Thermal vibration composite sensor and preparation method thereof

Abstract

This invention discloses a temperature-vibration composite sensor and its fabrication method, aiming to address the weakness of temperature-vibration composite sensors in terms of anti-interference capability. The invention includes: a base, with a temperature component at its bottom; a vibration component and a signal conversion circuit board housed within the base; the temperature component includes a probe, a first end of which is fixedly connected to the bottom of the base, and a second end of which houses a temperature-sensing resistor; a first cable is electrically connected to the temperature-sensing resistor, and the end of the first cable facing away from the temperature-sensing resistor is electrically connected to the signal conversion circuit board; a signal processing circuit board electrically connected to both the vibration component and the signal conversion circuit board is provided, and a second cable is electrically connected to the signal conversion circuit board. By centrally aggregating the temperature-vibration sensing signals through the signal conversion circuit board and processing them centrally through the signal processing circuit board, electromagnetic interference is effectively shielded, improving the sensor's anti-interference capability.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and more specifically, to a temperature-vibration composite sensor and its fabrication method. Background Technology

[0002] In related technologies, the operating conditions of locomotives and rolling stock are extremely complex and variable. Different operating conditions have different effects on the equipment status. It is of great significance to monitor vibration, shock and temperature throughout the entire life cycle of the device. In order to meet the high reliability requirements of temperature and vibration composite sensors for locomotives and rolling stock, the temperature and vibration composite sensors used on rail transit locomotives and rolling stock are mainly based on the IEPE vibration core principle. They rely on the piezoelectric effect in conjunction with the built-in micro-charge amplifier to realize vibration signal acquisition.

[0003] Technicians believe that the above-mentioned temperature-vibration composite sensor based on the IEPE vibration core principle has the following defects: the sensor based on this principle is limited by space and cannot realize the layout of external processing circuits, resulting in the product having weak electromagnetic interference resistance.

[0004] The above problems urgently need to be addressed.

[0005] The above-disclosed background information does not imply that the applicant accepts it as prior art. Summary of the Invention

[0006] This invention overcomes the shortcomings of weak anti-interference ability of sensors in related technologies, and provides a temperature-vibration composite sensor and its preparation method, thereby enhancing the anti-interference ability of the temperature-vibration composite sensor.

[0007] This invention provides a temperature-vibration composite sensor, comprising: a base, a temperature component at the bottom of the base, and a vibration component and a signal conversion circuit board inside the base; The temperature component includes a probe, a first end of which is fixedly connected to the bottom of the base, a second end of which is provided with a temperature measuring resistor, a first cable electrically connected to the temperature measuring resistor, an end of the first cable away from the temperature measuring resistor being electrically connected to the signal conversion circuit board, and a second cable electrically connected to the signal conversion circuit board, an end of the second cable away from the signal conversion circuit board extending out of the base. The vibration component and the signal conversion circuit board are equipped with a signal processing circuit board that is electrically connected to both.

[0008] Optionally, the vibration assembly includes a vibration acquisition circuit board, which is perpendicular to the bottom surface of the base. An acceleration sensor chip for acquiring vibration signals is fixed on the vibration acquisition circuit board, and the vibration acquisition circuit board is electrically connected to the signal processing circuit board via a flexible ribbon cable.

[0009] Optionally, the base also includes a support frame, which includes a base. The base has a first post that inserts into the periphery of the signal conversion circuit board and a second post that inserts into the periphery of the vibration acquisition circuit board. The top of the first post has a first slot that engages with the first end of the signal processing circuit board, and the top of the second post has a second slot that engages with the second end of the signal processing circuit board. The first slot and the second slot are at the same height. The second post also has a connecting platform, the top surface of which is flush with the bottom surface of the second slot.

[0010] Optionally, the first post is symmetrically arranged on the left and right sides of the signal conversion circuit board, and the side of the first post closest to the signal conversion circuit board has a first groove perpendicular to the base. The two first grooves form a space for the signal conversion circuit board to be inserted, and the bottom surface of the first groove is flush with the top surface of the base.

[0011] Optionally, the second column is symmetrically arranged on the left and right sides of the vibration acquisition circuit board, and the side of the second column closest to the vibration acquisition circuit board has a second groove perpendicular to the base. The two second grooves form a space for the vibration acquisition circuit board to be inserted. The second groove is arranged along the entire length. The base is hollowed out at the position corresponding to the bottom surface of the vibration acquisition circuit board, and the bottom surface of the vibration acquisition circuit board abuts against the inner bottom surface of the base.

[0012] Optionally, the base has a first hole at its top, a cover is fixed inside the first hole, and the base is filled with a matrix for fixing the internal components of the base.

