A kind of independent double-temperature-zone semiconductor partition vehicle-mounted cooling and heating box and automobile

Abstract

This invention relates to the field of automotive technology and discloses an independent dual-temperature zone semiconductor partition vehicle-mounted refrigerator / heater and vehicle. The refrigerator includes an inner liner, a main heat exchange system on the front side of the inner liner, and an auxiliary heat exchange system on the inner side. The auxiliary heat exchange system includes a semiconductor partition assembly disposed within the inner liner cavity, dividing the inner liner cavity into a first cavity and a second cavity. An auxiliary heat exchange semiconductor chip is integrated within the semiconductor partition assembly. Powering the auxiliary heat exchange semiconductor chip achieves a temperature difference between the first and second cavities on either side of the semiconductor partition assembly. This invention improves the space utilization of the dual-temperature zone refrigerator by integrating the heat exchange unit that controls temperature zone changes into the interior of the dual-temperature zone partition, while also avoiding the waste of condenser heat dissipation energy in the refrigeration system. This achieves efficient utilization of internal system energy and significantly reduces overall energy consumption under the dual-temperature zone differentiated temperature control mode.

Description

Technical Field

[0001] This invention relates to the field of automotive technology, and in particular to an independent dual-temperature zone semiconductor partition vehicle-mounted hot and cold box and a vehicle. Background Technology

[0002] As users increasingly demand refrigerated storage and heated items in their vehicles, in-vehicle refrigerators are becoming increasingly important. Currently, dual-temperature-zone in-vehicle refrigerators achieve cooling and heating functions separately through evaporators and heating films. When both cooling and heating functions are activated simultaneously, the two temperature zones operate independently, resulting in high energy consumption and inefficient utilization of condenser heat dissipation during cooling. Therefore, existing in-vehicle refrigerators, in order to achieve a dual-cavity, two-temperature-zone mode, must consume electricity to activate both the heating system to heat the high-temperature zone and the cooling system to cool the low-temperature zone. These two systems operate independently, failing to utilize waste heat from the cooling system, leading to high energy consumption. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the purpose of this invention is to provide an independent dual-temperature zone semiconductor partition vehicle-mounted hot and cold box and automobile to solve the above problems.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: In the first aspect, an independent dual-temperature zone semiconductor partition vehicle-mounted cooling and heating box includes an inner liner, a main heat exchange system is provided on the front side of the inner liner, and an auxiliary heat exchange system is provided on the inner side. The main heat exchange system includes a liquid storage tank, a TEC semiconductor patch and a turbulence fan arranged in sequence, and the turbulence fan enables the inner liner cavity to be cooled or heated simultaneously. The auxiliary heat exchange system includes a semiconductor partition assembly, which is located in the inner cavity and divides the inner cavity into a first cavity and a second cavity. An auxiliary heat exchange semiconductor chip is integrated in the semiconductor partition assembly. The auxiliary heat exchange semiconductor chip is energized to achieve the temperature difference between the first cavity and the second cavity on both sides of the semiconductor partition assembly.

[0005] As a further implementation, the vehicle-mounted hot and cold box includes an outer shell, with the inner liner disposed within the outer shell, and the liquid storage tank, TEC semiconductor patch, and turbulence fan disposed in the outer shell cavity outside the inner liner; One set of turbulence fans is installed in the main heat exchange system; Alternatively, two sets of turbulence fans can be installed, each corresponding to one of the two cavities of the inner liner.

[0006] As a further implementation, the liquid storage tank is connected to the vehicle's cryogenic cooling system via inlet and outlet water pipes, and the cryogenic cooling system provides cooling water to achieve heat exchange. The TEC semiconductor patch is attached to the outer surface of the liquid storage tank. Its water side is in direct contact with the coolant in the tank for heat exchange, and its air side is close to the turbulence fan for heat exchange with the flowing air.

[0007] As a further implementation, the inner liner is provided with an air intake grille at the top and an exhaust grille at the bottom. The air intake grille and the exhaust grille are arranged at corresponding positions in the first cavity and the second cavity, so as to realize the synchronous temperature control of the first cavity and the second cavity by the main heat exchange system.

[0008] As a further implementation, the position of the air intake grille corresponds to the position of the spoiler fan, and the TEC semiconductor patch is disposed between the spoiler fan and the exhaust grille.

[0009] As a further implementation, the semiconductor separator assembly includes a semiconductor separator, a connecting wire harness integrated within the semiconductor separator, an auxiliary heat exchange wire harness connector integrated at the bottom, and the connecting wire harness connecting the auxiliary heat exchange wire harness connector and the auxiliary heat exchange semiconductor chip.

[0010] As a further implementation, the bottom of the inner liner is provided with a wire harness socket. After the semiconductor partition assembly is installed, the wire harness socket and the auxiliary heat exchange wire harness connector are connected to allow power to be supplied to the auxiliary heat exchange semiconductor chip.

[0011] As a further implementation, the semiconductor partition is detachably connected to the inner liner; The inner liner has grooves on opposite sides, and the semiconductor partition slides into the grooves for installation.

[0012] As a further implementation, the inner liner has a top door panel for both heating and cooling.

[0013] Secondly, an automobile is provided with an on-board heating and cooling box as described above, wherein the on-board heating and cooling box controls the temperature difference between the first chamber and the second chamber through an auxiliary heat exchange system.

[0014] The beneficial effects of the present invention are as follows: 1. The semiconductor partition assembly of the present invention is disposed in the inner cavity, dividing the inner cavity into a first cavity and a second cavity. An auxiliary heat exchange semiconductor chip is integrated within the semiconductor partition assembly. Utilizing the semiconductor Peltier effect, the temperature difference between the two semiconductor electrodes replaces the heat exchanger, achieving temperature regulation between the two cavities, improving energy utilization, and reducing energy consumption. By integrating the heat exchange unit controlling temperature zone changes into the partition between the two temperature zones, the space utilization of the two-temperature-zone refrigerator is improved, and the waste of condenser heat dissipation energy in the refrigeration system is avoided, achieving efficient utilization of internal system energy and significantly reducing overall energy consumption under the dual-temperature-zone differentiated temperature control mode. When a single cooling or heating mode is selected, the main heat exchange system is activated, enabling simultaneous cooling or heating of both cavities within the refrigerator. When any two modes—refrigeration, preservation, or heating—are selected, the embedded auxiliary heat exchange system is activated, achieving cold and hot zone separation in the refrigerator and saving energy.

[0015] 2. The semiconductor partition assembly and inner liner of the present invention are designed to be detachable. If there are no temperature zone requirements, the partition can be removed to maximize the internal volume of the refrigerator and to flexibly adjust the internal volume of the cold and warm box, so as to meet the storage needs of multiple scenarios and further improve the practicality and adaptability of the product.

[0016] 3. This invention integrates the auxiliary heat exchange semiconductor chip, connecting wire harness, and auxiliary heat exchange wire harness connector inside the semiconductor partition assembly, so that the heat exchange unit that realizes temperature zone regulation and the partition structure that separates the two temperature zones are combined into one. There is no need to arrange additional heating film or independent evaporator on the outside of the inner liner, which effectively improves the space utilization of the vehicle-mounted cold and warm box, reduces the number of system components, simplifies the overall structure, and reduces manufacturing costs and system complexity.

[0017] 4. The liquid storage tank of the present invention is connected to the vehicle's low-temperature cooling system through inlet and outlet water pipes, and uses the vehicle's existing cooling water circulation to realize heat exchange on the water side of the TEC semiconductor chip, eliminating the need to configure a separate external heat dissipation device for the vehicle's in-vehicle heat exchanger, thus reducing system costs and installation space requirements.

