Supercapacitor ntc shedding detection method and management system
By calculating the temperature growth slope and temperature difference verification of the supercapacitor, the reliability problem of NTC thermistor detachment detection was solved, and the fault identification capability of the supercapacitor management system was improved.
Patent Information
- Application Number
- CN202611225086.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-13
- Publication Date
- 2026-11-06
AI Technical Summary
Existing methods for detecting the detachment of NTC thermistors in supercapacitors are unreliable under certain operating conditions, especially when the temperature collected after the NTC thermistor detaches is still within the normal range or when the ambient temperature changes, making it difficult to accurately identify the anomaly.
By periodically acquiring the temperatures of the NTC thermistor and the motherboard, the temperature growth slope of the supercapacitor is calculated. Based on the relative relationship between the slopes, suspected faulty supercapacitors are screened. Combined with temperature difference verification, it is determined whether the NTC thermistor has detached.
This improves the reliability of identifying the detachment state of NTC thermistors, reduces the impact of ambient temperature changes on the judgment results, and achieves more accurate fault detection.
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Figure CN123045553A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of supercapacitor temperature monitoring technology, and in particular to a method and management system for detecting and managing the detachment of NTC capacitors in supercapacitors. Background Technology
[0002] Supercapacitors are characterized by fast charging and discharging speeds and high power density. During high-current charging or discharging, the temperature of the supercapacitor itself can change rapidly depending on the operating conditions. To obtain temperature information from the supercapacitors, existing supercapacitor management systems typically configure NTC thermistors on each supercapacitor within the supercapacitor module. These NTC thermistors collect the temperature of the corresponding supercapacitor for system temperature monitoring and related protection and control. In actual use, factors such as loose assembly, long-term vibration, wire harness pulling, or abnormal solder joints can cause NTC thermistors to detach. Once detached from the supercapacitor body, the temperature readings collected by the NTC thermistor may not accurately reflect the actual temperature changes of the supercapacitor, thus affecting the supercapacitor management system's judgment of the temperature status.
[0003] Existing detection methods for NTC thermistor detachment in supercapacitors primarily rely on whether the sampled temperature falls outside a preset temperature range, while others depend on the temperature difference between the supercapacitor's sampled temperature and the motherboard temperature. However, when the sampled temperature remains within the normal range after NTC thermistor detachment, relying solely on temperature limits is insufficient to identify this anomaly. Furthermore, as the overall temperature of the supercapacitor module changes with ambient temperature, the temperature difference between individual cells and the motherboard may weaken, affecting the reliability of anomaly detection based on temperature difference. Therefore, existing detection methods still have limitations in identifying NTC thermistor detachment under certain operating conditions. Summary of the Invention
[0004] The purpose of this invention is to provide a method and management system for detecting the detachment of NTC thermistors in supercapacitors, in order to solve the technical problem mentioned in the background art that the existing detection methods are not reliable enough in identifying the detachment status of NTC thermistors in supercapacitors under certain operating conditions.
[0005] To achieve the above objectives, according to a first aspect of the present invention, a method for detecting NTC detachment in a supercapacitor is provided, applied to a supercapacitor management system. The supercapacitor management system includes a motherboard and a supercapacitor module, the supercapacitor module including a plurality of supercapacitors, each supercapacitor being configured with an NTC thermistor. The method is executed by the supercapacitor management system and includes:
[0006] The individual temperature of each NTC thermistor and the motherboard temperature of the motherboard are periodically acquired.
[0007] Based on a unified statistical time window, the temperature growth slope of each supercapacitor is determined according to the temperature changes of each individual NTC thermistor collected within the statistical time window.
[0008] Based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes are identified as suspected faulty supercapacitors.
[0009] Determine the temperature difference between the individual cell temperature of each suspected faulty supercapacitor and the motherboard temperature;
[0010] Based on whether the temperature difference corresponding to each suspected faulty supercapacitor meets the preset abnormal temperature difference conditions, each suspected faulty supercapacitor is verified, and based on the verification results, it is determined whether the NTC thermistor corresponding to each suspected faulty supercapacitor has fallen off.
[0011] In one possible implementation, the periodically acquired temperatures of each individual supercapacitor and the motherboard temperature are filtered and denoised before determining the temperature growth slope of each supercapacitor.
[0012] In one possible implementation, the statistical time window is 30 to 60 seconds;
[0013] For each supercapacitor, the temperature growth slope of the supercapacitor is determined based on the individual cell temperature collected at the start time of the statistical time window, the individual cell temperature collected at the current time of the statistical time window, and the statistical duration of the statistical time window.
[0014] In one possible implementation, determining supercapacitors with abnormally low temperature growth slopes as suspected faulty supercapacitors based on the relative relationship between the temperature growth slopes of each supercapacitor includes:
[0015] For each supercapacitor to be judged, the temperature growth slope of the supercapacitor to be judged is divided by the temperature growth slope of the other supercapacitors to obtain the corresponding ratio.
