Laundry treating apparatus

Abstract

This disclosure provides a garment processing device, relating to the field of household appliance technology. The garment processing device includes a drum assembly, a drying assembly, a condenser tray, and a semiconductor refrigeration module. The drum assembly includes an outer drum and an inner drum rotatably connected, with a condensation chamber formed between their rear walls. The drying assembly includes heating air ducts communicating with the condensation chamber and the inner drum respectively. The condenser tray has a condenser tray body located on the rear wall of the outer drum facing the inner drum, and a condenser tray extension extending from the outer periphery of the condenser tray body to the outside of the outer drum. The cold end of the semiconductor refrigeration module is located on the condenser tray extension for heat dissipation and cooling of the condenser tray, allowing the condenser tray to continuously absorb heat from the humid air, ensuring the normal operation of the drying process, and eliminating the need for cooling water, thus reducing the water consumption of the garment processing device. The garment processing device also includes a controller for controlling the switching of the semiconductor refrigeration module based on the surface temperature of the condenser tray body, satisfying the heat dissipation requirements of the condenser tray while reducing energy consumption.

Description

Technical Field

[0001] This disclosure relates to the field of household appliance technology, and in particular to a garment processing device. Background Technology

[0002] Clothing processing equipment is a type of equipment that converts electrical energy into mechanical energy to wash or dry clothes. It has now entered thousands of households and is very common.

[0003] A garment drying device includes a drum, a condenser chamber, and a heating duct, which together form a circulating air path. Inside the heating duct, air is heated and enters the drum. Inside the drum, the hot air exchanges heat with the garments, causing the moisture in the garments to evaporate, becoming humid air, which then enters the condenser chamber. In the condenser chamber, the humid air is cooled and dehumidified by cooling water, causing the water vapor to condense and be discharged with the cooling water. The dehumidified air then re-enters the heating duct for heating. This cycle continues, gradually reducing the moisture content of the garments until they are dry enough.

[0004] Currently, clothing processing equipment uses cooling water to cool and dehumidify hot and humid air. However, due to the weak thermal conductivity of water, the drying process is time-consuming and water-intensive, which affects the user experience. Summary of the Invention

[0005] In view of this, the purpose of this disclosure is to provide a garment processing device to improve the problems of long drying time and high water consumption in existing garment processing devices.

[0006] To achieve at least one of the above objectives, this disclosure provides a garment processing device, comprising:

[0007] Cylinder assembly; the cylinder assembly includes:

[0008] outer cylinder;

[0009] An inner cylinder is rotatably disposed inside the outer cylinder; a condensation cavity is formed between the rear wall of the outer cylinder and the rear wall of the inner cylinder;

[0010] The inner cylinder is configured to hold clothing and allow the clothing to exchange heat with the hot air flowing into the inner cylinder, forming humid and hot air flowing into the condensation chamber;

[0011] A drying assembly; the drying assembly has a heating air duct communicating with the condensation chamber and the inner cylinder;

[0012] The drying assembly is configured to drive dry, cold air from the condensation chamber into the heating duct, heat the air flowing into the heating duct to form hot air, and drive the hot air from the heating duct into the inner cylinder.

[0013] Condensation tray; the condensation tray includes:

[0014] A condenser plate body is disposed in the condensation chamber and on the rear wall of the outer cylinder facing the inner cylinder; the condenser plate is configured to exchange heat with the humid and hot air to form dry and cold air;

[0015] The condenser plate extension extends from the outer periphery of the condenser plate to the outside of the outer cylinder;

[0016] A semiconductor cooling module is located outside the outer cylinder;

[0017] The semiconductor cooling module has a cold end and a hot end that are positioned opposite to each other;

[0018] The cold end is attached to the extension of the condensation plate, and the hot end is provided with a heat dissipation component;

[0019] The semiconductor cooling module is configured to exchange heat with the condenser plate to cool the condenser plate.

[0020] In the above technical solution, a condenser tray and a semiconductor refrigeration module are installed in the clothing processing equipment. The condenser tray body is located on the rear wall of the outer drum facing the inner drum, allowing it to exchange heat with the humid and hot air flowing out of the inner drum. The semiconductor refrigeration module is located outside the outer drum, with its cold end attached to the condenser tray extension extending from the condenser tray body to the outside of the outer drum. The semiconductor refrigeration module can dissipate heat and cool the condenser tray, ensuring that the condenser tray can continuously absorb heat from the humid and hot air, causing the water vapor in the humid and hot air to condense. This ensures that the air entering the heating duct is dry air, and also ensures that the hot air entering the inner drum from the heating duct is dry air, which can continuously evaporate the moisture in the clothes, achieving clothing drying. At the same time, since the condenser tray is cooled by the semiconductor refrigeration module, there is no need to introduce cooling water, thus greatly reducing the water consumption of the clothing processing equipment.

[0021] In some embodiments, the condenser plate body is provided with a first heat transfer pipe;

[0022] The extension of the condenser plate is provided with a second heat transfer pipe that is connected to the first heat transfer pipe.

[0023] The first heat transfer pipe and the second heat transfer pipe are sealed with a heat transfer medium.

[0024] The cold end is in contact with the second heat transfer pipe.

[0025] In the above technical solution, a heat transfer pipe is set on the condenser plate, and a heat transfer medium with high heat exchange efficiency is sealed in the heat transfer pipe. The cold end of the semiconductor refrigeration module is in contact with the second heat transfer pipe. The heat transfer medium can absorb heat when it vaporizes and release heat when it liquefies, so that the condenser plate body can quickly absorb heat from the hot and humid air, so that the water vapor in the hot and humid air can be quickly condensed. The heat absorbed by the condenser plate body can also be quickly conducted to the condenser plate extension, and the condenser plate extension can also quickly release heat to the cold end of the semiconductor refrigeration module.

[0026] In some embodiments, at least one of the first heat transfer line and the second heat transfer line is a thin-walled line.

[0027] In the above technical solution, the heat transfer pipeline is made into a thin-walled pipeline, which can increase the contact area between the surface of the condenser plate and the humid air, improve the heat exchange efficiency between the condenser plate and the humid air, and improve the heat exchange efficiency between the extension of the condenser plate and the cold end.

[0028] In some embodiments, the condenser plate extension penetrates at least one of the side wall of the outer cylinder and the rear wall of the outer cylinder;

[0029] The sidewall of the outer cylinder surrounds the outer periphery of the rear wall of the outer cylinder.

[0030] In the above technical solution, by extending the condenser plate through at least one of the side wall and the rear wall of the outer cylinder, the semiconductor refrigeration module can be in direct contact with the condenser plate, allowing the semiconductor refrigeration module to dissipate heat and cool the condenser plate. At the same time, the condenser plate extension allows the semiconductor refrigeration module to be located outside the outer cylinder, avoiding the semiconductor refrigeration module from being affected by humid and hot air, and ensuring the heat dissipation efficiency of the semiconductor refrigeration module on the condenser plate.

[0031] In some embodiments, there is a gap between the condenser plate body and the rear wall of the outer cylinder;

[0032] The outer cylinder is provided with a water inlet, which is adapted to the gap so that the cooling water flowing out of the water inlet flows through the gap and exchanges heat with the condenser plate body.

[0033] In the above technical solution, the condenser tray can achieve two heat dissipation and cooling methods. One method is heat dissipation and cooling through a semiconductor refrigeration module attached to the extension of the condenser tray, and the other method is heat dissipation and cooling through cooling water flowing through the gap between the condenser tray and the rear wall of the outer drum. During the drying process, the garment processing equipment can select to activate any one or both of the above heat dissipation and cooling methods according to the heat dissipation and cooling requirements of the condenser tray, so as to improve drying efficiency and reduce drying time.

[0034] In some embodiments, the above-mentioned garment processing equipment further includes:

[0035] A first temperature detection device is disposed on the surface of the condenser plate body and is configured to detect the surface temperature of the condenser plate body.

[0036] The controller is connected to the first temperature detection device and the semiconductor refrigeration module, respectively.

[0037] The controller is configured to control the opening and closing of the semiconductor cooling module based on the surface temperature.

[0038] In the above technical solution, since the semiconductor cooling module is used to cool the condenser plate, the opening and closing of the semiconductor cooling module is controlled according to the surface temperature of the condenser plate. When the surface temperature is high, the semiconductor cooling module can be turned on to lower the surface temperature and ensure the condenser plate's ability to absorb heat from the humid air. When the surface temperature is low, the semiconductor cooling module can be turned off to reduce energy consumption and also to prevent the semiconductor cooling module from being turned on for a long time, which could lead to overheating and damage to the hot end.

