Refrigeration appliance

Abstract

This application provides a refrigeration device. It includes: a temperature-controlled chamber; a semiconductor refrigeration device including a cold end facing the interior of the temperature-controlled chamber, the cold end being used to supply cooling to the temperature-controlled chamber; a fan device including a cooling fan disposed within the temperature-controlled chamber, the cooling fan being close to the cold end, the cooling fan being used to promote the flow of gas at the cold end within the temperature-controlled chamber; and a humidity control device disposed within the temperature-controlled chamber, the humidity control device being used to adsorb water within the temperature-controlled chamber, the humidity control device being close to the cold end. This configuration effectively prevents condensation at the cold end, while simultaneously improving the cooling efficiency and humidity control of the temperature-controlled chamber.

Description

Technical Field

[0001] This application relates to the field of home appliances, and more particularly to a refrigeration device. Background Technology

[0002] As consumers increasingly demand multifunctionality and food preservation capabilities from refrigerators, differentiated temperature control within refrigerator compartments has become a crucial direction for refrigeration technology development. Especially in small spaces like refrigerator drawers, traditional compressor-based refrigeration methods have limitations, struggling to achieve rapid response and precise temperature control. In recent years, semiconductor refrigeration technology, due to its compact structure, fast response speed, and ease of control, has been gradually introduced into specific refrigerator compartments. A semiconductor refrigeration module, also known as a thermoelectric cooling module (TEC), is a device based on the Peltier effect. When energized, it generates a cold junction on one side and a hot junction on the other, achieving directional heat conduction and space cooling. This module offers advantages such as no moving parts, low noise, and no refrigerant required, making it particularly suitable for applications with limited space and high temperature control accuracy requirements. However, this design has the following drawback: the cold junction is prone to condensation due to continuous low-temperature operation, causing moisture to condense on its surface or in adjacent areas. Summary of the Invention

[0003] The purpose of this application is to provide a refrigeration device that, by installing a fan and a humidity control device near the cold end, can effectively prevent condensation at the cold end, while improving the refrigeration efficiency and humidity control of the temperature control room.

[0004] To achieve the above-mentioned objectives, one embodiment of this application provides a refrigeration device, the refrigeration device comprising:

[0005] Controlled greenhouse;

[0006] A semiconductor cooling device includes a cold end facing the interior of the controlled chamber, the cold end being used to supply cooling to the controlled chamber.

[0007] A fan device, including a cooling fan, wherein the cooling fan is disposed in the controlled chamber and is close to the cold end, and the cooling fan is used to promote the flow of gas at the cold end in the controlled chamber.

[0008] A humidity control device is installed in the controlled temperature chamber. The humidity control device is used to absorb water in the controlled temperature chamber and is located near the cold end.

[0009] As one embodiment of this application, the humidity control device includes:

[0010] A water-absorbing component is included on an inner surface inside the temperature control chamber and on an outer surface outside the temperature control chamber. The water-absorbing component absorbs water inside the temperature control chamber through its inner surface by physical adsorption.

[0011] An electrolytic water element is disposed on the outer surface of the water-absorbing element, and the electrolytic water element is used to electrolyze the water adsorbed by the water-absorbing element.

[0012] As one embodiment of this application, the refrigeration device includes:

[0013] A detection device for detecting the humidity and / or temperature inside the controlled-temperature room;

[0014] The control module is communicatively connected to the detection device and the water electrolysis element. When the humidity inside the controlled chamber is higher than the preset humidity value or the temperature is lower than the dew point temperature value, the control module is used to control the water electrolysis element to electrolyze the water adsorbed by the water absorption element.

[0015] In one embodiment of this application, the control module and the semiconductor cooling device are communicatively connected. The control module is used to control the current of the semiconductor module according to the internal temperature of the temperature-controlled chamber, so that the internal temperature of the temperature-controlled chamber is proportional to the current of the semiconductor module.

[0016] In one embodiment of this application, the control module is communicatively connected to the fan device, and the control module is used to control the speed of the cooling fan according to the internal temperature of the controlled chamber, so that the internal temperature of the controlled chamber is proportional to the speed of the cooling fan.

[0017] In one embodiment of this application, the cold end is oriented in a first direction, the humidity control device surrounds the cold end circumferentially along the first direction, the refrigeration device includes a heat insulation element, the heat insulation element covers the semiconductor refrigeration device circumferentially along the first direction, and the heat insulation element is disposed between the humidity control device and the semiconductor refrigeration device.

[0018] In one embodiment of this application, the refrigeration equipment includes an integrated module, which includes the semiconductor refrigeration device, the fan device, and the humidity control device. The integrated module is detachably plugged into the wall of the controlled temperature room.

[0019] In one embodiment of this application, the semiconductor cooling device includes a hot end disposed outside the controlled-temperature chamber, and the fan device includes a cooling fan disposed outside the controlled-temperature chamber, the cooling fan being close to the hot end, the cooling fan being used to dissipate heat from the hot end, and the cooling equipment includes:

[0020] A storage room, wherein the temperature-controlled room is located within the storage room;

[0021] A cooling air duct, used to supply cooling to the storage room;

[0022] The hot end and the cooling fan are connected to the cooling air duct.

[0023] In one embodiment of this application, the cold end faces a first direction, the hot end faces a second direction, the first direction is opposite to the second direction, the cooling fan is disposed on the first direction side of the cold end, the heat dissipation fan is disposed on the second direction side of the hot end, an opening is formed on the front side of the temperature control room, and the refrigeration equipment also includes a drawer, which is detachably disposed in the temperature control room through the opening.

[0024] In one embodiment of this application, the absorbent element includes an HCS oxygen barrier and humidity regulating membrane, the HCS oxygen barrier and humidity regulating membrane comprising:

[0025] A moisture-absorbing functional layer, located near the inner surface of the absorbent element;

[0026] An oxygen barrier layer is located near the outer surface of the absorbent element.

[0027] The water electrolysis device includes an electrolyte membrane, which comprises:

[0028] An anode layer is in contact with the outer surface of the water-absorbing element. When the water electrolysis element is energized, the anode layer decomposes the water adsorbed by the water-absorbing element into oxygen and hydrogen ions.