[0016] When at least one of the ratios corresponding to the supercapacitor to be judged is not greater than 0.5, the supercapacitor to be judged is determined to meet the slope anomaly condition, and the supercapacitor to be judged is identified as the suspected faulty supercapacitor.
[0017] In one possible implementation, the preset abnormal temperature difference condition is that the temperature difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature is outside the normal operating temperature difference range.
[0018] In one possible implementation, when multiple suspected faulty supercapacitors exist, the step of verifying each suspected faulty supercapacitor includes:
[0019] Determine the individual temperature difference between each of the suspected faulty supercapacitors;
[0020] Based on whether the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, it is determined whether the individual cell temperatures of each suspected faulty supercapacitor are close to each other.
[0021] When the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, and the temperature difference corresponding to each suspected faulty supercapacitor meets the preset temperature difference abnormal condition, it is determined that the NTC thermistors corresponding to each of the multiple suspected faulty supercapacitors have all fallen off, and the supercapacitor number corresponding to the fallen NTC thermistor is output.
[0022] In one possible implementation, the method further includes:
[0023] The number of NTC thermistors determined to have detached was counted.
[0024] When one NTC thermistor detaches, a Level 1 fault is reported, and the maximum charging and discharging power of the supercapacitor module is limited.
[0025] When two or more NTC thermistors detach, a level two fault is reported and overheat protection is activated.
[0026] The fault information corresponding to the detached NTC thermistor is uploaded to the backend terminal, and the fault location information corresponding to the detached NTC thermistor is stored.
[0027] According to a second aspect of the present invention, a supercapacitor management system is provided, including a motherboard and a supercapacitor module, the supercapacitor module including a plurality of supercapacitors, each supercapacitor being configured with an NTC thermistor, and further comprising:
[0028] The NTC temperature acquisition module is used to periodically acquire the individual temperature of each NTC thermistor.
[0029] The motherboard temperature acquisition module is used to acquire the motherboard temperature of the motherboard.
[0030] The temperature growth slope calculation unit is used to determine the temperature growth slope of each supercapacitor based on the temperature change of each individual NTC thermistor collected within the statistical time window, according to a unified statistical time window.
[0031] A temperature difference calculation unit is used to determine the temperature difference between the individual cell temperature of each supercapacitor and the motherboard temperature;
[0032] The NTC detachment comprehensive judgment unit is used to determine, based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes as suspected faulty supercapacitors, verifying the suspected faulty supercapacitors based on whether the temperature difference corresponding to the suspected faulty supercapacitors meets the preset abnormal temperature difference conditions, and determining whether the NTC thermistor corresponding to the suspected faulty supercapacitors has detached based on the verification results.
[0033] In one possible implementation, the supercapacitor management system further includes a data filtering preprocessing unit, which is used to filter and denoise the individual cell temperatures acquired by the NTC temperature acquisition module and the motherboard temperatures acquired by the motherboard temperature acquisition module.
[0034] The temperature growth slope calculation unit is used to determine the temperature growth slope of each supercapacitor based on the individual cell temperature after filtering and noise reduction.
[0035] The temperature difference calculation unit is used to determine the temperature difference based on the individual unit temperature and the motherboard temperature after filtering and noise reduction processing.
[0036] In one possible implementation, the supercapacitor management system further includes a fault classification unit. The fault classification unit is used to count the number of NTC thermistors determined to have detached based on the judgment result of the NTC detachment comprehensive judgment unit. When the number of detached NTC thermistors is one, a level one fault is reported and the maximum charging and discharging power of the supercapacitor module is limited. When the number of detached NTC thermistors is two or more, a level two fault is reported and overheat protection is activated. The unit also uploads the fault information corresponding to the detached NTC thermistors to the backend terminal and stores the fault location information corresponding to the detached NTC thermistors.
[0037] The above-described one or more technical solutions in the embodiments of the present invention have at least one or more of the following technical effects:
[0038] This invention provides a method for detecting NTC detachment in supercapacitors. It periodically acquires the individual cell temperature and motherboard temperature of each supercapacitor, determines the temperature growth slope of each supercapacitor within a unified statistical time window, and filters out suspected faulty supercapacitors with abnormally low temperature growth slopes based on the relative relationship between these slopes. The method then verifies the result by combining the temperature difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature. Compared to methods that rely solely on a preset temperature range or the temperature difference between the individual cell temperature and the motherboard temperature, this invention utilizes the differences in temperature growth slopes among the supercapacitors within the same supercapacitor module to reflect anomalies between the NTC-collected temperature and the actual temperature change of the supercapacitor. Furthermore, by using temperature difference verification, it reduces the impact of environmental temperature changes and other factors on the judgment results, thereby improving the reliability of identifying NTC detachment during supercapacitor operation.
[0039] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description
[0040] Figure 1 This is a flowchart illustrating a method for detecting NTC shedding in a supercapacitor according to an exemplary embodiment.
[0041] Figure 2 This is a block diagram showing the module connection of a supercapacitor management system according to an exemplary embodiment.