[0013] Optionally, the base sidewall extends outward to form a second hole. A connector is fixed to the side of the second hole away from the base. A sheath is fitted on the outer wall of the connector away from the second hole. The end of the second cable away from the signal conversion circuit board passes through the second hole, the connector, and the sheath in sequence to the outside. A plug for sealing the base is fitted on the position of the second cable corresponding to the connector.

[0014] Optionally, the inner wall of the second hole opposite to the base has an internal thread, and the outer wall of the connector near the second hole has an external thread; the connector and the second hole are fixedly connected by the threads; and / or, The outer wall of the connector corresponding to the sheath tube is provided with a barb structure to prevent the sheath tube from falling off. The sheath tube is also fitted with a crimping ring for pressing the connector and the sheath tube together.

[0015] Optionally, the temperature measuring resistor is provided with an insulating sleeve, which covers the temperature measuring resistor from the bottom to the connection between the temperature measuring resistor and the first cable. The first cable is covered with a heat-shrinkable sleeve, and the probe is filled with a heat-conducting material.

[0016] Optionally, the base is provided with a baffle, the baffle forming an arc-shaped protrusion on the side facing the inner cavity of the base, the bracket being recessed inward at the position corresponding to the arc-shaped protrusion of the baffle to form a clearance space to avoid the baffle, and a third hole is opened in the area enclosed by the baffle and the inner wall of the base, the third hole vertically penetrating the top and bottom surfaces of the base.

[0017] A method for fabricating a temperature-vibration composite sensor, applicable to a temperature-vibration composite sensor, includes the following steps: Step S1: Fix the probe to the bottom of the base; Step S2: Connect the temperature measuring resistor to the first cable; Step S3: Connect the end of the first cable away from the temperature measuring resistor to the signal conversion circuit board; Step S4: Electrically connect the second cable to the signal conversion circuit board; Step S5: Complete the pre-assembly connection of the vibration component, the signal conversion circuit board, and the signal processing circuit board, and establish an electrical connection between the signal processing circuit board and the vibration component and the signal conversion circuit board respectively; Step S6: Arrange the temperature measuring resistor inside the probe. The temperature measuring resistor and the signal conversion circuit board are connected through the first cable. The pre-assembled vibration component, the signal conversion circuit board and the signal processing circuit board are installed into the base as a whole, and the end of the second cable away from the signal conversion circuit board extends out of the base.

[0018] A method for fabricating a temperature-vibration composite sensor, wherein step S5 further includes: The vibration component, the signal conversion circuit board, and the signal processing circuit board are sequentially installed and fixed inside the bracket; The signal conversion circuit board is inserted into the first column of the bracket, the vibration acquisition circuit board is inserted into the second column of the bracket, and the signal processing circuit board is engaged with the first and second bayonets around its perimeter.

[0019] Compared with the prior art, the beneficial effects of the present invention are: The temperature component, vibration component, signal conversion circuit board, and signal processing circuit board are integrated and arranged on the base. The modular design allows the temperature and vibration sensing signals to be uniformly collected by the signal conversion circuit board and centrally processed by the signal processing circuit board. This effectively shields electromagnetic interference, improves the sensor's anti-interference capability, and ensures stable and reliable temperature and vibration data acquisition. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the structure of the first embodiment of the present invention.

[0021] Figure 2 This is an exploded view of the first embodiment of the present invention.

[0022] Figure 3 This is the first embodiment of the present invention. Figure 2 Enlarged view of a portion of point A in the middle.

[0023] Figure 4 This is a schematic diagram of the support structure according to the first embodiment of the present invention.

[0024] Figure 5 This is a top view of the first embodiment of the present invention.

[0025] Figure 6 This is the first embodiment of the present invention. Figure 5 Schematic diagram of the cross section at point B.

[0026] Figure 7 This is the first embodiment of the present invention. Figure 6 Enlarged view of a section at point C.

[0027] Figure 8 This is a schematic diagram of the structure before the injection substrate according to the third embodiment of the present invention.

[0028] In the picture: 1. Base; 101. Baffle; 102. First hole; 103. Second hole; 104. Third hole; 2. Probe; 3. Cover; 4. Connector; 5. Sheath; 6. Crimping ring; 7. Bracket; 71. Base; 72. First column; 721. First groove; 722. First bayonet; 73. Second column; 731. Second groove; 732. Second bayonet; 74. Connecting platform; 8. Vibration assembly; 81. Vibration acquisition circuit board; 82. Accelerometer chip; 9. Signal conversion circuit board; 10. First cable; 11. Second cable; 12. Signal processing circuit board; 13. Flexible ribbon cable; 14. Plug; 15. Temperature measuring resistor; 16. Insulating sleeve; 17. Heat shrink tubing; 18. Heat conductor; 19. Substrate. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] It should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Similarly, words such as "a" or "one" do not indicate a quantity limitation, but rather indicate the presence of at least one; "multiple" indicates two or more. Unless otherwise stated, words such as "before," "after," "below," and / or "above" are for illustrative purposes only and are not limited to a location or spatial orientation.

