Hot plate structure

Abstract

The application discloses a kind of vapor chamber structures, including a bottom plate, a top plate, multiple capillary support platforms and multiple sintered capillary elements;The bottom plate has a containing area, and a frame portion around the containing area, the top plate is covered on the bottom plate and is sealed with the frame portion to cover the containing area, the capillary support platform is arranged in the bottom plate and the top plate, each capillary support platform has a strip-shaped step, and multiple support portions are arranged on the strip-shaped step, and each support portion is arranged along the length direction of the strip-shaped step, and the sintered capillary element is arranged on the capillary support platform, each sintered capillary element has a base, and the side portion is arranged downward from the two sides of the base to sandwich the strip-shaped step, and the base is arranged on the strip-shaped step along the length direction of the strip-shaped step, and each support portion passes through the base to abut the inner surface of the top plate with the top surface of the base.

Description

Technical Field

[0001] This invention relates to a heat transfer element, and more particularly to a heat spreader structure. Background Technology

[0002] Existing vapor chambers are mainly composed of two enclosed plates forming a steam space. In order to maintain the steam space inside the vapor chamber, given its certain area, multiple supporting structures need to be installed between the two plates. This allows the vapor chamber to maintain the required steam space during the manufacturing process, even after methods such as vacuuming.

[0003] However, in existing heat spreaders, in addition to meeting the above conditions, a capillary structure such as sintered powder can be further coated on the support structure to increase the required liquid reflux. However, the existing support structure is too dispersed to form an effective capillary transport.

[0004] In view of this, the inventor, in order to improve and solve the above-mentioned deficiencies, has devoted himself to research and applied theoretical knowledge, and finally proposed an invention with a reasonable design that effectively improves the above-mentioned deficiencies. Summary of the Invention

[0005] The main objective of this invention is to provide a heat spreader structure that, through a design combining support and capillary action, provides a capillary and support structure with polyhedral features.

[0006] To achieve the above objectives, the present invention provides a heat spreader structure, including a base plate, a top plate, a plurality of capillary support platforms, and a plurality of sintered capillary elements; the base plate has a receiving area and a frame surrounding the receiving area, the top plate is placed on the base plate and sealed to the frame to cover the receiving area, the capillary support platforms are disposed within the base plate and the top plate, each capillary support platform has a strip-shaped step and a plurality of support portions disposed on the strip-shaped step, and the support portions are spaced apart along the length direction of the strip-shaped step, and the sintered capillary elements are disposed on the capillary support platforms, each sintered capillary element has a base and side portions extending downward from both sides of the base to clamp the strip-shaped step, and the base is disposed on the strip-shaped step along the length direction of the strip-shaped step, and each support portion passes through the base and abuts against the inner surface of the top plate together with the top surface of the base. Attached Figure Description

[0007] Figure 1 This is a three-dimensional view of the base plate of the present invention;

[0008] Figure 2 This is an exploded perspective view of the base plate and sintered capillary element of the present invention;

[0009] Figure 3 This is a three-dimensional assembly diagram of the present invention;

[0010] Figure 4It is based on Figure 3 Schematic diagram of section 4-4;

[0011] Figure 5 It is based on Figure 3 Schematic diagram of section 5-5;

[0012] Figure 6 It is based on Figure 3 Schematic diagram of section 6-6;

[0013] In the attached figures, the following reference numerals are used:

[0014] 1: Base plate;

[0015] 10: Storage area;

[0016] 10a: Recessed portion;

[0017] 10b: Heated surface;

[0018] 100: Capillary layer;

[0019] 11: Frame;

[0020] 110: Solder bath;

[0021] 12: Short support column;

[0022] 13: Long support column;

[0023] 2: Top slab;

[0024] 3: Capillary support platform;

[0025] 30: Strip-shaped steps;

[0026] 31: Support section;

[0027] 4: Sintered capillary elements;

[0028] 40: Base;

[0029] 400: Through hole;

[0030] 41: Side;

[0031] 410: Cross-slot. Detailed Implementation

[0032] To further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings. However, the drawings are provided for reference and illustration only and are not intended to limit the present invention.

[0033] Please see Figure 1 , Figure 2 and Figure 3The figures are a three-dimensional view of the base plate of the present invention, an exploded three-dimensional view of the base plate and sintered capillary elements, and a three-dimensional assembly diagram of the present invention. The present invention provides a heat spreader structure, comprising a base plate 1, a top plate 2 covering the base plate 1, a plurality of capillary support platforms 3 disposed within the base plate 1 and the top plate 2, and a plurality of sintered capillary elements 4 respectively disposed on each capillary support platform 3; wherein:

[0034] The base plate 1 can be made of a material with good thermal conductivity, such as aluminum or copper. One surface of the base plate 1 has a receiving area 10 and a frame portion 11 surrounding the receiving area 10. At least one recessed portion 10a can be further recessed within the receiving area 10 on the surface of the base plate 1, so that a heated surface 10b (e.g., a heat-receiving surface 10b) protrudes from the other surface of the base plate 1 opposite the recessed portion 10a. Figure 4 or Figure 5 As shown in the figure, it can be used to make contact with a heat source (not shown).

[0035] The top plate 2 can also be made of materials with good thermal conductivity, such as aluminum or copper. Figure 3 As shown, the top plate 2 can be a flat plate and is placed over the receiving area 10 of the base plate 1. A solder groove 110 can be provided on the frame portion 11 of the base plate 1, and the solder groove 110 is filled with solder (not shown) so that when the top plate 2 is placed over the receiving area 10 of the base plate 1, the top plate 2 covers the frame portion 11 and is sealed with solder, thereby forming a vacuum chamber within the receiving area 10 and providing space for the working fluid (not shown) to undergo phase change or the required vapor. Furthermore, a plurality of short support columns 12 and long support columns 13 can be provided between the top plate 2 and the base plate 1. The short support columns 12 are distributed outside the recessed portion 10a, while the long support columns 13 are distributed inside the recessed portion 10a.

