A method of touch glass etching

Abstract

This invention discloses a method for etching touch glass, comprising the following steps: S1, pre-treating the glass substrate to be etched to clean its surface; S2, preparing an etching solution comprising the following raw materials in parts by weight: 20-40 parts of fluoride salt, 5-10 parts of organic acid, 15-20 parts of acidic substance, 1-5 parts of surfactant, 1-3 parts of carboxymethyl cellulose, 1-5 parts of polyol, 1-1.5 parts of triethanolamine, and 80-100 parts of water; wherein the fluoride is a mixture of potassium fluoride, sodium fluoride, and ammonium fluorosilicate in a mass ratio of 1:1:(0.4-0.7); S3, placing the glass substrate to be etched onto an etching fixture, then transferring the fixture into an etching tank and completely immersing the glass substrate in the etching solution for etching and thinning, for 15-25 minutes; S4, transferring the etched glass to a clean water tank for rinsing. This invention has an anti-glare effect, enriching the visual appearance and tactile feel of electronic device covers.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, specifically a method for etching glass by touch. Background Technology

[0002] Touch glass, as a core component of modern electronic devices, automotive instrument systems, aviation displays, and medical diagnostic instruments, directly impacts user experience and functional performance due to its surface quality. To optimize visual effects, touch glass often undergoes anti-glare treatment. This treatment uses chemical etching to create a microscopic rough structure on the glass surface, effectively dispersing ambient light, eliminating specular reflection interference, and forming a uniform matte texture, thereby improving readability and operational comfort in bright light environments. However, in current industrial production, AG glass etching processes face significant efficiency bottlenecks. After a single batch of etching work is completed, continuous production must be interrupted. Operators must manually or with the aid of simple mechanical devices remove the glass products one by one from the sodium fluoride etching solution. This process is not only time-consuming but also requires extreme caution due to the highly corrosive nature of the solution, resulting in excessively high downtime. The inefficient loading and unloading operations severely hinder the overall production pace, leading to low capacity utilization. Furthermore, frequent manual intervention can introduce surface contamination or physical damage risks, further affecting product yield and production stability. In addition, the lack of automated connection mechanisms in traditional etching processes makes batch-to-batch transitions a prominent obstacle to large-scale production. Summary of the Invention

[0003] The purpose of this application is to provide a touch glass etching method that has the advantages of significantly improving etching efficiency, effectively reducing production downtime, increasing capacity utilization, and reducing product contamination risk.

[0004] This application provides a method for etching touch glass, the technical solution of which is as follows: Includes the following steps: S1, Pre-treat the glass sheet to be etched to make its surface clean; S2, prepare the etching solution, which includes the following raw materials in parts by weight: 20-40 parts of fluoride salt, 5-10 parts of organic acid, 15-20 parts of acidic substance, 1-5 parts of surfactant, 1-3 parts of carboxymethyl cellulose, 1-5 parts of polyol, 1-1.5 parts of triethanolamine and 80-100 parts of water; wherein, the fluoride is a mixture of potassium fluoride, sodium fluoride and ammonium fluorosilicate in a mass ratio of 1:1:(0.4-0.7).

[0005] S3, Place the glass sheet to be etched onto the etching fixture, then transfer the fixture into the etching tank and immerse the glass sheet completely in the etching solution for etching and thinning, for 15-25 minutes. S4, the etched glass is transferred to a clean water tank for cleaning.

[0006] Furthermore, this application also proposes that the organic acid is tartaric acid and oxalic acid in a mass ratio of 1:(1.5-3).

[0007] Furthermore, this application also proposes that the pretreatment process of the glass substrate in step S1 involves immersing it in a pretreatment solution consisting of 20%-25% sodium hydroxide and 80%-85% water by mass for 11-13 minutes.

[0008] Furthermore, this application also proposes that the glass substrate be immersed in the etching solution at a speed of 10-20 mm / s in step S3.