[0042] Explanation of reference numerals in the attached diagram: 100, NTC temperature acquisition module; 200, motherboard temperature acquisition module; 300, temperature increase slope calculation unit; 400, temperature difference calculation unit; 500, NTC detachment comprehensive judgment unit; 600, data filtering preprocessing unit; 700, fault classification unit. Detailed Implementation
[0043] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of systems and methods consistent with some aspects of the invention as detailed in the appended claims.
[0045] Figure 1 This is a flowchart illustrating a method for detecting NTC shedding in a supercapacitor according to an exemplary embodiment, as shown below. Figure 1 As shown, the method is applied to a supercapacitor management system, which includes a motherboard and a supercapacitor module. The supercapacitor module includes multiple supercapacitors, each of which is equipped with an NTC thermistor. The method is executed by the supercapacitor management system and includes:
[0046] In step S100, the individual cell temperatures collected by each NTC thermistor and the motherboard temperature are periodically acquired. Multiple supercapacitors in the supercapacitor module each acquire their individual cell temperatures through their respective NTC thermistors; these acquired individual cell temperatures reflect the temperature state of the corresponding supercapacitor. Simultaneously, the motherboard temperature is acquired to form temperature data corresponding to each individual cell temperature. The individual cell temperatures collected by each NTC thermistor and the motherboard temperature are continuously acquired periodically, ensuring that the temperature data obtained at different times reflects the temperature changes during supercapacitor operation. This provides a basis for subsequently determining the temperature growth slope of each supercapacitor and identifying the temperature difference between the individual cell temperature of a suspected faulty supercapacitor and the motherboard temperature.
[0047] In step S200, based on a unified statistical time window, the temperature growth slope of each supercapacitor is determined according to the individual cell temperature changes collected by each NTC thermistor within the statistical time window. For the individual cell temperatures collected by each NTC thermistor, the same statistical time window is used to statistically analyze the corresponding individual cell temperature changes, and the temperature growth slope of the corresponding supercapacitor is determined accordingly. The temperature growth slope is used to characterize the degree of change of the individual cell temperature of the corresponding supercapacitor over time within the statistical time window. Since the temperature growth slope of each supercapacitor is determined based on a unified statistical time window, each temperature growth slope has the same statistical time basis, which can be used to subsequently compare the temperature changes of different supercapacitors based on the relative relationship between the temperature growth slopes of each supercapacitor.
[0048] In step S300, based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes are identified as suspected faulty supercapacitors. The temperature growth slopes of each supercapacitor are compared to determine whether there are differences in the temperature change trends of each supercapacitor. Under normal operating conditions, the temperature growth slopes of each supercapacitor within the same supercapacitor module usually have similar trends. When an NTC thermistor detaches, the correlation between the individual cell temperature collected by the NTC thermistor and the actual temperature change of the corresponding supercapacitor is affected, and its corresponding temperature growth slope may be lower than that of other supercapacitors within the same supercapacitor module.
[0049] Furthermore, based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes are screened, and these screened supercapacitors are identified as suspected faulty supercapacitors. This identification of suspected faulty supercapacitors serves as the basis for subsequent temperature difference verification; the abnormally low temperature growth slope is used as a preliminary criterion and does not directly determine at this stage whether the corresponding NTC thermistor has detached.
[0050] In step S400, the temperature difference between the individual cell temperature of each suspected faulty supercapacitor and the motherboard temperature is determined. After identifying the suspected faulty supercapacitor, the individual cell temperature of each suspected faulty supercapacitor is obtained, and each individual cell temperature is compared with the motherboard temperature to determine the temperature difference corresponding to each suspected faulty supercapacitor. The temperature difference reflects the degree of difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature, and serves as the basis for subsequent verification of the suspected faulty supercapacitor.
[0051] Furthermore, during normal operation, the temperature difference between a single supercapacitor cell and the motherboard temperature typically remains relatively stable. However, when an NTC thermistor detaches, the temperature it collects may become closer to the ambient temperature, altering the temperature difference between the single cell and the motherboard. Therefore, by determining the temperature difference corresponding to each suspected faulty supercapacitor, it is possible to further assess whether there are any abnormalities in the corresponding temperature acquisition status based on the temperature increase slope screening results.
[0052] In step S500, each suspected faulty supercapacitor is verified based on whether its temperature difference meets a preset temperature difference anomaly condition. The verification result is then used to determine whether the NTC thermistor corresponding to each suspected faulty supercapacitor has detached. After identifying suspected faulty supercapacitors based on the relative relationship between temperature increase slopes, the temperature difference corresponding to each suspected faulty supercapacitor is further used for verification. For each suspected faulty supercapacitor, it is determined whether its corresponding temperature difference meets a preset temperature difference anomaly condition to determine whether there is an anomaly in the temperature difference relationship between the individual temperature of the suspected faulty supercapacitor and the motherboard temperature. The preset temperature difference anomaly condition is used to determine whether the temperature difference is abnormal.