[0029] A cathode layer is disposed on the side of the anode layer away from the water-absorbing element. When the water electrolysis element is energized, the cathode layer reduces the hydrogen ions into hydrogen gas.

[0030] A proton exchange membrane is disposed between the anode layer and the cathode layer, and is used to conduct hydrogen ions from the anode layer to the cathode layer.

[0031] Compared with the prior art, the present application has the following advantages by setting a fan device and a humidity control device near the cold end: it can effectively prevent condensation at the cold end, and at the same time improve the cooling efficiency and humidity control efficiency of the temperature control room. Attached Figure Description

[0032] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings, wherein:

[0033] Figure 1 This is a schematic diagram of the structure of a refrigeration device according to one embodiment of this application;

[0034] Figure 2This is a cross-sectional view of a temperature-controlled chamber and related components according to an embodiment of this application;

[0035] Figure 3 yes Figure 2 A magnified view of a portion of the image;

[0036] Figure 4 This is a schematic diagram of the structure of the temperature control chamber and related components according to one embodiment of this application;

[0037] Figure 5 yes Figure 4 Exploded view;

[0038] Figure 6 yes Figure 5 Schematic diagram of the inner shell structure;

[0039] Figure 7 yes Figure 5 Schematic diagram of the structure of the intermediate insulation layer;

[0040] Figure 8 yes Figure 5 A schematic diagram of the middle drawer.

[0041] The components include: 1. Temperature control chamber; 11. Opening; 12. Storage space; 13. Inner shell; 14. Outer shell; 15. Insulation layer; 2. Semiconductor refrigeration device; 21. Cold end; 22. Hot end; 3. Fan device; 31. Cooling fan; 32. Heat dissipation fan; 4. Humidity control device; 41. Water absorption component; 411. Moisture absorption functional layer; 412. Oxygen barrier functional layer; 42. Water electrolysis component; 421. Anode layer; 422. Cathode layer; 423. Proton exchange membrane; 5. Detection device; 51. Humidity sensor; 52. Temperature sensor; 6. Insulation component; 7. Drawer; 100. Refrigeration equipment; 101. Cabinet; 102. Door; 103. Storage room. Detailed Implementation

[0042] The present patent will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present patent, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of this patent.

[0043] Reference Figures 1 to 3 This application provides a refrigeration device 100. In one embodiment of this application, the refrigeration device 100 includes a temperature-controlled chamber 1. The refrigeration device may include a housing 101 and a door 102 for opening and closing the housing 101. The temperature-controlled chamber 1 may be disposed in the housing 101 or in the door 102.

[0044] In this application, the temperature-controlled chamber 1 refers to a relatively independent gas-isolated space enclosed by a structure, which is a closed or semi-closed area used to achieve temperature control. The temperature-controlled chamber 1 contains a storage space 12 for storing items, which can be used to store food, fresh produce, and other items that have specific temperature requirements.

[0045] "Within temperature control chamber 1" refers to the area within temperature control chamber 1. Specifically, "within temperature control chamber 1" includes the space enclosed by the walls of temperature control chamber 1, which may include the front wall, rear wall, left and right side walls, top wall, and bottom wall. "Within temperature control chamber 1" also includes the inner surface of the walls of temperature control chamber 1, i.e., the portion of the wall facing the accommodating space 12, which is also part of temperature control chamber 1. The area within temperature control chamber 1 is the target area for temperature regulation by the refrigeration equipment 100 and is the working area where items directly contact and are used.

[0046] "Outside temperature control room 1" refers to the spatial area surrounding the structure of temperature control room 1, that is, all areas not belonging to the interior of temperature control room 1. Specifically, "outside temperature control room 1" includes the area in the external space that is adjacent to temperature control room 1 but not enclosed by the walls of temperature control room 1. "Outside temperature control room 1" also includes the outer wall surface of temperature control room 1, that is, the wall surface facing the external space of temperature control room 1.

[0047] The refrigeration equipment 100 includes a semiconductor refrigeration device 2. The semiconductor refrigeration device 2 is the core component for achieving rapid cooling and precise temperature control inside the temperature-controlled chamber 1. Based on the thermoelectric cooling principle, namely the Peltier effect, the semiconductor refrigeration device 2 uses electric current to drive heat flow between the hot and cold ends, thereby achieving active cooling of the local space. The semiconductor refrigeration device 2 typically consists of multiple N-type and P-type semiconductor materials arranged alternately, connected by thermally conductive ceramic plates or metal electrodes to form a thermocouple structure.

[0048] The semiconductor cooling device 2 includes a cold end 21 and a hot end 22. When energized, a temperature difference is created between the cold end 21 and the hot end 22. When the semiconductor cooling device 2 is energized, the cold end 21 absorbs heat from the temperature control chamber 1, while the hot end 22 dissipates the heat to the outside, achieving energy transfer and thus rapidly reducing the gas temperature inside the temperature control chamber 1. This mechanism has a fast response speed and can achieve precise temperature control in a small space like the temperature control chamber 1.

[0049] The cold end 21 is at least partially located within the temperature-controlled chamber 1. That is, the cold end 21 can be entirely located within the temperature-controlled chamber 1, or it can be partially located within the temperature-controlled chamber 1. By making the cold end 21 directly face the storage chamber 103, the cold end 21 can directly contact the gas in the temperature-controlled chamber 1, forming a heat exchange, thereby reducing the temperature of the temperature-controlled chamber 1 and achieving cooling for the temperature-controlled chamber 1. The cold end 21 can be located in the top, rear wall, or bottom area of ​​the temperature-controlled chamber 1.

[0050] The refrigeration equipment 100 includes a fan unit 3. The fan unit 3 includes a cooling fan 31. The cooling fan 31 is located inside the temperature control chamber 1, near the cold end 21. The cooling fan 31 is used to promote gas flow at the cold end 21. The cooling fan 31 may adopt an axial flow micro fan structure.