[0031] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0035] First Embodiment Please refer to Figures 1 to 5 This embodiment provides a temperature-vibration composite sensor.

[0036] This invention provides a temperature-vibration composite sensor, comprising: a base 1, a temperature component at the bottom of the base 1, a vibration component 8 and a signal conversion circuit board 9 inside the base 1; For example, the base 1 is hollow inside, and the bottom surface of the inner wall of the base 1 is a plane that is flush with the horizontal plane, which facilitates the installation of corresponding components inside the base 1.

[0037] The temperature component includes a probe 2. The first end of the probe 2 is fixedly connected to the bottom of the base 1. The second end of the probe 2 is provided with a temperature measuring resistor 15. A first cable 10 is electrically connected to the temperature measuring resistor 15. The end of the first cable 10 away from the temperature measuring resistor 15 is electrically connected to a signal conversion circuit board 9. A second cable 11 is also electrically connected to the signal conversion circuit board 9. The end of the second cable 11 away from the signal conversion circuit board 9 extends out of the base 1. For example, the probe 2 is a thin-walled stainless steel tube, and the base 1 is welded to form a housing that accommodates the temperature component and the vibration component 8, providing protection for the temperature measuring resistor 15; In addition, the temperature measuring resistor 15 is a platinum resistance thermometer, and the platinum resistance thermometer is soldered to the pins of the first cable 10.

[0038] The advantage of this design is that the stainless steel probe 2 has high structural strength and excellent thermal conductivity, which can protect the internal temperature measuring resistor 15 from external impacts, oil and sewage vapor corrosion, and ensure the service life of the component. The solder connection method can ensure the stable electrical connection between the platinum resistance and the cable pins, and is less prone to cold solder joints and open circuits under high-frequency vibration conditions in vehicles, ensuring continuous and stable transmission of temperature signals.

[0039] The vibration assembly 8 and the signal conversion circuit board 9 are equipped with a signal processing circuit board 12 that is electrically connected to both.

[0040] For example, the signal conversion circuit board 9 and the signal processing circuit board 12 are connected by a flexible ribbon cable 13, and the first cable 10 and the second cable 11 are soldered to the signal conversion circuit board 9.

[0041] The advantage of this setup is that the flexible ribbon cable 13 can be flexibly bent and wired within the narrow internal space of the base 1, avoiding the defects of messy wiring and crosstalk short circuits caused by multiple discrete wires. At the same time, the soldering connection method improves the reliability of the circuit connection and ensures that temperature and vibration sensing signals are transmitted efficiently and with low interference between multiple circuit boards.

[0042] The vibration assembly 8 includes a vibration acquisition circuit board 81, which is perpendicular to the bottom surface of the base 1. An acceleration sensor chip 82 for acquiring vibration signals is fixed on the vibration acquisition circuit board 81. The vibration acquisition circuit board 81 is electrically connected to the signal processing circuit board 12 through a flexible ribbon cable 13.

[0043] For example, the acceleration sensing chip 82 is a MEMS accelerometer chip, which is mounted on the vibration acquisition circuit board 81 using SMT surface mount technology.

[0044] The aforementioned flexible cabling 13 refers to a bendable electrical connection wire made of multiple parallel conductors integrated on a flexible insulating substrate. It can realize electrical interconnection between boards in a narrow space and has the characteristics of resistance to bending, neat wiring, and resistance to signal crosstalk.

[0045] Accelerometer chip 82 refers to a sensor chip that, based on microelectromechanical technology, can convert the physical quantity of mechanical vibration acceleration into a recognizable electrical signal, and is used to collect vibration data of the device under test in real time during operation.

[0046] The aforementioned SMT refers to a surface mount technology, which is an electronic component assembly process that directly mounts and solders leadless / short-lead chip components onto the surface of a circuit board.

[0047] The advantage of this setup is that the MEMS accelerometer chip 82 is small in size and highly integrated. Combined with the SMT surface mount technology, it can achieve high-density component mounting, significantly reducing the space occupied by the vibration acquisition circuit board 81 and adapting to the compact structure design of the sensor. The vertically arranged vibration acquisition circuit board 81 can accurately acquire multi-dimensional vibration signals, ensuring the sensitivity and data accuracy of vibration detection.

[0048] Please refer to Figure 3 , Figure 4 The base 1 is also provided with a bracket 7, which includes a base 71. The base 71 is provided with a first post 72 that is inserted into the periphery of the signal conversion circuit board 9 and a second post 73 that is inserted into the periphery of the vibration acquisition circuit board 81. The top of the first post 72 is provided with a first slot 722 that is engaged with the first end of the signal processing circuit board 12. The top of the second post 73 is provided with a second slot 732 that is engaged with the second end of the signal processing circuit board 12. The first slot 722 and the second slot 732 are at the same height. The second post 73 is also provided with a connecting platform 74. The top surface of the connecting platform 74 is flush with the bottom surface of the second slot 732.