[0053] Furthermore, an abnormal temperature growth slope is used to screen suspected faulty supercapacitors, and the temperature difference is used to further verify the screening results. Based on the verification results obtained from whether the temperature difference meets the preset abnormal temperature difference conditions, each suspected faulty supercapacitor is judged separately to determine whether the corresponding NTC thermistor has detached. By combining the screening based on relative anomalies in the temperature growth slope with the temperature difference verification, the influence of factors such as ambient temperature changes can be reduced when judging solely based on a single temperature change characteristic.
[0054] By periodically acquiring the individual cell temperature and motherboard temperature of each supercapacitor, determining the temperature growth slope of each supercapacitor within a unified statistical time window, and filtering out suspected faulty supercapacitors with abnormally low temperature growth slopes based on the relative relationship between the temperature growth slopes of each supercapacitor, this invention further verifies the results by combining the temperature difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature. Compared to methods that rely solely on preset temperature ranges or the temperature difference between the individual cell temperature and the motherboard temperature, this invention utilizes the differences in the temperature growth slopes of each supercapacitor within the same supercapacitor module to reflect anomalies between the NTC-collected temperature and the actual temperature change of the supercapacitor. Furthermore, by using temperature difference verification, it reduces the impact of factors such as ambient temperature changes on the judgment results, thereby improving the reliability of identifying NTC detachment states during supercapacitor operation.
[0055] In an exemplary embodiment, before determining the temperature growth slope of each supercapacitor in step S200, the periodically acquired individual cell temperatures and the motherboard temperature are filtered and denoised to reduce the impact of sampling jitter on the temperature data during temperature acquisition. The filtered and denoised individual cell temperatures are used to subsequently determine the temperature growth slope of the corresponding supercapacitor, so that the determined temperature growth slope can more stably reflect the individual cell temperature changes within the statistical time window; the filtered and denoised motherboard temperature can then be used to subsequently determine the temperature difference between the individual cell temperature of a suspected faulty supercapacitor and the motherboard temperature.
[0056] This implementation does not further limit the specific filtering and noise reduction method. It mainly focuses on processing periodically collected temperature data to reduce the interference of sampling jitter on the subsequent determination of the temperature growth slope and temperature difference verification.
[0057] In an exemplary embodiment, in step S200, the statistical time window is 30 seconds to 60 seconds;
[0058] For each supercapacitor, the temperature growth slope of the supercapacitor is determined based on the individual cell temperature collected at the start time of the statistical time window, the individual cell temperature collected at the current time of the statistical time window, and the statistical duration of the statistical time window.
[0059] A uniform statistical time window is set, with a statistical duration of 30 to 60 seconds. For each supercapacitor, the same statistical time window is used to statistically analyze the temperature changes of each individual supercapacitor, ensuring that the temperature growth slope for each supercapacitor has a uniform time scale.
[0060] Specifically, for each supercapacitor, the individual cell temperature collected at the start of the statistical time window and the individual cell temperature collected at the current moment of the statistical time window are obtained. The temperature growth slope of the supercapacitor is determined based on the temperature change between the two and the statistical duration of the statistical time window. The specific calculation formula is as follows:
[0061]
[0062] in, This represents the slope of the temperature increase of the supercapacitor. This represents the unit temperature collected at the current moment within the statistical time window. This indicates the unit temperature collected at the start time of the statistical time window. This represents the statistical duration of the statistical time window. The temperature growth slope of each supercapacitor is determined according to the above method to characterize the individual temperature changes of each supercapacitor within the same statistical time window, and is used for subsequent comparison of the relative relationships between the temperature growth slopes of each supercapacitor.
[0063] In an exemplary embodiment, step S300, determining supercapacitors with abnormally low temperature growth slopes as suspected faulty supercapacitors based on the relative relationship between the temperature growth slopes of each supercapacitor, includes:
[0064] For each supercapacitor to be judged, the temperature growth slope of the supercapacitor to be judged is divided by the temperature growth slope of the other supercapacitors to obtain the corresponding ratio.
[0065] When at least one of the ratios corresponding to the supercapacitor to be judged is not greater than 0.5, the supercapacitor to be judged is determined to meet the slope anomaly condition, and the supercapacitor to be judged is identified as the suspected faulty supercapacitor.
[0066] Specifically, each of the supercapacitors is sequentially selected as a supercapacitor to be evaluated, and the temperature growth slope of the supercapacitor to be evaluated is compared with the temperature growth slopes of the other supercapacitors. During the comparison, the temperature growth slope of the supercapacitor to be evaluated is divided by the temperature growth slopes of the other supercapacitors, thereby obtaining the corresponding ratio of the supercapacitor to be evaluated relative to the other supercapacitors. Through this step-by-step comparison, the relative differences in the temperature growth slopes of the supercapacitors within the same supercapacitor module can be reflected.