[0018] 5. The TEC semiconductor patch controls the air-side to be either cold or hot by forward or reverse energization. Combined with the airflow circulation created by the turbulence fan, it can flexibly achieve cooling or heating functions within the inner cavity. When the auxiliary heat exchange system works in conjunction with the main heat exchange system, it can achieve multiple operating modes, including single cooling, single heating, cold / hot zoning, refrigeration / preservation zoning, and mode switching, meeting users' temperature control needs in different usage scenarios. Furthermore, during mode switching, the auxiliary heat exchange semiconductor patch can quickly adjust the temperature of both cavities, shortening the time to reach the set temperature and improving the user experience. Attached Figure Description

[0019] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0020] Figure 1 This is a schematic diagram of the overall structure of the semiconductor partition vehicle-mounted hot and cold box in an embodiment of the present invention; Figure 2 This is a schematic cross-sectional view of the semiconductor separator vehicle-mounted hot and cold box in an embodiment of the present invention; Figure 3 This is a top view of the semiconductor separator vehicle-mounted hot and cold box in an embodiment of the present invention; Figure 4 This is a schematic diagram of the semiconductor separator assembly in an embodiment of the present invention.

[0021] The diagram exaggerates the spacing or dimensions between parts to show their positions; the diagram is for illustrative purposes only.

[0022] The components include: 1. Vehicle-mounted refrigerator / heater box; 11. Refrigerator / heater box door panel; 12. Refrigerator / heater box shell frame assembly; 121. Front frame; 122. Middle frame; 123. Rear frame; 13. ECU controller; 14. Inlet / outlet water pipes; 15. Liquid storage tank; 16. TEC semiconductor patch; 17. Connecting wiring harness; 18. Baffle fan; 19. Semiconductor partition assembly; 110. Inner liner; 111. Wiring harness socket; 191. Auxiliary heat exchange semiconductor chip; 192. Semiconductor partition; 193. Auxiliary heat exchange wiring harness; 194. Auxiliary heat exchange wiring harness connector; 21. First cavity; 22. Second cavity. Detailed Implementation

[0023] It should be noted that the following detailed description is illustrative and intended to provide further explanation of the invention. Unless otherwise specified, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0024] Example 1 In a typical embodiment of the present invention, reference is made to Figures 1-4 As shown, an independent dual-temperature zone semiconductor partition vehicle-mounted cooling and heating box 1 includes a cooling and heating box shell frame assembly 12, an inner liner 110, a cooling and heating box door panel 11, a main heat exchange system, and an auxiliary heat exchange system.

[0025] The cold and warm box shell frame assembly 12 is the external frame support structure of the vehicle-mounted cold and warm box. It is composed of three parts: front frame 121, middle frame 122 and rear frame 123, which are sequentially spliced ​​together. The front frame 121, middle frame 122 and rear frame 123 are connected in sequence to form the overall frame of the box. The frame is covered with an outer shell plate, and the frame contains the inner liner 110 and related heat exchange components.

[0026] The inner liner 110 is supported inside the refrigerator shell frame assembly 12. Insulating foam material is filled between the inner liner 110 and the refrigerator shell frame assembly 12 to reduce heat exchange between the inner liner cavity and the external environment, thereby improving insulation performance. A refrigerator door panel 11 is hinged to the top opening of the inner liner 110. The refrigerator door panel 11 can be opened or closed for accessing items inside the inner liner 110.

[0027] The main heat exchange system is located inside the vehicle-mounted heat exchange box 1 and is located in front of the inner liner 110. The vehicle-mounted heat exchange box includes an outer shell and the inner liner is located inside the outer shell.

[0028] The main heat exchange system is located within the outer shell cavity formed between the front side wall of the inner liner 110 and the front frame 121 of the outer shell. The main heat exchange system includes a liquid storage tank 15, a TEC semiconductor patch 16, a turbulence fan 18, inlet and outlet water pipes 14, and corresponding connecting harnesses 17.

[0029] The coolant reservoir 15 is a rectangular or cylindrical sealed container that holds coolant. The reservoir 15 is connected to an inlet pipe and an outlet pipe, which together form the inlet / outlet pipe 14. The inlet / outlet pipe 14 passes through the front frame 121 of the outer shell and extends to the outside of the vehicle's insulated / cooled compartment, connecting to the vehicle's low-temperature cooling system. The low-temperature cooling system provides cooling water for heat exchange. Specifically, the coolant in the vehicle's low-temperature cooling system circulates within the reservoir 15 through the inlet / outlet pipe 14, carrying away or replenishing heat, thus achieving heat exchange between the reservoir 15 and the vehicle's cooling system.

[0030] The TEC semiconductor patch 16 is a thermoelectric cooling chip with a flat rectangular plate structure. It is attached to the outer surface of the coolant reservoir 15, with one side of the patch close to the reservoir 15 being the water side and the other the air side. Heat exchange fins are provided on the air side of the TEC semiconductor patch 16. The water side of the TEC semiconductor patch 16 is tightly attached to the outer surface of the reservoir 15, and good thermal contact is formed between the water side and the outer wall of the reservoir 15 through thermal grease or a thermal pad, enabling efficient heat exchange between the water side of the TEC semiconductor patch 16 and the coolant inside the reservoir 15.

[0031] The airflow side of the TEC semiconductor patch 16 faces the inner liner 110, and a certain gap is left between the airflow side and the baffle fan 18 to form an airflow channel, allowing for convection heat exchange between the airflow side and the flowing air. The baffle fan 18 is an axial fan or a centrifugal fan, and it is higher than the TEC semiconductor patch 16. The baffle fan 18 can be fixed to the front wall of the inner liner 110 using appropriate mounting brackets or fasteners.

[0032] The air inlet of the deflector fan 18 faces the side of the TEC semiconductor patch 16, and the air outlet faces the inner liner 110. Both the TEC semiconductor patch 16 and the deflector fan 18 are electrically connected to the ECU controller 13 via the connecting harness 17. The ECU controller 13 is installed in an appropriate position within the cold and warm box housing frame assembly 12 and is used to control the energizing direction and voltage of the TEC semiconductor patch 16, as well as to control the start, stop, and speed of the deflector fan 18.

[0033] The inner liner 110 has an air intake grille on its top front side, which is a combination of multiple through holes or strip-shaped holes. The position of the air intake grille corresponds to the air outlet position of the spoiler fan 18. The inner liner 110 also has an exhaust grille on its bottom front side, which is also a combination of multiple through holes or strip-shaped holes. The exhaust grille is located below the side of the TEC semiconductor patch 16. The air intake grille and exhaust grille penetrate the front sidewall of the inner liner 110, forming an airflow channel between the internal cavity of the inner liner 110 and the front cavity on the outer sidewall of the inner liner 110.

[0034] In an optional example, only one set of the main heat exchange system, consisting of the liquid storage tank 15, the TEC semiconductor patch 16, and the turbulence fan 18, is provided. This single set of main heat exchange systems enables simultaneous cooling and heating of the first cavity 21 and the second cavity 22 of the inner liner 110.

[0035] In another optional example, two sets of baffle fans 18 are provided, with each set corresponding to one of the two cavities of the inner liner. By setting two sets of baffle fans 18, the temperature of the corresponding cavity can be controlled independently.