[0009] Furthermore, this application also proposes that during the glass etching process, the temperature inside the etching tank is maintained at 25-45°C.

[0010] Furthermore, this application also proposes that the glass sheet is any one of 2.5D cover glass, 3D cover glass, flat glass, and perforated glass.

[0011] Furthermore, this application also proposes that the acidic substance is selected from one or more of hydrofluoric acid, sulfuric acid, and nitric acid.

[0012] Furthermore, this application also proposes that the surfactant is a nonionic surfactant.

[0013] The present invention has the following beneficial technical effects: By optimizing the etching solution and combining it with an automated transfer mechanism for the etching fixture, the etching cycle is effectively shortened and manual intervention is reduced. This has the advantages of significantly improving etching efficiency, effectively reducing production downtime, increasing capacity utilization, and reducing the risk of product contamination. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the process of the present invention. Detailed Implementation

[0015] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0016] In the description of this invention, it should be understood that if terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0017] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0018] like Figure 1 As shown, a touch glass etching method aims to improve etching efficiency and simplify operation by optimizing the composition of the etching solution and the etching process. The method may include the following steps: S1, Pre-treat the glass sheet to be etched to make its surface clean; S2, prepare the etching solution, which includes the following raw materials in parts by weight: 20-40 parts of fluoride salt, 5-10 parts of organic acid, 15-20 parts of acidic substance, 1-5 parts of surfactant, 1-3 parts of carboxymethyl cellulose, 1-5 parts of polyol, 1-1.5 parts of triethanolamine and 80-100 parts of water; wherein, the fluoride is a mixture of potassium fluoride, sodium fluoride and ammonium fluorosilicate in a mass ratio of 1:1:(0.4-0.7).

[0019] S3, Place the glass sheet to be etched onto the etching fixture, then transfer the fixture into the etching tank and immerse the glass sheet completely in the etching solution for etching and thinning, for 15-25 minutes. S4, the etched glass is transferred to a clean water tank for cleaning.

[0020] For ease of understanding, the following explains some key terms in this embodiment: Etching solution is a liquid mixture used to chemically etch glass substrates to achieve thinning or the formation of specific surface structures. Its components and proportions directly affect the etching effect.

[0021] Fluoride salts, as the main active component of the etching solution in this application, are responsible for reacting with silicon oxides in the glass to dissolve and remove the glass.

[0022] Organic acids typically act as complexing agents or pH adjusters in etching solutions, helping to stabilize the etching reaction rate and improve the uniformity of the etched surface.

[0023] Acidic substances, acting as auxiliary etchants in the etching solution, work synergistically with fluoride salts to accelerate the glass etching process and maintain the activity of the etching solution.

[0024] Surfactants are added to the etching solution to reduce the surface tension of the liquid, thereby improving the wettability of the etching solution on the glass surface, ensuring that the etching solution can contact the glass surface evenly, and reducing the generation of bubbles.

[0025] Carboxymethyl cellulose is typically used as a thickener or rheology modifier to adjust the viscosity of the etching solution, preventing it from flowing too quickly on the glass surface and helping to achieve a more uniform etching effect.

[0026] Polyols can act as solvents, wetting agents, or complexing agents in etching solutions, helping to improve the stability of the etching solution and potentially affecting the etching rate and surface quality.

[0027] Triethanolamine is often used as a pH buffer or complexing agent to stabilize the pH value of the etching solution and prevent excessive pH fluctuations from affecting the stability and uniformity of the etching reaction.

[0028] Etching fixtures are auxiliary tools used to fix the glass sheet to be etched and to accurately position it in the etching tank, ensuring that the glass sheet maintains a stable posture during the etching process.

[0029] An etching tank is a container that holds the etching solution and provides the environment for the etching reaction. Its design typically takes into account the circulation of the etching solution, temperature control, and ease of loading and unloading of the glass substrate.