[0067] Furthermore, when at least one ratio corresponding to the supercapacitor to be judged is not greater than 0.5, it indicates that the temperature growth slope of the supercapacitor to be judged is abnormally low compared to the temperature growth slope of at least one other supercapacitor. This determines that the supercapacitor to be judged meets the abnormal slope condition and is identified as a suspected faulty supercapacitor. Each supercapacitor is judged in the same way to screen out supercapacitors with abnormal temperature growth slopes, which are then further verified by combining the temperature difference between the individual temperature of the suspected faulty supercapacitor and the motherboard temperature.
[0068] In a specific example, the statistical time window is 60 seconds. When comparing the temperature growth slope of the supercapacitor where the NTC thermistor detached with the temperature growth slope of the corresponding supercapacitor where the NTC thermistor did not detach, the obtained ratio is 0.02, which is not greater than 0.5. Therefore, it can be determined that the supercapacitor where the NTC thermistor detached satisfies the aforementioned slope anomaly condition.
[0069] When a normal supercapacitor is used as the supercapacitor to be judged, and its temperature growth slope is compared inversely with that of a supercapacitor whose NTC thermistor has detached, the resulting ratio is 50, which does not meet the condition of not exceeding 0.5. When neither of the NTC thermistors corresponding to the two supercapacitors being compared has detached, the corresponding ratio is approximately 1, which also does not meet the aforementioned abnormal slope condition. Therefore, supercapacitors with abnormally low temperature growth slopes can be screened based on the relative relationship between the temperature growth slopes of different supercapacitors.
[0070] More specifically, the supercapacitor module includes three supercapacitors, which are denoted as Cell1, Cell2, and Cell3 for ease of explanation. Each of Cell1, Cell2, and Cell3 is equipped with a corresponding NTC thermistor. When only the NTC thermistor corresponding to Cell1 detaches, while the NTC thermistors corresponding to Cell2 and Cell3 do not detach, Cell1 is used as the supercapacitor to be judged. The temperature growth slope of Cell1 is divided by the temperature growth slopes of Cell2 and Cell3, and the resulting ratio satisfies the condition of not exceeding 0.5. However, when Cell2 or Cell3 is used as the supercapacitor to be judged for the corresponding comparison, the resulting ratio does not satisfy the condition of not exceeding 0.5. Therefore, based on the relative relationship of the temperature growth slopes among the supercapacitors, Cell1 can be identified as a suspected faulty supercapacitor.
[0071] Furthermore, when the NTC thermistors corresponding to Cell1 and Cell2 both detach, while the NTC thermistor corresponding to Cell3 does not detach, the temperature growth slopes of Cell1 and Cell2 are relatively close, and the ratio obtained by comparing them does not meet the condition of not exceeding 0.5. However, when the temperature growth slope of Cell1 is divided by the temperature growth slope of Cell3, and the temperature growth slope of Cell2 is divided by the temperature growth slope of Cell3, the resulting ratios both meet the condition of not exceeding 0.5. Therefore, there is at least one ratio of not exceeding 0.5 for Cell1 and Cell2 respectively, and Cell1 and Cell2 can be identified as suspected faulty supercapacitors. Thus, even if multiple NTC thermistors detach simultaneously, the corresponding suspected faulty supercapacitors can be screened out by comparing the relative temperature growth slopes of each supercapacitor.
[0072] In an exemplary embodiment, the preset temperature difference abnormality condition is that the temperature difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature is outside the normal operating temperature difference range. Under normal operating conditions, there is a corresponding temperature difference range between the individual cell temperature of the supercapacitor and the motherboard temperature; this temperature difference range is defined as the normal operating temperature difference range. For each suspected faulty supercapacitor, the temperature difference between its individual cell temperature and the motherboard temperature is compared with the normal operating temperature difference range to determine whether the temperature difference meets the preset temperature difference abnormality condition.
[0073] Furthermore, when the temperature difference corresponding to the suspected faulty supercapacitor is outside the normal operating temperature difference range, it is determined that the temperature difference meets the preset abnormal temperature difference condition, and this judgment result is used to further verify the suspected faulty supercapacitor. Thus, based on the abnormal temperature growth slope, the relationship between the individual cell temperature and the motherboard temperature is further combined to determine whether the corresponding NTC thermistor has detached.
[0074] In an exemplary embodiment, when there are multiple suspected faulty supercapacitors, the step of verifying each suspected faulty supercapacitor includes:
[0075] Determine the individual temperature difference between each of the suspected faulty supercapacitors;
[0076] Based on whether the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, it is determined whether the individual cell temperatures of each suspected faulty supercapacitor are close to each other.
[0077] When the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, and the temperature difference corresponding to each suspected faulty supercapacitor meets the preset temperature difference abnormal condition, it is determined that the NTC thermistors corresponding to each of the multiple suspected faulty supercapacitors have all fallen off, and the supercapacitor number corresponding to the fallen NTC thermistor is output.