[0049] For example, the signal processing circuit board 12 is fixed to the connecting platform 74 by positioning pins, and the first column 72 and the second column 73 are also provided with abutting platforms for abutting against the bottom surface of the signal processing circuit board 12 to ensure the flatness of the signal processing circuit board 12 during installation.

[0050] The advantage of this design is that the bracket 7 uses a multi-column, bayonet, and abutment platform limiting and snapping structure to achieve layered positioning and installation of the circuit board. This not only restrains the circuit board from shifting or shaking in the vehicle vibration environment and ensures the flatness of the installation between boards, but also enables modular pre-assembly, simplifies the assembly process of the internal components of the sensor, and improves production efficiency and product operation stability.

[0051] Optionally, the first post 72 is symmetrically arranged on the left and right sides of the signal conversion circuit board 9, and the first post 72 has a first groove 721 perpendicular to the base 71 on the side closer to the signal conversion circuit board 9. The two first grooves 721 form a space for the signal conversion circuit board 9 to be inserted, and the bottom surface of the first groove 721 is flush with the top surface of the base 71.

[0052] For example, the signal conversion circuit board 9 is inserted into the bracket 7 from top to bottom through the first slot 721, and the bottom surface of the signal conversion circuit board 9 abuts against the top surface of the base 71.

[0053] The advantage of this design is that the symmetrically arranged plug slots can limit the signal conversion circuit board 9 on both sides, making the assembly simple and convenient. At the same time, the bottom surface of the circuit board abuts against the base 71 to achieve vertical positioning, effectively preventing the circuit board from moving vertically due to vibration and ensuring the stability and reliability of the line connection points.

[0054] The second pillar 73 is symmetrically arranged on the left and right sides of the vibration acquisition circuit board 81, and the side of the second pillar 73 closest to the vibration acquisition circuit board 81 has a second groove 731 perpendicular to the base 71. The two second grooves 731 form a space for the vibration acquisition circuit board 81 to be inserted. The second groove 731 is set along the entire length. The base 71 is hollowed out at the position corresponding to the bottom surface of the vibration acquisition circuit board 81, and the bottom surface of the vibration acquisition circuit board 81 abuts against the inner bottom surface of the base 1.

[0055] For example, the vibration acquisition circuit board 81 is inserted into the bracket 7 from bottom to top through the second slot 731. This arrangement avoids collision with the second bayonet 732, shortens the distance between the second pillars 73, and improves the installation accuracy of the vibration acquisition circuit board 81 to meet the verticality or angle requirements of the sensor for the vibration acquisition circuit.

[0056] The advantage of this design is that the full-length plug slot combined with the hollow base 71 can precisely limit the verticality of the vibration acquisition circuit board 81, avoiding the decrease in vibration acquisition accuracy caused by assembly misalignment. At the same time, the assembly process can avoid bumping into the above-installed structure, reducing the assembly defect rate and ensuring the detection accuracy of vibration signal acquisition.

[0057] The base 1 has a first hole 102 at the top, a cover 3 is fixed in the first hole 102, and the base 1 is filled with a base 19 for fixing the internal components of the base 1.

[0058] For example, both the cover 3 and the base 1 are made of metal. After the cover 3 is interference-fitted with the base 1 through the first hole 102, the edge of the cover 3 is firmly welded to the base 1.

[0059] The aforementioned interference fit refers to the fit method in which the load is transmitted by friction when the first hole 102 and the cover 3 are fitted together, which plays a certain role in fixing.

[0060] In addition, the matrix 19 is epoxy resin, which is heated and melted before being filled into the base 1.

[0061] The advantage of this setup is that the metal cover 3 and the base 1 are fixed with double sealing through interference fit and welding. Combined with the internal epoxy resin potting substrate 19, it can not only firmly cover and fix all internal circuit boards, cables and components to resist vehicle vibration and impact, but also achieve insulation and pressure resistance, moisture and dust protection, which greatly improves the protection level and electrical safety performance of the sensor.

[0062] Please refer to Figure 6 The side wall of the base 1 extends outward to form a second hole 103. A connector 4 is fixed on the side of the second hole 103 away from the base 1. A sheath tube 5 is fitted on the outer wall of the connector 4 away from the second hole 103. One end of the second cable 11 away from the signal conversion circuit board 12 passes through the second hole 103, the connector 4 and the sheath tube 5 in sequence to extend to the outside. A plug 14 for sealing the base 19 is fitted on the position corresponding to the second cable 11 and the connector 4.

[0063] Specifically, the signal processing circuit board transmits the processed vibration signal to the signal conversion circuit board, and after being combined with the temperature sensing signal, it is output to the outside through the second cable.