[0030] Specifically, the implementation process of this touch glass etching method may include the following steps: First, in step S1, the glass substrate to be etched undergoes pretreatment to ensure its surface is clean. This pretreatment can be achieved in various ways. For example, it can be done by mechanically wiping away surface-adhered particles or by using ultrasonic cleaning equipment in deionized water to remove minute impurities. Alternatively, organic solvents can be used to degrease the glass surface to remove oil and other organic contaminants.

[0031] Next, in step S2, a liquid for etching is prepared. This etching solution is composed of a mixture of various raw materials in specific weight proportions. The fluoride salt, at a weight proportion of 20-40 parts, serves as the main etching active component. The organic acid, at a weight proportion of 5-10 parts (e.g., citric acid, acetic acid, or lactic acid), helps adjust the pH of the etching solution and stabilize the etching process. The acidic substance, at a weight proportion of 15-20 parts (e.g., hydrochloric acid or phosphoric acid), works synergistically with the fluoride salt to accelerate glass corrosion. The surfactant, at a weight proportion of 1-5 parts (e.g., anionic or cationic surfactants), reduces the surface tension of the etching solution and improves its wettability on the glass surface. Carboxymethyl cellulose, at a weight proportion of 1-3 parts, acts as a thickener to adjust the viscosity of the etching solution. The polyol, at a weight proportion of 1-5 parts (e.g., ethylene glycol or propylene glycol), acts as a solvent or wetting agent. The triethanolamine can be present in 1-1.5 parts by weight, serving as a pH buffer. Water is used as a solvent, in 80-100 parts by weight. Specifically, the fluoride component in the etching solution is set as a mixture of potassium fluoride, sodium fluoride, and ammonium fluorosilicate in a mass ratio of 1:1:(0.4-0.7), a specific ratio designed to optimize etching efficiency and surface quality.

[0032] Next, in step S3, the pretreated glass sheet is placed on an etching fixture. After the etching fixture carries the glass sheet, it is transferred to the etching tank, allowing the glass sheet to be completely immersed in the prepared etching solution. The glass sheet can be fed into the etching solution at a constant or variable speed; for example, it can be slowly immersed at a speed of 5 mm / s or 25 mm / s using a robotic arm. In the etching tank, the glass sheet is in full contact with the etching solution, undergoing a chemical reaction to achieve thinning. The duration of the etching process is controlled between 15 and 25 minutes. During the etching process, the temperature inside the etching tank can be maintained at room temperature, or maintained within a specific temperature range, such as 20°C or 50°C, using heating or cooling devices. The glass sheet can be various types of glass, such as display glass, optical glass, or architectural glass.

[0033] Finally, in step S4, the etched glass substrate is removed from the etching tank and transferred to a clean water tank for thorough cleaning. This cleaning step aims to remove residual etching solution and reaction products from the glass surface, ensuring a clean surface and preparing it for subsequent processing. Cleaning can be performed using methods such as multiple immersions, spraying, or ultrasonic cleaning.

[0034] The touch glass etching method proposed in this embodiment achieves effective thinning and surface treatment of touch glass by optimizing the composition and ratio of the etching solution and standardizing the etching process. This method helps improve the stability and uniformity of the etching process, reduces manual intervention, thereby improving the overall production efficiency of AG glass etching, and simplifies the operation process, reducing reliance on manual loading and unloading.

[0035] In some of the embodiments described above in this application, an etching solution containing organic acids is proposed. However, in actual application, if the type and ratio of organic acids are not properly selected, it may lead to unstable etching rate, poor etching uniformity, or even microscopic defects on the glass surface, affecting the optical performance and strength of the final product.

