44. This structure enables the second ultraviolet light source 4 to maintain stable operation within the limited installation space below the connection area and reduces the impact of temperature rise on the 365nm ultraviolet output during continuous irradiation.

[0058] When using the above-mentioned device to solidify the dental mold 5, the 3D printed dental mold 5 is first subjected to ultrasonic cleaning with alcohol to remove residual liquid resin on the surface, grooves and near the support structure 51 of the dental mold 5.

[0059] After cleaning, the dental mold 5 is supported on the carrying area of ​​the tray 2 by the support structure 51. The 3D printed support points in the support structure 51 are located between the bottom of the dental mold 5 and the light-transmitting plate 21. The tray 2 is placed on the first conveyor belt 11 and is conveyed by the first conveyor belt 11 along the conveying direction.

[0060] Based on the external dimensions of the dental mold 5, release the locking mechanism of the adjustable bracket, adjust the position of the lifting seat and the rotation angle of the rotating seat so that the two first ultraviolet light sources 3 are at heights and emission angles adapted to the dental mold 5, and then relock them.

[0061] The tray 2 passes sequentially through two first ultraviolet light sources 3. The two first ultraviolet light sources 3 emit at least two different nominal wavelengths of ultraviolet light, irradiating the top and periphery of the dental mold 5. Some of the ultraviolet light that does not directly reach the dental mold 5 is incident on the mirror aluminum reflector 6, reflected by the reflector plate, and re-enters the bearing area, irradiating the dental mold 5 from the side or at an angle.

[0062] When tray 2 enters the connection area via the first conveyor belt 11, the second ultraviolet light source 4, located below the irradiation gap, emits 365nm ultraviolet light upwards. After passing through the irradiation gap, part of this ultraviolet light is transmitted through the light-transmitting plate 21, and the other part passes directly through the through hole 22 through tray 2, irradiating the 3D printing support point from the bottom of the dental mold 5.

[0063] By arranging upper multi-band irradiation, mirror aluminum reflective supplementary lighting, and lower 365nm irradiation in the same transport process, the main body of the dental mold 5 and the bottom support structure 51 can each obtain ultraviolet irradiation adapted to their respective positions. After the support structure 51 has cured, the 3D printed support points can be removed, allowing the dental mold 5 to separate from the tray 2.

[0064] In one curing configuration, the effective absorption band of the 3D printed dental model resin is 230nm–360nm. The two first ultraviolet light sources 3 adopt a combination of three nominal wavelengths: 275nm, 310nm, and 365nm, and the second ultraviolet light source 4 adopts a fourth ultraviolet light-emitting chip with a nominal wavelength of 365nm.

[0065] The so-called effective absorption band refers to the main effective absorption range of the resin, and does not mean that the resin has no photochemical response outside the edge of this range. 365nm is the nominal center wavelength of the ultraviolet light-emitting chip, and the actual emitted light has a corresponding spectral width, which can match the response of the resin at the long-wavelength edge. 275nm and 310nm are located within the effective absorption band, and 365nm constitutes the long-wave ultraviolet irradiation portion.

[0066] In this configuration, the main curing light source for the dental model 5 consists of two first ultraviolet light sources 3 and one second ultraviolet light source 4, and ultraviolet mercury lamps are not required in the curing path. The multi-band first ultraviolet light source 3 provides the composite ultraviolet environment required for the curing of the dental model body, while the second ultraviolet light source 4 provides supplementary irradiation to the bottom support structure 51, thereby enabling the UVLED light source to undertake the secondary curing task of the dental model.

[0067] To verify the curing effect of this device, an EIT UV Power Puck II energy meter was used for testing at a conveyor belt speed of 10 mm / s. The test consisted of two stages: the first stage simulated direct top curing in existing technologies, and the second stage was a composite light curing process using the combined action of the first and second UV light sources of this device. The test results are as follows: In the UV-LED curing stage, the irradiance of the UVA, UVB, and UVC bands were 2.234 W / cm², 0.581 W / cm², and 0.208 W / cm², respectively, with total energies of 22.032 J / cm², 5.529 J / cm², and 1.991 J / cm², respectively. In the UVLED curing stage, the irradiance of the UVA, UVB, and UVC bands were 15.139 W / cm², 0.340 W / cm², and 0.266 W / cm², respectively, with total energies of 62.928 J / cm², 1.555 J / cm², and 1.148 J / cm², respectively, and the total cumulative energy across all bands reached 85.183 J / cm². See the table below.

[0068] As can be seen, this device, through the multi-band high-power output of the first ultraviolet light source, increases the irradiance of the UVA band to nearly 7 times that of traditional solutions, ensuring that the dental mold body can be deeply cured in a single pass. At the same time, since the second ultraviolet light source is located below the connection area, the ultraviolet light shines through the light-transmitting area of ​​the tray to the support structure, which redistributes the UVC band energy in different areas. This effectively compensates for the dead corners that the top light source cannot illuminate due to the dental mold, thereby significantly reducing the residual stress at the support point and improving the demolding yield.