[0036] Understandably, whether one or two sets of spoiler fans 18 are provided can be determined by technical personnel based on relevant requirements. Understandably, each set of spoiler fans 18 is correspondingly installed with the air intake grille.

[0037] The main heat exchange system works as follows: When cooling is required for the inner liner 110 cavity, the ECU controller 13 controls the TEC semiconductor patch 16 to be energized in the forward direction. At this time, the air-side of the TEC semiconductor patch 16 is the cold end, and the water-side is the hot end. The turbulence fan 18 starts and rotates, forming a negative pressure zone near the air-side of the TEC semiconductor patch 16, drawing in the cold air generated by the cold end of the air-side of the TEC semiconductor patch 16. After being accelerated by the turbulence fan 18, the cold air is blown into the inner cavity of the inner liner 110 through the air intake grille at the top of the inner liner 110. The cold air exchanges heat with the stored items and the inner wall of the cavity in the inner cavity of the inner liner 110, absorbing heat and increasing in temperature, becoming hot air. The hot air sinks naturally in the inner cavity of the inner liner 110 or flows downward under the negative pressure of the fan, and is discharged from the exhaust grille at the bottom of the inner liner 110, returning to the front cavity on the outer side of the front wall of the inner liner 110. Due to the presence of the negative pressure zone, the exhausted hot air flows upward through the cold end surface of the air side of the TEC semiconductor patch 16 and is cooled again. This cycle repeats continuously, achieving continuous cooling of the inner liner 110 cavity.

[0038] Meanwhile, the heat generated by the hot end of the water side of the TEC semiconductor patch 16 is transferred to the coolant in the reservoir 15. After the coolant temperature rises, it flows back to the vehicle's low-temperature cooling system through the inlet and outlet water pipes 14. The radiator of the vehicle's cooling system dissipates the heat to the outside environment. The cooled coolant then flows back into the reservoir 15, completing the water-side heat exchange cycle.

[0039] When heating of the inner liner 110 cavity is required, the ECU controller 13 controls the TEC semiconductor patch 16 to be energized in reverse. At this time, the air-side of the TEC semiconductor patch 16 becomes the hot end, and the water-side becomes the cold end. The turbulence fan 18 starts and rotates, forming a negative pressure zone near the air-side of the TEC semiconductor patch 16, drawing in the hot air generated by the hot end of the air-side of the TEC semiconductor patch 16. After being accelerated by the turbulence fan 18, the hot air is blown into the inner cavity of the inner liner 110 through the air intake grille at the top of the inner liner 110. The hot air exchanges heat with the stored items and the inner wall of the cavity in the inner cavity of the inner liner 110, releasing heat and lowering its temperature to become cooler air. The cooler air naturally sinks in the inner cavity of the inner liner 110 or flows downward under the negative pressure of the fan, and is discharged from the exhaust grille at the bottom of the inner liner 110, returning to the front cavity on the outer side of the front wall of the inner liner 110. The cooler air that is discharged flows over the hot end surface of the wind side of the TEC semiconductor patch 16 and is heated again. This cycle repeats to achieve continuous heating of the inner liner 110 cavity.

[0040] Meanwhile, the water-side cold end of the TEC semiconductor patch 16 absorbs heat from the coolant in the reservoir 15. After the coolant temperature drops, it flows back to the vehicle's low-temperature cooling system through the inlet and outlet water pipes 14. The heat generated by other heat sources in the vehicle's low-temperature cooling system (such as batteries, motors, etc.) can be added to the coolant, causing the coolant temperature to rise again and flow back into the reservoir 15, completing the water-side heat exchange cycle. In this embodiment, the inner chamber is simultaneously cooled or heated by a turbulence fan.

[0041] like Figures 2-4 As shown, the auxiliary heat exchange system is located inside the cavity of the inner liner 110. The auxiliary heat exchange system includes a semiconductor partition assembly 19. The semiconductor partition assembly 19 includes a semiconductor partition 192, an auxiliary heat exchange semiconductor chip 191, an auxiliary heat exchange wiring harness 193, and an auxiliary heat exchange wiring harness connector 194.

[0042] The semiconductor separator 192 is a rectangular or nearly rectangular plate structure, and its external dimensions are adapted to the cross-sectional dimensions of the internal cavity of the inner liner 110, such as... Figure 2 As shown. The semiconductor separator 192 is vertically disposed in the internal cavity of the inner liner 110, dividing the internal cavity of the inner liner 110 into two independent sub-cavities on the left and right sides. The two independent sub-cavities are defined as the first cavity 21 and the second cavity 22.

[0043] It is understandable that the semiconductor separator 192 is made of a material with good thermal insulation properties, such as polyurethane foam, polystyrene foam or vacuum insulation board, in order to reduce heat conduction between the first cavity 21 and the second cavity 22.

[0044] Two auxiliary heat exchange semiconductor plates 191 are embedded inside the semiconductor separator 192. These plates are arranged vertically or horizontally within the semiconductor separator 192; in this embodiment, they are arranged horizontally. The two auxiliary heat exchange semiconductor plates 191 are positioned in the middle region of the semiconductor separator 192, such that their two sides are close to the first cavity 21 and the second cavity 22, respectively. One side of the auxiliary heat exchange semiconductor plate 191 faces the first cavity 21, and the other side faces the second cavity 22.

[0045] The auxiliary heat exchange semiconductor chip 191 is provided with thermal grease or thermal pads on both sides so that the two sides of the auxiliary heat exchange semiconductor chip 191 can exchange heat with the air in the first cavity 21 and the second cavity 22 respectively. It can be understood that the area where the semiconductor partition 192 is arranged for the auxiliary heat exchange semiconductor chip 191 has good heat exchange capacity.

[0046] The auxiliary heat exchange harness 193 is a wire harness, one end of which is connected to the electrode terminals of the two auxiliary heat exchange semiconductor chips 191 respectively, and the other end is connected to the auxiliary heat exchange harness socket 194.

[0047] The auxiliary heat exchange harness 193 is arranged inside the semiconductor partition 192 along the internal channel or groove of the partition, and the auxiliary heat exchange harness 193 is led out from the bottom of the semiconductor partition 192. The auxiliary heat exchange harness socket 194 is an electrical connection socket, which is fixedly installed at the middle position of the bottom edge of the semiconductor partition 192, and the socket of the auxiliary heat exchange harness socket 194 faces downward.

[0048] A wiring harness socket 111 is provided on the bottom inner wall of the inner liner 110 at the mounting position of the semiconductor partition 192. The wiring harness socket 111 is an electrical connection plug, which is fixedly installed on the bottom inner wall of the inner liner 110, with the pins of the wiring harness socket 111 facing upwards. The wiring harness socket 111 is electrically connected to the ECU controller 13 through a wire. The ECU controller 13 can supply power to the auxiliary heat exchange wiring harness connector 194 through the wiring harness socket 111, thereby controlling the energizing direction and voltage of the auxiliary heat exchange semiconductor chip 191.

[0049] The inner wall of the inner liner 110 has grooves on both the front and rear sides. The grooves are vertical recesses or guide rails, with their openings facing the center of the inner cavity. The semiconductor separator 192 has protrusions or sliders on both sides that mate with the grooves. When installing the semiconductor separator assembly 192, align the left and right sides of the semiconductor separator 192 with the grooves on the inner wall of the inner liner 110, and insert the semiconductor separator 192 vertically downwards from the top opening of the inner liner 110. The side protrusions or sliders of the semiconductor separator 192 slide downwards along the grooves until the bottom edge of the semiconductor separator 192 approaches the bottom inner wall of the inner liner 110. At this point, the auxiliary heat exchange wire harness connector 194 and the wire harness socket 111 automatically engage and connect, achieving electrical connection.