[0064] For example, the outer wall of the plug 14 is tightly fitted to the inner wall of the connector 4, and the inner wall of the plug 14 is tightly fitted to the outer wall of the second cable 11. After the connector 4 is threaded and fixed to the second hole 103, the two are welded firmly by laser welding, and then the plug 14 is installed at the end of the connector 4 away from the second hole 103.

[0065] The aforementioned plug 14 refers to a sealing elastic component that is fitted onto the outside of the cable and fills the gap between the cable and the inner wall of the connector 4. It is used to seal the potting substrate 19, prevent water and gasoline contaminants from entering the sensor cavity, and at the same time, it serves to limit and prevent pulling of the lead-out cable.

[0066] Laser welding refers to the use of a continuous laser beam with a small focal spot and high power density, which can weld some high-melting-point and high-strength alloy materials. Laser welding uses high-energy laser pulses to locally heat a small area of ​​the material. The energy of the laser radiation diffuses into the interior of the material through heat conduction, melting the material and forming a specific molten pool to achieve the purpose of welding.

[0067] The inner wall of the second hole 103 on the side opposite to the base 1 has an internal thread, and the outer wall of the connector 4 on the side near the second hole 103 has an external thread. The connector 4 is fixedly connected to the second hole 103 by the thread; and / or, The outer wall of the connector 4, corresponding to the position of the sheath tube 5, is provided with a barb structure to prevent the sheath tube 5 from falling off. The sheath tube 5 is also fitted with a crimping ring 6 for pressing the connector 4 and the sheath tube 5 together.

[0068] For example, the sheath tube 5 tightly covers the outside of the outer cable, and the clamping ring 6 locks the sheath tube 5 to the barbed structure of the connector 4 by radial compression.

[0069] The advantage of this design is that the threaded connection combined with laser welding achieves a high-strength seal between the connector 4 and the base 1. The barbed structure and the clamping ring 6 work together to effectively lock the sheath tube 5, preventing the cable from being pulled or bent by external forces, which could cause the sheath to slip off or the internal cable to break. The multi-layered sealing protection structure ensures the waterproof and tensile performance of the cable outlet, making it suitable for the complex and harsh working conditions of rail transit.

[0070] Please refer to Figure 6 , Figure 7 The temperature measuring resistor 15 is provided with an insulating sleeve 16, which covers the temperature measuring resistor 15 from the bottom to the connection between the temperature measuring resistor 15 and the first cable 10. The first cable 10 is covered with a heat shrink tubing 17, and the probe 2 is filled with a heat conductor 18.

[0071] For example, the heat conductor 18 in this application is made of thermally conductive silicone. The thermally conductive silicone passes through the bottom of the base 1, is poured in from the top of the probe 2 and fills the inside of the probe 2, and then the components inside the base 1 are installed.

[0072] In addition, the heat shrink tubing 17 is fitted over the lead portion of the first cable 10.

[0073] Specifically, the insulating sleeve 16 covers the outside of the temperature measuring resistor 15 and its welding point with the cable, achieving electrical insulation protection, preventing short circuits between the component and the metal probe 2, and isolating the welding point from moisture corrosion; the heat shrink tubing 17 tightly wraps the cable leads, providing insulation and wear protection for multiple leads, preventing short circuits caused by mutual contact between cables; the heat conductor 18 is filled inside the probe 2, which can quickly conduct the temperature of the device under test to the temperature measuring resistor 15, reducing heat conduction lag, shortening the temperature response time, and improving the real-time performance and accuracy of temperature detection.

[0074] The base 1 is provided with a baffle 101. The baffle 101 forms an arc-shaped protrusion on the side facing the inner cavity of the base 1. The bracket 7 is recessed inward at the position corresponding to the arc-shaped protrusion of the baffle 101 to form a clearance space to avoid the baffle 101. A third hole 104 is opened in the area enclosed by the baffle 101 and the inner wall of the base 1. The third hole 104 vertically penetrates the top and bottom surfaces of the base 1.

[0075] For example, the baffle 101 is integrally formed with the base 1, and the structure of the baffle 101 and the base 1 is stronger. The third hole 104 is a positioning hole for fixing the temperature and vibration composite sensor. The third hole 104 is provided with internal threads. The bolt is inserted from the top of the base 1 and extends from the bottom of the base 1 to be fixed with the external components.