[0036] In this application, the organic acid is specifically defined as tartaric acid and oxalic acid in a mass ratio of 1:(1.5-3). Tartaric acid, as an important organic acid component, contains multiple hydroxyl and carboxyl groups in its molecular structure, giving it excellent chelating ability. During the etching process, tartaric acid can form stable complexes with silicates or metal ions generated during glass dissolution, effectively preventing these products from forming insoluble precipitates on the glass surface or in the etching solution, thereby maintaining the activity and cleanliness of the etching solution. In addition, tartaric acid can also act as a buffer, helping to maintain the pH value of the etching solution within a suitable range, ensuring the smooth progress of the etching reaction and avoiding uneven etching caused by pH fluctuations. Oxalic acid is another dicarboxylic acid with strong acidity. In the etching solution, oxalic acid can provide sufficient hydrogen ions, working synergistically with fluorides to effectively chemically erode the glass substrate, thereby accelerating the glass dissolution rate. At the same time, oxalic acid also has a certain chelating ability, which can help remove byproducts generated during the etching process, further maintaining the cleanliness of the glass surface and laying a good foundation for subsequent cleaning steps. The mixture of tartaric acid and oxalic acid at a mass ratio of 1:(1.5-3) is the result of meticulous optimization. This ratio aims to fully leverage the synergistic effects of the two organic acids: tartaric acid primarily stabilizes the etching solution system, inhibits precipitation formation, and improves etching uniformity; while oxalic acid primarily provides sufficient etching kinetics to ensure etching efficiency. By precisely controlling the ratio of the two, an optimal balance can be achieved between etching rate, etching uniformity, and the final glass surface quality.

[0037] By specifically defining the organic acid as a mixture of tartaric acid and oxalic acid in a mass ratio of 1:(1.5-3) using the above technical solution, this application effectively solves the problems of unstable etching rate and surface defects. The chelating effect of tartaric acid helps stabilize the etching solution and reduce the formation of insoluble substances, thereby ensuring the continuity and uniformity of the etching process. Oxalic acid provides the necessary acid strength, accelerates the dissolution of glass, and synergistically removes etching products. This precise ratio allows the etching solution to significantly improve the smoothness and gloss of the etched surface while maintaining a high etching rate, avoiding uneven etching, surface roughness, or microscopic defects that may be caused by a single organic acid or improper ratio, ultimately obtaining touch glass with excellent optical properties and mechanical strength.

[0038] In some embodiments of this application, a step S1 is proposed to pre-treat the glass substrate to be etched to clean its surface. However, during its implementation, if the pre-treatment method is not properly selected or the parameters are not precisely controlled, the glass surface may not be thoroughly cleaned. Residual contaminants or uneven surface conditions may affect the uniformity of the reaction between the subsequent etching solution and the glass surface, thereby causing problems such as uneven etching, surface defects, or unstable etching rate, and failing to obtain the desired etching effect.

[0039] In this regard, this application further proposes that the pretreatment process of the glass substrate in step S1 above involves immersing it in a pretreatment solution consisting of 20%-25% sodium hydroxide and 80%-85% water by mass for 11-13 minutes.

[0040] Specifically, the pretreatment solution consists of 20%-25% sodium hydroxide and 80%-85% water by mass. Sodium hydroxide is a strong alkaline substance that can effectively remove organic contaminants, oil, fingerprints, and other deposits from the surface of the glass substrate in aqueous solution. Simultaneously, the sodium hydroxide solution has a micro-etching effect on the glass surface, activating it and increasing its roughness, thereby improving the wettability and reactivity of the subsequent etching solution with the glass surface, laying the foundation for uniform etching. This specific concentration range of sodium hydroxide aqueous solution ensures sufficient cleaning and activation capabilities while avoiding excessive corrosion of the glass due to excessive concentration. The pretreatment method is immersion, where the glass substrate is completely submerged in the pretreatment solution, ensuring that the solution fully contacts all surfaces of the glass substrate for comprehensive and thorough cleaning and activation. This method is simple to operate, easy to control, and ensures uniform treatment results. The immersion time is controlled at 11-13 minutes. Immersion time is a key parameter affecting the pretreatment effect. If the immersion time is too short, the glass surface may not be thoroughly cleaned or sufficiently activated, affecting the subsequent etching effect. If the immersion time is too long, it may cause excessive corrosion to the glass surface, affecting the mechanical strength and surface quality of the glass. Controlling the immersion time to 11-13 minutes is an optimized range, designed to ensure that the glass surface is adequately cleaned and activated while avoiding overtreatment, thus providing the best starting conditions for subsequent etching steps.