[0039] In some implementations, the controller is configured to:

[0040] After the semiconductor cooling module is turned on for the first time in this drying process, and before the preset drying conditions are met, if the surface temperature is lower than the lower limit of the surface temperature, the semiconductor cooling module is controlled to turn off; if the surface temperature is higher than the upper limit of the surface temperature, the semiconductor cooling module is controlled to turn on.

[0041] The preset judgment conditions include at least one of the following:

[0042] Within a first preset time period, the various temperature change rates calculated based on the surface temperature are all within a first speed range;

[0043] Within a second preset time period, all current temperature difference values ​​calculated based on the surface temperature are within the first temperature difference range; wherein, the current temperature difference value is the difference between the current value and the initial value of the surface temperature.

[0044] In the above technical solution, before the moisture content in the clothes meets the drying requirements based on the preset drying conditions, that is, during the drying stage of the drying process, the opening and closing of the semiconductor cooling module is controlled based on the surface temperature. This can ensure the heat dissipation efficiency of the condenser plate while minimizing the opening time of the semiconductor cooling module and reducing power consumption.

[0045] In addition, based on at least one of the surface temperature change rate and the current temperature difference value, it can be determined whether the clothes meet the drying requirements and whether the drying stage has ended. This can ensure the accuracy of the drying judgment and achieve precise control over the opening and closing timing of the semiconductor cooling module. In this way, while ensuring the heat dissipation and cooling effect of the semiconductor cooling module on the condenser plate, the operating time of the semiconductor cooling module can be reduced, thus reducing its energy consumption.

[0046] In some embodiments, the above-mentioned garment processing equipment further includes:

[0047] A second temperature detection device is disposed between the condensation chamber and the heating air duct, and is configured to detect the first temperature of the dry and cold air;

[0048] The controller is connected to the second temperature detection device;

[0049] The control is also configured to:

[0050] After the preset interference condition is met, the semiconductor cooling module is controlled to turn on and off according to a preset switching time ratio;

[0051] When the preset cooling conditions are met, the semiconductor cooling module is controlled to shut down;

[0052] The preset cooling conditions include: the first temperature is less than the first lower temperature limit.

[0053] In the above technical solution, after the preset drying conditions are met, the clothing processing equipment can end the drying stage and enter the cooling stage to cool down the inside of the drum. Therefore, by controlling the semiconductor refrigeration module to be turned on during the cooling stage, the cooling efficiency of the cooling stage can be improved, the cooling time can be reduced, and the overall drying process time can be reduced, thus improving the user experience.

[0054] In addition, in the above embodiments, the controller adopts different control methods for the semiconductor refrigeration module in two different stages of the drying process, namely the drying stage and the cooling stage, to meet the different control requirements of the corresponding stages, which can reduce energy consumption while ensuring drying efficiency.

[0055] In some embodiments, the above-mentioned garment processing equipment further includes:

[0056] A third temperature detection device is located between the heating air duct and the inner cylinder, and is configured to detect the second temperature of the hot air.

[0057] The controller is connected to the third temperature detection device;

[0058] The controller is also configured to:

[0059] After the current control process is initiated, if the second air temperature is greater than the upper limit of the second air temperature and the surface temperature is greater than the upper limit of the surface temperature, the semiconductor cooling module is controlled to be turned on for the first time in the current control process.

[0060] In the above technical solution, since both the surface temperature and the air temperature meet the corresponding upper limits, it indicates that the temperature of the condenser tray is indeed high and needs to be cooled down. Based on this, the semiconductor cooling module is not turned on immediately at the start of the drying process. Instead, it is turned on for the first time only when the controller determines that both the surface temperature and the air temperature meet the corresponding thresholds. This ensures that the semiconductor cooling module is turned on only when the condenser tray really needs to be cooled down. This satisfies the cooling requirements of the condenser tray and reduces the cumulative operating time of the semiconductor cooling module in the drying process, thereby reducing the energy consumption of the clothing processing equipment.

[0061] In some implementations, the preset judgment condition further includes: the first temperature is greater than the upper limit of the first temperature.

[0062] In the above technical solution, the controller 6 can use at least one of the surface temperature T1 and the first air temperature T_g1 as the basis for determining whether the clothes meet the drying requirements and whether the drying stage needs to be ended and the cooling stage needs to be entered. This can not only further improve the accuracy of the drying determination and avoid the random error caused by the drying determination based on a single factor, but also realize different control methods for the opening and closing of the semiconductor refrigeration module in different stages (such as the drying stage and the cooling stage). In this way, while ensuring the heat dissipation and cooling effect of the semiconductor refrigeration module on the condenser plate, the opening time of the semiconductor refrigeration module can be reduced, thereby reducing its energy consumption. Attached Figure Description

[0063] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0064] Figure 1 This is a schematic diagram of the external structure of a garment processing device according to some embodiments of the present disclosure;

[0065] Figure 2 This is a perspective view of the internal structure of a garment processing device according to some embodiments of the present disclosure;

[0066] Figure 3 This is a schematic diagram of the structure of a drying component in a garment processing device according to some embodiments of the present disclosure;

[0067] Figure 4 This is a schematic diagram illustrating the structure and drying principle of a garment processing device according to some embodiments of the present disclosure;

[0068] Figure 5 This is a perspective view of the internal structure of another garment processing device provided according to some embodiments of the present disclosure;

[0069] Figure 6 This is a perspective view of the internal structure of another garment processing device provided according to some embodiments of the present disclosure;

[0070] Figure 7 This is a top view of the internal structure of another garment processing device provided according to some embodiments of the present disclosure;

[0071] Figure 8 for Figure 7 A sectional view along line AA of the internal structure of the garment processing equipment shown.

[0072] Figure 9 for Figure 8 An enlarged schematic diagram of a local area B in the sectional view shown;

[0073] Figure 10 This is a schematic diagram illustrating the structure and drying principle of another garment processing device according to some embodiments of the present disclosure;

[0074] Figure 11 for Figure 10 An enlarged schematic diagram of a local area C in the schematic diagram shown;

[0075] Figure 12 for Figure 10 An enlarged schematic diagram of a local area C in the schematic diagram shown;

[0076] Figure 13 for Figure 10 An enlarged schematic diagram of a local area C in the schematic diagram shown;

[0077] Figure 14 This is a perspective view of a condenser plate equipped with a semiconductor refrigeration module according to some embodiments of the present disclosure;

[0078] Figure 15 This is a front view of a condenser plate equipped with a semiconductor refrigeration module according to some embodiments of the present disclosure;

[0079] Figure 16 This is a front view of another condenser plate provided according to some embodiments of the present disclosure;

[0080] Figure 17 for Figure 16 Rear view of the condenser plate shown;

[0081] Figure 18 This is a schematic diagram illustrating the structure and drying principle of another garment processing device according to some embodiments of the present disclosure;

[0082] Figure 19 This is a schematic flowchart of a drying control method for a garment processing apparatus provided according to some embodiments of the present disclosure;

[0083] Figure 20 This is a schematic flowchart of another drying control method for a garment processing apparatus provided according to some embodiments of the present disclosure;

[0084] Figure 21 This is a schematic flowchart of another drying control method for a garment processing apparatus provided according to some embodiments of the present disclosure;

[0085] Figure 22 This is a schematic flowchart of another drying control method for a garment processing apparatus provided according to some embodiments of the present disclosure.

[0086] The attached figures are labeled as follows:

[0087] 1-Box body, 11-Dispensing port, 12-Door body;

[0088] 2-Cylinder assembly, 21-Outer cylinder, 211-Rear wall of outer cylinder, 212-Side wall of outer cylinder, 22-Inner cylinder, 221-Rotating shaft, 23-Door seal, 24-Condensation chamber, 251-Return air inlet, 252-Air inlet, 253-Water inlet, 254-Water outlet;

[0089] 3-Drying component, 31-Heating air duct, 311-Air duct housing, 32-Heater, 33-Fan;

[0090] 4-Condensation plate, 411-Condensation plate body, 411a-First side plate, 411b-Second side plate, 412-Condensation plate extension, 412a-Third side plate, 412b-Fourth side plate, 42-Mounting hole, 431-First heat transfer pipe, 432-Second heat transfer pipe, 44-Gap;

[0091] 5-Semiconductor cooling module, 51-Cold end, 52-Hot end, 53-Heat dissipation component;

[0092] 6-Controller;

[0093] 7-First temperature detection device;

[0094] 8-Second temperature detection device;

[0095] 9-Third temperature detection device. Detailed Implementation

[0096] The present disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. Through these descriptions, the features and advantages of the present disclosure will become clearer and more apparent.

[0097] Unless otherwise defined, all technical and scientific terms used in this disclosure have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs; the terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit this disclosure; the terms “comprising” and “having” and any variations thereof in the specification and the foregoing description of this disclosure are intended to cover non-exclusive inclusion.

[0098] The term "embodiment" as used in this disclosure means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this disclosure. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this disclosure can be combined with other embodiments.