[0050] After the semiconductor partition assembly 19 is installed, the semiconductor partition 192 divides the internal cavity of the inner liner 110 into a first cavity 21 and a second cavity 22. The first cavity 21 and the second cavity 22 are spatially independent and are adjacent only through the semiconductor partition 192. The semiconductor partition is detachably connected to the inner liner. When the dual-temperature zone function is not required, the user can pull the semiconductor partition 192 upwards, allowing the side protrusions or sliders of the semiconductor partition 192 to slide upwards along the slide groove, disengaging the auxiliary heat exchange wire harness connector 194 from the wire harness socket 111. The semiconductor partition 192 is then removed from the top opening of the inner liner 110. At this time, the first cavity 21 and the second cavity 22 merge into a single cavity with a large volume, maximizing the effective volume of the inner liner 110.

[0051] It is understood that the air intake grille at the top and the exhaust grille at the bottom of the inner liner 110 are arranged at positions corresponding to the first cavity 21 and the second cavity 22. Specifically, the air intake grille at the top front of the inner liner 110 spans above the first cavity 21 and the second cavity 22, with the right side of the air intake grille located directly above the first cavity 21 and the left side of the air intake grille located directly above the second cavity 22. Alternatively, independent air intake grilles can be provided directly above the first cavity 21 and the second cavity 22, respectively, and arranged corresponding to two sets of swirling fans 18. In this embodiment, it is preferred that two sets of swirling fans 18 are arranged, and the fan corresponding to the first cavity 21 is designated as the first swirling fan, and the fan corresponding to the second cavity 22 is designated as the second swirling fan.

[0052] Similarly, the exhaust grille at the bottom front of the inner liner 110 also spans below the first cavity 21 and the second cavity 22, or independent exhaust grilles are respectively set directly below the first cavity 21 and the second cavity 22. This arrangement allows the cold or hot air generated by the main heat exchange system to enter the first cavity 21 and the second cavity 22 simultaneously, and the air blown out by the turbulence fan 18 can enter both cavities simultaneously through the air intake grille, enabling the main heat exchange system to achieve synchronous temperature control of the first cavity 21 and the second cavity 22.

[0053] It should be noted that since the air inside the box is limited, and the moisture content in the air is also limited, the impact of condensation can be disregarded. Alternatively, in other optional examples, a water collection tank can be installed at the bottom of the vehicle-mounted heating / cooling box, corresponding to the location of the main heat exchange system. Specifically, it can be located below the heat exchange fins to facilitate the collection of condensation. Furthermore, a drainage structure can be installed on the water collection tank to drain the water when it is nearly full.

[0054] The vehicle-mounted refrigerator / heater box in this embodiment can achieve multiple operating modes to meet different usage needs. The control process and working principle of each operating mode are described in detail below.

[0055] Operating mode 1: Single cooling mode.

[0056] In this mode, the user needs to simultaneously cool the first cavity 21 and the second cavity 22, reducing the temperature in both cavities to the set cooling temperature. The ECU controller 13 controls the operation of the main heat exchange system, specifically by controlling the TEC semiconductor patch 16 to be forward-energized, making the air-side of the TEC semiconductor patch 16 the cold end and the water-side the hot end, while simultaneously controlling the two sets of turbulence fans 18 to start and rotate at an appropriate speed. The two sets of turbulence fans 18 create a negative pressure near the air-side of the TEC semiconductor patch 16, drawing in and accelerating the cold air generated at the cold end of the air-side of the TEC semiconductor patch 16. After passing through the turbulence fans 18, the cold air is blown into the first cavity 21 and the second cavity 22 respectively through the air intake grille at the top of the inner liner 110.

[0057] Cold air exchanges heat with the items inside the first cavity 21 and the inner wall of the cavity in the second cavity 22 respectively. After absorbing heat, the temperature rises and becomes hot air. The hot air is discharged from the exhaust grille at the bottom of the first cavity 21 and the second cavity 22, returns to the front cavity outside the front wall of the inner liner 110, and flows through the cold end of the TEC semiconductor patch 16 again to be cooled, forming an airflow circulation.

[0058] The heat generated by the hot end of the TEC semiconductor patch 16 on its water side is transferred to the coolant in the reservoir 15. The coolant circulates with the vehicle's low-temperature cooling system through the inlet and outlet pipes 14, dissipating the heat to the outside of the vehicle. In this operating mode, the auxiliary heat exchange system is not working, the ECU controller 13 does not energize the auxiliary heat exchange semiconductor 191, and the auxiliary heat exchange semiconductor 191 is in a de-energized state. The semiconductor partition 192 only serves to physically separate the first cavity 21 and the second cavity 22. However, since the main heat exchange system cools the two cavities simultaneously, the temperature change trends in the first cavity 21 and the second cavity 22 are consistent. Ultimately, the temperature in both cavities reaches the set cooling temperature and remains stable.

[0059] Operating mode 2: Single heating mode.

[0060] In this mode, the user needs to heat the first chamber 21 and the second chamber 22 simultaneously, raising the temperature in both chambers to the set heating temperature. The ECU controller 13 controls the operation of the main heat exchange system, specifically by controlling the TEC semiconductor patch 16 to be energized in reverse, making the air side of the TEC semiconductor patch 16 the hot end and the water side the cold end, while simultaneously controlling the two sets of turbulence fans 18 to start and rotate at an appropriate speed.

[0061] Two sets of turbulence fans 18 create negative pressure near the air side of the TEC semiconductor patch 16, drawing in and accelerating the hot air generated at the hot end of the air side of the TEC semiconductor patch 16. After passing through the turbulence fans 18, the hot air is blown into the first cavity 21 and the second cavity 22 respectively through the air intake grille at the top of the inner liner 110.

[0062] Hot air exchanges heat with the items inside the first cavity 21 and the inner wall of the cavity in the second cavity 22 respectively. After releasing heat, the temperature drops and becomes cooler air. The cooler air is discharged from the exhaust grille at the bottom of the first cavity 21 and the second cavity 22, returns to the front cavity outside the front side wall of the inner liner 110, and is heated again by flowing through the hot end of the TEC semiconductor patch 16, forming an airflow circulation.

[0063] The TEC semiconductor patch 16 absorbs heat from the coolant in the reservoir 15 at its water-side cooling end. After the coolant temperature drops, it circulates with the vehicle's low-temperature cooling system through the inlet and outlet water pipes 14. Other heat sources in the vehicle's low-temperature cooling system supplement the heat, causing the coolant temperature to rise again.

[0064] In this working mode, the auxiliary heat exchange system also does not work, and the ECU controller 13 does not energize the auxiliary heat exchange semiconductor chip 191. The first cavity 21 and the second cavity 22 are heated synchronously under the action of the main heat exchange system. Finally, the temperature in both cavities reaches the set heating temperature and remains stable.

[0065] Working mode 3: First chamber cooling and second chamber heating mode.

[0066] This two-cavity temperature difference mode requires energizing the auxiliary heat exchange semiconductor chip to achieve a temperature difference between the first and second cavities on both sides of the semiconductor separator assembly. In this mode, the user needs the first cavity 21 to cool down the items, while the second cavity 22 needs to heat up the items or keep them warm (insulate the temperature).