[0078] Specifically, when multiple suspected faulty supercapacitors are identified based on the relative relationship between the temperature growth slopes of each supercapacitor, the individual temperatures of these suspected faulty supercapacitors are compared to determine the temperature difference between them. Based on whether the determined temperature differences satisfy a preset temperature proximity condition, it is determined whether the individual temperatures of the multiple suspected faulty supercapacitors are close to each other. The preset temperature proximity condition is used to determine the temperature proximity of the multiple suspected faulty supercapacitors based on their individual temperature differences.
[0079] Furthermore, when the temperature difference between individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, it is determined that the individual cell temperatures of each suspected faulty supercapacitor are close to each other. Based on this, it is further determined whether the temperature difference between the individual cell temperature of each suspected faulty supercapacitor and the motherboard temperature meets the preset temperature difference abnormality condition. When both conditions are met simultaneously, it is determined that the NTC thermistors corresponding to each of the multiple suspected faulty supercapacitors have detached, and the supercapacitor number corresponding to the detached NTC thermistor is output to determine the corresponding fault location.
[0080] In an exemplary embodiment, the method further includes:
[0081] The number of NTC thermistors determined to have detached was counted.
[0082] When one NTC thermistor detaches, a Level 1 fault is reported, and the maximum charging and discharging power of the supercapacitor module is limited.
[0083] When two or more NTC thermistors detach, a level two fault is reported and overheat protection is activated.
[0084] The fault information corresponding to the detached NTC thermistor is uploaded to the backend terminal, and the fault location information corresponding to the detached NTC thermistor is stored.
[0085] Specifically, after determining whether each NTC thermistor has detached, the number of NTC thermistors identified as detached is counted, and the corresponding faults are graded according to the number. When only one NTC thermistor has detached, a Level 1 fault is reported, and the maximum charging and discharging power of the supercapacitor module is limited to restrict the charging and discharging power of the supercapacitor module under the corresponding fault condition.
[0086] Furthermore, when two or more NTC thermistors detach, a level two fault is reported and overheat protection is activated. Thus, level one and level two faults are distinguished based on the number of detached NTC thermistors, and corresponding handling measures are taken for different fault levels.
[0087] In addition, the fault information corresponding to the detached NTC thermistor is uploaded to the backend terminal, and the fault location information corresponding to the detached NTC thermistor is stored. The fault location information is used to record the location of the supercapacitor corresponding to the detached NTC thermistor, so as to identify and query the corresponding fault location.
[0088] In an exemplary embodiment, please refer to Figure 2 The present invention also provides a supercapacitor management system, including a motherboard and a supercapacitor module, wherein the supercapacitor module includes multiple supercapacitors, each supercapacitor being configured with an NTC thermistor, and further includes:
[0089] NTC temperature acquisition module 100 is used to periodically acquire the individual temperature of each of the NTC thermistors.
[0090] The motherboard temperature acquisition module 200 is used to acquire the motherboard temperature of the motherboard;
[0091] Temperature growth slope calculation unit 300 is used to determine the temperature growth slope of each supercapacitor based on the temperature change of each individual NTC thermistor collected within the statistical time window, according to a unified statistical time window.
[0092] Temperature difference calculation unit 400 is used to determine the temperature difference between the individual cell temperature of each supercapacitor and the motherboard temperature;
[0093] The NTC detachment comprehensive judgment unit 500 is used to determine, based on the relative relationship between the temperature growth slopes of each supercapacitor, a supercapacitor with an abnormally low temperature growth slope as a suspected faulty supercapacitor, to verify the suspected faulty supercapacitor based on whether the temperature difference corresponding to the suspected faulty supercapacitor meets the preset abnormal temperature difference condition, and to determine, based on the verification result, whether the NTC thermistor corresponding to the suspected faulty supercapacitor has detached.
[0094] Specifically, the NTC temperature acquisition module 100 periodically acquires the individual temperature of each NTC thermistor, so that each supercapacitor has continuously acquired individual temperature data over time; the motherboard temperature acquisition module 200 acquires the motherboard temperature, providing corresponding temperature data for subsequently determining the temperature difference between the individual temperature of each supercapacitor and the motherboard temperature.
[0095] The temperature growth slope calculation unit 300 processes the individual temperature changes of each NTC thermistor collected within the same statistical time range based on a unified statistical time window, and determines the temperature growth slope of the corresponding supercapacitor. Therefore, the temperature growth slope of each supercapacitor has a unified statistical time basis, which can be used to compare the temperature changes of different supercapacitors within the corresponding time range.
[0096] The temperature difference calculation unit 400 determines the temperature difference for each supercapacitor based on its individual cell temperature and the motherboard temperature. The determined temperature difference reflects the difference between the individual cell temperature of the corresponding supercapacitor and the motherboard temperature, and provides a basis for the NTC detachment comprehensive judgment unit 500 to further verify suspected faulty supercapacitors.