[0099] The specific term "exemplary" used in this disclosure means "serving as an example, embodiment, or illustration." Any embodiment illustrated as "exemplary" is not necessarily to be construed as superior or better than other embodiments. Although various aspects of embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated otherwise.

[0100] In the description of this disclosure, the technical terms “first,” “second,” “third,” etc., are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary or secondary relationship of the indicated technical features.

[0101] In the description of this disclosure, the technical terms "upper", "lower", "inner", "outer", "front", "back", "left", "right", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship under the working state of this disclosure. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0102] In the description of this disclosure, unless otherwise expressly specified and limited, the technical terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0103] In the description of this disclosure, "multiple" means two or more (including two), unless otherwise expressly and specifically limited.

[0104] In the description of this disclosure, the same reference numerals denote the same components, and for brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, and other dimensions of various components in the embodiments of this disclosure shown in the drawings, as well as the overall thickness, length, and other dimensions of the integrated device, are merely illustrative and should not constitute any limitation on this disclosure.

[0105] Clothing treatment equipment is a device that converts electrical energy into mechanical energy to wash or dry clothes. It is now widely used in households. Clothing treatment equipment with drying function includes a drum, a condenser chamber, and a heating air duct, which together form a circulating air path.

[0106] Inside the heating duct, air is heated and enters the drum. Inside the drum, the hot air exchanges heat with the clothing, causing the moisture in the clothing to evaporate, becoming humid air, which then enters the condenser chamber. In the condenser chamber, the humid air is cooled and dehumidified, causing the water vapor to condense and be expelled from the drum. The dehumidified air then re-enters the heating duct for heating. This cycle continues, gradually reducing the moisture content of the clothing until it reaches the required dryness level.

[0107] Currently, garment drying equipment cools and dehumidifies hot and humid air by injecting cooling water into a condensation chamber. However, due to the poor thermal conductivity of water, the entire drying process consumes a large amount of water, and the drying efficiency is low and the time is long, affecting the user experience.

[0108] Therefore, improving the drying efficiency of garment processing equipment and reducing water and electricity consumption during the drying process is an urgent problem to be solved. As part of the inventive concept of this disclosure, the structure, drying principle, and causes of high water consumption of garment processing equipment are first analyzed, and the technical solution of the embodiments of this disclosure is obtained through further reasonable analysis.

[0109] In some embodiments, the garment processing equipment may be a drum dryer with only drying function, or a drum washer-dryer combo that combines washing and drying functions. The following description, in conjunction with the accompanying drawings, details the structures related to the drying function within the garment processing equipment.

[0110] Figure 1 This is a schematic diagram of the external structure of a garment processing device provided in some embodiments of this disclosure. Figure 2 This disclosure provides a perspective view and a side view of the internal structure of a garment processing device according to some embodiments. Figure 3 This is a schematic diagram of the structure of a drying component in a garment processing device provided in some embodiments of this disclosure. Figure 4 This is a schematic diagram illustrating the drying principle of a garment processing device provided in some embodiments of this disclosure.

[0111] Please refer to the above. Figures 1 to 4 The garment processing equipment includes a housing 1, a drum assembly 2, and a drying assembly 3. The drum assembly 2 and the drying assembly 3 are both located inside the housing 1, and a circulating air duct is formed between the drum assembly 2 and the drying assembly 3. Air circulates in the circulating air duct, continuously exchanging heat with the wet clothes, causing the moisture in the wet clothes to evaporate continuously, thereby achieving the drying of the clothes.

[0112] In some embodiments, such as Figure 1 As shown, the housing 1 forms the outer shell of the garment processing equipment, which is usually a rectangular hollow structure. The appearance of the housing 1 can be designed as needed and is not limited here. The housing 1 is provided with a receiving cavity, which can provide installation space for components such as the drum assembly 2 and the drying assembly 3.

[0113] The housing 1 is provided with a dispensing port 11, which may be approximately circular and located on the front end face of the housing 1. The dispensing port 11 connects to the receiving cavity. Of course, in other embodiments, the dispensing port 11 may also be located on other end faces of the housing 1, which is not limited here.

[0114] The housing 1 is also equipped with a door 12, which is movably connected to the housing 1 near the dispensing port 11 via a hinge shaft to open or close the dispensing port 11.

[0115] In some embodiments, such as Figures 2 to 4 As shown, the drum assembly 2 is installed inside the receiving cavity of the box 1 and can be used for washing, rinsing, dehydrating and drying clothes.

[0116] The cylinder assembly 2 has a cylinder opening, which can be roughly circular and located on the front end face of the cylinder assembly 2. The cylinder opening is arranged opposite to the dispensing port 11.

[0117] The tube assembly 2 also has a clothing processing chamber, which can hold clothing; after the door 12 is opened, clothing can be put into the clothing processing chamber through the inlet 11 and the tube opening, or clothing can be taken out from the clothing processing chamber.

[0118] The cylinder assembly 2 includes an outer cylinder 21 and an inner cylinder 22. The outer cylinder 21 is disposed within the receiving cavity of the housing 1 and has a rear wall 211 away from the inlet 11 and a side wall 212 surrounding the outer periphery of the rear wall 211. The inner cylinder 22 is disposed inside the outer cylinder 21 and also has a rear wall away from the inlet 11 and a side wall surrounding the outer periphery of the rear wall of the inner cylinder 22.

[0119] The rear wall of the inner cylinder 22 is provided with a rotating shaft 221. Figure 4 The axis of the rotating shaft 221 is shown in the figure. The rotating shaft 221 passes through the rear wall 211 of the outer cylinder 21 and can be connected to a motor (not shown in the figure) located outside the outer cylinder 21. The motor can drive the rotating shaft 221 to rotate around its axis, thereby causing the inner cylinder 22 to also rotate around the axis of the rotating shaft 221.

[0120] The garment processing chamber is formed inside the inner drum 22, so that the clothes can move along with the inner drum 22 when it rotates, thereby improving the uniformity of washing, dehydration and drying of the clothes.

[0121] Both the front sides of the outer tub 21 and the front sides of the inner tub 22 have openings arranged opposite to each other, which can serve as the openings of the tub assembly 2. The opening of the outer tub 21 is provided with a door seal 23, which is adapted to the door body 12. When the door body 12 is closed, the door body 12 and the outer tub 21 form a closed cavity through the door seal 23, preventing washing water and other substances from flowing out of the opening of the outer tub 21.

[0122] The outer drum 21 is also provided with a water inlet 253 and a water outlet 254, and the inner drum 22 has a large number of through holes on its side wall and rear wall. When washing clothes, washing water can be injected into the clothes processing chamber through the water inlet 253. The washing water enters the inner drum 22 through the through holes and comes into contact with the clothes.

[0123] In some embodiments, such as Figures 2 to 4 As shown, the drying assembly 3 is located outside the outer cylinder 21, and the drying assembly 3 includes a heating air duct 31. The heating air duct 31 can be a cavity formed by the air duct shell 311, and the air duct shell 311 can be made of a thermoplastic polymer material with high heat resistance and flame retardancy, such as ABS (Acrylonitrile Butadiene Styrene).

[0124] A condensation chamber 24 is formed between the rear wall 211 of the outer cylinder 21 and the rear wall of the inner cylinder 22. A return air inlet 251 is provided on the side wall 212 of the outer cylinder 21 near the rear wall 211. The condensation chamber 24 is connected to the hot air duct 31 through the return air inlet 251.

[0125] An air inlet 252 can be provided on the door seal 23. The heating air duct 31 can be connected to the clothing processing chamber through the air inlet 252, that is, connected to the inside of the inner drum 22. At the same time, the inside of the inner drum 22 can be connected to the condensation chamber 24 through the through hole on the inner drum.

[0126] Thus, a circulation channel is formed between the heating air duct 31, the inner cylinder 22, and the condensation chamber 24.

[0127] The drying assembly 3 also includes a heater 32 and a fan 33 disposed within the heating duct 31. The heater 32 heats the air in the heating duct to form hot air at a higher temperature; the fan 33 drives the air to circulate within the aforementioned circulation channel, such as... Figure 4 As shown by the dashed arrow in the middle.

[0128] Reference Figure 4 In some embodiments, based on the aforementioned circulating air duct channel, the principle by which the clothing handling equipment performs the drying function is as follows:

[0129] Inside the heating air duct 31, air flows under the drive of the fan 33 and is heated to form hot air as it flows through the heater 32. The hot air then enters the inner cylinder 22 through the air inlet 252.

[0130] Inside the inner cylinder 22, hot air exchanges heat with wet clothes, causing the moisture in the wet clothes to evaporate and form hot and humid air, which enters the condensation chamber 24 through the through hole on the inner cylinder 22.