[0076] A method for fabricating a temperature-vibration composite sensor, applicable to a temperature-vibration composite sensor, includes the following steps: Step S1: Fix the probe 2 to the bottom of the base 1; Step S2: Connect the temperature measuring resistor 15 to the first cable 10; Step S3: Connect the end of the first cable 10 away from the temperature measuring resistor 15 to the signal conversion circuit board 9; Step S4: Electrically connect the second cable 11 to the signal conversion circuit board 9; Step S5: Complete the pre-installation connection of the vibration component 8, the signal conversion circuit board 9, and the signal processing circuit board 12, and establish an electrical connection between the signal processing circuit board 12 and the vibration component 8 and the signal conversion circuit board 9 respectively; Step S6: Arrange the temperature measuring resistor 15 inside the probe 2. The temperature measuring resistor 15 and the signal conversion circuit board 9 are connected through the first cable 10. The pre-assembled vibration component 8, the signal conversion circuit board 9 and the signal processing circuit board 12 are installed into the base 1 as a whole, and the second cable 11 extends out of the base 1 at one end away from the signal conversion circuit board 9.

[0077] A method for fabricating a temperature-vibration composite sensor, wherein step S5 further includes: The vibration component 8, the signal conversion circuit board 9, and the signal processing circuit board 12 are sequentially installed and fixed inside the bracket 7; The signal conversion circuit board 9 is inserted into the first column 72 of the bracket 7, the vibration acquisition circuit board is inserted into the second column 73 of the bracket 7, and the signal processing circuit board is engaged with the first bayonet 722 and the second bayonet 732 around its perimeter.

[0078] In this embodiment, the bracket 7 is placed on the horizontal bottom surface of the base 1. The signal conversion circuit board 9 is inserted into the first slot 721 of the bracket 7 from top to bottom, and the vibration acquisition circuit board 81 is inserted into the second slot 731 of the bracket 7 from bottom to top. The signal processing circuit board 12 is then snapped and fixed at the first slot 722 and the second slot 732 of the bracket 7. The signal processing circuit board 12 is locked to the connecting platform 74 by the positioning pin. Then, the first cable 10 is soldered to the signal conversion circuit board 9. The second cable 11 is passed through the second hole 103, the connector 4, and the sheath 5 on the side wall of the base 1 and then soldered to the signal processing circuit board 12.

[0079] For example, during the assembly process, the recessed structure of the bracket 7 is aligned with the arc-shaped protrusion of the inner baffle 101 of the base 1 to complete the alignment and avoid interference between the assembly structures.

[0080] The advantage of this setup is that, relying on the limiting and plugging structure of bracket 7, multiple circuit boards can be precisely positioned and installed in layers. The assembly process is standardized, which can effectively ensure the flatness and verticality of the circuit board installation and avoid assembly deviations from affecting the accuracy of sensing and data acquisition.

[0081] Second Embodiment Unlike the first embodiment, in this embodiment there are two baffles 101, which are symmetrically arranged in the base 1. In addition, the number of third holes 104 corresponds to the number and position of the baffles 101, and are symmetrically distributed in the area enclosed by the baffles 101 and the inner wall of the base 1.

[0082] The advantage of this design is that the arc-shaped avoidance structure can prevent structural interference between the bracket 7 and the baffle 101 during assembly, ensuring precise assembly of the internal bracket 7; the symmetrically arranged positioning holes with internal threads form a standard three-point mechanical installation interface, which can be directly compatible with the existing vehicle temperature sensor mounting base 1, and can be replaced and installed without modifying the equipment. The installation and positioning are firm and can effectively resist vibration and impact during vehicle operation.

[0083] Third Embodiment Unlike the first embodiment, the fabrication method of the temperature-vibration composite sensor used in this embodiment includes the following steps: Compared to steps S1 and S2, in this embodiment, after the probe 2 is sealed and fixedly welded to the bottom of the base 1, the temperature measuring resistor 15 is covered with an insulating sleeve 16, the temperature measuring resistor 15 is soldered to the pin of the first cable 10, a heat shrink sleeve 17 is fitted on the outside of the lead of the first cable 10 and heated and tightened, and then the welded temperature measuring resistor 15 assembly is installed into the probe 2 made of thin-walled stainless steel, and thermally conductive silicone is injected into the inner cavity of the probe 2 and fully filled.

[0084] For example, after the thermally conductive silicone is poured in, it is left to cure at room temperature to ensure that there are no air bubbles or voids inside the probe 2, thereby improving the thermal conductivity.

[0085] The advantage of this setup is that it completes the insulation protection of the temperature sensing element, cable encapsulation, and thermal conductive medium filling in stages, which not only avoids short-circuit failure of the temperature sensing element, but also minimizes temperature detection lag and ensures temperature acquisition response speed.

[0086] Compared to step S5, this embodiment uses SMT surface mount technology to solder the acceleration sensor chip 82 onto the surface of the vibration acquisition circuit board 81, and completes the electrical connection between the vibration acquisition circuit board 81, the signal conversion circuit board 9, and the signal processing circuit board 12 through the flexible ribbon cable 13. For example, after the soldering is completed, the three circuit boards are tested for continuity and signal interference immunity, and faulty boards with poor soldering or short circuits are removed to ensure that the electrical performance of the circuit is qualified.