[0067] At this time, the main heat exchange system and the auxiliary heat exchange system need to work together. The ECU controller 13 first controls the main heat exchange system to work in the cooling state, that is, controls the TEC semiconductor patch 16 to be energized in the forward direction, so that the air side of the TEC semiconductor patch 16 is the cold end and the water side is the hot end. At this time, the turbulence fan 18 corresponding to the first cavity 21 starts to rotate, while the vortex fan 18 corresponding to the second cavity 22 does not work. Cold air is blown into the first cavity 21 through the air intake grille, and no cold air enters the second cavity 22.

[0068] In order to heat the second cavity 22, the ECU controller 13 needs to simultaneously control the auxiliary heat exchange system to operate, and to energize the auxiliary heat exchange semiconductor chip 191 in the forward direction, so that the side of the auxiliary heat exchange semiconductor chip 191 facing the first cavity 21 is the cold end, and the side facing the second cavity 22 is the hot end.

[0069] The cold end of the auxiliary heat exchange semiconductor chip 191 absorbs heat from the air inside the first cavity 21, further reducing the temperature inside the first cavity 21. The hot end of the auxiliary heat exchange semiconductor chip 191 releases heat into the second cavity 22, increasing the temperature inside the second cavity 22.

[0070] In this operating mode, the heat absorbed by the cold end of the auxiliary heat exchange semiconductor chip 191 comes directly from the first cavity 21, and the heat released by the hot end is directly used to heat the second cavity 22. This achieves a redistribution of energy within the system and avoids the high energy consumption problem of having to simultaneously start independent cooling and heating systems. The cooling capacity of the main heat exchange system is mainly used for the first cavity 21, while the heating of the second cavity 22 mainly relies on the hot end of the auxiliary heat exchange semiconductor chip 191.

[0071] Understandably, in this mode, the amount of cold air supplied to the cavity by the main heat exchange system can be appropriately reduced, thereby lowering overall energy consumption. The auxiliary heat exchange system participates in the main heat exchange work, maximizing energy utilization.

[0072] Understandably, the ECU controller 13 dynamically adjusts the energizing voltage of the TEC semiconductor patch 16 and the energizing voltage of the auxiliary heat exchange semiconductor chip 191, as well as the rotation speed of the turbulence fan 18, based on the actual temperature feedback in the first cavity 21 and the second cavity 22, so that the temperature of the two cavities is stabilized at their respective set values.

[0073] Working mode four: First chamber refrigeration and second chamber preservation mode.

[0074] In this mode, the user needs the first chamber 21 for refrigeration, with the temperature set to a lower refrigeration temperature, such as -18 degrees Celsius or 0 degrees Celsius, while the second chamber 22 is needed for preservation, with the temperature set to a higher refrigeration temperature, such as 4 degrees Celsius or 8 degrees Celsius.

[0075] In this mode, both chambers need to be cooled, but the temperature settings are different, resulting in temperature differences.

[0076] The ECU controller 13 controls the main heat exchange system to operate in cooling mode. The TEC semiconductor patch 16 is forward-energized, and the turbulence fan 18 corresponding to the first cavity 21 starts. Another set of turbulence fans 18 also starts, blowing cold air into the first cavity 21 and the second cavity 22 through the air intake grille. However, it should be noted that the rotational speed of the first turbulence fan should be greater than that of the second turbulence fan, so that the temperature of the first cavity decreases at a greater rate than that of the second cavity 22.

[0077] The auxiliary heat exchange system can participate in operation under corresponding conditions. For example, when the temperature of the first cavity has not yet dropped to the refrigeration temperature, but the temperature of the second cavity begins to drop below the preservation temperature, the auxiliary heat exchange semiconductor chip 191 can be energized so that the side of the auxiliary heat exchange semiconductor chip 191 closest to the first cavity 21 is the cold side and the other side is the hot side, thereby regulating the temperature between the two cavities.

[0078] Understandably, in this mode, the speed of the two fans is optimally calibrated to ensure that the two chambers reach the temperature requirements of the corresponding mode synchronously.

[0079] Operating mode 5: Switch from dual-zone cooling mode to refrigeration and preservation mode.

[0080] Assuming the vehicle-mounted refrigerator / warmer is initially in operating mode one, meaning both the first chamber 21 and the second chamber 22 are in cooling mode, with both chambers at a relatively low cooling temperature. The user then needs to raise the temperature of the second chamber 22 to the freshness preservation temperature, while keeping the first chamber 21 at a constant refrigeration temperature.

[0081] If only the main heat exchange system is used for regulation, the cooling power of the main heat exchange system needs to be reduced or the cooling needs to be stopped, and the temperature of the second chamber 22 needs to be allowed to rise naturally. However, this will cause the temperature of the first chamber 21 to rise as well, making it impossible to maintain the refrigeration temperature, and the temperature regulation speed will be slow.

[0082] In this embodiment, after receiving the user's mode switching command, the ECU controller 13 maintains the main heat exchange system in cooling mode, the first circulating fan continues to operate, while the second circulating fan can stop operating. Simultaneously, the auxiliary heat exchange system is activated, and the auxiliary heat exchange semiconductor chip 191 is energized in the forward direction. The cold end of the auxiliary heat exchange semiconductor chip 191 faces the first cavity 21, absorbing heat from the air inside the first cavity 21 to ensure that the temperature of the first cavity 21 continues to be maintained at the refrigeration temperature.

[0083] The hot end of the auxiliary heat exchange semiconductor chip 191 faces the second cavity 22, releasing heat into it and causing the temperature inside the second cavity 22 to rise rapidly. The cold air supplied to the second cavity 22 by the main heat exchange system is heated by the hot end of the auxiliary heat exchange semiconductor chip 191, and the temperature inside the second cavity 22 gradually rises to the set preservation temperature. Based on feedback from the temperature sensor inside the second cavity 22, the ECU controller 13 dynamically adjusts the voltage of the auxiliary heat exchange semiconductor chip 191. When the temperature of the second cavity 22 approaches the set preservation temperature, the power of the auxiliary heat exchange semiconductor chip 191 is reduced to prevent temperature overshoot, ultimately stabilizing the temperature of the second cavity 22 at the preservation temperature and the temperature of the first cavity 21 at the refrigeration temperature. This operating mode enables rapid switching from uniform temperature cooling to differential cooling. The auxiliary heat exchange semiconductor chip 191 plays a crucial role in this switching process, shortening the temperature adjustment time and improving the user experience.

[0084] Operating Mode 6: Switch from dual-zone heating mode to cooling and heating mode.

[0085] Assume the vehicle-mounted heater / cooler is initially in operating mode two, meaning both chambers 21 and 22 are in heating mode with a relatively high heating temperature, such as 50 degrees Celsius. The user then needs to lower the temperature of chamber 21 to the cooling temperature, such as 4 degrees Celsius, while keeping the heating temperature of chamber 22 unchanged.

[0086] Upon receiving a mode switching command from the user, the ECU controller 13 can control the main heat exchange system to stop working and provide forward power to the auxiliary heat exchange semiconductor 191, so that the cold end of the auxiliary heat exchange semiconductor 191 faces the first cavity 21 and the hot end faces the second cavity 22. The cold end of the auxiliary heat exchange semiconductor 191 absorbs heat from the air inside the first cavity 21, which, together with the cold air supplied by the main heat exchange system, causes the temperature of the first cavity 21 to drop rapidly. The hot end of the auxiliary heat exchange semiconductor 191 releases heat to the second cavity 22, thus achieving mode switching.