[0051] The cooling fan 31 effectively suppresses condensation at the cold end 21. During the cooling process of the semiconductor refrigeration device 2, the surface temperature of the cold end 21 may be lower than the dew point, easily causing localized condensation. The dew point is the temperature at which water vapor begins to condense when the air maintains a constant water vapor content. When the air temperature drops to the dew point, the water vapor in the air reaches saturation and begins to condense into water droplets. The cooling fan 31 promotes continuous airflow around the cold end 21, preventing air from lingering at the cold end 21 and forming a stagnant zone. This effectively reduces the temperature difference buildup at the cold end 21, thereby reducing the risk of localized condensation at the cold end 21 and achieving anti-condensation at the cold end 21.

[0052] Furthermore, the cooling fan 31 can also improve cooling efficiency. The cooling fan 31 forces airflow across the surface of the cold end 21, creating an enhanced air convection heat transfer zone. Compared to natural convection, the cooling fan 31 accelerates airflow within the temperature control chamber 1, significantly increasing the heat exchange rate of the cold end 21, allowing cold energy to be transferred to the air in the temperature control chamber 1 more efficiently, thus improving the overall cooling response speed and cooling depth. Furthermore, the cooling fan 31 promotes a large circulating airflow field throughout the temperature control chamber 1, ensuring uniform diffusion of cold energy within the containment space 12, improving temperature control consistency, and contributing to the overall preservation of goods.

[0053] The refrigeration equipment 100 includes a humidity control device 4. The humidity control device 4 is used to adsorb water within the temperature control chamber 1. When the surface temperature of the cold end 21 is below the dew point, water vapor in the air easily condenses into water droplets, causing condensation. The humidity control device 4 is positioned close to the cold end 21, creating a preferential moisture absorption zone in the local space around the cold end 21. It actively captures moisture from the high-humidity air near the cold end 21, reducing the local relative humidity around the surface of the cold end 21, effectively preventing water vapor condensation and achieving the purpose of preventing condensation.

[0054] In addition, the humidity control device 4 also plays a role in humidity control throughout the entire temperature control chamber 1. It can dynamically adjust the indoor humidity to prevent excessive humidity from causing food to mold, change in flavor, or grow bacteria. It can achieve precise control of the humidity range and work together with temperature control to create a suitable storage environment.

[0055] The humidity control device 4 and the cooling fan 31 work together to produce a significant synergistic amplification effect, improving the anti-condensation efficiency of the cold end 21 and the dehumidification efficiency of the temperature control chamber 1. The fan drives the airflow within the temperature control chamber 1, causing water vapor to pass through the surface of the humidity control device 4 more quickly, thereby increasing its moisture absorption efficiency per unit time. The airflow driven by the fan can quickly diffuse the dry gas absorbed by the humidity control device 4 into the interior of the temperature control chamber 1, avoiding the formation of localized over-humidified or over-dry areas and achieving a balanced humidity distribution.

[0056] The combination of the cooling fan 31, the humidity control device 4, and the cold end 21 can achieve coupled temperature and humidity control. The cold end 21 provides cooling capacity, and the humidity control device 4 maintains a dry environment. The two work together under the drive of the fan to form a dynamic and stable temperature and humidity circulation system, realizing the synchronous control of space cooling and humidity control.

[0057] In another embodiment of this application, the cold end 21 may also be located outside the temperature control chamber 1. The refrigeration equipment 100 includes a cooling wall that is at least partially located inside the temperature control chamber 1 and communicates with the cold end 21. A cooling fan 31 is located near the cooling wall. The cooling fan 31 is used to promote gas flow at the cooling wall. A humidity control device 4 is located near the cooling wall. The cooling wall may be located at the top, rear wall, or bottom of the temperature control chamber 1.

[0058] The cold end 21 of the semiconductor cooling device 2 can be located outside the temperature control chamber 1, and the cooling capacity of the cold end 21 is indirectly transferred to the temperature control chamber 1 through a cold-conducting wall. This arrangement physically isolates the cold end 21 from the internal environment of the temperature control chamber 1, simplifying the structure and reducing the risk of condensation on the cold end 21. The cold-conducting wall can be made of a solid material with excellent thermal conductivity. One side of the cold-conducting wall can be in thermal contact with the cold end 21, for example, by means of a heat-conducting sheet or direct contact, to obtain the low temperature generated by the cold end 21; the surface of the other side of the cold-conducting wall can be arranged inside the temperature control chamber 1 as a cooling release surface, directly exchanging heat with the air in the temperature control chamber 1 to achieve cooling transfer. The cold-conducting wall can be flat, etc.

[0059] The cooling fan 31 is positioned close to the cooling wall to prevent condensation. By forcing air convection, the cooling fan 31 reduces humidity accumulation near the surface of the cooling wall, minimizing the formation of localized supercooled areas and effectively reducing the likelihood of condensation on the cooling wall surface. Furthermore, by promoting airflow at the cooling wall, the cooling fan 31 also improves the heat exchange efficiency of the cooling wall. The fan pushes air across the surface of the cooling wall, accelerating the heat exchange process and allowing the coolness released from the cooling wall to be distributed more quickly to the temperature control chamber 1.

[0060] The humidity control device 4 is positioned near the cooling wall to prevent localized humidity increases in the cooling wall area. During the release of cooling capacity, the surface of the cooling wall may become a hotspot for moisture condensation. The humidity control device 4 preferentially absorbs moisture at this location, maintaining a locally dry state on the cooling wall and further enhancing its anti-condensation capability. Under the airflow generated by the cooling fan 31, moisture is guided to the surface of the humidity control device 4, where it is rapidly dehumidified in conjunction with the adsorption structure, effectively delaying or preventing condensation near the dew point of the cooling wall.

[0061] Reference Figure 2 and Figure 3 In one embodiment of this application, the humidity control device 4 includes a water-absorbing element 41. The water-absorbing element 41 is located on an inner surface inside the temperature control chamber 1. The water-absorbing element 41 also includes an outer surface outside the temperature control chamber 1. The water-absorbing element 41 absorbs water from the temperature control chamber 1 through its inner surface via physical adsorption. The humidity control device 4 also includes a water electrolysis element 42. The water electrolysis element 42 is disposed on the outer surface side of the water-absorbing element 41 and is used to electrolyze the water adsorbed by the water-absorbing element 41.

[0062] The humidity control device 4 of this application includes a water absorption element 41 and an electrolysis element 42, which together constitute a humidity control structure with active dehumidification and automatic regeneration capabilities, enabling continuous, cyclical, and efficient moisture management while keeping the temperature control chamber 1 dry.