[0087] The advantage of this setup is that it allows for the pre-composition of circuit boards, pre-wiring between boards, and electrical testing, enabling standardized prefabrication of components, reducing the amount of welding work during on-site assembly, preventing circuit faults in advance, and improving the finished product qualification rate.

[0088] Please refer to Figure 8 After step S6, this embodiment also includes the following steps: screwing the connector 4 into the second hole 103 of the base 1 by threading, and welding the connector 4 to the base 1 by laser welding process; fitting a plug 14 on the outside of the second cable 11 and embedding it into the inner cavity of the connector 4 to seal the gap; fitting a sheath tube 5 on the outside of the connector 4, and pressing and locking the sheath tube 5 onto the barbed structure of the connector 4 by a clamping ring 6; Molten epoxy resin matrix 19 is heated and poured into the inner cavity of the base 1. After the epoxy resin has fully cured, the metal cover 3 is interference-fitted into the first hole 102 at the top of the base 1, and the edge of the cover 3 is laser-welded to the edge of the first hole 102 of the base 1 for sealing.

[0089] For example, sealant is applied to the plug 14 before assembly to further improve the waterproof sealing performance at the joint 4.

[0090] The advantage of this setup is that the threaded locking and laser welding work together to achieve high-strength fixation of the connector 4. Together with the plug 14, sheath 5, and crimping ring 6, it forms a multi-layer sealing and tensile-resistant structure, which can not only seal the epoxy resin used for subsequent potting, but also greatly improve the protection and tensile strength of the cable lead-out end.

[0091] Specifically, the epoxy resin is filled using a vacuum potting method to eliminate air bubbles inside the base 1, ensuring that the components are completely encapsulated. Vacuum potting allows the epoxy resin to fully fill all gaps inside the base 1, achieving all-round insulation, vibration reduction, and moisture protection for the components. Combined with the double-sealed welding of the cover 3, it meets the high pressure resistance and high protection level requirements of the sensor.

[0092] In summary, this application has at least the following advantages: First, the mechanical interface of this invention is compatible with the three-hole temperature sensor commonly used in vehicles, while maintaining the existing temperature sensor installation interface and wiring space in locomotives, rolling stock and EMUs. Secondly, the installation of the temperature sensing element and vibration acquisition circuit board 81 in the base 1 is solved by structural design and potting compound filling method, which can withstand a voltage of over 4000V and also meet the temperature response time requirements. Third, the layout design of the vibration acquisition circuit board 81, the signal processing circuit board 12 and the signal conversion circuit board 9 within the base 1 effectively transmits vibration signals. Fourth, the present invention has a compact structure, fewer parts, and a simple manufacturing process, which solves the problem of reduced reliability caused by complex design.

[0093] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A temperature-vibration composite sensor, characterized in that, include: The base (1) has a temperature component at its bottom and a vibration component (8) and a signal transfer circuit board (9) inside it. The temperature component includes a probe (2), the first end of which is fixedly connected to the bottom of the base (1), and a temperature measuring resistor (15) is provided in the second end of the probe (2). A first cable (10) is electrically connected to the temperature measuring resistor (15). The end of the first cable (10) away from the temperature measuring resistor (15) is electrically connected to the signal conversion circuit board (9). A second cable (11) is also electrically connected to the signal conversion circuit board (9). The end of the second cable (11) away from the signal conversion circuit board (9) extends out of the base (1). The vibration assembly (8) and the signal transfer circuit board (9) are provided with a signal processing circuit board (12) that is electrically connected to both of them.

2. The temperature-vibration composite sensor according to claim 1, characterized in that, The vibration assembly (8) includes a vibration acquisition circuit board (81), which is perpendicular to the bottom surface of the base (1). An acceleration sensor chip (82) for acquiring vibration signals is fixed on the vibration acquisition circuit board (81), and the vibration acquisition circuit board (81) is electrically connected to the signal processing circuit board (12) through a flexible ribbon cable (13).

3. The temperature-vibration composite sensor according to claim 2, characterized in that, The base (1) is also provided with a bracket (7), which includes a base (71). The base (71) is provided with a first post (72) that is inserted into the periphery of the signal conversion circuit board (9) and a second post (73) that is inserted into the periphery of the vibration acquisition circuit board (81). The top of the first post (72) is provided with a first slot (722) that is engaged with the first end of the signal processing circuit board (12). The top of the second post (73) is provided with a second slot (732) that is engaged with the second end of the signal processing circuit board (12). The first slot (722) and the second slot (732) are at the same height. The second post (73) is also provided with a connecting platform (74). The top surface of the connecting platform (74) is flush with the bottom surface of the second slot (732).