[0097] The NTC detachment comprehensive judgment unit 500 compares the temperature growth slope of each supercapacitor, filters supercapacitors with abnormally low temperature growth slopes based on the relative relationship between the temperature growth slopes, and identifies them as suspected faulty supercapacitors. For the identified suspected faulty supercapacitors, further verification is performed based on the corresponding temperature difference. The verification result is obtained according to whether the temperature difference meets the preset abnormal temperature difference conditions, and it is used to determine whether the NTC thermistor corresponding to the suspected faulty supercapacitor has detached. Preliminary screening is performed by the relative relationship between the temperature growth slopes, and verification is performed by combining the temperature difference between the individual unit temperature and the motherboard temperature, so that both types of temperature characteristics participate in the determination of the NTC detachment status.
[0098] In an exemplary embodiment, please refer to Figure 2 The supercapacitor management system further includes a data filtering and preprocessing unit 600, which is used to filter and denoise the individual cell temperature collected by the NTC temperature acquisition module 100 and the motherboard temperature collected by the motherboard temperature acquisition module 200.
[0099] The temperature growth slope calculation unit 300 is used to determine the temperature growth slope of each supercapacitor based on the individual cell temperature after filtering and noise reduction.
[0100] The temperature difference calculation unit 400 is used to determine the temperature difference based on the unit temperature and motherboard temperature after filtering and noise reduction processing.
[0101] Specifically, the data filtering and preprocessing unit 600 performs filtering and noise reduction processing on the unit temperatures periodically collected by the NTC temperature acquisition module 100 and the motherboard temperature collected by the motherboard temperature acquisition module 200, in order to reduce the impact of sampling jitter during temperature acquisition on subsequent data processing. The unit temperatures and motherboard temperatures after filtering and noise reduction processing are used as temperature data for subsequent temperature growth slope calculation and temperature difference calculation.
[0102] Furthermore, the temperature growth slope calculation unit 300, based on a unified statistical time window, determines the temperature growth slope of each supercapacitor according to the temperature change of each individual cell within the statistical time window after filtering and denoising, thereby reducing the interference of sampling jitter on the temperature growth slope determination result.
[0103] The temperature difference calculation unit 400 determines the temperature difference between the individual cell temperature of each supercapacitor and the motherboard temperature based on the individual cell temperature after filtering and noise reduction processing and the motherboard temperature after filtering and noise reduction processing, and provides the determined temperature difference to the NTC detachment comprehensive judgment unit 500 for verification of suspected faulty supercapacitors.
[0104] In an exemplary embodiment, please refer to Figure 2 The supercapacitor management system further includes a fault classification unit 700. The fault classification unit 700 is used to count the number of NTC thermistors determined to have detached based on the judgment result of the NTC detachment comprehensive judgment unit 500. When the number of detached NTC thermistors is one, a level one fault is reported and the maximum charging and discharging power of the supercapacitor module is limited. When the number of detached NTC thermistors is two or more, a level two fault is reported and overheat protection is activated. The system also uploads the fault information corresponding to the detached NTC thermistors to the background terminal and stores the fault location information corresponding to the detached NTC thermistors.
[0105] Specifically, the fault classification unit 700 determines the NTC thermistors that have been identified as having detached based on the judgment result output by the NTC detachment comprehensive judgment unit 500, and counts the number of NTC thermistors that have detached, so as to classify the corresponding faults according to the number.
[0106] Furthermore, when only one NTC thermistor has detached, the fault classification unit 700 reports a Level 1 fault and limits the maximum charging and discharging power of the supercapacitor module; when two or more NTC thermistors have detached, the fault classification unit 700 reports a Level 2 fault and activates overheat protection, thereby taking corresponding fault handling measures according to the number of detached NTC thermistors.
[0107] In addition, the fault classification unit 700 uploads the fault information corresponding to the detached NTC thermistor to the background terminal and stores the fault location information corresponding to the detached NTC thermistor, so as to record the detachment of the corresponding NTC thermistor and the corresponding fault location.
[0108] The above description describes specific embodiments of the present invention. Without departing from the inventive concept, those skilled in the art can make equivalent substitutions or modifications to the corresponding technical features based on the disclosed content of the present invention. The scope of protection of the present invention is defined by the scope of the claims.
Claims
1. A method for detecting NTC detachment in a supercapacitor, applied to a supercapacitor management system, the supercapacitor management system comprising a motherboard and a supercapacitor module, the supercapacitor module comprising multiple supercapacitors, each supercapacitor being equipped with an NTC thermistor, characterized in that... The method is executed by the supercapacitor management system and includes: The individual temperature of each NTC thermistor and the motherboard temperature of the motherboard are periodically acquired. Based on a unified statistical time window, the temperature growth slope of each supercapacitor is determined according to the temperature changes of each individual NTC thermistor collected within the statistical time window. Based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes are identified as suspected faulty supercapacitors. Determine the temperature difference between the individual cell temperature of each suspected faulty supercapacitor and the motherboard temperature; Based on whether the temperature difference corresponding to each suspected faulty supercapacitor meets the preset abnormal temperature difference conditions, each suspected faulty supercapacitor is verified, and based on the verification results, it is determined whether the NTC thermistor corresponding to each suspected faulty supercapacitor has fallen off.