[0069]

[0070] The conveying speeds of the first conveyor belt 11 and the second conveyor belt 12 can be determined based on the target irradiation dose required for the dental model resin, the irradiance of the first ultraviolet light source 3, and the effective irradiation length.

[0071] For any wavelength band, the irradiation dose received by the dental model 5 can be expressed as the integral of the irradiance of that wavelength band over time. When the irradiance variation is small, the irradiation dose can be set as the product of the average irradiance and the irradiation time. If the effective irradiation length of a single first ultraviolet light source 3 along the transport direction is L, and the transport speed is v, then the approximate irradiation time of the dental model 5 through the first ultraviolet light source 3 is the ratio of L to v. The irradiation doses of the same wavelength band generated by two first ultraviolet light sources 3 can be accumulated.

[0072] In actual production, the target dose for each wavelength band can be determined first based on the curing requirements of the resin used. Then, by adjusting the driving power, effective irradiation length, or delivery speed of the first ultraviolet light source 3, the dental model 5 can obtain the required dose in one delivery process. This setting method can establish a correspondence between delivery speed and irradiance, reducing under-curing or repeated delivery caused by operating at a fixed speed alone.

[0073] The first ultraviolet light source 3 and the second ultraviolet light source 4 can operate continuously or be activated and deactivated in conjunction with the position of the tray 2. In the linkage control mode, position detectors can be installed upstream of the first conveyor belt 1 and in the connecting area, and the position detectors are connected to the controllers of the first ultraviolet light source 3 and the second ultraviolet light source 4. After the first position detector 81, located upstream of the first conveyor belt 1, detects the leading edge of the tray 2, the controller activates the first ultraviolet light source 3 when the tray 2 is about to reach below it, based on the preset length of the tray 2 and the conveying speed. After the second position detector 82, located upstream of the connecting area, detects the leading edge of the tray 2, the controller activates the second ultraviolet light source 4 when the tray 2 is about to reach the connecting area. When the bearing area of ​​the tray 2 completely leaves the irradiation range of the second ultraviolet light source 4, the controller shuts down or reduces the output of the first ultraviolet light source 3 and the second ultraviolet light source 4.

[0074] The conveying speed can also be detected by an encoder connected to the first belt 11 or the second belt 12. The controller determines the position of the tray 2 relative to the irradiation gap based on the displacement pulses output by the encoder, and controls the first ultraviolet light source 3 and the second ultraviolet light source 4 accordingly.

[0075] This linkage method ensures that the 365nm ultraviolet light is mainly output when the tray 2 and the support structure 51 pass through the connection area, which can reduce ineffective irradiation in the trayless state and reduce the continuous heat load of the second ultraviolet light source 4 and the cooling system.

[0076] In the aforementioned basic structure and process, the dental mold 5, after undergoing alcohol ultrasonic cleaning, is supported on a quartz glass tray 2 via a support structure 51 and moves towards the docking area along the first conveyor belt 11. Two first ultraviolet light sources 3 irradiate the dental mold 5 with multi-band light according to the transport sequence. A mirrored aluminum reflector 6 reflects some of the ultraviolet light deviating from the dental mold 5 to the periphery of the mold. After the tray 2 reaches the docking area, a second ultraviolet light source 4 emits 365nm ultraviolet light from below, irradiating the 3D printing support points through the irradiation gap, the light-transmitting plate 21, and the through-hole 22. Both the first ultraviolet light source 3 and the second ultraviolet light source 4 employ water-cooling structures to dissipate the heat generated by the chip packaging module on the board during operation.

[0077] Therefore, the dental mold body and support structure can receive ultraviolet irradiation from above, around, and below within the same continuous transport path, reducing the obstruction area caused by single-above irradiation and minimizing the need to repeatedly pass through the curing area due to insufficient effective irradiation. After the bottom support points receive ultraviolet irradiation, it is beneficial to control the subsequent removal process and reduce the adverse effects of support point removal on the quality of the bottom of the dental mold. Those skilled in the art will understand that the steps, measures, and schemes in the various operations, methods, processes, and procedures discussed in this application can be alternated, modified, rearranged, decomposed, combined, or deleted.

[0078] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Any other corresponding changes and modifications made based on the technical concept of this application should be included within the scope of protection of the claims of this application.