[0087] Understandably, during the mode switching process, the main heat exchange system can be switched from heating to cooling mode first. That is, the TEC semiconductor patch 16 is controlled to switch from reverse power to forward power, so that the air side of the TEC semiconductor patch 16 becomes the cold end. The first turbulence fan 18 continues to rotate, blowing cold air into the first cavity 21 through the air intake grille. With the help of the auxiliary heat exchange semiconductor chip 191, the first cavity 21 can be quickly switched to cooling mode.

[0088] The ECU controller 13 can dynamically adjust the operating parameters of the main heat exchange system and the auxiliary heat exchange system based on feedback from the temperature sensors in the first cavity 21 and the second cavity 22. When the temperature of the first cavity 21 drops to the set cooling temperature and the temperature of the second cavity 22 stabilizes at the set heating temperature, the system enters steady-state operation. This operating mode enables rapid switching from uniform heating to dual-zone heating and cooling. During the switching process, the auxiliary heat exchange semiconductor chip 191 accelerates the cooling process of the first cavity 21 and prevents the temperature of the second cavity 22 from dropping, demonstrating the efficient adjustment capability of the auxiliary heat exchange system during mode switching.

[0089] Operating Mode 7: Switch from refrigeration and heating mode to dual-zone preservation mode.

[0090] Assuming the vehicle-mounted hot and cold box is initially in working mode three or a similar state, that is, the first chamber 21 is at the refrigeration temperature, for example, 0 degrees Celsius, and the second chamber 22 is at the heating temperature, for example, 50 degrees Celsius, with a large temperature difference between the two chambers.

[0091] The user needs to adjust the temperature of both chambers to the preservation temperature, for example, 8 degrees Celsius, to achieve uniform temperature in both zones. If only the main heat exchange system is used for adjustment, the first chamber 21 needs to be heated and the second chamber 22 needs to be cooled, making the adjustment process complex and time-consuming. In this embodiment, after receiving the user's mode switching command, the ECU controller 13 first determines whether the main heat exchange system should operate in cooling or heating mode, or at a lower power, based on the difference between the current temperature and the target temperature of the two chambers.

[0092] Assuming the target preservation temperature of 8 degrees Celsius falls between the current temperatures of the first cavity 21 (0 degrees Celsius) and the second cavity 22 (50 degrees Celsius), the ECU controller 13 can control the main heat exchange system to operate at a lower power cooling level, relying primarily on the auxiliary heat exchange system for temperature regulation. The second circulating fan activates, lowering the temperature of the second cavity, while the first circulating fan remains off. Simultaneously, the ECU controller 13 controls the auxiliary heat exchange semiconductor 191 to be reverse-energized, so that the cold end of the auxiliary heat exchange semiconductor 191 faces the second cavity 22, and the hot end faces the first cavity 21. The hot end of the auxiliary heat exchange semiconductor 191 releases heat into the first cavity 21, causing the temperature inside the first cavity 21 to gradually rise from 0 degrees Celsius to 8 degrees Celsius. The cold end of the auxiliary heat exchange semiconductor 191 absorbs heat from the air inside the second cavity 22, causing the temperature inside the second cavity 22 to gradually decrease from 50 degrees Celsius to 8 degrees Celsius.

[0093] The auxiliary heat exchange semiconductor chip 191 facilitates heat transfer from the second cavity 22 to the first cavity 21 during this process. The main heat exchange system and the auxiliary heat exchange semiconductor chip 191 work together to accelerate the process of the two cavities reaching a uniform temperature, shortening the temperature adjustment time and reducing energy consumption. Based on feedback from the temperature sensors in the two cavities, the ECU controller 13 dynamically adjusts the energizing voltage of the auxiliary heat exchange semiconductor chip 191 and the operating state of the main heat exchange system. When the temperatures of both cavities approach the set preservation temperature of 8 degrees Celsius, the power of the auxiliary heat exchange semiconductor chip 191 is gradually reduced. Finally, when the temperatures of both cavities reach 8 degrees Celsius and stabilize, the auxiliary heat exchange system stops working, and the two swirling fans of the main heat exchange system turn on to maintain the temperature of the two cavities at the preservation temperature with lower power.

[0094] This working mode fully utilizes the characteristic that the auxiliary heat exchange semiconductor chip 191 can be energized in reverse to change the direction of the hot and cold ends, realizing efficient switching from hot and cold partitioning to uniform temperature preservation, demonstrating the flexibility and energy-saving advantages of the technical solution of this invention.

[0095] When the user does not need the dual-temperature zone function but requires a larger single storage space, the semiconductor partition assembly 19 can be removed from the inner liner 110. The user opens the refrigerator / heater door panel 11, holds the upper edge of the semiconductor partition 192, and pulls it upwards. The side protrusions or sliders of the semiconductor partition 192 slide upwards along the groove on the inner wall of the inner liner 110. At the same time, the auxiliary heat exchange wire harness inlet 194 at the bottom of the semiconductor partition 192 gradually separates from the wire harness socket 111 at the bottom of the inner liner 110. When the semiconductor partition 192 is completely pulled out of the groove, the semiconductor partition assembly 19 separates from the inner liner 110, and the user can remove the semiconductor partition assembly 19 and store it properly.

[0096] At this point, the inner liner 110 is no longer separated by partitions. The original first cavity 21 and second cavity 22 are merged into a single cavity with a large volume. The effective volume of the inner liner 110 reaches its maximum, and the user can store large items or more items in this single cavity.

[0097] In this mode, the main heat exchange system can still operate normally, cooling or heating the entire inner liner 110 cavity to meet the user's single-temperature control needs. When the user requires the dual-temperature zone function again, the semiconductor partition assembly 19 can be reinserted into the slide groove of the inner liner 110, and the auxiliary heat exchange harness connector 194 can be reconnected to the harness socket 111 to restore the dual-temperature zone operating mode. The removable partition design improves the flexibility and space utilization of the vehicle-mounted hot and cold box, meeting the user's needs in multiple scenarios.

[0098] In actual use of a vehicle-mounted air cooler / heater, when the main heat exchange system is operating in cooling mode, the temperature of the cold end of the TEC semiconductor patch 16 on the air-side is relatively low. When the humid, hot air discharged from the inner liner 110 flows through the cold end of the TEC semiconductor patch 16 on the air-side, water vapor in the air may condense on the surface of the cold end to form condensate. However, since the volume of the inner liner 110 of the vehicle-mounted air cooler / heater is limited, typically ranging from a few liters to tens of liters, the total amount of air inside the liner is limited, and the amount of water vapor contained in the air is also very limited.

[0099] Under normal use, the items stored in the cavity are mostly sealed food or beverages, and these items themselves do not release a large amount of moisture into the cavity. Therefore, the moisture content in the air inside the cavity is extremely low. Even if a small amount of water vapor condenses during the refrigeration process, the amount of condensate is very small, usually only a few milliliters to tens of milliliters. This small amount of condensate will adhere to the surface of the cold end of the TEC semiconductor patch 16 or the bottom of the inner liner 110, and will not affect the normal operation of the vehicle-mounted refrigerator / heater. Users do not need to perform any special drainage treatment in daily use.