2. The method for detecting NTC detachment in supercapacitors according to claim 1, characterized in that, Before determining the temperature growth slope of each supercapacitor, the periodically acquired temperatures of each individual supercapacitor and the motherboard temperature are filtered and denoised.
3. The method for detecting NTC detachment in supercapacitors according to claim 1, characterized in that, The statistical time window is 30 to 60 seconds. For each supercapacitor, the temperature growth slope of the supercapacitor is determined based on the individual cell temperature collected at the start time of the statistical time window, the individual cell temperature collected at the current time of the statistical time window, and the statistical duration of the statistical time window.
4. The method for detecting NTC detachment in supercapacitors according to claim 3, characterized in that, The step of identifying supercapacitors with abnormally low temperature growth slopes as suspected faulty supercapacitors based on the relative relationship between the temperature growth slopes of each supercapacitor includes: For each supercapacitor to be judged, the temperature growth slope of the supercapacitor to be judged is divided by the temperature growth slope of the other supercapacitors to obtain the corresponding ratio. When at least one of the ratios corresponding to the supercapacitor to be judged is not greater than 0.5, the supercapacitor to be judged is determined to meet the slope anomaly condition, and the supercapacitor to be judged is identified as the suspected faulty supercapacitor.
5. The method for detecting NTC detachment in supercapacitors according to claim 1, characterized in that, The preset abnormal temperature difference condition is that the temperature difference between the individual cell temperature of the suspected faulty supercapacitor and the motherboard temperature is outside the normal operating temperature difference range.
6. The method for detecting NTC detachment in supercapacitors according to claim 5, characterized in that, When multiple suspected faulty supercapacitors exist, the verification of each suspected faulty supercapacitor includes: Determine the individual temperature difference between each of the suspected faulty supercapacitors; Based on whether the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, it is determined whether the individual cell temperatures of each suspected faulty supercapacitor are close to each other. When the temperature difference between the individual cells of each suspected faulty supercapacitor meets the preset temperature proximity condition, and the temperature difference corresponding to each suspected faulty supercapacitor meets the preset temperature difference abnormal condition, it is determined that the NTC thermistors corresponding to each of the multiple suspected faulty supercapacitors have all fallen off, and the supercapacitor number corresponding to the fallen NTC thermistor is output.
7. The method for detecting NTC detachment in supercapacitors according to claim 1, characterized in that, The method further includes: The number of NTC thermistors determined to have detached was counted. When one NTC thermistor detaches, a Level 1 fault is reported, and the maximum charging and discharging power of the supercapacitor module is limited. When two or more NTC thermistors detach, a level two fault is reported and overheat protection is activated. The fault information corresponding to the detached NTC thermistor is uploaded to the backend terminal, and the fault location information corresponding to the detached NTC thermistor is stored.
8. A supercapacitor management system, comprising a motherboard and a supercapacitor module, wherein the supercapacitor module comprises a plurality of supercapacitors, each supercapacitor being configured with an NTC thermistor, characterized in that, Also includes: The NTC temperature acquisition module is used to periodically acquire the individual temperature of each NTC thermistor. The motherboard temperature acquisition module is used to acquire the motherboard temperature of the motherboard. The temperature growth slope calculation unit is used to determine the temperature growth slope of each supercapacitor based on the temperature change of each individual NTC thermistor collected within the statistical time window, according to a unified statistical time window. A temperature difference calculation unit is used to determine the temperature difference between the individual cell temperature of each supercapacitor and the motherboard temperature; The NTC detachment comprehensive judgment unit is used to determine, based on the relative relationship between the temperature growth slopes of each supercapacitor, supercapacitors with abnormally low temperature growth slopes as suspected faulty supercapacitors, verifying the suspected faulty supercapacitors based on whether the temperature difference corresponding to the suspected faulty supercapacitors meets the preset abnormal temperature difference conditions, and determining whether the NTC thermistor corresponding to the suspected faulty supercapacitors has detached based on the verification results.
9. The supercapacitor management system according to claim 8, characterized in that, It also includes a data filtering preprocessing unit, which is used to filter and denoise the unit temperature collected by the NTC temperature acquisition module and the motherboard temperature collected by the motherboard temperature acquisition module. The temperature growth slope calculation unit is used to determine the temperature growth slope of each supercapacitor based on the individual cell temperature after filtering and noise reduction. The temperature difference calculation unit is used to determine the temperature difference based on the individual unit temperature and the motherboard temperature after filtering and noise reduction processing.
10. The supercapacitor management system according to claim 8, characterized in that, It also includes a fault classification unit, which is used to count the number of NTC thermistors judged to have detached based on the judgment result of the NTC detachment comprehensive judgment unit. When the number of detached NTC thermistors is one, a level one fault is reported and the maximum charging and discharging power of the supercapacitor module is limited. When the number of detached NTC thermistors is two or more, a level two fault is reported and overheat protection is activated. The fault information corresponding to the detached NTC thermistors is uploaded to the background terminal and the fault location information corresponding to the detached NTC thermistors is stored.