[0131] Inside the condensation chamber 24, the hot and humid air exchanges heat with the cooling water that enters the condensation chamber 24 through the water inlet 253, causing the water vapor in the hot and humid air to condense and form dry and cold air, which then re-enters the heating air duct 31 through the return air inlet 251. In addition, the condensate obtained from the condensation of water vapor can be discharged from the clothing processing equipment together with the cooling water through the water outlet 254.

[0132] Based on the drying principle described above, during the drying process, hot and humid air continuously enters the condenser chamber 24. Therefore, cooling water needs to be continuously injected into the condenser chamber 24 to exchange heat with the hot and humid air. Consequently, the drying process of the aforementioned clothing processing equipment consumes a large amount of water. At the same time, due to the weak thermal conductivity of water, the drying efficiency of the aforementioned clothing processing equipment is low and the drying time is long.

[0133] To improve drying efficiency and reduce water consumption, some embodiments of this disclosure provide another garment processing device. These are described below. Figures 5 to 10The structure and working principle of the garment processing equipment are explained.

[0134] Figure 5 and Figure 6 This is a perspective view of the internal structure of a garment processing device provided in some embodiments of this disclosure. Figure 7 This is a top view of the interior of a garment processing apparatus provided in some embodiments of this disclosure. Figure 8 for Figure 7 The image shows a sectional view of the internal structure of the garment processing equipment along line AA. Figure 9 for Figure 8 An enlarged schematic diagram of a local area B in the sectional view shown. Figure 10 This is a schematic diagram illustrating the drying principle of a clothing processing device provided in some embodiments of this disclosure.

[0135] In some embodiments, such as Figures 6 to 10 As shown, the garment processing equipment is also equipped with a condenser tray 4.

[0136] The condenser plate 4 includes a condenser plate body 411 and a condenser plate extension 412.

[0137] The condenser plate body 411 is located in the condenser chamber 24 and is fixed to the rear wall 211 of the outer cylinder 21 facing the inner cylinder 22 (that is, facing the inlet 11).

[0138] In some embodiments, such as Figure 14 and Figure 15 The diagram shows a perspective view and a front view of a condenser plate 4. The condenser plate body 411 has a mounting hole 42. Through the mounting hole 42, the condenser plate body 411 can be fixed to the rear wall 211 of the outer cylinder 21 using screws or the like.

[0139] Reference Figure 10 After the hot and humid air enters the condensing chamber 4 through the inner cylinder 22, it comes into contact with the condensing plate 4 and exchanges heat, causing the water vapor in the hot and humid air to condense into condensate, which cools and dehumidifies the hot and humid air, forming dry and cold air.

[0140] The condenser plate extension 412 extends from the outer periphery of the condenser plate body 411 to the outside of the outer cylinder 21.

[0141] Reference Figures 5 to 10 ,and Figure 14 and Figure 15 As shown, the garment processing equipment also includes a semiconductor cooling module 5. The semiconductor cooling module 5 is located on the outside of the outer cylinder 21. The semiconductor cooling module 5 is located on the extension of the condenser plate 412.

[0142] The semiconductor cooling module 5 has a cold end 51 and a hot end 52 disposed opposite to each other. The cold end 51 is attached to the extension portion 412 of the condenser plate, and the hot end 52 is provided with a heat dissipation component 53. The semiconductor cooling module 5 is configured to exchange heat with the condenser plate 4 to cool the condenser plate 4.

[0143] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the principle of how the semiconductor cooling module 5 cools the condenser plate 4 will be explained below.

[0144] Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, utilizes PN junctions made of semiconductor materials to form thermocouple pairs. When a direct current is applied, energy transfer occurs between the PN junctions, known as the Peltier effect. This causes one end of the thermocouple pair to cool down, forming the cold junction, while the other end cools up, forming the hot junction. With a constant current flowing through the thermocouple pair, the temperature difference between the cold and hot junctions is also constant.

[0145] Based on the above semiconductor refrigeration principle, the cold end 51 of the semiconductor refrigeration module 5 is attached to the condenser plate extension 412, which can absorb the heat of the condenser plate extension 412, that is, indirectly absorb the heat of the condenser plate body 411, thereby cooling the condenser plate body 411, so that the condenser plate body 411 can continuously exchange heat with the humid air, and cool and dehumidify the humid air.

[0146] Meanwhile, the heat absorbed by the cold end 51 is transferred to the hot end 52, and can be further absorbed or dissipated through the heat dissipation component 53, thereby suppressing the temperature rise of the hot end 52. Thus, under a certain temperature difference, the temperature rise of the cold end 51 can be suppressed, allowing the cold end 51 to continuously absorb the heat from the condenser plate extension 412.

[0147] Reference Figure 10 The drying process and principle of the aforementioned clothing processing equipment with a semiconductor refrigeration module are as follows:

[0148] Inside the heating air duct 31, air flows under the drive of the fan 33 and is heated to form hot air as it flows through the heater 32. The hot air then enters the inner cylinder 22 through the air inlet 252.

[0149] Inside the inner cylinder 22, hot air exchanges heat with wet clothes, causing the moisture in the wet clothes to evaporate and form hot and humid air, which enters the condensation chamber 24 through the through hole on the inner cylinder 22.

[0150] Inside the condensing chamber 24, the hot and humid air exchanges heat with the condensing plate body 411, causing the water vapor in the hot and humid air to condense and form dry and cold air, which then re-enters the heating air duct 31 through the return air vent 251.

[0151] Meanwhile, the heat absorbed by the condenser plate body 411 from the humid air is conducted to the condenser plate extension 412 and can be absorbed by the cold end 51 of the semiconductor refrigeration module 5, thereby cooling down the condenser plate body 411 or suppressing the temperature rise of the condenser plate body 411, so that the condenser plate body 411 can continuously exchange heat with the humid air and ensure the normal operation of the drying process.

[0152] In addition, water vapor in the humid air is condensed into condensate in the condensation chamber 24 and can be discharged from the clothing processing equipment through the outlet 254.

[0153] In the above embodiments, the humid air is cooled and dehumidified by exchanging heat with the condenser plate, and the condenser plate is cooled by heat exchange with the semiconductor refrigeration module, thereby continuously evaporating moisture from the clothes and achieving clothes drying. At the same time, since the condenser plate is cooled by the semiconductor refrigeration module, there is no need to introduce cooling water, thus greatly reducing the water consumption of the clothes processing equipment.

[0154] In addition, in the above embodiments, since the semiconductor cooling module has the characteristics of fast cooling and is not affected by ambient temperature, the heat dissipation efficiency of the condenser plate can be improved by using the semiconductor cooling module to dissipate heat and cool down the condenser plate, thereby improving the drying efficiency of the clothing processing equipment, reducing drying time, and enhancing the user experience.

[0155] In some embodiments, such as Figure 14 and Figure 15 As shown, a first heat transfer pipe 431 can also be provided on the condenser plate body 411. The first heat transfer pipe 431 is sealed with a heat transfer medium with excellent thermal conductivity, which can improve the heat exchange efficiency between the condenser plate body 411 and the humid air.

[0156] For example, the first heat transfer pipe 431 can be in the form of a grid, with pipes in different directions connected at the intersection, so that the heat transfer medium in the first heat transfer pipe 431 at different positions on the condenser plate body 411 can exchange heat quickly, further improving the heat exchange efficiency between the condenser plate body 411 and the humid air.

[0157] It should be noted that the denser the distribution of the first heat transfer pipes 431 on the condenser plate body 411 (i.e., the smaller the spacing between adjacent pipe sections), the higher the heat exchange efficiency, and the higher the cost of the condenser plate accordingly. The density of the first heat transfer pipes 431 can be set according to the actual application scenario, and this embodiment does not limit it.

[0158] In some embodiments, such as Figure 16 and Figure 17As shown, a second heat transfer pipe 432 connected to the first heat transfer pipe 431 may be provided on the condenser plate extension 412; the second heat transfer pipe 432 is also sealed with a heat transfer medium, which can improve the heat exchange efficiency between the condenser plate extension 412 and the semiconductor refrigeration module 5.

[0159] For example, the heat transfer medium in the first heat transfer pipe 431 and the second heat transfer pipe 432 can be a gas-liquid mixture of fluorides. Since fluorides have low boiling points and are easy to vaporize, their properties of absorbing heat during vaporization and releasing heat during liquefaction can be utilized to achieve rapid heat transfer.

[0160] In the above embodiments, by setting heat transfer pipes on the condenser plate 4 and sealing a heat transfer medium with high heat exchange efficiency in the heat transfer pipes, the heat transfer medium can absorb heat when it vaporizes and release heat when it liquefies, so that the condenser plate body 411 can quickly absorb heat from the humid air, so that the water vapor in the humid air can be quickly condensed. The heat absorbed by the condenser plate body 411 can also be quickly conducted to the condenser plate extension 412, and the condenser plate extension 412 can also quickly release heat to the cold end 51 of the semiconductor refrigeration module 5.