Claims

1. A dental mold curing device based on multi-band ultraviolet light source curing, characterized in that, include: The conveying mechanism includes a first belt line and a second belt line that are connected along the conveying direction, and a connection area is formed between the first belt line and the second belt line. A tray supports a dental mold and a supporting structure. The supporting structure is located between the dental mold and the tray. The tray includes a light-transmitting plate and through holes that penetrate the light-transmitting plate and are evenly distributed in an array. The light-transmitting plate and the through holes together constitute a light-transmitting area. The first curing component includes at least two first ultraviolet light sources arranged sequentially above the first belt along the conveying direction. Each first ultraviolet light source includes a first on-board chip package module with at least two ultraviolet light emission chip groups of different wavelengths. The light emission directions of the two first ultraviolet light sources are directed toward the top and periphery of the dental mold. as well as The second curing component includes a second ultraviolet light source disposed below the connection area, with its light-emitting surface facing upwards, and irradiates the support structure through the light-transmitting area of ​​the tray.

2. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, The chip packaging module on the first board includes a first ultraviolet (UV) light-emitting chip group, a second UV light-emitting chip group, and a third UV light-emitting chip group. The nominal wavelength of the first UV light-emitting chip group is 270nm-280nm, the nominal wavelength of the second UV light-emitting chip group is 305nm-315nm, and the nominal wavelength of the third UV light-emitting chip group is 360nm-370nm. The three UV light-emitting chip groups with different nominal wavelengths are packaged together on the same chip packaging module on the first board and distributed in the same light-emitting area.

3. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 2, characterized in that, The number proportions of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the chip packaging module on the first board are 35%-45%, 15%-25%, and 35%-45%, respectively. The power proportions of the first ultraviolet light-emitting chip group, the second ultraviolet light-emitting chip group, and the third ultraviolet light-emitting chip group in the total power of the chip packaging module on the first board are 25%-35%, 10%-20%, and 50%-60%, respectively.

4. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, A mirrored aluminum reflector is provided around the irradiation area of ​​the two first ultraviolet light sources. The mirrored aluminum reflector is arranged around the irradiation area corresponding to the two first ultraviolet light sources, and the reflective surface of the mirrored aluminum reflector faces the dental mold on the tray.

5. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, Two of the first ultraviolet light sources are mounted above the first belt via an adjustable bracket. The adjustable bracket includes a height adjustment component and an angle adjustment component, which are used to adjust the height and light emission direction of the first ultraviolet light sources, respectively.

6. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, The second ultraviolet light source is located directly below the docking area, with its light-emitting surface facing the lower surface of the tray passing through the docking area. The size of the light-emitting area of ​​the second ultraviolet light source in the horizontal direction is not less than the width of the tray in the direction perpendicular to the conveying direction. The second ultraviolet light source includes a chip packaging module on a second board, and the nominal wavelength of the fourth ultraviolet light-emitting chip group on the chip packaging module on the second board is 360nm-370nm.

7. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, The ultraviolet transmittance of the solid part of the light-transmitting plate is not less than 90%, and the through holes are arranged in a first array direction and a second array direction that are perpendicular to each other. The center-to-center spacing of the holes in the first array direction is equal to that in the second array direction.

8. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 1, characterized in that, The first ultraviolet light source includes a first front cover, a front cover lens, a chip packaging module on the first board, a first heat dissipation body, a rear cover, a first electrical connector, a handle, a first water inlet connector, and a first water outlet connector. The first front cover and the rear cover are respectively disposed on the light-emitting side and the backlight side of the first heat dissipation body. The front cover lens is disposed at the light-emitting port of the first front cover. The chip packaging module on the first board is disposed between the front cover lens and the first heat dissipation body, and is in thermal contact with the first heat dissipation body and electrically connected to the first electrical connector. The first heat dissipation body is provided with a cooling channel, which is connected to the first water inlet connector and the first water outlet connector. The handle is disposed on the rear cover.

9. The dental mold curing device based on multi-band ultraviolet light source curing according to claim 6, characterized in that, The second ultraviolet light source includes a second front cover, a front cover glass, a chip packaging module on the second board, a second heat dissipation body, a second electrical connector, a second water inlet connector, and a second water outlet connector. The front cover glass is disposed at the light outlet of the second front cover. The chip packaging module on the second board is disposed between the front cover glass and the second heat dissipation body, and is in thermal contact with the second heat dissipation body and electrically connected to the second electrical connector, respectively. The second heat dissipation body is provided with a cooling channel, which is connected to the second water inlet connector and the second water outlet connector, respectively.

10. A method for curing dental molds based on multi-band ultraviolet light sources, characterized in that, The dental mold curing device based on multi-band ultraviolet light source curing as described in any one of claims 1 to 9 includes the following steps: The 3D-printed dental mold was ultrasonically cleaned with alcohol to remove residual liquid resin from its surface. The cleaned dental mold is supported on the tray by the support structure and transported along the conveying direction by the conveying mechanism; The dental model is passed sequentially through two of the first ultraviolet light sources, and the top and periphery of the dental model are irradiated with ultraviolet light of at least two different wavelengths; and As the tray passes through the connection area between the first belt conveyor and the second belt conveyor, a second ultraviolet light source located below the connection area emits ultraviolet light upwards, which illuminates the support structure through the light-transmitting area of ​​the tray.

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