[0063] The water-absorbing component 41 includes the following two surface areas: The inner surface of the water-absorbing component 41, located inside the temperature control chamber 1 and facing the air space inside the temperature control chamber 1, serves as the adsorption interface that directly contacts the moisture inside the temperature control chamber 1. The outer surface of the water-absorbing component 41, located outside the temperature control chamber 1 or on the outer wall of the temperature control chamber 1, participates in the moisture removal process and cooperates with the water electrolysis component 42.

[0064] The absorbent component 41 can be made of materials with good hydrophilicity and moisture storage capacity, such as HCS multilayer humidity-regulating membrane, polymer gel membrane, nanoporous moisture-absorbing layer, etc., which have strong physical adsorption capacity and can continuously adsorb water vapor in the temperature-controlled chamber 1 without consuming energy.

[0065] The inner surface of the water-absorbing component 41 quickly captures water vapor molecules in the air of the temperature control chamber 1 through physical adsorption, effectively reducing the relative humidity. The water-absorbing component 41 can be installed on the wall of the temperature control chamber 1 without occupying the volume of the accommodating space 12, which is conducive to module integration. The water-absorbing component 41 has passive moisture absorption characteristics and can continuously absorb moisture, which is suitable for the low power consumption operation requirements of the temperature control chamber 1.

[0066] An electrolytic water element 42, disposed on the outer surface of the absorbent element 41, is used to electrolyze the water already adsorbed in the absorbent element 41. When the absorbent element 41 reaches its saturation threshold for adsorbed water, or when the humidity in the temperature-controlled chamber 1 approaches the condensation risk value, the control module activates the electrolytic water element 42, causing the water in the absorbent element 41 to be electrolyzed and converted into gas, which is then discharged. After the water in the absorbent element 41 is consumed by the electrolytic water element 42, the membrane of the absorbent element 41 can be automatically regenerated, maintaining its long-term moisture absorption capacity.

[0067] The humidity control device 4 in this embodiment, through the combination of water absorption element 41 and water electrolysis element 42, can achieve the following: when the humidity of the temperature control chamber 1 is low, the water electrolysis element 42 is not activated, and the humidity of the temperature control chamber 1 is controlled solely by the physical adsorption effect of the water absorption element 41. When the humidity of the temperature control chamber 1 is high, the water electrolysis element 42 is activated. The humidity of the temperature control chamber 1 is controlled by the cooperation of the water absorption element 41 and the water electrolysis element 42, resulting in good dehumidification effect and low energy consumption.

[0068] The electrolysis unit 42 enables the active removal of moisture from the absorbent component 41, eliminating reliance on natural evaporation or periodic replacement. This maintains the long-term, efficient operation of the absorbent component 41 and prevents adsorption capacity degradation. The electrolysis unit 42 effectively avoids the need for consumable replacements, allowing for the recycling of the membrane in the absorbent component 41, extending its lifespan, and improving the long-term stability and maintainability of the system. The electrolysis unit 42 is activated only when the absorbent component 41 is saturated with moisture or when a high humidity warning is issued, resulting in low overall energy consumption and environmental friendliness.

[0069] Reference Figure 2 and Figure 3 In one embodiment of this application, the refrigeration equipment 100 includes a detection device 5. The detection device 5 is used to detect the humidity and / or temperature inside the temperature-controlled chamber 1. The refrigeration equipment 100 includes a control module. The control module is communicatively connected to the detection device 5.

[0070] Specifically, the detection device 5 may include a humidity sensor 51 for detecting the humidity inside the temperature-controlled chamber 1. The control module is communicatively connected to the humidity sensor 51. The humidity sensor 51 can send the detected humidity information of the temperature-controlled chamber 1 to the control module. The detection device 5 may also include a temperature sensor 52 for detecting the temperature inside the temperature-controlled chamber 1. The temperature sensor 52 is communicatively connected to the control module. The temperature sensor 52 can send the detected temperature information of the temperature-controlled chamber 1 to the control module.

[0071] The detection device 5 can monitor the temperature and humidity environment inside the temperature control room 1, providing real-time data support for the dynamic control of components such as the humidity control device 4, the water electrolysis device 42, and the fan device 3.

[0072] Reference Figure 2 and Figure 3In one embodiment of this application, the control module is communicatively connected to the water electrolysis unit 42. When the humidity inside the temperature control chamber 1 is higher than a preset humidity value, the control module controls the water electrolysis unit 42 to electrolyze the water adsorbed by the water absorption unit 41. The preset humidity value is a value pre-set by the designer.

[0073] When the humidity inside the temperature control chamber 1 is higher than the preset humidity value, the control module determines that the current ambient humidity is too high, and there is a risk of condensation or unstable storage environment. It then triggers a control signal to start the operation of the water electrolysis device 42, which electrolyzes and discharges the water adsorbed by the water absorption device 41, thereby restoring the moisture absorption capacity of the water absorption device 41 and reducing the humidity of the temperature control chamber 1.

[0074] Reference Figure 2 and Figure 3 In one embodiment of this application, when the temperature inside the temperature control chamber 1 is lower than the dew point temperature, the control module is used to control the water electrolysis component 42 to electrolyze the water adsorbed by the water absorption component 41.

[0075] The control module can calculate the dew point temperature of the air based on the temperature and current humidity inside the temperature control chamber 1, or directly use the set dew point temperature threshold. When the temperature inside the temperature control chamber 1 is detected to be lower than the dew point temperature value, the control module automatically determines that water vapor condensation may occur, and immediately controls the operation of the water electrolysis unit 42 to discharge the water in the water absorption unit 41 in a timely manner, thereby reducing the risk of water vapor saturation in the cold zone from the source and realizing active anti-condensation control.

[0076] The detection device 5 of this application, in conjunction with the control module and humidity control structure, enables intelligent dehumidification response. It senses humidity changes in real time and dynamically drives the electrolytic water element 42 to operate, achieving rapid adjustment during humidity fluctuations and avoiding manual intervention. Dehumidification is triggered by a combination of temperature, humidity, or humidity, especially when the temperature at the cold end 21 or the cooling wall approaches the dew point, effectively delaying or preventing surface condensation. The electrolytic water element 42 is activated only when necessary, reducing ineffective operation, extending its service life, reducing energy consumption, and preventing corrosion and damage to critical components such as the cold end 21 and circuitry caused by condensation.