[0161] Therefore, the above embodiments can improve the heat transfer efficiency of the condenser plate 4, thereby improving the drying efficiency of the clothing processing equipment.

[0162] In some embodiments, both the first heat transfer pipe 431 and the second heat transfer pipe 432 can be thin-walled pipes formed by expansion, and the cold end 51 of the semiconductor refrigeration module 5 is attached to the second heat transfer pipe 432, which can improve the heat exchange efficiency between the condenser plate body 411 and the humid air, as well as improve the heat exchange efficiency between the condenser plate extension 412 and the cold end 51.

[0163] Figures 11 to 13 All Figure 1 A magnified schematic diagram of a local region C in the middle. The following is in conjunction with... Figures 11 to 13 The morphology of the first heat transfer pipe 431 and the second heat transfer pipe 432 on the condensing plate 4, as well as the structural relationship between the condensing plate 4 and the outer cylinder 21, are described.

[0164] Reference Figure 11 The condenser plate 4 can be a composite plate structure formed by two side plates being bonded together. The condenser plate body 411 includes a first side plate 411a and a second side plate 411b that are bonded together, and the condenser plate extension 412 includes a third side plate 412a and a fourth side plate 412b that are bonded together.

[0165] The first side plate 411a and the third side plate 412a are connected to form a side plate of the condenser plate 4 near the rear wall 211 of the outer cylinder 21. The second side plate 411b and the fourth side plate 412b are connected to form another side plate of the condenser plate 4 away from the rear wall 211 of the outer cylinder 21.

[0166] In some embodiments, at least one of the first heat transfer pipe 431 and the second heat transfer pipe 432 may be a thin-walled pipe formed by unilateral expansion of the corresponding position of the condenser plate 4.

[0167] like Figure 11 As shown in (a), the first heat transfer pipe 431 can be a thin-walled pipe formed by the expansion of the preset area of ​​the second side plate 411b in the direction away from the rear wall 211 of the outer cylinder 21, and the second heat transfer pipe 432 can be a thin-walled pipe formed by the expansion of the preset area of ​​the fourth side plate 412b in the direction away from the rear wall 211 of the outer cylinder 21.

[0168] In addition Figure 11 In addition to the one shown in (a), in some other embodiments, the first heat transfer pipe 431 may also be a thin-walled pipe formed by the expansion of a preset area of ​​the first side plate 411a along the direction close to the rear wall 211 of the outer cylinder 21; correspondingly, the second heat transfer pipe 432 is a thin-walled pipe formed by the expansion of a preset area of ​​the third side plate 412a along the direction close to the rear wall 211.

[0169] Alternatively, in some other embodiments, the first heat transfer pipe 431 may be a thin-walled pipe formed by the expansion of a preset area of ​​the first side plate 411a in a direction close to the rear wall 211; correspondingly, the second heat transfer pipe 432 is a thin-walled pipe formed by the expansion of a preset area of ​​the fourth side plate 412b in a direction away from the rear wall 211.

[0170] Alternatively, in some other embodiments, the first heat transfer pipe 431 may be a thin-walled pipe formed by the expansion of a preset area of ​​the second side plate 411b in a direction away from the rear wall 211; correspondingly, the second heat transfer pipe 432 may be a thin-walled pipe formed by the expansion of a preset area of ​​the third side plate 412a in a direction close to the rear wall 211.

[0171] In other embodiments, at least one of the first heat transfer pipe 431 and the second heat transfer pipe 432 may be a thin-walled pipe formed by double-sided expansion at a corresponding position of the condenser plate 4.

[0172] like Figure 11 As shown in (b), the first heat transfer pipe 431 can be a thin-walled pipe formed by the expansion of the first preset area of ​​the first side plate 411a along the direction close to the rear wall 211 and the expansion of the second preset area on the second side plate 411b opposite to the first preset area along the direction away from the rear wall 211.

[0173] Correspondingly, the second heat transfer pipe 432 can be a thin-walled pipe formed by the expansion of the third preset region of the third side plate 412a in the direction close to the rear wall 211, and the expansion of the fourth preset region on the fourth side plate 412b opposite to the third preset region in the direction away from the rear wall 211.

[0174] In addition Figure 11 In addition to the examples shown, in some other embodiments, one of the first heat transfer pipe 431 and the second heat transfer pipe 432 may be a thin-walled pipe formed by unilateral expansion, and the other may be a thin-walled pipe formed by bilateral expansion.

[0175] In the above embodiments, based on single-sided or double-sided expansion, heat transfer pipes are formed on the condenser plate 4, while the thickness of the outer wall of the pipes is made thinner than the thickness of the side plate before expansion, thereby improving heat transfer efficiency. In addition, the expansion to form the first heat transfer pipe 431 increases the contact area between the surface of the condenser plate body 411 and the humid air, which also improves heat transfer efficiency.

[0176] In the above embodiments, since the semiconductor cooling module 5 dissipates heat and cools the condenser plate, it is necessary for the semiconductor cooling module 5 to be in direct contact with the condenser plate 4. Simultaneously, to prevent the semiconductor cooling module 5 from being affected by humid and hot air, it is necessary to place the semiconductor cooling module 5 outside the outer cylinder 21. To meet these conditions, the above embodiments provide a condenser plate extension 412, which extends from the outer periphery of the condenser plate body 411 (located inside the outer cylinder 21) to the outside of the outer cylinder 21; that is, the condenser plate extension 412 needs to penetrate the outer wall of the outer cylinder 21.

[0177] In some embodiments, reference is made to Figure 12 As shown in (a), the condenser plate extension 412 can extend to the outside of the outer cylinder 21 through the side wall 212 penetrating the outer cylinder 21. In another embodiment, as... Figure 12 As shown in (b), the condenser plate extension 412 can also extend to the outside of the outer cylinder 21 through the rear wall 211 of the outer cylinder 21. In other embodiments, the condenser plate extension 412 can also extend to the outside of the outer cylinder 21 through the connection between the side wall 212 and the rear wall 211.

[0178] The included angle θ between the condenser plate extension 412 and the condenser plate body 411 can be any angle within (0, 180°). Figure 12 The structure shown in (b) can be considered as the case where θ = 90°. Figure 12 The structure shown in (a) can be considered as the case where θ = 180°.

[0179] It should be noted that in actual application scenarios, the penetration position of the condenser plate extension 412 on the outer cylinder 21 and the included angle between the condenser plate extension 412 and the condenser plate body 411 can be determined according to the space available outside the outer cylinder 21 to accommodate the semiconductor refrigeration module 5 in the actual product.

[0180] Based on semiconductor refrigeration technology, under the condition that the current passing through the semiconductor refrigeration module 5 is constant, the temperature difference between its cold end 51 and hot end 52 is fixed. Therefore, in order to ensure the cooling effect of the cold end 51, it is also necessary to dissipate heat from the hot end 52 as much as possible and reduce the temperature of the hot end 52. In view of this, in some embodiments, a heat dissipation component 53 is provided at the hot end 52; the heat dissipation component 53 specifically includes at least one of a cooling fan and a heat sink.

[0181] In the above embodiments, at least one heat dissipation component is used to dissipate heat from the hot end 52 of the semiconductor cooling module 5 to reduce the temperature of the hot end 52, thereby keeping the cold end 51 at a lower temperature, thus ensuring the heat dissipation and cooling efficiency of the semiconductor cooling module 5 on the condenser plate 4, and ensuring the drying efficiency of the clothing processing equipment.

[0182] In some embodiments, reference is made to Figure 13 The condenser plate body 411 is fixed to the rear wall 211 of the outer cylinder 21 by screws or other means, and there is a gap 44 between the condenser plate body 411 and the rear wall 211. A water inlet 213 can still be provided on the rear wall 211 or side wall 212 of the outer cylinder 21, and the position of the water inlet 213 is adapted to the gap 44, so that the cooling water entering from the water inlet 213 flows through the gap 44 and exchanges heat with the condenser plate body 411.

[0183] In the above embodiments, the condenser tray 4 has two heat dissipation and cooling methods: one method is to dissipate heat and cool down through the semiconductor cooling module 5 attached to the extension portion 412 of the condenser tray, and the other method is to dissipate heat and cool down through cooling water. During the drying process, the clothing processing equipment can select to activate any one or both of the above heat dissipation and cooling methods according to the heat dissipation and cooling requirements of the condenser tray 4, so as to improve drying efficiency and reduce drying time.