[0041] The above technical solution employs a specific concentration of sodium hydroxide aqueous solution for precise immersion pretreatment of the glass substrate within a defined time range. This thoroughly removes various contaminants from the glass surface and appropriately activates it. This precisely controlled pretreatment effectively solves the problem of uneven etching caused by incomplete surface cleaning or uneven activation, significantly improving the uniformity and stability of the reaction between the etching solution and the glass surface. This makes the subsequent etching and thinning process more controllable, avoiding localized over-etching or under-etching. Consequently, it ensures that the etched touch glass exhibits excellent surface quality, uniform thickness, and stable mechanical properties, greatly improving the product's yield and reliability.

[0042] In some embodiments described above, a step of immersing the glass substrate to be etched in an etching solution for etching and thinning is proposed. However, in actual operation, if the immersion speed of the glass substrate in the etching solution is not properly controlled, uneven contact between the etching solution and the glass surface may occur, easily leading to bubble adhesion, which in turn causes uneven etching of the glass surface, affecting the optical performance and surface quality of the final product.

[0043] In this regard, this application further proposes that, in step S3 above, the speed at which the glass substrate is immersed in the etching solution be controlled at 10-20 mm / s. This speed refers to the rate at which the glass substrate descends from above the etching tank and is completely immersed in the etching solution. To achieve precise control of the glass substrate immersion speed, various technical means can be employed. For example, a robotic arm or electric lifting platform equipped with a precision control system can be used to smoothly feed the glass substrate into the etching solution at a constant speed through a preset program. Alternatively, the glass substrate can be placed on a dedicated fixture, which is connected to a drive device such as a stepper motor or servo motor via a guide rail system. The drive device precisely controls the speed at which the fixture descends along the guide rail, thereby achieving precise adjustment of the glass substrate immersion speed in the etching solution. Limiting the immersion speed to the range of 10-20 mm / s is based on a comprehensive consideration of the uniformity and efficiency of the etching process. If the immersion speed is too low, the glass substrate may remain in the initial contact area with the etching solution for too long, causing localized over-etching or increasing the overall process time. If the immersion speed is too high, it may cause etching solution splashing, uneven wetting of the glass surface, or even the formation of bubbles on the glass surface. These bubbles will hinder sufficient contact between the etching solution and the glass surface, resulting in uneven etching. Therefore, a speed range of 10-20 mm / s ensures that the glass substrate is smoothly and uniformly immersed in the etching solution, avoiding the aforementioned adverse situations.

[0044] By precisely controlling the immersion speed of the glass substrate in the etching solution within the range of 10-20 mm / s using the above technical solution, it is possible to ensure that the glass substrate is immersed in the etching solution in a stable and uniform manner. This controlled immersion speed effectively avoids etching solution splashing and bubble generation caused by rapid immersion, and also avoids localized over-etching that may occur due to excessively slow immersion. Therefore, this solution can significantly improve the uniformity of contact between the etching solution and the glass surface, reduce bubble adhesion, thereby ensuring the uniformity of glass surface etching and ultimately obtaining touch glass products with high surface quality and excellent optical performance.

[0045] In the etching process of touch glass, the chemical reaction rate of the etching solution has a significant impact on the etching effect. If the temperature fluctuation in the etching tank is large or not effectively controlled, it may lead to an unstable etching rate, resulting in uneven etching of the glass substrate, inconsistent surface roughness, and even affecting the stability of the etching solution's components, ultimately reducing the product yield and production efficiency.

[0046] In this regard, this application further proposes that the temperature inside the etching tank is maintained at 25-45°C during the glass etching process.