[0077] Reference Figure 2 and Figure 3 In one embodiment of this application, the control module and the semiconductor cooling device 2 are communicatively connected. The control module is used to control the current of the semiconductor module according to the internal temperature of the temperature control chamber 1, so that the internal temperature of the temperature control chamber 1 is proportional to the current of the semiconductor module.

[0078] The control module is communicatively connected to the semiconductor refrigeration device 2. This communication connection allows the control module to regulate the operating status of the semiconductor refrigeration device 2 in real time, particularly adjusting its power supply current, thereby dynamically controlling the cooling capacity of the cold end 21. The control module can automatically adjust the current output to the semiconductor refrigeration device 2 based on the real-time temperature value detected inside the temperature control chamber 1 to achieve precise temperature control.

[0079] When the temperature inside the temperature control chamber 1 is detected to be higher than the target temperature setting, the control module can increase the current output to enhance the cooling power of the semiconductor refrigeration device 2. When the temperature inside the temperature control chamber 1 is detected to be close to or lower than the target setting, the control module can automatically reduce the current to appropriately weaken the cooling intensity or maintain a constant temperature.

[0080] The control logic of the control module can be set as follows: the deviation between the internal temperature of the temperature control chamber 1 and the target set temperature is proportional to the current intensity of the semiconductor refrigeration device 2. The higher the internal temperature of the temperature control chamber 1, the greater the current of the semiconductor refrigeration device 2, and the stronger the cooling capacity of the semiconductor refrigeration device 2. The lower the internal temperature of the temperature control chamber 1, the smaller the current of the semiconductor refrigeration device 2, and the weaker or non-cooling capacity of the semiconductor refrigeration device 2.

[0081] The cooling capacity of a semiconductor refrigeration module is directly proportional to its operating current. The control module dynamically adjusts the current output in real time based on the temperature, achieving precise temperature control and meeting the requirements for high-precision control of the storage environment. This control method improves cooling efficiency and reduces energy consumption. By adjusting the current as needed, the semiconductor refrigeration module avoids prolonged full-power operation, reducing power output when the ambient temperature is low or the load is light, thereby reducing energy consumption and extending equipment life.

[0082] Reference Figure 2 and Figure 3 In one embodiment of this application, the control module is communicatively connected to the fan device 3. The control module is used to control the rotation speed of the cooling fan 31 according to the internal temperature of the temperature control chamber 1, so that the internal temperature of the temperature control chamber 1 is proportional to the rotation speed of the cooling fan 31.

[0083] The control module continuously receives real-time temperature data from temperature sensor 52. When the temperature of the temperature-controlled chamber 1 is higher than the target temperature setpoint, the control module can increase the speed of the cooling fan 31 to enhance air convection and improve the heat exchange rate. When the temperature of the temperature-controlled chamber 1 is close to or lower than the target value, the control module can reduce the fan speed to maintain stable cooling capacity and reduce energy consumption. The fan can be a speed-adjustable motor, such as a pulse-width modulation drive fan or a voltage-controlled fan.

[0084] When the temperature in the temperature control chamber 1 rises, the fan speed increases, causing air to flow more forcefully through the cooling wall or cold end 21, enhancing thermal convection and thus increasing the rate of cooling release, achieving a faster temperature adjustment response. The control module adjusts the fan speed as needed based on the actual temperature, avoiding ineffective high-speed operation, reducing power consumption and noise, and extending the fan's lifespan.

[0085] Reference Figure 2 and Figure 3 In one embodiment of this application, the cold end 21 is oriented in a first direction. The humidity regulating device 4 surrounds the cold end 21 circumferentially along the first direction.

[0086] The cold end 21 can be a planar heat exchange surface, and its orientation is the "first direction" defined in this application. The circumferential direction of the first direction is the direction surrounding the first direction. For example, the cold end 21 is located at the top of the storage chamber 103 and faces downwards, so the first direction is the downward direction, and the circumferential direction of the first direction is the front-back direction and the left-right direction.

[0087] The humidity control device 4 can be a ring-shaped integrated structure or it can include multiple humidity control units. The circumferential orientation of the cold end 21 of the humidity control device 4, that is, the 360-degree direction around the cold end 21, forms a distribution that surrounds or semi-surrounds the cold end 21.

[0088] The area surrounding the cold end 21 is a high-risk area for condensation. The humidity control device 4 is arranged around it, forming an efficient moisture absorption barrier around the cold end 21. This creates a circumferential protective zone for the cold end 21, promptly absorbing accumulated moisture, reducing surface humidity, and inhibiting condensation formation. The surrounding structure can evenly distribute the moisture absorption function, avoiding the phenomenon of humidity decreasing in one area of ​​the cold end 21 while humidity remains accumulated in other areas due to single-point dehumidification, thus achieving more balanced and stable humidity control.

[0089] The fan can be located in the middle of the humidity control device 4. The surrounding humidity control device 4 can accelerate the diffusion of water vapor on the surface of the humidity control membrane by means of the airflow driven by the fan, thereby improving the moisture absorption efficiency per unit time.

[0090] The humidity control device 4 can be arranged in a closed ring to surround the cold end 21, and the fan is located at the center of the ring of the humidity control device 4.

[0091] Reference Figure 2 and Figure 3 In one embodiment of this application, the refrigeration device 100 includes a heat insulation member 6. The heat insulation member 6 circumferentially covers the semiconductor refrigeration device 2 along a first direction. The heat insulation member 6 is disposed between the humidity regulating device 4 and the semiconductor refrigeration device 2.

[0092] The insulation component 6 is positioned between the humidity regulating device 4 and the semiconductor refrigeration device 2, covering and surrounding the semiconductor refrigeration device 2 circumferentially along the first direction in which the cold end 21 faces, forming an effective thermal insulation barrier. The humidity regulating device 4 is arranged around the outside of the cold end 21 circumferentially, and the insulation component 6 is positioned between it and the refrigeration module; that is, the cold end 21 is inside, the humidity regulating device 4 is outside, and the insulation component 6 is in the middle. The insulation component 6 can be made of a thermal insulation material with low thermal conductivity, such as polyurethane foam, vacuum insulation board, aerogel composite board, EVA foam, etc.