[0184] For example, when drying cotton clothing, because cotton clothing has good heat resistance, a relatively high drying temperature, such as 70℃~80℃, is usually set. Therefore, compared to a lower drying temperature, the heat dissipation demand of the condenser tray 4 is higher, and a single cooling method may not be sufficient to quickly cool the condenser tray 4. Therefore, to save water, the clothing processing equipment can prioritize cooling the condenser tray 4 through the semiconductor cooling module 5. If the heat dissipation effect of the semiconductor cooling module 5 is insufficient to meet the heat dissipation demand of the condenser tray 4, cooling water can be used simultaneously for cooling.

[0185] Figure 18 A further structural and schematic diagram of the garment processing apparatus provided in some embodiments of this disclosure is shown. In some embodiments, reference is made to... Figure 15 and Figure 18 The surface of the condenser tray body 411 is provided with a first temperature detection device 7, which can detect the surface temperature of the condenser tray body 411, so that the garment processing equipment can control the drying process based on the surface temperature.

[0186] It should be noted that the specific location of the first temperature detection device 7 on the condenser plate body 411 is not limited to... Figure 15 and Figure 18 As shown, it can also be at other locations on the condenser plate body 411, but this embodiment does not limit the scope of the invention.

[0187] Continue to refer to Figure 18 The garment processing equipment also has a controller 6. The controller 6 has a built-in drying control program; when the controller 6 executes the drying control program, it can implement the corresponding drying control method, thereby controlling the drying process of the garment processing equipment.

[0188] The drying process of the garment processing equipment can be divided into at least two stages: the drying stage and the cooling stage. During the drying stage, the heater 32 is turned on to ensure that the air entering the inner drum 22 through the heating duct 31 is hot air at a high temperature, so that the moisture in the clothes will evaporate continuously, thus drying the clothes. When the clothes reach the drying requirements, the drying stage ends and the cooling stage begins. During the cooling stage, the heater 32 can be turned off, allowing the temperature in the inner drum 22 to gradually decrease to a safe range, so as to prevent the user from being burned by the high temperature air when opening the door 12 of the garment processing equipment.

[0189] like Figure 18 As shown, the controller 6 is connected to the first temperature detection device 7 and the semiconductor refrigeration module 5 respectively, so that the controller 6 can obtain the surface temperature of the condenser plate body 411 detected by the first temperature detection device 7, and can also control the semiconductor refrigeration module 5.

[0190] Figures 19 to 22 These are schematic flowcharts illustrating a drying control method for a garment processing device provided in some embodiments of this disclosure.

[0191] In some embodiments, reference is made to Figure 18 and Figure 19 The controller 6 executes its built-in drying control program, which can realize the following drying control process:

[0192] Step S91: Obtain the surface temperature T1 of the condenser plate body 411 detected by the first temperature detection device 7;

[0193] Step S92: Control the opening and closing of the semiconductor cooling module 5 according to the surface temperature T1.

[0194] In the above embodiments, since the semiconductor cooling module 5 is used to cool the condenser plate 4, the opening and closing of the semiconductor cooling module 5 is controlled according to the surface temperature T1 of the condenser plate body. When the surface temperature T1 is high, the semiconductor cooling module 5 can be turned on to lower the surface temperature T1 and ensure the heat absorption capacity of the condenser plate body 411 for the humid and hot air. When the surface temperature T1 is low, the semiconductor cooling module 5 can be turned off to reduce energy consumption and also to avoid the semiconductor cooling module from being turned on for a long time, which would cause the hot end to overheat and be damaged.

[0195] In some embodiments, reference is made to Figure 20 To achieve step S92 above, controller 6 can specifically execute the following control flow:

[0196] Step S922: After the semiconductor cooling module 5 is turned on for the first time in this drying process, and before the preset drying conditions are met, the surface temperature T1 is compared with the upper limit value of surface temperature T1' and the lower limit value of surface temperature T1” respectively.

[0197] In step S923, when the surface temperature T1 is less than the lower limit of the surface temperature T1", the semiconductor cooling module 5 is turned off; when the surface temperature T1 is greater than the upper limit of the surface temperature T1', the semiconductor cooling module 5 is turned on.

[0198] In the above embodiments, before determining that the moisture content in the clothes meets the drying requirements based on preset drying conditions, that is, during the drying stage of the drying process, the opening and closing of the semiconductor cooling module 5 are controlled based on the surface temperature T1. This can ensure the heat dissipation efficiency of the condenser plate 4 while minimizing the opening time of the semiconductor cooling module 5 and reducing power consumption.

[0199] For example, the upper limit of surface temperature T1' can be selected from the range of 30°C to 70°C, and the lower limit of surface temperature T1” can be selected from the range of 10°C to 20°C.

[0200] It should be noted that, due to the different heat resistance of different clothing materials, their corresponding drying temperatures also differ. Consequently, the surface temperature variation range of the condenser tray body 411 during the drying process also varies. Therefore, in practical applications, the specific values ​​of the aforementioned lower limit value T1” and upper limit value T1’ of the surface temperature can be set by combining factors such as different materials and different drying temperatures. This embodiment does not limit these values.

[0201] In some embodiments, the preset interference conditions upon which the controller 6 bases its execution of step S922 may include at least one of the following interference conditions:

[0202] 1) The various temperature change rates V_T1 calculated based on the surface temperature within the first preset time period are all within the first speed range;

[0203] 2) Within the second preset time period, each current temperature difference value △T1 calculated based on the surface temperature is within the first temperature difference range; wherein, the current temperature difference value △T1 is the difference between the current value T1_t and the initial value T1_0 of the surface temperature T1.

[0204] The principles and feasibility of the above-mentioned judgment conditions 1) and 2) will be explained below.

[0205] First, the above-mentioned interference judgment condition 1) uses the temperature change rate V_T1 as the basis for interference judgment.

[0206] The formula for calculating the temperature change rate V_T1 is: V_T1=(T12-T11) / △t. Where, T11 represents the surface temperature T1 detected by the first temperature detection device 7 at the first sampling time, T12 represents the surface temperature T1 detected by the first temperature detection device 7 at the second sampling time, and △t is the interval between the second sampling time and the first sampling time.

[0207] The first sampling time and the second sampling time mentioned above can be any two sampling times of the first temperature detection device 7 in this drying process; the first sampling time mentioned above is earlier than the second sampling time mentioned above.

[0208] As the drying process progresses, the moisture content of the clothes decreases, and the temperature of the humid air rises. Consequently, the heat absorbed by the condenser tray 4 from the humid air increases per unit time, leading to a higher rate of temperature change (V_T1) on the surface of the condenser tray 411. In other words, the rate of temperature change (V_T1) can indirectly reflect the degree of drying of the clothes. Therefore, in the above embodiment, the rate of temperature change (V_T1) can be used to determine whether the clothes meet the drying requirements, thereby determining whether the drying stage should end and the cooling stage should begin.

[0209] Compared to directly judging based on the magnitude of the surface temperature T1, the above embodiment judges based on a preset judgment condition 1). The controller 6 first calculates the temperature change rate V_T1 based on the surface temperature T1 corresponding to different sampling times, and then judges based on the temperature change rate V_T1. This can avoid misjudgment caused by the random value of the surface temperature T1 and improve the accuracy of judgment.

[0210] In addition, based on the above-mentioned preset drying condition 1), it is not that the temperature change rate V_T1 calculated once is within the corresponding threshold range, which is considered as the clothes meeting the drying requirements. Instead, it is only when multiple temperature change rates V_T1 calculated continuously within the first preset time period all fall within the first speed range that the clothes are considered to meet the drying requirements. This can also eliminate misjudgment caused by single sampling error or random value, thereby ensuring the accuracy of drying.

[0211] Secondly, the above-mentioned condition 2) uses the current temperature difference value △T1 as the basis for determining whether the condition is dry.

[0212] The current temperature difference value △T1 = T1_t - T1_0 means that the current temperature difference value △T1 represents the increase in temperature of the condenser plate body 411 at the current sampling time t relative to its initial value.

[0213] Wherein, the current value T1_t of the aforementioned surface temperature T1 is the surface temperature of the condenser plate body 411 detected by the first temperature detection device 7 at the current sampling time t.

[0214] The initial value T1_0 of the aforementioned surface temperature T1 is the surface temperature of the condenser plate body 411 detected by the first temperature detection device 7 at the initial sampling time of the drying stage. Furthermore, the initial value T1_0 of the aforementioned surface temperature actually represents the surface temperature of the condenser plate body 411 at ambient temperature, that is, the surface temperature of the condenser plate body 411 before heat exchange begins. For example, after the clothing processing equipment starts the drying process under user triggering, the temperature value initially obtained by the controller 6 from the first temperature detection device 7 can be used as the initial value T1_0 of the surface temperature.

[0215] Since the ambient temperature of the garment processing equipment may vary, the initial surface temperature T1_0 may also vary. Therefore, the initial surface temperature T1_0 can be obtained immediately after the garment processing equipment starts the drying process.