[0047] Specifically, to maintain the temperature within the etching tank precisely between 25-45°C throughout the glass etching process, a sophisticated temperature control system is typically configured. This system may include temperature sensors, such as thermocouples or resistance thermometers, for real-time monitoring of the etching solution temperature. Based on feedback from the temperature sensors, the system precisely regulates the temperature of the etching solution using heating devices (such as immersion heaters, jacketed heaters, or external heat exchangers) or cooling devices (such as cooling coils, cooling water circulation systems, or refrigerators). Furthermore, to ensure uniform temperature distribution within the etching solution, a circulation pump or stirring device is usually used to promote sufficient flow of the etching solution within the etching tank, thereby preventing overheating or undercooling in localized areas. Maintaining the temperature within the 25-45°C range is based on a comprehensive consideration of the chemical reaction kinetics, etching rate, etching uniformity, and etching solution stability of the configured etching solution components (such as fluorides, organic acids, and acidic substances), aiming to provide an optimal reaction environment.

[0048] By precisely maintaining the temperature within the etching tank at 25-45℃ during the glass etching process, the chemical reaction rate between the etching solution and the glass substrate can be ensured to be stable and controllable. This effectively avoids inconsistent etching rates caused by temperature fluctuations, resulting in uniform thinning and consistent surface quality of the glass substrate throughout the etching area. Simultaneously, a stable temperature environment helps maintain the activity and stability of the components in the etching solution, extending its lifespan and reducing scrap rates due to performance degradation. This precise temperature control significantly improves the etching accuracy and yield of touch glass products, providing a high-quality substrate for subsequent processing and use.

[0049] In the aforementioned touch glass etching methods, the shapes and structures of the original glass sheets are diverse. For example, the cover glass of devices such as smartphones and tablets may have curved edges or special structures such as perforations. If the etching is not adapted to these different shapes of original glass sheets, it may lead to uneven etching results, or even over-etching or under-etching in specific areas, affecting the final quality and yield of the product.

[0050] In this regard, this application further proposes that the glass sheet is any one of 2.5D cover glass, 3D cover glass, flat glass, and perforated glass.

[0051] Specifically, 2.5D cover glass refers to cover glass with a slight curvature at the edges, typically used in devices such as smartphones to provide a smoother feel and visual effect. Its characteristic is a smaller curvature at the edges, usually forming a gentle transition at the junction of the glass surface and the side. During etching, it is necessary to ensure that the etching solution can act evenly on these curved areas to avoid stress concentration or uneven etching. 3D cover glass refers to cover glass with a larger curvature or complex curved surface shape at the edges, such as the full-screen design of some high-end smartphones. Its characteristic is that the glass as a whole presents a three-dimensional curved surface, requiring higher uniformity and control precision in the etching process to ensure that the thinning effect of the curved part is consistent with that of the flat part, without affecting the strength and optical performance of the glass. Flat glass refers to traditional, flat glass sheets, widely used in various displays and protective panels. Its etching is relatively easy to control, but it is still necessary to ensure uniform overall thickness reduction and a surface free of defects such as pits and scratches. Perforated glass refers to glass with pre-processed holes in the glass sheet; these holes may be used for the installation of cameras, sensors, or other functional components. During the etching process, special attention should be paid to the etching of the hole edges to avoid hole deformation, edge cracking, or etchant retention in the holes, which could lead to localized over-etching.

[0052] By limiting the glass substrate to any one of 2.5D cover glass, 3D cover glass, flat glass, or perforated glass, this etching method can be optimized for glass products of different shapes and structures. For example, for curved 2.5D or 3D cover glass, the etching solution formulation and etching parameters can be better adapted to its curved surface characteristics, ensuring uniform contact and reaction of the etching solution in the curved area, thereby achieving overall uniform thinning and avoiding edge stress concentration or uneven etching. For perforated glass, by precisely controlling the etching process, the integrity of the hole edges can be effectively protected, preventing excessive erosion or deformation of the hole edges by the etching solution. This targeted selection of glass substrates makes this etching method more widely applicable and has higher etching precision, significantly improving the etching quality and yield of different types of touch glass products, and meeting the diverse and high-precision requirements of modern electronic products for glass covers.