[0093] The insulation component 6, acting as a heat insulation layer between the cold end 21 and the external structure, effectively reduces the ineffective diffusion of cold energy in non-target directions, suppresses heat loss from the cold end 21, and concentrates the cold energy on the gas inside the temperature control chamber 1, thereby improving heat exchange efficiency and reducing energy consumption. The insulation component 6 eliminates the "thermal bridge" effect between the cold end 21 and the surrounding heat conduction paths, preventing temperature difference interference or condensation at the hot-cold interface, thus maintaining the thermal stability of the refrigeration system. With the insulation component 6 installed, the adsorption surface of the humidity control device 4 is protected from the low-temperature effects of direct radiation or conduction from the cold end 21, preventing condensation or ice formation on the water absorption component 41 due to localized overcooling, and maintaining the stable moisture absorption efficiency of the humidity control device 4. The humidity control device 4 and the cold end 21 are separated by the insulation component 6, forming a partitioned structure where functions do not interfere with each other: the inner layer is the refrigeration and temperature control zone, and the outer layer is the active moisture absorption zone, which facilitates coordinated system control and modular design.

[0094] Reference Figure 2 and Figure 3 In one embodiment of this application, the hot end 22 is located outside the temperature control chamber 1, and the fan device 3 includes a heat dissipation fan 32 located outside the temperature control chamber 1. The heat dissipation fan 32 is close to the hot end 22 and is used to dissipate heat from the hot end 22.

[0095] The hot end 22 is located outside the temperature control chamber 1 and is used to release the heat absorbed by the cold end 21 to the external environment of the temperature control chamber 1, so as to maintain the low temperature of the cold end 21 and achieve continuous cooling. To improve the heat dissipation efficiency of the hot end 22, the cooling fan 32 is arranged close to the hot end 22 to form an air-cooled heat dissipation structure. Its function is to drive the airflow across the surface of the hot end 22, carry away the heat released therefrom, and avoid heat accumulation that would cause a decrease in temperature difference or a reduction in cooling efficiency.

[0096] Reference Figures 1 to 3 The refrigeration equipment 100 includes a storage compartment 103. The storage compartment 103 can be a refrigerator compartment, a freezer compartment, or a variable temperature compartment, etc. A temperature control compartment 1 is located inside the storage compartment 103.

[0097] The refrigeration equipment 100 includes a cooling air duct. The cooling air duct is used to supply cooling to the storage compartment 103. The refrigeration equipment 100 may include a refrigeration system. The refrigeration system may include a compressor, a condenser, and an evaporator. The evaporator may be disposed within the cooling air duct. The refrigeration equipment 100 may include a storage cooling fan disposed within the cooling air duct. When the storage cooling fan is activated, it blows cold air from the cooling air duct into the storage compartment 103 to lower the temperature inside the storage compartment 103. The cooling air duct is used to deliver cold air to the storage compartment 103 to achieve cooling and preservation of items within the storage compartment 103.

[0098] The hot end 22 and the cooling fan 32 are connected to the cooling air duct. The hot end 22 and the cooling fan 32 can be directly installed inside the cooling air duct. Alternatively, the refrigeration equipment 100 includes a cooling air duct connecting the cooling air duct and the hot end 22, and the cooling fan 32 is installed inside the cooling air duct.

[0099] The cooling air duct may include a supply air duct and a return air duct that communicate with the storage room 103. Preferably, the hot end 22 and the cooling fan 32 are connected to the return air duct of the cooling air duct to reduce the impact of heat dissipation from the hot end 22 on the cooling of the storage room 103.

[0100] The hot end 22 of the semiconductor cooling device 2 and its corresponding cooling fan 32 are connected to the cooling duct, enabling the use of the low-temperature airflow within the cooling duct to cool the hot end 22, thereby improving its heat dissipation efficiency and cooling performance. The cooling duct contains low-temperature air generated by the evaporator or other cold sources. The hot end 22 and the cooling fan 32 are positioned in a location directly or indirectly connected to the duct. When the cooling fan 32 operates, it guides some of the cold air from the cooling duct through the hot end 22, forming a cooling airflow and enhancing the heat exchange efficiency between the hot end 22 and the environment. This structure provides an auxiliary cooling air source for the hot end 22, effectively reducing the ambient temperature gradient around the hot end 22, thereby accelerating heat release from the hot end 22, increasing the temperature difference between the hot and cold ends of the semiconductor module, and enhancing its cooling capacity.

[0101] Enhanced heat dissipation at the hot end 22 helps maintain a consistently low temperature at the cold end 21, preventing a temperature rise in the cold end 21 due to heat buildup at the hot end 22 and ensuring accurate temperature control and stable cooling. Utilizing existing cold air resources in the cooling duct to cool the hot end 22 eliminates the need for a separate cooling system or forced air cooling unit, simplifying the structural design, reducing fan load, and achieving energy-saving operation. By integrating the heat dissipation function of the hot end 22 into the cooling duct, "duct reuse" is achieved, cooling both the storage compartment 103 and assisting in cooling the hot end 22, reducing structural redundancy and piping redundancy, and improving the overall compactness and maintainability of the unit.

[0102] Reference Figures 2 to 4In one embodiment of this application, an opening 11 is formed on the front side of the temperature control chamber 1. In this application, "front" refers to the orientation of the opening 11 of the temperature control chamber 1. "Rear" refers to the direction opposite to the orientation of the opening 11 of the temperature control chamber 1. "Left" and "right" refer to the left-hand side being left and the right-hand side being right when facing the opening 11 of the temperature control chamber 1. "Up" refers to the direction opposite to the direction of gravity. "Down" refers to the direction along the direction of gravity.

[0103] The temperature control chamber 1 has an internal accommodating space 12. The walls of the temperature control chamber 1 may include an inner shell 13, an outer shell 14, and an insulation layer 15 disposed between the inner shell 13 and the outer shell 14. The outer shell 14 may be provided with a connection structure that cooperates with the wall of the storage chamber 103, so that the temperature control chamber 1 is fixedly installed in the storage chamber 103. The refrigeration equipment 100 also includes a drawer 7. The drawer 7 is provided in the temperature control chamber 1 through an opening 11.