[0216] As the drying process progresses, the moisture content of the clothes decreases, and the temperature of the humid air rises. Consequently, the surface temperature T1 of the condenser tray 411 also gradually increases; that is, the current surface temperature value T1_t also gradually increases. Therefore, given a fixed initial surface temperature, the current temperature difference ΔT1 also gradually increases. In other words, the current temperature difference ΔT1 can indirectly reflect the degree of drying of the clothes. Therefore, the drying stage can be determined based on the current temperature difference ΔT1.

[0217] In addition, due to different ambient temperatures, the temperature of the condenser plate body 411 before heat exchange will also be different, that is, the initial surface temperature value will be different. For clothes with the same moisture content, the temperature reached by the condenser plate body 411 will also be different when the moisture content drops to the same level. It is difficult to set a suitable threshold to distinguish whether the current surface temperature value of the condenser plate body 411 meets the requirements for drying clothes.

[0218] Therefore, compared to directly judging dryness based on the current surface temperature value T1_t, the above embodiment judges dryness based on the difference between the current surface temperature value T1_t and the initial surface temperature value T1_0, i.e., the current temperature difference value △T1. This can avoid the surface temperature difference of the condenser plate body 411 caused by the difference in ambient temperature, facilitate the accurate setting of the judgment threshold, and improve the accuracy of dryness judgment.

[0219] In addition, based on the above-mentioned dryness condition 2), it is not that the current temperature difference value △T1 obtained in a single calculation is within the corresponding threshold range, which is considered as the clothes having met the drying requirements. Instead, it is only when multiple current temperature difference values ​​△T1 obtained in consecutive calculations within the second preset time period all fall within the first temperature difference range that the clothes are considered to have met the drying requirements. This can also eliminate misjudgment caused by single sampling error or random value, thereby ensuring the accuracy of dryness determination.

[0220] Based on the above analysis of the drying conditions 1) and 2), it can be seen that in this embodiment, when the controller 6 executes steps such as S922, it can determine whether the clothes meet the drying requirements and whether the drying stage has ended based on at least one of the drying conditions 1) and 2), that is, based on at least one of the temperature change rate V_T1 corresponding to the surface temperature T1 and the current temperature difference value ΔT1. This can ensure the accuracy of the drying determination and achieve precise control over the opening and closing timing of the semiconductor cooling module 5. In this way, while ensuring the heat dissipation and cooling effect of the semiconductor cooling module 5 on the condenser plate 4, the opening time of the semiconductor cooling module 5 can be reduced, thereby reducing its energy consumption.

[0221] In some embodiments, such as Figure 18 As shown, the garment processing equipment also includes a second temperature detection device 8; the second temperature detection device 8 is located between the condensing chamber 4 and the heating air duct 3, and is configured to detect the temperature of the dry, cold air flowing into the heating air duct 3 from the condensing chamber 4, i.e., the first air temperature T_g1. For example, the second temperature detection device 8 may be located near the return air vent 251.

[0222] The controller 6 can communicate with the second temperature detection device 8, so that the controller 6 can obtain the first air temperature T_g1 detected by the second temperature detection device 8, and perform relevant control processes based on the first air temperature T_g1.

[0223] In some embodiments, reference is made to Figure 21To achieve the above step S92, the controller 6 can also execute the following control flow based on the first air temperature T_g1 detected by the second temperature detection device 8:

[0224] Step S924: After the preset interference condition is met, control the semiconductor cooling module 5 to turn on and off according to the preset switching time ratio;

[0225] Step S925: When the preset cooling conditions are met, control the semiconductor cooling module 5 to shut down.

[0226] The preset cooling conditions include: the first temperature T_g1 is less than the first temperature lower limit value T_g1.

[0227] After the preset drying conditions are met, the garment processing equipment can end the drying stage and enter the cooling stage to cool down the inside of the inner drum 22. In the above embodiment, the semiconductor refrigeration module 5 is still turned on during the cooling stage, which can improve the cooling efficiency of the cooling stage, reduce the cooling time, thereby reducing the time of the entire drying process and improving the user experience.

[0228] In addition, in the above embodiments, the controller 6 adopts different control methods for the semiconductor cooling module 5 in two different stages of the drying process, namely the drying stage and the cooling stage, to meet the different control requirements of the corresponding stages, which can reduce energy consumption while ensuring drying efficiency.

[0229] The preset cooling conditions in step S925 above are used to determine whether the cooling stage has ended, that is, to measure whether the temperature inside the inner cylinder 21 has dropped to a safe range. In the above embodiment, the temperature inside the inner cylinder 21 is measured based on the temperature of the dry, cold air flowing into the heating duct 3 from the condensation chamber 4, i.e., the first air temperature T_g1; its principle and feasibility are analyzed below.

[0230] During the cooling phase, the controller 6 can shut down the heater 32 and keep the fan 33 on. Driven by the fan 32, the warmer air inside the inner cylinder 21 flows to the condenser chamber 24. Heat exchange occurs when the air passes through the condenser plate 4, and the temperature drops. The air then enters the heating duct 31 through the return air inlet 251 and re-enters the inner cylinder 21 through the air inlet 252. Therefore, during the cooling phase, as the temperature inside the inner cylinder 21 gradually decreases, the temperature of the air entering the heating duct 31 through the return air inlet 251 also gradually decreases.

[0231] For example, in the early stage of the cooling phase, the temperature inside the inner cylinder 21 may be around 70°C, and the temperature of the air that has been cooled by the condenser plate 4 and enters the heating duct 31 may be around 40°C; in the later stage of the cooling phase, the temperature inside the inner cylinder 21 may have dropped to around 40°C, and the temperature of the air that has been cooled by the condenser plate 4 and enters the heating duct 31 may drop to around 30°C or close to the ambient temperature.

[0232] Therefore, a threshold value can be set for the first air temperature T_g1 as a preset cooling condition, which serves as the basis for determining whether to end the cooling phase. This not only ensures accurate and timely termination of the cooling phase, reducing the operating time of the garment processing equipment and lowering energy consumption, but also eliminates the need for a temperature detection device inside the inner drum, thus reducing the cost of the garment processing equipment.

[0233] The preset switching time ratio mentioned in step S924 above represents the ratio between the duration t_on of the semiconductor cooling module 5 being in the on state and the duration t_off of the fan 33 being in the off state.

[0234] For example, the preset on / off time ratio can be set to t_on:t_off = 40 seconds: 20 seconds. That is, during the cooling phase, the controller 6 can control the semiconductor cooling module 5 to turn on for 40 seconds, turn off for 20 seconds, and then turn on again for 40 seconds, and so on, until the preset cooling conditions are met, at which point the controller controls the semiconductor cooling module 5 to turn off and not turn on again.

[0235] For example, the preset switching time ratio can be set to t_on:t_off = 60 seconds:0 seconds. That is, during the cooling stage, the semiconductor cooling module 5 can be kept on until the preset cooling conditions are met, at which point it will be controlled to turn off.

[0236] Furthermore, the aforementioned preset switching time ratio can also be set to other values, which can be determined or adjusted according to the cooling requirements of the cooling stage; for example, when it is necessary to minimize the cooling stage time, the on-time t_on can be increased and the off-time t_off can be decreased as much as possible. This disclosure embodiment does not limit the specific value of the preset switching time ratio.

[0237] In some embodiments, the semiconductor cooling module 5 is turned on for the first time in this drying process. It can be turned on immediately with the start of this drying process, that is, when the controller 6 starts to execute this drying process, the semiconductor cooling module 5 can be controlled to turn on. The components that are turned on at the same time may also include the heater 32, the fan 33, etc.

[0238] In other embodiments, to reduce the energy consumption of the semiconductor cooling module 5 during the drying process, the timing of the first activation of the semiconductor cooling module 5 can be determined based on the surface temperature T1 and the temperature of the hot air flowing through the air inlet 252. The following will be combined with... Figure 18 and Figure 22 This will be explained.

[0239] like Figure 18 As shown, the garment processing equipment also has a third temperature detection device 9. This third temperature detection device 9 is located between the heating air duct 31 and the inner drum 21, and is configured to detect the second temperature T_g2 of the hot air flowing into the inner drum 21 from the heating air duct 31.

[0240] For example, such as Figure 18 As shown, the third temperature detection device 9 can be located near the air inlet 252. The controller 6 can communicate with the third temperature detection device 9, so that after the controller 6 starts executing this drying process, it can control the semiconductor cooling module 5 to start for the first time based on the second air temperature T_g2 and the surface temperature T1.