4. The temperature-vibration composite sensor according to claim 3, characterized in that, The first post (72) is symmetrically arranged on the left and right sides of the signal conversion circuit board (9), and the first post (72) has a first groove (721) perpendicular to the base (71) on the side of the first post (72) near the signal conversion circuit board (9). The two first grooves (721) form a space for the signal conversion circuit board (9) to be inserted. The bottom surface of the first groove (721) is flush with the top surface of the base (71).

5. A temperature-vibration composite sensor according to claim 3 or 4, characterized in that, The second column (73) is symmetrically arranged on the left and right sides of the vibration acquisition circuit board (81), and the second column (73) has a second groove (731) perpendicular to the base (71) on the side of the vibration acquisition circuit board (81). The two second grooves (731) form a space for the vibration acquisition circuit board (81) to be inserted. The second groove (731) is set along the entire length. The base (71) is hollowed out at the position corresponding to the bottom surface of the vibration acquisition circuit board (81). The bottom surface of the vibration acquisition circuit board (81) abuts against the inner bottom surface of the base (1).

6. The temperature-vibration composite sensor according to claim 1, characterized in that, The base (1) has a first hole (102) at the top, a cover (3) is fixed in the first hole (102), and the base (1) is filled with a base (19) for fixing the internal components of the base (1).

7. A temperature-vibration composite sensor according to claim 1 or 6, characterized in that, The base (1) extends outward to form a second hole (103). A connector (4) is fixed on the side of the second hole (103) away from the base (1). A sheath (5) is fitted on the outer wall of the connector (4) away from the second hole (103). The end of the second cable (11) away from the signal conversion circuit board (9) passes through the second hole (103), the connector (4) and the sheath (5) in sequence to extend to the outside. A plug (14) for sealing the base (19) is fitted on the position of the second cable (11) corresponding to the connector (4).

8. A temperature-vibration composite sensor according to claim 7, characterized in that, The second hole (103) has an internal thread on the inner wall of the side facing away from the base (1), and the connector (4) has an external thread on the outer wall of the side facing the second hole (103). The connector (4) is fixedly connected to the second hole (103) by the thread; and / or, The outer wall of the connector (4) corresponding to the sheath tube (5) is provided with a barb structure to prevent the sheath tube (5) from falling off. The sheath tube (5) is also fitted with a crimping ring (6) for pressing the connector (4) and the sheath tube (5).

9. A temperature-vibration composite sensor according to claim 1, characterized in that, The temperature measuring resistor (15) is provided with an insulating sleeve (16), which covers the temperature measuring resistor (15) from the bottom to the connection between the temperature measuring resistor (15) and the first cable (10). The first cable (10) is covered with a heat shrink tubing (17), and the probe (2) is filled with a heat conductor (18).

10. A temperature-vibration composite sensor according to claim 3, characterized in that, The base (1) is provided with a baffle (101). The baffle (101) forms an arc-shaped protrusion on the side facing the inner cavity of the base (1). The bracket (7) is recessed inward at the position corresponding to the arc-shaped protrusion of the baffle (101) to form a clearance space to avoid the baffle (101). A third hole (104) is opened in the area enclosed by the baffle (101) and the inner wall of the base (1). The third hole (104) vertically penetrates the top and bottom surfaces of the base (1).

11. A method for fabricating a temperature-vibration composite sensor, characterized in that, The temperature-vibration composite sensor applied to any one of claims 1-10 includes the following steps: Step S1: Fix the probe (2) to the bottom of the base (1); Step S2: Connect the temperature measuring resistor (15) to the first cable (10); Step S3: Connect the end of the first cable (10) away from the temperature measuring resistor (15) to the signal conversion circuit board (9). Step S4: Connect the second cable (11) to the signal conversion circuit board (9). Step S5: Complete the pre-installation connection of the vibration component (8), the signal conversion circuit board (9) and the signal processing circuit board (12), and establish an electrical connection between the signal processing circuit board (12) and the vibration component (8) and the signal conversion circuit board (9) respectively; Step S6: Arrange the temperature measuring resistor (15) inside the probe (2), connect the temperature measuring resistor (15) and the signal conversion circuit board (9) through the first cable (10), and install the pre-assembled vibration assembly (8), the signal conversion circuit board (9) and the signal processing circuit board (12) into the base (1), and extend the second cable (11) away from the signal conversion circuit board (9) out of the base (1).

12. The method for preparing a temperature-vibration composite sensor according to claim 11, characterized in that, Step S5 also includes: The vibration assembly (8), the signal conversion circuit board (9), and the signal processing circuit board (12) are sequentially installed and fixed inside the bracket (7); The signal conversion circuit board (9) is inserted into the first column (72) of the bracket (7), the vibration acquisition circuit board is inserted into the second column (73) of the bracket (7), and the signal processing circuit board is engaged with the first bayonet (722) and the second bayonet (732) around its perimeter.

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