[0053] In some of the embodiments described above in this application, the etching solution needs to contain a certain amount of acidic substance. However, if the type of acidic substance is not clearly defined, the performance of the etching solution may be unstable, making it difficult to accurately control the etching rate and glass surface quality, thereby affecting the uniformity and yield of the final product.

[0054] In this application, the acidic substance in the etching solution is selected from one or more of hydrofluoric acid, sulfuric acid, and nitric acid. Specifically, hydrofluoric acid is a highly corrosive acid that primarily functions as the main etchant in glass etching, effectively dissolving the silica component in the glass to achieve glass thinning. Its mechanism of action involves the formation of stable fluorosilicic acid complexes between fluoride ions and silicon atoms, thereby transforming the glass substrate from a solid state into a soluble substance. In practical applications, the concentration and temperature of hydrofluoric acid are key factors affecting the etching rate and require precise control to avoid over-etching or surface roughness. Sulfuric acid, as an acidic substance, mainly plays a role in adjusting the pH value, stabilizing the etching rate, and assisting in the removal of etching products in the etching solution. The addition of sulfuric acid can effectively inhibit the deposition of byproducts from the reaction of fluoride ions with the glass surface, maintain the activity of the etching solution, and help improve the smoothness of the etched surface. In addition, sulfuric acid can provide a stable acidic environment, ensuring that other components such as fluoride salts and organic acids can fully exert their functions. Nitric acid, as another acidic substance, plays a similar role to sulfuric acid in the etching solution, mainly used to adjust the pH value and stabilize the etching process. Nitric acid has strong oxidizing properties and, in some cases, can help remove metallic impurities or organic contaminants that may be present on the glass surface, thereby further improving etching quality. At the same time, nitric acid has relatively low volatility, which helps maintain the stability of the etching solution composition. By selecting one or more of the above-mentioned acidic substances, the performance of the etching solution can be flexibly adjusted according to the specific glass type, the required etching depth, and the desired surface finish. For example, using hydrofluoric acid alone can achieve rapid etching, but may require more precise control to avoid surface defects; while combining it with sulfuric acid or nitric acid can optimize surface smoothness and gloss while ensuring etching efficiency and extending the service life of the etching solution.

[0055] The above technical solution clarifies the specific types of acidic substances in the etching solution, making the formulation of the etching solution more precise and controllable. By selecting one or more of hydrofluoric acid, sulfuric acid, and nitric acid, the acidity, etching rate, and surface treatment effect of the etching solution can be flexibly adjusted according to different etching requirements and the characteristics of the glass substrate. For example, hydrofluoric acid, as the main etching component, can efficiently dissolve the glass substrate; while the addition of sulfuric acid or nitric acid can effectively adjust the pH value of the etching solution, stabilize the etching process, inhibit the formation of by-products, and improve the smoothness and uniformity of the etched glass surface. This precise selection of acidic substances can significantly improve the stability and repeatability of the etching process, and ultimately improve the yield and performance of touch glass products.

[0056] In some embodiments of the above-mentioned touch glass etching method, the etching solution contains surfactants to improve the etching effect. However, in practical applications, if the surfactant is not selected properly, it may lead to a decrease in the stability of the etching solution. For example, it may decompose easily in a strongly acidic environment or generate too much foam during the etching process, thereby affecting the wetting uniformity of the glass substrate and resulting in inconsistent etching thinning effect, which affects the quality of the final product and production efficiency.