[0100] As an optional technical solution, to further improve the reliability and user experience of the vehicle-mounted refrigerator / heater, a condensate collection and drainage structure can be installed below the TEC semiconductor patch 16 and at the bottom of the inner liner 110. Specifically, an inclined guide channel is provided below the cold end of the air-side of the TEC semiconductor patch 16. The guide channel has a U-shaped or V-shaped groove structure, with one end located directly below the TEC semiconductor patch 16 and the other end extending to the bottom of the inner liner 110. Water droplets generated by condensation on the surface of the cold end of the air-side of the TEC semiconductor patch 16 flow downwards along the surface of the cold end under the action of gravity and drip into the guide channel. The inclined design of the guide channel allows the condensate to flow along the guide channel towards the bottom of the inner liner 110. A water collection groove or water collection box is provided at the bottom of the inner liner 110. The water collection groove is located at the lowest point of the bottom of the inner liner 110, and the end of the guide channel is connected to the water collection groove, allowing the condensate to flow from the guide channel into the water collection groove and collect.

[0101] A drain pipe extends from the bottom outer side of the inner liner 110. One end of the drain pipe is connected to the water collection groove, and the other end extends to the outside of the vehicle's air conditioning box. The drain pipe can be a soft rubber pipe or a hard plastic pipe. The external port of the drain pipe can be set at the bottom or side of the vehicle's air conditioning box. A valve or cover that can be opened and closed can be set at the external port of the drain pipe. When the user needs to drain water, he / she opens the valve or cover, and the condensate flows out of the vehicle's air conditioning box from the drain pipe under the action of gravity and is discharged into the undercarriage of the vehicle or into a special water collection container.

[0102] Users can close the valve or cover when drainage is not required to prevent outside air or debris from entering the vehicle's in-vehicle cooler / heater. This optional condensate treatment structure effectively collects and drains condensate during prolonged continuous cooling operation or in high-humidity environments, preventing condensate buildup at the bottom of the inner liner 110, keeping the interior dry and clean, and improving the user experience.

[0103] This embodiment of the vehicle-mounted refrigerator / heater box achieves a wealth of functions, including single cooling, single heating, cold and hot zone, refrigeration and preservation zone, and rapid switching between multiple modes, through the coordinated operation of the main heat exchange system and the auxiliary heat exchange system. This meets the temperature control needs of users in different usage scenarios. The semiconductor partition assembly 19 in the auxiliary heat exchange system utilizes the semiconductor Peltier effect to achieve energy redistribution and efficient utilization within the system, significantly reducing energy consumption in the dual-temperature zone differentiated temperature control mode. Compared to traditional dual-temperature zone vehicle-mounted refrigerator / heater boxes that require simultaneous activation of independent cooling and heating systems, this design offers significant energy savings and is particularly suitable for energy-sensitive applications such as electric vehicles.

[0104] The detachable design of the semiconductor separator assembly 19 enhances the space utilization flexibility of the vehicle-mounted cooling and heating box, meeting the diverse usage needs of users. The main heat exchange system utilizes the vehicle's low-temperature cooling system for water-side heat exchange, eliminating the need for a separate external heat dissipation device, thus reducing system costs and installation space requirements. The entire vehicle-mounted cooling and heating box features a compact structure, flexible control, and excellent performance, demonstrating significant practical value and promising market application prospects.

[0105] Understandably, different modes can be configured through the control interface, where different modes and their corresponding temperature ranges can be set to meet different needs.

[0106] Understandably, when there is a temperature difference between the two chambers during zoned temperature control, the voltages of the main heat exchange system and the auxiliary heat exchange system can be reasonably calibrated to achieve the purpose of zoned temperature control while saving energy.

[0107] Example 2 This embodiment provides a vehicle equipped with the independent dual-temperature zone semiconductor separator vehicle-mounted cooling and heating box described in Embodiment 1. The vehicle can be a hybrid vehicle or a pure electric vehicle, preferably a pure electric vehicle. Pure electric vehicles have a sophisticated low-temperature cooling system for cooling heat-generating components such as the power battery, drive motor, and motor controller. The coolant temperature in the low-temperature cooling system is typically maintained within a low temperature range, making it suitable as the heat exchange medium for the main heat exchange system of the vehicle-mounted cooling and heating box.

[0108] The in-vehicle refrigerator / heater 1 is installed in a suitable location within the vehicle. Common installation locations include, but are not limited to: the center armrest area between the center console and the front passenger seat; the rear armrest area between the rear seats; the trunk near the rear seat backs; or the central floor passage between the front and rear seats. The refrigerator / heater box shell frame assembly 12 of the in-vehicle refrigerator / heater 1 is fixedly installed on the corresponding installation location on the vehicle body using bolts, clips, or other fasteners, ensuring that the in-vehicle refrigerator / heater 1 will not move or shake during vehicle operation. The refrigerator / heater box door panel 11 of the in-vehicle refrigerator / heater 1 faces the passenger side, facilitating passenger access to items.

[0109] The inlet and outlet water pipes 14 of the vehicle-mounted air cooler / heater 1 pass through the outer shell of the vehicle-mounted air cooler / heater 1 and extend to the underside of the vehicle chassis or into the engine compartment, connecting to the vehicle's low-temperature cooling system. The vehicle's low-temperature cooling system includes a coolant reservoir, water pump, radiator, cooling pipes, and heat-generating components that need to be cooled (such as the power battery, drive motor, motor controller, etc.).

[0110] The inlet pipe of the vehicle-mounted air cooler 1 is connected to the coolant output pipe of the low-temperature cooling system, and the outlet pipe is connected to the coolant return pipe of the low-temperature cooling system. The water pump in the low-temperature cooling system drives the coolant to circulate within the system. The coolant flows from the coolant output pipe into the inlet pipe of the vehicle-mounted air cooler 1, enters the reservoir 15, and exchanges heat with the water side of the TEC semiconductor patch 16 in the reservoir 15. Then it flows out from the outlet pipe back to the coolant return pipe of the low-temperature cooling system. After being cooled by the radiator, it re-enters the coolant output pipe, forming a closed coolant circulation loop.

[0111] Through this connection method, the main heat exchange system of the vehicle-mounted heat exchange box 1 can utilize the existing coolant circulation and heat dissipation capacity of the vehicle's low-temperature cooling system to achieve efficient heat exchange on the water side of the TEC semiconductor patch 16. There is no need to configure an external heat dissipation device separately for the vehicle-mounted heat exchange box 1, which reduces system costs, simplifies the installation structure, and improves the integration of the whole vehicle.

[0112] The ECU controller 13 of the vehicle-mounted refrigerator / heater 1 is connected to the vehicle's overall control system via the vehicle's electrical wiring harness. The overall control system is the vehicle's central control unit, responsible for managing and coordinating the operation of various subsystems, including the powertrain, braking system, air conditioning system, and infotainment system. The ECU controller 13 communicates with the overall control system via CAN bus, LIN bus, or other vehicle communication protocols.

[0113] The vehicle control system can send control commands to the ECU controller 13, such as turning the on-board refrigerator / heater on or off, setting the target temperature of the first chamber 21 and the second chamber 22, and selecting the operating mode.

[0114] After receiving instructions from the vehicle control system, the ECU controller 13 controls the operation of the main heat exchange system and the auxiliary heat exchange system according to the instructions, thereby controlling the temperature of the on-board refrigerator / heater box 1. Simultaneously, the ECU controller 13 can feed back the operating status information of the on-board refrigerator / heater box 1, the current temperature information of the first chamber 21 and the second chamber 22, and fault alarm information to the vehicle control system. The vehicle control system then displays this information on the vehicle's instrument panel, central control display screen, or other human-machine interface for the driver or passengers to view.