[0241] Reference Figure 18 and Figure 22 The controller 6 can implement the following drying control process by executing its built-in drying control program:

[0242] Step S91: Obtain the surface temperature T1 of the condenser plate body 411 detected by the first temperature detection device 7, and the second air temperature T_g2 detected by the third temperature detection device 9;

[0243] Step S921: When the second air temperature T_g2 is greater than the upper limit of the second air temperature T_g2' and the surface temperature T1 is greater than the upper limit of the surface temperature T1', the semiconductor cooling module 5 is turned on for the first time in this control process.

[0244] Step S922: After the semiconductor cooling module 5 is turned on for the first time in this drying process, and before the preset drying conditions are met, the surface temperature T1 is compared with the upper limit value of surface temperature T1' and the lower limit value of surface temperature T1” respectively.

[0245] In step S923, when the surface temperature T1 is less than the lower limit of the surface temperature T1", the semiconductor cooling module 5 is turned off; when the surface temperature T1 is greater than the upper limit of the surface temperature T1', the semiconductor cooling module 5 is turned on.

[0246] The surface temperature T1 and the second air temperature T_g2 both meet the corresponding upper limits T1' and T_g2', indicating that the temperature of the condenser plate 4 is indeed high and needs to be cooled. Therefore, in the above embodiment, the semiconductor cooling module 5 is not turned on immediately at the start of the drying process. Instead, it is turned on for the first time only when the controller 6 determines that the surface temperature T1 and the second air temperature T_g2 both meet the corresponding thresholds. This ensures that the semiconductor cooling module 5 is turned on only when the condenser plate 4 really needs to be cooled, which can both meet the heat dissipation and cooling requirements of the condenser plate 4 and reduce the cumulative on-time of the semiconductor cooling module 5 in the drying process, thereby reducing the energy consumption of the clothing processing equipment.

[0247] In some embodiments, based on the first air temperature T_g1 detected by the second temperature detection device 8, the controller 6 may also, when executing step S922, determine the following condition 3): the first air temperature T_g1 is greater than the upper limit value of the first air temperature T_g1'.

[0248] As the drying process progresses, the moisture content of the clothes decreases, and the temperature of the humid air rises. This humid air is then condensed and dehumidified by the condenser plate 411, resulting in dry, cool air whose temperature also gradually increases. Therefore, the measured value of the first air temperature T_g1 gradually increases as the drying process continues. Consequently, when the moisture content of the clothes decreases to the required level for drying, the first air temperature T_g1 will also rise to a certain range, as described above. In other words, the level of the first air temperature T_g1 can indirectly reflect the degree of drying of the clothes.

[0249] Therefore, when executing steps S922 or S924, the controller 6 can use the above-mentioned interference condition 3) as a preset interference condition to determine whether it is necessary to change the switching control mode of the semiconductor cooling module 5.

[0250] In some embodiments, when executing steps S922 or S924, the controller 6 may also use at least one of the above-mentioned drying conditions 1) and 2) and drying condition 3) as preset drying conditions to determine whether the clothes meet the drying requirements and whether the drying stage needs to be ended and the cooling stage needs to be entered. This can further improve the drying accuracy and avoid random errors caused by drying based on a single factor. It can also realize different control methods for turning on and off the semiconductor cooling module 5 in different stages (such as the drying stage and the cooling stage). In this way, while ensuring the heat dissipation and cooling effect of the semiconductor cooling module 5 on the condenser plate 4, the operating time of the semiconductor cooling module 5 can be reduced and its energy consumption can be reduced.

[0251] The above embodiments disclose that the controller 6 can control the switching of the semiconductor cooling module 5 based on the surface temperature T1, the first air temperature T_g1, and the first air temperature T_g2. In practical applications, the controller 6 can also control other components in the clothing processing equipment, such as the heater 32, the fan 33, and the motor used to drive the inner drum 21, based on the surface temperature T1, the first air temperature T_g1, and the first air temperature T_g2, to achieve the corresponding functions of the drying and cooling stages, improve the drying efficiency of the clothing processing equipment, and reduce its energy consumption.

[0252] For example, when the controller 6 determines that at least one of the surface temperature T1 and the first air temperature T_g1 meets the preset dryness condition, it may perform at least one of the following while executing steps S924 to S925: control the heater 32 to turn off, control the fan 33 to remain on, reduce the rotation speed of the inner cylinder 21, etc.

[0253] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and not to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure, and they should all be covered within the scope of the claims and specification of this disclosure. This disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A garment processing device, characterized in that, include: Cylinder assembly; The cylinder assembly includes: outer cylinder; An inner cylinder is rotatably disposed inside the outer cylinder; a condensation cavity is formed between the rear wall of the outer cylinder and the rear wall of the inner cylinder; The inner cylinder is configured to hold clothing and allow the clothing to exchange heat with the hot air flowing into the inner cylinder, forming humid and hot air flowing into the condensation chamber; A drying assembly; the drying assembly has a heating air duct communicating with the condensation chamber and the inner cylinder; The drying assembly is configured to drive dry, cold air from the condensation chamber into the heating duct, heat the air flowing into the heating duct to form hot air, and drive the hot air from the heating duct into the inner cylinder. Condensation tray; the condensation tray includes: A condenser plate body is disposed in the condensation chamber and on the rear wall of the outer cylinder facing the inner cylinder; the condenser plate is configured to exchange heat with the humid and hot air to form dry and cold air; The condenser plate extension extends from the outer periphery of the condenser plate to the outside of the outer cylinder; A semiconductor cooling module is located outside the outer cylinder; The semiconductor cooling module has a cold end and a hot end that are positioned opposite to each other; The cold end is attached to the extension of the condensation plate, and the hot end is provided with a heat dissipation component; The semiconductor cooling module is configured to exchange heat with the condenser plate to cool the condenser plate.

2. The garment processing equipment according to claim 1, characterized in that, The condenser plate body is provided with a first heat transfer pipe; The extension of the condenser plate is provided with a second heat transfer pipe that is connected to the first heat transfer pipe. The first heat transfer pipe and the second heat transfer pipe are sealed with a heat transfer medium. The cold end is in contact with the second heat transfer pipe.

3. The garment processing equipment according to claim 2, characterized in that, At least one of the first heat transfer pipeline and the second heat transfer pipeline is a thin-walled pipeline.

4. The garment processing equipment according to claim 1, characterized in that, The extension of the condenser plate penetrates at least one of the side wall of the outer cylinder and the rear wall of the outer cylinder; The sidewall of the outer cylinder surrounds the outer periphery of the rear wall of the outer cylinder.

5. The garment processing equipment according to claim 1, characterized in that, There is a gap between the condenser plate body and the rear wall of the outer cylinder; The outer cylinder is provided with a water inlet, which is adapted to the gap so that the cooling water flowing out of the water inlet flows through the gap and exchanges heat with the condenser plate body.

6. The garment processing equipment according to claim 1, characterized in that, Also includes: A first temperature detection device is disposed on the surface of the condenser plate body and is configured to detect the surface temperature of the condenser plate body. The controller is connected to the first temperature detection device and the semiconductor refrigeration module, respectively. The controller is configured to control the opening and closing of the semiconductor cooling module based on the surface temperature.

7. The garment processing equipment according to claim 6, characterized in that, The controller is configured to: After the semiconductor cooling module is turned on for the first time in this drying process, and before the preset drying conditions are met, if the surface temperature is lower than the lower limit of the surface temperature, the semiconductor cooling module is controlled to turn off; if the surface temperature is higher than the upper limit of the surface temperature, the semiconductor cooling module is controlled to turn on. The preset judgment conditions include at least one of the following: Within a first preset time period, the various temperature change rates calculated based on the surface temperature are all within a first speed range; Within a second preset time period, all current temperature difference values ​​calculated based on the surface temperature are within the first temperature difference range; wherein, the current temperature difference value is the difference between the current value and the initial value of the surface temperature.

8. The garment processing equipment according to claim 7, characterized in that, Also includes: A second temperature detection device is disposed between the condensation chamber and the heating air duct, and is configured to detect the first temperature of the dry and cold air; The controller is connected to the second temperature detection device; The control is also configured to: After the preset interference condition is met, the semiconductor cooling module is controlled to turn on and off according to a preset switching time ratio; When the preset cooling conditions are met, the semiconductor cooling module is controlled to shut down; The preset cooling conditions include: the first temperature is less than the first lower temperature limit.

9. The garment processing equipment according to claim 7, characterized in that, Also includes: A third temperature detection device is located between the heating air duct and the inner cylinder, and is configured to detect the second temperature of the hot air. The controller is connected to the third temperature detection device; The controller is also configured to: After the current control process is initiated, if the second air temperature is greater than the upper limit of the second air temperature and the surface temperature is greater than the upper limit of the surface temperature, the semiconductor cooling module is controlled to be turned on for the first time in the current control process.

10. The garment processing equipment according to claim 8, characterized in that, The preset judgment condition also includes: the first temperature is greater than the upper limit of the first temperature.

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