[0104] This application utilizes the coordinated operation of the inner shell 13, the insulation layer 15, and the outer shell 14 to create a relatively independent insulation space within the temperature control chamber 1, which facilitates precise temperature control. Based on this independent insulation structure, in conjunction with the semiconductor refrigeration device 2, the fan device 3, and the humidity control device 4, the internal environment of the temperature control chamber 1 can be regulated, enabling precise control of the temperature and humidity within the temperature control chamber 1.

[0105] In one embodiment of this application, the refrigeration device 100 includes an integrated module. The integrated module includes a semiconductor refrigeration device 2, a fan device 3, and a humidity control device 4. The integrated module is detachably plugged into the wall of the temperature control chamber 1.

[0106] By integrating cooling, air supply, and humidity control functions into a single module, the complex wiring and wasted space associated with traditional distributed structures are reduced, contributing to the standardization and lightweight design of the entire unit. The module features a pluggable structure, allowing users or maintenance personnel to quickly replace or maintain the integrated module without disassembling the entire unit, significantly improving the maintainability and ease of use of the equipment.

[0107] Integrated modules allow for unified production, testing, and pre-assembly at the factory stage, improving product consistency, reducing on-site assembly errors, and facilitating large-scale production and quality control. The coordinated layout of functional components within the module facilitates the spatial linkage design of cold-end cooling, fan airflow, and humidity control / adsorption, optimizing heat exchange paths and airflow organization, and improving overall system operating efficiency.

[0108] Reference Figure 2 and Figure 3 In one embodiment of this application, the cold end 21 is oriented in a first direction, and the hot end 22 is oriented in a second direction. The first direction and the second direction are opposite. The cooling fan 31 is disposed on the first direction side of the cold end 21, and the heat dissipation fan 32 is disposed on the second direction side of the hot end 22.

[0109] Reference Figure 2 and Figure 3 In one embodiment of this application, the integrated module is detachably plugged into the top wall of the temperature control chamber 1. The cold end 21 faces downwards, and the hot end 22 faces upwards. A cooling fan 31 is disposed below the cold end 21. A heat dissipation fan 32 is disposed above the hot end 22. A humidity regulating device 4 surrounds the cold end 21 in both the front-back and left-right directions. The inner surface of the water-absorbing component 41 faces downwards, and the outer surface of the water-absorbing component 41 faces upwards. An electrolytic water component 42 is disposed above the water-absorbing component 41. A heat insulation component 6 surrounds the semiconductor refrigeration module in both the front-back and left-right directions.

[0110] Reference Figure 2 and Figure 3 In one embodiment of this application, the absorbent element 41 includes an HCS oxygen barrier and humidity regulating membrane. The HCS oxygen barrier and humidity regulating membrane includes a moisture-absorbing functional layer 411. The moisture-absorbing functional layer 411 is located near the inner surface of the absorbent element 41, i.e., facing the interior of the temperature control chamber 1. The moisture-absorbing functional layer 411 is located inside the temperature control chamber 1. This functional layer has the ability to quickly absorb moisture from the air and can work continuously in a passive state. The moisture-absorbing functional layer 411 is located inside the temperature control chamber 1 and is in direct contact with the air in the storage space, serving as the first interface for moisture adsorption.

[0111] The HCS oxygen barrier moisture-regulating membrane includes an oxygen barrier functional layer 412. The oxygen barrier functional layer 412 is located near the outer surface of the absorbent element 41. The oxygen barrier functional layer 412 can be located outside the temperature control chamber 1. Specifically, the oxygen barrier functional layer 412 is positioned on the outer surface of the absorbent element 41, i.e., away from the temperature control chamber 1 and close to the electrolytic structure. The oxygen barrier functional layer 412 is used to inhibit the penetration of external oxygen, water vapor, and other gases into the moisture-absorbing layer, maintaining the stability of the moisture-absorbing material.

[0112] The water electrolysis unit 42 includes an electrolyte membrane, which includes an anode layer 421. The anode layer 421 can be in contact with the outer surface of the water absorption unit 41. When the water electrolysis unit 42 is energized, the anode layer 421 decomposes the water adsorbed by the water absorption unit 41 into oxygen and hydrogen ions. The generated oxygen can be released through a vent or an exhaust channel.

[0113] The electrolyte membrane includes a cathode layer 422. The cathode layer 422 is disposed on the side of the anode layer 421 away from the water absorption element 41. When the water electrolysis element 42 is energized, the cathode layer 422 reduces hydrogen ions to hydrogen gas. The generated hydrogen gas can be released or treated by adsorption through a vent or exhaust channel.

[0114] The electrolyte membrane includes a proton exchange membrane 423. The proton exchange membrane 423 is disposed between the anode layer 421 and the cathode layer 422, and is used to conduct hydrogen ions from the anode layer 421 to the cathode layer 422.

[0115] The moisture-absorbing layer 411 can perform primary dehumidification without energy consumption, while the electrolyte membrane activates under conditions of excessive humidity or dew point risk, realizing an active humidity control mechanism. The absorbed moisture is converted into gas and discharged through the water electrolysis unit 42, restoring the moisture-absorbing unit 41's absorption capacity, avoiding replacement or drying, and improving system stability and maintainability. The oxygen barrier layer effectively suppresses external gas interference, protects the stability of the moisture-absorbing layer, and improves the overall lifespan and adsorption consistency of the humidity control components. The coordinated operation of moisture absorption and electrolysis enables highly efficient dehumidification and anti-condensation capabilities in cold areas.

[0116] The refrigeration equipment 100 in this application can be a refrigerator, freezer, display case, etc.

[0117] In summary, the refrigeration equipment 100 of this application can solve the technical problem in the prior art that the cold end 21 is prone to condensation of air humidity on its surface or in the adjacent area due to continuous low temperature operation, thus forming condensation.