[0115] The driver or passengers can send control commands to the vehicle control system for the vehicle-mounted refrigerator / heater 1 through the vehicle's central control display screen, steering wheel control buttons, voice control system, or mobile APP. The vehicle control system then forwards the commands to the ECU controller 13, thereby realizing remote or convenient control of the vehicle-mounted refrigerator / heater 1.

[0116] The power supply for the vehicle-mounted heat exchanger 1 comes from the vehicle's power battery or a 12V on-board battery. For pure electric vehicles, the power supply for the main heat exchange system and auxiliary heat exchange system of the vehicle-mounted heat exchanger 1 can be directly from the power battery. The power battery converts high-voltage DC power into low-voltage DC power suitable for use in the vehicle-mounted heat exchanger 1, such as 12V or 24V, through a DC-DC converter. The power supply line is connected to the ECU controller 13 of the vehicle-mounted heat exchanger 1 through the vehicle's electrical wiring harness. The ECU controller 13 then distributes the power to electrical components such as the TEC semiconductor patch 16, the turbulence fan 18, and the auxiliary heat exchange semiconductor chip 191.

[0117] For hybrid vehicles, the power supply for the on-board refrigerator / heater 1 can come from the vehicle's 12V battery. The battery is connected to the ECU controller 13 of the on-board refrigerator / heater 1 via the vehicle's electrical wiring harness, providing power to the on-board refrigerator / heater 1. The ECU controller 13 has an internal power management module that performs voltage regulation, filtering, and overcurrent protection on the input power to ensure the safe and stable operation of all electrical components of the on-board refrigerator / heater 1.

[0118] In practical automotive applications, the in-vehicle refrigerator / heater 1 provides drivers and passengers with convenient refrigeration, preservation, and heating functions, enhancing the comfort and convenience of in-vehicle life. Several typical usage scenarios are described below.

[0119] Scenario 1: Family road trip.

[0120] A family is going on a long road trip. Before setting off, they prepare refrigerated food, drinks, and ready-to-eat foods at home. The driver puts the refrigerated food and drinks into the first chamber 21 of the car's in-vehicle refrigerator / warmer 1, and sets the working mode of the first chamber 21 to refrigeration mode with a target temperature of 4 degrees Celsius via the car's central control display.

[0121] The ready-to-eat food requiring heating is placed into the second chamber 22 of the vehicle-mounted refrigerator / heater 1. The operating mode of the second chamber 22 is set to heating mode, and the target temperature is set to 60 degrees Celsius. After receiving the instruction, the ECU controller 13 of the vehicle-mounted refrigerator / heater 1 controls the heat exchange system to work in coordination, thereby controlling the temperature of different chambers.

[0122] In addition, the vehicle-mounted hot / cold box 1 in this embodiment can also be adapted to various scenarios, such as commuting to work, outdoor picnics, etc.

[0123] In this embodiment, the vehicle is equipped with an independent dual-temperature zone semiconductor partition vehicle-mounted heat exchanger 1, which organically integrates the vehicle-mounted heat exchanger 1 with the vehicle's low-temperature cooling system, vehicle control system, and power supply system, achieving seamless connection and efficient collaborative operation between the vehicle-mounted heat exchanger 1 and the vehicle. The vehicle-mounted heat exchanger 1 utilizes the coolant circulation of the vehicle's low-temperature cooling system to achieve water-side heat exchange in the main heat exchange system, eliminating the need for a separate external heat dissipation device, thus reducing system cost and installation complexity.

[0124] The vehicle-mounted refrigerator / heater 1 achieves intelligent control through the vehicle control system. Drivers and passengers can conveniently control the operating mode and temperature settings of the refrigerator / heater 1 through various human-machine interaction methods, enhancing the user experience. The main heat exchange system and auxiliary heat exchange system of the vehicle-mounted refrigerator / heater 1 work together to achieve rich temperature control functions, meeting the needs of drivers and passengers in various usage scenarios such as family road trips, commuting to work, and outdoor picnics, significantly improving the comfort, convenience, and practicality of life inside the car.

[0125] The energy-saving design of the vehicle-mounted hot and cold box 1 reduces the overall energy consumption of the vehicle, making it particularly suitable for pure electric vehicles. It helps to improve the driving range of electric vehicles, which is in line with the development trend of energy conservation and emission reduction in the automotive industry. It has good market application prospects and promotion value.

[0126] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A vehicle-mounted hot / cold box with an independent dual-temperature zone semiconductor partition, characterized in that, The inner liner has a main heat exchange system on the front and an auxiliary heat exchange system on the inside. The main heat exchange system includes a liquid storage tank, a TEC semiconductor patch and a turbulence fan arranged in sequence. The turbulence fan enables the inner liner cavity to be cooled or heated simultaneously. The auxiliary heat exchange system includes a semiconductor partition assembly, which is located in the inner cavity and divides the inner cavity into a first cavity and a second cavity. An auxiliary heat exchange semiconductor chip is integrated in the semiconductor partition assembly. The auxiliary heat exchange semiconductor chip is energized to achieve the temperature difference between the first cavity and the second cavity on both sides of the semiconductor partition assembly.

2. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 1, characterized in that, The vehicle-mounted hot and cold box includes an outer shell, with the inner liner disposed within the outer shell, and the liquid storage tank, TEC semiconductor patch, and turbulence fan disposed in the outer shell cavity outside the inner liner. One set of turbulence fans is installed in the main heat exchange system; Alternatively, two sets of turbulence fans can be installed, each corresponding to one of the two cavities of the inner liner.

3. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 2, characterized in that, The liquid storage tank is connected to the vehicle's low-temperature cooling system via inlet and outlet water pipes, and the low-temperature cooling system provides cooling water to achieve heat exchange. The TEC semiconductor patch is attached to the outer surface of the liquid storage tank. Its water side is in direct contact with the coolant in the tank for heat exchange, and its air side is close to the turbulence fan for heat exchange with the flowing air.

4. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 3, characterized in that, The inner liner is provided with an air intake grille at the top and an exhaust grille at the bottom. The air intake grille and the exhaust grille are arranged at corresponding positions in the first cavity and the second cavity to realize synchronous temperature control of the first cavity and the second cavity by the main heat exchange system.

5. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 4, characterized in that, The position of the air intake grille corresponds to the position of the spoiler fan, and the TEC semiconductor patch is disposed between the spoiler fan and the exhaust grille.

6. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 1, characterized in that, The semiconductor separator assembly includes a semiconductor separator, a connecting wire harness is integrated inside the semiconductor separator, and an auxiliary heat exchange wire harness socket is integrated at the bottom. The connecting wire harness connects the auxiliary heat exchange wire harness socket and the auxiliary heat exchange semiconductor chip.

7. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 6, characterized in that, The bottom of the inner liner is provided with a wire harness socket. After the semiconductor partition assembly is installed, the wire harness socket and the auxiliary heat exchange wire harness connector are connected to allow power to be supplied to the auxiliary heat exchange semiconductor chip.

8. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 6, characterized in that, The semiconductor separator is detachably connected to the inner liner; The inner liner has grooves on opposite sides, and the semiconductor partition slides into the grooves for installation.

9. The independent dual-temperature zone semiconductor partition vehicle-mounted hot / cold box according to claim 1, characterized in that, The inner liner is top of the hot and cold cabinet door panel.

10. A car, characterized in that, The vehicle is equipped with an on-board heating and cooling box as described in any one of claims 1-9, and the on-board heating and cooling box achieves temperature difference control between the first chamber and the second chamber through an auxiliary heat exchange system.

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