[0036] Please see again Figure 1 As shown, the capillary support platforms 3 are disposed within the receiving area 10 of the base plate 1. Specifically, each capillary support platform 3 may be integrally formed or joined to the recess 10a of the receiving area 10 by means of welding or other methods. Each capillary support platform 3 has a strip-shaped step 30 and a plurality of support portions 31 disposed on the strip-shaped step 30, and the support portions 31 are spaced apart along the length direction of the strip-shaped step 30. Furthermore, the capillary support platforms 3 are spaced apart in the recess 10a, and the aforementioned long support columns 13 can be arranged between any two adjacent capillary support platforms 3.

[0037] Please see again Figure 2 and Figure 3As shown, these sintered capillary elements 4 can be formed by sintering metal powder, and are respectively disposed on each of the above-mentioned capillary support stages 3; specifically, a capillary layer 100 can be coated in the recessed portion 10a before each sintered capillary element 4 is attached to each capillary support stage 3. Figure 4 and Figure 5 As shown, each sintered capillary element 4 has a base 40 and side portions 41 extending downward from both sides of the base 40. The base 40 is disposed on the strip-shaped step 30 along its length, and allows the support portions 31 on the strip-shaped step 30 to pass through and abut against the inner surface of the top surface 2 together with the top surface of the base 40 (i.e., as shown). Figure 6 As shown), the two side portions 41 sandwich the strip-shaped step 30 and contact the capillary layer 100 (i.e., as shown). Figure 4 or Figure 5 (As shown). In this way, the capillary support 3 can form a polyhedron, which helps the working fluid to undergo phase change and facilitates its reflux after cooling and liquefaction. At the same time, it can also increase the support between the top plate 2 and the bottom plate 1, which is conducive to maintaining the space inside the accommodating area 10 as the vacuum chamber of the heat spreader or its required vapor space.

[0038] Furthermore, such as Figure 2 As shown, each sintered capillary element 4 has a plurality of through holes 400 on its base 40 to correspond to each support portion 31 and to accommodate each support portion 31; and the base 40 and the two side portions 41 of each sintered capillary element 4 together form a cross groove 410 for the strip-shaped step 30 to be inserted and for each sintered capillary element 4 to be straddled on the strip-shaped step 30.

[0039] Therefore, the heat spreader structure of the present invention can be obtained through the above-described structural composition.

[0040] In conclusion, this invention does indeed achieve the intended use described in the above specification, and overcomes the deficiencies of the prior art. Furthermore, due to its novelty and inventiveness, it fully meets the requirements for an invention patent application. Therefore, this application is filed in accordance with the Patent Act. We respectfully request a thorough review and the granting of this patent to protect the inventor's rights.

[0041] However, the above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent techniques and means made using the contents of the present invention specification and drawings are also included in the scope of the present invention and are hereby stated.

Claims

1. A heat spreader structure, characterized in that, include: A base plate having a receiving area and a frame surrounding the receiving area; A top plate is placed on the bottom plate and sealed to the frame to cover the accommodating area; Multiple capillary support platforms are disposed within the bottom plate and the top plate. Each capillary support platform has a strip-shaped step and multiple support parts disposed on the strip-shaped step, and the multiple support parts are spaced apart along the length direction of the strip-shaped step. as well as Multiple sintered capillary elements are respectively disposed on each of the capillary support platforms. Each sintered capillary element has a base and side portions extending downward from both sides of the base to clamp the strip-shaped step. The base is disposed on the strip-shaped step along its length direction, and the multiple support portions pass through the base and abut against the inner surface of the top plate together with the top surface of the base.

2. The heat spreader structure as described in claim 1, characterized in that, The base plate is made of aluminum or copper.

3. The heat spreader structure as described in claim 1 or 2, characterized in that, The top plate is made of aluminum or copper.

4. The heat spreader structure as described in claim 1, characterized in that, The receiving area has at least one recessed portion on one surface of the base plate, and a heated surface protruding from the other surface of the base plate opposite to the recessed portion, and the plurality of capillary support platforms are located within the recessed portion.

5. The heat spreader structure as described in claim 4, characterized in that, The recessed portion is covered with a capillary layer, and the two sides of each sintered capillary element are in contact with the capillary layer.

6. The heat spreader structure as described in claim 4, characterized in that, A plurality of short support columns and a plurality of long support columns are provided between the bottom plate and the top plate, with the plurality of short support columns distributed outside the recess and the plurality of long support columns distributed inside the recess.

7. The heat spreader structure as described in claim 6, characterized in that, Each of the capillary support platforms is arranged at intervals within the recess, and the plurality of long support columns are arranged between any two adjacent capillary support platforms.

8. The heat spreader structure as described in claim 1, characterized in that, The plurality of capillary support platforms are integrally formed or welded together in the recess.

9. The heat spreader structure as described in claim 1, characterized in that, The base of the sintered capillary element is provided with a plurality of through holes, each of which corresponds to a support portion for receiving the support portion.

10. The heat spreader structure as described in claim 1 or 9, characterized in that, The base of each sintered capillary element and the two sides together form a cross groove, into which the strip-shaped step is inserted so that each sintered capillary element is placed across the strip-shaped step.

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