[0118] By employing the technical solution of this application, the humidity control device 4 and the cooling fan 31 can work together to produce a significant synergistic amplification effect, improving the anti-condensation efficiency of the cold end 21 and the dehumidification efficiency of the temperature control chamber 1. The fan drives the airflow within the temperature control chamber 1, prompting water vapor to pass through the surface of the humidity control device 4 more quickly, thereby increasing its moisture absorption efficiency per unit time. The airflow driven by the fan can quickly diffuse the dry gas absorbed by the humidity control device 4 into the interior of the temperature control chamber 1, avoiding the formation of localized over-humidified or over-dry areas and achieving a balanced humidity distribution. The cooperation of the cooling fan 31, the humidity control device 4, and the cold end 21 can achieve coupled temperature and humidity control. The cold end 21 provides cooling, and the humidity control device 4 maintains a dry environment. Under the drive of the fan, the two work together to form a dynamically stable temperature and humidity circulation system, achieving synchronous control of cooling and humidity control within the temperature control chamber 1.

[0119] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0120] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this patent, and are not intended to limit the scope of protection of this patent. All equivalent implementation methods or modifications that do not depart from the spirit of the technology of this patent should be included within the scope of protection of this patent.

Claims

1. A refrigeration device (100), characterized in that, The refrigeration equipment (100) includes: Temperature-controlled room (1); A semiconductor cooling device (2) includes a cold end (21), which is at least partially disposed inside the temperature control chamber (1), or the cold end (21) is disposed outside the temperature control chamber (1), and the cooling equipment (100) includes a cooling wall that is at least partially disposed inside the temperature control chamber (1) and communicates with the cold end (21) for cooling capacity; A fan device (3) includes a cooling fan (31), which is located in the temperature control chamber (1) and is close to the cold end (21) or the cooling wall. The cooling fan (31) is used to promote the flow of gas at the cold end (21) or the cooling wall. A humidity control device (4) is used to adsorb water in the temperature control chamber (1), and the humidity control device (4) is located near the cold end (21) or the cooling wall.

2. The refrigeration equipment (100) as described in claim 1, characterized in that, The humidity control device (4) includes: A water-absorbing component (41) is included on an inner surface inside the temperature control chamber (1) and an outer surface outside the temperature control chamber (1). The water-absorbing component (41) absorbs water in the temperature control chamber (1) by physical adsorption through its inner surface. An electrolytic water element (42) is disposed on the outer surface of the water-absorbing element (41), and the electrolytic water element (42) is used to electrolyze the water adsorbed by the water-absorbing element (41).

3. The refrigeration equipment (100) as described in claim 2, characterized in that, The refrigeration equipment (100) includes: A detection device (5) is used to detect the humidity and / or temperature inside the temperature-controlled chamber (1); The control module is communicatively connected to the detection device (5) and the water electrolysis unit (42). When the humidity inside the temperature control chamber (1) is higher than the preset humidity value or the temperature is lower than the dew point temperature value, the control module is used to control the water electrolysis unit (42) to electrolyze the water adsorbed by the water absorption unit (41).

4. The refrigeration equipment (100) as described in claim 3, characterized in that, The control module and the semiconductor cooling device (2) are connected in communication. The control module is used to control the current of the semiconductor module according to the internal temperature of the temperature control chamber (1) so that the internal temperature of the temperature control chamber (1) is proportional to the current of the semiconductor module.

5. The refrigeration equipment (100) as described in claim 4, characterized in that, The control module is communicatively connected to the fan device (3). The control module is used to control the rotation speed of the cooling fan (31) according to the internal temperature of the temperature control chamber (1) so that the internal temperature of the temperature control chamber (1) is proportional to the rotation speed of the cooling fan (31).

6. The refrigeration equipment (100) as described in claim 1, characterized in that, The cold end (21) is oriented in a first direction, and the humidity control device (4) surrounds the cold end (21) circumferentially along the first direction. The refrigeration device (100) includes a heat insulation component (6), which covers the semiconductor refrigeration device (2) circumferentially along the first direction. The heat insulation component (6) is disposed between the humidity control device (4) and the semiconductor refrigeration device (2).

7. The refrigeration equipment (100) as described in claim 1, characterized in that, The refrigeration equipment (100) includes an integrated module, which includes the semiconductor refrigeration device (2), the fan device (3), and the humidity control device (4). The integrated module is detachably plugged into the wall of the temperature control chamber (1).

8. The refrigeration equipment (100) as described in claim 1, characterized in that, The semiconductor cooling device (2) includes a hot end (22) located outside the temperature control chamber (1). The fan device (3) includes a cooling fan (32) located outside the temperature control chamber (1) and close to the hot end (22). The cooling fan (32) is used to dissipate heat from the hot end (22). The cooling equipment (100) includes: Storage room (103), the temperature control room (1) is located in the storage room (103); A cooling air duct for supplying cooling to the storage room (103); The hot end (22) and the cooling fan (32) are connected to the cooling air duct.

9. The refrigeration equipment (100) as described in claim 8, characterized in that, The cold end (21) faces a first direction, and the hot end (22) faces a second direction. The first direction is opposite to the second direction. The cooling fan (31) is located on the first direction side of the cold end (21), and the heat dissipation fan (32) is located on the second direction side of the hot end (22). An opening (11) is formed on the front side of the temperature control chamber (1). The refrigeration equipment (100) also includes a drawer (7), which is slidably installed in the temperature control chamber (1) through the opening (11).

10. The refrigeration equipment (100) as described in claim 2, characterized in that, The absorbent element (41) includes an HCS oxygen barrier and humidity regulating membrane, which comprises: A moisture-absorbing functional layer (411) is located near the inner surface of the absorbent element (41); An oxygen barrier layer (412) is located near the outer surface of the absorbent element (41); The water electrolysis unit (42) includes an electrolyte membrane, which comprises: The anode layer (421) is in contact with the outer surface of the water-absorbing element (41). When the water electrolysis element (42) is energized, the anode layer (421) decomposes the water adsorbed by the water-absorbing element (41) into oxygen and hydrogen ions. A cathode layer (422) is disposed on the side of the anode layer (421) away from the water-absorbing element (41). When the water electrolysis element (42) is energized, the cathode layer (422) reduces the hydrogen ions to hydrogen gas. A proton exchange membrane (423) is disposed between the anode layer (421) and the cathode layer (422) for conducting hydrogen ions from the anode layer (421) to the cathode layer (422).

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