[0057] In this regard, this application further proposes that the surfactant is a nonionic surfactant. Nonionic surfactants are surfactants whose molecules do not ionize in water and are uncharged. They mainly reduce the surface tension of liquids through the action of hydrophilic groups (such as polyoxyethylene ether chains and polyol groups) and hydrophobic groups (such as long-chain alkyl groups) in their molecules. Common nonionic surfactants include polyoxyethylene ethers (such as fatty alcohol polyoxyethylene ethers and alkylphenol polyoxyethylene ethers), polyoxyethylene polyoxypropylene block copolymers, fatty acid polyoxyethylene esters, alkyl glycosides, and polyol fatty acid esters. In etching solutions, the selection of nonionic surfactants needs to consider their stability in strongly acidic environments, compatibility with other components of the etching solution, and their impact on glass surface wetting and etching uniformity. For example, fatty alcohol polyoxyethylene ethers with good acid resistance can be selected, and their hydrophilic-lipophilic balance (HLB) value can be adjusted according to the specific formulation of the etching solution and the required wetting effect to ensure effective reduction of surface tension and promotion of uniform spreading of the etching solution during etching. In addition, its low-foaming or non-foaming characteristics are also an important consideration when making a selection, so as to avoid excessive foam affecting the etching quality.

[0058] By specifically defining nonionic surfactants in the above technical solution, this etching method effectively solves the problems of poor stability, easy decomposition, and excessive foaming that may exist with traditional surfactants in strongly acidic etching solutions. Nonionic surfactants exhibit good chemical stability under acidic conditions and are not prone to ionic reactions with acidic substances or fluoride salts in the etching solution, thus ensuring the long-term stability and activity of the etching solution. Simultaneously, their excellent wetting properties allow the etching solution to spread more evenly and thoroughly on the surface of the glass substrate, avoiding localized etching differences caused by uneven wetting. Furthermore, nonionic surfactants typically have a low foaming tendency or good defoaming properties, effectively suppressing foam generation during the etching process and preventing a foam layer from hindering the contact between the etching solution and the glass surface. This ensures the uniformity and consistency of the etching thinning process, significantly improving the etching quality and yield of touch glass.

[0059] It should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for etching touch glass, characterized in that, Includes the following steps: S1, Pre-treat the glass sheet to be etched to make its surface clean; S2, prepare the etching solution, comprising the following raw materials in parts by weight: 20-40 parts of fluoride salt, 5-10 parts of organic acid, 15-20 parts of acidic substance, 1-5 parts of surfactant, 1-3 parts of carboxymethyl cellulose, 1-5 parts of polyol, 1-1.5 parts of triethanolamine, and 80-100 parts of water; wherein the fluoride is a mixture of potassium fluoride, sodium fluoride, and ammonium fluorosilicate in a mass ratio of 1:1:(0.4-0.7); S3, Place the glass sheet to be etched onto the etching fixture, then transfer the fixture into the etching tank and immerse the glass sheet completely in the etching solution for etching and thinning, for 15-25 minutes. S4, the etched glass is transferred to a clean water tank for cleaning.

2. The touch glass etching method according to claim 1, characterized in that, The organic acids are tartaric acid and oxalic acid in a mass ratio of 1:(1.5-3).

3. The touch glass etching method according to claim 1, characterized in that, The pretreatment process of the glass substrate in step S1 involves immersing it in a pretreatment solution consisting of 20%-25% sodium hydroxide and 80%-85% water for 11-13 minutes.

4. The touch glass etching method according to claim 1, characterized in that, In step S3, the glass substrate is immersed in the etching solution at a speed of 10-20 mm / s.

5. The touch glass etching method according to claim 1, characterized in that, During the glass etching process, the temperature inside the etching tank is maintained at 25-45℃.

6. The touch glass etching method according to claim 1, characterized in that, The glass sheet is any one of 2.5D cover glass, 3D cover glass, flat glass, and perforated glass.

7. The touch glass etching method according to claim 1, characterized in that, The acidic substance is selected from one or more of hydrofluoric acid, sulfuric acid, and nitric acid.

8. The touch glass etching method according to claim 1, characterized in that, The surfactant is a nonionic surfactant.

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